Atmel mXT1664T2-C2U

Revision 1.1

maXTouch 1792-node Touchscreen Controller

DATASHEET

Features

 Atmel® maXTouch® Adaptive Sensing Touchscreen Technology

 Up to 41 X (transmit) lines and 71 Y (receive) lines
 A maximum of 1792 nodes can be allocated to the touchscreen
 Screen sizes of up to 12.5 inches diagonal are supported
 Multi-touch support with up to 16 concurrent touches tracked in real time
 Dual-boot OS support for Windows and Android
 Advanced Touch Handling
 Moisture/Water Compensation
 No false touch with condensation or water drop up to 22 mm diameter
 One-finger tracking with condensation or water drop up to 22 mm diameter
 Stylus Support
 Supports passive stylus with 1 mm contact diameter, subject to configuration,
stack up, and sensor design
 Glove Support
 Supports multiple-finger glove touch up to 1.5 mm thickness
 Supports single-touch gloved operation with various materials up to 5 mm
thickness
 Touch Performance
 Mutual capacitance and self capacitance measurements supported for touch
detection
 Response Times
 Initial latency <10 ms for first touch from idle, subject to configuration
 Atmel maXCharger® technology to combat ambient, charger noise, and power-line
noise:
 Up to 240 Vpp between 1 Hz and 1 kHz sinusoidal waveform
 Up to 20 Vpp between 1 kHz and 1 MHz sinusoidal waveform
 Scan Speed
 Typical report rate for 15 touches 100 Hz
 Enhanced Algorithms
 Lens bending algorithms to remove signal distortions
 Touch suppression algorithms to remove unintentional touches
 Palm Recovery Algorithm for quick restoration to normal state
 Panel / Cover Glass Support
 Supports fully-laminated sensors, touch-on-lens stack-ups and on-cell designs
 Works with PET or glass, including curved profiles
 Glass from 0.55 to 2.5 mm, dependent on screen size and touch size
 Plastic from 0.2 mm to 1.2 mm, dependent on screen size and touch size
 Works with all proprietary sensor patterns recommended by Atmel
 Compatible with True Single Layer designs

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Features

 Keys
 Up to 64 nodes can be allocated as mutual capacitance sensor keys (subject to other configurations)
 Adjacent Key Suppression® (AKS®) technology is supported for false touch prevention
 Power Saving
 Programmable timeout for automatic transition from active to idle states
 Pipelined analog sensing detection and digital processing to optimize system power efficiency
 Application Interfaces
 I2C-compatible slave mode: Standard/Fast mode 400 kHz, Fast-plus mode 1 MHz, High-speed mode up to 3.4 MHz
 USB composite device, full speed (12 Mbps)
 HID-I2C interface for Microsoft® Windows® 8.x
 Interrupt to indicate when a message is available
 Power Supply
 Digital (Vdd) 3.3 V nominal
 Analog (AVdd) 3.3 V nominal
 Host interface I/O voltage (VddIO) 1.8 V to 3.3 V nominal
 High voltage external X line drive (XVdd) 10.5 V maximum (1)
 Package
 162-ball UFBGA 10 × 5 × 0.6 mm, 0.5 mm pitch
 Environmental Conditions
 Operating temperature –40C to +85C

1. This is an Absolute Maximum value – the Nominal value must be set lower to allow for component tolerances.

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Table of Contents

Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table of Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1. Overview of mXT1664T2-C2U . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2. Connection and Configuration Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1 Pin Configuration – UFBGA 162 Balls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3. Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.1 UFBGA 162 Balls – I2C Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.2 UFBGA 162 Balls – USB Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.3 Schematic Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4. Circuit Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 Decoupling Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.2 I2C Line Pull-up Resistors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.3 Supply Quality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.4 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.5 Suggested Voltage Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5. Touchscreen Basics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.1 Sensor Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.2 Electrode Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.3 Scanning Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.4 Touchscreen Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

6. Sensor Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
6.1 Mutual Capacitance Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

7. Power-up / Reset Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

7.1 Power-up and Reset Sequence – VddIO Enabled after Vdd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

8. Detailed Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.1 Touch Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.2 Operational Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.3 Detection Integrator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.4 Sensor Acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.5 Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.6 Digital Filtering and Noise Suppression . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.7 Shieldless Support and Display Noise Suppression. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.8 Retransmission Compensation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.9 Grip Suppression . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.10 Lens Bending . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.11 Glove Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.12 Stylus Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.13 Unintentional Touch Suppression. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8.14 Adjacent Key Suppression Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8.15 GPIO Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

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9. Host Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
9.1 Communication Mode Selection (COMMSEL Pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
9.2 I2C Mode Selection (I2CMODE Pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
9.3 I2C Address Selection (ADDSEL Pin). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

10. I2C Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

10.1 I2C Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
10.2 Writing To the Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
10.3 I2C Writes in Checksum Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
10.4 Reading From the Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
10.5 Reading Status Messages with DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
10.6 CHG Line . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
10.7 SDA, SCL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
10.8 Clock Stretching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

11. HID-I2C Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

11.1 I2C Addresses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
11.2 Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
11.3 HID Descriptor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
11.4 HID-I2C Report IDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
11.5 Generic HID-I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
11.6 Digitizer HID-I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
11.7 CHG Line . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
11.8 SDA, SCL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
11.9 Clock Stretching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
11.10 Power Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
11.11 Microsoft Windows Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

12. USB Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

12.1 Endpoint Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
12.2 Composite Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
12.3 Interface 0 (Generic HID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
12.4 Interface 1 (Digitizer HID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
12.5 USB Suspend Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

13. PCB Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

13.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
13.2 Printed Circuit Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
13.3 Supply Rails and Ground Tracking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
13.4 Power Supply Decoupling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
13.5 Single Supply Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
13.6 Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
13.7 Analog I/O. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
13.8 Component Placement and Tracking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
13.9 EMC and Other Observations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

14. Getting Started with mXT1664T2-C2U . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

14.1 Establishing Contact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
14.2 Using the Object Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
14.3 Writing to the Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
14.4 Reading from the Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
14.5 Configuring the Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

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Table of Contents

15. Debugging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
16. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
16.1 Absolute Maximum Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
16.2 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
16.3 Test Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
16.4 Current Consumption – I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
16.5 Current Consumption – USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
16.6 Deep Sleep Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
16.7 Power Supply Ripple and Noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
16.8 Timing Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
16.9 Input/Output Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
16.10 I2C Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
16.11 USB Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
16.12 HID-I2C Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
16.13 Touch Accuracy and Repeatability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
16.14 Thermal Packaging. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
16.15 ESD Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
16.16 Soldering Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
16.17 Moisture Sensitivity Level (MSL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

17. Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

17.1 Part Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
17.2 Orderable Part Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
17.3 Mechanical Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

Appendix A. QMatrix Primer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

A.1 Acquisition Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
A.2 Moisture Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
A.3 Interference Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

Appendix B. I2C Basics (I2C Operation) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

B.1 Interface Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
B.2 Transferring Data Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
B.3 START and STOP Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
B.4 Address Byte Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
B.5 Data Byte Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
B.6 Combining Address and Data Bytes into a Transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

Appendix C. Glossary of Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

Associated Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

mXT1664T2-C2U 1.1 [Datasheet] 5

9998DX–AT42–02/15
Overview of mXT1664T2-C2U

1. Overview of mXT1664T2-C2U

1.1 Introduction
The Atmel maXTouch family of touch controllers brings industry-leading capacitive touch performance to customer
applications. The mXT1664T2-C2U features the latest generation of Atmel Adaptive Sensing technology that utilizes a
hybrid mutual- and self-capacitive sensing system in order to deliver unparalleled touch features and a robust user
experience.
 Patented capacitive sensing method – The mXT1664T2-C2U uses a unique charge-transfer acquisition engine
to implement the Atmel-patented QMatrix® capacitive sensing method. Coupled with a state-of-the-art CPU, the
entire touchscreen sensing solution can measure, classify and track number of individual finger touches with a
high degree of accuracy in the shortest response time.
 Capacitive Touch Engine (CTE) – The mXT1664T2-C2U features an acquisition engine, which uses an optimal
measurement approach to ensure almost complete immunity from parasitic capacitance on the receiver input lines.
The engine includes sufficient dynamic range to cope with anticipated touchscreen self and mutual capacitances,
which allows great flexibility for use with the Atmel proprietary sensor pattern designs. One- and two-layer ITO
sensors are possible using glass or PET substrates.
 Touch detection – The mXT1664T2-C2U allows for both mutual- and self-capacitance measurements, with the
self-capacitance measurements being used to augment the mutual-capacitance measurements to produce reliable
touch information.
When self-capacitance measurements are enabled, touch classification is achieved using both mutual- and self-
capacitance touch data. This has the advantage that both types of measurement systems can work together to
detect touches under a wide variety of circumstances.
During idle mode, the device performs self-capacitance touch scans. When a touch is detected, the device starts
performing mutual-capacitance touch scans as well as self capacitance scans.
Mutual-capacitance touch data is used wherever possible to classify touches as this has greater granularity than
self-capacitance measurements and provides positional information on touches. For this reason, multiple touches
can only be determined by mutual-capacitance touch data. If the self-capacitance touch processing detects
multiple touches, touchscreen processing is skipped until mutual-capacitance touch data is available.
Self-capacitance measurements, on the other hand, allow for the detection of single touches in extreme case,
such as single thick-glove touches, when touches can only be detected by self-capacitance data and may be
missed by mutual-capacitance touch detection.
 Display Noise Cancellation – A combination of analog circuitry, hardware noise processing, and firmware that
combats display noise without requiring additional listening channels or synchronization to display timing. This
enables the use of shieldless touch sensor stacks, including touch-on-lens.
 Noise filtering – Hardware noise processing in the capacitive touch engine provides enhanced autonomous
filtering and allows a broad range of noise profiles to be handled. The result is good performance in the presence
of charger and LCD noise.
 Processing power – The main CPU has two powerful microsequencer coprocessors under its control consuming
low power. This system allows the signal acquisition, preprocessing, postprocessing and housekeeping to be
partitioned in an efficient and flexible way.
 Interpreting user intention – The Atmel hybrid mutual- and self-capacitance method provides unambiguous
multitouch performance. Algorithms in the mXT1664T2-C2U provide optimized touchscreen position filtering for
the smooth tracking of touches, responding to a user's intended touches while preventing false touch triggered by
ambient noise or conductive material on the sensor surface, such as water. The suppression of unintentional
touches from the user’s gripping fingers, resting palm or touching cheek or ear also help ensure that the user’s
intentions are correctly interpreted.

mXT1664T2-C2U 1.1 [Datasheet] 6

9998DX–AT42–02/15
 2.

2.1
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

A
SCL RESET VDDIO DS0 Y68 Y64 Y60 AVDD GND Y50 Y46 Y42 AVDD GND X38 X39 X40 RSVD RSVD

B
SDA USBDM GND Y70 Y67 Y63 Y59 Y56 Y53 Y49 Y45 Y41 Y38 VDDCORE X33 X34 X35 X36 X37

C
USBDP COMMSEL AVDD Y69 Y66 Y62 Y58 Y55 Y52 Y48 Y44 Y40 Y37 GND X28 X29 X30 X31 X32
Connection and Configuration Information

ADDSEL

D
I2CMODE NOISE_IN GND GND Y65 Y61 Y57 Y54 Y51 Y47 Y43 Y39 Y36 XVDD X23 X24 X25 X26 X27
Pin Configuration – UFBGA 162 Balls

E
CHG DBG_SS AVDD GND GND GND X19 X20 X21 X22
GPIO0
Connection and Configuration Information

F
GPIO1 GPIO2 GND GND Y29 Y25 Y21 Y18 Y15 Y11 Y7 Y3 Y0 XVDD X14 X15 X16 X17 X18

G
GPIO3 GPIO4 VDDIO Y33 Y30 Y26 Y22 Y19 Y16 Y12 Y8 Y4 Y1 GND X9 X10 X11 X12 X13

H
GPIO5 DBG_CLK VDDIN Y34 Y31 Y27 Y23 Y20 Y17 Y13 Y9 Y5 Y2 XVDD X4 X5 X6 X7 X8
XIN

J
DBG_DATA TEST VDDCORE Y35 Y32 Y28 Y24 AVDD GND Y14 Y10 Y6 AVDD GND VREGBOOST X0 X1 X2 X3
XOUT

9998DX–AT42–02/15
mXT1664T2-C2U 1.1 [Datasheet]
Top View

7
Connection and Configuration Information

Table 2-1. Pin Listing – UFBGA 162 Balls

Pin Name Type Description If Unused...

A1 SCL OD Serial clock input Connect to VDD (USB

Mode)

A2 RESET I Reset low. Connection to host system is recommended Pull up to VddIO

A3 VDDIO P Digital power –

A4 DS0 O Driven Shield signal; used as guard track between X/Y signals and Leave open
ground

A5 Y68 S Y line connection Leave open

A6 Y64 S Y line connection Leave open

A7 Y60 S Y line connection Leave open

A8 AVDD P Analog power –

A9 GND P Ground –

A10 Y50 S Y line connection Leave open

A11 Y46 S Y line connection Leave open

A12 Y42 S Y line connection Leave open

A13 AVDD P Analog power –

A14 GND P Ground –

A15 X38 S X matrix drive line Leave open

A16 X39 S X matrix drive line Leave open

A17 X40 S X matrix drive line Leave open

A18 RSVD O Reserved Leave open

A19 RSVD O Reserved Leave open

B1 SDA OD Serial interface data Pull up to VddIO (USB

Mode)

B2 USBDM USB USB device port minus Connect to GND

B3 GND P Ground –

B4 Y70 S Y line connection Leave open

B5 Y67 S Y line connection Leave open

B6 Y63 S Y line connection Leave open

B7 Y59 S Y line connection Leave open

B8 Y56 S Y line connection Leave open

B9 Y53 S Y line connection Leave open

B10 Y49 S Y line connection Leave open

B11 Y45 S Y line connection Leave open

mXT1664T2-C2U 1.1 [Datasheet] 8

9998DX–AT42–02/15
Connection and Configuration Information

Table 2-1. Pin Listing – UFBGA 162 Balls (Continued)

Pin Name Type Description If Unused...

B12 Y41 S Y line connection Leave open

B13 Y38 S Y line connection Leave open

B14 VDDCORE P Digital core power –

B15 X33 S X matrix drive line Leave open

B16 X34 S X matrix drive line Leave open

B17 X35 S X matrix drive line Leave open

B18 X36 S X matrix drive line Leave open

B19 X37 S X matrix drive line Leave open

C1 USBDP I/O USB data port plus Leave open (USB

ADDSEL I2C address select: See Section 9.3 on page 33 mode).
Pull up/down as
required (I2C mode).

C2 COMMSEL I Communications interface selection: See Section 9.1 on page 32 –

C3 AVDD P Analog power –

C4 Y69 S Y line connection Leave open

C5 Y66 S Y line connection Leave open

C6 Y62 S Y line connection Leave open

C7 Y58 S Y line connection Leave open

C8 Y55 S Y line connection Leave open

C9 Y52 S Y line connection Leave open

C10 Y48 S Y line connection Leave open

C11 Y44 S Y line connection Leave open

C12 Y40 S Y line connection Leave open

C13 Y37 S Y line connection Leave open

C14 GND P Ground –

C15 X28 S X matrix drive line Leave open

C16 X29 S X matrix drive line Leave open

C17 X30 S X matrix drive line Leave open

C18 X31 S X matrix drive line Leave open

C19 X32 S X matrix drive line Leave open

D1 I2CMODE I Selects I2C mode: See Section 9.2 on page 32 –

D2 NOISE_IN I Charger present input Connect to GND

D3 GND P Ground –

D4 GND P Ground –

mXT1664T2-C2U 1.1 [Datasheet] 9

9998DX–AT42–02/15
Connection and Configuration Information

Table 2-1. Pin Listing – UFBGA 162 Balls (Continued)

Pin Name Type Description If Unused...

D5 Y65 S Y line connection Leave open

D6 Y61 S Y line connection Leave open

D7 Y57 S Y line connection Leave open

D8 Y54 S Y line connection Leave open

D9 Y51 S Y line connection Leave open

D10 Y47 S Y line connection Leave open

D11 Y43 S Y line connection Leave open

D12 Y39 S Y line connection Leave open

D13 Y36 S Y line connection Leave open

D14 XVDD P X line drive power –

D15 X23 S X matrix drive line Leave open

D16 X24 S X matrix drive line Leave open

D17 X25 S X matrix drive line Leave open

D18 X26 S X matrix drive line Leave open

D19 X27 S X matrix drive line Leave open

E1 CHG OD Change line interrupt Pull up to VddIO

E2 DBG_SS I/O Debug SS line; pull up to VddIO Input: Connect to GND

GPIO0 General purpose IO Output: Leave open

E3 AVDD P Analog power –

E4 GND P Ground –

E5 GND P Ground –

...

E15 GND P Ground power –

E16 X19 S X matrix drive line Leave open

E17 X20 S X matrix drive line Leave open

E18 X21 S X matrix drive line Leave open

E19 X22 S X matrix drive line Leave open

F1 GPIO1 I/O General purpose IO Input: Connect to GND

Output: Leave open

F2 GPIO2 I/O General purpose IO Input: Connect to GND

Output: Leave open

F3 GND P Ground –

F4 GND P Ground –

mXT1664T2-C2U 1.1 [Datasheet] 10

9998DX–AT42–02/15
Connection and Configuration Information

Table 2-1. Pin Listing – UFBGA 162 Balls (Continued)

Pin Name Type Description If Unused...

F5 Y29 S Y line connection Leave open

F6 Y25 S Y line connection Leave open

F7 Y21 S Y line connection Leave open

F8 Y18 S Y line connection Leave open

F9 Y15 S Y line connection Leave open

F10 Y11 S Y line connection Leave open

F11 Y7 S Y line connection Leave open

F12 Y3 S Y line connection Leave open

F13 Y0 S Y line connection Leave open

F14 XVDD P X line drive power –

F15 X14 S X matrix drive line Leave open

F16 X15 S X matrix drive line Leave open

F17 X16 S X matrix drive line Leave open

F18 X17 S X matrix drive line Leave open

F19 X18 S X matrix drive line Leave open

G1 GPIO3 I/O General purpose IO Input: Connect to GND

Output: Leave open

G2 GPIO4 I/O General purpose IO Input: Connect to GND

Output: Leave open

G3 VDDIO P Host interface power –

G4 Y33 S Y line connection Leave open

G5 Y30 S Y line connection Leave open

G6 Y26 S Y line connection Leave open

G7 Y22 S Y line connection Leave open

G8 Y19 S Y line connection Leave open

G9 Y16 S Y line connection Leave open

G10 Y12 S Y line connection Leave open

G11 Y8 S Y line connection Leave open

G12 Y4 S Y line connection Leave open

G13 Y1 S Y line connection Leave open

G14 GND P Ground –

G15 X9 S X matrix drive line Leave open

G16 X10 S X matrix drive line Leave open

mXT1664T2-C2U 1.1 [Datasheet] 11

9998DX–AT42–02/15
Connection and Configuration Information

Table 2-1. Pin Listing – UFBGA 162 Balls (Continued)

Pin Name Type Description If Unused...

