Edc-Ec8353 (2021-2022) - All Units
Edc-Ec8353 (2021-2022) - All Units
1. With a neat diagram explain the working of a PN junction diode in forward bias
And reverse bias and show the effects of temperature on its VI characteristics
(NOV/DEC 2012), (May / June 2016), (Nov / Dec 2015)
(OR)
Outline the charge carrier diffusion phenomenon across a PN junction. Explain the effect of
forward and reverse biasing on the depletion region. (Nov/Dec 2018 R-13) (April / May 2019-R17)
A PN junction is formed from a piece of semiconductor (Ge or Si) by diffusing p-type material
(Acceptor impurity Atoms) to one half side and N type material to (Donar Impurity Atoms) other half
side. The plane dividing the two zones is known as 'Junction'.
The P-region of the semiconductor contains a large number of holes and N region, contains a large
number of electrons. A PN junction just immediately formed is shown in Fig.
When PN junction is formed, there is a tendency for the electrons in the N-region to diffuse into the p-
region, and holes from P-region to N-region. This process is called diffusion. While crossing the junction,
the electrons and holes recombines with each other, leaving the immobile ions in the neighborhood of the
junction neutralized as shown in Fig.
These immobile + ve and –ve ions, set up a potential across the junction. This potential is called
potential barrier or junction barrier. Due to the potential barrier no further diffusion of electrons and holes
takes place across the junction. Potential barrier is defined as a potential difference built up across the PN
junction which restricts further movement of charge carriers across the junction. The potential barrier for
a silicon PN junction is about 0.7 volt, whereas for Germanium PN junction is approximately 0.3 volt.
Symbol of Diode:
The symbol of PN junction diode is shown in Fig. The P-type and N-type regions are referred to as Anode
and Cathode respectively. The arrowhead shows the conventional direction of current flow when the
diode is forward biased.
Working of PN Junction Diode:
Forward Bias:
When the positive terminal of the external battery is connected to the P-region and negative terminal to
the N-region, the PN junction is said to be forward biased as shown in Fig.
When the junction is forward biased, the holes in the p-region are repelled by the
positive terminal of the battery and are forced to move towards the junction. similarly, the electrons in the
N-region are repelled by the negative terminal of the battery and are forced to move towards the-junction.
This reduces the width of the depletion layer and barrier potential. If the applied voltage is greater than
the potential barrier vr, then the majority carriers namely holes in P-region and electrons in N-region,
cross the barrier. During crossing some of the charges get neutralized the remaining charges after
crossing, reach the other side and constitute current in the forward direction. The PN junction offers very
low resistance under forward biased condition.
Since the barrier potential is very small (nearly 0.7 V for silicon and 0.3 V for Germanium junction), a
small forward voltage is enough to completely eliminate the barrier. once the potential barrier is
eliminated by the forward voltage, a large current start flowing through the PN junction.
Reverse Bias:
When the positive terminal of the external battery is connected to the N-region and negative terminal to
the p-region, the PN junction is said to be reverse biased. When the junction is reverse biased, the holes in
the P-region are attracted by the negative terminal of the battery. Similarly, the electrons in the N-region
2
are attracted by the positive terminal of the external battery. This increases the width of the depletion
layer and barrier potential (Vs).
The increased barrier potential makes it very difficult for the majority carriers to diffuse across the
junction. Thus, there is no current due to majority carriers in a reverse biased PN junction. In other words,
the PN junction offers very high resistance under reverse biased condition.
In a reverse biased PN junction, a small amount of current (in µA) flows through the junction because of
minority carriers. ( i.e., electrons in the P-region and holes in the N region).The reverse current is small
because the number of majority carrier in both regions is small.
A graph between the voltage applied across the PN junction and the current flowing through the junction
is called the V-I characteristics of PN junction diode. Fig. shows the V-I characteristics of PN junction
diode.
Forward Characteristics:
Fig. (a) shows the circuit arrangement for drawing the forward V-I characteristics of PN junction diode.
To apply a forward bias, the +ve terminal of the battery is connected to Anode (A) and the negative
terminal of the battery is connected to Cathode (K). Now, when supply voltage is increased the circuit
current increases very slowly and the curve is nonlinear (region-OA).
The slow rise in current in this region is because the external applied voltage is used to overcome the
barrier potential (0.7 V for Si; 0.3V for Ge ) of the PN junction' However once the potential barrier is
eliminated and the external supply voltage is increased further, the current flowing through the PN
junction diode increases rapidly (region AB). This region of the curve is almost linear. The applied
voltage should not be increased beyond a certain safe limit, otherwise the diode will burnout.
The forward voltage at which the current through the PN junction starts increasing rapidly is called by
knee voltage. It is denoted by the letter VB.
3
Reverse Characteristics:
Fig (b) shows the circuit arrangement for drawing the reverse V-I characteristics of PN junction diode. To
apply a reverse bias, the +ve terminal of the battery is connected to cathode (K) and - ve terminal of the
battery is connected to anode (A).
Under this condition the potential buried at the junction is increased. Therefore, the junction resistance
becomes very high and practically no. current flows through the circuit. However, in actual practice, a
very small current (of the order of µA) flows in the circuit. This current is called reverse current and is
due to minority carriers. It is also called as reverse saturation current (I). The reverse current increases
slightly with the increase in reverse bias supply voltage.
If the reverse voltage is increased continuously at one state (marked by point C on the reverse
characteristics) breakdown of junction occurs and the resistance of the barrier regions falls suddenly.
Consequently, the reverse current increases rapidly (as shown by the curve CD in the current) to a large
value. This may destroy the junction permanently. The reverse voltage at which the PN junction breaks is
called as break down voltage.
Temperature effects
The cut in voltage decreases as the temperature increases. The reverse saturation current increases.
(∆𝑇⁄
𝐼02 =2 10 ) 𝐼01
∆𝑇 = T2- T1.
The voltage equivalent of temperature VT also increases. The reverse breakdown voltage increases.
The applied voltage and current though diode are related by the equation
𝑉⁄
𝐼 = 𝐼0 (𝑒 𝜂𝑉𝑇 − 1)
Where,
4
𝑘̅𝑇 1.38 × 10−23 𝑇
𝑉𝑇 = = =
𝑞 1.602 × 10−19 11600
At room temperature
300
𝑉𝑇 = = 26𝑚𝑉
11600
The value of η=1 for germanium and 2 for silicon.
𝐼 ≅ 𝐼0
Depletion layer capacitance (or) transition capacitance (or) space charge capacitance (May / June
2016)(Nov/Dec 2016)(May 2017)
• When a PN junction is reverse biased, a layer of positive and negative immobile ions, called depletion
layer, is formed on either side of the junction. It is also known as depletion-region, space-charge region or
transition region. The depletion-layer acts as a dielectric (i.e., non-conductive) medium between P-region
and N-region. We know that the P-region and N-region on either side of the junction, has a low
resistance. Therefore, these regions act as two plates of a capacitor, separated by a dielectric (i.e.,
depletion layer) as shown in Fig.
The capacitance formed in a junction area is called depletion layer capacitance. It is also called depletion
region-capacitance, space charge capacitance, transition region capacitance or simply junction
capacitance.
• Since the depletion layer width (d) increases with the increase in reverse bias voltage, the resulting
depletion layer capacitance will decrease with the increased reverse bias.
• The depletion layer capacitance depends upon the nature of a PN junction, semiconductor material and
magnitude of the applied reverse voltage. It is given by the relation,
5
Where
K = A constant, depending upon the nature of semiconductor material
VB = barrier voltage. 0.6V for silicon and 0.3V for germanium
V = applied reverse voltage
n a constant depending upon the nature of junction.
The value of the K is
• The value of ‘n’ is taken as 1/2 for step or abrupt junction, 1/3 for linearly graded junction.
• It is the evident from the above relation that the value of depletion layer capacitance (CT) can be
controlled by varying the applied reverse voltage. This property of variable capacitance, possessed by
reverse biased PN junction, is used in the concentration of a device called varactor.
Reverse biased.
Derivation:
6
qNA w2
VB = × ----------------3
ε 2
W=√VB
Q=No of change particle × change on each particle
=(NA × volume) × q
Q=qNA AW------------------2
Diff 3 w.r.to V
qNA w 2
VB = ×
ε 2
qNA 1 dw
1= ×2 2w
ε dv
dw ε
=
dv qNA w
Diff 2
dQ dw
= qNA A
dv dv
ε Aε
CT = qNA A =
qNA w w
dQ
CD =
dv
CD is >CT
I=Ipn(0) + Inp (0)
Ipn(0) → hole diffusion current n region
Inp (0) → electron diffusion current in p region
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Inp (0) ⋍ 0
P side heavily doped
dpn
Jp(x) = −qDp
dx
I
J=
A
dp
Ip (X)=−qADp dxn ---------------1
Pn (X) = Pn(0) e−X/LP ----------------2
Hole concentration in the right side of p material Pn(0) ie junction
Diff 2
dpn (x) 1
= Pn(0) e−X/LP ( )
dx LP
Ip (X)=−qADp Pn(0) e−X/LP . -1/LP
At x=0 Ip (X)=Ipn(0) =I
QADP
I= Pn (0)
LP
IL
Pn(0) = QADP -------------------------- A
P
Now the excess minority charge exists only on n side and given by
∞
Q=∫0 Aq Pn(0)e−X/LP dx
∞
e−X/LP
=AqPn(0) [ −1 ]
LP
0
=AqLpPn(0)[e−∞ − e−0 ]
Q=−AqLpPn(0)
Q=AqLpPn(0)------------------B
Put A in B
AqLpILP LP 2
Q= = .I
qADp Dp
Assume
LP 2
=𝜏
Dp
dQ
Q=𝜏I ⇒ dI = 𝜏
W.K.T
dQ dI
CD = .
dI dV
dI
CD = 𝜏.
dV
I = Io (eV/DVT )
dI 1
= I.
dV ηVT
I
CD = 𝜏.
ηVT
It is evident from the above relation, that diffusion capacitance is directly proportional to the forward
current (I).
8
Rectifiers – Half Wave and Full Wave
Half Wave
4. What is halfwave rectifier? Explain the working principle with neat sketch? (Nov / Dec 2015)
(Nov/Dec 2016)
Rectifiers are a class of circuits whose purpose is to convert ac waveforms (usually sinusoidal
and with zero average value) into a waveform that has a significant non-zero average value (dc
component). Simply stated, rectifiers are ac-to-dc energy converter circuits. Most rectifier circuits employ
diodes as the principal elements in the energy conversion process; thus, the almost inseparable notions of
diodes and rectifiers.
Uncontrolled rectifier: uncontrolled refers to the absence of any control signal necessary to operate the
primary switching elements (diodes) in the rectifier circuit. (The discussion of controlled rectifier circuits,
and the controlled switches themselves, is more appropriate in the context of power electronics
applications). Rectifiers are the fundamental building block in dc power supplies of all types and in dc
power transmission used by some electric utilities.
(a) Half Wave (HW) rectifier (b) Full Wave (FW) rectifier
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Negative half cycle:
During negative half cycle of the input signal, the anode of the diode becomes negative with respective to
the cathode and hence the diode D does not contact. For an ideal diode the impedance by the diode is
infinity. So the whole input voltage appears across the diode D. hence the voltage drop across R, is zero.
1 2π
Idc = ∫ i d(ωt)
2π 0
π
1
Idc = [∫ Im ∗ sinωt d(ωt)]
2π 0
1 Im Im Im
Idc = [−cosωt]π0 = [−cosπ − (−cos0)] = [−(−1) − (−1)] =
2π 2π 2π π
Vm
Idc =
π(R F + R L )
Im Vm
Vdc = × RL =
π π
10
Im 2 π π
Im 2 π
sin2ωt π
=√ ∫ d(ωt) − ∫ cos2(ωt) ∗ d(ωt) = √ [ωt 0 − ( ) ]
4π 0 0 4π 2 0
Im 2 sin2π sin0 Im 2 Im 2 Im
= √ [(π − 0) − ( − )] = √ [(π − 0) − 0] = √ =
4π 2 2 4π 4π 2
Im 2
Idc 2 ×RL π
×RL Im 2 /π2 ×RL 4
Rectification efficiency (η) = 2 = 2 = 2 = = 0.406
Irms ×RL Im
×RL Im /4×RL π2
2
′
Irms 2
Irms 2
− Idc Irms 2 Irms /2 2 π2
𝛄= =√ 2 = √( ) − 1 = √ ( ) − 1 = √ − 1 = 𝟏. 𝟐𝟏
Idc Idc Idc Im /π 4
𝑟𝑚𝑠 𝑣𝑎𝑙𝑢𝑒 𝜋
𝐹𝐹 = = = 1.57
𝑎𝑣𝑒𝑟𝑎𝑔𝑒 𝑣𝑎𝑙𝑢𝑒 2
(h) Peak factor:
𝑉𝑚
𝑃𝐹 = =2
𝑉
( 2𝑚 )
(i) Transformer utilization factor:
𝑃𝑑𝑐
𝑇𝑈𝐹 = (𝑇𝑟𝑎𝑛𝑠𝑓𝑜𝑟𝑚𝑒𝑟 𝑠𝑒𝑐𝑜𝑛𝑑𝑎𝑟𝑦 𝑟𝑎𝑡𝑒𝑑) = 0.287
𝑃𝑎𝑐
Disadvantages of HWR:
➢ Low output because one half cycle only delivers output
➢ A.C. component more in the output
➢ Requires heavy filter circuits to smooth out the output Peak inverse Voltage.
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Rectifiers – Full Wave using center tap Transformer
5. Explain the operation of full wave rectifier with center tap transformer. Also derive the following
for this rectifier. (Apr/May 2018)
i) DC output voltage (average value) ii) DC output current (average value) iii) RMS
output voltage.
In FWR, current flows through the load during both half cycles of the input a.c. supply. Like the
half wave circuit, a full wave rectifier circuit produces an output voltage or current which is purely DC or
has some specified DC component. Full wave rectifiers have some fundamental advantages over their half
wave rectifier counterparts. The average (DC) output voltage is higher than for half wave, the output of
the full wave rectifier has much less ripple than that of the half wave rectifier producing a smoother
output waveform.
A full wave rectifier is an electronic circuit which converts AC voltage into a pulsating DC voltage using
both half cycles of the applied AC voltage. A full wave rectifier is a circuit which allows a unidirectional
current to flow through the load during the entire input cycle as shown in fig. The result of full wave
rectification is a d.c. output voltage that pulsates every half-cycle of the input. On the other hand a half
wave rectifier allows the current to flow through the load during positive half-cycle only.
The circuit uses two diodes which are connected to secondary winding of the transformer. The input
signal is applied to the primary winding of the transformer. During the positive input half cycle, the
polarities of the secondary voltage is shown in fig. This forward bias the diode D, and reverse biases the
diode D1. As a result of this, the diode D, conducts some current whereas the diode D, is off.
The current through load R1 is as indicated in through D1, and the voltage Drop across RL will the fig.
The load current flows be equal to the input voltage.
12
Negative half cycle:
During the negative input half cycle, the polarities of the secondary voltage are interchanged. The
reverse-bias the diode D, and forward Biases the diode D2. As a result of this, the diode D1 is OFF and the
diode D2 conducts some current. The current through the load R, is an indicated in the fig. The load
current flows through D2 and the voltage drop across R1 will be equal to the input voltage. The maximum
efficiency of a fall-wave rectifier is 8l,2℅Vo and ripple factor is 0.48.
13
(a) Average or DC value of output current ( Idc ):
1 π
Idc = ∫ i d(ωt)
π 0
π
1
Idc = [∫ Im ∗ sinωt d(ωt)]
π 0
1 Im Im 2Im
Idc = [−cosωt]π0 = [−cosπ − (−cos0)] = [−(−1) − (−1)] =
π π π π
2Vm
Idc =
π(R F + R L )
2Im 2Vm
Vdc = × RL =
π π
Im 2 π π
Im 2 π
sin2ωt π
= √ ∫ d(ωt) − ∫ cos2(ωt) ∗ d(ωt) = √ [ωt 0 − ( ) ]
2π 0 0 2π 2 0
Im 2 sin2π sin0 Im 2 Im 2 Im
=√ [(π − 0) − ( − )] = √ [(π − 0) − 0] = √ =
2π 2 2 2π 2 √2
2Im 2
Idc 2 ×RL π
×RL 4Im 2 /π2 ×RL 0.812
Rectification efficiency (η) = 2 = Im 2
= 2 = R
= 81.2%
Irms ×RL ×RL Im /2×RL (1+ F )
√2 RL
2
RMS value of Ac component Irms 2 Im /√2 π2
𝛄= = √( ) − 1 = √( ) − 1 = √ − 1 = 𝟎. 𝟒𝟖
Dc value of wave Idc 2Im /π 8
14
Advantages:
1. The D.c load voltage and current are more than halfwave.
2. No D.c current thro transformer windings hence no possibility of saturation.
3. TUF is better.
4. Efficiency is higher.
5. Ripple factor less.
Disadvantages:
1. PIV rating of diode is higher
2. Higher PIV diodes are larger in size ad costlier.
3. Cost of transformer is high.
Another type of circuit that produces the same output waveform as the full wave rectifier circuit
above is that of the Full Wave Bridge Rectifier. This type of single-phase rectifier uses four individual
rectifying diodes connected in a closed loop "bridge" configuration to produce the desired output. The
main advantage of this bridge circuit is that it does not require a special center tapped transformer,
thereby reducing its size and cost. The single secondary winding is connected to one side of the diode
bridge network and the load to the other side as shown below.
The four diodes labeled D1 to D4 are arranged in "series pairs" with only two diodes conducting
current during each half cycle. During the positive half cycle of the supply, diodes D1 and D2 conduct in
series while diodes D3 and D4 are reverse biased and the current flows through the load as shown below.
During the negative half cycle of the supply, diodes D3 and D4 conduct in series, but diodes D1
and D2 switch of as they are now reverse biased. The current flowing through the load is the same
direction as before. As the current flowing through the load is unidirectional, so the voltage developed
across the load is also unidirectional the same as for the previous two diode full-wave rectifier.
15
Positive half cycle
Waveform:
16
Analysis of Full Wave Rectifier:
1 π 1 π
Idc = ∫ i d(ωt) Idc = [∫ Im ∗ sinωt d(ωt)]
π 0 π 0
1 Im Im 2Im
Idc = [−cosωt]π0 = [−cosπ − (−cos0)] = [−(−1) − (−1)] =
π π π π
2Vm
Idc =
π(R F + R L )
2Im 2Vm
(b) Average or DC value of output voltage (Vdc): Vdc = × RL =
π π
Im 2 π π
Im 2 π
sin2ωt π
= √ ∫ d(ωt) − ∫ cos2(ωt) ∗ d(ωt) = √ [ωt 0 − ( ) ]
2π 0 0 2π 2 0
Im 2 sin2π sin0 Im 2 Im 2 Im
=√ [(π − 0) − ( − )] = √ [(π − 0) − 0] = √ =
2π 2 2 2π 2 √2
2Im 2
Idc 2 ×RL π
×RL 4Im 2 /π2 ×RL 0.812
Rectification efficiency (η) = 2 = Im 2
= 2 = R
= 81.2%
Irms ×RL ×RL Im /2×RL (1+ F )
√2 RL
(e) Ripple Factor (γ):
2
RMS value of Ac component Irms 2 Im /√2 π2
𝛄= = √( ) − 1 = √( ) − 1 = √ − 1 = 𝟎. 𝟒𝟖
Dc value of wave Idc 2Im /π 8
17
(f)Peak inverse Voltage (PlV):
Peak inverse voltage is the maximum possible voltage across a diode when it is not
Conducting. During positive half cycle of the AC input voltage Diode D1, is conducting and Diode D, is
not conducting. In this case a voltage V, is developed across the load resistor R1. Now the voltage across
the non-conducting Diode D, is the sum of the voltage across R1 and voltage across the lower half of
transformer secondary Vm.
Hence, PIV of Diode D2 = Vm + Vm = 2Vm
Similary, PIV of Diode D1 = Vm + Vm = 2Vm
Advantages:
1. The D.c load voltage and current are more than half wave.
2. No D.c current thro transformer windings hence no possibility of saturation.
3. TUF is better.
4. Efficiency is higher.
5. Ripple factor less.
6. No centre tapped is required.
Disadvantages:
4 diodes are used therefore voltage drop across the diode is increased. This reduces output voltage.
Applications:
1. In power supply circuits.
2. Used as rectifier in power circuits to convert A.C to D.C
(b) In a bridge rectifier circuit, input supply is 230V, 50 Hz. Primary to secondary
turns ratio is 4:1, load resistance is 200 Ω. The diodes are ideal. Find DC output
voltage, PIV and output signal frequency. (Nov / Dec 2018-R17)
Solution: 𝑬𝒑𝒚 (𝒓𝒎𝒔) = 𝟐𝟑𝟎𝑽, 𝑵𝑵𝟐 = 𝟏𝟒 , 𝑹𝑳 = 𝟐𝟎𝟎Ω 𝑹𝒇 = 𝑹𝒔 = 𝟎Ω 𝒂𝒔 𝒊𝒅𝒆𝒂𝒍
𝟏
𝑬𝒑𝒚 (𝒓𝒎𝒔) 𝑵𝟏 𝑵𝟏 𝟏
= , 𝑬𝒔𝒚 (𝒓𝒎𝒔) = 𝑿 𝑬𝒑𝒚 (𝒓𝒎𝒔) = 𝑿 𝟐𝟑𝟎 = 𝟓𝟕. 𝟓 𝑽,
𝑬𝒔𝒚 (𝒓𝒎𝒔) 𝑵𝟐 𝑵𝟐 𝟒
18
7. Compare different types of rectifiers?
Type HW CT FW FW BR
No of diodes used 1 2 4
PIV Vm 2Vm Vm
Peak factor 2 √2 √2
Ripple frequency f 2f 2f
A light-emitting diode(LED) is a semiconductor light source LEDs are used as indicator lamps in many
devices and are increasingly used for other lighting. Introduced as a practical electronic component in
1962, early LEDs emitted low-intensity red light, but modern versions are available across the visible,
ultraviolet, and infrared wavelengths, with very high brightness.
When a light-emitting diode is forward-biased (switched on), electrons are able to recombine with
electron holes within the device, releasing energy in the form of photons. This effect is called
electroluminescence and the color of the light (corresponding to the energy of the photon) is determined
by the energy gap of the semiconductor.
LEDs are often small in area (less than 1 mm2), and integrated optical components may be used to
shape its radiation pattern.[5] LEDs present many advantages over incandescent light sources including
lower energy consumption, longer lifetime, improved robustness, smaller size, and faster switching. LEDs
powerful enough for room lighting are relatively expensive and require more precise current and heat
management than compact fluorescent lamp sources of comparable output.
Light Emitting Diodes are made from exotic semiconductor compounds such as Gallium Arsenide
(GaAs), Gallium Phosphide (GaP), Gallium Arsenide Phosphide (GaAsP), Silicon Carbide (SiC) or Gallium
Indium Nitride (GaInN) all mixed together at different ratios to produce a distinct wavelength of colour.
19
Different LED compounds emit light in specific regions of the visible light spectrum and therefore produce
different intensity levels.
Light-emitting diodes are used in applications as diverse as aviation lighting, automotive lighting,
advertising, general lighting, and traffic signals. LEDs have allowed new text, video displays, live video,
and sensors to be developed, while their high switching rates are also useful in advanced communications
technology. Infrared LEDs are also used in the remote control units of many commercial products
including televisions, DVD players, and other domestic appliances.
20
Laser diodes
9. Explain in detail about LASER DIODE? (May / June 2016) (April/May 2018)
The term laser comes from the acronym for light amplification for stimulated emission of
radiation. The laser medium can be a gas, liquid, amorphous solid or semiconductor.
Laser Action
The light travelling through a semiconductor, then a single photon is able to generate an identical second
photon. This photon multiplication is the key physical mechanism of lasing. The carrier inversion is the
first requirement of lasing. It is achieved at the PN junction by providing the conduction bandwith
electrons from the N-doped side and the valence band with holes from the P-doped side as shown in Fig.
The photon energy is given by the band gap, which depends on the semiconductor material. The optical
feedback and the confinement of photon in an optical resonator are the second basic requirement of
lasing.
PN Homojunction Laser
It has the material GaAs on both sides of the junction. A pair of parallel planes perpendicular to the plane of the
junction are cleared and polished under appropriate biasing in off condition, laser light is emitted from these planes.
The other two sides are deliberately roughened to prevent lasing in those directions. Such a cavity is called a
Fabryperot resonant cavity with a typical cavity length of 300 |J.m. It is a thin layer of material with a narrow band
gap. GaAs is sandwiched between layers of a material with band gap. This is usually realized by epitaxy. In such a
structure the carrier are better confined in the active region due to the heterojunction barriers. Optical confinement
is also better in DH laser. The propagation of the electromagnetic radiation is confined in a direction parallel to the
Stimulation
Emission
Region
layer interface. The current density required for lasing in lower for DH lasers compared to homojunction lasers.
The double preferred for continuous operation at room temperature.
21
Characteristics of Laser Diode
The Ideal light output against current characteristics for semiconductor laser is shown in Fig.4.28.
The solid line represents the laser characteristics. It may be observed that the device gives low light
output in the region, the threshold with corresponds to spontaneous emission only within the structure.
After the threshold current value the light output increases substantially for small increases in current
through the device.
22
ZENER DIODE
10. Explain the construction & working principle of Zener diode.
Explain the Break down mechanisms in semiconductor devices. (May/June 2016), (Nov / Dec 2015)
(OR) Explain the Concept of Zener Breakdown and its VI characteristics. (Nov/Dec 2018-R-13)
ZENER DIODE:
The Zener Diode is a PN junction semiconductor device.
It is fabricated with precise breakdown voltages, by controlling the doping level during manufacturing.
Practically, Zener Diodes are operated in reverse biased mode.
FORWARD CHARACTERISITCS:
In forward biased condition, the normal rectifier diode and the Zener diode operate in similar fashion.
(Refer: PN diode forward characteristics)
In reverse biased condition, the diode carries reverse saturation current till the reverse voltage applied is
less than the reverse breakdown voltage.
When the reverse voltage exceeds reverse breakdown voltage, the current through it changes drastically
but the voltage across it remains almost constant.
The normal operating regions for both diode and Zener are shown in below Fig.
23
Fig. The normal operating region for a rectifier diode and Zener diode
When the applied reverse voltage is increased then, the current through it is very small (few µA) and it is called
Reverse Leakage Current (Io)
At certain reverse voltage, the current will increase rapidly. The breakdown occurs and the current at this point
(knee or Zener knee) is called Zener knee current (IZK or IZmin).
Zener knee current is the minimum Zener current which is must to carry out the operate in Reverse Breakdown
Region.
The reverse voltage at which the breakdown occurs is called Zener Breakdown Voltage or Zener Voltage (VZ).
The VZ is set by controlling the doping level during manufacturing process.
Below the knee, the reverse breakdown voltage increases slightly as Zener current (IZ) increases but, remains
almost CONSTANT.
The current at which the nominal Zener breakdown voltage is specified is called Zener Test Current (IZT).
As the current increases, the power dissipation (PZ = VZ IZ) will be increased and if this power dissipation is
increased beyond a certain current value, the Zener diode may get damaged. So, there is a maximum current that a
Zener diode can carry safely is called Zener Maximum Current (IZM or IZmax).
