STPS2H100

Datasheet

100 V, 2 A power Schottky rectifier

Features
• Negligible switching losses
• High junction temperature capability
• Low leakage current
• Good trade-off between leakage current and forward voltage drop
• Avalanche capability specified
• ECOPACK2 component

Applications
• Switching diode
• Battery charger
• SMPS
• DC / DC converter
• Telecom power
• LED lighting

Description
This Schottky rectifier is designed for high frequency miniature switched mode power
supplies such as adaptors and on board DC/DC converters.
Packaged in SMA, SMA Flat, SMB, SMB Flat and SMA Flat Notch, the STPS2H100
Product status link is ideal for use in lighting and telecom power applications.
STPS2H100

Product summary

Symbol Value

IF(AV) 2A

VRRM 100 V

Tj (max.) 175 °C

VF (max.) 0.65 V

DS1452 - Rev 10 - October 2019 www.st.com

For further information contact your local STMicroelectronics sales office.
 STPS2H100
Characteristics

1 Characteristics

Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)

Symbol Parameter Value Unit

VRRM Repetitive peak reverse voltage 100 V

SMA Tl = 130 °C, δ = 0.5

SMB Tl = 135 °C, δ = 0.5

IF(AV) Average forward current 2 A
SMA Flat, SMA Flat Notch Tl = 145 °C, δ = 0.5

SMB Flat Tl = 150 °C, δ = 0.5

IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A

PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 173 W

Tstg Storage temperature range -65 to +175 °C

Tj Maximum operating junction temperature(1) 175 °C

1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.

Table 2. Thermal resistance parameters

Symbol Parameter Max. value Unit

SMA 30
SMA Flat, SMA Flat Notch 20
Rth(j-l) Junction to lead °C/W
SMB 25
SMB Flat 15

For more information, please refer to the following application note :

• AN5088 : Rectifiers thermal management, handling and mounting recommendations

Table 3. Static electrical characteristics

Symbol Parameter Test conditions Min. Typ. Max. Unit

Tj = 25 °C - 1.00 µA
IR(1) Reverse leakage current VR = VRRM
Tj = 125 °C - 0.40 1.00 mA

Tj = 25 °C - 0.79
IF = 2 A
Tj = 125 °C - 0.60 0.65
VF(2) Forward voltage drop V
Tj = 25 °C - 0.88
IF = 4 A
Tj = 125 °C - 0.69 0.74

1. Pulse test: tp = 5 ms, δ < 2%

2. Pulse test: tp = 380 µs, δ < 2%

To evaluate the conduction losses, use the following equation:

P = 0.56 x IF(AV) + 0.045 x IF2(RMS)

DS1452 - Rev 10 page 2/19

 STPS2H100
Characteristics (curves)

For more information, please refer to the following application notes related to the power losses :
• AN604: Calculation of conduction losses in a power rectifier
• AN4021: Calculation of reverse losses on a power diode

1.1 Characteristics (curves)

Figure 1. Average forward power dissipation versus Figure 2. Average forward current versus ambient
average forward current temperature (δ = 0.5, SMA / SMB)

PF(AV)( W) IF(AV)(A)
1.7 2.2
1.6 δ = 0.1 δ = 0.2 δ = 0.5 Rth(j-a) =Rt h(j-I)
δ = 0.05 2.0
1.5 SMB
1.4 1.8
1.3 SMA
1.2 1.6 SMA
1.1 δ= 1 1.4
Rth(j-a) = 100°C/W
S(CU) = 1.5cm2
1.0
0.9 1.2
0.8 SMB
1.0 Rth(j-a) = 80°C/W
0.7 S(CU) = 1.5cm2
0.6 0.8
0.5 0.6
0.4 T T
0.3 0.4
0.2
0.2
0.1 IF(AV) (A) δ=tp/T tp δ =tp/T tp Tamb (°C )
0.0 0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 50 75 100 125 150 175

Figure 3. Average forward current versus ambient Figure 4. Average forward current versus ambient
temperature (δ = 0.5, SMB Flat) temperature (δ = 0.5, SMA Flat, SMA Flat Notch)

IF(AV)(A) IF(AV)(A)
2.2 2.2
Rth(j-a)= Rth(j-l) Rth(j-a)=Rth(j-l)
2.0 2.0
1.8 1.8

1.6 1.6
SMA Flat
1.4 1.4 SMA Flat Notch

1.2 SMBflat 1.2

1.0 1.0
0.8 Rth(j-a)= 40 °C/W
0.8
S CU= 2.5 cm 2
0.6 0.6
T T
0.4 0.4
0.2 0.2
Tamb (°C) δ=tp/T tp Tamb (°C)
δ=tp/T tp
0.0 0.0
0 25 50 75 100 125 150 175 0 25 50 75 100 125 150 175

DS1452 - Rev 10 page 3/19

 STPS2H100
Characteristics (curves)

Figure 6. Relative variation of thermal impedance junction

Figure 5. Normalized avalanche power derating versus to ambient versus pulse duration (SMA)
junction temperature (Tj = 125 °C)

