0% found this document useful (0 votes)
83 views1 page

DDR Termination Regulator: Features General Description

The document summarizes a DDR termination regulator chip that supports different DDR memory standards. It can provide termination voltages for DDRI, DDRII, DDRIII, and DDRIIIL. The chip requires minimal external components, only 20uF of ceramic output capacitance. It has features such as remote sensing, integrated voltage division, and sleep state controls. The chip comes in MSOP-10 and MSOP-10FD packages.

Uploaded by

Lina Linu
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
83 views1 page

DDR Termination Regulator: Features General Description

The document summarizes a DDR termination regulator chip that supports different DDR memory standards. It can provide termination voltages for DDRI, DDRII, DDRIII, and DDRIIIL. The chip requires minimal external components, only 20uF of ceramic output capacitance. It has features such as remote sensing, integrated voltage division, and sleep state controls. The chip comes in MSOP-10 and MSOP-10FD packages.

Uploaded by

Lina Linu
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 1

Global Mixed-mode Technology G2997B

DDR Termination Regulator


Features General Description
„ Support DDR I (1.25VTT), DDR II (0.9 VTT), The G2997B is a 2A sink/source tracking termination
DDR III (0.75 VTT), and DDR IIIL (0.675VTT) regulator. It is specifically designed for low-cost/
Requirements low-external component count systems. The G2997B
„ Input Voltage Range: 3V to 5.5V maintains a high speed operational amplifier that pro-
„ VLDOIN Voltage Range: 1.2V to 3.6V vides fast load transient response and only requires
„ Requires Only 20µF Ceramic Output Capaci- 20µF (2x10µF) of ceramic output capacitance. The
tance
G2997B supports remote sensing functions and all
„ Supports High-Z in S3 and Soft-Off in S5
features required to power the DDR I / DDR II /DDRIII
„ Integrated Divider Tracks 1/2 VDDQSNS for
Both VTT and VTTREF /DDR IIIL VTT bus termination according to the
„ Remote Sensing (VTTSNS) JEDEC specification. In addition, the G2997B includes
„ ±20mV Accuracy for VTT and VTTREF integrated sleep-state controls placing VTT in High-Z
„ 10mA Buffered Reference (VTTREF) in S3 (suspend to RAM) and soft-off for VTT and
„ Built-In Soft-Start VTTREF in S5 (Shutdown). The G2997B is available
„ Over Current Protection in MSOP-10 and MSOP-10 (FD).
„ Thermal Shutdown Protection
„ MSOP-10 & MSOP-10 (FD) Package Ordering Information
ORDER TEMP. PACKAGE
Applications MARKING
NUMBER RANGE (Green)
„ DDR I/II/III/IIIL Memory Termination G2997BP71U G2997 -40°C~85°C MSOP-10
„ SSTL−2, SSTL−18
G2997BF61U G2997B -40°C~85°C MSOP-10 (FD)
„ HSTL Termination
Note: P7: MSOP-10 F6: MSOP-10 (FD)
1: Bonding Code
U: Tape & Reel

Pin Configuration

G2997B G2997B
DDR II
VDDQSNS 1 10 VIN VDDQSNS 1 10 VIN 1.8V VDDQSNS VIN VIN=5V
DDR II RS5
VLDOIN 2 9 S5 VLDOIN 2 9 S5 VLDOIN S5 S5
10kΩ
Thermal
VTT 3 8 GND VTT 3 8 GND
Pad VTT GND
RS3
PGND 4 7 S3 PGND 4 7 S3 PGND S3 S3
10kΩ
VTTSNS 5 6 VTTREF VTTSNS 5 6 VTTREF C1 VTTSNS VTTREF
2x10µF
C2
MSOP-10 Top View 0.1µF
MSOP-10 (FD)
Note: Recommend connecting the Thermal Pad to
the GND for excellent power dissipation.

Typical Application Circuit

DDR I DDR III*


2.5V VDDQSNS VIN VIN=5V 1.5V VDDQSNS VIN VIN=3.3V
RS5 DDR II RS5
VLDOIN S5 S5 VLDOIN S5 S5
10kΩ 10kΩ
VTT GND VTT GND
RS3 RS3
PGND S3 S3 PGND S3 S3
10kΩ 10kΩ
C1 VTTSNS VTTREF C1 VTTSNS VTTREF
2x10µF 2x10µF
C2 C2
0.1µF 0.1µF

* Recommended VIN =3.3V

Ver: 0.8 TEL: 886-3-5788833


Nov 22, 2011 http://www.gmt.com.tw
1

You might also like