323-1851-102.1 (6500 R11.2 CommonEqpt) Issue1
323-1851-102.1 (6500 R11.2 CommonEqpt) Issue1
323-1851-102.1 (6500 R11.2 CommonEqpt) Issue1
Common Equipment
Release 11.2
What’s inside...
Shelf processor circuit packs
Cross-connect circuit packs
BIP/FIP/AP/MIC/rectifier/Power Input Card
External equipment
4xOptical Protection Switch (OPS)
Contents 0
List of procedures
5-1 Provisioning 4xOPS circuit packs and OPSM2 modules automatically 5-23
5-2 Routing fiber-optic cables onto the 6500 shelf 5-25
5-3 Connecting or disconnecting fiber-optic cables to or from circuit packs 5-38
5-4 Editing facility parameters 5-40
5-5 Changing the protection parameters for a pair of facilities 5-41
5-6 Changing the primary state of a facility 5-44
5-7 Changing the primary state of a circuit pack or pluggable 5-47
5-8 Deleting a facility from an equipment 5-49
5-9 Deleting a circuit pack or pluggable 5-51
Equipment and facility provisioning parameters 5-52
Equipment and facility primary and secondary states 5-52
OPTMON facility parameters 5-53
ADJ facility parameters 5-54
Issue 1
The following new/enhanced features are covered in this document:
• new circuit packs
— 100G OTR WaveLogic 3n Extended C-Band 1xQSFP28 circuit pack
(NTK538EJ)
— 100G OTR WaveLogic 3n Enhanced C-Band 1xQSFP28 circuit pack
(NTK538EK)
— 100G OTR WaveLogic 3n Standard C-Band 1xQSFP28 circuit pack
(NTK538EL)
— 100G OTR WaveLogic 3n Basic C-Band 1xQSFP28 circuit pack
(NTK538EM)
— Flex4 WaveLogic 3e OCLD Premium with EDFA NxOTU4 C-Band
circuit pack (NTK539FJ)
— Flex4 WaveLogic 3e OCLD Submarine with EDFA NxOTU4 C-Band
circuit pack (NTK539FN)
— 200G MUX 2x100G/5x40G QSFP28/QSFP+ circuit pack (NTK529HA)
• Transceiver Triggered Switch (TTS)
Supporting WaveLogic Photonics 6500 Data 6500 Control Plane Submarine Networking
Documentation Coherent Select Application Guide Application Guide Application Guide
(323-1851-980) (NTRN15BA) (NTRN71AA) (NTRN72AA)
6500 Photonic Common 6500 - 5400 / 8700 Network Interworking Universal AC Rectifier
Layer Guide Photonic Layer Interworking Solution Guide Application Note
(NTRN15DA) Technical Publications (323-1851-160) (NTCA68CA) (009-2012-900)
The shelf processor circuit pack is the central processor for the 6500 shelf.
• Figure 1-1 on page 1-2 provides an overview of the shelf processor (SP)
faceplate.
• Figure 1-2 on page 1-3 provides an overview of the shelf processor
(SP-2) faceplate.
• Figure 1-3 on page 1-3 provides an overview of the shelf processor
(SP-2 Dual CPU) faceplate.
• Figure 1-4 on page 1-4 provides an overview of the shelf processor
(SPAP) faceplate.
• Figure 1-5 provides an overview of the shelf processor w/access panel
(SPAP-2) w/2xOSC 2xSFP faceplate.
• Figure 1-6 on page 1-6 shows the functional block diagram of a SP circuit
pack (NTK555AAE5/NTK555ABE5).
• Figure 1-7 on page 1-7 shows the functional block diagram of a SP-2
circuit pack (NTK555CAE5).
• Figure 1-8 on page 1-8 shows the functional block diagram of a SP-2
circuit pack (NTK555EAE5).
• Figure 1-9 on page 1-9 shows the functional block diagram of a SP-2 Dual
CPU circuit pack (NTK555FAE5).
• Figure 1-10 on page 1-10 shows the functional block diagram of a shelf
processor w/access panel (SPAP) circuit pack (NTK555LA).
Figure 1-2
Shelf processor faceplate (SP-2; NTK555CAE5 and NTK555EAE5)
Figure 1-3
Shelf processor faceplate (SP-2 Dual CPU; NTK555FAE5)
Figure 1-4
Shelf processor faceplate (Shelf processor w/access panel [SPAP]; NTK555LA)
Fail
Critical
Ready Major
In Use Minor
SP
Figure 1-5
Shelf processor faceplate (shelf processor w/access panel [SPAP-2] w/2xOSC 2xSFP; NTK555NA)
Telemetry In WSC 3
OSC-1 OSC-2
SP
Alarms
Fail
Critical
Ready Major
Minor
In Use
Alarms
10/100BT RJ-45
connector for WSC 4
Telemetry Out craft interfaces 10/100BT RJ-45 connectors
for COLAN-X and ILAN OUT
interfaces
Figure 1-6
Shelf processor circuit pack block diagram (NTK555AAE5/NTK555ABE5)
Service 10/100BT
slots RJ-45
RS-232
(DCE)
Ethernet
Switch
Backplane
Access
Panel
MIC
Flash
Processor Disk
Shelf Module
Control
IO
Panel
Power
Supply
Figure 1-7
Shelf processor circuit pack block diagram (NTK555CAE5)
Service 10/100BT
slots RJ-45
Ethernet
Switch
Backplane
Access USB
Panel
USB
MIC
Compact
Processor Flash
Shelf Module
Control
IO
Panel
Power
Supply
Figure 1-8
Shelf processor circuit pack block diagram (NTK555EAE5)
Service 10/100BT
slots RJ-45
Ethernet
Switch
Backplane
Access USB
Ethernet
Panel
Switch
USB
MIC
Compact
Processor Flash
Shelf Module
Control
IO
Panel
Power
Supply
Figure 1-9
Shelf processor circuit pack block diagram (NTK555FAE5)
Service 10/100BT
slots Ethernet RJ-45
Switch
Processor
Module
Ethernet
Backplane
Switch
Access
Panel
USB
USB
MIC
Compact
Processor Flash
Shelf Module
Control
IO
Panel
Power
Supply
Figure 1-10
Shelf processor w/access panel (SPAP) circuit pack block diagram (NTK555LA)
Ethernet Switch
Service RJ45 Slot 83 83
Equipment
Slots RJ45 Slot 84 84
Inventory RJ45 Slot 85 85
Backplane
Telemetry
Shelf Flash
Control Processor Module Disk
Power
Supply
Figure 1-11
Block diagram for the integrated shelf processor + OTN Flex MOTR 8xSFP in a NTK503MAE5 or
NTK503NAE5 variant of 2-slot shelf type
Ethernet Switch
RJ45 Slot-25 25
Equipment
RJ45 Slot-26 26
Inventory RJ45 Slot-27 27
Backplane
Telemetry
Service Processor Module
slots
SFP 1
SFP 2
SFP 3
Flash SFP 4
Disk 10G OTN Flex Mapper
SFP 5
SFP 6
SFP 7
Power SFP 8
Supply
Figure 1-12
Shelf processor w/access panel (SPAP-2) w/2xOSC 2xSFP circuit pack (NTK555NA) block
diagram
Telemetry
Input RJ45
Shelf
Control
Telemetry
Processor Module Output RJ45
Alarm DB-9
Flash
Power
Disk Supply
Legend
EOS Ethernet Over SONET
OSC Optical Service Channel
Supported functionality
The SP circuit packs (NTK555AAE5/NTK555ABE5/NTK555CAE5/
NTK555EAE5/NTK555FAE5/NTK555LA/NTK555NA) provide the following
functionality.
• perform software management for the shelf software management for all
circuit packs on the shelf (software, firmware and FPGA loads)
• maintain backup copy of all system software on a flash disk
• manage all shelf communications across the central office DCN (COLAN),
Local Intershelf LAN (ILAN) and intrasite LAN via optical Data
Communications Channels (DCC) or Optical Service Channels (OSC)
• manage and monitor the other circuit packs in the shelf
• provide the OAM interfaces for monitoring and provisioning the shelf
• maintain shelf provisioning database and on-shelf backups
• provide an RS-232 DCE port and a 10/100Base-T interface on the
faceplate for access to the craft user interface (only NTK555AAE5 and
NTK555ABE5). There is no RS-232 DCE port on any other shelf
processor circuit packs.
• provide a 10/100Base-T interface on the faceplate for access to the craft
user interface (NTK555CAE5, NTK555EAE5, and NTK555FAE5)
• provide three 10/100Base-T interfaces on the faceplate for access to the
COLAN-X, ILAN-OUT, and craft user interface on the integrated shelf
processor in a 2-slot shelf (NTK503MAE5 or NTK503NAE5 variant).
• provide three 10/100Base-T interfaces on the faceplate for access to the
COLAN-X, ILAN-OUT, and craft user interface on the shelf processor
w/access panel (NTK555LA).
• provide five 10/100Base-T interfaces on the faceplate for access to the
COLAN-X, COLAN-A, ILAN-IN, ILAN-OUT, and craft user interface on the
shelf processor SPAP-2 w/2xOSC (NTK555NA)
Note: Each LAN port is configurable as half-duplex 10 Mbit/s, half-duplex
100 Mbit/s, full-duplex 10 Mbit/s, full-duplex 100 Mbit/s, or Automatic. If
you set the configuration to Automatic, auto-negotiation is enabled. Auto-
negotiation automatically senses the speed (10BT/100BT), and mode
(half-/full-duplex) settings of the link. If the configuration is set to
Automatic, the LAN ports automatically detect the correct MDI/MDI-X
setting to use, so either straight or crossover cables can be used. If the
configuration is not set to automatic, then use a straight cable to connect
MDI to MDI-X interface types, and a crossover cable to connect MDI to
MDI and MDI-X to MDI-X interface types.
• Figure 1-13 on page 1-16 shows the ordering simplified flowchart for the
shelf processors used in 6500-7 packet-optical, 2-slot (only NTK503LA
variant), 7-slot, 14-slot, or 32-slot shelf types. Shelf processor is an
integrated part of NTK503MAE5 and NTK503NAE5 variants a 2-slot shelf
and cannot be ordered separately.
• Table 1-1 on page 1-17 and Table 1-2 on page 1-19 show the supported
shelf processor types in this release of 6500 and a simplified comparison.
Table 1-3 on page 1-21 shows the supported shelf processor types
(non-integrated and orderable) in this release of 6500 and a detailed
comparison.
Figure 1-13
Shelf processor ordering simplified flowchart for 6500-7 packet-optical, 2-slot, 7-slot, 14-slot, and
32-slot shelf types (Release 11.2)
Yes
SONET/SDH Control Plane or
Photonics Layer 0 Control Plane
application?
No
32-slot shelf or common shelf Yes
processor for 7/14/32-slot
shelf types?
No
SP-2 redundancy: two SP-2 kits
Table 1-1
6500 shelf processor type (simplified comparison as per functionality)
NTK555AAE5 No 1x 1x 1x No
Note 1
NTK555ABE5 Yes 1x 1x 1x No
Note 1 Note 3
NTK555LA Yes 1x 1x 1x No
Note 1 Note 8
Integrated Yes 1x 1x 1x No
Note 1 Note 10
Table 1-2
6500 shelf processor type (simplified comparison as per shelf type)
NTK555LA Yes No No No No
Note 1 Note 10
Integrated Yes No No No No
Note 1 Note 12
Note 10: This SPAP shelf processor w/access panel is only supported in 2-slot optical Type 2 shelf
(NTK503LA variant).
Note 11: This SPAP-2 w/2xOSC shelf processor also includes two OSC SFP ports and 2 Wayside
Ethernet (RJ-45) ports to provide equivalent functionality to an OSC w/WSC 2 Port SFP 2 port 10/
100BT (2xOSC) circuit pack (NTK554BAE5). This shelf processor is only supported in the 2-slot optical
Type 2 shelf (NTK503LA variant) and the 7-slot optical Type 2 shelf (NTK503KA variant).
Note 12: This shelf processor is integrated in the NTK503MAE5 and NTK503NAE5 variants of 2-slot
shelf type.
Table 1-3
6500 shelf processor type (detailed comparison for non-integrated shelf processors)
Support for √ √
32-slot shelf (all
variants)
Support for √ √ √ √
14-slot shelf (all
variants)
Support for √ √ √ √
7-slot optical
shelf
(NTK503PAE5)
Support for √
7-slot optical
Type 2 shelf
(NTK503KA)
Support for √ √ √
6500-7
packet-optical
shelf
(NTK503RA)
Support for √ √
2-slot optical
Type 2 shelf
(NTK503LA)
MSPP services √ √ √ √
10G Broadband √ √ √ √ √ √
services
(excludes
encryption)
Encryption √ √ √ √
circuit packs
40G Broadband √ √ √ √ √ √
services
ULH Broadband √ √ √ √
services
100G √ √ √ √
Broadband
services
Passive √ √ √ √ √ √
Photonics
Equipment
Non-passive √ √ √ √ √
Photonics
Equipment
Nodal √ √ √ √
MSPP/
Broadband/
Photonics
services
SONET/SDH √
Control Plane
and Photonics
Layer 0 Control
Plane
OTN switching √ √ √
Integrated OSC √
on shelf
processor
Colorless √ √ √
Photonics
Support for √ √ √
OTN I/F and
PKT I/F circuit
packs
Support for √ √ √
eMOTR circuit
pack
Large DCN √ √ √ √
Release server √ √ √ √
OTN Control √ √ √
Plane
Primary shelf of √ √ √ √ √
TIDc
consolidated
node
WaveLogic √ √ √ √
Photonics
Coherent Select
IPv6 support √ √ √ √
Supported SFPs
Table 1-4 provides a list of the SFPs that are supported on the shelf processor
SPAP-2 w/2xOSC (NTK555NA).
Table 1-4
Supported SFP modules for the shelf processor SPAP-2 w/2xOSC (NTK555NA)
Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1 and Note 2)
Note 1: Facilities on photonic circuit packs are auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities that cannot be manually added or deleted.
Note 2: OSC reach can be guaranteed only when both ends of the link are using the same SFP type.
This is enforced through procedure and One Planner design.
Note 3: The P155M pluggable on the SPAP-2 w/2xOSC circuit pack supports WSC facilities. These
facilities are not displayed or managed in the Equipment & Facilities Provisioning applications. They are
handled by Comms Setting Management application through LAN option under Interfaces tab. If you
provision the low output power SFP (NTK592NG) or the extended reach SFP (NTK592NV), the
connected LIM port 4 OPTMON facility will be put OOS automatically to prevent the “Loss of Signal”
alarm from being raised.
Performance monitoring
The SPAP-2 w/2xOSC circuit pack supports the following monitored entities:
• PM collection of SONET section (S)/SDH regenerator section (RS) at OC-
3/STM-1 rate for OSC facilities
• PM collection of SONET line (L)/SDH multiplex section (MS) at OC-3/
STM-1 rate for OSC facilities
• Physical layer PM collection for OSC facilities
Alarms
For a complete list of alarm and alarm clearing procedures for the 6500, refer
to Part 1 and Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
The following alarms are raised by the Shelf Processor Circuit pack. Since the
Shelf Processor is the primary shelf controller, it is responsible for raising
alarms against:
— Shelf Processor Equipment
— Comms facilities that are based on the SP circuit pack
— Common Shelf Equipment
— Shelf Security
— External Alarms/Controls
Note that other shelf alarms may be raised, such as timing alarms, that are
raised by the circuit pack that supports them (for example, the Cross Connect/
Sync circuit pack).
• Autoprovisioning Mismatch
• CPU2 Unreachable
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Circuit Pack Latch Open
• Circuit Pack Upgrade Failed
• Autoprovisioning Mismatch - Pluggable
• Circuit Pack Missing - Pluggable
• Circuit Pack Mismatch - Pluggable
Security alarms
• All provisioned RADIUS Server Unavailable
• Intrusion Attempt
• Primary RADIUS Server Unavailable
• Secondary RADIUS Server Unavailable
• Dormant account detected
• Primary RADIUS Accounting Server Unavailable
• Secondary RADIUS Accounting Server Unavailable
• All Provisioned RADIUS Accounting Servers Unavailable
Equipping rules
The following equipping rules apply to shelf processor circuit packs:
• is a single slot interface
• can be equipped in slots 15 and 16 of 6500-7 packet-optical or 14-slot
shelf types. The two shelf processors in a 6500-7 packet-optical or 14-slot
shelf support shelf processor redundancy through 1+1 equipment
protection where the shelf processor in slot 15 (working SP) is the active
shelf processor by default while the shelf processor in slot 16 (protection
SP) provides support for shelf processor equipment protection, local
dynamic and real time database redundancy/backup. If the shelf
processor in slot 15 fails, the standby shelf processor in slot 16 takes over
and becomes the active shelf processor.
• can be equipped in slots 41 and 42 of 32-slot shelf types. The two shelf
processors in a 32-slot shelf support shelf processor redundancy through
1+1 equipment protection where the shelf processor in slot 41 (working
SP) is the active shelf processor by default while the shelf processor in slot
42 (protection SP) provides support for shelf processor equipment
protection, local dynamic and real time database redundancy/backup. If
the shelf processor in slot 41 fails, the standby shelf processor in slot 42
takes over and becomes the active shelf processor.
• can be equipped in slot 15 of the 7-slot shelf types. Since there is only one
shelf processor equipped in a 7-slot shelf, shelf processor redundancy
and therefore shelf processor equipment protection, local dynamic and
real time database redundancy/backup are not supported in a 7-slot shelf
type.
• is an integrated part of the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or a field-replaceable shelf processor w/access panel (SPAP)
(NTK555LA)/shelf processor w/access panel (SPAP-2) w/2xOSC 2xSFP
(NTK555NA) in NTK503LA variant of 2-slot shelf on slot 15. Since there is
only one shelf processor equipped in a 2-slot shelf, shelf processor
redundancy and therefore shelf processor equipment protection, local
dynamic and real time database redundancy are not supported in a 2-slot
shelf type.
ATTENTION
When a shelf is configured to run without redundant shelf processors, the
standalone shelf processor must be inserted in slot 15 of 6500-7 packet-
optical shelf type or 14-slot shelf types or slot 41 of 32-slot shelf type. The
standalone shelf processor in a 2-slot optical Type 2 shelf type or 7-slot shelf
type must be always inserted in slot 15.
• both SPs forming the 1+1 protection group must be the same PEC. The
only exception is when using NTK555AAE5 and NTK555ABE5. A 1+1 SP
protection group can have an NTK555AAE5 and NTK555ABE5 only if the
14-slot shelf is not equipped with the NTK505MB Access Panel and an
OMX, OMD4, CMD44, BMD2, UBMD2, MBMD2, GMD10, FIM Type 1,
FIM Type 2, FIM Type 4, FIM Type 5, FIM Type 6, or DSCM circuit pack is
not provisioned in the access panel slots (83-90).
ATTENTION
In a 14-slot or 32-slot shelf with 1+1 SP protection provisioned, only one SP
must be replaced at a time. Removal of both shelf processors affects external
communications to/from the 6500 shelf (local or remote craft access is not
possible) and can result in data loss. When replacing a redundant SP, wait at
least 5 minutes after the SP has been inserted before replacing the second
SP.
ATTENTION
In a 6500 shelf that has photonic modules, for example, SLA, MLA, WSS,
while traffic is not affected by removal or failure of both shelf processors in a
redundant configuration or removal/failure of a non-redundant shelf
processor, it will result in the loss of photonic adjustment control within the
DOC domain that the shelf resides. Existing traffic is not affected, however,
the ability of the photonic system to adjust the channels if needed is lost.
• For SP-2 Dual CPU circuit packs, the shelves must be equipped with two
SP-2 Dual CPU circuit packs if the SONET/SDH Control Plane or Layer 0
Control Plane is enabled. Note that If the SONET/SDH Control Plane or
Layer 0 Control Plane is not activated, then it is not mandatory to have two
SP-2 Dual CPU circuit packs. Also if the OTN Control Plane is used, it is
not mandatory to have two SP-2 circuit packs.
Technical specifications
Table 1-5 on page 1-31 lists the weight, power consumption, and SFP
specifications for the shelf processor circuit packs.
Table 1-5
Weight and power consumption for shelf processor circuit packs
Shelf processor (SP-2 Dual CPU) circuit pack 1.2 kg (2.6 lb) 57 61
(NTK555FAE5) (see Note 3 and (see Note 3 and
Note 4) Note 4)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of AC-
powered equipment. For practical purposes, the rounded typical power consumption of an equipment
can be used as the equipment heat dissipation when calculating facilities thermal loads (an estimate of
the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: When equipped in a 14-slot packet-optical shelf (NTK503SA), this module is powered in feeder
zone 2 and its power is attributed to the zone 2 power budget.
Note 4: When equipped in a 32-slot shelf, this module is powered in feeder zone 2 and its power is
attributed to the zone 2 power budget.
Note 5: For optical SFP specifications, see the following sections in Part 3 of 6500 Planning,
NTRN10DP (Chapter 8):
— “OSC w/WSC 2 Port SFP 2 Port 10/100BT (2xOSC) circuit packs and 2xOSC ports on shelf
processor SPAP-2 w/2xOSC optical specifications”
Table 1-6
DCE DB9 female connector pinout (NTK555AAE5/NTK555ABE5)
Table 1-7 provides the pinout of the 10/100Base-T RJ-45 connectors on the
shelf processor.
Table 1-7
10/100Base-T RJ-45 pinout
Signal
RJ-45 Plug Pin
Shelf Access panel 48x10/100BT I/
processor O panel
All procedures assume that the user is logged in to the network element with
the appropriate user privilege code. Refer to the login procedures in
Administration and Security, 323-1851-301.
Configure SP
Equipment Protection
Procedure 1-2
End
Procedure
Table 1-8
Procedures in this chapter
Topic Page
Procedure 1-2, Changing the protection scheme for a pair of SPs 1-35
Procedure 1-1
Provisioning a circuit pack automatically
If automatic equipping is enabled, when inserted in the shelf, the SP circuit
pack is automatically provisioned as in-service.
Refer to “Equipping rules” on page 1-29 for supported slots for the SP circuit
pack.
CAUTION
Risk of equipment damage
Electrostatic discharge (ESD) can damage electrostatic
sensitive devices. Use antistatic protection to avoid damaging
circuit packs.
Prerequisites
• To provision the SP in slot 16 or 42, ensure the last SP that occupied the
slot has been deleted from equipment provisioning.
• Ensure the plastic pin protector on the circuit pack has been removed.
Step Action
Procedure 1-2
Changing the protection scheme for a pair of SPs
Use this procedure to change the protection scheme for a pair of SP
equipment:
• from 1+1 SP to unprotected
• from unprotected to 1+1 SP
Prerequisites
To perform this procedure, you must use an account with a level 3 or higher
UPC.
Step Action
3
CAUTION
Risk of communication loss
If you place an SP out-of-service, you may cause a loss
of communication.
ATTENTION
If the SP in the even slot is currently the active SP, an SP protection switch will occur
and all users will be logged out. It may take up to 15 minutes to regain contact with
the shelf.
Step Action
ATTENTION
When two SPs are equipped in a shelf but no protection is provisioned, if you place
the active SP in the odd slot to out of service while the SP in even slot is in service,
no switch will occur. The SP in the odd slot is still acting as the active SP in the shelf
and will respond to all internal and external service requests. Removing the SP in
the odd slot will result in loss of communication to the shelf and loss of all SP
support. Before removing the SP in the odd slot, ensure that equipment protection
is provisioned as 1+1 to ensure an auto switch will occur.
Procedure 1-3
Changing the primary state of a circuit pack
Use this procedure to change the primary state of a circuit pack to in-service
or out-of-service.
To change the 2-slot integrated SP equipment to OOS, you must first put all
the provisioned OTM1 line or FLEX client facilities to OOS. To change the
SPAP-2 w/2xOSC circuit pack to OOS, you must first put the provisioned OSC
facilities to OOS. Refer to the “Changing the primary state of a facility”
procedure in Part 1 of Configuration - Provisioning and Configuration, 323-
1851-310 for the detailed procedure.
Prerequisites
To perform this procedure, you must use an account with a level 3 or higher
UPC.
Step Action
Procedure 1-4
Deleting a circuit pack
Use this procedure to delete circuit pack equipment from the list of provisioned
equipment in the Equipment and Facility Provisioning application. This
procedure is applicable only to the protection SP. Only the redundant SP in the
even slot of the shelf may be deleted.
Prerequisites
To perform this procedure, you must
• use an account with a level 3 or higher UPC
• change the primary state of the protection SP circuit pack to OOS and its
protection scheme to unprotected. See Procedure 1-2, “Changing the
protection scheme for a pair of SPs” on page 1-35 and Procedure 1-3,
“Changing the primary state of a circuit pack” on page 1-37.
Step Action
Table 1-9
Equipment primary states
IS-ANR In-service - abnormal; failure exists but entity is still capable of performing
some of its provisioned functions (that is, partial failure)
The 6500 also supports SuperMux circuit packs that contain an on-board
high-order cross-connect (switching at STS1 and HO_VC3/VC4) making
SuperMux or a pair of mated SuperMux circuit packs capable of operating
without 6500 shelf cross-connect circuit packs. The NTK535FAE5 variant of
the SuperMux can also be configured to switch up to 20Gbps of high-order
traffic through STS-1/VC-3 (or VT1.5/VC12) cross-connect circuit packs.