G17 X11 S X matrix drive line Leave open

G18 X12 S X matrix drive line Leave open

G19 X13 S X matrix drive line Leave open

H1 GPIO5 I/O General purpose IO Input: Connect to GND

Output: Leave open

H2 DBG_CLK O Debug clock Output: Leave open

XIN I External oscillator input Input: Connect to GND

H3 VDDIN P Digital power –

H4 Y34 S Y line connection Leave open

H5 Y31 S Y line connection Leave open

H6 Y27 S Y line connection Leave open

H7 Y23 S Y line connection Leave open

H8 Y20 S Y line connection Leave open

H9 Y17 S Y line connection Leave open

H10 Y13 S Y line connection Leave open

H11 Y9 S Y line connection Leave open

H12 Y5 S Y line connection Leave open

H13 Y2 S Y line connection Leave open

H14 XVDD P High voltage power –

H15 X4 S X matrix drive line Leave open

H16 X5 S X matrix drive line Leave open

H17 X6 S X matrix drive line Leave open

H18 X7 S X matrix drive line Leave open

H19 X8 S X matrix drive line Leave open

J1 DBG_DATA O Debug data Leave open

XOUT External oscillator output

J2 TEST – Reserved for factory use; leave open Leave open

J3 VDDCORE P Digital power –

J4 Y35 S Y line connection Leave open

J5 Y32 S Y line connection Leave open

J6 Y28 S Y line connection Leave open

J7 Y24 S Y line connection Leave open

J8 AVDD P Analog power –

mXT1664T2-C2U 1.1 [Datasheet] 12

9998DX–AT42–02/15
Connection and Configuration Information

Table 2-1. Pin Listing – UFBGA 162 Balls (Continued)

Pin Name Type Description If Unused...

J9 GND P Ground –

J10 Y14 S Y line connection Leave open

J11 Y10 S Y line connection Leave open

J12 Y6 S Y line connection Leave open

J13 AVDD P Analog power –

J14 GND P Ground –

J15 VREGBOOST O Voltage booster control Leave open

J16 X0 S X matrix drive line Leave open

J17 X1 S X matrix drive line Leave open

J18 X2 S X matrix drive line Leave open

J19 X3 S X matrix drive line Leave open

Key:
I Input only O Output only I/O Input or output
OD Open drain output P Ground or power S Sense pin

mXT1664T2-C2U 1.1 [Datasheet] 13

9998DX–AT42–02/15
Schematic

3. Schematic

3.1 UFBGA 162 Balls – I2C Mode

VDD
22nF
AVDD

VDDIO GND
22nF
2.2uF
GND
1uF
See Notes GND
VDDIO XVDD
GND

2.2uF

Y70
Y69
Y68
Y67
Y66
Y65
Y64
Y63
Y62
Y61
Y60
Y59
Y58
Y57
Y56
Y55
Y54
Y53
Y52
Y51
Y50
Y49
Y48
Y47
Y46
Y45
Y44
Y43
Y42
Y41
Y40
Y39
Y38
Y37
Y36
10k

D14

H14

A13

A10

D10
A11

D11
A12

D12

D13
B14

B10
C10

B11
C11

B12
C12

B13
C13
F14

J13
A8

H3

A3
G3

A5

D5
A6

D6
A7

D7

D8

D9
C3

B4
C4

B5
C5

B6
C6

B7
C7

B8
C8

B9
C9
E3
J8

J3
GND XVDD
XVDD
XVDD

AVDD
AVDD
AVDD
AVDD
AVDD
AVDD

VDDIN

VDDIO
VDDIO
VDDCORE
VDDCORE

Y70
Y69
Y68
Y67
Y66
Y65
Y64
Y63
Y62
Y61
Y60
Y59
Y58
Y57
Y56
Y55
Y54
Y53
Y52
Y51
Y50
Y49
Y48
Y47
Y46
Y45
Y44
Y43
Y42
Y41
Y40
Y39
Y38
Y37
Y36
J2
TEST
GPIO0/DBG_SS E2 J16 X0
GPIO0/DBG_SS X0
J17 X1
X1
J18 X2
X2
VDDIO J19 X3
X3
GPIO1 F1 H15 X4
GPIO1 X4
H16 X5
X5
GPIO2 F2 H17 X6
3.3k 3.3k 3.3k GPIO2 X6
H18 X7
X7
H19 X8
X8
G15 X9
X9
SCL A1 G16 X10
SCL X10
G17 X11
X11
SDA B1 G18 X12
SDA X12
G19 X13
X13
CHG E1 F15 X14
CHG X14
F16 X15
X15
F17 X16
X16
F18 X17
X17
GPIO5 H1 F19 X18
GPIO5 X18
E16 X19
X19
See Notes ADDSEL C1 E17 X20
ADDSEL/USBDP X20
E18 X21
X21
B2
USBDM mXT1664T2-C2U X22
E19
D15
X22
X23
X23
GPIO3 G1 D16 X24
GPIO3 X24
D17 X25
X25
D18 X26
X26
D19 X27
X27
COMMSEL C2 C15 X28
COMMSEL X28
C16 X29
X29
I2CMODE D1 C17 X30
I2CMODE X30
GND C18 X31
X31
NOISE_IN D2 C19 X32
NOISE_IN X32
B15 X33
X33
VDDIO GPIO4 G2 B16 X34
GPIO4 X34
B17 X35
X35
B18 X36
X36
B19 X37
X37
10k DBG_CLK H2
DBG_CLK/XIN X38
A15 X38
A16 X39
X39
DBG_DATA J1 A17 X40
DBG_DATA/XOUT X40
RESET A2
RESET
A4 DRIVEN_SHIELD
DS0
VREGBOOST

Creset A18
RSVD
10nF RSVD
A19
See Notes
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND

Y35
Y34
Y33
Y32
Y31
Y30
Y29
Y28
Y27
Y26
Y25
Y24
Y23
Y22
Y21
Y20
Y19
Y18
Y17
Y16
Y15
Y14
Y13
Y12
Y11
Y10
Y9
Y8
Y7
Y6
Y5
Y4
Y3
Y2
Y1
Y0
GND
VREGBOOST J15

D4
E4
E5
A9
A14
B3
C14
D3
E15
F3
F4
G14
J9
J14

J4
H4
G4
J5
H5
G5
F5
J6
H6
G6
F6
J7
H7
G7
F7
H8
G8
F8
H9
G9
F9
J10
H10
G10
F10
J11
H11
G11
F11
J12
H12
G12
F12
H13
G13
F13
Y35
Y34
Y33
Y32
Y31
Y30
Y29
Y28
Y27
Y26
Y25
Y24
Y23
Y22
Y21
Y20
Y19
Y18
Y17
Y16
Y15
Y14
Y13
Y12
Y11
Y10
Y9
Y8
Y7
Y6
Y5
Y4
Y3
Y2
Y1
Y0

GND

See Notes

See “Schematic Notes” on page 16.

mXT1664T2-C2U 1.1 [Datasheet] 14

9998DX–AT42–02/15
Schematic

3.2 UFBGA 162 Balls – USB Mode

VDD

22nF

AVDD
GND
VDDIO 22nF
2.2uF

1uF GND

XVDD GND

GND

2.2uF

Y70
Y69
Y68
Y67
Y66
Y65
Y64
Y63
Y62
Y61
Y60
Y59
Y58
Y57
Y56
Y55
Y54
Y53
Y52
Y51
Y50
Y49
Y48
Y47
Y46
Y45
Y44
Y43
Y42
Y41
Y40
Y39
Y38
Y37
Y36
D14

H14

A13

A10

D10
A11

D11
A12

D12

D13
B14

B10
C10

B11
C11

B12
C12

B13
C13
F14

J13
A8

H3

A3
G3

A5

D5
A6

D6
A7

D7

D8

D9
C3

B4
C4

B5
C5

B6
C6

B7
C7

B8
C8

B9
C9
E3
J8

J3
GND

XVDD
XVDD
XVDD

AVDD
AVDD
AVDD
AVDD
AVDD
AVDD

VDDIN

VDDIO
VDDIO
VDDCORE
VDDCORE

Y70
Y69
Y68
Y67
Y66
Y65
Y64
Y63
Y62
Y61
Y60
Y59
Y58
Y57
Y56
Y55
Y54
Y53
Y52
Y51
Y50
Y49
Y48
Y47
Y46
Y45
Y44
Y43
Y42
Y41
Y40
Y39
Y38
Y37
Y36
J2
TEST
GPIO0 E2 J16 X0
GPIO0/DBG_SS X0
J17 X1
X1
J18 X2
VDDIO X2
J19 X3
X3
GPIO1 F1 H15 X4
GPIO1 X4
H16 X5
X5
3.3k 3.3k 3.3k GPIO2 F2
GPIO2 X6
H17 X6
H18 X7
X7
H19 X8
X8
G15 X9
X9
SCL A1 G16 X10
SCL X10
G17 X11
X11
SDA B1 G18 X12
SDA X12
G19 X13
X13
CHG E1 F15 X14
CHG X14
F16 X15
X15
GPIO4 G2 F17 X16
GPIO4 X16
F18 X17
X17
GPIO5 H1 F19 X18
GPIO5 X18
E16 X19
X19
USBDP C1 E17 X20
ADDSEL/USBDP X20
E18 X21
X21
USBDM B2
USBDM
mXT1664T2-C2U X22
E19 X22
D15 X23
X23
NOISE_IN D2 D16 X24
NOISE_IN X24
D17 X25
X25
GPIO3 G1 D18 X26
GPIO3 X26
D19 X27
VDDIO X27
C15 X28
C2 X28
COMMSEL C16 X29
X29
D1 C17 X30
I2CMODE X30
C18 X31
X31
C19 X32
X32
B15 X33
X33
GND B16 X34
X34
B17 X35
X35
H2 B18 X36
DBG_CLK/XIN X36
B19 X37
X37
15pF X38
A15 X38
1

VDDIO A16 X39

16 MHz X39
GND A17 X40
XTAL X40
2

10k J1
DBG_DATA/XOUT DS0
A4 DRIVEN SHIELD

15pF RSVD
A18
A19
GND RSVD
RESET A2
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND

RESET
Y35
Y34
Y33
Y32
Y31
Y30
Y29
Y28
Y27
Y26
Y25
Y24
Y23
Y22
Y21
Y20
Y19
Y18
Y17
Y16
Y15
Y14
Y13
Y12
Y11
Y10
Y9
Y8
Y7
Y6
Y5
Y4
Y3
Y2
Y1
Y0
Creset
10nF
VREGBOOST J15

D4
E4
E5
A9
A14
B3
C14
D3
E15
F3
F4
G14
J9
J14

J4
H4
G4
J5
H5
G5
F5
J6
H6
G6
F6
J7
H7
G7
F7
H8
G8
F8
H9
G9
F9
J10
H10
G10
F10
J11
H11
G11
F11
J12
H12
G12
F12
H13
G13
F13
See Notes
GND
Y35
Y34
Y33
Y32
Y31
Y30
Y29
Y28
Y27
Y26
Y25
Y24
Y23
Y22
Y21
Y20
Y19
Y18
Y17
Y16
Y15
Y14
Y13
Y12
Y11
Y10
Y9
Y8
Y7
Y6
Y5
Y4
Y3
Y2
Y1
Y0

GND

See Notes

See “Schematic Notes” on page 16.

mXT1664T2-C2U 1.1 [Datasheet] 15

9998DX–AT42–02/15
Schematic

3.3 Schematic Notes

3.3.1 Number of Available Nodes

Although 41 X lines and 71 Y lines are provided, only a maximum of 1792 nodes on the matrix can be used for the
touchscreen.

3.3.2 VDDCORE
VddCore is internally generated from the Vdd 3.3 V power supply. To guarantee stability of the internal voltage regulator,
a minimum value of 1 µF must be used for decoupling on VDDCORE.

3.3.3 DBG_SS Line

The DBG_SS line shares the same ball as GPIO0. Only one of these two functions can be chosen and the circuit should
be designed accordingly.
In I2C mode, pull-up resistor R2 in the schematics is optional and should be present only if the ball is used as DBG_SS.
For more information refer to Application Note: QTAN0050 Using the maXTouch Debug Port.

3.3.4 RESET Line

The RESET line is shown on the schematics with a 10 nF capacitor to ground. This capacitor is optional but may help if
ESD issues are encountered.

3.3.5 Decoupling capacitors

1. All decoupling capacitors must be X7R or X5R and placed <5 mm away from the balls for which they act as bypass
capacitors. Pins of the same type can share a capacitor provided no pin is more than 10 mm from the capacitor.
2. The schematics on the previous pages show the minimum capacitors required if the device is placed on the
system board. If the ball configuration means that sharing a bypass capacitor is not possible (distance between
balls too great to satisfy condition 1 or routing difficulty), then the number of base capacitors should be increased.
Note that this requires that the voltage regulator supplies for AVdd, Vdd and VddIO are clean and noise free. It also
assumes that the track length between the capacitors and on-board power supplies is < 50 mm.
3. If an active tail design is used, the voltage regulators are likely to be some distance from the device and it may be
necessary to implement additional decoupling. In this case, a parallel combination of capacitors is recommended
to give high and low frequency filtering as shown in Figure 3-1.

mXT1664T2-C2U 1.1 [Datasheet] 16

9998DX–AT42–02/15
Schematic

Figure 3-1. Additional Recommended Decoupling Capacitors

XVDD VDD
2.2 µF 22 nF

22 nF 2.2 µF

GND GND
VDDIO
22 nF

AVDD GND
2.2 µF 1 µF

22 nF 22 nF

GND GND

See pinout for exact

AVDD
AVDD

XVDD
XVDD

XVDD

VDD

VDDCORE
VDDIO

VDDIO
number and location
of balls for each
supply.

NOTES: 1. Additional base capacitors may be required if balls are widely separated.
2. Recommended additional decoupling capacitors are shown in blue

3.3.6 Low Drop-Out Voltage Regulators (LDOs)

In applications where the VddIO supply is at the same voltage level as Vdd and AVdd (that is, 3.3 V) it is permissible to
use a single LDO for all supply rails (AVDD/VDD/VDDIO/VDDHV). A suitable circuit is shown in Figure 3-2.

Figure 3-2. Low Drop-Out Regulators

AVDD/VDD/VDDIO/VDDHV

SUPPLY FROM HOST

8 1
VIN VOUT
2
SENSE/ADI
5
SHDN
1 uF 10 uF
10 nF
GND
GND
GND

4
BYP
3
6
7

GND GND GND

Where poor or inadequate tracking or decoupling leads to high noise levels on the supply rails, Atmel recommends that a
separate low drop-out voltage regulator supply is used for the AVdd supply.
See Section 4.5 on page 20 for further details. A list of approved regulators is given in Table 4-1 on page 21.

mXT1664T2-C2U 1.1 [Datasheet] 17

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Schematic

3.3.7 Voltage Booster

The XVdd power can be supplied using the Voltage Booster shown in Figure 3-3 or an external regulated supply. See
Section 16.2 on page 68 for the supply voltages possible and refer to the mXT1664T2-C2U 1.1 Protocol Guide for
information on how to set the required voltage. To run the High Voltage boost controller in a low frequency mode, a larger
inductor will need to be fitted to the boost circuit.
If an external supply is used, the components in Figure 3-3 can be omitted and VREGBOOST should be left open circuit.

Figure 3-3. XVdd Supply Circuit

VREGBOOST

VDDHV L1 D1 XVDD
1 3
10 R 10uH
2.2uF 22nF 10uF 50V

3
GND
GND
Q1
1
Cboost 47 R
33pF 50V 33pF

2
DNF - See note below
GND
GND GND

Notes: 1. Do not fit capacitor Cboost but make provision for it next to the VREGBOOST
ball. This capacitor may be required to minimize RF noise issues.
2. See Section 3.3.7.1 for suggested suppliers for L1 and Q1.

3.3.7.1 Suggested Component Suppliers

D1 is a Schottky Diode. Possible suppliers are shown in Table 3-1.
:

Table 3-1. Suitable Schottky Diode (D1)

Manufacturer Device

Various BAT54M3TG5

Various 1N4148WX

L1 is a 10 µH inductor in a 1812 case. Possible suppliers are shown in Table 3-2 on page 18.
:

Table 3-2. Suitable 10 µH Inductors (L1)

Manufacturer Device

Panasonic ELJFB100JF

TDK MLZ1608M100WT

TDK MLZ2012M100WT000

mXT1664T2-C2U 1.1 [Datasheet] 18

9998DX–AT42–02/15
Schematic

Q1 is an N-channel 20 V, 700 mA, MOSFET. Possible suppliers are shown in Table 3-3.
:

Table 3-3. Suitable MOSFETs (Q1)

Manufacturer Device

ON Semiconductor NTA4153NT1G

Toshiba SSM3K56FS

NXP PMR290UNE
(Note: NXP do not recommend use in new designs)

mXT1664T2-C2U 1.1 [Datasheet] 19

9998DX–AT42–02/15
Circuit Components

4. Circuit Components

4.1 Decoupling Capacitors

Each power supply pin requires decoupling as described in Section 3.3 on page 16. The capacitors should be ceramic
X7R or X5R.
The PCB traces connecting the decoupling capacitors to the pins of the device must not exceed 10 mm in length. This
limits any stray inductance that would reduce filtering effectiveness.

4.2 I2C Line Pull-up Resistors

The values for pull-up resistors on SDA and SCL need to be chosen to ensure rise times are within I2C specification – if
the rise time is too long the overall clock rate will be reduced.
If using a VddIO at the low end of the allowable range it is likely that the pull-up resistor values will need to be reduced
from those shown on the schematic.

4.3 Supply Quality

While the device has good Power Supply Rejection Ratio properties, poorly regulated and/or noisy power supplies can
significantly reduce performance.
Always operate the device with a well-regulated and clean AVdd and XVdd supply. It supplies the sensitive analog
stages in the device.

4.4 Oscillator
A 16 MHz crystal oscillator must be connected to the device when the device is operating in USB mode. A crystal
oscillator with a minimum accuracy of 100 ppm must be used.
An external oscillator is not needed in I2C mode.

