VL53L5CX

Datasheet

Time-of-Flight 8x8 multizone ranging sensor with wide field of view

Features
• Fast and accurate multizone distance ranging sensor
– Multizone ranging output with either 4x4 or 8x8 separate zones
– Autonomous Low-power mode with interrupt programmable threshold to
wake up the host
– Up to 400 cm ranging
– Multitarget detection and distance measurement in each zone
– 60 Hz frame rate capability
– Histogram processing and algorithmic compensation minimizes or removes
impact of cover glass crosstalk
– Motion indicator for each zone to show if targets have moved and how they
have moved
• Fully integrated miniature module with wide field of view (FoV)
– Emitter: 940 nm invisible light vertical cavity surface emitting laser (VCSEL)
and integrated analog driver
– 63 ° diagonal square FoV using diffractive optical elements (DOE) on both
transmitter and receiver
– Receiving array of single photon avalanche diodes (SPADs)
– Low-power microcontroller running Firmware
– Size: 6.4 x 3.0 x 1.5 mm
• Easy integration
– Single reflowable component
Product status link – Flexible power supply options, single 3.3 V or 2.8 V operation or
VL53L5CX combination of either 3.3 V or 2.8 V AVDD with 1.8 V IOVDD
– Compatible with wide range of cover glass materials

Applications
• Scene understanding. Multizone and multi-object distance detection enables 3D
room mapping and obstacle detection for robotics applications
• Wide FoV and multizone scanning allows content management (load in trucks,
tanks, waste bins)
• Gesture recognition
• Liquid level control
• Keystone correction for video projectors
• Laser assisted autofocus (LAF). Enhances the camera AF system speed and
robustness especially in difficult low light or low contrast scenes
• Augmented reality/virtual reality (AR/VR) enhancement. Dual camera
stereoscopy and 3D depth assistance thanks to multizone distance
measurement
• Smart buildings and smart lighting (user detection to wake up devices)
• IoT (user and object detection)
• Video focus tracking. 60 Hz ranging allows optimization of continuous focus
algorithm

DS13754 - Rev 2 - August 2021 www.st.com

For further information contact your local STMicroelectronics sales office.
 VL53L5CX

Description
The VL53L5CX is a state of the art, Time-of-Flight (ToF), multizone ranging sensor
enhancing the ST FlightSense product family. Housed in a miniature reflowable
package, it integrates a SPAD array, physical infrared filters, and diffractive optical
elements (DOE) to achieve the best ranging performance in various ambient lighting
conditions with a range of cover glass materials.
The use of a DOE above the vertical cavity surface emitting laser (VCSEL) allows a
square FoV to be projected onto the scene. The reflection of this light is focused by
the receiver lens onto a SPAD array.
Unlike conventional IR sensors, the VL53L5CX uses ST's latest generation, direct
ToF technology which allows absolute distance measurement whatever the target
color and reflectance. It provides accurate ranging up to 400 cm and can work at fast
speeds (60 Hz), which makes it the fastest, multizone, miniature ToF sensor on the
market.
Multizone distance measurements are possible up to 8x8 zones with a wide 63 °
diagonal FoV which can be reduced by software
Thanks to ST Histogram patented algorithms, the VL53L5CX is able to detect
different objects within the FoV. The Histogram also provides immunity to cover glass
crosstalk beyond 60 cm.

DS13754 - Rev 2 page 2/38

 VL53L5CX
Product overview

1 Product overview

1.1 Technical specifications

Table 1. Technical specifications

Feature Details

Package Optical LGA16

Size 6.4 x 3.0 x 1.5 mm
Ranging 2 to 400 cm per zone
IOVDD: 1.8 or 2.8 V or 3.3 V
Operating voltage
AVDD: 2.8 V or 3.3 V
Operating temperature -30 to 85 °C
Sample rate Up to 60 Hz
Infrared emitter 940 nm

I2C interface I2C: 400 kHz to 1 MHz serial bus, address: 0x52
Continuous or Autonomous (see UM2884 for more
Operating ranging mode
information)

1.2 Field of view

Rx (or collector) exclusion zone includes all modules assembly tolerances and is used to define the cover window
dimensions. The cover window opening must be equal to or wider than the exclusion zone.
The detection volume represents the applicative or system FoV in which a target is detected, and a distance
measured. It is determined by the Rx lens or the Rx aperture, and is narrower than the exclusion zone.

Figure 1. System FoV and exclusion zone description (not to scale)

Table 2. FoV angles

Horizontal Vertical Diagonal

Detection volume 45 o 45 o 63 o

Collector exclusion zone 55.5 o 61 o 82 o

Note: Detection volume depends on the environment and sensor configuration as well as target distance, reflectance,
ambient light level, sensor resolution, sharpener, ranging mode, and integration time.
Note: The detection volume of Table 2. FoV angles has been measured with a white 88 % reflectance perpendicular
target in full FoV, located at 1 m from the sensor, without ambient light (dark conditions), with an 8x8 resolution
and 14 % sharpener (default value), in Continuous mode at 15 Hz.

