LMV 431
LMV 431
LMV 431
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMV431, LMV431A, LMV431B
SNVS041G – MAY 2004 – REVISED SEPTEMBER 2014 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.9 LMV431BC Electrical Characteristics ....................... 9
2 Applications ........................................................... 1 7.10 LMV431BI Electrical Characteristics ..................... 10
3 Description ............................................................. 1 7.11 Typical Performance Characteristics .................... 11
4 Symbol and Functional Diagrams........................ 1 8 Detailed Description ............................................ 15
8.1 Functional Block Diagram ....................................... 15
5 Revision History..................................................... 2
6 Pin Configurations and Functions ....................... 3 9 Application and Implementation ........................ 16
9.1 Typical Application ................................................. 16
7 Specifications......................................................... 4
9.2 DC/AC Test Circuit.................................................. 18
7.1 Absolute Maximum Ratings ...................................... 4
7.2 Handling Ratings ...................................................... 4 10 Device and Documentation Support ................. 18
10.1 Documentation Support ....................................... 18
7.3 Recommended Operating Conditions....................... 4
10.2 Trademarks ........................................................... 18
7.4 Thermal Information .................................................. 4
10.3 Electrostatic Discharge Caution ............................ 18
7.5 LMV431C Electrical Characteristics.......................... 5
10.4 Glossary ................................................................ 19
7.6 LMV431I Electrical Characteristics ........................... 6
7.7 LMV431AC Electrical Characteristics ..................... 7 11 Mechanical, Packaging, and Orderable
7.8 LMV431AI Electrical Characteristics......................... 8
Information ........................................................... 19
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Changed formatting to match new TI datasheet guidelines; added Device Information and Handling Ratings tables,
Layout, and Device and Documentation Support sections; reformatted Detailed Description and Application and
Implementation sections. ....................................................................................................................................................... 1
• Added spec............................................................................................................................................................................. 4
REF CATHODE
SOT-23
Top View
7 Specifications
7.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Industrial (LMV431AI, LMV431I) −40 85
Operating temperature
Commercial (LMV431AC, LMV431C, LMV431BC) 0 70
°C
Lead temperature TO-92 Package/SOT-23 -5,-3 Package 265
(Soldering, 10 sec.)
Internal power dissipation (2) TO-92 0.78 W
SOT-23-5, -3 Package 0.28 W
Cathode voltage 35 V
Continuous cathode current −30 30
mA
Reference input current −.05 3
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Ratings apply to ambient temperature at 25°C. Above this temperature, derate the TO-92 at 6.2 mW/°C, and the SOT-23-5 at 2.2
mW/°C. See derating curve in Operating Condition section.
(1) The human body model is a 100 pF capacitor discharged through a 1.5kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin. MIL-STD-883 3015.7.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) TJ Max = 150°C, TJ = TA+ (RθJA PD), where PD is the operating power of the device.
R1 = 10 kΩ, R2 = ∞
IREF Reference Input Current 0.15 0.5 μA
II = 10 mA (see Figure 33)
Deviation of Reference Input Current R1 = 10 kΩ, R2 = ∞,
∝IREF 0.05 0.3 μA
over Temperature II = 10 mA, TA = Full Range (see Figure 33)
Minimum Cathode Current for
IZ(MIN) VZ = VREF(see Figure 32) 55 80 µA
Regulation
IZ(OFF) Off-State Current VZ= 6 V, VREF = 0 V (see Figure 34 ) 0.001 0.1 μA
VZ = VREF, IZ = 0.1 mA to 15 mA
rZ Dynamic Output Impedance (2) 0.25 0.4 Ω
Frequency = 0 Hz (see Figure 32)
(1) Deviation of reference input voltage, VDEV, is defined as the maximum variation of the reference input voltage over the full temperature
range. See the following:
The average temperature coefficient of the reference input voltage, ∝VREF, is defined as:
§ V VMin · 6 § VDEV · 6
r ¨ Max ¸ 10 r¨ ¸ 10
ppm V
© REF (at 25qC) ¹ V
© REF (at 25 q C) ¹
v VREF
qC T2 T1 T2 T1
Where: T2 − T1 = full temperature change. ∝VREF can be positive or negative depending on whether the slope is positive or negative.
Example: VDEV = 6 mV, VREF = 1240 mV, T2 − T1 = 125°C.