4.5 Suggested Voltage Regulators

An LDO regulator should be chosen that provides adequate output capability, low noise, good load regulation and step
response.
Suitable fixed output LDO devices are shown in Table 4-1 on page 21.
With a single regulator, PCB layout is more critical than with multiple LDO regulators, and special care with the PCB
layout should be taken. See Section 13.5 on page 62 for information concerning PCB design with a single LDO.

4.5.1 Multiple Voltage Regulator Supply

The AVdd supply stability is critical for the device because this supply interacts directly with the analog front end. If noise
problems exist when using a single LDO regulator, Atmel recommends that the supply for the analog section of the board
be supplied by a regulator that is separate from the logic supply and high voltage regulators. This reduces the amount of
noise injected into the sensitive, low signal level parts of the design.

mXT1664T2-C2U 1.1 [Datasheet] 20

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Circuit Components

4.5.2 Suggested Voltage Regulators

The voltage regulators listed in Table 4-1 have been tested and found to work well with the mXT1664T2-C2U.
Table 4-1. Suitable LDO Regulators

Manufacturer Device Current Rating (mA)

Analog Devices ADP122/ADP123 300

Diodes Inc. AP2125 300

Diodes Inc. AP7335 300

Linear Technology LT1763CS8-3.3 500

NXP LD6836 300

Texas Instruments LP2981 100
Texas Instruments LP3981 300
Texas Instruments LP5996 150 / 300
1. Some manufacturers claim that minimal or no capacitance is required for correct regulator operation. However, in all cases, a minimum
of a 1.0 µF ceramic, low ESR capacitor at the input and output of these devices should be used. The manufacturer’s datasheets should
always be referred to when selecting capacitors for these devices and the typical recommended values, types and dielectrics adhered
to.
2. A“soft-start” regulator with excellent noise and load step regulation will be needed to satisfy the XVdd supply requirements.
1% resistors should be used to define the nominal output voltage. If 5% resistors are used, the nominal XVdd voltage must be reduced
accordingly to ensure that the recommended voltage range is adhered to.

4.5.3 LDO Selection Criteria

The LDO devices in Table 4-1 have been proved to provide satisfactory performance in Atmel maxTouch controllers,
however, if it is desired to use an alternative LDO, certain performance criteria should be verified before using the device.
These are:
 Stable with low value multi-layer ceramic capacitors on input and output – actual values will be device dependent,
but it is good design practice to use values greater than the minimum specified in the LDO regulator data sheet
 Low output noise – less than 100 µV RMS over the range 10 Hz to 1 MHz
 Good load transient response – this should be less than 35 mV peak when a load step change of 100 mA is
applied at the device output terminal
 Input supply requirement of between 4.5 V and 5.5 V
 Low quiescent current to improve battery life
 Thermal and current limit overload protection
 Ideally, select an LDO with common footprint, to allow interchanging between regulators

mXT1664T2-C2U 1.1 [Datasheet] 21

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Touchscreen Basics

5. Touchscreen Basics

5.1 Sensor Construction

A touchscreen is usually constructed from a number of transparent electrodes. These are typically on a glass or plastic substrate.
They can also be made using non-transparent electrodes, such as copper or carbon. Electrodes are constructed from Indium
Tin Oxide (ITO) or metal mesh. Thicker electrodes yield lower levels of resistance (perhaps tens to hundreds of /square) at the
expense of reduced optical clarity. Lower levels of resistance are generally more compatible with capacitive sensing. Thinner
electrodes lead to higher levels of resistance (perhaps hundreds to thousands of /square) with some of the best optical
characteristics.
Interconnecting tracks can cause problems. The excessive RC time constants formed between the resistance of the track and
the capacitance of the electrode to ground can inhibit the capacitive sensing function. In such cases, the tracks should be
replaced by screen printed conductive inks (non-transparent) outside the touchscreen viewing area.

5.2 Electrode Configuration

The specific electrode designs used in Atmel touchscreens are the subject of various patents and patent applications.
Further information is available on request.
The device supports various configurations of electrodes as summarized in Section 6. on page 24.

5.3 Scanning Sequence

All nodes are scanned in sequence by the device. There is a full parallelism in the scanning sequence to improve overall
response time. The nodes are scanned by measuring capacitive changes at the intersections formed between the first X line
and all the Y lines. Then the intersections between the next X line and all the Y lines are scanned, and so on, until all X and Y
combinations have been measured.
The device can be configured in various ways. It is possible to disable some nodes so that they are not scanned at all. This can
be used to improve overall scanning time.

5.4 Touchscreen Sensitivity

5.4.1 Adjustment
Sensitivity of touchscreens can vary across the extents of the electrode pattern due to natural differences in the parasitic
capacitance of the interconnections, control chip, and so on. An important factor in the uniformity of sensitivity is the
electrode design itself. It is a natural consequence of a touchscreen pattern that the edges form a discontinuity and
hence tend to have a different sensitivity. The electrodes at the far edges do not have a neighboring electrode on one
side and this affects the electric field distribution in that region.
A sensitivity adjustment is available for the whole touchscreen. This adjustment is a basic algorithmic threshold that
defines when a node is considered to have enough signal change to qualify as being in detect.

5.4.2 Mechanical Stackup

The mechanical stackup refers to the arrangement of material layers that exist above and below a touchscreen. The
arrangement of the touchscreen in relation to other parts of the mechanical stackup has an effect on the overall
sensitivity of the screen. QMatrix technology has an excellent ability to operate in the presence of ground planes close to
the sensor. QMatrix sensitivity is attributed more to the interaction of the electric fields between the transmitting (X) and
receiving (Y) electrodes than to the surface area of these electrodes. For this reason, stray capacitance on the X or Y
electrodes does not strongly reduce sensitivity.

mXT1664T2-C2U 1.1 [Datasheet] 22

9998DX–AT42–02/15
Touchscreen Basics

Front panel dielectric material has a direct bearing on sensitivity. Plastic front panels are usually suitable up to about
1.2 mm, and glass up to about 2.5 mm (dependent upon the screen size and layout). The thicker the front panel, the
lower the signal-to-noise ratio of the measured capacitive changes and hence the lower the resolution of the
touchscreen. In general, glass front panels are near optimal because they conduct electric fields almost twice as easily
as plastic panels.
Note: Care should be taken using ultra-thin glass panels as retransmission effects can occur, which can significantly
degrade performance.

mXT1664T2-C2U 1.1 [Datasheet] 23

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Sensor Layout

6. Sensor Layout

6.1 Mutual Capacitance Matrix

The specific electrode designs used in Atmel touchscreens are the subject of various patents and patent applications.
Further information is available on request.
The physical matrix can be configured to have one or more touch objects. These are configured using the appropriate
touch objects (Multiple Touch Touchscreen T100 and Key Array T15). It is not mandatory to have all the allowable touch
objects present. The objects are disabled by default so only those that you wish to use need to be enabled. Refer to the
mXT1664T2-C2U 1.1 Protocol Guide for more information on configuring the touch objects.
The device supports various configurations of electrodes as summarized below:
 Touchscreen: 41 X × 71 Y maximum (subject to other configurations)
 Keys: Up to 64 keys in an X/Y grid
Although there are a total of 112 lines, arranged as a matrix of 41 X by 71 Y (2911 nodes), only a maximum of 1792
nodes can be used for all the touch objects on this device. The matrix can be made up of any combination of X and Y
lines in the design, provided the X and Y lines are contiguous and subject to the maximum of 1792 nodes. For example
the matrix could be constructed as a matrix of 41 X by 43 Y lines (giving 1763 nodes) or as a matrix of 25 X by 71 Y
(giving 1775 nodes). The arrangement chosen depends on the application.
When designing the physical layout of the touch panel, obey the following rules:
 Each touch object should be a regular rectangular shape in terms of the lines it uses
 The touch objects cannot share X and Y lines if self-capacitance measurement is enabled.
 It is recommended that the touchscreen should start at X0, Y0; if self-capacitance measurement is enabled, the
touchscreen must start at X0, Y0
 It is recommended that the keys should occupy the highest X and Y lines

mXT1664T2-C2U 1.1 [Datasheet] 24

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Power-up / Reset Requirements

7. Power-up / Reset Requirements

There is an internal Power-on Reset (POR) in the device.
If an external reset is to be used the device must be held in RESET (active low) while the digital (Vdd) analog (AVdd) and
I/O (VddIO) power supplies are powering up. The supplies must have reached their nominal values before the RESET
signal is deasserted (that is, goes high). This is shown in Figure 7-1. See Section 16.2 on page 68 for nominal values for
Vdd, VddIO, AVdd, and XVdd.

Figure 7-1. Power Sequencing on the mXT1664T2-C2U

AVdd

XVdd

> 0 ns

Vdd
VddIO

(VddIO)

RESET

> 90 ns

Note: 1) Vdd, VddIO, and AVdd can be powered up in any order

2) XVdd must not be powered up until after Vdd and
must obey the rate-of-rise specification

CAUTION: XVdd must not be grounded when Vdd is active as damage to the device may result.
Vdd must be applied to the device before the external XVdd supply to ensure that the different power domains in the
device are initialized correctly. Typically this can be done by connecting the enable pin of the Switched-Mode Power
Supply (SMPS) supplying XVdd to a 10 k pull-up resistor connected to the Vdd, but the XVdd can be controlled
separately by the host, if required.
After power-up, the device takes 100 ms before it is ready to start communications.
If the RESET line is released before the AVdd or external XVDD supply has reached its nominal voltage (see Figure 7-2
on page 26), then some additional operations need to be carried out by the host. There are two options open to the host
controller:
 Start the part in deep sleep mode and then send the command sequence to set the cycle time to wake the part and
allow it to run normally. Note that in this case a calibration command is also needed.
 Send a reset command.

mXT1664T2-C2U 1.1 [Datasheet] 25

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Power-up / Reset Requirements

Figure 7-2. Power Sequencing on the mXT1664T2-C2U – Late rise on AVDD or XVdd

RESET disasserted before AVdd/XVdd

at nominal level

(Nom)
AVdd or
XVdd

(Nom)

Vdd/VddIO

(VddIO)
RESET

The RESET pin can be used to reset the device whenever necessary. The RESET pin must be asserted low for at least
90 ns to cause a reset. After releasing the RESET pin the device takes 100 ms before it is ready to start communications.
It is recommended to connect the RESET pin to a host controller to allow it to initiate a full hardware reset without
requiring a power-down.
Make sure that any lines connected to the device are below or equal to Vdd during power-up. For example, if RESET is
supplied from a different power domain to the VDDIO pin, make sure that it is held low when Vdd is off. If this is not done,
the RESET signal could parasitically couple power via the RESET pin into the Vdd supply.

Note that the voltage level on the RESET pin of the device must never exceed VddIO (digital supply voltage).
A software reset command can be used to reset the chip (refer to the Command Processor T6 object in the mXT1664T2-
C2U 1.1 Protocol Guide. A software reset takes a maximum of 101 ms. After the chip has finished it asserts the CHG line
to signal to the host that a message is available. The reset flag is set in the Message Processor object to indicate to the
host that it has just completed a reset cycle. This bit can be used by the host to detect any unexpected brownout events.
This allows the host to take any necessary corrective actions, such as reconfiguration.
A checksum check is performed on the configuration settings held in the nonvolatile memory. If the checksum does not
match a stored copy of the last checksum, then this indicates that the settings have become corrupted. This is signaled to
the host by setting the configuration error bit in the message data for the Command Processor T6 object (refer to the
mXT1664T2-C2U 1.1 Protocol Guide for more information).
Note that the CHG line is briefly set as an input during power-up or reset. It is therefore particularly important that the line
should be allowed to float high via the CHG line pull-up resistor during this period. It should not be driven by the host (see
Table 16.8.3 on page 80).
At power-on, the device performs a self-test routine to check for shorts that might cause damage to the device. Refer to
the Self Test T25 object in the mXT1664T2-C2U 1.1 Protocol Guide for more details about this process.

7.1 Power-up and Reset Sequence – VddIO Enabled after Vdd

The Power-up sequence that can be used in applications where VddIO must be powered up after Vdd, is shown in
Figure 7-3.
In this case the communication interface to mXT is not driven by the host system. The RESET and CHG pins are
connected to VddIO using suitable pull-up resistors. Vdd is powered up, followed by VddIO, no more than 10 ms after
Vdd. Due to the pull-up resistors, RESET and CHG will rise with VddIO. The internal POR system ensures reliable boot
up of the device and the CHG line will go low approximately 90 ms after Vdd to notify the host that the device is ready to
start communication.

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Figure 7-3. Power-up Sequence

< 10 ms

Vdd

VddIO

No External drive. Pull-up resistor to VddIO on RESET and CHG

RESET when VddIO rises, RESET and CHG rise with VddIO

CHG

> 90 ms

7.1.1 Summary
The Power-up and RESET requirements for the maXTouch devices are summarised in the table below.

VddIO Delay
Condition External RESET (After Vdd) AVdd Power-Up Comments

1 Low at Power-up 0 ms Before RESET is If AVdd bring-up is delayed then additional

released actions will be required by the host. See notes
in Figure 7-1 on page 25
2 Not driven <10 ms Before VddIO

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8. Detailed Operation

8.1 Touch Detection

The mXT1664T2-C2U allows for both mutual and self capacitance measurements, with the self capacitance
measurements being used to augment the mutual capacitance measurements to produce reliable touch information.
When self capacitance measurements are enabled, touch classification is achieved using both mutual and self
capacitance touch data. This has the advantage that both types of measurement systems can work together to detect
touches under a wide variety of circumstances.
Mutual capacitance touch data is used wherever possible to classify touches as this has greater granularity than self
capacitance measurements and provides positional information on touches. Refer to the mXT1664T2-C2U 1.1 Protocol
Guide for more information on measurements.
Self capacitance measurements, on the other hand, allow for the detection of single touches in extreme case, such as
single thick glove touches, when touches can only be detected by self capacitance data and may be missed by mutual
capacitance touch detection.

8.2 Operational Modes

The device operates in two modes: Active (touch detected) and Idle (no touches detected). Both modes operate as a
series of burst cycles. Each cycle consists of a short burst (during which measurements are taken) followed by an
inactive sleep period. The difference between these modes is the length of the cycles. Those in idle mode typically have
longer sleep periods. The cycle length is configured using the IDLEACQINT and ACTVACQINT settings in the Power
Configuration T7. In addition, an Active to Idle Timeout setting is provided.
Refer to the mXT1664T2-C2U 1.1 Protocol Guide for full information on how these modes operate, and how to use the
settings provided.

8.3 Detection Integrator

The device features a touch detection integration mechanism. This acts to confirm a detection in a robust fashion. A
counter is incremented each time a touch has exceeded its threshold and has remained above the threshold for the
current acquisition. When this counter reaches a preset limit the sensor is finally declared to be touched. If, on any
acquisition, the signal is not seen to exceed the threshold level, the counter is cleared and the process has to start from
the beginning.
The detection integrator is configured using the appropriate touch objects (Multiple Touch Touchscreen T100, Key Array
T15). Refer to the mXT1664T2-C2U 1.1 Protocol Guide for more information.

8.4 Sensor Acquisition

The maximum acquisition time for one X line on the mXT1664T2-C2U is 5 µs. Care should be taken to ensure that the
total time for one X line configured by the Acquisition Configuration T8 and CTE Configuration T46 objects do not exceed
this (refer to the mXT1664T2-C2U 1.1 Protocol Guide for details on these objects).

8.5 Calibration
Calibration is the process by which a sensor chip assesses the background capacitance on each node. Nodes are only
calibrated on reset and when:
 The node is enabled (that is, activated).
or
 The node is already enabled and one of the following applies:
 The node is held in detect for longer than the Touch Automatic Calibration setting (refer to the mXT1664T2-
C2U 1.1 Protocol Guide for more information on TCHAUTOCAL setting in the Acquisition Configuration
object).

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 The signal delta on a node is at least the touch threshold (TCHTHR) in the anti-touch direction, while it
meets the criteria in the Touch Recovery Processes that results in a recalibration. (Refer to the mXT1664T2-
C2U 1.1 Protocol Guide for objects Acquisition Configuration T8 and Self Capacitance Configuration T111).
 The host issues a recalibrate command.
 Certain configuration settings are changed.
A status message is generated on the start and completion of a calibration.
Note that the device performs a global calibration; that is, all the nodes are calibrated together.

8.6 Digital Filtering and Noise Suppression

The mXT1664T2-C2U supports on-chip filtering of the acquisition data received from the sensor. Specifically, the
maXCharger T72 object provides an algorithm to suppress the effects of noise (for example, from a noisy charger
plugged into the user’s product). This algorithm can automatically adjust some of the acquisition parameters on-the-fly to
filter the analog-to-digital conversions (ADCs) received from the sensor.
Additional noise suppression is provided by the Self Capacitance maXCharger T108 object. Similar in both design and
configuration to the maXCharger T72 object, the Self Capacitance maXCharger T108 object is the noise suppression
interface for self capacitance touch measurements.
Noise suppression is triggered when a noise source is detected.
 A hardware trigger can be implemented using the NOISE_IN pin.
 The host driver code can indicate when a noise source is present.
 The noise suppression is also triggered based on the noise levels detected using internal line measurements.The
maXCharger T72 and Self Capacitance maXCharger T108 object selects the appropriate controls to suppress the
noise present in the system.
Refer to the mXT1664T2-C2U 1.1 Protocol Guide for more information on the maXCharger T72 and Self Capacitance
maXCharger T108 objects.

8.7 Shieldless Support and Display Noise Suppression

The mXT1664T2-C2U can support shieldless sensor design even with a noisy LCD by using the following features.
 Optimal Integration: This feature is not filtering as such, but enables the user to use a shorter integration window.
The integration window optimizes the amount of charge collected against the amount of noise collected, to ensure
an optimal SNR. This feature also benefits the system in the presence of an external noise source. This feature is
configured using the Shieldless T56 object. Refer to the mXT1664T2-C2U 1.1 Protocol Guide for more information
 Display noise suppression: This feature is based on filtering provided by the Lens Bending T65 object (See
Section 8.10 on page 30). This feature allows the device to overcome display noise simultaneously with external
noise. Refer to the mXT1664T2-C2U 1.1 Protocol Guide for more information

8.8 Retransmission Compensation

The device can limit the undesirable effects on the mutual capacitance touch signals caused by poor device coupling to
ground, such as poor sensitivity and touch break-up. This is achieved using the Retransmission Compensation T80
object. This object can be configured to allow the touchscreen to compensate for signal degradation due to these
undesirable effects. If self capacitance measurements are also scheduled, the Retransmission Compensation T80 object
will use the resultant data to enhance the compensation process.
The Retransmission Compensation T80 object is also capable of compensating for water presence on the sensor if self
capacitance measurements are scheduled. In this case, both mutual capacitance and self capacitance measurements
are used to detect moisture and then, once moisture is detected, self capacitance measurements are used to detect
single touches in the presence of moisture.
Refer to the mXT1664T2-C2U 1.1 Protocol Guide for more information on the Retransmission Compensation T80 object.

