NOA1302

Ambient Light Sensor with

I2C Interface
Description
The NOA1302 integrates a wide dynamic range ambient light
sensor (ALS) with a 16−bit ADC and a 2−wire I2C digital interface.
The NOA1302 ambient light sensor provides a linear response over http://onsemi.com
the range of close to 0 lux to well over 100,000 lux with programmable
integration times to optimize noise performance. The sensor employs
proprietary CMOS image sensing technology from ON Semiconductor
which provides low noise and high dynamic range output signals and
light response similar to the response of the human eye. CTSSOP−8
The NOA1302 operates as an I2C slave device and supports DC SUFFIX
commands to set options in the device and read out the ambient light CASE 949AA
intensity count.
MARKING DIAGRAM
Features
• Senses Ambient Light and Provides an Output Count Proportional to 8
the Ambient Light Intensity
• Human Eye Type of Spectral Response
• Provides Comfortable Levels of Display Depending on the Viewing
ÉÉ
1302

ÉÉ
AYWG
Environment 1
• Linear Response Over the Full Operating Range 1302= Specific Device Code
• Senses Intensity of Ambient Light from ~0 Lux to over 100,000 Lux A = Assembly Location
Y = Year
• Programmable Integration Times of 400 ms, 200 ms and 100 ms W = Work Week
• No External Components Required G = Pb−Free Package
• Low Power Consumption
• Built−in 16−bit ADC PIN ASSIGNMENT
•

•
I2C Serial Communication Port − Standard Mode – 100 kHz
− Fast Mode – 400 kHz
This Device is Pb−Free, Halogen Free/BFR Free, and RoHS
NC
NC
VSS
1
ÉÉ
ÉÉ
8
NC
NC
VDD
SCL SDA
Compliant
(Top View)
Applications
• Saves Display Power in Applications such as: ORDERING INFORMATION
− Laptops, Notebooks, Digital Signage See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
− LCD TVs and Monitors, Digital Picture Frames
− LED Indoor/Outdoor Residential and Street Lights

Vin = 3.3 V
hv
R1 R2
1k 1k
6 VDD SDA 5 SDA
C1 C2 MCU
3 VSS SCL 4 SCL
10m 0.1m
CL not to exceed 250 pF
IC1 including all parasitic
NOA1302 capacitances

Figure 1. Typical Application Circuit

© Semiconductor Components Industries, LLC, 2009 1 Publication Order Number:

August, 2009 − Rev. 1 NOA1302/D
 NOA1302

Table 1. ORDERING INFORMATION

Part Number Package Shipping Configuration† Temperature Range

NOA1302DCRG CTSSOP−8 2500 / Tape & Reel 0°C to 70°C

(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.

ADC
hn 16−bits

Control

SCL
I2C Serial
Interface SDA

Figure 2. Simplified Block Diagram

Table 2. PIN FUNCTION DESCRIPTION

Pin Pin Name Description
1, 2, 7, 8 N/C Not connected, leave this pin unconnected.
3 VSS Ground pin.
4 SCL External I2C clock supplied by the I2C master.
5 SDA Bi−directional data signal for communications between this device and the I2C master.
6 VDD Power pin.

Table 3. ABSOLUTE MAXIMUM RATINGS

Rating Symbol Value Unit
Input power supply VDD 5.5 V
Input voltage range Vin −0.3 to VDD + 0.2 V
Output voltage range Vout −0.3 to VDD + 0.2 V
Maximum Junction Temperature TJ(max) 85 °C
Storage Temperature TSTG −40 to 85 °C
ESD Capability, Human Body Model (Note 1) ESDHBM 2.5 kV
ESD Capability, Charged Device Model (Note 1) ESDCDM 750 V
ESD Capability, Machine Model (Note 1) ESDMM 250 V
Moisture Sensitivity Level MSL 3 −
Lead Temperature Soldering (Note 2) TSLD 260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Charged Device Model tested per ESD−STM5.3.1−1999
ESD Machine Model tested per EIA/JESD22−A115
Latchup Current Maximum Rating: ≤ 100 mA per JEDEC standard: JESD78
2. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D

