Design Rule Checks (DRC) - A Practical View For 28nm Technology
Design Rule Checks (DRC) - A Practical View For 28nm Technology
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Abstract
their causes and how to fix the various design rule 16,000 IP Cores from 450 Vendors
checks (DRC) at lower technology node on block level
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as well as full chip level implementation while
meeting the design rule with respect to latest technology standards.
I. INTRODUCTION
The first question that comes to the mind of an ASIC designer is “what is a
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design rule check?”, why we are doing this at SOC level, and what would
happen if the design does not meet the design rule checks? In this paper, 1,000 Verification IPs from 50 Vendors
you will find the answer to all these queries. Design rule checks are nothing
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but physical checks of metal width, pitch and spacing requirement for the
different layers which depend on different technology nodes. We need to
clean up the DRC of the design because there is a logical connection of
various components, and if they are physically connected, then it will fail the
functionality of the chips, and chips won’t be able to perform a specific task.
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The layout of a design must be in accordance with a set of predefined
technology rules given by the foundry for manufacturability. After completion A Heuristic Approach to Fix Design Rule
Check (DRC) Violations in ASIC Designs
of the layout and its physical connection, an automatic program will check @7nm FinFET Technology
each and every polygon in the design against these design rules and report
A practical view of ESL design
any violations. This whole process is called Design Rule Checking (DRC).
Electronic Circuit Design for RF Energy
There are many design rules at different technology nodes, a few of which Harvesting using 28nm FD-SOI
are mentioned below. Technology
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11/30/22, 1:30 PM Design Rule Checks (DRC) - A Practical View for 28nm Technology
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Solution:
To fix this type of short violation, different net segments on same layer has
to be placed away so that they will not cross each other. In this case, net
adjusted net will not cross each other and also meet the spacing requirement
in the same layer.
Solution:
To fix this type of spacing violation, the net needs to be placed away from
the via, or different size vias need to be inserted so it will meet the same net
spacing requirement. In above case, routing taken in reverse U shape will
meet the spacing requirements as below.
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11/30/22, 1:30 PM Design Rule Checks (DRC) - A Practical View for 28nm Technology
CASE C: Same layer spacing with net and cell geometry blockage
Description: In this case, there is same layer spacing with the cell blockage
and via enclosure
Highlighted in pic using white marker. Same net spacing in red color.
Solution:
Solution:
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11/30/22, 1:30 PM Design Rule Checks (DRC) - A Practical View for 28nm Technology
To meet this minimum area requirement, we need to increase the area of the
segment that will not violate the other design rule (spacing, short). For this
case I have increase the area where I was getting the violation shown below.
Description: This type violation pops up when two different layer of same
logical net connected by inserting the VIA. If inserted via is not aligning with
the metal crossing we are seeing the VIA misalignment.
Solution:
Proper VIA instance need to insert so the VIA enclosure align layer in its
direction properly and if needed we need to stretch the net and insert the
VIA.
After fixing the all DRC again we need to verify drc with different tool
Caliber,Quartz before releasing to foundary because while fixing the drc
there may be a chances of populating the new DRC violation.
Author
Experience in Place & Route, Static Timing Analysis, and Layout Verification,
Signal Integrity analysis, Low power technique implementation.
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11/30/22, 1:30 PM Design Rule Checks (DRC) - A Practical View for 28nm Technology
I’m a physical design engineer with 5 years experience in Very Large Scale
Integration/Application Specific Integrated Circuits field, I have worked on
different nanometer technology node (16nm,28nm,40nm,65nm) of ASIC
design Chips (SoC) in semiconductor industry from RTL netlist to GDS II,
Sign off process. I have successfully taped out multiple SoC. I have handled
many block which have more 2 million instance count with high number of
SRAMS and successfully completed whole PnR (Placement to Route) to sign
off flow. I have worked on different client project based on client
requirement (High speed Router SoC, Low Power SoC, FPGA SoC, Different
processor Series quadcore, octa core SoC ).
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