Revertive UPSR/SNCP
Revertive UPSR/SNCP is supported with the following cross-connect circuit
packs:
• NTK557PAE5 X-Conn 80G/20G VT-1.5/VC-12 (80/20)
• NTK557EAE5 X-Conn 240G+ STS-1/VC-3 (240/0)
• NTK557GAE5 X-Conn 240G+/80G VT-1.5/VC-12 (240/80)
• NTK610BBE5 X-Conn 640G+ STS-1/VC-3 (640/0)
Table 2-1 lists the supported cross-connect circuit packs in 6500. For all
supported OTN I/F, PKT I/F and PKT/OTN I/F circuit packs in any shelf type,
it is mandatory to use dual PKT/OTN cross-connect circuit packs.
Table 2-1
Supported cross-connect circuit packs in 6500
The 6500 7-slot shelf types do not support/require cross-connect circuit packs. N/A
X-Conn 1200G PKT/ NTK615BA This cross connect supports up to 6500-7 packet-
OTN Type 2 1200 Gbit/s OTN capacity with ODUk optical shelf type
switching granularity. This cross-connect (NTK503RA)
circuit pack needs SP-2 circuit packs to
function (NTK555CAE5, NTK555EAE5,
or NTK555FAE5).
X-Conn 80G/80G VT- NTK557NAE5 This cross-connect has a fixed capacity of 14-slot shelf types
1.5/VC-12 (80/80) 80 Gbit/s with VT1.5/VT2/VC11/VC12/LO (NTK503AxE5/
VC3 (AU4 mapped) switching granularity. NTK503BxE5/
VT1.5/VT2/VC11/VC12/LO VC3 (AU4 NTK503CxE5/
mapped) capacity is 80 Gbit/s. This NTK503ADE5/
means a 80/80 cross-connect circuit pack NTK503BDE5/
supports a maximum of 80G capacity in NTK503CDE5/
total with a HO limit of 80G and LO limit of NTK503GA)
80G traffic.
Note: Although 80G of VT1.5/VC11/VT2/
VC12 capacity is supported, if ONM
Applications Platform (AP) is managing
the network, there is a limit of 20,000
standing alarms in the managed network.
OMEA alarm filtering is required if path
alarming causes this limit to be exceeded.
Full path alarming (up to the limit
applicable to circuit packs or NE) is
available at the network element and Site
Manager interface.
MXC 20G/20G VT1.5/ NTK557TBE5 This cross-connect has a fixed capacity of 14-slot shelf types
VC-12 5xSFP 20 Gbit/s with VT1.5/VT2/VC11/VC12/LO (NTK503AxE5/
VC3 (AU4 mapped) switching granularity. NTK503BxE5/
VT1.5/VT2/VC11/VC12/LO VC3 (AU4 NTK503CxE5/
mapped) capacity is 20 Gbit/s. This NTK503ADE5/
means a MXC cross-connect circuit pack NTK503BDE5/
supports a maximum of 20G capacity in NTK503CDE5/
total with a HO limit of 20G and LO limit of NTK503GA)
20G traffic. The SFP optics are integrated
on the faceplate (multiservice cross-
connect, MXC). See “Multiservice cross-
connect (MXC) circuit pack” on page 2-23
for more details.
X-Conn 240G+ STS-1/ NTK557ES This cross connect supports up to 240 14-slot packet-
VC-3 (240/0) Gbit/s high-order and LO_VC3 capacity optical shelf type
with STS1/VC3 switching granularity. (NTK503SA)
LO_VC3 connections are only supported
to/from compatible circuit packs. This
means a 240/0 cross-connect circuit pack
supports a maximum of 240G total XC
capacity but no LO VT1.5/VT2/VC11/
VC12 connections.
X-Conn 640G+ STS-1/ NTK610BBE5 This cross connect supports up to 640 32-slot shelf types
VC-3 (640/0) Gbit/s high-order and LO_VC3 capacity (NTK603AAE5 and
with STS1/VC3 switching granularity. NTK603AB)
LO_VC3 connections are only supported
to/from compatible circuit packs. This
means a 640/0 cross-connect circuit pack
supports a maximum of 640G total XC
capacity but no LO VT1.5/VT2/VC11/
VC12 connections.
X-Conn 3200G PKT/ NTK616BA This cross connect supports up to 32-slot shelf types
OTN Type 2 3200 Gbit/s OTN capacity with ODUk (NTK603AAE5 and
switching granularity. This cross-connect NTK603AB)
circuit pack needs SP-2 circuit packs to
function (NTK555EAE5 or
NTK555FAE5).
The 2-slot shelf type does not support/require cross-connect circuit packs. N/A
Note 1: For PKT/OTN shelf configurations (including those that also support Photonic and/or
Broadband services) in a 6500-7 packet-optical shelf type, the 6500-7 packet-optical shelf type supports
redundant single height/single width cross-connect circuit packs (1+1 equipment protection) located in
slots 7 and 8.
Note 2: For PKT/OTN and MSPP shelf configurations (including those that also support Photonic and/
or Broadband services) in a 6500 14-slot shelf type, the 14-slot shelf type supports redundant single
height/single width cross-connect circuit packs (1+1 equipment protection) located in slots 7 and 8.
Note 3: The following conditions exist if you want to add a SDH-SONET gateway or LO-HO connection
with a 240/80 cross-connect circuit pack (NTK557GAE5 or NTK557GS):
— When a LO VC3 path from an STM-n facility on a 1xOC-192/STM-64, 2xOC-48/STM-16, 8xOC-3/
12/STM-1/4, or 16xSTM-1e circuit pack is used as a VC3 or STS1 connection source with a 240G+/
80G VT1.5/VC-12 (240/80) cross connect circuit pack (NTK557GAE5 or NTK557GS) to a HO VC3
destination (AU3-mapped in any STM-n facility), an STS-1 gateway destination (OCn/EC1 facility),
or to a DS3/E3 facility, any VC11/VC12 traffic sourced from within the same AU4/VC4 may
experience an in-service traffic interruption when the VC3/STS1 connection is entered or bridged
(during a bridge and roll operation involving the STM-n facility).
— LO VC3 sources within the AU4/VC4 are not affected by the addition of VC3/STS1 connections.
Path connections that are made or bridged on any other cross-connect circuit pack type (except the
240/80 cross-connect circuit pack) and connections or bridge and roll activities between LO VC3
sources and LO VC3 destinations are not affected.
— Therefore, in order to avoid the possibility of any VC11/VC12 traffic interruption when using the 240/
80 cross-connect circuit pack with 1xOC-192/STM-64, 2xOC-48/STM-16, 8xOC-3/12/STM-1/4, or
16xSTM-1e circuit packs, it is recommended to avoid assigning VC11/VC12 connections to AU4/
VC4s that are required to support LO VC3 connections between the STMn facilities on these circuit
packs and HO VC3 destinations (STMn facility), STS1 gateway destinations (OCn/EC1 facility) or
to a DS3/E3 facility. Otherwise, it is recommended to enter or bridge all connections between LO
VC3 sources (from STMn facilities on these circuit packs) and HO VC3, STS1, or DS3/E3
destinations before the VC11/VC12 connections or traffic within the AU4/VC4 is established.
Note 4: For PKT/OTN and MSPP shelf configurations (including those that also support Photonic and/
or Broadband services) in a 6500 32-slot shelf type, the 6500 32-slot shelf type supports redundant
double height/single width cross-connect circuit packs (1+1 equipment protection) located in slots 9 and
10.
Figure 2-1 on page 2-9 shows the faceplate of the cross-connect circuit pack.
Figure 2-2 on page 2-9 shows the faceplate of the MXC circuit pack.
Figure 2-3 on page 2-10 to Figure 2-8 on page 2-15 show the functional block
diagrams for different cross-connect circuit packs.
Figure 2-1
Cross-connect circuit pack faceplate (NTK557AAE5 is shown as an example)
Fail
- Card not failed = LED off, Card failed = LED on
Ready
In Use
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Ref 3
Yellow circle (Synchronization status)
Ref 4
- Used to communicate loss of synchronization timing reference
- One LED per timing reference (1 Fail, 2 Fail, 3 Fail, 4 Fail)
R99
EEEEE99999
S/N NT030MEE9999E
NTUD99EE
Type E
Figure 2-2
MXC circuit pack faceplate
Fail
- Card not failed = LED off, Card failed = LED on
Ready
In Use
Green rectangle (Ready)
- Used to communicate hardware or software functional state
Sync
Ref 1
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Ref 2
Ref 3
LOS
Blue diamond (In Use)
Ref 4
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled
1 Tx - Equipment in-service = LED on; Equipment out-of-service = LED off
Rx
4 Tx
Rx
Red/yellow bi-color circle (Fail/LOS)
- Used to communicate Rx Loss of Signal/optical module fail
5 Tx
Rx
- Red = module fail; Yellow = Rx Loss of Signal
NTUD99EE
Type E
Figure 2-3
Cross-connect circuit pack block diagram (NTK557xxE5, except NTK557TBE5 and NTK557GAE5/
NTK557GS)
XC
Traffic to all slots
SONET/SDH
Cross-connect fabric
XC
Traffic from all slots
Backplane
Switch
Accelerator
Processor Power
Sync Module Supply
Figure 2-4
Cross-connect circuit pack block diagram for MXC (NTK557TBE5)
XC SFP 1
Traffic to all slots
SFP 2
XC
Traffic from all slots SFP 5
Backplane
Switch
Accelerator
Processor Power
Sync Module Supply
Legend
OHP Overhead processor
Figure 2-5
Cross-connect circuit pack block diagram (NTK557GAE5/NTK557GS)
XC
Traffic to all slots
XC
Traffic from all slots
Backplane
Switch
Accelerator
Processor Power
Sync Module Supply
Figure 2-6
Cross-connect circuit pack block diagram (NTK615AA/NTK615BA)
Pkt/OTN
XC Traffic to all slots
Packet/OTN
cross-connect fabric
Pkt/OTN
XC Traffic from all slots
Backplane
Switch
Accelerator
Processor Power
Sync Module Supply
Figure 2-7
Cross-connect circuit pack block diagram (NTK610BBE5)
XC
Traffic to all slots
SONET/SDH
Cross-connect fabric
XC
Traffic from all slots
Backplane
Switch
Accelerator
Processor Power
Sync Module Supply
Figure 2-8
Cross-connect circuit pack block diagram (NTK616AA/NTK616BA)
Pkt/OTN
XC Traffic to all slots
Packet/OTN
cross-connect fabric
Pkt/OTN
XC Traffic from all slots
Backplane
Switch
Accelerator
Processor Power
Sync Module Supply
Supported functionality
The cross-connect and MXC circuit packs (NTK615AA, NTK615BA,
NTK616AA, NTK616BA, NTK557xx, and NTK610BBE5) provide the following
functionality.
Connection management
In the 6500 architecture and for MSPP, converged MSPP/Photonic, converged
MSPP/Broadband, or converged MSPP/Broadband/Photonic services, the
cross-connect circuit packs switch traffic between port circuit packs. Two
cross-connect circuit packs provide redundant equipment protection. All
ingress port circuit pack traffic is mapped into appropriate SONET/SDH or
ODU containers and directed towards the cross-connect circuit pack which
switches the incoming traffic to the appropriate egress port circuit pack.
The cross-connect circuit packs are 1+1 protected working in hot standby and
have synchronization phase and frequency alignment. The 6500 supports
hitless (no errors) switching between the switch matrices for circuit pack
failure, removal of the circuit pack, and software upgrades. Switching to the
redundant cross-connect does not affect system configuration and user
commands.
As the MXC circuit pack contains optical ports, switching between the MXC
circuit packs could result in a protection switch between protected optical
ports (if optical ports are unprotected, the traffic will be lost).
Figure 2-9
6500 cross-connect overview
Switch
Figure 2-10
Cross-connects—number of destinations
Unprotected Connections
From From
1 destination 2 destinations
To To
1WAY cross-connect 2WAY cross-connect
(1 destination) (2 destinations)
3 destinations
4 destinations
To
2WAYPR cross-connect
(3 destinations)
To Mate
2WAYDPR cross-connect
(4 destinations)
4 destinations
3 destinations
To To Protection
Table 2-2
SONET/SDH cross-connect circuit packs capacity summary
Note 1: This is the maximum destinations of the specified type and rate that a cross-connect circuit
pack can support independently of the software release or interface circuit pack type. Specific software
release, interface circuit pack type, and traffic mix may limit the actual number of possible destinations.
Note 2: Includes 2WAY cross-connect types.
Note 3: Includes 2WAYPR cross-connect type and 2WAY cross-connect type to a single line/MS pro-
tected endpoint.
Note 4: Includes 2WAYDPR cross-connect type and 2WAY cross-connect type between line/MS pro-
tected endpoints.
Note 5: The 240/80 cross-connect circuit pack implements VT1.5/VC11 and VT2/VC12 grooming
through a two-stage switching fabric (a subtended low order switching scheme), therefore the number
of possible VT1.5/VC11 and VT2/VC12 destinations or bi-directional cross-connect is limited to 1536
unique STS-1/VC-3/TUG-3 sources and 1536 unique STS-1/VC-3/TUG-3 destinations. LO VC-3 paths
originating on the L2SS DS1/E1/DS3/E3 4xGE (PDH gateway) circuit packs (NTK531MAE5) consume
an STS-1/TUG-3 worth of the low order switch capacity (reducing the number of possible VT1.5/VC11
and VT2/VC12 connections by an equivalent amount).
Table 2-3
PKT/OTN Cross-connect circuit packs capacity summary
600G PKT/ ODU0 480 ODU0 240 ODU0 160 ODU0 120 ODU0
OTN ODU1 240 ODU1 120 ODU1 80 ODU1 60 ODU1
ODU2 60 ODU2 30 ODU2 20 ODU2 15 ODU2
ODU3 12 ODU3 6 ODU3 4 ODU3 3 ODU3
1200G PKT/ ODU0 960 ODU0 480 ODU0 320 ODU0 240 ODU0
OTN Type 2 ODU1 480 ODU1 240 ODU1 160 ODU1 120 ODU1
ODU2 120 ODU2 60 ODU2 40 ODU2 30 ODU2
ODU3 24 ODU3 12 ODU3 8 ODU3 6 ODU3
1600G PKT/ ODU0 1280 ODU0 640 ODU0 426 ODU0 320 ODU0
OTN ODU1 640 ODU1 320 ODU1 213 ODU1 160 ODU1
ODU2 160 ODU2 80 ODU2 53 ODU2 40 ODU2
ODU3 32 ODU3 16 ODU3 10 ODU3 8 ODU3
3200G PKT/ ODU0 2560 ODU0 1280 ODU0 852 ODU0 640 ODU0
OTN Type 2 ODU1 1280 ODU1 640 ODU1 426 ODU1 320 ODU1
ODU2 320 ODU2 160 ODU2 106 ODU2 80 ODU2
ODU3 64 ODU3 32 ODU3 20 ODU3 16 ODU3
Note 1: This is the maximum destinations of the specified type and rate that a cross-connect circuit
pack can support independently of the software release or interface circuit pack type. Specific software
release, interface circuit pack type, and traffic mix may limit the actual number of possible destinations.
Note 2: Includes 2WAY cross-connect types.
Note 3: Includes 2WAYPR cross-connect type.
Note 4: Includes 2WAYDPR cross-connect type.
Synchronization
The 6500-7 packet-optical, 6500 14-slot, or 6500 32-slot shelf provides
system synchronization using 1+1 redundant synchronization hardware on
the cross-connect circuit pack for both timing generation and timing
distribution. The 6500 2-slot or 7-slot shelf does not support/require cross-
connect (XC) or MXC circuit packs and therefore does not support/require
timing generation and timing distribution.
Synchronization hardware
The 6500 synchronization system spans across several components and
consist of the following:
• cross-connect or MXC circuit pack that contains a Stratum 3 level (freerun)
shelf clock and BITS interfaces
• OC-n/STM-n or SuperMux interface circuit packs, which can recover
timing from incoming signals and transfer it to the XC circuit pack
• access panel, which is the location of the shelf BITS inputs/outputs
• shelf processor that provides the user interface
Figure 2-11
6500 synchronization architecture
ESI/ESO ESI/ESO
Unbalanced Balanced
Access Panel
Shelf
Processor
Cross-connect circuit packs
OC-n/STM-n or SuperMux
interface circuit packs
shelf type). The optical ports on the MXC circuit pack provide the same
functionality as provided by the optical ports on the optical interface circuit
packs described in subsequent sections in this chapter.
The MXC circuit pack supports five SFP modules. Port 1 supports OC-3/STM-
1, OC-12/STM-4, or OC-48/STM-16 ports. Ports 2 to 5 support OC-3/STM-1
or OC-12/STM-4 ports. The maximum total bandwidth supported for the five
SFP ports is 5G. The MXC circuit pack is supported in SDH network elements
(NE mode is SDH) and SONET network elements (NE mode is SONET).
In this release of 6500, the MXC circuit pack supports the following interface
circuit packs:
• 63xE1 circuit pack
• 24x10/100BT circuit pack
• 24x10/100BT with 8xSFP circuit pack
• 8xOC-3/12/STM-1/4 circuit pack
• 2xOC-48/STM-16 circuit pack
• 16xOC-n/STM-n 5G STS-1/HO SFP circuit pack
• 16xOC-n/STM-n 5G VT1.5/LO SFP circuit pack
• 16xOC-n/STM-n 10G STS-1/HO SFP circuit pack
• 16xOC-n/STM-n 10G VT1.5/LO SFP circuit pack
• 4xGE EPL circuit pack
• 24xDS3/E3 circuit pack
• 24xDS3/EC-1 circuit pack
• L2SS VT1.5/LO 4xGE circuit pack
• L2SS DS1/E1/DS3/E3 4xGE circuit pack (PDH gateway)
• DS1 module (DSM) (the DSM support is achieved by using an OC3/12
circuit pack)
When using the MXC circuit pack, interface slots (slots 1 to 6 and 9 to 14 for
14-slot shelf types) can only support 2.5G of traffic:
• only port 1 on a 2xOC-48/STM-16 circuit pack is supported (you cannot
provision cross-connects on port 2)
• only ports 1 to 4 on a 8xOC-3/12/STM-1/4 circuit pack are supported (you
cannot provision cross-connects on ports 5 to 8)
• only ports 1 to 8 on a 16xOC-n/STM-n 5G STS-1/HO SFP or 16xOC-n/
STM-n 5G VT1.5/LO SFP circuit pack are supported while using OC-3/
STM-1 SFPs (you cannot provision cross-connects on ports 9 to 16)
• only ports 1 to 4 on a 16xOC-n/STM-n 5G STS-1/HO SFP or 16xOC-n/
STM-n 5G VT1.5/LO SFP circuit pack are supported while using OC-12/
STM-4 SFPs (you cannot provision cross-connects on ports 5 to 16)
• only ports 1 to 4 on a 16xOC-n/STM-n 10G STS-1/HO SFP or 16xOC-n/
STM-n 10G VT1.5/LO SFP circuit pack are supported while using OC-3/
STM-1 or OC-12/STM-4 SFPs (you cannot provision cross-connects on
ports 5 to 16)
• only port 1 on a 16xOC-n/STM-n 10G STS-1/HO SFP or
16xOC-n/STM-n 10G VT1.5/LO SFP circuit pack is supported while using
OC-48/STM-16 SFPs (you cannot provision cross-connects on ports 2 to
16)
• only ports 3 and 4 on a 4xGE EPL circuit pack are supported (you cannot
provision cross-connects on ports 1 and 2)
The SFP ports on the MXC circuit pack provide the following functionality.
• supports OC-3/STM-1, OC-12/STM-4, and OC-48/STM-16 (SONET and
SDH) services
• supports non-concatenated rates of VT1.5/VC11, VT2/VC12, STS-1/
LO_VC3, STS-1/HO_VC3, VC4
• supports contiguous concatenation at STS3c, STS12c/VC4-4c, STS24c/
VC4-8c, and STS48c/VC4-16c
• terminates section/RS and line/MS overhead
— terminates section/RS and line/MS overhead bytes in Rx direction
— inserts section/RS and line/MS overhead bytes in Tx direction
• section/RS DCC or line/MS DCC selectable where the default is Off (a
section/RS DCC on each of the five optical ports and a maximum of two
line/MS DCC per MXC circuit pack)
• monitors optical power input and output
• selectable automatic laser shut off controlled by software
• automatic detection of SFP modules, which are hot pluggable.
From To
From To
Cross-connection types
The multiservice cross-connect circuit pack (MXC) supports the following
cross-connection types:
• 1WAY (Unidirectional)
• 1WAYPR (Unidirectional Path Ring)
• 2WAY (Bidirectional)
• 2WAYPR (Bidirectional Path Ring)
• 2WAYDPR (Dual Bidirectional Path Ring)
Cross-connection rates
The multiservice cross-connect circuit pack (MXC) supports the following
cross-connection rates:
• VT1.5/VC11 and VT2/VC12 (any port supporting sub-STS1 connections)
• STS1/VC3 and STS3c/VC4 (OC-3/STM-1 ports)
• STS1/VC3, STS3c/VC4, and STS12c/VC4-4c (OC-12/STM-4 ports)
• STS1/VC3, STS3c/VC4, STS12c/VC4-4c, STS24c/VC4-8c, and STS48c/
VC4-16c (OC-48/STM-16 ports)
Supported SFPs
Table 2-5 provides a list of the SFPs that are supported on the
MXC circuit pack.
Table 2-5
Supported SFP modules for the MXC circuit pack (NTK557TBE5)
Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)
Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)
Note 1: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.
Performance monitoring
The multiservice cross-connect circuit pack (MXC) supports the following
monitored entities:
• PM collection for SONET section (S)/SDH regenerator section (RS) and
SONET line (L)/SDH multiplex section (MS) services
• PM collection for SONET path (P)/SDH path (P) services, except for STM-
1e and DSM OC-3 facilities
• PM collection for STS1/VC3, STS3c/VC4, STS12c/VC4-4c, STS24c/VC4-
8c, and STS48c/VC4-16c concatenated payloads
• PM collection for SONET VT Path (VTn)/SDH VC Path (VCm) for VT1.5/
VC11, VT2/VC12, STS1/LO VC3 (VT1.5/LO circuit packs only), STS1/HO
VC3, and VC4 non-concatenated payloads
• PM collection of protection switch count/duration, except for STM-1e
facilities
• Physical layer PM collection (OPR, OPRN, OPT, and OPTN), except for
STM-1e and DSM OC-3 facilities
Alarms
For a complete list of alarm clearing procedures for the 6500, refer to Part 1
and Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipping rules
The following equipping rules apply to cross-connect and MXC circuit packs:
• For 6500 where MSPP circuit packs are present, SONET/SDH cross-
connect circuit packs (STS-1/VC-3 X-Conn, VT1.5/VC12 X-Conn, or
MXC) must be equipped in the appropriate shelf slots (in a 1+1 equipment
protection configuration).
• For 6500 where PKT/OTN circuit packs are present, a PKT/OTN cross-
connect (PKT/OTN X-conn) must be equipped in the appropriate shelf
slots (in a 1+1 equipment protection configuration).
• MSPP circuit packs that work with SONET/SDH cross-connects (or MXC)
cannot be equipped in the same shelf as PKT/OTN circuit packs that work
with PKT/OTN cross-connects since only one type of cross-connect can
be equipped in the shelf.
• For 14-slot shelf types, cross-connect (or MXC) circuit packs are equipped
in slots 7 and 8 when required.
• For 32-slot shelf types, cross-connects circuit packs are equipped in slots
9 and 10 (double-height slots) when required.
• For 6500-7 packet-optical shelf type, cross-connect circuit packs are
equipped in slots 7 and 8 when required.
• The 6500 7-slot shelf type does not support/require cross-connect circuit
packs.
• The 2-slot shelf type does not support/require cross-connect circuit packs.
• Both cross-connects or MXC circuit packs must be the same variant
(except during a reconfiguration).
• The size of the cross-connect switching capacity determines the service
interface slot capacity:
— Table 2-6 lists the 14-slot switching capacity by shelf and X-Conn type
(in this release).
— Table 2-7 on page 2-40 lists the 32-slot switching capacity by shelf and
X-Conn type (in this release).
— Table 2-8 on page 2-41 lists the 6500-7 packet-optical switching
capacity by shelf and X-Conn type (in this release).
Table 2-6
6500 14-slot shelf switching capacity by shelf and X-Conn type (in this release)
14-slot shelf X-Conn type Configuration total capacity by Slot switching capacity
variant (Note 4) connection type (backplane interface b/w) by
(Note 1, shelf and X-Conn type
Note 2, and (Gbps); each of
Note 3)
STS1/ LO VC- LO PKT/ 1 to 5 7 9 11 to
HO (Note 3 (Note VT1.5/ OTN 4 and and and 14
5) 6) VC12 (Note 8) 6 8 10
(Note 7)
NTK557AAE5 80G - - -
(XC 80G/0G)
14-slot shelf X-Conn type Configuration total capacity by Slot switching capacity
variant (Note 4) connection type (backplane interface b/w) by
(Note 1, shelf and X-Conn type
Note 2, and (Gbps); each of
Note 3)
STS1/ LO VC- LO PKT/ 1 to 5 7 9 11 to
HO (Note 3 (Note VT1.5/ OTN 4 and and and 14
5) 6) VC12 (Note 8) 6 8 10
(Note 7)
NTK557AAE5 80G - - -
(XC 80G/0G)
14-slot shelf X-Conn type Configuration total capacity by Slot switching capacity
variant (Note 4) connection type (backplane interface b/w) by
(Note 1, shelf and X-Conn type
Note 2, and (Gbps); each of
Note 3)
STS1/ LO VC- LO PKT/ 1 to 5 7 9 11 to
HO (Note 3 (Note VT1.5/ OTN 4 and and and 14
5) 6) VC12 (Note 8) 6 8 10
(Note 7)
14-slot shelf X-Conn type Configuration total capacity by Slot switching capacity
variant (Note 4) connection type (backplane interface b/w) by
(Note 1, shelf and X-Conn type
Note 2, and (Gbps); each of
Note 3)
STS1/ LO VC- LO PKT/ 1 to 5 7 9 11 to
HO (Note 3 (Note VT1.5/ OTN 4 and and and 14
5) 6) VC12 (Note 8) 6 8 10
(Note 7)
14-slot shelf X-Conn type Configuration total capacity by Slot switching capacity
variant (Note 4) connection type (backplane interface b/w) by
(Note 1, shelf and X-Conn type
Note 2, and (Gbps); each of
Note 3)
STS1/ LO VC- LO PKT/ 1 to 5 7 9 11 to
HO (Note 3 (Note VT1.5/ OTN 4 and and and 14
5) 6) VC12 (Note 8) 6 8 10
(Note 7)
Note 12: Total STS1/HO, LO_VC3 and LO VT1.5/VC12 connection bandwidth is limited to 80G across the
entire shelf (with the per slot maximum as noted).