In practical circuits, a current limiting resistor is used in series with Zener diode in order to limit the current
between IZmin to IZmax.
24
EQUIVALENT CIRCUIT OF ZENER DIODE:
When the breakdown occurs then IZ may increase from IZmin to IZmax but voltage across Zener remains
almost constant. The internal impedance decreases as current increases in Zener region. But this
impedance is very small and hence ideally Zener diode is indicated by a battery of voltage VZ. This VZ
remains almost constant in the Zener region which is shown in Fig.
In practical circuit, the Zener internal resistance is to be considered (even though it is very small) and
called as Zener Dynamic Resistance ZZ. Due to this resistance the Zener region is not exactly vertical,
i.e., for the small change in the Zener current ∆IZ produces a small change in Zener voltage ∆VZ. The
ratio of VZ to IZ is called Zener resistance ZZ.
Hence, the practical Zener diode equivalent circuit should be indicated with a battery of V Z along with
series resistance ZZ as shown in Fig.
∆𝑉𝑍 1
Dynamic Resistance, 𝑍𝑍 = = ∆𝐼
∆𝐼𝑍 [∆𝑉𝑍 ]
𝑍
1
𝑍𝑍 =
[𝑠𝑙𝑜𝑝𝑒 𝑜𝑓 𝑡ℎ𝑒 𝑟𝑒𝑣𝑒𝑟𝑠𝑒 𝑐ℎ𝑎𝑟𝑎𝑐𝑡𝑒𝑟𝑖𝑠𝑡𝑖𝑐𝑠 𝑖𝑛 𝑧𝑒𝑛𝑒𝑟 𝑟𝑒𝑔𝑖𝑜𝑛]
25
BREAKDOWN MECHANISM IN ZENER DIODE:
ZENER BREAKDOWN:
Zener breakdown occurs at Reverse biased condition because of heavy doping;
Practically, Zener breakdown is observed in the Zener diodes with breakdown voltage less than 6V.
In Zener breakdown, the value of the breakdown voltage decreases as PN junction temperature increases, i.e.
Negative Temperature Coefficient (NTC)
For applied reverse biased voltage of less than 6V causes a high magnitude electric
field (3 X 105 V/cm) across the depletion region, at the PN junction.
This electric field applies a large force on the valence electron of the atom, tending it
to separate them from their respective nuclei. Electron-hole pairs are generated in
large numbers and there will be a sudden increase in current. (To limit this current, a
current limiting resistor is used in order to protect the Zener diode from being
destroyed because of excessive heating at the junction)
AVALANCHE BREAKDOWN:
Avalanche Breakdown occurs at Reverse biased condition due to ionization of electron and hole pairs
Practically, Avalanche breakdown is observed in the Zener diodes with breakdown voltage greater than 6V.
In avalanche breakdown, the value of the breakdown voltage increases as PN junction temperature increases, i.e.
Positive Temperature Coefficient (PTC)
For applied reverse biased voltage of greater than 6V causes increased acceleration
of minority charge particles. Thus, collision between accelerated charge particles
with high velocity and kinetic energy with adjacent atom is involved in breaking the
covalent bonds of the crystal structure. This process is called Carrier
Multiplication.
At this stage, junction is said to be in breakdown and current starts increasing
rapidly. To limit this current below IZmax, a current limiting resistor is necessary.
26
ZENER AS REGULATOR
11. (a) Explain the working of a Zener diode as a regulator? (May 2017) (Nov/Dec 2017) (Nov/Dec
2018 – R17)
The Zener Diode is used to regulate the Load Voltage. Here, the Zener is used in reverse biased condition.
Since, voltage across the Zener Diode is CONSTANT & equal to VZ, it is connected across the load.
⸫ The Load Voltage (Vo) is equal to Zener Voltage (VZ).
i.e. The Zener Diode acts as an ideal voltage source which maintains a constant load voltage,
independent of the current.
Vo = VZ is constant
𝑉 𝑉
IL = 𝑜 = 𝑍 = 𝑐𝑜𝑛𝑠𝑡𝑎𝑛𝑡
𝑅𝐿 𝑅𝐿
And 𝐼 = 𝐼𝑍 + 𝐼𝐿
Fig. Varying input condition
As long 𝑰𝒁 is between 𝑰𝒁𝒎𝒊𝒏 and 𝑰𝒁𝒎𝒂𝒙 , the VZ i.e. output voltage Vo is constant. Thus, the changes
in the input voltage is get compensated and output is maintained constant.
The maximum power dissipation for the zener diode is fixed, 𝑷𝑫 = 𝑽𝒁 𝑰𝒁𝒎𝒂𝒙
27
REGULATION WITH VARYING LOAD (Load Regulation)
Zener Regulator under varying load condition (RL is variable) and constant input voltage (Vin is constant)
is shown in Fig.
Vo = VZ is constant and Vin is Constant, then for constant R, the current (I) is
constant.
𝑉 −𝑉
I = 𝑖𝑛 𝑍 (constant); I = 𝐼𝐿 + 𝐼𝑍
𝑅
As long 𝑰𝒁 is between 𝑰𝒁𝒎𝒊𝒏 and 𝑰𝒁𝒎𝒂𝒙 , the VZ i.e. output voltage Vo is constant. Thus, the changes
in the load is get compensated and output is maintained constant.
(b) For the following circuit, find the maximum and minimum values of Zener diode
current. (Nov/Dec 2018 – R17)
80 − 50 120 − 50
𝐼(𝑚𝑖𝑛) = = 6𝑚𝐴 𝐼(𝑚𝑎𝑥) = = 14𝑚𝐴
5 𝑋 103 5 𝑋 103
28
Problems: (Anna University Exam - Solved Problems)
1. For the zener regulator shown in Fig. 5, calculate the range of input voltage for which output
will remain constant.
𝑰𝒁 (𝒎𝒊𝒏) = 𝟐. 𝟓𝒎𝑨, 𝑰𝒁 (𝒎𝒂𝒙) = 𝟐𝟓𝒎𝑨, 𝑽𝒁 = 𝟔. 𝟏𝑽, 𝒓𝒁 = 𝟎 𝑲Ω
Solution:
𝐼𝑍 (𝑚𝑖𝑛) = 2.5𝑚𝐴, 𝐼𝑍 (𝑚𝑖𝑛) = 25𝑚𝐴, 𝑉𝑍 = 6.1𝑉, 𝑟𝑍 = 0 𝐾Ω, 𝑅 = 2.2 𝐾Ω, 𝑅𝐿 = 1 𝐾Ω
𝑉𝑍 6.1
𝐼𝐿 = = = 6.1 𝑋 10−3 = 6.1𝑚𝐴 (𝑪𝑶𝑵𝑺𝑻𝑨𝑵𝑻)
𝑅𝐿 1 𝑋 103
𝐹𝑜𝑟 𝑉𝑖𝑛 (𝑚𝑖𝑛) ; 𝐼 (𝑚𝑖𝑛) = 𝐼𝑧(𝑚𝑖𝑛) + 𝐼𝐿 𝐹𝑜𝑟 𝑉𝑖𝑛 (𝑚𝑧𝑥) ; 𝐼 (𝑚𝑎𝑥) = 𝐼𝑍(𝑚𝑎𝑥) + 𝐼𝐿
𝐼 = 2.5 𝑋 10−3 + 6.1 𝑋 10−3 = 8.6𝑚𝐴 𝐼 = 25 𝑋 10−3 + 6.1 𝑋 10−3 = 31.1𝑚𝐴
𝑉𝑖𝑛 (𝑚𝑖𝑛) = 𝑉𝑍 + 𝐼𝑅𝑉𝑖𝑛 (𝑚𝑎𝑥) = 𝑉𝑍 + 𝐼𝑅
𝑉𝑖𝑛 (𝑚𝑖𝑛) = 6.1 + 8.6 𝑋 10−3 𝑋 2.2 𝑋 10−3 = 25.02𝑉 𝑉𝑖𝑛 (𝑚𝑖𝑛) = 6.1 + 31.1 𝑋 10−3 𝑋 2.2 𝑋 10−3 = 74.52𝑉
⸫ 𝑽𝒊𝒏 (𝒎𝒊𝒏) = 𝟐𝟓. 𝟎𝟐𝑽 ⸫ 𝑽𝒊𝒏 (𝒎𝒂𝒙) = 𝟕𝟒. 𝟓𝟐𝑽
2. A silicon diode has a saturation current 7.5𝝁 A at room temperature 300K.Find the saturation
current at 400k. Io1=7.5 x 10-6 A at T1=300⁰ K=27⁰ C and T2=400 ⁰K=127⁰ C. (Nov/Dec 2016 – R13)
Solution: The saturation current at 400⁰K is
∆𝑇
𝐼02 =𝐼01 × 210 =7.5 X 10-6 X 2(127-27)/10 =7.68mA
4. An AC voltage of peak value 20V is connected in series with a silicon diode and load resistance of
500Ω. If the forward resistance of diode is 10Ω find the peak current through the diode.
(Nov/Dec 2018-R17)
Solution: 𝐸𝑚 = 20𝑉, 𝑅𝐿 = 500Ω, 𝑅𝑓 = 10Ω
𝐸𝑚 20
𝐼𝑚 = 𝐼𝑚 =
𝑅𝑓 + 𝑅𝐿 500 + 10
⸫ 𝐼𝑚 = 39.22 𝑚𝐴
29
5. (a) Determine the peak output voltage of a half wave rectifier, if the diode has V F =
0.7V and the AC input is 22V. (April / May 2019-R17)
(b) If load resistance is given as 500Ω, calculate peak output current of the above given half wave
rectifier.
𝑉𝑝𝑜 30.4
Solution: 𝑅𝐿 = 500Ω 𝐼𝑝 = = 𝐼𝑝 = 60.8 𝑚𝐴
𝑅𝐿 500
(c) Determine the diode peak reverse voltage (PIV). PIV = 𝑉𝑝𝑖 = 31.1 V
6. What value of series resistor is required to limit the current through a LED to 20 mA with a forward
voltage drop of 1.6 V when connected to a 10V supply? (Nov/Dec 2017)
Assume the mobility of majority and minority carriers are same and KT=26 meT at room temperature.
i n2
a) Minority carrier concentration=Doping concentration
(1.5×1016 ) atoms
= 1020
= 2.25 × 1012 m3
We knowσ = nq(μn + μp )
σ 1
or(μn + μp ) = nq = ρnq
1 1
=(2×103 )(1.5×1016 )(1.6×10−19 ) = 4.8
In this case the concentration of majority and minority carriers are same, thus
1 m2
μn + μp = 2μn = or μn = o. 1042
4.8 Volt − sec
no 1020
C) EA − Ei = KT log e = 0.026log e ( )
ni 1016 ×15
=0.229e V.
Thus EF lies0.229e V above from fermilevel.
2
(2ni)2 [2(1.5×1016 ) ] 9×1032
d) Minority carrier concentration=doping concentration = 1020
= 1020
=9× 1012 atoms/cm3 .
30
Additional Questions: PART-A
1. Define valence electron.
Electrons that are in shells close to nucleus are tightly bounced to the atom and have low energy. Whereas
electrons that are in shells farther from the nucleus have large energy and less tightly bound to the atom.
Electrons with highest energy level exist in the outermost shell of an atom. These electrons determine the
electrical and chemical characteristic of each particular type of atom. These electrons are known as valence
electrons.
31
Additional Questions (PART-B)
1. Draw and explain the energy band diagram for the following
(i) conductors (ii) Insulators (iii) semiconductors
Insulators :
The materials in which the condition band and valence bands are seperated by a wide energy gap (≈ 15 eV) as
shown in figure.
A wide energy gap means that a large amount of energy is required, to free the electrons, by moving them from the
valence band into the condition band ;
Since at room temperature, the valence electrons of an insulator do not have enough energy to jump in to the
condition, therefore insulator do not have an ability to conduct current. Thus insulators have very high resistively
(or extremely low conductivity) at room temperatures.
However if the temperature is raised, some of the valence electrons may acquire energy and jump in to the
conduction band. It causes the resistively of insulators to decrease.Therefore an insulator have negative temperature
co-efficient of resistance.
Conductors :-
The materials in which conduction and valence bands overlap as shown in figure are called conductors.
The overlapping indicates a large number of electrons available for conduction.Hence the application of a small
amount of voltage results a large amount of current.
Semiconductors :-
The materials, in which the conduction and valence bands are separeated by a small energy gap (1eV) as
shown in figure are called semiconductors.
Silicon and germanium are the commonly used semiconductors.
A small energy gap means that a small amount of energy is required to free the elctrons by moving them from the
valence band in to the conduction band.
The semiconductors behave4 like insulators at 0K, because no electrons are available in the conduction band.
If the temperature is further increased, more valence elctrons will acquire energy to jump into the conduction
band.Thus like insulators, semiconductors also have negative temperature co-efficient of resistance. It means that
conductivity of semiconductors increases with the increases tempertature.
o Intrinsic seiconductor
A semiconductor in an extremely pure form is known as an intrinic semiconductor. An Intrinsic
semiconductor, even at room temperature, hole-electron pairs all created. When electric field is applied across an
semiconductor intrinisic semiconductor, the current conduction takes place by two process, namely by free
electrons and holes.
32
Free electrons are produced due to the breeding up of fome co-valent bonds by thermal energy. At the same
time holes are created in the co-valent bond itself.When electric field is applied across the semi-conducteurs
material electrons will move towards the positive terminal of supply, holes will move towards negative terminal of
the supply.
Thus current conduction inside this intrinisic semiconductor material is due to movement of holes & electrons.
But the current in the external wire is only because of electrons. Since while applying electric field, holes
are attracted towards negative terminal. There one new electron is introduced. This electron will combine with the
hole, thus cancelling them.
At the same time electrons are moving towards positive terminal, while leacing from this intrinisic
material it leaves a hole. Again this holes are attracted towards negative terminal.
o Extrinisic semiconductor :
The current conduction capability of intrinisic semiconductor is very low at rom temperature. So we can
not use it in electric devices.
Hence the current conduction capability must be increased. This can be achieved by adding impurities to the
intrinisic semiconductor. So that it become impurity semiconductor (or) Extrinisic semiconductor.The process of
adding impurity is known as doping.
The amount & type of impurities have to be closely controlled during the preparation of extrinisic
semiconductor. Generally, for 108 atoms of semiconductor, one impurity atom is added.
The purpose of adding impurity is to increase either the number of free electrons or holes in the semiconductor
crystal. If the pentavalent impurity is adding to the semiconductor, a large number of free electrons are produced in
the semiconductor.
On the other hand if the trivalent impurtiy is added it introdued large number of holes. Depending upon the type of
impurity added, extrisic semiconductors are classified into
➢ n – type Semiconductor
➢ p – type Semiconductor
n – type Semiconductor :
The number of free electrons in an instrinsic silicon can be increased by adding a pentavalent atom to it.
These are atoms with five valence electrons. Typical example for pentavalent atoms are Arsenic, Phosphorous,
Bismuth and Antimony.
Four of the pentavalent atoms valence electrons form covalent bond with the valence electrons of Silicon
atom, leaving an extra electron. Since valence orbit cannot hold no more than eight electrons the extra electron
becomes a conduction electron.
33
Since the pentavalent atom donnates this extra conduction electron it is often called as a donor atom. For
each pentavalent atom added, one free electron exists in a silicon crystal. A small amount of pentavalent impurity is
enough to get more number of free electrons is greater than the nuumber of holes this extrinsic semiconductor is
known as an n type semiconductor.
When a pentavalent atom is added a number of conduction band electrons are produced. Only a few holes
exist in the valence band, created by thermal energy. Therefore in an n-type semiconductor, electrons are majority
carriers and holes are minority carriers.
p-type semiconductor
A p-type semiconductor (p for Positive) is obtained by carrying out a process of doping by adding a certain
type of atoms (acceptors) to the semiconductor in order to increase the number of free charge carriers (in this case
positive holes).
When the doping material is added, it takes away (accepts) weakly bound outer electrons from the
semiconductor atoms. This type of doping agent is also known as an acceptor material and the vacancy left behind
by the electron is known as a hole.
The purpose of p-type doping is to create an abundance of holes. In the case of silicon, a trivalent atom
(typically from Group 13 of the periodic table, such as boron or aluminium) is substituted into the crystal lattice.
The result is that one electron is missing from one of the four covalent bonds normal for the silicon lattice. Thus the
dopant atom can accept an electron from a neighboring atom's covalent bond to complete the fourth bond. This is
why such dopants are called acceptors.
The dopant atom accepts an electron, causing the loss of half of one bond from the neighboring atom and
resulting in the formation of a "hole". Each hole is associated with a nearby negatively charged dopant ion, and the
semiconductor remains electrically neutral as a whole. However, once each hole has wandered away into the
lattice, one proton in the atom at the hole's location will be "exposed" and no longer cancelled by an electron.
This atom will have 3 electrons and 1 hole surrounding a particular nucleus with 4 protons. For this reason
a hole behaves as a positive charge. When a sufficiently large number of acceptor atoms are added, the holes
greatly outnumber thermal excited electrons. Thus, holes are the majority carriers, while electrons become minority
carriers in p-type materials.
34
EC8353-ELECTRONIC DEVICES AND CIRCUITS
1. What is transistor (BJT)? What are the types of circuit connections known as configurations, for operating a
transistor?
Transistor (BJT) is a three-terminal device: Base (B), Emitter (E) & Collector (C).
Transistor can be operated in three configurations Common Base (CB), Common Emitter (CE) & Common
Collector (CC).
According to configuration it can be used for voltage as well as current amplification.
5. Brief the construction of BJT. Draw the symbol and structure and of BJT.
BJT is a three- layer semiconductor device consisting of two PN junctions.
If a layer of P-type material is sandwiched between two layers of N-type the transistor is known as NPN
transistor.
Fig. Symbol of BJT (NPN type) Fig. Structure of BJT (NPN type)
On the other hand, if a layer of N-type material is sandwiched between two layers of P-type, the transistor is known
as PNP transistor.
Fig. Symbol of BJT (PNP type) Fig. Structure of BJT (PNP type)
7. Why the width of the base region of a transistor is kept very Small as compared to other regions?
Base region of a transistor is kept very small and lightly doped so as to pass most of the injected charge
carriers to the collector.
1
8. How transistor is used as an amplifier? (OR) Explain the word transistor.
The amplification in the transistor is achieved by passing input current signal from a region of low resistance to a
region of high resistance.
{This concept of transfer of resistance has given the TRANSfer-resISTOR (TRANSISTOR)}
As the knee voltage of silicon is higher (0.7V) than the knee voltage of germanium (0.3V), silicon will be more
stable for temperature variation than germanium.
12. Compare the performance of a transistor in three different configurations. (Nov/Dec 2012) (OR) Compare
the input resistance, output resistance and voltage gain of CB, CC and CE configuration. (OR) Compare the
performance of CE and CC configuration. (May 2017)
Property CB CE CC
Input resistance Low (about 100) Moderate (about 750 ) High (about 750 k)
Output resistance High (about 450 ) Moderate (about 45 ) Low (about 25)
Current gain 1 High High
Voltage gain About 150 About 500 Less than 1
Phase shift 0 or 360o 180o 0 or 360o
Between input & output For high frequency For audio frequency For impedance matching
voltages Applications circuits circuits
As the collector voltage VCC is made to increase the reverse bias, the space charge width between collector and
base tends to increase, with the result that the effective width of the base decreases. This known as early effect or
base width modulation.
Fig. Structure and for n-channel JFET Fig. Structure and for p-channel JFET
2
17. What are the features of JFET?
a) The operation of JFET depends upon the flow of majority carriers only.
b) The input impedance of JFET is very high, in the order of MΩ.
c) The JFET is less noisy than BJT.
d) It exhibits no offset voltage at zero drain current.
e) It is simple to fabricate.
F) It occupies less space in an integrated circuit.
18. Draw the transfer and drain characteristics curves of JFET? (May / June 2016)
Drain Characteristics:
Transfer Characteristics:
3
21. Define drain resistance.
The drain resistance or output (rd) is defined as the ratio between change in drain-source voltage (VDS)
and change in drain current (ID) at constant gate-source voltage (VGS).
𝜕𝑉𝐷𝑆
rd = 𝑉𝐺𝑆
𝜕𝑖𝐷
24. FET has lower thermal noise than BJT - Justify. (April / May 2019-R17)
The FET has high gate-to-main current resistance, on the order of 100MΩ or more providing a
high degree of isolation between control and flow. Because base current noise will increase with shaping
time, a FET typically produces less noise than a Bipolar Junction Transistor (BJT).
Thus, found in noise-sensitive electronics such as tuners and low noise amplifiers for VHF and satellite
receivers. It is relatively immune to radiation.
25. What is the difference between BJT and JFET? (Nov/Dec 2017) (Apr/May 2018) (Nov/Dec 2018-R17)
S.
Bipolar junction transistor (BJT) Junction field effect transistor (JFET)
No.
Bipolar device (current conduction is by Unipolar device (current is by only one type of
1
both electrons and holes) carrier-either electrons or holes)
2 Low input impedance due to forward bias High input impedance due to reverse bias
3 Current control device Voltage control device
4 Gain is characterized by voltage gain Gain is characterized by Tran conductance.
5 High noise level Low noise level
MOSFET
26. What are the different types of MOSFET? (May/June-2012, 2013)
The modes of operation of the MOSFET are divided into two types.
a) Depletion mode MOSFET
b) Enhancement mode MOSFET
29. What is the major difference in construction of the D-MOSFET and the E-MOSFET?
The depletion MOSFET has a structural channel, whereas the enhancement-MOSFET does not.
30. If the gate-to-source voltage in depletion MOSFET is zero, what is the current from drain to source?
When gate –source voltage is zero for depletion MOSFET, the drain-source current is equal to IDSS. (ID_IDSS)
34. What is the difference between JFET and MOSFET? (May / Jun 2016)
UJT
35. Draw the structure of UJT. (Nov/Dec 2017)
B2 B2
Eta-point +
B2
RB2
Eta-point
RB2
p-type
E
E A A VBB
E +
RB1
n-type RB1
Ve Ie VBB
- -
B1 B1 B1
5
(a) (b) (c)
36. What is UJT?
Uni junction transistor is a three terminal semiconductor device consisting of only one PN junction. It differs from
ordinary PN diode in the sense that it has three terminals namely Emitter, Base 1 and Base 2.
39. What is intrinsic stand OFF ratio of UJT and its equivalent circuit? (May 2017)
The intrinsic stand OFF radio (r|) is defined as the ratio between the internal dynamic resistance (RBl) and
the inter base resistance (RBB)-
𝑹
η = 𝑹𝑩𝟏
𝑩𝟐
Where,
RBB = RB1 + RB2
RB1 – internal dynamic resistance
RB2 – inter base resistance
THYRISTOR
41. Describe the basic structure of SCR?
SCR consist of four semiconductor layers forming a PNPN structure. It has three PN junctions namely J1 , J2
anode (A), cathode ( K ) and the gate (G).
44. Define holding current? What is the latching current in SCR? (April / May 2019-R17)
Holding current is the current below which the SCR switches from the conduction state (ON state) to
the forward blocking state.
Latching Current is the minimum current required to trigger the device from its OFF state to ON state.
6
45. What is the forward blocking region?
This region corresponding to the OFF condition of the SCR when anode is positives.
46. What is the turn OFF mechanism used for SCR?
To turn OFF a SCR, the following methods are applied.
(i) Reversing polarity of anode-to-cathode voltage called as Gate turn OFF
switch (GTO).
(ii)The second method is anode current interruption. Changing anode current
by means of momentarily series or parallel switching arrangement.
(iii)Third method is forced commutation. In this, the current through SCR
is reduced below the holding current
49. Show how an SCR can be triggered on by the application of a pulse to the gate terminal. (Nov / Dec
2015)
SCR is forward bias with a small voltage, it is in 'OFF' and no current flows through the SCR. The
applied forward voltage is increased, a certain critical voltage called forward break over voltage
( V B 0 ) . Th e fo r wa rd b r ea k o ve r vo lta g e i s red u c ed b y a p p l ica t io n o f g a t e p u ls es .
7
53. What are the applications of DIAC?
The DIAC is used as a triggering device; it is not a control device. It is used in.
• Temperature control
• Triggering of TRIAC
• Light diming circuits
• Motor speed control
54. What is TRIAC?
TRIAC is a three terminal semiconductor switching device which can conduct in either forward or
reverse direction. The TRIAC is the combination of two SCR's connected in parallel but in opposite
direction.
PART-B
BJT-Structure, Operation & Characteristics
1. Explain about the transistor (BJT) operation.
Structure:
Symbol:
Applying external voltage to a transistor is called biasing. In order to operate transistor properly as an
amplifier, it is necessary to correctly bias the two PN junctions with external voltages. Depending upon
external bias voltage polarities used, the transistor works in one of the three regions.
To bias the transistor in its active region the emitter base junction is forward biased, while the collector-
base junction in reverse-biased as shown in Fig. The Fig. shows the circuit connections for active region
for both NPN and PNP transistors.
As shown in fig. the forward bias applied to the emitter base junction of an NPN transistor causes
a lot of electrons from the emitter region to cross over to the base region. As the base is lightly doped
with P-type impurity, the number of holes in the base region is very small and hence the number of
electrons that combine with holes in the P – type base region is also very small. Hence a few electrons
combine with holes to constitute a base current IB. The remaining electrons (more than 95%) crossover
into the collector region to constitute a collector current IC. Thus the base and collector current summed
up give the emitter current i.e. IE=-(IC+IB).
In the external circuit of the NPN bipolar junction transistor, the magnitudes of the emitter current IE, the
base current IB and the collector current IC are related by IE=IC+IB.
As shown in fig. the forward bias applied to the emitter – base junction of a PNP transistor causes
a lot of hoses from the emitter regions to cross over to the base region as the base is lightly doped with N-
type impurity. The number of electrons in the base regions is very small and hence the number of holes
combined with electrons in the N – type base region is also very small. Hence a few holes combined with
electrons to constitute a base current IB.
9
Fig. Current in PNP transistor
The remaining holes (more than 95%) cross over into the collector region to constitute a collector
current IC. Thus, the collector and base current when summed up gives the emitter current.
In the external circuit of the PNP bipolar junction transistor, the magnitudes of the emitter current
IE, the base current IB and the collector current IC are related by
IE=IC+IB
The equation gives the fundamental relationship between the currents in a bipolar transistor
circuit. Also, this fundamental equation shows that there are current amplification factors and in
common base transistor configuration and common emitter transistor configuration respectively for the
static (d.c) currents, and for small changes in the currents.
Large – signal current gain (). The large signal current gain of a common base transistor is
defined as the ratio of the negative of the collector – current increment to the emitter – current change
from cut off (IE=0) to IE,i.e.
=−
(Ic − ICBO )
IE − 0
where ICBO (or ICO) is the reverse saturation current flowing through the reverse biased collector –
base junction. i.e. the collector to base leakage current with emitter open. As the magnitude of ICBO is
negligible when compared to IE, the above expression can be written as
IC
=
IE
Since IC and IE are flowing in opposite directions, is always positive. Typical value of ranges
from 0.90 to 0.995. Also, is not a constant but varies with emitter current IE, collector voltage VCB and
the temperature.
10
2. (a) Explain various characteristics of BJT in Common Base configuration with neat
diagram.
This configuration is also called the grounded base configuration. In this case the
input is connected between emitter and base while the output is taken across the collector and base. Thus
the base of the transistor is common to both input and output circuits and hence the name, common base
configuration. The common base circuit arrangement for NPN transistors is shown in Fig.
