Assignment I
Assignment I
1.
Calculate the intrinsic carrier concentration of GaAs at T = 300 K and 450 K. Nc = 4.7 ×
1017 cm-3, Nv = 7.0 × 1018 cm-3 and Eg =1.42 eV.
2.
Determine the value of n0 and p0 for silicon at 300 K if the Fermi level is 0.22 eV above
the valence band energy. Nc = 2.8 × 1019 cm-3, Nv = 1.04 × 1019 cm-3 and Eg =1.12 eV.
3.
The electron concentration in silicon at T = 300 K is n0 = 5 × 104 cm-3. (a) Determine p0
and (b) Determine the position of Fermi level with respect to the intrinsic Fermi level.
4.
For an n-type silicon sample with 1016 cm-3 phosphorous donor impurities and a donor
level at ED= 0.045 eV, find the ratio of the neutral donor density to the ionized donor
density at 77 K where the Fermi level is 0.0459 below the bottom of the conduction band.
5.
Consider a sample of Si at 300 K doped at an impurity concentration of Nd = 1015 cm-3
and Na = 1014 cm-3. Calculate the drift current density if the applied electric field E = 35
V/cm. Assume μn = 1350 cm2/V-s and μp = 480 cm2/V-s. [Ans 6.80 A/cm2]
6.
An electron in a silicon device is injected in a region where the field is 500 kV/cm. The
length of this region is 1.0 m. Calculate the number of impact ionization events that
occur for the incident electron.
7.
From Shockley-Hall-Reed recombination theory, find out the life time for excess carriers
for an intrinsic semiconductor. [Ans. R = δn/ (τp0 + τn0)]
8.
Show that the diffusion length is an average distance the minority carriers diffuse before
recombination.
9.
A silicon diode is fabricated by starting with an n-type (Nd =1016 cm-3) substrate, into
which indium is diffused to form as a p-type region doped at 10 18 cm-3. Assuming that an
abrupt p+-n junction is formed by the diffusion process, i) calculate the Fermi level
positions in the p- and n-regions; ii) determine the contact potential in the diode; iii)
calculate the depletion widths on the p- and n-side.
10.
Consider a 20 μm diameter p-n diode fabricated in silicon. The donor density is 1016 cm-3
and the acceptor density is 1018 cm-3. Calculate the following in this diode at 300 K.
i) The depletion widths and electric field profile under reverse biases of 0, 2, 5,
and 10 V, and under a forward bias of 0.5 V.
ii) What are the charges in the depletion region for these biases?
11.
A silicon p+n diode has a doping of N a = 1019 cm-3, Nd = 1016 cm-3. Calculate the 300
K breakdown voltage of this diode using the critical field of 4×10 5 V/cm. If a diode with
the same ε/Nd value was to be made from diamond, calculate the breakdown voltage.
Diode with diamond critical field is 107 V/cm.
12.
Consider a long base p+n diode which is biased to carry a forward current of 1 mA. The
junction capacitance is 100 pF. If the minority carrier lifetime τp is 1 μs, what is the
admittance of the diode at 300 K for a 1 MHz signal?
13.
A metal-silicon Schottky barrier with a 100 μm diameter has 1/C2 vs V slope of -3×1024
F- 2 V-1. Calculate the doping density in the silicon.
14.
Consider a Schottky barrier formed on an InAlAs doped n-type at 10 16 cm-3. Calculate the
saturation current density if the Schottky barrier height is i) 0.7 V; ii) 0.6 V at 300 K.