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    Advanced Manufacturing Techniques R Crockett

    Uploaded by

    Qiang Gao
    This document discusses laser direct imaging (LDI) technology for printed circuit board manufacturing. It provides details on: - The benefits of LDI for improving production capabilities and yields compared to traditional film exposure methods. - The five step LDI process of surface preparation, resist lamination, exposure, development, and circuit creation through etching and plating. - The main users of LDI equipment in prototype and high-density interconnect markets where it provides advantages like flexibility and improved registration/yields. - The evolution of LDI equipment and dry film resists over time to higher resolution and productivity capabilities needed for demanding applications like fine line circuits.

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    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd

    Advanced Manufacturing Techniques R Crockett

    Uploaded by

    Qiang Gao
    349 views32 pages
    This document discusses laser direct imaging (LDI) technology for printed circuit board manufacturing. It provides details on: - The benefits of LDI for improving production capabilities and yields compared to traditional film exposure methods. - The five step LDI process of surface preparation, resist lamination, exposure, development, and circuit creation through etching and plating. - The main users of LDI equipment in prototype and high-density interconnect markets where it provides advantages like flexibility and improved registration/yields. - The evolution of LDI equipment and dry film resists over time to higher resolution and productivity capabilities needed for demanding applications like fine line circuits.

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    This document discusses laser direct imaging (LDI) technology for printed circuit board manufacturing. It provides details on: - The benefits of LDI for improving production capabilities and yields compared to traditional film exposure methods. - The five step LDI process of surface preparation, resist lamination, exposure, development, and circuit creation through etching and plating. - The main users of LDI equipment in prototype and high-density interconnect markets where it provides advantages like flexibility and improved registration/yields. - The evolution of LDI equipment and dry film resists over time to higher resolution and productivity capabilities needed for demanding applications like fine line circuits.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    349 views32 pages

    Advanced Manufacturing Techniques R Crockett

    Uploaded by

    Qiang Gao
    This document discusses laser direct imaging (LDI) technology for printed circuit board manufacturing. It provides details on: - The benefits of LDI for improving production capabilities and yields compared to traditional film exposure methods. - The five step LDI process of surface preparation, resist lamination, exposure, development, and circuit creation through etching and plating. - The main users of LDI equipment in prototype and high-density interconnect markets where it provides advantages like flexibility and improved registration/yields. - The evolution of LDI equipment and dry film resists over time to higher resolution and productivity capabilities needed for demanding applications like fine line circuits.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 32

    Dry-Film Developments for LDI - Technology

    Russell Crockett Circuit Packaging Materials. DuPont Electronic Technologies

    Advanced Manufacturing Techniques.

    Rotherham 4 August. 2009

    9/3/2009 DUPONT CONFIDENTIAL

    Laser Direct Imaging for Printed Circuit Manufacture. Why Use LDI to expose a dry film resist?
    Is it an Enabling Technology?
    Improve production capabilities

    Does it Improve Yields?


    Reduce costs

    9/3/2009 DUPONT CONFIDENTIAL

    Laser Direct Imaging for Printed Circuit Manufacture. The 5 Steps to Create the Image.
    Surface Preparation. Resist Lamination.

    Resist Exposure.LDI step. p p


    Resist Development. Circuit Creation.
    Etching. Plating.

    9/3/2009 DUPONT CONFIDENTIAL

    Laser Direct Imaging for Printed Circuit Manufacture. The main Users of LDI Equipment. Prototype Market - Enabling Technology.
    Speed to production. No phototool preparation. Flexability. Single board production.

    HDI Market Yield Improvement.


