TI Designs

Multi-Standard CC2650 SensorTag Design Guide

TI Designs Design Features

TI Designs provide the foundation that you need • Offers Cloud Connectivity Out of Box
including methodology, testing and design files to – Access and Control Your SensorTag From
quickly evaluate and customize the system. TI Designs Anywhere and Explore a Seamless Integration
help you accelerate your time to market. With Mobile Applications and Web Pages
Through Javascript and MQTT
Design Resources
• Supports Multi-Standard Wireless MCU
http://www.ti.com/tool/TID – Bluetooth® Smart
C-CC2650STK- Tool Folder Containing Design Files
SENSORTAG – ZigBee®
http://www.ti.com/product – IPv6 over low-power wireless personal area
Product Folder
/cc2650 networks (6LoWPAN)
http://www.ti.com/product • Offers Low Power
Product Folder
/opt3001
http://www.ti.com/product • Supports 10 Low-Power Sensors
Product Folder
/tmp007 – Ambient Light
http://www.ti.com/product
/hdc1000
Product Folder – Infrared Temperature
http://www.ti.com/tool/cc2 – Ambient Temperature
Tools Folder
650stk
– Accelerometer
http://www.ti.com/tool/ccs
Tools Folder – Gyroscope
tudio
– Magnetometer
– Pressure
ASK Our E2E Experts
WEBENCH® Calculator Tools – Humidity
– Microphone
– Magnetic Sensor
• Based on the Extremely Low-Power and High-
Performance ARM® Cortex®-M3 CC2650 Wireless
MCU
• Can Use DevPacks to Expand the Functionality of
the SensorTag to Fit Your Design Ideas
– The Emulator Debug DevPack With a Free
Code Composer Studio™ IDE License,
Provides a Complete Development System.

Featured Applications
• Handsets for Smart Phones
• Home Automation
• Sensor Nodes
• Smart Watches
• Weather Stations
Code Composer Studio, SimpleLink are trademarks of Texas Instruments.
Cortex is a registered trademark of ARM Limited.
ARM is a registered trademark of ARM Physical IP Inc.
iOS, iBeacon, Apple App Store are trademarks of Apple Inc.
Bluetooth is a registered trademark of Bluetooth SIG.
Android, Google Play are trademarks of Google Inc.
ZigBee is a registered trademark of Zigbee Alliance.
All other trademarks are the property of their respective owners.

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Buzzer

Coin Cell/
2x AAA
2x Push DevPack
Buttons Interface

CC3200
JTAG
LED (WiFi)
Interface
CC2650
(BLE/ZigBee)
PDM
Reed Relay Microphone
MK24 SPK0833
I2C

IR Temp
Light Sensor Altimeter 9-axis Motion Humidity/Temp
Sensor
OPT3001 BMP280 MPU-9250 HDC1000
TMP007

An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and other
important disclaimers and information.

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www.ti.com System Description

1 System Description

1.1 Multi-Standard CC2650 SensorTag

The SensorTag kit invites you to realize your cloud-connected product idea. The new SensorTag includes
10 low-power MEMS sensors in a small package and is expandable with DevPacks that make adding your
own sensors or actuators easy.
Connect to the cloud with Bluetooth Smart and get your sensor data online in three minutes. The
SensorTag is ready to use right out the box with an iOS™ and Android™ application and require no
programming experience to get started.
The SensorTag is based on the low-power and high-performance CC2650 wireless MCU, which offers
75% lower power consumption than previous Bluetooth Smart products. This rate of power consumption
lets the SensorTag use battery power and offers years of battery life from a single coin cell battery.
The Bluetooth Smart SensorTag includes iBeacon™ technology. This technology allows your phone to
launch applications and customize content based on SensorTag data and your physical location.
The SensorTag can be enabled with ZigBee / 6LoWPAN technology.
Visit www.ti.com/SensorTag for more information on SensorTag technology.

1.1.1 Block Diagram

Buzzer

Coin Cell/
2x AAA
2x Push DevPack
Buttons Interface

CC3200
JTAG
LED (WiFi)
Interface
CC2650
(BLE/ZigBee)
PDM
Reed Relay Microphone
MK24 SPK0833
I2C

IR Temp
Light Sensor Altimeter 9-axis Motion Humidity/Temp
Sensor
OPT3001 BMP280 MPU-9250 HDC1000
TMP007

Figure 1. Block Diagram

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2 Highlighted Products
The design features the following devices:
• CC2650
• OPT3001
• TMP007
• HDC1000
For more information on these devices, see the product folders at www.TI.com.

