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Ultrascale Fpga Product Selection Guide PDF

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0% found this document useful (0 votes)
154 views12 pages

Ultrascale Fpga Product Selection Guide PDF

Uploaded by

Afortunatov
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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© Copyright 2013–2016 Xilinx

.
Kintex® UltraScale™ FPGAs
Device Name KU025(1) KU035 KU040 KU060 KU085 KU095 KU115
System Logic Cells (K) 318 444 530 726 1,088 1,176 1,451
Logic Resources CLB Flip-Flops 290,880 406,256 484,800 663,360 995,040 1,075,200 1,326,720
CLB LUTs 145,440 203,128 242,400 331,680 497,520 537,600 663,360
Maximum Distributed RAM (Kb) 4,230 5,908 7,050 9,180 13,770 4,800 18,360
Block RAM/FIFO w/ECC (36Kb each) 360 540 600 1,080 1,620 1,680 2,160
Memory Resources
Block RAM/FIFO (18Kb each) 720 1,080 1,200 2,160 3,240 3,360 4,320
Total Block RAM (Mb) 12.7 19.0 21.1 38.0 56.9 59.1 75.9
CMT (1 MMCM, 2 PLLs) 6 10 10 12 22 16 24
Clock Resources
I/O DLL 24 40 40 48 56 64 64
Maximum Single-Ended HP I/Os 208 416 416 520 572 650 676
Maximum Differential HP I/O Pairs 96 192 192 240 264 288 312
I/O Resources
Maximum Single-Ended HR I/Os 104 104 104 104 104 52 156
Maximum Differential HR I/O Pairs 48 48 48 48 56 24 72
DSP Slices 1,152 1,700 1,920 2,760 4,100 768 5,520
System Monitor 1 1 1 1 2 1 2
Integrated IP PCIe® Gen1/2/3 1 2 3 3 4 4 6
Resources Interlaken 0 0 0 0 0 2 0
100G Ethernet 0 0 0 0 0 2 0
16.3Gb/s Transceivers (GTH/GTY) 12 16 20 32 56 64(2) 64
Commercial -1 -1 -1 -1 -1 -1 -1
Speed Grades Extended -2 -2 -3 -2 -3 -2 -3 -2 -3 -2 -2 -3
Industrial -1 -2 -1 -1L -2 -1 -1L -2 -1 -1L -2 -1 -1L -2 -1 -2 -1 -1L -2
Package Package Dimensions
HR I/O, HP I/O, GTH/GTY
Footprint(3, 4, 5, 6) (mm)
A784(7) 23x23(8) 104, 364, 8 104, 364, 8
A676(7) 27x27 104, 208, 16 104, 208, 16
A900(7) 31x31 104, 364, 16 104, 364, 16
A1156 35x35 104, 208, 12 104, 416, 16 104, 416, 20 104, 416, 28 52, 468, 28
A1517 40x40 104, 520, 32 104, 520, 48 104, 520, 48
C1517 40x40 52, 468, 40
Footprint D1517 40x40 104, 234, 64
Compatible with B1760 42.5x42.5 104, 572, 44 52, 650, 48 104, 598, 52
Virtex® UltraScale
A2104 47.5x47.5 156, 676, 52
Devices
B2104 47.5x47.5 52, 650, 64 104, 598, 64
D1924 45x45 156, 676, 52
F1924 45x45 104, 520, 56 104, 624, 64
Notes:
1. Certain advanced configuration features are not supported in the KU025. Refer to the Configuring FPGAs section in DS890, UltraScale Architecture and Product Overview.
2. GTY transceivers in KU095 devices support data rates up to 16.3Gb/s.
3. Packages with the same package footprint designator, e.g., A2104, are footprint compatible with all other UltraScale devices with the same sequence. See the migration table for details on inter-family migration.
4. Maximum achievable performance is device and package dependent; consult the associated data sheet for details.
