DATASHEET

ISL8483E, ISL8485E FN6048

ESD Protected to ±15kV, 5V, Low Power, High Speed or Slew Rate Limited Rev.13.00
RS-485/RS-422 Transceivers Sep 24, 2018

The ISL8483E and ISL8485E are ESD protected, BiCMOS 5V

powered, single transceivers that meet both the RS-485 and
Features
RS-422 standards for balanced communication. Each driver • Pb-Free (RoHS compliant)
output/receiver input is protected against ±15kV ESD strikes • Extended industrial temperature options (+125°C)
without latch-up. Unlike competitive devices, this Renesas
• RS-485 I/O pin ESD protection . . . . . . . . . . . . . . ±15kV HBM
family is specified for 10% tolerance supplies (4.5V to 5.5V).
- Class 3 ESD level on all other pins. . . . . . . . . . . >7kV HBM
The ISL8483E uses slew rate limited drivers that reduce EMI
and minimize reflections from improperly terminated • Specified for 10% tolerance supplies
transmission lines or unterminated stubs in multidrop and • High data rate version (ISL8485E). . . . . . . . . . up to 10Mbps
multipoint applications.
• Slew rate limited version for error free data transmission
Data rates up to 10Mbps are achievable by using the (ISL8483E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . up to 250kbps
ISL8485E, which features higher slew rates. • Single unit load allows up to 32 devices on the bus
Both devices present a “single unit load” to the RS-485 bus, • 1nA low current Shutdown mode (ISL8483E)
which allows up to 32 transceivers on the network.
• Low quiescent current:
Receiver (Rx) inputs feature a “fail-safe if open” design, which - 160µA (ISL8483E)
ensures a logic high Rx output if Rx inputs are floating. - 500µA (ISL8485E)
Driver (Tx) outputs are short-circuit protected even for voltages • -7V to +12V common-mode input voltage range
exceeding the power supply voltage. Additionally, on-chip
thermal shutdown circuitry disables the Tx outputs to prevent • Three-state Rx and Tx outputs
damage if power dissipation becomes excessive. • 30ns propagation delays, 5ns skew (ISL8485E)
These half duplex configurations multiplex the Rx inputs and • Operate from a single +5V supply (10% tolerance)
Tx outputs to allow transceivers with Rx and Tx disable • Current limiting and thermal shutdown for driver overload
functions in 8 Ld packages. protection

Related Literature Applications

For a full list of related documents, visit our website: • Factory automation
• ISL8483E and ISL8485E product pages • Security networks
• Building environmental control systems
• Industrial/process control networks
• Level translators (such as RS-232 to RS-422)
• RS-232 “extension cords”

TABLE 1. SUMMARY OF FEATURES

NO. OF
DEVICES
PART HALF/FULL ALLOWED DATA RATE SLEW-RATE RECEIVER/DRIVER QUIESCENT ICC LOW POWER PIN
NUMBER DUPLEX ON BUS (Mbps) LIMITED? ENABLE? (µA) SHUTDOWN? COUNT

ISL8483E Half 32 0.25 Yes Yes 160 Yes 8

ISL8485E Half 32 10 No Yes 500 No 8

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ISL8483E, ISL8485E

Typical Operating Circuit

5V 5V

8 100nF 100nF 8
RPU RPU
VCC VCC
RB
1 RO RO 1
A/Y 6 6 A/Y
2 RE RE 2
RT2 VFS RT1
3 DE B/Z 7 7 B/Z DE 3

4 DI DI 4
RB
GND GND
5 5

To calculate the resistor values, refer to TB509

Ordering Information
PART NUMBER TAPE AND REEL PACKAGE
(Notes 3, 4) PART MARKING TEMP. RANGE (°C) (UNITS) (Note 2) (RoHS COMPLIANT) PKG. DWG. #
ISL8483EIBZ 8483 EIBZ -40 to +85 - 8 Ld SOIC M8.15

ISL8483EIBZ-T 8483 EIBZ -40 to +85 2.5k 8 Ld SOIC M8.15

ISL8485EABZ 8485 EABZ -40 to +125 - 8 Ld SOIC M8.15

ISL8485EABZ-T 8485 EABZ -40 to +125 2.5k 8 Ld SOIC M8.15

ISL8485ECBZ 8485 ECBZ 0 to +70 - 8 Ld SOIC M8.15

ISL8485ECBZ-T 8485 ECBZ 0 to +70 2.5k 8 Ld SOIC M8.15

ISL8485EIBZ 8485 EIBZ -40 to +85 - 8 Ld SOIC M8.15

ISL8485EIBZ-T 8485 EIBZ -40 to +85 2.5k 8 Ld SOIC M8.15

ISL8485EIPZ ISL 8485EIPZ -40 to +85 - 8 Ld PDIP (Note 1) E8.3

NOTES:
1. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in reflow solder processing applications.
2. Refer to TB347 for details about reel specifications.
3. These Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Pb-free products are MSL classified
at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
4. For Moisture Sensitivity Level (MSL), refer to the product information pages for the ISL8483E and the ISL8485E. For more information on MSL, refer
to TB363.

