MINI-Compact System

Model Name MX-J840

Model Code MX-J840/ZD

SERVICE MANUAL
MINI-Compact System Contents

1. Precaution

2. Product Specification

3. Disassembly and Reassembly

4. Troubleshooting

5. PCB Diagram

6. Schematic Diagram

MX-J840

Refer to the service manual in the GSPN (see the rear cover) for more information.
Contents

Contents
1. Precaution........................................................................................................................................ 1 − 1
1.1. Safety Precautions ................................................................................................................... 1 − 1
1.2. Servicing Precautions ............................................................................................................... 1 − 3
1.3. Precautions for Electrostatically Sensitive Devices (ESDs) .............................................................. 1 − 4
1.4. Installation Precautions ............................................................................................................. 1 − 5
2. Product Specification ......................................................................................................................... 2 − 1
2.1. Product Feature ....................................................................................................................... 2 − 1
2.2. Specifications.......................................................................................................................... 2 − 2
2.3. Specifications Analysis ............................................................................................................. 2 − 3
2.4. Accessories ............................................................................................................................ 2 − 4
2.4.1. Supplied Accessories ................................................................................................... 2 − 4
3. Disassembly and Reassembly .............................................................................................................. 3 − 1
3.1. Main Disassembly and Reassembly ............................................................................................. 3 − 1
3.2. DECK Disassembly and Reassembly ........................................................................................... 3 − 8
4. Troubleshooting ................................................................................................................................ 4 − 1
4.1. Checkpoints by Error Mode ....................................................................................................... 4 − 1
4.1.1. No Power................................................................................................................... 4 − 2
4.1.2. No Output .................................................................................................................. 4 − 4
4.2. Measures to be taken when the Protection Circuit operates............................................................... 4 − 5
4.2.1. Operation of Power Block Protection Circuit .................................................................... 4 − 5
4.2.2. Check AMP in Power Protection .................................................................................... 4 − 6
4.3. MICOM, MPEG Initialization & Update ...................................................................................... 4 − 7
4.4. Buyer-Region Code Setting Method ............................................................................................ 4 − 8
4.4.1. The inserting method of Region Code after replacing the Main PBA ..................................... 4 − 8
5. PCB Diagram ................................................................................................................................... 5 − 1
5.1. Wiring Diagram....................................................................................................................... 5 − 1
5.2. FRONT PCB Top .................................................................................................................... 5 − 2
5.2.1. Pin Connection ........................................................................................................... 5 − 3
5.3. FRONT PCB Bottom ............................................................................................................... 5 − 4
5.4. MAIN PCB Top ...................................................................................................................... 5 − 5
5.4.1. Pin Connection ........................................................................................................... 5 − 6
5.4.2. Test Point Wave Form .................................................................................................. 5 − 7
5.5. MAIN PCB Bottom.................................................................................................................. 5 − 8
5.6. SMPS PCB Top....................................................................................................................... 5 − 9
5.6.1. Pin Connection ........................................................................................................... 5 − 10
5.7. SMPS PCB Bottom .................................................................................................................. 5 − 11
6. Schematic Diagram ........................................................................................................................... 6 − 1
6.1. Overall Block Diagram ............................................................................................................. 6 − 1

i Copyright© 1995-2013 SAMSUNG. All rights reserved.

 Contents

6.2. FRONT-1 ............................................................................................................................... 6 − 2

6.3. FRONT-2 ............................................................................................................................... 6 − 3
6.4. FRONT-3 ............................................................................................................................... 6 − 4
6.5. MAIN-1................................................................................................................................. 6 − 5
6.6. MAIN-2................................................................................................................................. 6 − 6
6.7. MAIN-3................................................................................................................................. 6 − 7
6.8. MAIN-4................................................................................................................................. 6 − 8
6.8.1. Test Point Wave Form .................................................................................................. 6 − 9
6.9. MAIN-5................................................................................................................................. 6 − 10
6.10. SMPS .................................................................................................................................... 6 − 11

Copyright© 1995-2013 SAMSUNG. All rights reserved. ii

1. Precaution

1. Precaution
Follow these safety instructions while servicing the ESD to prevent damage and to protect against potential hazards
such as electrical shock and X-rays.

1.1. Safety Precautions

1) When reinstalling the chassis and its assemblies, be sure to restore all of the protective devices, including the control
knobs and the compartment covers.

2) Make sure that there are no cabinet openings through which people (particularly children) can make contact with
dangerous internal components.

3) Design Alteration Warning:

Never alter or add to the mechanical or electrical design of the unit.
Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard.
Also, any design changes or additions will void the manufacturer’s warranty.

4) Leakage Current Hot Check Figure 1.1 AC Leakage Test:

WARNING

Do not use an isolation transformer during this test. Use a leakage-current tester or a metering system that complies.

With the unit completely reassembled, plug the AC cord directly into a AC outlet. With the unit’s power switched from
the ON to the OFF position, measure the current between a known ground and all exposed metal parts.
Known Grounds - Earth
Known Metal parts - screwheads, metal cabinets, etc.

LEAKAGE (READING
DEVICE CURRENT SH OULD NOT BE
UNDER TES TER ABOVE 0.5mA)
TES T
TES T ALL
EXPO S ED METAL
SU RFACES
2-WIRE CORD
ALSO TES T WITH
PLUG REVER S ED
(US ING AC EARTH
ADAPTER P LUG GROUND
AS R EQ UIRED)

Figure 1.1 AC Leakage Test

1-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 1. Precaution

5) Insulation Resistance Cold Check:

(1) With the unit’s AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs.
(2) Set the power switch to ON. (3) Measure the resistance between the shorted AC plug and any exposed metallic parts.
Example: screwheads, metal cabinets, antenna port, etc. If any of the exposed metallic parts has a return path to the
chassis, the measured resistance should be between 1 and 5.2 megohms. If there is no return path, the measured
resistance should be “infinite.” If the resistance is outside these limits, a shock hazard might exist. See Figure 1.2
Insulation Resistance Test

Ante nna
Term inal

Expo s ed
Meta l P a rt

oh m
Ohmmet er

Figure 1.2 Insulation Resistance Test

6) Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced with
parts that meet the original specifications. Always determine the cause of damage or overheating, and correct any
potential hazards.

7) Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and especially the AC
and high voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring.
Do not change the spacing between components and the printed circuit board. Check the AC power cord for damage.
Make sure that no wires or components touch thermally hot parts.

8) Product Safety Notice:

Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visual
inspection. These safety features and the protection they give might be lost if the replacement component differs from
the original—even if the replacement is rated for higher voltage, wattage, etc.

9) Components that are critical for safety are indicated in the circuit diagram by shading, or . Use replacement
components that have the same ratings, especially for flame resistance and dielectric strength specifications. A
replacement part that does not have the same safety characteristics as the original might create shock, fire or other
hazards.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 1-2

1. Precaution

1.2. Servicing Precautions

1) Servicing precautions are printed on the cabinet. Follow them.

2) Always unplug the unit’s AC power cord from the AC power source before attempting to :
(a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a
test component in parallel with an electrolytic capacitor.

3) Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used.
The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such elements
to their original position.

4) After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that
the portion around the serviced part has not been damaged.

5) Check the insulation between the blades of the AC plug and accessible conductive parts (examples : metal panels,
input terminals and earphone jacks).

6) Insulation Checking Procedure :

Disconnect the power cord from the AC source. Connect an insulation resistance meter (500 V) to the blades of the
AC plug. The insulation resistance between each blade of the AC plug and accessible conductive parts (see above)
should be greater than 1 megohm.

7) Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all
solid-state heat sinks are correctly installed.

8) Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead;
always remove the instrument’s ground lead last.

CAUTION

First read the “Safety Precautions” section of this manual. If some unforeseen circumstance creates a conflict between the
servicing and safety precautions, always follow the safety precautions.

1-3 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 1. Precaution

1.3. Precautions for Electrostatically Sensitive Devices (ESDs)

Some semiconductor (“solid state”) devices are easily damaged by static electricity.
Such components are called Electrostatically Sensitive Devices (ESDs).
Examples include integrated circuits and some field-effect transistors.
The following techniques will reduce the occurrence of component damage caused by static electricity :

1) Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your
body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove it
prior to applying power–this is an electric shock precaution.)

2) After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent
accumulation of electrostatic charge.

3) Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.

4) Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.

5) Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static” (these can
accumulate sufficient electrical charge to damage ESDs).

6) Do not remove a replacement ESD from its protective package until you are ready to install it.
Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum
foil or other conductive materials.

7) Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material
to the chassis or circuit assembly into which the device will be installed.

8) Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, or
lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 1-4

1. Precaution

1.4. Installation Precautions

1) Keep the product away from a heat source such as candle light, mosquito repellent incense, heating equipment, or direct
sunlight. Otherwise, this may cause fire.

2) Do not install the product on a place that is shaking, tilted, unstable, or seriously vibrating. The product may drop to get
damaged or injure a person. If using the product in a highly vibrating place, it may be broken or cause fire.

3) When moving the product, turn off the power switch and unplug all the connected cables with the product such as the
power plug and antenna cable. If the power cord is damaged, this may cause electric shock or fire.

4) Secure room for ventilation. Keep at least 10 cm of distance from the rear wall, and at least 5 cm from either side wall.

5) Installing the product in a special place like below rather than normal environment may cause serious quality concerns
due to its special conditions. If this is the case, make sure to contact a local Samsung service center before installing the
product. (Special places: a place where a large amount of dust is accumulated; where chemical substances are used
or the ambient temperature is too high or low; a place that is full of moisture or water; in transportation vehicles
such as a car; or in public places such as the airport or subway station where the product is supposed to operate
uninterruptedly for a long time)

6) Keep the packaging plastic wrapper out of children's reach. If children play with it improperly, they may get suffocated.

7) If installing the product on a display cabinet, shelf, desk, etc., keep the product from protruding on its lower side. If the
product falls, it may break or cause physical injury. Use only the display cabinet or shelf that fully covers the product.

8) If using lithium batteries, carefully read the following precautions:

NOTE

• Ensure the batteries are inserted in the right direction. Otherwise, they may cause an explosion. Dispose of used batteries
according to the manufacturer's instructions.

• Do not expose the battery to fire.

• Do not disassemble, short - cut, or heat the battery.

• Use only the same type and size of batteries for replacement.

• Do not expose the battery to fire or excessive heat.

1-5 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 2. Product Specification

2. Product Specification

2.1. Product Feature

■ Power
• 2.0 CH : 800W (RMS 10%)
• IR Amp

■ Specialized Function in 2015

• CD Ripping (Able to ripping while listening)
• GIGA Mode
• Demo / Demo Music Play
• Football Mode
• Non-Stop Music Relay
• CD / USB Program
• Auto Change

■ Connectivity
• USB Host (Twin USB)
• TV Sound Connect
• Bluetooth
• BT Power On

■ Disc
• Type : 1 Tray (12 cm CD)
• Compatible : CD DA / CD-R / RW, WMA, MP3, ISO9660

Copyright© 1995-2013 SAMSUNG. All rights reserved. 2-1

2. Product Specification

2.2. Specifications

■ Basic Specification
Weight 2.5 Kg

Dimensions 200 (W) x 308.5 (H) x 230 (D) mm

General
Operating Temperature Range +5 °C ~ +35 °C

Operating Humidity Range 10 % to 75 %

Signal/Noise ratio 55 dB

FM Tuner Usable sensitivity 12 dB

Total harmonic distortion 0.6 %

Reading Speed : 4.8 ~ 5.6 m/sec.

