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Constant Ground Via Stitching: PCB From The Load Devices To The Power Source. Thus, It Maintains A Healthy

Via stitching is a technique used in PCB design to improve thermal and electrical performance. There are three main types of via stitching: constant ground, thermal, and shielding. Constant ground stitching maintains a low resistance ground path. Thermal stitching improves heat dissipation across copper planes. Shielding stitching uses rows of vias to reduce electromagnetic interference for high frequency signals.

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90 views5 pages

Constant Ground Via Stitching: PCB From The Load Devices To The Power Source. Thus, It Maintains A Healthy

Via stitching is a technique used in PCB design to improve thermal and electrical performance. There are three main types of via stitching: constant ground, thermal, and shielding. Constant ground stitching maintains a low resistance ground path. Thermal stitching improves heat dissipation across copper planes. Shielding stitching uses rows of vias to reduce electromagnetic interference for high frequency signals.

Uploaded by

alaa ices
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Constant Ground 

Via Stitching
This is the most commonly used Via stitching technique used in most PCBs.
Ground Planes via stitching are done to ensure shorter ground return paths in
PCB from the load devices to the power source. Thus, it maintains a healthy
ground return path obtaining low resistance in the ground plane. It produces
lower heat dissipation since the copper pour is larger and is connected with the
top and bottom layer or with the other layers as well if the design supports more
than two layers of the copper plane, resulting in a low drop resistance. It keeps
the balance of the copper resistance across all places in the PCB. Thus, if
someone measures the voltage drop between ground planes at different places,
due to different resistance, different voltage drop causes the ground bounce
issue. 

Thermal Via Stitching


PCB Based heatsink is much more useful in most instances if properly designed. A
key component of the PCB-based heatsink is the Thermal Via Stitching. We have
made multiple projects where thermal via stitching is used to provide excellent
thermal conductivity over multiple copper planes (Top & Bottom).

 it is very helpful in distributing the heat over the copper plane. As the PCB is
much more conducive on the layer segment where the high power component is
seated. It becomes too hot and the heat is only distributed sideways whereas the
PCB core and the other opposite layer stays cooler than the active traces.
Stitching at this point makes it more thermally conductive through-plane
conductivity which further dissipates the heat to the core and further to the
connected opposite plane which reduces the overall junction temperature of the
targeted high power component.

Shielding Via Stitching


Via shielding is done for an EMI-related reason on high-frequency RF or Mixed-
signal circuits mainly in WiFi, Bluetooth, and other wide bands of high-frequency
elements that can be affected due to the EMI interference. It is also termed a PCB
picket fence.
Generally, it is created using a single or multiple rows of vias stitched across the
perimeter of the large copper plane that is too close to the high-frequency tracks

Generally, it is suggested to use the Shielded Via stitching on an RF board where


the vias are spaced at a minimum of 1/10th of the targeted wavelength of the
highest frequency that needs to be shielded from interfacing. In some practices, it
is done with 1/8th of spaces as well. But the major attention is to keep the vias
spacing small compared with the wavelength in the substrate dielectric.

helping maintain a low impedance and short


return loops.
Via shielding has a different function, in RF designs it is used to help
reduce crosstalk and electromagnetic interference in a route that is
carrying an RF signal.  A via shield, also known as a via fence or a
picket fence, is created by placing one or more rows of vias alongside
the signal's route path. In Altium Designer, this is referred to as via
shielding.

Adding Stitching Vias


Via stitching is run as a post-process, filling free areas of copper with stitching vias. For via
stitching to be possible, there must be overlapping regions of copper that are attached to the
specified net, on different layers. Supported regions of copper include Fills, Polygons and Power
Planes.
-OPARATING Frequency
- WIFI
- Radar
- Sub-GHZ
- Bluetooth either at 2.4 GHZ or 5 GHZ
That important for material selection &
stack up selection and you can know how
much losses you can expect in your RF
channels
Losses are important to determine the size
of the board and the length of any routing
channel
You should use floorplaning around
particular frequency to ensure you are
gonna have enough power in that signal in
order to route it between your different
components
If your losses are .2 dB per inch

Osc----Amplifier-----filter -----sma connector

You must care about power out from


amplifier and power in sma and compare
them
Pout – pin = loss
Then loss/ 0.2 dm = that will give you the
total loss
Assume loss 6 Db
6/.2=30 inch
Then we can accept a total routing length of
30 inch
Also, there is additional loses from the input
of filter maybe .5 dB
HYBRID STACK UP HAVE mixes
materials that are designed for rf pcb
operating at the high G HZ range
with a standard fr4 material

If you want to make traces thin then


make gap between ground plan and
signal 4 to 5 mil that make micro
strip trace on the top & bottom
about 8-10 mil dk=4

Amplifier require startup sequence


Also there are power startup
integrated cct that essentially delay
power being delivered to different
rails

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