ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES ®

IPC-6013A
Amendment 1

Qualification and Performance

Specification for Flexible
Printed Boards

IPC-6013A
Amendment 1
January 2005 A standard developed by IPC

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January 2005 IPC-6013A - Amendment 1

Qualification and Performance

Specification for Flexible Printed Boards

Global Replacement for Dimensional Values

Convert all micrometer (µm) dimensions to millimeter (mm) dimensions. Convert all corresponding micro-inch [µin]
dimensions to inch dimensions [in] and limit the accuracy to no more than 5 digits to the right of the decimal point.
Table 1-1 Final Finish, Surface Plating and Coating Thickness Requirements
Replace dimensional values in table as follows (excluding GWB-1 and Immersion Gold which cannot be expressed in
inches in less than 6 digits to the right of the decimal point):
Code Finish Class 1 Class 2 Class 3
Final Finish
Coverage and Coverage and Coverage and
S Solder Coating over Bare Copper
Solderable5 Solderable5 Solderable5
Coverage and Coverage and Coverage and
T Electrodeposited Tin-Lead (fused) (min.)
Solderable5 Solderable5 Solderable5
X Either Type S or T As indicated by code
0.008 mm 0.008 mm 0.008 mm
TLU Electrodeposited Tin-Lead Unfused (min)
[0.00031 in] [0.00031 in] [0.00031 in]
Gold Electroplate (min.) for flexible printed
0.0008 mm 0.0008 mm 0.0013 mm
G wiring edge connectors and areas not
[0.00003 in] [0.00003 in] [0.00005 in]
intended to be soldered
Gold Electroplate (max.) for areas 0.0008 mm 0.0008 mm 0.0008 mm
GS
intending to be soldered [0.00003 in] [0.00003 in] [0.00003 in]
Gold Electroplate for areas to be wire 0.05 µm 0.05 µm 0.05 µm
GWB-1
bonded (ultrasonic) (min) [1.97 µin] [1.97 µin] [1.97 µin]
Gold Electroplate for areas to be wire 0.0003 mm 0.0003 mm 0.0008 mm
GWB-2
bonded (thermosonic) (min) [0.00001 in]] [0.00001 in]] [0.00003 in]
Nickel - Electroplate for Edge Board 0.002 mm 0.0025 mm 0.0025 mm
N
Connectors (min) [0.00008 in] [0.00010 in] [0.00010 in]
Nickel - Electroplate as a Barrier to 0.001 mm 0.0013 mm 0.0013 mm
NB
Copper-Tin Diffusion1 (min) [0.00004 in] [0.00005 in] [0.00005 in]
OSP Organic Solderability Preservative Solderable Solderable Solderable
0.003 mm 0.003 mm 0.003 mm
ENIG Electroless Nickel
[0.00012 in] (min) [0.00012 in] (min) [0.00012 in] (min)
0.05 µm 0.05 µm 0.05 µm
Immersion Gold
[1.97 µin] (min) [1.97 µin] (min) [1.97 µin] (min)
IS Immersion Silver Solderable Solderable Solderable
IT Immersion Tin Solderable Solderable Solderable
C Bare Copper As indicated in Table 3-10 and/or 3-11
Surface and Hole Plating
2
Copper (Min. Average) Holes
0.012 mm 0.012 mm 0.012 mm
Type 2
[0.00047 in] [0.00047 in] [0.00047 in]
0.025 mm 0.025 mm 0.025 mm
Type 3, 4 ≥ 6 layers
[0.00098 in] [0.00098 in] [0.00098 in]
0.035 mm 0.035 mm 0.035 mm
Type 3, 4 > 6 layers
[0.00138 in] [0.00138 in] [0.00138 in]
Copper (Min. Thin Areas3)
0.010 mm 0.010 mm 0.010 mm
Type 2
[0.00039 in] [0.00039 in] [0.00039 in]
0.020 mm 0.020 mm 0.020 mm
Type 3, 4 ≤ 6 layers
[0.00079 in] [0.00079 in] [0.00079 in]

1
IPC-6013A - Amendment 1 January 2005

Code Finish Class 1 Class 2 Class 3

0.030 mm 0.030 mm 0.030 mm
Type 3, 4 > 6 layers
[0.00118 in] [0.00118 in] [0.00118 in]]
Copper (Via Structure4) Blind Vias 4