2.1 CC2650 – Wireless MCU

The CC2650 device is a wireless MCU targeting Bluetooth Smart, ZigBee and 6LoWPAN, and ZigBee
RF4CE remote control applications.
The device is a member of the CC26xx family of cost-effective, ultra-low power, 2.4-GHz RF devices. The
ability to consume very low active RF and MCU currents and low-power mode currents provides excellent
battery life for the device. This ability also lets the device operate on small coin cell batteries and in
energy-harvesting applications.

Figure 2. CC2650 Functional Block Diagram

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www.ti.com Highlighted Products

2.2 OPT30001 – Ambient Light Sensor

The OPT3001 sensor measures the intensity of visible light. The spectral response of the sensor closely
matches the photopic response of the human eye and includes infrared rejection.

VDD

VDD

OPT3001 SCL
SDA
Ambient I2C
Optical ADC Interface INT
Light
Filter ADDR

GND

Figure 3. OPT3001 Functional Block Diagram

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2.3 TMP007 – Infrared Thermopile Temperature Sensor

The TMP007 sensor is an IR thermopile sensor that measures the temperature of an object without direct
contact with it. The integrated thermopile absorbs the infrared energy from the object in the field of view of
the sensor. The device digitizes the thermopile voltage and then provides it and the die temperature as
inputs to the integrated math engine. The math engine then computes the temperature of the
corresponding object.

V+

IR
Thermopile Voltage EEPROM
Sensor Reference

ALERT
Digital I2C and
Gain SMBus ADR0
16-Bit Control
ADC and Compatible ADR1
Math Engine Digital SCL
Interface SDA
Local
Temperature
TMP007

AGND DGND

Figure 4. TMP007 Functional Block Diagram

2.4 HDC1000 – Humidity Sensor With Integrated Temperature Sensor

The HDC1000 sensor is a factory-calibrated digital humidity sensor with an integrated temperature sensor
that provide accurate measurements at very low power. The HDC1000 sensor measures humidity based
on a novel capacitive sensor and functions within thetemperature range of –40°C to 125°C. The innovative
WLCSP (wafer-level chip scale package) simplifies board design with an ultra compact package and the
sensing element on the bottom of the HDC1000 device protects against dirt, dust, and other contaminants.

3.3 V 3.3 V 3.3 V

RH HDC1000 VDD
MCU VDD
SDA 2
IC
Registers SCL
DRDYn
Peripheral
ADC + I2C GPIO
ADR0
Logic
ADR1

OTP
TEMPERATURE Calibration Coefficients

GND GND

Figure 5. HDC1000 Functional Block Diagram

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www.ti.com System Design Theory

3 System Design Theory

The SensorTag is a complete development kit that requires no knowledge of embedded software to get
started testing with the kit. Connect the SensorTag to your smart phone using Bluetooth Smart; then use
your phone to connect to the cloud and access your latest workout data online in a matter of minutes.
iBeacon lets your phone launch applications and customize content based on SensorTag data and your
physical location.
Get started quickly using your applications, the supporting iOS and Android applications, or the SensorTag
to develop your own product using the low-power sensors.

3.1 Application and Web Development

Access data from your SensorTag through cloud providers or use JavaScript and jQuery examples to
access data directly. Use Android and iOS mobile applications as starting points for your own Internet of
Things (IoT) projects or write HTML5 platform-independent code based on the source code from sample
web application projects.

3.2 Embedded Software Development

The SensorTag offers open hardware and software reference design for low-power IoT nodes at a low
cost. The SensorTag with the Debug DevPack provide the most affordable platform for developing
hardware. Port the SensorTag application between radio standards to quickly evaluate which wireless
technology is right for your application.

3.3 Hardware Development

Use the SensorTag hardware as the development platform for your IoT project. The open hardware
demonstrates how to use 10 low-power sensors. The DevPack interface makes it easy to develop and test
your own sensors and actuators on the IoT cloud.

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4 Getting Started

4.1 Hardware
The SensorTag kit includes everything needed to get started. Download the free SensorTag application
from the Apple App Store™ or Google Play™ and get started with your IoT development.

