Esp32 s3 Mini 1 Mini 1u Datasheet En-2997643

ESP32S3MINI1
ESP32S3MINI1U
Datasheet
Smallsized module supporting 2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 (LE)
Built around ESP32S3 series of SoCs, Xtensa® dualcore 32bit LX7 microprocessor
Flash up to 8 MB, optional 2 MB PSRAM in chip package
39 GPIOs, rich set of peripherals
Onboard PCB antenna or external antenna connector
ESP32S3MINI1 ESP32S3MINI1U
Version1.0
Espressif Systems
Copyright © 2022
www.espressif.com
1 Module Overview
1 Module Overview
Note:
Check the link or the QR code to make sure that you use the latest version of this document:
https://www.espressif.com/sites/default/files/documentation/esp32-s3-mini-1_mini-1u_datasheet_
en.pdf
1.1 Features
CPU and OnChip Memory Peripherals
• ESP32-S3 embedded, Xtensa® dual-core 32-bit • GPIO, SPI, LCD interface, Camera interface,
LX7 microprocessor, up to 240 MHz UART, I2C, I2S, remote control, pulse counter,
LED PWM, USB 1.1 OTG, USB Serial/JTAG
• 384 KB ROM
controller, MCPWM, SDIO host, GDMA, TWAI®
• 512 KB SRAM controller (compatible with ISO 11898-1, i.e.
CAN Specification 2.0), ADC, touch sensor,
• 16 KB SRAM in RTC temperature sensor, timers and watchdogs
• Up to 8 MB Quad SPI flash

Integrated Components on Module
• 2 MB PSRAM (ESP32-S3FH4R2 only)
• 40 MHz crystal oscillator
WiFi Antenna Options

• On-board PCB antenna
• 802.11 b/g/n
(ESP32-S3-MINI-1)
• Bit rate: 802.11n up to 150 Mbps
• External antenna via a connector
• A-MPDU and A-MSDU aggregation (ESP32-S3-MINI-1U)
• 0.4 µs guard interval support Operating Conditions
• Center frequency range of operating channel: • Operating voltage/Power supply: 3.0 ~ 3.6 V
2412 ~ 2484 MHz
• Operating ambient temperature:
Bluetooth – 85 °C version: –40 ~ 85 °C
– 105 °C version: –40 ~ 105 °C

• Bluetooth LE: Bluetooth 5, Bluetooth mesh
• Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps Certification
• Advertising extensions • RF certification: See certificates for

ESP32-S3-MINI-1 and ESP32-S3-MINI-1U
• Multiple advertisement sets
• Green certification: RoHS/REACH
• Channel selection algorithm #2
Test
• Internal co-existence mechanism between Wi-Fi
and Bluetooth to share the same antenna • HTOL/HTSL/uHAST/TCT/ESD
Espressif Systems 2 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0

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1 Module Overview
1.2 Description
ESP32-S3-MINI-1 and ESP32-S3-MINI-1U are two powerful, generic Wi-Fi + Bluetooth LE MCU modules that
feature a rich set of peripherals, yet an optimized size. They are an ideal choice for a wide variety of application
scenarios related to Internet of Things (IoT), such as embedded systems, smart home, wearable electronics,
etc.
ESP32-S3-MINI-1 comes with a PCB antenna. ESP32-S3-MINI-1U comes with an external antenna connector.
The variants and ordering information for the module are shown in Table 1.
Table 1: Ordering Information
Ordering Code Chip Embedded Flash (MB) PSRAM (MB) Dimensions (mm)
ESP32-S3-MINI-1-N8 (85 °C) ESP32-S3FN8 8 (Quad SPI) 0
ESP32-S3-MINI-1-N4R2 (85 °C) ESP32-S3FH4R2 4 (Quad SPI) 2 (Quad SPI) 15.4 × 20.5 × 2.4
ESP32-S3-MINI-1-H4R2 (105 °C) ESP32-S3FH4R2 4 (Quad SPI) 2 (Quad SPI)
ESP32-S3-MINI-1U-N8 (85 °C) ESP32-S3FN8 8 (Quad SPI) 0
ESP32-S3-MINI-1U-N4R2 (85 °C) ESP32-S3FH4R2 4 (Quad SPI) 2 (Quad SPI) 15.4 × 15.4 × 2.4
ESP32-S3-MINI-1U-H4R2 (105 °C) ESP32-S3FH4R2 4 (Quad SPI) 2 (Quad SPI)
1
The ESP32-S3FH4R2 chip is not yet in mass production, so modules embedded with this chip are still in sample
status.
At the core of the modules is an ESP32-S3, an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. You
can power off the CPU and make use of the low-power co-processor to constantly monitor the peripherals for
changes or crossing of thresholds.
ESP32-S3 integrates a rich set of peripherals including SPI, LCD, Camera interface, UART, I2C, I2S, remote
control, pulse counter, LED PWM, USB Serial/Jtag, MCPWM, SDIO host, GDMA, TWAI® controller (compatible
with ISO 11898-1, i.e., CAN Specification 2.0), ADC, touch sensor, temperature sensor, timers and watchdogs,
as well as up to 45 GPIOs. It also includes a full-speed USB 1.1 On-The-Go (OTG) interface to enable USB
communication.
Note:
* For more information on ESP32-S3, please refer to ESP32-S3 Series Datasheet .
1.3 Applications
• Generic Low-power IoT Sensor Hub • Mesh Network
• Generic Low-power IoT Data Loggers • Home Automation
• Cameras for Video Streaming • Smart Building
• Over-the-top (OTT) Devices • Industrial Automation
• USB Devices • Smart Agriculture
• Speech Recognition • Audio Applications
• Image Recognition • Health Care Applications

1 Module Overview
• Wi-Fi-enabled Toys • Retail & Catering Applications
• Wearable Electronics

Contents
Contents
1 Module Overview 2
1.1 Features 2
1.2 Description 3
1.3 Applications 3
2 Block Diagram 8
3 Pin Definitions 9
3.1 Pin Layout 9
3.2 Pin Description 10
3.3 Strapping Pins 11
4 Electrical Characteristics 14
4.1 Absolute Maximum Ratings 14
4.2 Recommended Operating Conditions 14
4.3 DC Characteristics (3.3 V, 25 °C) 14
4.4 Current Consumption Characteristics 15
4.5 Wi-Fi RF Characteristics 15
4.5.1 Wi-Fi RF Standards 15
4.5.2 Wi-Fi RF Transmitter (TX) Specifications 16
4.5.3 Wi-Fi RF Receiver (RX) Specifications 17
4.6 Bluetooth LE Radio 18
4.6.1 Bluetooth LE RF Transmitter (TX) Specifications 18
4.6.2 Bluetooth LE RF Receiver (RX) Specifications 20
5 Module Schematics 23
6 Peripheral Schematics 25
7 Physical Dimensions and PCB Land Pattern 26

