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SIM868_Series_Hardware_Design_V1.07

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 Smart Machine Smart Decision

Document Title SIM868 Series Hardware Design

Version V1.07

Date 2018-01-29

Status Release

Document Control ID SIM868_Series_Hardware_Design_V1.07

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General Notes

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SIMCom offers this information as a service to its customers, to support application and engineering efforts that
use the products designed by SIMCom. The information provided is based upon requirements specifically

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provided to SIMCom by the customers. SIMCom has not undertaken any independent search for additional
relevant information, including any information that may be in the customer’s possession. Furthermore, system
validation of this product designed by SIMCom within a larger electronic system remains the responsibility of the

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customer or the customer’s system integrator. All specifications supplied herein are subject to change.

Copyright EN
This document contains proprietary technical information which is the property of SIMCom Limited, copying of
this document and giving it to others and the using or communication of the contents thereof, are forbidden
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without express authority. Offenders are liable to the payment of damages. All rights reserved in the event of grant
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of a patent or the registration of a utility model or design. All specification supplied herein are subject to change
without notice at any time.
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Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2018

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Contents

1. Introduction........................................................................................................ 10

2. SIM868 Overview .............................................................................................. 10

2.1. SIM868 Key Features ......................................................................................................... 11
2.2. Operating Modes ................................................................................................................. 14

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2.3. Functional Diagram............................................................................................................. 15

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3. Package Information ......................................................................................... 16

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3.1. Pin Out Diagram ................................................................................................................. 16
3.2. Pin Description.................................................................................................................... 17

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3.3. Package Dimensions ........................................................................................................... 19

4. Application Modes of SIM868 .......................................................................... 22

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4.1. All-in-one Mode .................................................................................................................. 22
4.2.
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Stand-alone Mode ............................................................................................................... 23

5. Application Interface of GSM .......................................................................... 24

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5.1. Power Supply of GSM ........................................................................................................ 24
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5.2. Reference Circuit of GSM Power Supply ........................................................................... 25

5.3. Power on/off GSM Part ....................................................................................................... 26
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5.3.1. Power on GSM .................................................................................................................................... 26

5.3.2. Power off GSM ................................................................................................................................... 27
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5.4. Power Saving Mode of GSM .............................................................................................. 28

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5.4.1. Minimum Functionality Mode of GSM Part ....................................................................................... 28

5.5. Serial Port of GSM .............................................................................................................. 29
5.5.1. Function of Serial Port ........................................................................................................................ 30
5.5.2. Serial Interfaces ................................................................................................................................... 30
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5.5.3. Debug Interface ................................................................................................................................... 32

5.5.4. Software Upgrade of GSM.................................................................................................................. 33
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5.6. UART1_RI Behaviors ......................................................................................................... 33

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5.7. Audio Interfaces .................................................................................................................. 34

5.7.1. Speaker Interfaces Configuration ........................................................................................................ 35
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5.7.2. Microphone Interfaces Configuration ................................................................................................. 36

5.7.3. Audio Electronic Characteristic .......................................................................................................... 36
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5.7.4. TDD Noise of GSM ............................................................................................................................ 36

5.8. SIM Card Interface.............................................................................................................. 37
5.8.1. SIM Card Application ......................................................................................................................... 37
5.8.2. SIM Card Design Guide ...................................................................................................................... 38
5.8.3. Design Considerations for SIM Card Holder ...................................................................................... 39
5.9. SD Interface ........................................................................................................................ 41
5.10. I2C Bus ............................................................................................................................... 41
5.11. ADC .................................................................................................................................... 41

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5.12. Network Status Indication ................................................................................................... 42
5.13. Operating Status Indication ................................................................................................. 42
5.14. RF Synchronization Signal ................................................................................................. 43
5.15. Antenna Interface of GSM .................................................................................................. 43
5.16. Bluetooth Antenna Interface ............................................................................................... 45
5.17. Bluetooth Low Energy (BLE) ............................................................................................. 46

6. Application Interface of GNSS ......................................................................... 47

6.1. GNSS Overview .................................................................................................................. 47

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6.2. Power Supply of GNSS....................................................................................................... 47

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6.3. Backup Power of GNSS ...................................................................................................... 47
6.4. Power on/off GNSS ............................................................................................................ 48

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6.5. Serial Port of GNSS ............................................................................................................ 49
6.6. Software Upgrade of GNSS ................................................................................................ 50

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6.7. 1PPS Output ........................................................................................................................ 50
6.8. Antenna Interface ................................................................................................................ 51
6.8.1. Passive Antenna .................................................................................................................................. 51

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6.8.2. Active Antenna .................................................................................................................................... 52
6.9. Operation Modes of GNSS ................................................................................................. 52
6.10.
6.10.1.
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A-GPS ................................................................................................................................. 54
Easy Mode ....................................................................................................................................... 54
6.10.2. EPO .................................................................................................................................................. 54
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6.11. Fast-Fix ............................................................................................................................... 54
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6.12. Multi-tone AIC .................................................................................................................... 55

6.13. SBAS ................................................................................................................................... 55
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7. PCB Layout ........................................................................................................ 56

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7.1. Pin Assignment ................................................................................................................... 56

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7.2. Principle of PCB Layout ..................................................................................................... 57

7.2.1. Antenna Interface ................................................................................................................................ 57
7.2.2. Power Supply ...................................................................................................................................... 57
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7.2.3. SIM Card Interface .............................................................................................................................. 57

7.2.4. Audio Interface.................................................................................................................................... 57
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8. Electrical, Reliability and Radio Characteristics ........................................... 58

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8.1. Absolute Maximum Ratings ............................................................................................... 58

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8.2. Recommended Operating Conditions ................................................................................. 58

8.3. Digital Interface Characteristics.......................................................................................... 58
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8.4. SIM Card Interface Characteristics ..................................................................................... 59

8.5. SIM_VDD Characteristics .................................................................................................. 59
8.6. VDD_EXT Characteristics.................................................................................................. 59
8.7. Current Consumption（GSM_VBAT=4.0V）................................................................... 59
8.8. Electro-Static Discharge...................................................................................................... 60
8.9. Radio Characteristics .......................................................................................................... 61
8.9.1. Module RF Output Power ................................................................................................................... 61
8.9.2. Module RF Receive Sensitivity........................................................................................................... 62

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8.9.3. Module Operating Frequencies ........................................................................................................... 62

9. Manufacturing ................................................................................................... 63
9.1. Top and Bottom View of SIM868 ....................................................................................... 63
9.2. Typical Solder Reflow Profile............................................................................................. 63
9.3. The Moisture Sensitivity Level ........................................................................................... 64
9.4. Baking Requirements .......................................................................................................... 64

10. Packaging ......................................................................................................... 65

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11. Appendix .......................................................................................................... 67

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11.1. Related Documents ............................................................................................................. 67
11.2. Terms and Abbreviations .................................................................................................... 68

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11.3. Safety Caution ..................................................................................................................... 70

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Table Index
TABLE 1: KEY FEATURES OF GSM PART .................................................................................................................. 11
TABLE 2: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE ............................ 12
TABLE 3: KEY FEATURES OF GNSS PART ................................................................................................................ 12
TABLE 4: OVERVIEW OF GSM OPERATING MODES .............................................................................................. 14
TABLE 5: OVERVIEW OF GNSS OPERATING MODES............................................................................................. 15
TABLE 6: PIN DESCRIPTION ....................................................................................................................................... 17

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TABLE 7: RECOMMENDED ZENER DIODE .............................................................................................................. 24
TABLE 8: THE CURRENT CONSUMPTION OF FUNCTION MODE ........................................................................ 28

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TABLE 9: SERIAL PORT PIN DEFINITION ................................................................................................................. 29

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TABLE 10: SERIAL PORT CHARACTERISTICS ......................................................................................................... 30
TABLE 11: USB_VBUS OPERATION VOLTAGE ........................................................................................................ 33
TABLE 12: UART_RI BEHAVIOURS ............................................................................................................................ 33

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TABLE 13: AUDIO INTERFACE DEFINITION ............................................................................................................ 34
TABLE 14: PERFORMANCE OF AUDIO AMPLIFIER ................................................................................................ 35

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TABLE 15: MICROPHONE INPUT CHARACTERISTICS........................................................................................... 36
TABLE 16: AUDIO OUTPUT CHARACTERISTICS .................................................................................................... 36

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TABLE 17: SIM PIN DEFINITION................................................................................................................................. 37
TABLE 18: PIN DESCRIPTION (MOLEX SIM CARD HOLDER) .............................................................................. 39
TABLE 19: PIN DESCRIPTION (AMPHENOL SIM CARD HOLDER) ....................................................................... 40
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TABLE 20: PIN DEFINITION OF THE I2C ................................................................................................................... 41
TABLE 21: PIN DEFINITION OF THE ADC ................................................................................................................. 41
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TABLE 22: ADC SPECIFICATION ................................................................................................................................ 42

TABLE 23: PIN DEFINITION OF THE NETLIGHT ..................................................................................................... 42
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TABLE 24: STATUS OF THE NETLIGHT ..................................................................................................................... 42

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TABLE 25: PIN DEFINITION OF THE STATUS ........................................................................................................... 43

TABLE 26: DEFINITION OF THE RF_SYNC PIN........................................................................................................ 43
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TABLE 27: RECOMMENDED TVS COMPONENT ..................................................................................................... 44

TABLE 28: CURRENT CONSUMPTION OF BT3.0 ..................................................................................................... 45
TABLE 29: CURRENT CONSUMPTION (CSCLK=1) .................................................................................................. 46
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TABLE 30: CURRENT CONSUMPTION (CSCLK=0) .................................................................................................. 46

TABLE 31: SERIAL PORT PIN DEFINITION ............................................................................................................... 49
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TABLE 32: SERIAL PORT CHARACTERISTICS ......................................................................................................... 49

TABLE 33: RECOMMENDED BPF COMPONENT ...................................................................................................... 52
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TABLE 34: DEFAULT CONFIGURATION OF GNSS (FULL ON MODE) .................................................................. 52

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TABLE 35: ABSOLUTE MAXIMUM RATINGS ........................................................................................................... 58

TABLE 36: RECOMMENDED OPERATING CONDITIONS ....................................................................................... 58
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TABLE 37: DIGITAL INTERFACE CHARACTERISTICS ........................................................................................... 58

TABLE 38: SIM CARD INTERFACE CHARACTERISTICS ........................................................................................ 59
TABLE 39: SIM_VDD CHARACTERISTICS ................................................................................................................ 59
TABLE 40: VDD_EXT CHARACTERISTICS ............................................................................................................... 59
TABLE 41: CURRENT CONSUMPTION ...................................................................................................................... 59
TABLE 42: THE ESD CHARACTERISTICS (TEMPERATURE: 25℃, HUMIDITY: 45 %) ....................................... 60
TABLE 43: GSM850 AND EGSM900 CONDUCTED RF OUTPUT POWER .............................................................. 61
TABLE 44: DCS1800 AND PCS1900 CONDUCTED RF OUTPUT POWER ............................................................... 61
TABLE 45: CONDUCTED RF RECEIVE SENSITIVITY ............................................................................................. 62

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TABLE 46: OPERATING FREQUENCIES..................................................................................................................... 62
TABLE 47: MOISTURE SENSITIVITY LEVEL AND FLOOR LIFE ........................................................................... 64
TABLE 48: BAKING REQUIREMENTS ....................................................................................................................... 64
TABLE 49: TRAY SIZE ................................................................................................................................................... 65
TABLE 50: SMALL CARTON SIZE ............................................................................................................................... 66
TABLE 51: BIG CARTON SIZE ..................................................................................................................................... 66
TABLE 52: RELATED DOCUMENTS ........................................................................................................................... 67
TABLE 53: TERMS AND ABBREVIATIONS ................................................................................................................ 68
TABLE 54: SAFETY CAUTION ..................................................................................................................................... 70

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Figure Index
FIGURE 1: SIM868 BLOCK DIAGRAM ....................................................................................................................... 15
FIGURE 2: PIN OUT DIAGRAM (TOP VIEW) ............................................................................................................. 16
FIGURE 3: DIMENSIONS OF SIM868 (UNIT: MM) .................................................................................................... 19
FIGURE 4: RECOMMENDED PCB FOOTPRINT OUTLINE ...................................................................................... 20
FIGURE 5: RECOMMENDED SMT STENCIL FOOTPRINT OUTLINE .................................................................... 21
FIGURE 6: ALL-IN-ONE MODE DIAGRAM................................................................................................................ 22
FIGURE 7: STAND-ALONE MODE DIAGRAM .......................................................................................................... 23

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FIGURE 8: REFERENCE CIRCUIT OF THE GSM_VBAT INPUT .............................................................................. 24
FIGURE 9: THE MINIMAL GSM_VBAT VOLTAGE REQUIREMENT AT GSM_VBAT DROP ............................... 24

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FIGURE 10: REFERENCE CIRCUIT OF THE LDO POWER SUPPLY ....................................................................... 25

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FIGURE 11: REFERENCE CIRCUIT OF THE DC-DC POWER SUPPLY ................................................................... 25
FIGURE 12: THE MINIMAL VBAT VOLTAGE REQUIREMENT AT VBAT DROP .................................................. 25
FIGURE 13: POWERED ON/OFF GSM USING TRANSISTOR .................................................................................. 26

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FIGURE 14: POWERED ON/OFF GSM USING BUTTON........................................................................................... 26
FIGURE 15: TIMING OF POWER ON GSM ................................................................................................................. 26

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FIGURE 16: TIMING OF POWER OFF GSM ................................................................................................................ 27
FIGURE 17: TIMING OF RESTART GSM ..................................................................................................................... 28