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Pin Configuration
ISL8483E, ISL8485E
(8 LD PDIP, SOIC)
TOP VIEW

RO 1 8 VCC
R
RE 2 7 B/Z

DE 3 6 A/Y

DI 4 D 5 GND

Pin Descriptions
PIN FUNCTION

RO Receiver output: RO is high if A > B by at least 0.2V; RO is low if A < B by 0.2V or more; RO is high if A and B are unconnected (floating).

RE Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high.
DE Driver output enable. The driver outputs Y and Z are enabled by bringing DE high. They are high impedance when DE is low.

DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.

GND Ground connection.

A/Y ±15kV HBM ESD protected, RS-485, RS-422 level noninverting receiver input and noninverting driver output. Pin is an input (A) if DE = 0;
pin is an output (Y) if DE = 1.

B/Z ±15kV HBM ESD protected, RS-485, RS-422 level inverting receiver input and inverting driver output. Pin is an input (B) if DE = 0; pin is
an output (Z) if DE = 1.

VCC System power supply input (4.5V to 5.5V).

Truth Tables RECEIVING

TRANSMITTING INPUTS OUTPUT

INPUTS OUTPUTS RE DE A-B RO

RE DE DI Z Y 0 0 VAB≥ 0.2V 1

X 1 1 0 1 0 0 0.2V > VAB > -0.2V Undetermined

X 1 0 1 0 0 0 VAB ≤ -0.2V 0

0 0 X High-Z High-Z 0 0 Inputs Open 1

1 0 X High-Z * High-Z * 1 0 X High-Z *

*Shutdown mode for ISL8483E (see Note 11) 1 1 X High-Z

*Shutdown mode for ISL8483E (see Note 11)

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Absolute Maximum Ratings Thermal Information

VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Thermal Resistance (Typical, Note 5) θJA (°C/W)
Input Voltages 8 Ld SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
DI, DE, RE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V) 8 Ld PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
Input/Output Voltages Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C
A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +150°C
RO. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V) Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
Short-Circuit Duration *Pb-free PDIPs can be used for through hole wave solder processing only.
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous They are not intended for use in reflow solder processing applications.
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .See “ESD PERFORMANCE”

Operating Conditions
Temperature Range
ISL8485ECx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
ISL848xEIx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
ISL8485EAx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +125°C

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions can adversely impact product
reliability and result in failures not covered by warranty.

NOTE:
5. θJA is measured with the component mounted on a low-effective thermal conductivity test board in free air. Refer to TB379 for details.

Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V,
TA = +25°C, (Note 6)

TEMP MIN MAX

PARAMETER SYMBOL TEST CONDITIONS (°C) (Note 16) TYP (Note 16) UNIT
DC CHARACTERISTICS

Driver Differential VOUT (No Load) VOD1 Full - - VCC V

Driver Differential VOUT (With Load) VOD2 R = 50Ω (RS-422), (Figure 1 on page 6) Full 2 3 - V
R = 27Ω (RS-485), (Figure 1 on page 6) Full 1.5 2.3 5 V

Change in Magnitude of Driver VOD R = 27Ω or 50Ω, (Figure 1 on page 6) Full - 0.01 0.2 V
Differential VOUT for
Complementary Output States

Driver Common-Mode VOUT VOC R = 27Ω or 50Ω, (Figure 1 on page 6) Full - - 3 V

Change in Magnitude of Driver VOC R = 27Ω or 50Ω, (Figure 1 on page 6) Full - 0.01 0.2 V
Common-Mode VOUT for
Complementary Output States

Logic Input High Voltage VIH DE, DI, RE Full 2 - - V

Logic Input Low Voltage VIL DE, DI, RE Full - - 0.8 V

Logic Input Current IIN1 DE, DI, RE (ISL8483E) Full -2 - 2 µA

IIN1 DI (ISL8485E) Full -2 - 2 µA

IIN1 DE, RE (ISL8485E) Full -25 - 25 µA

Input Current (A, B), (Note 14) IIN2 DE = 0V, VCC = 0V or 4.5 to 5.5V VIN = 12V Full - - 1 mA