0.020 mm 0.020 mm 0.025 mm

(min. average)
[0.00079 in] [0.00079 in] [0.00098 in]
0.018 mm 0.018 mm 0.020 mm
(min. at thin area)
[0.00071 in] [0.00071 in] [0.00079 in]
Copper (Via Structure4) Buried Vias
0.013 mm 0.015 mm 0.015 mm
(min. average)
[0.00051 in] [0.00059 in] [0.00059 in]
0.011 mm 0.013 mm 0.013 mm
(min. at thin area)
[0.00043 in] [0.00051 in] [0.00051 in]
1
Nickel plating used under the tin-lead or solder coating for high temperature operating environments act as a barrier to prevent the formation of copper-tin
compounds.
2
Copper plating (1.2.5.2) thickness applies to surface and hole walls.
3
For Class 3 boards having a drilled hole diameter <0.35 mm [0.0138 in] and having an aspect ratio >3.5:1, the minimum thin area copper plating in the hole
shall be 0.025 mm [0.00098 in].
4
Low Aspect Ratio Blind Vias refer to blind vias produced using a controlled depth mechanism (e.g., laser, mechanical, plasma or photo defined). All
performance characteristics for plated holes, as defined in this document, shall be met.
5
See also 3.3.5.

2 APPLICABLE DOCUMENTS 3.3.2.10 Coverfilm Separations

Replace IPC-7711, Rework of Electronic Assemblies as Replace item c as follows:
follows:
There shall be no coverfilm nonlamination along the outer
IPC-7711/21A Rework and Repair Guide edges or covercoat openings of the coverfilm that reduces
the seal below minimum edge to conductor spacing.
3.2.6.2 Electrodeposited Copper
3.3.2.11.1 Covercoat Coverage
Replace 50 µm - 100 µm [1969 µin - 3937 µin] as follows:
Replace micrometer and micro-inch values in subpara-
0.05 mm - 0.10 mm [0.00197 in - 0.00394 in] graph e., item a) as follows:
3.3.1.2 Edges, Flexible Section
a) On surface mount lands, misregistration shall not cause
encroachment of the covercoat over the land area
Replace 2nd sentence as follows:
greater than 0.050 mm [0.00197 in] for a pitch ≥1.25
Tears shall not be allowed in Type 1 or Type 2 flexible mm [0.04921 in]. Encroachment shall not exceed 0.025
printed wiring or within the flexible sections of Type 3 or mm [0.00098 in] for a pitch ≤1.25 mm [0.04921 in], and
Type 4. encroachment may occur on adjacent sides, but not on
opposite sides of a surface mount land.
3.3.2 Construction Imperfections - Rigid
Replace subsection title with ‘‘Construction Imperfec- 3.4.2 Etched Annular Ring and Breakout (Internal)
tions’’ Move to 3.7.10, Etched Annular Ring and Breakout
(Internal)
3.3.2.6 Scratches, Dents and Tool Marks
3.4.3 becomes 3.4.2 and 3.4.4 becomes 3.4.3 as a result of
Replace as follows: this transfer. Likewise, the following figure changes take
Scratches, dents and tool marks are acceptable, provided effect:
they do not expose conductors or disrupt fibers greater than Figure 3-4 becomes Figure 3-15.
allowed in 3.3.2.4 and 3.3.2.5 and do not reduce the dielec-
tric spacing below the minimum specified. Dents or tool Figure 3-5 through Figure 3-15 become Figure 3-4 through
marks that cause delamination, changes physical size of the Figure 3-14.
conductor, or reduces conductor width or spacing shall be
rejectable.