DS13754 - Rev 2 page 3/38

 VL53L5CX
Field of illumination

1.3 Field of illumination

The VCSEL field of illumination (FoI) is shown in the figure below. The relative emitted signal power depends on
the FoI angle, and corresponds to:
• 50 ° x 50 ° considering a beam with 75 % signal from maximum
• 65 ° x 65 ° considering a beam with 10 % signal from maximum

Figure 2. VL53L5CX FoI

DS13754 - Rev 2 page 4/38

 VL53L5CX
System block diagram

1.4 System block diagram

Figure 3. VL53L5CX block diagram

1.5 Device pinout

The figure below shows the pinout of the VL53L5CX

Figure 4. VL53L5CX pinout (bottom view)

The VL53L5CX pin description is given in the table below.

DS13754 - Rev 2 page 5/38

 VL53L5CX
Device pinout

Table 3. VL53L5CX pin description

Pin number Signal name Signal type Signal description

I2C interface reset pin, active high. Toggle this

A1 I2C_RST Digital input pin from 0 to 1, then back to 0 to reset the I2C
slave. Connect to GND via 47 kΩ resistor.
A2 RSVD4 Reserved Connect to ground
Digital input/output Interrupt output, defaults to opendrain output
A3 INT
(I/O) (tristate), 47 kΩ pullup resistor to IOVDD required
1.8 V, 2.8 V or 3.3 V supply for digital core and
A4 IOVDD Power
I/O supply
Comms enable. Drive this pin to logic 0 to
disable the I2C comms when the device is in
LP mode. Drive this pin to logic 1 to enable I2C
A5 LPn Digital input comms in LP mode. Typically used when it is
required to change the I2C adress in multidevice
systems. A 47 kΩ pullup resistor to IOVDD is
required.
A6 RSVD1 Reserved Connect to ground
A7 RSVD2 Reserved Connect to ground
B1 AVDD Power 2.8 V or 3.3 V analog and VCSEL supply
Connect to a ground plane to allow good thermal
B4 THERMALPAD Ground
conduction
B7 AVDD Power 2.8 V or 3.3 V analog and VCSEL supply
C1 GND Ground Ground
General purpose I/O, defaults to opendrain
C2 RSVD6 Reserved output (tristate), 47 kΩ pullup resistor to IOVDD
required
Data (bidirectional), 2.2 kΩ pullup resistor to
C3 SDA Digital I/O
IOVDD required
Clock (input), 2.2 kΩ pullup resistor to IOVDD
C4 SCL Digital input
required
C5 RSVD5 Reserved Do not connect
C6 RSVD3 Reserved Connect to ground
C7 GND Ground Ground

Note: The THERMALPAD pin has to be connected to ground (for more information refer to AN5657).
Note: All digital signals must be driven to the IOVDD level.
Note: Toggling the I2C_RST pin resets the sensor I2C communication only. It does not reset the sensor itself. To reset
the sensor please refer to the sensor reset management procedure (UM2884).

DS13754 - Rev 2 page 6/38

 VL53L5CX
Application schematic

1.6 Application schematic

The figures below show the application schematic of the VL53L5CX with different IOVDD and AVDD
combinations.

Figure 5. Typical application schematic

AVDD IOVDD

IOVDD = [1.8 V, 2.8 V, 3.3 V]

AVDD = [2.8 V, 3.3 V]

4.7uF 100nF
IOVDD 6.3V 10V
IOVDD

2.2 k 2.2 k 47k 47k

A4
B1

B7
U2 47k

IOVDD
AVDD
AVDD
A5
LPn
C2
RSVD6
C4
SCL
Host MCU C3 RSVD5
C5
SDA

THERMAL PAD
A3
INT A6
A1 RSVD1
I2C_RST A7
RSVD2
C6
RSVD3
A2
GND
GND

RSVD4
R7
47k ToF sensor
C1
C7

B4

Note: Capacitors on the external supplies (AVDD and IOVDD) should be placed as close as possible to the module
pins.

DS13754 - Rev 2 page 7/38

 VL53L5CX
Functional description

2 Functional description

2.1 Software interface

This section shows the software interface of the device. The host customer application controls the VL53L5CX
using an application programming interface (API). The API implementation is delivered to the customer as a driver
(C code and reference Linux driver). The driver provides the customer application with a set of high level functions
that allow control of the VL53L5CX Firmware such as device initialization, ranging start/stop, mode select etc.