CD Disc CD : 12 cm (Compact Disc)
Maximum Play Time : 74 min.

MX-J840 : 800 Watts (10% THD)

Front speaker output 400 W/CH (4 Ω/100 Hz)

Frequency range 20 Hz ~ 20 KHz

Amplifier
S/N Ratio 80 dB

Channel separation 65 dB

Input sensitivity (AUX) 2V

NOTE

• Samsung Electronics Co., Ltd reserves the right to change the specifications without notice.
• Weight and dimensions are approximate.
• Design and specifications are subject to change without prior notice.
• For the power supply and Power Consumption, refer to the label attached to the product.

2-2 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 2. Product Specification

2.3. Specifications Analysis

Model Name MX-J840 MX-H830

Photo

Total Power (RMS 10%) 800 W 750 W

SPK CHANNEL 2.0 ch 2.0 ch
FRONT DISPLAY VFD Red led
3D Beat Lighting X X
GIGA SOUND O O
SPK LED LIGHTING X O
DJ BEAT X X
BEAT WAVING X X
TV Sound O X
COMPATIBLE DISC CD DA / CD-R / CD-RW CD DA / CD-R / CD-RW
COMPATIBLE FILE WMA / MP3 WMA / MP3
USB HOST 1.0 2 2
CD RIPPING O O
BLUETOOTH O O
AUDIO IN (RCA) O O
MIC IN X O
HEADPHONE OUT X X
VIDEO OUT X X
FM / AM O / O O / O
SPK IMPEDANCE 4 ohm 4 ohm
STBY POWER CONSUMPTION 0.45 W ↓ 0.45 W ↓
MAIN SIZE (mm) 200 (W) X 308.5 (H) X 230 (D) 233 (W) X 351 (H) X 300 (D)
SPK SIZE (mm) 274 (W) X 414 (H) X 260 (D) 272 (D) X 409 (D) X 290 (D)
Package Weight 16.2 Kg 17.73 Kg

TIP

O : Feature Included
X : Not Included

Copyright© 1995-2013 SAMSUNG. All rights reserved. 2-3

2. Product Specification

2.4. Accessories

2.4.1. Supplied Accessories

Accessories Item Item code

Batteries (AAA) 4301-000116

Remote Control AH59-02694C

User’s Manual AH68-02791H

FM/AM Antenna AH42-00036A

2-4 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 3. Disassembly and Reassembly

3. Disassembly and Reassembly

3.1. Main Disassembly and Reassembly

CAUTION

• Be careful to follow the disassembly sequence described in the manual. Otherwise, the product may be damaged.

• Be sure to carefully read and understand the safety instructions before performing any work as the IC chips on
the PCB are vulnerable to static electricity.

• In order to assemble reverse the order of disassembly.

Description Description Photo

1. Unfasten 4 screws on the 2 side Cover.

: BH,+,B,M3,L10,ZPC(BLK)

CAUTION

Be careful not to make any scratches as you remove them.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-1

3. Disassembly and Reassembly

Description Description Photo

2. Separate the Front Panel.

3-2 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 3. Disassembly and Reassembly

Description Description Photo

3. Unfasten 2 screws, and then separate the Rear PCB from Rear
Panel.
: BH,+,B,M3,L10,ZPC(BLK)

4. Unfasten 5 screws in SMPS and detach AC-CORD & 13P shield

wire.
: BH,+,-,B,M3,L10,ZPC(WHT)

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-3

3. Disassembly and Reassembly

Description Description Photo

5. Unfasten 4 kitting screws and detach DECK wire.

: BH,+,-,B,M3,L10,ZPC(WHT)

3-4 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 3. Disassembly and Reassembly

Description Description Photo

6. Unfasten 2 screws from inside, separate DECK from mecha.

: BH,+,B,M3,L10,ZPC(BLK)

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-5

3. Disassembly and Reassembly

Description Description Photo

7. Pull the Jack. BT Module

Lift
Lift BT Module.

Pul l

3-6 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 3. Disassembly and Reassembly

Description Description Photo

8. Unfasten 14 screws, and then separate the Front PCB from Front
Panel.
: BH,+,-,B,M3,L10,ZPC(WHT)

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-7

3. Disassembly and Reassembly

3.2. DECK Disassembly and Reassembly

Description Description Photo

1. Separate Tray - Disc from DECK.

3-8 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 3. Disassembly and Reassembly

Description Description Photo

O P E N/C LO S E

HOOK

HOOK

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-9

3. Disassembly and Reassembly

Description Description Photo

2. Lift up Holder-Cable, separate Traverse-DECK.

HOOK HOOK

3-10 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 3. Disassembly and Reassembly

Description Description Photo

3. Disassemble complete.

Holde r-Ca ble

Tra verse- Deck

HOLDER-CHUCK Tra y-dis c

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-11

4. Troubleshooting

4. Troubleshooting

4.1. Checkpoints by Error Mode

Oscilloscope Setting Values Normal Voltage 27 MHz 32.768 KHz

Voltage/DIV 1 Vol/DIV 1 Vol/DIV 1 Vol/DIV

TIME/DIV 1 uS/DIV 10 ns/DIV 0.1 uS/DIV

4-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 4. Troubleshooting

4.1.1. No Power

No P owe r

Che ck MAIN P CB No Che ck MAIN P CB No

C5027 : 1.35V; Che ck or re pla ce S MP S .
P CN2 2 ~ 3# (5.1V).
MP C12 : 3.3V.

Ye s Ye s
Che ck or re pla ce
MP IC1 / MP IC2.

Che ck MAIN P CB No
Che ck or re pla ce MIC5.
MIC5 P 1# : 5.1V.

Ye s

Check VFD
No
Voltage on MAIN PCB Che ck or re pla ce S MP S .
PCN2 6# & 11#.

Ye s

(1)
Che ck CLOCK circuit in Ye s Cha nge
MAIN P CB X1 the FRONT P CB As s y.
pa rt OK?

* Re fe r to wa ve pa tte rn
No ima ge of Fig. 4-1.

Che ck pa tte rn or
re pla ce MIC1.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-2

 4. Troubleshooting

(1)
REMOCON_IN

MIC 1
CLOSE_SW

KEY_ADC2
KEY_ADC1

USB_FLG1
USB_EN1
BT_RST

TU_CLK
TU_RST
BT_RX

VARI_A
VARI_B
BT_TX

TU_DA
MP3. 3V_PW
DRV

2.2KOHM
MIC3

MR35
OPTR6
OPTR5
OPTR4
10KOHM
10KOHM
10KOHM
1 NC VCC
8
2 NC /WC
7
3 6

2.2KOHM

2.2KOHM
MC71
E2 SCL

MR48

MR49
100NF
4 5
VPR9 2.7KOH M
VSS SDA
P CN2

OPTR1
OPTR2
OPTR3
10KOHM
10KOHM
10KOHM
VPR10
KC11NF

2.7KOH M
DGND
MC9

KC2
47PF

MP3. 3V_PW
1NF

DGND
MR72
MR71 (1) DGND
MR70
10KOHM
16V
16V

16V

10KOHM
100OHM

100OHM
100OHM
100OHM

100OHM
100OHM
100OHM
100OHM
100OHM

100OHM
100OHM

10KOHM
33OHM
33OHM
100NF
100NF

100NF

MC44

MP3.3 V
MR61
MC46
MC45
MR80

MR68
MR67
MR60
MR59

MR63
MR62
MR106

VPR8
VPR7
MR107
MR108
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89

USB_EN2
CLOSESW
AMPSTBY

SOUT
CLOSE/VOBS1

VDD

SPDIF_OUT

VD33PLL
VS33PLL
VD33
SIN

VS33/VSS
AUX[4]
AUX[5]
SR[31]
SR[30]

SR[26]
SR[25]
SR[24]
SR[23]
SR[22]
SR[21]
SR[20]
SR[07]
SR[06]
SR[05]
SR[04]

MAR8 USB_FLG2
100OH M
SR[0 2] 88 1 2 VFD_DO
SR[0 1] 87 * 5.4.
3 MAIN
4 P CB Top VFD_CE
SR[0 0] 86 5 6 VFD_CLK
SR[1 2] 85 7 8 USB_M_RESET

MIC 2 SR[1 1] 84
83
MR93A
MR93B
100OH M
100OH M MP3.3V_PW
MC79
MC78
MC80

SR[1 0]
100PF
100PF
100PF

VD33 82 MC43 100NF 16V

81 MC42 100NF 16V MPBD2
VDD
LINE_IN_L0 80 MC41 100NF
0.2OHM

22OH M
MB1

79
20KOHM

20KOHM

LINE_IN_R0
78 A3.3V_PW
MR31

MR32

VD33AADC
LINE_IN_L1 77
LINE_IN_R1 76
MC34
LINE_IN_L2 75 MR8 27KOHM 10U F 6.3V
74 MR7 MC33 TUNER_L
LINE_IN_R2 27KOHM 10UF 6.3V
73 MR46 27KOHM MC32 TUNER_R MP1.35V_P
LINE_IN_L3 10UF 6.3V
AUX_L
LINE_IN_R3 72 MR45 27KOHM 10UF 6.3V AUX_R
71 MC31

MIC1
VDDAADC
70
100NF 16V
MIC
MC37

MC38
MC39

69
MC40A

10UF
220UF

22UF

VS33ADAC
68 MC29 100NF 16V
P3CD VD33ADAC
DAC_O3 67
66
MR53 100OH M PWM_AM2
DAC_O2 MR43 33OH M OPLCH
65
1204-003466 DAC_O1
VD33ADAC
VS33ADAC
64
63
MR42
MC28
33OH M
100NF 16V
OPRCH
(1)
62
VID_XI
VID_XO 61 UCN1
MR39 33OH M MC27
50V
100KOHM
MR40

60 1 2
27MHZ

27PF
X1

SR[0 3] I2C_WP
SPDIF_ IN 59 3 4 MAR7 P_ON1 MC26
SR[1 6] 58 5 6 100OHM PWM_AM1 27PF
57 7 8 50V DGND
SR[1 7]
IR_RS
VDD 56 MC25 100NF 16V
AUX[3] 55 1 2 IR_SD
AUX[2] 54 3 4 MAR6 P_ON
OP[7 ] 53 5 6 100OHM TU_RDS
OP[6 ] 52 7 8 VOL_DN
OP[5 ] 51 MR30 100OH M VOL_UP
VSS3 3/VSS 50
VD33 49 MC24 100NF 16V
OP[4 ] 48 P_ON3
OP[3 ] 47
OP[2 ] 46
OP[1 ] 45 MR97 P_ON2
VS33/VSS

VS33/VSS
RESET_B

SPI_CLK
SPI_CS2
SPI_CS3

0OHM
SPI_DO
AUX[7]
AUX[6]

AUX[1]
AUX[0]

SPI_DI
DB[10]
DB[11]

DB[12]
DB[13]
DB[14]
DB[15]

MCLK
OP[0]

1/16 W
DB[8]
DB[9]

VD33

VD33
VDD

VDD

DGND
MR11
MR98
MR99

MP3.3V_PW
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44

MC7
MC8

* 6.8. MAIN-4
10NF
10NF

TP_RST
100NF 16V

10KOHM
10KOHM
10KOHM

MR25
MC20

8.2KOH M
<Fig. 4-1>
100NF

100NF
100NF

DGND
16V
16V

16V
MC18

4-3 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 4. Troubleshooting

4.1.2. No Output

AUDIO no output

Check Menu È Music No Choos e the corre ct Function, No

Function and Volume Change the Function.
or turn on the Volume .
knob ON.

