Design Logic Programable
Design Logic Programable
R
R
Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development
of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
Documentation in any form or by any means including, but not limited to, electronic, mechanical, photocopying, recording, or otherwise,
without the prior written consent of Xilinx. Xilinx expressly disclaims any liability arising out of your use of the Documentation. Xilinx reserves
the right, at its sole discretion, to change the Documentation without notice at any time. Xilinx assumes no obligation to correct any errors
contained in the Documentation, or to advise you of any corrections or updates. Xilinx expressly disclaims any liability in connection with
technical support or assistance that may be provided to you in connection with the Information.
THE DOCUMENTATION IS DISCLOSED TO YOU “AS-IS” WITH NO WARRANTY OF ANY KIND. XILINX MAKES NO OTHER
WARRANTIES, WHETHER EXPRESS, IMPLIED, OR STATUTORY, REGARDING THE DOCUMENTATION, INCLUDING ANY
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NONINFRINGEMENT OF THIRD-PARTY
RIGHTS. IN NO EVENT WILL XILINX BE LIABLE FOR ANY CONSEQUENTIAL, INDIRECT, EXEMPLARY, SPECIAL, OR INCIDENTAL
DAMAGES, INCLUDING ANY LOSS OF DATA OR LOST PROFITS, ARISING FROM YOUR USE OF THE DOCUMENTATION.
© 2008 Xilinx, Inc. All rights reserved.
XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. All other trademarks
are the property of their respective owners.
Preface
CHAPTER 1: INTRODUCTION
Chapter 1 is an overview of how and where PLDs are used and gives a brief history of
programmable logic devices.
Conventions
Convention Meaning or Use Example
Messages, prompts, and
Courier font program files that the system speed grade: - 100
displays
Literal commands that you enter
Courier bold ngdbuild design_name
in a syntactical statement
Commands that you select from
File → Open
Helvetica bold a menu
Keyboard shortcuts Ctrl+C
Variables in a syntax statement
for which you must supply ngdbuild design_name
values
See the Development System
Italic font References to other manuals Reference Guide for more
information.
If a wire is drawn so that it
Emphasis in text overlaps the pin of a symbol, the
two nets are not connected.
An optional entry or parameter.
However, in bus specifications, ngdbuild [option_name]
Square brackets [ ]
such as bus[7:0], they are design_name
required.
A list of items from which you
Braces { } lowpwr ={on|off}
must choose one or more
Chapter 1
Introduction
The History of Programmable Logic
By the late 1970s, standard logic devices were all the rage, and printed circuit boards were
loaded with them. Then someone asked, “What if we gave designers the ability to
implement different interconnections in a bigger device?” This would allow designers to
integrate many standard logic devices into one part.
To offer the ultimate in design flexibility, Ron Cline from Signetics (which was later
purchased by Philips and then eventually Xilinx) came up with the idea of two
programmable planes. These two planes provided any combination of “AND” and “OR”
gates, as well as sharing of AND terms across multiple ORs.
This architecture was very flexible, but at the time wafer geometries of 10 µm made the
input-to-output delay (or propagation delay) high, which made the devices relatively slow.
The features of the PLA were:
• Two programmable ground planes
• Any combination of ANDs/ORs
• Sharing of AND terms across multiple ORs
• Highest logic density available to user
• High fuse count; slower than PALs
• Programmable logic array
Inputs
A B C
X=A&B#C
Y = A & B # !C
Chapter 1:
MMI (later purchased by AMD) was enlisted as a second source for the PLA array. After
fabrication issues, it was modified to become the programmable array logic (PAL)
architecture by fixing one of the programmable planes.
This new architecture differed from that of the PLA in that one of the programmable planes
was fixed – the OR array. PAL architecture also had the added benefit of faster tPD and less
complex software, but without the flexibility of the PLA structure.
Other architectures followed, such as the PLD. This category of devices is often called
Simple PLD.
• One programmable plane: AND/Fixed OR
• Finite combination of ANDs/ORs
• Medium logic density available to user
• Lower fuse count; faster than PLAs (at the time, fabricated on a 10 μm process)
• Programmable array logic
Inputs
A B C
Outputs have dedicated product terms
X=A&B#C
Y = A & B # !C
Requires 4 pt’s
The architecture had a mesh of horizontal and vertical interconnect tracks. At each junction
was a fuse. With the aid of software tools, designers could select which junctions would
not be connected by “blowing” all unwanted fuses. (This was done by a device
programmer, but more commonly these days is achieved with ISP).
Input pins were connected to the vertical interconnect. The horizontal tracks were
connected to AND-OR gates, also called “product terms”. These in turn connected to
dedicated flip-flops, whose outputs were connected to output pins.
PLDs provided as much as 50 times more gates in a single package than discrete logic
devices! This was a huge improvement, not to mention fewer devices needed in inventory
and a higher reliability over standard logic.