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8.9 Grip Suppression

The device has two grip suppression mechanisms to suppress false detections from a user’s grip.
Mutual grip suppression works by specifying a boundary around a touchscreen, within which touches can be suppressed
whilst still allowing touches in the center of the touchscreen. This ensures that a “rolling” hand touch (such as when a
user grips a mobile device) is suppressed. A “real” (finger) touch towards the center of the screen is allowed.
Mutual grip suppression is configured using the Grip Suppression T40 object. There is one instance of the Grip
Suppression T40 object for each Multiple Touch Touchscreen T100 object present on the device.
Refer to the mXT1664T2-C2U 1.1 Protocol Guide for more information on the Grip Suppression T40 object.
Self Capacitance grip suppression works by looking for characteristic shapes in the self capacitance measurement along
the touchscreen boundary, and thereby distinguishing between a grip and a touch further into the sensor.

8.10 Lens Bending

The device supports algorithms to eliminate disturbances from the measured signal and also to measure the bend
component.
When the sensor suffers from the screen deformation (lens bending) the signal values acquired by normal procedure are
corrupted by the disturbance component (bend). The amount of bend depends on:
 The mechanical and electrical characteristics of the sensor
 The amount and location of the force applied by the user touch to the sensor
The Lens Bending T65 object measures the bend component and compensates for any distortion caused by the bend.
As the bend component is primarily influenced by the user touch force, it can be used as a secondary source to identify
the presence of a touch. The additional benefit of the Lens Bending T65 object is that it will eliminate LCD noise as well.
Refer to the mXT1664T2-C2U 1.1 Protocol Guide for more information on the Lens Bending T65 object.

8.11 Glove Detection

The device has glove detection algorithms that process the measurement data received from the touchscreen classifying
touches as potential gloved touches.
The Glove Detection T78 object is used to detect glove touches. In Normal Mode the Glove Detection T78 object applies
vigorous glove classification to small signal touches to minimize the effect of unintentional hovering finger reporting.
Once a gloved touch is found, the Glove Detection T78 object enters Glove Confidence Mode. In this mode the device
expects the user to be wearing gloves so the classification process is much less stringent.
Refer to the mXT1664T2-C2U 1.1 Protocol Guide for more information on the Glove Detection T78 object.

8.12 Stylus Support

The mXT1664T2-C2U allows for the particular characteristics of passive stylus touches, whilst still allowing conventional
finger touches to be detected. The touch sensitivity and threshold controls for stylus touches are configured separately
from those for conventional finger touches so that both types of touches can be accommodated.
Stylus support ensures that the small touch area of a stylus registers as a touch, as this would otherwise be considered
too small for the touchscreen. Additionally, there are controls to distinguish a stylus touch from an unwanted approaching
finger (such as on the hand holding the stylus).
Passive stylus touches are configured by the Stylus T47 object. There is one instance of the Stylus T47 object for each
Multiple Touch Touchscreen T100 object present on the device.
Refer to the mXT1664T2-C2U 1.1 Protocol Guide for more information on configuring a stylus.

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8.13 Unintentional Touch Suppression

The Touch Suppression T42 object provides a mechanism to suppress false detections from unintentional touches from
a large body area, such as from a face, ear or palm. The Touch Suppression T42 object also provides Maximum Touch
Suppression to suppress all touches if more than a specified number of touches has been detected. There is one
instance of the Touch Suppression T42 object for each Multiple Touch Touchscreen T100 object present on the device.
Refer to the mXT1664T2-C2U 1.1 Protocol Guide for more information on the Touch Suppression T42 object.

8.14 Adjacent Key Suppression Technology

Adjacent Key Suppression (AKS) technology is a patented method used to detect which touch object is touched when
objects are located close together. A touch in a group of AKS objects is only indicated on the object in that group that is
touched first. This is assumed to be the intended object. Once an object in an AKS group is in detect, there can be no
further detections within that group until the object is released. Objects can be in more than one AKS group.
Note that AKS technology works best when it operates in conjunction with a detect integration setting of several
acquisition cycles.
The device has two levels of AKS. The first level works between the touch objects (Multiple Touch Touchscreen T100 and
Key Array T15). The touch objects are assigned to AKS groups. If a touch occurs within one of the touch objects in a
group, then touches within other objects inside that group are suppressed. For example, if a touchscreen and a Key
Array are placed in the same AKS group, then a touch in the touchscreen will suppress touches in the Key Array, and
vice versa.
The second level of AKS is internal AKS within an individual Key Array object (note that internal AKS is not present on
other types of touch objects, only a Key Array T15). If internal AKS is enabled, then when one key is touched, touches on
all the other keys within the Key Array are suppressed.
AKS is configured using the touch objects (Multiple Touch Touchscreen T100 or Key Array T15).
Refer to the mXT1664T2-C2U 1.1 Protocol Guide for more information.
Note: If a touch is in detect and then AKS is enabled, that touch will not be forced out of detect. It will not go out of
detect until the touch is released. AKS will then operate normally. This applies to both levels of AKS.

8.15 GPIO Pins

The mXT1664T2-C2U has 6 GPIO pins. The pins can be set to be either an input or an output, as required. Note that
unused GPIO pins can be left externally unconnected as long as they are given a defined state by using the GPIO/PWM
Configuration T19 object. With the GPIO/PWM Configuration T19 object, an unused GPIO pin can be either set to Input
mode, with internal pull-up, or Output mode.
By default GPIO pins are set to be inputs. If not used they should be connected to GND. Alternatively, they can be set as
outputs using the GPIO/PWM Configuration T19 object and left open.

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9. Host Communications

9.1 Communication Mode Selection (COMMSEL Pin)

The selection of the I2C or USB interface is determined by the COMMSEL pin:
 If the COMMSEL pin is low (GND), I2C mode is selected.
 If the COMMSEL pin is high (VddIO), USB mode is selected.

9.2 I2C Mode Selection (I2CMODE Pin)

The selection of the I2C or the HID-I2C mode is determined by the I2CMODE pin:
 If the I2CMODE pin is low (GND), HID-I2C mode is selected.
 If the I2CMODE pin is high (VddIO), I2C mode is selected.
 If the I2CMODE pin is floating, the mode is selected according to the I2C address (as determined by the ADDSEL
pin). See Section 9.2.1 for more information.

9.2.1 Automatic Selection of I2C and HID-I2C Modes

If the I2CMODE pin is left floating (that is, automatic mode selection), the device will listen on both I2C addresses and
automatically select the protocol to be used depending on the first message received. In this case the ADDSEL pin
determines the primary and secondary I2C addresses, and these in turn determine the communications mode to be used.
If the primary I2C address is detected, I2C is used for communications; if the I2C secondary address is detected, HID-I2C
is used.
The selection of both the communications mode and the I2C addresses is summarized in Table 9-1 on page 32.

Table 9-1. Communications Mode Selection

I2CMODE ADDSEL Mode

0 0 HID-I2C communications at 0x4A

(HID-I2C selected) (Address = 0x4A)

1 HID-I2C communications at 0x4B

(Address = 0x4B)

1 0 I2C communications at 0x4A

(I2C selected) (Address = 0x4A)

1 I2C communications at 0x4B

(Address = 0x4B)

No input or input floating 0 I2C communications at 0x4A (primary address)

(auto selection) (Primary address = 0x4A, HID-I2C communications at 0x4B (secondary address)
secondary address = 0x4B)

1 I2C communications at 0x4B (primary address)

(Primary address = 0x4B, HID-I2C communications at 0x4A (secondary address)
secondary address = 0x4A)

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9.3 I2C Address Selection (ADDSEL Pin)

If the I2CMODE pin is not floating (that is, a particular mode is chosen), the ADDSEL pin selects a single I2C address,
according to Table 9-2.

Table 9-2. I2C Address Selection

ADDSEL I2C Address

Connected to GND 0x4A

Pulled up to VddIO 0x4B

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I2C Communications

10. I2C Communications

The device can use an I2C interface for communication. See Appendix B. on page 88 for details of the I2C protocol.
The I2C interface is used in conjunction with the CHG line. The CHG line going active signifies that a new data packet is
available. This provides an interrupt-style interface and allows the device to present data packets when internal changes
have occurred.
To use the device in I2C mode, the I2CMODE pin should be pulled high. Alternatively, if auto selection is required, the
I2CMODE pin should be left floating and the primary I2C address used. See Section 9. on page 32 for more information.

10.1 I2C Addresses

The device supports two I2C device addresses that are selected using the ADDSEL line at start up. The two internal I2C
device addresses are 0x4A and 0x4B. The selection of the address (and the communication mode) is described in
Section 9.3 on page 33. These are shifted left to form the SLA+W or SLA+R address when transmitted over the I2C
interface, as shown in Figure 10-1.

Table 10-1. Format of an I2C Address

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Address: 0x4A or 0x4B Read/write

10.2 Writing To the Device

A WRITE cycle to the device consists of a START condition followed by the I2C address of the device (SLA+W). The next
two bytes are the address of the location into which the writing starts. The first byte is the Least Significant Byte (LSByte)
of the address, and the second byte is the Most Significant Byte (MSByte). This address is then stored as the address
pointer.
Subsequent bytes in a multi-byte transfer form the actual data. These are written to the location of the address pointer,
location of the address pointer + 1, location of the address pointer + 2, and so on. The address pointer returns to its
starting value when the WRITE cycle STOP condition is detected.
Figure 10-1 shows an example of writing four bytes of data to contiguous addresses starting at 0x1234.

Figure 10-1.Example of a Four-byte Write Starting at Address 0x1234

START SLA+W 0x34 0x12 0x96 0x9B 0xA0 0xA5 STOP

Write Address Write Data

(LSB, MSB)

10.3 I2C Writes in Checksum Mode

In I2C checksum mode an 8-bit CRC is added to all I2C writes. The CRC is sent at the end of the data write as the last
byte before the STOP condition. All the bytes sent are included in the CRC, including the two address bytes. Any
command or data sent to the device is processed even if the CRC fails.
To indicate that a checksum is to be sent in the write, the most significant bit of the MSByte of the address is set to 1. For
example, the I2C command shown in Figure 10-2 writes a value of 150 (0x96) to address 0x1234 with a checksum. The
address is changed to 0x9234 to indicate checksum mode.

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I2C Communications

Figure 10-2.Example of a Write To Address 0x1234 With a Checksum

START SLA+W 0x34 0x92 0x96 Checksum STOP

Write Address Write Data

(LSB, MSB)

10.4 Reading From the Device

Two I2C bus activities must take place to read from the device. The first activity is an I2C write to set the address pointer
(LSByte then MSByte). The second activity is the actual I2C read to receive the data. The address pointer returns to its
starting value when the read cycle NACK is detected.
It is not necessary to set the address pointer before every read. The address pointer is updated automatically after every
read operation. The address pointer will be correct if the reads occur in order. In particular, when reading multiple
messages from the Message Processor T5 object, the address pointer is automatically reset to allow continuous reads
(see Section 10.5).
The WRITE and READ cycles consist of a START condition followed by the I2C address of the device (SLA+W or SLA+R
respectively).
Figure 10-3 shows the I2C commands to read four bytes starting at address 0x1234.

Figure 10-3.Example of a Four-byte Read Starting at Address 0x1234

Set Address Pointer

START SLA+W 0x34 0x12 STOP

Read Address
(LSB, MSB)

Read Data

START SLA+R 0x96 0x9B 0xA0 0xA5 STOP

Read Data

10.5 Reading Status Messages with DMA

The device facilitates the easy reading of multiple messages using a single continuous read operation. This allows the
host hardware to use a direct memory access (DMA) controller for the fast reading of messages, as follows:
1. The host uses a write operation to set the address pointer to the start of the Message Count T44 object, if
necessary (1). If a checksum is required on each message, the most significant bit of the MSByte of the read
address must be set to 1.
2. The host starts the read operation of the message by sending a START condition.
3. The host reads the Message Count T44 object (one byte) to retrieve a count of the pending messages (refer to the
mXT1664T2-C2U 1.1 Protocol Guide for details).
4. The host calculates the number of bytes to read by multiplying the message count by the size of the Message
Processor T5 object (2).

1. The STOP condition at the end of the read resets the address pointer to its initial location, so it may already be pointing at the Message Count
T44 object following a previous message read.
2. The host should have already read the size of the Message Processor T5 object in its initialization code.

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5. Note that the size of the Message Processor T5 object as recorded in the Object Table includes a checksum byte.
If a checksum has not been requested, one byte should be deducted from the size of the object. That is: number of
bytes = count × (size – 1).
6. The host reads the calculated number of message bytes. It is important that the host does not send a STOP
condition during the message reads, as this will terminate the continuous read operation and reset the address
pointer. No START and STOP conditions must be sent between the messages.
7. The host sends a STOP condition at the end of the read operation after the last message has been read. The
NACK condition immediately before the STOP condition resets the address pointer to the start of Message Count
T44 object.
Figure 10-4 shows an example of using a continuous read operation to read three messages from the device without a
checksum. Figure 10-5 on page 37 shows the same example with a checksum.

Figure 10-4.Continuous Message Read Example – No Checksum

Set Address Pointer

START SLA+W LSB MSB STOP

Start Address of
Message Count Object

Read Message Count

Continuous START SLA+R Count = 3

Read

Message Count Object

Read Message Data

(size – 1) bytes

Report ID Data Data

Message Processor Object – Message # 1

Report ID Data Data

Message Processor Object – Message # 2

Report ID Data Data STOP

Message Processor Object – Message # 3

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Figure 10-5.Continuous Message Read Example – I2C Checksum Mode

Set Address Pointer

MSB |
START SLA+W LSB Checksum STOP
0x80

Start Address of
Message Count Object

Read Message Count

Continuous START SLA+R Count = 3

Read

Message Count Object

Read Message Data

size bytes

Report ID Data Data Checksum

Message Processor Object – Message # 1

Report ID Data Data Checksum

Message Processor Object – Message # 2

Report ID Data Data Checksum STOP

Message Processor Object – Message # 3

There are no checksums added on any other I2C reads. An 8-bit CRC can be added, however, to all I2C writes, as
described in Section 10.3 on page 34.
An alternative method of reading messages using the CHG line is given in Section 10.6.

10.6 CHG Line

The CHG line is an active-low, open-drain output that is used to alert the host that a new message is available in the
Message Processor T5 object. This provides the host with an interrupt-style interface with the potential for fast response
times. It reduces the need for wasteful I2C communications.
The CHG line remains low as long as there are messages to be read. The host should be configured so that the CHG line
is connected to an interrupt line that is level-triggered. The host should not use an edge-triggered interrupt as this means
adding extra software precautions.
The CHG line should be allowed to float during normal usage. This is particularly important after power-up or reset (see
Section 7. on page 25).
A pull-up resistor is required, typically 3.3 k to VddIO.
The CHG line operates in two modes, as defined by the Communications Configuration T18 object (refer to the
mXT1664T2-C2U 1.1 Protocol Guide).

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Figure 10-6.CHG Line Modes for I2C-compatible Transfers

Mode 0
I2C Interface ACK NACK
START SLA-R B0 B1 … Bn B0 B1 … Bn … B0 B1 … Bn STOP
Message #1 Message #2 Message #m

CHG Line …

CHG line high or low; see text

Mode 1
I2C Interface ACK
START SLA-R B0 B1 … Bn B0 B1 … Bn … B0 B1 … Bn STOP
Message #1 Message #2 Message #m

CHG Line
…
CHG line high or low; see text

In Mode 0:
1. The CHG line goes low to indicate that a message is present.
2. The CHG line goes high when the first byte of the first message (that is, its report ID) has been sent and
acknowledged (ACK sent) and the next byte has been prepared in the buffer.
3. The STOP condition at the end of an I2C transfer causes the CHG line to stay high if there are no more messages.
Otherwise the CHG line goes low to indicate a further message.
Mode 0 allows the host to continually read messages. Messaging reading ends when a report ID of 255 (“invalid
message”) is received. Alternatively the host ends the transfer by sending a NACK after receiving the last byte of a
message, followed by a STOP condition. If and when there is another message present, the CHG line goes low, as in
step 1. In this mode the state of the CHG line does not need to be checked during the I2C read.
In Mode 1:
1. The CHG line goes low to indicate that a message is present.
2. The CHG line remains low while there are further messages to be sent after the current message.
3. The CHG line goes high again only once the first byte of the last message (that is, its report ID) has been sent and
acknowledged (ACK sent) and the next byte has been prepared in the output buffer.
Mode 1 allows the host to continually read the messages until the CHG line goes high, and the state of the CHG line
determines whether or not the host should continue receiving messages from the device.
Note: The state of the CHG line should be checked only between messages and not between the bytes of a message.
The precise point at which the CHG line changes state cannot be predicted and so the state of the CHG line
cannot be guaranteed between bytes.
The Communications Configuration T18 object can be used to configure the behavior of the CHG line. In addition to the
CHG line operation modes described above, this object allows the use of edge-based interrupts, as well as direct control
over the state of the CHG line. Refer to the mXT1664T2-C2U 1.1 Protocol Guide for more information.

10.7 SDA, SCL

The I2C bus transmits data and clock with SDA and SCL, respectively. These are open-drain. The device can only drive
these lines low or leave them open. The termination resistors (Rp) pull the line up to Vdd if no I2C device is pulling it
down.
The termination resistors should be chosen so that the rise times on SDA and SCL meet the I2C specifications for the
interface speed being used, bearing in mind other loads on the bus (see Section 16.10 on page 80).

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10.8 Clock Stretching

The device supports clock stretching in accordance with the I2C specification. It may also instigate a clock stretch if a
communications event happens during a period when the device is busy internally. The maximum clock stretch is
approximately 10 – 15 ms.
The device has an internal bus monitor that can reset the internal I2C hardware if SDA or SCL is stuck low for more than
200 ms. This means that if a prolonged clock stretch of more than 200 ms is seen by the device, then any ongoing
transfers with the device may be corrupted. The bus monitor is enabled or disabled using the Communications
Configuration T18 object. Refer to the mXT1664T2-C2U 1.1 Protocol Guide for more information.