4.2 Firmware

4.2.1 The Bluetooth Low Energy Stack (BLE-STACK-2): includes download links for the SensorTag Bluetooth
Low Energy firmware.

4.2.2 SensorTag ZigBee Firmware

The ZigBee stack (Z-STACK-HOME) includes download links for the SensorTag ZigBee firmware.

4.2.3 SensorTag 6LowPAN Firmware

The Contiki stack includes download links for the SensorTag 6LowPAN firmware.

5 Test Setup
We measured the antenna radiation pattern in a 3-m long RF shielded room (an anechoic chamber). The
device under test (DUT) was set in transmit mode and rotated around to create a 360° antenna radiation
pattern. The measurement antenna was placed in the opposite side of the chamber. The DUT transmitted
a continuous wave (CW) at 2440 MHz and the antenna measured the wave with 15° steps in azimuth and
elevation. Figure 6, Figure 7, and Figure 8 show the test set up.

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Figure 6. Antenna Radiation Pattern

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Figure 7. DUT Mounted On Rotating Arm

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Figure 8. Measurement Antenna

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6 Test Data

Figure 9. Theta = 0, Phi = 0

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Figure 10. Theta = 180, Phi = 0

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Figure 11. Theta = 90, Phi = 0

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Figure 12. Theta = 90, Phi = 180

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Figure 13. Theta = 90, Phi = 270

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www.ti.com Test Data

Figure 14. Theta = 90, Phi = 90

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7 Design Files

7.1 Schematics
To download the schematics for each board, see the design files at SWRR134.
H1 K1

VDD VDD
VDD VDD
JTAG_TCK
JTAG_TCK JTAG_TMS JTAG_TCK
JTAG_TMS JTAG_TMS
BUTTON1
BUTTON1 BUTTON2 BUTTON1
BUTTON2 LED1 BUTTON2
LED1 LED2 LED1
LED2 LED2
SDA
SDA SCL
SCL BUZZER
BUZZER
SDA HP nRESET
SDA HP nRESET
SCL HP
SCL HP
nRESET
nRESET

MPU INT DP_ID

MPU INT REED SCL DP_ID
REED SDA SCL
MIC PWR DP0 SDA
MIC PWR AUDIO DI DP1 DP0
AUDIO DI BUZZER DP2 DP1
BUZZER TMP RDY DP3 DP2
TMP RDY DP4/UART_RX DP3
DP5/UART_TX DP4/UART_RX
DP6/AUDIO DO DP5/UART_TX
DP_ID DP7/AUDIO CLK DP6/AUDIO DO
DP_ID DP0 DP8/SCLK/TDI DP7/AUDIO CLK
DP0 DP1 DP9/MISO DP8/SCLK/TDI
DP1 DP2 DP10/MOSI DP9/MISO
DP2 DP3 DP11/CSN DP10/MOSI
DP3 DP4/UART_RX DP12/AUDIO FS/TDO DP11/CSN
DP4/UART_RX DP5/UART_TX FLASH_CS DP12/AUDIO FS/TDO
DP5/UART_TX DP6/AUDIO DO FLASH_CS
DP6/AUDIO DO DP7/AUDIO CLK
DP7/AUDIO CLK DP8/SCLK/TDI
DP8/SCLK/TDI DP9/MISO
DP9/MISO Peripheral and Power
DP10/MOSI
DP10/MOSI DP11/CSN
DP11/CSN N1
DP12/AUDIO FS/TDO
DP12/AUDIO FS/TDO MPU PWR
MPU PWR VDD
FLASH_CS VDD
FLASH_CS
SCL
SDA SCL
SDA
SCL HP
SDA HP SCL HP
SDA HP
CC2650
MPU INT
REED MPU INT
TMP RDY REED
TMP RDY
MIC PWR
DP7/AUDIO CLK MIC PWR
AUDIO DI DP7/AUDIO CLK
DP12/AUDIO FS/TDO AUDIO DI
MPU PWR DP12/AUDIO FS/TDO
MPU PWR

Sensors
Figure 15. CC2650STK Schematics

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VDDR
VDDS
FL1 VDDS Decoupling Capacitors VDDR Decoupling Capacitors
L1
2 1 Pin 13 Pin 22 Pin 44 Pin 34 10uH Pin 45 Pin 48
VDD DCDC_SW 1 2
BLM18HE152SN1
C2 C3 C4 C6 C7 C8 C9
C1 C5 C31
100nF 100nF 100nF 100nF 10uF 100nF 100nF
DNM 22uF DNM