5. For full part number details, see the Ordering Information section in DS890, UltraScale Architecture and Product Overview.
6. See UG575, UltraScale Architecture Packaging and Pinouts User Guide for more information.
7. GTH transceivers in A784, A676, and A900 packages support data rates up to 12.5Gb/s.
8. 0.8mm ball pitch. All other packages listed 1mm ball pitch.
Page 2 © Copyright 2013–2016 Xilinx
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Virtex® UltraScale™ FPGAs
Device Name XCVU065 XCVU080 XCVU095 XCVU125 XCVU160 XCVU190 XCVU440
Logic Resources System Logic Cells (K) 783 975 1,176 1,567 2,027 2,350 5,541
CLB Flip-Flops 716,160 891,424 1,075,200 1,432,320 1,852,800 2,148,480 5,065,920
CLB LUTs 358,080 445,712 537,600 716,160 926,400 1,074,240 2,532,960
Maximum Distributed RAM (Kb) 4,830 3,980 4,800 9,660 12,690 14,490 28,710
Block RAM/FIFO w/ECC (36Kb each) 1,260 1,421 1,728 2,520 3,276 3,780 2,520
Memory Resources
Block RAM/FIFO (18Kb each) 2,520 2,842 3,456 5,040 6,552 7,560 5,040
Total Block RAM (Mb) 44.3 50.0 60.8 88.6 115.2 132.9 88.6
CMT (1 MMCM, 2 PLLs) 10 16 16 20 28 30 30
Clock Resources I/O DLL 40 64 64 80 120 120 120
Transceiver Fractional PLL 5 8 8 10 13 15 0
Maximum Single-Ended HP I/Os 468 780 780 780 650 650 1,404
Maximum Differential HP I/O Pairs 216 360 360 360 300 300 648
I/O Resources
Maximum Single-Ended HR I/Os 52 52 52 52 52 52 52
Maximum Differential HR I/O Pairs 24 24 24 24 24 24 24
DSP Slices 600 672 768 1,200 1,560 1,800 2,880
System Monitor 1 1 1 2 3 3 3
PCIe® Gen1/2/3 2 4 4 4 4 6 6
Integrated IP
Interlaken 3 6 6 6 8 9 0
Resources
100G Ethernet 3 4 4 6 9 9 3
GTH 16.3Gb/s Transceivers 20 32 32 40 52 60 48
GTY 30.5Gb/s Transceivers 20 32 32 40 52 60 0
Commercial – – – – – – -1
Speed Grades Extended -1H -2 -3 -1H -2 -3 -1H -2 -3 -1H -2 -3 -1H -2 -3 -1H -2 -3 -2 -3
Industrial -1 -2 -1 -2 -1 -2 -1 -2 -1 -2 -1 -2 -1 -2
Package Package Dimensions
HR I/O, HP I/O, GTH 16.3Gb/s, GTY 30.5Gb/s
Footprint(1, 2, 3) (mm)
C1517 40x40 52, 468, 20, 20 52, 468, 20, 20 52, 468, 20, 20
Footprint D1517 40x40 52, 286, 32, 32 52, 286, 32, 32 52, 286, 40, 32
Compatible with
B1760 42.5x42.5 52, 650, 32, 16 52, 650, 32, 16 52, 650, 36, 16
Kintex® UltraScale
A2104 47.5x47.5 52, 780, 28, 24 52, 780, 28, 24 52, 780, 28, 24
Devices
B2104 47.5x47.5 52, 650, 32, 32 52, 650, 32, 32 52, 650, 40, 36 52, 650, 40, 36 52, 650, 40, 36
C2104 47.5x47.5 52, 364, 32, 32 52, 364, 40, 40 52, 364, 52, 52 52, 364, 52, 52
B2377 50x50 52, 1248, 36, 0
A2577 52.5x52.5 0, 448, 60, 60
A2892 55x55 52, 1404, 48, 0
Notes:
1. Packages with the same package footprint designator, e.g., A2104, are footprint compatible with all other UltraScale devices with the same sequence. See the migration table for details on inter-family migration.
2. For full part number details, see the Ordering Information section in DS890, UltraScale Architecture and Product Overview.
3. See UG575, Kintex UltraScale and Virtex UltraScale FPGAs Packaging and Pinouts User Guide for more information.

