Transistor - Wikipedia
Transistor - Wikipedia
Transistor - Wikipedia
long-distance telephony. The triode, however, was a fragile device that consumed a substantial
amount of power. In 1909, physicist William Eccles discovered the
crystal diode oscillator.[7] Physicist Julius Edgar Lilienfeld filed a patent
Transistor for a field-effect transistor (FET) in Canada in 1925,[8] which was
intended to be a solid-state replacement for the triode.[9][10] Lilienfeld
also filed identical patents in the United States in 1926[11] and
A transistor is a semiconductor device used to amplify or 1928.[12][13] However, Lilienfeld did not publish any research articles
switch electrical signals and power. The transistor is one of about his devices nor did his patents cite any specific examples of a
the basic building blocks of modern electronics.[1] It is working prototype. Because the production of high-quality
composed of semiconductor material, usually with at least semiconductor materials was still decades away, Lilienfeld's solid-state Julius Edgar
three terminals for connection to an electronic circuit. A amplifier ideas would not have found practical use in the 1920s and Lilienfeld proposed
voltage or current applied to one pair of the transistor's 1930s, even if such a device had been built. [14] In 1934, inventor Oskar the concept of a field-
terminals controls the current through another pair of [15] effect transistor in
Heil patented a similar device in Europe.
terminals. Because the controlled (output) power can be 1925.
higher than the controlling (input) power, a transistor can
amplify a signal. Some transistors are packaged individually, Bipolar transistors
but many more in miniature form are found embedded in Size comparison of BJT transistor
packages, from left to right: SOT-23,
integrated circuits.
TO-92, TO-126, TO-3
Physicist Julius Edgar Lilienfeld proposed the concept of a
field-effect transistor in 1926, but it was not
possible to actually construct a working device
at that time.[2] The first working device to be
built was a point-contact transistor invented in
1947 by physicists John Bardeen and Walter
Brattain while working under William Shockley
at Bell Labs. The three shared the 1956 Nobel John Bardeen, William Shockley and
Prize in Physics for their achievement.[3] The Walter Brattain at Bell Labs in 1948.
most widely used type of transistor is the Bardeen and Brattain invented the
metal–oxide–semiconductor field-effect point-contact transistor in 1947 and
transistor (MOSFET), which was invented by Shockley the bipolar junction
Mohamed Atalla and Dawon Kahng at Bell transistor in 1948.
Metal–oxide–semiconductor field-effect transistor A replica of the first working transistor, a point-
Labs in 1959.[4][5][6] Transistors revolutionized (MOSFET), showing gate (G), body (B), source (S) contact transistor invented in 1947
the field of electronics, and paved the way for and drain (D) terminals. The gate is separated from From November 17, 1947, to December 23,
smaller and cheaper radios, calculators, and the body by an insulating layer (pink). 1947, John Bardeen and Walter Brattain at
computers, among other things. AT&T's Bell Labs in Murray Hill, New Jersey, performed experiments and observed that when
two gold point contacts were applied to a crystal of germanium, a signal was produced with the
Most transistors are made from very pure silicon, and some from germanium, but certain other
semiconductor materials are sometimes used. A transistor may have only one kind of charge output power greater than the input.[16] Solid State Physics Group leader William Shockley saw
carrier, in a field-effect transistor, or may have two kinds of charge carriers in bipolar junction the potential in this, and over the next few months worked to greatly expand the knowledge of
transistor devices. Compared with the vacuum tube, transistors are generally smaller and semiconductors. The term transistor was coined by John R. Pierce as a contraction of the term
require less power to operate. Certain vacuum tubes have advantages over transistors at very transresistance.[17][18][19] According to Lillian Hoddeson and Vicki Daitch, Shockley had
high operating frequencies or high operating voltages. Many types of transistors are made to proposed that Bell Labs' first patent for a transistor should be based on the field-effect and that
standardized specifications by multiple manufacturers. he be named as the inventor. Having unearthed Lilienfeld's patents that went into obscurity
years earlier, lawyers at Bell Labs advised against Shockley's proposal because the idea of a
field-effect transistor that used an electric field as a "grid" was not new. Instead, what Bardeen,
History Brattain, and Shockley invented in 1947 was the first point-contact transistor.[14] In