7.1 Physical Dimensions 26
7.2 Recommended PCB Land Pattern 28
7.3 Dimensions of External Antenna Connector 30
8 Product Handling 31
8.1 Storage Conditions 31
8.2 Electrostatic Discharge (ESD) 31
8.3 Reflow Profile 31
9 Related Documentation and Resources 32
Revision History 33

List of Tables
List of Tables
1 Ordering Information 3
2 Pin Definitions 10
3 JTAG Signal Source Selection 12
4 Strapping Pins 12
5 The Default Value for VDD_SPI Voltage 13
6 Parameter Descriptions of Setup and Hold Times for the Strapping Pin 13
7 Absolute Maximum Ratings 14
8 Recommended Operating Conditions 14
9 DC Characteristics (3.3 V, 25 °C) 14
10 Current Consumption Depending on RF Modes 15
11 Current Consumption Depending on Work Modes 15
12 Wi-Fi RF Standards 16
13 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 16
14 TX EVM Test 16
15 RX Sensitivity 17
16 Maximum RX Level 17
17 RX Adjacent Channel Rejection 18
18 Bluetooth LE Frequency 18
19 Transmitter Characteristics - Bluetooth LE 1 Mbps 18
20 Transmitter Characteristics - Bluetooth LE 2 Mbps 19
21 Transmitter Characteristics - Bluetooth LE 125 Kbps 19
22 Transmitter Characteristics - Bluetooth LE 500 Kbps 19
23 Receiver Characteristics - Bluetooth LE 1 Mbps 20
24 Receiver Characteristics - Bluetooth LE 2 Mbps 21
25 Receiver Characteristics - Bluetooth LE 125 Kbps 21
26 Receiver Characteristics - Bluetooth LE 500 Kbps 22

List of Figures
List of Figures
1 ESP32-S3-MINI-1 Block Diagram 8
2 ESP32-S3-MINI-1U Block Diagram 8
3 Pin Layout (Top View) 9
4 Setup and Hold Times for the Strapping Pin 13
5 ESP32-S3-MINI-1 Schematics 23
6 ESP32-S3-MINI-1U Schematics 24
7 Peripheral Schematics 25
8 ESP32-S3-MINI-1 Physical Dimensions 26
9 ESP32-S3-MINI-1U Physical Dimensions 26
10 ESP32-S3-MINI-1 Recommended PCB Land Pattern 28
11 ESP32-S3-MINI-1U Recommended PCB Land Pattern 29
12 Dimensions of External Antenna Connector 30
13 Reflow Profile 31

2 Block Diagram
2 Block Diagram
ESP32-S2-MINI-2
40 MHz
Crystal ESP32-S3-MINI-1
3V3 40 MHz Antenna
Crystal
3V3 Antenna
RF Matching
ESP32-S2FH4 RF Matching
ESP32-S2FN4R2
ESP32-S3FN8
EN GPIOs
ESP32-S3FH4R2
EN FLASH PSRAM(opt.) GPIOs
(QSPI) (QSPI)
FLASH PSRAM(opt.)
(QSPI) (QSPI)
Figure 1: ESP32S3MINI1 Block Diagram
ESP32-S3-MINI-1U
40 MHz
Crystal ESP32-S2-MINI-2U
3V3 40 MHz Antenna
Crystal
3V3 Antenna
RF Matching
ESP32-S3FN8 RF Matching
ESP32-S3FH4R2
ESP32-S2FH4
EN GPIOs
ESP32-S2FN4R2
EN FLASH PSRAM(opt.) GPIOs
(QSPI) (QSPI)
FLASH PSRAM(opt.)
(QSPI) (QSPI)
Figure 2: ESP32S3MINI1U Block Diagram

3 Pin Definitions
3 Pin Definitions
3.1 Pin Layout

The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 7.1 Physical Dimensions.
The pin diagram is applicable for ESP32-S3-MINI-1 and ESP32-S3-MINI-1U, but the latter has no keepout
zone.
Keepout Zone
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin 51
Pin 52
Pin 60
Pin 59
Pin 58
Pin 57
Pin 56
Pin 54
Pin 53
Pin 50
Pin 49
Pin 48
Pin 47
Pin 46
Pin 55
Pin 62 Pin 65
GND GND
GND Pin 1 Pin 45 EN
GND Pin 2 Pin 44 IO46
3V3 Pin 3 Pin 43 GND
IO0 Pin 4 Pin 42 GND
IO1 Pin 5 Pin 41 IO45
IO2 Pin 6 GND GND GND Pin 40 RXD0
IO3 Pin 7 Pin 39 TXD0

Pin 61
IO4 Pin 8 GND
GND
GND Pin 38 IO42
IO6 Pin 10 GND GND GND Pin 36 IO40

Pin 21
Pin 22
Pin 16
Pin 17
Pin 20
Pin 23
Pin 24
Pin 26
Pin 27
Pin 30
Pin 18
Pin 19
Pin 25
Pin 28
Pin 29
Pin 63 Pin 64
GND GND
IO21
IO12
IO14
IO34
IO16
IO20
IO26
IO13
IO17
IO18
IO19
IO47
IO33
IO48
IO15
Figure 3: Pin Layout (Top View)

3 Pin Definitions
3.2 Pin Description

The module has 65 pins. See pin definitions in Table 2.
For explanations of pin names and function names, as well as configurations of peripheral pins, please refer to
ESP32-S3 Series Datasheet .
Table 2: Pin Definitions
Name No. Type a Function