Ye s Ye s

Check
ALQ31, ALQ41, ARQ31 & No Replace MIC1 on
ARQ41 (IRF6645) input signal MAIN PCB. (ESS P3CD)
on MAIN PCB .

Ye s

Check
ALQ31, ALQ41, ARQ31 No Replace AIC1 / AIC2 on
&ARQ41 (IRF6645) input signal MAIN PCB. (IRS2092)
on MAIN PCB .

Ye s

No
Che ck L2001 / L2002. Replace L2001 / L2002.

Ye s

Check L2001 / L2002 pattern.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-4

4. Troubleshooting

4.2. Measures to be taken when the Protection Circuit operates

4.2.1. Operation of Power Block Protection Circuit

■ Cases of the SMPS Protection.

1) If there is over current at the AMP IC. (Speaker Wire Short)

2) If temperature of the AMP IC is over 150 ℃.

3) There is no power supply for amp.

■ Protection Circuit operates when power problem occurs in the SMPS.

Protection
Location Pin No. Remark
Open Short

+5.3 V (5#) X X
MX-J840
SMPS PCB +PVDD (+33 V)
X X
CN851 (15 ~ 16#)

5 V (9#) X X

P-ON (+5.3 V (1#) X X

4-5 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 4. Troubleshooting

4.2.2. Check AMP in Power Protection

If you think, there are problems at the AMP Part, you can check the PCB without disassembling the set.

CAUTION

Do not connect the power cord during the test!

Measurement Resistance using Tester

R CH 2 kΩ

L CH 2 kΩ

If Measured Resistance is very different from above

numbers, There is a Problem.
→ AMP Part Problem

2 CH S P E AK E R O U T

R IGHT

LE FT

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-6

4. Troubleshooting

4.3. MICOM, MPEG Initialization & Update

■ MPEG Reset
1) During “No Disc” Displayed, push the stop Button 5 seconds. After displayed “INITIALIZE” set will power off
automatically.

■ MPEG Update
1) Prepare Rom file at USB Memory. Update file name : MX-J840WWB-XXXX.rom

2) Insert USB Memory, and play. ‘UPDATE’ will be displayed. Set will be power off → on → open.

■ MPEG Version Check

1) Power On.

2) CD mode select – OPEN status

3) Push the | button for 5 seconds, check the MICOM version.

4) Push the | button for 5 seconds, check the MPEG version.

4-7 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 4. Troubleshooting

4.4. Buyer-Region Code Setting Method

4.4.1. The inserting method of Region Code after replacing the Main PBA

NOTE

• When replacing the Main PBA and System Micom should be inserted the region code.

• The set is not working properly if you don't insert the region code.

• The region code is inserted by the remote control.

1) Change to “AUX” function, and then push the ‘ENTER’ button about 10 seconds.

2) When displayed “TEST”, input 46 to set the buyer.

TES T
3) When displayed “– – –”, input the buyer code, refer to the follow Option Table.

−−−
4) It will show the buyer that you set up. Then the buyer setting is succeed.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-8

4. Troubleshooting

Table 4.1 MX-J840 Option Table

Region Code Buyer

00 Latin American
01 Brazil
02 Africa, Indonesia, Asia, Hongkong
03 USA, Canada
04 Iran (HC)
05 Europe
06 Philippines
07 KOR

4-9 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 5. PCB Diagram

5. PCB Diagram

5.1. Wiring Diagram

RFCN2 UCN1
Pin Signal Function Function Signal Pin Pin Signal Function Function Signal Pin
1 SP+ SPINDLE MOTOR+ SPINDLE MOTOR+ SP+ 1 1 VH VFD Driver IC Power Supply VFD Driver IC Power Supply VH 1
2 SP- SPINDLE MOTOR+ SPINDLE MOTOR+ SP- 2 2 VFD- VFD Power Supply(-) VFD Power Supply(-) VFD- 2
3 SL- SLED_MOTOR- SLED_MOTOR- SL- 3 3 VFD+ VFD Power Supply(+) VFD Power Supply(+) VFD+ 3
4 SL+ SLED_MOTOR+ SLED_MOTOR+ SL+ 4 4 DGND GND GND DGND 4
5 INSW OPEN SWITCH OPEN SWITCH INSW 5 5 VFD_CE VFD Enable VFD Enable VFD_CE 5
6 OUTSW CLOSE SWITCH CLOSE SWITCH OUTSW 6 6 VFD_CLK VFD Working Clock Signal VFD Working Clock Signal VFD_CLK 6
7 GND MOTOR GND MOTOR GND GND 7 7 VFD_DO VFD Data VFD Data VFD_DO 7
8 D+ NOT CONNECT NOT CONNECT NC 8 8 JOG- Volume Down Volume Down JOG- 8
9 D- NOT CONNECT NOT CONNECT NC 9 9 JOG+ Volume Up Volume Up JOG+ 9
10 KEY_AD2 Key Signal 2 Key Signal 2 KEY_AD2 10
RFCN1 11 KEY_AD1 Key Signal 1 Key Signal 1 KEY_AD1 11

J ACK
Front
Pin Signal Function Function Signal Pin 12 DGND GND GND DGND 12
1 CD_VR CD circuit Adjust CD circuit Adjust CD_VR 1 13 REMOCON REMOCON Eye Signal REMOCON Eye Signal REMOCON 13
2 CD_MPD APC input signal APC input signal CD_MPD 2 14 5.1V Abov/Driver IC Power Supply Abov/Driver IC Power Supply 5.1V 14
3 CD_LD CD Laser control CD Laser control CD_LD 3 15 USB1_5.2V USB Power Supply USB Power Supply USB1_5.2V 15
Deck

4 LD_GND GND GND LD_GND 4 16 5.1V Abov/Driver IC Power Supply Abov/Driver IC Power Supply 5.1V 16
5 SW CD/DVD OPTION CD/DVD OPTION SW 5 17 USB1_DN USB Differential Signal USB Differential Signal USB1_DN 17
6 F- Focus driver differential signal - Focus driver differential signal - F- 6 18 USB1_DN USB Differential Signal USB Differential Signal USB1_DN 18
7 T- Track driver differential signal - Track driver differential signal - T- 7 19 USB1_DP USB Differential Signal USB Differential Signal USB1_DP 19
8 T+ Track driver differential signal + Track driver differential signal + T+ 8 20 USB1_DP USB Differential Signal USB Differential Signal USB1_DP 20
9 F+ Focus driver differential signal + Focus driver differential signal + F+ 9 21 USB2_5.2V USB Power Supply USB Power Supply USB2_5.2V 21
10 B PD IC output signal PD IC output signal B 10 22 DGND GND GND DGND 22
11 C PD IC output signal PD IC output signal C 11 23 USB2_DN USB Differential Signal USB Differential Signal USB2_DN 23
12 D PD IC output signal PD IC output signal D 12 24 USB2_DN USB Differential Signal USB Differential Signal USB2_DN 24
13 A PD IC output signal PD IC output signal A 13 25 USB2_DP USB Differential Signal USB Differential Signal USB2_DP 25
14 NC NOT CONNECT NOT CONNECT NC 14 26 USB2_DP USB Differential Signal USB Differential Signal USB2_DP 26
15 NC NOT CONNECT NOT CONNECT NC 15 Main 27 DGND GND GND DGND 27
16 VCC RF POWER 5V RF POWER 5V VCC 16
17 VREF Voltage reference Voltage reference VREF 17 BTCN1 BT
18 GND Digital GROND Digital GROND GND 18 Pin Signal Function Function Signal Pin
19 DVD_VR DVD VR DVD VR DVD_VR 19 1 BT_RST BT Reset Signal BT Reset Signal BT_RST 1

BT ASSY
20 PD_GND DGND DGND PD_GND 20 2 MP3.3V_PW BT Power Supply BT Power Supply MP3.3V_PW 2
21 DVD_LD DVD Laser control DVD Laser control DVD_LD 21 3 BT_RXT BT Communicate Signal (Receive) BT Communicate Signal (Receive) BT_RXT 3
22 RF RF signal RF signal RF 22 4 BT_TXD BT Communicate Signal (Send) BT Communicate Signal (Send) BT_TXD 4
23 NC NOT CONNECT NOT CONNECT NC 23 5 GND GND GND GND 5
6 I2C_SCL I2C_SCL I2C_SCL I2C_SCL 6
PCN2 7 I2C_SDA I2C_SDA I2C_SDA I2C_SDA 7
Pin Signal Function Function Signal Pin 8 GND GND GND GND 8
1 VFD+ VFD Power Supply(+) VFD Power Supply(+) VFD+ 1 9 NC NOT CONNECT NOT CONNECT NC 9
2 P-ON MICOM Control SMPS Signal MICOM Control SMPS Signal P-ON 2 10 NC NOT CONNECT NOT CONNECT NC 10
3 VFD- VFD Power Supply(-) VFD Power Supply(-) VFD- 3
4 DGND GND GND DGND 4
5 VH VFD Driver IC Power Supply VFD Driver IC Power Supply VH 5
SMPS

6 A5.3V AMP/MPEG Power Supply AMP/MPEG Power Supply A5.3V 6

7 DGND GND GND DGND 7
8 DGND GND GND DGND 8
9 VPS AMP/MPEG Power Supply AMP/MPEG Power Supply VPS 9
10 A-5V GVDD GVDD A-5V 10
11 -PVDD AMP GVDD Power(-) AMP GVDD Power(-) -PVDD 11
12 -PVDD AMP GVDD Power(-) AMP GVDD Power(-) -PVDD 12
13 AGND AMP GND AMP GND AGND 13
14 AGND AMP GND AMP GND AGND 14
15 +PVDD AMP GVDD Power(+) AMP GVDD Power(+) +PVDD 15
16 +PVDD AMP GVDD Power(+) AMP GVDD Power(+) +PVDD 16