VDDS
2
U1A VDDS VDDR
13 L2
R1 VDDS2
VDDS3
22 2.4nH Coaxial
24 44
100k JTAG_TMS
25 JTAG_TMSC VDDS 34 1 C11 switch
JTAG_TCK JTAG_TCKC VDDS_DCDC A1
nRESET 35 45
RESET_N VDDR 48 C32 15pF
VDDR 4 3
C12 DCDC_SW 33 2 3
DCDC_SW 1pF ANT1 ANT4 ANT5
100nF 1
3 RF_P 2 1 2 1 2 2 1 1
X32K_Q1 RF_N C33 15pF
4
23 X32K_Q2 46 2nH 2nH 0 2.4GHz
DCOUPL X24M_N L3
Y1 49 47
VSS X24M_P J1 ANT6
1 2 ANT2 ANT3
CC26xx-7x7 MS-156HF 0.5pF
Y2 2.4nH DNM 1pF
32.768kHz
24MHz C13
C14 C15 C16 1pF
12pF 12pF 1uF 1 3

C17 C18
2 4
DNM_0402 DNM_0402

VDD
MPU PWR
U1B
BUTTON2 5 26 DP12/AUDIO FS/TDO
6 DIO_0 DIO_16 27
TMP RDY DIO_1 DIO_17 DP8/SCLK/TDI
R2 R3 AUDIO DI 7 28 DP9/MISO
R4 R5 10k 10k 8 DIO_2 DIO_18 29
REED DIO_3 DIO_19 DP10/MOSI
10k 10k BUTTON1 9 30 DP11/CSN
10 DIO_4 DIO_20 31
SDA DIO_5 DIO_21 BUZZER
11 32 DP6/AUDIO DO
SCL DIO_6 DIO_22
MPU INT 12 36 DP2
14 DIO_7 DIO_23 37 VDD
SDA HP DIO_8 DIO_24 DP1
15 38 DP0
SCL HP DIO_9 DIO_25
LED1 16 39 VDD
17 DIO_10 DIO_26 40 R6
DP7/AUDIO CLK DIO_11 DIO_27 DP3
MPU PWR 18 41 DP4/UART_RX 200k
19 DIO_12 DIO_28 42
MIC PWR DIO_13 DIO_29 DP5/UART_TX
FLASH_CS 20 43 DP_ID
21 DIO_14 DIO_30
LED2 DIO_15
CC26xx-7x7

Figure 16. CC2650STK Schematics

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Buzzer Battery interface

VDD
R26 R12
BAT+
1+ 0 0
VDD_BATT

+
BZ1
HCS0503B
BAT-
3
-

-
2

2
1
+
+
3 BT1
R7 BAT-HLD-001

3-
1 Q1
BUZZER
BC846B
10k
2

R8
5.1

SKIN Connector

J2 R23 U2
VDD 1 2 DNM B2 A2
3 4 V+ IN
SCL SDA
DP12/AUDIO FS/TDO 5 6 DP7/AUDIO CLK DevPack->VDD A1 C2
NO COM VDD
7 8 DP6/AUDIO DO R9
DP11/CSN
9 10 DP5/UART_TX C1 B1 2Meg
11 12 NC GND
DP10/MOSI DP4/UART_RX
13 14 DP3 TS5A3159AYZPR
DP9/MISO
DP8/SCLK/TDI 15 16 DP2
DP_ID 17 18 DP1
19 20 DP0
Debug / JTAG interface LSS-110-01-F-DV-A-TR

POWER GOOD

P1

2 1 VDD
JTAG_TMS
4 3
JTAG_TCK
6 5
DP12/AUDIO FS/TDO
8 7
DP8/SCLK/TDI
10 9
nRESET

BB02-BS101-KA8-025B00

External storage
LEDs and Buttons VDD

R16 R17 R18

2.2k 10k 10k
CR1 R10
2 1 680 U10
LED1
5 8 VDD
DP10/MOSI DI/IO0 VCC
DP8/SCLK/TDI 6
LS L296-P2Q2-1 CLK
1
FLASH_CS nCS
3 C28
CR3 R27 7 nWP 2
150 nHOLD DO/IO1 DP9/MISO 100nF
2 1
LED2
9
4 EGP
LPL296-J2L2-25 GND
W25X20CLUXIG
R21
270 SW1
2 1
BUTTON1
MTA2-WNC