GND 1, 2, 42, 43, 46-65 P GND
3V3 3 P Power supply
IO0 4 I/O/T RTC_GPIO0, GPIO0
IO1 5 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0
IO8 12 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7, SUBSPICS1
IO9 13 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD, SUBSPIHD
RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4,
IO10 14 I/O/T
SUBSPICS0
RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5,
IO11 15 I/O/T
SUBSPID
RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6,
IO12 16 I/O/T
SUBSPICLK
RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7,
IO13 17 I/O/T
SUBSPIQ
RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS,
IO14 18 I/O/T
SUBSPIWP
IO15 19 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P
IO16 20 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N
IO17 21 I/O/T RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6
IO18 22 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, CLK_OUT3
IO19 23 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D
IO20 24 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+
IO21 25 I/O/T RTC_GPIO21, GPIO21
b
IO26 26 I/O/T SPICS1, GPIO26
IO47 27 I/O/T SPICLK_P_DIFF, GPIO47, SUBSPICLK_P_DIFF
IO33 28 I/O/T SPIIO4, GPIO33, FSPIHD, SUBSPIHD
IO34 29 I/O/T SPIIO5, GPIO34, FSPICS0, SUBSPICS0
IO48 30 I/O/T SPICLK_N_DIFF, GPIO48, SUBSPICLK_N_DIFF
IO35 31 I/O/T SPIIO6, GPIO35, FSPID, SUBSPID
IO36 32 I/O/T SPIIO7, GPIO36, FSPICLK, SUBSPICLK
Cont’d on next page

3 Pin Definitions
Table 2 – cont’d from previous page

a
Name No. Type Function
IO37 33 I/O/T SPIDQS, GPIO37, FSPIQ, SUBSPIQ
IO38 34 I/O/T GPIO38, FSPIWP, SUBSPIWP
IO39 35 I/O/T MTCK, GPIO39, CLK_OUT3, SUBSPICS1
IO40 36 I/O/T MTDO, GPIO40, CLK_OUT2
IO41 37 I/O/T MTDI, GPIO41, CLK_OUT1
IO42 38 I/O/T MTMS, GPIO42
TXD0 39 I/O/T U0TXD, GPIO43, CLK_OUT1
RXD0 40 I/O/T U0RXD, GPIO44, CLK_OUT2
IO45 41 I/O/T GPIO45
IO46 44 I/O/T GPIO46
High: on, enables the chip.
EN 45 I Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
a
P: power supply; I: input; O: output; T: high impedance. Pin functions in bold font are the default pin functions.
For pin 28 ∼ 29, 31 ∼ 33, the default function is decided by eFuse bit.
b
For modules with ordering codes ending with -N4R2 and -H4R2, IO26 connects to the embedded PSRAM and
is not available for other uses.
3.3 Strapping Pins

Note:
The content below is excerpted from Section Strapping Pins in ESP32-S3 Series Datasheet . For the strapping pin map-
ping between the chip and modules, please refer to Chapter 5 Module Schematics.
ESP32-S3 has four strapping pins:
• GPIO0
• GPIO45
• GPIO46
• GPIO3
Software can read the values of corresponding bits from register “GPIO_STRAPPING”.
During the chip’s system reset (power-on-reset, RTC watchdog reset, brownout reset, analog super watchdog
reset, and crystal clock glitch detection reset), the latches of the strapping pins sample the voltage level as
strapping bits of “0” or “1”, and hold these bits until the chip is powered down or shut down.
GPIO0, GPIO45 and GPIO46 are connected to the chip’s internal weak pull-up/pull-down during the chip reset.
Consequently, if they are unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of these strapping pins.
GPIO3 is floating by default. Its strapping value can be configured to determine the source of the JTAG signal
inside the CPU, as shown in Table 4. In this case, the strapping value is controlled by the external circuit that
cannot be in a high impedance state. Table 3 shows more configuration combinations of

3 Pin Definitions
EFUSE_DIS_USB_JTAG, EFUSE_DIS_PAD_JTAG, and EFUSE_STRAP_JTAG_SEL that determine the JTAG

signal source.
Table 3: JTAG Signal Source Selection
EFUSE_STRAP_JTAG_SEL EFUSE_DIS_USB_JTAG EFUSE_DIS_PAD_JTAG JTAG Signal Source

1 0 0 Refer to Table 4
0 0 0 USB Serial/JTAG controller
don’t care 0 1 USB Serial/JTAG controller
don’t care 1 0 On-chip JTAG pins
don’t care 1 1 N/A
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-S3.
After reset, the strapping pins work as normal-function pins.
Refer to Table 4 for a detailed configuration of the strapping pins.
Table 4: Strapping Pins
VDD_SPI Voltage
Pin Default 3.3 V 1.8 V
GPIO45 Pull-down 0 1
1
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO46 Pull-down Don’t care 0
Enabling/Disabling ROM Messages Print During Booting 2 3
Pin Default Enabled Disabled

GPIO46 Pull-down See the fourth note See the fourth note
JTAG Signal Selection
EFUSE_DIS_USB_JTAG = 0, EFUSE_DIS_PAD_JTAG = 0,
Pin Default
EFUSE_STRAP_JTAG_SEL=1
0: JTAG signal from on-chip JTAG pins
GPIO3 N/A
1: JTAG signal from USB Serial/JTAG controller
Note:
1. The strapping combination of GPIO46 = 1 and GPIO0 = 0 is invalid and will trigger unexpected behavior.
2. By default, the ROM boot messages are printed over UART0 (U0TXD pin) and USB Serial/JTAG controller together.
The ROM code printing can be disabled through configuration register and eFuse. For detailed information, please
refer to Chapter Chip Boot Control in ESP32-S3 Technical Reference Manual.
VDD_SPI voltage is determined either by the strapping value of GPIO45 or by EFUSE_VDD_SPI_TIEH. When
EFUSE_VDD_SPI_FORCE is 0, VDD_SPI voltage is determined by the strapping value of GPIO45; when
EFUSE_VDD_SPI_FORCE is 1, VDD_SPI voltage is determined by EFUSE_VDD_SPI_TIEH. Please refer to the

3 Pin Definitions
following table for default configurations:
Table 5: The Default Value for VDD_SPI Voltage
Chip Variant EFUSE_VDD_SPI_FORCE EFUSE_VDD_SPI_TIEH VDD_SPI Voltage

ESP32-S3 0 0 Determined by GPIO45
ESP32-S3R2 1 1 Force to 3.3 V
ESP32-S3R8 1 1 Force to 3.3 V
ESP32-S3R8V 1 0 Force to 1.8 V
ESP32-S3FN8 1 1 Force to 3.3 V
ESP32-S3FH4R2 1 1 Force to 3.3 V
Figure 4 shows the setup and hold times for the strapping pin before and after the CHIP_PU signal goes high.
Details about the parameters are listed in Table 6.
tSU tHD
VIL_nRST
CHIP_PU
VIH
Strapping pin
Figure 4: Setup and Hold Times for the Strapping Pin
Table 6: Parameter Descriptions of Setup and Hold Times for the Strapping Pin
Parameter Description Min (ms)

tSU Setup time before CHIP_PU goes from low to high 0
tHD Hold time after CHIP_PU goes high 3