PLD technology has moved on from the early days with companies such as Xilinx
producing ultra-low-power CMOS devices based on flash memory technology. Flash PLDs
provide the ability to program the devices time and time again, electrically programming
and erasing the device. Gone are the days of erasing for more than 20 minutes under an UV
eraser.
CPLD
MC0 MC0
CPLDs are great at handling wide and complex gating at blistering speeds – 5
nanoseconds, for example, which is equivalent to 200 MHz. The timing model for CPLDs
is easy to calculate so before starting your design you can calculate your input-to-output
speeds.
Chapter 1:
design changes into the CPLD development tool, and re-implement and test the
design immediately.
• Lower Development Costs: CPLDs offer very low development costs. Because
CPLDs are re-programmable, you can easily and very inexpensively change
your designs. This allows you to optimize your designs and continue to add new
features to enhance your products. CPLD development tools are relatively
inexpensive (or in the case of Xilinx, free). Traditionally, designers have had to face
large cost penalties such as re-work, scrap, and development time. With CPLDs, you
have flexible solutions, thus avoiding many traditional design pitfalls.
• More Product Revenue: CPLDs offer very short development cycles, which means
your products get to market quicker and begin generating revenue sooner. Because
CPLDs are re-programmable, products can be easily modified using ISP over the
Internet. This in turn allows you to easily introduce additional features and quickly
generate new revenue. (This also results in an expanded time for revenue). Thousands
of designers are already using CPLDs to get to market quicker and stay in the market
longer by continuing to enhance their products even after they have been introduced
into the field. CPLDs decrease TTM and extend TIM.
• Reduced Board Area: CPLDs offer a high level of integration (that is, a large number
of system gates per area) and are available in very small form factor packages. This
provides the perfect solution for designers whose products which must fit into
small enclosures or who have a limited amount of circuit board space to implement
the logic design. Xilinx CoolRunner® CPLDs are available in the latest chip scale
packages. For example, the CP56 CPLD has a pin pitch of 0.5 mm and is a mere 6 x 6
mm in size, making it ideal for small, low-power end products. The CoolRunner-II
CPLDs are also available in the QF (quad flat no-lead) packages, giving them the
smallest form factor available in the industry. The QF32 is just 5 x 5 mm in size.
if your design changes, you simply reprogram. By utilizing one device instead of
many, your board reliability will increase by only picking and placing one device
instead of many.
• Reliability: Reliability can also be increased by using ultra-low-power CoolRunner
CPLDs. Their lower heat dissipation and lower power operation leads to
decreased FIT.
12
Logic Logic Logic Logic Logic Logic
Cell Cell Cell Cell Cell Cell Data Out
Data In
1
10 11
With the introduction of the Spartan® series of FPGAs, Xilinx can now compete with gate
arrays on all aspects – price, gate, and I/O count, as well as performance and cost.
There are two basic types of FPGAs: SRAM-based reprogrammable and OTP (One Time
Programmable). These two types of FPGAs differ in the implementation of the logic cell
and the mechanism used to make connections in the device.
Chapter 1:
The dominant type of FPGA is SRAM-based and can be reprogrammed as often as you
choose. In fact, an SRAM FPGA is reprogrammed every time it’s powered up, because the
FPGA is really a fancy memory chip. That’s why you need a serial PROM or system
memory with every SRAM FPGA.
In the SRAM logic cell, instead of conventional gates, an LUT determines the output based
on the values of the inputs. (In the “SRAM logic cell” diagram above, six different
combinations of the four inputs determine the values of the output.) SRAM bits are also
used to make connections.
OTP FPGAs use anti-fuses (contrary to fuses, connections are made, not “blown,”
during programming) to make permanent connections in the chip. Thus, OTP FPGAs do
not require SPROM or other means to download the program to the FPGA. However,
every time you make a design change, you must throw away the chip! The OTP logic cell
is very similar to PLDs, with dedicated gates and flip-flops.
Logic Consolidation
Logic Consolidation
The consolidation of 74 series standard logic into a low-cost CPLD is a very attractive
proposition. Not only do you save PCB area and board layers – thus reducing your total
system cost – but you only have to purchase and stock one generic part instead of 20 or
more pre-defined logic devices. In production, the pick and place machine only has to
place one part, therefore speeding up production. Less parts means higher quality and
better FIT factor.
By using Xilinx CoolRunner devices, you can benefit from low power consumption and
reduced thermal emissions. This in turn leads to the reduction of the use of heat sinks
(another cost savings) and a higher reliability end product.
Chapter 1:
Chapter 2
Xilinx Devices
The Ultimate System Integration Platform
Virtex-5, 1.0V, 30K to 330K logic cells
Xilinx CPLDs
Currently, Xilinx offers CPLD products in two categories: XC9500 and CoolRunner
devices. This guide will focus on the two most popular families, the XC9500XL and the
CoolRunner-II. To choose a CPLD that's right for you, review the product features below to
identify the product family that fits your application. You should also review the selection
considerations to choose the device that best meets your design criteria.