2
January 2005 IPC-6013A - Amendment 1

Table 3-5 Minimum Etch Annular Ring Following stress, test coupons or production boards shall
Replace all instances of 50 µm [0.0020 in] with 0.050 mm be microsectioned. Microsectioning shall be accomplished-
[0.0020 in] per IPC-TM-650, Method 2.1.1, or 2.1.1.2 on test coupons
or production boards. Evaluation of all applicable holes
Replace 150 µm [0.00591 in] with 0.15 mm [0.00591 in] and vias, including blind and buried, for all such structures
Internal Plated-through Holes, Class 3, replace as fol- found on the finished printed board shall be inspected in
lows: the vertical cross section in accordance with Table 4-3. The
grinding and polishing accuracy of the microsection shall
The minimum internal annular ring2 shall be 0.025 mm
be such that the viewing area of each of the holes is within
[0.00098 in].
10% of the drilled diameter of the hole.
Add footnote 2 following Table 3-5 as follows:
3.7.5 Etchback (Type 3 and Type 4 Only)
2. See 3.7.10 regarding annular ring requirements for func-
Replace first sentence as follows:
tional and nonfunctional lands.
When specified on the procurement documentation, flexible
Table 3-6 Allowable Squeeze-Out of Coverlayer Adhe- printed wiring shall be etched back for the lateral removal
sive and Ooze-Out of Covercoat of adhesive, resin and/or glass fibers from the drilled hole
Replace both instances of 70 µm with 0.070 mm [0.00276 wall prior to plating.
in]
Replace 0.003 mm [0.000118 in] with 0.003 mm [0.00012
3.7 Structural Integrity in] in second sentence
Add the following sentence to the end of the 2nd para- Append at the end of Note as follows:
graph:
Adhesiveless constructions exhibit minimal etchback at the
Refer to IPC-2221 for appropriate coupon design of blind flexible dielectric to metal interface.
and buried vias for plated hole evaluation.
Table 3-9 Plated-Through Hole Integrity After Stress
3.7.1 Thermal Stress Testing Change table title as follows:
Replace 2nd paragraph as follows:

Table 3-9 Plated Hole Integrity After Stress

Replace ‘‘Wicking’’ as follows:
Property Class 1 Class 2 Class 3
Wicking (maximum copper 0.205 mm [0.00807 in], pro- 0.18 mm [0.00709 in], pro- 0.16 mm [0.00630 in], pro-
plating penetration including vided the additional micro- vided the additional micro- vided the additional micro-
0.08 mm [0.00315 in] etchback section criteria of 3.7.8.1 section criteria of 3.7.8.1 section criteria of 3.7.8.1
allowance) are met are met are met
Wicking (maximum copper 0.175 mm [0.00689 in], pro- 0.15 mm [0.00591 in], pro- 0.13 mm [0.00512 in], pro-
plating penetration including vided the additional micro- vided the additional micro- vided the additional micro-
0.05 mm [0.0020 in] smear section criteria of 3.7.8.1 section criteria of 3.7.8.1 section criteria of 3.7.8.1
removal allowance) are met are met are met

Replace ‘‘Plating Separation’’ as follows:

Plating Separation Allowed at knee, maximum None Allowed
length 0.125 mm [0.00492 in]

3
IPC-6013A - Amendment 1 January 2005

3.7.8 Plating Integrity Note: Consideration should be given to how the microsec-
Add new section 3.7.8.1 for wicking as follows: tion cut is ‘‘clocked,’’ or rotated. Misregistration can occur
randomly as opposed to orthogonally and therefore an
orthogonal cut will not guarantee that a microsection view
3.7.8.1 Wicking (Copper Plating) When Etchback is will portray hole breakout, if it exists. See Figures 3-16 and
specified on the master drawing, the maximum copper plat- 3-17 for an example of how breakout may or may not be
ing penetration, when measured from the edge of the detected within a microsection based on the rotation.
drilled hole, shall not exceed the values in Table 3-9,
Add new section 3.7.10.1 for internal registration assess-
which is the sum of copper wicking and etchback allow-
ment for Class 2 product as follows:
ances (see Figure 3-12), or shall not violate the minimum
conductor spacing below the minimum requirements in
3.5.2. See also 3.7.10.2 regarding minimum conductor 3.7.10.1 Internal Registration Assessment (Class 2)
spacing. For Class 2 boards, if internal annular ring breakout is
detected in the vertical cross section, but the degree of
When Etchback is not specified on the master drawing breakout cannot be determined, internal registration may be
(smear removal only), the maximum copper plating pen- assessed by nondestructive techniques other than microsec-
etration, when measured from the edge of the drilled hole, tion, such as, special patterns, probes, and/or software,
shall not exceed the values in Table 3-9, which is the sum which are configured to provide information on the inter-
of copper wicking and smear removal allowances (see Fig- polated annular ring remaining and pattern skew. Tech-
ure 3-13), or shall not violate the minimum conductor niques include, but are not limited to the following:
spacing below the minimum requirements in 3.5.2). • The optional F coupon.
• Custom designed electrically testable coupons.
3.7.10 Annular Ring (Internal) • Radiographic (x-ray) techniques.
Replace as follows: • Horizontal microsection.
• CAD/CAM data analysis as correlated to pattern skew by
3.7.10 Etched Annular Ring and Breakout (Internal) layer.