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11. HID-I2C Communications

The device is an HID-I2C device presenting two Top-level Collections (TLCs):
 Generic HID-I2C – Provides a generic HID-I2C interface that allows the host to communicate with the device using
the object-based protocol (OBP).
 Digitizer HID-I2C – Supplies touch information to the host. This interface is supported by Microsoft Windows 8 and
8.1 without the need for additional software.
See Section 9. on page 32 for information on selecting HID-I2C mode.
Other features are identical to standard I2C communication described in Section 10. on page 34.
Refer to the Microsoft HID-I2C documentation, HID Over I2C Protocol Specification – Device Side, for information on the
HID-I2C specification.

11.1 I2C Addresses

See Section 10.1 on page 34.

11.2 Device
The device is compliant with HID-I2C specification V1.0. It has the following specification:
Vendor ID: 0x03EB (Atmel)
Product ID: 0x214F (mXT1664T2-C2U)
Version: 16-bit Version & Build Identifier in the form 0xVVBB, where:
VV = Version Major (Upper 4 bits) / Minor (Lower 4 bits)
BB = Build number in BCD format
HID descriptor address: 0x0000

11.3 HID Descriptor

The host should read the HID descriptor on initialization to ascertain the key attribute of the HID device. These include
the report description and the report ID to be used for communication with the HID device. The HID descriptor address is
0x0000.
Note that the host driver must not make any assumptions about the report packet formats, data locations or report IDs.
These must be read from the HID descriptor as they may change in future versions of the firmware.
For more information on how to read the HID descriptor, refer to the Microsoft HID-I2C documentation.

11.4 HID-I2C Report IDs

Table 11-1 describes the HID-I2C report IDs used in reports sent to the host.

Table 11-1. HID-I2C Report IDs

Report ID Description Top-level Collection

0x06 Object Protocol (OBP) command and response

Generic HID-I2C
(see Section 11.5 on page 41)

0x01 Touch report

Digitizer HID-I2C
(see Section 11.6.1 on page 45)

0x02 Maximum Touches (Surface Contacts) report

Digitizer HID-I2C
(see Section 11.6.3 on page 48)

0x05 Touch Hardware Quality Assurance (THQA) report

Digitizer HID-I2C
(see Section 11.6.4 on page 48)

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11.5 Generic HID-I2C

The Generic HID-I2C TLC supports an input report for receiving data from the device and an output report for sending
data to the device.
Commands are sent by the host using the output reports. Responses from the device are sent using input reports.
Supported commands are:
 Read/Write Memory Map
 Send Auto-return Messages
The HID-I2C Report ID used is that for Object Protocol commands and responses; see Table 11-1 on page 40 for the
value.

11.5.1 Read/Write Memory Map

11.5.1.1 Introduction
This command is used to carry out a write/read operation on the memory map of the device.
The command packet has the generic format given in Figure 11-1. The following sections give examples on using the
command to write to the memory map and to read from the memory map.

Figure 11-1. Generic Command Packet Format

Rpt ID 0x51 NumWx NumRx Addr 0 Addr 1 Data 0 ... Data 11

Command Number of Bytes Address Pointer Write Data

ID to Read/Write (LSByte, MSByte)

In Figure 11-1:
 Rpt ID is the HID-I2C Report ID used for Object Protocol commands and responses (see Table 11-1 on page 40).
 NumWx is the number of data bytes to write to the memory map (may be zero). If the address pointer is being
sent, this must include the size of the address pointer.
 NumRx is the number of data bytes to read from the memory map (may be zero).
 Addr 0 and Addr 1 form the address pointer to the memory map (where necessary; may be zero if not needed).
 Data 0 to Data 11 are the bytes of data to be written (in the case of a write). Note that data locations beyond the
number specified by NumWx will be ignored.
The response packet has the generic format given in Figure 11-2.

Figure 11-2. Response Packet Format

Rpt ID Status NumRx Data 0 ... Data 14

Success/ Number of Read Data

Failure Bytes Read

In Figure 11-2:
 Rpt ID is the HID-I2C Report ID used for Object Protocol commands and responses (see Table 11-1 on page 40).
 Status indicates the result of the command:
 0x00 = read and write completed; read data returned
 0x04 = write completed; no read data requested
 NumRx is the number of bytes following that have been read from the memory map (in the case of a read). This
will be the same value as NumRx in the command packet.
 Data 0 to Data 14 are the data bytes read from the memory map.

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11.5.1.2 Writing To the Device

A write operation cycle to the device consists of sending a packet that contains six header bytes. These specify the HID-
I2C report ID, the Command ID, the number of bytes to read, the number of bytes to write, and the 16-bit address pointer.
Subsequent bytes in a multi-byte transfer form the actual data. These are written to the location of the address pointer,
location of the address pointer +1, location of the address pointer + 2, and so on.
Figure 11-3 shows an example command packet to write four bytes of data to contiguous addresses starting at 0x1234.

Figure 11-3. Example of a Four-byte Write Starting at Address 0x1234

0x06ID
Rpt 0x51 0x06 0x00 0x34 0x12 0x96 0x9B 0xA0 0xA5

Report ID Command Number Number Address Pointer Write Data

for OBP ID of Bytes of Bytes (LSB, MSB)
to Write to Read

In Figure 11-3:
 Rpt ID is the HID-I2C Report ID used for Object Protocol commands and responses (see Table 11-1 on page 40).
 The number of bytes to read is set to zero as this is a write-only operation.
 The number of bytes to write is six: that is, four data bytes plus the two address pointer bytes.
Figure 11-4 shows the response to this command. Note that the result status returned is 0x04 (that is, the write operation
was completed but no read data was requested). Note also that the Report ID is the same one used in the command
packet.

Figure 11-4. Response to Example Four-byte Write

0x06 0x04

Report ID Result
for OBP

11.5.1.3 Reading From the Device

A read operation consists of sending a packet that contains the six header bytes only and no write data.
Figure 11-5 shows an example command packet to read four bytes starting at address 0x1234. Note that the address
pointer is included in the number of bytes to write, so the number of bytes to write is set to 2 as there are no other data
bytes to be written.

Figure 11-5. Example of a Four-byte Read Starting at Address 0x1234

0x06 0x51 0x02 0x04 0x34 0x12

Report ID Command Number Number Address Pointer

for OBP ID of Bytes of Bytes (LSB, MSB)
to Write to Read

It is not necessary to set the address pointer before every read. The address pointer is updated automatically after every
read operation, so the address pointer will be correct if the reads occur in order.
Figure 11-6 shows the response to this command. The result status returned is 0x00 (that is the write operation was
completed and the data was returned). The number of bytes returned will be the same as the number requested (4 in this
case).

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Figure 11-6. Response to Example Four-byte Read

0x06 0x51 0x02 0x04 0x34 0x12

Report ID Command Number Number Address Pointer

for OBP ID of Bytes of Bytes (LSB, MSB)
to Write to Read

11.5.2 Send Auto-return Messages

With this command the device can be configured to return new messages from the Message Processor T5 object
autonomously. The packet sequence to do this is shown in Figure 11-7.

Figure 11-7. Packet Sequence for “Send Auto-return” Command

Host Device
Send Auto-return Command Packet

Response Packet

Message Data Packet

Message Data Packet

:
:
:

Message Data Packet

Null Packet to Terminate

The HID-I2C Report ID used is that for Object Protocol commands and responses; see Table 11-1 on page 40 for the
value.
The command packet has the format given in Figure 11-8.

Figure 11-8. Command Packet Format

Rpt ID 0x88 Res 0 Res 1 Res 2 Res 3 Res 4 Res 5

Command Reserved Bytes

ID (=0x00)

In Figure 11-8:
 Rpt ID is the HID-I2C Report ID used for Object Protocol commands and responses (see Table 11-1 on page 40).
 Res 0 to Res 5 are reserved bytes with a value of 0x00.
The response packet has the format given in Figure 11-9. Note that with this command, the command packet does not
include an address pointer as the device already knows the address of the Message Processor T5 object.

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Figure 11-9. Response Packet Format

Rpt ID 0x88 0x00

Command
Received

Once the device has responded to the command, it starts sending message data. Each time a message is generated in
the Message Processor T5 object, the device automatically sends a message packet to the host with the data. The
message packets have the format given in Figure 11-10.

Figure 11-10.Message Packet Format

Rpt ID 0xFA 0x00 Msg ID Data 0 ... Data n

ID Bytes Message Message Data

Report ID

In Figure 11-10:
 Rpt ID is the HID-I2C Report ID used for Object Protocol commands and responses (see Table 11-1 on page 40).
 ID Bytes identify the packet as an auto-return message packet.
 Msg ID is the Report ID (1) returned by the Message Processor T5 object.
 Message Data bytes are the bytes of data returned by the Message Processor T5 object. The size of the data
depends on the source object for which this is the message data. Refer to the mXT1664T2-C2U 1.1 Protocol
Guide for more information.
To stop the sending of the messages, the host can send a null command packet. This consists of two bytes: a HID-I2C
report ID and a command byte of 0x00 (see Figure 11-11).

Figure 11-11.Null Command Packet Format

Rpt ID 0x00

Null
Command
ID

Note that any read or write will also terminate any currently enabled auto-return mode (see Section 11.5.1.2 on page 42).

1. This is the Report ID used in the Object Protocol and should not be confused with the HID-I2C Report ID. Refer to the mXT1664T2-C2U 1.1
Protocol Guide for more information on the use of Report IDs in the Object Protocol.

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11.5.2.1 Reading Status Messages

Figure 11-12 shows an example sequence of packets to receive messages from the Message Processor T5 object using
the “Send Auto-return” command.

Figure 11-12.Example Auto-return Command Packet

Send Auto-return Command

0x06
Rpt ID 0x88 0x00 0x00 0x00 0x00 0x00

Report ID Command Reserved

for OBP ID

Response From Chip Set

Rpt
0x06ID 0x88 0x00 0x00 0x00 0x00 0x00

Report ID Command Reserved

for OBP Received

Read Message Data

0x06
Rpt ID 0xFA 0x00 0x02 0xC0 0x1C 0x1A 0x1E 0x06 0x4F 0x10

0x06
Rpt ID 0xFA 0x00 0x11 0x03 0x1C 0x1A 0x1C 0x00 0x00

Report ID ID Bytes Message Message Data

for OBP Report ID

Send Null Command To Terminate

Rpt
0x06ID 0x00

Report ID Null
for OBP

11.6 Digitizer HID-I2C

This is a digitizer class HID.

11.6.1 Touch Report

The format of a Touch report is shown in Figure 11.6.2 on page 46.
Each Touch report starts with a report ID and contains the data for one touch.

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The HID-I2C Report ID used is that for Touch reports; see Table 11-1 on page 40 for the value.

11.6.2 Touch Report Packet Format

Touch Scan Time
Rpt ID (14 bytes) (2 bytes) Count

Touch
Status
Data

In Figure 11.6.2:
 Rpt ID is the HID-I2C Report ID used for Touch reports (see Table 11-1 on page 40).
 Touch is the data for the touch.
 Scan Time is the Timestamp for the report packet
 Count is used to identify the report packets for current active touches that are to be reported as a single package.
The Count in the first packet for the first touch is set to the number of active touches to be sent in one package.
Subsequent packets for subsequent active touches have a Count of 0.
An example of the Touch report packets for 3 active touches is shown in Figure 11-13.

Figure 11-13.Example Touch Report Packets for 3 Active Touches

0x01 Touch 1 Scan Time

Rpt ID (14 bytes) (2 bytes) Count = 3

Touch 2 Scan Time

0x01
Rpt ID Count = 0
(14 bytes) (2 bytes)

Touch 3 Scan Time

0x01
Rpt ID Count = 0
(14 bytes) (2 bytes)

Report ID Touch Packet

for Touch Status Count
Data

Each input report consists of a HID-I2C report ID followed by 17 bytes of that describe the status of one active touch. The
input report format depends on the geometry calculation control (TCHGEOMEN) of the Digitizer HID Configuration T43
object. Table 11-2 on page 47 and Table 11-3 on page 47 give the detailed format of a touch report packet.

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Table 11-2. Touch Report Format when TCHGEOMEN = 1

Byte Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0 HID-I2C Touch Report ID

1 Reserved Status

2 Touch ID

3–4 X Position

5–6 X’ Position
7–8 Y Position

9 – 10 Y’ Position

11 Touch Width

12 Reserved

13 Touch Height

14 Reserved

15 – 16 Scan Time

17 Count

Table 11-3. Touch Report Format when TCHGEOMEN = 0

Byte Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
2
0 HID-I C Touch Report ID

1 Reserved Status
2 Touch ID

3–4 X Position

5–6 X’ Position

7–8 Y Position

9 – 10 Y’ Position

11 Reserved
12 Reserved

13 Reserved

14 Reserved

15 – 16 Scan Time

17 Count

 Byte 0:
The HID-I2C Report ID (see Table 11-1 on page 40 for Touch reports).
 Byte 1:
Status: Status of the touch detection. This bit is set to 1 if touch is detected, and set to 0, if no touches are
detected.
 Byte 2:
Touch ID: Identifies the touch for which this is a status report (starting from 0).
 Bytes 3 to 10:

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X and Y positions: These are scaled to 12-bit resolution. This means that the upper four bits of the MSByte will
always be zero.
 Byte 11:
Touch Width: Reports the width of the detected touch when TCHGEOMEN is set to 1.
Reserved when TCHGEOMEN is set to 0
 Byte 13:
Touch Height: Reports the height of the detected touch when TCHGEOMEN is set to 1.
Reserved when TCHGEOMEN is set to 0
 Byte 15 to 16:
Scan Time: Timestamp associated with the current report packet with a 10 kHz resolution.
 Byte 17:
Count: For the first touch, the number of active touches to be sent in one package. Subsequent packets for
subsequent active touches have a Count of 0.

11.6.3 Maximum Touches (Surface Contacts) Report

The format of the Maximum Touches report packet is shown in Figure 11-14.
The HID-I2C Report ID used is that for Maximum Touches reports; see Table 11-1 on page 40 for the value.

Figure 11-14.Example Maximum Touches Report

Max
Rpt ID Touches
(1 byte)

Maximum
Number of
Touches
Reported

In Figure 11-14:
 Rpt ID is the HID-I2C Report ID used for Maximum Touches reports (see Table 11-1 on page 40).
 Max Touches is the maximum number of touches that can be reported by the device.
Read this report to receive the maximum number of touches that can currently be reported.
Write this report to set the maximum number of touches to be reported. Note that the number of touches cannot be set to
more than the maximum number of touches defined by Multiple Touch Touchscreen T100 NUMTCH.

11.6.4 Touch Hardware Quality Assurance (THQA) Report

The THQA data is reported to Windows using the THQA Report ID (see Table 11-1 on page 40 for the value). The
content of this data is defined by Microsoft.

11.7 CHG Line

Latency
Rpt ID Mode
(1 byte)

Read: Current Latency Mode

Write: New Latency Mode

The CHG line is an active-low, open-drain output that is used to alert the host that a new message is available in the
Input Buffer. This provides the host with an interrupt-style interface with the potential for fast response times. It reduces
the need for wasteful I2C communications.

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Further information on the CHG line is given in Section 10.6 on page 37.

11.8 SDA, SCL

Identical to standard I2C operation. Refer to Section 10.7 on page 38.

11.9 Clock Stretching

Identical to standard I2C operation. Refer to Section 10.8 on page 39.

11.10 Power Control

The mXT1664T2-C2U supports the use of the HID-I2C SET POWER commands to put the device into a low power state
(analogous to the USB SUSPEND command).

11.11 Microsoft Windows Compliance

The mXT1664T2-C2U has algorithms within the Digitizer HID Configuration T43 and Multiple Touch Touchscreen T100
specifically to ensure Microsoft Windows 8 and 8.1 compliance.
The device also supports Microsoft Touch Hardware Quality Assurance (THQA) in the Serial Data Command T68 object.
Refer to the Microsoft whitepaper How to Design and Test Multitouch Hardware Solutions for Windows 8.
These, and other device features, may need specific tuning.

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12. USB Communications

The device is a composite USB device with two Human Interface Device (HID) interfaces:
 Interface 0 – This interface provides a Generic HID that allows the host to communicate with the device using the
Object Protocol. The HID identifier string is Atmel maXTouch Control.
 Interface 1 – This interface provides a Digitizer HID that supplies touch information to the Host for passing on to a
PC operating system. This interface is supported by Microsoft® Windows® 8 and 8.1 without the need for additional
software. The HID identifier string is Atmel maXTouch Digitizer.
The topography of the USB device is shown in Figure 12-1.

Figure 12-1.USB Topography

Composite Device Endpoint 0

(Control)

Interface 0 Interface 1
“Atmel maXTouch Control” “Atmel maXTouch Digitizer”
(Generic HID) (Digitizer HID)

Endpoint 1 Endpoint 2 Endpoint 3

(In) (Out) (In)

Communication takes place using Full-speed USB at 12 Mbps.

For more information on the USB HID specifications visit www.usb.org.

12.1 Endpoint Addresses

The endpoint addresses are listed in Table 12-1.
Table 12-1. Endpoint Addresses

Endpoint Direction Address

Endpoint 0 Bidirectional (control) –

Endpoint 1 In 0x81

Endpoint 2 Out 0x02

Endpoint 3 In 0x83

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12.2 Composite Device

The composite device is a USB 2.0-compliant USB composite device running at full speed (12 Mbps). It has the following
specification:
Vendor ID: 0x03EB (Atmel)
Product ID: 0x214F (mXT1664T2-C2U)
Version: 16-bit Version & Build Identifier in the form 0xVVBB, where:
VV = Version Major (Upper 4 bits) / Minor (Lower 4 bits)
BB = Build number in BCD format
The composite device has one bidirectional endpoint: the Control Endpoint (Endpoint 0). It is used by the USB Host to
interrogate the USB device for details on its configurations, interfaces and report structures. It is also used to apply
general device settings relating to USB Implementation.

12.3 Interface 0 (Generic HID)

Interface 0 is a Generic Human Interface Device, compliant with HID specification 1.11 with amendments (1).
It consists of two endpoints: an interrupt-In endpoint (Endpoint 1) and an interrupt-out endpoint (Endpoint 2). The data
packet in each case contains a 1-byte USB Report ID followed by 63 bytes of data, totalling 64 bytes (see Figure 12-2).

Figure 12-2.Data Packet for Interface 1

0x01 Data 0 Data 1 Data 62

USB Packet Data

Report ID

Commands are sent by the application software over the Interrupt-out endpoint, Endpoint 2. The command is sent as the
first data byte of the packet data (data byte 0), followed by conditions and/or data.
The supported commands are as follows:
 Read/write Memory Map
 Send Auto-return messages
 Start debug monitoring
 End debug monitoring
Responses from the device are sent via the interrupt-In endpoint, Endpoint 1.