Product Features
XC9500XL Device – The XC9500XL ISP CPLD family takes complex programmable logic
devices to new heights of performance, features, and flexibility. This family delivers
industry-leading speeds while providing the flexibility of enhanced customer-proven pin-
locking architecture, along with extensive IEEE Std.1149.1 JTAG Boundary Scan support.
This CPLD family is ideal for high-speed, low-cost designs.
CoolRunner-II Device – The CoolRunnerII CPLD family offers extremely low power,
making them the leaders in an all-new market segment: portable electronics. With standby
current in the low micro amps and minimal operational power consumption, these parts
are ideal for any application is that is especially power sensitive, such as battery-powered
or portable applications. The CoolRunner-II CPLD extends usage as it offers system-level
features such as LVTTL and SSTL, clocking modes, and input hysteresis.
Selection Considerations
To decide which device best meets your design criteria, take a minute to jot down your
design specs (using the list below as a criteria reference). Next, go to a specific product
family page to get more detailed information about the device you need.
Density – Each part gives an equivalent “gate count,” or estimate of the logic density of the
part.
Number of Registers – Count up the number of registers you need for your counters, state
machines, registers, and latches. The number of macrocells in the device must be at least
this large.
Number of I/O Pins – How many inputs and outputs does your design need?
Speed Requirements – What is the fastest combinatorial path in your design? This will
determine the Tpd (in nanoseconds) of the device. What is the fastest sequential circuit in
your design? This will tell you what fMax you need.
Package – What electromechanical constraints are you under? Do you need the smallest
ball grid array package possible, or can you use a more ordinary QFP? Or are you
prototyping and need to use a socketed device, such as a PLCC package?
Low Power – Is your end product battery- or solar-powered? Does your design require the
lowest power devices possible? Do you have heat dissipation concerns?
System-Level Functions – Does your board have multi-voltage devices? Do you need to
level shift between these devices? Do you need to square up clock edges? Do you need to
interface to memories and microprocessors?
The CoolRunner-II family of CPLDs is targeted for low-power applications that include
portable, handheld, and power-sensitive applications. Each member of the family includes
RealDigital design technology that combines low power and high speed. With this design
technique, the family offers true pin-to-pin speeds of 5.0 ns, while simultaneously
delivering power that is less than 16 µA (standby) without the need for special "power
down bits" that can negatively affect device performance. By replacing conventional
amplifier methods for implementing product terms (a technique that has been used in
PLDs since the bipolar era) with a cascaded chain of pure CMOS gates, the dynamic power
is also substantially lower than any competing CPLD. CoolRunner-II devices are the only
total CMOS PLDs
TM
CoolRunner -II
High Volume Applications
High Performance, Low Power with
No Cost Penalty
Performance & Density
• Consumer
• Cell Phones
XC9500XL • Cameras
• Set-Top Boxes
Specialty Functions • DVD Players
• Portable GPS
XC9500 • High Speed Clocking
• Delay Lock Loops
• MP3 & Portable Radios
LSI • Digital Delay Lines
• PDAs
• Communication
• Memory Controllers • Servers & PCs
• Bus Interfaces • Graphics Cards
SSI / MSI • UAR/Ts
• Printers
• Counters • Line Cards
• State Machines • Cable Modems
Glue Logic • Industrial
• 7400 Series Replacement • Motor Controllers
Xilinx CoolRunner-II CPLDs deliver the high speed and ease of use associated with the
XC9500/XL/XV CPLD family and the extremely low power versatility of the XPLA3. This
means that the exact same parts can be used for high-speed data communications,
computing systems, and leading-edge portable products, with the added benefit of ISP.
Low power consumption and high-speed operation are combined into a single family that
is easy to use and cost effective. Xilinx-patented Fast Zero Power architecture inherently
delivers extremely low power performance without the need for special design measures.
Clocking techniques and other power-saving features extend your power budget. These
design features are supported from Xilinx ISE 4.1i software onwards. Figure 2-4 shows
some of the advanced CoolRunner-II CPLD package offering with dimensions. All
packages are surface mount, with more than half of them ball-grid technologies. The ultra-
tiny packages permit maximum functional capacity in the smallest possible area.
PC44 306.25m2
16mm
VQ44 144m2
The CMOS technology used in CoolRunner-II CPLDs generates minimal heat, allowing the
use of tiny packages during high-speed operation. At least two densities are present in
each package, with three in the VQ100 (100-pin, 1.0 mm QFP) and TQ144 (144-pin, 1.4 mm
QFP), and in the FT256 (256- ball, 1.0 mm-spacing FLBGA). The FT256 is particularly
suited for slim-dimensioned portable products with mid to high-density logic
requirements.