VIN = -7V Full - - -0.8 mA

Receiver Differential Threshold V TH -7V  VCM  12V Full -0.2 - 0.2 V

Voltage

Receiver Input Hysteresis V TH VCM = 0V +25 - 70 - mV

Receiver Output High Voltage VOH IO = -4mA, VID = 200mV Full 3.5 - - V

Receiver Output Low Voltage VOL IO = -4mA, VID = 200mV Full - - 0.4 V

Three-State (High Impedance) IOZR 0.4V  VO  2.4V Full - - ±1 µA

Receiver Output Current

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Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V,
TA = +25°C, (Note 6) (Continued)

TEMP MIN MAX

PARAMETER SYMBOL TEST CONDITIONS (°C) (Note 16) TYP (Note 16) UNIT

Receiver Input Resistance RIN -7V  VCM  12V Full 12 - - kΩ

No-Load Supply Current, (Note 7) ICC ISL8485E, DI, RE = 0V or VCC DE = VCC Full - 700 900 µA

DE = 0V Full - 500 565 µA

ISL8483E, DI, RE = 0V or VCC DE = VCC Full - 470 650 µA

DE = 0V Full - 160 250 µA

Shutdown Supply Current ISHDN ISL8483E, DE = 0V, RE = VCC, DI = 0V or VCC Full - 1 50 nA

Driver Short-Circuit Current, IOSD1 DE = VCC, -7V  VY or VZ  12V, (Note 8) Full 35 - 250 mA
VO = High or Low

Receiver Short-Circuit Current IOSR 0V  VO  VCC Full 7 - 85 mA

SWITCHING CHARACTERISTICS (ISL8485E)

Driver Input to Output Delay tPLH, tPHL RDIFF = 54Ω, CL = 100pF, (Figure 2 on page 7) Full 18 30 50 ns

Driver Output Skew tSKEW RDIFF = 54Ω, CL = 100pF, (Figure 2 on page 7) Full - 2 10 ns

Driver Differential Rise or Fall Time tR, tF RDIFF = 54Ω, CL = 100pF, (Figure 2 on page 7) Full 3 11 25 ns
Driver Enable to Output High tZH CL = 100pF, SW = GND, (Figure 3 on page 7) Full - 17 70 ns

Driver Enable to Output Low tZL CL = 100pF, SW = VCC, (Figure 3 on page 7) Full - 14 70 ns

Driver Disable from Output High tHZ CL = 15pF, SW = GND, (Figure 3 on page 7) Full - 19 70 ns
Driver Disable from Output Low tLZ CL = 15pF, SW = VCC, (Figure 3 on page 7) Full - 13 70 ns

Receiver Input to Output Delay tPLH, tPHL (Figure 4 on page 7) Full 30 40 150 ns

Receiver Skew | tPLH - tPHL | tSKD (Figure 4 on page 7) +25 - 5 - ns

Receiver Enable to Output High tZH CL = 15pF, SW = GND, (Figure 5 on page 8) Full - 9 50 ns

Receiver Enable to Output Low tZL CL = 15pF, SW = VCC, (Figure 5 on page 8) Full - 9 50 ns

Receiver Disable from Output High tHZ CL = 15pF, SW = GND, (Figure 5 on page 8) Full - 9 50 ns
Receiver Disable from Output Low tLZ CL = 15pF, SW = VCC, (Figure 5 on page 8) Full - 9 50 ns

Maximum Data Rate fMAX (Note 15) Full 10 - - Mbps

SWITCHING CHARACTERISTICS (ISL8483E)

Driver Input to Output Delay tPLH, tPHL RDIFF = 54Ω, CL = 100pF, (Figure 2 on page 7) Full 250 800 2000 ns

Driver Output Skew tSKEW RDIFF = 54Ω, CL = 100pF, (Figure 2 on page 7) Full - 160 800 ns

Driver Differential Rise or Fall Time tR, tF RDIFF = 54Ω, CL = 100pF, (Figure 2 on page 7) Full 250 800 2000 νσ

Driver Enable to Output High tZH CL = 100pF, SW = GND, (Figure 3 on page 7), Full 250 - 2000 νσ
(Note 9)

Driver Enable to Output Low tZL CL = 100pF, SW = VCC, (Figure 3 on page 7), Full 250 - 2000 νσ
(Note 9)