Figure 6. VL53L5CX system functional description

2.2 Power state machine

Figure 7. Power state machine

Table 4. Power state description

Device state Description

Low power idle state with data retention

RAM and register content retained
LP idle
Allows fast resume to HP idle

I2C communication disabled if using LPn

High power idle state
HP idle Device needs to be in HP idle state to start ranging
Power up state
Full operation
Ranging
VCSEL is active (pulsing)

DS13754 - Rev 2 page 8/38

 VL53L5CX
Power up sequence

2.3 Power up sequence

The recommended power up sequence is shown in the figure below. When powering up the device, the IOVDD
supply should be applied at the same time or after AVDD. When removing power, the AVDD supply should be
removed at the same time or after IOVDD.
Note: Avoid powering IOVDD while AVDD is unpowered to prevent increased leakage current.

Figure 8. Power up sequence

Table 5. Power up timing table

Time Description Min.

t1 IOVDD rise after AVDD 0s

t2 IOVDD fall before AVDD 0s

DS13754 - Rev 2 page 9/38

 VL53L5CX
Power up sequence

2.3.1 Power up slew

To ensure proper operation of the module, the following minimum slew rates on the supplies must be met for
correct operation of the power on reset (POR) circuitry. The POR circuitry triggers at 0.9 V, but the supplies
should reach their operation levels in accordance with the slew rates listed in the table below.

Figure 9. Power up slew

Note: The minimum reset time is the minimum time required for the device ROM to load and boot up after IOVDD
reaches the POR rising threshold. The supply must have reached the minimum operating level (1.6 V) within this
time.
Note: The minimum slew rate on the IOVDD is the same regardless of 1.8 V or 2.8 V operation.
Note: The AVDD rise time is determined by the internal analogue levels which must be stable for correct operation.

Table 6. Supply slew rate minimum limits

Supply status AVDD slew IOVDD slew

Start together 0.001 V/µs 0.012 V/µs

AVDD stable followed by IOVDD — 0.012 V/µs
IOVDD stable followed by AVDD 0.001 V/µs —

2.3.2 Power up and I2C access

For correct operation of the device, the I2C interface assumes the power level has reached 1.62 V.

DS13754 - Rev 2 page 10/38

 VL53L5CX
I2C control interface

3 I2C control interface

This section specifies the control interface. The I2C interface uses two signals: serial data line (SDA) and
serial clock line (SCL). Each device connected to the bus uses a unique address and a simple master / slave
relationships exists.
Both SDA and SCL lines are connected to a positive supply voltage using pull-up resistors located on the host.
Lines are only actively driven low. A high condition occurs when lines are floating and the pull-up resistors pull
lines up. When no data is transmitted both lines are high.
Clock signal (SCL) generation is performed by the master device. The master device initiates data transfer. The
I2C bus on the VL53L5CX has a maximum speed of 1 Mbits/s and uses a device 8-bit address of 0x52.

Figure 10. Data transfer protocol

Information is packed in 8-bit packets (bytes) always followed by an acknowledge bit, Ac for VL53L5CX
acknowledge and Am for master acknowledge (host bus master). The internal data are produced by sampling
SDA at a rising edge of SCL. The external data must be stable during the high period of SCL. The exceptions to
this are start (S) or stop (P) conditions when SDA falls or rises respectively, while SCL is high.
A message contains a series of bytes preceded by a start condition and followed by either a stop or repeated
start (another start condition but without a preceding stop condition) followed by another message. The first
byte contains the device address (0x52) and also specifies the data direction. If the least significant bit is low
(that is, 0x52) the message is a master-write-to-the-slave. If the lsb is set (that is, 0x53) then the message is a
master-read-from-the-slave.

Figure 11. VL53L5CX I2C device address: 0x52

All serial interface communications with the camera module must begin with a start condition. The VL53L5CX
module acknowledges the receipt of a valid address by driving the SDA wire low. The state of the read/write bit
(lsb of the address byte) is stored and the next byte of data, sampled from SDA, can be interpreted. During a write
sequence, the second byte received provides a 16-bit index which points to one of the internal 8-bit registers.

DS13754 - Rev 2 page 11/38

 VL53L5CX
I2C control interface

Figure 12. VL53L5CX data format (write)

As data are received by the slave, they are written bit by bit to a serial/parallel register. After each data byte
has been received by the slave, an acknowledge is generated, the data are then stored in the internal register
addressed by the current index.
During a read message, the contents of the register addressed by the current index is read out in the byte
following the device address byte. The contents of this register are parallel loaded into the serial/parallel register
and clocked out of the device by the falling edge of SCL.

Figure 13. VL53L5CX data format (read)

At the end of each byte, in both read and write message sequences, an acknowledge is issued by the receiving
device (that is, the VL53L5CX for a write and the host for a read).
A message can only be terminated by the bus master, either by issuing a stop condition or by a negative
acknowledge (that is, not pulling the SDA line low) after reading a complete byte during a read operation.
The interface also supports auto-increment indexing. After the first data byte has been transferred, the index is
automatically incremented by 1. The master can therefore send data bytes continuously to the slave until the
slave fails to provide an acknowledge or the master terminates the write communication with a stop condition. If
the auto-increment feature is used the master does not have to send address indexes to accompany the data
bytes.