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Table 4. OPERATING RANGES

Standard Mode Fast Mode

Rating Symbol Min Max Min Max Unit

Power supply voltage VDD 3.0 3.6 3.0 3.6 V
Power supply current (VDD = 3.3 V) IDD 325 950 325 950 mA
Low level input voltage (VDD related input levels) VIL −0.3 0.3 VDD −0.3 0.3 VDD V
High level input voltage (VDD related input levels) VIH 0.7 VDD VDD + 0.2 0.7 VDD VDD + 0.2 V
Hysteresis of Schmitt trigger inputs (VDD > 2 V) Vhys N/A N/A 0.05 VDD − V
Low level output voltage (open drain) at 3 mA sink VOL 0 0.4 0 0.4 V
current (VDD > 2 V)

High level output voltage (with 1 kW pullup resist- VOH VDD − 0.1 N/A VDD − 0.1 N/A V
ance) at and output current of −20 mA (VDD > 2 V)
Input current of IO pin with an input voltage II −10 10 −10 10 mA
between 0.1 VDD and 0.9 VDD

Output low current IOL − 45 − 45 mA

Capacitance on IO pin CI − 10 − 10 pF
Operating free−air temperature range TA 0 70 0 70 °C

Table 5. ELECTRICAL CHARACTERISTICS

(Unless otherwise specified, these specifications apply over VDD = 3.3 V, 0°C < TA < 70°C) (Note 3)
Standard Mode Fast Mode

Parameter Symbol Min Max Min Max Unit

SCL clock frequency fSCL 10 100 100 400 kHz
Hold time for START condition. After this period, the first clock tHD;STA 4.0 − 0.6 − mS
pulse is generated.

Low period of SCL clock tLOW 4.7 1.3 mS

High period of SCL clock tHIGH 4.0 0.6 mS
Data hold time for I2C−bus devices tHD;DAT_d 0 3.45 0 0.9 mS
Data set−up time tSU;DAT 250 − 100 − nS
Rise time of both SDA and SCL (input signals) (Note 4) tr_INPUT 5 300 5 300 nS
Fall time of both SDA and SCL (input signals) (Note 4) tf_INPUT 5 300 5 300 nS
Rise time of SDA output signal (Note 4) tr_OUT − 1000 − 1000 nS
Fall time of SDA output signal (Note 4) tf_OUT − 1000 − 1000 nS
Output fall time from VIHmin to VILmax with a bus capacitance tof 2 250 2 250 nS
from 10 pF to 250 pF. (Note 5)

Set−up time for STOP condition tSU;STO 4.0 − 0.6 − mS

Bus free time between STOP and START condition tBUF 4.7 − 1.3 − mS
Capacitive load for each bus line CL − 250 − 250 pF
(including all parasitic capacitance)

Noise margin at the low level for each connected device VnL 0.1 VDD − 0.1 VDD − V
(including hysteresis)

Noise margin at the high level for each connected device VnH 0.2 VDD − 0.2 VDD − V
(including hysteresis)
3. Refer to Figure 3 for more information on AC characteristics
4. The rise time and fall time are measured with a pull−up resistor Rp = 1 kW and Cb of 250 pF (including all parasitic capacitances).
5. Cb = capacitance of one bus line, maximum value of which including all parasitic capacitances should be less than 250 pF.

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 NOA1302

Table 6. OPTICAL CHARACTERISTICS (Unless otherwise specified, these specifications are for VDD = 3.3 V, TA = 25°C)
Parameter Test Conditions Symbol Min Typ Max Unit
Irradiance responsivity lp (see Figure 5) Re 545 nM
Illuminance responsivity Incandescent light source: Rv 150 Counts
Ev = 100 lux (see Figure 6)

Incandescent light source: 1480

Ev = 1000 lux (see Figure 6)

Illuminance responsivity Fluorescent light source: Rv 130 Counts

Ev = 100 lux (see Figure 7)

Fluorescent light source: 1290

Ev = 1000 lux (see Figure 7)

Dark current Ev = 0 lux (see Figure 9) 2 Counts

SDA
tLOW tf
tf tr tSU;DAT tSP tr tBUF

SCL
tHD;STA tSU;STO
S tHD;DAT tHIGH P S

Figure 3. AC Characteristics

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 NOA1302

TYPICAL CHARACTERISTICS

Figure 4. Photo Diode Spectral Response (Without Filter) Figure 5. Human Eye vs. NOA1302 Spectral
Response

Figure 6. Incandescent Light Response Figure 7. Fluorescent Light Response

(200 ms Integration) (200 ms Integration)

Figure 8. Light Response vs. VDD Figure 9. Dark Counts vs. Temperature
(200 ms Integration)