§ 6.0 mV · 6
¨ ¸ 10
v VREF © 1240 mV ¹ 39 ppm / qC
125qC
(2) The dynamic output impedance, rZ, is defined as:
'VZ
rZ
'IZ
When the device is programmed with two external resistors, R1 and R2, (see Figure 33 ), the dynamic output impedance of the overall
circuit, rZ, is defined as:
'VZ ª § R1 · º
rZ # «rZ ¨ 1 ¸»
'IZ ¬ © R2 ¹ ¼
(1) Deviation of reference input voltage, VDEV, is defined as the maximum variation of the reference input voltage over the full temperature
range. See the following:
The average temperature coefficient of the reference input voltage, ∝VREF, is defined as:
§ V VMin · 6 § VDEV · 6
r ¨ Max ¸ 10 r¨ ¸ 10
v VREF
ppm © VREF (at 25qC) ¹ © VREF (at 25q C) ¹
qC T2 T1 T2 T1
Where: T2 − T1 = full temperature change. ∝VREF can be positive or negative depending on whether the slope is positive or negative.
Example: VDEV = 6 mV, VREF = 1240 mV, T2 − T1 = 125°C.
§ 6.0 mV · 6
¨ ¸ 10
v VREF © 1240 mV ¹ 39 ppm / qC
125qC
(2) The dynamic output impedance, rZ, is defined as:
'VZ
rZ
'IZ
When the device is programmed with two external resistors, R1 and R2, (see Figure 33 ), the dynamic output impedance of the overall
circuit, rZ, is defined as:
'VZ ª § R1 · º
rZ # «rZ ¨ 1 ¸»
'IZ ¬ © R2 ¹ ¼
IZ = 10 mA (see Figure 33 )
'VREF Ratio of the Change in Reference Voltage
VZ from VREF to 6 V −1.5 −2.7 mV/V
to the Change in Cathode Voltage
'VZ R1 = 10 kΩ, R2 = ∞ and 2.6 kΩ
R1 = 1 kΩ, R2 = ∞
IREF Reference Input Current 0.15 0.50 μA
II = 10 mA (see Figure 33)
Deviation of Reference Input Current over R1 = 10 kΩ, R2 = ∞,
∝IREF 0.05 0.3 μA
Temperature II = 10 mA, TA = Full Range (see Figure 33)
IZ(MIN) Minimum Cathode Current for Regulation VZ = VREF(see Figure 32) 55 80 µA
IZ(OFF) Off-State Current VZ = 6 V, VREF = 0V (see Figure 34 ) 0.001 0.1 μA
VZ = VREF, IZ = 0.1mA to 15mA
rZ Dynamic Output Impedance (2) 0.25 0.4 Ω
Frequency = 0 Hz (see Figure 32)
(1) Deviation of reference input voltage, VDEV, is defined as the maximum variation of the reference input voltage over the full temperature
range. See the following:
The average temperature coefficient of the reference input voltage, ∝VREF, is defined as:
§ V VMin · 6 § VDEV · 6
r ¨ Max ¸ 10 r¨ ¸ 10
v VREF
ppm © VREF (at 25qC) ¹ © VREF (at 25q C) ¹
qC T2 T1 T2 T1
Where: T2 − T1 = full temperature change. ∝VREF can be positive or negative depending on whether the slope is positive or negative.
Example: VDEV = 6 mV, VREF = 1240 mV, T2 − T1 = 125°C.
§ 6.0 mV · 6
¨ ¸ 10
v VREF © 1240 mV ¹ 39 ppm / qC
125qC
(2) The dynamic output impedance, rZ, is defined as:
'VZ
rZ
'IZ
When the device is programmed with two external resistors, R1 and R2, (see Figure 33 ), the dynamic output impedance of the overall
circuit, rZ, is defined as:
'VZ ª § R1 · º
rZ # «rZ ¨ 1 ¸»
'IZ ¬ © R2 ¹¼
R1 = 10 kΩ, R2 = ∞
IREF Reference Input Current 0.15 0.5 μA
II = 10 mA (see Figure 33)
Deviation of Reference Input Current over R1 = 10 kΩ, R2 = ∞,
∝IREF 0.1 0.4 μA
Temperature II = 10 mA, TA = Full Range (see Figure 33)
IZ(MIN) Minimum Cathode Current for Regulation VZ = VREF(see Figure 32) 55 80 µA
IZ(OFF) Off-State Current VZ = 6 V, VREF = 0 V (see Figure 34 ) 0.001 0.1 μA
VZ = VREF, IZ = 0.1 mA to 15 mA
rZ Dynamic Output Impedance (2) 0.25 0.4 Ω
Frequency = 0 Hz (see Figure 32)
(1) Deviation of reference input voltage, VDEV, is defined as the maximum variation of the reference input voltage over the full temperature
range. See the following:
The average temperature coefficient of the reference input voltage, ∝VREF, is defined as:
§ V VMin · 6 § VDEV · 6
r ¨ Max ¸ 10 r¨ ¸ 10
v VREF
ppm © VREF (at 25qC) ¹ © VREF (at 25q C) ¹
qC T2 T1 T2 T1
Where: T2 − T1 = full temperature change. ∝VREF can be positive or negative depending on whether the slope is positive or negative.