4 Electrical Characteristics
4.1 Absolute Maximum Ratings

Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These
are stress ratings only and functional operation of the device at these or any other conditions beyond those
indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.
Table 7: Absolute Maximum Ratings
Symbol Parameter Min Max Unit

VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 105 °C
4.2 Recommended Operating Conditions
Table 8: Recommended Operating Conditions
Symbol Parameter Min Typ Max Unit

VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 — — A
85 °C version 85
TA Operating ambient temperature –40 — °C
105 °C version 105
4.3 DC Characteristics (3.3 V, 25 °C)
Table 9: DC Characteristics (3.3 V, 25 °C)

CIN Pin capacitance — 2 — pF
1 1
VIH High-level input voltage 0.75 × VDD — VDD + 0.3 V
1
VIL Low-level input voltage –0.3 — 0.25 × VDD V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
2 1
VOH High-level output voltage 0.8 × VDD — — V
2 1
VOL Low-level output voltage — — 0.1 × VDD V
1
High-level source current (VDD = 3.3 V, VOH >=
IOH — 40 — mA
2.64 V, PAD_DRIVER = 3)
Low-level sink current (VDD1 = 3.3 V, VOL =
IOL — 28 — mA
0.495 V, PAD_DRIVER = 3)
RP U Internal weak pull-up resistor — 45 — kΩ
RP D Internal weak pull-down resistor — 45 — kΩ
Chip reset release voltage (EN voltage is within
VIH_nRST 0.75 × VDD1 — VDD1+ 0.3 V
the specified range)


Chip reset voltage (EN voltage is within the
VIL_nRST –0.3 — 0.25 × VDD1 V
specified range)
1
VDD is the I/O voltage for pins of a particular power domain.
2
VOH and VOL are measured using high-impedance load.
4.4 Current Consumption Characteristics

With the use of advanced power-management technologies, the module can switch between different power
modes. For details on different power modes, please refer to Section Low Power Management
in ESP32-S3 Series Datasheet .
Table 10: Current Consumption Depending on RF Modes
Work mode Description Peak (mA)

802.11b, 1 Mbps, @20.5 dBm 355
802.11g, 54 Mbps, @18 dBm 297
TX
802.11n, HT20, MCS 7, @17.5 dBm 286
Active (RF working)
802.11n, HT40, MCS 7, @17 dBm 285
802.11b/g/n, HT20 95
RX
802.11n, HT40 97
1
The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient
temperature at the RF port. All transmitters’ measurements are based on a 100% duty cycle.
2
The current consumption figures for in RX mode are for cases when the peripherals are dis-
abled and the CPU idle.
Note that the data in Table 11 only applies to the module variants that embed the chip variant ESP32-S3.
Table 11: Current Consumption Depending on Work Modes
Work mode Description Typ 2 Unit

Light-sleep — 240 1 µA
RTC memory and RTC peripherals are powered on. 8 µA
Deep-sleep
RTC memory is powered on. RTC peripherals are powered off. 7 µA
Power off CHIP_PU is set to low level. The chip is powered off. 1 µA
1
An extra PSRAM consumption of 40 µA should be added for modules embedded with ESP32-
S3FH4R2 chip.
2
Please refer to ESP32-S3 Series Datasheet if there are any inconsistencies.
4.5 WiFi RF Characteristics

4.5.1 WiFi RF Standards

Table 12: WiFi RF Standards
Name Description
1
Center frequency range of operating channel 2412 ~ 2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n
11b: 1, 2, 5.5 and 11 Mbps
20 MHz 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
Data rate
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz 11n: MCS0-7, 150 Mbps (Max)
Antenna type PCB antenna, external antenna via the connector 2
1
Device should operate in the center frequency range allocated by regional regulatory authorities. Target
center frequency range is configurable by software.
2
For the modules that use external antennas, the output impedance is 50 Ω. For other modules without
external antennas, the output impedance is irrelevant.
4.5.2 WiFi RF Transmitter (TX) Specifications

Target TX power is configurable based on device or certification requirements. The default characteristics are
provided in Table 13.
Table 13: TX Power with Spectral Mask and EVM Meeting 802.11 Standards
Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — 20.5 —
802.11b, 11 Mbps — 20.5 —
802.11g, 6 Mbps — 20.0 —
802.11g, 54 Mbps — 18.0 —
802.11n, HT20, MCS 0 — 19.0 —
802.11n, HT20, MCS 7 — 17.5 —
802.11n, HT40, MCS 0 — 18.5 —
802.11n, HT40, MCS 7 — 17.0 —
Table 14: TX EVM Test
Min Typ SL1

Rate
(dB) (dB) (dB)
802.11b, 1 Mbps, @20.5 dBm — –24.5 –10
802.11b, 11 Mbps, @20.5 dBm — –24.5 –10
802.11g, 6 Mbps, @20 dBm — –23.0 –5
802.11g, 54 Mbps, @18 dBm — –29.5 –25
802.11n, HT20, MCS 0, @19 dBm — –24.0 –5
802.11n, HT20, MCS 7, @17.5 dBm — –30.5 –27
802.11n, HT40, MCS 0, @18.5 dBm — –25.0 –5
802.11n, HT40, MCS 7, @17 dBm — –30.0 –27
1
SL stands for standard limit value.

4.5.3 WiFi RF Receiver (RX) Specifications
Table 15: RX Sensitivity
Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — –98.2 —
802.11b, 2 Mbps — –95.6 —
802.11b, 5.5 Mbps — –92.8 —
802.11b, 11 Mbps — –88.5 —
802.11g, 6 Mbps — –93.0 —
802.11g, 9 Mbps — –92.0 —
802.11g, 12 Mbps — –90.8 —
802.11g, 18 Mbps — –88.5 —
802.11g, 24 Mbps — –85.5 —
802.11g, 36 Mbps — –82.2 —
802.11g, 48 Mbps — –78.0 —
802.11g, 54 Mbps — –76.2 —
802.11n, HT20, MCS 0 — –93.0 —
802.11n, HT20, MCS 1 — –90.6 —
802.11n, HT20, MCS 2 — –88.4 —
802.11n, HT20, MCS 3 — –84.8 —
802.11n, HT20, MCS 4 — –81.6 —
802.11n, HT20, MCS 5 — –77.4 —
802.11n, HT20, MCS 6 — –75.6 —
802.11n, HT20, MCS 7 — –74.2 —
802.11n, HT40, MCS 0 — –90.0 —
802.11n, HT40, MCS 1 — –87.5 —
802.11n, HT40, MCS 2 — –85.0 —
802.11n, HT40, MCS 3 — –82.0 —
802.11n, HT40, MCS 4 — –78.5 —
802.11n, HT40, MCS 5 — –74.4 —
802.11n, HT40, MCS 6 — –72.5 —
802.11n, HT40, MCS 7 — –71.2 —
Table 16: Maximum RX Level
Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — 5 —
802.11b, 11 Mbps — 5 —
802.11g, 6 Mbps — 5 —
802.11g, 54 Mbps — 0 —
802.11n, HT20, MCS 0 — 5 —
802.11n, HT20, MCS 7 — 0 —