The current amplification factor is defined as the ratio of changes in Collector current (∆IC) to the change
in emitter current (∆IE) when the collector to base voltage (VCB) is maintained at a constant value.
α=(∆IC)/ (∆IE) (at constant VCB)
The value of α is always less than unity. The practical value of transistors lie between 0.95 and 0.99.
The circuit arrangement for determining the characteristics of a common base NPN transistors is shown in
Fig.In this circuit, the collector to base voltage (VCB) can be
varied by adjusting the potentiometer R2. The emitter to base voltage (VEB) can be varied by adjusting the
potentiometer Rl. The DC voltmeters and DC milliammeters are connected in the emitter and collector
circuits to measure the voltages and currents.
The curve plotted between the emitter current (IE) and the emitter to base voltage (VEB) at constant
collector to base voltage (VCB) are known as input characteristics of a transistor in common base
configuration.
11
Input Resistance (Ri):
It is the ratio of change in emitter to base voltage (∆VEB) to the corresponding change in emitter
current (∆IE) for a constant collector to base voltage (VCB).
The curve plotted between the collector current (IC) and the collector to base voltage
(VCB) at constant emitter current (IE) are known as output characteristics of a transistor is common base
configuration.
The output characteristics are as shown in Fig. and it can be divided into three
important regions namely (i) Saturation region (ii) Active region (iii) Cut-off region.
In this region, collector to base voltage (VCB) is negative for a NPN transistor. A small change in
collector to base voltage (VCB) results in a large valve of collector current.
In this region the collector current (IC) is almost equal to the emitter current (IE). The
transistor is always operated in this region. In the active region, the curves are almost flat. A very
large change in VCB produces only a very small change in IC. It means that the circuit has very high
output resistance about 500 K Ω.
It is the region along the X-axis as shown by shaded or dotted portion. This corresponds to the curve
marked IE=0. In the cut-off region both the junctions of a
Transistor are reverse biased. A small collector current flows even when the emitter
Current (IE) is equal to zero.
If the collector to base voltage (VCB) is increased beyond a certain large value, the
collector current (IC) increases rapidly due to avalanche breakdown and the transistor
action is lost. This region is called breakdown region.
12
(b) For a transistor connected in CE configuration, sketch the typical output and input
characteristics and explain the shape of characteristics.
This configuration is also called the grounded emitter configuration. In this case the
input is connected between base and emitter, while the output is taken across the collector and emitter.
Thus emitter of the transistor is common to both input and output circuits and hence the name, common
emitter configuration. The common emitter arrangement for NPN transistor is as shown in Fig.
The base current amplification factor is defined as the ratio of change in collector
current (∆IC) to the change in emitter current (∆IE) when the collector to emitter voltage(VCE) is
maintained at a constant value.
The circuit arrangement for determining the characteristics of a common emitter NPN transistor is shown
inFig.In this circuit, the collector to emitter voltage (VEC) can be varied by adjusting the potentiometer R2.
The base to emitter voltage (VBE) can be varied by adjusting the potentiometer R1. The DC voltmeters and
milliammeters are connected in the base and collector circuits to measure the voltages and currents.
1. Input Characteristics:
The curve plotted between the base current (IB) and the base to emitter voltage (VBE) at constant
collector to emitter voltage (VCE) at constant collector to emitter voltage (VCE )are known as input
characteristics of a transistor in common emitter configuration.
13
Input Resistance (Ri): It is the ratio of change in base to emitter voltage (VBE) to the
Corresponding change in base current (∆IB) for a constant collector to emitter voltage
(vCE).
When the collector to emitter voltage (VCE) is increased, the value of base current (IB) decreased slightly
as shown in Fig.
2. Output Characteristics:
The curves plotter between the collector current (IC) and the collector to emitter
Voltage (VCE) at constant base current (IB) is known as output characteristic of a
transistor in common emitter configuration.
The output characteristic may be divided into three important regions namely
saturation region, active region, and cut-off region.
If the collector to emitter voltage (VCE) is increased beyond a certain large collector current (IC) increases rapidly
due to avalanche breakdown and the action is lost. This region is called breakdown region.
14
(c) Explain various characteristics of BJT in Common Collector configuration with
neat diagram.
Common collector configuration (CC configuration):
This configuration is also called the grounded collector configuration' In this case the input is common
between base and Collector. While the output is taken across the emitter and collector. Thus the collector
of the transistor is common to both input and output circuits and hence the name common collector
configuration. The common collector circuit arrangement for NPN transistor as shown in Fig.
The current amplification is defined as the ratio of change in emitter current (∆IE) to
the change in base current (∆IB). It is generally denoted by γ.
1. Input Characteristics:
The curves plotted between the base current (IB) and the base to collector voltage (VBC) at
constant emitter to collector voltage (VEC) are known as input characteristics of a transistor in
common collector configuration.
15
2. Output Characteristics:
The curves plotted between the emitter current (IE) and the emitter to collector voltage (VEC) at
constant base current (IB) are known as output characteristics of a transistor is common collector
configuration.
3. Explain the emitter bias method used in transistor amplifier circuits. (Nov/Dec 2017)
Emitter Bias
This biasing network uses two supply voltages, VCC and VEE, which are
equal but opposite in polarity. Here VEE forward biases the base-emitter
junction through RE while VCC reverse biases the collector-base junction.
Moreover
In this kind of biasing, IC can be made independent of both β and VBE by choosing RE >> RB/β and VEE
>> VBE, respectively; which results in a stable operating point.
16
4. Explain the selection of Q point for transistor bias circuits and discuss the limitations on the output
voltage swing. (Nov / Dec 2015)
The dc load line for a transistor circuit is a straight line drawn on the transistor output characteristics.
For a common emitter CE circuit. The load line is a graph of collector current versus collector emitter voltage for a
given value of collector resistance and a given supply voltage. The load lines show all corresponding levels of Ic
and VCE that can exist in a particular circuit.
Consider the common emitter circuit in fig. Note that the polarities of the transistor terminal voltage are such that
the base emitter junction is forward biased and the collector base junction is reverse biased. These are the normal
bias polarities for the transistor junctions. The dc load line for the circuits in fig drawn on the device common
emitter characteristics in fig.
If the base emitter voltage is zero, the transistor is not conducting and IC = 0. Substituting the VCC and RC values
from fig into equal 5-1
Plot point A on the common emitter characteristics in fig. 5-2 at Ic = 0 and VCE = 20V. This is one point on the dc
load line.
Now assume a collector current of 2mA, and calculate the corresponding collector emitter voltage level.
Plot point B fig 5-2 at VCE = 0 and IC = 2mA. The straight line drawn though point A and point B is the dc load
line for RC = 10kohms and VCC = 20V. If either of these two quantities is changed, a new load line must be drawn.
17
As already stated the dc load line represents all corresponding IC and VCE levels that can exist in the
circuit as represented by Eq. 5-1 for example a point plotted at VCE = 16V and IC = 1.5mA on fig 5-2 does
not appear on the load line. This combination of voltage and current cannot exist in this particular circuit.
Knowing any one of IB, IC, or VCE, it is easy to determine the other two from a dc load line drawn on the
device characteristics. It is not always necessary to have the device characteristics in order to draw the dc
load line. A simple graph of IC versus VCE can be used as demonstrated in example 5-1.
The maximum possible transistor collector emitter voltage swing for a given circuit can be
determined without using the transistor characteristics. For convenience, it may be assumed that Ic can be
driven to zero at one extreme and to Vcc / Rc at the other extreme, [see fig]. This changes the collector
emitter voltage from VCE = Vcc to VCE = 0, as illustrated in fig. thus with the Q point at the center of the
load line, the maximum possible collector voltage swing is seen to be approximately ∓𝑉𝑐𝑐 /2.
5. (a) Explain construction and operation of Junction Field Effect Transistor (JFET)? (NOV/DEC
2012) (May/June-2012)
(b) Explain drain and transfer characteristics of JFET? (May 2017)
The channel ends are designated as source(S) and drain (D). The source S is the terminal through
which the majority carriers enters the bar and drain D is the terminal through which the majority carriers
leave the bar. The two p-regions, which are formed by alloying or by diffusion, are connected together
and their terminal is called gate. When no bias applied to JFET, depletion regions are formed at two pn
junctions as shown in fig. Recall that depletion region is a region depleted of charge carriers and therefore
behaves insulators
18
P-channel JFET
19
(b) Characteristics of JFET:-
The circuit diagram to obtain the characteristics of JFET is shown in fig.
20
Characteristics of JFET for different values of VGS
6. With neat diagram explain the construction & working of depletion MOSFET and enhancement
MOSFET with its necessary characteristics curve. (Nov/Dec 2018 R-13) (May/June 2016) (Apr/May 2018)
OR
Brief about the construction and operation of n-channel depletion type MOSFET with a neat
diagram. Enumerate the characteristics of depletion type MOSFET with a suitable graph.
(April/May 2019-R17)
Depletion MOSFET:
• The construction of an N-channel depletion MOSFET is shown in fig. If consists of a lightly
doped p-type substrate in which two highly doped n-regions are diffused. The two heavily doped n-
21
regions act as the source and drain. A lightly doped n-type channel is introduced between the two
heavily doped source and drain. A thin layer of (1µm thick) silicon dioxide is coated on the surface.
Holes are cut in the oxide layer to make contact with n-regions due to sio2 layer the gate is completely
insulated from the channel. This permits operation with gate source or gate channel voltages above and
below zero. In addition the insulated layer of sio2 accounts for very high input impedance of MOSFET.
In some MOSFETS the p-type substrate is internally connected to source, whereas in many discrete
devices an additional terminal is provided for substrate labeled SS.
SS substrate
Basic operation:
In fig a voltage VDS is applied between the drain and source terminals and the gate to source
voltage is set to zer. As a result, current is established from drain to source (conventional direction)
similar to JFET like in JFET, the satuarated drain current IDSS flow during pinch-off and it is labeled as
IDSS.
If a negative voltage is applied to gate with repeat to source. These holes recombine with electrons
and reduce the number of free electrons in the n-channel available for conduction. The more negative the
bias, lesser the number of free electrons in the channel. Since the negative voltage on the gate deplete
channel, the device is referred to as depletion MOSFET. The depletion mode of operation is similar to
JFET operation. When sufficient negative voltage is applied to gate the channel may be completely cut
off and the corresponding VGS is called (VGS (OFF)).
If a positive voltage is applied to gate with respect to source then the electrons are induced in the
channel. The induced electrons constitute additional current from source to drain. If we increase V GS
more in positive direction more number of electrons is induced and hence the drain current increases.
22
That is, the application of a positive gate –to –source voltage has enhanced the number of charge carriers
compared to that of when VGS=0v. For this reason the mode in which the MOSFET. Operates for positive
values of gate-to-source voltage is known as enhancement mode.
It is a plot of drain current versus drain source voltage for various value of gate-source voltage. The drain
characteristics of depletion MOSFET is shown ii fig. Note that for negative of VGS the characteristics of
depletion MOSFET is similar to those N-channel JFET. If the gate is made positive additional carrier are
introduced in the channel and the channel conductivity increases. Therefore the depletion MOSFET
consists of two regions of operation
.
The transfer characteristics of deletion MOSFET is shown in fig. The general shape of the transfer
characteristics is similar to those for the JFET. However the deletion MOSFET can be operated with
VGS>0. As a result IDSS is not maximum drain current as it is for JFET. The equation fior transfer
characteristics curve of depletion MOSFET is same as that of JFET.
The three circuit symbols for n-channel MOSFET and p-channel MOSFET are shown in fig.
23
N-channel enhancement MOSFET (May/June-2013), (May/June2016), (Nov/Dec2015) (May
2017) (Apr/May 2018)
• The construction of n-channel enhancement MOSFET is shown in fig. like depletion MOSFET it also
consists of a p-type substrate and two heavily doped n-regions that act as source and drain. The sio2 layer is present
to isolate the gate from the region between the drain and source. The source and drain terminals are connected
through metallic contacts to n-doped regions. But the enhancement MOSFET does not contain diffused channel
MOSFET does not contain diffused channel between the source and drain
When the drain is made positive with repeat to source and no potential is applied to gate due to absence of the
channel, a small drain current (ie., a reverse leakage current) flows. The we apply a positive voltage to that gate
with respect to source and substrate, negative charge carriers are induced in the substrate the negative charge
carriers which are minority carriers in the p-type substrate form an “inversion layer”. As the gate potential is
increased more and more negative charge carriers are induced. There negative carriers that are accumulated
between source and drain current flows from source to drain through the induced channel. The magnetized of the
drain current depends on the gate potential. Since the conduction of the channel is enhanced by the positive bias
voltage on the gate the device known as enhancement MOSFET.
Drain characteristics :
The drain characteristics of enhancement MOSFET is shown in fig.
The current IDSS for VGS=0 is very small of the order of nano amperes shown in fig. Note that
the drain current increases with positive increases with positive increase in gate source have voltage.
24
Transfer characteristics:
The n-channel enhancement MOSFET requires a positive gate to source voltage for its operation fig shows
the general transfer characteristics of an n-channel MOSFET. Since the drain current is zero for VGS=0, the IDSS
is zero for this device. As VGS is made positive the current ID increases slowly at first and then more rapidly with
an increase in VGS. The gate source voltage at which there is significant increase in drain current is called the
threshold voltage and is referred to as VT or VGS the equation for the transfer characteristics of enhancement
MOSFET differs as the curve states at VGS(th) rather than at VGS. The equation for transfer characteristics is
𝐼𝐷 =K(𝑉𝐺𝑆− 𝑉𝐺𝑆(𝑡ℎ)) 2
7. (a) Explain the construction operation and characteristics of UJT? (May/June2016), (Nov/Dec2015)
(Nov/Dec 2018)
(b) Describe the operation of UJT as a relaxation oscillator and derive its frequency of oscillation?
(Nov/Dec 2016)
Eta-point +
B2
RB2
Eta-point
RB2
p-type
E
E A A VBB
E +
RB1
n-type RB1
Ve Ie VBB
- -
B1 B1 B1
(a) (b) (c)
Fig.: (a) Basic structure of UJT (b) Symbolic representation (c) Equivalent circuit
UJT is an n-type silicon bar in which p-type emitter is embedded. It has three terminals base1, base2 and
emitter ‘E’. Between B1 and B2 UJT behaves like ordinary resistor and the internal resistances are given as RB1
and RB 2 with emitter open RB B = RB1 + RB 2 . Usually the p-region is heavily doped and n-region is lightly doped.
The equivalent circuit of UJT is as shown. When VBB is applied across B1 and B2 , we find that potential at A is
VBB RB1 RB1
VAB1 = = VBB =
RB1 + RB 2 RB1 + RB 2
is intrinsic standoff ratio of UJT and ranges between 0.51 and 0.82. Resistor RB 2 is between 5 to
10K.
25
OPERATION
When voltage VBB is applied between emitter ‘E’ with base 1 B1 as reference and the emitter voltage VE
is less than (VD + VBE ) the UJT does not conduct. (VD + VBB ) is designated as VP which is the value of
voltage required to turn on the UJT. Once VE is equal to VP VBE + VD , then UJT is forward biased and
it conducts.
The peak point is the point at which peak current I P flows and the peak voltage VP is across the UJT.
After peak point the current increases but voltage across device drops, this is due to the fact that emitter
starts to inject holes into the lower doped n-region. Since p-region is heavily doped compared to n-region.
Also holes have a longer life time, therefore number of carriers in the base region increases rapidly. Thus
potential at ‘A’ falls but current I E increases rapidly. RB1 Acts as a decreasing resistance.
The negative resistance region of UJT is between peak point and valley point. After valley point, the
device acts as a normal diode since the base region is saturated and RB1 does not decrease again.
Negative Resistance
Region
Ve
Cutoff Saturation
region region
VBB
R load line
Vp
Peak Point
Valley Point
Vv
0 Ip Iv Ie
(B) Operation of UJT as a relaxation oscillator and its derivation- frequency of oscillation. (Nov 2016)
UJT as a relaxation oscillator consists of UJT and a capacitor CE which is charged through RE as the
supply voltage VBB is switched ON. The voltage across the capacitor increases exponentially and when
the capacitor voltage reaches the peak point voltage Vp, the UJT starts conducting and the capacitor
voltage is discharged rapidly through EB1 and R1.After the peak point voltage of UJT is reached, it
provides negative resistance to the discharge path which is useful in working of the relaxation oscillator.
As the capacitor voltage reaches zero the device then cuts off and capacitor CE starts to charge again. This
cycle is repeated continuously generating a saw tooth waveform across CE.
The inclusion of external resistors R2 and R1 in series with B2 and B1 provides spike waveform. When the
UJT fires, the sudden surge of current through B1 causes drop across R1,which provides positive spikes.
At the time of firing fall of VEB1 causes I2 to increases rapidly which generates negative going spikes
across R2.
26
Frequency of oscillation:
Voltage across the capacitance prior to breakdown is given by
Vc=VBB(1- e−t/RE CE )
R E CE - Charging time constant
Discharge of capacitor occurs when VC is equal to the peak point voltage Vp,
Vp= 𝜂VBB=VBB(1- e−t/RECE )
Where 𝜂 =(1- e−t/RE CE )
e−t/RE CE =1- 𝜂
Taking Log on both side
t 1
= log e
R E CE (1 − 𝜂)
1
t = R E CE ln
(1 − 𝜂)
1
f = 1/t = 1
RE CE ln(1− )
𝜂
27
THYRISTOR (SCR)
8. DRAW AND EXPLAIN THE V-I CHARACTERISTICS OF THYRISTOR (SCR) (or) DISCUSS THE
DIFFERENT MODES OF OPERATION OF THYRISTOR WITH THE HELP OF ITS STATIC V-I
CHARACTERISTICS. (Nov/Dec 2017) (Apr/May 2018) (OR)
Outline the structure of SCR and explain its operation. Also, illustrate its V-I characteristics.
(Apr/May 2019-R17)
RL
VAA K
VGG
Circuit diagram
A typical V-I characteristics of a thyristor is shown above. In the reverse direction the thyristor appears similar to a
reverse biased diode which conducts very little current until avalanche breakdown occurs. In the forward direction
the thyristor has two stable states or modes of operation that are connected together by an unstable mode that
appears as a negative resistance on the V-I characteristics. The low current high voltage region is the forward
blocking state or the off state and the low voltage high current mode is the on state. For the forward blocking state
the quantity of interest is the forward blocking voltage VBO which is defined for zero gate current. If a positive
gate current is applied to a thyristor then the transition or break over to the on state will occur at smaller values of
anode to cathode voltage as shown. Although not indicated the gate current does not have to be a dc current but
instead can be a pulse of current having some minimum time duration. This ability to switch the thyristor by means
of a current pulse is the reason for wide spread applications of the device.
However once the thyristor is in the on state the gate cannot be used to turn the device off. The only way to turn off
the thyristor is for the external circuit to force the current through the device to be less than the holding current for
a minimum specified time period.
HOLDING CURRENT I H
After an SCR has been switched to the on state a certain minimum value of anode current is required to maintain
the thyristor in this low impedance state. If the anode current is reduced below the critical holding current value,
the thyristor cannot maintain the current through it and reverts to its off state usually I is associated with turn off
the device.
LATCHING CURRENT I L
After the SCR has switched on, there is a minimum current required to sustain conduction. This current is called
the latching current. I L associated with turn on and is usually greater than holding current.
28
Fig.: Effects on gate current on forward blocking voltage
9. Sketch the four layer construction of an SCR and the two transistor equivalent circuit explains the
device operation. (Non / Dec 2016)(May 2017)
A thyristor is the most important type of power semiconductor devices. They are extensively used in
power electronic circuits. They are operated as bi-stable switches from non-conducting to conducting
state.
A thyristor is a four layer, semiconductor of p-n-p-n structure with three p-n junctions. It has three
terminals, the anode, cathode and the gate.
The word thyristor is coined from thyratron and transistor. It was invented in the year 1957 at Bell Labs.
The Different types of Thyristors are
29
OPERATION
When the anode is made positive with respect the cathode junctions 𝐽1 & 𝐽3 are forward biased and
junction J 2 is reverse biased. With anode to cathode voltage VAK being small, only leakage current flows
through the device. The SCR is then said to be in the forward blocking state. If VAK is further increased to
a large value, the reverse biased junction J 2 will breakdown due to avalanche effect resulting in a large
current through the device. The voltage at which this phenomenon occurs is called the forward
breakdown voltage VBO . Since the other junctions 𝐽1 & 𝐽3 are already forward biased, there will be free
movement of carriers across all three junctions resulting in a large forward anode current. Once the SCR
is switched on, the voltage drop across it is very small, typically 1 to 1.5V. The anode current is limited
only by the external impedance present in the circuit.
Although an SCR can be turned on by increasing the forward voltage beyond VBO , in practice, the
forward voltage is maintained well below VBO and the SCR is turned on by applying a positive voltage
between gate and cathode. With the application of positive gate voltage, the leakage current through the
junction J 2 is increased. This is because the resulting gate current consists mainly of electron flow from
cathode to gate. Since the bottom end layer is heavily doped as compared to the p-layer, due to the
applied voltage, some of these electrons reach junction J 2 and add to the minority carrier concentration
in the p-layer. This raises the reverse leakage current and results in breakdown of junction J 2 even
though the applied forward voltage is less than the breakdown voltage VBO . With increase in gate current
breakdown occurs earlier.
30
DIAC
• The DIAC can be turned ON only when the applied voltage across it is main terminal reaches the
break - over voltage.
• The M.T.2 is positive with respect to M.T.1, the DIAC passes current through the DIAC
P 1 N 1 P 2 N 2 from M.T.2 to
• M.T.1 as shown in Fig. 5.12 (a). The DIAC turn 'ON' the applied voltage makes M.T.2 negative
with respect to the M.T.1, the DIAC current through the diode
• When the current drops below the holding value. It is used as a triggering device.
Characteristics of a DIAC
The DIAC is operated with M.T.2 positive with respect to M.T.1, the V I characteristics obtained is
as shown in Fig. 5.13 by the curve marked OAB. Similarly the DIAC is operated with its M.T.2
negative with respect to M.T.I, the V-l characteristics obtained as shown in Fig. 5.13 by the curve
marked OCD.
Applications
The DIAC is used as a triggering device; it is not a control device. It is used in,
• Temperature control
• Triggering of TRIAC
• Light diming circuits
• Motor speed control
31
TRIAC
11. EXPLAIN THE CONSTRUCTION, OPERATION & STATIC CHARACTERISTICS OF TRIAC
A triac is a three terminal bi-directional switching thyristor device. It can conduct in both directions when it is
triggered into the conduction state. The triac is equivalent to two SCRs connected in anti-parallel with a common
gate. Figure below shows the triac structure. It consists of three terminals viz., MT2 , MT1 and gate G.
MT1
G N2
MT2
P2
N3
P2
N1
N1
P1 G MT1
P1
N4
MT2
The gate terminal G is near the MT1 terminal. Figure above shows the triac symbol. MT1 is the reference
terminal to obtain the characteristics of the triac. A triac can be operated in four different modes depending upon
the polarity of the voltage on the terminal MT2 with respect to MT1 and based on the gate current polarity.
The characteristics of a triac are similar to that of an SCR, both in blocking and conducting states. A SCR can
conduct in only one direction whereas triac can conduct in both directions.
When MT2 and gate current are positive with respect to MT1, the gate current flows through P2-N2 junction as
shown in figure below. The junction P1-N1 and P2-N2 are forward biased but junction N1-P2 is reverse biased.
When sufficient number of charge carriers is injected in P2 layer by the gate current the junction N1-P2 breakdown
and triac starts conducting through P1N1P2N2 layers. Once triac starts conducting the current increases and it’s V-I
characteristics is similar to that of thyristor. Triac in this mode operates in the first-quadrant.
MT2 (+)
P1
N1
P2
Ig
N2
MT1 (−)
G
V
(+)
Ig
32
MODE 2: MT2 positive, Negative gate current ( I − mode of operation)
MT2 (+)
P1
Initial Final
N1
conduction conduction
P2
N3 N2
MT1 (−)
G
V
Ig
When MT2 is positive and gate G is negative with respect to MT1 the gate current flows through P2-N3 junction as
shown in figure above. The junction P1-N1 and P2-N3 are forward biased but junction N1-P2 is reverse biased.
Hence, the triac initially starts conducting through P1N1P2N3 layers. As a result the potential of layer between P2-
N3 rises towards the potential of MT2. Thus, a potential gradient exists across the layer P2 with left hand region at
a higher potential than the right hand region. This results in a current flow in P 2 layer from left to right, forward
biasing the P2N2 junction. Now the right hand portion P1-N1 - P2-N2 starts conducting. The device operates in
first quadrant. When compared to Mode 1, triac with MT2 positive and negative gate current is less sensitive and
therefore requires higher gate current for triggering.
MT 2 (−)
N4
P1
N1
P2
N2
G MT1 (+)
(+)
Ig
The device operates in third quadrant in this mode. Triac in this mode is less sensitive and requires higher gate
current for triggering.
33
MODE 4: MT2 negative, Negative gate current ( III − mode of operation)
MT 2 (−)
N4
P1
N1
P2
N3
G MT1 (+)
(+)
Ig
In this mode both MT2 and gate G are negative with respect to MT1, the gate current flows through P2N3 junction
as shown in figure above. Layer N3 injects electrons as shown by arrows into P2 layer. These results in increase in
current flow across P1N1 and the device will turn ON due to increased current in layer N1. The current flows
through layers P2N1P1N4. Triac is more sensitive in this mode compared to turn ON with positive gate current.
(Mode 3).
Triac sensitivity is greatest in the first quadrant when turned ON with positive gate current and also in third
quadrant when turned ON with negative gate current. When MT2 is positive with respect to MT1 it is
recommended to turn on the triac by a positive gate current. When MT2 is negative with respect to MT1 it is
recommended to turn on the triac by negative gate current. Therefore Mode 1 and Mode 4 are the preferred modes
of operation of a triac ( I + mode and III − mode of operation are normally used).
TRIAC CHARACTERISTICS
Figure below shows the circuit to obtain the characteristics of a triac. To obtain the characteristics in the third
quadrant the supply to gate and between MT2 and MT1 are reversed.
RL I
- +
A
MT2
Rg + +
+ -G
A MT1 V Vs
-
+ -
Vgg
-
Figure below shows the V-I Characteristics of a triac. Triac is a bidirectional switching
device. Hence its characteristics are identical in the first and third quadrant. When gate
current is increased the break over voltage decreases.
34
VB01, VB01
MT2(+) - Breakover voltages
G(+) Ig2 > Ig21
Ig2
I Ig1
VB02
V
→V VB01
MT2(−)
G(−)
Triac is widely used to control the speed of single-phase induction motors. It is also used in domestic lamp
dimmers and heat control circuits, and full wave AC voltage controllers.
IGBT is a voltage-controlled device. It has high input impedance like a MOSFET and low on-state conduction
losses like a BJT.
Figure below shows the basic silicon cross-section of an IGBT. Its construction is same as power MOSFET
except that n+ layer at the drain in a power MOSFET is replaced by P+ substrate called collector.
