STTH812

Ultrafast recovery - 1200 V diode

Main product characteristics

A K
IF(AV) 8A
VRRM 1200 V
Tj 175° C A
VF (typ) 1.25 V A
trr (typ) 50 ns K K
TO-220AC TO-220FPAC
Features and benefits STTH812D STTH812FP

■ Ultrafast, soft recovery

■ Very low conduction and switching losses K
■ High frequency and/or high pulsed current
operation
A
■ High reverse voltage capability A
■ High junction temperature K
NC
■ Insulated packages:
D2PAK TO-220Ins
– TO-220Ins
Electrical insulation = 2500 VRMS STTH812G STTH812DI
Capacitance = 7 pF
– TO-220FPAC
Electrical insulation = 2000 VRMS Order codes
Capacitance = 12 pF
Part Number Marking

Description STTH812D STTH812D

The high quality design of this diode has STTH812G STTH812G

produced a device with low leakage current, STTH812G-TR STTH812G
regularly reproducible characteristics and intrinsic
STTH812FP STTH812FP
ruggedness. These characteristics make it ideal
for heavy duty applications that demand long term STTH812DI STTH812DI
reliability.
Such demanding applications include industrial
power supplies, motor control, and similar
mission-critical systems that require rectification
and freewheeling. These diodes also fit into
auxiliary functions such as snubber, bootstrap,
and demagnetization applications.
The improved performance in low leakage current,
and therefore thermal runaway guard band, is an
immediate competitive advantage for this device.

March 2006 Rev 1 1/11

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Characteristics STTH812

1 Characteristics

Table 1. Absolute ratings (limiting values at 25° C, unless otherwise specified)

Symbol Parameter Value Unit

VRRM Repetitive peak reverse voltage 1200 V

2
TO-220AC / D PAK / TO-220FPAC 30
IF(RMS) RMS forward current A
TO-220AC Ins 20
TO-220AC / D2PAK Tc = 140° C
IF(AV) Average forward current, δ = 0.5 TO-220FPAC Tc = 75° C 8 A
TO-220AC Ins Tc = 115° C
IFRM Repetitive peak forward current tp = 5 µs, F = 5 kHz square 100 A
IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 80 A
Tstg Storage temperature range -65 to + 175 °C
Tj Maximum operating junction temperature 175 °C

Table 2. Thermal parameters

Symbol Parameter Value Unit
2PAK
TO-220AC / D 1.9
Rth(j-c) Junction to case TO-220FPAC 5.4 °C/W
TO-220AC Ins 3.1

Table 3. Static electrical characteristics

Symbol Parameter Test conditions Min. Typ Max. Unit

Tj = 25° C 8
IR(1) Reverse leakage current VR = VRRM µA
Tj = 125° C 5 50
Tj = 25° C 2.2
(2)
VF Forward voltage drop Tj = 125° C IF = 8 A 1.30 2.0 V
Tj = 150° C 1.25 1.9
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %

To evaluate the conduction losses use the following equation:

P = 1.5 x IF(AV) + 0.05 IF2(RMS)

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STTH812 Characteristics

Table 4. Dynamic characteristics

Symbol Parameter Test conditions Min. Typ Max. Unit

IF = 1 A, dIF/dt = -50 A/µs,

100
VR = 30 V, Tj = 25° C
trr Reverse recovery time ns
IF = 1 A, dIF/dt = -100 A/µs,
50 70
VR = 30 V, Tj = 25° C
IF = 8 A, dIF/dt = -200 A/µs,
IRM Reverse recovery current 14 21 A
VR = 600 V, Tj = 125° C
IF = 8 A, dIF/dt = -200 A/µs,
S Softness factor 2
VR = 600 V, Tj = 125° C
IF = 8 A dIF/dt = 50 A/µs
tfr Forward recovery time 400 ns
VFR = 1.5 x VFmax, Tj = 25° C
IF = 8 A, dIF/dt = 50 A/µs,
VFP Forward recovery voltage 7 V
Tj = 25° C

Figure 1. Conduction losses versus Figure 2. Forward voltage drop versus

average current forward current
P(W) IFM(A)
20 80
δ = 0.1 δ = 0.2
18 δ = 0.05 δ = 0.5
70
16 Tj=150°C
(typical values)
60
14 δ=1