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FIGURE 18: CONNECTION OF THE SERIAL INTERFACES ..................................................................................... 31
FIGURE 19: RESISTOR MATCHING CIRCUIT ........................................................................................................... 31
FIGURE 20 : DIODE ISOLATION CIRCUIT ................................................................................................................. 31
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FIGURE 21: TX LEVEL MATCHING CIRCUIT ........................................................................................................... 32
FIGURE 22: RX LEVEL MATCHING CIRCUIT ........................................................................................................... 32
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FIGURE 23: USB REFERENCE CIRCUIT .................................................................................................................... 32

FIGURE 24: CONNECTION FOR SOFTWARE UPGRADING .................................................................................... 33
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FIGURE 25: UART1_RI BEHAVIOUR OF VOICE CALLING AS A RECEIVER ....................................................... 34

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FIGURE 26: UART1_RI BEHAVIOUR OF URC OR RECEIVE SMS .......................................................................... 34

FIGURE 27: UART1_RI BEHAVIOUR AS A CALLER ................................................................................................. 34
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FIGURE 28: SPEAKER REFERENCE CIRCUIT .......................................................................................................... 35

FIGURE 29: MICROPHONE REFERENCE CIRCUIT .................................................................................................. 36
FIGURE 30: REFERENCE CIRCUIT OF THE 8-PIN SIM CARD HOLDER ............................................................... 38
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FIGURE 31: REFERENCE CIRCUIT OF THE 6-PIN SIM CARD HOLDER ............................................................... 38
FIGURE 32: MOLEX 91228 SIM CARD HOLDER....................................................................................................... 39
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FIGURE 33: AMPHENOL C707 10M006 512 SIM CARD HOLDER ........................................................................... 40
FIGURE 34: SD REFERENCE CIRCUIT ....................................................................................................................... 41
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FIGURE 35: REFERENCE CIRCUIT OF NETLIGHT................................................................................................... 42

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FIGURE 36: RF_SYNC SIGNAL DURING TRANSMIT BURST ................................................................................ 43

FIGURE 37: GSM ANTENNA MATCHING CIRCUIT.................................................................................................. 44
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FIGURE 38: GSM ANTENNA MATCHING CIRCUIT WITHOUT RF CONNECTOR ............................................... 44

FIGURE 39: BLUETOOTH ANTENNA MATCHING CIRCUIT .................................................................................. 45
FIGURE 40: REFERENCE CIRCUIT OF THE GPS_VBAT INPUT ............................................................................. 47
FIGURE 41: RTC SUPPLY FROM RECHARGEABLE BATTERY .............................................................................. 48
FIGURE 42: RTC SUPPLY FROM EXTERNAL POWER ............................................................................................. 48
FIGURE 43: POWER ON/OFF GNSS............................................................................................................................. 49
FIGURE 44: TIMING OF POWER ON GNSS ................................................................................................................ 49
FIGURE 45: TIMING OF POWER OFF GNSS .............................................................................................................. 49
FIGURE 46: CONNECTION FOR SOFTWARE UPGRADING AND DEBUGGING FOR GNSS .............................. 50

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FIGURE 47: CONNECTION FOR SOFTWARE UPGRADING IN ALL-IN-ONE MODE........................................... 50
FIGURE 48: 1PPS APPLICATION CIRCUIT ................................................................................................................. 51
FIGURE 49: GNSS PASSIVE ANTENNA MATCHING CIRCUIT ............................................................................... 51
FIGURE 50: GNSS ACTIVE ANTENNA MATCHING CIRCUIT ................................................................................. 52
FIGURE 51: PIN ASSIGNMENT .................................................................................................................................... 56
FIGURE 52: TOP AND BOTTOM VIEW OF SIM868 ................................................................................................... 63
FIGURE 53: TYPICAL SOLDER REFLOW PROFILE OF LEAD-FREE PROCESS .................................................. 63
FIGURE 54: PACKAGING INTRODUCE ...................................................................................................................... 65
FIGURE 55: MODULE TRAY DRAWING ..................................................................................................................... 65

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FIGURE 56: SMALL CARTON DRAWING................................................................................................................... 66
FIGURE 57: BIG CARTON DRAWING ......................................................................................................................... 66

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Version History
Date Version Description of change Author
Yanwu.Wang;
2016-06-20 1.00 Origin
Xiaoxu.Chen
1. Update figure 1
2. Add voltage range of GPS_VBAT
3. Add voltage range of VRTC
4. Add voltage range of GNSS_EN

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5. Add Recommenced SMT stencil footprint
Yanwu.Wang;

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2016-08-01 1.01 6. Delete Over-Temperature or Under- Temperature Power off
Xiaoxu.Chen
7. Change PWRKEY pin from at least 1 second to 1.5 second for

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power off the module
8. Add GNSS software update part

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9. Delete Multiplexing function
10. Add BPF component in GNSS part
1. Add Application Mode

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2. Add Power Supply of GNSS
3. Add Power Saving Mode of GNSS

2016-11-24 1.02
4.
5.
Add operation mode of GNSS
Modify Backup Power of GNSS
EN Yanwu.Wang;
Xiaoxu.Chen
6. Add software upgrading in Simultaneous mode
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7. Add Application of GNSS
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8. Add A-GPS、Fast-Fix、Easy-Mode、SBAS、GLP
1. Update Tab 3, Tab 6(GPS_VBAT 2.9V~4.4V)
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2. Update backup current to 8uA, stop current to 590uA

2017-02-18 1.03 Update periodic mode Ming.zhu
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3.
4. Update AlwaysLocateTM mode
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5. Delete the blank of document

1. Add the description of SIM868E
2017-06-08 1.04 2. Add Chapter 5.16 for BT interface Ming.zhu
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3. Add Chapter 5.17 for BLE power consumption

2017-06-13 1.05 1. Change the name of document Ming.zhu

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1. Add one note on Page 46

2017-07-13 1.06 Ming.zhu
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2. Add Chapter 10 for packaging information

1. Change the logo figure
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2018-01-29 1.07 2. Add the current consumption of BT3.0 Ming.zhu

3. Update Table 30
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1. Introduction
This document defines the SIM868 series module and describes its hardware interface in great detail. The
SIM868 series module includes two variants (SIM868 and SIM868E) currently. Both of them have the same
function except BLE, which is particular for SIM868E. SIM868 series is hereinafter uniformly referred to as the
SIM868 except in BT chapters.

The document can help customers understand SIM868 interface specifications, electrical and mechanical details.
With the help of this document and other SIM868 application notes, customer guide, customers can use SIM868

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to design various applications conveniently.

2. SIM868 Overview

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Designed for global market, SIM868 is integrated with a high performance GSM/GPRS part and a GNSS part.
The GSM part is a quad-band GSM/GPRS that works on frequencies GSM 850 MHz, EGSM 900MHz, DCS
1800MHz and PCS 1900MHz. GSM features GPRS multi-slot class 12/class 10 (optional) and supports the

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GPRS coding schemes CS-1, CS-2, CS-3 and CS-4.

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The GNSS part solution offers best-in-class acquisition and tracing sensitivity, Time-To-First-Fix (TTFF) and
accuracy. With built-in LNA, GNSS doesn’t need external LNA. GNSS can track as low as -167dBm signal even

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without network assistance. The GNSS has excellent low power consumption characteristic (acquisition 24mA,
tracking 22mA). GNSS supports various location and navigation applications, including autonomous GPS,
GLONASS, BEIDOU, QZSS, SBAS (WAAS, EGNOS, GAGAN, and MSAS) and A-GPS.
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With a tiny configuration of 17.6*15.7*2.3mm, SIM868 can meet almost all the space requirements in
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customers’ applications, such as smart phone, PDA and other mobile devices.
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SIM868 has a SMT+LGA package with 77 pads, and provides all hardware interfaces between the module and
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customers’ boards.
 One three-line serial port, one full modem serial port and one GNSS serial port.
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 USB interface
 Audio channels which include a microphone input and two speakers output
 Programmable general purpose input and output
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 Two SIM card interfaces

 SD card interface
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 I2C interface
 ADC interface
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 Support GNSS function

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 33tracking/99 acquisition-channel GNSS receiver

 12 multi-tone active interference cancellers and jamming elimination
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 Max fixed update rate up to 10 HZ (1Hz default)

 Accuracy 2.5m CEP

SIM868 is designed with power saving technique so that the current consumption is as low as 0.65 mA in sleep
mode (with GNSS part power off).
SIM868 integrates TCP/IP protocol and extended TCP/IP AT commands which are very useful for data transfer
applications. For details about TCP/IP applications, please refer to document [3].

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2.1. SIM868 Key Features

Table 1: Key Features of GSM Part

Feature Implementation
Power supply 3.4V ~4.4V
Power saving Typical power consumption in sleep mode is 0.65mA (AT+CFUN=0)

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 Quad-band: GSM 850, EGSM 900, DCS 1800, PCS 1900. SIM868 can search
the 4 frequency bands automatically. The frequency bands can also be set by

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Frequency bands
AT command “AT+CBAND”. For details, please refer to document [1].

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 Compliant to GSM Phase 2/2+
 Class 4 (2W) at GSM 850 and EGSM 900
Transmitting power

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 Class 1(1W) at DCS 1800 and PCS 1900
 GPRS multi-slot class 12(default)
GPRS connectivity
 GPRS multi-slot class 1~12 (option)

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 Normal operation:-40°C ~ +85°C
Temperature range
 Storage temperature -45°C ~ +90°C

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GPRS data downlink transfer: max. 85.6 kbps
GPRS data uplink transfer: max. 85.6 kbps
 Coding scheme: CS-1, CS-2, CS-3 and CS-4
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Data GPRS
 PAP protocols for PPP connect
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 Integrate the TCP/IP protocol

 Support Packet Broadcast Control Channel (PBCCH)
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USSD  Unstructured Supplementary Services Data (USSD) support

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 MT, MO, CB, Text and PDU mode.

SMS
 SMS storage: SIM card
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SIM interface Support SIM card: 1.8V, 3V

FLASH 32Mbit
RAM 32Mbit
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Speech codec modes:

 Half Rate (ETS 06.20)
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 Full Rate (ETS 06.10)

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Audio features  Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)

 Adaptive multi rate (AMR)
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 Echo Cancellation
 Noise Suppression
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Serial port:
 Default one full modem serial port
 Can be used for AT commands or data stream
Serial port and  Support RTS/CTS hardware handshake and software ON/OFF flow control
USB port  Multiplex ability according to GSM 07.10 Multiplexer Protocol
 Autobauding supports baud rate from 1200 bps to 115200bps
 upgrading firmware
USB port:

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 Can be used for debugging and upgrading firmware

Phonebook management Support phonebook types: SM, FD, LD, RC, ON, MC.
SIM application toolkit GSM 11.14 Release 99
 Size:17.6*15.7*2.3mm
Physical characteristics
 Weight:1.5g
Firmware upgrade Full modem serial port or USB interface

Table 2: Coding schemes and maximum net data rates over air interface

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Coding scheme 1 timeslot 2 timeslot 4 timeslot

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CS-1 9.05kbps 18.1kbps 36.2kbps

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CS-2 13.4kbps 26.8kbps 53.6kbps
CS-3 15.6kbps 31.2kbps 62.4kbps

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CS-4 21.4kbps 42.8kbps 85.6kbps

Table 3: Key Features of GNSS Part

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Performance
Parameter Description

Power supply Power supply

Min
2.9
EN Typ
3
Max
4.4
Unit
V
Horizontal Position
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Autonomous <2.5 m
Accuracy(1)
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Velocity Accuracy(2) Without Aid 0.1 m/s

Acceleration Accuracy Without Aid 0.1 m/s2
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Accuracy of 1PPS 10 nS
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Backup batter voltage VRTC 2.3 4.3 V

Maximum Altitude 18000 m
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Dynamic Performance Maximum Velocity 515 m/s

Maximum Acceleration 4 G
Hot start <1 s
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TTFF with GPS

Warm start 21.4 s
only(3)
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Cold start 22.3 s

Hot start <1 s
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TTFF with
Warm start 21.2 s
GLONASS only(3)
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Cold start 21.68 s

Hot start <1 s
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TTFF with GPS and

Warm start 21.54 s
GLONASS (3)
Cold start 21.67 s
Hot start <1 s
A-GPS TTFF(EPO in
Warm start / s
flash mode)
Cold start / s
A-GPS TTFF(Easy Hot start <1 s
mode) Warm start 1.4 s

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Cold start 13.6 s

Autonomous
-149 dBm
Sensitivity with GPS acquisition(cold start)
only mode Re-acquisition -161 dBm
Tracking -167 dBm
Autonomous
-147 dBm
Sensitivity with acquisition(cold start)
GLONASS only mode Re-acquisition -155 dBm

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Tracking -160 dBm
Autonomous

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-149 dBm
Sensitivity with GPS acquisition(cold start)

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and GLONASS Re-acquisition -161 dBm
Tracking -167 dBm

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Channels 33/99
Update rate 10 Hz

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Receiver Tracking L1, CA Code
Protocol support
NMEA
Acquisition
EN 24.5 mA
Continuous tracking 22.2 mA
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Power consumption
GLP current 12 mA
With GPS only
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Sleep current 6.5 mA

mode(4)
Stop current 490 uA
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Backup current 8 uA
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Acquisition 31 mA
Continuous tracking 31.2 mA
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Power consumption GLP current 12 mA

With BD only mode(4) Sleep current 6.5 mA
Stop current 490 uA
M

Backup current 8 uA
O

Acquisition 22.4 mA
Continuous tracking 27.3 mA
C

Power consumption
GLP current 12 mA
With GLONASS only
M

Sleep current 6.5 mA

mode(4)
Stop current 490 uA
SI

Backup current 8 uA
Acquisition 31 mA
Continuous tracking 26 mA
Power consumption
GLP current 12 mA
With GPS and
Sleep current 6.5 mA
GLONASS (4)
Stop current 590 uA
Backup current 8 uA

SIM868_Series_Hardware_Design_V1.07 13 2018-01-18
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Acquisition 31.2 mA
Continuous tracking 25.8 mA
Power consumption GLP current 12 mA
With GPS and BD (4) Sleep current 6.5 mA
Stop current 490 uA
Backup current 8 uA
(1) 50% 24hr static, -130dBm
(2) 50% at 30m/s

E
(3) GPS signal level: -130dBm
(4) Single Power supply 3V@-130dBm

L
FI
2.2. Operating Modes

Table 4 summarizes the various operating modes of GSM:

AL
Table 4: Overview of GSM operating modes

TI
Mode Function
Module will automatically go into sleep mode if the conditions of sleep

GSM/GPRS
EN
mode are enabling and there aren’t on air and hardware interrupt (such as
GPIO interrupt or data on serial port).
SLEEP In this case, the current consumption of module will reduce to the minimal
D
level.
FI

In sleep mode, the module can still receive paging message and SMS.
Software is active. Module is registered to the GSM network and ready to
GSM IDLE
N

communicate.
Normal Connection between two subscribers is in progress. In this case, the power
O

operation GSM TALK consumption depends on network settings such as DTX off/on,
C

FR/EFR/HR, hopping sequences and antenna.