Figure 14. VL53L5CX data format (sequential write)

DS13754 - Rev 2 page 12/38

 VL53L5CX
I2C interface - timing characteristics

Figure 15. VL53L5CX data format (sequential read)

3.1 I2C interface - timing characteristics

Timing characteristics are shown in the tables below. Please refer to the figure below for an explanation of the
parameters used.
Timings are given for all process, voltage and temperature (PVT) conditions.

Table 7. I2C interface - timing characteristics for Fast mode plus (1 MHz)

Symbol Parameter Minimum Typical Maximum Unit

FI2C Operating frequency 0 — 1000 kHz

tLOW Clock pulse width low 0.5 — — µs

tHIGH Clock pulse width high 0.26 — — µs

Pulse width of spikes which are

tSP — — 50 ns
suppressed by the input filter
Bus free time between
tBUF 0.5 — — µs
transmissions
tHD.STA Start hold time 0.26 — — µs

tSU.STA Start setup time 0.26 — — µs

tHD.DAT Data in hold time 0 — 0.9 µs

tSU.DAT Data in setup time 50 — — ns

tR SCL/SDA rise time — — 120 ns

tF SCL/SDA fall time — — 120 ns

tSU.STO Stop setup time 0.26 — — µs

Ci/o Input/output capacitance (SDA) — — 10 pF

Cin Input capacitance (SCL) — — 4 pF
CL Load capacitance — 140 550 pF

DS13754 - Rev 2 page 13/38

 VL53L5CX
I2C interface - timing characteristics

Table 8. I2C interface - timing characteristics for Fast mode (400 kHz)

Symbol Parameter Minimum Typical Maximum Unit

FI2C Operating frequency 0 — 400 kHz

tLOW Clock pulse width low 1.3 — — µs

tHIGH Clock pulse width high 0.6 — — µs

Pulse width of spikes which are

tSP — — 50 ns
suppressed by the input filter
Bus free time between
tBUF 1.3 — — ms
transmissions
tHD.STA Start hold time 0.26 — — µs

tSU.STA Start setup time 0.26 — — µs

tHD.DAT Data in hold time 0 — 0.9 µs

tSU.DAT Data in setup time 50 — — ns

tR SCL/SDA rise time — — 120 ns

tF SCL/SDA fall time — — 120 ns

tSU.STO Stop setup time 0.6 — — µs

Ci/o Input/output capacitance (SDA) — — 10 pF

Cin Input capacitance (SCL) — — 4 pF
CL Load capacitance — 125 400 pF

Figure 16. I2C timing characteristics

stop start start stop

VIH
SDA ... VIL

tBUF tLOW tR tF tHD.STA

VIH
SCL
VIL
...

tHD.STA tHD.DAT tHIGH tSU.DAT tSU.STA tSU.STO

DS13754 - Rev 2 page 14/38

 VL53L5CX
Electrical characteristics

4 Electrical characteristics

4.1 Absolute maximum ratings

Table 9. Absolute maximum ratings

Parameter Min. Typ. Max. Unit

AVDD, IOVDD -0.5 — 3.6

V
SCL, SDA, LPn, INT and I2C_RST -0.5 — 3.6

Note: Stresses above those listed in Section 1 Product overview may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at these or any other conditions above those indicated
in the operational sections of the specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.

4.2 Recommended operating conditions

Table 10. Recommended operating conditions

Parameter Min. Typ. Max. Unit

2.8 V configuration 2.5 2.8 3.3

AVDD supply(1)
3.3 V configuration 3.0 3.3 3.6
1.8 V configuration 1.62 1.8 1.98 V
IOVDD supply 2.8 V configuration 2.5 2.8 3.3
3.3 V configuration 3.0 3.3 3.6
Ambient temperature (normal operating) -30 — 85 °C

1. AVDD is independent of IOVDD

4.3 Electrostatic discharge (ESD)

The VL53L5CX is compliant with ESD values presented in the table below.

Table 11. ESD performances

Parameter Specification Conditions

Human body model JEDEC JS-001-2014 ± 2 kV, 1500 Ohms, 100 pF

Charged device model JEDEC JS-002-2014 ± 500 V

DS13754 - Rev 2 page 15/38

 VL53L5CX
Current consumption

4.4 Current consumption

The current consumption values are given in the table below.
• Typical values quoted are for nominal voltage, process, and temperature (23 oC).
• Maximum values are quoted for worst case conditions (process, voltage, and temperature) unless stated
otherwise (70 oC).

Table 12. Current consumption

Average current consumption

Device State AVDD IOVDD Unit

Typ. Max. Typ. Max.

LP idle 45 300 0.1 1 μA

HP idle 1.3 1.6 2.8 35 mA

Active ranging(1) 45 50 50 80 mA

1. Active ranging is when the device is actively ranging. The current consumption is not affected by 4x4 or 8x8 zone
configuration

IOVDD peak current will be the average value +10 mA.

