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What are MEMS?

Introduction to MEMS

1. MEMS refer to miniature mechatronic systems

bulk fabricated using VLSI technology.
2. Techniques and processes to design and create
miniature systems.

ECE Harish Sharma ECE Harish Sharma

What are MEMS? Dimensional Ranges

3. In order to create a completely functioning ‘System’ that
makes use of MEMS, the system will require various other sub-
systems, such as: power, microelectronics, communication and
software.

Moore’s Law: Density (and performance, broadly

defined) of digital integrated circuits increases by a
factor of two every 1.5 year.
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Why Go Small? MEMS benefits

• For micro-scale sensors: 1. Micro size sensors and actuators:
- Higher Sensitivity Integration with electronics on single chip
- Better Linearity (system on chip).
- Better Responsivity
- Dynamic Range 2. Decreased cost of production: bulk
- Cost Reduction from Batch Fabrication processing.
• For micro-scale actuators: 3. Many new features and products
- Dynamic Response Speed
previously unthought can be possible.
- Lower Power Consumption
- Footprint 4. Combination of MEMS with other
- Cost Reduction from Batch Fabrication branches: Example optical MEMS, Bio-
MEMS =>futuristic devices.
ECE Harish Sharma ECE Harish Sharma

MEMS Sensors MEMS in Sensors

Chemical Sensors Accelerometers and Gyroscopes
Work on simple principles of chemical reactions between the -In day to day use:
sample, e.g. ,O2 and the sensing materials, e.g., a metal resulting Automobile accelerometers (air bag)
in changing of the physical properties of the sensing materials.
1. Chemiresistor sensors.
2. Chemicapacitor sensors
3. Chemimechanical sensors: change shapes when they are
exposed to chemicals
4. Metal oxide gas sensors: SnO2 change their electrical
resistance when exposed to certain chemicals.
ADXL202 dual axis accelerometer
Copyright 1995- 2003 Analog Devices, Inc.

ECE Harish Sharma

ECE Harish Sharma

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MEMS in Sensors MEMS in Sensors

Accelerometers Gyroscopes

Gyroscope is a form of accelerometer that measures

angular rotation rates.

The movement of the proof mass is carried out by

measuring the change of capacitances between the
pairs of electrodes .

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MEMS in Sensors MEMS in Sensors

Autonomous airplane Encoders

1. 81,000 grating lines

2. 36-mm grating disc
3. Interference to produce
detection signal
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MEMS in Actuators MEMS in Actuators

Deskjet printer Optical Switch

Nozzle on printer cartridge Micro-Optical Components at Bell Labs

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MEMS in Actuators MEMS in Actuators

Actuated Mirrors Actuated Mirrors

Fiber, Lenses and

Bell Lab single-color Mirror Bell Lab cross-color Mirrors
Mirrors
4 x 4 Optical Switch
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MEMS in Actuators MEMS in Actuators

Actuated Mirrors-DLP Technology Micromotors

• Array of micromirrors on chip

• Applications: projection TV etc.
First one was made
by
Mehergany at MIT

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MEMS in Actuators MEMS System

Micromotors Capsule camera

• 240o viewing angle

• Images at rate of 2 per
second
• Unit on belt to receive
images
• 2-6 hr journey through
intesting
• 0.4 X 1 in size

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MEMS System Micro-actuators

•Comb
Drive

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Micro-actuators Micro-actuators
Comb Drive Comb Drive operating gears

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Bio-MEMS Sensor More MEMS devices

• Other micro-sensors:
Cantilever based
Pressure sensor
• Concept: cantilever structure with antigen
Vibrating gyroscope
• Effects: Bio-MEMS sensors: DNA chips
o Change in mass • Micro actuators
o Deflection due to repulsive forces Comb actuators, micro-motors
• Detection of bacteria by Thermal actuators
o Optical Piezo-actuators
o Capacitive • Micro-gears, micro-engines
o Other techniques like resonance freq. • Micro-fluidic systems: drug delivery: smart pill
• Grating light valve (GLV display)
• Digital optical switches

