LEAD FREE REFLOW OVEN TU-380

OPERATION MANUAL

BGA CUSTOMISED FULLY-AUTO LEAD FREE REFLOW OVEN

WEIDACHENG INDUSTRY CO.,LTD

NO.3,Ally 57,Lane 456,Tung An Street,Tao Yuan City,Taiwan.R.O.C.
http://www.bga500.com.twE-mail:[email protected]
TEL:886-3-3255899 FAX:886-3-3259058

LEAD FEAD REFLOW OVEN TU-380

 FUNCTION & SPECIFICATION
1. Machine Dimension : 850(L) x 280(W) x 280(H) mm
2. Voltage : 220V /AC /50/60Hz
3. Power : 3300Watts
4. Weight : 40 Kg
5. Reflow Area : 155mm x 155 mm
6. N2 Retrofit : N2 flow rate can control by a N2 Flow Meter,
Range from 0-25 M3/Min.(1 LPM = 28 lit/Min), N2 will help to
reduce oxidation during reflow process.
7. Amp Meter : During power on Oven max. surge is 15Amp, and when
under normal running condition consume only 6.2 –8 Amp.
8.The upper and bottom heating panel are control by separate
controller and the temp. setting can be set individually.
9. During Power on until ready to use, The oven takes about 25 min.
10.Tempreture Control Function:
(a)It control by two separate controller with Fuzzy Control.
(b)By using PID Micro Computer Controller, The Computer can
control for temperature setting and using for measuring
temperature profile.
(c)The ‘Smart’ type temperature Controller can be easily use to
monitor the working area temperature, auto run, auto set PID
Value and temperature setting. Temperature Adjustment 0.5% FS
+ 1 digit.
(d)Temperature Setting Range : 28 –420 Degree Celcius.
(E)Temperature Accuracy : 0.1 Degree Celcius
11.Timer Setting : Set according to required time for application.
( Moving into Reflow Area )
12.AUTO Setting : When press Fully Auto Button, The BGA tray
will auto send the tray into the reflow area, after finish reflow the
tray will auto move to the original area with fan cooling function.
13.Before turn off the Oven, we must off the heater first until it reach
below 100 degree celcius Then can only power off the main switch
for the main power source.
14.During application, do not press the tray and sometimes it will bend
the slider guide and it will cause problem for sliding movement.
****** WEIDACHENG ****** (1)
LEAD FEAD REFLOW OVEN TU-380
 Control Panel Introduction :
Heater ON/OFF Switch Temp Controller Max.Temp. Setting

Amp. Meter Thermo Couple Plug USB Connector N2 Meter

Fuse 3 Amp Temp. Controller Detected Value Emergency Stop Swith

Power Swithch hermo Couple Temp.Timer Start Button Flow Meter

Upper Heater Detected Temp. Bottom Heater Detected

Upper Heater Temp. Setting Below Heater Temp. Setting

****** WEIDACHENG ****** (2)

Operation Procedure
 1. Press POWER -> On Machine
2. Press AUTO->Complete Run
3. Press Red Button -> Will Stop at any step until dissolve defect
issue, Press Stop and return to Origin, If you need to
continue Please press AUTO.
4. Press STOP-> Will immediately stop operation until defect
issue dissolve And will continue to run.
5. Press HEATER-> ON Start Heating TOP & Bottom Heater, Press
OFF Will cut off Both Heaters.
6. Flow Meter ->Flow Meter Knob. Adjust N2 flow rate (I LPM=28
Lit/Min.)
7. N2 Knob ->Adjust N2 intake pressure.
8. N2 Meter -> N2 Meter set at 1.5Kg.
9. Ampere Meter-> Show Existing ampere consumption.

Tem. Control Panel

OUT-1 OUT-2 MAX.Output Min.Output Actual Temp.Display

Actual Value Select Button Setting Temp.Display

Setting Value Increase Temp Button Decrease Temp. Button.

****** WEIDACHENG ****** (3)

Temperature Controller Setting

 Select Button Confirm button Select upper setting Select lower setting

Press for 3sec go into first level setting

Press 5sec go into secong level setting.
Warning: When setting in the first and Second level, pls
do not re set factory setting to avoid machine error.
First Level Setting Press for 3sec go into first level setting
1. STby-Displsy OFF Press SEL OFF Blink Press︿ON Blink Press SEL
Enter ON Stop Blinking.
(A) Displsy OFF-Temp.Control Display and Function.
(B) Displsy ON-Only temp.Control Display.Stop Temp.Control.
2. LRCH Displsy 0 (Display 0)
3. AT Displsy 0 Press SEL-> 0 Blink ~Display1-> Press SEL Enter ->
1 Stop Blinking, 1 Right Bottom corner start blinking.
(A)-Numbers Right Bottom corner start blinking, CPU start
initialize PID Value.
PID Defination:
P=5.0 P- Output ratio 0.01to999.9
i=240 i=Intergrayion 0to3200 seconds.
d=60 d=Differentate 0.01to999.9 seconds.
****** WEIDACHENG ****** (4)

Timer Setting Accuracy 0.1 Sec

OUT-1 OUT-2 Lower Limit Output Time display Time setting display

Reset Setting 1stValue Adjust 2nd Value adjust 3rdvalue adjust decimal value adjust

1. Thermo Couple is measuring the BGA IC actual surface

tempreture. temp.