Collector
+ C
p
+
n Bufferlayer
−
n epi G
p
+ +
n n E
Gate Gate
Emitter
Structure Symbol
Fig.: Insulated Gate Bipolar Transistor
IGBT has three terminals gate (G), collector (C) and emitter (E). With collector and gate voltage positive with
respect to emitter the device is in forward blocking mode. When gate to emitter voltage becomes greater than the
threshold voltage of IGBT, a n-channel is formed in the P-region. Now device is in forward conducting state. In
this state p+ substrate injects holes into the epitaxial n − layer. Increase in collector to emitter voltage will result in
increase of injected hole concentration and finally a forward current is established.
35
CHARACTERISTIC OF IGBT
Figure below shows circuit diagram to obtain the characteristic of an IGBT. An output characteristic is a plot
of collector current IC versus collector to emitter voltage VCE for given values of gate to emitter voltage VGE .
IC
RC
RS G VCC
VCE
VG RGE VGE
E
VCE
A plot of collector current IC versus gate-emitter voltage VGE for a given value of VCE gives the transfer
characteristic. Figure below shows the transfer characteristic.
Note
Controlling parameter is the gate-emitter voltage VGE in IGBT. If VGE is less than the threshold voltage VT then
IGBT is in OFF state. If VGE is greater than the threshold voltage VT then the IGBT is in ON state.
IGBTs are used in medium power applications such as ac and dc motor drives, power supplies and solid state
relays.
IC
VGE
VT
36
Solved Problems:
1. Design a voltage divider bias circuit for transistor to establish the quiescent point VCE=12v, Ic =
1.5mA, Stability factor S < 3, 𝜷 = 𝟓𝟎, 𝑽𝑩𝑬 = 𝟎. 𝟕𝑽, 𝑽𝑪𝑪 = 𝟐𝟐. 𝟓 𝑽 𝒂𝒏𝒅 𝑹𝒄 = 𝟓. 𝟔 𝑲Ω.
(May 2017) (Nov/Dec 2017)
𝛽 = 50, 𝑉𝐵𝐸 = 0.7 𝑉, 𝑉𝐶𝐶 = 22.5 𝑉, 𝑅𝐶 = 5.6 𝑘𝛺, 𝑉𝐶𝐸 = 12 𝑉, 𝐼𝐶 = 1.5 𝑚𝐴, 𝑆≤3
𝐸𝑚𝑖𝑡𝑡𝑒𝑟 𝑅𝑒𝑠𝑖𝑠𝑡𝑎𝑛𝑐𝑒 (𝑅𝐸 )
𝑅𝑒𝑠𝑖𝑠𝑡𝑎𝑛𝑐𝑒𝑠 𝑅1 𝑎𝑛𝑑 𝑅2
Stability factor (s)
𝛽+1 50 + 1 51
3= = =
𝑅 1.4 × 103 70 × 103
1 + 𝛽 (𝑅 +𝐸 𝑅 ) 1 + 50 × 1 +
𝑡ℎ 𝐸 𝑅𝑡ℎ + 1.4 × 103 𝑅𝑡ℎ + 1.4 × 103
(𝑅𝑡ℎ + 1.4 × 103 ) + 70 × 103
3[ ] = 51
𝑅𝑡ℎ + 1.4 × 103
Solution:
The relative dielectric constant of silicon is given in table 5-1 as 12, and hence 𝜖 = 12𝜖0 . Using the value
of 𝑒 𝑎𝑛𝑑 𝜖0 from appendixes A and B, we have from Eq expressed in mks units,
Hence the channel width has been reduced to about one third its value for VGS = 0
3. Determine the base current for the CB transistor circuit if IC =80 mA and 𝜷 = 170. (Nov/Dev
2016)
Given
IC =80 mA
𝛽 = 170.
𝐼 80 ×10−3 𝐼𝑐 80 ×10−3
𝛽 = 𝑐= =170 ∴ 𝐼𝐵 = = =0.4706 mA
𝐼𝐵 𝐼𝐵 𝛽 170
5. A transistor has a typical 𝜷 = 100. If the collector current is 40 mA. What is the value of emitter
current? (May 2017)
𝐼
Given: IC =40 mA 𝛽 = 100 𝛽 = 𝐼𝑐
𝐵
𝐼 40 ×10−3
∴ 𝐼𝐵 = 𝛽𝑐 = =0.0004 A
100
38
6. If the collector current is 2mA and the base current is 25µA, what is the emitter current?
Solution: IC = 2mA, IB=25µA,
IE = IB+IC =2mA+25µA ⸫IE =2.025mA
7. Calculate IC and IE for a transistor that has 𝜶 = 𝟎. 𝟗𝟗 𝒂𝒏𝒅 𝑰𝑩 = 𝟏𝟓𝟎𝝁𝑨. Determine the value of 𝜷𝒅𝒄 for the
transistor? (Nov / Dec 2015)
𝛼 0.99
Solution: 𝛽= = = 99
1−𝛼 1−099
𝐼𝐶
𝛽 = ; 𝐼𝐶 = 𝛽 × 𝐼𝐵 = 99 × 150 𝜇𝐴 = 14 𝑚𝐴
𝐼𝐵
𝐼𝐶 𝐼𝑐 14
𝛼= ; 𝐼𝐸 = = = 14.14𝑚𝐴
𝐼𝐸 𝛼 0.99
8. A germanium transistor is to be operated at zero signal IC = 1mA. If the collector supply voltage
VCC = 12V, what is the value of RB in the base resistor method? Assume β = 100. If another
transistor of same batch with β = 50 is used, what will be new value of zero signal I C for same
RB? Comment on the results. (Nov/Dec 2018-R17)(13 Marks)
Solution:
Comment: It is clear from the above example that with the change in transistor parameter β,
the zero-signal collector current has changed from 1mA to 0.5 mA. Therefore, the base resistor
method cannot provide stabilization.
9. The intrinsic stand-off ratio for a UJT is 0.6. If the inter base resistance is 10KΩ, what are the
value of RB1 and RB2? (Nov/Dec 2018-R17) (4 Marks)
39
10. When VGS of a JFET changes from -3.1 V to -3 V, the drain current changed from 1 mA to 1.3
mA. Find the value of transconductance. (Nov/Dec 2018-R17) (2 Marks)
Solution:
∆𝐼𝐷 (1.3−1)×10−3
𝑔𝑚 = = (3.1−3)
= 3 𝑚𝐴/𝑉
∆𝑉𝐺𝑆
11. Find the Q point of the transistor shown below. Also draw the DC load line. Give β = 100 and
VBE = 0.7V. (Nov/Dec 2018-R17) (15 Marks)
40
12. In a self-bias n-channel JFET, the operating point is to be set at ID = 1.5mA and VDS =10V. The
parameters are IDSS = 5mA and VGS (off) = -2V. Find the values of RS and RD if VDD = 20V.
(Nov/Dec 2018-R17) (9 Marks)
41
EC8353-ELECTRONIC DEVICES AND CIRCUITS
UNIT-III AMPLIFIERS
PART-A
BJT Small Signal Model
1. Which is the BJT configuration is suitable for impedance matching application and why?
CC configuration is suitable for impedance matching application because of very high input impedance and low
output impedance.
.
3. What are the tools used for small signal analysis of BJT?
• h – Parameter circuit model.
• z – Parameter circuit model.
• y – Parameter circuit model.
• Trans-conductance parameter circuit model.
• Physical model
• T-model
4. What are the steps used for small signal analysis of BJT?
• Draw the actual circuit diagram
• Replace coupling capacitors and emitter bypass capacitor by short circuit.
• Replace dc source by a short circuit. In other words, short VCC and ground lines.
5. State the phase relationship between input / output currents and phase relationship between the input /
output voltages of various transistors configurations. (Nov/Dec 2018)
For all the transistor configurations, input and output currents are in phase.
The input and output voltages of both CB and CC configuration are in phase. But in common-emitter amplifier
the input and output voltages are 1800 out of phase.
1
6. Draw the low frequency hybrid model of BJT in common emitter configuration.
Vb = hieIb + hreVc
Ic = hfeIb + hoeVc
8. Why emitter is always forward biased and collector is always reverse biased with respect to base?
To supply majority charge carrier to base and to remove the charge carriers away from the collector-base
junction.
10. Give the voltage gain for CE configuration including source resistance.
Avs = Ai x RL / RS + Ri
= (- hfe / 1+ hoe RL) x RL / (RS + Ri)
11. Define the hie and hfe for a common emitter transistor configuration.
From the h – parameter equivalent circuit of the common emitter configuration.
Hie = Δ VBE / Δ IB | VCE constant
Hfe = Δ IC / Δ IB | VCE constant
12. Give the current gain expression for a common emitter transistor configuration.
Current gain for common emitter configuration:
Ai = - IC/ Ib = - hfe / 1 + hoe RL
2
MOSFET small signal model
13. What is trans-conductance? Give its expression for MOSFET. (Nov/Dec 2017)
The trans-conductance is a ratio of output current to input voltage and hence it represents the gain of the
MOSFET.
Tran conductance expression for MOSFET
gm = 2 √ (KIDQ)
IDQ = K (VGSQ – VT)2
14. State the values of Cgd and Cgs in various operating regions of MOSFET.
Values of gate capacitances in Triode Region:
Cgs =Cgd = (WL Cox) ½
Values of gate capacitances in Saturation Region:
Cgs = (WL Cox) 2/3
Cgd=0
Values of gate capacitances in Cut - off Region:
Cgs =Cgd=0
Cgd = WL Cox
Cox – Gate Capacitance.
3
19. Draw general frequency response curve (or) half-power frequencies of an amplifier.
• In the above diagram the frequency f2 lies in high frequency region, while the frequency f1 lies in low frequency region.
• These two frequencies are also referred to as half power half – power frequencies since gain or output voltage drops
to 70.7% of maximum value and this represents a power level of one half the power at the reference frequency in mid
– frequency region.
Additional Questions
20. What is the relation between α and β of the transistor?
𝛽
α=𝛽+1
21. Why must the base be narrow for the transistor action?
β is the ratio of IC to IB. IB becomes less if the base width is narrow. Higher value of β can be obtained with lower value
of base current.
22. What are emitter efficiency and base transport factor of a transistor?
The ratio of current of injected carriers at emitter junction to the total emitter current is called the emitter injection efficiency.
Transport Factor, β= IC / IB
4
27. Draw the hybrid model for a transistor. (Nov/Dec 2012)
5
32. State the advantages of using h-parameters for analyzing transistor amplifiers.
i.) Real numbers at audio frequencies
ii.) Easy to measure
iii.) Can be obtained from the transistor static characteristics curves,
iv.) Convenient to use in circuit analysis and design,
v.) Most of the transistor manufacturers specify the h – parameters.
34. State the effect of coupling and bypass capacitors on the frequency response of amplifier.
Reactance of a capacitor is given by Xc = 1 / 2πfc. At medium and high frequencies, the factor f makes Xc
very small, so that all coupling capacitors behave as short circuits. At low frequencies, Xc increases. This increase
in Xc drops the signal voltage across the capacitor and reduces the circuit gain. As signal frequencies decrease,
the capacitor reactance’s increase and circuit gain continues to fall, reducing the output voltage.
35. State the effect of internal transistor capacitance on the frequency response of amplifier.
At high frequencies, the reactance of the junction capacitance are low. As frequency increases, the reactance of
junction capacitances fall. When these reactance become small enough, they provide shunting effect as they are
in parallel with junctions. This reduces the circuit gain and hence the output voltage.
6
39. Draw the small signal equivalent circuit of PMOS transistor.
41. What do you mean by drain diffusion and source diffusion capacitance?
Drain and Source capacitances are due to the reverse – biased pn junctions formed by the n+ source region and
the p – type substrate, and the n+ drain region and the p- type substrate. These are denoted as source diffusion
capacitance and drain diffusion capacitance respectively.
42. Give the expression of unity gain frequency (fT)for MOSFET amplifier?
Unity gain frequency for MOSFET:
fT =gm / 2π (Cgs + Cgd)
From the above expression we can say that fT is proportional to gm and inversely proportional to the
internal capacitances.
• Voltage gain ≈ 1
COMMON DRAIN Good voltage buffer • High input resistance
AMPLIFIER
• Low input resistance
• Current Gain ≈ 1
COMMON GATE Good current buffer • Low input resistance
AMPLIFIERS
• High output resistance
44. What is the need of coupling capacitors in amplifier design? (Aril/May 2019) (Nov / Dec 2015)
Coupling capacitors isolates the DC condition of one stage from the following stages.
It is used to couple output of one stage to another stage.
45. Differentiate between power transistor and signal transistor. (May / Jun 2016)
S.No Power transistor Small signal transistor
1 n-1 drift layer is present 110 n-1 drift layer
2 Secondary breakdown occurs No secondary breakdown
3 Used in power circuits Used in amplifying circuits
7
PART-B
1. Draw the small signal model of BJT device (OR) Draw the parameters equivalent circuit or small
signal model of a transistor in CE, CB, CC configuration? (Apr/May 2018). (OR)
Draw the hybrid model of BJT in CE, CC and CB configuration.
Ib − Input current; Ic − Output current; Vbe − Input voltage; Vce − Output voltage
CE Configuration
∆V
hre = ∆VBE ⃒ IB − constant---- (4)
CE
∆I
hfe = ∆I c ⃒ VCE − constant---- (5)
B
∆I
hoe = ∆Vc ⃒ IB − constant ---- (6)
C
9
2. (A) Derive the expressions for current gain (AI ), voltage gain(AV ), input resistance (Ri ) and
output resistance (RO ) for CE amplifier using h – parameter model. (April/May 2015 & 18) (Nov / Dec’
2014& 16)
Illustrate the steps involved in analyzing a BJT amplifier circuit using small signal model.
(April/May 2019) (5 Marks)
Circuit diagram
h – Parameter model
IL
Current gain [AI ] AI =
Ib
10
Vb hie Ib +(AI Ib RL )
Now R i = = = hie + hre AI R L
Ib Ib
−hfe
Substituting, AI = to the above equation
1+hoe RL
−hfe
R i = hie + hre ( ) × RL
1 + hoe R L
hre hfe R L
R i = hie −
1 + hoe R L
V A I I b RL I 1
Voltage gain (𝐀 𝐕 ) AV = Vc = ⸫ Vb = R
b Vb b i
AI R L
AV =
Ri
I
Output admittance (𝐘𝐨 )Yo = Vc with Vs = 0
c
Ic = hfe Ib + hoe Vc (divide this equation by VC)
Ic hfe Ib + hoe Vc
=
Vc Vc
hfe Ib
Yo = + hoe
Vc
From h parameter circuit with 𝐕𝐬 = 𝟎
R s Ib + hie Ib + hre Vc = 0 (Apply KVL)
Ic −hre
Yo = = hfe ( ) + hoe
Vc R s + hie
hfe hre 1
𝑌o = hoe − and Ro =
Rs +hie 𝑌o
11
(B) Draw the circuit of CE amplifier with DC sources eliminated and deduce the small signal model for
amplifier operation. (April/May 2019) (8 Marks) (OR) Approximate analysis of CE amplifier using
simplified Hybrid Model.
IL
Current gain [AI ] AI =
Ib
−IC
AI = = −hfe
Ib
Vb
𝐈𝐧𝐩𝐮𝐭 𝐑𝐞𝐬𝐢𝐬𝐭𝐚𝐧𝐜𝐞 (R i )R i =
Ib
R i = hie
V A I I b RL I 1
Voltage gain (𝐀 𝐕 ) AV = Vc = ⸫ Vb = R
b Vb b i
AI R L
AV =
Ri
Output admittance (𝐘𝐨 )Yo = 0
R o =1/Y= ∞
12
3. (A) Derive the expressions for current gain, voltage gain, input impedance and output impedance
for an Emitter Follower (common collector) circuit.
Circuit diagram
I −Ie
Current gain (AI ) AI = IL =
b Ib
Apply KCL
Ie = hfc Ib + hoc Ve = hfc Ib + hoc (−Ie R L ) (𝑠𝑖𝑛𝑐𝑒, Ve = −Ie R L )
Ie hfc
Ie + Ie R L hoc = hfc Ib ; Ie (1 + hoc R L ) = hfc Ib ; =
Ib 1 + hoc R L
Ie −IL −hfc
Ai = = =
Ib Ib 1 + hoc R L
Vb
𝐈𝐧𝐩𝐮𝐭 𝐑𝐞𝐬𝐢𝐬𝐭𝐚𝐧𝐜𝐞 (𝐑 𝐢 )R i =
Ib
Apply KVL
Vb = hic Ib + hrc Ve ( Ve = −Ie R L )
−Ie
Ve = AI Ib R L {AI = }
Ib
Now
hic Ib +hre (AI Ib RL )
Ri = ; R i = hic + hre AI R L
Ib
h RL −hfc
R i = hic − hrc (1+hfc ) {AI = 1+h }
oc RL oc RL
13
V
Voltage gain (AV ) AV = Ve {∵ Ve = −Ie R L ; Ie = AI Ib; Vb = Ib R 𝑖 }
b
A I I b RL A I I b RL Ib 1
AV = ⥤ {∵ =R}
Vb Ib R 𝑖 Vb i
AI R L
AV =
R𝑖
I
Output admittance (𝐘𝟎 ) Y0 = V2 with Vs = 0
2
Ie
𝑌𝑂 = with Vs = 0
Ve
Ie = hfc Ib + hoc Ve
Ie hfc Ib
Dividing the above equation by Ve , = + hoc − − − (1)
Ve Ve
From circuit Vs = 0
Apply KVL
R S Ib + hic Ib + hrc Ve = 0
(R S + hic )Ib = −hrc Ve
Ib −hrc
= − − − (2)
Ve R s + hic
Sub equation (2) in (1)
Ie −hrc
= hfc ( ) + hoc
Ve R s + hic
Ie hfc hrc 1
yo = = hoc − 𝑎𝑛𝑑 R o =
Ve R s + hic yo
(B) Draw the circuit of CC amplifier with DC sources eliminated and deduce the small signal model
for amplifier operation. (April/May 2019) (8 Marks) (OR) Approximate analysis of CC amplifier
using simplified Hybrid Model.
In simplified CE model, the input is applied to base and output is taken from collector, and emitter is
common between input and output. The same simplified model can be modified to get simplified CC
model.
For simplified CC model, make collector common and take output from emitter.
14
The hfb Ib current direction is now exactly opposite that of CE model because the current hfc Ib always points
towards emitter.
I −Ie
Current gain (AI ) AI = IL =
b Ib
Ai = 1 + hfe
Vb
𝐈𝐧𝐩𝐮𝐭 𝐑𝐞𝐬𝐢𝐬𝐭𝐚𝐧𝐜𝐞 (𝐑 𝐢 )R i =
Ib
Apply KVL
Vb = hie Ib + IO R L ; (divide both sides by Ib )
−Ie −I𝑂
{AI = = }
Ib Ib
Now
Vb
Ri = = hie + (1 + IO hfe )R L;
Ib
V
Voltage gain (AV ) AV = Ve
b
A I I b RL A I I b RL Ib 1
AV = ⥤ {∵ =R}
Vb Ib R 𝑖 Vb i
AI R L
AV =
R𝑖
A I I b RL A I I b RL
Substituting values of A𝐼 and R i 𝑤𝑒 𝑔𝑒𝑡, AV = ⥤
Vb I b R𝑖
I
Output admittance (𝐘𝟎 ) Y0 = V2 with Vs = 0
2
Ie
𝑌𝑂 = with Vs = 0
Ve
Ie = hfc Ib + hoc Ve
Ie hfc Ib
Dividing the above equation by Ve , = + hoc − − − (1)
Ve Ve
From circuit Vs = 0
Apply KVL
R S Ib + hic Ib + hrc Ve = 0
(R S + hic )Ib = −hrc Ve
Ib −hrc
= − − − (2)
Ve R s + hic
Sub equation (2) in (1)
Ie −hrc
= hfc ( ) + hoc
Ve R s + hic
Ie hfc hrc 1
yo = = hoc − 𝑎𝑛𝑑 R o =
Ve R s + hic yo
15
4. Derive the expression for 𝐀 𝐢 , 𝐀 𝐯 , 𝐑 𝐜 𝐚𝐧𝐝 𝐑 𝐨 𝐟𝐨𝐫 𝐂𝐁 amplifier using h parameter model. (April/May
2016)
Circuit diagram
h parameter model
I −Ic
Current gain (𝐀 𝐈 ) AI = IL =
e Ie
Ic = hfb Ie + hob Vc
hfb Ie + hob (−Ic R L ) ∴ Vc = −Ic R L
Ic + hob Ic R L = hfb Ie
(1 + hob R L ) Ic = hfb Ie
Ic hfb −IL hfb
AI = =− ⥤ =−
Ie 1 + hob R L Ie 1 + hob R L
Ve
𝐈𝐧𝐩𝐮𝐭 𝐑𝐞𝐬𝐢𝐬𝐭𝐚𝐧𝐜𝐞 𝐑 𝐢 R i =
Ie
Ve = hib Ie + hrb Vc
Vc = −R L Ic
= AI Ie R L
Ve hib Ie + hrb AI Ie R L
Ri = =
Ie Ie
R i = hib + hrb AI R L
V A I I e RL
Voltage gain (𝐀 𝐕 ) AV = Vc =
e Ve
16
AI R L Ie 1
= ⃒ =
Rc Ve R i
I
Output admittance(𝐘𝟎 ) Y0 = Vc with Vs = 0
c
Ic = hfb Ie + hob Vc
Ic hfb Ie
÷ Vc = + hob − − − (1)
Vc Vc
When Vs = 0
R s Ie + hib Ie + hrb Vc = 0
(R s + hib ) Ie = −hrb Vc
Ie hrb
=− − − − (2)
Vc R s + hib
Sub (2) in (1)
Ic −hrb
= hfb ( ) + hob
Vc R s + hib
Ic hfb . hrb
y0 = = hob −
Vc R s + hib
1
Ro =
y0
5. Explain the frequency response operation of BJT amplifier with suitable circuit diagram.
From the fig 9.1, the capacitors CS,CC and CE will determine the low-frequency response.
Cs is normally connected between the applied source and active device. In fig 9.2The total resistance is now RS
+ Ri ,the cutoff frequency is established as
1
fLS =
2𝛱(𝑅𝑆 + 𝑅𝑖 ) 𝐶𝑆
Fig Loaded BJT amplifier with capacitors that affect the low- frequency response
17
Fig Determining the effect of Cs on the low frequency response
At mid or high frequency, the reactance of the capacitor will be small to permit short circuit approximation for
the element. the voltage Vi related to VS by
𝑅 𝑖 𝑉𝑆
Vi|mid =
𝑅𝑖 + 𝑅𝑆
18
The effect of CE on the gain is given by,
AV = - RC / re + RE
At the midband frequency level, the Short circuit equivalents for the capacitors can be inserted. The highest low
frequency cutoff determined by CS, CC or CE.
If there are two or more high cutoff frequencies, the effect will be to raise the lower cutoff frequency and reduce
the resulting bandwidth of the system. there is an interaction between the capacitive elements that can affect the
resulting low cutoff frequency.
6. Discuss the factors involved in the selection of IC, RC and RE for a single stage common emitter BJT
amplifier circuit, using voltage divider bias (Nov/Dec2015)
It is also called potential divider bias or self-bias.
In all D.C bias discussed in the above sections clearly states that the values of D.C bias currents and voltage of collector
𝐼𝐶
depends on the currents gain𝛽(𝛽 = 𝐼𝐵). But we know it is purely a temperature sensitive one particularly in silicon type.
Hence the nominal value of 𝛽 is not well defined.
So it is not desirable to provide a D.C bias circuit which is independent of the transistor current gain (𝛽). This is avoided
by potential or voltage divider bias shown in the
Here R1 and R2 forms potential dividing Rc collector load resister and its equivalent thevinins circuits is as follows;
19
This method is widely used since its provides a stable Q-point.
In this method two resistors R1 and R2 connected across the supply voltage Vcc and it provide biasing.
Emitter resistance Re provides bias to BE junction. This causes the base current and hence collector current flows in zero
signal condition.
Applying KVL law to BE junction circuit we get fig.
20
Gain and frequency response
Decibels: The decibel (dB) is a measure of the difference in magnitude between two power levels. The power
gain in decibel is given by,
𝑃2
GdB = 10 log10 dB
𝑃1
Where P2 = specified terminal power; P1 = reference power
If the power P2 is output power (P0) and P1 is input power (Pi) of an amplifier. Then the power
gain is given by,
𝑃0
GdB = 10 log10
𝑃𝑖
𝑉0
If V0 and Vi are output and input voltage of an amplifier then voltage gain,GdB = 20 log10
𝑉𝑖
The frequency response is divided into three region 1) Low frequency region 2) Mid frequency
region 3) High frequency region.
1) Mid frequency region: The gain of the amplifier is maximum AVmid intersecting the frequency response at point
A and B. The corresponding frequencies f1 ans f2 are generally called corner, cutoff or half power frequencies.
If the maximum voltage gain in mid-band is AVmid = V0 / Vi then the gain at half power frequencies is AVmid / √2
The output power in mid-band is, Po(mid) = V02 / R0 = (AVmid Vi)2 / R0
The power at half power frequency is, Po(HPF) = V02 / R0 = (AVmid Vi /√2)2 / R0
= P0(mid) / 2
2) Cutoff Frequency: The frequency at which the voltage gain is equal to 0.707 times of its maximum value is called
cutoff frequency.
3) Bandwidth: The bandwidth of the amplifier is defined as the difference between the two half power frequencies f1
and f2
Bandwidth = f2 – f1
Where f1= the lower cutoff frequency
f2=the upper cutoff frequency
4) Low frequency region: In midband frequencies the coupling and bypass capacitor are replaced by short circuits.
21
1
Capacitive reactance Xc = 2𝛱𝑓𝐶
At Low frequency, the coupling and bypass capacitor are increased. Hence the voltage gain decreases.
5) High frequency region: Here the internal capacitance across the junction affects the performance of the amplifier.
The capacitance, Cb'e = feedback path from bias to emitter
Cce = feedback path from collector to emitter
These capacitors divert the signal to ground.
Cb'c = feedback path from base to collector
This provides a bypass path for the input ac signal.
VD = VDD – IDRD - id RD
Vd=- id RD = - gm vgs RD
Av= Vd / Vgs = - gm RD
This gm depends on the bias. The Trans conductance gm equals the slope of iD- vgs characteristic.
Similarly drain voltage, VD = VD + Vd
In saturation mode, MOSFET acts a voltage controlled current source, The control voltage Vgs and output current
iD give rise to small signal Π-model.
Becomes amplifiers combines the advantages of BJT and MOSFET, They provide very large input resistance
from MOSFET and a large output impedance from the BJT.
23
9. Explain Small signal model of P Channel MOSFET.
The above diagram shows the common source circuit with p-channel MOSFET and its A.C equivalent circuit.
The A.C equivalent circuit seen for n-channel MOSFET also applies to the p-channel MOSFET; however, there
is a change in current directions and voltage polarities compared to the circuit containing the n-channel MOSFET.
The above diagram shows the small signal equivalent circuit of the p-channel MOSFET amplifier.
10. Explain the Common – Source (CS) Configuration. (April/May 2019) (Nov/Dec 2017)
The diagram shows the common source circuit with voltage divider biasing and coupling capacitor. The MOSFET is biased
near the middle of the saturation region by R1 and R2 resistors to work as an amplifier.
Assume that,the signal frequency is sufficiently large for the coupling capacitor to act essentially as a short circuit. The
signal source is represented by a Thevenin equivalent circuit, in which the signal voltage source vs, is in series with an
equivalent source resistance Rsi.
Here Rsi should me much less than the amplifier input resistance,
Ri = R1║ R2 in order to minimize loading effects.