50
12

10 40
Tj=25°C
8 (maximum values)
30
Tj=150°C
6 (maximum values)
T 20
4
10
2
IF(AV)(A) δ=tp/T tp VFM(V)
0 0
0 1 2 3 4 5 6 7 8 9 10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Figure 3. Relative variation of thermal Figure 4. Relative variation of thermal

impedance junction to case impedance junction to case versus
versus pulse duration pulse duration
Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c)
1.0 1.0
Single pulse Single pulse
0.9 TO-220AC 0.9 TO-220FPAC
D2PAK
TO-220Ins
0.8 0.8

0.7 0.7

0.6 0.6

0.5 0.5

0.4 0.4

0.3 0.3

0.2 0.2

0.1 0.1
tp(s) tp(s)
0.0 0.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01

3/11
Characteristics STTH812

Figure 5. Peak reverse recovery current Figure 6. Reverse recovery time versus dIF/dt
versus dIF/dt (typical values) (typical values)
IRM(A) trr(ns)
35 500
VR=600V
VR=600V Tj=125°C
450 IF=2 x IF(AV)
Tj=125°C
30 IF=2 x IF(AV)
400

25 IF=IF(AV) 350 IF=IF(AV)

300 IF=0.5 x IF(AV)

20 IF=0.5 x IF(AV)

250
15 200

10 150

100
5
50
dIF/dt(A/µs) dIF/dt(A/µs)
0 0
0 50 100 150 200 250 300 350 400 450 500 0 50 100 150 200 250 300 350 400 450 500

Figure 7. Reverse recovery charges versus Figure 8. Softness factor versus dIF/dt
dIF/dt (typical values) (typical values)
Qrr(µC) S factor
3.0 4.0
VR=600V IF ≤ 2xIF(AV)
Tj=125°C VR=600V
3.5 Tj=125°C
2.5
IF=2 x IF(AV)

3.0
2.0

IF=IF(AV) 2.5
1.5
IF=0.5 x IF(AV)
2.0

1.0
1.5

0.5 1.0
dIF/dt(A/µs) dIF/dt(A/µs)
0.0 0.5
0 50 100 150 200 250 300 350 400 450 500
0 50 100 150 200 250 300 350 400 450 500

Figure 9. Relative variations of dynamic Figure 10. Transient peak forward voltage
parameters versus junction versus dIF/dt (typical values)
temperature
VFP(V)
2.25 45
IF=IF(AV)
VR=600V IF=IF(AV)
2.00 Reference: Tj=125°C Tj=125°C
40
1.75
S factor 35
1.50
30
1.25
25
1.00
20
trr
0.75
IRM 15
0.50
10
QRR
0.25
Tj(°C) 5
0.00 dIF/dt(A/µs)
25 50 75 100 125 0
0 100 200 300 400 500

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STTH812 Characteristics

Figure 11. Forward recovery time versus dIF/dt Figure 12. Junction capacitance versus
(typical values) reverse voltage applied (typical
values)
tfr(ns) C(pF)
700 1000
IF=IF(AV) F=1MHz
VFR=1.5 x VF max. VOSC=30mVRMS
Tj=125°C Tj=25°C

600

100
500

400
10

300

dIF/dt(A/µs) VR(V)
200 1
0 100 200 300 400 500 1 10 100 1000

Figure 13. Thermal resistance junction to

ambient versus copper surface
under tab (Epoxy printed circuit
board FR4, ecu = 35 µm)
Rth(j-a)(°C/W)
80

70

60

50

40

30

20

10
SCU(cm²)
0
0 5 10 15 20 25 30 35 40

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Package mechanical data STTH812

2 Package mechanical data

Epoxy meets UL94, V0

Cooling method: by conduction (C)
Recommended torque value: 0.55 Nm (TO-220AC)
Maximum torque value: 0.7 Nm (TO-220AC)

Table 5. T0-220AC dimensions

DIMENSIONS

REF. Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

H2 A

ØI
C 1.23 1.32 0.048 0.051
C
D 2.40 2.72 0.094 0.107
L5
L7 E 0.49 0.70 0.019 0.027

L6 F 0.61 0.88 0.024 0.034

L2 F1 1.14 1.70 0.044 0.066

G 4.95 5.15 0.194 0.202
F1 L9 D
H2 10.00 10.40 0.393 0.409

L4 L2 16.40 typ. 0.645 typ.