****** WEIDACHENG ****** (5)

2.Communication connection between Thermo Couple & USB

Thermo Couple Connection Detected tempreture USB- Connection
3.Timer Setting Accuracy 0.1 Sec

0~ 9 9 9. 9 sec
****** WEIDACHENG ****** (6)
4.Max. Reflow Area.155mmX155mm
 5.Using Computer to Plot out the Temp. Profile for the Communication
connection between Thermo Couple & USB

6.Saving for the Tempreture Profile and print out in the Graph Format.

****** WEIDACHENG ****** (7)

6. Data convert into Graph format

 7. Data convert to Microsoft Excel format

****** WEIDACHENG ****** (8)

Comparison for Different Solders Melting Point

 (A) Sn/In/Ag-Tin, Silver & Copper alloy the melting
point is about 217 Deg C.
(B) Pb-Sn-Tin, Lead Melting point is about 183 Deg C

TU-380 Fully Auto Lead Free

Reflow- Advantages

BGA-IC Reflow Heat source

Upper Heater Zone
       
︴︴︴︴︴N2
Plate

         Lower Heater Zone

Reflow Heat source

(8) TU-380 is more suitable to use to reflow and rework for BGA
cause the heat transfer Is transfer using not contact and also the
heat transfer is more even. Compare to the Hot plate which are
using direct heat transfer will cause die damages due to delta T is
More than 5 Deg C. The delta T for the hot air is only 1 Deg /sec.
Therefore by using Hot Air method will not cause damage to the
components and more suitable for Rework.

****** WEIDACHENG ****** (8)

Single Side Hot Plate
 BGA-IC Heating Panel

       

Hot Plate Heat source Transfer from IC body to others

Direct Heat transfer will easily cause die expansion more

rapidly and will cause die Crack and the solder ball
will flow away from pad ( 205-208Deg C). Even during
reflow for Lead Free at (217Deg C) it will more easily
cause damage on the die.
( Deform, Color change), therefore not suitable to use as
repairing.

****** WEIDACHENG ****** (10)

(A)Hot Plate Disadvantages

(1) Heat Increase : Single Sided Heat Increase.
 Disadvantages : For Lead Free it need to increase until 260 Deg C
to Reflow.
(2) Heat Transfer : Component direct Heat Contact Heat Transfer
Disadvantages : Direct Heat contact with component will cause
the die to crack or Lifted with the pad cause the
heat expansion is too high.
(3) During reflow will not be able to apply N2, Will decrease the
performance of N2 During reflow.
Disadvantages : Lead Free process the reflow Temp. is 217 Deg C,
Without N2 and High Temp. it will cause the Pad
easily oxidize and will not get a good solder joint,
It will also cause the package change color and oxidized.
(B) Lead Free Solder ball Reflow Oven : Tu-380
(1) Heat Increase : Top And Bottom Heaters
Advantages : By using Top and Bottom heaters and can set
separately can Easily Get the heating profile
that we require.
(2) Heat Transfer : Using Non Contact Heat Transfer.
Advantages : During heat transfer the component is in the
middle of the conveyer, Whereas the heat transfer
will be more even for the whole component.
(3) Can apply N2 : Is a must for Lead Free Process
Advantages : Decrease Oxidation. Increase the joint contacts
and reliability.
(4) Profile detection: Can direct link to the PC and be able to view
directly from PC.
Advantages : Can immediate detect the temp. for the Solder
Joints, It’s also Easy To view or change the
parameter for the temp. setting required.
(5) Reflow Oven Tray Transfer Vibration rate Requirement :
ith a stable transfer Guide to enable a minimum
vibration rate required.
Advantages : By using a linear guide enable the movement to cut
down to the Minimal vibration of the tray and it will
ecrease the movement of the soder Ball during reflow.
****** WEIDACHENG ****** (11)
 Lead Free solder ball melting Point diagram.
LEAD-FREE ALLOYS

Tin Silver Copper Melting Point ( ℃ )

(Sn) (Ag) (Cu) Eutectic Solidus Liquidus
LAC405 95.5 4 0.5 -- 217 218
LAC305 96.5 3 0.5 217 218
LAC350 96.5 3.5 -- 221 -- --

Profile for the Lead Free solder Ball melting Point.

****** WEIDACHENG ****** (12)

 Reflow Profile
Indalloy # 241 ; 95.5Sn 3.8Ag 0.7Cu
Solidus Temp 217 deg C , Liquidus Temp 217 deg C ,
300
Peak temperature should exceed liquidus by 30 - 40 deg C

250
Reflow
Temp (deg C)
217
45 - 90 seconds
200 Soak or Dryout
above liquidus
30 - 60 seconds

150 Cool Down

<4 deg C/sec
100
Preheat
1.0 - 2.0 deg C/sec
50

0
0 1 2 3 4 5 6 7
Time (min)
This profile serve as a guide in establishing a reflow profile for your process.
Different reflow methods, board geometries and densities may require further adjustments.
 DRAM-PCB Reflow

Reballed Reflow

****** WEIDACHENG ****** (14)