The following diagram shows the resulting small- signal equivalent circuit.
24
vo= - gm vgs (ro║RD)
vi= vgs
Av = vo / vi= - gm vgs (ro║RD) / vgs = - gm(ro║RD)
The input gate to source voltage is
vi= (Ri/ Ri+ Rsi) vs
So the small signal overall voltage gain is,
Since Rsi is not zero, the amplifier input signal vi is less than the signal voltage, This is known as loading effect.
It reduces the voltage gain of the amplifier.
The input resistance is Ris = R1║ R2
The output resistance is Ro = RD║ro
We can also relate the A.C drain current to the A.C drain to source voltage, as
Vds = - Id (RD)
11. Analysis of Common – Drain (CD) or Source follower Amplifier.(Nov/Dec 2016)(May 2017)
The above diagram shows the common – drain amplifier circuit. It is also known as grounded drain amplifier.
In this amplifier circuit, drain is used as a signal ground and hence RD is not needed.
The input signal is coupled to via Cc1 to the MOSFET gate and the output signal at the output signal at the
MOSFET source is coupled via Cc2 to a load resistance RL.
Since RL is in effect connected in series with the source terminal of the MOSFET, it is more convenient to use
the MOSFET’s T model for the analysis. This is shown in the following diagram.
Ri = R G
vi = vsxRi / (Ri + Rsi)= vsxRG / (RG + Rsi)
From the following diagram it can be seen that the load resistance RL is in parallel with ro and resistance 1/gm
in series with RL║ro.
25
The input voltage vi appears across the total resistance and hence by applying the voltage divider rule, we have
vo = vix (RL║ro) / ( 1/gm) + (RL║ro)
Av = vo / vi = (RL║ro) / (1/gm) + (RL║ro)
The above diagram shows the D.C load line, the transition point, and the Q- point, which is in the saturation
region.
26
High Frequency Analysis
The fT is the frequency at which the short – circuit current gain of the CS MOSFET amplifier becomes unity.
The above diagram shows the modified high – frequency equivalent circuit to determine the short – circuit current
gain. Here, the input is fed with a current – source signal Ii and the output terminals are shorted.
The short circuit current Io is given by
Io = gm Vgs – s Cgd Vgs
27
The second term in the above equation is very small and can be neglected at the frequencies of interest and thus
Io = gm Vgs
The Vgs in terms of Ii can be given by
Vgs = Ii / s (Cgs + Cgd)
Substituting the values of Ii and Io from the above equations we have
Io / Ii = gm Vgs / Vgs.s(Cgs + Cgd) = gm / s(Cgs + Cgd)
For physical frequencies s=jω. From above equation it can be seen that the magnitude of the current becomes
unity at the frequency.
ωT=gm / Cgs + Cgd
fT=gm / 2π (Cgs + Cgd)
From the above expression we can say that fT is proportional togm and inversely proportional to the internal
capacitances.
14. Explain Frequency response of CS Amplifier. (Apr/May 2018) (OR) With neat circuit diagram, perform ac
analysis for common source using equivalent circuit NMOSFET AMPLIFIER (NOV/DEC2015)
The following diagram shows the CS MOSFET amplifier. Its gain falls at low frequency due to the effect of C c1
and Cs and Cc2. Its gain falls at high frequency due to the effect of Cgs and Cgd.
28
High Frequency Response:
29
15. Explain small signal model of MOSFET.
The above diagram shows the A.C equivalent circuit. Here, the D.C sources are made zero.
From the equivalent circuit for the NMOS amplifier circuit, we can draw a small signal equivalent circuit for the
MOSFET.
30
The above diagram shows the small signal low frequency A.C equivalent circuit for n – channel MOSFET.
The relation of Id by Vgs is included as a current source gm vgs connected from drain to source.
The input impedance is represented by the open circuit at its input terminals, since gate current IG is zero.
We know that the circuit has the finite output resistance of a MOSFET biased in the saturation region because of
the nonzero slope in the ID versus VDS curve.
where λ is the channel length modulation parameter and is a positive quantity. The small signal output resistance,
is defined as,
31
Problems
1. For the circuit below, find (i) dc bias levels (ii) dc voltage across the capacitors (iii) ac emitter resistance (iv)
voltage gain (v) state of the transistor. (Nov/Dec 2018)
Solution:
Given that,
Emitter resistance, RE=1 KΩ
Collector resistance, RC=2 KΩ
Load resistance, RL=1 KΩ
Collector input voltage, VCC=15V
Amplification factor, ß=100
Input resistance, R1=40 KΩ and R2=10 KΩ
Voltage gain, AV= ?
AC emitter resistance, re= ?
i. DC bias levels: DC bias levels of CE amplifier determined by calculating various dc voltages and dc currents.
DC voltage, V2 across resistor, R2 is
𝑉𝐶𝐶
𝑉2 = 𝑋 𝑅2
𝑅1 + 𝑅2
Substituting the corresponding values, V2 is obtained as,
15
𝑉2 = 𝑋 10
40 + 10
V2= 3 V
DC emitter voltage, VE across emitter resistor, RE is,
VE=V2-2VBE
= 3 V- 0.7 V
= 2.3 V
DC emitter voltage, VE= 2.3 V
DC emitter current, IE is given by,
𝑉𝐸
𝐼𝐸 =
𝑅𝐸
2.3 𝑉
𝐼𝐸 = = 2.3 𝑚𝐴
1 𝐾Ω
DC Collector voltage, VC is determined as, VC = VCC - ICRC
VC=15 V - 2.3 X 2 KΩ since [IE = IC]
VC = 10.4 V
DC base current, IB is obtained as,
Using the relation IC = ß IB
IC 2.3 𝑚𝐴
IB = = = 0.023 𝑚𝐴
ß 100
32
ii. DC voltages across the capacitors: From the above calculations, DC voltages across capacitors in the circuit is
obtained as,
DC voltage across capacitor, Cin is, V2 = 3 V
DC voltage across emitter capacitor, CE is , VE = 2.3 V
DC voltage across collector capacitor, CC is VC = 1.4 V
iii. AC Emitter Resistance: The ac emitter resistance, re’ is given by, [IE = 2.3 mA]
25 mV 25 mV
r′e = = = 10.9 Ω
IE 2.3 mA
iv. Voltage Gain(AV): The voltage gain AV of CE amplifier is defined by,
rc
AV =
r′e
Here, total ac collector resistance, rc is determined by, 𝑟𝑒 = 𝑅𝑐 ⃦ 𝑅𝐿
𝑅𝐶 𝑅𝐿 2𝑋1
𝑟𝑐 = = 10.9Ω = 0.667 𝐾Ω
𝑅𝐶 + 𝑅𝐿 2+1
Substituting rc value in AV, implies,
0.667 𝐾Ω
𝐴𝑉 =
10.9 Ω
Voltage gain, AV = 61.2
v. State of transistor: From the above calculation it can be determined that the transistor is in active state.
Since VC > VE
2. Determine the mid band gain, the upper 3 dB frequency fH of a CS amplifier fed with a signal source having an
internal resistance Rsig = 100 KΩ. The amplifier has RG = 4.7 MΩ, RD = RL = 15 KΩ gm = 1 mA/V, ro = 150
KΩ, Cgs = 1 pF and Cgd = 0.4 pF. (May/June2016)
𝑅𝐺
Solution: 𝐴𝑀 = 𝑔 𝑅′
𝑅𝐺 +𝑅𝑆𝑖𝑔 𝑚 𝐿
Where 𝑅𝐿′ = 𝑟0 ‖𝑅𝐷 ‖𝑅𝐿 = 150‖15‖15 = 7.14KΩ
𝑔𝑚 𝑅𝐿′ = 1 × 7.14 = 7.14𝑉/𝑉
4.7
Thus 𝐴𝑀 = − 4.7+0.1 × 7.14 = −7𝑉/𝑉
The equivalent capacitance Ceq is found as
𝐶𝑒𝑞 = (1 + 𝑔𝑚 𝑅𝐿′ )𝐶𝑔𝑑 = (1 + 7.14) × 0.4 = 3.26𝑝𝐹
The total input capacitance Cin can be now obtained as
𝐶𝑖𝑛 = 𝐶𝑔𝑑 + 𝐶𝑒𝑞 = 1 + 3.26 = 4.26 𝑝𝐹
The upper 3 dB frequency fH is found from
1 1
𝑓𝐻 = = = 382 𝑘𝐻𝑧
2𝜋𝐶𝑖𝑛 (𝑅𝑠𝑖𝑔 ‖𝑅𝐺 ) 2𝜋 × 4.26 × 1 (0.1‖4.7) × 106
−12
33
3. The MOSFET shown fig has the following parameter VT = 2V, 𝜷 = 𝟎. 𝟓 × 𝟏𝟎−𝟑, rd = 75KΩ. It is biased at
at ID = 1.9m A. (Nov/Dec2017)
b)
𝑟𝑖𝑛 = 𝑅1 ‖𝑅2 = (47𝑀Ω‖(22𝑀Ω) = 15𝑀Ω
34
4. A CC amplifier shown in below figure has VCC = 15V, RB = 75KΩ and RE = 910 Ω the 𝜷 of the silicon
transistors is 100 and the load resistor is 600 Ω find rin and AV. (Nov/Dec 2015)
Given:
VCC = 15V, RB = 75KΩ, RE = 910 Ω,𝛽 = 100, RL = 600 Ω
To Find: rin and AV
𝑉𝐶𝐶 −0.7 0.026
Formulae used 𝐼𝐵 = , 𝐼𝐸 = (1 + 𝛽)𝐼𝐵 , 𝑟𝐸 =
𝑅𝐵 +(𝛽+1)𝑅𝐸 𝐼𝐸
𝑟𝑖𝑛 (𝑠𝑡𝑎𝑔𝑒) = (𝛽 + 1)(𝑟𝑒 + 𝑟𝐿 )‖𝑅𝐵
𝑉𝐿 = 𝑅𝐸 ‖𝑅𝐿
𝑟𝑖𝑛 (𝑠𝑡𝑎𝑔𝑒) = (𝛽 + 1)(𝑟𝑒 + 𝑅𝐸 )
𝑟𝑜 (𝑠𝑡𝑎𝑔𝑒) = 𝑅𝐸 ‖𝑟𝑒 (𝑟𝑠 = 0)
𝑉𝐿 𝑅𝐸
𝐴𝑟 = = (𝑜𝑢𝑡𝑝𝑢𝑡 𝑜𝑝𝑒𝑛)
𝑉𝑆 𝑟𝐸 + 𝑅𝐸
Calculation:
𝑉𝐶𝐶 − 0.7 15 − 0.7 15 − 0.7 143
𝐼𝐵 = = = =
𝑅𝐵 + (𝛽 + 1)𝑅𝐸 75000 + (100 + 1)910 75000 + 101 ∗ 910 166910
= 8.5674 × 10−4 𝐴
𝐼𝐸 = (1 + 𝛽)𝐼𝐵 = (101) × 8.5674 × 10−4 = 0.08653𝐴
0.026 0.026
𝑟𝐸 = = = 0.300
𝐼𝐸 0.08653
𝑟𝑖𝑛 (𝑠𝑡𝑎𝑔𝑒) = (𝛽 + 1)(𝑟𝑒 + 𝑅𝐸 ) = (101) × (0.300 + 910) = 91940.3 𝑜ℎ𝑚𝑠
𝑉𝐿 𝑅𝐸 910
𝐴𝑉 = = = = 0.999
𝑉𝑆 𝑟𝐸 + 𝑅𝐸 910 + 0.300
35
5. Evaluate the AI, AV, Ri, Ro, Ais, Avs of a single stage CE amplifier with Rs=1 KΩ R1=22KΩ, R2=10KΩ,
Rc=2KΩ, RL=2KΩ, hfe=50,hie=1.1KΩ, hoe=25µA/V and hre=2.5X10-4
(Nov/Dec 2016)
Given
Rs=1 KΩ R1=22KΩ,R2=10KΩRc=2KΩ,RL=2KΩ,hfe=50,hie=1.1KΩ,hoe=25µA/V and hre=2.5X10-4.
i)Current gain
𝐴𝑖 = −ℎ𝑓𝑒 = −50
ii)Input impedance 𝑅𝑖 = ℎ𝑖𝑒 = 1.1 𝑘𝛺
𝑅𝑖 = ℎ𝑖𝑒 ⃦ 𝑅1 ⃦ 𝑅 2
= 1.1 × 103 ⃦ 22 × 103 ⃦ 10𝑘𝛺
22 × 10 × 106
= 1.1 × 103 ⃦ [ ]
32 × 103
220 × 103
= 1.1 × 103 ⃦ [ ]
32
= 1.1 ⃦ 6.87𝑘
6
1.1 × 6.87 × 10 7.56 × 106
= = = 0.947 × 103 = 947 𝛺
(1.1 + 6.87)103 7.975 × 103
𝒊𝒊𝒊)𝑽𝒐𝒍𝒕𝒂𝒈𝒆 𝒈𝒂𝒊𝒏
𝐴𝐼 𝑅𝐿 ′ −50 × (𝑅𝑐 ⃦𝑅𝐿 ) −50(2𝑘 ⃦ 2𝑘)
𝐴𝑣 = = = = −45.45
𝑅𝑖 𝑅𝑖 1.1𝑘
Output voltage
1
𝑅0 = =∞
𝑦0
𝑅0′ = 𝑅0 ⃦𝑅𝐿 ′ = ∞ ⃦ 2𝑘 ⃦ 2𝑘 = 1𝑘
Over all voltage gain
𝑉𝑖𝑛
𝐴𝑣𝑠 = 𝐴𝑉 ×
𝑉𝑠
𝑉𝑜 𝑉𝑜 𝑉𝑏
𝐴𝑣𝑠 = = ×
𝑉𝑠 𝑉𝑏 𝑉𝑠
𝑉𝑜 𝑉𝑏 𝑅1
𝑤ℎ𝑒𝑟𝑒 = 𝐴𝑣 𝑎𝑛𝑑 =
𝑉𝑏 𝑉𝑠 𝑅1 + 𝑅3
6. Fig shows a common emitter amplifier. Determine the input resistance, ac load resistance, voltage gain
and output voltage?(May 2017)
Given:
𝑉𝐶𝐶 = 12 𝑉,𝑅𝐶 = 10 𝑘𝛺,𝑅𝛼 = 3 𝑘𝛺,𝛽 = 60, 𝑅1 = 100 𝑘𝛺,𝑅2 = 50 𝑘𝛺,𝑟𝐸 = 1 𝑘𝛺,𝑅𝐸1 = 2 𝑘𝛺,𝑅𝑆 =
100 𝛺,
𝑉𝑠 = 10 𝑚𝑉
𝑅2 50 × 103
𝑉𝑡ℎ = 𝑉𝐶𝐶 ( ) = 12 ( )
𝑅1 + 𝑅2 100 × 103 + 50 × 103
50 12
= 12 ( )= = 4𝑉
150 3
𝑅𝑡ℎ = 𝑅1 ⃦𝑅2
100 × 50 × 103 × 103 100 × 50 × 103
= 3 =
10 × 100 + 50 × 103 103 (150)
3 3
500 × 10 100 × 10
= = = 33.3 × 103 𝛺 = 33.3 𝑘𝛺
15 3
𝐸𝑚𝑖𝑡𝑡𝑒𝑟 𝑟𝑒𝑠𝑖𝑠𝑡𝑎𝑛𝑐𝑒 (𝑅𝐸 )
37
𝑅𝐸 = 𝑅𝐸1 + 𝑅𝐸 = 1𝑘𝛺 + 2𝑘𝛺 = 3𝑘𝛺
𝑉𝑡ℎ − 𝑉𝐵𝐸
𝐼𝐸 =
𝑅
𝑅𝐸 + 𝑡ℎ
𝛽
4 − 0.7
=
33.3 × 103
3 × 103 + 60
3.3
𝐼𝐸 = = 0.000928 = .92𝑚𝐴
3555.55
A.C resistance
25 25
𝑟𝑒1 = =
𝐼𝐸 (𝑚𝐴) 0.92
Input resistance
𝑅𝑖 = 𝛽(𝑟𝐸 + 𝑟𝑒1 ) = 27𝛺
= 60(1 × 103 + 27)
= 61620 𝛺
= 61.6 𝑘𝛺
= 10𝑘 ⃦3𝑘
10 × 3 × 106 30
= = × 103 = 2.3 𝑘𝛺
13 × 103 13
𝑟𝐿 2307
𝐴𝑣 = = = 2.246
𝑟𝐸 + 𝛾𝑒1 1 × 103 + 27
Overall voltage gain
W.K.T the ratio of base to source voltage
𝑉𝑖𝑛 𝑅𝑖𝑆 21.62 × 103 21.62 × 103
= = = = 0.99
𝑉𝑠 𝑅𝑆 + 𝑅𝑖𝑆 100 + 21.62 × 103 21720
∴ 𝑜𝑣𝑒𝑟 𝑎𝑙𝑙 𝑣𝑜𝑙𝑡𝑎𝑔𝑒 𝑔𝑎𝑖𝑛
𝑉𝑖𝑛
𝐴𝑣𝑠 = 𝐴𝑉 × = 2.246 × 0.99 = 2.235
𝑉𝑠
Output voltage
𝑉𝑂 = 𝐴𝑉𝑆 × 𝑉𝑆 = 2.235 × 10 𝑚𝑉
𝑉𝑂 = 22.35 𝑚𝑉
38
7. An NPN common emitter amplifier circuit has the following parameters: hfe=50, hie=1KΩ and
Rc=3KΩ. Find the voltage gain of the amplifier. (April/May 2019)
𝐴𝐼 𝑅𝐿
𝐴𝑉 = ; 𝐴𝐼 = −ℎ𝑓𝑒 ; 𝑅𝑖 = ℎ𝑖𝑒 ; 𝑅𝐿 = 𝑅𝐶 ;
𝑅𝑖
−50 𝑋 3 𝑋 103
𝐴𝑉 = ; 𝐴𝐼 = −50; 𝑅𝑖 = 1𝐾; 𝑅𝐿 = 3𝐾;
1 𝑋 103
𝑨𝑽 = −𝟏𝟓𝟎
8. A common emitter amplifier has an input resistance 2.5 kΩ and voltage gain of 200.If the input signal
voltage is 5mV. Find the base current of the amplifier. (May 2017) (Nov/Dec 2017)
W.K.T
ib-base current, Ri=2.5 kΩ, Vs=5mV
𝑉
2.5X10-3 = 𝑠 = 5x10-3/𝑖𝑏 ∴ 𝑖𝑏 = 2 × 10−6 𝐴 = 2𝜇𝐴
𝑖𝑏
39
Additional Important question and answers:
1. Derive the expression for current gain, input impedance and voltage gain of a CE transistor Amplifier.
(Nov/Dec 2016) (Apr/May 2018)
The ac equivalent circuit can be obtained by replacing all the capacitors and voltage sources by a short circuit.
Characteristics of CE amplifier:
A. Without Emitter Resistor
(1) It has good voltage gain with phase inversion i.e., the output voltage is 180 ̊ out of phase with input.
(2) It also has good current gain, power gain and relatively high input and output impedance.
40
Assume hre=0,
The input impedance: hie seen to be in series with hreV0.For CE circuit, hre is normally a very small quantity. So
that the voltage hreV0 fed back from the output to the input circuit is much smaller than the voltage drop across
hie.
Zi'= RB ‖hie where RB = R1|| R2
The output impedance: The output voltage variation have liitle
effect upon the input of CE circuit, only the output half of the
circuit need to be considered in determining the output
impedance.
1
Z0'= RC
ℎ𝑜𝑒
2. Derive the expression for current gain, input impedance and voltage gain of a CC transistor Amplifier.
This circuit is also known as emitter follower amplifier because its voltage gain is close to unity. Hence a change
in base voltage appears as an equal change across the load.
Characteristics of CC amplifier:
(1) CC amplifier provide current gain and power gain. but no voltage gain.
(2) It has high input impedance and very low output impedance.
Current gain: The current gain is defined as the ratio of output current to input current
AI = - (1+hfe)ib / ib . ib/ Ii
AI = - (1+hfe).RB / RB+Zi.
44
3. Derive the expression for current gain, input impedance and voltage gain of a CB transistor Amplifier.
(May/June2016)
In this circuit only a fraction of output voltage is feedback to input thus hre is very small. Therefore hrbV0 can be
neglected when deriving CB gain and impedance.
Characteristics of CB amplifier:
(1) This CB circuit provides voltage gain and power gain but no current gain.
(2) It has high output impedance and very low input impedance thus it is unsuitable for most voltage amplification.
b. Output impedance: The output has very less impact on the input hence the output impedance can be taken as
Ze≅ 1 / hob
The actual output impedance is given by, Z0 = RC ║ZC≅ RC
RC is usually much smaller than 1/ hob, soothe circuit impedance is approximately equal to RC.
c. Voltage Gain: it is given by Av = V0 / Vi--------------------4
V0 = IC (RC ║RL) ------------5
Vi=Iehib +IeRB - IEhfbRB = Ie[hib + RB(1 - hfb)]
AV = IC (RC ║RL) / Ie[hib + RB(1 - hfb)]----------6
AV = hfb (RC ║RL) / hib + RB(1 - hfb)--------------7
d. Current gain: The transfer current gain of the device is given by hfc = IC / Ie-----------8
The signal current is divided between RE and Ze,and the collector current divides between RC and RL ,giving a lower
value of current gain.
IL = IC RE / RE + RL
= hfcIe RE / RE + RL but Ie=IS RB/ RB + Ze
Ai = IL / IS = hfcRERB / (RB + Ze)(RC + R:L)----------9
e. Power Gain:
The Power gain is given by APT = AV * hfb-------------10
Where Ai is significantly different from hfb Ap = AV * Ai------11
f. Application:
It is used for very high frequency voltage amplifier.
45
EC8353-ELECTRON DEVICES AND CIRCUITS
PART-A
8. When two signals V1 and V2 are connected to the two inputs of a difference amplifier, define a
difference signal Vd and common-mode signal Vc
The difference signal Vd is defined as the difference of the two signal inputs,
i.e., Vd=V1–V2
The common-mode signal Vc is defined as the average of the two signals,
I.e., Vc = (V1+V2)
9. What is the common-mode gain AC in terms of A1and A2?
It is given by Ac = A1 + A2
10. Define CMRR what its ideal value How to improve it. (Nov/Dec2015), (May/ June2016)(May 2017)
The common-mode rejection ratio (CMRR) of a differential amplifier is defined as the ratio of the differential-
mode gain to common-mode gain.
|A |
CMRR = |Ad |
c
CMRR (dB)=20logAd–20logAc.
1
Single tuned amplifiers
Tuned amplifiers are amplifiers that are designed to reject a certain range of frequencies below a lower cut off
frequency ωL and above a upper cut off frequency ωH and allows only a narrow band of frequencies.
• High selectivity
• Smaller collector supply voltage
• Small power gain.
Neutralization methods
19. State the merits of using push-pull configuration. (May 2018) (Apr/May 2018)
• Efficiency is high. (78.5%)
• Figure of merit is high.
• Distortion is less
• Ripple present in the output due to power supply is multiplied.
20. List the disadvantages of push-pull amplifier.
• Two identical transistors are needed.
• Centre taping is required in transformer.
• Transformers used are bulky and expensive.
• If the parameters of the two transistors differ, there will be unequal amplification of the two halves of
signal which introduces more distortion.
2
21. How do you bias class-A operation?
In class A mode of means, the output current flows throughout the entire period of input cycle and the Q-point is
chosen at the midpoint of A.C load line and biased.
24. A multistage amplifier employs five stages each of which has a power gain of 30. What is the total gain of
the amplifier in dB. (Nov/Dec 2018)
Given that,
The power gain of each stage in a five-stage amplifier is,
AVn = 30, n = 1 to 5
Total gain, AV = ?
The overall gain, AV of an n-stage amplifier is given as,
AV = AV1 X AV2 X AV3 X ……AVn
Here, n = 5
AV = AV1 X AV2 X AV3 X AV4 X AV5
= 30 X 30 X 30 X 30 X 30
AV = 243 X 105
Total gain, AV = 243 X 105
AV = 147.71 dB
25. CMRR of an amplifier is 100dB, calculate common mode gain if the differential gain is 1000(Nov/Dec
2016)
It is a measure of an active device in converting the d.c power of the supply into the ac power delivered to
load. It is also referred theoretical efficiency or collector circuit efficiency
• Mathematically, collector circuit efficiency,
a.c.power delivered to the load
𝜂𝑐 =
power supplied by the d.c.source to output circuit
27. A tuned circuit has a resonant frequency of 1600 KHz and a bandwidth of 10 KHz. What is the value of
its Q factor? (May 2017)
resonant frequency 1600
Q factor = bandwidth
= 10 = 160
3
29. Compare the characteristics of CE, CB, CC amplifiers (May/June 2016) (Nov/Dec 2017)
30.
Common Collector
S.No Common Emitter Amplifier Common Base Amplifier
Amplifier
2 1800 phase shift occurs No phase shift occurs No phase shift occurs
31. A multistage amplifier employs five stages each of which has a power gain of 30. What
is the total gain of the amplifier in dB? (Nov/Dec 2017)
Solution:
Absolute gain of each stage = 30 No. of stages = 5
Power gain of one stage in dB = 10 log 10 30 = 14.77
∴ Total power gain = 5 ×14.77 = 73.85 dB
33. Determine the input impedance of a differential amplifier (emitter coupled) with R B=3.9 KΩ and ZB=2.4
KΩ. (April/May 2019)
𝑍𝑖 = 𝑅𝐵 ǁ 𝑍𝐵
𝑅𝐵 × 𝑍𝐵
𝑍𝑖 =
𝑅𝐵 + 𝑍𝐵
34. A single tuned amplifier provides a band width of 10KHz at a frequency of 1MHz. Find the circuit Q.
(April/May 2019)
𝑓𝑂 = 𝐵𝑊 × 𝑄𝑂
𝑓𝑂
𝑄𝑂 =
𝐵𝑊
1 × 106
𝑄𝑂 =
10 × 103
𝑄𝑂 = 100
4
PART-B
• Ac equivalent circuit for cascade amplifier is drawn by shorting dc supply and capacitors.
5
Analysis of second stage (CB)
a) Current gain (Ai2)
6
From the above figure, 𝑉𝑖1 , 𝑉𝑖2 , 𝑉𝑖3the input of first, second and third stages and 𝑉𝑜1 , 𝑉𝑜2 , 𝑉𝑜3 are the output
𝑉
of the three stages. Therefore, 𝑉𝑜3 is the overall voltage gain of 3 stage amplifier which is given as follows:
𝑖1
𝑉𝑜3
𝐴𝑣 = …………… (1)
𝑉𝑖1
𝑉 𝑉 𝑉
= 𝑉𝑜3 .𝑉𝑖3 . 𝑉𝑖2 …………… (2)
𝑖3 𝑖2 𝑖1
Therefore, the voltage gain of multistage amplifier is the product of individual gains of the each stage.
Then the multistage amplifier is shown below.
Voltage gain: The resultant voltage gain of the multistage amplifier is the product of the voltage gains of the various
stages or individual stages.
From the above discussion, the multistage amplifier is divided into three parts:
i) Input stage
ii) Middle stage and
iii) Output stage.
❖ In the above, the input stage must be designed with input impedance matches with the source impedance.
❖ Similarly, the output stage designed must be the output impedance matches with the load impedance.