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-1

5. PCB Diagram

5.2. FRONT PCB Top

(1)
N
FC

(3)
N

(2)
FC

CN1

5-2 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 5. PCB Diagram

5.2.1. Pin Connection

1) FCN1 3) CN1
Connect to VFD Connect to Main

Pin No. Signal Pin No. Signal

1 DGND 1 -VP
2 VP 2 VFD-
3 -VFD 3 VFD+
4 +VFD 4 DGND
5 DGND 5 VFD_CE
6 VFD_CE 6 VFD_CLK
7 VFD_CLK 7 VFD_DO
8 VFD_DO 8 JOG-
9 KEY3 9 JOG+
10 RE_IN 10 DGND
11 ST_5V 11 KEY_AD2
12 ST_5V 12 KEY_AD1
13 DGND' 13 DGND
14 REMOTE
2) FCN2 15 ST_5.1V
Connect to VFD 16 USB1_5V
Pin No. Signal 17 USB1_DN
1 DGND 18 USB1_DN
2 VP 19 USB1_DP
3 -VFD 20 USB1_DP
4 +VFD 21 USB2_5V
5 DGND 22 GND
6 VFD_CE 23 USB2_DN
7 VFD_CLK 24 USB2_DN
8 VFD_DO 25 USB2_DP
9 KEY3 26 USB2_DP
10 RE_IN 27 DGND
11 ST_5V
12 ST_5V
13 DGND'

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-3

5. PCB Diagram

5.3. FRONT PCB Bottom

5-4 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 5. PCB Diagram

5.4. MAIN PCB Top

(1) B TC N 1

IC 5 0 0 2

MP IC 2
MP IC 1
IC 5 0 0 1

MIC 1
P CN2 (5)

TP 1
RFCN1

MIC 2
(2) AF IC 1

AIC 1 AIC 2

UCN1
RFCN2

(3) (4)

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-5

5. PCB Diagram

5.4.1. Pin Connection

1) BTCN1 2) RFCN1 4) UCN1 5) PCN2

BT control Deck Control (Focus / Data) FRONT Panel Control VFD / CD Voltage Supply

Pin No. Signal Pin No. Signal Pin No. Signal Pin No. Signal
1 BT_RST 1 CD_VR 1 VH 1 VFD+
2 MP3.3V_PW 2 CD_MPD 2 VFD- 2 P-ON
3 BT_RXT 3 CD_LD 3 VFD+ 3 VFD-
4 BT_TXD 4 LD_GND 4 DGND 4 DGND
5 GND 5 SW 5 VFD_CE 5 VH
6 I2C_SCL 6 F- 6 VFD_CLK 6 A5.3V
7 I2C_SDA 7 T- 7 VFD_DO 7 DGND
8 GND 8 T+ 8 JOG- 8 DGND
9 NC 9 F+ 9 JOG+ 9 VPS
10 NC 10 B 10 KEY_AD2 10 A-5V
11 C 11 KEY_AD1 11 -PVDD
12 D 12 DGND 12 -PVDD
13 A 13 REMOCON 13 AGND
14 NC 14 5.1V 14 AGND
15 NC 15 USB1_5.2V 15 +PVDD
16 VCC 16 5.1V 16 +PVDD
17 VREF 17 USB1_DN
18 GND 18 USB1_DN
19 DVD_VR 19 USB1_DP
20 PD_GND 20 USB1_DP
21 DVD_LD 21 USB2_5.2V
22 RF 22 DGND
23 NC 23 USB2_DN
24 USB2_DN
3) RFCN2 25 USB2_DP
Deck Open / Close Control 26 USB2_DP
Pin No. Signal 27 DGND
1 SP+
2 SP-
3 SL-
4 SL+
5 INSW
6 OUTSW
7 GND
8 NC
9 NC

5-6 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 5. PCB Diagram

5.4.2. Test Point Wave Form

TP1

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-7

5. PCB Diagram

5.5. MAIN PCB Bottom

5-8 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 5. PCB Diagram

5.6. SMPS PCB Top

(1)

CN8 5 1

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-9

5. PCB Diagram

5.6.1. Pin Connection

1) CN851
VFD / CD / AMP Voltage Supply

Pin No. Signal

1 VFD+
2 P-ON
3 VFD-
4 DGND
5 VH
6 A5.3V
7 DGND
8 DGND
9 VPS
10 A-5V
11 -PVDD
12 -PVDD
13 AGND
14 AGND
15 +PVDD
16 +PVDD

5-10 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 5. PCB Diagram

5.7. SMPS PCB Bottom

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-11

6. Schematic Diagram

6. Schematic Diagram

6.1. Overall Block Diagram

• SDRAM IC : M12L128168A
• MPEG IC : ES8393ASA

0
DVD/C D E ngine VFD
• IR AMP IC: IRF6645
0

0
DP- 31 Me cha AM5766
Mo to r Drive
• The Main MPEG control each IC in this PCB.

F ro nt E nd
• Audio signal comes from CD DECK, USB, TUNER, AUX, Bluetooth and so on, decoded by MPEG IC and then transfer
8K- EEPROM T u ner C o ntrol
to AMP IC.
2M F lash
0

VP S Up da te • The signal is sent to the Crystal amplificatory circuit through MPEG IC. This Crystal amplificatory circuit is Low Pass Filtered.
Sound will be hear by Connecting the Speaker system.
128MB
DRAM E S S_P3CD Ke y P O WE R

0
MP EG C hip
0

U SB1 G L8 52G
US B Hub
U SB H OST S MPS
C o n tro l
U SB2

FL
F M/AM
0

0
0

F u nction C o n trol FR
In put
ADC
0

Au dio C rystal P ro
AUX De c oder P re AMP IR Am p

6-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 6. Schematic Diagram

6.2. FRONT-1

POWER VFD
FR29 FR28 FR27

PGND
LGND
VDD
OSC
CLK
STB

DIN
180K OHM 12KOHM 8.2KOHM

VH

F+
F+
F-
F-
KEY3_1

11
1
2

3
4
5
6
7
8
9
10

12
10KOHM

FSW16
FR20

FC3
GND

FSW15

1NF
VH
OSC

22UF
22UF
VC1
VC2

VC3
VDD

100NF

VC4
100NF
47KOHM
DIN
CLK

VR4
STB
DGND1

DGND1

DGND1
-VFD

VBD1
DGND1

VBD2

+VFD
-VFD_1

+VFD_1
ST_5V
EYE1 47O HM
ER1
1 RE_IN
OUT

10OHM
VR1
1N4148
MGND1 2
VCC
ER2

VD3
MGND2 3
47O HM
GND
22UF

100NF
EC1
16V

EZD1
EC2

EZD2
50V

1N4148
5.6

5.6

VC6
VR2
10OHM

VC5

100NF
100NF
VD2
1N4148
VD1
DGND1

DGND1

VP_1
ST_5V
VFD_DO_1
VFD_CE_1
VFD_CLK_1
TP47
TP45
TP40
TP41

TP44

TP46

TP49
TP39

TP43
TP37

TP42
TP38

ST_5V

DGND 13
12
VP
11 VP_1
-VFD 10 -VFD_1
+VFD +VFD_1
DGND 9
VFD_CE 8 VFD_CE_1
7
VFD-CLK
6 VFD_CLK_1
VFD_DO 5 VFD_DO_1
KEY3 4 KEY3_1
RE_IN 3 RE_I N
ST_5V 2
ST_5V 1
DGND

FCN1 DGND1

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-2

6. Schematic Diagram

6.3. FRONT-2
FR19 FR188
FR1 FR17 FR1 6 FR1 5 FR1 4 FR1 3 FR1 2 FR1 1
POWER 180K OHM 12KOHM 8.2KOHM 5.6KOHM 3.9KOHM 2.2KOHM 1.5KOHM 1.5KOHM 2.2KOHM
KEY1
AUDIO

10KOHM

FSW8

FSW7

FSW6

FSW5

FSW4

FSW3

FSW2

FSW1

FC1
FR10

1NF

JC1
1NF
2
MGND2 3
MGND1
1

JC2
1NF
DGND FR26
5.6KOHM
FR25 FR2 4
2.2KOHM
FR2 3 FR2 2 FR2 1 FJOG
3.9KOHM 1.5KOHM 1.5KOHM 2.2KOHM
KEY3 KEY2
VOLUME JOG

100UF 16V

47NF 50V

470OHM

FSW14

FSW13

FSW12

FSW11

FSW10

FSW9
UR1
DGND

UC2

FC2
UC1

1NF
1
UBD1
2
MGND1 3
1 4 VOL_UP
2
USB1_5V 5
3
USB1_DN 6
USB1_DP VOL_DN
4 7
DGND 8
MGND2
USB_JK1 DGND

TP11
TP10

TP22
TP21
TP12
TP13

TP17
TP18
TP16

TP20
TP15

TP19
TP14
TP1

TP4
TP2

TP5

TP7

TP9
TP35

TP52

TP3

TP6

TP8
TP50

TP54

USB1 DGND
ST5V_PW NCN1
VP 1 VP
-VFD 2 -VFD
100UF 16V

50V

+VFD 3 +VFD
470OHM
UC4

4
UR2

DGND
UC3

VFD_CE 5
VFD_CE
47NF

VFD-CLK 6
MGND1 UBD2 VFD_DO 7 VFD_CLK
1 USB2_5V VOL_DN 8 VFD_DO
2 VOL_UP 9 VOL_DN
3 USB2_DN 10 VOL_UP
USB2_DP KEY2 11 KEY2
4 KEY1
DGND 12 KEY1
13
MGND2 RE_IN
14 REMO_IN
ST_5V
USB_JK2 USB1_5V 15
USB1_5V
TP23
TP48
TP51
TP53

16
USB2 DGND
ST_5V
USB1_DN 17
18
USB1_DN
19
USB1_DN
USB1_DP USB1_DP
USB1_DP 20
21
TP26

TP32
TP27

TP29
TP30
TP25

TP31

TP36
TP28

TP33
TP34
TP24

USB2_5V
22
USB2_5V
ST5V_PW DGND
USB2_DN 23
24 USB2_DN
DGND 1 USB2_DN 25
VP 2
VP USB2_DP 26 USB2_DP
-VFD 3 USB2_DP
+VFD 4 -VFD DGND 27
DGND 5 +VFD
VFD_CE 6 VFD_CE
VFD-CLK 7
VFD_DO 8 VFD_CLK
VFD_DO
CN1 DGND
KEY3 9
10 KEY3
RE_IN REMO_I N
ST_5V 11
ST_5V 12
DGND 13