acknowledgement of this accomplishment, Shockley, Bardeen, and Brattain were jointly
awarded the 1956 Nobel Prize in Physics "for their researches on semiconductors and their
discovery of the transistor effect".[20][21]
Shockley's research team initially attempted to build a field-effect transistor (FET), by trying to The first "prototype" pocket transistor radio was shown by INTERMETALL (a company
modulate the conductivity of a semiconductor, but was unsuccessful, mainly due to problems founded by Herbert Mataré in 1952) at the Internationale Funkausstellung Düsseldorf between
with the surface states, the dangling bond, and the germanium and copper compound materials. August 29, 1953 and September 6, 1953.[33][34] The first "production" pocket transistor radio
In the course of trying to understand the mysterious reasons behind their failure to build a was the Regency TR-1, released in October 1954.[21] Produced as a joint venture between the
working FET, this led them instead to invent the bipolar point-contact and junction Regency Division of Industrial Development Engineering Associates, I.D.E.A. and Texas
transistors.[22][23] Instruments of Dallas Texas, the TR-1 was manufactured in Indianapolis, Indiana. It was a near
pocket-sized radio featuring 4 transistors and one germanium diode. The industrial design was
In 1948, the point-contact transistor was independently invented by outsourced to the Chicago firm of Painter, Teague and Petertil. It was initially released in one of
physicists Herbert Mataré and Heinrich Welker while working at the six different colours: black, ivory, mandarin red, cloud grey, mahogany and olive green. Other
Compagnie des Freins et Signaux Westinghouse, a Westinghouse colours were to shortly follow.[35][36][37]
subsidiary located in Paris. Mataré had previous experience in
developing crystal rectifiers from silicon and germanium in the German The first "production" all-transistor car radio was developed by Chrysler and Philco
radar effort during World War II. Using this knowledge, he began corporations and it was announced in the April 28, 1955 edition of the Wall Street Journal.
researching the phenomenon of "interference" in 1947. By June 1948, Chrysler had made the all-transistor car radio, Mopar model 914HR, available as an option
witnessing currents flowing through point-contacts, Mataré produced starting in fall 1955 for its new line of 1956 Chrysler and Imperial cars which first hit the
consistent results using samples of germanium produced by Welker, dealership showroom floors on October 21, 1955.[38][39][40]
similar to what Bardeen and Brattain had accomplished earlier in
Herbert Mataré in December 1947. Realizing that Bell Labs' scientists had already invented The Sony TR-63, released in 1957, was the first mass-produced transistor radio, leading to the
1950. He the transistor before them, the company rushed to get its "transition" mass-market penetration of transistor radios.[41] The TR-63 went on to sell seven million units
independently into production for amplified use in France's telephone network and filed worldwide by the mid-1960s.[42] Sony's success with transistor radios led to transistors
invented a point- his first transistor patent application on August 13, 1948.[24][25][26] replacing vacuum tubes as the dominant electronic technology in the late 1950s.[43]
contact transistor in
June 1948. The first bipolar junction transistors were invented by Bell Labs' William The first working silicon transistor was developed at Bell Labs on January 26, 1954, by Morris
Shockley, which applied for patent (2,569,347) on June 26, 1948. On Tanenbaum. The first production commercial silicon transistor was announced by Texas
April 12, 1950, Bell Labs chemists Gordon Teal and Morgan Sparks had Instruments in May 1954. This was the work of Gordon Teal, an expert in growing crystals of
successfully produced a working bipolar NPN junction amplifying germanium transistor. Bell
high purity, who had previously worked at Bell Labs.[44][45][46]
Labs had announced the discovery of this new "sandwich" transistor in a press release on July 4,
1951.[27][28]
Field effect transistors
The first high-frequency transistor was the
surface-barrier germanium transistor The basic principle of the field-effect transistor (FET) was first proposed by physicist Julius
developed by Philco in 1953, capable of Edgar Lilienfeld in 1926, when he filed a patent for a device similar to MESFET and in 1928
operating at frequencies up to 60 MHz.[29] when he filed a patent for an insulated-gate field-effect transistor.[47][48] The FET concept was
These were made by etching depressions into later also theorized by engineer Oskar Heil in the 1930s and by William Shockley in the 1940s.