❖ Then, middle stage is designed with our desired voltage and current gain.
Anyhow, to select the cascading configuration, the following considerations are important since we normally
use these three configurations.
7
Common mode and Difference mode analysis
3. Draw the circuit diagram and explain the working of a differential amplifier using FET. Derive
the expression for differential mode gain and common mode gain.(May 2017)
• Normally, analysis in amplifier depends on both AC and DC analysis.
• In the above two, the d.c signals determines the operating values for the transistors and used as biasing.
• Similarly, a.c signals are used as input signals, which determine the output of the differential amplifier.
• The dual input, balanced output differential amplifier is also called Symmetrical Differential Amplifier.
❖ DC ANALYSIS:
• DC analysis means using D.c voltage as biasing voltage and keeping it constant (to obtain suitable
operating point).
❖ AC ANALYSIS:
• For performing AC analysis, we must apply AC input signals as an input. So, we can calculate the
following:
A. Differential mode gain (Ad).
B. Common mode gain (Ac).
C. Input resistance (Ri).
D. Output resistance (Ro).
The above can be obtained by using h-parameters.
VS
= ib (R S + hie ) ……..(2)
2
VS
ib =2(R ……...(3)
S +hie )
• Negative sign indicates that 1800 phase difference between input and output. If the input
signals are equal and are out of phase by 1800, we get
V V
• Differential mode signal Vd = V1 –V2 = ( 2S ) – (– 2S ) = VS …..(7)
hfe R C
Ad = … … … . (8)
2(R S + hie )
• When the output of differential amplifier is measured with reference to ground, it is called
unbalanced output.
• The output across the collectors of Q1 and Q2 to be perfectly matched then Ad for
balanced output is twice than that of Ad for unbalanced output. Therefore
hfe R C
Ad = … … … … … … . (9)
(R S + hie )
• In this mode, both the emitter current Ie1 = Ie2 = Ie of TQ1, TQ2 flows through RE in the
same direction, with same magnitude.
9
• Hence, the total current flowing through RE is nearly 2Ie …..(13)
11
(R S + hie + 2R E (1 + hfe )
CMRR = | | … (30)
2(R S + hie )
This is CMRR for dual input balanced output differential amplifier circuit.
For balanced case,
(R S + hie + 2R E (1 + hfe )
CMRR = | |
(R S + hie )
For unbalanced case,
(R S + hie + 2R E (1 + hfe )
CMRR = | |
2(R S + hie )
C. Input Impedance (Ri):
Ri is defined as the equivalent resistance existing between any one of the input and the ground
when other input terminal is grounded.
𝑉𝑆
𝑅𝑖 =
𝐼𝑏
Put the 𝑉𝑆 and 𝐼𝑏 from the above discussion, Ri = 2(RS + hie).
Hence for dual input circuit, the total input resistance is 2(RS + hie), as the 2 circuits are
perfectly matched.
This input resistance is not dependent on whether output is balanced or unbalanced.
D) OUTPUT IMPEDANCE RO:
• It is defined as the equivalent resistance between one of the output terminals with
respect to ground.
• The resistance between output terminal with respect to ground is RC.
RO = RC
12
4. Draw a differential amplifier and its ac equivalent circuit. (OR) Explain the operation of basic
emitter coupled differential amplifier (or) Explain the function of differential amplifier with neat
circuit. (A/M 2010) (M/J 2012) (OR) Explain the common mode and differential mode operation of
the differential amplifier (May/June2016 Nov/Dec-2017, May-2018) (OR)
Explain the working of a single ended input differential amplifier. (Nov/Dec 2018)
•
Fig: block diagram of differential amplifier
• In an ideal amplifier, the output voltage Vo is proportional to the difference between the two input
signals. Therefore we can write,
Vo α ( Vin1- Vin2 ) …………………..(1)
❖ DIFFERENTIAL GAIN Ad:
• From the above equation, we can write the differential gain Ad is [ Generally gain is nothing but the
output parameter (may be voltage, current, etc.) to input parameter].
• Therefore, Vo = Ad ( Vin1 – Vin2 ) …………………(2)
Where Ad = Differential gain constant
• This Ad is thegain with which differential amplifier amplifies the difference between two input signal
is called Differential gain.
• The difference between the two inputs (Vin1῀ Vin2) is generally called difference voltage and denoted
as Vd.
• output foreThere voltage is Vo = Ad . Vd ……………(3)
• Therefore the differential gain can be expressed as,
𝑉𝑜
Ad = …………………(4)
𝑉𝑑
❖ COMMON MODE GAIN Ac : If we apply two input voltages which are equal in all the respect to the
differential amplifier i.e., V1 = V2 then, ideally the output voltage Vo is (V1῀ V2) .Ad , must be zero.
• In this mode the applied input signals, phase and frequency must be in same.
13
• But the output voltage of the practical differential amplifier not only depends on the difference voltage
but also depends on the average common level of the two inputs.
• Such an average level of the two input signal is called common mode signal which is denoted as Vc.
𝑉1+ 𝑉2
Vc = .........................(5)
2
• In practical, the differential amplifier produces the output voltage proportional to each common mode
signal. The gain which it amplifies the common mode signal to produce the output is called common
mode gain of the differential amplifier denoted as Ac.
𝑉𝑜
Ac = …………………….(6)
𝑉𝑐
• In ideal case the CMRR is infinite, because the common mode gain is nearly or exactly zero. But in
practical, it is not infinite.
• But ρ is very large one, since Ad is very large and Ac is very small. The CMRR can be expressed in dB
also.
| 𝐴𝑑 |
CMRR in dB = 20 log dB …………..(9)
|𝐴𝑐 |
14
Ac = Common mode gain of differential amplifier,
Vd = Differential mode voltage.
• From equation (10), Vo can be written as,
Ac .𝑉
Vo = Ad .Vd[ 1+Ad . 𝑉𝑐 ] ………………..(11)
𝑑
1 𝑉𝑐
Vo = Ad .Vd[ 1+ 𝐴𝑑 . ]…………………(12)
𝑉𝑑
𝐴𝑐
1 𝑉𝑐
Vo = Ad .Vd[ 1+𝐶𝑀𝑅𝑅 . ] ……………..(13)
𝑉𝑑
• Therefore, from the above equation, the CMRR is practically very large, though both Vc and Vc
components are present.
• The output is proportional to the difference in signal only. Then the common mode component is greatly
rejected.
16
• Due to negative going signal on the base of TQ2, an amplified positive going signal develops on the
collector of TQ2 and anegative going signal develops across RE, because of emitter follower action of
TQ2.
• So. The signal voltage across RE due to effect of TQ1 and TQ2 are equal in magnitude and 180ᵒ out of
phase due to method pair of transistors.
• Hence these two signals cancel each other and there is no signal across the emitter resistance.
• Hence there is no AC signal current flowing
through the emitter resistance. Hence RE in this
case does not introduce negative feedback.
• In phase signal voltages at the bases of TQ1 and TQ2 causes in phase signal voltages to appear across RE which add
together.
• Hence RE causes a signal current and provides negative feedback.
• This feedback reduces the common mode gain of differential amplifier.
17
5. Explain the analysis of Differential amplifier. With neat sketch explain the BJT differential
amplifier with active load and derive for Ad, Ac, and CMRR How CMRR improved (Nov/Dec
2015)(Nov/Dec 2016,May-2018) (OR)
Deduce the expression for Emitter currents in a differential amplifier under large signal operation.
(April/May 2019)
❖ DC ANALYSIS:
• DC analysis means using D.c voltage as biasing voltage and keeping it constant (to obtain suitable
operating point).
• For obtaining DC analysis, we must obtain operating point values i.e., ICQ and VCQ for the transistors
used.
• In DC analysis, the supply voltage d.c is taken as biasing voltage and the applied input a.c signals of both
Vs1 and Vs2 are to be zero.
18
To obtain DC analysis following assumptions are to be taken:
1) Assuming RS1 = RS2 (source resistances of both sides) and is simply denoted by RS.
2) The transistor used TQ1 and TQ2 both are matched in their ideal identical characteristics.
3) Emitter resistances connected in both RE1 and RE2 must be the same.
i.e., RE1 = RE2 = RE
RE1 .RE2
Hence RE = RE1|| RE2 = [RE1 +RE2 ]
RS
In practice, << 2R E ..……….(9)
β
19
VEE −VBE
IE = …………. (10)
2RE
• From the above equation (1), we can observe the following points.
i. R E (Emitter resistance) determines the emitter circuit of TQ1 and TQ2 for the known value
of VEE .
ii. Then, the collector resistance (RL) is independent of current that flows through Emitter
terminals of TQ1 and TQ2.
The collector voltage, VC = VCC – IC RC ……….(11)
• Neglecting the drop across RS, we can obtain the emitter voltage of TQ1 as approximately equal to –
VBE.
• Then, VCE = VC – VE = (VCC – IC RC) - VBE …………(12)
VCE = VCC +VBE −IC RC
• Hence, IE = IC = ICQ while VCE = VCEQ for given values of VCC and VEE.
• Therefore operating point (Q) can be obtained from equation (10) and (12).
❖ AC ANALYSIS:(Nov/Dec 2016)
• For performing AC analysis, we must apply AC input signals as an input. So, we can calculate the
following:
E. Differential mode gain (Ad).
F. Common mode gain (Ac).
G. Input resistance (Ri).
H. Output resistance (Ro).
The above can be obtained by using h-parameters.
D. Differential gain (Ad)
• To obtain the Differential mode gain, the two input signals must be different from each other.
• Here, we take the two a.c input signals as equal in magnitude but having 180ᵒ phase shift between them.
VS
• Then, the magnitude of each a.c input voltage VS1 and VS2is .
2
• For the a.c purposes, emitter terminal can be grounded which is shown in figure below with small signal
analysis.
20
Figure (1): AC Equivalent for differential operation (half circuit concept)
• The circuit which can be analyzed by considering only one transistor is called Half circuit concept of
analysis.
VS
= ib (R S + hie ) ……..(2)
2
VS
ib =2(R ……...(3)
S +hie )
• Negative sign indicates that 1800 phase difference between input and output. If the input signals are equal
and are out of phase by 1800, we get
21
V V
• Differential mode signal Vd = V1 –V2 = ( 2S ) – (– 2S ) = VS …..(7)
hfe R C
Ad = … … … . (8)
2(R S + hie )
• When the output of differential amplifier is measured with reference to ground, it is called unbalanced
output.
• The output across the collectors of Q1 and Q2 to be perfectly matched then Ad for balanced output is twice
than that of Ad for unbalanced output. Therefore
hfe R C
Ad = … … … … … … . (9)
(R S + hie )
E. Common mode gain (AC)
• In common mode, the both transistor’s input magnitude and phases are also inphase with each other.
• Let us assume that input signals are having the same magnitude VS and are in same phase.
V1 +V2 VS +VS
• Common mode voltage VC = = = VS ………(10)
2 2
• In this mode, both the emitter current Ie1 = Ie2 = Ie of TQ1, TQ2 flows through RE in the same direction,
with same magnitude.
• Hence, the total current flowing through RE is nearly 2Ie …..(13)
22
Figure(2): Approximate Hybrid model
• As the current through RE is 2Ie , for simplicity of derivation, we have to assume the Ie and effective
emitter resistance as 2RE.
• Current through RC = Load current IL
• Effective emitter = 2 RE
• Current through emitter resistance = IL + Ib
• Current through hoe = (IL – hfe . Ib)
• Now, applying Kirchhoff’s voltage law to input side,
24
(R S + hie + 2R E (1 + hfe )
CMRR = | | … (30)
2(R S + hie )
• This is CMRR for dual input balanced output differential amplifier circuit.
• Hence for dual input circuit, the total input resistance is 2(RS + hie), as the 2 circuits are perfectly
matched.
• This input resistance is not dependent on whether output is balanced or unbalanced.
D) OUTPUT IMPEDANCE RO:
• It is defined as the equivalent resistance between one of the output terminals with respect to ground.
• The resistance between output terminal with respect to ground is RC.
R O = RC
25
FET input stages
6. Explain the FET input stages.
❖ FET parameters:
• The following are the parameters of FET as an amplifier.
1. The transcondutance ‘𝑔𝑚 ’
2. The dynamic resistance ‘𝑟𝑑 ’ and
3. The amplification factor µ.
• Transcondutance:
✓ It is defined as the ratio of change in drain current to the change in gate source voltage at a constant
drain source voltage.
𝛥𝐼𝐷
𝑔𝑚 = / 𝛥𝑉𝐷𝑆 = Constant
𝛥𝑉𝐺𝑆
✓ It is expressed in mill amperes per volt or micro mhos. It is sometimes referred to as the common
source forward trans admittance.
• Dynamic Drain Resistance or output Resistance:
✓ The drain resistance is defined as the ratio of change in drain source voltage 𝑉𝐷𝑆 to the change in drain
current 𝐼𝐷 at a constant gate source voltage.
𝛥𝑉𝐷𝑆
𝑟𝑑 = / 𝛥𝑉𝐺𝑆
𝛥𝐼𝐷
✓ The reciprocal of drain resistance is the drain conductance, it is called sometimes as common source
output conductance.
• Amplification factor:
✓ Amplification factor is defined as the ratio of change in drain source voltage to the change in gate
source voltage at a constant drain current.
𝛥𝑉
µ = 𝛥𝑉𝐷𝑆 / 𝛥𝐼𝐷
𝐺𝑆
26
Single tuned amplifiers
7. Draw the circuit diagram of a single tuned amplifier and obtained expression for its gain ,resonant
and cut off frequency (May/June 2016), (Nov/Dec2015)
(OR)
Illustrate the behavior of a MOSFET based amplifier circuit tuned load. Also deduce expression for
voltage gain at Centre frequency, Q and bandwidth. (April/May 2019)
• Tuned amplifiers are amplifiers that are designed to reject a certain range of frequencies below a lower
cut off frequency ωL and above a upper cut off frequency ωH and allows only a narrow band of frequencies.
• The output across the tuned circuit is coupled to the next stage through the coupling capacitor. The
tuned circuit is formed by L and C resonates at the frequency of operation.
Here Ci and Ceq represent input and output circuits capacitance respectively. They can be given as
27
Ci = Cbe + Cbc (1-A) where A is the voltage gain of the amplifier
Ceq = Cbe( ( A-1) / A)+C where C is the tuned circuit capacitance
The gce is represented as the output resistance of current of generator gmVbe
gce = (1 / rce) = hce – gm*hce = hce = (1/R0)
The admittance of the inductor along with resistor R is given by
1
𝑌=
𝑅 + 𝑗𝜔𝐿
Multiplying numerator and denominator by 𝑅 + 𝑗𝜔𝐿we get
1 𝑅𝑡 𝜔0 𝑗𝜔𝜔0 𝐶𝑅𝑡
𝑌= [1 + + ]
𝑅𝑡 𝑗𝜔𝐿𝜔0 𝜔0
𝑅𝑡
= 𝜔0 𝐶𝑅𝑡 = 𝑄𝑒
𝐿𝜔0
𝜔 𝜔
1 + 𝑗𝑄𝑒 [𝜔 − 𝜔0 ]
0
𝑌=
𝑅𝑡
1 𝑅𝑡
𝑍= =
𝑌 1 + 𝑗𝑄 [ 𝜔 − 𝜔0 ]
𝑒 𝜔 𝜔
0
𝑅𝑡 𝑅𝑡
𝑍= =
1 1 + 𝛿 2 + 2𝛿 − 1
1 + 𝑗𝑄𝑒 [(1 + 𝛿) − ( )] 1 + 𝑗𝑄𝑒 [ ]
1+𝛿 1+𝛿
𝑅𝑡
𝑍=
𝛿
+1
1 + 𝑗2𝑄𝑒 𝛿 [2 ]
1+𝛿
𝑅𝑡
𝑍=
1 + 𝑗2𝑄𝑒 𝛿
At resonance 𝜔 = 𝜔0 , 𝛿 = 0
𝑍 = 𝑅𝑡 = 𝑅0 𝑝𝑎𝑟𝑎𝑙𝑙𝑒𝑙 𝑅𝑃 𝑃𝑎𝑟𝑎𝑙𝑙𝑒𝑙 𝑅
𝜔0𝐿2 𝜔0 𝐿
𝑅𝑃 = =
𝑅 𝜔0 𝐶𝑅
𝑟𝑏′𝑒
𝑉𝑏′𝑒 = 𝑉𝑖
𝑟𝑏𝑏′ + 𝑟𝑏′𝑒
𝑟𝑏 ′ 𝑒
𝑉0 = −𝑔𝑚 𝑉𝑏′ 𝑒 𝑍 = −𝑔𝑚 (𝑉𝑖 )𝑍
𝑟𝑏𝑏′ + 𝑟𝑏′ 𝑒
29
𝑉0 𝑟𝑏 ′ 𝑒
𝐴𝑣 = = −𝑔𝑚 ( )𝑍
𝑉𝑖 𝑟𝑏𝑏′ + 𝑟𝑏′ 𝑒
𝑟𝑏 ′ 𝑒 𝑅𝑡
𝐴𝑣 = −𝑔𝑚 ( )∗
𝑟𝑏𝑏′ + 𝑟𝑏′ 𝑒 1 + 𝑗2𝑄𝑒 𝛿
𝑟𝑏 ′ 𝑒
𝐴𝑣 (𝑎𝑡 𝑟𝑒𝑠𝑜𝑛𝑎𝑛𝑐𝑒) = −𝑔𝑚 ( ) ∗ 𝑅𝑡
𝑟𝑏𝑏′ + 𝑟𝑏′ 𝑒
𝐴𝑣 1
| |=
𝐴𝑣 (𝑎𝑡 𝑟𝑒𝑠𝑜𝑛𝑎𝑛𝑐𝑒) √1 + (2𝛿𝑄𝑒 )2
1
2𝛿 =
𝑄𝑒
1
∆𝜔 = 𝑟𝑎𝑑/𝑠𝑒𝑐
𝑅𝑡 𝐶
𝐴𝑣
Gain plotted against 𝛿
𝐴𝑣 (𝑎𝑡 𝑟𝑒𝑠𝑜𝑛𝑎𝑛𝑐𝑒)
30
Gain and frequency response
8. Draw the frequency response of an ideal and a practical tuned amplifier and discuss their
characteristics. (Nov/Dec 2018)
The amplifier that amplifies a particular frequency and rejects other frequencies are termed as tuned
amplifiers.
Basically the tuned amplifier amplify the signal within a narrow frequency band that is centered about a
frequency f0. The signal between the lower and higher cut-off frequencies is amplified. The resonant
frequency of an ideal tuned circuit is expressed as,
1 1
𝑓0 = 2𝜋√𝐿𝐶 (or) 𝜔0 = [since ω0 = 2πf0]
√𝐿𝐶
Figures 2(a), 2(b) illustrates the ideal response and actual response curve of a tuned amplifier circuit
respectively.
From the figure 2(b), it is observed that at higher and lower cut-off frequencies, the curve decreases and is
maximum at resonant frequency (f0).
Av = β x CR
𝑅𝑖
L
➢ We know that the value of the quantity CR (changes above or below the resonant called impedance of
the tuned circuit) is very high at the resonant frequency and it decreases as the frequency changes
above or below the resonant frequency.
➢ Therefore voltage gain of a tuned amplifier is very high at the resonant frequency and it decreases as
the frequency changes above or below the resonant frequency.
➢ The above facts are shown in the form of a voltage gain versus frequency plot shown in figure below.
32
𝑓𝑜
BW = Δf = f2 – f1 = 𝑄𝑜
Neutralization methods
❖ In a tuned RF amplifier the transistor are used at the frequency near to their unity gain bandwidth. To
amplify the narrow band of high frequencies.
❖ At this frequency inter-junction capacitor b/w base and collector of transistor (Cbc)of transistor
becomes dominant
❖ As a reactance of Cbc at Rf is low and its provide feedback path from a collector to base.
❖ If some feedback signal reaches the input from output in a positive manner with proper phase shift
then the circuit is unstable, generating its own oscillation.
Amplifier, it was necessary to reduce stage gain to a level that ensures the circuit stability
❖ To achieve stability the professor Hazettile introduced a circuit in which the troublesome effects of the
cbc was neutralized by introducing a signal coupled through the Cbc.
HAZELTINE NEUTRALIZATION:-
❖ This is the neutralization technique employed in tuned RF amplifier to maintain stability .
33
❖ The undesired effect of collector to base capacitance of the transistor is neutralized by introducing a
signal which cancels the signal coupled through the collector to base capacitance
❖ This is achieved by a small variable capacitance (CN)is connected from the bottom of coil to the base
of the transistor .It introduce a signal to the base of the transistor such that it cancels out the signal fed
to the base by Cbc
❖ By properly adjusted Cn exactly neutralized achived.
❖ Modified version of Hazeltine neutralization called neutron dyneneutralization.
NEUTRODYNE NEUTRALIZATION:-
❖ In a neutrodyne neutralization technique, Cn is connected to the centre trapped to the secondary coil.
❖ Hence it is connected with Vcc which ensures that it is insensitivity to any variation is supply voltage
Vcc .Hence provided higher neutralization for the tuned amplifier.
❖ In principle, the circuit functions are the same manner as the hazeltine neutralizing capacitor does not
have the supply voltage across it.
34
• It is essential in almost all electronic systems, where a large amount of power is required to be supplied
to the load.
• The power amplifier, is used as a last stage in a electronic system. For example, a public address system
(PAS) consists of a microphone, a multistage amplifier, a power amplifier and a loudspeaker.
• The microphone converts the sound waves into electrical signal, which is of very low voltage (usually of
few millivolts).
• This signal is insufficient to drive the loudspeaker. Therefore this signal is first raised to a sufficiently
high value (a few volts) by passing it through a multistage small-signal (or voltage) amplifier.
• This signal is then used to drive the power amplifier, because it is incapable of delivering a large amount
of power to the loudspeakers.
• A power amplifier is more commonly known as audio amplifier. The audio amplifiers are used in public
address system, tape recorders, stereo systems, television receivers, radio receivers, broadcast
transmitters etc.
• It will be interesting to know that a power amplifier dies not actually amplify the power. As a matter of
fact, it takes power from the d.c. power supply connected to the output circuit and converts it into useful
a.c. signal power.
• The power is fed to the load. The type of a.c. power developed, at the output of a power amplifier, is
controlled by the input signal.
• Thus we can say that actually a power amplifier is a d.c. to a.c. power converter, whose action is
controlled by the input signal.
• The power amplifiers, are also known as large signal amplifiers.
• The term ‘large signal’ for the power amplifiers arises because these amplifiers use a large part of their
a.c. load line for operation.
• It is in contrast to the small signal amplifiers, which use only 10% of their a.c. load line for operation.
The small signal amplifiers are commonly known as voltage amplifiers.
12. Explain in detail the various types of power amplifier. (OR) Explain with circuit diagram class B
power amplifier and derive for its efficiency (Nov/Dec2015)(May 2017)(Nov/Dec-2017)
i. Class-A amplifier:
• A class-A amplifier is one in which the operating point and the input signal are such that the
current in the output circuit, flows at all times.
• A class-A amplifier operates essentially over a linear portion of its characteristics.
• In class-A operation, the transistor stays in the active region throughout the a.c cycle.
• The point and the input signal are such as to make the output current flows for 360°.
• Voltage gain: The voltage gain for a class-A amplifier may be obtained in the same way as the
small-signal amplifier. It is given by the relation,
𝑟
𝐴𝑣 = 𝑟𝐿
𝑒
𝑟𝐿 = A.C. load resistance whose value is equal to the parallel combination of collector
resistance ( 𝑅𝑐 ) and load resistance ( 𝑅𝐿 ).
35
• Current gain: the current gain of a transistor is the ratio of a.c. collector current ( 𝑖𝑐 ) to the a.c.
base current ( 𝑖𝑏 ).
𝑖𝑐
𝐴𝑖 = =β
𝑖𝑏
• Power gain: The a.c. input power to the base of transistor,
𝑃𝑖𝑛 = 𝑉𝑖𝑛 . 𝑖𝑏
• The collector efficiency of the amplifier circuit is defined as the ratio of a.c. power delivered to
the load, to the power supplied by thed.c. source to the transistor.
• Mathematically, collector circuit efficiency,
a.c.power delivered to the load
𝜂𝑐 = power supplied by the d.c.source to the transistor
36
Figure: classification of amplifiers based on the biasing condition
Where 𝐼𝑑𝑐 is the average value of current drawn from the 𝑉𝐶𝐶 supply.
• D.C. power loss in load resistor: Its value is given by the relation,
PRL(dc) = I2dc . RL
• A.C. output power in load resistor: Its value is given by the relation,
37
𝑃𝑜(𝑎𝑐) = I2 .RL = V2 / RL
• Power dissipated within the resistor: Its value is given by the relation,
• For the largest possible output signal, the peak value of the output voltage is equal to the 𝑉𝐶𝐶 supply
(i.e., 𝑉𝑃 = 𝑉𝐶𝐶 ). In the case, the overall efficiency is maximum, and its value,
• The value of collector efficiency is equal to the overall efficiency, whose maximum value is also
78.5%.
Additional Questions:
39
Figure: Push-pull amplifier- class-B
• In the above circuit, both transistors is of NPN type.
• If both are PNP, the supply voltage must be –VCC. but basic diagram is same.
• Input driver transfer driver circuit drives the circuit, then the input signal is applied to the primary of the driver
transformer.
• The centre tap on the secondary of the driver transformer is grounded. The centre tap on the primary of the
output transformer is connected to the supply voltage +VCC.
• Whenever the input signal is under positive half cycle, when point A is positive with respect to B, then the
transistor Q1 is in the active region. But Q2 is under in OFF condition now.So the load gets this positive voltage
drop output across it.
• Then, point B is positive with respect to A under negative half cycle. So, Q1 is in the OFF condition.so the load
gets voltage in negative across it due to negative voltage. This is shown in the waveform.
• For the output transformer, the number of turns of each half of the primary is N1. But in the secondary, it is N2.
• Hence, the total number of turns in primary side of output transformer is 2N1.
• Then turns ratio is 2N1 : N2.
• D.C operation:
✓ The Q-point is adjusted on the X-axis such that, VCEQ = VCC and ICEQ is zero. The coordinates of the Q-point
are (VCC,0). There is no d.c base bias voltage.
• D.C power input:
✓ Each transistor output is in the form of half rectified waveform. Hence, if Im is the peak value of the output
𝐼𝑚
current of each transistor, the dc or AV value is , due to half rectified waveform.
𝜋
✓ Then, two currents drawn by the two transistors, form the A.C supply are in the same direction.
✓ Therefore, the total D.C or average current drawn from the A.C supply is algebraic sum of the
individual average current drawn by each transistor,
𝐼𝑚 𝐼𝑚 2𝐼𝑚
Idc = + = …………..(1)
𝜋 𝜋 𝜋
✓ The total d.c power input is given by,
Pdc = VCC * Idc ……………(2)
2
Pdc = 𝜋VCC .Im …………..(3)
40
Figure: Waveform output
• A.C operation:
✓ When A.C signal is applied to the input driver transformer, for positive half cycle Q1 transistor
is under ON condition. Then, its current flow path is shown in the following diagram.
41
−1
✓ The slope of the a.c load line is , while the d.c load line istheverticalline passing through the
RL’
Q on the X-axis. The load lines are shown below.