Internal annular ring shall be measured by microsection to Note: Microsectioning or statistical sampling shall be used
verify conformance to Table 3-5 as shown in Figure 3-15. to verify correlation of the approved technique, and a cali-
bration standard established for the specific technique
Note: The board design may have nonfunctional lands of employed.
varying sizes for conductor routing spacing constraints. Add new 3.7.10.2 for breakout conditions as follows:
The functional lands shall meet the minimum annular ring
requirement. Non-functional lands which are less than the
3.7.10.2 Breakout (Internal) Conditions If misregistra-
functional land diameter are not required to meet the mini- tion to the point of breakout is detected in vertical micro-
mum annular ring requirement. sections, the concerns are that:
Measurements for internal annular ring are from the inside 1. The conductor width minimum may be compromised at
of the drilled hole to the edge of the internal land as shown the land junction and,
in Figure 3-15. Negative etchback is evaluated per 3.7.7 2. There is insufficient electrical spacing.
and Figure 3-14. External pads of vias produced as sequen- Note: Electrical spacing may be further compromised due
tially laminated structures may be evaluated inprocess prior to the combined copper plating penetration of both etch-
to additional lamination(s) (see 3.4.2). When sequentially back and wicking.
produced vias are evaluated in-process their compliance
The extent and direction of misregistration shall be deter-
shall be documented. Lands not associated with a sequen-
mined. Actual boards or appropriate test coupons shall then
tial via structure shall be evaluated as internal annular ring
be tested to determine compliance. This may be accom-
at microsection. Microsection analysis is performed per
plished by the techniques listed in 3.7.10.
3.7.2 (see Figures 3-5 and 3-6). Unless prohibited by the
customer, the employment of filleting or ‘‘tear drops’’ to
Figure 3-12 Negative Etchback
create additional land area at the conductor junction shall
be acceptable for Class 1 and 2 and in accordance with Replace metric and inch dimensions as follows:
general requirements for lands with holes detailed in IPC- Class 1 - 0.025 mm [0.00098 in]
2221. Employment of filleting or ‘‘tear drops’’ in Class 3 Class 2 - 0.025 mm [0.00098 in]
product shall be as agreed upon between user and supplier. Class 3 - 0.013 mm [0.00051 in]

4
January 2005 IPC-6013A - Amendment 1

Figure 3-13 Etchback Depth Allowance Add new Figure 3-16:

Renumber as Figure 3-12 and replace as follows:

Only a vertical cut at M-M reveals

the minimum conductor width

M-M
M
C
B

C-C
A A

B
-B

M
A-A
IPC-6012a-3-16

IPC-6013a-3-12
Figure 3-16 Microsection Rotations for Breakout
Figure 3-12 Etchback Depth Allowance Detection

Figure 3-14 Smear Removal Allowance Add new Figure 3-17:

Renumber as Figure 3-13 and replace as follows:

If the mount were cut

through Section AA, the
A A microsection would
B C look like this

B A A
C

C B
If the mount were cut
through Section BB, the
microsection would
B look like this
C

Only microsection cut BB reveals

the actual annular ring reduction

If the mount were cut

through Section CC, the
microsection would
look like this
IPC-6012a-3-17

Figure 3-17 Comparison of Microsection Rotations

IPC-6013a-3-13

Figure 3-13 Smear Removal Allowance

5
IPC-6013A - Amendment 1 January 2005

Table 3-10 Conductor Thickness after Processing

Rename and replace table as follows:
Table 3-10 Internal Layer Foil Thickness after Processing
Absolute Cu Min. (IPC-4562 less Maximum Variable Processing Minimum Final Finish after
Weight 10% reduction) (mm) [in] Allowance Reduction* (mm) [in] Processing (mm) [in]
1/8 oz. [0.0051] 0.0046 [0.00018] 0.0015 [0.00006] 0.0031 [0.00012]
1/4 oz. [0.0085] 0.0070 [0.00030] 0.0015 [0.00006] 0.0062 [0.00024]
3/8 oz. [0.012] 0.0108 [0.00043] 0.0015 [0.00006] 0.0093 [0.00037]
1/2 oz. [0.0171] 0.0154 [0.00061] 0.0040 [0.00016] 0.0114 [0.00045]
1 oz. [0.0343] 0.0309 [0.00122] 0.0060 [0.00024] 0.0249 [0.00098]
2 oz. [0.0686] 0.0617 [0.00243] 0.0060 [0.00024] 0.0557 [0.00219]
3 oz. [0.1029] 0.0926 [0.00365] 0.0060 [0.00024] 0.0866 [0.00341]
4 oz. [0.1372] 0.1235 [0.00486] 0.0060 [0.00024] 0.1175 [0.00463]
Above 4 oz. IPC-4562 value less 10% 0.0060 [0.00024] 0.0060 [0.00024] below
[0.1372] reduction minimum thickness of
calculated 10% reduction
of foil thickness in
IPC-4562
* Process allowance reduction does not allow for rework processes for weights below 1/2 oz. For 1/2 oz. and above, the process allowance reduction allows for
one rework process.