R22
270 SW2
2 1
BUTTON2
MTA2-WNC

Figure 17. CC2650STK Schematics

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Reed Relay Pressure Sensor Infrared Thermopile Sensor

VDD

R11
SW3 0
VDD 1 2 REED VDD
MK24-A
U3
SDA 3 8 C19
5 SDI VDD
SDO 100nF U4
6 R50
4 VDDIO B3 A3 2.2k
SCL SCK SCL SCL V+
VDD 2 SDA C3
CSB SDA C2
VDD nALERT TMP RDY
1 C20 C1
7 GND B1 ADR0
GND 100nF C21 ADR1
BMP280 A1
Humidity 100nF
A2 DGND
AGND

TMP007

U9
SDA A2 B1 VDD
SDA VDD

SCL A1 D2
SCL nDRDY C22
C1 VDD
ADR0 100nF
D1
ADR1
B2 C2
GND DNC
HDC1000YPA

Digital Microphone
U6
5 MIC PWR
VDD
R31
2
0 SELECT
DP7/AUDIO CLK 4 C23
CLOCK 1
DATA 100nF
3
Gyroscope and accelerometer GND
SPH0641LU4H
R32
0
AUDIO DI

MPU PWR
C25
U8
100nF
MPU INT 12 13
INT VDD
24 8
SDA HP SDA/SDI VDDIO
23
SCL HP SCL/SCLK

MPU PWR 22 10
Light Sensor
11 nCS REGOUT C27 C26
FSYNC 100nF 10nF
21 1 MPU PWR
7 AUX_DA RESV_1
AUX_CL 2
9 NC_2 3
AD0/SDO NC_3 4 U7
19 NC_4 5
RESV_19 NC_5 SCL 4 1 VDD
6 nCLK VDD
20 NC_6 14
RESV_20 NC_14 C24
15
NC_15 VDD 2 6 SDA
18 16 ADDR DATA
GND NC_16 100nF
25 17
EGP NC_17
3 5
7 GND nINT
MPU-9250
EGP/GND

OPT3001

Figure 18. CC2650STK Schematics

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7.2 Bill of Materials

To download the bill of materials (BOM), see the design files at SWRR135.

Table 1. BOM
ITEM PART
QUANTITY VALUE DESCRIPTION MPN MANUFACTURER
NUMBER REFERENCE
1 A1 1 DNM Mechanic, 2.4-GHz inverted F antenna, SMD DN007 TI
2 ANT1, ANT4 2 2 nH Inductor, Chip, 2 nH, –0.3 nH / +0.3 nH, 0.3 A, LQG15HS2N0S02D Murata
–55°C / 125°C,
0402, SMD
3 ANT2, C17, C18, C31 4 DNM Capacitor, Ceramic, N/A value, –55°C / 125°C, CAPACITOR_0402_DNM_N/A_M Manufacturer
0402, SMD Selection
4 ANT3, C11, C13 3 1 pF Capacitor, Ceramic C0G / NP0, 1 pF, GRM1555C1H1R0CA01D Murata
50 V, –0.25 pF / 0.25 pF,
–55°C / 125 °C, 0402, SMD
5 ANT5, R12, R26 3 0 Resistor, Thick Film, 0, – 5% / 5%, 0.063 W, RESISTOR_0402_0_ Manufacturer
50 V, –55°C / 155°C, 0402, SMD ±5%_50V_0.063W_M_±200PPM Selection
6 ANT6 1 0.5 pF Capacitor, Ceramic C0G / NP0, 0.5 pF, 50 V, GRM1555C1HR50BA01D Murata
–0.1 pF / 0.1 pF,
–55°C / 125°C, 0402, SMD
7 BAT+ 1 DNM Noncomponent, Battery + Pad, SMD
8 BAT– 1 DNM Noncomponent, Battery – Pad, SMD
9 BT1 1 BAT-HLD-001 Battery, BAT-HLD-001 Linx
Holder for CR2032 and CR2025 batteries, SMD
10 BZ1 1 HCS0503B Acoustic, Buzzer, 3 V, –40°C / 85°C, SMD HCS0503B Changzhou
Tianyin
11 C1 1 DNM Capacitor, Ceramic X5R, 2.2 µF, 10 V, GRM188R61A225ME34D Murata
–20% / 20%, –55°C / 85°C, 0603, SMD
12 C2, C3, C4, C6, C8, C9, 7 100 nF Capacitor, Ceramic X7R, 100 nF, 6.3 V, GRM155R70J104KA01D Murata
C12 –10% / 10%, –55°C / 125°C, 0402, SMD
13 C5 1 22 µF Capacitor, Ceramic X5R, 22 µF, 4 V, GRM188R60G226MEA0D Murata
–20% / 20%, –55°C / 85°C, 0603, SMD
14 C7 1 10 µF Capacitor, Ceramic X5R, 10 µF, 6.3 V, GRM188R60J106ME47D Murata
–20% / 20%, –55°C / 85°C, 0603, SMD
15 C14, C15 2 12 pF Capacitor, Ceramic C0G / NP0, 12 pF, GRM1555C1H120JA01D Murata
50 V, –5% / +5%, –55 DEGC / +125 DEGC,
0402, SMD
16 C16 1 1 µF Capacitor, Ceramic X5R, 1 µF, 10 V, GRM155R61A105KE15D Murata
–10% / 10%, –55°C / 85°C, 0402, SMD
17 C19, C20, C21, C22, C23, 9 100 nF Capacitor, Ceramic X5R, 100 nF, 10 V, CAPACITOR_0201_100nF_ Manufacturer
C24, C25, C27, C28 –10% / 10%, –55°C / 85°C, 0201, SMD X5R_I_±10%_10V Selection