Table 2-1 also details the distribution of advanced features across the CoolRunner-II CPLD
family. The family has uniform basic features, with advanced features included in densities
where they are most useful. For example, it is unlikely that you would need four I/O banks
on 32- and 64-macrocell parts, but very likely for 384- and 512-macrocell parts.
The I/O banks are groupings of I/O pins using any one of a subset of compatible voltage
standards that share the same V CCIO level. The clock division capability is less efficient
on small parts, but more useful and likely to be used on larger ones. DataGATE™
technology, an ability to block and latch inputs to save power, is valuable in larger parts,
but brings marginal benefit to small parts.
Table 2-1: CoolRunner-II Family Overview
Features XC2C32A XC2C64A XC2C128 XC2C256 XC2C384 XC2C512
FSYSTEM (MHz) 323 263 244 256 217 179
Max User I/O 33 64 100 184 240 270
I/O Banks 2 2 2 2 4 4
LVCMOS, LVTTL (1.5,1.8,2.5,3.3) Yes Yes Yes Yes Yes Yes
HSTL, SSTL - - Yes Yes Yes Yes
DualEDGE Yes Yes Yes Yes Yes Yes
DataGATE, CoolCLOCK - - Yes Yes Yes Yes
Standby Power (μW) 28.8 30.6 34.2 37.8 41.4 45.0
Advanced Security Yes Yes Yes Yes Yes Yes
Packages (size) Maxium User I/O
QFG32 (5x5 mm) 21
VQ44 (12x12 mm) 33 33
PC44 (17.5x17.5 mm) 33 33
QF48 (7x7 mm) 37
CP56 (6x6 mm) 33 45
VQ100 (16x16 mm) 64 80 80
CP132 (8x8 mm) 100 106
TQ144 (22x22 mm) 100 118 118
PQ208 (30.6x30.6 mm) 173 173 173
FT256 (17x17 mm) 184 212 212
FG324 (23x23 mm) 240 270
Function Function
Block 1 Block n
I/O Pin MC1 MC1 I/O Pin
I/O Pin MC2 MC2 I/O Pin
16 FB 16 FB
I/O Blocks
I/O Blocks
16 PLA PLA 16
40
AIM 40
DS090_01_121201
The PLA is different – and better. First, any p-term can be attached to any OR gate inside
the function block macrocell(s). Second, any logic function can have as many p-terms as
needed attached to it within the function block, to an upper limit of 56. Third, you can
reuse product terms at multiple macrocell OR functions so that within a function block,
you need only create a particular logical product once, but you can reuse it as many as 16
times within the function block. Naturally, this works well with the fitting software, which
identifies product terms that can be shared.
The software places as many functions as it can into function blocks. There is no need to
force macrocell functions to be adjacent or have any other restriction except for residing in
the same function block, which is handled by the software. Functions need not share a
common clock, common set/reset, or common output enable to take full advantage of the
PLA. In addition, every p-term arrives with the same time delay incurred. There are no
cascade time adders for putting more product terms in the function block. When the
function block p-term budget is reached, a small interconnect timing penalty routes signals
to another function block to continue creating logic. Xilinx design software handles all this
automatically.
CoolRunner-II Macrocell
The CoolRunner-II CPLD macrocell is extremely efficient and streamlined for logic
creation. You can develop SOP logic expressions comprising as many as 40 inputs and span
56 product terms within a single function block. The macrocell can further combine the
SOP expression into an XOR gate with another single p-term expression. The resulting
logic expression’s polarity is also selectable. The logic function can be pure combinatorial
or registered, with the storage element operating selectively as a D or T flip-flop, or
transparent latch. Available at each macrocell are independent selections of global,
function- block level, or local p-term-derived clocks, sets, resets, and output enables. Each
macrocell flip-flop is configurable for either single edge or DualEDGE clocking, providing
either double data rate capability or the ability to distribute a slower clock (thereby saving
power). For single-edge clocking or latching, either clock polarity may be selected per
macrocell.
CoolRunner-II macrocell details are shown in Figure 2-7. Standard logic symbols are used
in the in figure, except the trapezoidal multiplexers have input selection from statically
programmed configuration select lines (not shown). Xilinx application note XAPP376
gives a detailed explanation of how logic is created in the CoolRunner-II CPLD family.
FB Inputs
from AIM
40
PLA Array
49
P terms Macrocell
4
Control from I/O Block
Terms (Fast Input) Feedback to AIM
PTA
PTA
PTB CTS
VCC GSR
GND
PTC GND
to I/O
S
D/T Q
FIF
Latch
DualEDGE
GCK0 PTC CE
GCK1 CK R
CTC GCK2
PTC PTA
CTR
GSR
GND
When configured as a D-type flip-flop, each macrocell has an optional clock enable signal
permitting state hold while a clock runs freely. Note that control terms are available to be
shared for key functions within the function block, and are generally used whenever the
exact same logic function would be repeatedly created at multiple macrocells. The control
term product terms are available for function block clocking (CTC), function block
asynchronous set (CTS), function block asynchronous reset (CTR), and function block
output enable (CTE).
