Data Sheet
Data Sheet
DATA SHEET
TDA3810
Spatial, stereo and pseudo-stereo
sound circuit
Product specification January 1985
File under Integrated Circuits, IC02
Philips Semiconductors Product specification
DESCRIPTION
The TDA3810 integrated circuit provides spatial, stereo and pseudo-stereo sound for radio and television equipment.
Features
• Three switched functions:
– spatial (widened stereo image)
– stereo
– pseudo-stereo (artificial stereo from a mono source)
• Offset compensated operational amplifiers to reduce switch noise
• LED driver outputs to facilitate indication of selected operating mode
• Start/stop circuit to reduce switch noise and to prevent LED-flicker
• TTL-compatible control inputs
PACKAGE OUTLINE
18-lead DIL; plastic (SOT102); SOT102-1; 1996 November 25.
January 1985 2
January 1985
Philips Semiconductors
circuit
Spatial, stereo and pseudo-stereo sound
3
Product specification
TDA3810
(1) Used in spatial mode for correction of high
frequency only (optimal performance).
Fig.1 Block diagram/test circuit showing external components; for control inputs to pins 11 and 12 see truth table.
Philips Semiconductors Product specification
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage (pin 18) VP max. 18 V
Storage temperature range Tstg −25 to +150 °C
Operating ambient temperature range Tamb 0 to +70 °C
THERMAL RESISTANCE
From crystal to ambient Rth cr-a = 80 K/W
CHARACTERISTICS
VP = 12 V; Tamb = 25 °C; test circuit Fig.1 stereo mode (pin 11 to ground) unless otherwise specified.
Output load:
R6-10, 13-10 ≥ 4,7 kΩ; C6-10, 13-10 ≤ 150 pF.
PSEUDO-STEREO MODE
The quality and strength of the pseudo-stereo effect is determined by external filter components.
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Philips Semiconductors Product specification
Truth table
January 1985 5
Philips Semiconductors Product specification
PACKAGE OUTLINE
D ME
seating plane
A2 A
A1
L
c
Z e w M
b1
(e 1)
b b2
18 10 MH
pin 1 index
E
1 9
0 5 10 mm
scale
UNIT
A A1 A2
b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.40 0.53 1.40 0.32 21.8 6.48 3.9 8.25 9.5
mm 4.7 0.51 3.7 2.54 7.62 0.254 0.85
1.14 0.38 1.14 0.23 21.4 6.20 3.4 7.80 8.3
inches 0.055 0.021 0.055 0.013 0.86 0.26 0.15 0.32 0.37
0.19 0.020 0.15 0.10 0.30 0.01 0.033
0.044 0.015 0.044 0.009 0.84 0.24 0.13 0.31 0.33
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
93-10-14
SOT102-1
95-01-23
January 1985 6
Philips Semiconductors Product specification
SOLDERING with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
Introduction 5 seconds.
There is no soldering method that is ideal for all IC The device may be mounted up to the seating plane, but
packages. Wave soldering is often preferred when the temperature of the plastic body must not exceed the
through-hole and surface mounted components are mixed specified maximum storage temperature (Tstg max). If the
on one printed-circuit board. However, wave soldering is printed-circuit board has been pre-heated, forced cooling
not always suitable for surface mounted ICs, or for may be necessary immediately after soldering to keep the
printed-circuits with high population densities. In these temperature within the permissible limit.
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. Repairing soldered joints
A more in-depth account of soldering ICs can be found in
Apply a low voltage soldering iron (less than 24 V) to the
our “IC Package Databook” (order code 9398 652 90011).
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
Soldering by dipping or by wave
soldering iron bit is less than 300 °C it may remain in
The maximum permissible temperature of the solder is contact for up to 10 seconds. If the bit temperature is
260 °C; solder at this temperature must not be in contact between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
January 1985 7