Example: VDEV = 6 mV, VREF = 1240 mV, T2 − T1 = 125°C.
§ 6.0 mV · 6
¨ ¸ 10
v VREF © 1240 mV ¹ 39 ppm / qC
125qC
(2) The dynamic output impedance, rZ, is defined as:
'VZ
rZ
'IZ
When the device is programmed with two external resistors, R1 and R2, (see Figure 33 ), the dynamic output impedance of the overall
circuit, rZ, is defined as:
'VZ ª § R1 · º
rZ # «rZ ¨ 1 ¸»
'IZ ¬ © R2 ¹¼
IZ = 10 mA (see Figure 33 )
'VREF Ratio of the Change in Reference Voltage
VZ from VREF to 6 V −1.5 −2.7 mV/V
to the Change in Cathode Voltage
'VZ R1 = 10 kΩ, R2 = ∞ and 2.6 kΩ
R1 = 10 kΩ, R2 = ∞
IREF Reference Input Current 0.15 0.50 μA
II = 10 mA (see Figure 33)
Deviation of Reference Input Current over R1 = 10 kΩ, R2 = ∞,
∝IREF 0.05 0.3 μA
Temperature II = 10 mA, TA = Full Range (see Figure 33)
IZ(MIN) Minimum Cathode Current for Regulation VZ = VREF(see Figure 32) 55 80 µA
IZ(OFF) Off-State Current VZ = 6 V, VREF = 0V (see Figure 34 ) 0.001 0.1 μA
VZ = VREF, IZ = 0.1mA to 15mA
rZ Dynamic Output Impedance (2) 0.25 0.4 Ω
Frequency = 0 Hz (see Figure 32)
(1) Deviation of reference input voltage, VDEV, is defined as the maximum variation of the reference input voltage over the full temperature
range. See the following:
The average temperature coefficient of the reference input voltage, ∝VREF, is defined as:
§ V VMin · 6 § VDEV · 6
r ¨ Max ¸ 10 r¨ ¸ 10
v VREF
ppm © VREF (at 25qC) ¹ © VREF (at 25q C) ¹
qC T2 T1 T2 T1
Where: T2 − T1 = full temperature change. ∝VREF can be positive or negative depending on whether the slope is positive or negative.
Example: VDEV = 6 mV, VREF = 1240 mV, T2 − T1 = 125°C.
§ 6.0 mV · 6
¨ ¸ 10
v VREF © 1240 mV ¹ 39 ppm / qC
125qC
(2) The dynamic output impedance, rZ, is defined as:
'VZ
rZ
'IZ
When the device is programmed with two external resistors, R1 and R2, (see Figure 33 ), the dynamic output impedance of the overall
circuit, rZ, is defined as:
'VZ ª § R1 · º
rZ # «rZ ¨ 1 ¸»
'IZ ¬ © R2 ¹¼
IZ = 10 mA (see Figure 33 )
'VREF Ratio of the Change in Reference Voltage
VZ from VREF to 6V −1.5 −2.7 mV/V
to the Change in Cathode Voltage
'VZ R1 = 10 kΩ, R2 = ∞ and 2.6 kΩ
R1 = 10 kΩ, R2 = ∞
IREF Reference Input Current 0.15 0.50 μA
II = 10 mA (see Figure 33)
Deviation of Reference Input Current over R1 = 10 kΩ, R2 = ∞,
∝IREF 0.1 0.4 μA
Temperature II = 10 mA, TA = Full Range (see Figure 33)
IZ(MIN) Minimum Cathode Current for Regulation VZ = VREF(see Figure 32) 55 80 µA
IZ(OFF) Off-State Current VZ = 6 V, VREF = 0 V (see Figure 34 ) 0.001 0.1 μA
VZ = VREF, IZ = 0.1 mA to 15 mA
rZ Dynamic Output Impedance (2) 0.25 0.4 Ω
Frequency = 0 Hz (see Figure 32)
(1) Deviation of reference input voltage, VDEV, is defined as the maximum variation of the reference input voltage over the full temperature
range. See the following:
The average temperature coefficient of the reference input voltage, ∝VREF, is defined as:
§ V VMin · 6 § VDEV · 6
r ¨ Max ¸ 10 r¨ ¸ 10
v VREF
ppm © VREF (at 25qC) ¹ © VREF (at 25q C) ¹
qC T2 T1 T2 T1
Where: T2 − T1 = full temperature change. ∝VREF can be positive or negative depending on whether the slope is positive or negative.