You can configure any macrocell flip-flop as an input register or latch, which takes in the
signal from the macrocell’s I/O pin and directly drives the AIM. The macrocell
combinatorial functionality is retained for use as a buried logic node if needed.
I/O Blocks
I/O blocks are primarily transceivers. However, each I/O is either automatically
compliant with standard voltage ranges or can be programmed to become compliant. In
addition to voltage levels, each input can selectively arrive through Schmitt-trigger inputs.
This adds a small time delay, but substantially reduces noise on that input pin. Hysteresis
also allows easy generation of external clock circuits. The Schmitt-trigger path is best
illustrated in Figure 2-8. Outputs can be directly driven, tri-stated, or open-drain
configured. A choice of slow or fast slew rate output signal is also available.
VREF for Local Bank
HSTL & SSTL
VCCIO
VREF
to AIM I/O Pin
128 macrocell
Input Hysteresis
to Macrocell and larger devices
(Fast Input)
Enabled
Control Term
PTB
4
GTS[0:3] /
CGND
Open Drain
Disabled
I/O Banking
CPLDs are widely used as voltage interface translators; thus, the I/O pins are grouped in
large banks. The four smaller parts have two output banks. With two banks available, the
outputs will switch to one of two selected output voltage levels, unless both banks are set
to the same voltage. The larger parts (384 and 512 macrocell) support four output banks,
split evenly. They can support groupings of one, two, three, or four separate output voltage
levels. This kind of flexibility permits easy interfacing to 3.3V, 2.5V, 1.8V, and 1.5V in a
single part.
DataGATE
Low power is the hallmark of CMOS technology. Other CPLD families use a sense
amplifier approach to create p-terms, which always has a residual current component. This
residual current can be several hundred milliamps, making these CPLDs unusable in
portable systems. CoolRunner-II CPLDs use standard CMOS methods to create the CPLD
architecture and deliver the corresponding low current consumption, without any special
tricks.
However, sometimes you might want to reduce the system current even more by
selectively disabling unused circuitry. The patented DataGATE technology permits a
straightforward approach to additional power reduction. Each I/O pin has a series switch
that can block the arrival of unused free- running signals that may increase power
consumption. Disabling these switches enables you to complete your design and choose
which sections will participate in the DataGATE function.
DataGATE
Configuration
Assertion Rail
Bit
Data Latch
Input
to AIM
Pin
clock nets. The signal is buffered and driven to multiple traces with minimal loading and
skew.
Global DIV2
Clock
(GCK2) Clock DIV4 to FB 1
Divide
By
2,4,6,…,16 to FB n
CDRST
DIV16
x378_01_041202
DualEDGE
Each macrocell has the ability to double its input clock switching frequency. Figure 2-7
shows the macrocell flip-flop with the DualEDGE option (doubled clock) at each
macrocell. The source to double can be a control term clock, a product term clock, or one of
the available global clocks. The ability to switch on both clock edges is vital for a number
of synchronous memory interface applications as well as certain double data rate I/O
applications.
CoolCLOCK
In addition to the DualEDGE flip-flop, you can gain additional power savings by
combining the clock division circuitry with the DualEDGE circuitry. This capability is
called CoolCLOCK and is designed to reduce clocking power within the CPLD. Because
the clock net can be a significant power drain, you can reduce the clock power by driving
the net at half frequency, and then doubling the clock rate using DualEDGE triggering at
the macrocells. Figure 2-11 illustrates how CoolCLOCK is created by internal clock
cascading, with the divider and DualEDGE flip-flop working together.
Input Device
Divide Routing Macrocell
Clock D/T/L
Q
D
DIV2 T
Latch
x378_03_041202
Design Security
You can secure your designs during programming to prevent either accidental overwriting
or pattern theft via readback. CoolRunner-II CPLDs have four independent levels of
security provided on-chip, eliminating any electrical or visual detection of configuration
patterns. These security bits can be reset only by erasing the entire device. Additional
details are omitted intentionally.
XC9500XL CPLDs also complement the higher-density Xilinx FPGAs to provide a total
logic solution, within a unified development environment. The XC9500XL family is fully
WebPOWERED via its free WebPACK ISE software.
Family Highlights
• Lowest cost per macrocell
• State-of-the-art pin-locking architecture
• Highest programming reliability reduces system risk
• Complements Xilinx 3.3V FPGA families
• Performance
♦ 5 ns pin-to-pin speed
♦ 222 MHz system frequency
• Powerful Architecture
♦ Wide 54-input function blocks
♦ As many as 90 product-terms per macrocell
♦ Fast and routable Fast CONNECT™ II switch matrix
♦ Three global clocks with local inversion
♦ Individual OE per output, with local inversion
• Highest Reliability
♦ Endurance rating of 10,000 cycles
Platform FPGAs
Spartan-3/3E/3A/3AN FPGAs
Xilinx Spartan-3 FPGAs are ideal for low-cost, high-volume applications and are targeted
as replacements for fixed-logic gate arrays and ASSP products such as bus interface chip
sets. The Spartan-3 (1.2V, 90 nm) FPGA is not only available for a very low cost, but it
integrates many architectural features associated with high-end programmable logic. This
combination of low cost and features makes it an ideal replacement for ASICs (gate arrays)
and many ASSP devices. For example, a Spartan-3 FPGA in a car multimedia system could
Platform FPGAs
absorb many system functions, including embedded IP cores, custom system interfaces,
DSP, and logic. Figure 2-14 below shows such a system.