F L4 13.00 14.00 0.511 0.551
M L5 2.65 2.95 0.104 0.116
E
L6 15.25 15.75 0.600 0.620
G
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam. I 3.75 3.85 0.147 0.151

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STTH812 Package mechanical data

Table 6. T0-220Ins dimensions

DIMENSIONS

REF Millimeters Inches

Min. Max. Min. Max.

A 15.20 15.90 0.598 0.625

B C a1 3.75 0.147
ØI b2
a2 13.00 14.00 0.511 0.551
L
F B 10.00 10.40 0.393 0.409

A b1 0.61 0.88 0.024 0.034

I4 b2 1.23 1.32 0.048 0.051

c2 C 4.40 4.60 0.173 0.181

a1

l2
c1 0.49 0.70 0.019 0.027
a2
c2 2.40 2.72 0.094 0.107

M e 4.80 5.40 0.189 0.212

b1 c1
e F 6.20 6.60 0.244 0.259
ØI 3.75 3.85 0.147 0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
M 2.60 0.102

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Package mechanical data STTH812

Table 7. T0-220FPAC dimensions

DIMENSIONS

REF Millimeters Inches

Min. Max. Min. Max.

A A 4.4 4.6 0.173 0.181

H B B 2.5 2.7 0.098 0.106

D 2.5 2.75 0.098 0.108

Dia E 0.45 0.70 0.018 0.027

F 0.75 1 0.030 0.039

L6
F1 1.15 1.70 0.045 0.067
L2 L7
G 4.95 5.20 0.195 0.205
L3

L5 G1 2.4 2.7 0.094 0.106

D H 10 10.4 0.393 0.409

F1
L4 L2 16 Typ. 0.63 Typ.

L3 28.6 30.6 1.126 1.205

F E L4 9.8 10.6 0.386 0.417
G1
L5 2.9 3.6 0.114 0.142
G
L6 15.9 16.4 0.626 0.646

L7 9.00 9.30 0.354 0.366

Dia. 3.00 3.20 0.118 0.126

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STTH812 Package mechanical data

Table 8. D2PAK dimensions

DIMENSIONS

REF. Millimeters Inches

Min. Max Min. Max.

A 4.40 4.60 0.173 0.181

A

E A1 2.49 2.69 0.098 0.106

C2
L2
A2 0.03 0.23 0.001 0.009

B 0.70 0.93 0.027 0.037

D
L
B2 1.14 1.70 0.045 0.067
L3
A1 C 0.45 0.60 0.017 0.024
B2
C R
C2 1.23 1.36 0.048 0.054
B
D 8.95 9.35 0.352 0.368
G
E 10.00 10.40 0.393 0.409
A2
G 4.88 5.28 0.192 0.208

M L 15.00 15.85 0.590 0.624

* V2
L2 1.27 1.40 0.050 0.055
* FLAT ZONE NO LESS THAN 2mm
L3 1.40 1.75 0.055 0.069

M 2.40 3.20 0.094 0.126

R 0.40 typ. 0.016 typ.

V2 0° 8° 0° 8°

Figure 14. D2PAK footprint (dimensions in mm)

16.90

10.30 5.08

1.30

3.70
8.90

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.

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Ordering information STTH812

3 Ordering information

Part Number Marking Package Weight Base qty Delivery mode

STTH812D STTH812D TO-220AC 1.86 g 50 Tube

STTH812DI STTH812DI TO-220Ins 1.86 g 50 Tube
STTH812FP STTH812FP TO-220FPAC 2.2 g 50 Tube
STTH812G STTH812G D2 PAK 1.48 g 50 Tube
STTH812G-TR STTH812G D2 PAK 1.48 g 1000 Tape & reel

4 Revision history

Date Revision Description of Changes

02-Mar-2006 1 First issue.

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STTH812

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