PARM (t p ) Zth(j-a) / Rth(j-a)

PARM (10 µs) 1.0
1 SMA
0.9

0.8

0.7
0.1
0.6

0.5

0.4
0.01
0.3

0.2

0.1 Single pulse

t p(µs)
t p (s)
0.001
0.0
1 10 100 1000 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

Figure 7. Relative variation of thermal impedance junction Figure 8. Relative variation of thermal impedance junction
to lead versus pulse duration (SMA Flat, SMA Flat Notch) to ambient versus pulse duration (SMB)

Zth(j-l) / Rth(j-l) Zth(j-a) /Rth(j-a)

1.0 1.0
SMA Flat SMB
0.9 SMA Flat Notch 0.9
0.8 0.8
0.7 0.7
0.6 0.6
0.5 0.5
0.4 0.4

0.3 0.3

0.2 0.2
Single pulse
0.1 0.1 Single pulse
t p (s) t p (s)
0.0 0.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

Figure 9. Relative variation of thermal impedance junction Figure 10. Reverse leakage current versus reverse
to lead versus pulse duration (SMB Flat) voltage applied (typical values)

Zth(j-l) /Rth(j-l) IR(µA)

1.0 1.E+04
SMBflat
0.9
1.E+03 Tj = 150 °C
0.8
Tj = 125 °C
0.7
1.E+02
Tj = 100 °C
0.6

0.5 1.E+01 Tj = 75 °C

0.4 Tj = 50 °C
1.E+00
0.3
Tj = 25 °C
0.2
1.E-01
0.1 Single pulse
t p (s) VR (V)
0.0 1.E-02
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 0 20 40 60 80 100

DS1452 - Rev 10 page 4/19

 STPS2H100
Characteristics (curves)

Figure 11. Junction capacitance versus reverse voltage Figure 12. Forward voltage drop versus forward current
applied (typical values) (low level)

C(pF) IF (A)
100 2.0
F= 1MHz 1.8
VOSC= 30mVRMS
Tj = 25°C Tj=125°C
1.6 (Maximum values)

1.4

1.2
Tj=125°C
(Typical values)
1.0

0.8
Tj=25°C
(Maximum values)
0.6

0.4

0.2
VR ( V) VF (V)
10 0.0
1 10 100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2

Figure 13. Forward voltage drop versus forward current Figure 14. Thermal resistance junction to ambient versus
(high level) copper surface under each lead (SMA)

IF(A) Rth(j-a) (°C/W)

100 200
Epoxy printed circuit board FR4, copper thickness: 35 µm SMA

Tj=125°C
(Maximum values)
150

Tj=125°C
(Typical values)
10 100

Tj=25°C 50
(Maximum values)

VF (V) S(Cu)(cm²)
1 0
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Figure 15. Thermal resistance junction to ambient versus

copper surface under each lead (SMA Flat, SMA Flat
Notch) Figure 16. Thermal resistance junction to ambient versus
copper surface under each lead (SMB)
Rth(j-a) (°C/W) Rth(j-a) (°C/W)
200
200
Epoxy printed circuit board FR4, copper thickness: 35 µm Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm SMB
SMA Flat
SMA Flat Notch

150
150

100
100

50
50

S(Cu)(cm²) S(Cu)(cm²)
0
0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

DS1452 - Rev 10 page 5/19

 STPS2H100
Characteristics (curves)

Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (SMB Flat)

Rth(j-a) (°C/W)
200
Epoxy printed circuit board FR4, eCu= 35 µm SMB-Flat

150

100

50

SCu (cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

DS1452 - Rev 10 page 6/19

 STPS2H100
Package information

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

2.1 SMA Flat package information

• Epoxy meets UL94, V0
• Lead-free package

Figure 18. SMA Flat package outline

A
c
D

L 2x

L1 2 x

E E1

L
L2 2 x

b 2x

Table 4. SMA Flat package mechanical data

Dimensions

Ref. Millimeters Inches (for reference only)

Min. Typ. Max. Min. Typ. Max.

A 0.90 1.10 0.035 0.044

b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.005 0.016
D 2.25 2.95 0.088 0.117
E 4.80 5.60 0.188 0.221
E1 3.95 4.60 0.155 0.182
L 0.75 1.50 0.029 0.060
L1 0.50 0.020
L2 0.50 0.020

DS1452 - Rev 10 page 7/19

 STPS2H100
SMA Flat package information

Figure 19. SMA Flat recommended footprint in mm (inches)

5.52
(0.217)

1.52
(0.060)

1.20 3.12 1.20

(0.047) (0.123) (0.047)
millimeter s
(inches)

DS1452 - Rev 10 page 8/19

 STPS2H100
SMA Flat Notch package information

2.2 SMA Flat Notch package information

• Epoxy meets UL94, V0
• Cooling method: by conduction (C)
• Band indicates cathode

Figure 20. SMA Flat Notch package outline

Table 5. SMA Flat Notch package mechanical data

Dimensions

Ref. Millimeters Inches (for reference only)

Min. Typ. Max. Min. Typ. Max.