In the car multimedia system shown in the above figure, the PCI bridge takes the form of
a pre-verified drop in IP core, and the device-level and board-level clocking functions are
implemented in the Spartan-3 on-chip DCMs. CAN core IP can connect to the body
electronics modules. These cores are provided by Xilinx AllianceCORE™ partners such as
Bosch, Memec Design, CAST, Inc., Xylon, and Intelliga. On-chip 18 x 18 multipliers can be
used in DSP-type activities such as filtering and formatting. Other custom-designed
interfaces can be implemented to off-chip processors, an IDE interface to the drive unit of
a DVD player, audio, memory, and LCD. Additionally, the Spartan-3 XCITE digitally
controlled impedance technology can reduce EMI and component count by providing on-
chip tunable impedances to provide line matching without the need for external resistors.
The Spartan-3 family is based on advanced 90 nm, eight- layer metal process technology.
Xilinx uses 90 nm technology to drive pricing down to under $20 for a one-million-gate
FPGA (approximately 17,000 logic cells), which represents a cost savings as high as 80
percent compared to competitive offerings. A smaller die size and 300 mm wafers improve
device densities and yields, thereby reducing overall production costs. This in turn leads to
a more highly integrated, less expensive product that takes up less board space when
designed into an end product.
Platform FPGAs
The Spartan-3 FPGA memory architecture provides the optimal granularity and efficient
area utilization.
• Shift Register SRL16 Blocks
♦ Each CLB LUT works as a 16-bit fast, compact shift register
♦ Cascade LUTs to build longer shift registers
♦ Implement pipeline registers and buffers for video or wireless
COUT COUT
SLICEL S3
X1Y1
SLICEL S2
X1Y0
Switch
Matrix
SLICEM S1
X0Y1
SHIFT
SLICEM S0
X0Y0
CIN CIN
Platform FPGAs
Logic Cells 1,728 4,320 8,064 17,280 29,952 46,080 62,208 74,480
Block RAM Bits 72K 216K 288K 432K 576K 720K 1,728K 1,872K
Distributed RAM Bits 12K 30K 56K 120K 208K 320K 432K 520K
DCMs 2 4 4 4 4 4 4 4
I/O Standards 24 24 24 24 24 24 24 24
Max Single Ended I/O 124 173 264 391 487 565 712 784
Digital clock management (DCM) Eliminate on-chip and board level clock delay,
simultaneous multiply and divide, reduction of
board level clock speed and number of board level
clocks, adjustable clock phase for ensuring
coherency
Global routing resources Distribution of clocks and other signals with very
high fanout throughout the device
Programmable output drive Improves signal integrity, achieving right trade off
between Tco and ground bounce
Table 2-6: Spartan-3E FPGA Family Overview
Device XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E
System Gates 100K 250K 500K 1200K 1600K
Logic Cells 2,160 5,508 10,476 19,512 33,192
Dedicated Multipliers 4 12 20 28 36
Block RAM Blocks 4 12 20 28 36
Block RAM Bits 72K 216K 360K 504K 648K
Distributed RAM Bits 15K 38K 73K 136K 231K
DCMs 2 4 4 8 8
Max Differential I/O 40 68 92 124 156
Max Single Ended I/O 108 172 232 304 376
VQ100 66 66
CP132 92 92
TQ144 108 108
PQ208 158 158
FT256 172 190 190
FG320 232 250 250
FG400 304 304
FG484 376
Platform FPGAs
$15 $6
$10
$4
$6
$7/$2
Spartan-3E
$30
$7.50
$6
Spartan-3A/3AN
The Spartan-3A and Spartan-3AN families are pin-to-pin compatible low-cost FPGA
families. The Spartan-3AN is non-volatile. Its offering is shown in Table 2-7.
Table 2-7: Spartan-3AN Family
Virtex FPGAs
Virtex-4 FPGAs
With more than 100 innovations, the Virtex-4 family represents a new milestone in the
evolution of FPGA technology. The idea behind the family was to offer higher
performance, higher logic density, lower power, lower cost and more advanced
capabilities over previous families. To offer one or two of these items is relatively easy – the
challenge was to offer all at the same time. We did this through a combination of
innovative process and circuit design, process development, the ASMBL architectural
approach and the use of advanced embedded functions.