Driver Disable from Output High tHZ CL = 15pF, SW = GND, (Figure 3 on page 7) Full 300 - 3000 νσ

Driver Disable from Output Low tLZ CL = 15pF, SW = VCC, (Figure 3 on page 7) Full 300 - 3000 νσ

Receiver Input to Output Delay tPLH, tPHL (Figure 4 on page 7) Full 250 350 2000 ns

Receiver Skew | tPLH - tPHL | tSKD (Figure 4 on page 7) +25 - 25 - ns

Receiver Enable to Output High tZH CL = 15pF, SW = GND, (Figure 5 on page 8), Full - 10 50 ns
(Note 10)

Receiver Enable to Output Low tZL CL = 15pF, SW = VCC, (Figure 5 on page 8), Full - 10 50 ns
(Note 10)

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ISL8483E, ISL8485E

Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V,
TA = +25°C, (Note 6) (Continued)

TEMP MIN MAX

PARAMETER SYMBOL TEST CONDITIONS (°C) (Note 16) TYP (Note 16) UNIT

Receiver Disable from Output High tHZ CL = 15pF, SW = GND, (Figure 5 on page 8) Full - 10 50 ns

Receiver Disable from Output Low tLZ CL = 15pF, SW = VCC, (Figure 5 on page 8) Full - 10 50 ns

Maximum Data Rate fMAX (Note 15) Full 250 - - kbps

Time to Shutdown tSHDN (Note 11) Full 50 200 600 ns

Driver Enable from Shutdown to tZH(SHDN) CL = 100pF, SW = GND, (Figure 3 on page 7), Full - - 2000 νσ
Output High (Notes 11, 12)

Driver Enable from Shutdown to tZL(SHDN) CL = 100pF, SW = VCC, (Figure 5 on page 8), Full - - 2000 νσ
Output Low (Notes 11, 12)

Receiver Enable from Shutdown to tZH(SHDN) CL = 15pF, SW = GND, (Figure 5 on page 8), Full - - 2500 ns
Output High (Notes 11, 13)

Receiver Enable from Shutdown to tZL(SHDN) CL = 15pF, SW = VCC, (Figure 5 on page 8), Full - - 2500 ns
Output Low (Notes 11, 13)

ESD PERFORMANCE
RS-485 Pins (A/Y, B/Z) Human Body Model +25 - 15 - kV

All Other Pins +25 - >7 - kV

NOTES:
6. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise
specified.
7. Supply current specification is valid for loaded drivers when DE = 0V.
8. Applies to peak current. See “Typical Performance Curves” on page 10 for more information.
9. When testing the ISL8483E, keep RE = 0 to prevent the device from entering SHDN.
10. When testing the ISL8483E, the RE signal high time must be short enough (typically <200ns) to prevent the device from entering SHDN.
11. The ISL8483E is put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 50ns, the parts are ensured not to enter
shutdown. If the inputs are in this state for at least 600ns, the parts are ensured to have entered shutdown. See “Low Power Shutdown Mode
(ISL8483E Only)” on page 9.
12. Keep RE = VCC, and set the DE signal low time >600ns to ensure that the device enters SHDN.
13. Set the RE signal high time >600ns to ensure that the device enters SHDN.
14. Devices meeting these limits are denoted as “single unit load (1 UL)” transceivers. The RS-485 standard allows up to 32 Unit Loads on the bus.
15. Limits established by characterization and are not production tested.
16. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.

Test Circuits and Waveforms

R
VCC DE
Z
DI
D VOD
Y

R VOC

FIGURE 1. DRIVER VOD AND VOC

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Test Circuits and Waveforms (Continued)

3V
DI 1.5V 1.5V
0V

tPLH tPHL

VOH
CL = 100pF OUT (Y) 50% 50%
DE
VCC VOL
DI Z
RDIFF tPHL tPLH
D
Y CL = 100pF VOH
OUT (Z) 50% 50%
SIGNAL
GENERATOR VOL

+VOD
90% 90%
DIFF OUT (Y - Z)
10% 10%
-VOD
tR tF

SKEW = |tPLH (Y or Z) - tPHL (Z or Y)|

FIGURE 2A. TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES

DE
Z 500Ω VCC
DI
D
SIGNAL SW GND
Y
GENERATOR CL 3V
DE Note 6 1.5V 1.5V
0V
(SHDN) FOR ISL8483E ONLY tZH, tZH(SHDN) tHZ
Note 6 OUTPUT HIGH
PARAMETER OUTPUT RE DI SW CL (pF) VOH - 0.5V
VOH
tHZ Y/Z X 1/0 GND 15 OUT (Y, Z) 2.3V
0V
tLZ Y/Z X 0/1 VCC 15
tZH Y/Z 0 (Note 9) 1/0 GND 100 tZL, tZL(SHDN) tLZ
tZL Y/Z 0 (Note 9) 0/1 VCC 100 Note 6 VCC

tZH(SHDN) Y/Z 1 (Note 12) 1/0 GND 100 OUT (Y, Z)