A1 0.90 1.10 0.035 0.044

A1 0.05 0.002
b 1.25 1.65 0.049 0.065
C 0.15 0.40 0.005 0.016
D 2.25 2.90 0.088 0.115
E 5.00 5.35 0.196 0.211
E1 3.95 4.60 0.155 0.182
G 2.00 0.079
G1 0.85 0.033
L 0.75 1.20 0.029
L1 0.45 0.018
L2 0.45 0.018
L3 0.05 0.002
V 8° 8°
V1 8° 8°

DS1452 - Rev 10 page 9/19

 STPS2H100
SMA Flat Notch package information

Figure 21. SMA Flat Notch recommended footprint in mm (inches)

1.20 3.12 1.20

(0.047) (0.123) (0.047)

1.52
(0.060)

5.52
(0.217)

DS1452 - Rev 10 page 10/19

 STPS2H100
SMA package information

2.3 SMA package information

• Epoxy meets UL94, V0
• Lead-free package

Figure 22. SMA package outline

E1

A1

C A2
L b

Table 6. SMA package mechanical data

Dimensions

Ref. Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.097

A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.90 0.089 0.114
E 4.80 5.35 0.189 0.211
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059

DS1452 - Rev 10 page 11/19

 STPS2H100
SMA package information

Figure 23. SMA recommended footprint in mm (inches)

1.4 2.63 1.4

(0.055) (0.103) (0.055)

1.64
(0.064)

5.43
(0.214)

DS1452 - Rev 10 page 12/19

 STPS2H100
SMB package information

2.4 SMB package information

• Epoxy meets UL94, V0
• Lead-free package

Figure 24. SMB package outline

E1

A1

C A2

L b

Table 7. SMB package mechanical data

Dimensions

Ref. Millimeters Inches (for reference only)

Min. Max. Min. Max.

A1 1.90 2.45 0.0748 0.0965

A2 0.05 0.20 0.0020 0.0079
b 1.95 2.20 0.0768 0.0867
c 0.15 0.40 0.0059 0.0157
D 3.30 3.95 0.1299 0.1556
E 5.10 5.60 0.2008 0.2205
E1 4.05 4.60 0.1594 0.1811
L 0.75 1.50 0.0295 0.0591

DS1452 - Rev 10 page 13/19

 STPS2H100
SMB package information

Figure 25. SMB recommended footprint

1.62 2.60 1.62

(0.064) (0.102) (0.064)

2.18
(0.086)

5.84
(0.230)

DS1452 - Rev 10 page 14/19

 STPS2H100
SMB Flat package information

2.5 SMB Flat package information

• Epoxy meets UL94, V0
• Lead-free package

Figure 26. SMB Flat package outline

A
c
D

L 2x

L1 2 x

E E1

L2 2 x

Table 8. SMB Flat mechanical data

Dimensions

Ref. Millimeters Inches (for reference only)

Min. Typ. Max. Min. Typ. Max.

A 0.90 1.10 0.035 0.043

b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
L 0.75 1.50 0.030 0.059
L1 0.40 0.016
L2 0.60 0.024

DS1452 - Rev 10 page 15/19

 STPS2H100
SMB Flat package information

Figure 27. Footprint recommendations, dimensions in mm (inches)

1.20 3.44 1.20

(0.047) (0.136) (0.047)

2.07
(0.082)

5.84
(0.230)

millimeters
(inches)

DS1452 - Rev 10 page 16/19

 STPS2H100
Ordering Information

3 Ordering Information

Table 9. Ordering information

Order code Marking Package Weight Base qty. Delivery mode

STPS2H100A S21 SMA 0.068 g 5000 Tape and reel

STPS2H100AF F21 SMA Flat 0.035 g 10 000 Tape and reel
STPS2H100AFN A21 SMA Flat Notch 0.039 g 10 000 Tape and reel
STPS2H100U G21 SMB 0.107 g 2500 Tape and reel
STPS2H100UF FG21 SMB Flat 0.050 g 5000 Tape and reel

DS1452 - Rev 10 page 17/19

 STPS2H100

Revision history

Table 10. Document revision history

Date Version Changes

Jul-2003 4A Last update.

SMA package dimensions update. Reference A1 max. changed from 2.70
Aug-2004 5
(0.106 inches) to 2.03 mm (0.080 inches).
Reformatted to current standards. Added ECOPACK statement. Added
08-Feb-2007 6
SMBflat package.
15-Feb-2010 7 Updated weight for SMBflat in Table 9.
24-Jun-2013 8 Added SMAflat package
Removed figure 6.
Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise
17-May-2018 9
specified) and Section Description.
Minor text changes to improve readability.
08-Oct-2019 10 Added Section 2.2 SMA Flat Notch package information.

DS1452 - Rev 10 page 18/19

 STPS2H100

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DS1452 - Rev 10 page 19/19