AVDD peak current will be the average current +10 mA.

Table 13. Example of typical power consumption in Continuous mode

Parameter 2V8/1V8 2V8/2V8 3V3/3V3 Unit

Continuous mode (4x4

216 266 313 mW
mode or 8x8 mode)

Table 14. Example of typical power consumption in Autonomous mode

Parameter 2V8/1V8 2V8/2V8 3V3/3V3 Unit

4x4 mode - 1 Hz frame rate with 5 ms

2.8 3.7 4.5
integration time
4x4 mode - 5 Hz frame rate with 5 ms
11 16 19
integration time
mW
4x4 mode - 10 Hz frame rate with 45 ms
95 133 156
integration time
8x8 mode - 1 Hz frame rate with 5 ms
8 11 11
integration time

DS13754 - Rev 2 page 16/38

 VL53L5CX
Digital input and output

4.5 Digital input and output

The following tables summarize the digital I/O electrical characteristics.

Table 15. INT, I2C_RST, LPn

IOVDD
Symbol Parameter Min. Max. Unit
configuration

1.8 V
VIL Low level input voltage -0.3 0.35* IOVDD
2.8 V - 3.3 V
1.8 V 2.28
VIH High level input voltage 0.65*IOVDD
2.8 V - 3.3 V 3.6
V
Low level output voltage 1.8 V
VOL — 0.4
(IOUT = 4 mA) 2.8 V - 3.3 V

High level output voltage 1.8 V 1.22

VOH —
(IOUT = 4 mA) 2.8 V - 3.3 V 2.1

Table 16. I2C interface (SDA/SCL)

IOVDD
Symbol Parameter Min. Max. Unit
configuration

Low level input 1.8 V 0.54

VIL -0.3
voltage 2.8 V - 3.3 V 0.3*IOVDD

High level input 1.8 V 2.28

VIH 1.13
voltage 2.8 V - 3.3 V 3.6 V

Low level output 1.8 V

VOL voltage — 0.4
(Iout = 4 mA) 2.8 V- 3.3 V

Leakage from IOVDD supply — 2.5

IIL/IH μA
Leakage from IOVDD pad — 1

Note: I2C pads use 1V8 switching thresholds for all IOVDD supplies
Note: A maximum load of 12 mA is assumed in the above table

DS13754 - Rev 2 page 17/38

 VL53L5CX
Ranging performance

5 Ranging performance

5.1 Zone mapping

5.1.1 Zone mapping 4x4

The figure below shows the zone definition in 4x4 mode. There are 16 zones in total which increment along a row
first before starting a new row. The physical view is from the device top into the lens. The numbers of each zone,
as indicated in the figure below, corresponds to the ZoneIDs returned by the sensor.

Figure 17. Zone mapping in 4x4 mode

5.1.2 Zone mapping 8x8

The figure below shows the zone definition in 8x8 mode. There are 64 zones in total which increment along a row
first before starting a new row. The physical view is from the device top into the lens. The numbers of each zone,
as indicated in the figure below, correspond to the ZoneIDs returned by the sensor to the host.

Figure 18. Zone mapping in 8x8 mode

DS13754 - Rev 2 page 18/38

 VL53L5CX
Continuous ranging mode

5.1.3 Effective zone orientation

The VL53L5CX module includes a lens over the RX aperture which flips (horizontally and vertically) the captured
image of the target. As a consequence, the zone identified as zone 0 in the bottom left of the SPAD array is
illuminated by a target located at the top right hand side of the scene.

Figure 19. Effective orientation

5.2 Continuous ranging mode

5.2.1 Measurement conditions

The following criteria and test conditions apply to all the characterisation results detailed in this section unless
specified otherwise:
• The specified target fills 100 % of the field of view of the device (in all zones).
• Targets used are Munsell N4.75 (17 %) and Munsell N9.5 (88 %).
• AVDD is 2.8 V, IOVDD is 1.8 V.
• Nominal ambient temperature is 23 oC.
• Maximum range capability is based on a 90 % detection rate (1).
• Range accuracy figures are based on 2.7 sigma ie 99.3 % of measurements are within the specified
accuracy.
• Tests are performed in the dark and at 2 W/m2 target illumination (940 nm). A 2 W/m2 target irradiance at
940 nm is equivalent to 5 kLux daylight.
• All tests are performed without coverglass.
• The sensor relies on default calibration data.
• The device is controlled through the API using the default driver settings.

1. Detection rate is a statistical value indicating the worst case percentage of measurements that return a valid ranging. For
example, taking 1000 measurements with 90 % detection rate gives 900 valid distances. The 100 other distances may be
outside the specification.

DS13754 - Rev 2 page 19/38

 VL53L5CX
Continuous ranging mode

5.2.2 Maximum ranging distance 4x4

The table below shows the maximum ranging capability of the VL53L5CX under different conditions. Refer to
Section 5.2.1 Measurement conditions for the general test conditions.