Table 3-11 External Conductor Thickness after Plating

Replace table as follows:
Table 3-11 External Conductor Thickness after Plating
Maximum
Plus minimum Variable Minimum Surface Conductor
Absolute Cu Min. plating for Plus minimum Processing Thickness after Processing (mm) [in]
(IPC-4562 less Class 1 and 2 plating for Allowance
10% reduction) (0.020 mm) Class 3 (0.025 Reduction3
Weight1 (mm) [in] [0.00079 in]2 mm) [0.00098 in]2 (mm) [in] Class 1 & 2 Class 3
1/8 oz. 0.0046 [0.00018] 0.0246 [0.00097] 0.0296 [0.00117] 0.0015 [0.00006] 0.0231 [0.00091] 0.0281 [0.00111]
1/4 oz. 0.0070 [0.00030] 0.0277 [0.00109] 0.0327 [0.00129] 0.0015 [0.00006] 0.0262 [0.00103] 0.0312 [0.00123]
3/8 oz. 0.0108 [0.00043] 0.0308 [0.00121] 0.0358 [0.00141] 0.0015 [0.00006] 0.0293 [0.00115] 0.0343 [0.00135]
1/2 oz. 0.0154 [0.00061] 0.0354 [0.00139] 0.0404 [0.00159] 0.0020 [0.00008] 0.0334 [0.00132] 0.0384 [0.00151]
1 oz. 0.0309 [0.00122] 0.0509 [0.00200] 0.0559 [0.00220] 0.0030 [0.00012] 0.0479 [0.00189] 0.0529 [0.00208]
2 oz. 0.0617 [0.00243] 0.0817 [0.00322] 0.0867 [0.00341] 0.0030 [0.00012] 0.0787 [0.00310] 0.0837 [0.00320]
3 oz. 0.0926 [0.00365] 0.1126 [0.00443] 0.1176 [0.00463] 0.0040 [0.00016] 0.1086 [0.00428] 0.1136 [0.00447]
4 oz. 0.1235 [0.00486] 0.1435 [0.00565] 0.1485 [0.00585] 0.0040 [0.00016] 0.1395 [0.00549] 0.1445 [0.00569]
1. Starting foil weight of design requirement per procurement documentation.
2. Process allowance reduction does not allow for rework processes for weights below 1/2 oz. For 1/2 oz. and above, the process allowance reduction allows for
one rework process.
3. Reference: Min. Cu Plating Thickness
Class 1 = 2 (0.020 mm) [0.00079 in] Class 2 = 2 (0.020 mm) [0.00079 in] Class 3 = (0.025 mm) [0.00098 in]

6
January 2005 IPC-6013A - Amendment 1

3.9.2.2 Isolation (Circuit Shorts)

Replace last sentence in 2nd paragraph as follows:

When automated test equipment is used, the minimum applied voltage shall be the maximum rated voltage of the flexible
printed wiring. When not specified, the default value of 40 volts shall be used.

4.1 Qualification

Add the following 3rd sentence to the paragraph:

Qualification should include those applicable tests as referenced in Tables 4-3 and 4-4.