2.3V
VOL + 0.5V V
tZL(SHDN) Y/Z 1 (Note 12) 0/1 VCC 100 OL
OUTPUT LOW

FIGURE 3A. TEST CIRCUIT FIGURE 3B. MEASUREMENT POINTS

FIGURE 3. DRIVER ENABLE AND DISABLE TIMES

RE 3V
15pF A 1.5V 1.5V
B
+1.5V RO
A R 0V

tPLH tPHL

VCC
SIGNAL
GENERATOR RO 50% 50%
0V

FIGURE 4A. TEST CIRCUIT FIGURE 4B. MEASUREMENT POINTS

FIGURE 4. RECEIVER PROPAGATION DELAY

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Test Circuits and Waveforms (Continued)

RE
B 1kΩ
RO VCC
R
SIGNAL SW GND Note 6
A 3V
GENERATOR 15pF
RE 1.5V 1.5V
0V

(SHDN) FOR ISL8483E ONLY tZH, tZH(SHDN) tHZ

Note 6 OUTPUT HIGH
VOH
VOH - 0.5V
RO 1.5V
PARAMETER DE A SW 0V
tHZ 0 +1.5V GND
tZL, tZL(SHDN) tLZ
tLZ 0 -1.5V VCC Note 6
VCC
tZH (Note 10) 0 +1.5V GND RO 1.5V
VOL + 0.5V V
tZL (Note 10) 0 -1.5V VCC OL
OUTPUT LOW
tZH(SHDN) (Note 13) 0 +1.5V GND

tZL(SHDN) (Note 13) 0 -1.5V VCC

FIGURE 5A. TEST CIRCUIT FIGURE 5B. MEASUREMENT POINTS

FIGURE 5. RECEIVER ENABLE AND DISABLE TIMES

Application Information All the receivers include a “fail-safe if open” function that ensures
a high level receiver output if the receiver inputs are unconnected
RS-485 and RS-422 are differential (balanced) data (floating).
transmission standards for use in long haul or noisy
Receivers easily meet the data rates supported by the
environments. RS-422 is a subset of RS-485, so RS-485
corresponding driver.
transceivers are also RS-422 compliant. RS-422 is a
point-to-multipoint (multidrop) standard that allows only one ISL8483E and ISL8485E receiver outputs are tri-statable through
driver and up to 10 receivers on each bus, assuming one unit the active low RE input.
load devices. RS-485 is a true multipoint standard that allows up
to 32 one unit load devices (any combination of drivers and Driver Features
receivers) on each bus. To allow for multipoint operation, the The RS-485 and RS-422 drivers are differential output devices
RS-485 specification requires that drivers handle bus contention that deliver at least 1.5V across a 54Ω load (RS-485) and at least
without sustaining any damage. 2V across a 100Ω load (RS-422). The drivers feature low
Another important advantage of RS-485 is the extended propagation delay skew to maximize bit width and to minimize
Common-Mode Range (CMR). The CMR specifies that the driver EMI.
outputs and receiver inputs withstand signals that range from The ISL8483E and ISL8485E drivers are tri-statable using the
+12V to -7V. RS-422 and RS-485 are intended for runs as long as active high DE input.
4000 ft, so the wide CMR is necessary to handle ground potential
differences and voltages induced in the cable by external fields. The ISL8483E driver outputs are slew rate limited to minimize
EMI and to minimize reflections in unterminated or improperly
Receiver Features terminated networks. The data rate on these slew rate limited
The devices use a differential input receiver for maximum noise versions is a maximum of 250kbps. The ISL8485E driver outputs
immunity and common-mode rejection. Input sensitivity is are not limited, so faster output transition times allow data rates
±200mV as required by the RS-422 and RS-485 specifications. of at least 10Mbps.

Receiver input impedance surpasses the RS-422 spec of 4kΩ

and meets the RS-485 “Unit Load” requirement of 12kΩ
minimum.
Receiver inputs function with common-mode voltages as high as
±7V outside the power supplies (for example, +12V and -7V),
making them ideal for long networks where induced voltages are
a realistic concern.