FCN2 DGND

6-3 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 6. Schematic Diagram

6.4. FRONT-3

1
2
3
4 SVO L_UP
5
6 SVO L_DN
7
8
JC3
1NF

JC4
1NF
SCN1
SDGND

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-4

6. Schematic Diagram

6.5. MAIN-1
A+5V_PW
POWER

3.3KOHM
AUDIO

AR4
APR5
DCP

AC7

47NF
AR4FL E
A+5V_PW

CSD
CSD
33KOHM B
C
FRO NT_L AQ2

75KOHM
AC1FL AR1FL AR2FL KST92

AR3
10UFF 6.3V
10U 6.3V 8.2KOHM 2.7KOHM E
AR32
A+5V_PW

AQ12
10V
AC110UF 10V
OPLCH AC4FL C
B
IR_RS

10KOHM
33KOHM

27KOHM

22UF
120P F

AR1
AR3FL 50V C A-5V_PW
1.2KOHM AR5F AQ11 B

AC2

AR8
E
10OHM

47NF
AC8
AC2FL AC3FL AQ6 E
2SA1980S-Y
1.5NF 1.5NF B

5
6
7
8
AC5F C
50V 50V
100NF E

VCC
OUT2
IN2+

BA4560F
IN2-

AFIC1

1N4148WS
A-5V_PW DGND

D1002
B
C A-5V_PW

OUT1
IN1+
VEE

IN1-
AQ1 AQ5
AC6F C KST42 2SA1980S-Y
B
DGND AC2FR AC3FR 100NF
1.5NF DGND E

4
3
2
1
1.5NF AR10
50V 50V AR3FR 22KOHM
1.2KOHM
AR6F A+5V_PW

10V 10UF

AR2
47KOHM
10OHM

APC19
AC1FR AR1FR AR2FR AD7
AC4FR
10UF 6.3V 8.2KOHM 2.7KOHM 120P F 75
OPRCH

47UF 6.3V
50V AR19 E

AC12
A-5V_PW
B
33KOHM C
FRO NT_R 6.8KOHM
DGND AQ15
AR4FR 2SA1979S-Y

10KOHM
AR11
CSD DGND

-37V_PW C
AQ13 B

FROM SMPS MMBT2222A E

22KOHM
AR12
DGNDB
DGNDT

P_ONB
VFD+B
VFD+T

DGNDB1
DGNDT1
VFD-B
VFD-T

P_ONT
VHB
VHT

A-5V_PW
PCN2 PC3
100PF

+VFD 1 VFD+
P_ON 2 P_O N
-VFD 3 VFD-
4 M5.1V_PW
DGND
VH 5 VH
A5.3V 6
A-5V_PW
SMW200-16C

DGND 7
DGND
VPS
8
9 DGND
VARIABLE PO WER BLOCK
VARI_SMPS
A-5V 10 VARI_SMPS
-PVDD 11
330UF

PC2

100PF

12
PC1

-PVDD
AGND 13
M5VB
M5VT

VPSB
VPST
A-5VB
A-5VT

AGND 14
15

VPR6

VPR5
0OHM

0OHM
1/10W

1/10W
+PVDD
+PVDD 16
DGND
-25V_PW
+PVDDT1
+PVDDT

39KOHM
1/4W

22KOHM

VPR4

VPR3
R10043 390O HM

1/4W
390O HM
37V_PW R10042
Q1001 VPQ1
1/4W KTC4378 SRA2203S 1/10W
+PVDDB 390O HM 39KOHM C
R10041 TP VARI_B VPQ3

C
B

E
APC7A

APC9A

E
APC1A APC1

+PVDDB1 GVDD-25V
100NF 100NF

E
50V

390OHM
100NF
100NF

B
50V
50V

B VPR1
R10032
R10033
390OHM
390OHM 390OHM 390OHM

R10031
AGNDT1

1/4W
AGNDT

KRC106S-RTK
1/4W
1/4W

63V
47KOHM
APR3

2.2MF
APC7

APC9
1.5OHM 1.5OHM 50V

APC3
100NF

100NF
50V

50V

100OHM VPQ2
R10061
390OHM 390OHM
R10062
R10063

390OHM

SRA2203S 1/10W
1/16W
1/4W

R1001

39KOHM
1/4W

1/4W

C
VARI_A VPQ4

C
B
APR1

E
E
VPR2

B
KRC106S-RTK
390OHM
R10011
R10012
R10013

R1005
1/4W

AGNDB
1/4W
APC11 APC11A

1/10W
1/4W

100NF

AGNDB1 6.81KOHM
APC12
100NF

10UF

-37V_PW
APC2AAPR2

10UF

100NF
50V

25V

25V

50V
50V

63V 1/10W
2.2MF 47KO HM
APC10
APC8

APC4 D1005
100NF 100NF
100NF 100NF

50V

DGND
APC12A

DGND
50V
100NF 100NF

SDZ6V2G
50V

-37V_PW
100NF

6.2
50V
-PVDDT1

100NF
-PVDDT

50V
C1001

C1002

DGND
APC10A

APC15
APR4
APC8A

D1001
APC2

50V
50V

SDZ7V5G
50V

7.5
-PVDDB
-PVDDB1

6-5 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 6. Schematic Diagram

6.6. MAIN-2
ALR3
FRONT_L ALC1
ALR1 220KO HM
POWER 10UF

10V 1.8KO HM
AUDIO 1/10 W ALD3 37V_PW
PWM_AM1 100P F 12KO HM 3.9KOHM BAV20WS-V

ALC14
27KOHM

220NF
ALR4 ALR14

ALR17
ALC2 ALR2
47KOHM -25V_PW

50V
10KOHM
4.7KOHM
ALQ31

ALR16
ALR19

ALR15

10NF
AIC1 IRF6775MTRPBF

1SR154-400TE25
3.3OHM

100NF
ALC51NF

220NF
27KOHM
ALR18
1 7

ALC15
IRS2092STRPBF

50V
2 6

20KOHM
ALR31
ALC4 ALR5 ALC6 ALD4 ALR20

ALD6
1 VAA CSH
16 ES1D-13-F 3.3OHM 5

ALC16 250V
2 15

ALC18
1NF 270OHM GND VB 3 4

100V
A+5V_PW 1NF 3 14

ALC13A
IN- HO
4 13

ALC13
COMP VS
VS

10UF
10UF
5 12

25V
25V
CSD VCC
6 11 ALR21
VSS LO 10OHM
7 10

10UF 10V
ALR10 VREF COM
COM
L2001 47KOHM

100NF
4.7OHM 8 9

ALC7

ALC9
47KOHM
ALR7
IR_SD OCSET DT
DBF-2022A
DCP

50V
ALR35

1/4W

10NF 100V
ALQ2 ALR26

43KOHM

ALC29
10OHM

1.2KOHM
ALC21
ALR22 ALQ41

ALC23
220NF

ALR29
2SA1980S-Y A-5V_PW

10UF 25V

100NF
100NF
100NF
100NF
E

1SR154-400TE25
10OHM IRF6775MTRPBF

10NF
8.2KOHM

50V
10UF 10V

100V
ALR13

ALR23
6.8KOHM
ALC11
100NF
B

ALC10
1 7

ALC8
C
ALQ1

ALR33
10KOHM
ALR6

ALR25
2 6
SRC1203S

1OHM
DGND

10OHM
ALD7
ALR9

100NF
100KOHM
220OHM ALR8
4.7OHM

10UF 25V
C
B
5
3 4

ALC12

ALC25
ALR27
E

10NF 100V
43KOHM

ALC24
ALR30

ALC28 250V
ALC17 250V
ALC19 250V
ALC20 250V
220NF

ALR32 1W
3.9KOHM

1.2KOHM
ALC22
ALD2A

50V
ALD5

3.3KOHM
1NF 50V

ALR12

ALR24
SD_G D 19-217/R6C-AL1M2VY/3T
C2045

ALR34
-37V_PW
1N4148WS

1/4W
CSD
ALD2 ALR11
400V

220OHM
1N4148WS 8.2K/3.3K: 65N S
ADD1

S1G

DGND DGND
5.6K/4.7K:40NS

SPK2

MGND2
4 + -
2
1

MGND1
- +
ARC1 3
10UF
ARR3
10V ARR1 220KO HM ST0280627P
FRONT_R
1.8KO HM
1/10W 37V_PW
1/16W ARD3 DGND
100P F 12KO HM 3.9KOH M BAV20WS-V
PWM_AM2