an n-type germanium base from both sides with
jets of Indium(III) sulfate until it was a few ten- In 1945 JFET was patented by Heinrich Welker.[49] Following Shockley's theoretical treatment
thousandths of an inch thick. Indium on JFET in 1952, a working practical JFET was made in 1953 by George C. Dacey and Ian M.
electroplated into the depressions formed the Ross.[50]
collector and emitter.[30][31]
In 1948 Bardeen patented the progenitor of MOSFET, an insulated-gate FET (IGFET) with an
AT&T first used transistors in inversion layer. Bardeen's patent as well as the concept of an inversion layer forms the basis of
telecommunications equipment in circuits of CMOS technology today.[51]
the No. 4A Toll Crossbar Switching System in
1953 for selecting trunk circuits from routing
information encoded on translator cards.[32] MOSFET (MOS transistor)
The Western Electric No. 3A phototransistor
read the mechanical encoding from punched Semiconductor companies initially focused on junction transistors in the early years of the
metal cards. semiconductor industry. The junction transistor was a relatively bulky device that was difficult
Philco surface-barrier transistor developed and to mass-produce, which limited it to several specialized applications. Field-effect transistors
produced in 1953
(FETs) were theorized as potential alternatives to junction transistors, but researchers initially The MOSFET (metal–oxide–semiconductor field-effect transistor), also known as the MOS
could not get FETs to work properly, largely due to the troublesome surface state barrier that transistor, is by far the most widely used transistor, used in applications ranging from
prevented the external electric field from penetrating the material.[52] computers and electronics[54] to communications technology such as smartphones.[69] The
MOSFET has been considered to be the most important transistor,[70] possibly the most
In the 1950s, engineer Mohamed Atalla investigated the surface properties of silicon important invention in electronics,[71] and the birth of modern electronics.[72] The MOS
semiconductors at Bell Labs, where he proposed a transistor has been the fundamental building block of modern digital electronics since the late
new method of semiconductor device fabrication,
20th century, paving the way for the digital age.[73] The US Patent and Trademark Office calls it
coating a silicon wafer with an insulating layer of
a "groundbreaking invention that transformed life and culture around the world".[69] Its
silicon oxide so that electricity could reliably
importance in today's society rests on its ability to be mass-produced using a highly automated
penetrate to the conducting silicon below,
process (semiconductor device fabrication) that achieves astonishingly low per-transistor costs.
overcoming the surface states that prevented
MOSFETs are the most numerously produced artificial objects ever with more than 13 sextillion
electricity from reaching the semiconducting layer.
This is known as surface passivation, a method manufactured by 2018.[74]
that became critical to the semiconductor industry
Although several companies each produce over a billion individually packaged (known as
as it later made possible the mass-production of
discrete) MOS transistors every year,[75] the vast majority of transistors are now produced in
silicon integrated circuits.[53][54] He presented his
integrated circuits (often shortened to IC, microchips or simply chips), along with diodes,
findings in 1957.[55] Building on his surface Mohamed Atalla (left) and Dawon Kahng (right)
resistors, capacitors and other electronic components, to produce complete electronic circuits. A
passivation method, he developed the metal– invented the MOSFET (MOS transistor) at Bell
logic gate consists of up to about twenty transistors whereas an advanced microprocessor, as of
oxide–semiconductor (MOS) process. [53] He Labs in 1959.
2022, can use as many as 57 billion transistors (MOSFETs).[76]
proposed the MOS process could be used to build
the first working silicon FET, which he began The transistor's low cost, flexibility, and reliability have made it a ubiquitous device.
working on building with the help of his Korean colleague Dawon Kahng.[53] Transistorized mechatronic circuits have replaced electromechanical devices in controlling
appliances and machinery. It is often easier and cheaper to use a standard microcontroller and
The metal–oxide–semiconductor field-effect transistor (MOSFET), or MOS transistor, was write a computer program to carry out a control function than to design an equivalent
invented by Mohamed Atalla and Dawon Kahng in 1959.[4][5] The MOSFET was the first truly mechanical system to control that same function.