Note 13: This cross-connect circuit pack only supports 160G of STS1/HO/LO_VC3 capacity in these 14-
slot shelf variants. It must be used in a 14-slot converged shelf (NTK503xDE5 variant) in order to make use
of its 240G capacity.
Note 14: VT1.5/VT2/VC11/VC12 connection bandwidth with compatible port cards is limited to a total of
1536 STS-1/VC3/TUG-3s (80G) across the entire 14-slot shelf (with the per slot maximum as noted).
Table 2-7
6500 32-slot shelf switching capacity by shelf and X-Conn type (in this release)
32-slot shelf X-Conn type Configuration total capacity by Slot switching capacity
variant (Note 2) connection type (backplane interface b/w)
(Note 1) by shelf and X-Conn type
STS1/ LO LO PKT/ for each of the 32 service
HO VC-3 VT1.5/ OTN slots (slots 1-8, 11-18,
(Note 3) (Note 4) VC12 (Note 5) 21-28, 31-38)
Table 2-8
6500-7 Packet-Optical shelf switching capacity by shelf and X-Conn type (in this release)
• If the external synchronization mode is SDH-J and the use of the 64 kHz
ESI or 6 MHz ESO ports is required, the following releases of the cross-
connect circuit packs are required:
— NTK557AA/BA: Release 08 or higher
— NTK557EAE5/GAE5: Release 01 or higher
— NTK557ES/NTK557GS: Release 01 or higher
— NTK557NA/PA/QA: Release 04 or higher
— NTK557AA/BA: Release 05A, 06B
— NTK557NA/PA/QA: Release 02A
The 02A, 05A, and 06B releases are cross-connect circuit packs which
have been upgraded as a result of a return/repair operation.
• To support VT1.5/VC11 and VT2/VC12 switching granularity, both cross-
connect or MXC circuit packs and the optical interface circuit packs must
support VT1.5/VC11 and VT2/VC12 switching granularity.
• In a 14-slot shelf type (except packet-optical; NTK503SA; shelf type), you
cannot provision a cross-connect circuit pack in slot 7 or 8 if one of these
slots already contains a Broadband or Photonic circuit pack.
Technical specifications
Table 2-9 lists the weight, power consumption, and SFP specifications for the
cross-connect circuit packs.
Table 2-9
Weight and power consumption for cross-connect circuit packs
MXC 20G/20G VT1.5/VC-12 5xSFP 1.0 (2.2) 60 (see Note 4) 60 (see Note 4)
(NTK557TBE5)
X-Conn 1200G PKT/OTN Type 2 (NTK615BA) 1.3 kg (2.9 lb) 106 • 165 (when used
in 14-slot
packet-optical
shelf)
• 125 (when used
in 6500-7
packet-optical
shelf)
X-Conn 640G+ STS-1/VC-3 (640/0) 3.4 (7.4) 130 (see Note 5) 190 (see Note 5)
(NTK610BBE5)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of AC-
powered equipment. For practical purposes, the rounded typical power consumption of an equipment
can be used as the equipment heat dissipation when calculating facilities thermal loads (an estimate of
the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The power consumption values are derated so that pluggables transceivers must be
considered separately. When estimating the total power for the equipment in a slot or in a system, you
must add the power values for each of the required pluggable devices For pluggable transceiver power
values, refer to Pluggable Datasheets and Reference, 323-1851-180.
Note 4: For this circuit pack that must be equipped with SFPs, the power values published in this table
do not include SFPs power values. You must add 1 W to typical or power budget values per SFP.
Note 5: This module's power is attributed to the feeder zone 2 power budget only in a 32-slot shelf.
Note 6: For optical SFP specifications, see the following sections in Part 3 of 6500 Planning,
NTRN10DP (Chapter 8):
— “OC-3/12/STM-1/4 SFP optical specifications”
— “OC-48/STM-16 SFP and DPO optical specifications”
— “OC-3/STM-1, OC-12/STM-4, OC-48/STM-16 CWDM optical specifications”
Latency
Table 2-10 on page 2-44 shows the latency specifications for cross-connect
circuit packs. Table 2-11 on page 2-45 shows the latency specifications for
OCn/STMn ports in MXC circuit packs. This information is used in conjunction
with ingress and egress latency data for circuit packs that support connections
to/from the cross-connects.
Table 2-10
Latency for cross-connect (XC) circuit packs
Note 1: Typical latency applies to all STS, High Order and Low Order VC-3 connections with the
exception of LO VC-3 sourced from the L2SS DS1/E1/DS3/E3 4xGE (PDH gateway) circuit pack.
Typical latency for VT1.5/VT2 and VC11/VC12 connections from any source and LO VC-3
connections from the L2SS (PDH gateway) is 8 us.
Note 2: Typical latency applies to all ODUk/Packet flows.
Table 2-11
Latency for OCn/STMn ports in MXC circuit packs
MXC 20G/20G VT1.5/VC-12 5xSFP circuit pack NTK557TBE5 10 (see Note 1) 5 (see Note 2)
Note 1: This is the typical latency for STS-1, STS-Nc, LO_VC3 and HO paths and includes the delay
through the integrated or mate MXC’s fabric. LO VT1.5, VT2, VC11 and VC12 paths incur a typical
latency of 23 µs (including the delay through the integrated or mate MXC’s fabric).
Note 2: This is the typical latency from the integrated or mate MXC’s fabric to the OCn/STMn facility.
Install 2 Identical XC
Circuit Pack(s)
Procedure 2-1
Provisioning NE
Timing Mode and
References
Procedure 2-3
End
Procedure
Table 2-12
Procedures in this chapter
Topic Page
Procedure 2-3, Provisioning the network element timing mode and 2-51
references
Procedure 2-1
Provisioning a circuit pack automatically
When automatic equipping is enabled, a cross-connect circuit pack is
automatically provisioned when it is inserted in the shelf.
CAUTION
Risk of equipment damage
Electrostatic discharge (ESD) can damage electrostatic
sensitive devices. Use antistatic protection to avoid damaging
circuit packs.
Prerequisites
• To provision equipment for an empty equipment slot, ensure the last
equipment that occupied the slot has been deleted.
• Ensure the plastic pin protector on the circuit pack has been removed.
• Ensure automatic equipping is enabled.
Step Action
Procedure 2-2
Provisioning external synchronization input (ESI)
parameters
Use this procedure to provision the signal format, line code, frame format,
impedance, and San for ESI A and ESI B. DUSOVERRIDE is provisionable for
ESI A and ESI B if the network element is in the SONET external
synchronization mode with the signal format of DS1 and frame format of ESF.
The options available depend on the NE external synchronization mode
(SONET, SDH, or SDH-J). See Table 2-14 on page 2-59 for details.
This procedure is only applicable if ESI A and/or ESI B is to be used for timing
generation or timing distribution. See Procedure 2-3, “Provisioning the
network element timing mode and references” on page 2-51 for information on
provisioning timing generation for the network element.
Prerequisites
To perform this procedure, you must use an account with a level 3 UPC or
higher.
Step Action
Step Action
13 Click OK.
—end—
Procedure 2-3
Provisioning the network element timing mode and
references
Use this procedure to provision the timing generation (timing mode and
references) for the network element. The timing mode can be set to:
• internal timing—the shelf timing is derived from an internal clock on the
cross-connect circuit pack
• line timing—the shelf timing is derived from a received OC-n/STM-n/
STM1J/STM4J signal
• external timing—the shelf timing is derived from the BITSIN/ESI ports
• mixed timing—the shelf timing is derived from OC-n/STM-n/STM1J/
STM4J ports and BITSIN/ESI ports
For line timing, external timing, and mixed timing, a hierarchy of up to four
reference sources can be provisioned. The timing generation selects the
source in the hierarchy with the highest derived quality level for the shelf
timing. If there is more than one source at the highest derived quality level, the
timing generation selects the highest priority source in the hierarchy from
references with the same derived quality level (first is the highest priority and
fourth is the lowest priority). To provision a timing source from an OC-n/STM-
n/STM1J/STM4J port, the reference source must be logically equipped.
If using the BITSIN/ESI in the hierarchy, you must provision the ESI
parameters, see Procedure 2-2, “Provisioning external synchronization input
(ESI) parameters” on page 2-49.
You cannot use the DS3, EC-1, E1, E3, DS1DS3, E1DS3, E1E3, STM1E, GE,
10/100BT, L2SS, PDH gateway, or RPR facilities as synchronization source
references.
DS1 DSM facilities and OC-3 ports which are provisioned as DSM hosts
cannot be used as synchronization source references.
Prerequisites
To perform this procedure, you must:
• use an account with a level 3 UPC or higher
• have a network synchronization plan for the network element
Step Action
5 Select the required Timing Group Name for the independent timing group for
which you wish to change the mode.
6 Select the Timing Generation tab.
7 Click Edit to open the Synchronization Edit dialog box.
8 Select Timing Mode & References from the Type drop-down list.
Step Action
9 From the network synchronization plan, determine the timing mode required.
Select the required Timing mode radio button to set the timing mode for the
network element.
CAUTION
Risk of Service outage
To avoid timing loops, verify the clock source setting of
each network element in the network. An incorrect
clock source setting can cause a service outage.
In general, the Timing mode radio buttons are disabled if both cross-connect
circuit packs are missing.
Except when changing the timing mode from line timing or external timing to
mixed timing, you must remove all references from the hierarchy (set the
references to None, see step 10) before changing the timing mode.
10 From the network synchronization plan, determine the references to be
provisioned. For each timing generation reference to be provisioned, select
the timing reference from the appropriate source drop-down list, leave all
other possible references as None. See Table 2-13 on page 2-58.
• Only one port of each multi-port circuit pack can be used as a timing
reference source.
• The available options from the source drop-down lists are dependent on
the selected timing mode. Only logically equipped sources are available
for selection.
• You cannot remove the active reference source from the hierarchy. To
remove the active source from the timing generation hierarchy, you first
must either perform a manual switch away from the active source or a
lockout on the active source (refer to the “Operating a synchronization
protection switch” procedure in Part 2 of Configuration - Provisioning and
Operating, 323-1851-310).
• If a reference source is not selected as the active source, it can be
removed from the timing generation hierarchy. It is recommended that
you perform a lockout of the reference source before removing it from the
timing generation hierarchy (refer to the “Operating a synchronization
protection switch” procedure in Part 2 of Configuration - Provisioning and
Operating, 323-1851-310).
• E1, E3, DS3, EC-1, DS1DS3, E1DS3, E1E3, STM1E, GE, 10GE, 10/
100BT, L2SS, PDH gateway, and RPR facilities cannot be set as
synchronization source references.
• DS1 DSM facilities and OC-3 ports which are provisioned as DSM hosts
cannot be set as line synchronization source references.
Step Action
11 Click OK.
12 Click Yes in the confirmation dialog box.
13 If the Synchronization Protection application is open, click Refresh in the
Synchronization Protection application to update the application with the
changes you have made to the hierarchy.
—end—
Procedure 2-4
Changing the primary state of a circuit pack
Use this procedure to change the primary state of a circuit pack to in-service
or out-of-service.
Both PKT/OTN cross-connect circuit packs can be put OOS only if:
• OSRP control plane is disabled.
• No circuit packs requiring the PKT/OTN cross-connect circuit packs are
provisioned.
• No shelf timing dependencies are provisioned.
• No ESO is provisioned.
Prerequisites
To perform this procedure, you must use an account with a level 3 or higher
UPC.
Step Action
Step Action
CAUTION
Risk of service interruption
If you place a facility out-of-service, you can cause a
loss of traffic.
5 Click Edit in the Equipment area to open the Edit Equipment dialog box.
6 Select IS or OOS from the Primary state drop-down list.
7 Click OK.
8 If you are changing the primary state to OOS, click Yes in the warning dialog
box.
—end—
Procedure 2-5
Deleting the cross-connect circuit packs
Use this procedure to delete the cross-connect circuit packs from the list of
provisioned equipment in the Equipment and Facility Provisioning application.
For the PKT/OTN cross-connect circuit packs, there must be no VCPs, FCCs,
DTLs, and DTLSETs provisioned. The OSRP-Node must be in the blocked
node admin state.
When one instance of the cross-connect circuit pack is deleted, its mate
cross-connect circuit pack will also be deleted.
Prerequisites
To perform this procedure, you must:
• use an account with a level 3 or higher UPC
• delete all circuit packs that require the cross-connect circuit pack. Refer to
the “Deleting a circuit pack, module, or pluggable” procedure in Part 1 of
Configuration - Provisioning and Operating, 323-1851-310.
• deprovision all timing references on the XC, see Procedure 2-3,
“Provisioning the network element timing mode and references” on page
2-51.
• put both cross-connect circuit packs out-of-service, see Procedure 2-4,
“Changing the primary state of a circuit pack” on page 2-55.
Step Action
Step Action
Table 2-13
Timing reference parameters
Line Timing Any equipped OC-n/STM-n/STM1J/STM4J port See Note 2, Note 3, and Note 4
Note 1: Each possible source, except None, can only appear once in the timing reference hierarchy.
Note 2: Only one port on each multi-port circuit pack can be selected as a timing generation and timing
distribution reference.
Note 3: DS3, EC-1, E1, E3, DS1DS3, E1DS3, E1E3, STM1E, GE, 10/100BT, 10GE, L2SS, PDH
gateway, and RPR facilities cannot be set as synchronization source references.
Note 4: DS1 DSM facilities and OC-3 ports which are provisioned as DSM hosts cannot be set as
synchronization source references.
Note 5: To maximize reliability, the BITSIN/ESI ports require the payload of the incoming signal to be
all 1’s. The BITSIN/ESI hardware may not operate correctly with other payload patterns.
Table 2-14
ESI parameters
Frame format SF (default), ESF Superframe format (SF) or extended superframe format
(ESF). If ESF selected, Sync Status Messaging is
supported.
DUSOVERRIDE disable (default), DUSOVERRIDE can only be set to enable If the network
enable element is in the SONET external synchronization mode
with the signal format of DS1 and frame format of ESF.
Signal format E1, 2MHz (default) E1 (2048 kbit/s signal) or 2MHz (2048 kHz clock)
Impedance 75R (default), 120R Impedance of ESI. Select 75R (75 ohm) for coaxial cables
(BT43 connectors on access panel) or 120R (120 ohm)
for twisted pairs (DB9 connector on access panel).
Frame format Normal (default), Frame format for E1 signal. If Normal selected, Sync
CRC4 (Note 1) Status Messaging is not supported on ESI. If CRC4
selected, Sync Status Messaging is supported.
Not applicable to 2MHz signal format.
San SA4 (default), SA5, Overhead bit used for Sync Status Messaging. Only
SA6, SA7, SA8 applicable to E1 signal format with CRC4 frame format.
(Note 1)
Note 1: The line code, frame format, and SAN parameters in the SDH external synchronization mode
are only applicable if the E1 signal format is selected.
Note 2: If the network element is in the SONET external synchronization mode with the signal format
of DS1 and frame format of ESF, you can override the BITSIN quality level by enabling DUSOVERRIDE
parameter.
BIP/FIP/AP/MIC/rectifier/Power Input
Card 3-
Table 3-1
Circuit packs in this chapter
Topic Page
— NTK599BGE5: 4 x 20A (or optional 2 x 40A) per input feed with D-type
alarm connectors with optional wire-wrap adaptor providing 4 x 20A
outputs per feed (supported on 6500-7 packet-optical, 7-slot, and all
14-slot shelf types). The allowable input configurations are 2 x 40A
feeds using external jumpers or 4 x 20A feeds without external
jumpers. In each case the total output current must not exceed 80A per
side.
— NTK599BH: 1 x 40A (or optional 2 x 20A or 4 x 10A) per input feed with
D-type alarm connectors with optional wire-wrap adaptor providing
4 x 10A outputs per feed (supported on 2-slot shelves (only
NTK503MAE5 and DC powered NTK503LA variants) and 7-slot shelf).
The allowable input configurations are 1 x 40A feeds using 4-way
jumpers, 2 x 20A using 2-way jumpers, and 4 x 10A feeds without
external jumpers. The total output current must not exceed 40A per
side.
— NTK599BK: 1 x 50A per input feed with D-type alarm connectors with
optional wire-wrap adaptor providing 4 x 50A outputs per feed
(supported on 6500-7 packet-optical (NTK503RA) and 14-slot
packet-optical shelf (NTK503SA)). The allowable input configurations
are 1 x 50A feeds using 4-way jumpers. The total output current must
not exceed 50A per side.
Note: For more information on NTK599AA, NTK599BA, NTK599BGE5,
NTK599BH, and NTK599BK BIPs, refer to “6500 BIPs (NTK599AA,
NTK599BA, NTK599BGE5, NTK599BH, and NTK599BK)” on page 3-4.
The NTK599AA BIP has been manufacture discontinued and is no longer
available. For replacement information, see Planning - Ordering
Information, 323-1851-151 (Chapter 2).
• eight circuit breakers, four connected to ‘A’ negative input(s) and four
connected to ‘B’ negative input(s)
• eight output power connectors, four connected to ‘A’ negative input(s) and
four connected to ‘B’ negative input(s) with either rear access connectors
(NTK599AA) or front access connectors (NTK599BA, NTK599BGE5,
NTK599BH, and NTK599BK)
• 19 in./23 in./ETSI rack mount, 1 U high unit (NTK599AA) or 2 U high unit
(NTK599BA, NTK599BGE5, NTK599BH, and NTK599BK), and 280 mm
deep
• circuit breaker trip indication (circuit breaker type to be On, Off or trip
position)
• alarm unit for bay level alarm gathering, display (critical, major and minor
lamps for the frame), and alarm reset. For the NTK599BA, NTK599BGE5,
NTK599BH, and NTK599BK variants, the alarm unit is field replaceable.
• input and output alarm connectors/wire-wrap fields (D-type for
NTK599AA, D-type/wire-wrap field for NTK599BA, NTK599BGE5,
NTK599BH, and NTK599BK)
• visual alarm inputs and outputs (NTK599AA) or visual and audible alarm
inputs and outputs (NTK599BA, NTK599BGE5, NTK599BH, and
NTK599BK)
• optional battery return (BR) to frame ground (FG) strap
The input terminals, with lugs in position, are protected from inadvertent
access preventing the shorting of any negative terminal to any positive
terminal, or any terminal to frame.
The BIP has a pair of M6 studs for connection to protective earth (PE). These
studs work with double hole crimp terminals. This connection point is separate
from the two points where the optional connection can be made between the
common A and B feed returns and PE.
The BIP also provides for input reverse polarity protection in that reversing the
polarity does not affect the characteristics of the BIP.
The BIP provides LEDs to indicate the status of each of the A or B input power
feeds. The green FLT (NTK599AA BIP) or Power OK (NTK599BA BIP,
NTK599BGE5 BIP, NTK599BH BIP, and NTK599BK BIP) LED (one for the A
feed (FLTA or Power OK A) and one for B feed (FLTB or Power OK B)
illuminate under normal operating conditions to indicate that each power
interface (A or B) feed has two power feeds. The green FLT or Power OK LED
extinguishes to indicate either or both of the following conditions:
• the input feed on the side (A or B) of the module below -39 Vdc ± 1 Vdc
• an open fuse in the capacitor module
Circuit breakers
The BIP provides eight plug-in rocker switch circuit breakers where four
connect to the ‘A’ negative input and four connect to the ‘B’ negative input.
Alarm input
The BIP receives:
• three alarm signals (Critical, Major and minor visual alarms) from the 6500
through a 9-way D-type connector (Male/Pin type) alarm input interface
(NTK599AA)
• three alarm signals (Critical, Major and minor visual and audible alarms,
six inputs) from the 6500 through a 9-way D-type connector (Female/
receptacle type) alarm input interface (NTK599BA, NTK599BGE5,
NTK599BH, and NTK599BK)
For details on the BIP connector pinouts, see “BIP connector pinouts” on page
3-21.
For the NTK599AA BIP, the external alarm signal activation is a relay contact
to -48/60 Vdc return (RTN). The incoming alarm signal energizes a relay in the
BIP and causes illumination of the corresponding alarm LEDs on the alarm
unit.
For the NTK599BA BIP, NTK599BGE5 BIP, NTK599BH BIP, and NTK599BK
BIP, the external alarm signal activation is a loss of a relay contact to -48/60
Vdc return (RTN). The loss of the alarm signal energizes a relay in the BIP and
causes illumination of the corresponding alarm LEDs on the alarm unit. If
using the alarm input on the NTK599BA BIP or NTK599BGE5 BIP, you must
use either an Issue 3 or later SDH access panel (NTK505LAE5), a
SONET/J-SDH access panel (NTK505MAE5), an SDH-J access panel
(NTK505KA), an access Panel with connections for eight external slots
(NTK505MBE5), or an access Panel with connections for four external slots
(NTK505PAE5).
Figure 3-1
6500 BIP (NTK599AA)—front view
Major
Breaker interfaces Critical Minor
ALARM-IN 4x40 A
(DB-9 male) A feed B feed
Filter-B
Bracket status Bracket
Filter-A LED Power
ALARM OUT status Alarm
test
(DB-25 male) reset
Rack alarm unit
Figure 3-2
6500 BIP (NTK599AA)—rear view
B3 B1
B4 B2
A3 A1
A4 A2
BAT B2- BAT B1- RTN B2+ RTN B1+ RTN A2+ RTN A1+ BAT A2- BAT A1-
Figure 3-3
6500 BIP (NTK599BA, NTK599BGE5, NTK599BH, and NTK599BK)—front view
Alarm cutoff
With front cover on Lamp test
Status A feed status
Breakers
B feed status
Alarm in
Output power
Front cover cable area
Diagram
(inside the cover)
Alarm out
Alarm output
The BIP provides an alarm output interface through a 25-way D-type, pin/male
connector (NTK599AA) or a 25-way D-type, pin/male or wire-wrap field
(NTK599BA, NTK599BGE5, NTK599BH, and NTK599BK) and provides the
following output alarms:
• three visual bay alarms (critical, major and minor)
• three audible bay alarms (critical, major and minor) (NTK599BA,
NTK599BGE5, NTK599BH, and NTK599BK only)
• power alarm
• circuit breaker alarms
The relays of the NTK599AA BIP are deenergized when there is no alarm
condition, and energized in an alarm condition. The relays of the NTK599BA,
NTK599BGE5, NTK599BH, and NTK599BK BIPs are energized when there
is no alarm condition, and deenergized in an alarm condition. ‘Normal’ (N/O
and N/C) refers to a deenergized relay. The three relay contacts are:
• COM (common) - the contact connected to either of the other two contacts
• N/O (normally open)
• N/C (normally closed)
For details on the BIP connector pinouts, see “BIP connector pinouts” on page
3-21.
Alarm unit
The alarm unit (AU) contains LEDs to provide visual indication of alarms active
for the 6500 installed on the rack. The alarm unit illuminates the appropriate
LEDs (critical, major and minor) on the front panel of the BIP based on alarm
signals received from the 6500 shelves through the alarm input interface and
close the appropriate alarm relay contacts on the alarm output interface. The
alarm unit contains the following LEDs:
• red and yellow alarm LEDs fed from the input alarm signals illuminate to
indicate the following conditions:
— critical alarm (red)
— major alarm (red)
— minor alarm (yellow)
The alarm unit contains an LED test button on the front panel of the BIP. When
pressed, all LEDs illuminate. The alarm unit also contains a push button
switch (ACO) on the BIP front panel to reset all BIP alarm relays. The alarm
unit is field replaceable on NTK599BA, NTK599BGE5, NTK599BH, and
NTK599BK variants.
Figure 3-4 on page 3-12 shows views of the DSM BIP (NTN458RA variant).
Breaker alarm
Breaker alarms operate in one of two ways. Both methods have a red indicator
light “off” for normal operation and “on” when the alarm circuit is activated. The
first method uses indicating type breakers that provide a mechanical
connection to activate the alarm card. The second method uses open-circuit
electronic sensing across the fuse holder. Open-circuit detection usually
requires a reset switch to clear the breaker alarm.
Both methods have the breaker alarm external relay contacts deenergized or
in a powered-off state for normal operation and energized or in a powered-on
state when a breaker alarm is detected, providing common (C) to normally
open (NO) closure for the alarm state.