Table 17. Maximum ranging capabilities when ranging continuously at 30 Hz

Target reflectance level. Full

Zone Dark Ambient light (5 klux)
FoV (reflectance %)

Typical: 4000 mm Typical: 1700 mm

Inner
Minimum: 4000 mm Minimum: 1400 mm
White target (88 %)
Typical: 4000 mm Typical: 1400 mm
Corner
Minimum: 4000 mm Minimum: 1100 mm
Typical: 2400 mm Typical: 1000 mm
Inner
Minimum: 1900 mm Minimum: 900 mm
Grey target (17 %)
Typical: 2200 mm Typical: 950 mm
Corner
Minimum: 1800 mm Minimum: 850 mm

5.2.3 Maximum ranging distance 8x8

The table below shows the maximum ranging capability of the VL53L5CX under different conditions. Refer to
Section 5.2.1 Measurement conditions for the general test conditions.

Table 18. Max ranging capabilities when ranging continuously at 15Hz

Target reflectance level. Full

Zone Dark (0 klux) Ambient light (5 klux)
FoV (reflectance %)

Typical: 3500 mm Typical: 1100 mm

Inner
Minimum: 2600 mm Minimum: 950 mm
White target (88 %)
Typical: 3100 mm Typical: 1000 mm
Corner
Minimum: 1700 mm Minimum: 800 mm
Typical: 1300 mm Typical: 800 mm
Inner:
Minimum: 900 mm Minimum: 600 mm
Grey target (17 %)(1)
Typical: 1100 mm Typical: 650 mm
Corner
Minimum: 600 mm Minimum: 400 mm

1. measured 13 % in IR at 940 nm

DS13754 - Rev 2 page 20/38

 VL53L5CX
Continuous ranging mode

5.2.4 Range accuracy - Continuous mode

The figure below illustrates how range accuracy is defined over distance.

Figure 20. Range accuracy vs distance

Table 19. Range accuracy

Ambient light (5
Distance Mode Target reflectance Zones Dark (0 klux)
klux)

20 - 200 mm 8x8 15Hz Grey target (17 %) All ±15 mm 15 mm

White target (88 %) ±4 % 7%
4x4 30Hz
Grey target (17 %) ±5 % 8%
201 - 4000 mm All
White target (88 %) ±5 % 8%
8x8 15Hz
Grey target (17 %) ±5 % 11%

DS13754 - Rev 2 page 21/38

 VL53L5CX
Autonomous ranging mode

5.3 Autonomous ranging mode

5.3.1 Measurement conditions

The following criteria and test conditions apply to all the characterisation results detailed in this section unless
specified otherwise:
• The specified target fills 100 % of the field of view of the device (in all zones).
• Targets used are Munsell N4.75 (17 %) and Munsell N9.5 (88 %).
• AVDD is 2.8 V, IOVDD is 1.8 V.
• Nominal ambient temperature is 23 oC.
• Maximum range capability is based on a 90 % detection rate (1).
• Range accuracy figures are based on 2.7 sigma ie 99.3 % of measurements are within the specified
accuracy.
• Tests are performed in the dark and at 2 W/m2 target illumination (940 nm). A 2 W/m2 target irradiance at
940 nm is equivalent to 5 kLux daylight.
• All tests are performed without coverglass.
• The sensor relies on default calibration data.
• The device is controlled thought the API using the default driver settings.

1. Detection rate is a statistical value indicating the worst case percentage of measurements that return a valid ranging. For
example, taking 1000 measurements with 90 % detection rate gives 900 valid distances. The 100 other distances may be
outside the specification.

5.3.2 Maximum ranging distance 4x4

Table 20. Maximum ranging capabilities when ranging with Autonomous mode at 30 Hz – 4x4 – integration
time 5 ms

Target reflectance level. Full FoV Integration time

Zone Dark (0 klux) Ambient light (5 klux)
(reflectance %) (ms)

Typical : 3000 mm Typical : 1300 mm

Inner 5
Minimum : 2700 mm Minimum : 1100 mm
White target (88 %)
Typical : 2700 mm Typical : 1200 mm
Corner 5
Minimum : 2400 mm Minimum : 1000 mm
Typical : 1100 mm Typical : 800 mm
Inner 5
Minimum : 900 mm Minimum : 600 mm
Grey target (17 %)
Typical : 1000 mm Typical : 700 mm
Corner 5
Minimum : 800 mm Minimum : 500 mm

DS13754 - Rev 2 page 22/38

 VL53L5CX
Range offset drift over temperature

Table 21. Maximum ranging capabilities when ranging with Autonomous mode at 15 Hz – 8x8 – integration
time 5 ms

Target reflectance level. Full FoV Integration time

Zone Dark (0 klux) Ambient light (5 klux)
(reflectance %) (ms)