compact transistor that could be miniaturized and mass-produced for a wide range of uses.[52]
In a self-aligned CMOS process, a transistor is formed wherever the gate layer (polysilicon or
metal) crosses a diffusion layer.[56]: p.1 (see Fig. 1.1) With its high scalability,[57] and much lower
Simplified operation
power consumption and higher density than bipolar junction transistors,[58] the MOSFET made
A transistor can use a small signal applied between
it possible to build high-density integrated circuits,[6] allowing the integration of more than
one pair of its terminals to control a much larger signal
10,000 transistors in a single IC.[59] at another pair of terminals. This property is called
gain. It can produce a stronger output signal, a voltage
CMOS (complementary MOS) was invented by Chih-Tang Sah and Frank Wanlass at Fairchild
or current, which is proportional to a weaker input
Semiconductor in 1963.[60] The first report of a floating-gate MOSFET was made by Dawon signal and thus, it can act as an amplifier.
Kahng and Simon Sze in 1967.[61] A double-gate MOSFET was first demonstrated in 1984 by Alternatively, the transistor can be used to turn
Electrotechnical Laboratory researchers Toshihiro Sekigawa and Yutaka Hayashi.[62][63] current on or off in a circuit as an electrically
FinFET (fin field-effect transistor), a type of 3D non-planar multi-gate MOSFET, originated controlled switch, where the amount of current is
from the research of Digh Hisamoto and his team at Hitachi Central Research Laboratory in determined by other circuit elements.[77]
1989.[64][65] A Darlington transistor opened up so the
actual transistor chip (the small square) can
There are two types of transistors, which have slight
be seen inside. A Darlington transistor is
differences in how they are used in a circuit. A bipolar
Importance transistor has terminals labeled base, collector, and
effectively two transistors on the same chip.
One transistor is much larger than the other,
emitter. A small current at the base terminal (that is,
Transistors are the key active components in practically all modern electronics. Many thus flowing between the base and the emitter) can control
but both are large in comparison to
consider the transistor to be one of the greatest inventions of the 20th century.[66] or switch a much larger current between the collector
transistors in large-scale integration
because this particular example is intended
and emitter terminals. For a field-effect transistor, the for power applications.
The invention of the first transistor at Bell Labs was named an IEEE Milestone in 2009.[67] The terminals are labeled gate, source, and drain, and a
list of IEEE Milestones also includes the inventions of the junction transistor in 1948 and the voltage at the gate can control a current between
MOSFET in 1959.[68] source and drain.[78]
The image represents a typical bipolar transistor in a circuit. A charge will flow between emitter Transistor as an amplifier
and collector terminals depending on the current in the base. Because internally the base and
emitter connections behave like a semiconductor The common-emitter amplifier is designed so that a
diode, a voltage drop develops between base and small change in voltage (Vin) changes the small
emitter while the base current exists. The amount of current through the base of the transistor whose
this voltage depends on the material the transistor is current amplification combined with the properties of
made from and is referred to as VBE.[78] the circuit means that small swings in Vin produce
large changes in Vout.[78]
Transistor as a switch Various configurations of single transistor amplifiers
are possible, with some providing current gain, some
Transistors are commonly used in digital circuits as
voltage gain, and some both.
electronic switches which can be either in an "on" or
"off" state, both for high-power applications such as From mobile phones to televisions, vast numbers of
switched-mode power supplies and for low-power products include amplifiers for sound reproduction,
applications such as logic gates. Important parameters radio transmission, and signal processing. The first
for this application include the current switched, the discrete-transistor audio amplifiers barely supplied a
A simple circuit diagram to show the labels
voltage handled, and the switching speed, of an n–p–n bipolar transistor few hundred milliwatts, but power and audio fidelity
characterized by the rise and fall times.[78] gradually increased as better transistors became Amplifier circuit, common-emitter
available and amplifier architecture evolved.[78] configuration with a voltage-divider bias
In a switching circuit, the goal is to simulate, as near circuit
as possible, the ideal switch having the properties of Modern transistor audio amplifiers of up to a few
an open circuit when off, the short circuit when on, hundred watts are common and relatively inexpensive.