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Table 1. BOM (continued)

ITEM PART
QUANTITY VALUE DESCRIPTION MPN MANUFACTURER
NUMBER REFERENCE
18 C26 1 10 nF Capacitor, Ceramic X5R, 10 nF, 10 V, GRM033R71A103KA01D Murata
–10% / 10%, –55°C / 125°C, 0201, SMD
19 C29 1 DNM
20 C32, C33 2 15 pF Capacitor, Ceramic, 15 pF, 50 V, GRM0332C1H150JA01D Murata
–5% / 5%, –55°C / 125°C, 0201, SMD
21 CR1 1 LS L296-P2Q2-1 Opto, LED, Super Red Color, 630 nm, LS L296-P2Q2-1-Z Osram
1.8 V TO 2.3 V, 0.06 A, 0603, SMD
22 CR3 1 LPL296-J2L2-25 Opto, LED, Green Color, 562 nm, LP L296-J2L2-25 Osram
0.02 A, 0.08 W, 0603, SMD
23 FIDU1, FIDU2, FIDU3, 6 DNM Fiducial Mark, Round 1.27 mm
FIDU4, FIDU5, FIDU6
24 FL1 1 BLM18HE152SN1 Filter, EMI, 1500 @ 100 MHz, BLM18HE152SN1D Murata
–55°C / 125°C, 0603, SMD
25 J1 1 MS-156HF Connector Coax RF, Straight, Female, SMD MS-156HF Hirose
26 J2 1 LSS-110-01-F-DV-A- Connector, Header, Hi-speed Socket, Female, LSS-110-01-F-DV-A-TR Samtec
TR Straight, 2 Rows,
20 Pins, Pitch 0.635 mm, SMD
27 L1 1 10 µH Inductor, Chip, 10 µH, –20% / 20%, CKS2125100M-T Taiyo Yuden
0.11 A, –40°C / 85°C, 0805, SMD
28 L2, L3 2 2.4 nH Inductor, Chip, 2.4 nH, –0.3 nH / 0.3 nH, LQG15HS2N4S02D Murata
0.3 A, –55°C / 125°C, 0402, SMD
29 P1 1 BB02-BS101-KA8- Connector, Header, Male, 2 Rows, BB02-BS101-KA8-025B00 Gradconn
025B00 10 Pins, Pitch 1.27 mm, SMD
30 Q1 1 BC846B Transistor, Bipolar NPN, BC846B,215 NXP
65 V, 0.1 A, 0.25 W, SOT –23, SMD
31 R1 1 100 k Resistor, Thick Film, 100 k, –5% / 5%, RESISTOR_0402_100k_ Manufacturer
0.063 W, 50 V, -55°C / 155°C, 0402, SMD +/-5%_50V_0.063W_M_±200PPM Selection
32 R2, R3, R4, R5, R7, R17, 7 10 k Resistor, Thick Film, 10 K, –5% / 5%, RESISTOR_0201_10k_ Manufacturer
R18 0.05 W, 30 V, –55°C / 125°C, 0201, SMD ±5%_30V_0.05W_M_±200ppm Selection
33 R6 1 200 k Resistor, Thick Film, 200 K, –1% / 1%, CRCW0201200KFKED Vishay Dale
0.05 W, 30 V, –55°C / 125°C, 0201, SMD
34 R8 1 5.1 Resistor, Thick Film, 5R1, –5% / 5%, RMC1/205R1JPA Kamaya
0.05 W, 25 V, –55°C / 125°C, 0201, SMD
35 R9 1 2 MΩ Resistor, Thick Film, 2M, –1% / 1%, RC0402FR-072ML Yageo
0.063 W, 50 V, –55°C / 155°C, 0402, SMD
36 R10 1 680 Resistor, Thick Film, 680, –5% / 5%, RESISTOR_0402_680_±5%_50V_ Manufacturer
0.063 W, 50 V, –55°C / 155°C, 0402, SMD 0.063W_M_±200PPM Selection
37 R11, R31, R32 3 0 Resistor, Thick Film, 0, –1% / 1%, RESISTOR_0201_0_±1%_30V_ Manufacturer
0.05 W, 30 V, –55°C / 155°C, 0201, SMD 0.05W_M_±100PPM Selection