Table 4-3 Acceptance Testing and Frequency

Replace Dimensional Requirements as follows:

Dimensional Requirements
Dimensional: Flexible 3.4 X Sample (6.5) Sample (4.0) Sample (4.0) Per Board
Printed Wiring
Hole Size and Hole 3.4.1 X Sample (6.5) Sample (4.0) Sample (4.0) Per Board
Pattern Accuracy
Etched Annular Ring 3.4.2 X Sample (6.5) Sample (4.0) Sample (4.0) Per Board
(External)
Solderable Annular 3.4.2.1 X Sample (6.5) Sample (4.0) Sample (4.0) Per Board
Ring (External)
Bow and Twist 3.4.3 X Sample (6.5) Sample (4.0) Sample (4.0) Per Board
(Individual Board or
Stiffener Portion Only)

Replace Structural Integrity After Stress Types 3-4 (Microsection) as follows:

Structural Integrity After Stress Types 3-4 (Microsection)6
Laminated Integrity 3.7.3 A and B Sample (2.5) Sample (1.5) Sample (1.0) Per panel
3.7.4 or A/B
Etchback (Type 3 and 3.7.5 A and B Sample (2.5) Sample (1.5) Sample (1.0) Per panel
Type 4 Only) 3.7.6 or A/B
3.7.7
Plating Integrity 3.7.8 A and B Sample (2.5) Sample (1.5) Sample (1.0) Per panel
or A/B
Plating Voids 3.7.9 A and B Sample (2.5) Sample (1.5) Sample (1.0) Per panel
or A/B
Annular Ring (Internal) 3.7.10 A and B Sample (2.5) Sample (1.5) Sample (1.0) Twice per
or A/B panel,
opposite
corners 3,5
Plating/Coating Thickness 3.7.11 A and B Sample (2.5) Sample (1.5) Sample (1.0) Per panel
or A/B
Minimum Layer/Copper 3.7.12 A and B Sample (2.5) Sample (1.5) Sample (1.0) Per panel
Foil Thickness or A/B
Minimum Surface 3.7.13 A and B Sample (2.5) Sample (1.5) Sample (1.0) Per panel
Conductor Thickness or A/B
Metal Cores 3.7.14 A and B Sample (2.5) Sample (1.5) Sample (1.0) Per panel
or A/B
Dielectric Thickness 3.7.15 A and B Sample (2.5) Sample (1.5) Sample (1.0) Per panel
or A/B

7
IPC-6013A - Amendment 1 January 2005

Replace Structural Integrity After Stress Type 2 (Microsection) as follows:

Structural Integrity After Stress Type 2 (Microsection)6
Laminate Integrity (Flexible) 3.7.3 A or B Sample (6.5) Sample (4.0) Sample (2.5) Per panel
or A/B
Plating Integrity 3.7.8 A or B Sample (6.5) Sample (4.0) Sample (2.5) Per panel
or A/B
Plating Voids 3.7.9 A or B Sample (6.5) Sample (4.0) Sample (2.5) Per panel
or A/B
Plating/Coating Thickness 3.7.11 A or B Sample (6.5) Sample (4.0) Sample (2.5) Per panel
or A/B
Minimum Surface 3.7.13 A or B Sample (6.5) Sample (4.0) Sample (2.5) Per panel
Conductor Thickness or A/B
Dielectric Thickness 3.7.15 A or B Sample (6.5) Sample (4.0) Sample (2.5) Per panel
or A/B

Add footnote 3 following Table 4-3:

3. For class 2 product, the degree of breakout following evaluation of vertical cross sections may be assessed by methods
other than horizontal microsection.
Add footnote 5 following Table 4-3:
5. The A and B or 2 A/B test coupons shall be taken from opposite corners of the manufacturing panel and in opposing
axes (one in the ‘‘x’’ axis and the other in the ‘‘y’’ axis).
Add footnote 6 following Table 4-3:
6. All via structures shall be represented in the thermally stressed evaluations.

Table 4-4 Quality Conformance Testing

Replace as follows:
Requirement Test Coupon Test Frequency
and Method
Inspection Section Type 1, 5 Type 2 - 4 Class 1 Class 2 Class 3
Rework Simulation 3.8 B or A/B As required Two coupons Two coupons
per QTR per month
Bond Strength 3.6.3 B or A/B As required As required Two coupons Two coupons
(Unsupported Lands) per QTR per month
Bond Strength (Stiffener) 3.6.4 Board Board As required As required As required
Dielectric Withstanding 3.9.1 E E As required Two coupons Two coupons
Voltage per QTR per month
Moisture and Insulation 3.10.1 E E Maintain elec- Two coupons Two coupons
Resistance trical function per QTR per month

5.2 Superceded Specifications

Replace as follows:
This specification supersedes and replaces IPC-6013A, IPC-FC-250 and IPC-RF-245.