and an instantaneous transition between the two
states. Parameters are chosen such that the "off"
output is limited to leakage currents too small to affect Comparison with vacuum tubes
connected circuitry, the resistance of the transistor in
the "on" state is too small to affect circuitry, and the Before transistors were developed, vacuum (electron) tubes (or in the UK "thermionic valves" or
transition between the two states is fast enough not to just "valves") were the main active components in electronic equipment.
have a detrimental effect.[78]
In a grounded-emitter transistor circuit, such as the BJT used as an electronic switch, in Advantages
light-switch circuit shown, as the base voltage rises, grounded-emitter configuration
the emitter and collector currents rise exponentially. The key advantages that have allowed transistors to replace vacuum tubes in most applications
The collector voltage drops because of reduced are
resistance from the collector to the emitter. If the voltage difference between the collector and
emitter were zero (or near zero), the collector current would be limited only by the load No cathode heater (which produces the characteristic orange glow of tubes), reducing
resistance (light bulb) and the supply voltage. This is called saturation because the current is power consumption, eliminating delay as tube heaters warm-up, and immune from cathode
poisoning and depletion.
flowing from collector to emitter freely. When saturated, the switch is said to be on.[79]
Very small size and weight, reducing equipment size.
The use of bipolar transistors for switching applications requires biasing the transistor so that it Large numbers of extremely small transistors can be manufactured as a single integrated
operates between its cut-off region in the off-state and the saturation region (on). This requires circuit.
sufficient base drive current. As the transistor provides current gain, it facilitates the switching Low operating voltages compatible with batteries of only a few cells.
of a relatively large current in the collector by a much smaller current into the base terminal. Circuits with greater energy efficiency are usually possible. For low-power applications (for
The ratio of these currents varies depending on the type of transistor, and even for a particular example, voltage amplification) in particular, energy consumption can be very much less
type, varies depending on the collector current. In the example of a light-switch circuit, as than for tubes.
shown, the resistor is chosen to provide enough base current to ensure the transistor is Complementary devices available, providing design flexibility including complementary-
saturated.[78] The base resistor value is calculated from the supply voltage, transistor C-E symmetry circuits, not possible with vacuum tubes.
junction voltage drop, collector current, and amplification factor beta.[80] Very low sensitivity to mechanical shock and vibration, providing physical ruggedness and
virtually eliminating shock-induced spurious signals (for example, microphonics in audio
applications).
Not susceptible to breakage of a glass envelope, leakage, outgassing, and other physical power modules (see Packaging).
damage. Amplification factor hFE, βF
(transistor beta)[82] or gm P-channel
(transconductance).
Limitations
Working temperature: Extreme
Transistors may have the following limitations: temperature transistors and
traditional temperature
They lack the higher electron mobility afforded by the vacuum of vacuum tubes, which is transistors (−55 to 150 °C (−67
to 302 °F)). Extreme temperature N-channel
desirable for high-power, high-frequency operation – such as that used in some over-the-air
television transmitters and in travelling wave tubes used as amplifiers in some satellites transistors include high-
temperature transistors (above
Transistors and other solid-state devices are susceptible to damage from very brief
150 °C (302 °F)) and low- MOSFET enh
electrical and thermal events, including electrostatic discharge in handling. Vacuum tubes MOSFET dep
temperature transistors (below
are electrically much more rugged.
−55 °C (−67 °F)). The high-
They are sensitive to radiation and cosmic rays (special radiation-hardened chips are used temperature transistors that MOSFET symbols
for spacecraft devices). operate thermally stable up to
In audio applications, transistors lack the lower-harmonic distortion – the so-called tube 250 °C (482 °F) can be developed by a general strategy of blending interpenetrating semi-
sound – which is characteristic of vacuum tubes, and is preferred by some.[81] crystalline conjugated polymers and high glass-transition temperature insulating
polymers.[83]
Types Hence, a particular transistor may be described as silicon, surface-mount, BJT, NPN, low-
power, high-frequency switch.
Classification
Mnemonics
Transistors are categorized by
Convenient mnemonic to remember the type of transistor (represented by an electrical symbol)
Structure: MOSFET (IGFET), BJT, PNP P-channel involves the direction of the arrow. For the BJT, on an n-p-n transistor symbol, the arrow will
JFET, insulated-gate bipolar transistor "Not Point iN". On a p-n-p transistor symbol, the arrow "Points iN Proudly". This however
(IGBT), other types. does not apply to MOSFET-based transistor symbols as the arrow is typically reversed (i.e. the
Semiconductor material (dopants): arrow for the n-p-n points inside).