= 2
2
* 100 ……(12)
𝑉 .𝐼
𝜋 𝐶𝐶 𝑚
𝜋 𝑉𝑚
=4 ∗ 100 ……..(13)
𝑉𝐶𝐶
• Maximum efficiency:
✓ As the peak value of the collector voltage Vm increases, the efficiency also increases.
✓ Then the maximum value of Vm is possible which is equal to VCC.
𝑃
%η max = 𝑃𝑎𝑐 * 100
𝑑𝑐
𝜋 𝑉𝑚
=4 ∗ 100 = 78.5%
𝑉𝐶𝐶
42
13. Evaluate the (1) operating point (2)differential gain(3)common mode gain(4)CMRR and (5)output
voltage if Vs1=70mV peak to peak at 1 Khz and Vs2=40 mV peak to peak at 1 Khz of dual input
balanced output differential amplitude hie=2.8 KΩ.(Nov/Dec 2016)
1. Operating point value are 𝐼𝐶𝑄 , 𝑉𝐶𝐸𝑄 . Apply KVL to input side.
−𝐼𝐵 𝑅𝑆 − 𝑉𝐵𝐸 − 2𝑅𝐸 𝐼𝐸 + 𝑉𝐸𝐸 = 0
−𝐼𝐸
𝑅 − 𝑉𝐵𝐸 − 2𝑅𝐸 𝐼𝐸 + 𝑉𝐸𝐸 = 0
𝛽 𝑆
𝑉𝐸𝐸 − 𝑉𝐵𝐸
𝐼𝐸 =
𝑅
2𝑅𝐸 + 𝑆
𝛽
𝛽 = ℎ𝑓𝑒 = 100
15 − 0.7
𝐼𝐸 = = 1.051 𝑚𝐴
100
2 × 6.8 × 103 + 100
𝐼𝐶 = 𝐼𝐸 = 1.051 𝑚𝐴
∴ 𝑉𝐶𝐸𝑄 = 10.758 𝑉
ℎ 𝑅𝐶
Differential gain, 𝐴𝑑 = 𝑅 𝑓𝑒+ℎ
𝑠 𝑖𝑒
𝐴𝑑 162.068
𝐶𝑀𝑅𝑅 = = = 474.652
𝐴𝑐 0.3414
Output voltage, 𝑉𝑜 = 𝐴𝑑 𝑉𝑑 + 𝐴𝑐 𝑉𝑐
𝑉𝑑 = 𝑉𝑠1 − 𝑉𝑠2 = 70 − 40 = 30 𝑚𝑉 (𝑃 − 𝑃)
𝑉𝑠1 + 𝑉𝑠2 70 + 40
𝑉𝑐 = = = 55 𝑚𝑉 (𝑃 − 𝑃)
2 2
𝑉𝑜 = 162.068 × 30 × 10−3 + 55 × 10−3 × 0.3414
= 4.86204 + 0.0187
14. A parallel resonant circuit has a capacitor of 250 pF in one branch and inductance of 1.2 mH and a
resistance of 10Ω in parallel branch. Find (1). Resonant frequency (2). Impedance of the circuit at
resonance (3). Q-factor of the circuit. (Nov/Dec 2018)
Solution:
i. Resonant frequency of the parallel tuned circuit is defined as,
1 1 𝑅2
𝑓𝑟 = √ −
2𝜋 𝐿𝐶 𝐿2
1 1 10 𝑋 10
𝑓𝑟 = √ −
2𝜋 1.25 𝑋 10−3 𝑋 250 𝑋 10−12 (1.25 𝑋 10−3 )2
1
𝑓𝑟 = 2𝜋 𝑋 178836.493 = 284.7 X 103 Hz
Zr = 500 KΩ
44
15. Compare voltage and power amplifiers. (Nov/Dec 2018)
1. The amplitude of input A.C signal is small 1. The amplitude of A.C signal is large.
𝑉𝐺𝑆 2
𝐼𝐷 = 𝐼𝐷𝑆𝑆 [1 − ]
𝑉𝑃
−𝐼𝐷 𝑅𝑆 2 𝐼𝐷 𝑅𝑆 2
𝐼𝐷 = 𝐼𝐷𝑆𝑆 [1 − ] = 𝐼𝐷𝑆𝑆 [1 + ]
𝑉𝑃 𝑉𝑃
𝑉𝑆 + 𝑉𝐷𝑆 + 𝐼𝐷 𝑅𝐷 − 𝑉𝐷𝐷 = 0
46
EC8353-ELECTRON DEVICES AND CIRCUITS
PART-A
FEEDBACK AMPLIFIERS
1. Define feedback and feedback factor. Define Positive feedback and Negative feedback.
Feedback: The process of injecting a fraction of the output voltage of an amplifier into the input so that it becomes a
part of the input is known as feedback.
Feedback Factor: Feedback factor is defined as the ratio of feedback signal (Voltage/Current) to the amplifier output
which is given as input to the feedback network. Hence, it is also called as feedback ratio and is denoted by β.
𝑉
i.e., 𝛽 = 𝑉𝑓 ; 𝑉𝑓 − 𝐹𝑒𝑒𝑑𝑏𝑎𝑐𝑘 𝑉𝑜𝑙𝑡𝑎𝑔𝑒 𝑉𝑂 − 𝐴𝑚𝑝𝑙𝑖𝑓𝑖𝑒𝑟 𝑂𝑢𝑡𝑝𝑢𝑡 𝑉𝑜𝑙𝑡𝑎𝑔𝑒
𝑜
Positive feedback: If the feedback voltage is in-phase to the input from the source, i.e., feedback signal in-phase with
the original input signal. It is called positive feedback.
Negative feedback: If the feedback voltage is opposite (out of phase) to the input from the source, i.e., feedback signal
opposes the original input signal. It is called negative or degenerative feedback.
3. Write the disadvantages of negative feedback in amplifier circuits and how it can be overcome? (April/May 2015)
The main disadvantage of using negative or degenerative feedback in amplifier is Reduction in Gain.
The required Gain can be attained by increasing the number of amplifier stages
5. What is the condition required for satisfactory operation of a negative feedback amplifier? (April/May 2019)
The open-loop voltage gain must be much greater than the required closed-loop gain.
𝐴𝑣
Overall Voltage Gain with -ve feedback (Closed-loop Gain), 𝐴𝑣𝑓 = 1+𝛽𝐴
𝑣
𝐴𝑣
𝐴𝑣𝑓 = {𝑆𝑖𝑛𝑐𝑒, 𝛽𝐴𝑣 ≫ 1}
𝛽𝐴𝑣
1
Therefore, 𝐴𝑣𝑓 = 𝛽
{Where 𝐴𝑣 is the voltage gain without a feedback and β is the feedback factor is due to negative feedback the gain is reduced
by factor 1 + 𝛽𝐴𝑣 }
6. With negative feedback the bandwidth of the amplifier increases- True/False?
True.
Bandwidth of amplifier with feedback is greater than bandwidth of amplifier without feedback.
12. Which is the most commonly used feedback arrangement in cascaded amplifier and why? (Nov/Dec-2013-R13)
A voltage series feedback s commonly used in cascaded amplifiers. Since, it has high input impedance and low output
impedance that is needed for cascaded amplifiers.
16. Classify the various oscillators based on the output waveforms, circuit components, operating frequencies and
feedback used.
According to the nature of waveform generated.
1. Sinusoidal or Harmonic Oscillators
2. Non-sinusoidal or Relaxation oscillators
Based on circuit components. (Nov/Dec 2017)
According to the frequency determining networks,
1. RC oscillators (Phase-shift Oscillator and Wien Bridge Oscillator)
2. LC oscillators (Hartley Oscillator and Colpitts Oscillator)
3. Crystal oscillators
17. What are the types of sinusoidal oscillator? [or] Mention the different types of sinusoidal oscillator?
a) RC phase shift Oscillator.
b) Wein bridge Oscillator.
c) Hartley Oscillator
d) Colpitts Oscillator
e) Crystal Oscillator
LC Oscillator RC Oscillator
27. What is the advantage of a colpitts oscillator compared to a phase shift oscillator? (Nov/Dec 2015)
ii) The advantage of colpitts oscillator is the frequency of oscillation is very high.
iii) We can vary the frequency of oscillation.
Crystal oscillators.
31. An oscillator operating at 1 MHz has a stability of 1 in 10 4. What will be the minimum value of frequency generated?
(April/May 2019)
The typical frequency stability of oscillators that do not use CRYSTAL is about 1 in 104.
The minimum value of frequency generated might be 100KHz or lower than 1MHz for the oscillator
operating at 1MHz.
{If the crystal is used, the frequency stability can be improved to better than 1 in 106, which gives a ±1 Hz
variation in the output of a 1 MHz oscillator.}
32. How does an oscillator differ from an amplifier? (or) Differentiate oscillator & amplifier. [Nov/Dec 2013] [Nov/Dec 2016]
1. What is meant by feedback? What are the types of feedback and effects of negative feedback?
(May/June-2012) (Nov/Dec 2017)
Negative feedback
If β is negative, the voltage feedback subtracts from the input yielding a lower output and reduced voltage
gain. Hence this feedback is known as negative feedback.
Positive feedback
If the phase of the voltage feedback is such as to increase the input, then β is positive and the result is
positive feedback.
Increase Stability:
The voltage gain due to a negative feedback is given by
𝐴𝑣
𝐴𝑣𝑓 = … … … … … . . (1)
1+𝛽𝐴𝑣
Where 𝐴𝑣 is the voltage gain without a feedback and β is the feedback factor is due to negative feedback
the gain is reduced by factor 1 + 𝛽𝐴𝑣
𝐴𝑣 1
If 𝛽𝐴𝑣 >> 1 then 𝐴𝑣𝑓 = =
𝛽𝐴𝑣 𝛽
Hence the gain of the amplifier with feedback has been stabilized against such problems as ageing of a transistor or
a transistor being re-placed by a transistor with a different value of β.
𝑑𝐴𝑣𝑓 1
= ((1+𝛽𝐴 2
𝑑𝐴𝑣 𝑣) )
𝑑𝐴
𝑑𝐴𝑣𝑓 = (1+𝛽𝐴𝑣 2
𝑣)
𝑑𝐴𝑣𝑓 𝑑𝐴𝑣
= ((1+𝛽𝐴 2
𝐴𝑣𝑓 𝑣 ) ).𝐴𝑣𝑓
𝐴𝑣
Instead of 𝐴𝑣𝑓 𝑠𝑢𝑏 in above equation
1+𝛽𝐴𝑣
𝑑𝐴𝑣𝑓 𝑑𝐴𝑣
= 𝐴𝑣
𝐴𝑣𝑓 ((1+𝛽𝐴𝑣 )2 ).( )
1+𝛽𝐴𝑣
𝑑𝐴𝑣
=
𝐴𝑣 (1+𝛽𝐴𝑣 )
𝑑𝐴𝑣𝑓
| |
𝐴𝑣𝑓 1
Sensitivity= 𝑑𝐴 = |1+𝛽𝐴 | … … … … … . .4
| 𝑣| 𝑣
𝐴𝑣
𝐷 = 1 + 𝐴𝑣 β … … … … … … . .5
Frequency distortion
From equ 1 we find that for a negative feedback amplifier having 𝐴𝑣 β>> 1 the gain withfeedback is
𝐴𝑣𝑓 =1/β. If the feedback network does not contain any reactive elements the gain is not function of frequency.
Reduction in noise
There are many sources of noise is an amplifier. If the noise present at the output is N and the amplifier
gain is A. then the noise present in the amplifier with negative feedback is
𝑁
N1 = 1+𝛽𝐴 .
𝑣
Reduction in distortion
Let us assume that the distortion in the absence of feedback is D. Because the effect of feedback the
distortion present at the input is equal to
𝐷
𝐷𝑓 = 1+𝛽𝐴
𝑣
Bandwidth
If the bandwidth of an amplifier without feedback is given by
Bwf=BW(1+β𝐴𝑣 )
In curve a source the frequency response of an amplifier without feedback when a negative feedback is
introduced the gain of the amplifier decreases.
Frequency response of an amplifier with and without feedback
Obtain curve C. from fig we can observe that there is decrease in the lower cutoff frequency and increase in upper
cutoff frequency hence the bandwidth increases. Therefore β increases Bandwidth also increases Loop Gain
A loop gain is used to describe the product of voltage gain 𝐴𝑣 and feedback factor β. The amount of
feedback introduced into an amplifier may be expressed in decibels according to the following definition.
F=feedback in db
𝐴𝑣𝑓
= 20 log
𝐴𝑣
1
= 20 log
1 + 𝛽𝐴𝑣
The negative feedback increases amplifier bandwidth which can be proven mathematically as
below
TYPES OF NEGATIVE FEEDBACK AMPLIFIER
Feedback amplifier, the output signal sampled may be either voltage or current and sampled signal can be
mixed either is series or in shunt with the input
➢ Voltage series feedback amplifier (Series-Shunt feedback amplifier) (Nov/Dec 2016) (May 2017)
➢ Current Series Feedback Amplifier (Shunt-Series feedback amplifier)
➢ Current Shunt Feedback Amplifier (Series-Series feedback amplifier) (May 2017)
➢ Voltage Shunt Feedback Amplifier (Shunt-Shunt feedback amplifier)
• Ri – input resistance
• Rs – source resistance
• RL – load resistance
• RO – output resistance
• AV – voltage gain
• Ri >> RS then Vi = Vs
• RL >> Ro then Vo = AVVi = Av Vs
• Amplifier provides a voltage output proportional to the voltage input
• The proportionality factor does not depend on magnitudes of the source an load resistance
• Hence it is called voltage amplifier
Feedback Topology
Input resistance
Output Resistance
Step 1: Equivalent circuit
𝑅𝑂
𝑅𝑂𝑓 𝑋 𝑅𝐿 ( ) 𝑋 𝑅𝐿
’ 1+𝛽𝐴𝑉
R of = Rof || RL = = 𝑅𝑂
𝑅𝑂𝑓 + 𝑅𝐿 + 𝑅𝐿
(1+𝛽𝐴𝑉 )
RO RL RO RL
= =
RO +RL (1+βAV ) RO +RL +βAV RL
′
𝑅𝑜′
𝑅𝑜𝑓 =
1 + 𝛽𝐴𝑣
• Ri – input resistance
• Rs – source resistance
• RL – load resistance
• RO – output resistance
• AI – current gain
• Rs >> Ri and Ii = Is
• Ro >> RL IL = AI Ii
• Amplifier provides a current output proportional to the current input
• The proportionality factor does not independent on source and load resistance
• Hence it is called current amplifier
Feedback Topology
Input Resistance
Step 1: equivalent circuit
Step 2: obtain expression for VS
Applying KVL to the input side we get,
VS – Ii Ri – Vf = 0 ⸫ Vs = Ii Ri + Vf = Ii Ri + βIo
⸫ Vf = βIo
VS = Ii Ri + β GM Vi = Ii Ri + β GM Ii Ri {Since, Vi = Ii Ri}
Output Resistance
𝑉
𝐼= − 𝐺𝑚 𝑉𝑖
𝑅𝑜
𝑉
𝑅𝑜𝑓 = = 𝑅𝑜 (1 + 𝐺𝑚 β)
𝐼
′
𝑅𝑜𝑓 𝑋 𝑅𝐿
𝑅𝑜𝑓 = 𝑅𝑜𝑓 ||𝑅𝐿 =
𝑅𝑜𝑓 + 𝑅𝐿
𝑅𝐿 𝑅𝑜 (1 + β𝐺𝑚 )
𝑅𝑜 + 𝑅𝐿
𝑅𝑓𝑜 =
β𝐺𝑚 𝑅𝑜
1+𝑅 +
𝑜 𝑅𝐿
′
𝑅𝑜′ (1 + β𝐺𝑚 ) 𝑅𝑜 𝑅𝐿 𝐺𝑚 𝑅𝑜
𝑅𝑜𝑓 = ⸫𝑅𝑜′ = 𝑎𝑛𝑑 𝐺𝑀 =
1 + β𝐺𝑚 𝑅𝑜 + 𝑅𝐿 𝑅𝑜 + 𝑅𝐿
Feedback Topology
Input Resistance
Is = Ii + If = Ii + β Vo ⸫ If = β Vo
Is = Ii + β RM Ii = Ii (1+ β RM)
𝑅𝑖
⸫ 𝑅𝑖𝑓 =
(1+β𝑅𝑀 )
Output Resistance
Ii = - If = - β V
𝑅𝑜 𝑋 𝑅𝐿
′
𝑅𝑜𝑓 𝑋 𝑅𝐿 1 + 𝑅𝑚 β 𝑅𝑜 𝑅𝐿
𝑅𝑜𝑓 = 𝑅𝑜𝑓 ||𝑅𝐿 = = =
𝑅𝑜𝑓 + 𝑅𝐿 𝑅𝑜 𝑅𝑜 + 𝑅𝐿 (1 + 𝑅𝑚 β)
+ 𝑅𝐿
1 + 𝑅𝑚 β
𝑅𝑜 𝑅𝐿
′ 𝑅𝑜 + 𝑅𝐿
𝑅𝑓𝑜 =
β𝑅𝑚 𝑅𝐿
1+
𝑅𝑜 + 𝑅𝐿
′ 𝑅𝑜′ 𝑅𝐿 𝑋 𝑅𝑜𝑓 𝑅𝑚 𝑅𝐿
𝑅𝑓𝑜 = where 𝑅𝑜′ = 𝑎𝑛𝑑 𝑅𝑀 =
1+β𝑅𝑀 𝑅𝐿 +𝑅𝑜𝑓 (𝑅𝑜 +𝑅𝐿 )
(D) Current Shunt Amplifier:
Input Resistance
Step 1: Equivalent Circuit
Is = Ii + If = Ii + β Io ⸫ If = β Io
Is = Ii + β AI Ii = Ii (1+ β AI)
𝑅𝑖
𝑅𝑖𝑓 =
(1 + β𝐴𝐼 )
Output Resistance
Step 1: Equivalent Circuit
𝑉
𝐼= − 𝐴𝑖 𝐼𝑖
𝑅𝑜
Ii = - If = - β Io ⸫ Is = 0
Ii = β I ⸫ I = - Io
′
𝑅𝑜𝑓 𝑋 𝑅𝐿
𝑅𝑜𝑓 = 𝑅𝑜𝑓 ||𝑅𝐿 =
𝑅𝑜𝑓 + 𝑅𝐿
′
𝑅𝑜′ (1 + β𝐴𝑖 )
𝑅𝑜𝑓 =
(1 + β𝐴𝐼 )
𝑅𝑜 𝑅𝐿 𝐴𝑖 𝑅𝑜
𝑅𝑜′ = 𝑎𝑛𝑑 𝐴𝐼 =
𝑅𝑜 +𝑅𝐿 𝑅𝑜 +𝑅𝐿
OSCILLATORS:
5. Explain the construction and working of the following oscillators and derive the expression for
frequency of oscillation. Also, write about advantages and disadvantages.
A. Phase-Shift Oscillator (RC type Oscillator)
B. Wein Bridge Oscillator (RC type Oscillator)
C. Hartley Oscillator (LC type Oscillator)
D. Colpitts Oscillator (LC type Oscillator)
E. Crystal Oscillator
Analysis of RC circuit:
• In this circuit output is taken across resistor R.
1
• The capacitive reactance XC is given by 𝑋𝐶 = 2𝜋𝑓𝐶 Ω where f is frequency of the input.
• The total impedance of the circuit is,
1
𝑍 = 𝑅 − 𝑗𝑋𝐶 = 𝑅 − 𝑗 ( ) Ω
2𝜋𝑓𝐶
= |𝑍| < −Ф0 Ω
• The current ‘I’ flowing in the circuit is,
𝑉𝑖 < 00 𝑉𝑖 < 00 𝑉𝑖
𝐼= = 0
= | | < +Ф0 𝐴
𝑍 |𝑍| < −Ф 𝑍
𝑋𝐶
|𝑍| =√𝑅 2 + 𝑋𝐶2 𝑎𝑛𝑑 Ф = tan−1
𝑅
• In this equation the current ‘I’ leads input voltage by angle Ф
• The output voltage is drop across R hence VO=VR=IR
• The output voltage is in phase with current hence it leads input voltage by angle Ф
• Thus, RC circuit introduces a phase shift Ф between input and output which depends on R, C and frequency f.
• Replacing the transistor by its approximate h-parameter model, the equivalent circuit of RC
phase shift oscillator is shown in fig.
• It is known that R = hie + R3 and replace current source by equivalent voltage source.
𝑅𝐶
• The ratio of resistance RC to R is K. =𝐾
𝑅
• The modified equivalent circuit is shown below
• Applying KVL to the three loops
1
𝐼1 𝑅𝐶 − 𝐼 − 𝑅(𝐼1 − 𝐼2 ) − ℎ𝑓𝑒 𝐼𝑏 𝑅𝑐 = 0 𝑎𝑛𝑑 𝑢𝑠𝑒 𝑅𝐶 = 𝑘 𝑅
𝑗𝜔𝐶 1
1
⸫ 𝐼1 [𝑘𝑅 + 𝑅 + ] + 𝐼2 𝑅 = ℎ𝑓𝑒 𝐼𝑏 𝑘 𝑅 ------ eq. 3
𝑗𝜔𝐶
1 1
− 𝐼2 − 𝑅(𝐼2 − 𝐼1 ) − 𝑅(𝐼2 − 𝐼3 ) = 0 𝑖. 𝑒 𝐼1 𝑅 − 𝐼2 (2𝑅 + ) + 𝐼3 𝑅 = 0 ---- eq. 4
𝑗𝜔𝐶 𝑗𝜔𝐶
1 1
− 𝐼3 − 𝐼3 𝑅 − 𝑅(𝐼3 − 𝐼2 ) = 0 𝑖. 𝑒 𝐼2 𝑅 − 𝐼3 (2𝑅 + ) = 0 ---- eq. 5
𝑗𝜔𝐶 𝑗𝜔𝐶
• Using jω = s and Cramers’s rule
1
−(𝑘 + 1)𝑅 − +𝑅 0
𝑠𝐶
| 1 |
𝐷= 𝑅 −2𝑅 − 𝑅
| 𝑠𝐶 |
1
0 𝑅 −2𝑅 −
𝑠𝐶
• Solving the determinant, we get,
𝑠3 𝐶 3 𝑅 3 (3𝑘+1)+𝑠2 𝐶 2 𝑅 2 (4𝑘+6)+𝑠𝑅𝐶(5+𝑘)+1
𝐷 = −{ } ---- eq. 6
𝑠3 𝐶 3
𝐷3 −𝑘𝑅 3 ℎ𝑓𝑒 𝐼𝑏 𝑠3 𝐶 3
𝐼3 = = ------- eq. 8
𝐷 𝑠3 𝐶 3 𝑅 3 (3𝑘+1)+𝑠2 𝐶 2 𝑅 2 (4𝑘+6)+𝑠𝑅𝐶(5+𝑘)+1
To satisfy Barkhausen criterion, <Aβ = 00 hence imaginary part of the denominator term
must be 0
⸫ α3 – 4kα - 6α = 0 i.e. α ( α2 – 4 k – 6 ) = 0
29
⸫ ℎ𝑓𝑒 = 4𝑘 + 23𝑘 +
𝑘
• For satisfying Aβ = 1, the expression for the value of hfe of the transistor used in RC phase
shift oscillator is given by,
29 𝑅𝐶
hfe ≥ 4 k +23 + where k =
𝑘 𝑅
• For minimum hfe, find k for minimum hfe from the expression
𝑑ℎ𝑓𝑒
𝑑𝑘
=0
𝑑 29 29 29
⸫ [4𝑘 + 23 + ] = 0 i.e. 4 − = 0 i.e. 𝑘 2 =
𝑑𝑘 𝑘 𝑘2 4
k = 2.6925 for minimum hfe
using in the expression of hfe,
29
hfe (min) = 4 X 2.6925 + 23 + = 44.54
2.6925
Thus for the circuit to oscillate, the transistor must be selected with hfe greater than 44.54
Advantages:
Disadvantages:
• To vary the frequency, values of R and C of all three sections are to be varied simultaneously which is
practically difficult. Hence frequency cannot be varied
• Frequency stability is poor due to changes in the values of various components due to effect temperature,
aging etc.
(B) WEIN BRIDGE OSCILLATOR: (RC Oscillator)
Explain the working of Wien Bridge Oscillator. Derive the expression for frequency of oscillation and
condition for maintenance of oscillation.
(OR)
Design an oscillator to operate at a frequency of 10 KHz which gives an extremely pure sine
wave output, good frequency stability and highly stabilized amplitude. Discuss the operation
of this oscillator as an audio signal generator.
𝜔2 𝑅2 𝐶1 (𝑅1 𝐶1 + 𝑅2 𝐶2 + 𝑅2 𝐶1 ) + 𝑗𝜔𝐶1 𝑅2 (1 − 𝜔2 𝑅1 𝑅2 𝐶1 𝐶2 )
𝛽= (10)
(1 − 𝜔 2 𝑅1 𝑅2 𝐶1 𝐶2 )2 + 𝜔 2 (𝑅1 𝐶1 + 𝑅2 𝐶2 + 𝑅2 𝐶1 )2
To have zero phase shift, imaginary part of above equation must be zero.
(1 − 𝜔2 𝑅1 𝑅2 𝐶1 𝐶2 ) = 0
𝟏
𝐹𝑟𝑒𝑞𝑢𝑒𝑛𝑐𝑦 𝑜𝑓 𝑊𝑖𝑒𝑛 𝐵𝑟𝑖𝑑𝑔𝑒 𝑂𝑠𝑐𝑖𝑙𝑙𝑎𝑡𝑜𝑟, 𝒇 = Hz (12)
𝟐𝝅√𝑹𝟏 𝑹𝟐 𝑪𝟏 𝑪𝟐
Thus, the gain of amplifier stage must be at least 3 to ensure sustained oscillations in Wien Bridge
Oscillator.
1
Case (2): If 𝑅1 ≠ 𝑅2 and 𝐶1 ≠ 𝐶2 then use 𝜔 = 𝑖𝑛 (10) 𝑡ℎ𝑒𝑛
√𝑅1 𝑅2 𝐶1 𝐶2
𝑹𝟐 𝑪𝟏 𝑹𝟏 𝑪𝟏 + 𝑹𝟐 𝑪𝟐 + 𝑹𝟐 𝑪𝟏 𝟐
𝜷= ⇒∴𝑨≥ {∵ |𝐴𝛽| ≥ 1}
𝑹𝟏 𝑪𝟏 + 𝑹𝟐 𝑪𝟐 + 𝑹𝟐 𝑪𝟏 𝑹𝟐 𝑪𝟏
LC OSCILLATORS:
Outline the LC tuned Oscillator and deduce expression for amplifier Gain, feedback Gain
and necessary condition for LC Oscillator in general.
Analysis of Amplifier stage
Applying KVL,
𝐴𝑉 𝑉𝑖
𝐼=− and 𝑉𝑂 = 𝐼𝑍𝐿
𝑅𝑜 +𝑍𝐿
𝑽𝒐 𝑨𝑽 𝒁𝑳
𝑨= =−
𝑽𝒊 𝑹𝒐 + 𝒁𝑳
𝑉𝑓 𝑍1
i.e. 𝛽 = =
𝑉𝑜 𝑍1 +𝑍3
Circuit diagram
Construction:
• The Hartley oscillator circuit using BJT as an active device.
• The resistances R1, R2 and RE are biasing resistors
• The RFC is radio frequency chock whose reactance value is very high and high frequency and can be
treated as open circuit. While for d.c operation, it is shorted hence does not cause problems for d.c
operation.