Example: VDEV = 6 mV, VREF = 1240 mV, T2 − T1 = 125°C.
§ 6.0 mV · 6
¨ ¸ 10
v VREF © 1240 mV ¹ 39 ppm / qC
125qC
(2) The dynamic output impedance, rZ, is defined as:
'VZ
rZ
'IZ
When the device is programmed with two external resistors, R1 and R2, (see Figure 33 ), the dynamic output impedance of the overall
circuit, rZ, is defined as:
'VZ ª § R1 · º
rZ # «rZ ¨ 1 ¸»
'IZ ¬ © R2 ¹¼
Figure 1. Reference Voltage vs. Junction Temperature Figure 2. Reference Input Current vs. Junction Temperature
Figure 3. Cathode Current vs. Cathode Voltage 1 Figure 4. Cathode Current vs. Cathode Voltage 2
Figure 5. Off-State Cathode Current vs. Junction Figure 6. Delta Reference Voltage Per Delta Cathode Voltage
Temperature vs. Junction Temperature
Figure 7. Input Voltage Noise vs. Frequency Figure 8. Test Circuit For Input Voltage Noise vs. Frequency
BW = 0.1 Hz To 10 Hz
Figure 9. Low Frequency Peak To Peak Noise Figure 10. Test Circuit For Peak To Peak Noise
Figure 11. Small Signal Voltage Gain And Phase Shift vs. Figure 12. Test Circuit For Voltage Gain And Phase Shift vs.
Frequency Frequency
Figure 13. Reference Impedance vs. Frequency Figure 14. Test Circuit For Reference Impedance vs.
Frequency
Figure 15. Pulse Response 1 Figure 16. Test Circuit For Pulse Response 1
12
IZ
STABLE STABLE
9
+
UNSTABLE
VZ=2V CL VSUPPLY
REGION
6 -
VZ=3V
3
FOR VZ = VREF, STABLE FOR CL = 1pF
TO 10k nF
0
0.001 0.01 0.1 1 10 100 1k 10k
Figure 19. LMV431 Stability Boundary Condition Figure 20. Test Circuit For VZ = VREF
VZ 150:
R1 IZ
10k:
+
CL VSUPPLY
-
R2
Figure 21. Test Circuit For VZ = 2V, 3V Figure 22. Percentage Change In VREF vs.
Operating Life At 55°C
8 Detailed Description
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
§ R1 ·
VO | ¨ 1 ¸ VREF
© R2 ¹ § R1 ·
VO ¨ 1 R2 ¸ VREF
© ¹
VO MIN VREF 5 V
Figure 23. Series Regulator
Figure 24. Output Control of a Three-Terminal
Fixed Regulator
§ R1 ·
VLIMIT | ¨ 1 ¸ VREF
§ R1 · © R2 ¹
VO | ¨ 1 ¸ VREF
© R2 ¹
Figure 25. Higher Current Shunt Regulator Figure 26. Crow Bar
VREF
IO
RCL
V
DELAY RCÜn
(V ) VREF
Figure 29. Delay Timer Figure 30. Current Limiter or Current Source
10.2 Trademarks
All trademarks are the property of their respective owners.