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ISL8483E, ISL8485E

Data Rate, Cables, and Terminations Low Power Shutdown Mode (ISL8483E Only)
RS-485 and RS-422 are intended for network lengths up to These CMOS transceivers all use a fraction of the power required
4000 ft, but the maximum system data rate decreases as the by their bipolar counterparts, but the ISL8483E includes a
transmission length increases. Devices operating at 10Mbps are shutdown feature that reduces the already low quiescent ICC to a
limited to lengths less than 100 feet, and the 250kbps versions 1nA trickle. The ISL8483E enters shutdown whenever the
can operate at full data rates with lengths in excess of 1000 ft. receiver and driver are simultaneously disabled (RE = VCC and
DE = GND) for a period of at least 600ns. Disabling both the
Twisted pair cable is the cable of choice for the RS-485 and RS-
driver and the receiver for fewer than 50ns ensures that the
422 networks. Twisted pair cables tend to pick up noise and
ISL8483E does not enter shutdown.
other electromagnetically induced voltages as common-mode
signals, which are effectively rejected by the differential receivers Note that receiver and driver enable times increase when the
in these ICs. ISL8483E enables from shutdown. Refer to Notes 9 through
Notes 12 on page 6 at the end of the “Electrical Specifications”
Proper termination is imperative when using the 10Mbps devices
table for more information.
to minimize reflections. Short networks using the 250kbps
versions do not need to be terminated, but terminations are
recommended unless power dissipation is an overriding concern. ESD Protection
In point-to-point or point-to-multipoint (single driver on bus) All pins on these interface devices include Class 3 Human Body
networks, terminate the main cable in its characteristic Model (HBM) ESD protection structures, but the RS-485 pins
impedance (typically 120Ω) at the end farthest from the driver. In (driver outputs and receiver inputs) incorporate advanced
multi-receiver applications, keep stubs connecting receivers to structures allowing them to survive ESD events in excess of
the main cable as short as possible. In multipoint (multi-driver) ±15kV HBM. The RS-485 pins are particularly vulnerable to ESD
systems, terminate the main cable in its characteristic damage because they typically connect to an exposed port on
impedance at both ends. Keep stubs that are connecting a the exterior of the finished product. Simply touching the port pins
transceiver to the main cable as short as possible. or connecting a cable can cause an ESD event that might destroy
unprotected ICs. These new ESD structures protect the device
Built-In Driver Overload Protection whether or not it is powered up without either allowing any
latchup mechanism to activate and without degrading the
The RS-485 specification requires that drivers survive worst case
RS-485 common-mode range of -7V to +12V. The built-in ESD
bus contentions undamaged. The ISL848xE devices meet this
protection eliminates the need for board level protection
requirement through driver output short-circuit current limits and
structures (such as transient suppression diodes) and the
on-chip thermal shutdown circuitry.
associated, undesirable capacitive load that they present.
The driver output stages incorporate short-circuit current limiting
circuitry that ensures that the output current never exceeds the Human Body Model Testing
RS-485 specification, even at the common-mode voltage range As the name implies, the HBM test method emulates the ESD
extremes. Also, these devices use a foldback circuit that reduces event delivered to an IC during human handling. The tester
the short-circuit current and consequently the power dissipation delivers the charge stored on a 100pF capacitor through a 1.5kΩ
when the contending voltage exceeds either supply. current limiting resistor into the pin under test. The HBM method
In the event of a major short-circuit condition, the ISL848xE determines an IC’s ability to withstand the ESD events typically
devices perform a thermal shutdown that disables the drivers present during handling and manufacturing.
whenever the die temperature becomes excessive. This The RS-485 pin survivability on this high ESD family has been
eliminates the power dissipation allowing the die to cool. The characterized to be in excess of ±15kV for discharges to GND.
drivers automatically re-enable after the die temperature
drops about 15°. If the contention persists, the thermal
shutdown/re-enable cycle repeats until the fault is cleared.
Die Characteristics
Receivers stay operational during thermal shutdown. SUBSTRATE POTENTIAL (POWERED UP):
GND

TRANSISTOR COUNT:
518

PROCESS:
Si Gate CMOS

FN6048 Rev.13.00 Page 9 of 15

Sep 24, 2018
ISL8483E, ISL8485E

Typical Performance Curves VCC = 5V, TA = +25°C, ISL8483E and ISL8485E; unless otherwise specified.
90 3.6

80 3.4

DIFFERENTIAL OUTPUT VOLTAGE (V)

DRIVER OUTPUT CURRENT (mA)