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Table 1. BOM (continued)

ITEM PART
QUANTITY VALUE DESCRIPTION MPN MANUFACTURER
NUMBER REFERENCE
38 R16, R50 2 2.2 k Resistor, Thick Film, 2K2, –5% / 5%, CRCW02012K20JNED Vishay
0.05 W, 30 V, –55°C / 125°C, 0201, SMD
39 R21, R22 2 270 Resistor, Thin Film, 270, –5% / +5%, RESISTOR_0402_270_±1%_50V_ Manufacturer
0.0625 W, 50 V, –55 DEGC / +125 DEGCC, 0.063W_M_ ±200PPM Selection
0402, SMD
40 R23 1 DNM Resistor, Do Not Mount, 0402, SMD DNM Do Not Mount
41 R27 1 150 Resistor, Thick Film, 150, –5% / +5%, RESISTOR_0402_150_±5%_50V_ Manufacturer
0.063 W, 50 V, –55 DEGC / +155 DEGC, 0402, 0.063W_M_±200PPM Selection
SMD
42 SW1, SW2 2 MTA2-WNC Switch, Tact Switch, Right Angle, 0.05 A @ 12 MTA2-WNC-V-T/R Diptronics
VDC, SMD
43 SW3 1 MK24-A Switch, Other, Reed Sensor, MK24-A-3 Meder
SPST-NO, Pull-in: 23 AT to 50 AT,
0.3 A @ 60 V, 0.3 A, 60 V, SMD
44 U1 1 CC26xx-7x7 IC, Digital, TI Custom 26xx, QFN48, SMD CC26xx_7x7_QFN48 TI
45 U2 1 TS5A3159AYZPR IC, Analog, SPDT Switch Single-channel 2:1 TS5A3159AYZPR TI
Multiplexer / Demultiplexer,
4.5 V to 5.5 V, DSBGA6, SMD
46 U3 1 BMP280 IC, Transducer Pressure, 300 hPa to 110 hPa, BMP280 Bosch
1.71 V to 3.6 V, LGA8, SMD
47 U4 1 TMP007 IC, Transducer, TMP007AIYZFR TI
Infrared Thermopile Sensor,
2.5 V to 5.5 V, DSBGA8, SMD
48 U6 1 SPH0641LU4H IC, Digital, Microphone with Multiple SPH0641LU4H Knowles
Performance Mode,
1.62 V to 3.6 V, SMD
49 U7 1 OPT3001 IC, Analog, OPT3001, SON6, SMD OPT3001 TI
50 U8 1 MPU-9250 IC, Transducer, 3-AXIS Accelerometer, 3-AXIS MPU-9250 Invensense
Gyroscope, 2.4 V to 3.6 V, QFN24, SMD
51 U9 1 HDC1000YPA IC, Transducer, Low-power, High-accuracy HDC1000YPAR TI
Digital Humidity Sensor with Integrated
Temperature Sensor,
2.7 V TO 5.5 V, DSBGA8, SMD
52 U10 1 W25X40CLUXIG IC, Memory, 4 M-bit of Serial Flash Memory, W25X40CLUXIG Winbond
2.3 V to 3.6 V, USON8, SMD
53 U11 1 DNM
54 Y1 1 32.768 kHz Crystal, Resonator, 32.768 kHz, FC-135 32.7680KA-AG0 Epson
–20 PPM / 20 PPM, –40°C / 85°C, SMD