12.3.1 Read/Write Memory Map

12.3.1.1 Introduction
This command is used to carry out a write/read operation on the memory map of the device.
The USB Report ID is 0x01.The command packet has the generic format given in Figure 12-3. The following sections
give examples on using the command to write to the memory map and to read from the memory map.

Figure 12-3.Generic Command Packet Form

0x01 0x51 NumWx NumRx Addr0 Addr1 Data 0 Data 57

USB Command Number of Bytes Address Pointer Write Data

Report ID ID to Write / Read (LSB, MSB)

1. This is an implementation of the Microsoft USB HID specification for multi-touch digitizers.

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In Figure 12-3:
 NumWx is the number of data bytes to write to the memory map (may be zero). If the address pointer is being
sent, this must include the size of the address pointer.
 NumRx is the number of data bytes to read from the memory map (may be zero).
 Addr 0 and Addr 1 form the address pointer to the memory map (where necessary; may be zero if not needed).
 Data 0 to Data 57 are the bytes of data to be written (in the case of a write). Note that data locations beyond the
number specified by NumWx will be ignored.
The response packet has the generic format given in Figure 12-4.

Figure 12-4.Response Packet Format

0x01 Status NumRx Data 0 Data 60

USB Result Number of Read Data

Report ID Bytes Read

In Figure 12-4:
 Status indicates the result of the command:
 0x00 = read and write completed; read data returned
 0x04 = write completed; no read data requested
 NumRx is the number of bytes following that have been read from the memory map (in the case of a read). This
will be the same value as NumRx in the command packet.
 Data 0 to Data 60 are the data bytes read from the memory map.

12.3.1.2 Writing To the Device

A write operation cycle to the device consists of sending a packet that contains six header bytes. These specify the USB
report ID, the Command ID, the number of bytes to read, the number of bytes to write, and the 16-bit address pointer.
Subsequent bytes in a multibyte transfer form the actual data. These are written to the location of the address pointer,
location of the address pointer +1, location of the address pointer + 2, and so on.
The address pointer returns to its starting value when the READ cycle STOP condition is detected.
Figure 12-5 shows an example command packet to write four bytes of data to contiguous addresses starting at 0x1234.

Figure 12-5.Example of a Four-byte Write Starting at Address 0x1234

0x01 0x51 0x06 0x00 0x34 0x12 0x96 0x9B 0xA0 0xA5

USB Command Number Number Address Pointer Write Data

Report ID ID of Bytes of Bytes (LSB, MSB)
to Write to Read

In Figure 12-5:
 The number of bytes to read is set to zero as this is a write-only operation.
 The number of bytes to write is six: that is, four data bytes plus the two address pointer bytes.
Figure 12-6 shows the response to this command. Note that the result status returned is 0x04 (that is, the write operation
was completed but no read data was requested).

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Figure 12-6.Response to Example Four-byte Write

0x01 0x04

USB Result
Report ID

12.3.1.3 Reading From the Device

A read operation consists of sending a packet that contains the six header bytes only and no write data.
Figure 12-7 shows an example command packet to read four bytes starting at address 0x1234. Note that the address
pointer is included in the number of bytes to write, so the number of bytes to write is set to 2 as there are no other data
bytes to be written.

Figure 12-7.Example of a Four-byte Read Starting at Address 0x1234

0x01 0x51 0x02 0x04 0x34 0x12

USB Command Number Number Address Pointer

Report ID ID of Bytes of Bytes (LSB, MSB)
to Write to Read

The address pointer returns to its starting value when the READ cycle STOP condition is detected.
It is not necessary to set the address pointer before every read. The address pointer is updated automatically after every
read operation, so the address pointer will be correct if the reads occur in order.
Figure 12-8 shows the response to this command. The result status returned is 0x00 (that is the write operation was
completed and the data was returned). The number of bytes returned will be the same as the number requested (4 in this
case).

Figure 12-8.Response to Example Four-byte Read

0x01 0x00 0x04 0x96 0x9B 0xA0 0xA5

USB Result Number Read Data

Report ID of Bytes
Read

12.3.2 Send Auto-return Messages

12.3.2.1 Introduction
With this command the device can be configured to return new messages from the Message Processor T5 object
autonomously. The packet sequence to do this is shown in Figure 12-9.

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Figure 12-9.Packet Sequence for “Send Auto-return” Command

Host Device
Send Auto-return Command Packet

Response Packet

Message Data Packet

Message Data Packet

:
:
:

Message Data Packet

Null Packet to Terminate

The USB Report ID is 0x01.

The command packet has the format given in Figure 12-10.

Figure 12-10.Command Packet Format

0x01 0x88 Res 0 Res 1 Res 2 Res 3 Res 4 Res 5

USB Command Reserved Bytes

Report ID ID (=0x00)

In Figure 12-10:
 Res 0 to Res 5 are reserved bytes with a value of 0x00.
The response packet has the format given in Figure 12-11. Note that with this command, the command packet does not
include an address pointer as the device already knows the address of the Message Processor T5 object.

Figure 12-11.Response Packet Format

0x01 0x88 0x00

USB Command
Report ID Received

Once the device has responded to the command, it starts sending message data. Each time a message is generated in
the Message Processor T5 object, the device automatically sends a message packet to the host with the data. The
message packets have the format given in Figure 12-12.

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Figure 12-12.Message Packet Format

0x01 0xFA 0x00 Rpt ID Data 0 Data n

USB ID Bytes Message Message Data

Report ID Report ID

In Figure 12-12:
 ID Bytes identify the packet as an auto-return message packet.
 Message Report ID is the Report ID returned by the Message Processor T5 object. (1)
 Message Data bytes are the bytes of data returned by the Message Processor. The size of the data depends on
the source object for which this is the message data. Refer to the mXT1664T2-C2U 1.1 Protocol Guide for more
information.
To stop the sending of the messages, the host can send a null command packet. This consists of two bytes: a report ID
of 0x01 and a command byte of 0x00 (see Figure 12-13).

Figure 12-13.Null Command Packet Format

0x01 0x00

USB Null
Report Command
ID ID

Note that the Start Debug Monitoring command may also terminate any currently enabled auto-return mode (see
Section 12.3.2.2).

1. This is the Message Report ID used in the Object Protocol and should not be confused with the USB Report ID. Refer to the mXT1664T2-
C2U 1.1 Protocol Guide for more information on the use of Report IDs in the Object Protocol.

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USB Communications

12.3.2.2 Reading Status Messages

Figure 12-14 on page 56shows an example sequence of packets to receive messages from the Message Processor T5
object using the “Send Auto-return” command.

Figure 12-14.Example Auto-return Command Packet

Send Auto-return Command

0x01 0x88 0x00 0x00 0x00 0x00 0x00

USB Command Message Data

Report ID
ID

Response From Chip Set

0x01 0x88 0x00

Command
Received

Read Message Data

0x01 0xFA 0x00 0x02 0xC0 0x1C 0x1A 0x1E 0x06 0x4F 0x10

0x01 0xFA 0x00 0x11 0x03 0x1C 0x1A 0x1C 0x00 0x00

ID Bytes Message Message Data

Report ID

Send Null Command To Terminate

0x01 0x00

Null

12.3.3 Start Debug Monitoring

This command instructs the device to return debug-monitoring data packets using the debug port, if this feature has been
enabled in the Command Processor T6 object.
The USB Report ID can be either 0x01 or 0x02. This allows the source of the request to be identified. The main
difference is that a USB Report ID of 0x01 will terminate any currently enabled auto-return mode (see Section 12.3.2 on
page 53).
The command packet has the format given in Figure 12-15.

Figure 12-15.Command Packet Format

0x01or
0x02 0xE1

USB Command
Report ID
ID

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USB Communications

The response packet has the format given in Figure 12-16. Note that the USB Report ID will be the same as that used in
the command packet.

Figure 12-16.Response Packet Format

0x01 or
0x02 0xE1

USB Command
Report Received
ID

The debug data packet has the format given in Figure 12-17.

Figure 12-17.Debug Data Packet Format

Packet Num Frame

0x02 Num Packets Num
Data 0 Data 59

USB Debug Data

Report ID

In Figure 12-17:
 PacketNum is the number of this USB packet in the debug data frame (full set of debug data). Refer to
QTAN0050, Using the maXTouch Debug Port, for more information on the format of the debug data.
 NumPackets is the total number of USB packets that make up a debug data frame.
 FrameNum is the ID number of this frame.
 Data 0 to Data 59 are 59 bytes of debug data.

12.3.4 Stop Debug monitoring

This command instructs the device to cease returning debug-monitoring data packets.
The command packet has the following format:
The USB Report ID is either 0x01 or 0x02.
The command packet has the format given in Figure 12-18.

Figure 12-18.Command Packet Format

0x01 or
0x02 0xE2

USB Command
Report ID
ID

The response packet has the format given in Figure 12-19.

Figure 12-19.Response Packet Format

0x01 or
0x02 0xE2

USB Command
Report Received
ID

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12.4 Interface 1 (Digitizer HID)

12.4.1 Normal Touch Report

Interface 1 is a Digitizer-class HID, compliant with HID specification 1.11 with amendments. (1)
This interface consists of a single interrupt-In endpoint (Endpoint 3).
The format of an input report is shown in Figure 12-19. Each input report starts with a USB Report ID (2) (value 0x01). This
is followed by 6 sets of data (11 bytes each) that describe the status of up to 5 active touches. The input report is
terminated by a single byte that contains the number of active touches.

Figure 12-20.Input Report Packet

Touch 1 Touch 2 Touch 3 Touch 4 Touch 5 Scan

0x01 (11bytes) (11bytes) (11bytes) (11bytes) (11bytes) Count
Time

USB Active Touch Status Data

Report ID

Any unused touch data bytes are set to zero (for example, the data for one active touch would be followed by 56 zeroed
bytes). If there are more than five active touches to be reported, a further input report is sent with the remaining touch
data. In this case, the count (for all touches) is sent in the last count byte and the count byte in the first report is zero. An
example of the input report packets for 7 active touches is shown in Figure 12-21 on page 58.

Figure 12-21.Example Input Report Packets for 7 Active Touches

Touch 1 Touch 2 Touch 3 Touch 4 Touch 5 Scan

0x01 (11bytes) (11bytes) (11bytes) (11bytes) (11bytes) Count=7
Time

Touch 6 Touch 7 0 0 0 Scan

0x01 (11bytes) (11bytes) (11bytes) (11bytes) (11bytes) 0
Time

USB Active Touch Status Data

Report ID

The input report format depends on the geometry calculation field (TCHGEOMEN) of the Digitizer HID Configuration T43
object. Table 12-2 and Table 12-3 gives the detailed format of an input report packet.

1. This is an implementation of Microsoft’s USB HID specification for Multitouch digitizers.

2. The term USB Report ID should not be confused with the term Report ID as used in the Object Protocol; the two are entirely different
concepts.

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Table 12-2. Input Report Format when TCHGEOMEN is Enabled

Byte Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 USB Report ID
1 Touch ID (first touch) Reserved Status
2 X Position LSByte (first touch)
3 0 0 0 0 X Position MSBits (first touch)
4 X Position LSByte (first touch)
5 0 0 0 0 X Position MSBits (first touch)
6 Y Position LSByte (first touch)
7 0 0 0 0 Y Position MSBits (first touch)
8 Y Position LSByte (first touch)
9 0 0 0 0 Y Position MSBits (first touch)
10 Touch width
11 Touch height
12 – 22 Touch data for second touch – same format as bytes 1 – 11
23 – 33 Touch data for third touch – same format as bytes 1 – 11
34 – 44 Touch data for fourth touch – same format as bytes 1 – 11
45 – 55 Touch data for fifth touch – same format as bytes 1 – 11
56 – 57 Scan time
58 Contact count

Table 12-3. Input Report Format when TCHGEOMEN is Disabled

Byte Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 USB Report ID
1 Touch ID (first touch) Reserved Status
2 X Position LSByte (first touch)
3 0 0 0 0 X Position MSBits (first touch)
4–5 Reserved
6 Y Position LSByte (first touch)
7 0 0 0 0 Y Position MSBits (first touch)
8–9 Reserved
10 –11 Reserved
12 – 22 Touch data for second touch – same format as bytes 1 – 11
23 – 33 Touch data for third touch – same format as bytes 1 – 11
34 – 44 Touch data for fourth touch – same format as bytes 1 – 11
45 – 55 Touch data for fifth touch – same format as bytes 1 – 11
56 – 57 Scan time
58 Contact count

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In Table 12-3:
 Byte 1:
Status: 1 = In detect, 0 = Not in detect.
Touch ID: Identifies the touch for which this is a status report (starting from 1).
 Bytes 2 to 9:
X and Y positions: These are scaled to 12-bit resolution. This means that the upper four bits of the MSByte will
always be zero.
Bytes 4, 5, 8, 9, 10 and 11 are Reserved when TCHGEOMEN field is set to 0.
 Byte 10:
Touch Width: Reports the width of the detected touch.
 Byte 11:
Touch Height: Reports the height of the detected touch.
 Byte 56 to 57:
Scan Time: Timestamp associated with the current report frame with a 10 kHz resolution.
Note that the scan time for each report packet of a single frame is same.
 Byte 58:
Contact Count: Non-zero value in the first report packet of a frame indicating the total number of report packets in
the frame. Zeros in the subsequent report packets within the frame.

12.4.2 Maximum Touches Report

An example of the Maximum Touches report packet is shown in Figure 12-22.

Figure 12-22.Example Maximum Touches Report

Maximum
0x02 Touches
(1 byte)

USB Maximum
Report ID Number of
Touches
Supported

Read this report to receive the current maximum number of touches that can be reported.

12.4.3 Touch Hardware Quality Assurance (THQA) Report

The THQA data is reported to Windows using report ID 5. The content of this data is defined by Microsoft.

12.5 USB Suspend Mode

When the device is used in USB configuration, the USB “System Suspend” event can be used to minimize current
consumption. Note that it is possible to put the device into deep sleep mode without also sending a “System Suspend”
event on the USB bus, but the current consumption is not as low. The USB controller must send a USB “System Wake
Up” event on the bus to bring the device out of suspend mode.
The device can also be configured to respond to USB “Remote Wakeup” requests. In this case, if the operating system
enables remote wakeup and the device is suspended, the device will continue to scan at a preset sensor refresh rate.
Use of the remote wake up feature and the sensor refresh rate are configured using the Digitizer HID Configuration T43
object (refer to the mXT1664T2-C2U 1.1 Protocol Guide for more information).

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PCB Design Considerations

13. PCB Design Considerations

13.1 Introduction
The following sections give the design considerations that should be adhered to when designing a PCB layout for use
with the mXT1664T2-C2U. Of these, power supply and ground tracking considerations are the most critical.
By observing the following design rules, and with careful preparation for the PCB layout exercise, designers will be
assured of a far better chance of success and a correctly functioning product.

13.2 Printed Circuit Board

Atmel recommends the use of a four-layer printed circuit board for mXT1664T2-C2U applications. This, together with
careful layout, will ensure that the board meets relevant EMC requirements for both noise radiation and susceptibility, as
laid down by the various national and international standards agencies.

13.2.1 PCB Cleanliness

Modern no-clean-flux is generally compatible with capacitive sensing circuits.

CAUTION: If a PCB is reworked to correct soldering faults relating to any of the device devices, or to
any associated traces or components, be sure that you fully understand the nature of the flux used
during the rework process. Leakage currents from hygroscopic ionic residues can stop capacitive
sensors from functioning. If you have any doubts, a thorough cleaning after rework may be the only
safe option.

13.3 Supply Rails and Ground Tracking

Power supply and clock distribution are the most critical parts of any board layout. Because of this, it is advisable that
these be completed before any other tracking is undertaken. After these, supply decoupling, and analog and high speed
digital signals should be addressed. Track widths for all signals, especially power rails should be kept as wide as
possible in order to reduce inductance.
The Power and Ground planes themselves can form a useful capacitor. Flood filling for either or both of these supply
rails, therefore, should be used where possible. It is important to ensure that there are no floating copper areas remaining
on the board: all such areas should be connected to the 0 V plane. The flood filling should be done on the outside layers
of the board.
In applications where the USB bus supplies power to the board, care should be taken to ensure that suitable capacitive
decoupling is provided close to the USB connector. The tracking to the on-board regulators should also be kept as short
as possible.
It should also be remembered that the screen of the USB cable is not intended to be connected to the ground or 0V
supply of a remote device. It should either be left open circuit (being connected only at the host computer end) or
decoupled with a suitable high voltage capacitor (typically 4.7 nF, 250 V) and a parallel resistor (typically 1 M). Note
that these components may not be required when the USB cabling is internal and permanently wired, and is routed away
from the noisier parts of the system.

13.4 Power Supply Decoupling

As a rule, a suitable decoupling capacitor should be placed on each and every supply pin on all digital devices. It is
important that these capacitors are placed as close to the chip supply pins as possible (less than 10 mm away). The
ground connection of these capacitors should be tracked to 0 V by the shortest, heaviest traces possible.
Capacitors with a Type II dielectric, such as X5R or X7R and with a value of at least 100 nF, should be used for this
purpose.
In addition, at least one ‘bulk’ decoupling capacitor, with a minimum value of 4.7 µF should be placed on each power rail,
close to where the supply enters the board.

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Surface mounting capacitors are preferred to wire leaded types due to their lower ESR and ESL. It is often possible to fit
these decoupling capacitors underneath and on the opposite side of the PCB to the digital ICs. This will provide the
shortest tracking, and most effective decoupling possible.
Refer to the application note Selecting Decoupling Capacitors for Atmel PLDs (doc0484.pdf; available on the Atmel
website) for further general information on decoupling capacitors.

13.5 Single Supply Operation

When designing a PCB for an application using a single LDO, extra care should be taken to ensure short, low inductance
traces between the supply and the touch controller supply input pins. Ideally, tracking for the individual supplies should
be arranged in a star configuration, with the LDO at the junction of the star. This will ensure that supply current variations
or noise in one supply rail will have minimum effect on the other supplies. In applications where a ground plane is not
practical, this same star layout should also apply to the power supply ground returns.

13.6 Crystal Oscillator

If a crystal oscillator is used, its placement is critical to the performance of the design. The connecting leads between the
device and the crystal should be as short as possible. These tracks, together with the crystal itself, should be placed
above a suitable ground plane. It is also important that no other signal tracks are placed close to, or under, these tracks.
The crystal input pins are at a relatively high impedance and cross-talk from other signals will seriously affect oscillator
stability and accuracy. The crystal case should also be connected to ground if possible.
If an oscillator module is used, care still needs to be taken when tracking to the device. The clock signal should be kept
as short as possible, with a solid ground return underneath the clock output.