Bay alarms
Bay alarms are visual indications for the rack frame (system level). These
alarms can be a combination of three different levels: critical, major, and
minor. Critical alarms are red, a major alarm can either be a red or yellow, and
the minor alarm is always yellow. The external alarm contacts are deenergized
or in a powered-off state for normal operation and energizing or going to a
power-on state when an external alarm is detected. Activation of these types
of alarms comes from external equipment alarm contacts that are either in the
rack frame or system and provide an alarm ground to the input ports of the
alarm system.
Alarm circuits
Most monitoring alarm systems require an alarm ground signal to activate the
individual alarms. The most common, is a single-point contact or paralleled
contact configuration. An alarm ground wire connects to the common of the
external relay contact, and the associated NC or NO contact connects to the
alarm monitoring system. When the alarm activates, the relay closure
between the C and either the NC or NO sends an alarm ground to the alarm
monitoring system, activating the appropriate alarm. Multiple relay contacts
can be paralleled in this configuration to activate a single or multiple input to
the alarm monitoring system.
Figure 3-4
DSM BIP (NTN458RA)
Output
connectors
B A
Rear view
(rotated)
TOP OF PANEL
PWR FUSE
ALM ALARM BAY ALARMS
VIS AUD CONTACTS ACTIVATE
CR
NO NC NC NO C A R
MJ
NC NO NC NO C A R
MN
C C NC NO C A R
5"
Top view
23" bracket
19" bracket
A B
Front view
Output breakers Output breakers
power A power B
The BIP/FIP can be used for bay configurations containing one to 13 Common
Photonic Layer (CPL) modules or one to eight DSMs (powered from the
5A A/B output feeds) as well as one 6500 shelf or other Ciena product
(powered from the 10A, 20A or 40A A/B output feed when the optional
breakers are equipped). Breaker kits are separately ordered from Ciena
(NTK599ZR for 10A, NTK599ZT for 20A, NTK599ZS for 40A). Available rack
space and the requirement to limit the total current draw to 60A (A or B) will
limit the number and type of loads that can be connected. For example, only
seven DSMs may be equipped in the same rack and powered from the same
BIP/FIP as a 14-slot shelf. When configured with 10A A/B breakers, the
BIP/FIP can be used with 2-slot (DC-powered) or 7-slot (NTK503PAE5 or
NTK503KA shelf variant equipped with DC Power Input Cards) shelf. With 20A
or 40A A/B breakers, the BIP/FIP can be used with a 6500-7 packet-optical
(NTK503RA), 7-slot (NTK503PAE5 or NTK503KA shelf variant equipped with
DC Power Input Cards), or 14-slot shelf (equipped with any power inputs cards
except the NTK505DS 2x50A breakerless variant. The BIP/FIP is not required
for 2-slot (AC-powered) or 32-slot shelf type.
Figure 3-5 on page 3-14 shows views of the BIP NTK599DA and FIP
NTK599EA.
Figure 3-5
BIP/FIP NTK599DA/EA—front view
• power cables are routed towards the rear of the BIP/FIP, then out of the
frame
• optional return or ground bridge accessible from front
• A and B are isolated loads, have separate alarm capabilities and can be
separately configured
• the Filter Fail red LED indicates that the voltage is less than or equal to
-34 V
The BIP/FIP is rated for operation in the temperature range of -10°C to +60°C.
The BIP/FIP provides A and B inputs with a voltage of -48 Vdc nominal
(-40 Vdc to -60 Vdc).
When a breaker trips, it pops out. When a fuse is blown on the A or B side of
the FIP, the A side or B side Fuse Fail LED is lit as appropriate. To identify the
blown fuse, look at the plastic lens top of the fuses to identify the fuse with the
broken filament (the pop-up alarm indicator will be visible). Order 5A
replacement fuse kit NTK599ZW from Ciena.
Table 3-2
BIP/FIP NTK599DA/EA—LED summary (A or B side)
Note: LED is lit when the voltage is less than or equal to -34 V.
Equipping rules
The BIP/FIP is installed at the top of the rack and can support up to four 14-
slot shelves terminating in a single rack or up to four 6500-7 packet-optical or
7-slot shelves (when NTK503KA shelf variant is equipped with DC Power
Input Cards) terminating in a single rack. The BIP/FIP is not required for 2-slot
or 32-slot shelf.
Table 3-3
BIP/FIB summary table
• This breaker interface panel provides four 40A circuit breakers per side to power up to three 14-slot
shelves (maximum that can fit in a bay) in one bay and is 1U high (requires 1U of space above for
access). This breaker interface panel cannot be used to power the DSM shelves. The manufacturing
of NTK599AA is discontinued, use NTK599BAE5 or NTK599BGE5.
• Not supported in 14-slot packet-optical shelf type (NTK503SA).
The 1U+1U BIP Installation Kit contains fasteners and cage nuts to mount the 1U+1U breaker interface
panel to a variety of equipment frames/racks. It contains a length of cable and lugs to connect the
1U+1U BIP to office frame/rack ground. It also contains 2-hole compress lugs to connect office power
cables to the 1U+1U BIP. The manufacturing of NTK599ZZ is discontinued, use NTK599ZX and either
NTK599ZA, NTK599ZB, NTK599ZC, or NTK599ZD when ordering BIP NTK599BA or NTK599BGE5.
The 2U BIP Installation Kit contains fasteners and cage nuts to mount the 2U breaker interface panel
to a variety of equipment frames/racks. It contains a length of cable and lugs to connect the 2U BIP to
office frame/rack ground. It also contains straight and 90 degree angled 2-hole compress lugs to
connect office power cables to the 2U BIP for vertical or rear power cable routing options. The
manufacturing of NTK599ZY is discontinued, use NTK599ZX and either NTK599ZA, NTK599ZB,
NTK599ZC, or NTK599ZD.
This breaker interface panel provides four 40A circuit breakers per side to power up to three 14-slot
shelves or up to six 6500-7 packet-optical or 7-slot shelves (using two BIPs) in one bay and are 2U high.
Has D-type output alarm connector (or wire-wrap via an adapter). This breaker interface panel cannot
be used to power the DSM shelves.
This breaker interface panel provides four 20A circuit breakers per side to power up to three 14-slot
shelves or up to six 6500-7 packet-optical or 7-slot shelves in one bay (using two BIPs) and is 2U high.
Has D-type output alarm connector (or wire-wrap via an adapter). This breaker interface panel cannot
be used to power the DSM shelves.
This breaker interface panel provides four 10A circuit breakers per side to power up to four
2-slot shelves (only NTK503MAE5 and DC powered NTK503LA variants) or up to four 7-slot shelves in
one bay and is 2U high. Has D-type output alarm connector (or wire-wrap via an adapter). This breaker
interface panel cannot be used to power the DSM shelves.
This breaker interface panel provides four 50A circuit breakers per side to power up to two
14-slot packet-optical shelf (NTK503SA) shelves equipped with 2x50A Power Input Cards or up to four
6500-7 packet-optical shelf (NTK503RA) shelves equipped with 50A Power Input Cards. Has D-type
output alarm connector (or wire-wrap via an adapter). This breaker interface panel cannot be used to
power the DSM shelves.
• This breaker interface panel provides four 20A, one 15A, and three 5A circuit breakers per side to
power up to eight DSMs (depending on the power cable used). This breaker interface panel cannot be
used to power the 14-slot or 7-slot shelves.
• Not supported in 14-slot packet-optical shelf type (NTK503SA).
• This breaker interface panel (BIP) can be used for bay configurations containing one 14-slot shelf and
other CIENA products (up to seven DSMs) or up to eight DSMs. BIP contains thirteen 5A breakers and
a position for a 20A or 40A breaker for each feed (A/B). For 14-slot shelves, use 40A breakers. For
DSMs, use 5A breakers. Can also be used for bay configurations containing one 14-slot shelf and
Common Photonic Layer modules. Does not provide access panel to BIP external alarm functionality.
Requires power cables NTTC01BC, NTTC01BD, or NTTC01BE. When used with power cables
NTTC01BD or NTTC01BE, the high current ring lugs supplied with the BIP can be discarded.
• This breaker interface panel (BIP) can be used for bay configurations containing one 7-slot shelf and
other CIENA products. BIP contains thirteen 5A breakers and a position for a 20A or 40A breaker for
each side. For 7-slot shelves, use 40A breakers. Can also be used for bay configurations containing
one 7-slot shelf, and Common Photonic Layer or DSM modules. Does not provide access panel to BIP
external alarm functionality. Requires power cables NTTC01CFE6, NTTC01CHE6, NTTC01CJE6, or
NTTC01CKE6.
• This breaker interface panel (BIP) can be used for bay configurations containing one
6500-7 packet-optical shelf and other Ciena products. BIP contains thirteen 5A breakers and a
position for a 20A or 40A breaker for each side. For 6500-7 packet-optical shelf, use 40A breakers.
Can also be used for bay configurations containing one 6500-7 packet-optical shelf, and Common
Photonic Layer or DSM modules. Does not provide access panel to BIP external alarm functionality.
Requires power cables NTTC01FE, NTTC01FF, NTTC01FG, or NTTC01FH.
• This fuse interface panel (FIP) can be used for bay configurations containing one 14-slot shelf and
other CIENA products (up to seven DSMs) or up to eight DSMs. FIP contains thirteen 5A fuses and a
position for a 20A or 40A breaker for each feed (A/B). For 14-slot shelves, use 40A breakers. For
DSMs, use 5A fuses. Can also be used for bay configurations containing one 14-slot shelf and
Common Photonic Layer modules. Does not provide access panel to FIP external alarm functionality.
Requires power cables NTTC01BC, NTTC01BD, or NTTC01BE. When used with power cables
NTTC01BD or NTTC01BE, the high current ring lugs supplied with the BIP can be discarded.
• This fuse interface panel (FIP) can be used for bay configurations containing one 7-slot shelf and other
Ciena products. FIP contains thirteen 5A fuses and a position for a 20A or 40A breaker for each side.
For 7-slot shelves, use 40A breakers. Can also be used for bay configurations containing one 7-slot
shelf and, Common Photonic Layer or DSM modules. Does not provide access panel to FIP external
alarm functionality. Requires power cables NTTC01CFE6, NTTC01CHE6, NTTC01CJE6, or
NTTC01CKE6.
• This fuse interface panel (FIP) can be used for bay configurations containing one 6500-7 packet-
optical shelf and other Ciena products. FIP contains thirteen 5A fuses and a position for a 20A or 40A
breaker for each side. For 6500-7 packet-optical shelf, use 40A breakers. Can also be used for bay
configurations containing one 6500-7 packet-optical shelf and, Common Photonic Layer or DSM
modules. Does not provide access panel to FIP external alarm functionality. Requires power cables
NTTC01FE, NTTC01FF, NTTC01FG, or NTTC01FH.
This kit contains two 10A breakers (one for each A/B feed) for use with the 1U front access BIP or FIP
(NTK599DA or NTK599EA). Order one kit for a 2-slot or 7-slot shelf connected to the 1U front access
BIP or FIP.
This kit contains two 20A breakers (one for each A/B feed) for use with the 1U front access BIP or FIP
(NTK599DA or NTK599EA). Order one kit for a 6500-7 packet-optical, 7-slot, or 14-slot shelf connected
to the 1U front access BIP or FIP.
This kit contains two 40A breakers (one for each A/B feed) for use with the 1U front access BIP or FIP
(NTK599DA or NTK599EA). Order one kit for a 6500-7 packet-optical, 7-slot, or 14-slot shelf connected
to the 1U front access BIP or FIP.
This kit contains two 5A breakers for use with the 13x5A, 20A or 40A 1U front access BIP. Order only
as replacements for broken breakers.
This kit contains two 5A fuses for use with the 13x5A, 20A or 40A 1U front access FIP. Order only as
replacements for blown fuses.
Order this horizontal tie bar if installing the 1U BIP or FIP (NTK599DA/EA) in a 23” rack. Order one
horizontal tie bar per 1U BIP or FIP (NTK599DA/EA).
Order this horizontal tie bar if installing the 1U BIP or FIP (NTK599DA/EA) in a 19” rack. Order one
horizontal tie bar per 1U BIP or FIP (NTK599DA/EA).
The BIP/FIP Installation Kit contains fasteners and cage nuts to mount the 2U breaker interface panel
(NTK599BA or NTK599BGE5), the 1U BIP/FIP (NTK599DA/EA), or the 1U AC rectifier (NTN458SA) to
a variety of equipment frames/racks. It contains a length of cable and lugs to connect the BIP/FIP/AC
rectifier to office frame/rack ground. The manufacturing of NTK599ZX is discontinued and you must use
the RoHS compliant version (NTK599ZXE6).
Technical specifications
Table 3-4 lists the physical specifications for BIP/FIP.
Table 3-4
Physical specifications for BIP/FIP
Height (2 x 100A variant, 1U (44.4 mm / 1.75 in.) 1U required above NTK599AA BIP for
NTK599AA, BIP/FIP, maintenance and cabling purposes (for
NTK599DA/EA) example, torque and lug inspection)
Table 3-5
Technical specifications for BIP/FIP
Breaker Interface Panel, 20A (for DSM shelves) NTK458RA 4.5 kg (10.1 lb)
Each power feed is monitored through its input breaker, fuse, AC/DC power
conversion circuit (as applicable) and provides a low/no voltage indication
which the shelf processors uses to raise a Power Failure - A,
Power Failure - B or Power Failure alarm against the affected feed (as
applicable to the shelf and power card). A Fused Power Input Card also
monitors any equipped alarm indicator fuses and the shelf processor will raise
a Power Failure - Fuse Blown alarm against any feed with a blown alarm
indicator fuse that has sufficient voltage on the power input terminals (if there
is low/no voltage on the power input terminals, a Power Failure - A or Power
Failure - B alarm will be raised regardless of the alarm indicator fuse state).
As long as the shelf processor is active, a Power Failure - Low Voltage alarm
will be raised to indicate a power brownout when all the power feeds to the
shelf have low/no voltage.
Shelf power schemes and Power Input Card types can be selected based on
the following powering applications and criteria:
— Fused: a fuse per power feed limits the current between the power
input terminals and the shelf backplane. The fuse and an optional
fuse-blown alarm indicator fuse are equipped in a removable fuse
cartridge. Specific shelves and Power Input Card variants support a
variety of main fuses in a range from 20A to 60A. Select Fused Power
Input Cards if your site powering practice requires use of fuses or if the
feeder cables or power source must be current limited/protected at a
rating less than is available with a breakered Power Input Card variant.
— Breakerless: power is not current limited with a breaker or fuse so
current must be externally limited/protected to the lesser of the Power
Input Card rating, the shelf rating or the power cable rating. Select a
breakerless Power Input Card only if current is limited/protected at the
power disconnect point (for example a BIP/FIP).
• 24 Vdc Power Input Card with D-Sub connector
— used in applications that require operation at 24 Vdc (27 Vdc nominal).
— two Power Input Cards are required to be equipped in the shelf: the A
feed/return connects to one Power Input Card and the B feed/return
connects to the other Power Input Card.
— each Power Input Card independently converts 24 Vdc to -48 Vdc for
use by the circuit packs and modules equipped in the shelf.
— the two Power Input Cards are used in a 1+1 equipment protected
configuration where either Power Input Card can supply all of the
power to the shelf backplane.
— the Power Input Card has a 2W2 D-Sub power landing to connect
either the A or B feed/return power cable.
— specific D-Sub power cables are supported.
Only one type is available:
— Breakered: a circuit breaker limits the current between the power input
terminals and the integrated 24 Vdc to -48 Vdc converter.
• 100 - 240 Vac Power Input Card
— used in applications that require operation at 100 to 240 Vac
(50Hz/60Hz).
— two or more Power Input Cards are required to be equipped in the shelf
with an AC power cable to each.
— each card independently converts 100 - 240 Vac to -48 Vdc for use by
the circuit packs and modules equipped in the shelf.
— for applications that use two Power Input Cards in a 1:1 equipment
protected configuration, either Power Input Card can supply all of the
power to the shelf backplane. For applications that use three or four
Power Input Cards 1:N equipment protection is available (one
equipped Power Input Card and associated AC feed can act as a
back-up for any one of the other Power Input Cards). For applications
that use four Power Input Cards, a 2:2 equipment configuration is
available (two Power Input Cards and associated AC feeds provide
redundancy for the other two).
— the Power Input Card has a 3-pin IEC320 female sockets.
— specific AC power cables are supported.
— the card does not include a breaker or user-serviceable fuse for the AC
feed.
Refer to the following tables:
• Table 3-6, “6500 shelves with integrated power supply units (PSU)” on
page 3-26
• Table 3-7, “6500 2-slot Type 2 shelf with Power Input Cards” on page 3-27
• Table 3-8, “7-slot shelf (NTK503PAE5 variant), 6500-7 packet-optical, and
14-slot shelves (all variants) with Power Input Cards” on page 3-27
• Table 3-9, “6500 7-slot Type 2 shelf with Power Input Cards” on page 3-28
• Table 3-10, “6500 32-slot shelves with Power Input Cards” on page 3-29
• Table 3-11, “ 6500 power feeds versus Power Input Cards/Power supply
units” on page 3-29
• Table 3-12, “6500 Power Input Cards other characteristics” on page 3-36
Note: The NTK505AA and NTK505BA variants are manufacture
discontinued. For replacement information, see Planning - Ordering
Information, 323-1851-151.
Table 3-6
6500 shelves with integrated power supply units (PSU)
Table 3-7
6500 2-slot Type 2 shelf with Power Input Cards
Table 3-8
7-slot shelf (NTK503PAE5 variant), 6500-7 packet-optical, and 14-slot shelves (all variants) with
Power Input Cards
6500-7 packet- √ √ √
optical shelf
(NTK503RA)
14-slot shelf √ √ √
(NTK503AA/ (when
NTK503AB/ equipped with
NTK503BAE5/ 40A fuse or
NTK503CAE5/ less)
NTK503CCE5/
NTK503AC/
NTK503BC/
NTK503GA)
with 40A rating
Converged 14-slot √ √ √ √
shelf
(NTK503ADE5/
NTK503BDE5/
NTK503CDE5)
with 60A rating
Table 3-8
7-slot shelf (NTK503PAE5 variant), 6500-7 packet-optical, and 14-slot shelves (all variants) with
Power Input Cards
14-slot packet- √ √ √ √
optical shelf
(NTK503SA)
with 60A/2x50A
rating
Table 3-9
6500 7-slot Type 2 shelf with Power Input Cards
Table 3-10
6500 32-slot shelves with Power Input Cards
NTK605CAE5/NTK605EAE5 NTK605FA/NTK605FE/NTK605GA/NTK605GE
32-slot packet- √
optical shelf
(NTK603AAE5)
32-slot packet- √
optical shelf
(NTK603AB)
Table 3-11
6500 power feeds versus Power Input Cards/Power supply units
Power Input Card or Power Supply 1A, 1B 2A, 2B 3A, 3B 4A, 4B Other Referenced
Unit note
Power Input Card or Power Supply 1A, 1B 2A, 2B 3A, 3B 4A, 4B Other Referenced
Unit note
Power Input Card or Power Supply 1A, 1B 2A, 2B 3A, 3B 4A, 4B Other Referenced
Unit note
Power Input Card or Power Supply 1A, 1B 2A, 2B 3A, 3B 4A, 4B Other Referenced
Unit note
Power Input Card or Power Supply 1A, 1B 2A, 2B 3A, 3B 4A, 4B Other Referenced
Unit note
Note 1: This Power Input Card supports one -48/60 Vdc power feed/return (1A or 1B depending on the
power card slot). Two power input cards are required per shelf. A and B power is supplied to each slot in the
shelf (except to an Access Panel in a 7-slot shelf (NTK503PAE5 shelf variant), 6500-7 packet-optical, or
14-slot shelf does not draw power directly from the Power Input Cards).
Note 2: This Power Input Card supports three separate -48/60 Vdc feeds/returns (3A or 3B depending the
power card slot). The three feed/return terminals can be bridged together to share a single feed/return using
3-prong busbar/jumpers. Two power input cards are required per shelf. Each of the three feeds provides
power to specific set of slots and the three A and B feeds follow the same distribution:
— Zone 1: feed 1 to slots 1-7 and 21-27
— Zone 2: feed 2 to cross-connects (slots 9 and 10), cooling fan modules (slots 45 and 46), access panel
(slot 47), shelf processors (slots 41 and 42), and slots 8,11, 28, 31
— Zone 3: feed 3 to slots 12-18 and 32-38
See “Feeder wire configurations in 32-slot shelf type” on page 3-37 for more information on feeders in
32-slot shelf.
Note 3: This Power Input Card supports three separate -48/60 Vdc feeds/returns (3A or 3B depending the
power card slot). The three feed/return terminals can be bridged together to share a single feed/return using
3-prong busbar/jumpers. Two power input cards are required per shelf. Each of the three feeds provides
power to specific set of slots and the three A and B feeds follow the same distribution:
— Zone 1: 11 service slots (2-3, 6-8, 18, 21, 25-28), XC-A cross-connect circuit pack (slot 9), and SP-A
shelf processor (slot 41)
— Zone 2: 10 service slots (4-5, 14-15, 22-24, 35-37) and cooling fan modules (slots 45 and 46)
— Zone 3: 11 service slots (1, 11-13, 16-17, 31-34, 38), XC-B cross-connect circuit pack (slot 10), SP-B
shelf processor (slot 42), and access panel (slot 47)
See “Feeder wire configurations in 32-slot shelf type” on page 3-37 for more information on feeders in
32-slot shelf.
Note 4: This Power Input Card supports four separate -48/60 Vdc feeds/returns (4A or 4B depending the
power card slot). The four feed/return terminals can be bridged together to share a one or two feeds/returns
using 2-prong or 4-prong busbar/jumpers. Two power input cards are required per shelf. Each of the four
feeds provides power to specific set of slots and the four A and B feeds follow the same distribution:
— Zone 1: eight service slots (1, 11-13, 31-34), XC-B cross-connect circuit pack (slot 10), SP-B shelf
processor (slot 42), and access panel (slot 47)
— Zone 2: eight service slots (2-3, 14-15, 21, 35-37) and a cooling fan module (slot 45)
— Zone 3: eight service slots (4-5, 16-17, 22-24, 38) and a cooling fan module (slot 46)
— Zone 4: eight service slots (6-8, 18, 25-28), XC-A cross-connect circuit pack (slot 9), and SP-A shelf
processor (slot 41)
See “Feeder wire configurations in 32-slot shelf type” on page 3-37 for more information on feeders in
32-slot shelf.
Power Input Card or Power Supply 1A, 1B 2A, 2B 3A, 3B 4A, 4B Other Referenced
Unit note
Note 5: This Power Input Card supports two separate -48/60 Vdc feeds/returns (2A or 2B depending the
power card slot). Two power input cards are required per shelf. Each of the two feeds provides power to
specific set of slots and the two A and B feeds follow the same distribution:
— Zone 1: feed 1 to
– slots 1, 3, 5, 7 (cross-connect), 10, 12, and 14
– cooling fan modules 1 and 3 when equipped with high flow front cooling fan module (Type 3)
(NTK507LS) or high flow rear cooling fan module (Type 3) (NTK507MS)
— Zone 2: feed 2 to
– slots 2, 4, 6, 8 (cross-connect), 9, 11, and 13
– slots 15 and 16 (shelf processors) and slot 17-2 (MIC)
– cooling fan module 2 when equipped with high flow front cooling fan module (Type 3) (NTK507LS) or
high flow rear cooling fan module (Type 3) (NTK507MS) or all three cooling fan modules when
equipped with high flow front cooling fan module (NTK507LDE5) or high flow rear cooling fan module
(NTK507MDE5)
Note 6: When 40A (NTK505CEE5, NTK505DEE5, or NTK505EEE5) or 60A (NTK505CAE5, NTK505DAE5,
or NTK505EAE5) rated Power Input Cards are equipped in a 14-slot packet-optical shelf (NTK503SA), the
two shelf power zones share the 40A/60A feeder, but each zone is limited the lesser of 40A or the provisioned
current.
Note 7: This Power Input Card supports one 24 Vdc power feed/return. Two Power Input Cards are required
per shelf (redundant A and B; maximum 17A each and a total of 17A for both Power Input Cards when load
sharing and when the applied voltage is within the specified operating range). A shelf equipped with and
provisioned to use these Power Input Cards will report 18 Amps as the Provisioned shelf current system
parameter in the Node information panel (refer to Administration and Security, 323-1851-301). Each 24 Vdc
Power Input Cards accepts a 24 Vdc (27 Vdc nominal) feed and independently converts it to 48 Vdc for use
within the shelf (this Power Input Card enables the shelf and equipped circuit packs to operate in DC power
installations that do not have -48/60 Vdc power systems).
Power Input Card or Power Supply 1A, 1B 2A, 2B 3A, 3B 4A, 4B Other Referenced
Unit note
Note 8: This Power Input Card supports one -48/60 Vdc power feed/return. Two Power Input Cards are
required per shelf (redundant A and B; maximum 10A).
Note 9: This Power Input Card supports one 100/240 Vac power feed. Two Power Input Cards are required
per shelf (redundant A and B; maximum continuous apparent power of 542 VA each and a total of 542 VA
for both Power Input Cards when load sharing). Similar to the AC power supplies integrated in the AC variant
of 2-slot shelf (NTK503NAE5), each AC Power Input Card accepts a 100 to 240 Vac feed and independently
converts it to 48 Vdc dc for use within the shelf. This Power Input Card enables the shelf and equipped circuit
packs to operate in installations that do not have DC power. Right-routing AC power cables are required. See
Planning - Ordering Information, 323-1851-151 (Chapter 4) for more details.