Module is ready for GPRS data transfer, but no data is currently sent or
GPRS
received. In this case, power consumption depends on network settings and
STANDBY
M

GPRS configuration.
There is GPRS data transfer (PPP or TCP or UDP) in progress. In this case,
O

power consumption is related with network settings (e.g. power control

GPRS DATA
level); uplink/downlink data rates and GPRS configuration (e.g. used
C

multi-slot settings).
M

Normal power off by sending AT command “AT+CPOWD=1” or using the PWRKEY. The
power management unit shuts down the power supply for the baseband part of the module.
Power off
SI

Software is not active. The serial port is not accessible. Power supply (connected to 3V)
remains applied.
AT command “AT+CFUN” can be used to set the module to a minimum functionality mode
Minimum without removing the power supply. In this mode, the RF part of the module will not work
functionality or the SIM card will not be accessible, or both RF part and SIM card will be closed, and the
mode serial port is still accessible. The power consumption in this mode is lower than normal
mode.

SIM868_Series_Hardware_Design_V1.07 14 2018-01-18
 Smart Machine Smart Decision

Table 5: Overview of GNSS operating modes

Mode GPS_VBAT GNSS_EN VRTC Main clock RTC clock

Full on on H on on on
Stop on H on off on
Backup X L on off on

E
Note: X means no matter GPS_VBAT is existed or not.

L
2.3. Functional Diagram

FI
Figure 1 shows the block diagram of SIM868:

AL
 GSM baseband
 PMU
 The GSM Radio Frequency part

TI
 Antenna interface
 GNSS interface
 Other interface EN
D
FI
N
O
C
M
O
C
M

Figure 1: SIM868 block diagram

SI

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3. Package Information

3.1. Pin Out Diagram

STATUS NETLIGHT VDD_EXT PWRKEY ADC GND GND GSM_VBAT GPS_VBAT

E
42 41 40 39 38 37 36 35 34

L
FI
68 67 66 65 64 63
UART1_TXD 1 33 GND

GPS_ANT GND GND SCL SDA GND

AL
UART1_RXD 2 32 GSM_ANT

SPK2N 43

TI
UART1_RTS 3 31 GND

SPK2P 44 GND GND GND

UART1_CTS 4

GND 45
EN 30 GND

5
D
UART1_DCD 69 76 75 29 RF_SYNC
FI

UART1_DTR 6
UART1_DTR MCCA3 46 62 GPS_RXD 28 VRTC
N

GND GND GND

UART1_RI 7 27 GND
O

MCCA2 47 61 GPS_TXD
C

GND 8 70 77 74 26 USB_DM
MCCA1 48 60 1PPS

MICP 9 25 USB_DP
M

MCCA0 49 GND GND GND 59 GNSS_EN

O

MICN 10 24 USB_VBUS
C

58 GPIO2
MCCK 50
11 71 72 73
SPK1P 23 UART2_RXD
M

MCCM0 SIM2_DET SIM2_DATA SIM2_CLK SIM2_RST SIM2_VDD GPIO1

SI

SPK1N 12 22 UART2_TXD
51 52 53 54 55 56 57

13 14 15 16 17 18 19 20 21

GND SIM1_DET SIM1_DATA SIM1_CLK SIM1_RST SIM1_VDD GND BT_ANT GND

Figure 2: Pin out Diagram (Top view)

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3.2. Pin Description

Table 6: Pin description

Pin name Pin number I/O Description Comment

Power supply
GPS_VBAT 34 I Power supply for GNSS 2.9V ~4.4V
GSM_VBAT 35 I Power supply for GSM 3.4V ~4.4V
VDD_EXT 40 O 2.8V power output If it is unused, keep open.

E
8,13,19,21,27,30,

L
31,33,36,37,45,63, 36、37 pins recommend for
GND Ground
66,67,69,70,71,72, GSM_VBAT.

FI
73,74,75,76,77
Power on/off

AL
PWRKEY should be pulled low
PWRKEY 39 I and then released to power on/off Internally pulled up to 3V
the module.

TI
Audio interface
MICP
MICN
9
10
I EN
Differential audio input

SPK1P 11 If these pins are unused,

D
SPK1N 12 keep open.
O Differential audio output
FI

SPK2P 44
SPK2N 43
N

GNSS interface
O

GPS_RXD 62 I Receive data

If these pins are unused,
GPS_TXD 61 O Transmit data
C

keep open.
1PPS 60 O Time Mark outputs timing pulse
GNSS_EN 59 I GNSS power enable
It is recommended to
M

VRTC 28 I/O Power supply for GNSS RTC

connect with a battery.
O

SD interface
MCCA3 46 I/O
C

MCCA2 47 I/O
SD serial data I/O
M

MCCA1 48 I/O If these pins are unused,

MCCA0 49 I/O keep open.
SI

MCCK 50 I/O SD serial clock

MCCM0 51 I/O SD command output
GPIO
NETLIGHT 41 O Network status
STATUS 42 O Power on status If these pins are unused,
GPIO1 57 I/O Programmable general purpose keep open.
GPIO2 58 I/O input and output.

SIM868_Series_Hardware_Design_V1.07 17 2018-01-18
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Serial port
UART1_DTR 6 I Data terminal ready
UART1_RI 7 O Ring indicator
UART1_DCD 5 O Data carrier detect
UART1_CTS 4 O Clear to send
If these pins are unused,
UART1_RTS 3 I Request to send
keep open.
UART1_TXD 1 O Transmit data
UART1_RXD 2 I Receive data

E
UART2_TXD 22 O Transmit data

L
UART2_RXD 23 I Receive data

FI
Debug interface
USB_VBUS 24 I
If these pins are unused,
USB_DP 25 I/O Debug and download

AL
keep open.
USB_DM 26 I/O
ADC

TI
10bit general analog to digital
ADC 38 I If it is unused, keep open.
converter
I2C
SDA 64 I/O
EN
I2C serial bus data Should be pulled up to 2.8V
via 4.7K resistor externally
D
SCL 65 O I2C serial bus clock
SIM card interface
FI

Voltage supply for SIM card.

SIM1_VDD 18 O
Support 1.8V or 3V SIM card.
N

All signals of SIM interface

SIM1_DATA 15 I/O SIM data input/output should be protected against
O

SIM1_CLK 16 O SIM clock ESD.

SIM1_RST 17 O SIM reset
C

SIM1_DET 14 I SIM card detection If it is unused, keep open.

Voltage supply for SIM card.
SIM2_VDD 56 O
Support 1.8V or 3V SIM card
M

All signals of SIM interface

SIM2_DATA 53 I/O SIM data input/output should be protected against
O

SIM2_CLK 54 O SIM clock ESD.

SIM2_RST 55 O SIM reset
C

SIM2_DET 52 I SIM card detection If it is unused, keep open.

M

Antenna interface
GSM_ANT 32 I/O Connect GSM antenna
SI

If these pins are unused,

BT_ANT 20 I/O Connect Bluetooth antenna
keep open.
GPS_ANT 68 I Connect GNSS antenna
Synchronizing signal of RF
RF_SYNC 29 O Synchronizing signal of RF

SIM868_Series_Hardware_Design_V1.07 18 2018-01-18
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3.3. Package Dimensions

L E
FI
AL
TI
EN
D
FI
N
O
C

Figure 3: Dimensions of SIM868 (Unit: mm)

M
O
C
M
SI

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L E
FI
AL
TI
EN
D
FI
N
O
C
M
O
C

Figure 4: Recommended PCB footprint outline

M
SI

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L E
FI
AL
TI
EN
D
FI
N
O
C
M
O
C
M
SI

Figure 5: Recommended SMT stencil footprint outline

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4. Application Modes of SIM868

4.1. All-in-one Mode

In all-in-one mode, UART2 of GSM is connected with GNSS_UART. It’s convenient for communication
between GSM and GNSS, such as control GNSS, firmware upgrade and download EPO data.

As the Figure 6, a 10K resistor should be added between GPIO1 and GNSS_EN pin.

L E
In this mode, GNSS part can be enabled through AT command“AT+CGNSPWR=1”and disabled through AT

FI
command“AT+CGNSPWR=0”. GSM and GNSS’s firmware could be upgraded through UART1 port or USB
with high-speed.

AL
Module
USB

TI
GSM_VBAT

5V 4V
Adapter LDO
VRTC
GPS_VBAT
LDO

GNSS_EN
OUT EN
V_GPS
VRTC

GNSS_RXD

GNSS_TXD
R101
D
10K

GPIO1
FI

UART2_RXD

UART2_TXD
UART1_RXD
UART1_TXD
PWRKEY
N
O
C

RXD

TXD

MCU
M

Figure 6: All-in-one Mode Diagram

O
C
M
SI

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4.2. Stand-alone Mode

In stand-alone mode, GSM and GNSS part can work independently. It’s convenient for customer to control them
separately. Figure 7 is the block diagram of this mode.

Module

E
5V 4V VRTC

L
GSM_VBAT VRTC
Adapter LDO

FI
GPS_VBAT V_GPS
LDO OUT

AL
GNSS_EN

TI
UART1_RXD
UART1_TXD

GNSS_RXD
GNSS_TXD
PWRKEY

EN
D RXD1

RXD2
TXD1

TXD2

MCU
FI
N

Figure 7: Stand-alone Mode Diagram

O
C
M
O
C
M
SI

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5. Application Interface of GSM

5.1. Power Supply of GSM

The recommended typical power supply voltage of GSM is 4.0V, and range from 3.4V to 4.4V. The maximum
current consumption of GSM can reach 2A maximum during a transmitting burst period, which will cause a big
voltage drop on the GSM_VBAT. So, to decrease the voltage drop, it is necessary to add an additional circuit at
the GSM_VBAT pin, which is illustrated in Figure 8.

E
GSM_VBAT

L
FI
CA CB 33pF 10pF 5.1V
500mW

AL
TI
EN
Figure 8: Reference circuit of the GSM_VBAT input

For the GSM_VBAT input, a 100uF tantalum capacitor CA (low ESR) and a 1uF~10uF ceramics capacitor CB
D
are strongly recommended. Add the 33pF and 10pF capacitors can effectively eliminate the high frequency
interference. A 5.1V/500mW zener diode is strongly recommended, which can prevent chip from damaging by
FI

the voltage surge. These capacitors and zener diode should be placed as close as possible to GSM_VBAT pin.
N

Table 7: Recommended zener diode

O

Vendor Part number Power(watts) Packages

C

1 On semi MMSZ5231BT1G 500mW SOD123

2 Prisemi PZ3D4V2H 500mW SOD323
3 Vishay MMSZ4689-V 500mW SOD123
M

4 Crownpo CDZ55C5V1SM 500mW 0805

O

When designing the power supply circuit in customers’ application, pay special attention to power loss. Ensure
C

that the input GSM_VBAT voltage never drops below 3.0V even when current consumption rises to 2A in the
transmit burst. If the GSM_VBAT voltage drops below 3.0V, the GSM may be shut off automatically. The PCB
M

traces from the GSM_VBAT pin to the power supply must be wide enough (at least 60mil) to decrease voltage
drops in the transmit burst. The power IC and the bypass capacitor should be placed to the GSM_VBAT as close
SI

as possible.

GSM_VBAT

MIN:3.0V

Figure 9: The minimal GSM_VBAT voltage requirement at GSM_VBAT drop

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5.2. Reference Circuit of GSM Power Supply

Figure 10 is the reference design of +5V input power supply. The output power supply is 4.1V, thus a linear
regulator can be used.

DC INPUT U101 MIC29302 GSM_VBAT

2 4
Vin Vout

C101+ C102 1
FB 5

GND
R101
On/Off
+ C103

E
100uF 100K C104 R103
1uF 3 470Ω
PWR_CTRL
330uF 100nF

L
R102

FI
43K

AL
Figure 10: Reference circuit of the LDO power supply

If there is a high drop-out between the input and the desired output (GSM_VBAT), a DC-DC power supply will

TI
be preferable because of its better efficiency especially with the 2A peak current in burst mode of the GSM.
Figure 11is the reference circuit.