The metalloids; germanium (first
used in 1947) and silicon (first used NPN N-channel
Field-effect transistor (FET)
in 1954)—in amorphous,
polycrystalline and monocrystalline The field-effect transistor,
form.
BJT JFET sometimes called a unipolar
The compounds gallium arsenide transistor, uses either electrons
(1966) and silicon carbide (1997). BJT and JFET symbols (in n-channel FET) or holes (in p-
The alloy silicon-germanium (1989) channel FET) for conduction. The
The allotrope of carbon graphene (research ongoing since 2004), etc. (see four terminals of the FET are
Semiconductor material). named source, gate, drain, and
Electrical polarity (positive and negative): NPN, PNP (BJTs), N-channel, P-channel (FETs). body (substrate). On most FETs,
Maximum power rating: low, medium, high. the body is connected to the source
inside the package, and this will be Operation of a FET and its Id-Vg curve. At first, when no gate
Maximum operating frequency: low, medium, high, radio (RF), microwave frequency (the
assumed for the following
maximum effective frequency of a transistor in a common-emitter or common-source circuit voltage is applied, there are no inversion electrons in the channel, so
description.
is denoted by the term fT, an abbreviation for transition frequency—the frequency of the device is turned off. As gate voltage increases, the inversion
transition is the frequency at which the transistor yields unity voltage gain) electron density in the channel increases, current increases, and
In a FET, the drain-to-source thus the device turns on.
Application: switch, general purpose, audio, high voltage, super-beta, matched pair. current flows via a conducting
Physical packaging: through-hole metal, through-hole plastic, surface mount, ball grid array, channel that connects the source
region to the drain region. The conductivity is varied by the electric field that is produced when Bipolar transistors are so named because they conduct by using both majority and minority
a voltage is applied between the gate and source terminals, hence the current flowing between carriers. The bipolar junction transistor, the first type of transistor to be mass-produced, is a
the drain and source is controlled by the voltage applied between the gate and source. As the combination of two junction diodes and is formed of either a thin layer of p-type semiconductor
gate–source voltage (VGS) is increased, the drain–source current (IDS) increases exponentially sandwiched between two n-type semiconductors (an n–p–n transistor), or a thin layer of n-type
for VGS below threshold, and then at a roughly quadratic rate: (IDS ∝ (VGS − VT)2, where VT is semiconductor sandwiched between two p-type semiconductors (a p–n–p transistor). This
construction produces two p–n junctions: a base-emitter junction and a base-collector junction,
the threshold voltage at which drain current begins)[84] in the "space-charge-limited" region separated by a thin region of semiconductor known as the base region. (Two junction diodes
above threshold. A quadratic behavior is not observed in modern devices, for example, at the 65 wired together without sharing an intervening semiconducting region will not make a
nm technology node.[85] transistor).
For low noise at narrow bandwidth, the higher input resistance of the FET is advantageous. BJTs have three terminals, corresponding to the three layers of semiconductor—an emitter, a
base, and a collector. They are useful in amplifiers because the currents at the emitter and
FETs are divided into two families: junction FET (JFET) and insulated gate FET (IGFET). The
collector are controllable by a relatively small base current.[87] In an n–p–n transistor operating
IGFET is more commonly known as a metal–oxide–semiconductor FET (MOSFET), reflecting
in the active region, the emitter-base junction is forward biased (electrons and holes recombine
its original construction from layers of metal (the gate), oxide (the insulation), and
at the junction), and the base-collector junction is reverse biased (electrons and holes are
semiconductor. Unlike IGFETs, the JFET gate forms a p–n diode with the channel which lies
formed at, and move away from the junction), and electrons are injected into the base region.
between the source and drains. Functionally, this makes the n-channel JFET the solid-state
Because the base is narrow, most of these electrons will diffuse into the reverse-biased base-
equivalent of the vacuum tube triode which, similarly, forms a diode between its grid and
collector junction and be swept into the collector; perhaps one-hundredth of the electrons will
cathode. Also, both devices operate in the depletion-mode, they both have a high input
recombine in the base, which is the dominant mechanism in the base current. As well, as the
impedance, and they both conduct current under the control of an input voltage.