Note 10: This Power Input Card supports one 100V/240V AC power feed. Two, three or four AC Power Input
Cards are required per 7-slot Type 2 shelf (NTK503KA). The following Power Input Card and AC feeder
redundancy Provisioned shelf current settings are supported:
— 1X5_1X5: 1:1 Power Input Card/feeder protection when equipped with two AC Power Input Cards (in
slots 17 and 20)
— 1X5_2X5: 1:2 Power Input Card/feeder protection when equipped with three AC Power Input Cards (in
slots 17, 18 and 20)
— 1X5_3X5: 1:3 Power Input Card/feeder protection when equipped with four AC Power Input Cards (in
slots 17 to 20)
— 2X5_2X5: 2:2 Power Input Card/feeder protection when the shelf equipped with four AC Power Input
Cards (in slots 17 to 20)
Note 11: The AC Power Input Cards support maximum continuous apparent power of 542 VA each and a
total of 542 VA for all Power Input Cards when load sharing. Each AC Power Input Card accepts a 100 to
240 Vac feed and independently converts it to 48 Vdc dc for use within the shelf. The AC Power Input Card
enables the shelf and equipped circuit packs to operate in installations that do not have DC power. AC power
cables are required. See Planning - Ordering Information, 323-1851-151 (Chapter 4) for more details.
Note 12: Two -48/60 Vdc power feeds/return connections are integrated into this 2-slot shelf variant
(redundant A and B; maximum 10A). The integrated DC power connection points are not field-replaceable.
Note 13: Two 110/220 Vac power connections are integrated into this 2-slot shelf variant (redundant A and
B; continuous apparent power of 343 VA each and a total of 343 VA for both Power Input Cards when load
sharing). Each 100 to 240 Vac feed is independently converted to 48 Vdc for use within the shelf. This
integrated AC to DC conversion function is not field-replaceable. This shelf type is suitable for use in
installations that do not have DC power. Right-routing AC power cables are required. See
Planning – Ordering Information, 323-1851-151 (Chapter 4) for more details.
Table 3-12
6500 Power Input Cards other characteristics
• NTK505AA √
• NTK505BA
• NTK505CE √ √
• NTK505DE
• NTK505CC √
• NTK505EC
• NTK505EEE5 √
• NTK505TR
• NTK505CAE5 √ √
• NTK505DAE5
• NTK605CAE5
• NTK605CEE5
• NTK505EAE5 √
• NTK505DS
• NTK605FA
• NTK605FE
• NTK605GA
• NTK605GE
• NTK505SB √
• NTK505RA
ATTENTION
The largest power cable size that can be accommodated onto the 32-slot
shelf is 14 mm in overall outer diameter (AWG#2 or smaller). Power feed
larger than the recommended size must be tapped to a smaller cable to the
32-slot shelf.
ATTENTION
The 2x50A breakerless Power Input Card (NTK505DS) is rated for a
maximum of 50A on each of the two feeds and connection to a power source
current limited to more than 50A will exceed the rating. A 60A feed can only
be connected to the shelf when equipped with Power Input Cards rated for
60A such as the 60A breakered (NTK505CAE5), 60A breakerless
(NTK505DAE5) and Fused Power Input Card (NTK505EAE5).
The 14-slot packet-optical shelf type does not support power budgets with
different current limits on each zone. Refer to “Power budget for 14-slot
packet-optical shelf type (NTK503SA)” in Part 3 of 6500 Planning,
NTRN10DP (Chapter 8) for 14-slot packet-optical shelf power budget.
Figure 3-6
Power Input Card (breakerless) - 2-Wire D-Sub Input, Max 10A (NTK505TA)
Power Card
-40V --- -75V 10A Power OK
L+ L-
Insertion/extraction handle
D-type connector
Figure 3-7
24 Vdc Power Input Card (breakered) - 2-Wire D-Sub Input (NTK505TR)
Green circle ‘Power OK’ LED indicates that the breaker is “ON”
and that a DC voltage within the operating range is detected
and being converted to -48 Vdc for supplying to backplane 25A pop-up
(this LED does not support lamp test) breaker
L+ L-
Insertion/extraction handle
D-type connector
Figure 3-8
AC Power Input Card (100 - 240 Vac) (NTK505SB)
Figure 3-9
40A Power Input Card (breakered) - 3-Wire D-Sub Input (NTK505AA)
Green circle ‘Power OK’ LED indicates that the breaker is “ON” and that a
minimum voltage in the correct polarity is being supplied to backplane
Power (this LED does not support lamp test)
Card
-48/60V
D-type connector
Battery Return (pin)
L+ PE (socket)
L-
Figure 3-10
40A Power Input Card (breakerless) - 3-Wire D-Sub Input (NTK505BA)
Po
OK
Test Test points
points
-48/60V
D-type connector
PE (socket)
L- -48/-60 Vdc (pin)
Figure 3-11
40A Power Input Card (breakered) - 2-Wire D-Sub Input (NTK505CE)
Power Card
Test points
Test points
Green circle ‘Power OK’ LED indicates that a minimum voltage
in the correct polarity is being supplied to backplane
(this LED does not support lamp test)
Po Circuit breaker switch
OK
Available on breakered power cards only
L+
Battery Return (Socket)
Figure 3-12
40A Power Input Card (breakerless) - 2-Wire D-Sub Input (NTK505DE)
Power Card
Test points
Test points
L+
Battery Return (Socket)
Figure 3-13
40A Fused Power Input Card (NTK505EEE5)
Power Card
Green circle ‘Power OK’ LED indicates that the main fuse and/or
alarm indicator fuse is present and working and that a minimum
voltage in the correct polarity is being supplied to the backplane
(this LED does not support lamp test)
Po
OK
Alarm indicator fuse - Optional
Fuse holder (removable fuse cartridge) - Contains main fuse
(and optional alarm indicator fuse)
Card pull handle
Tab to aid in power card removal from shelf
-48/60V
D-type connector
L+
Battery Return (Socket)
Figure 3-14
50A Power Input Card (breakered) - 2-Wire D-Sub Input (NTK505CC)
Insertion/extraction handle
Green circle ‘Power OK’ LED indicates that the breaker is “ON”
and that a minimum voltage in the correct polarity is being supplied
to backplane (this LED does not support lamp test)
D-type connector
Figure 3-15
50A Fused Power Input Card (NTK505EC)
Insertion/extraction handle
Figure 3-16
60A Power Input Card (breakered) (NTK505CAE5)
Power
Card
Insertion/extraction handle
Po
OK
Green circle ‘Power OK’ LED indicates that the breaker is “ON”
and that a minimum voltage in the correct polarity is being supplied
to backplane (this LED does not support lamp test)
-48/60V
Plasticinsulator
L+
Figure 3-17
60A Power Input Card (breakerless) (NTK505DAE5)
Power
Card
Insertion/extraction handle
Po
OK
Green circle ‘Power OK’ LED indicates that a minimum voltage
in the correct polarity is being supplied to backplane
(this LED does not support lamp test)
-48/60V
Plastic insulator
L+
Figure 3-18
60 Fused Power Input Card - Max 60A (NTK505EAE5)
Power
Card
Insertion/extraction handle
-48/60V
Theseare not test points as this power input card does not support
test points.
Figure 3-19
2x50A breakerless Power Input Card (NTK505DS)
Insertion/extraction handle
L1
A green circle ‘Pwr OK’ LED for each of feed L1 and L2 indicates
that a minimum voltage in the correct polarity is being supplied to
associated backplane power zone
L2 (these LEDs do not support lamp test)
L1+
Plastic insulator
L2-
L2+
Figure 3-20
Power Input Card Type 2 (breakered) - 2-Wire D-Sub Input, Max 50A (NTK505QA)
Figure 3-21
Power Input Card Type 2 (fused) - 2-Wire D-Sub Input, Max 50A (NTK505QE)
Insertion/extraction handle
Figure 3-22
AC Power Input Card Type 2 (100 - 240 Vac) (NTK505RA)
Power
OK Power Card
Fan air inlet grill Green circle ‘Power OK’ LED indicates that an
AC voltage within the operating range is detected
and being converted to -48 Vdc for supplying to backplane
(this LED does not support lamp test)
Figure 3-23
3x60A breakered Power Input Card (NTK605CAE5 variant)
Off On Off On
L1 L2
Green ‘Power’ LED indicates that all three breakers are “ON”
and that a minimum voltage in the correct polarity is being
supplied to all three backplane power zones
(this LED does not support lamp test)
Figure 3-24
3x60A Fused Power Input Card (NTK605EAE5)
Fuse holder (removable fuse cartridge) - Contains main fuse (and optional alarm indicator fuse)
Off On Off On
L1 L2
Note:
Verify both MAIN & INDICA
TOR
fuses are installedTurn-Up.
at
Note: Power Car
d Test Points
Replace both MAIN & INDICA TOR
Low Voltage
_ L3
fuses if either is operated.
This unit has
more than one
Power + Off On
L1 L2 L3
power source.
Figure 3-25
3x60A Power Input Card Type 2 (breakered) (NTK605FA variant)
Safety cover
Figure 3-26
3x60A Power Input Card Type 2 (fused) (NTK605FE)
Safety cover
Figure 3-27
4x60A breakered Power Input Card Type 2 (NTK605GA variant)
Safety cover
Figure 3-28
4x60A Fused Power Input Card Type 2 (NTK605GE)
Safety cover
Equipping rules
2-slot, 7-slot, 14-slot, and 32-slot shelf types
The Power Input Cards are:
• located in slots 17 and 18 of the 2-slot shelf (only NTK503LA variant of
2-slot shelf as NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf
include integrated power unit supply and do not have filed-replaceable
Power Input Cards).
• located in slots 17 and 18 of the 7-slot shelf (NTK503PAE5 variant), slots
17, 18, 19, and 20 of the 7-slot optical Type 2 shelf (NTK503KA variant
when equipped with AC Power Input Cards but only slots 17 and 19 when
the shelf is equipped with DC Power Input Cards since they are
double-width).
• located in slot 17, subslots 17-1 and 17-3 of 14-slot shelf. The 14-slot shelf
types support up to 40A with D-type connector Power Input Cards and up
to 60A with lug terminated Power Input Cards. D-type Power Input Cards
are available as 40A breakered (NTK505AA/NTK505CEE5), breakerless
(NTK505BA/NTK505DEE5), and fused (NTK505EEE5 which can be
equipped with 20A, 30A and 40A fuses). Lug terminated Power Input
Cards are available as 60A breakered (NTK505CAE5), breakerless
(NTK505DAE5), breakerless 2x50A (NTK505DS), and fused
(NTK505EAE5 which can be equipped with 20A, 30A, 40A, 50A and 60A
fuses).
• located in slots 17 and 18 of the 6500-7 packet-optical shelf. The 6500-7
packet-optical shelf type supports the same 40A and 60A Power Input
Cards as 14-slot shelf types (see above). The 6500-7 packet-optical shelf
also supports 50A breakered (NTK505CC) and fused (NTK505EC which
can be equipped with 20A, 30A, 40A, and 50A fuses) Power Input Cards.
• located in slot 43 and 44 of 32-slot shelf. The NTK603AAE5 variant of
32-slot shelf type supports 3x60A Power Input Card (breakered)
(NTK605CAE5) and 3x60A Power Input Card (fused) (NTK605EAE5).
The NTK603AB variant of 32-slot shelf type supports 3x60A Power Input
Card (breakered) (NTK605FA), 3x60A Power Input Card (fused)
(NTK605FE), 4x60A Power Input Card (breakered) (NTK605GA), and
4x60A Power Input Card (fused) (NTK605GE). Both Power Input Cards
are lug terminated. The 3x60A Power Input Card (fused) (NTK605EAE5
or NTK605FE) and 4x60A Power Input Card (fused) (NTK605GE) can be
equipped with 30A, 40A, 50A, and 60A fuses.
Technical specifications
Table 3-13 lists the weight and power consumption for the Power Input Cards.
Table 3-13
Technical specifications for Power Input Cards
Fused Power Input Card - 2-Wire D-Sub NTK505EC 0.5 kg (1.1 lb) 2 2
Input, Max 50A
Fused Power Input Card - Max 60A NTK505EAE5 0.9 kg (1.9 lb) 2 2
3x60A Power Input Card Type 2 (fused) NTK605FE 2.7 kg (6.0 lb) 10 30
(see Note 7 (see Note 7
and Note 9) and Note 9)
4x60A Power Input Card Type 2 (fused) NTK605GE 2.7 kg (6.0 lb) 14 40
(see Note 8 (see Note 8
and Note 10) and Note 10)
Fused Power Input Card - 2-Wire D-Sub NTK505EEE5 0.9 kg (1.9 lb) 2 2
Input, Max 40A
AC Power Input Card (100 - 240 Vac) NTK505SB 0.8 kg (1.7 lb) 17 45
(see Note 12)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of AC-
powered equipment. For practical purposes, the rounded typical power consumption of an equipment
can be used as the equipment heat dissipation when calculating facilities thermal loads (an estimate of
the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: Half of this module's power is attributed to each of the two feeder zones in a 14-slot
packet-optical shelf (NTK503SA).
Note 4: This power value is per Power Input Card and since two are required per 14-slot packet-optical
shelf (NTK503SA), this results in a shelf power budget of 20W. If a power feed is not active or a Power
Input Card is removed, the equivalent feed(s) on the other Power Input Card will dissipate twice the
power resulting in a maximum of 20W per shelf.
Note 5: One third of this module's power is attributed to each of the three feeder zones in a 32-slot shelf
(NTK603AAE5).
Note 6: This power value is per Power Input Card and since two are required per 32-slot shelf
(NTK603AAE5), this results in a shelf power budget of 60W. One third of the circuit pack's power is
attributed to each of the three power zones. If a power feed is not active, the equivalent feed on the other
Power Input Card will dissipate twice the power resulting in a maximum of 60W per shelf.
Note 7: One third of this module's power is attributed to each of the three feeder zones in a 32-slot shelf
(NTK603AB).
Note 8: One fourth of this module's power is attributed to each of the four feeder zones in a 32-slot
shelf (NTK603AB).
Note 9: This power value is per Power Input Card and since two are required per 32-slot shelf
(NTK603AB), this results in a shelf power budget of 60W. One third of the circuit pack's power is
attributed to each of the three power zones. If a power feed is not active, the equivalent feed on the other
Power Input Card will dissipate twice the power resulting in a maximum of 60W per shelf.
Note 10: This power value is per Power Input Card and since two are required per 32-slot shelf
(NTK603AB), this results in a shelf power budget of 60W. One fourth of the circuit pack's power is
attributed to each of the four power zones. If a power feed is not active, the equivalent feed on the other
Power Input Card will dissipate twice the power resulting in a maximum of 60W per shelf.
Note 11: This typical value assumes that the shelf is supplied with 27 Vdc and is equipped with circuit
packs in slots 1 and 2 with total typical draw of 100W. If the shelf is operating at the maximum
recommended power budget limit, typical power for each Power Input Card is 22W.
Note 12: This typical value assumes shelf is supplied a minimum 110 Vac and is equipped with circuit
packs in slots 1 and 2 with a total typical draw of 100W. If the shelf is operating at the maximum
recommended power budget limit, typical power for each Power Input Card is 33W.
The 1U AC rectifier:
• must be used with 6500 breakered Power Input Cards or Fused Power
Input Cards
• requires rear access cabling for the AC power and cannot be installed in
‘back-to-back’ rack configurations or closed cabinets
• has a depth of greater than 300 mm and cannot be used in 300 mm deep
ETSI racks or cabinets (for example, ETSI rack NTKD71AB)
The 1U AC rectifier supports 120, 208, 220, or 240 Vac feed inputs. For the
corresponding wire sizes and fuse/breaker ratings, see Table 3-14 and
Table 3-15.
Table 3-14
1U AC rectifier supported inputs for a 7-slot (when NTK503KA shelf variant is equipped with DC
Power Input Cards) or 14-slot shelf equipped with 40A Power Input Cards (one rectifier powering
both A and B feeds)
Input Max. current of Breaker of each AC Wire size of each Output power
each AC feed feed AC feed (Note 1)
Note 1: The 6500 shelf must be provisioned to match the rectifier's output power. The Provisioned
shelf current parameter is set in the equipment's System Information panel. For more information, refer
to Administration and Security, 323-1851-301.
Note 2: On a 7-slot shelf, you must set the Provisioned shelf current to 15A (a 599W maximum total
shelf power budget). On a 14-slot shelf, you must use the lowest Provisioned shelf current setting
which is 20A but you must not equip the shelf with modules surpassing a maximum 600W power
budget. If Fused Power Input Cards are being used, 15A fuses are recommended for the 7-slot shelf
and 15A or 20A fuses are recommended for the 14-slot shelf.
Note 3: Set the Provisioned shelf current to 40A (a 1500W total shelf power budget). If Fused Power
Input Cards are being used, a 40A fuses are recommended.
Table 3-15
1U AC rectifier supported inputs for a 14-slot shelf equipped with 60A (or less) Power Input Cards
(one rectifier per A/B feed)
Input Max. current of each Breaker of each AC Wire size of each AC Output
AC feed feed feed power
(Note 1)
One feed Two feeds One feed Two feeds One feed Two feeds
per 1U per 1U per 1U per 1U per 1U per 1U
rectifier rectifier rectifier rectifier rectifier rectifier
Note 1: The 6500 shelf must be provisioned to match the rectifier's output power. The Provisioned
shelf current parameter is set in the equipment's System Information panel. For more information, refer
to Administration and Security, 323-1851-301.
Note 2: On a 14-slot shelf, you must set the Provisioned shelf current to 30A (a 1199W maximum
total shelf power budget). If Fused Power Input Cards are being used, 30A fuses are recommended.
Equipping rules
The 1U AC rectifier can be installed in a 19-inch or 23-inch rack. To install the
rectifier in a 23-inch rack, you must install the extender brackets supplied with
the rectifier chassis. Do not use the compression lugs, #10 - 14 AWG,
supplied with the 1U rectifier kit. Use the #8 AWG power lug kit (NTK599ZE)
instead.
Table 3-16
1U AC rectifier summary table
Note 1: This kit includes a rectifier chassis pre-installed with two 1500 W rectifiers, #6 AWG rectifier
chassis ground cable, #6 AWG CO reference ground cable, and 5 hex screws. It also contains #10 -14
AWG compression lugs, do not use these, use the #8 AWG/10 mm² power lugs provided in kit
NTK599ZE for 40A Power Input Cards (NTK505CE or NTK505EEE5 equipped with 40A fuse) and use
the #6 AWG/16 mm² power lugs provided in kit NTK599ZA/NTK599ZB for 60A Power Input Cards
(NTK505CAE5 or NTK505EAE5 equipped with 60A fuse). Each rectifier NTN458SA requires one BIP/
FIP Installation/Grounding Kit NTK599ZX. This rectifier must only be used with the 14-slot packet-
optical shelf when it is equipped with 40A or 60A breakered or Fused Power Input Cards. This rectifier
must not be used with breakerless Power Input Cards including the 2x50A breakerless Power Input
Card.
Note 2: You must order one rectifier kit when using 40A Power Input Cards (NTK505CEE5 or
NTK599EEE5). You must order two rectifier kits when using 60A Power Input Cards (NTK505CAE5 or
NTK505EAE5 equipped with 60A fuse or less).
Note 3: This 1U AC rectifier is only supported on 14-slot and 7-slot (when NTK503KA shelf variant is
equipped with DC Power Input Cards) shelf types (not supported on 2-slot or 32-slot shelf type).
Note 4: This is a field replaceable 1500 W rectifier module for the 1U AC rectifier NTN458SA. Order
for sparing purposes only.
Technical specifications
Table 3-17 lists the physical specifications for 1U AC rectifier.
Table 3-17
Physical specifications for 1U AC rectifier
Table 3-18
Technical specifications for 1U AC rectifier
ATTENTION
If the external synchronization mode is SDH-J and the use of the 64 kHz ESI
or 6 MHz ESO ports is required, the following releases of the cross-connect
circuit packs are required:
For details on the access panel connector pinouts, see “Access panel
connector pinouts” on page 3-85.
Figure 3-29
Access panel—front views
A ESI B A ESO B ESI/ESO DTE Alarm Telemetry COLAN-A COLAN-B ILAN In ILAN Out COLAN-X
A ESO B ESI/ESO ACO Visual / Audible Alarms Telemetry COLAN-A COLAN-B ILAN In ILAN Out COLAN-X
DTE
6.312 MHz
A ESO B A ESI/ESO B DTE Alarms Telemetry COLAN-A COLAN-B ILAN In ILAN Out COLAN-X
6.312 MHz
External 83 84 85 86 87 88 89 90 DTE ESI/ESO/ 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 Telemetry COLAN-A COLAN-B ILAN In ILAN Out COLAN-X
Slots Alarms A
Access Panel with connections for eight external slots (SONET) (NTK505MBE5)
Major
ACO/
Minor Lamp
Test
57 58 59 60 61 62 External Slot COLAN-X COLAN-A
External Slot
ESI/ESO Alarms
83 84 85 86 COLAN-A ILAN In ILAN Out COLAN-X
Fail
Critical
Ready Major
In Use Minor
SP
SP
Alarms
Fail
Critical
Ready Major
Minor
In Use
Table 3-19
Access panel—interface descriptions
two 120 ohm • NTK505KA • For a NTK605MAE5 access panel, you can
balanced DB9 use a female DB9 to wire wrap adapter
female (NTK605MZE5) to cover over the DB9
connectors connectors of the ESI/ESO ports to provide
wire wrap posts.
• For a NTK505JA access panel, you can use a
female DB9 to wire wrap adapter (NTK505JZ)
to cover over the DB9 connectors of the ESI/
ESO ports to provide wire wrap posts.
• Integrated access panel in a 2-slot shelf
(NTK503MAE5 and NTK503NAE5 variants)
does not have ESI/ESO ports.
• Shelf processor w/access panel in a 2-slot
shelf (NTK503LA variant) does not have ESI/
ESO ports.
Alarms DB9 female • NTK505JA • Provides an interface for Critical, Major and
connector • NTK505LAE5 minor alarm conditions.
ACO/Lamp push button • NTK605MAE5 • Enables user to shut off the audible receive
Test switch attention alarms and perform a shelf level
lamp test using a push button switch.
• Integrated access panel in a 2-slot shelf
(NTK503MAE5 and NTK503NAE5 variants)
does not have ACO/Lamp Test ports.
• Shelf processor w/access panel in a 2-slot
shelf (NTK503LA variant) does not have
ACO/Lamp Test ports.
Critical/ LED • NTK605MAE5 • Enables user to visually see the critical, major
Major/Minor • Integrated access and minor alarms that are active on the 2-slot
Alarm panel in a 2-slot or 32-slot shelf.
indicators shelf (only
NTK503MAE5 and
NTK503NAE5
variants)
• NTK555LA
• NTK555NA
ILAN IN/ RJ-45 connector • NTK505JA • Interoffice LAN and provides 10/100BT
OUT (MDI) • NTK505LAE5 connectivity from the 6500 to subtended
(see Note shelves for shelf management. Ports are
3) • NTK505MAE5 switched to the active shelf processor.
• NTK505KA • Integrated access panel in a 2-slot shelf
• NTK505MBE5 (NTK503MAE5 and NTK503NAE5 variants)
• NTK605MAE5 does not have dedicated ILAN IN port (only
ILAN OUT port).
• NTK505PAE5
• Shelf processor w/access panel in a 2-slot
• Integrated access shelf (NTK503LA variant) does not have
panel in a 2-slot dedicated ILAN IN port (only ILAN OUT port).
shelf (only
NTK503MAE5 and
NTK503NAE5
variants)
• NTK555LA
• NTK555NA
External RJ-45 connector • NTK505MBE5 • Provides eight proprietary serial interfaces for
slots connectivity between the 14-slot shelf and up
(83 to 90) to eight Photonic layer passive modules (for
example OMD4, CMD44, BMD2, UBMD2,
MBMD2, GMD10, OBMD 1x8, OBB 2x2x2,
OBB 2x4x1, FIM Type 1, FIM Type 2, FIM Type
4, FIM Type 5, FIM Type 6, and DSCM),
PPC6, Transponder Protection Tray (TPT), or
OMX. The proprietary serial interfaces in this
type of access panel enable the 14-slot shelf
to support autoprovisioning and inventory for
the connected equipment.
(see Note 4 and Note 5)
External RJ-45 connector • NTK505PAE5 • Provides four proprietary serial interfaces for
slots connectivity between the 7-slot shelf and up to
(83 to 86) four Photonic layer passive modules (for
example OMD4, CMD44, CMD96, BMD2,
UBMD2, MBMD2, GMD10, OBMD 1x8, OBB
2x2x2, OBB 2x4x1, FIM Type 1, FIM Type 2,
FIM Type 4, FIM Type 5, FIM Type 6, and
DSCM), PPC6, Transponder Protection Tray
(TPT), or OMX. The proprietary serial
interfaces in this type of access panel enable
the 7-slot shelf to support autoprovisioning
and inventory for the connected equipment.
(see Note 4 and Note 5)
External RJ-45 connector • NTK505JA • Provides four proprietary serial interfaces for
slots connectivity between the 6500-7 packet-
(83 to 86) optical shelf and up to four Photonic layer
passive modules (for example OMD4,
CMD44, BMD2, UBMD2, MBMD2, OBMD
1x8, OBB 2x2x2, OBB 2x4x1, GMD10, and
DSCM), PPC6, Transponder Protection Tray
(TPT), or OMX. The proprietary serial
interfaces in this type of access panel enable
the 6500-7 packet-optical shelf to support
autoprovisioning and inventory for the
connected equipment.