DC input U101 LM2596-ADJ

1 Vin Vout 2
L101
EN
100uH
FB101

270Ω
GSM_VBAT

C101 + C102 5
+
GND

D10 R101
On/Off FB 4
D
C103 C104
100uF 1uF PWR_CTR 2 2.2K
3 330uF 100nF
L MBR360
FI

R102
1K
N
O

Figure 11: Reference circuit of the DC-DC power supply

C

When battery is used, the total impedance between battery and GSM_VBAT pins should be less than 150mΩ.
Figure 12 shows the GSM_VBAT voltage drop at the maximum power transmit phase, and the test condition is as
following:
M

GSM_VBAT=4.0V,
O

A GSM_VBAT bypass capacitor CA=100µF tantalum capacitor (ESR=0.7Ω),

Another GSM_VBAT bypass capacitor CB=1uF~10uF.
C
M

577us 4.615ms
SI

IGSM_VBAT Burst:2A

GSM_VBAT
Max:350mV

Figure 12: The minimal VBAT voltage requirement at VBAT drop

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5.3. Power on/off GSM Part

5.3.1. Power on GSM

Customer can power on GSM by pulling down the PWRKEY pin for at least 1 second and then release. This pin
is already pulled up to 3V in the module internal, so external pull up is not necessary. Reference circuits are
shown as below.

E
3V

L
100K

FI
PWRKEY Power
on/off logic
1K
4.7K

AL
Turn on/off
impulse 47K GSM

TI
EN
Figure 13: Powered on/off GSM using transistor

3V
D
100K
FI

PWRKEY Power
1K on/off logic
N
O

GSM
C

Figure 14: Powered on/off GSM using button

The power on timing is illustrated as Figure 15:

M

T>1.5s
O

VBAT
t>1s
C

PWRKEY VIL<0.7V
(INPUT) T>62ms
M

VDD_EXT
SI

t>3.2s

STATUS

Serial Port Undefind Active

Figure 15: Timing of power on GSM

When power on procedure is completed, GSM will send following URC to indicate that the module is ready to

SIM868_Series_Hardware_Design_V1.07 26 2018-01-18
 Smart Machine Smart Decision
operate at fixed baud rate.
RDY
This URC does not appear when autobauding function is active.

Note: Customer can use AT command “AT+IPR=x” to set a fixed baud rate and save the configuration to
non-volatile flash memory. After the configuration is saved as fixed baud rate, the Code “RDY” should be
received from the serial port every time when SIM868 is powered on. For details, please refer to the chapter
“AT+IPR” in document [1].

5.3.2. Power off GSM

L E
GSM will be powered off in the following situations：

FI
 Power off GSM by the PWRKEY pin.
 Power off GSM by AT command “AT+CPOWD=1”.

AL
5.3.2.1. Power off GSM by the PWRKEY Pin

Customer can power off GSM by pulling down the PWRKEY pin for at least 1.5 second and release. The power
off timing is illustrated in Figure 16.

TI
1.5s<T1<33s
PWRKEY
(input)

VDD_EXT
VIL<0.7V
EN
T2≥2s
D
FI

STATUS
T3=2s
N

Serial port Active Undifined

O
C

Figure 16: Timing of power off GSM

Note:
M

1. The GSM will restart after pulling down the PWRKEY over 33 seconds.
2. VDD_EXT will power off after STATUS changes into low level and the PWRKEY release 55ms.
O

If 1.5s<T1<2s，T2>2s；
If 2s≤T1<33s，T2>T1+55ms
C

This procedure makes the GSM log off from the network and allows the software to enter into a secure state to
M

save data before completely shut off.

SI

Before the completion of the power off procedure, the GSM will send URC:
NORMAL POWER OFF
At this moment, AT commands can’t be executed any more. Power off mode can also be indicated by STATUS pin,
which is at low level at this time.

5.3.2.2. Power off GSM by AT Command

GSM can be powered off by AT command “AT+CPOWD=1”. This procedure makes the GSM log off from the
network and allows the software to enter into a secure state to save data before completely shut off.
Before the completion of the power off procedure, the GSM will send URC:
SIM868_Series_Hardware_Design_V1.07 27 2018-01-18
 Smart Machine Smart Decision
NORMAL POWER OFF
At this moment, AT commands can’t be executed any more. Power off mode can also be indicated by STATUS pin,
which is at low level at this time.

For detail about AT command “AT+CPOWD”, please refer to document [1].

5.3.2.3. Restart GSM by PWRKEY:

When the GSM works normally, if the customer wants to restart the GSM, follow the procedure as Figure 17:
1) Power off the GSM.

E
2) Wait for at least 800ms after STATUS pin changes to low level.
3) Power on the GSM.

L
FI
1.5s<T1<2s T3>800ms

PWRKEY

AL
STATUS
T2≥2s

TI
EN
Figure 17: Timing of restart GSM
D
FI

5.4. Power Saving Mode of GSM

GSM has two power saving modes: Minimum functionality mode and sleep mode. AT command
N

“AT+CSCLK=1”can be used to set GSM into sleep mode. AT command “AT+CFUN=<fun>“can be used to set
O

GSM into minimum functionality. When GSM is in sleep mode and also in minimum functionality mode, the
current of GSM is the lowest.
C

5.4.1. Minimum Functionality Mode of GSM Part

There are three functionality modes, which could be set by AT command “AT+CFUN=<fun>“. The command
M

provides the choices of the functionality levels <fun>=0, 1, 4.

O

 AT+CFUN=0： Minimum functionality

 AT+CFUN=1： Full functionality (default)
C

 AT+CFUN=4： Flight mode (disable RF function)

M

Table 8: The current consumption of Function Mode

SI

<fun> BS-PA-MFRMS Current consumption(mA)

0 / 0.65
9 0.86
1 5 1.02
2 1.42
4 / 0.69
Minimum functionality mode minimizes the current consumption to the lowest level. If GSM is set to
minimum functionality mode by “AT+CFUN=0”, the RF function and SIM card function will be disabled. In
SIM868_Series_Hardware_Design_V1.07 28 2018-01-18
 Smart Machine Smart Decision
this case, the serial port is still accessible, but partial AT commands and correlative to RF function and SIM
card function will not be accessible.
For detailed information about AT command “AT+CFUN=<fun>“, please refer to document [1].

5.4.1.1. Sleep Mode 1 (AT+CSCLK=1)

Customer can control GSM to enter or exit the sleep mode (AT+CSCLK=1) by DTR signal. When DTR is in
high level and without interrupt (on air and hardware such as GPIO interrupt or data in serial port), GSM will
enter sleep mode automatically. In this mode, GSM can still receive paging or SMS from network but the serial
port is not accessible.

E
5.4.1.2. Wake Up GSM from Sleep Mode 1

L
When GSM is in sleep mode 1(AT+CSCLK=1), the following methods can wake up the GSM:

FI
 Pull down DTR pin
The serial port will be active after DTR pin is pulled to low level for about 50ms
 Receive a voice or data call from network

AL
 Receive a SMS from network
 Receive external interrupt

TI
Note: After module has received incoming call or new SMS, serial port can report URC, but it cannot input AT

5.4.1.3. Sleep Mode 2 (AT+CSCLK=2)

EN
command. Only after the DTR pin is pulled to low level for 50ms, the serial port can input AT command.
D
In this mode, GSM will continuously monitor the serial port data signal. When there is no data transfer over 5
seconds on the RXD signal and there is no on air and hardware interrupts (such as GPIO interrupt), GSM will
FI

enter sleep mode 2 automatically. In this mode, GSM can still receive paging or SMS from network.
N

5.4.1.4. Wake Up GSM from Sleep Mode 2

O

When GSM is in sleep mode 2 (AT+CSCLK=2), the following methods can wake up the module:
 Send data to GSM via main serial port (the first character will lose).
C

 Receive a voice or data call from network.

 Receive a SMS from network.
M

Note: Autobauding is default. It cannot enter sleep mode in the absence of synchronous serial port baud rate
after GSM power on.
O

5.5. Serial Port of GSM

C

GSM default provides one unbalanced asynchronous serial port and one three-line serial port.
M

Table 9: Serial port pin definition

SI

Pin name Pin number Function

UART1_DTR 6 Data terminal ready
UART1_RI 7 Ring indicator
Serial port UART1_DCD 5 Data carrier detect
UART1_CTS 4 Clear to send
UART1_RTS 3 Request to send

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 Smart Machine Smart Decision

UART1_TXD 1 Transmit data

UART1_RXD 2 Receive data
UART2_TXD 22 Transmit data
UART2_RXD 23 Receive data

Note: Hardware flow control is disabled by default. AT command “AT+IFC=2, 2”can enable hardware flow
control. AT command “AT+IFC=0,0”can disable hardware flow control. For more details please refer to
document [1].

E
Table 10: Serial port characteristics

L
Symbol Min Max Unit

FI
VIL -0.3 0.7 V
VIH 2.1 3.0 V

AL
VOL - 0.4 V
VOH 2.4 - V

TI
5.5.1. Function of Serial Port

Serial port:
 Full mode device.
EN
D
 Contain data lines UART1_TXD/UART1_RXD; hardware flow control lines UART1_RTS/UART1_CTS,
status lines UART1_DTR, UART1_DCD and UART1_RI.
FI

 Serial port can be used for GPRS service and AT communication.

 Autobauding supports the following baud rates:
N

1200, 2400, 4800, 9600, 19200, 38400, 57600 and 115200bps

O

Autobauding allows GSM to automatically detect the baud rate of the host device. Pay more attention to the
C

following requirements:
 Synchronization between DTE and DCE:
When DCE powers on with autobauding enabled, it is recommended to send "AT" or "at" or "aT" or "At"
to synchronize the baud rate, until DTE receives the "OK" response, which means DTE and DCE are
M

correctly synchronized. For more information please refer to AT command "AT+IPR".

O

 Restrictions of autobauding operation:

C

The DTE serial port must be set at 8 data bits, no parity and 1 stop bit.
The URC such as "RDY", "+CFUN: 1" and "+CPIN: READY” will not be reported.
M
SI

Note: Customer can use AT command “AT+IPR=x” to set a fixed baud rate and the setting will be saved to
non-volatile flash memory automatically. After the configuration is set as fixed baud rate, the URC such as
"RDY", "+CFUN: 1" and "+CPIN: READY” will be reported when GSM is powered on.

5.5.2. Serial Interfaces

The following figure shows the connection between GSM and client (DTE).

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 Smart Machine Smart Decision

GSM(DCE) Customer(DTE)
Serial Port Serial Port
UART1_TXD TXD

UART1_RXD RXD

UART1_RTS RTS

UART1_CTS CTS

UART1_DTR DTR

UART1_DCD DCD

UART1_RI RING

E
GND GND

L
FI
Figure 18: Connection of the serial interfaces

AL
If the voltage of UART is 3.3V, the following reference circuits are recommended. If the voltage is 3.0V, please
change the resistors in the following figure from5.6K to 14K.

TI
1K
UART1_TXD RXD
UART1_RXD 1K

UART1_RTS

UART1_CTS
EN
1K

1K
TXD

RTS

CTS
1K
UART1_DTR GPIO
D
1K
UART1_DCD GPIO
1K
FI

UART1_RI EINT

GND 5.6K 5.6K 5.6K GND

N

DTE
GSM (3.3V)
O

Figure 19: Resistor matching circuit

C

If the voltage of UART is 3V or3.3V, the following reference circuit is recommended:

10K
M

VDD_EXT
O

UART1_RXD TXD

UART1_TXD RXD
C

10K
M

GND GND
SI

GSM DTE

Figure 20 : Diode isolation circuit

Note: Please make sure the minimum of client high limit should be less than 2.8V minus the diode drop.
If the voltage of UART is 5V, the following reference circuit is recommended:

SIM868_Series_Hardware_Design_V1.07 31 2018-01-18
 Smart Machine Smart Decision

VDD_EXT
GSM DTE
VDD
4.7K

VDD_EXT
4.7K
47K

UART1_TXD RXD

L E
Figure 21: TX level matching circuit

FI
VDD_EXT
GSM DTE

AL
VDD_EXT VDD
4.7K

TI
4.7K
47K

UART1_RXD
EN TXD
D
FI

Figure 22: RX level matching circuit

N
O

5.5.3. Debug Interface

C

GSM could be debugged through USB port. The recommended diagram is shown as Figure 23:
M

USB_VBUS VBUS
O

22R
USB_DM USB_DM
C

22R
USB_DP USB_DP
M

1uF
SI

GND GND

GSM USB

Figure 23: USB reference circuit

The TVS on USB data line should be less than 5pF, and the USB signals have to be layout according to
differential signal layout rules.

Note: Please reserve the USB interface or test point for further debugging.
SIM868_Series_Hardware_Design_V1.07 32 2018-01-18
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Table 11: USB_VBUS operation voltage

Pin Min Typ Max Unit

USB_VBUS 4.3 5.0 7.0 V

5.5.4. Software Upgrade of GSM

Customer could upgrade module’s GSM part firmware through USB or UART interface.

If upgrading GSM part through USB interface, it is necessary to connect USB_VBUS, USB_DP, USB_DM, and

E
GND to PC. There is no need to operate PWRKEY pin in the whole procedure, when GSM detects USB_VBUS

L
and can communicate normally with USB_DP and USB_DM, it will enter USB download mode automatically.