ASMBL Architecture
One of the most remarkable developments embodied in the new Virtex-4 FPGA family is
the Advanced Silicon Modular Block (ASMBL) columnar architecture, which represents a
fundamentally new way of constructing the FPGA floor plan and its interconnect to the
package. First of all, ASMBL enables IO pins, clock pins and power and ground pins to be
located anywhere on the silicon chip, not just along the periphery as with previous FPGA
architectures. This in turn allows power and ground pins to be brought directly into the
centre of the silicon die, thereby significantly reducing on-chip IR drops that can occur
with the largest FPGAs running at the highest frequencies
Virtex FPGAs
The columnar approach to building the ASMBL architecture enables Xilinx to cost-
effectively develop multiple FPGA platforms, each with different combinations of feature
sets. Thus, a specific platform can be optimized specifically for a certain domain of
applications – such as logic, connectivity, DSP and embedded processing – to meet
application requirements previously delivered only by ASICs, ASSPs and similar devices
while remaining programmable at heart.
Virtex-4
Traditional FPGA Family Multi-platform FPGA Family
Feature
Device
D
Device Capability & Cost
cost
Feature
C
Feature
B
Feature
B
Feature Feature
A A
Virtex-4 Variants
Virtex-4 is offered in three variants; Virtex-4 LX, optimized for high performance logic
functions; Virtex-4 SX, optimized for high-performance signal processing; Virtex-4 FX,
optimized for embedded processing and high-speed serial connectivity.
LX FX SX
Resource
Logic 14-
14-200K LCs 12-
12-140K LCs 23-
23-55K LCs
Memory 0.9-
0.9-6Mb 0.6-
0.6-10Mb 2.3-
2.3-5.7Mb
SelectIO 240-
240-960 240-
240-896 320-
320-640
Virtex-4 LX
The most general-purpose family would be the Virtex-4 LX or logic optimized platform
family. The LX family is similar in function to early Virtex-II devices without the
embedded PowerPC processor or higher-speed serial I/Os found in the newer Virtex-II
ProTM devices. All types of soft Intellectual Property (IP) cores can be implemented on this
Platform, including various DSP blocks and soft processor cores such as MicroBlaze or
PicoBlaze. The primary benefit is the use of highly integrated general-purpose logic
elements, which makes this the most cost-effective logic platform.
The Virtex-4 LX Platform will have several family members with small–to-large-size
devices, making it a suitable match for many applications. This family will have twice the
logic density of any device shipping today. The cost benefits of using advanced 90nm
silicon fabrication technology on 300mm wafers, together with cost-effective device
packaging insures this platform’s broad-based acceptance. The higher clock frequencies
compared to previous generation platform FPGAs greatly expands the LX Platform’s
suitability for replacing ASICs.
• Highest Logic Capacity Ever (up to 200k LCs)
• Widest Capacity Range (8 LX devices ranging for 14k to 200k LCs)
Virtex-4 FX
Adding a PowerPC and high-speed serial transceivers creates the full-featured Virtex-4 FX
platform. The combination of features, architecture, and fabrication process enables
processor clock speeds of up to 450 MHz. Combining this capability with serial
transceivers supporting any speed from 600 Mbps to 11.1Gbps provides a very capable
high-performance platform FPGA that meets embedded-processing and connectivity-
domain requirements.
Virtex FPGAs
The FX Platform incorporates advanced system features that are particularly useful in a
wide-range of applications in the Telecom, Storage, and Networking space, and other
system applications requiring high-performance processing and high-bandwidth I/O.
These applications can be segmented into two general application domains based on the
system behavior. The embedded-processing domain is dominated by control flow
operations involving complex data types. The connectivity-domain involves message-
based processing and is dominated by asynchronous data flow operations. Both domains
are best implemented on the Virtex-4 FX full-featured platform.
• Additional Advanced System Functions
♦ 10 Gbps RocketIO
♦ PowerPC Cores
♦ 10/100/1000 Ethernet MAC Cores
• Rich Memory Mix BRAM/FIFO
♦ Up to Nearly 10 Mbits
• Six FX Devices Ranging from 12k to 140k LCs
Virtex-4 SX
Increasing the ratio of DSP and memory blocks to the number of logic elements creates the
Virtex-4 SX, or signal-processing/DSP Platform family of devices. The changed ration of
features creates a relatively smaller die size Platform in comparison to other Virtex-4
platforms for high-speed signal processing. This trade-off combined with the new DSP
slice features packs the capability for the highest DSP performance into the most cost-
effective Virtex-4 SX Platform. With significantly higher DSP bandwidth at much reduced
power consumption of previous Virtex-II Pro devices, the Virtex-4 SX Platform delivers the
most DSP performance per dollar compared to any other device. Each DSP Slice
implements an 18-bit x 18-bit MAC that can be clocked at 500MHz. The impact of Virtex-4
DSP specific enhancements to include new modes and capabilities, together with other
parts of the optimized SX Platform architecture, enables more capable higher level DSP IP.