Min Typ Max
Rate
(dBm) (dBm) (dBm)
802.11n, HT40, MCS 0 — 5 —
802.11n, HT40, MCS 7 — 0 —
Table 17: RX Adjacent Channel Rejection
Min Typ Max

Rate
(dB) (dB) (dB)
802.11b, 1 Mbps — 35 —
802.11b, 11 Mbps — 35 —
802.11g, 6 Mbps — 31 —
802.11g, 54 Mbps — 14 —
802.11n, HT20, MCS 0 — 31 —
802.11n, HT20, MCS 7 — 13 —
802.11n, HT40, MCS 0 — 19 —
802.11n, HT40, MCS 7 — 8 —
4.6 Bluetooth LE Radio
Table 18: Bluetooth LE Frequency
Min Typ Max

Parameter (MHz) (MHz) (MHz)
Center frequency of operating channel 2402 — 2480
4.6.1 Bluetooth LE RF Transmitter (TX) Specifications
Table 19: Transmitter Characteristics Bluetooth LE 1 Mbps
Parameter Description Min Typ Max Unit

RF power control range –25.00 0 20.00 dBm
RF transmit power
Gain control step — 3.00 — dB
Max |fn |n=0, 1, 2, ..k — 2.50 — kHz
Max |f0 − fn | — 2.00 — kHz
Carrier frequency offset and drift
Max |fn − fn−5 | — 1.40 — kHz
|f1 − f0 | — 1.00 — kHz
∆ f 1avg — 249.00 — kHz
Min ∆ f 2max (for at least
Modulation characteristics — 198.00 — kHz
99.9% of all ∆ f 2max )
∆ f 2avg /∆ f 1avg — 0.86 — —


±2 MHz offset — –37.00 — dBm
In-band spurious emissions ±3 MHz offset — –42.00 — dBm
>±3 MHz offset — –44.00 — dBm
Table 20: Transmitter Characteristics Bluetooth LE 2 Mbps

RF transmit power
Max |fn |n=0, 1, 2, ..k — 2.50 — kHz
Max |f0 − fn | — 2.00 — kHz
Max |fn − fn−5 | — 1.40 — kHz
|f1 − f0 | — 1.00 — kHz
∆ f 1avg — 499.00 — kHz
Min ∆ f 2max (for at least
Modulation characteristics — 416.00 — kHz
99.9% of all ∆ f 2max )
∆ f 2avg /∆ f 1avg — 0.89 — —
Table 21: Transmitter Characteristics Bluetooth LE 125 Kbps

RF transmit power
Max |fn |n=0, 1, 2, ..k — 0.80 — kHz
Max |f0 − fn | — 1.00 — kHz
|fn − fn−3 | — 0.30 — kHz
|f0 − f3 | — 1.00 — kHz
∆ f 1avg — 248.00 — kHz
Modulation characteristics Min ∆ f 1max (for at least
— 222.00 — kHz
99.9% of all∆ f 1max )
Table 22: Transmitter Characteristics Bluetooth LE 500 Kbps

RF transmit power


Max |fn |n=0, 1, 2, ..k — 0.80 — kHz
Max |f0 − fn | — 1.00 — kHz
|fn − fn−3 | — 0.85 — kHz
|f0 − f3 | — 0.34 — kHz
∆ f 2avg — 213.00 — kHz
Modulation characteristics Min ∆ f 2max (for at least
— 196.00 — kHz
99.9% of all ∆ f 2max )
4.6.2 Bluetooth LE RF Receiver (RX) Specifications
Table 23: Receiver Characteristics Bluetooth LE 1 Mbps

Sensitivity @30.8% PER — — –96.5 — dBm
Maximum received signal @30.8% PER — — 8 — dBm
Co-channel C/I F = F0 MHz — 8 — dB
F = F0 + 1 MHz — 4 — dB
F = F0 – 1 MHz — 4 — dB
F = F0 + 2 MHz — –23 — dB
F = F0 – 2 MHz — –23 — dB
Adjacent channel selectivity C/I
F = F0 + 3 MHz — –34 — dB
F = F0 – 3 MHz — –34 — dB
F > F0 + 3 MHz — –36 — dB
F > F0 – 3 MHz — –37 — dB
Image frequency — — –36 — dB
F = Fimage + 1 MHz — –39 — dB
Adjacent channel to image frequency
F = Fimage – 1 MHz — –34 — dB
30 MHz ~ 2000 MHz — –12 — dBm
2003 MHz ~ 2399 MHz — –18 — dBm
Out-of-band blocking performance
2484 MHz ~ 2997 MHz — –16 — dBm
3000 MHz ~ 12.75 GHz — –10 — dBm
Intermodulation — — –29 — dBm

Table 24: Receiver Characteristics Bluetooth LE 2 Mbps

Sensitivity @30.8% PER — — –92 — dBm
F = F0 + 2 MHz — 4 — dB
F = F0 – 2 MHz — 4 — dB
F = F0 + 4 MHz — –27 — dB
F = F0 – 4 MHz — –27 — dB
F = F0 + 6 MHz — –38 — dB
F = F0 – 6 MHz — –38 — dB
F > F0 + 6 MHz — –41 — dB
F > F0 – 6 MHz — –41 — dB
F = Fimage – 2 MHz — 4 — dB
30 MHz ~ 2000 MHz — –15 — dBm
2003 MHz ~ 2399 MHz — –21 — dBm
Out-of-band blocking performance
2484 MHz ~ 2997 MHz — –21 — dBm
3000 MHz ~ 12.75 GHz — –9 — dBm
Intermodulation — — –29 — dBm
Table 25: Receiver Characteristics Bluetooth LE 125 Kbps

Sensitivity @30.8% PER — — –103.5 — dBm
F = F0 + 1 MHz — 1 — dB
F = F0 – 1 MHz — 2 — dB
F = F0 + 2 MHz — –26 — dB
F = F0 – 2 MHz — –26 — dB
F = F0 + 3 MHz — –36 — dB
F = F0 – 3 MHz — –39 — dB
F > F0 + 3 MHz — –42 — dB
F > F0 – 3 MHz — –43 — dB