FI
If customer upgrades GSM through UART interface, it is strongly recommended to lead the UART1_TXD,
UART1_RXD, GND and PWRKEY pin to IO connector for the upgrading, and PWRKEY pin should be

AL
connected to GND while upgrading. Refer to Figure 24 for debugging and upgrading software.

TI
GSM(DCE) I/O Connector
Serial Port
UART1_TXD
EN TXD
UART1_RXD RXD
D
GND GND
FI

PWRKEY
PWRKEY
N
O
C

Figure 24: Connection for software upgrading

The UART interface supports the CMOS level. If customer connects the module to the computer, the level shift
should be added between the DCE and DTE.
M

5.6. UART1_RI Behaviors

O

Table 12: UART_RI behaviours

C
M

State RI response
Standby High
SI

The pin is changed to low. When any of the following events occur, the pin will be changed to
high:
Voice call
（1）Establish the call
（2）Hang up the call
The pin is changed to low, and kept low for 120ms when a SMS is received. Then it is changed
SMS
to high.
Others For more details, please refer to document [2].

SIM868_Series_Hardware_Design_V1.07 33 2018-01-18
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The behavior of the RI pin is shown in the following figure when the module is used as a receiver.
RI
HIGH

Establish the call

Hang up the call
LOW
Idle Ring

Figure 25: UART1_RI behaviour of voice calling as a receiver

L E
RI
HIGH

FI
120ms

AL
LOW
Receive SMS

TI
Idle
URC

EN
Figure 26: UART1_RI behaviour of URC or receive SMS

However, if the module is used as caller, the UART1_RI will remain high. Please refer to Figure 27.
D
RI
HIGH
FI
N
O

LOW
Idle Ring Establish Hang up Idle
C

the call the call

Figure 27: UART1_RI behaviour as a caller

M
O

5.7. Audio Interfaces

C

GSM part provides an analog input (MICP; MICN), which could be connected to electric microphone. The
M

module also provides two analog audio outputs (SPK1P/1N; SPK2P/2N).

SI

Table 13: Audio interface definition

Pin name Pin number Function

MICP 9 Audio input positive
MICN 10 Audio input negative
SPK1P 11 Audio output positive
SPK1N 12 Audio output negative
SPK2P 44 Audio output positive

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SPK2N 43 Audio output negative

SPK1P/1N output can directly drive 32Ω receiver.

SPK2P/2N output can directly drive 8Ω speaker, which integrates class-AB audio amplifier as shown Table 14:

Table 14: Performance of audio amplifier

Test Conditions Class-AB AMP

4.2V 8Ω THD+N=1% 0.87W

E
3.3V 8Ω THD+N=1% 0.53W

L
4.2V 8Ω THD+N=10% 1.08W
3.3V 8Ω THD+N=10% 0.65W

FI
AT command “AT+CMIC” is used to adjust the input gain level of microphone. AT command “AT+SIDET”

AL
is used to set the side-tone level. In addition, AT command “AT+CLVL” is used to adjust the output gain level.
For more details, please refer to document [1].

TI
In order to improve audio performance, the following reference circuits are recommended. The audio signals
have to be layout according to differential signal layout rules as shown in Figure 28 and Figure 29.

5.7.1. Speaker Interfaces Configuration

EN
D
FI

Close to speaker
N

ESD
O

10pF 33pF 33pF

10pF
SPK1P/2P
C

10pF 33pF 33pF

10pF
SPK1N/2N
10pF 33pF ESD
10pF 33pF
Module
M
O

Figure 28: Speaker reference circuit

C
M
SI

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5.7.2. Microphone Interfaces Configuration

These components should

be placed to microphone
as close as possible

ESD
10pF 33pF

E
MICP
The lines in bold type should
be accorded to differential 10pF 33pF

L
signal layout rules Electret
MICN
Microphone

FI
ESD
10pF 33pF
Module

AL
TI
Figure 29: Microphone reference circuit

EN
5.7.3. Audio Electronic Characteristic
D
Table 15: Microphone input characteristics
FI

Parameter Min Typ Max Unit

N

Microphone biasing voltage - 1.9 2.2 V

O

Working current - - 2.0 mA

Input impedance(differential) 13 20 27 KΩ
C

Idle channel noise - - -67 dBm0

Input level:-40dBm0 29 - - dB
SINAD
Input level:0dBm0 - 69 - dB
M
O

Table 16: Audio output characteristics

C

Parameter Conditions Min Typ Max Unit

RL=32 Ω receiver - 15 90 mW
M

Normal output
RL=8 Ω speaker - - 1080 mW
SI

5.7.4. TDD Noise of GSM

Audio signal could be interfered by RF signal. Coupling noise could be filtered by adding 33pF and 10pF
capacitor to audio lines. 33pF capacitor could eliminate noise from GSM850/EGSM900MHz, while 10pF
capacitor could eliminate noise from DCS1800/PCS1900Mhz frequency. Customer should adjust this filter
solution according to field test result.

SIM868_Series_Hardware_Design_V1.07 36 2018-01-18
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GSM antenna is the key coupling interfering source of TDD noise. Thereat, pay attention to the layout of audio
lines which should be far away from RF cable, antenna and GSM_VBAT pin. The bypass capacitor for filtering
should be placed near module.
Conducting noise is mainly caused by the GSM_VBAT drop. If audio PA is powered by GSM_VBAT directly,
then there will be some cheep noise from speaker output easily. So it is better to put big capacitors and ferrite
beads near audio PA input.

TDD noise is related to GND signal. If GND plane is not good, lots of high-frequency noises will interfere
microphone and speaker over bypass capacitor.

E
5.8. SIM Card Interface

L
FI
The SIM interface complies with the GSM Phase 1 specification and the new GSM Phase 2+ specification for
FAST 64kbps SIM card. Both 1.8V and 3.0V SIM card are supported. The SIM interface is powered from an
internal regulator in the module.

AL
5.8.1. SIM Card Application

TI
Table 17: SIM pin definition

Pin name Pin number Function

EN
D
SIM1_VDD 18 Voltage supply for SIM card. Support 1.8V or 3V SIM card
SIM1_DATA 15 SIM data input/output
FI

SIM1_CLK 16 SIM clock

N

SIM1_RST 17 SIM reset

SIM1_DET 14 SIM card detection
O

SIM2_VDD 56 Voltage supply for SIM card. Support 1.8V or 3V SIM card
C

SIM2_DATA 53 SIM data input/output

SIM2_CLK 54 SIM clock
SIM2_RST 55 SIM reset
M

SIM2_DET 52 SIM card detection

O

It is recommended to use an ESD protection component such as ST (www.st.com ) ESDA6V1-5W6 or ON

SEMI (www.onsemi.com ) SMF05C. The SIM card peripheral components should be placed close to the SIM
C

card holder. The reference circuit of the 8-pin SIM card holder is illustrated in Figure 30.
M
SI

SIM868_Series_Hardware_Design_V1.07 37 2018-01-18
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VDD_EXT 4.7K
MOLEX-91228
SIM_VDD
VCC GND
SIM_RST 22R
RST VPP
SIM_CLK 22R
Module SIM_DET
CLK I/O
PRESENCE GND
SIM_DATA 22R
SIM Card
22pF 22pF 22pF 100nF
ESDA6V1

L E
FI
Figure 30: Reference circuit of the 8-pin SIM card holder

The SIM_DET pin is used for detection of the SIM card hot plug in. Customer can select the 8-pin SIM card

AL
holder to implement SIM card detection function. AT command “AT+CSDT” is used to enable or disable SIM
card detection function. For details of this AT command, please refer to document [1].
If the SIM card detection function is not used, customer can keep the SIM_DET pin open. The reference circuit

TI
of 6-pin SIM card holder is illustrated in the Figure 31.

SIM_VDD
SIM_RST 22R
EN MOLEX-91228
VCC GND
RST VPP
SIM_CLK 22R
Module
D
CLK I/O
SIM_DET
C107 10M 006 512
SIM_DATA 22R
FI

22pF 22pF 22pF 100nF

ESDA6V1
N
O
C

Figure 31: Reference circuit of the 6-pin SIM card holder

5.8.2. SIM Card Design Guide

M

SIM card signal could be interfered by some high frequency signal, it is strongly recommended to follow these
O

guidelines while designing:

 SIM card holder should be far away from GSM antenna
C

 SIM traces should keep away from RF lines, GSM_VBAT and high-speed signal lines
M

 The traces should be as short as possible

 Keep SIM card holder’s GND connect to main ground directly
SI

 Shielding the SIM card signal by ground well

 Recommend to place a 100nF capacitor on SIM_VDD line and keep it close to the SIM card holder
 Add some TVS with parasitic capacitance should not exceed 50pF
 Add 22R resistors to (SIM_RST/SIM_CLK/SIM_DATA) signal could enhance ESD protection
 Add 22pF capacitors to (SIM_RST/SIM_CLK/SIM_DATA) signal to reduce RF interference

SIM868_Series_Hardware_Design_V1.07 38 2018-01-18
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5.8.3. Design Considerations for SIM Card Holder

For 8-pins SIM card holder, SIMCom recommends to use Molex 91228. Customer can visit
http://www.molex.com for more information about the holder.

L E
FI
AL
TI
EN
D
FI
N
O
C

Figure 32: Molex 91228 SIM card holder

M

Table 18: Pin description (Molex SIM card holder)

O

Pin name Signal Description

C1 SIM_VDD SIM card power supply
C

C2 SIM_RST SIM card reset

M

C3 SIM_CLK SIM card clock

C4 GND Connect to GND
SI

C5 GND Connect to GND

C6 VPP Not connect
C7 SIM_DATA SIM card data I/O
C8 SIM_DET Detect SIM card presence

SIM868_Series_Hardware_Design_V1.07 39 2018-01-18
 Smart Machine Smart Decision

For 6-pin SIM card holder, SIMCom recommends to use Amphenol C707 10M006 512 .Customer can visit
http://www.amphenol.com for more information about the holder.

L E
FI
AL
TI
EN
D
FI
N

Figure 33: Amphenol C707 10M006 512 SIM card holder

O
C

Table 19: Pin description (Amphenol SIM card holder)

Pin name Signal Description

C1 SIM_VDD SIM card power supply
M

C2 SIM_RST SIM card reset

O

C3 SIM_CLK SIM card clock

C5 GND Connect to GND
C

C6 VPP Not connect

M

C7 SIM_DATA SIM card data I/O

SI

Note: The interval time of removing and plugging SIM card should be greater than 2s. Otherwise may not
detect correctly.

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5.9. SD Interface

The reference circuit is recommended in Figure 34:

MCCA2 DAT2

MCCA3 DAT3

MCCM0 CMD

E
VDD_SD VDD

MCCK CLK

L
GND GND

FI
MCCA0 DAT0
MCCA1 DAT1

AL
Module SD

TI
Figure 34: SD reference circuit

EN
If the power supply is 2.8V for SD card, customer can use VDD_EXT; if the power supply is 3.3V, please use
external LDO.
D
5.10. I2C Bus
FI

The SIM868 provides an I2C interface which is only used in the embedded AT application.
N

Table 20: Pin definition of the I2C

O

Pin name Pin number Description

C

SCL 65 I2C serial bus clock(open drain output)

SDA 64 I2C serial bus data(open drain output)
M

Note:
1. I2C should be pulled up to 2.8V via 4.7K resistor externally.
O

2. I2C function is not supported in the standard firmware. If you need, please contact SIMCom.
C

5.11. ADC
M

Table 21: Pin definition of the ADC

SI

Pin name Pin number Description

ADC 38 Analog voltage input
SIM868 provides an auxiliary ADC, which can be used to measure the voltage. Customer can use AT command
“AT+CADC” to read the voltage value.

Note: Customer can use AT command set mode. For details, please refer to document [1].

SIM868_Series_Hardware_Design_V1.07 41 2018-01-18
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Table 22: ADC specification

Parameter Min Typ Max Unit

Voltage range 0 - 2.8 V
ADC Resolution - 10 - bits
Sampling rate - - 1.08 MHz
ADC precision 10 30 mV

E
5.12. Network Status Indication

L
FI
Table 23: Pin definition of the NETLIGHT

AL
Pin name Pin number Description
NETLIGHT 41 Network Status Indication

TI
The NETLIGHT pin can be used to drive a network status indication LED. The status of this pin is listed in
following table:

Table 24: Status of the NETLIGHT

EN
D
Status SIM868 behavior
Off Powered off
FI

64ms On/ 800ms Off Not registered the network

64ms On/ 3000ms Off Registered to the network
N

64ms On/ 300ms Off GPRS communication is established

O

Reference circuit is recommended in Figure 35:

C

GSM_VBAT
M

R
Module
O

4.7K
NETLIGHT
C

47K
M
SI

Figure 35: Reference circuit of NETLIGHT

Note: Customer can use AT command set mode. For details, please refer to document [1].

5.13. Operating Status Indication

The pin42 is for operating status indication of the module. The pin output is high when module is powered on

SIM868_Series_Hardware_Design_V1.07 42 2018-01-18
 Smart Machine Smart Decision
and low when module is powered off.

Table 25: Pin definition of the STATUS

Pin name Pin number Description

STATUS 42 Operating status indication

Note: For timing about STATUS, please refer to the chapter “Power on/off GSM Part”

5.14. RF Synchronization Signal

L E
The synchronization signal serves to indicate GSM transmit burst.

FI
Table 26: Definition of the RF_SYNC pin

AL
Pin name Pin number Description

RF_SYNC 29 Transmit synchronization signal

TI
RF sync signal is raised to high level 220us prior to GSM transmit burst, and changed to low level at the end of
EN
the GSM transmit burst. The timing of the RF sync signal is shown in Figure 35.