Page 3 © Copyright 2013–2016 Xilinx


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UltraScale Device Ordering Information

Footprint

XC V U ### -1 F L V A #### C
Xilinx V: Virtex UltraScale Value Index Speed Grade F: Flip-Chip F: Lid V: RoHS 6/6 Package Package Temperature
Commercial K: Kintex -1 = Slowest (1.0mm) L: Lid SSI G: RoHS 6/6 Designator Pin Count Grade
-L1 = Low Power S: Flip-Chip B: Lidless w/exemption 15 (C, E, I)
(Kintex only) (0.8mm)
-H1 = Slowest or Mid
(Virtex only)
-2 = Mid
-3 = Fastest
C = Commercial (Tj = 0°C to +85°C)
E = Extended (Tj = 0°C to +100°C)
I = Industrial (Tj = –40°C to +100°C)

For valid part/package combinations,


go to DS890, UltraScale Architecture and Product Overview: Device-Package Combinations and Maximum I/Os Tables

Important: Verify all data in this document with the device data sheets found at www.xilinx.com

Page 4 © Copyright 2013–2016 Xilinx


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UltraScale™ Device Footprint Compatibility
HR I/O, HP I/O, GTH 16.3Gb/s; GTY 30.5Gb/s 23mm–42.5mm
Package
Dimensions 23x23 27x27 31x31 35x35 40x40 42.5x42.5
(mm)
Package
A784 A676 A900 A1156 A1517 C1517 D1517 B1760
Footprint

XCKU025 104, 208, 12, 0

XCKU035 104, 364, 8, 0 104, 208, 16, 0 104, 364, 16, 0 104, 416, 16, 0

XCKU040 104, 364, 8, 0 104, 208,16, 0 104, 364, 16, 0 104, 416, 20, 0

XCKU060 104, 416, 28, 0 104, 520, 32, 0

XCKU085 N/A 104, 520, 48, 0 104, 572, 44, 0

XCKU095 52, 468, 20, 8(1) N/A 52, 468, 20, 20(1) 52, 650, 32, 16(1)

XCKU115 104, 520, 48, 0 N/A 104, 234, 64, 0 104, 598, 52, 0

XCVU065 52, 468, 20, 20 N/A N/A

XCVU080 Footprint compatibility is 52, 468, 20, 20 52, 286, 32, 32 52, 650, 32, 16
indicated by shading per column.
XCVU095 52, 468, 20, 20 52, 286, 32, 32 52, 650, 32, 16

XCVU125 52, 286, 40, 32 52, 650, 36, 16


Notes:
1. GTY transceivers in KU095 devices support data rates up to 16.3Gb/s. Refer to data sheet for details.

Important: Verify all data in this document with the device data sheets found at www.xilinx.com

Page 5 © Copyright 2013–2016 Xilinx


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UltraScale™ Device Footprint Compatibility 45mm–55mm
HR I/O, HP I/O, GTH 16.3Gb/s; GTY 30.5Gb/s
Package
Dimensions 45x45 47.5x47.5 50x50 52.5x52.5 55x55
(mm)
Package
D1924 F1924 A2104 B2104 C2104 B2377 A2577 A2892
Footprint

XCKU035

XCKU040

XCKU060

XCKU085 104, 520, 56, 0

XCKU095 N/A 52, 650, 32, 32(1)

XCKU115 156, 676, 52, 0 104, 624, 64, 0 156, 676, 52, 0 104, 598, 64, 0

XCVU065 N/A N/A

XCVU080 52, 780, 28, 24 52, 650, 32, 32

XCVU095 52, 780, 28, 24 52, 650, 32, 32 52, 364, 32, 32

XCVU125 52, 780, 28, 24 52, 650, 40, 36 52, 364, 40, 40

XCVU160 52, 650, 40, 36 52, 364, 52, 52

XCVU190 Footprint compatibility is 52, 650, 40, 36 52, 364, 52, 52 0, 448, 60, 60
indicated by shading per column.
XCVU440 52, 1248, 36, 0 52, 1404, 48, 0