base is lightly doped (in comparison to the emitter and collector regions), recombination rates
Metal–semiconductor FETs (MESFETs) are JFETs in which the reverse biased p–n junction is are low, permitting more carriers to diffuse across the base region. By controlling the number of
replaced by a metal–semiconductor junction. These, and the HEMTs (high-electron-mobility electrons that can leave the base, the number of electrons entering the collector can be
transistors, or HFETs), in which a two-dimensional electron gas with very high carrier mobility controlled.[87] Collector current is approximately β (common-emitter current gain) times the
is used for charge transport, are especially suitable for use at very high frequencies (several base current. It is typically greater than 100 for small-signal transistors but can be smaller in
GHz). transistors designed for high-power applications.
FETs are further divided into depletion-mode and enhancement-mode types, depending on Unlike the field-effect transistor (see below), the BJT is a low-input-impedance device. Also, as
whether the channel is turned on or off with zero gate-to-source voltage. For enhancement the base-emitter voltage (VBE) is increased the base-emitter current and hence the collector-
mode, the channel is off at zero bias, and a gate potential can "enhance" the conduction. For the emitter current (ICE) increase exponentially according to the Shockley diode model and the
depletion mode, the channel is on at zero bias, and a gate potential (of the opposite polarity) can Ebers-Moll model. Because of this exponential relationship, the BJT has a higher
"deplete" the channel, reducing conduction. For either mode, a more positive gate voltage transconductance than the FET.
corresponds to a higher current for n-channel devices and a lower current for p-channel devices.
Nearly all JFETs are depletion-mode because the diode junctions would forward bias and Bipolar transistors can be made to conduct by exposure to light because the absorption of
conduct if they were enhancement-mode devices, while most IGFETs are enhancement-mode photons in the base region generates a photocurrent that acts as a base current; the collector
types. current is approximately β times the photocurrent. Devices designed for this purpose have a
transparent window in the package and are called phototransistors.
could consume just as much power as a standard transistor.[95] European Electronic Component Manufacturers Association (EECA)
Organic electrochemical transistor.
Solaristor (from solar cell transistor), a two-terminal gate-less self-powered phototransistor. The European Electronic Component Manufacturers Association (EECA) uses a numbering
scheme that was inherited from Pro Electron when it merged with EECA in 1983. This scheme
begins with two letters: the first gives the semiconductor type (A for germanium, B for silicon,
Device identification and C for materials like GaAs); the second letter denotes the intended use (A for diode, C for
general-purpose transistor, etc.). A three-digit sequence number (or one letter and two digits,
Three major identification standards are used for designating transistor devices. In each, the for industrial types) follows. With early devices this indicated the case type. Suffixes may be
alphanumeric prefix provides clues to the type of the device. used, with a letter (e.g. "C" often means high hFE, such as in: BC549C[97]) or other codes may
follow to show gain (e.g. BC327-25) or voltage rating (e.g. BUK854-800A[98]). The more
common prefixes are:
Joint Electron Device Engineering Council (JEDEC)
EECA transistor prefix table
The JEDEC part numbering scheme evolved in the 1960s in the United States. The JEDEC EIA-
370 transistor device numbers usually start with 2N, indicating a three-terminal device. Dual- Prefix Type and usage Example Equivalent Reference
gate field-effect transistors are four-terminal devices, and begin with 3N. The prefix is followed Germanium, small-signal AF
AC AC126 NTE102A
by a two-, three- or four-digit number with no significance as to device properties, although transistor
early devices with low numbers tend to be germanium devices. For example, 2N3055 is a silicon Germanium, AF power
n–p–n power transistor, 2N1301 is a p–n–p germanium switching transistor. A letter suffix, AD
transistor
AD133 NTE179
such as "A", is sometimes used to indicate a newer variant, but rarely gain groupings.