Table 26: Receiver Characteristics Bluetooth LE 500 Kbps

Sensitivity @30.8% PER — — –100 — dBm
F = F0 + 1 MHz — 1 — dB
F = F0 – 1 MHz — 0 — dB
F = F0 + 2 MHz — –24 — dB
F = F0 – 2 MHz — –24 — dB
F = F0 + 3 MHz — –37 — dB
F = F0 – 3 MHz — –39 — dB
F > F0 + 3 MHz — –38 — dB
F > F0 – 3 MHz — –42 — dB

Espressif Systems
5 Module Schematics
5 Module Schematics
This is the reference design of the module.
5 4 3 2 1
GND
GND GND
3
Y1
GND
GND XOUT
C1 C4
D D
TBD TBD VDD33
XIN
1
2
The values of C1 and C4 vary with
the selection of the crystal. R1
GND 10K(NC)
The value of R4 varies with the actual 40MHz(±10ppm)
VDD33 PCB board. GPIO46 VDD33
GPIO45 GND
U0RXD
R3 499 U0TXD
C3 C2 GPIO42 D1
0
GPIO41 ESD
1uF 10nF GPIO40
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
GPIO39
VDD33 GND GPIO38
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND GND GND 62 65
R4
L1 2.0nH(0.1nH) GND GND
C C10 VDD33 1 45 CHIP_PU C
C6 C7 C8 C9 VDD33 2 GND EN 44 GPIO46
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
0.1uF 3 GND IO46 43
10uF 1uF 0.1uF 0.1uF GPIO0 4 3V3 GND 42
23
GND
VDDA
VDDA
XTAL_P
XTAL_N
GPIO46
GPIO45
U0RXD
U0TXD
MTMS
VDD3P3_CPU
MTDO
MTCK
GPIO38
MTDI
GPIO1 5 IO0 GND 41 GPIO45
GND GPIO2 6 IO1 IO45 40 U0RXD
GND GND GND GND GPIO3 7 IO2 RXD0 39 U0TXD
ANT1 GPIO4 8 IO3 TXD0 38 GPIO42
RF_ANT LNA_IN IO4 ESP32-S3-MINI-1 IO42
1 L2 TBD 1 42 GPIO37 GPIO5 9 37 GPIO41
2 2 LNA_IN GPIO37 41 GPIO36 GPIO6 10 IO5 IO41 36 GPIO40
3 VDD3P3 GPIO36 40 GPIO35 GPIO7 11 IO6 IO40 35 GPIO39
L3 C11 C12 VDD3P3 GPIO35 IO7 IO39
PCB_ANT CHIP_PU 4 39 GPIO34 GPIO8 12 34 GPIO38
TBD TBD TBD GPIO0 5 CHIP_PU GPIO34 38 GPIO33 GPIO9 13 IO8 IO38 33 GPIO37
GPIO1 6 GPIO0 GPIO33 37 GPIO47 GPIO10 14 IO9 IO37 32 GPIO36
GPIO2 7 GPIO1 SPICLK_P 36 GPIO48 GPIO11 15 IO10 IO36 31 GPIO35
GPIO3 8 GPIO2 SPICLK_N 35 IO11 IO35
GND GND GND
GPIO4 9 GPIO3 SPID 34 63 64
C5 GPIO4 SPIQ GND GND
IO12
IO13
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26
IO47
IO33
IO34
IO48
GPIO5 10 33
TBD GPIO6 11 GPIO5 SPICLK 32
GPIO7 12 GPIO6 SPICS0 31 VDD_SPI U2 GND
GPIO7 SPIWP
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
B GPIO8 13 30 B
ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0
GPIO9 14 GPIO8 SPIHD 29

GND
GPIO9 VDD_SPI
VDD3P3_RTC
XTAL_32K_N
XTAL_32K_P
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GPIO26
GPIO47
GPIO33
GPIO34
GPIO48
The values of L3, C5, C11, L2 and C12 C13 C14
vary with the actual PCB board.
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
SPICS1
0.1uF 1uF
NC: No component.
ESP32-S3-MINI-1(pin-out)
U1 ESP32-S3FN8 GND GND
15
16
17
18
19
20
21
22
23
24
25
26
27
28
VDD33 ESP32-S3FH4R2
C15
0.1uF
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GPIO26
GND
A A
Figure 5: ESP32S3MINI1 Schematics Title

<ESP32-S3-MINI-1>
Size Page Name Rev

A4 <02_ESP32-S3-MINI-1> 1.1 Confidential and Proprietary
Date: Tuesday, May 10, 2022 Sheet 2 of 2
5 4 3 2 1
5 4 3 2 1
Espressif Systems
5 Module Schematics
GND
GND GND
3
Y1
GND
GND XOUT
C1 C4
D D
TBD TBD VDD33
XIN
1
2
The values of C1 and C4 vary with
the selection of the crystal. R1
GND 10K(NC)
The value of R4 varies with the actual 40MHz(±10ppm)
VDD33 PCB board. GPIO46 VDD33
GPIO45 GND
U0RXD
R3 499 U0TXD
C3 C2 GPIO42 D1
0
GPIO41 ESD
1uF 10nF GPIO40
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
GPIO39
VDD33 GND GPIO38
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND GND GND 62 65
R4
L1 2.0nH(0.1nH) GND GND
C C10 VDD33 1 45 CHIP_PU C
C6 C7 C8 C9 VDD33 2 GND EN 44 GPIO46
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
0.1uF 3 GND IO46 43
3V3 GND
10uF 1uF 0.1uF 0.1uF GPIO0 4 42
GND
VDDA
VDDA
XTAL_P
XTAL_N
GPIO46
GPIO45
U0RXD
U0TXD
MTMS
VDD3P3_CPU
MTDO
MTCK
GPIO38
MTDI
GPIO1 5 IO0 GND 41 GPIO45
GND GPIO2 6 IO1 IO45 40 U0RXD
GND GND GND GND GPIO3 7 IO2 RXD0 39 U0TXD
GPIO4 8 IO3 TXD0 38 GPIO42
RF_ANT LNA_IN IO4 ESP32-S3-MINI-1U IO42
1 L2 TBD 1 42 GPIO37 GPIO5 9 37 GPIO41
2 LNA_IN GPIO37 41 GPIO36 GPIO6 10 IO5 IO41 36 GPIO40
3 VDD3P3 GPIO36 40 GPIO35 GPIO7 11 IO6 IO40 35 GPIO39
ANT1 C11 C12 VDD3P3 GPIO35 IO7 IO39
4
3
2
CHIP_PU 4 39 GPIO34 GPIO8 12 34 GPIO38