220us 577us
D
FI

Transmit burst
N
O

RF_SYNC
C

Figure 36: RF_SYNC signal during transmit burst

M
O

5.15. Antenna Interface of GSM

C

Antenna interface of GSM:

M

 The input impendence of the antenna should be 50Ω, and the VSWR should be less than 2.
 It is recommended that the GSM antenna should be placed as far as possible.
SI

 The isolation of the antenna should be bigger than 30dB

Note：About RF design, please refer to document [15], [16] for more information.

The GSM antenna pad named GSM_ANT which is connected to an external GSM antenna, the connection of the
antenna must be decoupled from DC voltage. This is necessary because the antenna connector is DC coupled to
ground via an inductor for ESD protection. The external antenna must be matched properly to achieve the best
performance, so the matching circuit is necessary.
It is recommended to reserve the matching circuit as following:

SIM868_Series_Hardware_Design_V1.07 43 2018-01-18
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GND
(Pin31)

Module RF connector GSM

Antenna
GSM_ANT R101
(Pin32)
C101 C102 D101

GND

E
(Pin33)

L
FI
Figure 37: GSM antenna matching circuit

AL
The RF connector is used for conduction test. If the space between RF pin and antenna is not enough, the
matching circuit should be designed as in the following figure:

TI
GND

Module
(Pin31)
EN GSM
GSM_ANT Antenna
D
R101
(Pin32)
FI

C101 C102 D101

GND
N

(Pin33)
O
C

Figure 38: GSM antenna matching circuit without RF connector

In above figure, the components R101, C101 and C102 are used for antenna matching, the value of the
M

components can only be got after the antenna tuning, usually, they are provided by antenna vendor. By default, the
R101 is 0Ω resistor, and the C101, C102 are reserved for tuning.
O

The RF test connector in the figure is used for the conducted RF performance test, and should be placed close to
the module’s antenna pin. The traces impedance between components must be controlled in 50Ω.The component
C

D101 is a bidirectional TVS component, which is used for ESD protection, the recommended part numbers of the
M

TVS are listed in the Table 27:

SI

Table 27: Recommended TVS component

Package Type Supplier

0201 LXES03AAA1-154 Murata
0402 LXES15AAA1-153 Murata

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5.16. Bluetooth Antenna Interface

The Bluetooth Interface of SIM868 is compliant with Bluetooth Specification 3.0. It is recommended to reserve
the matching circuit as following:

GND
(Pin19)

BT
Module Antenna

E
BT_ANT R201
(Pin20)
C201 C202

L
FI
GND
(Pin21)

AL
Figure 39: Bluetooth antenna matching circuit

TI
R201, C201, C202 are the matching circuit, the value should be defined by the antenna design. Normally R201 is
0R, C202 and C201 are not mounted.
EN
There are some suggestions for placing components and RF trace for GSM_ANT/BT_ANT:
 The RF connector is used for conducted test, so keep it as close to pin GSM_ANT as possible;
D
 Antenna matching circuit should be close to the antenna;
 Keep the RF traces impedance as 50Ω;
FI

The RF traces should be kept far away from the high frequency signals and strong interference source. The
following table lists the power consumption of BT3.0.
N
O

Table 28: Current consumption of BT3.0

C

No. Test Case Command Current Note :CSCLK=1, VBAT=3.8V

(mA)
1 Modem Stand at+btpower=0 Turn on flight mode with SIM Card
0.75mA
M

By
Turn on BT at+btpower=1 Modem: off
2 1.9mA
O

with advertising BT: on

3 Inquiring at+btscan=1,60 Modem: off
C

surrounding 31mA BT: on

M

BT device
4 BT Connection at+btpair=0,1 Modem: off
SI

20mA
BT: on
5 Get profile at+btgetprof Modem: off
provided by 20mA BT: on
paired device
6 Push OPP at+btopppush Modem: off
object to 20mA BLE: on
paired device

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5.17. Bluetooth Low Energy (BLE)

SIM868E’s Bluetooth Interface is compliant with Bluetooth v4.0, including BT low energy (BLE).They have the same
reference circuit of Bluetooth antenna, but the BLE has lower power consumption

Table 29: Current consumption (CSCLK=1)

Num Test Case Current Consumption(mA) Note :CSCLK=1, VBAT=3.8V

1 Modem Stand By 0.69 Turn on flight mode with SIM Card
BT On with BLE advertising 2.24 Modem: off

E
2 BT: on (Interval:500ms~1250ms,

L
Normal=880ms)

FI
3 BLE Connection 2.33 Modem: off
BLE: on (Connection Interval:
380ms)

AL
4 BLE-FMP 5.44 Modem: off
BLE: on (BLE Connected, Press

TI
Find my device)
5 BLE-PXP 5.38 Modem: off
EN BLE: on (BLE Connected/Out of
range)
D
Table 30: Current consumption (CSCLK=0)
FI

Num Test Case Current Consumption(mA) Note : VBAT=3.8V

N

1 Modem Stand By 13.1 Turn on Full functionality mode

O

with SIM Card

BT On with BLE advertising 14.0 Modem: on
C

2 BT: on (Interval:500ms~1250ms,
Normal=880ms)
3 BLE Connection 14.3 Modem: on
M

BLE: on (Connection Interval:

380ms)
O

4 BLE-FMP 17.1 Modem: on

C

BLE: on (BLE Connected, Press

Find my device)
M

5 BLE-PXP 17.9 Modem: on

SI

BLE: on (BLE Connected/Out of

range)

Note: For the description of “Modem off”, it means turn on the flight mode (at+cfun=4). For details about AT
command for BT application, please refer to document [17]

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6. Application Interface of GNSS

6.1. GNSS Overview

SIM868 provides a high-performance L1 GNSS solution for cellular handset applications. The solution offers
best-in-class acquisition and tracking sensitivity, Time-To-First-Fix (TTFF) and accuracy. The GNSS supports
both fully-autonomous operations for handheld consumer navigation devices and other standalone navigation
systems.

L E
For GNSS part Performance, please refer to Table 3.

FI
GNSS NMEA outputs through serial port. The default baud rate is 9600/115200bps. (Determine by firmware)

6.2. Power Supply of GNSS

AL
The power supply range of GNSS is from 2.9V to 4.4V. Recommended voltage is 4.0V. The power supply must
be able to provide sufficient current up to 200mA. For the GPS_VBAT input, a bypass capacitor (low ESR) such

TI
as a 10 µF and a 100nF capacitor are strongly recommended.

GPS_VBAT EN
D
FI

10uF 100nF
N
O
C
M

Figure 40: Reference circuit of the GPS_VBAT input

O
C

6.3. Backup Power of GNSS

M

Power source (such as battery or LDO) connected to VRTC pin will help the GNSS chipset keep its internal RTC
running while the main power source is turned off, this will help to short the cold start time. The voltage should be
SI

kept between 2.3~4.3V, and the typical value is 3.0V.

SIM868_Series_Hardware_Design_V1.07 47 2018-01-18
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 Rechargeable battery backup

Module

GNSS Part
Power Supply
GPS_VBAT
Backup LDO
Domain LDO/DCDC

E
VRTC

L
Rechargeable

FI
Backup Battery

AL
Figure 41: RTC supply from rechargeable battery

 External Power

TI
Module

GNSS Part

Backup LDO
ENGPS_VBAT
Power Supply

LDO/DCDC
Domain
D
FI

VRTC
N
O

2.3-4.3V
External power
C

Figure 42: RTC supply from external power

M
O

6.4. Power on/off GNSS

C

The GNSS is controlled by GNSS_EN pin. The GNSS_EN should be pulled up to high (1.5-4.4V) through a 10k
resistor to power on the GNSS, and be pulled to low (0-0.3V) to power off GNSS.
M
SI

2.9-4.4V GPS_VBAT GPS

LDO V_GPS
10K
GNSS_EN
Turn on/off
impulse

Module

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 Smart Machine Smart Decision
Figure 43: Power on/off GNSS

GPS_VBAT
(input)

T1=1s

GNSS_EN
T2=1.6s T =1.9s
2
V_GPS

E
NEMA

L
GPS_TX

FI
Figure 44: Timing of power on GNSS

AL
GPS_VBAT
(input)

TI
T1=3.4s
GNSS_EN

V_GPS
EN
D
GPS_TX
FI

NEMA
N
O

Figure 45: Timing of power off GNSS

C

6.5. Serial Port of GNSS

M

GNSS UART interface support NMEA output and PMTK command input.
O

Table 31: Serial port pin definition

C

Pin name Pin number Function

M

GPS_TXD 61 Transmit data

Serial port
SI

GPS_RXD 62 Receive data

Table 32: Serial port characteristics

Symbol Min Max Unit

VIL -0.3 0.7 V
VIH 2.1 3.0 V
VOL - 0.4 V

SIM868_Series_Hardware_Design_V1.07 49 2018-01-18
 Smart Machine Smart Decision

VOH 2.4 - V

6.6. Software Upgrade of GNSS

GNSS firmware can be upgraded through UART interface.

Module(GNSS) I/O Connector

Serial Port
GPS_TXD TXD

E
GPS_RXD RXD

L
FI
GND GND
10K
GNSS_EN 2.8V

AL
Figure 46: Connection for software upgrading and debugging for GNSS

TI
If customer upgrades GSM and GNSS part in all-in-one mode, the GNSS UART should be connected to GSM
EN
UART2; GNSS_EN must be connected to GPIO1 of GSM part through 10K resistance. Thus customer could
upgrade the module through UART1 or USB port of GSM.
D
FI

GPS_TXD
GPS_RXD
GNSS_EN
N

R1 R2 R3
SIM868 Module
O

0R 0R 10K

GPIO1
C

UART2_TXD
UART2_RXD
M

Figure 47: Connection for software upgrading in all-in-one Mode

O

Note: GNSS_EN must be connected to GPIO1 of GSM part

C

6.7. 1PPS Output

M

The 1PPS pin outputs pulse-per-second signal for precise timing purposes after the position has been fixed. The
SI

1PPS signal can be provided through designated output pin for many external applications. This pulse is not only
limited to be active every second but also allowed to set the required duration, frequency, and active high/low by
programming user-defined settings.
Figure 48 is the typical application of the 1PPS function:

SIM868_Series_Hardware_Design_V1.07 50 2018-01-18
 Smart Machine Smart Decision

GPS_VBAT

R
Module
4.7K
1PPS

47K

L E
FI
Figure 48: 1PPS Application circuit

AL
6.8. Antenna Interface

TI
Antenna interface of GNSS:
EN
 The input impendence of the antenna should be 50Ω, and the VSWR should be less than 2.
 It is recommended that the GNSS antenna should be placed as far as possible to other antenna.
 The isolation of the antenna should be more than 30dB
D
Note：About RF design, please refer to document [15], [16] for more information.
FI

6.8.1. Passive Antenna

N
O

Passive antenna contains only the radiating element, e.g.: the ceramic patch, the helix structure, and chip antennas.
Sometimes it also contains a passive matching network to match the electrical connection to 50Ω impedance.
C

The most common antenna type for GPS/GLONASS application is the patch antenna. Patch antennas are flat, gen
erally have a ceramic and metal body and are mounted on a metal base plate.
M

GNSS
Passive
MODULE
Antenna
O

Matching circuit

GPS_ANT BPF
C

(PIN68) R101

C101 C102
M

GND
(PIN67)
SI

Figure 49: GNSS passive antenna matching circuit

The components R101, C101 and C102 are used for antenna matching, the BPF is used for out of band noise
signal suppression. The components’ value only can be got after the antenna tuning. Normally R101 is 0Ω, C101
and C102 are not mounted.

SIM868_Series_Hardware_Design_V1.07 51 2018-01-18
 Smart Machine Smart Decision
6.8.2. Active Antenna

Active antenna has an integrated Low-Noise Amplifier (LNA). VCC_ANT is needed on customer’s application
board for the active antenna power input, as shown in Figure 50.
GNSS
Active
Antenna
VCC_ANT
R102 10Ω L101 27nH
MODULE

Matching circuit

E
GPS_ANT BPF
(PIN68) R101
GND C101 C102

L
(PIN67)

FI
AL
Figure 50: GNSS active antenna matching circuit

TI
The inductor L101 is used to prevent the RF signal from leaking into the VCC_ANT pass and route the bias
supply to the active antenna, the recommended value of L101 is no less than 27nH. R102 can protect the whole
circuit in case the active antenna is shorted to ground. EN
Table 33: Recommended BPF component
D
Package Type Supplier
FI

1.10*0.90 SAFFB1G56KB0F0A Murata

N
O

6.9. Operation Modes of GNSS

C

GNSS supports operating modes like full on mode, stop mode, backup mode, periodic mode, AlwaysLocateTM
mode and GLP mode.

Full on mode: In this mode, the GNSS will enter full on mode after first power up. Power consumption will
M


vary depending on the amount of satellite acquisitions and number of satellites in track.
O

Table 34: Default configuration of GNSS (full on mode)

C

Item Configuration Comment

M

Baud rate Depend on firmware 9600/115200bps

SI

GNSS GPS+GLONASS GPS/BEIDOU/GLONASS

Update rate 1Hz default 10Hz Max
SBAS Enable
AIC Enable

Note: The GNSS modes mentioned above are set by PMTK commands. The PMTK commands for multiple
position chosen are illustrated as below:
$PMTK353,1,0,0,0,0*2A (GPS only)
$PMTK353,0,0,0,0,1*2A (BEIDOU only)
SIM868_Series_Hardware_Design_V1.07 52 2018-01-18
 Smart Machine Smart Decision
$PMTK353,0,1,0,0,0*2A (GLONASS only)
$PMTK353,1,1,0,0,0*2B (GPS+GLONASS)
$PMTK353,1,0,0,0,1*2B (GPS+BEIDOU)
Customer can refer to document [13] for more information.