27KOHM
ARR17
ARC2 ARR2 ARR4 ARR14
47KOHM

10KOHM
-25V_PW

ARR15

ARC14
4.7KOHM
ARR16

220NF
ARR19

1SR154-400TE25
AIC2 ARQ31

10NF
50V
1NF 3.3OHM

ARR18
ARC5

27KOHM

250V 100NF
IRS2092STRPBF IRF6775MTRPBF

ARR31
ARR5 1 7

ARC18
ARC4

ARC16
ARD4 ARR20

20KOHM
ARD6
ARC6 1 VAA CSH
16 ES1D-13-F 3.3OHM 2 6
1NF 270OHM 2 GND VB
15 5
A+5V_PW 1NF 3 14

ARC13A
1/10W IN- HO 3 4
13

100V
4

ARC13

ARC15
220NF
COMP VS
VS

10UF
5 12

10UF
25V

50V
25V
CSD VCC
6 11 ARR21
VSS LO 10OHM
7 10
10UF 10V

ARR10 VREF COM

COM
L2002
100NF

4.7OHM 8 9
ARC7

ARC9

OCSET DT
DCP
DBF-2022A

1/4W
ARR35

50V
ARR331.2KOHM

10NF 100V
43KOHM
47KOHM

ARC29
ARC21

ARC23
220NF
A-5V_PW ARR22

1SR154-400TE25
ARR13

ARR29
10UF 25V

50V

100NF
100NF
100NF
100NF
10OHM ARQ41
10UF 10V

6.8KOHM

8.2KOHM
ARC11
100NF

ARR23
ARC10

IRF6775MTRPBF

10KOHM
ARC8

ARR25
ARR26

ARR33
ARR27
10OHM

1W 100NF
ARD7
1 7

1OHM
ARR9 DGND

1.2KOHM
10NF
100V
4.7OHM 2 6

10UF 25V
5

ARC25
ARC12
3 4

10NF 100V
ARC24
ARR34
ARC22

ARC28 250V
ARC17 250V
ARC19 250V
ARC20 250V
220NF
3.9KOHM

ARR32
ARR30
ARD2A
3.3KOHM
ARD5

43KOHM
ARR24

50V
ARR12

SD_G D -37V_PW

10OHM
1N4148WS

1/4W
CSD
ARD2 ARR11
1N4148WS 220OHM
8.2K/3.3K: 65NS
DGND
5.6K/4.7K:40NS

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-6

6. Schematic Diagram

6.7. MAIN-3

TU_RDS
POWER TU3.3V_PW

AUDIO

TUR71KOHM
NR01
0OHM
10KOHM
TUR6

FM
1/16W
AM
20
19
18
17
16
FM_S
MM-DG36 TUNER ANT JACK TIC1 SI4705-D60-ZM0R
FMJ1

GPO3/DCLK
MGND1GPO1
NC

DFS
GPO2/INT-
FMRF TUR9
TUR1

MGND1
15 0OHM

MGND2MGND1
TUC16 1 TUC9 100OHM

VFDCLK1
VFDCLK2
10PF NC DOUT 10UF 10V

VFDDN2
VFDDO1
VFDDO2
VOLDN1
VFDCE1
VFDCE2

VOLUP1
2 14

MGND3
VOLIP2
VFD+1

KEY11
KEY22
VFD+2
TUNER_L

MGND2
KEY21

KEY12
VFD-2
FMI LOUT

VFD-1
1
3 13 FM
TUNER_R

VH1
VH2
RFGND ROUT
4 12

VT2002
TUC1 7

TL1

100NH
LPI GND TUC1 0 TUR2

12
2PF 5 /RST
11 10UF 10V 100OHM
50V DGND VDD

TUC2
UCN1

33KOHM

33KOHM
TUC12

TUC3
10UF 10V
LL1608-FSLR10J

TUR3

TUR4
22PF
22PF
RCLK
SCLK
SDIO
/SEN

VIO
VH
1
VH
VFD-
2 TU3.3V_PW DGND MP3.3V_PW
VFD- DGND

6
7
8
9
10
VFD+
3 TBD1
4 VFD+ MC-146(32.768KHZ,20PPM)
DGND TUX1

AM1
5

2
4
6
8
VFD_CE VFD_CE ANT1 32.768HZ

TUC14

TUC13
0.01OHM

0V
0 UF 110V

10UF 10V
AM_S
6

NZH3V3A
VFD_CLK VFD_CLK AM DGND

TD1
7 1 Q0 Q3 4
TUC15

3.3
VFD_DO VFD_DO

110UF
8 3 LZR1

3711-000898
JOG- VOL_DN 2

AM_G

100OHM 1

7
3
5
JOG+ 9 VOL_UP FM_RDS 470NF
2 3

AM_GND

TUR18

FM_RDS
1

VT2001
10 0OHM 25V

0OHM

TUR17
Q1 Q2
KEY_ADC2 M5.1V_PW

AM
KEY_AD2

12
11 KEY_ADC1

22PF 50V
KEY_AD1
MAIN-FRONT PCB

DGND 1 2

22PF 50V
DGND 12
3 4

TUC18

TUC19
13 FBD1 USB5V1_PW AM
REMOTE REMOCON_IN 5 6
52045-2745

5.1V 14 FM1 FMRF

7 8
USB1_5.2V 15 DGND
5.1V 16 0.01O HM 4730 USE DGND TUR16
10KOHM TPTX
USB1_DN 17 UCN3
USB1_DN
USB1_DN 18 USB5V2_PW

GCC02-0096
19 DGND UART_RX 5
USB1_DP USB1_DP
20 TIC1 OPTION SPEC TUR9 TUR18 NR01 TUR6 4
USB1_DP

TU_RST

TU_CLK
21

TU_DA
TU_CE
USB2_5.2V 1204-002700 FM 4702 0 OHM 0 OHM 0 OHM OMIT
22 2
DGND 1204-003347 AM 4730 OMIT OMIT OMIT 10KOHM
23 USB2_DN UART_TX 3
USB2_DN
24 1204-003345 RDS 4705 OMIT 0 OHM OMIT
OMIT OMIT 1
USB2_DN
USB2_DP 25 USB2_DP
26 TPRX
USB2_DP
UGND 27
DGND

USR1 USR 4
REMO1
REMO2
DGND_7
DGND_6
DGND_5
DGND_8
DGND_1

DGND_4

DGND
DGND_3

USB1DN1
DGND_2

USB2DP1
M5V1

USB2DN1

USB1DN2
A5V1

USB2DP2

USB1DP1

USB5V11
USB2DN2

USB1DP2
M5V2

USB5V12
USB5V21
A5V2

USB5V22

USB_M_RESET
33OHM 10KOH M

4.7KOHM
4.7KOHM

USC12
USR2

USR3

100NF
DGND
M5.1V_PW
USB5V1_PW TPS2069CDBVR
UBD2 USIC1
0.01OHM
1 OUT 5

22
23
24
25
26
27
28
IN
USIC3 2 GND
3 /FLT 4
USB_EN1

PGANG
OVCUR2#
EN/EN#

OVCUR1#

USC18
SDA

USC20
PSELF

USC19
V5
V33

USC21
USC5

USC22

USR9
10UF
100NF

10KOHM
10NF

10UF

100NF
USR8
1NF
21 1

10KOHM
DVDD DM0 USB_DN
VT2003
20 OVCUR3# GL852G-31 DP0 2 USB_DP
19 OVCUR4# DM1 3 BT3.3V_PW
18 4 UBD1
USC6 TEST/SCL DP1

MGND1
17 RESET# AVDD 5
USB2_DP DGND 16 DP4 DM2 6
2 3 1UF 15 7 0.2OHM
DM4 DP2
USB2_DN 1 4 DGND
USB_FLG1

AVDD

AVDD
RREF
UFT2

DM3
DP3
DGND

X2
X1
USD3

9
8
14
13
12
11
10
USR10
33OHM

100NF
100NF
100NF

47UF
47UF
DGND M5.1V_PW
USB1_DP USB5V2_PW TPS2069CDBVR

15PF 620OHM
MP3.3V_PW

USC8 USR5
USB1_DN UBD3 USIC2
BT_SDA1
BT_RST1

BT_SCL1

2 3
BTGND1
BT3.3V1
BT_RX1

0.01OHM
BT_TX1

1 4
1 5
4.7KOHM

4.7KOHM

OUT

USC10
USC11
USB2

UFT1 IN
USC7
2

USC4
USC3
BTR2

BTR1

USC9
GND

10NF
USX1

USC1510UF
15PF
BTCN1 3 4

1NF
12MHZ /FLT
EN/EN# USB_EN2

USC17
USC16

USR6
10KOHM
USC13

USC14
10

100NF
10KOHM

10UF
USR7
MGND2

9
8 BR2 DGND
BR1 33O HM
7 33O HM
12507HS-H10M1

I2C_S DA DGND
6 I2C_S CL
5 BTBD3 0.2O HM BT3.3V_PW MP3.3V_PW
4 0.2O HM BTBD4 BT_TX AO3415AS
MGND1

3 BT_RX BTQ1
2
USB_FLG2
D

1 DGND
100KOHM

BTBD2 BT_RST
1UF
16V
G

BTBD1 0.2O HM
0.2OHM

0.2O HM
100NF

100NF

100PF
100PF
47UF

10UF
15PF
15PF
BT_SDA
BT_RST

BT_SCL
BTGND
BT3.3V
BT_RX

BC3
BR3
BT_TX

10KOHM

DGND
BR4
1/16W
BTC1
BTC8
BTC5
BTC4
BTC3
BTC2

BTC7
BTC6
BTBD5

C
BTQ2 B P_ON2
DTC114EU E

DGND

DGND

6-7 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 6. Schematic Diagram

6.8. MAIN-4

REMOCON_IN
CLOSE_SW
POWER

KEY_ADC2
KEY_ADC1

USB_FLG1
OPEN_SW

USB_EN1
BT_RST

TU_CLK
TU_RST
MOCTL

BT_RX

VARI_A
MVREF

VARI_B
BT_TX

TU_DA
MP3.3V_PW

CDLD
AUDIO

DRV
MP3.3V_PW

MIN
DA

2.2KOHM
MIC3

MR35
OPTR6
OPTR5
OPTR4
10KOHM
10KOHM
10KOHM
1 NC VCC
8
2 NC /WC
7
3 6

2.2KOHM

2.2KOHM

2.2KOHM
MC71
E2 SCL
SCL

MR48

MR49

MR50
100NF
4 VSS SDA
5
VPR9 2.7KOHM

OPTR1
OPTR2
OPTR3
10KOHM
10KOHM
10KOHM
VPR10
I2C_WP

KC11NF
2.7KOHM

10PF
DGND I2C_SCL

MC9
50V
16V

KC2
47PF
MC83
MP3.3V_PW

10UF 6.3V

1NF
10UF 6.3V
I2C_SDA

MC57

MC56

MC51

100NF
MC53
DGND

100NF
MR72
MR71 DGND
MR70

EMULATOR OPTION 10KOHM

4.7NF 50V

100NF 16V

16V

16V
16V

16V
10KOHM

22NF 25V
470KOHM

100OHM

100OHM

100OHM
100OHM
100OHM

100OHM
100OHM
100OHM
100OHM
100OHM

100OHM
100OHM
10KOHM

10KOHM

1NF 50V
MP3.3V_PW

33OHM
33OHM
100NF
100PF

100PF

100PF
MR79

100NF
100NF

100NF
10KOHM

1NF
50V
5SP_3.3V

MC44
SPI_CS3 1SP_CS
MP3.3V

MC47
MR84

MR61
MC55
MC54

MC52

MC50
MC49
MC48
2SP_CLK

MC11

MC13

MC46
MC45
MR85

MR82

MR80

MR68
MR67
MR60
MR59

MR63
MR62
MR106

VPR8
VPR7
MR107
SPI_CLK

MR108
MP3.3V_PW
SPI_DI 3SP_DI
SPI_DO 4SP_DO
RESET 5_RS
AD6 6SP_GND
1N4148WS

132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
MC58
MR19 10UF
FLASH 33O HM USB_EN2

OPENSW

CLOSESW
AMPSTBY
DGND

SPNN

OPEN/VOBS

SOUT
CLOSE/VOBS1
CDLD
REX

VGB

VDD
MB
6.3V

AGC1
AGC2
VBO
SPNP

SPDIF_OUT
VPB
DB
MP

VD33PLL
VS33PLL
V165O

VD33
FE
TE

SIN

VS33/VSS
PI

AUX[4]
AUX[5]
SR[31]
SR[30]

SR[26]
SR[25]
SR[24]
SR[23]
SR[22]
SR[21]
SR[20]
SR[07]
SR[06]
SR[05]
SR[04]
SPI_CS3 MAR8 USB_FLG2

MC61
SPI_CS 100O HM
MC59 100NF 133 88 1 2

100PF

50V
VPA SR[02]
SPI_CS2 16V VFD_DO
134 VGA SR[01] 87 3 4
MR26
EMULATOR 33O VFD_CE
HM MC60 680P F 135 DRFP SR[00] 86 5 6 VFD_CLK
PUHRF 50V 136 A SR[12] 85 7 8
A USB_M_RESET
B
137 B SR[11] 84 MR93A 100O HM
138 83 MR93B 100O HM MP3.3V_PW

MC79
MC78
MC80
C SR[10]
C

100PF
100PF
100PF
MC62A 139 D VD33 82 MC43 100NF 16V
D MPBD2
100NF 140 E VDD 81 MC42 100NF 16V
16V 141 80 MC41 100NF
MVREF F LINE_IN_L0

0.2OHM
22O HM

MB1
142 79

20KOHM

20KOHM
MIN LINE_IN_R0
MIN A3.3V_PW
143 78

MR31

MR32
MC62 100NF SLV VD33AADC
MR86 1.2KOHM 16V 144 77
DMO LINE_IN_L1
SPINDLE
FOCUS
MR87 1KOHM 145 FOO LINE_IN_R1 76
MC34
MR88 1.2KOHM 146 SLO LINE_IN_L2 75 MR8 27KOHM 10UF 6.3V
SLEG N TUNER_L
MR89 1KOHM 147 TRO LINE_IN_R2 74 MR7 27KOHM MC33 10UF 6.3V
TRACK TUNER_R MP1.35V_PW
148 73 MR46 27KOHM MC32 10UF
25V