CONN TBD TBD GPIO0 5 CHIP_PU GPIO34 38 GPIO33 GPIO9 13 IO8 IO38 33 GPIO37
GPIO1 6 GPIO0 GPIO33 37 GPIO47 GPIO10 14 IO9 IO37 32 GPIO36
24
GPIO2 7 GPIO1 SPICLK_P 36 GPIO48 GPIO11 15 IO10 IO36 31 GPIO35

GPIO3 8 GPIO2 SPICLK_N 35 IO11 IO35
GND GND GND
GPIO4 9 GPIO3 SPID 34 63 64
GPIO4 SPIQ GND GND
IO12
IO13
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26
IO47
IO33
IO34
IO48
GPIO5 10 33
GPIO5 SPICLK
The values of C11, L2 and C12 GPIO6 11
GPIO6 SPICS0
32
VDD_SPI
GPIO7 12 31 U2 GND
vary with the actual PCB board. GPIO7 SPIWP
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
B GPIO8 13 30 B
GPIO8 SPIHD
NC: No component. GPIO9 14
GPIO9 VDD_SPI
29
VDD3P3_RTC
XTAL_32K_N
XTAL_32K_P
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GPIO26
GPIO47
GPIO33
GPIO34
GPIO48
C13 C14
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
SPICS1
0.1uF 1uF
ESP32-S3-MINI-1U(pin-out)
U1 ESP32-S3FN8 GND GND
15
16
17
18
19
20
21
22
23
24
25
26
27
28
VDD33 ESP32-S3FH4R2
ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0
C15
0.1uF
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GPIO26
GND
A A
Figure 6: ESP32S3MINI1U Schematics Title

<ESP32-S3-MINI-1U>
Size Page Name Rev

A4 <02_ESP32-S3-MINI-1U> 1.1 Confidential and Proprietary
Date: Tuesday, May 10, 2022 Sheet 2 of 2
5 4 3 2 1
6 Peripheral Schematics
4 3 2
6 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).
GND
GND
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
62 65
GND GND
VDD33 1 45 EN C2 TBD
GND EN GND
2 44 IO46
3 GND IO46 43 VDD33
IO0 4 3V3 GND 42 JP1
C1 C3 IO1 5 IO0 GND 41 IO45 R1 TBD 1
IO2 6 IO1 IO45 40 RXD0 2 1
22uF 0.1uF IO3 7 IO2 RXD0 39 TXD0 3 2
IO4 8 IO3 TXD0 38 IO42 4 3
IO5 9 IO4 ESP32-S3-MINI-1/ESP32-S3-MINI-1U IO42 37 IO41 4
GND GND IO6 10 IO5 IO41 36 IO40 UART
JP4 IO7 11 IO6 IO40 35 IO39 GND JP2
1 IO8 12 IO7 IO39 34 IO38 TMS 1
1 2 IO9 13 IO8 IO38 33 IO37 TDI 2 1
2 IO10 14 IO9 IO37 32 IO36 TDO 3 2
Boot Option IO11 15 IO10 IO36 31 IO35 TCK 4 3
IO11 IO35 4
GND 63 64 JTAG
IO12
IO13
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26
IO47
IO33
IO34
IO48
GND GND SW1
R7 0 EN
U1
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
C8 0.1uF
IO12
IO13
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26
IO47
IO33
IO34
IO48
GND
C4 12pF(NC)
GND
NC
JP3
1
R3 0(NC) R4 0 USB_D+ 1
X1 USB_D- 1
R5 0(NC) R6 0 2
32.768KHz(NC) 2
2
R2
X1: ESR = Max. 70 KΩ C5 C6 USB OTG

GND TBD TBD
C7 12pF(NC)
NC: No component. GND GND
Figure 7: Peripheral Schematics
• Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal
performance. If you choose to solder it, please apply the correct amount of soldering paste.
• To ensure that the power supply to the ESP32-S3 chip is stable during power-up, it is advised to add an
RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and
C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module
and the power-up and reset sequence timing of the chip. For ESP32-S3’s power-up and reset sequence
timing diagram, please refer to Section Power Scheme in ESP32-S3 Series Datasheet .
4 3 2

7 Physical Dimensions and PCB Land Pattern
7.1 Physical Dimensions
Unit: mm
15.4±0.15 0.8
5.05
0.6
20.5±0.15
14 1.2
15.45
13.2
14.8
12.3
10.6
11.5
13.55
0.6
5
0.
4.5
0.5
Ø
4.5
1.2
0.7 2.4±0.15 10.6
11.5
12.3
13.2
14.8
Top view Side view Bottom view
Figure 8: ESP32S3MINI1 Physical Dimensions
Unit: mm
15.4±0.15 0.8
0.85
0.6
1.2
3.2
1.6
15.4±0.15
13.2
14.8
12.3
10.6
11.5
13.55
0.6
14 4.5
0.5
4.5
1.2
0.7 2.4±0.15 10.6

11.5
12.3
13.2
14.8
Top view Side view Bottom view
Figure 9: ESP32S3MINI1U Physical Dimensions

Note:
For information about tape, reel, and product marking, please refer to Espressif Module Package Information.

7.2 Recommended PCB Land Pattern
Unit: mm
: Pad
15.4
5.05
Pin 1 Antenna Area
1.2
0.6
20.5
13.2
12.3
10.6
14.8
11.5
4.5 1.2
4.5
0.6
10.6
11.5
12.3
13.2
14.8
Figure 10: ESP32S3MINI1 Recommended PCB Land Pattern

Unit: mm
: Pad
Pin 1 15.4
1.2
0.6
13.2
15.4
12.3
10.6
14.8
11.5
1.2
4.5
4.5
0.6
10.6
11.5
12.3
13.2
14.8
Figure 11: ESP32S3MINI1U Recommended PCB Land Pattern

7.3 Dimensions of External Antenna Connector

ESP32-S3-MINI-1U uses the third generation external antenna connector as shown in Figure 12. This connector
is compatible with the following connectors:
• W.FL Series connector from Hirose
• MHF III connector from I-PEX
• AMMC connector from Amphenol
Unit: mm
Tolerance: +/-0.1 mm
CONTACT
A
2.00±0.10
1.7
A
GROUND CONTACT
2.05±0.10
1.7
0.57
0.85
CONTACT
1.40
0.10
HOUSING
HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0;
SHELL
CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;

