LM2907 and LM2917 Frequency To Voltage Converter: 1 Features 3 Description
LM2907 and LM2917 Frequency To Voltage Converter: 1 Features 3 Description
LM2907 and LM2917 Frequency To Voltage Converter: 1 Features 3 Description
LM2907-N, LM2917-N
SNAS555D – JUNE 2000 – REVISED DECEMBER 2016
• Hand-Held Tachometers (1) For all available packages, see the orderable addendum at
the end of the data sheet.
• Speed Governors
• Cruise Control
• Automotive Door Lock Control
• Clutch Control
• Horn Control
• Touch or Sound Switches
Minimum Component Tachometer Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2907-N, LM2917-N
SNAS555D – JUNE 2000 – REVISED DECEMBER 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 9.3 Feature Description................................................. 11
2 Applications ........................................................... 1 9.4 Device Functional Modes........................................ 12
3 Description ............................................................. 1 10 Application and Implementation........................ 13
4 Revision History..................................................... 2 10.1 Application Information.......................................... 13
10.2 Typical Applications .............................................. 14
5 Description (continued)......................................... 3
6 Pin Configuration and Functions ......................... 3 11 Power Supply Recommendations ..................... 27
7 Specifications......................................................... 5 12 Layout................................................................... 28
12.1 Layout Guidelines ................................................. 28
7.1 Absolute Maximum Ratings ...................................... 5
12.2 Layout Example .................................................... 28
7.2 ESD Ratings.............................................................. 5
7.3 Recommended Operating Conditions....................... 5 13 Device and Documentation Support ................. 29
7.4 Thermal Information .................................................. 6 13.1 Related Links ........................................................ 29
7.5 Electrical Characteristics........................................... 6 13.2 Receiving Notification of Documentation Updates 29
7.6 Typical Characteristics .............................................. 7 13.3 Community Resources.......................................... 29
13.4 Trademarks ........................................................... 29
8 Parameter Measurement Information .................. 9
13.5 Electrostatic Discharge Caution ............................ 29
9 Detailed Description ............................................ 10
13.6 Glossary ................................................................ 29
9.1 Overview ................................................................. 10
9.2 Functional Block Diagram ....................................... 11 14 Mechanical, Packaging, and Orderable
Information ........................................................... 29
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Recommended
Operating Conditions table, Thermal Information table, Parameter Measurement Information section, Detailed
Description section, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ...... 1
• Deleted Built-In Zener on LM2917 from Features .................................................................................................................. 1
• Deleted Only One RC Network Provides Frequency Doubling from Features....................................................................... 1
• Added Thermal Information table ........................................................................................................................................... 6
• Changed tablenote text From: C2 = 0.22 mFd To: C2 = 0.22 µF .......................................................................................... 6
5 Description (continued)
The more versatile configurations provide differential tachometer input and uncommitted op amp inputs. With this
version the tachometer input may be floated and the op amp becomes suitable for active filter conditioning of the
tachometer output.
Both of these configurations are available with an active shunt regulator connected across the power leads. The
regulator clamps the supply such that stable frequency-to-voltage and frequency-to-current operations are
possible with any supply voltage and a suitable resistor.
P and D Package
8-Pin PDIP and SOIC
Top View
TACH+ 1 8 TACH±/GND
CP1 2 7 IN±
CP2/IN+ 3 6 V+
EMIT 4 5 COL
Not to scale
TACH+ 1 14 NC
CP1 2 13 NC
CP2 3 12 GND
IN+ 4 11 TACH±
EMIT 5 10 IN±
NC 6 9 V+
NC 7 8 COL
Not to scale
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN MAX UNIT
Supply voltage 28 V
Supply current (Zener options) 25 mA
Collector voltage 28 V
Differential input voltage Tachometer, op amp, and comparator 28 V
LM2907 (8), LM2917 (8) –28 28
Tachometer
Input voltage LM2907 (14), LM2917 (14) 0 28 V
Op amp and comparator 0 28
LM29x7 (8) 1200
Power dissipation mW
LM29x7 (14) 1580
PDIP package Soldering (10 s) 260
Soldering information Vapor phase (60 s) 215 °C
SOIC package
Infrared (15 s) 220
Operating temperature, TJ –40 85 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(1) Hysteresis is the sum VTH – (–VTH), offset voltage is their difference. See test circuit.
(2) VOH = 0.75 × VCC – 1 VBE and VOL = 0.25 × VCC – 1 VBE, therefore VOH – VOL = VCC / 2. The difference (VOH – VOL) and the mirror gain
(I2 / I3) are the two factors that cause the tachometer gain constant to vary from 1.
(3) Ensure that when choosing the time constant R1 × C1 that the maximum anticipated output voltage at CP2/IN+ can be reached with I3 ×
R1. The maximum value for R1 is limited by the output resistance of CP2/IN+ which is greater than 10 MΩ typically.
(4) Nonlinearity is defined as the deviation of VOUT (at CP2/IN+) for fIN = 5 kHz from a straight line defined by the VOUT at 1 kHz and VOUT
at 10 kHz. C1 = 1000 pF, R1 = 68 kΩ and C2 = 0.22 µF.