    Side to side, layer to layer registration. Large panel registration to micro vias. Reduced repeat fault ( dirt ) imaging for fine line. Better quality and lower total cost.
    9/3/2009 DUPONT CONFIDENTIAL

    LDI History
    Polyscan PDI-2000 Nikon Pentax DI-2000

    Orbotech DP-100

    Dai-Nihon Screen

    1990

    1995

    2000

    UV Laser out put


    360nm 405nm
    9/3/2009 DUPONT CONFIDENTIAL

    * 350 - 365nm * 400 - 415nm

    LDI Technology 355nm vs. 405nm


    Polygon Mirror System DMD (Digital Micro Mirror Devise) System

    Laser
    Wave Length355nm DMD
    Scan direction Feed direction

    Laser
    Wave Length405nm

    Polygon Mirror

    Panel
    Feed direction

    Panel

    Polygon Mirror 305nm


    Orbotech

    DMD. Digital Micro-mirror Devise 405nm


    Fuji Pentax (ORC) Hitachi

    9/3/2009 DUPONT CONFIDENTIAL

    Polygon Optical System

    source: ORBOTECH

    AOM UV Laser Beam Splitter S litt Polygon Lens System

    Stage movement during imaging Panel

    9/3/2009 DUPONT CONFIDENTIAL

    DMD 405nm LDI system


    Optical system Exposure
    Light Lens

    DMD

    CAD data
    Focus Lens

    ON OFF

    Optical head

    Imaging
    Direct imaging Panel feed direction
    9/3/2009 DUPONT CONFIDENTIAL

    DMD Digital Micro mirror Device

    Laser technology and Resist evolution.

    Polygon Plotters ( DP 100 )


    Low energy Productivity gated by photospeed, ~ 10mJ

    Dry film resists( LDI 300, 500 Series )


    V Very hi h photospeed, high h t d 8 - 10mJ 30micron resist 15 18mJ 50micron resist

    Trade off
    Unstable to heat and yellow light. Poor processing productivity, development, stripping. Brittle, poor tenting. Conventional resist 60 75mJ

    9/3/2009 DUPONT CONFIDENTIAL

    10

    LDI History
    Orbotech DP-100
    Dai-Nihon Screen

    Polyscan PDI-2000

    Nikon

    Pentax DI-2000

    1990

    1995
    LDI 200

    2000

    LDI 300

    LDI 500

    9/3/2009 DUPONT CONFIDENTIAL

    11

    LDI 500 series dry-film 405nm + 355nm


    LDI540 @ 405nm LDI540 @ 355nm

    9/3/2009 DUPONT CONFIDENTIAL

    12

    LDI 500 series dry-film 405nm + 355nm


    LDI540 @ 405nm 25 28 mJ/cm2 LDI540 @ 355nm 14 16 mJ/cm2

    9/3/2009 DUPONT CONFIDENTIAL

    13

    LDI Dry-Film Developments


    Orbotech DP-100
    Dai-Nihon Screen LI-7000

    Polyscan PDI-2000

    Nikon

    Pentax DI-2000

    1990

    1995
    LDI 200 LDI 300

    2000

    LDI 500

    LDI 800

    9/3/2009 DUPONT CONFIDENTIAL

    14

    Laser technology and Resist evolution.

    Digital Micro Mirror Device, LDI plotter


    High resolution Smaller panel format Used U d mainly i A i i l in Asia. Needed specific photo-initiator at 405nm. Not compatible with other dry film photo-initiators. Not compatible with other exposure equipment. Riston* LDI 800 developed specifically for 405nm wave length.

    9/3/2009 DUPONT CONFIDENTIAL

    15

    Laser technology and Resist evolution.

    Polygon Plotters ( Paragon 8000 )


    Higher energy Productivity gated by photospeed, ~ 18mJ

    Dry film resists( LDI 7000 and 7200 Series )


    Hi h photospeed, High h t d

    Benifits
    More stable to heat and yellow light. Improved resolution. Improved resist flow and adhesion. Improved processing productivity, development, stripping. Higher yields.