70
3.2 RDIFF = 100Ω
60
3.0
50
2.8
40
2.6
30

20 2.4 RDIFF = 54Ω

10 2.2

0 2.0
0 1 2 3 4 5
-40 -25 0 25 50 75 85
DIFFERENTIAL OUTPUT VOLTAGE (V) TEMPERATURE (°C)
FIGURE 6. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT FIGURE 7. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
VOLTAGE TEMPERATURE

160 700
140 650 ISL8485E, DE = VCC, RE = X
120
Y OR Z = LOW 600
100
80 550
OUTPUT CURRENT (mA)

ISL8485E, DE==GND,
ISL8485, DE GND,RE
RE==XX
60 500
40
ICC (µA)

450 ISL8483E, DE = VCC, RE = X

20
400
0
-20 350
Y OR Z = HIGH
-40 300
-60
250
-80
-100 200 ISL8483E, DE = GND, RE = GND
-120 150
-7 -6 -4 -2 0 2 4 6 8 10 12 -40 -25 0 25 50 75 85
OUTPUT VOLTAGE (V) TEMPERATURE (oC)
FIGURE 8. DRIVER OUTPUT CURRENT vs SHORT-CIRCUIT VOLTAGE FIGURE 9. SUPPLY CURRENT vs TEMPERATURE

1200 400

1100
PROPAGATION DELAY (ns)

tPLHY tPLHZ 300

1000

|tPHLY - tPLHZ|
SKEW (ns)

900
tPHLY 200 |tPLHY - tPHLZ|
800
tPHLZ

700
100

600
|CROSS PT. OF Y AND Z - CROSS PT. OF YAND Z|

500 0
-40 -25 0 25 50 75 85 -40 -25 0 25 50 75 85
TEMPERATURE (°C) TEMPERATURE (°C)
FIGURE 10. DRIVER PROPAGATION DELAY vs TEMPERATURE FIGURE 11. DRIVER SKEW vs TEMPERATURE (ISL8483E)
(ISL8483E)

FN6048 Rev.13.00 Page 10 of 15

Sep 24, 2018
ISL8483E, ISL8485E

Typical Performance Curves VCC = 5V, TA = +25°C, ISL8483E and ISL8485E; unless otherwise specified. (Continued)
40 3.0
PROPAGATION DELAY (ns)

35 2.5
|tPHLY - tPLHZ|
tPHLY

SKEW (ns)
30 tPHLZ 2.0 |tPLHY - tPHLZ|
tPLHZ

tPLHY
25 1.5

|CROSSING PT. OF Y- AND Z¯ - CROSSING PT. OF Y¯ AND Z-|

20 1
-40 -25 0 25 50 75 85 -40 -25 0 25 50 75 85
TEMPERATURE (°C) TEMPERATURE (°C)
FIGURE 12. DRIVER PROPAGATION DELAY vs TEMPERATURE FIGURE 13. DRIVER SKEW vs TEMPERATURE (ISL8485E)
(ISL8485E)

DRIVER INPUT (V)

DRIVER INPUT (V)

RDIFF = 54Ω, CL = 100pF

RECEIVER OUTPUT (V)

RECEIVER OUTPUT (V)

RDIFF = 54Ω, CL = 100pF
5 5
DI DI
0 0

5 5
RO RO
0 0

4 4
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)

B/Z A/Y
3 3

2 A/Y 2 B/Z

1 1

0 0
TIME (400ns/DIV) TIME (400ns/DIV)
FIGURE 14. DRIVER AND RECEIVER WAVEFORMS, FIGURE 15. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL8483E) HIGH TO LOW (ISL8483E)

DRIVER INPUT (V)

DRIVER INPUT (V)

RDIFF = 54Ω, CL = 100pF

RECEIVER OUTPUT (V)

RDIFF = 54Ω, CL = 100pF

RECEIVER OUTPUT (V)

5 5
DI DI
0 0

5 5
RO RO
0 0

4 4
DRIVER OUTPUT (V)

DRIVER OUTPUT (V)

B/Z A/Y
3 3

2 A/Y 2 B/Z

1 1

0 0
TIME (10ns/DIV) TIME (10ns/DIV)
FIGURE 16. DRIVER AND RECEIVER WAVEFORMS, FIGURE 17. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL8485E) HIGH TO LOW (ISL8485E)

FN6048 Rev.13.00 Page 11 of 15

Sep 24, 2018
ISL8483E, ISL8485E

Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please visit our website to make sure
that you have the latest revision.