(see Note 4 and Note 5)
External RJ-45 connector • Integrated access • Provides three proprietary serial interfaces for
slots panel in a 2-slot connectivity between the 2-slot shelf and up to
(25 to 27) shelf (only three Photonic layer passive modules (for
NTK503MAE5 and example OBMD 1x8, OBB 2x2x2, OBB 2x4x1,
NTK503NAE5 OMD4, CMD44, BMD2, UBMD2, MBMD2,
variants) and DSCM), PPC6, Transponder Protection
Tray (TPT), or OMX. The proprietary serial
interfaces in this type of access panel enable
the 2-slot shelf to support autoprovisioning
and inventory for the connected equipment.
(see Note 4 and Note 5)
External RJ-45 connector • NTK555LA • Provides three proprietary serial interfaces for
slots connectivity between the 2-slot Type 2 shelf
(83 to 85) and up to three Photonic layer passive
modules (for example OBMD 1x8, OBB
2x2x2, OBB 2x4x1, OMD4, CMD44, CMD96,
BMD2, UBMD2, MBMD2, and DSCM), PPC6,
Transponder Protection Tray (TPT), or OMX.
The proprietary serial interfaces in this type of
shelf processor w/access panel enable the
2-slot Type 2 shelf to support autoprovisioning
and inventory for the connected equipment.
(see Note 4 and Note 5)
External RJ-45 connector • NTK555NA • Provides eight proprietary serial interfaces for
slots connectivity between the 7-slot Type 2 or
(83 to 90) 2-slot Type 2 shelf and up to eight Photonic
layer passive modules (for example OBMD
1x8, OBB 2x2x2, OBB 2x4x1, OMD4, CMD44,
CMD96, BMD2, FIM Type 1 (only in 7-slot
Type 2 shelf), FIM Type 2 (only in 7-slot Type
2 shelf), FIM Type 4 (only in 7-slot Type 2
shelf), FIM Type 5 (only in 7-slot Type 2 shelf),
FIM Type 6 (only in 7-slot Type 2 shelf), and
DSCM), PPC6, Transponder Protection Tray
(TPT), or OMX. The proprietary serial
interfaces in this type of shelf processor w/
access panel enable the
7-slot Type 2 or 2-slot Type 2 shelf to support
autoprovisioning and inventory for the
connected equipment.
(see Note 4 and Note 5)
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Common alarms
• Circuit Pack Missing
• Corrupt Inventory Data
Equipping rules
The access panel is installed in 6500 shelf as follows:
• on the top of the 14-slot shelf type
• on the top of the 32-slot shelf in slot 47
• on the bottom of the 7-slot shelf (NTK503PAE5 variant) in slot 19
• on the bottom of the 6500-7 packet-optical shelf in slot 19
• on the bottom of the 7-slot Type 2 shelf type in slot 15 (integrated with the
shelf processor in NTK503KA variant of 7-slot shelf)
• on the bottom of the 2-slot shelf type in slot 15 (integrated in the shelf for
NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf and integrated
with the shelf processor in NTK503LA variant of 2-slot shelf)
Table 3-20
Access panel summary table
Note 1: This access panel provides fully connectorized terminations for shelf level alarms,
synchronization, and management connectivity. The panel provides BT type 43 or D-type connectors
for synchronization inputs/outputs and D-type connectors for alarm and telemetry signals.
Note 2: This access panel provides fully connectorized terminations for management connectivity and
modem access. The panel provides mini-BNC connectors for 6.312 MHz synchronization outputs and
wire-wrap connectors for synchronization, alarm, and telemetry inputs/outputs.
Note 3: This access panel provides fully connectorized terminations for shelf level alarms,
synchronization and management connectivity. The panel provides D-type connectors for
synchronization inputs, mini-BNC connectors for 6.312 MHz synchronization outputs, and D-type
connectors for alarm and telemetry signals. Includes two cables (NTK509HA) which are used as
adapters between the mini-BNC connectors on the Access Panel (SDH-J) and standard BNC cables.
Note 4: This access panel provides fully connectorized terminations for management connectivity and
modem access. The panel provides wire-wrap connectors for synchronization and alarms interfaces,
DB9 male connectors for modem access, DB25 connectors for telemetry inputs/outputs, and RJ-45
connectors for LAN interface ports. This access panel also provides eight RJ-45 serial interfaces for
connectivity between the 14-slot and up to eight photonic layer modules (for example, OMD4, CMD44,
BMD2, UBMD2, MBMD2, GMD10, OBMD 1x8, OBB 2x2x2, OBB 2x4x1, FIM Type 1, FIM Type 2, FIM
Type 4, FIM Type 5, FIM Type 6, and DSCM) or PPC6. The RJ-45 serial interfaces in this type of access
panel enable the 32-slot to support autoprovisioning and inventory for the photonic layer modules (for
example, OMD4, CMD44, BMD2, UBMD2, MBMD2, GMD10, OBMD 1x8, OBB 2x2x2, OBB 2x4x1, FIM
Type 1, FIM Type 2, FIM Type 4, FIM Type 5, FIM Type 6, and DSCM) or PPC6.
Note 5: This access panel can be equipped in all 14-slot shelf types and is recognized by shelf
inventory if the 14-slot shelf is running Release 5.0 or higher software load.
Note 6: All access panels are supported with any NE mode (SONET, SDH, or SDH-J), however specific
ESI/ESO interface types and specific connectors varies by access panel. The capabilities of each
access panel are summarized in Table 3-19.
Note 7: This access panel is intended for 14-slot shelf types except NTK505KA access panel that is
not supported in 14-slot packet-optical shelf (NTK503SA). This access panel is not supported in 7-slot
or 32-slot shelf type.
Note 8: This access panel provides fully connectorized terminations for management connectivity and
modem access. The panel provides BT type 43 or D-type connectors for synchronization, D-type
connectors for alarms interfaces, push button switch for ACO/Lamp Test, LEDs for critical/ major/minor
alarm indicators, DB9 male connectors for modem access, DB25 connectors for telemetry inputs/
outputs, and RJ-45 connectors for LAN interface ports. This access panel also provides 12 RJ-45 serial
interfaces for connectivity between the 32-slot and up to 12 photonic layer modules (for example, OMD4,
CMD44, BMD2, UBMD2, MBMD2, GMD10, OBMD 1x8, OBB 2x2x2, OBB 2x4x1, FIM Type 1, FIM Type
2, FIM Type 4, FIM Type 5, FIM Type 6, and DSCM) or PPC6. The RJ-45 serial interfaces in this type of
access panel enable the 32-slot to support autoprovisioning and inventory for the photonic layer
modules (for example, OMD4, CMD44, BMD2, UBMD2, MBMD2, GMD10, OBMD 1x8, OBB 2x2x2,
OBB 2x4x1, FIM Type 1, FIM Type 2, FIM Type 4, FIM Type 5, FIM Type 6, and DSCM) or PPC6.
Note 9: This access panel can be equipped in a 32-slot shelf type and is recognized by shelf inventory
if the 32-slot shelf is running Release 6.0 or higher software load.
Note 10: This access panel is intended for 32-slot shelf types. Order one per shelf.
This access panel is not supported in 7-slot or 14-slot shelf type.
Note 11: This access panel provides fully connectorized terminations for management connectivity and
modem access. The panel provides D-type connectors for alarms interfaces, DB25 connectors for
telemetry inputs/outputs, and RJ-45 connectors for LAN interface ports. This access panel also provides
four RJ-45 serial interfaces for connectivity between the 7-slot (NTK503PAE5 variant) and up to four
photonic layer modules (for example, OMD4, CMD44, BMD2, UBMD2, MBMD2, GMD10, OBMD 1x8,
OBB 2x2x2, OBB 2x4x1, FIM Type 1, FIM Type 2, FIM Type 4, FIM Type 5, FIM Type 6, and DSCM) or
PPC6. The RJ-45 serial interfaces in this type of access panel enable the 7-slot shelf (NTK503PAE5
variant) to support autoprovisioning and inventory for the photonic layer modules (for example, OMD4,
CMD44, BMD2, UBMD2, MBMD2, GMD10, OBMD 1x8, OBB 2x2x2, OBB 2x4x1, FIM Type 1, FIM Type
2, FIM Type 4, FIM Type 5, FIM Type 6, and DSCM) or PPC6.
Note 12: This access panel provides fully connectorized terminations for management connectivity and
modem access. The panel provides DB9 connectors for ESI/ESO and alarms interfaces, and RJ-45
connectors for telemetry inputs/outputs and LAN interface ports. This access panel also provides four
RJ-45 serial interfaces for connectivity between the 6500-7 packet-optical shelf and up to four photonic
layer modules (for example, OSC Filter (1516.9 nm), OMD4, CMD44, BMD2, UBMD2, MBMD2, OBMD
1x8, OBB 2x2x2, OBB 2x4x1, GMD10, and DSCM). The RJ-45 serial interfaces in this type of access
panel enable the 6500-7 packet-optical shelf to support autoprovisioning and inventory for the photonic
layer modules (for example, OSC Filter (1516.9 nm), OMD4, CMD44, BMD-2, UBMD2, MBMD2, OBMD
1x8, OBB 2x2x2, OBB 2x4x1, GMD10, and DSCM).
Note 13: This access panel is intended for 7-slot shelf type (NTK503PAE5 variant only) and is
recognized by shelf inventory if the 7-slot shelf (NTK503PAE5 variant) is running Release 6.0 or higher
software load. Order one per shelf. This access panel is not supported in other shelf types.
Note 14: This access panel is intended for 6500-7 packet-optical shelf type and is recognized by shelf
inventory if the 6500-7 packet-optical shelf is running Release 10.0 or higher software load. Order one
per shelf. This access panel is not supported in other shelf types.
Note 15: This adapter fits over DB25 connectors of the alarms or telemetry ports of a NTK605MAE5
access panel to provide wire wrap posts.
Note 16: This adapter fits over DB9 connectors of the ESI/ESO ports of a NTK605MAE5 access panel
to provide wire wrap posts.
Note 17: This adapter fits over DB9 connectors of the ESI/ESO ports of a NTK505JZ access panel to
provide wire wrap posts.
Technical specifications
Table 3-21 lists the weight and power consumption for the access panels.
Table 3-21
Technical specifications for access panels
Access Panel with connections for eight NTK505MBE5 1.0 kg (2.2 lb) 0 0
external slots
Access Panel for 7-slot optical shelf NTK505PAE5 0.5 kg (1.1 lb) 0 0
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of AC-
powered equipment. For practical purposes, the rounded typical power consumption of an equipment
can be used as the equipment heat dissipation when calculating facilities thermal loads (an estimate of
the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: This module's power is attributed to the feeder zone 2 power budget only in a 32-slot shelf.
Figure 3-30
MIC faceplate overview
ACO
White circle (ACO/RCV ATTN)
Single LED to indicate an ACO or
ACO/
Lamp Test Receive Attention condition
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
• Corrupt Inventory Data
Equipping rules
The maintenance interface card (MIC) is installed in slot 17, subslot 17-2 of
the 14-slot shelf. In a 32-slot shelf, the maintenance interface card (MIC)
functions are performed by access panel (NTK605MAE5). In a 7-slot shelf, the
maintenance interface card (MIC) functions are located on Cooling Fan
Module for 7-slot shelf (NTK507PAE5) or Cooling Fan Module Type 2 for 7-slot
shelf (NTK507PB). In a 6500-7 packet-optical shelf, the maintenance interface
card (MIC) functions are located on Cooling Fan Module for 6500-7 packet-
optical shelf (NTK507QA). In a 2-slot shelf, the maintenance interface card
(MIC) functions are integrated on 2-slot shelf (NTK503MAE5/NTK503NAE5/
NTK503LA).
Technical specifications
Table 3-22 lists the weight and power consumption for the MIC.
Table 3-22
Technical specifications for MIC
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of AC-
powered equipment. For practical purposes, the rounded typical power consumption of an equipment
can be used as the equipment heat dissipation when calculating facilities thermal loads (an estimate of
the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Connector pinouts
BIP connector pinouts
Table 3-23 to Table 3-27 on page 3-90 provide details on the DB9, DB25, and
wire-wrap connector pinouts available on the BIPs.
Table 3-23
Alarm input DB9 male connector pin assignment (NTK599AA)
Pin Signal
1 Spare pin
Pin 1 Pin 5 2 Critical
3 Major
Pin 9 4 Minor
Pin 6
5 Reserved pin
6 Spare pin
7 Receive Attention
8 Battery Return
9 Fault clear
Table 3-24
Alarm input DB9 female connector pin assignment (NTK599BA, NTK599BGE5,
NTK599BH, and NTK599BK)
Pin Signal
3 Battery Return
5 Battery Return
Table 3-25
Alarm output DB25 male connector pin assignment (NTK599AA)
13 Not connected
Table 3-26
Alarm output DB25 female connector pin assignment (NTK599BA,
NTK599BGE5, NTK599BH, and NTK599BK)
13 Not connected
Table 3-27
Optional alarm output wire-wrap connector pin assignment (NTK599BC)
Table 3-28 on page 3-91 to Table 3-47 on page 3-104 provide details on
different connector pinouts available on the access panels.
Table 3-28
ESI/ESO 120 ohm balanced DB9 female connector pinout (NTK555NA,
NTK505LAE5, NTK505JA, and NTK605MAE5)
5 GND
Table 3-29
ESI/ESO A 120 ohm balanced DB9 female connector pinout (NTK505KA)
3 GND 8 GND
Pin 9 Pin 6 4 GND 9 GND
5 GND
Table 3-30
ESI/ESO B 120 ohm balanced DB9 female connector pinout (NTK505KA)
3 GND 8 GND
Pin 9 Pin 6 4 GND 9 GND
5 GND
Table 3-31
Alarms DB9 female connector pinout (NTK505LAE5, Release 1 and 2)
1 NC 6 NC
Pin 5 Pin 1
2 Critical, N/O 7 NC
5 NC
Table 3-32
Alarms DB9 female connector pinout (NTK505JA, NTK505LAE5, Release 3
onwards, and NTK505KA)
Table 3-33
Alarms DB25 female connector pinout (NTK605MAE5 and NTK505PAE5)
Table 3-34
Telemetry in/out DB25 female connector pinout (NTK505LAE5/KA/MBE5,
NTK605MAE5, and NTK505PAE5)
6 In 8 19 In 16
7 In 5 20 In 13
8 In 6 21 In 14
9 GND 22 In 11
10 In 3 23 In 12
11 In 4 24 In 9
12 In 1 25 In 10
13 In 2
Table 3-35
DTE DB9 male connector pinout (NTK505LAE5/MA/KA/MBE5 and
NTK605MAE5)
Table 3-36
BITS/ACU/alarms wire-wrap connector pinout (NTK505MAE5)
BITS
Pin 12A
Pin 8A Pin 32A 2A ESI A-P (tip) 2C ESI A-N (ring)
Pin 2A Pin 16A
BITS
RMT
ACU
VISUAL/AUDIBLE
ALARMS
4A ESI B-P (tip) 4C ESI B-N (ring)
Visual/Audible Alarms
Table 3-37
Telemetry wire-wrap connector pinout (NTK505MAE5)
14A In 13 14C In 14
18A In 10 18C In 11
22A In 7 22C In 8
26A In 4 26C In 5
30A In 1 30C In 2
Table 3-38
BITS/ACU/alarms wire-wrap connector pinout (NTK505MBE5)
BITS
10A ESI B-P (tip) 10C ESI B-N (ring) 10E Ground
14A ESO B-P (tip) 14C ESO B-N (ring) 14E Ground
RMT ACU
Visual/Audible Alarms
22A Visual Minor, N/O 22C Visual Minor, COM 22E Visual Minor, N/C
24A Visual Major, N/O 24C Visual Major, COM 24E Visual Major, N/C
26A Visual Critical, N/O 26C Visual Critical, COM 26E Visual Critical, N/C
28A Audible Minor, N/O 28C Audible Minor, COM 28E Audible Minor, N/C
30A Audible Major, N/O 30C Audible Major, COM 30E Audible Major, N/C
32A Audible Critical, N/O 32C Audible Critical, COM 32E Audible Critical, N/C
Table 3-39
External Slot I/F RJ-45 (NTK505JA, NTK555LA, NTK555NA, NTK503MAE5,
NTK503NAE5, NTK505MBE5, NTK605MAE5, and NTK505PAE5)
1 Ground
2 Presence Detect
3 Serial Clock
6 Ground
7 Ground
8 Ground
Table 3-40
Female DB25 to wire wrap adapter connector pinout (NTK605MYE5)
1 2 3 4 5 6 7 8 9 10
A GND N/C Visual Visual Visual GND Audible Audible Audible GND
Minor, Major, Critical, Minor, Major, Critical,
N/O N/O N/O N/O N/O N/O
B ACO/ N/C Visual Visual Visual GND Audible Audible Audible GND
Lamptest In Minor, Major, Critical, Minor, Major, Critical,
COM COM COM COM COM COM
C GND N/C Visual Visual Visual GND Audible Audible Audible GND
Minor, Major, Critical, Minor, Major, Critical,
N/C N/C N/C N/C N/C N/C
1 2 3 4 5 6 7 8 9 10
Front view
Table 3-41
Telemetry wire-wrap adapter connector pinout (NTK605MYE5)
1 2 3 4 5 6 7 8 9 10
C In 16 In 15 In 14 In 13 In 12 GND In 7 In 8 In 9 GND
Table 3-42
ESI/ESO wire-wrap adapter connector pinout (NTK605MZE5)
1 2 3 4
1 2 3 4
Front view
Table 3-43
10/100Base-T RJ-45 pinout
Signal
RJ-45 Plug Pin
Shelf Access panel 48x10/100BT I/
processor O panel
Table 3-44
Alarm input RJ-45 telemetry connector pinout (integrated access panel in
NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf or shelf processor w/
access panel in NTK503LA variant of 2-slot shelf)
1 In 1 White/Orange
2 In 2 Orange
3 In 3 White/Green
6 In 6 Green
7 In 7 White/Brown
8 Ground Brown
Table 3-45
Telemetry in RJ-45, Telemetry Out RJ-45, and visual alarm output DB9
connector pinout for NTK505JA and SPAP-2 w/2xOSC (NTK555NA)
1 In 1 White/Orange
2 In 2 Orange
3 In 3 White/Green
4 In 4 Blue
5 In 5 White/Blue
7 In 7 White/Brown
8 Ground Brown
1 VIS_CRIT_NC 6 VIS_CRIT_COM
Pin 5 Pin 1 2 VIS_CRIT_NO 7 VIS_MAJ_NC
3 VIS_MAJ_NO 8 VIS_MAJ_COM
5 VIS_MIN_COM — —
Table 3-46
Wire-wrap adapter (NTK505JZ) connector pinout when used on the ESI/ESO DB9 port of a 6500-7
packet-optical shelf Access Panel (NTK505JA)
1 2 3 4 5 6
1 2 3 4 5 6
D ESO B-P (tip) GND GND GND GND ESO A-P (tip)
Table 3-47
Wire-wrap adapter (NTK505JZ) connector pinout when used on the Alarms DB9 port of a 6500-7
packet-optical shelf Access Panel (NTK505JA)
1 2 3 4 5 6
A VIS_MAJ_NO VIS_CRIT_NC
B VIS_MAJ_COM VIS_CRIT_COM
C VIS_MIN_NO VIS_CRIT_NO
External equipment 4-
Table 4-1
External equipment in this chapter
Topic Page
In conjunction with 1+1 APS (ODU) layer linear protection scheme, 1+1 TPT
and 1+1 port TPT protection are offered. Use of TPT is meant to protect the
client equipment against client port faults and equipment failure. The client
equipment can be a multi client-port or a single-client port circuit pack. The
1+1 port TPT allows certain client ports on a multi client-port circuit pack to be
TPT protected, while other client ports on the same multi client-port circuit
pack can remain unprotected. Therefore on a multi client-port circuit pack that
support 1+1 port TPT protection, a mixture of protected and unprotected client
ports is supported. However in the case of 1+1 TPT protection, all client ports
of a multi client-port circuit pack switch to protection even if the fault only
occurs on one port.
The TPT contains optical splitter/coupler filters that function as entry and exit
points to the 6500 network. As an entry point to the 6500 network, the
splitter/coupler receives a signal from one client fiber. The filter splits the
power of the signal and then transmits it over two separate fibers into the client
ports on the two circuit packs which form the TPT protection group. The power
of the signals that are transmitted to the two circuit packs is approximately 50
percent of the power of the signal that was received.
As an exit point from the 6500 network, the coupler receives a signal from only
one client fiber and no signal from the other client fiber. To accommodate this,
the software within the circuit packs determines which signal is best. The
circuit pack with the best signal transmits its signal to the TPT, which transmits
the signal to the subtending equipment. The non-active circuit pack will shut
down its client lasers, so that the TPT will only have one optical signal which
is coupled to the client equipment.
As an example, Figure 4-1 on page 4-3 illustrates the function of the TPT for
OTSC circuit packs, however the principle is the same for other circuit packs
that support 1+1 TPT and 1+1 port TPT protection.
Figure 4-1
1+1 TPT protection (10G OTSC example)
Transponder
Tributary side Protection tray (TPT) 6500 network
10G
OTSC
Tx
working
Rx 10G
OTSC
protection
Client
Equipment
Legend
Active (laser on)
Protected (laser off)
1 2
B B
O
CLIENT To client Rx To client Rx CLIENT To client Rx To client Rx O
T IN 1 2 IN 1 2 T
T T
O
CLIENT Fm client Tx Fm client Tx CLIENT Fm client Tx Fm client Tx O
P OUT 1 2 OUT 1 2 P
T T
O
COMBINER COMBINER COMBINER COMBINER COMBINER COMBINER O
P COMMON 1 2 COMMON 1 2 P
B B
O SPLITTER SPLITTER SPLITTER SPLITTER SPLITTER SPLITTER O
T COMMON 1 2 COMMON 1 2 T
1 2
Figure 4-3
2-channel TPT block diagram (NT0H59ABE5/NT0H59BBE5)
Equipment
Inventory inventory
(RJ-45)
Client 2 Client 2
Rx 2
To
Splitter
Optical
Client 2
Out
Rx 1
To
Client 2 Client 2
From
Tx 2
Coupler
Optical
Client 2
In
From
Tx 1
Client 1 Client 1
Rx 2
Coupler
To
Optical
Client 1
Out
Rx 1
To
Client 1 Client 1
From
Tx 2
Splitter
Optical
Client 1
In
From
Tx 1
Figure 4-4
Interior view of a 4-channel Transponder Protection Tray
1 2 3 4
B B
O
CLIENT To CLIENT To CLIENT CLIENT To CLIENT To CLIENT CLIENT To CLIENT To CLIENT CLIENT To CLIENT To CLIENT O
T IN Rx 1 Rx 2 IN Rx 1 Rx 2 IN Rx 1 Rx 2 IN Rx 1 Rx 2 T
T T
O
CLIENT Fm CLIENT Fm CLIENT CLIENT Fm CLIENT Fm CLIENT CLIENT Fm CLIENT Fm CLIENT CLIENT Fm CLIENT Fm CLIENT O
P OUT Tx 1 Tx 2 OUT Tx 1 Tx 2 OUT Tx 1 Tx 2 OUT Tx 1 Tx 2 P
T COMBINER COMBINER COMBINER COMBINER COMBINER COMBINER COMBINER COMBINER COMBINER COMBINER COMBINER COMBINER T
O
O
P COMMON 1 2 COMMON 1 2 COMMON 1 2 COMMON 1 2 P
B B
O
SPLITTER SPLITTER SPLITTER SPLITTER SPLITTER SPLITTER SPLITTER SPLITTER SPLITTER SPLITTER SPLITTER SPLITTER O
T COMMON 1 2 COMMON 1 2 COMMON 1 2 COMMON 1 2 T
1 2 3 4
Release 11.2
4-8 External equipment
Inventory
July 2016
323-1851-102.1 Standard Issue 1
Common Equipment
External equipment 4-9
Release 11.2
Inventory
4-10 External equipment
Ch. 1 Ch. 1 Ch. 1 Ch. 1 Ch. 2 Ch. 2 Ch. 2 Ch. 2 Ch. 10 Ch. 10 Ch. 10 Ch. 10
Client 1 Client 2 Client 1 Client 2 Client 1 Client 2 Client 1 Client 2 Client 1 Client 2 Client 1 Client 2
In In Out Out In In Out Out In In Out Out
July 2016
323-1851-102.1 Standard Issue 1
Common Equipment
External equipment 4-11
Each type of Transponder Protection Tray contains a patch panel with pairs of
SC-SC connectors (for 2-Channel and 4-Channel TPTs) or LC-LC connectors
(for 10-Channel TPT). Use these connectors to make the fiber connections
between subtending equipment and the Transponder Protection Tray, and
between the tray and the circuit packs. For 2-Channel and 4-Channel TPTs,
connectors on the client-side are accessed by lifting the pull-up tab located on
top of each bulkhead. For 10-Channel TPT, connectors on the client-side are
accessed by removing the dust caps.
The TPT can be located anywhere in the equipment rack or collocated with
subtending equipment. The TPT can be also collocated with client equipment.
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Autoprovisioning Mismatch
• Circuit Pack Missing
• Circuit Pack Mismatch
Equipment alarms
• Corrupt Inventory data
Equipping rules
TPT is an external equipment.