13.7 Analog I/O

In general, tracking for the analog I/O signals from the device should be kept as short as possible. These normally go to
a connector which interfaces directly to the touchscreen.
Ensure that adequate ground-planes are used. An analog ground plane should be used in addition to a digital one. Care
should be taken to ensure that both ground planes are kept separate and are connected together only at the point of
entry for the power to the PCB. This is usually at the input connector.

13.8 Component Placement and Tracking

It is important to orient all devices so that the tracking for important signals (such as power and clocks) are kept as short
as possible. This simple point is often overlooked when initially planning a PCB layout and can save hours of work at a
later stage.

13.8.1 Digital Signals

In general, when tracking digital signals, it is advisable to avoid sharp directional changes, sensitive signal tracks (such
as analog I/O) and any clock or crystal tracking.
A good ground return path for all signals should be provided, where possible, to ensure that there are no discontinuities
in the ground return path.

13.9 EMC and Other Observations

The following recommendations are not mandatory, but may help in situations where particularly difficult EMC or other
problems are present:
 A small common mode choke is recommended on the differential USB data pair. This should be placed directly at
the USB connector, between the connector and the relevant pins. Tracking lengths for the USB data pair should be
kept as short as possible.
 Try to keep as many signals as possible on the inside layers of the board. If suitable ground flood fills are used on
the top and bottom layers, these will provide a good level of screening for noisy signals, both into and out of the
PCB.

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 Ensure that the on-board regulators have sufficient tracking around and underneath the devices to act as a
heatsink. This heatsink will normally be connected to the 0 V or ground supply pin. Increasing the width of the
copper tracking to any of the device pins will aid in removing heat. There should be no solder mask over the
copper track underneath the body of the regulators.
 Ensure that the decoupling capacitors, especially high capacity ceramic type, have the requisite low ESR, ESL and
good stability/temperature properties. Refer to the regulator manufacturer’s datasheet for more information.

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Getting Started with mXT1664T2-C2U

14. Getting Started with mXT1664T2-C2U

14.1 Establishing Contact

14.1.1 Communication with the Host

The host can use the following interface to communicate with the device:
 I2C interface (see Section 10. on page 34)
 HID-I2C interface (see Section 11. on page 40)
 USB interface (see Section 12. on page 50)

14.1.2 Power-up Sequence

On power-up, the CHG line goes low to indicate that there is new data to be read from the Message Processor T5 object.
If the CHG line does not go low, there is a problem with the device.
The host should attempt to read any available messages to establish that the device is present and running following
power-up or a reset. Examples of messages include reset or calibration messages. The host should also check that there
are no configuration errors reported.

14.2 Using the Object Protocol

The device has an object-based protocol that is used to communicate with the device. Typical communication includes
configuring the device, sending commands to the device, and receiving messages from the device. Refer to the
mXT1664T2-C2U 1.1 Protocol Guide for more information.
The host must perform the following initialization so that it can communicate with the device:
1. Read the start positions of all the objects in the device from the Object Table and build up a list of these addresses.
2. Use the Object Table to calculate the report IDs so that messages from the device can be correctly interpreted.

14.3 Writing to the Device

There are a number of mechanisms for writing to the device:
 Using an I2C write operation (see Section 10.2 on page 34).
 Using the USB Generic HID write operation (see Section 12.3.1.2 on page 52).
 Using the Generic HID-I2C write operation (see Section 11.5.1.2 on page 42).
To communicate with the device, you write to the appropriate object:
 To send a command to the device, you write the appropriate command to the Command Processor T6 object (refer
to the mXT1664T2-C2U 1.1 Protocol Guide).
 To configure the device, you write to an object. For example, to configure the device power consumption you write
to the global Power Configuration T7 object, and to set up a touchscreen you write to a Multiple Touch
Touchscreen T100 object. Some objects are optional and need to be enabled before use. Refer to the
mXT1664T2-C2U 1.1 Protocol Guide for more information on the objects.

14.4 Reading from the Device

Status information is stored in the Message Processor T5 object. This object can be read to receive any status
information from the device. The following mechanisms provide an interrupt-style interface for reading messages in the
Message Processor T5 object:
 The CHG line is asserted whenever a new message is available in the Message Processor T5 object (see
Section 10.6 on page 37). See Section 10.4 on page 35 for information on the format of the I2C read operation.
 When using the USB interface, the interface provides an interrupt-driven interface that sends the messages
automatically (see Section 12.3.1.3 on page 53).
 When using the HID-I2C interface, the interface provides an interrupt-driven interface that sends the messages
automatically (see Section 11.5.1.3 on page 42)

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Note that the host should always wait to be notified of messages. The host should not poll the device for messages.

14.5 Configuring the Device

The objects are designed such that a default value of zero in their fields is a “safe” value that typically disables
functionality. The objects must be configured before use and the settings written to the nonvolatile memory using the
Command Processor T6 object.
Perform the following actions for each object:
1. Enable the object, if the object requires it.
2. Configure the fields in the object, as required.
3. Enable reporting, if the object supports messages, to receive messages from the object.
Refer to the mXT1664T2-C2U 1.1 Protocol Guide for more information on configuring the objects.
The following objects require no configuration:
 Debug Objects
 Diagnostic Debug T37
 General objects:
 Message Processor T5
 Command Processor T6
 Support objects:
 Message Count T44
The following objects must be configured before use:
 General objects
 Power Configuration T7
 Acquisition Configuration T8
The following objects should be checked and configured as necessary:
 Touch objects:
 Key Array T15
 Multiple Touch Touchscreen T100
 Signal processing objects:
 Stylus T47
 Support objects:
 Communications Configuration T18
 GPIO/PWM Configuration T19
 User Data T38
 Digitizer HID Configuration T43
 CTE Configuration T46
 Self Capacitance Global Configuration T109
 Self Capacitance Tuning Parameters T110
 Self Capacitance Configuration T111
 Self Capacitance Measurement Configuration T113
The following objects are optional and can be configured, as required:
 Signal processing objects:
 Grip Suppression T40
 Touch Suppression T42
 Shieldless T56
 Lens Bending T65
 maXCharger T72

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 Glove Detection T78

 Retransmission Compensation T80
 Symbol Gesture Processor T92
 Touch Sequence Processor T93
 Self Capacitance maXCharger T108
 Support objects:
 Self Test T25
 Timer T61
 Serial Data Command T68
 Dynamic Configuration Controller T70
 Dynamic Configuration Container T71
 CTE Scan Configuration T77
 Touch Event Trigger T79
 Auxiliary Touch Configuration T104

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Debugging

15. Debugging
The device provides a mechanism for obtaining raw data for development and testing purposes by reading data from the
Diagnostic Debug T37 object. Refer to the mXT1664T2-C2U 1.1 Protocol Guide for more information on this object.
A second mechanism is provided that allows the host to read the real-time raw data using the low-level debug port. This
can be accessed via the SPI interface or the USB interface. Note that if both the I2C-compatible and USB interfaces are
used for normal communications, the debug data is output on the USB interface. Refer to QTAN0050, Using the
maXTouch Debug Port, for more information on the debug port.
There is also a Self Test T25 object that runs self-test routines in the device to find hardware faults on the sense lines
and the electrodes. This object also performs an initial pin fault test on power-up to ensure that there is no X-to-Y short
before the high-voltage supply is enabled inside the chip. A high-voltage short into the analog circuitry would break the
device.
Refer to the mXT1664T2-C2U 1.1 Protocol Guide and QTAN0059, Using the maXTouch Self Test Feature, for more
information on the Self Test T25 object.

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Specifications

16. Specifications

16.1 Absolute Maximum Specifications

Vdd 3.6 V

VddIO 3.6 V

AVdd 3.6 V

XVdd 10.5 V

Voltage forced onto any pin –0.3 V to (Vdd or AVdd) + 0.3 V

Configuration parameters maximum writes 10,000

CAUTION: Stresses beyond those listed under Absolute Maximum Specifications may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or other conditions beyond those
indicated in the operational sections of this specification is not implied. Exposure to absolute maximum specification
conditions for extended periods may affect device reliability.

16.2 Recommended Operating Conditions

Operating temp –40C to +85C

Storage temp –60C to +150C

Vdd 3.3 V ±5%

VddIO 1.8 V to 3.3 V ±5% (I2C-compatible Mode)

3.3 V ±5% (USB Mode)

AVdd 3.3 V ±5%

External XVdd – Static 8.5 V

(1)
XVdd – With Voltage Booster enabled 6.15 V Nominal – Band Gap Referenced
7.38 V Nominal – Band Gap Referenced
8.51 V Nominal – Band Gap Referenced (Recommended)

Cx transverse load capacitance per node 0.5 pF to 3 pF

Temperature slew rate 10C/min

Notes: 1. Refer to the mXT1664T2-C2U 1.1 Protocol Guide for more information on how to configure the XVDD voltage booster mode using the
CTE Configuration T46 XVOLTAGE field.

16.2.1 Analog Voltage Supply

Parameter Min Typ Max Units Notes

Operating limits 3.14 3.3 3.47 V

Supply Rise Rates – – 0.36 V/µs

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Specifications

16.2.2 Digital Voltage Supply

Parameter Min Typ Max Units Notes

VddIO

Operating limits 1.71 – 3.47 V I2C-compatible

3.14 3.3 3.47 V USB

Supply Rise Rates – – 0.36 V/µs

Vdd

Operating limits 3.14 3.3 3.47 V

Supply Rise Rates – – 0.36 V/µs

16.2.3 XVdd Supply

Parameter Min Typ Max Units Notes

Operating limits 6.1 – 9.0 V External XVdd supply

Supply Rise Rates – – 0.1 V/µs

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Specifications

16.3 Test Configuration

The values listed below were used in the reference unit to validate the interfaces and derive the characterization data
provided in the following sections.
See mXT1664T2-C2U 1.1 Protocol Guide for information about the individual objects and their fields.
The values for the user’s application will depend on the circumstances of that particular project and will vary from those
listed here. Further tuning will be required to achieve an optimal performance.

Table 16-1. Test Configuration

Object/Parameter Description/Setting

GPIO/PWM Configuration T19 Object Enabled

Self Test T25 Object Enabled

Touch Suppression T42 Object Enabled

CTE Configuration T46

IDLESYNCSPERX 8

ACTVSYNCSPERX 16

Stylus T47 Object Enabled

Shieldless T56 Object Enabled

Lens Bending T65 Object Enabled

Dynamic Configuration Controller T70 Object Enabled

maXCharger T72 Object Enabled

Touch Event Trigger T79 Object Enabled

Retransmission Compensation T80 Object Enabled

Multiple Touch Touchscreen T100 Object Enabled

XSIZE 32

YSIZE 52

Auxiliary Touch Configuration T104 Object Enabled

Self Capacitance maXCharger T108 Object Enabled

Self Capacitance Global Configuration T109 Object Enabled

Self Capacitance Measurement Configuration T113 Object Enabled

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Specifications

16.4 Current Consumption – I2C Interface

16.4.1 Analog Supply

Acquisition Rate (ms) 0 Touches (mA) 1 Touch (mA) 5 Touches (mA) 10 Touches (mA) 15 Touches (mA)
Free-run 13.64 15.03 21.40 17.61 15.06
10 4.04 5.24 13.72 15.40 13.70
16 2.55 3.64 9.49 11.00 12.76
32 1.27 2.30 8.99 4.89 4.35
64 0.58 1.33 3.84 2.65 2.40
128 0.19 0.60 1.64 1.47 1.73
254 0.21 0.44 1.96 0.53 0.68

25.00

20.00
Current Consumption (mA)

15.00 0 Touches (mA)

1 Touch (mA)
5 Touches (mA)
10.00
10 Touches (mA)
15 Touches (mA)
5.00

0.00
Free-run 10 16 32 64 128 254
Acquisition Rate (ms)

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Specifications

16.4.2 Digital Supply

16.4.2.1 Vdd

Acquisition Rate (ms) 0 Touches (mA) 1 Touch (mA) 5 Touches (mA) 10 Touches (mA) 15 Touches (mA)
Free-run 15.13 16.52 20.53 21.54 20.89
10 4.94 6.03 13.20 18.48 20.15
16 3.19 4.11 9.88 13.14 14.37
32 1.74 2.43 8.71 6.02 7.83
64 1.07 1.62 7.07 3.43 4.44
128 0.61 0.83 1.04 3.23 3.58
254 0.48 0.65 1.55 1.90 1.53

25.00

20.00
Current Consumption (mA)

15.00 0 Touches (mA)

1 Touch (mA)
5 Touches (mA)
10.00
10 Touches (mA)
15 Touches (mA)
5.00

0.00
Free-run 10 16 32 64 128 254
Acquisition Rate (ms)

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Specifications

16.4.2.2 VddIO

Acquisition Rate (ms) 0 Touches (mA) 1 Touch (mA) 5 Touches (mA) 10 Touches (mA) 15 Touches (mA)
Free-run 1.22 1.11 1.08 1.08 1.33
10 1.26 1.25 1.02 1.21 1.33
16 1.21 1.07 1.15 1.15 1.33
32 1.20 1.20 1.23 1.31 1.23
64 1.15 1.36 1.13 1.20 1.22
128 1.25 1.27 1.28 1.30 1.21
254 1.24 1.21 1.28 1.21 1.21

1.40

1.20
Current Consumption (mA)

1.00

0.80 0 Touches (mA)

1 Touch (mA)
0.60 5 Touches (mA)
10 Touches (mA)
0.40
15 Touches (mA)

0.20

0.00
Free-run 10 16 32 64 128 254
Acquisition Rate (ms)

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Specifications

16.4.3 XVdd Supply

Acquisition Rate (ms) 0 Touches (mA) 1 Touch (mA) 5 Touches (mA) 10 Touches (mA) 15 Touches (mA)
Free-run 0.64 0.64 0.89 0.84 0.80
10 0.21 0.23 0.68 0.73 0.78
16 0.13 0.17 0.48 0.52 0.76
32 0.07 0.10 0.42 0.23 0.26
64 0.03 0.06 0.19 0.25 0.14
128 0.02 0.03 0.04 0.10 0.10
254 0.01 0.02 0.07 0.08 0.05

0.90

0.80

0.70
Current Consumption (mA)

0.60
0 Touches (mA)
0.50
1 Touch (mA)
0.40 5 Touches (mA)

0.30 10 Touches (mA)

15 Touches (mA)
0.20

0.10

0.00
Free-run 10 16 32 64 128 254
Acquisition Rate (ms)

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Specifications

16.5 Current Consumption – USB Interface

16.5.1 Analog Supply

Acquisition Rate (ms) 0 Touches (mA) 1 Touch (mA) 5 Touches (mA) 10 Touches (mA) 15 Touches (mA)
Free-run 13.52 14.98 21.30 17.98 14.91
10 4.71 5.69 13.40 13.40 14.36
16 3.36 4.46 14.05 13.80 11.79
32 2.22 3.22 5.07 6.81 6.77
64 1.65 2.64 4.59 4.53 3.47
128 1.43 1.88 2.17 2.97 2.00
254 1.27 1.53 1.50 2.20 1.99

25.00

20.00
Current Consumption (mA)

15.00 0 Touches (mA)

1 Touch (mA)
5 Touches (mA)
10.00
10 Touches (mA)
15 Touches (mA)
5.00

0.00
Free-run 10 16 32 64 128 254
Acquisition Rate (ms)

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Specifications

16.5.2 Digital Supply

16.5.2.1 Vdd

Acquisition Rate (ms) 0 Touches (mA) 1 Touch (mA) 5 Touches (mA) 10 Touches (mA) 15 Touches (mA)
Free-run 16.13 17.48 21.46 22.99 22.03
10 11.09 11.89 17.29 19.57 21.39
16 10.25 10.83 16.57 19.59 18.93
32 9.52 10.00 11.35 15.29 14.57
64 9.15 9.57 11.17 11.75 11.10
128 9.04 9.25 9.55 10.62 11.19
254 8.93 9.02 10.15 10.42 9.55

25.00

20.00
Current Consumption (mA)

15.00 0 Touches (mA)

1 Touch (mA)
5 Touches (mA)
10.00
10 Touches (mA)
15 Touches (mA)
5.00

0.00
Free-run 10 16 32 64 128 254
Acquisition Rate (ms)

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Specifications

16.5.2.2 VddIO

Acquisition Rate (ms) 0 Touches (mA) 1 Touch (mA) 5 Touches (mA) 10 Touches (mA) 15 Touches (mA)
Free-run 1.86 1.86 1.86 1.86 1.86
10 1.85 1.85 1.85 1.86 1.86
16 1.85 1.85 1.85 1.86 1.86
32 1.85 1.85 1.85 1.85 1.85
64 1.85 1.85 1.85 1.85 1.85
128 1.85 1.85 1.85 1.85 1.85
254 1.85 1.85 1.85 1.85 1.85

1.80

1.60
Current Consumption (mA)

1.40

1.20
0 Touches (mA)
1.00 1 Touch (mA)
0.80 5 Touches (mA)
10 Touches (mA)
0.60
15 Touches (mA)
0.40

0.20

0.00
Free-run 10 16 32 64 128 254
Acquisition Rate (ms)

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Specifications

16.5.3 XVdd Supply

Acquisition Rate (ms) 0 Touches (mA) 1 Touch (mA) 5 Touches (mA) 10 Touches (mA) 15 Touches (mA)
Free-run 0.64 0.65 0.89 0.84 0.80
10 0.62 0.63 0.77 0.76 0.79
16 0.62 0.63 0.78 0.79 0.76
32 0.61 0.63 0.67 0.70 0.68
64 0.61 0.63 0.67 0.65 0.64
128 0.61 0.62 0.62 0.63 0.63
254 0.61 0.62 0.62 0.63 0.62

0.90

0.80

0.70
Current Consumption (mA)

0.60
0 Touches (mA)
0.50
1 Touch (mA)
0.40 5 Touches (mA)

0.30 10 Touches (mA)

15 Touches (mA)
0.20

0.10

0.00
Free-run 10 16 32 64 128 254
Acquisition Rate (ms)

16.6 Deep Sleep Current

TA = 25C

Parameter Min Typ Max Units Notes

Deep Sleep Current – 720 – µA Vdd = 3.3 V, AVdd = 3.3 V

Deep Sleep Power – 2376 – µW Vdd = 3.3 V, AVdd = 3.3 V

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Specifications

16.7 Power Supply Ripple and Noise

Parameter Min Typ Max Units Notes

Vdd – – ±50 mV Across frequency range

1 Hz to 1 MHz

AVdd – – ±25 mV Across frequency range

1 Hz to 1 MHz

AVdd (with noise suppression enabled) – – ±40 mV Across frequency range

1 Hz to 1 MHz, with Noise
Suppression enabled

16.8 Timing Specifications

16.8.1 Touch Latency

Description Min Typ Max Units Notes

100 Hz – 23.7 – ms

16.8.2 Speed

400

350

300

250
ReportRate(Hz)

200

150

100

50

0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
NumberofTouches

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Specifications

16.8.3 Reset Timing

Parameter Min Typ Max Units Notes

Power on to CHG line low – 100 – ms Vdd supply for POR

VddIO supply for external reset

Hardware reset to CHG line low – 100 – ms

Software reset to CHG line low – 101 – ms

The mXT1664T2-C2U meets Microsoft Windows 8 requirements.