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 NOA1302

TYPICAL CHARACTERISTICS

Figure 10. Dark Counts vs. Vdd Figure 11. Idd vs. Temperature

Figure 12. Idd vs.Vdd Figure 13. Idd vs Ev

Figure 14. Maximum Value of RP (in kW)

as a function of Bus Capacitance (in pF)

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 NOA1302

DESCRIPTION OF OPERATION

Ambient Light Sensor Architecture sent MSB first. RD/WR_ command bit follows the address
The NOA1302 employs a sensitive photo diode fabricated bits. Upon receiving a valid address the device responds by
in ON Semiconductor’s standard CMOS process driving SDA low for an ACK. After receiving an ACK, the
technology. The major components of this sensor are as I2C master sends eight bits of data with MSB first. Upon
shown in Figure 2. The photons which are to be detected pass receiving eight bits of data the NOA1302 generates an ACK.
through an ON Semiconductor proprietary color filter The I2C master terminates this write command with a stop
limiting extraneous photons and thus performing as a band condition.
pass filter on the incident wave front. The filter only
transmits photons in the visible spectrum which are
primarily detected by the human eye. The photo response of SDA A[6:0] WR ACK D[7:0] ACK
this sensor is as shown in Figure 5.
The ambient light signal detected by the photo diode is
converted to digital signal using a variable slope integrating SCL
ADC with a resolution of 16−bits, unsigned. The ADC value
Start Stop
is provided to the control block connected to the I2C Condition Condition
interface block.
Figure 15. I2C Write Command
Equation 1 shows the relationship of output counts Cnt as
a function of integration constant Ik, integration time Tint (in Figure 16 shows an I2C read command sent by the master
seconds) and the intensity of the ambient light, IL(in lux), at to the slave device. The I2C read command begins with a
room temperature (25°C). start condition. After the start condition, seven bits of
C nt address are sent by the master MSB first, followed by the
IL + (eq. 1) RD/WR_ command bit. For a read command the RD/WR_
(I k @ T int)
bit is high. Upon receiving the address bits and RD/WR_
Where: command bits the device responds with an ACK. After
Ik = 6.67 (for fluorescent light) sending an ACK, the device sends eight bits of data MSB
Ik = 7.5 (for incandescent light) first. After receiving the data, the master terminates this
Hence the intensity of the ambient fluorescent light (in lux): transaction by issuing a NACK command to indicate that the
C nt master only wanted to read one byte from the device. The
IL + (eq. 2) master generates a stop condition to end this transaction.
(6.67 @ T int)
Repeated START condition is not supported. Each I2C
and the intensity of the ambient incandescent light (in lux): transaction must be terminated with a STOP condition after
C nt all required bits have been transmitted and received.
IL + (eq. 3)
(7.5 @ T int)

For example let: ACK

SDA A[6:0] RD D[7:0] NACK
Cnt = 1200
Tint = 200 mS
Intensity of ambient incandescent light, IL(in lux): SCL

IL + 1200 (eq. 4)
(7.5 @ 200 mS) Start Stop
Condition Condition
IL = 800 lux Figure 16. I2C Read Command
I2C Interface
Programmer’s Model
The NOA1302 operates on the I2C bus as a slave device. Ambient light intensity count is obtained from the the
The I2C address is fixed at 0x39 (hexadecimal 39). Registers NOA1302 by issuing a fixed sequence of I2C commands.
can be programmed by sending commands over an I2C bus. Integration time is programmable by writing different
Ambient light intensity count value can be obtained by values to the integration time register. The following
reading registers. The ambient light intensity count is 16 sections describe what a programmer needs to know about
bits, hence two I2C read operations are needed. This device issuing commands to the chip and register access.
supports both standard (100 Kbit/s) and fast mode
(400 Kbit/s) of operation on the I2C bus. Integration Time Register
Figure 15 shows an I2C write operation. To write to an Table 7 describes integration time register which controls
internal register of the NOA1302 a write command must be the exposure time. This register has three bits, EC[2:0]
sent by an I2C master. The write command begins with a start which control the duration of the integration time.
condition. After the start condition, seven bits of address are