 Stop mode: Stop mode means a low quiescent (590uA typ) power state and a PMTK command can be used
to enter. Any character input will exit from stop mode.

Note: Using the PMTK161 command to enter stop mode: "$PMTK161,0*28"

E
Customer can refer to document [13] for more information.

L
 Backup mode: In this mode, the power source (such as battery) is connected to VRTC pin, which will help

FI
to keep its internal RTC running when the GPS_VBAT is turned off. The VRTC power must be kept active
all the time, the GNSS module will perform a quick start every power-on.
Backup mode has lower power consumption than stop mode. The power consumption in this mode is about

AL
8uA.

TI
 Periodic mode: In this mode, periodic control power on/off of GPS to reduce power consumption.
"$PMTK225,(Type),(Run time),(Sleep time),(Second run time),(Second sleep time)*15"

Note: Using the PMTK225 command to set periodic mode:

EN
Periodic backup mode:
D
"$PMTK225,0*2B"
"$PMTK223,1,25,180000,60000*38"
FI

"$PMTK225,1,3000,12000,18000,72000*15"
Periodic stop mode:
N

"$PMTK225,0*2B"
O

"$PMTK223,1,25,180000,60000*38"
"$PMTK225,2,3000,12000,18000,72000*15"
C

Customer can refer to document [13] for more information.

 AlwaysLocateTM mode: AlwaysLocateTM is an intelligent controller of GNSS periodic mode. Depending on

M

the environment and motion conditions, GNSS can adaptive adjust the on/off time to achieve balance of
positioning accuracy and power consumption.
O

Note: Using the PMTK225 command to set AlwaysLocateTM mode.

C

AlwaysLocateTM Stop mode:

M

"$PMTK225,0"
"$PMTK225,8"
SI

AlwaysLocateTM Backup mode:

"$PMTK225,0"
"$PMTK225,9"
Customer can refer to document [13] for more information.

 GLP mode: The power consumption is lower in GLP (GNSS low power) mode. GNSS can be waked up
when the host sends the command through the communication interface.

GLP mode is to achieve 1Hz NMEA output and power saving, switch the Measurement Engine (DSP) and

SIM868_Series_Hardware_Design_V1.07 53 2018-01-18
 Smart Machine Smart Decision
Positioning Engine (ARM) on/off. In GLP mode, the active time (on time) of Measurement Engine (DSP)
and Positioning Engine (ARM) should be adjusted dynamically according to GNSS signal.

Note: Using the PMTK262 command to enable/disable GLP mode:

"$PMTK262,3" Enable GLP mode;
"$PMTK262,0" Disable GLP mode;
Customer can refer to document [13] for more information.

6.10. A-GPS

L E
A-GPS means assisted GPS, which is a system that can improve the startup performance and time-to-first-fix

FI
(TTFF) of a GNSS satellite-based positioning under certain conditions. GNSS part supports EPO file, EASY
MODE and SBAS.

AL
6.10.1. Easy Mode

Easy is the abbreviation of Embedded Assist System, it works as embedded firmware which accelerates TTFF by

TI
predicting satellite navigation messages from received ephemeris.

EN
No additional computing interval for Easy task. Easy is efficiently scheduled and computed in free time of every
second after GNSS navigation solution.
D
Easy function is conceptually designed to automatically engage for predicting after first receiving the broadcast
FI

ephemeris. After a while（generally tens of seconds）, 3-day extensions will be completely generated then all
Easy functions will be maintained at a standby condition. Easy assistance is going to be engaged when the GNSS
N

requests in new TTFF condition or re-generates again with another new received ephemeris. Meanwhile, TTFF
will be benefited by Easy assistance.
O

Note: The modes mentioned above can be set by PMTK commands; customer can refer to document [13] for
C

more information.

6.10.2. EPO
M
O

GNSS supports the EPO (Extended Prediction Orbit) data service. The EPO data service supports 7/14/30 days
orbit prediction to customers. It needs to download aiding information from EPO server, which includes
C

ephemeris, almanac, rough last position ,time, satellite status and an optional time synchronization signal. This
M

function will reduce time of first fixing significantly and improving the acquisition sensitivity. Customer should
update the EPO files from EPO server daily through the GSM part.
SI

Note: The modes mentioned above can be set by PMTK commands; customer can refer to document [13] for
more information.

6.11. Fast-Fix

The Fast-Fix technology is based on the latest EPO data. Fast-Fix online provides extra time aiding from NITZ

SIM868_Series_Hardware_Design_V1.07 54 2018-01-18
 Smart Machine Smart Decision
or NTP, which could reduce TTFF and acquisition sensitivity in cold start.

6.12. Multi-tone AIC

SIM868 module supports Multi-tone AIC (active interference canceller) to suppress the RF noise from GSM,
Wi-Fi and so on.
With the help of AIC function, The GNSS signal could be demodulated from the jammed signal, which can
ensure better navigation quality. AIC function is enabled by default. Enabling AIC function will increase extra
current consumption

E
Note: Using the PMTK286 command to enable/disable AIC function:

L
Enable AIC function: $PMTK286,1*23

FI
Disable AIC function: $PMTK286,0*22

6.13. SBAS

AL
SBAS is the abbreviation of Satellite Based Augmentation System. The SBAS concept is based on the
transmission of differential corrections and integrity messages for navigation satellites that are within sight of a

TI
network of reference stations deployed across an entire continent. SBAS messages are broadcast via
geostationary satellites that are able to cover vast areas.
EN
Several countries have implemented their own satellite-based augmentation system. Europe has the European
Geostationary Navigation Overlay Service (EGNOS) which covers Western Europe and beyond. The USA has its
D
Wide Area Augmentation System (WAAS). Japan is covered by its Multi-functional Satellite Augmentation
FI

System (MSAS). India has launched its own SBAS program named GPS and GEO Augmented Navigation
(GAGAN) to cover the Indian subcontinent.
N
O
C
M
O
C
M
SI

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7. PCB Layout
This section provides some guidelines on PCB layout, in order to eliminate interference or noise.

7.1. Pin Assignment

Before PCB layout, we should learn about pin assignment in order to get reasonable layout with so many
external components. Figure 51 is the overview of pin assignment of the module.

E
STATUS NETLIGHT VDD_EXT PWRKEY ADC GND GND VBAT GPS_VBAT

L
42 41 40 39 38 37 36 35 34

FI
68 67 66 65 64 63
UART1_TXD 1 33 GND

GPS_ANT GND GND SCL SDA GND

AL
UART1_RXD 2 32 GSM_ANT

SPK2N 43

TI
UART1_RTS 3 31 GND

UART1_CTS 4
SPK2P 44 GND GND
EN GND

30 GND
D
GND 45
UART1_DCD 5 69 76 75 29 RF_SYNC
FI

UART1_DTR 6
UART1_DTR 28 VRTC
N

MCCA3 46 62 GPS_RXD

GND GND GND

O

UART1_RI 7 27 GND
MCCA2 47 61 GPS_TXD
C

GND 8 70 77 74 26 USB_DM
MCCA1 48 60 1PPS
M

MICP 9 25 USB_DP
O

MCCA0 49 GND GND GND 59 GNSS_EN

MICN 10 24 USB_VBUS
C

58 GPIO2
MCCK
M

50
11 71 72 73
SPK1P 23 UART2_RXD
SI

MCCM0 SIM2_DET SIM2_DATA SIM2_CLK SIM2_RST SIM2_VDD GPIO1

SPK1N 12 22 UART2_TXD
51 52 53 54 55 56 57

13 14 15 16 17 18 19 20 21

GND SIM1_DET SIM1_DATA SIM1_CLK SIM1_RST SIM1_VDD GND BT_ANT GND

Figure 51: PIN assignment

SIM868_Series_Hardware_Design_V1.07 56 2018-01-18
 Smart Machine Smart Decision

7.2. Principle of PCB Layout

7.2.1. Antenna Interface

 Antenna interface used for RF conducting test such as coaxial cable pad, RF connector
should be placed close to RF_IN pad.
 RF trace should be as short and direct as possible.
 Keep the impedance of RF traces as 50Ω;

E
 Avoid any other signal crossing or parallel directly under the RF trace.

L
7.2.2. Power Supply

FI
 VBAT and GND are very important in layout.

AL
 The VBAT trace should be as short and wide as possible.
 Zener diode and capacitor should be placed close to VBAT pin.
 The trace of pin 36 and pin37 to main GND should be as short and wide as possible.

TI
7.2.3. SIM Card Interface


GSM transmitter.
EN
Ensure SIM card holder is far away from antenna or RF cable to avoid high power interference of
D
 Put SIM card holder near the module.
 Add ESD component to protect SIM_CLK, SIM_DATA, SIM_RST and SIM_VDD signals.
FI

 All the signals should be far away from power and high-speed-frequency signal.
 The length of signals should be less than 100mm.
N

7.2.4. Audio Interface

O

The signal trace of audio should be far away from antenna

C


 The signal trace of audio should not parallel to VBAT
 The audio trace are surrounded with GND
M
O
C
M
SI

SIM868_Series_Hardware_Design_V1.07 57 2018-01-18
 Smart Machine Smart Decision

8. Electrical, Reliability and Radio Characteristics

8.1. Absolute Maximum Ratings

The absolute maximum ratings stated in Table 35 are stress ratings under non-operating conditions. Stresses
beyond any of these limits will cause permanent damage to SIM868.

Table 35: Absolute maximum ratings

E
Symbol Min Typ Max Unit

L
GSM_VBAT - - 4.5 V

FI
GPS_VBAT - - 4.5
VRTC - - 4.5

AL
GNSS_EN - - 4.5
Current (GSM_VBAT) 0 - 2.0 A

TI
USB_VBUS - - 7 V
II* - 4 16 mA
IO* - 4 EN
*These parameters are for digital interface pins, GPIO, and UART.
16 mA
D
8.2. Recommended Operating Conditions
FI

Table 36: Recommended operating conditions

N

Symbol Parameter Min Typ Max Unit

O

GSM_VBAT GSM power supply voltage 3.4 4.0 4.4 V

C

GPS_VBAT GPS power supply voltage 2.9 4.0 4.4

VRTC Backup battery voltage 2.3 4.3
GNSS_EN(VOH) GPS enable 1.5 2.8 4.4 V
M

GNSS_EN(VOL) GPS disable - - 0.3 V

TOPER Operating temperature -40 +25 +85 ℃
O

TSTG Storage temperature -45 +90 ℃

C
M

8.3. Digital Interface Characteristics

SI

Table 37: Digital interface characteristics

Symbol Parameter Min Typ Max Unit

VIH High-level input voltage 2.1 - 3.0 V
VIL Low-level input voltage -0.3 - 0.7 V
VOH High-level output voltage 2.4 - - V
VOL Low-level output voltage - - 0.4 V

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 Smart Machine Smart Decision
Note: These parameters are for digital interface pins, such as GPIO and UART.

8.4. SIM Card Interface Characteristics

Table 38: SIM card interface characteristics

Symbol Parameter Min Typ Max Unit

IIH High-level input current -1.0 - 1.0 uA
IIL Low-level input current -1.0 - 1.0 uA

E
1.4 - - V
VIH High-level input voltage
2.4 - - V

L
- - 0.27 V

FI
VIL Low-level input voltage
0.4 V
1.62 - - V

AL
VOH High-level output voltage
2.7 - - V
- - 0.36 V
VOL Low-level output voltage

TI
- - 0.4 V

8.5. SIM_VDD Characteristics

EN
D
Table 39: SIM_VDD characteristics
FI

Symbol Parameter Min Typ Max Unit

- 3.0 -
N

VO Output voltage V
- 1.8 -
O

IO Output current - - 10 mA
C

8.6. VDD_EXT Characteristics

M

Table 40: VDD_EXT characteristics

O

Symbol Parameter Min Typ Max Unit

VO Output voltage 2.7 2.8 2.9 V
C

IO Output current - - 50 mA
M
SI

8.7. Current Consumption（GSM_VBAT=4.0V）

Table 41: Current consumption

Symbol Parameter Conditions Min Typ Max Unit

Voltage 4.0 V
GSM_VBAT Power drop PCL=5 350 mV
Voltage ripple PCL=5

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 Smart Machine Smart Decision

@ f<200kHz 50 mV
@ f>200kHz 2.0 mV
Power off mode 130 150 uA
Sleep mode (AT+CFUN=1)：
( BS-PA-MFRMS=9 ) 0.86 mA
( BS-PA-MFRMS=5) 1.02 mA
( BS-PA-MFRMS=2) 1.42 mA
Idle mode (AT+CFUN=1)：
GSM850 13.7 mA

E
EGSM900 13.7 mA

L
DCS1800 13.7 mA

FI
PCS1900 13.7 mA
Voice call (PCL=5)：
GSM850 223 mA

AL
EGSM900 234 mA
Voice call (PCL=0)：
DCS1800 162 mA

TI
IGSM_VBAT Average current PCS1900 170 mA

GSM850
EGSM900
EN
Data mode GPRS (1Rx,4Tx)：
378
414
mA
mA
D
DCS1800 270 mA
PCS1900 308 mA
FI

Data mode GPRS (3Rx,2Tx)：

GSM850 323 mA
N

EGSM900 340 mA
O

DCS1800 212 mA
PCS1900 236 mA
C

Data mode GPRS (4Rx,1Tx)：

GSM850 217 mA
EGSM900 223 mA
M

DCS1800 153 mA
PCS1900 163 mA
O

IMAX Peak current During Tx burst 2.0 A

C

Note: In Table 41 the current consumption value is the typical one of the module tested in laboratory. In the
M

mass production stage, there may be differences among each individual.