DATE REVISION CHANGE

Sept 24, 2018 FN6048.13 Updated the Ordering Information table by adding tape and reel information, removing part, and updating notes.
Updated Typical Operating Circuits on page 2.
Removed About Intersil section and updated disclaimer.

Aug 31, 2017 FN6048.12 Updated Receiving Truth table on page 2.

Applied Intersil A Renesas Company template.

May 8, 2017 FN6048.11 Applied new header/footer

Removed any mention of military version.
Updated ordering information table on page 2 as follows:
Updated Note 2, added Notes 3, and 5.

Sept 3, 2015 FN6048.10 - Ordering Information Table on page 2.

- Added Revision History.
- Added About Intersil Verbiage.
-Updated POD M8.15 to most current revision with changes as follows:
-Revision 1 to Revision 2 Changes:
Updated to new POD format by removing table and moving dimensions onto drawing and adding land pattern
-Revision 2 to Revision 3 Changes:
Changed Note 1 "1982" to "1994"
Changed in Typical Recommended Land Pattern the following:
2.41(0.095) to 2.20(0.087)
0.76 (0.030) to 0.60(0.023)
0.200 to 5.20(0.205)
-Revision 3 to Revision 4 Changes:
Changed Note 1 "1982" to "1994"

FN6048 Rev.13.00 Page 12 of 15

Sep 24, 2018
ISL8483E, ISL8485E

Package Outline Drawings For the most recent package outline drawing, see M8.15.

M8.15
8 lead narrow body small outline plastic package
Rev 4, 1/12

DETAIL "A"
1.27 (0.050)
0.40 (0.016)

INDEX 6.20 (0.244)

AREA 5.80 (0.228)
0.50 (0.20)
x 45°
4.00 (0.157) 0.25 (0.01)
3.80 (0.150)

8°
1 2 3 0°

0.25 (0.010)
0.19 (0.008)
TOP VIEW SIDE VIEW “B”

2.20 (0.087)

1 8
SEATING PLANE

1.75 (0.069) 0.60 (0.023)

5.00 (0.197) 2 7
4.80 (0.189) 1.35 (0.053)
1.27 (0.050)

3 6
-C-

4 5
1.27 (0.050) 0.25(0.010)
0.10(0.004)
0.51(0.020)
0.33(0.013) 5.20(0.205)

SIDE VIEW “A TYPICAL RECOMMENDED LAND PATTERN

NOTES:
17. Dimensioning and tolerancing per ANSI Y14.5M-1994.
18. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
19. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
20. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
21. Terminal numbers are shown for reference only.
22. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
23. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
24. This outline conforms to JEDEC publication MS-012-AA ISSUE C.

FN6048 Rev.13.00 Page 13 of 15

Sep 24, 2018
ISL8483E, ISL8485E

For the most recent package outline drawing, see E8.3.

N
E1
INDEX
AREA 1 2 3 N/2 E8.3 (JEDEC MS-001-BA ISSUE D)
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
-B-
-A- INCHES MILLIMETERS
D E SYMBOL MIN MAX MIN MAX NOTES
BASE
PLANE A2 A - 0.210 - 5.33 4
-C- A
SEATING A1 0.015 - 0.39 - 4
PLANE L C
L A2 0.115 0.195 2.93 4.95 -
D1 A1 eA
D1 B 0.014 0.022 0.356 0.558 -
B1 e
eC C B1 0.045 0.070 1.15 1.77 8, 10
B
eB C 0.008 0.014 0.204 0.355 -
0.010 (0.25) M C A B S
D 0.355 0.400 9.01 10.16 5
NOTES:
D1 0.005 - 0.13 - 5
1. Controlling Dimensions: INCH. In case of conflict between English
and Metric dimensions, the inch dimensions control. E 0.300 0.325 7.62 8.25 6
2. Dimensioning and tolerancing per ANSI Y14.5M-1982. E1 0.240 0.280 6.10 7.11 5
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 e 0.100 BSC 2.54 BSC -
of Publication No. 95.
eA 0.300 BSC 7.62 BSC 6
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3. eB - 0.430 - 10.92 7
5. D, D1, and E1 dimensions do not include mold flash or protrusions. L 0.115 0.150 2.93 3.81 4
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). N 8 8 9
6. E and eA are measured with the leads constrained to be
Rev. 0 12/93
perpendicular to datum -C- .
7. eB and eC are measured at the lead tips with the leads
unconstrained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 -
1.14mm).

FN6048 Rev.13.00 Page 14 of 15

Sep 24, 2018
 Notice
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