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Data Sheet

The TDA3810 integrated circuit provides three audio modes - spatial, stereo, and pseudo-stereo - for use in radio and television equipment. It features operational amplifiers to reduce switch noise, LED driver outputs to indicate the selected mode, and start/stop circuitry to prevent LED flicker. The circuit operates from a 12V power supply with low current draw and includes inputs for stereo audio signals and control signals to select the operating mode.
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Download as PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
45 views

Data Sheet

The TDA3810 integrated circuit provides three audio modes - spatial, stereo, and pseudo-stereo - for use in radio and television equipment. It features operational amplifiers to reduce switch noise, LED driver outputs to indicate the selected mode, and start/stop circuitry to prevent LED flicker. The circuit operates from a 12V power supply with low current draw and includes inputs for stereo audio signals and control signals to select the operating mode.
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
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INTEGRATED CIRCUITS

DATA SHEET

TDA3810
Spatial, stereo and pseudo-stereo
sound circuit
Product specification January 1985
File under Integrated Circuits, IC02
Philips Semiconductors Product specification

Spatial, stereo and pseudo-stereo


TDA3810
sound circuit

DESCRIPTION
The TDA3810 integrated circuit provides spatial, stereo and pseudo-stereo sound for radio and television equipment.

Features
• Three switched functions:
– spatial (widened stereo image)
– stereo
– pseudo-stereo (artificial stereo from a mono source)
• Offset compensated operational amplifiers to reduce switch noise
• LED driver outputs to facilitate indication of selected operating mode
• Start/stop circuit to reduce switch noise and to prevent LED-flicker
• TTL-compatible control inputs

QUICK REFERENCE DATA


Supply voltage (pin 18) VP typ. 12 V
Supply current (LEDs off) IP typ. 6 mA
Operating ambient temperature range Tamb 0 to +70 °C
Input signals (r.m.s. value) Vi(rms) < 2 V
Total harmonic distortion (stereo) THD typ. 0,1 %
Channel separation (stereo) α typ. 70 dB
Gain (stereo) Gv typ. 0 dB

PACKAGE OUTLINE
18-lead DIL; plastic (SOT102); SOT102-1; 1996 November 25.

January 1985 2
January 1985

Philips Semiconductors
circuit
Spatial, stereo and pseudo-stereo sound
3

Product specification
TDA3810
(1) Used in spatial mode for correction of high
frequency only (optimal performance).

Fig.1 Block diagram/test circuit showing external components; for control inputs to pins 11 and 12 see truth table.
Philips Semiconductors Product specification

Spatial, stereo and pseudo-stereo sound


TDA3810
circuit

RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage (pin 18) VP max. 18 V
Storage temperature range Tstg −25 to +150 °C
Operating ambient temperature range Tamb 0 to +70 °C

THERMAL RESISTANCE
From crystal to ambient Rth cr-a = 80 K/W

CHARACTERISTICS
VP = 12 V; Tamb = 25 °C; test circuit Fig.1 stereo mode (pin 11 to ground) unless otherwise specified.
Output load:
R6-10, 13-10 ≥ 4,7 kΩ; C6-10, 13-10 ≤ 150 pF.

PARAMETER SYMBOL MIN. TYP. MAX. UNIT


Supply voltage range (pin 18) VP 4,5 − 16,5 V
Supply current IP − 6 12 mA
Reference voltage VS 5,3 6 6,7 V
Input voltage (pin 2 or 17)
THD = 0,2% (stereo mode) Vi(rms) − − 2 V
Input resistance (pin 2 or 17) Ri 50 75 − kΩ
Voltage gain Vo/Vi Gv − 0 − dB
Channel separation (R/L) α 60 70 − dB
Total harmonic distortion
f = 40 to 16 000 Hz; Vo(rms) = 1 V THD − 0,1 − %
Power supply ripple rejection RR − 50 − dB
Noise output voltage
(unweighted) left and right output Vn(rms) − 10 − µV
SPATIAL MODE (pins 11 and 12 HIGH)
Antiphase crosstalk α − 50 − %
Voltage gain Gv 1,4 2,4 3,4 dB

PSEUDO-STEREO MODE
The quality and strength of the pseudo-stereo effect is determined by external filter components.

January 1985 4
Philips Semiconductors Product specification

Spatial, stereo and pseudo-stereo sound


TDA3810
circuit

PARAMETER SYMBOL MIN. TYP. MAX. UNIT


CONTROL INPUTS (pins 11 and 12)
Input resistance Ri 70 120 − kΩ
Switching current −Ii − 35 100 µA
LED DRIVERS (pins 7 and 8)
Output current for LED −Io 10 12 15 mA
Forward voltage VF − − 6 V

Truth table

CONTROL INPUT STATE LED LED


MODE SPATIAL PSEUDO
PIN 11 PIN 12 PIN 7 PIN 8
Mono pseudo-stereo HIGH LOW off on
Spatial stereo HIGH HIGH on off
Stereo LOW X off off

LOW = 0 to 0,8 V (the less positive voltage)


HIGH = 2 V to 5,5 V (the more positive voltage)
X = don’t care

January 1985 5
Philips Semiconductors Product specification

Spatial, stereo and pseudo-stereo sound


TDA3810
circuit

PACKAGE OUTLINE

DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1

D ME
seating plane

A2 A

A1
L

c
Z e w M
b1
(e 1)
b b2
18 10 MH

pin 1 index
E

1 9

0 5 10 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT
A A1 A2
b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.40 0.53 1.40 0.32 21.8 6.48 3.9 8.25 9.5
mm 4.7 0.51 3.7 2.54 7.62 0.254 0.85
1.14 0.38 1.14 0.23 21.4 6.20 3.4 7.80 8.3

inches 0.055 0.021 0.055 0.013 0.86 0.26 0.15 0.32 0.37
0.19 0.020 0.15 0.10 0.30 0.01 0.033
0.044 0.015 0.044 0.009 0.84 0.24 0.13 0.31 0.33

Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN


ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

93-10-14
SOT102-1
95-01-23

January 1985 6
Philips Semiconductors Product specification

Spatial, stereo and pseudo-stereo sound


TDA3810
circuit

SOLDERING with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
Introduction 5 seconds.
There is no soldering method that is ideal for all IC The device may be mounted up to the seating plane, but
packages. Wave soldering is often preferred when the temperature of the plastic body must not exceed the
through-hole and surface mounted components are mixed specified maximum storage temperature (Tstg max). If the
on one printed-circuit board. However, wave soldering is printed-circuit board has been pre-heated, forced cooling
not always suitable for surface mounted ICs, or for may be necessary immediately after soldering to keep the
printed-circuits with high population densities. In these temperature within the permissible limit.
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. Repairing soldered joints
A more in-depth account of soldering ICs can be found in
Apply a low voltage soldering iron (less than 24 V) to the
our “IC Package Databook” (order code 9398 652 90011).
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
Soldering by dipping or by wave
soldering iron bit is less than 300 °C it may remain in
The maximum permissible temperature of the solder is contact for up to 10 seconds. If the bit temperature is
260 °C; solder at this temperature must not be in contact between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS

Data sheet status


Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS


These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

January 1985 7

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