Notes: Important: Verify all data in this document with the device data sheets found at www.xilinx.com
1. GTY transceivers in KU095 devices support data rates up to 16.3Gb/s. Refer to data sheet for details.
Page 6 © Copyright 2013–2016 Xilinx
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UltraScale Architecture Migration Table
UltraScale and UltraScale+ families provide footprint compatibility to enable users to migrate designs from one
device or family to another. Any two packages with the same footprint identifier code are footprint compatible.
Kintex® UltraScale™ Kintex UltraScale+™ Virtex® UltraScale Virtex UltraScale+
Pkg mm
KU025 KU035 KU040 KU060 KU085 KU095 KU115 KU3P KU5P KU9P KU11P KU13P KU15P VU065 VU080 VU095 VU125 VU160 VU190 VU440 VU3P VU5P VU7P VU9P VU11P VU13P

A784 23 X X

B784 23 X X

A676 27 X X

B676 27 X X

A900 31 X X

D900 31 X X X

E900 31 X X

A1156 35 X X X X X X X

A1517 40 X X X

C1517 40 X X X X X

D1517 40 X X X X

E1517 40 X X

A1760 42.5 X

B1760 42.5 X X X X X X

E1760 42.5 X

D1924 45 X

F1924 45 X X X

A2104 47.5(1) X X X X X X X X

B2104 47.5(1) X X X X X X X X X X X X

C2104 47.5(1) X X X X X X X X X

B2377 50 X

A2577 52.5 X X X X

A2892 55 X

Notes: Legend
1. The body size of the VU13P device in the A2104, B2104, and C2104 packages is 52.5mm. These packages are footprint compatible with the corresponding 47.5mm body size packages.
See UG583, UltraScale Architecture PCB Design User Guide for important migration details. Device
Migration Path
Page 7 © Copyright 2013–2016 Xilinx
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Digital Signal Processing Metrics
UltraScale architecture further enhances the Xilinx DSP48 slice with features designed to allow users to
do more calculations in fewer DSP resources, enhancing both device utilization and performance.
Examples include wider multipliers for floating point calculations, wide XOR functions for ECC, CRC, and
EFEC, and pre-adder squaring for rounding algorithms.

DSP Slice Count


XCKU025 1152
XCKU035 1700
XCKU040 1920
XCKU060 2760
XCKU085 4100
XCKU095 768
XCKU115 5520

XCVU065 600
XCVU080 672
XCVU095 768
XCVU125 1200
XCVU160 1560 Speed grade -1 -2 -3
XCVU190 1800 FMAX [MHz] 594 661 741
XCVU440 2880 Max GMAC/s 6558 7297 8181

For more information, refer to: UG579, UltraScale Architecture DSP Slice User Guide

Important: Verify all data in this document with the device data sheets found at www.xilinx.com

Page 8 © Copyright 2013–2016 Xilinx


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Block RAM Metrics
UltraScale architecture block RAM adds new features to increase performance, device utilization, and
power efficiency. These new features are designed to provide highly efficient solutions for applications in
the Wireless, Wired, Video, and Signal Processing markets by offering hardened memory cascade to
reduce fabric use and increase performance, and flexible hard FIFO and user accessible dynamic power
control to reduce power.

