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Aim Paste Handling Guideline Revnf1

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50 views2 pages

Aim Paste Handling Guideline Revnf1

Uploaded by

ravi.you
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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SOLDER PASTE STORAGE & HANDLING GUIDELINES

page one of two

TRANSPORTATION

AIM solder paste is shipped in specially designed packaging which maintains the product temperature between 0°-30°C
(32°-84°F) for a minimum of 48 hours depending on external conditions. Solder paste should be shipped via overnight
service or refrigerated transport. Extended transport time in high temperature environments must be avoided. Cold packs
used as part of paste packaging may arrive melted. This is normal and not an indication of mishandling or damage if 48
hour transport time is not exceeded.

STORAGE

Solder paste should be transferred immediately to controlled storage on receipt.

Refrigeration is recommended but may not be required. AIM solder pastes typically have a shelf life of three to six months
when stored at room temperature (22°C/72°F). Refrigerated: 0°-12°C (32°F-55°F) / Unrefrigerated < 25°C (< 77°F). Refer
to the product-specific TDS for additional shelf life information. Solder paste performance may be affected if exposed to
temperatures exceeding 30°C (85°F). Do not expose solder paste to temperatures exceeding 32°C (90°F).

Solder paste in cartridges or syringe packaging should be stored vertically, tip down when possible. If stored horizontally,
packages should be periodically rotated 180°.

Date of Manufacture (DOM) is noted on the paste label; paste should be used before the expiration period found on the
product specific TDS. Oldest solder paste lots should be used first, on a First-In First-Out (FIFO) system with date and time
of removal from storage recorded.

PREPARATION FOR USE

Solder paste must NEVER be used cold. Solder paste must be allowed to reach ambient temperature, 68°-77°F (20°-25°C),
before breaking the seal of the paste package. This typically takes four to six hours. DO NOT FORCE WARM THE PASTE.

Once the solder paste has reached ambient temperature paste in jars should be stirred with a plastic tool lightly and
thoroughly for one minute or more. Solder paste in syringes and cartridges does not require mixing. Use of automated solder
paste mixing equipment is not recommended and may damage solder paste.
Document Rev #NF1

COPYRIGHT © 2020 All Rights Reserved. The information found in this document shall not be reproduced without the approval of AIM Solder.
SOLDER PASTE STORAGE & HANDLING GUIDELINES
page two of two

STENCIL APPLICATION

DO NOT combine new and used solder paste in the same container. This will contaminate and degrade unused paste.

Paste should not be re-refrigerated after opening. Any opened material should be resealed and stored at room temperature.
Use of fresh paste daily is highly recommended.

Stencil life/open time are end-user specific. Solder paste performance degrades over time. The condition of the paste should
be continually monitored to ensure viability for the application. Environmental conditions, equipment settings and application
requirements will impact the useful life of the material. Exposure to heat, moisture and the atmosphere will accelerate paste
degradation and should be controlled.

Paste performance can be affected by under-stencil wipe solvent. Isopropanol (IPA) is not recommended. AIM DJAW-10 is
recommended for use with all AIM pastes.

ENVIRONMENTAL CONDITIONS

For optimal results, the production area should be maintained at temperature of 22°- 26°C (72°-80°F) at 45% ± 5% relative
humidity. If temperature and humidity conditions are not maintained at optimal levels, paste performance may decrease.

Defects such as visible dryness, thickening, transfer efficiency variability, aperture clogging and slumping are indicators
that the paste is has degraded beyond its useful life. The paste should be removed, stencil and print area cleaned and new
paste applied.

The importance of solder paste cannot be overstated, as it is the foundation of the SMT process. Adherence to these
guidelines ensures the solder paste will perform as designed, providing the best possible performance and outcomes.
Contact AIM for additional information.

The information provided above is general guidelines for handling AIM Print and Dispense Solder Pastes.

Product Technical Data Sheets (TDS) and Certificate of Analysis should be referenced for specific product
recommendations.

Document Rev #NF1

COPYRIGHT © 2020 All Rights Reserved. The information found in this document shall not be reproduced without the approval of AIM Solder.

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