50V

25V

50V

CDPD LINE_IN_L3 6.3V

MPD AUX_L
MC63

MC64

MC65

MC66

MC67 149 72 MR45 27KOHM 10UF 6.3V

470NF

AUX_R
MP3.3V_PW
470NF

REFD LINE_IN_R3
10NF

10NF

100NF MC69 100NF 150 71 MC31

MIC1
AVD33 VDDAADC
16V 16V 151 70

100NF 16V
AVS33 MIC

MC37

MC38
MC39
6.3V MC70 100NF 152 69

MC40A

10UF
220UF
MR90 MC68

22UF
DVCC VS33ADAC

6.3V
16V 153 68 MC29 100NF
4.7KOHM 10UF 16V

DGND
MC72 100NF
16V
154
155
VDD
USB_ VCCA P3CD VD33ADAC
DAC_O3 67
66
MR53 100O HM PWM_AM2
USB_DN USB_ DM DAC_O2 MR43 33O HM OPLCH
156 65
USB_DP
MC74 100NF
16V
157
158
USB_ CP
USB_ AGND
VD33
1204-003466 DAC_O1
VD33ADAC
VS33ADAC
64
63
MR42
MC28
33O HM
100NF 16V
OPRCH
DGND
159 62 50V
TP 1
DMA[4] VID_XI
MA4
160 DMA[5] VID_XO 61 MR39 33O HM
MA5 MC27

100KOHM
MR40
161 60 1 2

27MHZ
27PF
DSCK

X1
I2C_WP
MA11

SYSCL K SR[03]
OPOUT
DB15

DB14
DB13

DB12
DB11

DB10

DQM

MA9
MA8
MA7
MA6
MA5
MA4

162 59 3 4 MAR7
DB9

DB8

MA6 DMA[6] SPDIF_IN

P_ON1 MC26
MP3.3V_PW 163 DMA[7] SR[16] 58 5 6 100O HM 27PF
MA7 PWM_AM1 50V
164 VS33/VSS SR[17] 57 7 8 DGND
IR_RS
165 56 MC25 100NF 16V
0.2OHM

DMA[8] VDD
MA8
166 DMA[9] AUX[3] 55 1 2
MA9 IR_SD
MB2

167 DMA[11] AUX[2] 54 3 4 MAR6

MA11 P_ON
MA3
168 DMA[3] OP[7] 53 5 6 100O HM TU_RDS
C1
4.7KOHM

MC75 100NF 169 52 7 8

MC12

MR47

VD33 OP[6]
1NF VOL_DN
100NF
100NF
C79

MC76 16V 170 VDD OP[5] 51 MR30 100O HM VOL_UP

16V 100NF 171 DMA[2] VSS33/VSS 50
MA2
C2 MA1
172 DMA[1] VD33 49 MC24 100NF 16V
100P F 173 DMA[0] OP[4] 48 P_ON3
MA0
MA10 174 DMA[10] OP[3] 47
MR95 175 46
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28

RAS2# 33OHM DRAS2 _B OP[2]

RAS1# MR96 176 DRAS1 _B

VS33/VSS
OP[1] 45 MR97 P_ON2

VS33/VSS

VS33/VSS
DRAS0_B

RESET_B
UDQM

SPI_CLK
SPI_CS2
SPI_CS3
DCAS_B
VDDQ

VDDQ

DCS0_B

33OHM 0OHM
VSSQ

VSSQ

DQ9

DQ8

CLK
CKE
NC

NC

SPI_DO
DQ15

DQ14
DQ13

DQ12
DQ11

DQ10

DWE_B
VSS

VSS

VSS
A9
A8
A7
A6
A5
A4
A11

AUX[7]
AUX[6]

AUX[1]
AUX[0]

SPI_DI
DB[10]
DB[11]

DB[12]
DB[13]
DB[14]
DB[15]
DSCK

MCLK
OP[0]
1/16W
DB[7]
DB[6]
DB[5]
DB[4]
DB[3]
DB[2]
DB[1]
DB[0]

DB[8]
DB[9]
S_P_O PT
VD33

VD33

VD33
DQM
VDD

VDD

VDD

VDD
OTP DGND

MR11
MR98
MR99
1
2
3
4
5
6
7
8
9

MP3.3V_PW
MIC2

10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44

MC7
MC8
10NF
10NF
M12L128168A-6TG 2N
TP_RST
A10/AP

100NF 16V
LDQM
VDDQ

VDDQ
VSSQ

VSSQ

10KOHM
10KOHM
10KOHM
/CAS
/RAS
VDD

VDD

VDD

MR25
DQ0

DQ1
DQ2

DQ3
DQ4

DQ5
DQ6

DQ7

/WE

A13
A12

MC14
/CS

MC20
A0
A1
A2
A3

68OHM

8.2KOHM
100NF

100NF

100NF

100NF

100NF
100NF
DGND

MC19 16V
MP1.35V_PW
16V

16V

16V

16V
MIC5
MC17

MC18
MR12

MC15

MC21
M5.1V_PW
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27

RT9818C-42PV MP3.3V_PW
MIC4
1 /RESET,RESET
VDD
3 W25Q 32F VSSIG
16V

SPI_CS
1 /CS
8
MC77

GND
2 VCC
7
100NF

100NF
C73

C74

100NF

100NF

100NF
C75

C76

SPI_DI DO(IO1)
3 /HOLD(IO3)
6
MC16

MC22 MC23 /WP(IO2) SPI_CLK

15PF

PLL3 4 CLK
5
50V

2
100NF 100NF GND SPI_DO
DI(IO0)
PLL2

100OHM
100OHM

MC81

MC5
33OHM
33OHM
33OHM

33OHM
33OHM
33OHM
PLL1 DGND 16V 16V

47PF
100NF
PLL0
2
4
6
8

2
4
6
8
2
4
6
8
2
4
6
8

2
4
6
8
DGND
MR13
33OHM
100OHM

100OHM
MAR1

MAR2

DGND
4.7KOHM

MR14
MR15

MR16
MR17
MR18

MR20
MR21
MR22
DQM

4.7KOHM

4.7KOHM
DWE#

MA1

MR1

MR2

MR3

MR4
4.7KOHM

DGND
MA0

MA2
MA3
CAS#

MA10

MP3.3V_PW
DB0

DB1
DB2

DB3
DB4

DB5
DB6

DB7

CS0#
RAS0#

RAS1#
RAS2#

1
3
5
7

1
3
5
7
1
MAR3 3
100OHM 5
7
1
MAR4 3
5
7

1
MAR5 3
5
7
100OHM

100OHM

MR24 10KOHM
MR91 10KOHM
PLL0 MR92 10KOHM
PLL1
PLL2
PLL3
PLL2 PLL1 PLL0 MULTI FRE Q PL3 CLK SOURCE OTP
DQM

0 CRYSTAL S_P_OPT
DWE#
DSCK

0 0 0 0 BYPASS N/A
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0

DB8
DB9
CAS#
CS0#

UART_RX
RAS0#

DB10
DB11

DB12
DB13
DB14
DB15

UART_TX

1 DCLK INPUT
I2C_SDA

SPI_CLK
I2C_SCL

SPI_CS2
SPI_CS3

0 0 1 4.5 121.5
SPI_DO
4.7KOHM

4.7KOHM
MR6

SPI_CS
MR5
MC1

MC2

MC3

MC4

RESET

SPI_DI

OTP
15PF

15PF

0 1 0 4.75 128.25
15PF

15PF

0 1 1 5.0 135 0 NORMAL MODE

1 0 0 1 5.25 141.75 1 TEST MODE
1 0 1 5.75 155.25 S_L S_P_OPTION
1 1 0 6.0 162 0 NORMAL MODE
1 1 1 5.5 148.5 1 TEST MODE
DGND

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-8

6. Schematic Diagram

6.8.1. Test Point Wave Form

TP1

6-9 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 6. Schematic Diagram

6.9. MAIN-5
MP3.3V_PW

SPMO_N
SPMO_P
POWER

MOCTL
CDVR
RF5V_PW

22UF 6.3V
AUDIO RF5V_PW MPD EMC1 100P F

4.7OHM
R5021

10KOHM
C5010

R5027
EMC2 100P F

1/16W
B

1/4W
C3002 C EMC3 100P F
100NF 10V
D EMC4 100P F
A EMC5 100P F

R5030

R5037
10KOHM
22OHM

R5043

R5048
4.7KOHM

10KOHM

R5049
10KOHM
IC5002

1/16W

1/16W

1/16W
R5046
E 1 OUT1 8 1KOHM DGND
1/16W

RFQ1
VCC 1/16W 100P F

RF50V
2 7

RF5V
B CDLD IN1-
OUT2 RFC7 A MVREF
C
R5025 3 IN1+ 6 100P F
RF5V_PW DM5V_PW
DM5V_PW IN2-
DGND 220OHM 4 GND 5 C5012 SW

SW
BD5001 IN2+

R5044

R5050
2.2KOHM

680OHM
1MOHM
0.01OHM 100P F

1NF 50V

R5041
0V
NF 550V

1/16W

1/16W
C5014
C5011
C5013 CDVR

1/16W
MVREF
PUHRF
RF10
RF11
RF12
RF13
C5002

11NF
RF1
RF2
RF3
RF5
RF6
RF7
RF8
RF9
RFCN1 330UF DGND
CDLDO

100NF 10V
C5003 EMC IMPROVE

R5042

R5045

R5047
C5025
18KOHM

22KOHM
23

100NF 10V

3.3KOHM
VCC_5V 10UF

RFC20

1/16W
RFR1

47KOHM

1/16W
R5024
D5001

1/16W
RF 22 PUHRF

1/16W
21
RFC1

DVD_LD 20
0OHM
15PF
DVD_MPD 19
DVD_VR 18
GND 17 C5004
VREF 16 MVREF
VCC DGND
F 15
14 10UF AP1117E33GZ-13-89 A3.3V_PW
E 13
A A M5.1V_PW
D 12 D MPIC3 MGND1 1/10W
C 11 C
22O HM
10 1 IN
OUT
OUT
3
B 9
B
F+ 8
FOCUS _P GND MPR8
T+ 7
TRACK_P A+5V_PW