XCKU025 13 Block RAM Capacity (Mb)


XCKU035 19
XCKU040 21
XCKU060 38
XCKU085 57
XCKU095 59
XCKU115 76
XCVU065 44
XCVU080 50
XCVU095 61
XCVU125 89
XCVU160 115
XCVU190 133
XCVU440 89

Speed grade -1 -2 -3
True dual-port Block RAM FMAX [MHz] 525 585 660
For more information, refer to: UG573, UltraScale Architecture Memory Resources User Guide
Important: Verify all data in this document with the device data sheets found at www.xilinx.com

Page 9 © Copyright 2013–2016 Xilinx


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High-Speed Serial Transceivers
For high bandwidth applications, including 500Gb/s, 400Gb/s, and 100Gb/s line cards, serial data transmission
across backplanes and longer distances is becoming increasingly important. UltraScale architecture serial
transceivers include the proven on-chip circuits required to provide optimal signal integrity in real world
environments, at data rates up to 16.3Gb/s (GTH) and 30.5Gb/s (GTY).
Total Transceiver Count GTH = 16.3Gb/s GTH GTY
XCKU025 12 GTY = 30.5Gb/s
XCKU035 16
XCKU040 20
XCKU060 32
XCKU085 56
XCKU095 32 32(1)
XCKU115 64

XCVU065 20 20
XCVU080 32 32
XCVU095 32 32
XCVU125 40 40
XCVU160 52 52
XCVU190 60 60
XCVU440 48
For more information, refer to UG576, UltraScale Architecture GTH Transceivers User Guide and UG578, UltraScale Architecture GTY Transceivers User Guide
Notes:
1. GTY up to 16.3Gb/s. Refer to data sheet for details. Important: Verify all data in this document with the device data sheets found at www.xilinx.com
Page 10 © Copyright 2013–2016 Xilinx
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Transceiver Aggregate Bandwidth
For high bandwidth applications, including 500Gb/s, 400Gb/s, and 100Gb/s line cards, serial data transmission
across backplanes and longer distances is becoming increasingly important. UltraScale architecture serial
transceivers include the proven on-chip circuits required to provide optimal signal integrity in real world
environments, at data rates up to 16.3Gb/s (GTH) and 30.5Gb/s (GTY).
Transceiver Aggregate Bandwidth (Gb/s) GTH = 16.3Gb/s GTH GTY
XCKU025 391 GTY = 30.5Gb/s
XCKU035 522
XCKU040 652
XCKU060 1043
XCKU085 1826
XCKU095 1043 1043(1)
XCKU115 2086

XCVU065 652 1220


XCVU080 1043 1952
XCVU095 1043 1952
XCVU125 1304 2440
XCVU160 1695 3172
XCVU190 1956 3660
XCVU440 1565
Transceiver Aggregate Bandwidth (Gb/s) = # of Transceivers x Maximum Line Rate x 2 (Full Duplex)
For more information, refer to UG576, UltraScale Architecture GTH Transceivers User Guide and UG578, UltraScale Architecture GTY Transceivers User Guide
Notes: Important: Verify all data in this document with the device data sheets found at www.xilinx.com
1. GTY up to 16.3Gb/s. Refer to data sheet for details.
Page 11 © Copyright 2013–2016 Xilinx
.
References

DS890, UltraScale Architecture and Product Overview


DS892, Kintex UltraScale FPGA Data Sheet: DC and AC Switching Characteristics
DS893, Virtex UltraScale FPGA Data Sheet: DC and AC Switching Characteristics
UG570, UltraScale Architecture Configuration User Guide
UG571, UltraScale Architecture SelectIO Resources User Guide
UG572, UltraScale Architecture Clocking Resources User Guide
UG573, UltraScale Architecture Memory Resources User Guide
UG574, UltraScale Architecture Configurable Logic Block User Guide
UG575, Kintex UltraScale and Virtex UltraScale FPGAs Packaging and Pinout User Guide
UG576, UltraScale Architecture GTH Transceivers User Guide
UG578, UltraScale Architecture GTY Transceivers User Guide
UG579, UltraScale Architecture DSP Slice User Guide
UG580, UltraScale Architecture System Monitor User Guide
UG583, UltraScale Architecture PCB and Pin Planning User Guide
PG150, LogiCORE IP UltraScale Architecture-Based FPGAs Memory Interface Solutions
Important: Verify all data in this document with the device data sheets found at www.xilinx.com XMP102 (v1.7)

Page 12 © Copyright 2013–2016 Xilinx


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