SX55
512 •• 256
256 GMAC/s:
GMAC/s: Highest
Highest DSP
DSP
performance in the industry
performance in the industry
DSP
Slices •• Lowest
Lowest DSP
DSP cost
cost // performance ratio
ratio
SX35 FX140
192
FX100
160
SX25
128 FX60
LX100 LX160 LX200
96 LX80
LX40 LX60
64 LX25
FX40
32 FX20
LX15 Device
FX12
Cost
Virtex-5
The Virtex-5 family of FPGAs represents the 5th generation in the Virtex series of FPGAs.
Built on 65 nm triple-oxide process technology, the proven multi-platform ASMBL
architecture, and the all-new ExpressFabric technology, the Virtex-5 family offers
customers the highest performance, most flexible connectivity, optimized power, lowest
system cost and maximum productivity. The first family available at product launch is
Virtex-5 LX, shown in Table 2-9. The complete Virtex-5 Platform family is as follows:
• Virtex-5 LX Platform - Optimized for high-performance logic
• Virtex-5 LXT Platform - Optimized for high-performance logic with low-power serial
connectivity
• Virtex-5 SXT Platform - Optimized for DSP and memory-intensive applications with
low-power serial connectivity
• Virtex-5 FXT Platform - Optimized for embedded processing and memory-intensive
applications with highest-speed serial connectivity
Logic
On-chip RAM
DSP Capabilities
Parallel I/Os
Serial I/Os
®
PowerPC Processors
Shipping since May ‘06 Oct ‘06 Feb ‘07 Now
For a complete Virtex-5 Platform FPGA product table, see
http://www.xilinx.com/publications/prod_mktg/pn0010938-4.pdf
Design-In Flexibility
With Xilinx XA devices, you can design-in flexibility and get your product to market faster
than ever before. Because many new standards continue to evolve (such as the LIN, MOST,
and FlexRay in-car busing standards), you need the flexibility to quickly modify your
designs at any time. With our unique Internet Reconfigurable Logic (IRL) capability, you
can remotely and automatically modify your designs, in the field, after your product has
left the factory. By combining our latest XA PLDs with our solutions infrastructure of high-
productivity software, IP cores, design services, and customer education, you can develop
advanced, highly flexible products faster than ever before. For more information, visit
www.xilinx.com/automotive.
XA Product Range
Table 2-10: Temperature Grades
Product Group Temperature Grade/Range (ºC)
C I Q
FPGA Tj = 0 to +85 Tj = -40 to +100 Tj = -40 to +125
CPLD Ta = 0 to +70 Ta = -40 to +85 Ta = -40 to +125
Chapter 3
4. Generate a netlist.
EDIF is the industry-wide standard for netlists; many others exist, including vendor-
specific ones such as the Xilinx Netlist Format (XNF). Once you have the design netlist, you
have all you need to determine what the circuit does.
Design Flow
STAT_MAC
Specification
clock CLK AUG amber_light
Libraries Counter
CLOCK COUNT (3.0)
RESET
Schematic
Capture Design Schematic
Netlist
101010101001110101010101
010101011110001110100111
101010101001110101010101
010101011110001110100111
101010101001110101010101
010101011110001110100111
101010101001110101010101
010101011110001110100111
Design Netlist
The example on the previous pages is obviously very simplistic. Let’s describe a more
realistic design of 10,000 equivalent gates. The typical schematic page contains about 200
gates, contained with soft macros. Therefore, it would require 50 schematic pages to create
a 10,000-gate design! Each page needs to go through all the steps mentioned previously:
adding components, interconnecting the gates, adding I/Os, and generating a netlist. This
is rather time-consuming, especially if you want to have a 20,000, 50,000, or even larger
design.
Another inherent problem with using schematic capture is the difficulty in migrating
between vendors and technologies. If you initially create your 10,000 gate design with
FPGA vendor X and then want to migrate to a gate array, you would have to modify every
one of those 50 pages using the gate array vendor’s component library.
would have to be loaded, positioned on the page, and interconnected, with I/O buffers
added. That would be about three days of work.
The HDL implementation, which is also 6,000 gates, requires eight lines of text and can be
done in three minutes. This file contains all the information necessary to define our 16 x 16
multiplier. So, as a designer, which method would you choose? In addition to the
tremendous time savings, the HDL method is completely vendor-independent. This opens
up tremendous design possibilities for engineers.
$ESIGN &LOW
3PECIFICATION
,IBRARIES
3CHEMATIC
#APTURE
.ETLIST
$ESIGN 3CHEMATICS
/2
ENTITY -5,4 IS
PORT ! " IN STD?LOGIC DOWNTO
9 OUT STD?LOGIC DOWNTO
END -5,4
ARCHITECTURE "%(!6% OF -5,4 IS
BEGIN
9 !