SECTION: A-A
SCALE: 1:1
SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;
PERFORMANCE:
CONTACT RESISTANCE: 20mOHM Max.
DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE;
INSULATION RESISTANCE: 500MOHM Min.
Figure 12: Dimensions of External Antenna Connector

8 Product Handling
8 Product Handling
8.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and /90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.
After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and
/60%RH. If the above conditions are not met, the module needs to be baked.
8.2 Electrostatic Discharge (ESD)

• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V
8.3 Reflow Profile

Solder the module in a single reflow.
Temperature (℃)
Peak Temp.
235 ~ 250 ℃
250
Preheating zone Reflow zone Cooling zone
150 ~ 200 ℃ 60 ~ 120 s 217 ℃ 60 ~ 90 s –1 ~ –5 ℃/s
217
200
Soldering time
> 30 s
Ramp-up zone
1 ~ 3 ℃/s
100
50
25
Time (sec.)
0
0 50 100 150 200 250
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s

Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 13: Reflow Profile

9 Related Documentation and Resources
9 Related Documentation and Resources

Related Documentation
• ESP32-S3 Series Datasheet – Specifications of the ESP32-S3 hardware.
• ESP32-S3 Technical Reference Manual – Detailed information on how to use the ESP32-S3 memory and peripherals.
• ESP32-S3 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-S3 into your hardware product.
• Certificates
https://espressif.com/en/support/documents/certificates
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents
Developer Zone
• ESP-IDF Programming Guide for ESP32-S3 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
https://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
https://espressif.com/en/support/download/sdks-demos
Products
• ESP32-S3 Series SoCs – Browse through all ESP32-S3 SoCs.
https://espressif.com/en/products/socs?id=ESP32-S3
• ESP32-S3 Series Modules – Browse through all ESP32-S3-based modules.
https://espressif.com/en/products/modules?id=ESP32-S3
• ESP32-S3 Series DevKits – Browse through all ESP32-S3-based devkits.
https://espressif.com/en/products/devkits?id=ESP32-S3
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en
Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
https://espressif.com/en/contact-us/sales-questions

Revision History
Revision History
Date Version Release notes
• Update information about flash and PSRAM on the title page and in Section
1.1
• Add certification and test information
• Add information of new module variants and their ambient operating tem-
perature versions in Table 1
2022-05-24 v1.0 • Add the second note in Table 2
• Add Table 5 and update description of ROM code printing in Section 3.3
• Add notes in Table 11
• Update Bluetooth LE RF data
• Update module schematics in Section 5
• Other minor updates
2021-11-16 v0.6 Overall update for chip revision 1

2021-03-30 v0.1 Preliminary release, for chip revision 0

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Esp32 s3 Mini 1 Mini 1u Datasheet En-2997643

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ESP32­S3­MINI­1

CPU and On­Chip Memory Peripherals

• Up to 8 MB Quad SPI flash

Wi­Fi Antenna Options

• 0.4 µs guard interval support Operating Conditions

Bluetooth – 85 °C version: –40 ~ 85 °C

– 105 °C version: –40 ~ 105 °C

• Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps Certification

• Advertising extensions • RF certification: See certificates for

Espressif Systems 2 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0

Table 1: Ordering Information

• Generic Low-power IoT Data Loggers • Home Automation

• Cameras for Video Streaming • Smart Building

• Over-the-top (OTT) Devices • Industrial Automation

• USB Devices • Smart Agriculture

• Speech Recognition • Audio Applications

• Image Recognition • Health Care Applications

Espressif Systems 3 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0

• Wi-Fi-enabled Toys • Retail & Catering Applications

Espressif Systems 4 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0

7 Physical Dimensions and PCB Land Pattern 26

9 Related Documentation and Resources 32

Espressif Systems 5 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0

Espressif Systems 6 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0

Espressif Systems 7 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0

Figure 1: ESP32­S3­MINI­1 Block Diagram

Figure 2: ESP32­S3­MINI­1U Block Diagram

Espressif Systems 8 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0

3.1 Pin Layout

GND Pin 1 Pin 45 EN

GND Pin 2 Pin 44 IO46

3V3 Pin 3 Pin 43 GND

IO0 Pin 4 Pin 42 GND

IO1 Pin 5 Pin 41 IO45

IO2 Pin 6 GND GND GND Pin 40 RXD0

IO3 Pin 7 Pin 39 TXD0

IO5 Pin 9 Pin 37 IO41

IO6 Pin 10 GND GND GND Pin 36 IO40

IO7 Pin 11 Pin 35 IO39

IO8 Pin 12 Pin 34 IO38

IO9 Pin 13 Pin 33 IO37

IO10 Pin 14 Pin 32 IO36

IO11 Pin 15 Pin 31 IO35

Figure 3: Pin Layout (Top View)

Espressif Systems 9 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0

3.2 Pin Description

Table 2: Pin Definitions

Name No. Type a Function

Espressif Systems 10 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0

Table 2 – cont’d from previous page

3.3 Strapping Pins

ESP32-S3 has four strapping pins:

Espressif Systems 11 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0

EFUSE_DIS_USB_JTAG, EFUSE_DIS_PAD_JTAG, and EFUSE_STRAP_JTAG_SEL that determine the JTAG

Table 3: JTAG Signal Source Selection

EFUSE_STRAP_JTAG_SEL EFUSE_DIS_USB_JTAG EFUSE_DIS_PAD_JTAG JTAG Signal Source

After reset, the strapping pins work as normal-function pins.

ESP32S3MINI1

CPU and OnChip Memory Peripherals

WiFi Antenna Options

Figure 1: ESP32S3MINI1 Block Diagram

Figure 2: ESP32S3MINI1U Block Diagram

4.5 WiFi RF Characteristics

Table 12: WiFi RF Standards

4.5.2 WiFi RF Transmitter (TX) Specifications

4.5.3 WiFi RF Receiver (RX) Specifications

Table 19: Transmitter Characteristics Bluetooth LE 1 Mbps

Table 20: Transmitter Characteristics Bluetooth LE 2 Mbps

Table 21: Transmitter Characteristics Bluetooth LE 125 Kbps

Table 22: Transmitter Characteristics Bluetooth LE 500 Kbps

Table 23: Receiver Characteristics Bluetooth LE 1 Mbps

Table 24: Receiver Characteristics Bluetooth LE 2 Mbps

Table 25: Receiver Characteristics Bluetooth LE 125 Kbps

Table 26: Receiver Characteristics Bluetooth LE 500 Kbps