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Why use Silicon? Materials for MEMS

• A main goal of MEMS research is to integrate all Other materials
components of a system or device as much as • Polycrystalline silicon (polysilicon)
possible. Therefore, common materials and • Silicon dioxide (SiO2)
compatible fabrication processes are required. • Silicon nitride (Si3N4)
• Aluminum (thin film)
• Silicon is a material with unique electrical and • Gold (thin film)
mechanical properties, such as semi- • Many more including polymers now a days
conductivity, peizo resistivity, high mechanical • Doping of silicon
strength, mechanically elastic behaviour, etc...

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Conventional (VLSI)
Course Contents
Fabrication processes
• Introduction to MEMS: Motivation, history Material removal
• Lithography: patterning
and current status • Chemical etching
• MEMS: Fabrication • Isotropic
Conventional MEMS fabrication using • Anisotropic
VLSI technology • Plasma etching: RIE
Nonconventional fabrication Material deposition
• Oxidation
• Sputtering
• Chemical Vapor Deposition (CVD)
• Electroplating
• Surface micromachining
• LIGA
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Nonconventional Micro-fabrication History of MEMS Technology

• 1958 Robert Noyce – Fairchild and Jack Kilby (Nobel Prize,
• Laser micromachining and welding, processing Physics, 2000) -
Texas Instruments invent the integrated circuit
of metals and nonmetals with laser 1959 - “There's Plenty of Room at the Bottom” - Famous talk by
• Electro Discharge and Electro Chemical Richard P. Feynman
micromachining (EDM and ECM) • 1965 - Invention of surface micromachining (Harvey
• Microstereo lithography: scanning process, Nathanson and William Newell, Resonant Gate Transistor)
dynamic mask process • In 1968, Robert Newcomb (Stanford, now Maryland)
• Electronic packaging proposed and attempted to fabricate a surface
micromachined electromagnetic motor after seeing the
Westinghouse work.
• Late 1960s: Honeywell and Philips commercialize
piezoresistive pressure sensor utilizing a silicon membrane
formed by anisotropic etching.
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History of MEMS Technology History of MEMS Technology

• 1970 - Micromachined silicon pressure sensor demonstrated • 1987: Berkeley and Bell Labs demonstrate polysilicon surface
(Petersen) micromechanisms
• 1960s-70s: research at Stanford on implanted silicon pressure • 1988 - Rotary electrostatic side drive motors (Fan, Tai, Muller)
sensors (Jim Meindl), neural probes, and a wafer-scale gas • 1989 - Lateral comb drive (Tang, Nguyen, Howe)
chromatograph (both Jim Angell) • 1991 - Polysilicon hinges developed (Pister, Judy, Burgett,
• 1980s: Kurt Petersen of IBM and ex-Stanford students Henry Fearing)
Allen, Jim Knutti, Steve Terry help initiate Silicon Valley • 1992 - Multi User MEMS Process (MUMPs) is introduced by
“silicon microsensor and microstructures” industry MCNC, (now MEMSCAP)
• 1990s: silicon ink-jet print heads become a commodity • 1993 - First surface micromachined accelerometer (ADXL50)
• 1970 - First silicon accelerometer demonstrated (Kulite) sold, (Analog Devices)
• 1977 - First capacitive pressure sensor (Stanford) • 1998 - Demonstration of DMD (Digital Mirror Device), (Texas
• 1984 - First polysilicon MEMS device (R. T. Howe and R. S. Instruments)
Muller, IEEE IEDM, San Francisco)
• Mirror Device), (Texas Instruments)
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References
• G. K. Ananthasuresh, K. J. Vinoy, S. Gopalakrishnan, K. N.
Bhat, V. K. Aatre - Micro and Smart Systems_ Technology
and Modeling (2012, Wiley)

• www.me.iitb.ac.in › ~gandhi › 05L1_coursecontents_mtvn

• www.engr.uvic.ca › ~mech466 › MECH466-Lecture-1

ECE Harish Sharma