Typical : 1900 mm Typical : 900 mm

Inner 5
Minimum : 1700 mm Minimum : 800 mm
White target (88 %)
Typical : 1600 mm Typical : 800 mm
Corner 5
Minimum : 1300 mm Minimum : 650 mm
Typical : 800 mm Typical : 500 mm
Inner 5
Minimum : 600 mm Minimum : 400 mm
Grey target (17 %)
Typical : 600 mm Typical : 400 mm
Corner 5
Minimum : 500 mm Minimum : 300 mm

5.3.3 Range accuracy - Autonomous mode

Table 22. Range accuracy – Autonomous mode

Distance (mm) Mode Integration time (ms) Reflectance Dark (0 klux) Ambient light (5 klux)

20-200 mm 8x8 15 Hz 5 ms White 88 % ±17 mm ±20 mm

5 ms Grey 17 % ±6 % ±10 %
4x4 30 Hz
5 ms White 88 % ±5 % ±8 %
201-4000mm
5 ms Grey 17 % ±8 % ±12 %
8x8 15 Hz
5 ms White 88 % ±7 % ±10 %

5.4 Range offset drift over temperature

Any increase in silicon temperature either from selfheating or a change in ambient temperature results in a range
offset drift which may be minimised by performing periodic autocalibration, resulting in typical drift of 0.05 mm/°C.

DS13754 - Rev 2 page 23/38

 VL53L5CX
Outline drawings

6 Outline drawings

The figures below gives details of the VL53L5CX module. All values are given in millimetres.

Figure 21. Outline drawing (page 1/4)

Note: SM stands for solder mask.

Note: A thermal pad is required on the application board for thermal dissipation purpose. For more information, refer to
AN5657.

DS13754 - Rev 2 page 24/38

 VL53L5CX
Outline drawings

Figure 22. Outline drawing (page 2/4)

Note: For more information, refer to the pin description in Table 3. VL53L5CX pin description.

Figure 23. Outline drawing (page 3/4) - Module with liner

DS13754 - Rev 2 page 25/38

 VL53L5CX
Outline drawings

Figure 24. Outline drawing (page 4/4)

DS13754 - Rev 2 page 26/38

 VL53L5CX
Laser safety considerations

7 Laser safety considerations

The laser output power must not be increased by any means and no optics should be used with the intention of
focusing the laser beam.
Caution: Use of controls or adjustments or performance of procedures other than those specified herein may result in
hazardous radiation exposure.

Figure 25. Class 1 laser label

Figure 26. Laser notice 50: applies to IEC 60825-1:2007

Figure 27. Laser notice 56: applies to IEC 60825-1:2014

DS13754 - Rev 2 page 27/38

 VL53L5CX
Packaging and labeling

8 Packaging and labeling

8.1 Product marking

See the figure below for the product marking area. The marking is L5C-

Figure 28. Product marking area

A 2D product marking code is applied on the corner of the module cap as shown in the figure below.
Note: The 2D marking code aligns with pin C7 of the module and is not an indicator of pin 1.

Figure 29. 2D product marking code

DS13754 - Rev 2 page 28/38

 VL53L5CX
Inner box labeling

8.2 Inner box labeling

The labeling follows the ST standard packing acceptance specification.
The following information is on the inner box label:
• Assembly site
• Sales type
• Quantity
• Trace code
• Marking
• Bulk ID number

8.3 Packing
At customer/subcontractor level, it is recommended to mount the VL53L5CX in a clean environment.
To help avoid any foreign material contamination at final assembly level the modules are shipped in a tape and
reel format with a protective liner.
The liner is compliant with reflow at 260 °C (as per JEDEC-STD-020E).
Note: The liner must be removed during assembly of the customer device, just before mounting the cover glass.

8.4 Tape outline drawing

Figure 30. VL53L5CX tape outline and reel packaging drawing

DS13754 - Rev 2 page 29/38

 VL53L5CX
Pb-free solder reflow process

8.5 Pb-free solder reflow process

The table and figure below show the recommended and maximum values for the solder profile.
Customers have to tune the reflow profile depending on the PCB, solder paste and material used. We expect
customers to follow the “recommended” reflow profile, which is specifically tuned for the VL53L5CX package.
For any reason, if a customer must perform a reflow profile which is different from the “recommended” one
(especially peak >240 °C), the new profile must be qualified by the customer at their own risk. In any case, the
profile has to be within the “maximum” profile limit described in the table below.

Table 23. Recommended solder profile

Parameters Recommended Maximum Units

Minimum temperature (TS min) 130 150 °C

Maximum temperature (TS max) 200 200 °C
Time ts (TS min to TS max) 90-110 60-120 s

Temperature (TL) 217 217 °C

Time (tL) 55-65 55-65 s
Ramp up 2 3 °C/s

Temperature (Tp-10) — 235 °C

Time (tp-10) — 10 s
Ramp up — 3 °C/s

Peak temperature (Tp) 240 260 °C

Time to peak 300 300 s

Ramp down (peak to TL) -4 -6 °C/s

Figure 31. Solder profile

Note: The component should be limited to a maximum of three passes through this solder profile.
Note: As the VL53L5CX package is not sealed, only a dry reflow process should be used (such as convection reflow).
Vapor phase reflow is not suitable for this type of optical component.
Note: The VL53L5CX is an optical component and as such, it should be treated carefully. This would typically include
using a ‘no-wash’ assembly process.