Germanium, small-signal RF
AF AF117 NTE160
transistor
JEDEC prefix table
Germanium, RF power
Prefix Type and usage AL ALZ10 NTE100
transistor
1N two-terminal device, such as diodes Germanium, switching
AS ASY28 NTE101
transistor
2N three-terminal device, such as transistors or single-gate field-effect transistors
Germanium, power switching
3N four-terminal device, such as dual-gate field-effect transistors AU AU103 NTE127
transistor
with 2S,[96] e.g., 2SD965, but sometimes the "2S" prefix is not marked on the package–a Silicon, RF (high frequency) Datasheet (http://www.onsemi.com/pub_lin
BF BF245 NTE133
2SD965 might only be marked D965 and a 2SC1815 might be listed by a supplier as simply BJT or FET k/Collateral/BF245A-D.PDF)
C1815. This series sometimes has suffixes, such as R, O, BL, standing for red, orange, blue, etc., Silicon, switching transistor Datasheet (http://www.fairchildsemi.com/ds/
BS BS170 2N7000
to denote variants, such as tighter hFE (gain) groupings. (BJT or MOSFET) BS/BS170.pdf)
With so many independent naming schemes, and the abbreviation of part numbers when The electron mobility and hole mobility columns show the average speed that electrons and
printed on the devices, ambiguity sometimes occurs. For example, two different devices may be holes diffuse through the semiconductor material with an electric field of 1 volt per meter
marked "J176" (one the J176 low-power JFET, the other the higher-powered MOSFET 2SJ176). applied across the material. In general, the higher the electron mobility the faster the transistor
can operate. The table indicates that Ge is a better material than Si in this respect. However, Ge
As older "through-hole" transistors are given surface-mount packaged counterparts, they tend has four major shortcomings compared to silicon and gallium arsenide:
to be assigned many different part numbers because manufacturers have their systems to cope
with the variety in pinout arrangements and options for dual or matched n–p–n + p–n–p 1. Its maximum temperature is limited.
devices in one pack. So even when the original device (such as a 2N3904) may have been 2. It has relatively high leakage current.
assigned by a standards authority, and well known by engineers over the years, the new versions 3. It cannot withstand high voltages.
are far from standardized in their naming.
4. It is less suitable for fabricating integrated circuits.
Construction Because the electron mobility is higher than the hole mobility for all semiconductor materials, a
given bipolar n–p–n transistor tends to be swifter than an equivalent p–n–p transistor. GaAs
has the highest electron mobility of the three semiconductors. It is for this reason that GaAs is
Semiconductor material used in high-frequency applications. A relatively recent FET development, the high-electron-
mobility transistor (HEMT), has a heterostructure (junction between different semiconductor
Semiconductor material characteristics materials) of aluminium gallium arsenide (AlGaAs)-gallium arsenide (GaAs) which has twice
Semiconductor Junction forward Electron mobility Hole mobility Max. junction the electron mobility of a GaAs-metal barrier junction. Because of their high speed and low
material voltage @ 25 °C, V @ 25 °C, m2/(V·s) @ 25 °C, m2/(V·s) temp., °C noise, HEMTs are used in satellite receivers working at frequencies around 12 GHz. HEMTs
based on gallium nitride and aluminum gallium nitride (AlGaN/GaN HEMTs) provide still
Ge 0.27 0.39 0.19 70 to 100
higher electron mobility and are being developed for various applications.
Si 0.71 0.14 0.05 150 to 200
Maximum junction temperature values represent a cross-section taken from various
GaAs 1.03 0.85 0.05 150 to 200
manufacturers' datasheets. This temperature should not be exceeded or the transistor may be
Al–Si junction 0.3 — — 150 to 200 damaged.
The first BJTs were made from germanium (Ge). Silicon (Si) types currently predominate but Al–Si junction refers to the high-speed (aluminum-silicon) metal–semiconductor barrier diode,
certain advanced microwave and high-performance versions now employ the compound commonly known as a Schottky diode. This is included in the table because some silicon power
semiconductor material gallium arsenide (GaAs) and the semiconductor alloy silicon- IGFETs have a parasitic reverse Schottky diode formed between the source and drain as part of
germanium (SiGe). Single element semiconductor material (Ge and Si) is described as the fabrication process. This diode can be a nuisance, but sometimes it is used in the circuit.
elemental.
Packaging
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