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 NOA1302

Table 7. INTEGRATION TIME REGISTER 1. Send write command 0x1Dh to set EC[0] = 0.
2. Send write command 0x88h to set EC[1] = 1, now
EC[2,1,0] Operation Integration Time
EC[2:0] = 010.
000 Normal mode of operation 400 ms
001 Normal mode of operation 200 ms (Default)
Rise and Fall Time of SDA (Output)
Proper operation of the I2C bus depends on keeping the
010 Normal mode of operation 100 ms
bus capacitance low and selecting suitable pull−up resistor
011 Test mode 16.7 ms values. Figure 17 and Figure 18 show the rise and fall time
100 Simulation test mode use 1.0 ms on SDA in output mode under maximum load conditions.
only The measurement set−up is shown in Figure 19. Figure 14
101 Reserved for future use shows the maximum value of the pull−up resistor (RP) as a
function of the I2C data bus capacitance.
110 Reserved for future use
111 Reserved for future use

Programming Sequence and Command Summary

This section describes supported commands and
programming sequence. The NOA1302 only supports single
byte write and a single byte read I2C commands. Ambient
light intensity count is 16 bits wide, thus two I2C read
commands are needed.
Table 8 describes supported commands. All of these
commands have to be sent to the fixed address (0x39).
Table 8. DEVICE COMMANDS RP = 1 kW
Command Function CL = 250 pF (including all parasitic caps)
tr = 530 ns
0x00h Start reading ADC data
Figure 17. SDA Rise Time (tr)
0x03h Complete reading ADC data
0x1Dh Change EC[0] to 0
0x18h Reset EC[2:0] to default value (001)
0x43h Prepare ADC LS byte for reading
0x83h Prepare ADC MS byte for reading
0x88h Change EC[1] to 1
0x90h Change EC[2] to 1

Programming Sequence
To read 16 bits wide ambient light intensity count, the
following commands must be issued in sequence:
1. Send write command 0x00h to start the ADC
RP = 1 kW
conversion cycle. CL = 250 pF (including all parasitic caps)
2. Send write command 0x03h to complete the ADC tf = 21 ns
cycle.
Figure 18. SDA Fall Time (tf)
3. Send write command 0x43h to prepare the LS byte
for reading.
4. Send read byte command, returns LS byte of 16−bits
LED hn ADC
count.
Pulse
5. Send write command 0x83h to prepare the MS Generator Control
byte for reading. SCL
6. Send read byte command, returns MS byte of I2C Serial SDA
count. NOA1302 Interface
To change the integration time, for example to 100 ms, the Figure 19. Measurement Set−up
following commands must be used in sequence:

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 NOA1302

PACKAGE DIMENSIONS

CTSSOP8 3x3
CASE 949AA−01
4X ISSUE O
0.20 C NOTES:
D 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
8X b 2. CONTROLLING DIMENSION: MILLIMETER.
D 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION AND IS
A NOTE 5
D2 0.15 M C A-B D DETERMINED BETWEEN 0.08 AND 0.15 MM FROM THE LEAD TIP.
8 5 NOTE 3 4. DIMENSIONS D AND E1 DOES NOT INCLUDE MOLD
PROTRUSIONS, TIE BAR BURRS, GATE BURRS OR FLASH. END
E2 FLASH SHALL NOT EXCEED 0.25 PER SIDE. DIMENSIONS D AND
E1 DO INCLUDE ANY MOLD CAVITY MISMATCH AND ARE
E1 E DETERMINED AT THE GAUGE PLANE.
5. DATUMS A AND B TO BE DETERMINED AT THE GAUGE PLANE.
6. DETAILS OF THE PIN 1 IDENTIFIER ARE OPTIONAL, BUT MUST BE
0.25 LOCATED WITHIN THIS ZONE.
PIN 1
INDICATOR 1 4 MILLIMETERS
NOTE 6
B NOTE 5 e GAUGE DIM MIN MAX
e/2 PLANE A −−− 1.10
TOP VIEW C M L A1 0.00 0.14
AUXILIARY A2 0.73 0.93
TOP VIEW DETAIL A b 0.24 0.39
c 0.13 0.24
DETAIL A D 3.00 BSC
A D2 0.66 1.37
8X E 4.90 BSC
A1 c E1 3.00 BSC
0.15 C E2 0.41 1.37
e 0.65 BSC
A2 SEATING L 0.39 0.67
C PLANE M 0° 8°
SIDE VIEW END VIEW

SOLDERING FOOTPRINT*
8X
0.48 8X
0.72

1.05

0.65
PITCH
DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

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