DS13754 - Rev 2 page 30/38

 VL53L5CX
Handling and storage precautions

8.6 Handling and storage precautions

8.6.1 Recommended solder pad dimensions

Figure 32. Recommended solder pattern

8.6.2 Shock precautions

Sensor modules house numerous internal components that are susceptible to shock damage. If a unit is subject
to excessive shock, is dropped on the floor, or a tray/reel of units is dropped on the floor, it must be rejected, even
if no apparent damage is visible.

8.6.3 Part handling

Handling must be done with non-marring ESD safe carbon, plastic, or teflon tweezers. Ranging modules are
susceptible to damage or contamination. The customer is advised to use a clean assembly process until a
protective cover glass is mounted.

8.6.4 Compression force

A maximum compressive load of 25 N should be applied on the module.

8.6.5 Moisture sensitivity level

Moisture sensitivity is level 3 (MSL) as described in IPC/JEDEC JSTD-020-C.
Note: If devices are stored out of the packaging for more than 168 hours, the devices should be baked before use. The
optimum bake recommended is at + 90 °C for a minimum of 6 hours.

8.7 Storage temperature conditions

Table 24. Recommended storage conditions

Parameter Min. Typ. Max. Unit

Temperature (storage) -40 23 90 °C

DS13754 - Rev 2 page 31/38

 VL53L5CX
Ordering information

9 Ordering information

The VL53L5CX is currently available in the formats below. More detailed information is available on request.

Table 25. Order codes

Order codes Package Packing Minimum order quantity

VL53L5CXV0GC/1 Optical LGA16 with liner Tape and reel 3600 pcs

DS13754 - Rev 2 page 32/38

 VL53L5CX
Package information

10 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

DS13754 - Rev 2 page 33/38

 VL53L5CX
Acronyms and abbreviations

11 Acronyms and abbreviations

Acronym/abbreviation Definition

AF autofocus
API application programming interface
AR/VR augmented reality/virtual reality
DOE diffractive optical element
ESD electrostatic discharge
FoV field of view
FoI field of illumination
GPIO general purpose input output
HP high power

I2C inter-integrated circuit (serial bus)

LAF laser autofocus

LGA land grid array
LP low power
NVM non-volatile memory
PCB printed circuit board
PDAF phase detection autofocus
PLL phase-locked loop
PVT process, voltage and temperature
POR power on reset
RAM random-access memory
SPAD single photon avalanche diode
SW software
ToF Time-of-Flight
UI user interface
UM user manual
VCSEL vertical cavity surface emitting laser

DS13754 - Rev 2 page 34/38

 VL53L5CX

Revision history

Table 26. Document revision history

Date Version Changes

06-Jul-2021 1 Initial release

30-Aug-2021 2 Added Section 8.6.1 Recommended solder pad dimensions

DS13754 - Rev 2 page 35/38

 VL53L5CX
Contents

Contents
1 Product overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.1 Technical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Field of view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Field of illumination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.4 System block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.5 Device pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.6 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Software interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Power state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Power up sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3.1 Power up slew. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.3.2 Power up and I2C access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3 I2C control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

3.1 I2C interface - timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

4.1 Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.3 Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.4 Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.5 Digital input and output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

5 Ranging performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

5.1 Zone mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.1.1 Zone mapping 4x4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5.1.2 Zone mapping 8x8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5.1.3 Effective zone orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

5.2 Continuous ranging mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

5.2.1 Measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

5.2.2 Maximum ranging distance 4x4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

DS13754 - Rev 2 page 36/38

 VL53L5CX
Contents

5.2.3 Maximum ranging distance 8x8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5.2.4 Range accuracy - Continuous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

5.3 Autonomous ranging mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

5.3.1 Measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

5.3.2 Maximum ranging distance 4x4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

5.3.3 Range accuracy - Autonomous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

5.4 Range offset drift over temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

6 Outline drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

7 Laser safety considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
8 Packaging and labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
8.1 Product marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.2 Inner box labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.3 Packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.4 Tape outline drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.5 Pb-free solder reflow process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.6 Handling and storage precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8.6.1 Recommended solder pad dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

8.6.2 Shock precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

8.6.3 Part handling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

8.6.4 Compression force . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

8.6.5 Moisture sensitivity level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

8.7 Storage temperature conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

9 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

10 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
11 Acronyms and abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

DS13754 - Rev 2 page 37/38

 VL53L5CX

IMPORTANT NOTICE – PLEASE READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service
names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2021 STMicroelectronics – All rights reserved

DS13754 - Rev 2 page 38/38