Figure 5. Normalized Tachometer Output (K) Figure 6. Normalized Tachometer Output (K)
vs Temperature vs Temperature
Figure 7. Tachometer Currents I2and I3 vs Supply Voltage Figure 8. Tachometer Currents I2and I3 vs Temperature
Figure 11. Op Amp Output Transistor Characteristics Figure 12. Op Amp Output Transistor Characteristics
9 Detailed Description
9.1 Overview
The LM29x7 frequency-to-voltage converter features two separate inputs to monitor the signal. In the 8-pin
devices, one of these inputs is internally grounded and therefore it monitors the remaining input for zero
crossings. In the 14-pin devices, both of these inputs are open and it instead detects whenever the differential
voltage switches polarity. Therefore, the input comparator outputs a square wave of equal frequency to the input.
A charge pump system is used to translate the frequency of this square wave to a voltage. At the start of every
positive half cycle of the input signal a 180-µA constant current charges C1 until its voltage has increased by
VCC/2. The capacitor is held at that voltage until the input signal begins a negative half cycle. Then the 180-µA
constant current discharges capacitor C1 until its voltage has dropped by VCC/2. This voltage is held until the
next positive half cycle and the process repeats. This generates pulses of current flowing into and out of
capacitor C1 at the same frequency as the input signal. For every full cycle, the charge pump mirrors both
current pulses as positive current pulses into the parallel combination of resistor R1 and capacitor C2. Therefore
every full cycle, the amount of charge leaving pin 3 is equal to the sum of the charge entering C1 and leaving C1.
Because the voltage at pin 3 is equal to I3(avg) × R1, I(avg) is calculated in Equation 1.
I3(avg) = Q/t = (Qcharge + Qdischarge) / (1 / f) = 2 × Q × f = 2 × C1 × (VCC/2) × f = C1 × VCC × f (1)
This average current will be flowing across R1, giving the output voltage in Equation 2.
Vo = R1 × C1 × VCC × f (2)
C2 acts as a filter to smooth the pulses of current and does not affect the output voltage. However, the size of C2
determines both the output response time for changes in frequency and the amount of output voltage ripple.
The voltage generated is then fed in a high gain op amp. This op amp drives a bipolar transistor whose collector
and emitter are each broken out to a pin. The LM29x7 has the flexibility to be configured a variety of ways to
meet system requirements including voltage output, driving loads, operating a relay, and more.
9.3.2 Configurable
While the ratio of output voltage to input frequency is dependent on supply voltage, it is easily adjusted through
the combination of one resistor and one capacitor, R1 and C1. The formula for calculating the expected output
voltage is in Equation 3.
VOUT = VCC × f × C1 × R1. (3)
The sizes of R1 and C1 have other effects on the system such as maximum frequency and output linearity. See
Choosing R1 and C1 for detailed instructions on sizing components.
Copyright © 2000–2016, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: LM2907-N LM2917-N
LM2907-N, LM2917-N
SNAS555D – JUNE 2000 – REVISED DECEMBER 2016 www.ti.com
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
C1 = .01 µF C2 = 1 µF R1 = 100 kΩ
C1 = .01 µF C2 = 1 µF R1 = 100 kΩ Rdrop = 910 Ω Zener Regulated VCC = 7.58 V
Rdrop = 910 Ω Zener Regulated VCC = 7.58 V
Figure 16. Output Response to an Increase Figure 17. Output Voltage Ripple
in Input Frequency
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
V3 steps up in voltage by the amount of (VCC × C1) / C2, for each complete input cycle (2 zero crossings).
For example: if C2 = 200 × C1 after 100 consecutive input cycles, then V3 = 1/2 × VCC.
SPACER
SPACER
Figure 27. Frequency to Voltage Converter With 2 Pole Butterworth Filter to Reduce Ripple
Figure 28. Magnetic Pickup Buffer With Zener Regulated Output Magnitude
SPACER
Figure 29. Magnetic Pickup Buffer With 1/2 VCC Output Magnitude
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
10.2.2.7 Changing Tachometer Gain Curve or Clamping the Minimum Output Voltage
SPACER
Figure 47. VOUT vs Frequency Plot With Output Clamped at Low Speeds
12 Layout
13.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
13.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 10-Jun-2022
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LM2907N-8/NOPB ACTIVE PDIP P 8 40 RoHS & Green NIPDAU Level-1-NA-UNLIM -40 to 85 LM Samples
2907N-8
LM2907N/NOPB ACTIVE PDIP N 14 25 RoHS & Green Call TI Level-1-NA-UNLIM -40 to 85 LM2907N Samples
LM2917MX-8/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM29 Samples
17M-8
LM2917MX/NOPB ACTIVE SOIC D 14 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM2917M Samples
LM2917N-8/NOPB ACTIVE PDIP P 8 40 RoHS & Green NIPDAU Level-1-NA-UNLIM -40 to 85 LM Samples
2917N-8
LM2917N/NOPB ACTIVE PDIP N 14 25 RoHS & Green Call TI Level-1-NA-UNLIM -40 to 85 LM2917N Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Jun-2022
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Jun-2022
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Jun-2022
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Jun-2022
TUBE
T - Tube
height L - Tube length
W - Tube
width
Pack Materials-Page 3
PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1
.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]
4X (0 -15 )
4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
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EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND
4214825/C 02/2019
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55] SYMM
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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