Table 4-2
External equipment
Note 1: This is a single-mode 4-channel TPT equipment and is used to provide 1+1 TPT protection on
— 100G WL3n MOTR, FLEX MOTR, 8xOTN Flex MOTR, (1+8)xOTN Flex MOTR, 10G OC-192/STM-
64 WT, 10GEL WT, 10G OTU2 WT, 10G OTSC, SuperMux, 4x10G OTR, and 2x10G OTR circuit
packs.
— 40G MOTR groups (40G MUX OCI/40G OCLD or 40G MUX OCI/Wavelength-selective 40G OCLD
while 40G MUX OCI circuit pack must be NTK525CFE5 variant).
— 40G OTR groups (40G+ CFP OCI/40G OCLD or 40G+ CFP OCI/Wavelength-selective 40G
OCLD).
— 100G MOTR groups (10x10G MUX/100G OCLD,10x10G MUX/100G WL3/WL3e, 10x10G MUX/
Flex2 WL3/WL3e OCLD, 10x10G MUX/Flex3 WL3e OCLD, or 10x10G MUX/Flex4 WL3e OCLD).
— 100G OTR groups (100G OCI/100G WL3/WL3e, 100G OCI/Flex3 WL3e OCLD, or 100G OCI/Flex2
WL3/WL3e OCLD).
For more information about TPT equipment, see Common Equipment, 323-1851-102.1. For more
information about TPT protection, see Part 2 of Configuration - Provisioning and Operating,
323-1851-310.
Note 2: This is a single-mode 2-channel TPT equipment and is used to provide 1+1 TPT protection on
— 100G WL3n MOTR, FLEX MOTR, 8xOTN Flex MOTR, (1+8)xOTN Flex MOTR, 10G OC-192/STM-
64 WT, 10GEL WT, 10G OTU2 WT, 10G OTSC, SuperMux, 4x10G OTR, and 2x10G OTR circuit
packs.
— 40G MOTR groups (40G MUX OCI/40G OCLD or 40G MUX OCI/Wavelength-selective 40G OCLD
while 40G MUX OCI circuit pack must be NTK525CFE5 variant).
— 40G OTR groups (40G+ CFP OCI/40G OCLD or 40G+ CFP OCI/Wavelength-selective 40G
OCLD).
— 100G MOTR groups (10x10G MUX/100G OCLD,10x10G MUX/100G WL3/WL3e, 10x10G MUX/
Flex2 WL3/WL3e OCLD, 10x10G MUX/Flex3 WL3e OCLD, or 10x10G MUX/Flex4 WL3e OCLD).
— 100G OTR groups (100G OCI/100G WL3/WL3e, 100G OCI/Flex3 WL3e OCLD, 100G OCI/Flex4
WL3e OCLD, or 100G OCI/Flex2 WL3/WL3e OCLD).
For more information about TPT equipment, see Common Equipment, 323-1851-102.1. For more
information about TPT protection, see Part 2 of Configuration - Provisioning and Operating,
323-1851-310.
Note 3: This is a multi-mode 4-channel TPT equipment and is used to provide 1+1 TPT protection on
SuperMux, 4x10G OTR, FLEX MOTR, 8xOTN Flex MOTR, and (1+8)xOTN Flex MOTR circuit packs.
For more information about TPT equipment, see Common Equipment, 323-1851-102.1. For more
information about TPT protection, see Part 2 of Configuration - Provisioning and Operating,
323-1851-310.
Note 4: This is a multi-mode 2-channel TPT equipment and is used to provide 1+1 TPT protection on
SuperMux, 4x10G OTR, FLEX MOTR, 8xOTN Flex MOTR, and (1+8)xOTN Flex MOTR circuit packs.
For more information about TPT equipment, see Common Equipment, 323-1851-102.1. For more
information about TPT protection, see Part 2 of Configuration - Provisioning and Operating,
323-1851-310.
Note 5: This is a single-mode 10-channel TPT equipment and is used to provide 1+1 TPT protection on
— 100G WL3n MOTR, FLEX MOTR, 8xOTN Flex MOTR, (1+8)xOTN Flex MOTR, 10G OC-192/STM-
64 WT, 10GEL WT, 10G OTU2 WT, 10G OTSC, SuperMux, 4x10G OTR, and 2x10G OTR circuit
packs.
— 40G MOTR groups (40G MUX OCI/40G OCLD or 40G MUX OCI/Wavelength-selective 40G OCLD
while 40G MUX OCI circuit pack must be NTK525CFE5 variant).
— 40G OTR groups (40G+ CFP OCI/40G OCLD or 40G+ CFP OCI/Wavelength-selective 40G
OCLD).
— 100G MOTR groups (10x10G MUX/100G OCLD,10x10G MUX/100G WL3/WL3e, 10x10G MUX/
Flex2 WL3/WL3e OCLD, 10x10G MUX/Flex3 WL3e OCLD, or 10x10G MUX/Flex4 WL3e OCLD).
— 100G OTR groups (100G OCI/100G WL3/WL3e, 100G OCI/Flex3 WL3e OCLD, 100G OCI/Flex4
WL3e OCLD, or 100G OCI/Flex2 WL3/WL3e OCLD).
For more information about TPT equipment, see Common Equipment, 323-1851-102.1. For more
information about TPT protection, see Part 2 of Configuration - Provisioning and Operating,
323-1851-310.
Note 6: One Fiber Manager for each TPT is required. Use the fiber manager for fiber slack
management since these TPTs do not have fiber management capabilities.
Technical specifications
Table 4-3 lists the physical specifications for TPT.
Table 4-3
Physical specifications for TPT
Table 4-4 lists the specifications for the 2-channel and 4-channel single-mode
and multimode transponder protection trays.
Table 4-4
2-channel and 4-channel Transponder protection trays (TPT-2, TPT-2 MM, TPT-4, and TPT-4 MM)
specifications
Table 4-5 lists the specifications for the 10-channel single-mode transponder
protection trays (TPT-10).
Table 4-5
10-channel Transponder Protection Tray (TPT-10) specifications
Figure 4-8
1+1 ETS protection
Legend
CS = Client side
LS = Line side
Release 11.2
40G MUX OCI
Port 1 ETS 40G MUX OCI & 40G OCLD (working line) 40G MUX OCI & 40G OCLD Port 1 ETS
40G MUX OCI OCI OCLD OCLD OCI 40G MUX OCI
Port 1
C CS LS LS CS D Port 1
A Splitter Rx P1 Tx Photonic Rx Tx P1 Switch B Subtending
Subtending Tx P1 Rx Tx Rx P1
Equipment Layer Equipment
Rx P2 Tx P2
E Tx P2 Rx P2 F Rx
Tx
ETS Rx P3 ETS Tx
Rx D Tx P3 C
Tx P3 Rx P3
B Rx P4 Tx P4 A
4-20 External equipment
Tx P4 Rx P4
Switch E Splitter
F Secondary Path
Tx
E ETS Tx
Rx ETS C
D A
B
Switch E Splitter
F
July 2016
323-1851-102.1 Standard Issue 1
Common Equipment
Figure 4-10
Release 11.2
Port 1 E TS 100G MUX OCI & 100G OCLD (working line) 100G MUX OCI & 100G OCLD Port 1 E TS
100G MUX OCI OCI OCLD OCLD OCI 100G MUX OCI
Spl itter C CS LS LS CS D Port 1
Port 1 A Rx P1 Tx Swi tch B
Phot onic Rx Tx P1 Subtend ing
Subtending Tx P1 Rx Tx Rx P1
Equipment Layer Equipment
Rx P2 Tx P2
E Tx P2 Rx P2 F Rx
Tx
ETS Rx P3 Tx P3 ETS Tx
Rx D C
Tx P3 Rx P3
B Rx P4 Tx P4 A
Tx P4 Rx P4
Switch Rx P5 Tx P5
F E Spli tter
ETS splits client TX signal 50/50 Tx P5 Rx P5
so traffic is bridged on working Rx P6 Tx P6
Tx P6
D Tx P7 Tx P7
Rx P7 A
B Rx P8
Tx P8 Tx P8
Rx P9 Rx P8 E Splitter
Switch Tx P9
F Tx P9
Rx P10 Rx P9
Client port XFP laser is shutoff Tx P10
Tx P10
if LOFEF parameter is Enabled Rx P10
and fault occurs
100G MUX OCI
100G MUX OCI Port 4 ETS
100G MUX OCI
Port 4 E TS D Port 4
100G MUX OCI Switch B Sub tending
Spl itter C
Port 4 A Equipment
Subtending
Equipment F Rx
E ET S Tx
Tx Note 1: Only 4 of the 10 ports are shown as connected C
Rx ETS
D A
B
to ETSs, but all 10 can be.
Note 2: There can be some 100G MUX OCI client ports not E Splitte r
Switch
F connected to ETS and others connected. This is supported
allowing a mix of unprotected and protected services.
July 2016
External equipment 4-21
Figure 4-11 shows an interior view of the 4-channel tray. Figure 4-12 on page
4-23 shows the functional block diagram of an Enhanced Trunk Switch (ETS).
Figure 4-11
Front view of an Enhanced Trunk Switch
Figure 4-12
Enhanced Trunk Switch (ETS) block diagram (NTUG90ANE5)
A B
C E D F
The ETS consists of three parts: the ETS shelf, the ETS Comms module, and
the ETS Switch module.
ETS Shelf
The ETS Shelf is a two-slot, 1U high, rack-mount shelf that contains the ETS
Switch module and ETS Comms module.
The ETS Comms and ETS Switch modules are both individually field
replaceable. However, only the ETS Comms can be replaced in-service. The
ETS shelf also provides easy front access for fiber connections. The ETS
Shelf also includes a 5-pin power terminal block located on the rear of the unit
for redundant DC power supply connections. The ETS Shelf requires a fan
module to cool the shelf.
The ETS shelf can be powered using the breaker interface panel (BIP)/fuse
interface panel (FIP) (NTK599DA/NTK599EA). The BIP/FIP can also be used
to power the 14-slot shelf if you add the BIP/FIP Breaker Kit (NTK599ZS) and
the 14-slot Cable Assy (NTTC01BD or NTTC01BE). If DC power is not
available, use the 2U rectifier (NTN458SB). For more information about 2U
rectifier (NTN458SB) and how to order this item, refer to the Common
Photonic Layer (CPL) documentation suite, 323-1661-XXX.
The internal backplane connection in the ETS Shelf supplies electrical power
and supports monitoring and configuration for each module (ETS Switch and
ETS Comms module) installed in the unit. You can make a TCP connection to
the ETS Shelf by connecting an Ethernet cable to the 10BASE-T Ethernet
connector (RJ-45) on the backplane of the ETS Shelf.
Note: Both the RS-232 DB9 serial port on the ETS Comms module and
the RJ-45 Ethernet port on the back panel of the ETS Shelf support the
same set of TL1 commands.
Back panel
Figure 4-13 shows the back panel of the Enhanced Trunk Switch.
Figure 4-13
Back panel
Table 4-6 describes the connectors on the back panel of the ETS Shelf.
Table 4-6
Back panel connectors
ETS Shelf ETHERNET One RJ-45 Ethernet connector for TCP communications via a
10BASE-T Ethernet cable. The Ethernet connector is enabled by
the ETS Comms module mounted in slot A on the left side of the
ETS Shelf.
ALARMS One DB25 connector for aggregated major and minor telemetry
alarm relays.
Note: You must manually configure the telemetry alarm description with
the appropriate text in the Telemetry configuration screen of the System
Manager.
ETS Comms
The ETS Comms module monitors and communicates with the ETS Switch
mounted in the ETS Shelf. It polls and reports shelf information, slot
occupancy, and the types of modules installed in the shelf, and their status.
The ETS Comms is also used to set various parameters of the ETS Switch.
The ETS Comms supports a TL1 command line interface.
ATTENTION
If a reset occurs as a result of electrical power failure, the ETS Comms
module recovers with its current configuration information intact after it
resumes operation. However, the date and time must be reset after a reset
occurs.
Front panel
The front panel of the ETS Comms contains:
• five indicator lamps
• two buttons
• one RS-232 DB9 connector for craft interface connections to the ETS
Comms module
Figure 4-14 shows the front panel of the ETS Comms module.
Figure 4-14
Front panel of the ETS Comms module
Table 4-7 describes the buttons on the front panel of the ETS Comms module.
Table 4-7
Front panel buttons of the ETS Comms module
Button Description
ACO Interrupts the audible alarms by deactivating the ETS Comms alarm relays.
INIT Reinitializes the module, which resets the LEDs and alarm relays based on
the new startup alarm conditions.
ETS Switch
The ETS Switch module provides continuous optical power monitoring on the
primary and secondary paths. It typically provides client-layer optical path
protection and optical channel path protection. If optical power on one path
drops below a preset threshold, the ETS Switch will switch traffic to the other
path.
ATTENTION
If a reset occurs or if a total electrical power failure occurs, the ETS switch
recovers on the current (most recent) active path with its current (most
recent) switch thresholds and operating mode configuration data.
Front panel
The front panel of the ETS Switch contains:
• six indicator lamps
• two switch buttons. In automatic mode, the module switches traffic
between paths when the measured signal power is less than a preset
threshold. In manual mode, traffic can only be switched to the alternate
path by pressing a button on the module front panel, or by sending an
explicit TL1 command to the module. Table 4-8 on page 4-27 describes
these switch buttons on the front panel of the ETS Switch module.
Table 4-8
Switch buttons of the ETS Switch module
Button Description
Figure 4-15 shows the front panel of the ETS Switch module.
Figure 4-15
Front panel of the ETS Switch module
Indicator lamps
The description of the indicator lamps of all three ETS module components
follows.
ETS Shelf
Indicator lamps on the front panel of the ETS Shelf unit show the status of the
fans and the status of the primary and secondary power supplies.
ETS Switch
The six indicator lamps on the front panel of the ETS Switch module show the
following:
• module status
• path in use
• current operating mode
The AUTO LED indicates the operating mode. When the AUTO LED is off, the
module is in manual mode; and when the AUTO LED is green, the module is
in automatic mode.
ETS Comms
The front panel of the ETS Comms module has the following indicator lamps:
• CARD: bi-color LED (green/yellow) that indicates the operating status of
the ETS Comms module
• CRIT: indicates that a critical alarm is active against the ETS
• MAJ: indicates that a major alarm is active against the ETS
• MIN: indicates that a minor alarm is active against the ETS
• ACO: indicates that the ETS Comms telemetry alarm relays are
deactivated
See Table 4-9 for more information on the indicator lamps on the ETS Comms.
Table 4-9
Indicator lamps for ETS Comms module
CARD Yellow/Green Indicates the operational state of the ETS Comms module. This LED has
(bi-color) the following states:
Green — the module is operating normally.
Yellow — the module failed to initialize. This state can indicate that the
ETS Comms module is not fully seated in the slot.
Green/Yellow flashing — the ETS Comms module is not mounted in the
correct slot of the ETS Shelf.
This lamp is off when a loss of power has occurred.
CRIT Red Indicates that a module managed by the ETS Comms raised a critical
alarm.
MAJ Red Indicates that a module managed by the ETS Comms raised a major
alarm or the ETS Comms has lost contact to the monitored module.
MIN Yellow Indicates that a module managed by the ETS Comms raised a minor
alarm or one of the power supplies (A or B) has failed.
ACO Yellow Indicates that the alarm cut-off (ACO) button was pressed, deactivating
the ETS Comms telemetry alarm relays. Present alarms are no longer
reported through the alarm relays in this case.
Equipping rules
ETS is an external equipment and is used to provide 1+1 ETS protection on
10G WT, 10GEL WT, 10G OTR, 2x10G OTR, 4x10G OTR, 10G OTSC,
40G MUX OCI, and 10x10G MUX circuit packs. For more information about
ETS protection, see Part 2 of Configuration - Provisioning and Operating,
323-1851-310.
Technical specifications
Table 4-10 lists the physical specifications for ETS.
Table 4-10
Physical specifications for ETS
Table 4-11
Enhanced Trunk Switch specifications
ETS Switch — 2W —
Coupler section 40 dB
End-to-End 6.4 dB
Alarm relay signals Dry contact: critical, major and minor alarms.
Relay open under normal operation.
Relay closed when power is off or alarm is active.
See “Connector pinouts” on page 3-88 for DB25
connector pinout
Fuses 2A
Width (see Note 6) • 442.7 mm (17.43 in.) with a setback from front to
mounting flange equal to 35.6 mm (1.4 in.), 127 mm
(5.0 in.) or 165.1 mm (6.5 in.)
• 431.8 mm (17 in.) with a setback from front to mounting
flange equal to 152.4 mm (6.0 in.)
Note 1: Maximum power consumption values are obtained during worst-case operating conditions
(for example, temperature, humidity).
Note 2: All dBm power levels referenced are aggregate power levels.
Note 3: This value cannot be provisioned.
Note 4: Can be provisioned in 1 dB increments.
Note 5: Captured RPL at the moment the link is setup should not exceed –6 dBm.
Note 6: The width specified is with the mounting brackets installed.
Table 5-1
4xOptical Protection Switch (OPS) in this chapter
Topic Page
Each 4xOPS circuit pack includes two fixed optical protection groups and two
pluggable protection groups. The two pluggable protection groups are
provided by equipping a 2xOptical Protection Switch Module (OPSM2 C-
Band) (also referred to as OPSM2) in the sub-slot. Each protection group
(fixed or pluggable) has six unidirectional ports (common, SW1, SW2). In the
transmit direction, the signal is divided into two optical streams by a splitter
and goes out on both SW1 and SW2 ports. In the receive direction, the SW1
and SW2 Rx signals are selected by an optical switch based on optical power
and provisioned LOS thresholds. This circuit pack comes with a
4xOPS sub-slot filler panel/cover (410-5300-001) which must only be
removed when a OPSM2 is equipped in the sub-slot.
The optical switch can be placed in different locations to provide path and
equipment protection.
Figure 5-1 on page 5-3 shows the faceplate of a 4xOPS circuit pack and
Figure 5-2 on page 5-4 provides a functional block diagram of the 4xOPS
circuit pack. Figure 5-3 on page 5-5 provides a functional block diagram of the
OPSM2 module.
Figure 5-1
4xOPS circuit pack faceplate
NTK576AA 2xOPSM
Yellow bi-color circle (LOS)
- Used to communicate Rx Loss of Signal
Fixed protection groups
Figure 5-2
4xOPS circuit pack block diagram (NTK554TA)
2x1 Optical
OPS3 SW1 In 13
Switch
Backplane
PD PD
OPS3 SW2 In 15
PD PD OPS4 SW2 In 21
Legend
OPS Optical Protection Switch
PD Photodiode
Figure 5-3
OPSM2 module block diagram (NTK576AA)
2x1 Optical
OPS1 SW1 In 1
Switch
OPS1 SW1 Out 2
PD PD
OPS1 SW2 In 3
OPS1SW2 Out 4
1x2 Optical
OPS1 COM In 5
Splitter
OPS1COM Out 6
PD PD OPS2 SW2 In 9
Legend
OPS Optical Protection Switch
PD Photodiode
Supported functionality
The 4xOPS circuit pack (NTK554TA) and OPSM2 module (NTK576AA)
provide the following functionality:
• can be used in the following applications:
— Client-layer Optical Path Protection: Between 6500 client ports and
subtending equipment
— Optical Channel (OCH) Path Protection: Between 6500 line ports and
a CMD
— Span Layer Path Protection: After a Passive Photonic OTS to protect
the span signal
— Stand-alone with 3rd Party Equipment
• see Table 5-2 for function and connector type for each port in 4xOPS
optical interface (NTK554TA)
Table 5-2
4xOPS optical interfaces
• see Table 5-3 for function and connector type for each port in OPSM2
module (NTK576AA)
Table 5-3
OPSM2 module
Performance monitoring
The 6500 Packet-Optical Platform monitors and collects physical PMs for
4xOPS and OPSM2 circuit pack facilities. Table 5-4 on page 5-8 provides a list
of monitor types supported on 4xOPS and OPSM2 circuit packs. Figure 5-4
on page 5-9 and Figure 5-5 on page 5-10 show the 4xOPS and OPSM2 circuit
pack optical monitoring points.
Table 5-4
Monitor types table for 4xOPS and OPSM2 circuit pack
OPTMON
OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X
PSCW-OTS X
PSCP-OTS X
PSD-OTS X
Figure 5-4
4xOPS circuit pack optical monitoring points
2x1 Optical
OPS3 SW1 In 13
Switch
Backplane
PD PD
OPS3 SW2 In 15
PD PD OPS4 SW2 In 21
Legend
OPS Optical Protection Switch
PD Photodiode
Figure 5-5
OPSM2 circuit pack optical monitoring points
2x1 Optical
OPS1 SW1 In 1
Switch
OPS1 SW1 Out 2
PD PD
OPS1 SW2 In 3
OPS1SW2 Out 4
1x2 Optical
OPS1 COM In 5
Splitter
OPS1COM Out 6
Legend
OPS Optical Protection Switch
PD Photodiode
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Autoprovisioning Mismatch
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Circuit Pack Upgrade Failed
• Circuit Pack Unknown
• Database Not Recovered For Slot
Pluggable alarms
• Circuit Pack Missing - Pluggable
• Circuit Pack Failed - Pluggable
• Intercard Suspected - Pluggable
Common alarms
• Software Auto-Upgrade in Progress
• Software Auto-Upgrade Failed
Adjacency alarms
• Adjacency Mismatch
Equipping rules
The following equipping rules apply to 4xOPS circuit pack:
• is a single slot interface
• can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot packet-optical,
optical, converged optical, optical/front electrical, converged optical/front
electrical, optical/rear electrical, or converged optical/rear electrical
shelves.
• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
• can be equipped in slots 1 to 7 of the 7-slot optical shelf.
• can be equipped in slots 1 to 8 of the 6500-7 packet-optical shelf.
• can be equipped in slots 1 and 2 of the 2-slot optical shelf.
Technical specifications
Table 5-5 on page 5-13 lists the weight, power consumption, and other
specifications for the 4xOPS optical interface circuit pack and OPSM2
module.
Table 5-5
Technical specifications for 4xOPS circuit pack and OPSM2 module
Power consumption Typical (W): 8 (see Note 1) Typical (W): 1 (see Note 1)
Power Budget (W): 10 (see Power Budget (W): 1 (see Note
Note 2) 2)
Connector type LC
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of AC-
powered equipment. For practical purposes, the rounded typical power consumption of an equipment
can be used as the equipment heat dissipation when calculating facilities thermal loads (an estimate of
the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: Inclusive of faceplate connectors.
Note 4: This is the OPS automatic switch time. Subtending equipment recovery time will dictate overall
restoration time.
Note 5: Accuracy at CWDM waves may not meet 1 dB spec.
Procedure 5-1
Provisioning
complete
The circuit packs connected to the OPS are provisioned as Unprotected. The
circuit packs connected to the OPS do not necessarily need to be equipped in
the same shelf. The protection groups are auto-created when the circuit pack
and pluggable module are provisioned. Protection group latches to the current
state if there is an equipment failure.
Figure 5-6
Client-layer optical path protection
Figure 5-7
Optical channel path protection
Figure 5-8
Optical channel path protection: supported and unsupported regen configurations
The Transceiver Triggered Switch (TTS) feature allows switches to occur due
to transceiver detected faults, supporting applications in which total optical
power cannot be used. TTS switches enables transceiver triggered switches
in addition to optical total power switches. TTS provides another level of
protection, but does not inhibit existing power level based switching.
Figure 5-9
Passive network span layer path protection
Figure 5-10
3rd party equipment path protection
Table 5-6
CMD support for 1+1 OPS in the optical channel path protection application
SCMD4 NA YES NA NA NA NA
• The TX Conditioning or Laser Off Far End Fail parameter on the 6500
client port connected to the OPS must be set to shut off the laser when the
circuit pack detects faults or certain alarm conditioning signals. Failure to
set this parameter correctly will prevent automatic protection switching
from occurring.
• OPS LOS threshold should be kept at -20 dBm threshold unless otherwise
required to be changed.
• Rx power level at SW1 IN and SW2 IN should not differ by more than
5 dB. Use attenuator pads, if necessary, to meet this requirement. This
operational consideration exists to ensure that the subtending equipment
receiver does not see a dramatic change in power level when the OPS
switches. Some subtending equipment may take longer time to re-acquire
a signal if the new signal has a different power level.
• OPS switch port ADJ facility expected far end address is provisioned to
point to OTR client port. OPS alarms (due to Client laser shutoffs) are not
correlated out by site level correlation/network level correlation. Since
most of OTR client ports don’t have ADJ facility, adjacency facility is
unidirectional (from OPS to OTR).
• For circuit packs that support the holdoff timer, the holdoff timer must be
set to 0 ms for facilities connected to the OPS.
When TTS mode is enabled for an OPTMON facility, Service and Photonic
Layer Interoperability (SPLI) automatically enables TTS mode on the OTM/
OTMC2/OTM4 facility connected to the Common In port of the 4xOPS circuit
pack.
By default, the TTS feature is disabled. You can enable/disable the TTS
feature using the Edit OPTMON Protection Provisioning dialog box for the
4xOPS within the Site Manager Protection -> Protection Provisioning
application. Refer to the “Changing the protection parameters for a pair of
facilities” on page 5-32.
– Issue a manual switch against the working member. This does not
cause a switch, but overwrites the transceiver fault (TRFLT) with
Manual. Then, release the Manual to switch back from protected to
working line.