SI

8.8. Electro-Static Discharge

SIM868 is an ESD sensitive component, so attention should be paid to the procedure of handling and packaging.
The ESD test results are shown in the following table.

Table 42: The ESD characteristics (Temperature: 25℃, Humidity: 45 %)

Pin name Contact discharge Air discharge

VBAT ±5KV ±10KV

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GND ±5KV ±10KV

UART1_TXD /UART1_RXD ±4KV ±8KV
Antenna port ±5KV ±10KV
SPKP/SPKN/MICP/MICN ±4KV ±8KV
PWRKEY ±4KV ±8KV

8.9. Radio Characteristics

E
8.9.1. Module RF Output Power

L
The Table 43 shows the module conducted output power, it follows the 3GPP TS 05.05 technical specification

FI
requirement.

AL
Table 43: GSM850 and EGSM900 conducted RF output power

GSM850, EGSM900

TI
Tolerance (dB) for conditions
PCL Nominal output power (dBm)
Normal Extreme
5
6
33
31
EN ±2
±3
±2.5
±4
D
7 29 ±3 ±4
8 27 ±3 ±4
FI

9 25 ±3 ±4
10 23 ±3 ±4
N

11 21 ±3 ±4
O

12 19 ±3 ±4
C

13 17 ±3 ±4
14 15 ±3 ±4
15 13 ±3 ±4
M

16 11 ±5 ±6
17 9 ±5 ±6
O

18 7 ±5 ±6
C

19-31 5 ±5 ±6
M

Table 44: DCS1800 and PCS1900 conducted RF output power

SI

DCS1800,PCS1900
Tolerance (dB) for conditions
PCL Nominal output power (dBm)
Normal Extreme
0 30 ±2 ±2.5
1 28 ±3 ±4
2 26 ±3 ±4
3 24 ±3 ±4

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 Smart Machine Smart Decision

4 22 ±3 ±4
5 20 ±3 ±4
6 18 ±3 ±4
7 16 ±3 ±4
8 14 ±3 ±4
9 12 ±4 ±5
10 10 ±4 ±5
11 8 ±4 ±5

E
12 6 ±4 ±5

L
13 4 ±4 ±5

FI
14 2 ±5 ±6
15 0 ±5 ±6
For the module’s output power, the following should be noted:

AL
At GSM900 and GSM850 band, the module is a class 4 device, so the module’s output power should not exceed

TI
33dBm, and at the maximum power level, the output power tolerance should not exceed +/-2dB under normal
condition and +/-2.5dB under extreme condition.

EN
At DCS1800 and PCS1900 band, the module is a class 1 device, so the module’s output power should not exceed
30dBm, and at the maximum power level, the output power tolerance should not exceed +/-2dB under normal
D
condition and +/-2.5dB under extreme condition.
FI

8.9.2. Module RF Receive Sensitivity

N

Table 45 shows the module’s conducted receiving sensitivity; it is tested under static condition.
O

Table 45: Conducted RF receive sensitivity

C

Frequency Receive sensitivity（Typical） Receive sensitivity(Max)

GSM850,EGSM900 < -109dBm < -107dBm
DCS1800,PCS1900 < -109dBm < -107dBm
M

8.9.3. Module Operating Frequencies

O

The Table 46 shows the module’s operating frequency range; it follows the 3GPP TS 05.05 technical
C

specification requirement.
M

Table 46: Operating frequencies

SI

Frequency Receive Transmit

GSM850 869 ～ 894MHz 824 ～ 849MHz
EGSM900 925 ～ 960MHz 880 ～ 915MHz
DCS1800 1805 ～ 1880MHz 1710 ～ 1785MHz
PCS1900 1930 ～ 1990MHz 1850 ～ 1910MHz

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9. Manufacturing

9.1. Top and Bottom View of SIM868

L E
FI
AL
TI
EN
D
Figure 52: Top and bottom view of SIM868
FI

9.2. Typical Solder Reflow Profile

N
O
C
M
O
C
M
SI

Figure 53: Typical solder reflow profile of lead-free process

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 Smart Machine Smart Decision
9.3. The Moisture Sensitivity Level

The moisture sensitivity level of SIM868 module is 3. The modules should be mounted within 168 hours after
unpacking in the environmental conditions of temperature <30℃ and relative humidity of <60% (RH). It is
necessary to bake the module if the above conditions are not met:

Table 47: Moisture sensitivity level and floor life

Moisture Sensitivity Level Floor Life (out of bag) at factory ambient≤30°C/60% RH or as stated
(MSL)

E
1 Unlimited at ≦30℃/85% RH

L
2 1 year

FI
2a 4 weeks
3 168 hours

AL
4 72 hours
5 48 hours
5a 24 hours

TI
Mandatory bake before use. After bake, it must be reflowed within the time limit
6
specified on the label.
NOTES:
EN
1. If the vacuum package is not open for 3 months or longer than the packing date, baking is also
D
recommended before re-flow soldering.
2. For product handling, storage, processing, IPC / JEDEC J-STD-033 must be followed.
FI

9.4. Baking Requirements

N

SIM868 modules are vacuum packaged, and guaranteed for 6 months storage without opening or leakage under
O

the following conditions: the environment temperature is lower than 40℃, and the air humidity is less than 90%.
C

If the condition meets one of the following ones shown below, the modules should be baked sufficiently before
re-flow soldering, and the baking condition is shown in table below; otherwise the module will be at the risk of
permanent damage during re-flow soldering.
M

 If the vacuum package is broken or leakage;

O

 If the vacuum package is opened after 6 months since it’s been packed;
C

 If the vacuum package is opened within 6 months but out of its Floor Life at factory ambient≦30℃
/60%RH or as stated.
M

Table 48: Baking requirements

SI

Baking temperature Moisture Time

40℃±5℃ <5% 192 hours
120℃±5℃ <5% 4 hours

Note: Care should be taken if that plastic tray is not heat-resistant, the modules should be taken out for
preheating, and otherwise the tray may be damaged by high-temperature heating.

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10. Packaging
SIM868 module support tray packaging.

L E
FI
AL
TI
EN
Figure 54: Packaging introduce
D
FI
N
O
C
M
O
C

Figure 55: Module tray drawing

M
SI

Table 49: Tray size

Length（±3mm） Width（±3mm） Number

242.0 161.0 50

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 Smart Machine Smart Decision

L E
FI
Figure 56: Small carton drawing

AL
TI
Table 50: Small Carton size

Length（±10mm）
270
Width（±10mm）
180
EN
Height（±10mm）
120
Number
50*20=1000
D
FI
N
O
C
M
O

Figure 57: Big carton drawing

C
M
SI

Table 51: Big Carton size

Length（±10mm） Width（±10mm） Height（±10mm） Number

380 280 280 1000*4=4000

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11. Appendix

11.1. Related Documents

Table 52: Related documents

SN Document name Remark

[1] SIM800_Series_AT_Command_Manual

E
SIM800 Series UART Port Application
[2]
Note_V1.01.doc

L
SIM800 Series_TCPIP_Application

FI
[3]
Note_V1.02
ITU-T Draft new recommendation
[4] Serial asynchronous automatic dialing and control

AL
V.25ter：
Digital cellular telecommunications (Phase 2+); AT
[5] GSM 07.07：
command set for GSM Mobile Equipment (ME)

TI
[6] GSM 07.10： Support GSM 07.10 multiplexing protocol

[7] GSM 07.05：

EN
Digital cellular telecommunications (Phase 2+); Use of Data
Terminal Equipment – Data Circuit terminating Equipment
(DTE – DCE) interface for Short Message Service (SMS)
D
and Cell Broadcast Service (CBS)
Digital cellular telecommunications system (Phase 2+);
FI

Specification of the SIM Application Toolkit for the

[8] GSM 11.14：
Subscriber Identity Module – Mobile Equipment (SIM –
N

ME) interface
O

Digital cellular telecommunications system (Phase 2+);

[9] GSM 11.11： Specification of the Subscriber Identity Module – Mobile
C

Equipment (SIM – ME) interface

Digital cellular telecommunications system (Phase 2+);
[10] GSM 03.38：
Alphabets and language-specific information
M

Digital cellular telecommunications system (Phase 2) ；

[11] GSM 11.10 Mobile Station (MS) conformance specification； Part 1：
O

Conformance specification
C

[12] AN_Serial Port AN_Serial Port

SIM868_NMEA Message
M

[13]
Specification_V1.00
SI

[14] EPO-II_Format_Protocol_Customer EPO-II_Format and Protocol

[15] SIM868_RF_Design_Application Note
AN_SMT Module_RF_Reference
[16]
Design_Guide
[17] SIM800_Series_BT_Command_Manual

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11.2. Terms and Abbreviations

Table 53: Terms and abbreviations

Abbreviation Description
ADC Analog-to-Digital Converter
AMR Adaptive Multi-Rate
CS Coding Scheme
CTS Clear to Send

E
DTE Data Terminal Equipment (typically computer, terminal, printer)

L
DTR Data Terminal Ready

FI
DTX Discontinuous Transmission
EFR Enhanced Full Rate
EGSM Enhanced GSM

AL
ESD Electrostatic Discharge
ETS European Telecommunication Standard

TI
FR Full Rate
GPRS General Packet Radio Service
GSM
HR
EN
Global Standard for Mobile Communications
Half Rate
D
MO Mobile Originated
MS Mobile Station (GSM part), also referred to as TE
FI

MT Mobile Terminated
N

PAP Password Authentication Protocol

PBCCH Packet Broadcast Control Channel
O

PCB Printed Circuit Board

C

PCL Power Control Level

PCS Personal Communication System, also referred to as GSM 1900
PDU Protocol Data Unit
M

PPP Point-to-point protocol

RF Radio Frequency
O

RMS Root Mean Square (value)

C

RX Receive Direction
SIM Subscriber Identification Module
M

SMS Short Message Service

SI

TE Terminal Equipment, also referred to as DTE

TX Transmit Direction
SINAD Signal to Noise and Distortion Ratio
UART Universal Asynchronous Receiver & Transmitter
URC Unsolicited Result Code
USSD Unstructured Supplementary Service Data
A-GPS Assisted Global Positioning System
CMOS Complementary Metal Oxide Semiconductor
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 Smart Machine Smart Decision

CEP Circular Error Probable

GLP GNSS Low Power
DGPS Difference Global Positioning System
EEPROM Electrically Erasable Programmable Read Only Memory
EPO Extended Prediction Orbit
ESD Electrostatic Sensitive Devices
EASY Embedded Assist System
EGNOS European Geostationary Navigation Overlay Service

E
GPS Global Positioning System

L
GAGAN The GPS Aided Geo Augmented Navigation

FI
kbps Kilo bits per second
MSL moisture sensitive level
MSAS Multi-Functional Satellite Augmentation System

AL
NMEA National Marine Electronics Association
PRN Pseudo Random Noise Code

TI
QZSS Quasi-Zenith Satellites System
SBAS Satellite Based Augmentation Systems
WAAS
Phonebook abbreviations
EN
Wide Area Augmentation System
D
FD SIM fix dialing phonebook
LD SIM last dialing phonebook (list of numbers most recently dialed)
FI

MC Mobile Equipment list of unanswered MT calls (missed calls)

N

ON SIM (or ME) own numbers (MSISDNs) list

RC Mobile Equipment list of received calls
O

SM SIM phonebook
C

NC Not connect
M
O
C
M
SI

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11.3. Safety Caution

Table 54: Safety caution

Marks Requirements
When in a hospital or other health care facility, observe the restrictions about the use of mobiles.
Switch the cellular terminal or mobile off, medical equipment may be sensitive to not operate
normally for RF energy interference.

E
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off.

L
The operation of wireless appliances in an aircraft is forbidden to prevent interferes with

FI
communication systems. Forget to think much of these instructions may lead to the flight safety or
offend against local legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch

AL
off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where
blasting operations are in progress. Operation of any electrical equipment in potentially explosive

TI
atmospheres can constitute a safety hazard.

Your cellular terminal or mobile receives and transmits radio frequency energy while switched on.
EN
RF interferes can occur if it is used close to TV sets, radios, computers or other electric equipment.

Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a
D
vehicle, unless it is securely mounted in a holder for hands free operation. Before making a call
with a hand-held terminal or mobile, park the vehicle.
FI

GSM cellular terminals or mobiles operate over radio frequency signals and cellular networks and
N

cannot be guaranteed to connect in all conditions, for example no mobile fee or a invalid SIM card.
While you are in this condition and need emergent help, please remember using emergency calls.
O

In order to make or receive calls, the cellular terminal or mobile must be switched on and in a
service area with adequate cellular signal strength.
C

Some networks do not allow for emergency call if certain network services or phone features are in
use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you
can make an emergency call.
M

Also, some networks require that a valid SIM card be properly inserted in the cellular terminal or
mobile.
O
C
M
SI

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 Smart Machine Smart Decision

Contact us:
Shanghai SIMCom Wireless Solutions Co.,Ltd.
Address: Building A, SIM Technology Building, No. 633, Jinzhong Road, Shanghai, P. R. China
200335
Tel: +86 21 3252 3300
Fax: +86 21 3252 3020
URL: www.simcomm2m.com

L E
FI
AL
TI
EN
D
FI
N
O
C
M
O
C
M
SI

SIM868_Series_Hardware_Design_V1.07 71 2018-01-18