Note: Any CHG line activity before the power-on or reset period has expired should be ignored by the host. Operation
of this signal cannot be guaranteed before the power-on/reset periods have expired (see Table 16.8.3).

16.9 Input/Output Characteristics

Parameter Description Min Typ Max Units Notes

Input (RESET, GPIO, SDA, SCL)

Vil Low input logic level –0.3 – 0.3 × VddIO V VddIO = 1.8 V to Vdd

Vih High input logic level 0.7 × VddIO – VddIO V VddIO = 1.8 V to Vdd

Iil Input leakage current – – 1 µA Pull-up resistors disabled

RESET pin Internal pull-up resistor 20 40 60 k

Output (CHG, GPIO)

Vol Low output voltage 0 – 0.2 × VddIO V VDDIO = 1.8 V to VDD. Iol = -2mA

Voh High output voltage 0.8 × VddIO – VddIO V VDDIO = 1.8 V to VDD. Ioh = 2mA

16.10 I2C Specifications

Parameter Value

Addresses 0x4A or 0x4B

Maximum bus speed (SCL) 3.4 MHz

I2C specification Version 6.0

Required pull-up resistance for standard mode (100 kHz) 1 k to 10 k (1)

Required pull-up resistance for fast mode (400 kHz) 1 k to 3 k (1)

Required pull-up resistance for fast+ mode (1 MHz) 0.7 k (max) (1)

Required pull-up resistance for high-speed mode (3.4 MHz) 0.5 k to 0.75 k (1)
Notes: 1. The values of pull-up resistors should be chosen to ensure SCL and SDA rise and fall times meet the I2C specification. The value
required will depend on the amount of stray capacitance on the line.

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Specifications

16.11 USB Specification

Parameter Value

Endpoint Addresses 0x81 (Endpoint 1)

0x02 (Endpoint 2)
0x83 (Endpoint 3)

Maximum bus speed 12 Mbps

Vendor ID 0x03EB (Atmel)

Product ID 0x214F (mXT1664T2-C2U)

USB specification USB 2.0

HID specification 1.11 with amendments for multitouch digitizers

16.12 HID-I2C Specification

Parameter Value

Vendor ID 0x03EB (Atmel)

Product ID 0x214F (mXT1664T2-C2U)

HID-I2C specification 1.0

16.13 Touch Accuracy and Repeatability

Parameter Min Typ Max Units Notes

Linearity (touch only; 5.4 mm electrode pitch) – ±1 – mm 8 mm or greater finger

Linearity (touch only; 4.2 mm electrode pitch) – ±0.5 – mm 4 mm or greater finger

Accuracy – ±1 – mm

Accuracy at edge – ±2 – mm

Repeatability – ±0.25 – % X axis with 12-bit resolution

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Specifications

16.14 Thermal Packaging

16.14.1 Thermal Data

Parameter Typ Unit Condition Package

Junction to ambient thermal resistance 46.2 C/W Still air UFBGA 162, 10 × 5 mm

Junction to case thermal resistance 8.7 C/W UFBGA 162, 10 × 5 mm

16.14.2 Junction Temperature

The average chip junction temperature, TJ in C can be obtained from the following:

T J = T A +  P D   JA 

If a cooling device is required, use this equation:

T J = T A +  P D    HEATSINK +  JC  

where:
 JA= package thermal resistance, Junction to ambient (C/W).
 JC = package thermal resistance, Junction to case thermal resistance (C/W).
 HEATSINK = cooling device thermal resistance (C/W), provided in the cooling device datasheet.
 PD = device power consumption (W).
 TA is the ambient temperature (C).

16.15 ESD Information

Parameter Value Reference standard

Human Body Model (HBM) ±2000 V JEDEC JS–001

Charge Device Model (CDM) ±250 V

16.16 Soldering Profile

Profile Feature Green Package

Average Ramp-up Rate (217C to Peak) 3C/s max

Preheat Temperature 175C ±25C 150 – 200C

Time Maintained Above 217C 60 – 150 s

Time within 5C of Actual Peak Temperature 30 s

Peak Temperature Range 260C

Ramp down Rate 6C/s max

Time 25C to Peak Temperature 8 minutes max

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Specifications

16.17 Moisture Sensitivity Level (MSL)

MSL Rating Package Type(s) Peak Body Temperature Specifications

MSL3 BGA 260oC IPC/JEDEC J-STD-020

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Package Information

17. Package Information

17.1 Part Marking

17.1.1 ATMXT1664T2-C2U – 162-ball UFBGA

A1 Ball ID

Abbreviation of Silicon Die

Part Number Revision

Date Code
ATMXT1664T2-C2U
(variable text)
YYWW# ##
Lot Code
(variable text)
LOTCODE Country Code

17.2 Orderable Part Number

Firmware Silicon Die

Orderable Part Number QS Number Revision Revision(1) Description

ATMXT1664T2-C2U 961 1.1 D 162-ball 10 × 5 × 0.6 mm, 0.5 mm pitch

(Supplied in trays) UFBGA, RoHS compliant

ATMXT1664T2-C2UR 961 1.1 D 162-ball 10 × 5 × 0.6 mm, 0.5 mm pitch

(Supplied in tapes and reels) UFBGA, RoHS compliant

Notes: 1. Refer to Application Note MXTAN0205: Reading the Revision ID on T2 Devices for information on the Silicon Die Revision

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Package Information

17.3 Mechanical Drawings

17.3.1 UFBGA 162 Balls

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QMatrix Primer

Appendix A. QMatrix Primer

A.1 Acquisition Technique

QMatrix capacitive acquisition uses a series of pulses to deposit charge into a sampling capacitor, Cs. The pulses are driven on
X lines from the controller. The rising edge of the pulse causes current to flow in the mutual capacitance, Cx, formed between
the X line and a neighboring receiver electrode or Y line. While one X line is being pulsed, all others are grounded. This leads to
excellent isolation of the particular mutual capacitances being measured (1), a feature that makes for good inherent touchscreen
performance.
After a fixed number of pulses (known as the burst length) the sampling capacitor's voltage is measured to determine how
much charge has accumulated. This charge is directly proportional to Cx and therefore changes if Cx (2) changes. The transmit-
receive charge transfer process between the X lines and Y lines causes an electric field to form that loops from X to Y. The field
itself emanates from X and terminates on Y. If the X and Y electrodes are fixed directly (3) to a dielectric material like plastic or
glass, then this field tends to channel through the dielectric with very little leakage of the field out into free-space (that is, above
the panel). Some proportion of the field does escape the surface of the dielectric, however, and so can be influenced during a
touch.
When a finger is placed in close proximity (a few millimeters) or directly onto the dielectric's surface, some of this stray field and
some of the field that would otherwise have propagated via the dielectric and terminated onto the Y electrode, is diverted into
the finger and is conducted back to the controller chip via the human body rather than via the Y line.
This means that less charge is accumulated in Cs, and hence the terminal voltage present on Cs, after all the charge transfer
pulses are complete, becomes less. In this way, the controller can measure changes in Cx during touch. This means that the
measured capacitance Cx goes down during touch, because the coupled field is partly diverted by the touching object.
The spatial separation between the X and Y electrodes is significant to make the electric field to propagate well in relation to the
thickness of the dielectric panel.

A.2 Moisture Resistance

A useful side effect of the QMatrix acquisition method is that placing a floating conductive element between the X and Y lines
tends to increase the field coupling and so increases the capacitance Cx. This is the opposite change direction to normal touch,
and so can be quite easily ignored or compensated for by the controller. An example of such floating conductive elements is
the water droplets caused by condensation.
As a result, QMatrix-based touchscreens tend not to go into false detect when they are covered in small non-coalesced water
droplets. Once the droplets start to merge, however, they can become large enough to bridge the field across to nearby ground
return paths (for example, other X lines not currently driven, or ground paths in mechanical chassis components). When this
happens, the screen's behavior can become erratic.
There are some measures used in these controllers to help with this situation, but in general there comes a point where the
screen is so contaminated by moisture that false detections become inevitable. It should also be noted that uniform
condensation soon becomes non-uniform once a finger has spread it around. Finger grease renders the water highly
conductive, making the situation worse overall.
In general, QMatrix has industry-leading moisture tolerance but there comes a point when even the best capacitive touchscreen
suffers due to moisture on the dielectric surface.

1. A common problem with other types of capacitive acquisition technique when used for touchscreens, is that this isolation is not so pronounced.
This means that when touching one region of the screen, the capacitive signals also tend to change slightly in nearby nodes too, causing
small but often significant errors in the reported touch position.
2. To a first approximation.
3. Air gaps in front of QMatrix sensors massively reduce this field propagation and kill sensitivity. Normal optically clear adhesives work well to
attach QMatrix touchscreens to their dielectric front panel.

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QMatrix Primer

A.3 Interference Sources

A.3.1 Power Supply

The device can tolerate short-term power supply fluctuations. If the power supply fluctuates slowly with temperature, the
device tracks and compensate for these changes automatically with only minor changes in sensitivity. If the supply
voltage drifts or shifts quickly, the drift compensation mechanism is not able to keep up, causing sensitivity anomalies or
false detections.
If power supply noise is present (usually caused by LEDs, relays, or other high current devices) and affects the
measurement results then a separate Low Dropout (LDO) type regulator should be used for the AVdd power supply.
It is recommended that all ceramic decoupling capacitors on supply lines are placed very close (<5 mm) to the chip. A
bulk capacitor of at least 2.2 µF and a higher frequency capacitor of around 10 nF to 100 nF in parallel are
recommended; both must be X7R or X5R dielectric capacitors.

A.3.2 Other Noise Sources

Refer to QTAN0079, Buttons, Sliders and Wheels Sensor Design Guide, for information (downloadable from the Touch
Technology area of the Atmel website).

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I2C Basics (I2C Operation)

Appendix B. I2C Basics (I2C Operation)

B.1 Interface Bus

The device communicates with the host over an I2C bus. The following sections give an overview of the bus; more
detailed information is available from www.nxp.com/documents/user_manual/UM10204.pdf. Devices are connected to the
I2C bus as shown in Figure B-1. Both bus lines are connected to Vdd via pull-up resistors. The bus drivers of all I2C
devices must be open-drain type. This implements a wired AND function that allows any and all devices to drive the bus,
one at a time. A low level on the bus is generated when a device outputs a zero.

Figure B-1. I2C Interface Bus

Vdd

Device 1 Device 2 Device 3 Device n R1 R2

SDA

SCL

B.2 Transferring Data Bits

Each data bit transferred on the bus is accompanied by a pulse on the clock line. The level of the data line must be stable
when the clock line is high; the only exception to this rule is for generating START and STOP conditions.

Figure B-2. Data Transfer

SDA

SCL

Data Stable Data Stable

Data Change

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I2C Basics (I2C Operation)

B.3 START and STOP Conditions

The host initiates and terminates a data transmission. The transmission is initiated when the host issues a START
condition on the bus, and is terminated when the host issues a STOP condition. Between the START and STOP
conditions, the bus is considered busy. As shown in Figure B-3, START and STOP conditions are signaled by changing
the level of the SDA line when the SCL line is high.

Figure B-3. START and STOP Conditions

SDA

SCL

START STOP

B.4 Address Byte Format

All address bytes are 9 bits long, consisting of 7 address bits, one READ/WRITE control bit and an acknowledge bit. If
the READ/WRITE bit is set, a read operation is performed, otherwise a write operation is performed. When the device
recognizes that it is being addressed, it will acknowledge by pulling SDA low in the ninth SCL (ACK) cycle. An address
byte consisting of a slave address and a READ or a WRITE bit is called SLA+R or SLA+W, respectively.
The most significant bit of the address byte is transmitted first. The address sent by the host must be consistent with that
selected with the option jumpers.

Figure B-4. Address Byte Format

Addr MSB Addr LSB R/W ACK

SDA

SCL

1 2 7 8 9
START

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I2C Basics (I2C Operation)

B.5 Data Byte Format

All data bytes are 9 bits long, consisting of 8 data bits and an acknowledge bit. During a data transfer, the host generates
the clock and the START and STOP conditions, while the receiver is responsible for acknowledging the reception. An
acknowledge (ACK) is signaled by the receiver pulling the SDA line low during the ninth SCL cycle. If the receiver leaves
the SDA line high, a NACK is signaled.

Figure B-5. Data Byte Format

Data MSB Data LSB ACK

Aggregate
SDA

SDA from
Transmitter

SDA from
Receiver

SCL from
Master
1 2 7 8 9

SLA+R/W Data Byte Stop or Next

Data Byte

B.6 Combining Address and Data Bytes into a Transmission

A transmission consists of a START condition, an SLA+R/W, one or more data bytes and a STOP condition. The wired
“ANDing” of the SCL line is used to implement handshaking between the host and the device. The device extends the
SCL low period by pulling the SCL line low whenever it needs extra time for processing between the data transmissions.
Note: Each write or read cycle must end with a stop condition. The device may not respond correctly if a cycle is
terminated by a new start condition.
Figure B-6 shows a typical data transmission. Note that several data bytes can be transmitted between the SLA+R/W
and the STOP.

Figure B-6. Byte Transmission

Addr MSB Addr LSB R/W ACK Data MSB Data LSB ACK

SDA

SCL

1 2 7 8 9
1 2 7 8 9
START SLA+RW Data Byte STOP

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Glossary of Terms

Appendix C. Glossary of Terms

Channel
See Node.
Jitter
The peak-to-peak variance in the reported location for an axis when a fixed touch is applied. Typically jitter is
random in nature and has a Gaussian (1) distribution, therefore measurement of peak-to-peak jitter must be
conducted over some period of time, typically a few seconds. Jitter is typically measured as a percentage of the
axis in question.
For example a 100 × 100 mm Touchscreen that shows ±0.5% jitter in X and ±1% jitter in Y would show a peak
deviation from the average reported coordinate of ±0.5 mm in X and ±1 mm in Y. Note that by defining the jitter
relative to the average reported coordinate, the effects of linearity are ignored.
Linearity
The measurement of the peak-to-peak deviation of the reported touch coordinate in one axis relative to the
absolute position of touch on that axis. This is often referred to as the nonlinearity. Non-linearity in either X or Y
axes manifest themselves as regions where the perceived touch motion along that axis (alone) is not reflected
correctly in the reported coordinate giving the sense of moving too fast or too slow. Linearity is measured as a
percentage of the axis in question.
For each axis, a plot of the true coordinate versus the reported coordinate should be a perfect straight line at
45. A non-linearity makes this plot deviate from this ideal line. It is possible to correct modest non-linearity
using on-chip linearization tables, but this correction trades linearity for resolution in regions where stronger
corrections are needed (because there is a stretching or compressing effect to correct the nonlinearity, so
altering the resolution in these regions). Linearity is typically measured using data that has been sufficiently
filtered to remove the effects of jitter. For example, a 100 mm slider with a nonlinearity of ±1% reports a position
that is, at most, 1 mm away in either direction from the true position.
Multitouch
The ability of a touchscreen to report multiple concurrent touches. The touches are reported as separate sets of XY
co-ordinates.
Node
One of the capacitive measurement points at which the sensor controller can detect capacitive change.
Resolution
The measure of the smallest movement on a slider or touchscreen in an axis that causes a change in the
reported coordinate for that axis. Resolution is normally expressed in bits and tends to refer to resolution across
the whole axis in question. For example, a resolution of 10 bits can resolve a movement of 0.0977 mm on a
slider 100 mm long. Jitter in the reported position degrades usable resolution.
Touchscreen
A two-dimensional arrangement of electrodes whose capacitance changes when touched, allowing the location
of touch to be computed in both X and Y axes. The output from the XY computation is a pair of numbers,
typically 12-bits each, ranging from 0 to 4095, representing the extents of the touchscreen active region.

1. Sometimes called Bell-shaped or Normal distribution.

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Associated Documents

Associated Documents

Note: The documents listed below are available under NDA only. In addition, some documents may have further
restrictions placed upon them.
For information on using and configuring the device, see the following:
 mXT1664T2-C2U 1.1 Protocol Guide (distributed with Atmel approval only)
The following documents may also be useful (available by contacting Atmel Touch Technology Division):
 Touchscreen design and PCB/FPCB layout guidelines:
 Application Note: QTAN0054 – Getting Started with maXTouch Touchscreen Designs
 Application Note: MXTAN0208 – Design Guide for PCB Layouts for Atmel Touch Controllers
 Application Note: QTAN0080 – Touchscreens Sensor Design Guide
 Configuring the device:
 Application Note: QTAN0078 – maXTouch Stylus Tuning
 Application Note: QTAN0059 – Using the maXTouch Self Test Feature
 Application Note: QTAN0070 – Recovering from Palm Touches During Calibration with maXTouch
Touchscreen Controllers
 Miscellaneous:
 Application Note: QTAN0050 – Using the maXTouch Debug Port
 Application Note: QTAN0058 – Rejecting Unintentional Touches with the maXTouch Touchscreen
Controllers
 Application Note: QTAN0061 – maXTouch Sensitivity Effects for Mobile Devices
 Application Note: QTAN0083 – Power and Speed Considerations
 Application Note: QTAN0051 – Bootloading Procedure for Atmel Touch Sensors Based on the Object
Protocol
 Tools:
 QTAN0101 – Object Server User Guide

mXT1664T2-C2U 1.1 [Datasheet] 92

9998DX–AT42–02/15
Revision History

Revision History

Revision Number History

Revision AX – May 2014 Initial edition for firmware revision 1.1 – Preliminary

Revision BX – September 2014 Updated for firmware revision 1.1.AC – Release

 Corrected description of ball J2
 Added ordering information for firmware 1.1.AC devices
 Changed location of Host Communications information

Revision CX – December 2014  Corrected reset value

 Revised component labeling
 Revised voltage regulator recommendations
 Revised description of USB interface (no functional change)

Revision DX – February 2015  Updated Power-up / Reset Requirements section

mXT1664T2-C2U 1.1 [Datasheet] 93

9998DX–AT42–02/15
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