Figure 5-11
Optical channel path protection (TTS feature)
OPS topology
This section is applicable for when TTS is enabled or disabled, unless
otherwise noted.
Circuit packs supported in the TTS OPS optical channel path protection
application are listed below. The TTS optical channel path protection
application is not supported when the circuit pack is in BPSK format. The
TTS optical channel path protection application is also supported when the
WL3/WL3 Flex circuit packs are used in a fabric (with the XCIF).
• 100G WL3/WL3e OCLD (NTK539Ux), QPSK100G format
• Flex2 WL3/WL3e OCLD (NTK539Bx), QPSK100G format
• Flex3 WL3e OCLD (NTK539Qx), QPSK100G and 16QAM200G format
• Flex4 WL3e OCLD (NTK539Fx), QPSK100G and 16QAM200G format
Circuit packs supported in the passive network span layer path protection
application are the same as those supported in the optical channel path
protection application. See the list in the earlier section.
See Table 5-7 on page 5-25 for XFP/SFP+/CFP pluggables that can be
connected to the OPS when used in the client-layer optical path protection
application.
Table 5-7
Pluggables that can be connected to the OPS when used in the client-layer optical path
protection application
Note 1: Refer to the “Pluggable Modules” section in Part 3 of Planning, NTRN10DP for pluggable
module support in each circuit pack.
Note 2: CFP support depends on subtending equipment specifications. Maximum channel insertion
loss must be 5 dB or greater.
See Table 5-8 for pluggables that can be connected to the OPS when used in
the optical channel path protection application.
Table 5-8
Pluggables that can be connected to the OPS when used in the optical channel path
protection application
Note: Refer to the “Pluggable Modules” section in Part 3 of Planning, NTRN10DP for pluggable
module support in each circuit pack.
Table 5-9
Procedures in this chapter
Topic Page
Procedure 5-2, Routing fiber-optic cables onto the 6500 shelf 5-29
Procedure 5-1
Provisioning 4xOPS circuit packs and OPSM2
modules automatically
If automatic equipping is enabled, a 4xOPS circuit pack and the OPSM2
module present are automatically provisioned when inserted in the shelf.
Facilities will auto-provision.
See “Equipping rules” on page 5-12 for supported slots for 4xOPS circuit
packs. If a circuit pack is inserted in an unsupported slot, an Autoprovisioning
Mismatch alarm is raised.
CAUTION
Risk of equipment damage
Electrostatic discharge can damage electrostatic sensitive
devices. Use antistatic protection to avoid damaging circuit
packs.
Prerequisites
• To provision the 4xOPS circuit pack in an empty slot, ensure the last
equipment that occupied the slot and its related facilities have been
deleted.
• To provision an OPSM2 for an empty subslot on the 4xOPS circuit pack,
ensure the last OPSM2 that occupied the subslot and its related facilities
have been deleted.
• Ensure the plastic pin protector on the circuit pack and OPSM2 has been
removed.
• Ensure automatic equipping is enabled.
Step Action
Procedure 5-2
Routing fiber-optic cables onto the 6500 shelf
Refer to the procedure on routing fiber-optical cables onto the 6500 shelf, in
the Installation technical publication specific to the respective 6500 shelf type.
—end—
Procedure 5-3
Connecting or disconnecting fiber-optic cables to or
from circuit packs
Refer to the procedure on connecting or disconnecting fiber-optic cables to or
from circuit packs, in the Installation technical publication specific to the
respective 6500 shelf type.
—end—
Procedure 5-4
Editing facility parameters
Use this procedure to edit the facility parameters for a facility.
Depending on the application, you may need to change the LOS threshold
value on the OPTMON facilities and provision the adjacencies.
Prerequisites
To perform this procedure, you must use an account with a level 3 or higher
UPC.
Step Action
Procedure 5-5
Changing the protection parameters for a pair of
facilities
Use this procedure to change the following protection parameters for a pair of
protected OPTMON facilities on the OPS/POPS equipment.
• scheme: 1+1 linear IntraCard (default) or Unprotected
The primary state of the SW2 OPTMON facility in the pair must be
manually put to OOS before you can change the scheme from 1+1 linear
IntraCard to Unprotected.
• switch mode: Unidirectional, read only
• remote standard: OTN G.873.1, read only
• revertive mode: Sets the protection switch to revertive or non-revertive.
For 1+1 OPS, revertive switching is applicable only to switches caused by
signal failure (SF) on SW1. The SF declaration is based on the
provisioned OPTMON Loss of Signal (default -20 dBm), and the SF
clearing has a 3 dB hysteresis. When revertive is enabled, the OPS will
switch from SW2 back to SW1 after the SF fault on SW1 RX clears for the
specified wait to restore time, or if an SF failure occurs on SW2 Rx while
a wait to restore is active. Revertive switching is disabled by default. Upon
release of a user initiated manual or forced switch request against SW1,
the group switches back to the working path if there is not currently a fault
present on the working path.
1+1 revertive mode is supported along with Transceiver Triggered Switch
(TTS) mode for OPS protection schemes. TTS switches do not revert, but
TTS mode does not inhibit the regular behavior of pre-existing revertive
switching. TTS switches enables transceiver triggered switches in addition
to optical total power switches. TTS provides another level of protection,
but does not inhibit existing power level based switching.
• wait to restore time: Sets the time before traffic is switched back to the
working facility after the original fault causing the switch has cleared.
Editable only when the Revertive mode is set to Yes (enabled). The default
wait to restore time is 5 minutes.
• Transceiver Triggered Switch Enabled (applicable to 1+1 OPS only):
Enables OPS switches due to a fault detected on the transceiver circuit
pack instead of the total power. Refer to
“Optical channel path protection: transceiver triggered switch” on page
5-19 and Figure 5-11 on page 5-21 for details and restrictions.
Prerequisites
To perform this procedure, you must use an account with a level 3 or higher
UPC.
Step Action
Procedure 5-6
Changing the primary state of a facility
Use this procedure to change the primary state of an OPTMON facility.
CAUTION
Risk of service interruption
If you place a facility out-of-service, you can cause a
loss of traffic.
The primary state of Adjacency facilities of type ADJ, ADJ-LINE and ADJ-
FIBER is not editable. However, you can change the primary state of non-
derived ADJ-TX or ADJ-RX facilities from initial default IS to OOS-MA by first
editing the Adjacency Type from Unknown to TX for the selected Common In
port, and editing the Adjacency Type from Unknown to RX for the Common
Out port. By default, the transmitter and receiver types for those ADJ-TX and
ADJ-RX are set to Unknown, assuming the far-end address is not yet
provisioned (SPLI can auto-provision the transmitter and receiver types to a
supported type if the far-end addresses are correctly provisioned).
Alternatively, if the transmitter type or receiver type are already set, editing the
transmitter or receiver type to UNKNOWN (optical channel must be
unmanaged from DOC first) or setting the Far End Address to NULL (if Sync
Provisioned is set to True) would set the associated ADJ-TX and ADJ-RX
facility from IS to OOS-MA.
Editing the ADJ Type of the Common ports of the OPS/POPS from TX or RX
to UNKNOWN will return the ADJ-TX and ADJ-RX Primary State to the initial
default IS state.
Prerequisites
To perform this procedure you must:
• use an account with a level 3 or higher UPC
Step Action
Step Action
9 Click OK.
10 If changing the primary state to OOS, click Yes in the warning dialog box.
—end—
Procedure 5-7
Changing the primary state of a circuit pack or
pluggable
Use this procedure to change the primary state of a 4xOPS circuit pack or
OPSM2 pluggable to in-service (IS) or out-of-service (OOS).
You cannot change the primary state of the OPSM2 pluggable to IS if the
associated 4xOPS circuit pack is OOS. Similarly, you cannot change the
primary state of a 4xOPS circuit pack to OOS if the OPSM2 pluggable is still
IS.
You must change the primary state of any related facilities to out-of-service
before changing the primary state of a circuit pack or pluggable to out-of-
service. See Procedure 5-6, “Changing the primary state of a facility” on page
5-34.
You can change the primary state of 4xOPS circuit packs and OPSM2
modules regardless of the primary state of their non-user provisioned
adjacency facilities.
Prerequisites
To perform this procedure, you must use an account with a level 3 or higher
UPC.
Step Action
Step Action
5 Ensure that any related facilities are out-of-service. See Procedure 5-6,
“Changing the primary state of a facility” on page 5-34.
CAUTION
Risk of service interruption
If you place a facility out-of-service, you can cause a
loss of traffic.
Procedure 5-8
Deleting a facility from an equipment
Use this procedure to delete a facility.
CAUTION
Risk of service interruption
If you delete a facility, you will cause a loss of traffic.
Prerequisites
To perform this procedure, you must:
• ensure the end-to-end service to be deleted is not carrying traffic
• ensure the facility to be deleted is out-of-service
• ensure that the protection switching scheme on the facility to be deleted is
provisioned as unprotected. See Procedure 5-5, “Changing the protection
parameters for a pair of facilities” on page 5-32.
• use an account with a level 3 or higher UPC
Step Action
Procedure 5-9
Deleting a circuit pack or pluggable
Use this procedure to delete a circuit pack or pluggable equipment from the
list of provisioned equipment in the Equipment and Facility Provisioning
application. In order to delete the 4xOPS circuit pack, the OPSM2 pluggable
must be deleted first.
Prerequisites
To perform this procedure, you must:
• use an account with a level 3 or higher UPC
• delete all facilities on the circuit pack or pluggable. See Procedure 5-8,
“Deleting a facility from an equipment” on page 5-38. For the 4xOPS and
OPSM2, you can only delete non-adjacency and user-provisioned
adjacency facilities on the circuit pack and pluggable module.
• put the circuit pack or pluggable to be deleted out-of-service. See
Procedure 5-7, “Changing the primary state of a circuit pack or pluggable”
on page 5-36.
• delete the OPSM2 pluggable before you delete the 4xOPS circuit pack
Step Action
Table 5-10
Equipment and facility primary states
IS-ANR In-service - abnormal; failure exists but entity is still capable of performing
some of its provisioned functions (that is partial failure)
Table 5-11
Facility secondary states
FAF Applies to OPTMON facility if there is damage on the particular facility (Facility
failed).
Primary State • IS Sets the primary state of the facility. IS and OOS
• OOS are selectable, sets the primary state of the facility.
See “Equipment and facility primary states” on
page 5-40 for complete list of primary states that
can be displayed.
Secondary See “Facility secondary states” on Displays the facility operational state.
State page 5-40 The Auto in-service state is editable for supported
circuit packs.
LOS Threshold • OPS and POPS: Sets the loss of signal threshold at which automatic
(dBm) -40.00 to 15.00 (default: -20) protection switch and alarm reporting occurs. For
more information, see Part 2 of Fault Management
- Alarm Clearing, 323-1851-543.
Auto In-Service numeric value Displays the time left on the Auto in-service timer.
Time Left
(hh-mm)
ADJ
Unit • ADJ-shelf-slot-port Displays the facility, shelf number, slot number, and port
number for the selected facility.
Primary State • IS (default) Displays the primary state of the facility. Read-only.
• OOS
Actual Far End • string format Displays the actual far end address which is the detected
Address TID, shelf, slot, and port of the far end of the fiber. Read-
only
Actual Far End See Note 2. Displays the option that each field of the far end address
Address Format represents. Read-only
Expected Far End • TID-shelf-slot-port Sets the provisioned far end address of the fiber
Address (Note 1) connection.
Expected Far End See Note 2. Sets the expected far end line receive and client receive
Address Format addresses format reported by the adjacency.
Customer Defined • string format (up to 64 Used to identify a provisioned facility. It is the same as
Facility Identifier characters) the Common Language Facility Identifier (CLFI). The
provisioned value appears in the facility alarm report if
the SP2, SPAP, SPAP-2 w/2xOSC, or the 2-slot
integrated SP is equipped.
Port Label • OPSn SW1 Out Displays the port label. n=1 to 4
• OPSn SW2 Out
• OPSn Common Out
• OPSn Common In
ADJ-LINE
Unit • ADJ-shelf-slot-port Displays the facility, shelf number, slot number, and port
number for the selected facility.
Primary State • IS (default) Displays the primary state of the facility. Read-only.
• OOS
Actual Far End • string format Displays the actual far end address which is the detected
Address TID, shelf, slot, and port of the far end of the fiber. Read-
only
This parameter is only applicable to Line Adjacency
facilities in this release.
Actual Far End See Note 2 Displays the option that each field of the far end address
Address Format represents. Read-only
Note: This parameter is only applicable to Line
Adjacency facilities in this release.
Expected Far End • TID-shelf-slot-port Sets the provisioned far end address of the fiber
Address (Note 1) connection. In Line Adjacency facilities, the Expected
Far End parameter is used to detect mis-fibering events
when compared to the actual far end address.
Expected Far End See Note 2 Sets the expected far end line receive address format
Address Format provisioned against adjacency.
Customer Defined • string format (up to 64 Used to identify a provisioned facility. It is the same as
Facility Identifier characters) the Common Language Facility Identifier (CLFI). The
provisioned value appears in the facility alarm report if
the SP2, SPAP, SPAP-2 w/2xOSC, or the 2-slot
integrated SP is equipped.
Span Loss (dB) • numeric format Displays the calculated OSC span loss. A dash is
displayed when not applicable. Read-only.
Span Loss Margin • 0.00 to 10.00 Sets the margin for span loss. For more information, see
(dB) • 3.00 (default) the description for Target Span Loss and Minimum Span
Loss.
Target Span Loss • 0.00 to 60.00 Sets the maximum acceptable span loss.
(dB) • 0.00 (default) When Span Loss exceeds (Target Span Loss + Span
Loss Margin), the “High Received Span Loss” alarm is
raised.
When Span Loss drops below (Target Span Loss + Span
Loss Margin - 1.0 dB), the “High Received Span Loss”
alarm is cleared.
When Target Span Loss is set to 0.00, the “High
Received Span Loss” alarm is disabled.
Minimum Span • 0.00 to 60.00 Sets the minimum acceptable span loss.
Loss (dB) • 0.00 (default) When Span Loss drops below (Minimum Span Loss -
Span Loss Margin), the “Low Received Span Loss”
alarm is raised.
When Span Loss exceeds (Minimum Span Loss - Span
Loss Margin + 1.0 dB), the “Low Received Span Loss”
alarm is cleared.
When Minimum Span Loss is set to 0.00, the “Low
Received Span Loss” alarm is disabled.
ADJ-TX (Note 1)
Unit • ADJ-shelf-slot-port Displays the facility, shelf number, slot number, and port
number for the selected facility.
Primary State • IS (default) Sets the primary state of the facility. Read-only.
• OOS-MA
Circuit Identifier • Up to 64 characters Sets circuit identifier text. The parameter is also
displayed in the DOC screen, photonic connections
screen, and shelf wavelength topology screen, to help
the user identify the channels.
Wavelength (nm) • numeric format Displays the wavelength of the facility in numeric format.
The number in brackets is the channel ID.
Read-only
Actual Far End • string format Displays the actual far end address which is the detected
Address TID, shelf, slot, and port of the far end of the fiber. Read-
only
Actual Far End See Note 2 Displays the option that each field of the far end address
Address Format represents. Read-only
Expected Far End • TID-shelf-slot-port Sets the far end address of the fiber connection, which is
Address the transmitter port of the terminal equipment that is
connected to the OPS.
Expected Far End See Note 2 Sets the expected transmit address format provisioned
Address Format against adjacency.
Expected Far End string Displays the expected far end product engineering code.
PEC
Discovered Far string Displays the discovered far end product engineering
End PEC code.
Customer Defined • string format (up to 64 Used to identify a provisioned facility. It is the same as
Facility Identifier characters) the Common Language Facility Identifier (CLFI). The
provisioned value appears in the facility alarm report if
the SP2, SPAP, SPAP-2 w/2xOSC, or the 2-slot
integrated SP is equipped.
Transmitter Type • transmitter type Sets the transmitter type of the facility. It identifies the
equipment type that is transmitting the signal.
Note that Transmitter Type can be automatically set by
SPLI.
Discovered Type • same range of values as The transmitter type that is discovered by SPLI.
Transmitter Type
Active • False Sets the Active flag of the ADJ-TX. When set to TRUE,
• True the channel will be automatically added when DOC Auto
add channels parameter is set to Enabled. For a DOC
managed channel, the Active parameter is TRUE. If the
Active parameter is changed to FALSE for a DOC
managed channel and the DOC Auto delete channels
parameter is set to Enabled, then the channel will be
automatically deleted by DOC.
Minimum Launch • numeric format Sets minimum capable power in numeric format in dBm
Power (dBm) unit.
The data is part of the defaulted value entered as part of
the Transmitter Type provisioning. The Minimum Launch
Power parameter is used by the DOC application to add
the channel into the network.
Maximum Launch • numeric format Sets the maximum capable power in numeric format in
Power (dBm) dBm unit.
The data is part of the defaulted value entered as part of
the Transmitter Type provisioning. The Maximum
Launch Power parameter is used by the DOC application
to add the channel into the network.
Actual Tx Power numeric format Sets the current provisioned/measured power in numeric
(dBm) format in dBm unit.
The data is part of the defaulted value entered as part of
the Transmitter Type provisioning. The Maximum/typical
Launch Power parameter is used by the DOC application
to add the channel into the network. This power must be
within 3 dBm of the actual power.
DOC Care • False (default) Displays whether the channel is under DOC control.
• True Any change to the facility provisioning could be traffic
affecting. The transmitter type cannot be changed when
DOC care is set to True.
Modulation Class • 10G Sets the relative bias for the channel. Used to enable
• 10GNGM groups (or classes) of channels to be prioritized to
achieve a different relative OSNR to other channels.
• 2G5
• 40G
• 40GULH
• 100G
• 100GWL3
• 100GWL3BPSK
• CUSTOM1 to
CUSTOM6
• Undefined
• Unknown
Express Delete • False (default) Enables or disables express delete of the channel by
• True DOC. When Express Delete is True and the Active
parameter is changed from True to False, DOC invokes
the Forced delete action. The Express Delete parameter
automatically changes to False when the Active
parameter changes from False to True.
Sync Provisioned • True (default) This parameter, along with the Auto Discovered
• False parameter, controls whether OTMn facility Tx
wavelength and Tx power autoprovisioning occurs.
Discovered SPLI Unknown, True, False Discovered SPLI Management as seen by the
Management transmitter.
Rule • Shortest path (default) Displays the routing rule. Editable through TL1 only.
• Longest path
Mate Info string Displays mate information for CCMD at Regen site.
• Unknown
OCH Line System • COLORED Selects the value of the OCH Line System Type for the
Type • COLORLESS selected facility.
• CONTENTIONLESS
• CSCOLORED
(Coherent Select
Colored)
• CSCOLORLESS
(Coherent Select
Colorless)
Target Input • decimal or NA Displays the desired target transmit power at the CCMD
Power At CMD input add port. Read-only. Applicable for CCMD12
(dBm) (NTK508FA)/CCMD8X16 (NTK508HA).
Tx Minimum • 12.5 to 4800 Displays the Tx Network Media Channel (NMC) Signal
Spectral Width • Default for Foreign Bandwidth in GHz. Used to create default NMCC
(GHz) Coherent is 37.5 bandwidth. Applicable for CCMD12 (NTK508FA)/
CCMD8X16 (NTK508HA).
• Default for Foreign is 42
ADJ-RX
Unit • ADJ-shelf-slot-port Displays the facility, shelf number, slot number, and port
number for the selected facility.
Primary State • IS (default) Displays the primary state of the facility. Read-only.
• OOS-MA
Wavelength (nm) • numeric format Displays the wavelength of the facility in numeric format.
The number in brackets is the channel ID.
Read-only
Actual Far End • string format Displays the actual far end address which is the detected
Address TID, shelf, slot, and port of the far end of the fiber. Read-
only
Actual Far End See Note 2. Displays the option that each field of the far end address
Address Format represents. Read-only
Expected Far End • TID-shelf-slot-port Sets the far end address of the fiber connection, which is
Address (Note 1) the receiver port of the terminal equipment that is
connected to the OPS.
Expected Far End See Note 2. Sets the expected receive address format provisioned
Address Format against adjacency.
Expected Far End string Displays the expected far end product engineering code.
PEC
Discovered Far string Displays the discovered far end product engineering
End PEC code.
Customer Defined • string format (up to 64 Used to identify a provisioned facility. It is the same as
Facility Identifier characters) the Common Language Facility Identifier (CLFI). The
provisioned value appears in the facility alarm report if
the SP2, SPAP, SPAP-2 w/2xOSC, or the 2-slot
integrated SP is equipped.
Receiver Type • receiver type Sets the receiver type of the facility.
Note that Receiver Type can be automatically set by
SPLI.
Max. Positive • numeric format Displays the maximum positive transient for the receiver.
Transient (dB/s) Read-only
Max. Negative • numeric format Displays the maximum negative transient for the
Transient (dB/s) receiver. Read-only
Sensitivity Level • numeric format Sets the sensitivity threshold power in dBm.
(dBm) This parameter is automatically provisioned when
provisioning a selected ADJ-RX type.
Nominal Level • numeric format Sets the nominal receiver power in dBm.
(dBm) This parameter is automatically provisioned when
provisioning a selected ADJ-RX type.
Current Rx Input • numeric format Displays the expected power at the receiver.
Power (dBm) This option is not supported in this release.
DOC Care • False (default) Displays whether the channel is under DOC control.
• True Any change to the facility provisioning could be traffic
affecting. The receiver type cannot be changed when
DOC care is set to True.
Discovered Type • same range of values as The receiver type that is discovered by SPLI.
Receiver Type
Sync Provisioned • True (default) This parameter, along with the Auto Discovered
• False parameter, controls whether OTMn facility Tx
wavelength and Tx power autoprovisioning occurs.
Port Label • OPSn Common Out Displays the port label. n=1 to 4
OCH Line System • COLORED Selects the value of the OCH Line System Type for the
Type • COLORLESS selected facility.
• CONTENTIONLESS
• CSCOLORED
(Coherent Select
Colored)
• CSCOLORLESS
(Coherent Select
Colorless)
ADJ-FIBER
Unit • ADJ-shelf-slot-port Displays the facility, shelf number, slot number, and port
number for the selected facility.
Primary State • IS (default) Displays the primary state of the facility. Read-only.
• OOS-MA
Pad Loss (dB) numeric format Sets the pad loss in dB. Pads are provisioned as Pad
(default: 0.00) Loss for a passive layer network.
For a non-passive network, channel pads that connect to
a CMD Tx and/or Rx must be provisioned as Pad Loss.
Everywhere else in the network, pads are provisioned as
DSCMs.
Drift Threshold • numeric format Displays the threshold of the changes in the span loss
(dB) (default: 6.00) before a fault alarm is raised, in dB. DOC raises an ‘DOC
Action: Fault Detected’ alarm if a span loss changes by
an amount that exceeds the provisioned "drift threshold
input" value for the fiber used by the span. The value has
a supported range of 0.00 to 99.99 dB.
Excess Loss (dB) • numeric format Displays the excess loss input power in dB.
(default: 0.00)
Actual Far End • string format Displays the actual far end address which is the detected
Address TID, shelf, slot, and port of the far end of the fiber. Read-
only
Note: This parameter is not applicable to ADJ-FIBER
facilities in this release.
Actual Far End See Note 2. Displays the option that each field of the far end address
Address Format represents. Read-only
Note: This parameter is not applicable to ADJ-FIBER
facilities in this release.
Expected Far End • TID-shelf-slot-port Sets the provisioned far end address of the fiber
Address (Note 1) connection.
Expected Far End See Note 2. Sets the expected receive address format provisioned
Address Format against adjacency.
Customer Defined • string format (up to 64 Used to identify a provisioned facility. It is the same as
Facility Identifier characters) the Common Language Facility Identifier (CLFI). The
provisioned value appears in the facility alarm report if
the SP2, SPAP, SPAP-2 w/2xOSC, or the 2-slot
integrated SP is equipped.
Fiber Loss Minor numeric format Sets the fiber loss minor threshold in dB. When the fiber
Threshold (dB) (default: 3.00) loss exceeds the provisioned excess loss for that fiber by
more than the provisioned threshold, the “High Fiber
Loss” alarm is raised with minor severity if the High Fiber
Loss Detection Alarm system parameter is enabled,
Fiber Loss Major • numeric format Sets the fiber loss major threshold in dB. When the fiber
Threshold (dB) (default: 10.00) loss exceeds the provisioned excess loss for that fiber by
more than the provisioned threshold, the “High Fiber
Loss” alarm is raised with major severity if the High Fiber
Loss Detection Alarm system parameter is enabled,
Fiber Loss (dB) • numeric format or NA Displays the fiber loss in dB.
Port Label • OPSn SW1 Out Displays the port label. n=1 to 4
• OPSn SW2 Out
• OPSn Common Out
• OPSn Common In
Note 1: The Expected Far End Address is controlled by the Expected Far End Address Format
selection. If the Expected Far End Address Format is set to ‘NULL’, then the Expected Far End
Address is disabled; Otherwise, it is enabled.
Note 2: The Far End Address Format options are:
• NULL
• TID-BAY-SH-SL-PRT
• TID-SH-SL-PRT
• TID-SH-SL-SBSL-PRT
• TID-SH-SL-PRT-SBPRT
Common Equipment
Release 11.2
Publication: 323-1851-102.1
Document status: Standard
Issue 1
Document release date: July 2016
CONTACT CIENA
For additional information, office locations, and phone numbers, please visit the Ciena
web site at www.ciena.com