    9/3/2009 DUPONT CONFIDENTIAL

    16

    LDI Dry-Film continued developments


    Orbotech DP-100
    Dai-Nihon Screen

    Polyscan PDI-2000

    Nikon

    Pentax DI-2000

    1990

    1995 199
    LDI 200

    2000

    LDI 300 LDI 500 LDI 800 LDI 7000


    9/3/2009 DUPONT CONFIDENTIAL

    17

    Laser Direct Imaging for Printed Circuit Manufacture. Why Use LDI to expose a dry film resist?
    Is it an Enabling Technology?
    Improve production capabilities

    Does it Improve Yields?


    Reduce costs

    9/3/2009 DUPONT CONFIDENTIAL

    18

    Why Use LDI to expose a dry film resist?


    Yield Imaging Defects, none LDI exposure
    100 90 80 70 60 Yield % 50 opens/nicks 40 30 20 10 0 75 50 Feature size ym

    without Repeats with Repeats

    9/3/2009 DUPONT CONFIDENTIAL

    19

    Why Use LDI to expose a dry film resist?


    Yield Imaging Defects, 50ym
    100 90 80 70 Yield % 60 Imaging 50 Defects 40 30 20 10 0 1 LDI Exposure 2

    ( non-repeating )

    without Cleaning with Cleaning

    9/3/2009 DUPONT CONFIDENTIAL

    20

    Why Use LDI to expose a dry film resist? Yield Mis-registration Defects (610 x 510mm)

    100 90 80 70 60 Yield % 50 Misregistration 40 30 20 10 0 Feature size 50ym

    Film exposure LDI exposure

    9/3/2009 DUPONT CONFIDENTIAL

    21

    Riston* LDI 7040

    9/3/2009 DUPONT CONFIDENTIAL

    22

    LDI Dry Film Resist Requirements All Applications


    Adhesion to many surface finishes Productivity, all processes. Flow at lamination. Resolution, Resolution ~ 50ym Etching, Acid and Alkaline Plate Cu, Sn, PB,Ni, Au. Tenting, T&E and Plating. Stability, Transport, yellow light. Can be exposed on conventional printers. Highest possible yields.
    9/3/2009 DUPONT CONFIDENTIAL

    23

    LDI Dry Film Resist Requirements Best in class dry film, plus LDI exposure
    Riston* LDI 7000 and 7200 series.
    Good Adhesion on all surfaces Good Flow - Characteristics High Resolution Good Tenting ( 8mm through 65m Cu acid etch ) High Productivity - fast development - fast and easy stripping Acid and Alkaline etch. Plating, Cu, Sn, Pb, Ni, Au.
    9/3/2009 DUPONT CONFIDENTIAL

    24

    LDI 7000,7200, Dry Film Resists


    Riston* LDI 7000 and 7200 series.
    Thicker resists 7250,7262,7275 and 7299
    Optimized for through polymerization.

    Cover sheet clarity and quality. High resolution capability, sub 50ym. ( resist thickness ) Compatibility with standard exposure equipment. Production proven high yield performance.
    Etching innerlayers. Tent and etch. Cu & Sn and Ni & Au plating.
    9/3/2009 DUPONT CONFIDENTIAL

    25

    Riston* LDI 7000 / 7200 Series LDI 7030 16 mJ/cm2 LDI 7040 20 mJ/cm2 LDI 7250 30 mJ/cm2 Paragon 8000, gate energy 18mJ.

    9/3/2009 DUPONT CONFIDENTIAL

    26

    LDI 7040 - 37 micron L/S

    14 mJ/cm2

    20 mJ/cm2

    9/3/2009 DUPONT CONFIDENTIAL

    27

    LDI 7030

    LDI 7250

    9/3/2009 DUPONT CONFIDENTIAL

    28

    Riston* LDI 7040

    9/3/2009 DUPONT CONFIDENTIAL

    29

    Riston* LDI 7250

    9/3/2009 DUPONT CONFIDENTIAL

    30

    Riston* LDI 7250

    9/3/2009 DUPONT CONFIDENTIAL

    31

    LDI Productivity? Paragon + DuPont WBR 2100

    9/3/2009 DUPONT CONFIDENTIAL

    32

    9/3/2009 DUPONT CONFIDENTIAL

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