10.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
10.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LMV431ACM5X/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 N09A
LMV431AIM5 NRND SOT-23 DBV 5 1000 Non-RoHS Call TI Level-1-260C-UNLIM -40 to 85 N08A
& Green
LMV431AIM5/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 N08A
LMV431AIM5X NRND SOT-23 DBV 5 3000 Non-RoHS Call TI Level-1-260C-UNLIM -40 to 85 N08A
& Green
LMV431AIM5X/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 N08A
LMV431AIMF NRND SOT-23 DBZ 3 1000 Non-RoHS Call TI Level-1-260C-UNLIM -40 to 85 RLA
& Green
LMV431AIMF/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RLA
LMV431AIMFX NRND SOT-23 DBZ 3 3000 Non-RoHS Call TI Level-1-260C-UNLIM -40 to 85 RLA
& Green
LMV431AIMFX/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RLA
LMV431AIZ/LFT3 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LMV431
AIZ
LMV431AIZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 85 LMV431
AIZ
LMV431BCM5/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM N09C
LMV431BCM5X/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM N09C
LMV431BIMF NRND SOT-23 DBZ 3 1000 Non-RoHS Call TI Level-1-260C-UNLIM -40 to 85 RLB
& Green
LMV431BIMF/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RLB
LMV431BIMFX/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RLB
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LMV431CM5X/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 N09B
LMV431CZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type 0 to 70 LMV431
CZ
LMV431IM5 NRND SOT-23 DBV 5 1000 Non-RoHS Call TI Level-1-260C-UNLIM -40 to 85 N08B
& Green
LMV431IM5/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 N08B
LMV431IM5X/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 N08B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
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Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Jun-2022
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Jun-2022
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Jun-2022
Width (mm)
H
W
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Jun-2022
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV431CM5X/NOPB SOT-23 DBV 5 3000 208.0 191.0 35.0
LMV431IM5 SOT-23 DBV 5 1000 208.0 191.0 35.0
LMV431IM5/NOPB SOT-23 DBV 5 1000 208.0 191.0 35.0
LMV431IM5X/NOPB SOT-23 DBV 5 3000 208.0 191.0 35.0
Pack Materials-Page 4
4203227/C
PACKAGE OUTLINE
DBZ0003A SCALE 4.000
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
2.64 C
2.10
1.12 MAX
1.4
B A
1.2 0.1 C
PIN 1
INDEX AREA
0.95
3.04
1.9 2.80
3
2
0.5
3X
0.3
0.10
0.2 C A B (0.95) TYP
0.01
0.25
GAGE PLANE 0.20
TYP
0.08
0.6
TYP SEATING PLANE
0 -8 TYP 0.2
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
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EXAMPLE BOARD LAYOUT
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
(R0.05) TYP
(2.1)
SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK
4214838/C 04/2017
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
(R0.05) TYP
(2.1)
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
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PACKAGE OUTLINE
DBV0005A SCALE 4.000
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
C
3.0
2.6 0.1 C
1.75 1.45
B A
1.45 0.90
PIN 1
INDEX AREA
1 5
2X 0.95
3.05
2.75
1.9 1.9
2
4
3
0.5
5X
0.3
0.15
0.2 C A B (1.1) TYP
0.00
0.25
GAGE PLANE 0.22
TYP
0.08
8
TYP 0.6
0 TYP SEATING PLANE
0.3
4214839/F 06/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.25 mm per side.
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EXAMPLE BOARD LAYOUT
DBV0005A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X (0.95)
3 4
SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK
4214839/F 06/2021
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
DBV0005A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
2 (1.9)
2X(0.95)
3 4
(R0.05) TYP
(2.6)
4214839/F 06/2021
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
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PACKAGE OUTLINE
LP0003A SCALE 1.200 SCALE 1.200
TO-92 - 5.34 mm max height
TO-92
5.21
4.44
EJECTOR PIN
OPTIONAL
5.34
4.32
(1.5) TYP
(2.54) SEATING
2X NOTE 3 PLANE
4 MAX
(0.51) TYP
6X
0.076 MAX
SEATING
PLANE
3X
12.7 MIN
0.43
2X 0.55 3X
3X 0.35
2.6 0.2 0.38
2X 1.27 0.13
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL STRAIGHT LEAD OPTION
TO STRAIGHT LEAD OPTION
2.67
3X
2.03 4.19
3.17
3 2 1
3.43 MIN
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
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EXAMPLE BOARD LAYOUT
LP0003A TO-92 - 5.34 mm max height
TO-92
FULL R
0.05 MAX (1.07) TYP
ALL AROUND METAL 3X ( 0.85) HOLE
TYP TYP
2X
METAL
(1.5) 2X (1.5)
2X
SOLDER MASK
OPENING
1 2 3
(R0.05) TYP 2X (1.07)
(1.27)
SOLDER MASK
(2.54)
OPENING
METAL
2X
1 2 3 SOLDER MASK
(R0.05) TYP
(2.6) OPENING
SOLDER MASK
OPENING (5.2)
4215214/B 04/2017
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TAPE SPECIFICATIONS
LP0003A TO-92 - 5.34 mm max height
TO-92
13.7
11.7
32
23
16.5
15.5
11.0 9.75
8.5 8.50
19.0
17.5
4215214/B 04/2017
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