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Table 1. BOM (continued)

ITEM PART
QUANTITY VALUE DESCRIPTION MPN MANUFACTURER
NUMBER REFERENCE
55 Y2 1 24 MHz Crystal, Crystal Oscillator, TSX-3225 24.0000MF15X-AC3 Epson
24 MHz, –15 PPM / °C / 15 PPM / °C,
–40°C / 85°C, SMD

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7.3 PCB Layout Recommendations

7.3.1 Layout Considerations for CC2650 – Wireless MCU

Ensure the following layout considerations:
• Ensure that the layout of the RF components follows the reference designs.
• Ensure that RF components connected to the ground have multiple ground vias close to their ground
pads to minimize ground impedance.
• Ensure that an uninterrupted and solid ground plane exists under all the RF components (from the
antenna and to the ground vias in the exposed ground pad).
• Place the balun and/or RF filter as close to the CC2650 device as possible to ensure no traces are
under the RF path.
• Place the antenna matching components as close to the antenna as possible.
• Place the decoupling capacitors as close to their VDD pins as possible.
• Ensure that the ground return path from the decoupling capacitors to the EGP is as short and direct as
possible.
• Place the DCDC components (L1 and C7) close to the DCDC_SW pin.
• Ensure that the ground connection of the DCDC-capacitor is as short and direct as possible to avoid
ground-switching noise.
• Position the humidity and IR temperature sensors away from hot points on the board like the battery,
display, or microcontroller because they are dependent on temperature.
• Use the slots around the device to reduce the thermal mass for a quicker response to environmental
changes.

Figure 19. RF Layout Considerations

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Figure 20. DCDC Layout Considerations

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7.3.2 Layout Considerations for Humidity Sensor – HDC1000

Figure 21. HDC1000

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Figure 22. HDC1000

7.3.3 Layout Considerations for the IR Temperature Sensor – TMP007

For layout assembly considerations for the TMP007, see SBOU143.

7.3.4 Layout Prints

To download the layout prints for each board, see the design files at SWRC304

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Figure 23. Top Silkscreen

Figure 24. Top Solder Mask

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Figure 25. Top Layer

Figure 26. Layer 2

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Figure 27. Layer 3

Figure 28. Bottom Layer

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Figure 29. Bottom Solder Mask

Figure 30. Bottom Silkscreen

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Figure 31. Mechanical Dimensions and Drill Holes

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7.4 Cadence Allegro Project

Download the Allegro project files for the SensorTag at SWRC304.

Figure 32. SensorTag Allegro project

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7.5 Layout Guidelines

Figure 33. CC2650 SensorTag Layout Guidelines

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7.6 Gerber Files

To download the Gerber files, see the design files at SWRC304.

Figure 34. CC2650STK Mechanical Drawing

7.7 Assembly Drawings

To download the assembly drawings for each board, see the design files at SWRC304.

Figure 35. Assembly Drawing (Top) Figure 36. Assembly Drawing 2 (Bottom Side Mirrored)

7.8 Software Files

For information regarding software, see Section 4.2.
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References www.ti.com

8 References
1. TI Technical Reference Manual, CC26xx SimpleLink™ Wireless MCU, SWCU117
2. TI Application Note, SimpleLink™ Bluetooth Low Energy CC2640 Software Developer’s Guide,
SWRU393
3. TI Application Note, OPT3001: Ambient Light Sensor Application Guide, SBEA002
4. TI Application Note, TMP007 Layout and Assembly User Guide, SBOU143
5. TI Application Note, Humidity Sensor, SNAA216

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www.ti.com About the Author

9 About the Author

ESPEN SLETTE is a systems application engineer at TI, where he develops reference design solutions
for wireless connectivity (that is, Wi-Fi, Bluetooth Smart, RF4CE, ZigBee / 6LoWPAN, and sub-1GHz).
Espen Slette has experience in application support for wireless products and RF design. Espen Slette
earned his Master of Science in Electrical Engineering (MSEE) from NTNU in Trondheim, Norway.

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