• Due to RFC, the isolation between a.c and d.c operation is achieved. The C1 and C2 are coupling capacitors
while CE is the emitter bypass capacitor. The CE amplifier provides phase shift of 1800.
• In the feedback circuit, as the centre of L1 and L2 is grounded, it provides additional phase shift of 1800.
This satisfies Barkhausen condition. In this oscillator, X1 = ωL1,
X2 = ωL2, X3 = -1/ωC
Analysis:
1
i.e 𝜔(𝐿1 + 𝐿2 ) =
𝜔𝑐
1 1
⸫ 𝜔= i.e 𝑓 =
√(𝐿1 + 𝐿2 )𝐶 2𝜋√(𝐿1 + 𝐿2 )𝐶
• The inductance L1+L2 is equivalent inductance denoted as Leq. To satisfy |Aβ| = 1, then hfe of
the BJT used must be L1/L2.
𝐿1
ℎ𝑓𝑒 =
𝐿2
• Practically L1 and L2 are wound on a single core and there exists a mutual inductance M
between them.
In this case, 𝐿𝑒𝑞 = 𝐿1 + 𝐿2 + 2𝑀
1 𝐿1 +𝑀
𝑓= and ℎ𝑓𝑒 =
2𝜋√𝐿𝑒𝑞 𝐶 𝐿2 +𝑀
• If capacitor C is kept variable, frequency can be varied over wide range.
1
⸫ 1 − 𝜔3 𝐶(𝐿1 + 𝐿2 ) = 0 𝑖. 𝑒 𝜔 = (𝜔3 ℎ𝑓𝑒 ℎ𝑖𝑒 𝐿1 𝐿2 𝐶 ≠ 0)
√𝐶(𝐿1 +𝐿2 )
1 1
𝑓= =
2𝜋√𝐶(𝐿1 + 𝐿2 ) 2𝜋√𝐶𝐿𝑒𝑞
1
• Equating magnitude of both sides of the equation and using 𝜔 = 𝑤𝑒 𝑔𝑒𝑡
√𝐶(𝐿1 +𝐿2 )
𝐿1
ℎ𝑓𝑒 = ℎ𝑓𝑒 𝑟𝑒𝑞𝑢𝑖𝑟𝑒𝑑 𝑓𝑜𝑟 𝑜𝑠𝑐𝑖𝑙𝑙𝑎𝑡𝑖𝑜𝑛
𝐿2
• In practice, L1 and L2 may be wound on a single core so that there exists a mutual
inductance between them denoted as M.
• In such a case, the mutual inductance is considered while determining the equivalent
inductance Leq, Leq = L1+L2+2M
• If L1 and L2 are assisting each other, then sign of 2M is positive while if L1 and L2 are in
series opposition then sign of 2M is negative.
Advantage:
• The frequency can be easily varied by variable capacitor
• The output amplitude remains constant over the frequency range
• The feedback ratio of L1 and L2 remains constant
• It can be operated over wide range of frequency
Disadvantage:
• The output is rich in harmonics hence not suitable for pure sine wave requirement
• Poor frequency stability
Applications:
• Used as local oscillators in TV and radio receivers
• In function generators
• In radio frequency sources
Construction:
• It uses two capacitive resistances and one inductive reactance in its feedback network.
• The amplifier stage uses BJT in common emitter configuration providing 180o phase shift. The resistance
R1, R2 and RE are the biasing resistors.
• The RFC is radio frequency choke providing insulation between AC and DC operations. The CC1 and CC2
are coupling capacitors. In the feedback circuit, as the center C1 and C2 are grounded, it provides additional
phase shift of 1800, satisfying Barkhausen angle condition.
−1 −1
• In this oscillator 𝑋1 = 𝑋2 = 𝑋3 = 𝜔𝐿
𝜔𝐶1 𝜔𝐶2
• For LC oscillator, X1+X2+X3=0
1 1 1 1 1
⸫ − − + 𝜔𝐿 = 0 i.e 𝜔𝐿 = [ + ]
𝜔𝐶1 𝜔𝐶2 𝜔 𝐶1 𝐶2
1 𝐶1 𝐶2
⸫𝜔2 = 𝐶 𝐶 where = 𝐶𝑒𝑞
𝐿[ 1 2 ] 𝐶1 +𝐶2
𝐶1 +𝐶2
1 1 𝐶1 𝐶2
⸫ 𝜔= i.e 𝑓 = 𝑎𝑛𝑑 𝐶𝑒𝑞 =
√𝐿𝐶𝑒𝑞 2𝜋√𝐿𝐶𝑒𝑞 𝐶1 +𝐶2
−𝑗ℎ𝑓𝑒 𝐼𝑏 1 𝑗
𝑉0 = ℎ𝑓𝑒 𝐼𝑏 𝑋𝐶2 = ….. 𝑋𝐶2 = =−
𝜔𝐶2 𝑗𝜔𝐶2 𝜔𝐶2
1 1 𝐶1 𝐶2
𝜔= 𝑎𝑛𝑑 𝑓 = 𝑤ℎ𝑒𝑟𝑒 𝐶𝑒𝑞 =
√𝐿𝐶𝑒𝑞 2𝜋√𝐿𝐶𝑒𝑞 𝐶1 + 𝐶2
𝐶2
ℎ𝑓𝑒 =
𝐶1
Advantages:
• Pure output waveform
• Good stability at high frequency
• Improved performance at high frequency
• Wide range of frequency
• Simple construction
•
Disadvantages:
• Difficult to adjust the feedback
• Poor isolation
Applications:
• Its main application is high frequency function generators.
(E) CRYSTAL OSCILLATOR:
Describe and explain the operation of the crystal oscillator.
(OR)
Can you use Piezo-Electric effect for electric oscillators? If so, explain a
component with such characteristics. Also draw a circuit for the same.
• The crystals are either naturally occurring or synthetically manufactured, exhibiting the piezoelectric effect
• The piezoelectric effect means under the influence of mechanical pressure, the voltage gets generated
across the opposite faces of the crystal
• If the mechanical force is applied in such a way to force the crystal to vibrate the a.c voltage gets generated
across it.
• Every crystal has its own resonating frequency depending on its cut. So under the influence of the
mechanical vibrations, the crystal generates an electrical signal of very constant frequency
• The crystal has a greater stability in holding the constant frequency. The crystal oscillators are preferred
when greater frequency stability is stability
• Quartz is a compromise between the piezoelectric activity of Rochelle salt and the strength of the
tourmaline.
• Quartz is inexpensive and easily available in nature hence very commonly used in the crystal oscillators.
Constructional Details:
• The natural shape of quartz is a hexagonal prism. But for its practical use, it is cut to the rectangular slab.
This slab is then mounted between the two metal plates.
• The metal plates are called holding plates, as they hold the crystal slab in between them.
• RLC forms a resonating circuit. The expression for the resonating frequency fr is,
1 𝑄2
𝑓𝑟 = 2𝜋√𝐿𝐶 √1+𝑄2 where Q = Quality factor of crystal
𝜔𝐿
𝑄=
𝑅
𝑄2
• The Q factor of the crystal is very high, typically 20,000. Value of Q up to 106 also can be achieved. Hence √1+𝑄2
1
factor approaches to unity and we get the resonating frequency as 𝑓𝑟 = 2𝜋
√𝐿𝐶
• The crystal frequency is in fact inversely proportional to the thickness of the crystal.
1
• f α 𝑡 where t = Thickness
• So to have very frequencies, thickness of the crystal should be very small
• The crystal has two resonating frequencies, series resonant frequency and parallel resonant frequency.
Applications
• Watches
• Communication transmitters and receivers
1
𝑓𝑠 =
2𝜋√𝐿𝐶
Crystal Stability:
i. Temperature stability
ii. Long term stability
iii. Short term stability
Solved Problems
1. In a Hartley oscillator, if L1=0.2mH, L2=0.3mH and C=0.003µF. Calculate the frequency of oscillations.
[MAY 2012]
Given: L1=0.2mH, L2=0.3mH, C=0.003µF
To find frequency of oscillations f=1/(2π√[(L1+L2) C)] by substituting f=129.949KHz
3. In a phase shift oscillator, R1=R2=R3=1 MΩ and C1=C2=C3=68 pF. At what frequency does the circuit
oscillate. (Nov/Dec 2018)
Given that,
For a phase shift oscillator, Resistance, R1 = R2 = R3 = 1 MΩ; Capacitor, C1 = C2 = C3 = 68 pF
Frequency, f = ?
1
Frequency of phase shift oscillator is given by, 𝑓 = 2𝜋𝑅𝐶√6
1 frequency, f = 955.9 Hz
Substituting corresponding values in above equation ,𝑓 = 2𝜋 𝑋 1𝑋106 𝑋 68 𝑋 = 955.9 𝐻𝑧
√6
4. A wien bridge oscillator is used for operation at 10KHz. If the value of the resistor R is 100Kohms, what
is the value of C required?
Solution:
Given: F = 10KHZ, R = 100KΩ, C= ?
The frequency of oscillation is
1 1 1
F =2𝜋𝑅𝐶 C = 2𝜋𝑅𝐹 C= 2𝜋×100×103×10×103
C = 1.591× 𝟏𝟎−𝟏𝟎 F
5. An amplifier has a c urrent gain of 240 and input impedance of 15 k Ω without feedback. If negative
current feedback (mi = 0.015) is applied, what will be the input impedance of the amplifier? (Nov/Dec
2017)
7. A 1 mH inductor is available. Find the capacitor values of a colpitt’s oscillator so that f=1 MHz and
feedback fraction=0.25 (Nov/Dec 2018)
Solution:
Given that,
For a Colpitts oscillator,
Inductance, L = 1 mH
Resonant frequency, f0 = 1 MHz
Feedback factor, β = 0.25
The resonant frequency of Colpitts oscillator is given by,
1
𝑓0 = − − − −(1)
2𝜋√𝐿𝐶𝑒𝑞
𝐶 𝐶
Where,𝐶𝑒𝑞 = 𝐶 1+𝐶2
1 2
From equation (1),
1
𝐶𝑒𝑞 = 2 2 − − − −(2)
4𝜋 𝑓0 𝐿
𝐶1
Given feedback factor, 𝛽 = = 0.25
𝐶2
C2 = 4C1
Substituting the given specifications in equation (2)
1
𝐶𝑒𝑞 =
4𝜋 2 (106 )2 𝑋 10−3
𝐶1 𝐶2
= 2.533 𝑋 10−11
𝐶1 + 𝐶2
4𝐶12
= 2.53 𝑋 10−11
5𝐶1
C1 = 3.166 X 10-11 = 31.66 pF
From C2 = 4C1,
C2 = 4 X (3.166 X 10-11)
C2 = 126.65 pF
8. The overall gain of a multistage amplifier is 140. When negative voltage feedback is applied the gain is
reduced to 17.5 find the fraction of the output that is feedback to the input. (Nov/Dec 2018)
Given that,
For a multistage feedback amplifier,
Overall gain, AV = 140
Feedback gain, Avf = 17.5
Feedback fraction, β = ?
Voltage gain of negative feedback amplifier is defined as,
𝐴𝑣 40
𝐴𝑣𝑓 = 17.5 =
1 + 𝐴𝑣 𝛽 1 + 140𝛽
17.5 + 2450 β = 140
1
𝛽 = 20 = 0.05
β = 0.05
9. In colpitts oscillator C1 = 1nF and C2 = 100nF. If the frequency of oscillation is 1 kHz find the value of
inductor. Also find the minimum gain required for obtaining sustained oscillations. (May / Jun 2016)
Given data:
Formulae used:
1 𝐶1+𝐶2 𝐶1
𝑓 = 2𝑛 √𝐿1𝐶1𝐶2 , 𝐴𝑉 = 𝐶2
𝐶1+𝐶2 101×10−6
Frequency of oscillations 𝐿 = 4𝑛2 𝑓2𝐶1𝐶2 = 4𝑛2 ×(10×1000)2×100×10−12
𝑟
101×106 101
= 4𝑛2 ×(100000)2 = 3.99 × 10−5 = 25.634 × 10−5 𝐻 = 256.34𝜇𝐹
𝐶1 1
𝐴𝑉 > = = 0.01𝑛𝐹
𝐶2 100
10. Design a RC phase Shift Oscillator to generate 5KHz sine wave with 20 V peak to Peak amplitude.
Assume hfe=𝜷 = 𝟏𝟓𝟎, 𝑪 = 𝟏. 𝟓𝒏𝑭, hre=1.2KΩ(Nov.Dec 2016)
1 1 1
𝑓= ; 5 × 103 = −9 𝑅=
2𝜋𝑅𝑐√6 2𝜋×1.5×10 √6×𝑅 2𝜋×1.5×10 ×√6×5×103
−9
𝑅 = 8.67 𝑘 𝛺
11. In Colpitts Oscillator, the desired frequency is 500 KHz. Find the value of L. Assume C= 1000pF.
(Apr/May 2018)
12. When negative voltage feedback is applied to an amplifier of gain 100, the overall gain falls to 50.
Calculate the fraction of the output voltage fedback. If this fraction is maintained, calculate the value of
the amplifier gain required if the overall stage gain is to be 75. (Nov/Dec 2017)
13. In Colpitts oscillator, C1 = C2 =C and L=100 X 10-6 H. The frequency of oscillation is 500 KHz.
Determine the value of C. (Apr/May 2018)
14. An amplifier in required with a voltage gain of 100 which does not vary by more that 1%. If it is to use
negative feedback with a basic amplifier the voltage gain of which vary by 20%, find the minimum
voltage gain required and the feedback factor. (Nov/Dec 2018)
Solution:
Closed loop voltage gain of amplifier, Af is defined as,
𝐴𝑚
𝐴𝑓 = − − − − − (1)
1 + 𝐴𝑚 𝛽
𝐴𝑚
100 =
1 + 𝐴𝑚 𝛽
𝐴𝑚 = 100 + 100 𝐴𝑚 𝛽 − − − − − (2)
Since, feedback voltage gain, Af does not vary more than 1% and amplifier gain varies by 20% equation (1) can
be written as,
0.8 𝐴𝑚
99 =
1 + 0.8 𝐴𝑚 𝛽
0.8 𝐴𝑚 = 99 + 79.2 𝐴𝑚 𝛽 − − − − − (3)
Multiplying equation (1) with 0.792 or both sides,
0.792 𝐴𝑀 = 79.2 + 79.2 𝐴𝑚 𝛽 − − − − − (4)
Subtracting equation (3) and (4),
19.8
0.008 Am = 19.8; 𝐴𝑚 = Am = 2475
0.008
Substituting Am in equation (2),
2475 = 100 + 100 X 2475 X β
2475 − 100
𝛽= β = 0.0096
2475 𝑋 100
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Additional Important Questions:
6. Discuss the effect for the following negative feedback amplifiers and derive the expression for input
resistance, output resistance and voltage gain for common emitter amplifier.
A. VOLTAGE SERIES FEEDBACK
B. VOLTAGE SHUNTFEEDBACK
C. CURRENT SERIES FEEDBACK
D. CURRENT SHUNT FEEDBACK
Draw circuit of CE amplifier with Voltage Series feedback and obtain the expression for feedback ratio, voltage
gain, input and output resistances.
𝑉𝑓
𝑉𝑜𝑙𝑡𝑎𝑔𝑒 𝑓𝑒𝑒𝑑𝑏𝑎𝑐𝑘 𝑓𝑎𝑐𝑡𝑜𝑟 𝛽 =
𝑉𝑜
Gain
𝑉
Amplifier Gain 𝐴𝑣 = 𝑉𝑜
𝑖
𝑉𝑜 = 𝐴𝑣 𝑉𝑖 − − − (1)
Feedback is connected 𝑉𝑠 = 𝑉𝑖 + 𝑉𝑓 ; 𝑉𝑖 = 𝑉𝑠 − 𝑉𝑓
Now 𝑉𝑠 = 𝑉𝑖 + 𝛽 𝑉𝑜 = 𝑉𝑖 + 𝛽𝐴𝑣 𝑉𝑖
𝑉𝑠 = 𝑉𝑖 (1 + 𝐴 𝛽) − − − (2)
𝑉𝑖 = 𝑉𝑠 − 𝑉𝑓 & 𝑉𝑖 = 𝐼𝑖 𝑅𝑖
∴ 𝑉𝑠 = 𝑉𝑖 + 𝑉𝑓 = 𝐼𝑖 𝑅𝑖 + 𝐴 𝛽 𝑉𝑖
= 𝐼𝑖 𝑅𝑖 + 𝐴 𝛽 𝑅𝑖 𝐼𝑖
𝑉𝑠 = 𝑅𝑖 𝐼𝑖 (1 + 𝐴 𝛽)
𝑉𝑖 𝐼𝑖 𝑅𝑖 (1+𝐴 𝛽)
Now, Input Impedance 𝑍𝑖𝑓 = 𝐼𝑖
= 𝐼𝑖
𝑉𝑖
= (1 + 𝐴 𝛽)
𝐼𝑖
𝑍𝑖𝑓 = 𝑍𝑖 (1 + 𝐴 𝛽)
𝑉𝑠 = 0
𝑉𝑖 = −𝑉𝑃 = 𝛽𝑉𝑜
∴ 𝑉𝑜 = 𝐼𝑜 𝑅𝑜 − 𝐴 𝛽𝑉𝑜
𝑉𝑜 + 𝐴 𝛽𝑉𝑜 = 𝐼𝑜 𝑅𝑜
𝑉𝑜 (1 + 𝐴 𝛽) = 𝐼𝑜 𝑅𝑜
𝑉𝑜 𝑅𝑜
=
𝐼𝑜 1 + 𝐴 𝛽
𝑅𝑜
𝑍𝑜 =
1+𝐴𝛽
𝐼𝑒 𝐼𝑏 + 𝐼𝑐
𝐴𝑖 = = = 1 + ℎ𝑓𝑒
𝐼𝑏 𝐼𝑏
ℎ𝑖𝑒 + 𝑅𝑠
𝑅𝑜 =
1 + ℎ𝑓𝑒
𝑅𝑜𝑓 = 𝑅𝑜 ⃦ 𝑅𝑐
Draw circuit of CE amplifier with Voltage Shunt feedback and obtain the expression for feedback ratio, voltage
gain, input and output resistances. (April / May 2015 -R13)
Connection Diagram:
𝑉𝑜 𝑉𝑜
𝐺𝑎𝑖𝑛 ∶ 𝐴𝐹 = =
𝐼𝑠 𝐼𝑖
𝐼𝑠 = 𝐼𝑖 + 𝐼𝑓
= 𝐼𝑖 + 𝛽 𝑉𝑜
𝐼𝑠 = 𝐼𝑖 + 𝐴 𝛽𝐼𝑖 = 𝐼𝑖 (1 + 𝐴𝛽)
𝑉𝑜 𝐴𝐼
𝑖 𝐴
𝐴𝐹 = 𝐼𝑠
= 𝐼 (1+𝐴𝛽) = 1+𝐴𝛽 𝑤𝑖𝑡ℎ𝑜𝑢𝑡 𝑓𝑒𝑒𝑑𝑏𝑎𝑐𝑘.
𝑖
𝑖 𝑍
𝑍𝑖 = (1+𝐴𝛽)
Input impedance is reduced by the factor (1 + 𝐴𝛽) for both series, shunt feedback connection.
Output Impedance
= 𝑅𝑜 𝐼𝑜 − 𝐴 𝐼𝐹 ∴ 𝐼𝑖 = −𝐼𝐹
𝑉𝑜 + 𝐴𝛽 𝑉𝑜 = 𝑅𝑜 𝐼𝑜 𝑉𝑜 (1 + 𝐴𝛽) = 𝑅𝑜 𝐼𝑜
𝑉𝑜 𝑅𝑜 𝑉𝑜 𝑜 𝑅
𝐼𝑜
= 1+𝐴𝛽 𝑍𝑜 = 𝐼𝑜
= 1+𝐴𝛽
Draw circuit of CE amplifier with Current Shunt feedback and obtain the expression for feedback ratio, voltage
gain, input and output resistances. (April / May 2015 -R13)
Connection Diagram
𝑉𝑜
𝐴𝑚𝑝𝑙𝑖𝑓𝑖𝑒𝑟 𝐺𝑎𝑖𝑛, 𝐴 = 𝐼𝑆 = 𝐼𝑖 + 𝐼𝐹
𝐼𝑖
𝐼𝐹
𝐹𝑒𝑒𝑑𝑏𝑎𝑐𝑘 𝑓𝑎𝑐𝑡𝑜𝑟 𝛽 = 𝐼𝐹 = 𝛽𝐼𝑜
𝐼𝑜
𝐼𝑜 = 𝐴𝐼𝑖
𝐴
𝐴𝐹 =
1 + 𝛽𝐴
Input Impedance:
𝐼𝑠 = 𝐼𝑖 + 𝐼𝐹
𝑉𝑖 𝑉𝑖 𝑉𝑖 𝐴𝛽𝑉𝑖 𝑉𝑖
𝐼𝑠 = + 𝛽𝐼𝑜 ; 𝐼𝑠 = + 𝐴𝛽𝐼𝑖 ; 𝐼𝑠 = + ; 𝐼𝑠 = (1 + 𝐴𝛽)
𝑅𝑖 𝑅𝑖 𝑅𝑖 𝑅𝑖 𝑅𝑖
𝑉𝑖 𝑅𝑖
𝑅𝑖𝑓 = 𝐼𝑠
= 1+𝐴𝛽
Output Impedance:
𝐼𝑠 = 𝐼𝑖 + 𝐼𝐹 𝐼𝑖 = 𝐼𝑠 − 𝐼𝐹
𝑉𝑜
𝐼𝑜 = 𝐴 𝐼𝑖 +
𝑅𝑜
𝑉𝑜
= (1 + 𝐴𝛽)
𝑅𝑜
𝑉𝑜
𝑅𝐹 = = 𝑅𝑜 (1 + 𝐴𝛽)
𝑅𝑜
Draw circuit of CE amplifier with Current Series feedback and obtain the expression for feedback ratio, voltage
gain, input and output resistances. (April / May 2015 -R13)
Transconductance Amplifier:
𝐼𝑜 𝐼𝑜
𝐺𝑎𝑖𝑛 = =
𝑉𝑜 𝑉𝑖 + 𝑉𝐹
𝐴 𝑉𝑖 𝐴 𝑉𝑖
= ⥤
𝑉𝑖 + 𝛽𝐼𝑜 𝑉𝑖 + 𝐴𝛽𝑉𝑖
𝐴 𝑉𝑖 𝐴
𝐴𝐹 = =
𝑉𝑖 (1 + 𝐴𝛽) 1 + 𝐴𝛽
Equivalent Circuit
Input Impedance:
𝑉𝑠 = 𝐼𝑖 𝑅𝑖 + 𝑉𝐹
= 𝐼𝑖 𝑅𝑖 + 𝛽𝐼𝑜
= 𝐼𝑖 𝑅𝑖 + 𝐴𝛽𝑉𝑖
= 𝐼𝑖 𝑅𝑖 + 𝐴𝛽𝐼𝑖 𝑅𝑖
= 𝐼𝑖 𝑅𝑖 (1 + 𝐴𝛽)
𝑉𝑠
𝑍𝑖 = = 𝑅𝑖 (1 + 𝐴𝛽)
𝐼𝑖
Output Impedance:
𝑉𝑠 = 0
𝑉𝑠 = 𝑉𝑖 + 𝑉𝐹
𝑉𝑖 + 𝑉𝐹 = 0; 𝑉𝑖 = −𝑉𝐹
𝑉𝑜 𝑉𝑜
𝐼𝑜 = 𝐴𝑉𝑖 + = −𝐴𝑉𝑖 +
𝑍𝑜 𝑍𝑜
𝑉𝑜
= −𝐴 𝛽𝐼𝑜 +
𝑍𝑜
𝑉 𝑉
𝐼𝑜 + 𝐴 𝛽𝐼𝑜 = 𝑍𝑜 ; 𝐼𝑜 (1 + 𝐴𝛽) = 𝑍𝑜
𝑜 𝑜
𝑉𝑜
𝑍𝑂𝐹 = = 𝑍𝑜 (1 + 𝐴𝛽)
𝐼𝑜
Step 1:
Therefore, the voltage series feedback X0, XS, Xi, Xf are voltages. Then its analysis is as followings.
𝐒𝐭𝐞𝐩 𝟐 ∶
𝑉𝑓
𝛽= 𝑉0
𝑉0
𝑊ℎ𝑒𝑟𝑒𝑉𝑓 = (𝑅 ) 𝑅𝐸1
𝑓 +𝑅𝐸1
𝑉
0 )𝑅
(𝑅 +𝑅 𝐸1
𝑓 𝐸1
𝐴𝑙𝑠𝑜, 𝛽 =
𝑉0
𝑅𝐸1
∴𝛽=𝑅
𝑓 +𝑅𝐸1
𝐒𝐭𝐞𝐩 𝟑 ∶ 𝐷𝑟𝑎𝑤𝑖𝑛𝑔𝑏𝑎𝑠𝑖𝑐𝑎𝑚𝑝𝑙𝑖𝑓𝑖𝑒𝑟.=
(𝑖)𝐹𝑜𝑟𝑡ℎ𝑒𝑖𝑛𝑝𝑢𝑡𝑐𝑖𝑟𝑐𝑢𝑖𝑡𝑔𝑜𝑡𝑜𝑜𝑢𝑡𝑝𝑢𝑡𝑎𝑛𝑑𝑝𝑢𝑡𝑋0 = 0; 𝑖. 𝑒. , 𝑉0 = 0
(𝑖𝑖)𝐹𝑜𝑟𝑜𝑢𝑡𝑝𝑢𝑡𝑐𝑖𝑟𝑐𝑢𝑖𝑡𝑔𝑜𝑡𝑜𝑖𝑛𝑝𝑢𝑡𝑎𝑛𝑑𝑝𝑢𝑡𝐼𝑖 = 0
𝑅𝐸1 𝑅𝑓
𝑅𝐸 =
𝑅𝐸1 + 𝑅𝑓
𝐴𝑙𝑠𝑜, 𝑅𝐿2 = 𝑅𝐶2 ⃦ (𝑅𝑓 + 𝑅𝐸1 )
Here, the first stage is common emitter connection with feedback resistor 𝑅𝑓 𝑎𝑛𝑑𝑅𝐸1 is also called𝒈𝒍𝒐𝒃𝒂𝒍𝒇𝒆𝒆𝒅𝒃𝒂𝒄𝒌.
𝑆𝑡𝑒𝑝 4 ∶ 𝐴𝑛𝑎𝑙𝑦𝑠𝑖𝑠𝑔𝑖𝑣𝑒𝑠𝑡ℎ𝑒𝑓𝑜𝑙𝑙𝑜𝑤𝑖𝑛𝑔𝑟𝑒𝑠𝑢𝑙𝑡𝑠𝑖𝑛𝑠ℎ𝑜𝑟𝑡,
𝑖. 𝑒. , D = 1 + AV β
AV AV
AVf = or
D (1 + AV β)
R if = R i × DorR i (1 + AV β)
R0 R0
R 0f = or
D (1 + AV β)
From the above analysis voltage gain with feedback 𝐴𝑉𝐹 and output resistance 𝑅0𝑓 is reduced by (1 + 𝐴𝛽) times, and input
resistance (𝑅𝑖𝑓 ) with feedback is increased by ( 1 + 𝐴𝛽) times.