MPR7
T-

1OHM
TRACK_N

2
F- 6 FOCUS _N
SW 5 SW

10UF
4

10V
LD_GND CB2012UA300T

MPC5
3

PBD5
CD_LD

MPC4

10UF
CDLDO

10V
CD_MPD 2 MPD
M5.1V_PW
1 Q5004
CD_VR CDVR AO3415AS

D
S
1UF 16V
C5017
100KOHM
R5029

C5018
RFGND
GNDF

100NF
1/16W

G
TP1
TP2
TP3
TP5
TP6
TP7
TP8
TP9
TP10
TP11
TP12
TP13
TP22
TP17

DGND DGND

10UF 10V
10KOHM
R5035

C5021
DCLOAD_N
DCLOAD_P

1/16W
MPR1
SLED_N
SLED_P

OUTSW
SPMON

12
SPMOP

10KOHM
INSW

10KOHM
M5.1V_PW

MPC9
RFCN2 Q5003

10UF
MPIC1 MP3.3V_PW
R5013 MPR1A MPL2
4.7UH

MPR2
C
33O HM P_O N1 B
CB2012UA300T 1 8
SP+ 1 SPMO _P PGND NC
2 OPEN_SW 100OHM
E 2 7
10022HS-09C

VIN SS
SP- 3 SPMO _N 3 LX
6

1.1KOHM
CLOSE_SW

MPR14
AGND EN
SL- SLED_N MBD1 4 5
C5008

C5009

4 R5014
47KOHM

47KOHM
R5015

R5018
100NF

SL+
100NF

FB COMP
SLED_P 33O HM
INSW 5 DTC114EU
6 MGND1 MPR5
OUTSW DGND

10UF 10V
7

MPC6
10UF 10V

MPC12
47UF 6.3V
100NF
MPC1
GND

MPC2
8 30KOHM

MPR4

10V
8.2KOHM
D+

1/10W
9

330KOHM
MPR15
D-

33NF 16V
10KOHM
MPR3

MPC11
DGND

1/10W
RF_7
RFND

MPC3
RF_1
RF_2
RF_3
RF_4
RF_5
RF_6
RF_8
RF_9

50V
2.2NF
R5007
C5007 33OHM
1/16W
DA
100NF 10V R5008 DGND
3.3KOHM DGND
1/16W
IC5001 DRV
R5005 R5009
22KOHM 1KOHM
1 28

P_ON3
FOCUS VINFC MUTE R5031
2 27
MGND1

1/16W TRB_1 BIAS 1/16W

R5006 3 26 1/16W 10KOHM

47KOHM
REGO2 VINTK TRACK

R5032
6.8KOHM 4 25 R5023 1/16W
SLEGN VINSL+ TRB_2 R5010 1KOHM VLP8040T4R7M-1
1/16W 5 24 39KOHM MPIC2 L5001 MP1.35V_PW
REGO1 OPOUT
1/16W OPOUT M5.1V_PW
6 23 R5011 4.7UH
R5028
27KOHM
R5019

1/16W
1MOHM

CLOSE FWD VINLD

1KOHM SPINDLE 1 8
7 22 PGND NC
1/16W

1/16W

OPEN REV GND

R5022 R5026 2 7
8 21 VIN LXMGND1
SS
Vcc1 VCTL 10KOHM 1.2KOHM 3 6

R5040
9 20 1/16W AGND EN
R5051
VOTR- OPIN
4 5

1/10W
10 19 R5012 1/16W 1/16W FB COMP 47KOHM
R5020

VOTR+ Vcc2 22KOHM

3.3KOHM

3.3KOHM
MGND2

11 18 R5039 AUX_R AUXI_R

1/16W

SLED_N VOSL+ VOLD- SPMO_N R5052

12 17 R5016 3.6KOHM 16V
SLED_P VOSL- VOLD+ DGND 47KOHM

22UF 6.3V

22UF 6.3V
10UF 10V

0V
0 UF 110V

13 16 2.2OHM 470UF AUX_L AUXI_L

C5026

C5027
FOCUS _N
C5015

TRACK_N MPC81
C5016

VOFC- VOTK-
1/8W 1/10W
14 15

8.2KOHM
SPMO_P

R5038
FOCUS _P VOFC+ VOTK+ TRACK_P

1/10W
110UF

AUC5R
47KOHM

47KOHM
AUC5L
R5053

R5054
33NF 16V
10KOHM

VT5001

VT5002
1/8W
R5002

R5003

R5034

C5023
10KOHM

220PF
10KOHM

220PF
TG1
TG1 T
TG2
G2
1/10W
1/16W

1/16W

R5017
2.2OHM

C5022
50V
2.2NF
C5006
220UF

10UF
C5005

10V

M5.1V_PW M5.1V DGND DM5V_PW DGND

Q5002
AO3415AS DGND DGND
D
S
C5001
100KOHM
R5001

G
2.2UF

AUXR AUXL
R5004
10KOHM

AUXI_L 4
1/16W

2
AUXI_R 3
P_ON
1
C
P_O N B Q5001
E
DTC114EU
DGND
CD VJK2

DGND

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-10

6. Schematic Diagram

6.10. SMPS
OPTION CA801,CA802
! ! ! FREE 420V/360uF MAIN BLOCK CY895S
250V /1nF ! HEAT S INK
FP 801S
NT801S 3D15 CX801S INVEA 500V/150uF HS 801 58*10*16.3(2-HOLE M3TAP )*48(H)
AC250V/T10AH 275V /220nF
! ! B+
HS 851
DA851 HS 851 40*10*16.3(2-HOLE M3TAP )*48(H)
EY01 EY02 EY03 EY04 LX801S LX802S BD801 CA801 CA802 S FF1606G
GND_S
! RX801S
RX806S
1M
F940750S
CP 940750S ! F940750S
CP 940750S EY25
D15S B60
OP TION OP TION
GND_P
LA851
BFD3580R2FD8G
HS 802 33*7*22(HOLE e 2.65)*30(H)
1M(3216) (3216) 10mH 10mH
!

1
CN801 +5 0 % /-3 0 % CY891S + 5 0 % / -3 0 % RADIAL
YW396-03AV EY16 680pF
EY14
EY18
EY08 ! 250V EY20 EY22 RA801
2W/47K
TA891S
EER424220(16P )
+P VDD(B+43V)
1
! EY06 43V/1.2 A

3
1 CX802S 2 4 140uH±7% A5.3V VP S : 56V/4.1A(MAX)
2 RX802S RX805S 275V
2 1M(3216) 1M 220nF E Y2 3 E Y2 4
3 VX801S (3216) CA804 ZDA851
3 14D751K EY27 EY29 630V /10nF
EY05 EY33 LMSZ5242B (12V) RA855 RA859

2
EY19 EY21 530B EY31
EY13
EY15 EY17
EY07
! RA805
1,2 10,11
110K F(3216) OP EN
CA860

3
HS 802 2W/47K CA851
CY892S EY26 CA853 820uF/ 100V
RX803S RX804S 2KV/470pF
1M 680pF 820uF/ 100V ZDA852 (NHA)
1M(3216) (3216) EY28 EY30
250V (NHA) LMSZ5242B (12V)
5,6 13,14,15
DA801
HS 1M RA856 RA860
36KF(1608) OP EN
RA852
EMI BLOCK GND_S GND_P 1KF(1608)
BEA804 BEA802
3550 3550
R-FORMING R-FORMING VP S GND
EY11 !

1
RA811 RA810 RA809 RA851 CA858
2MF(3216) 2MF(3216) 2MF(3216) QA802
QA803 S TF15N80K EY39 1KF P CA891S 50V/33pF( 1608) GND_S
KTN2222AS GND_S (1608) LTV817S COG
DA806 RA825 BEA805 HS 801 RA857 RA861

2
1N4148W 3R3( 3216) S R CB3216P K121E 1KF(3216) OP EN
1 CA857
50V/100nF( 1608)

2
QA804
KTN2907AS 13,14,15
RA824

3
10KF(3216) CA855 CA861
CA852 RA853 820uF/ 100V
VCC 2KV/470pF 820uF/ 100V 5.1 KF(1608)
CA814 RA826 EY12 16,17,18 (NHA) (NHA)
50V/100nF 47( 3216) S R RA858
QA805 (1608) RA807 RA862

3
KTN2222AS DA802 RA803 10KF(3216) 3.3 KF(3216) OP EN

2
1N4148W 3R3( 3216) S R EY34 DA852 ICA851 1
RA827 GND_P 1 CA805 KIA431A
DA804 DA803 S FF1606G
1N4148W RA802 1N4148W 10( 3216) S R 2KV/100pF LA852
2KF(3216) BEA801

2
BFD3580R2FD8G
VCC CB3216P K121E RADIAL

3
CA819
QA806 50V/100nF
RA806 (1608) QA801 -P VDD(B-43V)
100K F(1608) 14 KTN2907AS RA804 EY40

13
47( 3216) S R S TF15N80K 43V/1.2A

9
VP S : 56V/4.1A(MAX)
RA818
HV

DRV
NC
GND_P 10KF(3216)
10 4 EY41 HS 851 EY42
VCC ZCD

! RA814
33KF(1608)
BEA803
CB3216P K121E
11 ICA801 1
OVP BLOCK
BO OP P
NCP 1336B
RA819 RA820 QM864
240K F(3216) 27KF(1608) KTN2907AS
ON A5.3V
CA806 6 7
FB CS
TIME
220nF
GND

8
OVP

OTP
25V RM872
CT

(1608) RA821 1KF(1608)

1KF(1608) RM891
1KF
5

12

2
CA808
50V/33uF
! 9

1
(RD)
CA807 LTV817S EY32 !
LMS Z5239B(9.1V)

220nF CA820 P CA891S EY09

25V 50V/47uF
(1608) CA809 (RD) P CM892S ˆ “ }zv
CA811 CA815 CA816
ZDA801

220nF CA812 330pF CA818 RA813 RA816 RA817 33pF 220pF LTV817B ˜’ œ wuurv{ˆ
RA812 25V 2.2nF 100nF 22KF(1608) 1.2KF 1KF 50V 50V RA822 RM890
(1608) 50V (1608) (1608) 0.0 5F 1KF

2
180K F 50V (1608) CA810 50V (1608) (1608) 5W
(1608) (1608) 50V/22uF (1608) +P VDD(B+43V) v {
(RD)
v {
+P VDD(B+43V) v z v z
EY10 v y
GND v y
GND v x v x
-P VDD(B-43V) v w v w
GND_P
QM859 P S _ON -P VDD(B-43V) v v v v
2N7002K
VP S v u
v u
MULTI BLOCK EY37
DM852
1N4148W B-5V ~
~
B30V GND } }
TM891S
EE2525W(5+8 13P IN)
700uH±7%
! 7 DM855
HER208
RM885
10KF QM856
0.0 11A/0.022A
RM879
GND |
{
|
(3216) KS A916 RM875 150K F B30V {
(2A/1000V) 0(3216) (1608) z
CM862 A5.3V[S tby_4.4V] z
B+ 13 CM861
10nF y
CM860 CM868 50V/47uF -VFD_GND_+2.6V y
RM870 RM883
50V/100nF 1KF(1608) (RD) 50V +P VDD(B+43V)
50V/47uF RM869 47K(3216) (1608) x
470K (1608) GND x
RM801 CM801 EY36 (RD) (3216) ON
QM857 +VFD_+2.2V_+4.8V w w
2W/68K 10nF 2N7002K
630V RM876 v
530B 5 RM873 82KF(3216)
P S _ON v
150K F(1608)
GND_S
3 GND
BBM801 DM801 DM857
3550 UF4007 1N4148W GND_S RM877
R-FORMING +VFD_+2.2V_+4.8V 82KF(3216)
9

3
DM854 ZDM851 0.1 85A/0.2A
S B210 QM854 RM888 LMSZ5221( 2.4V) ICM853 1
(2A/100V) KTC3228Y 10KF(3216) RM866 KIA431A
QM855 220F( 3216)
! KTN2907AS
5

8 CM864

2
VCC
! LTV817S DM802 CM859 16V/470uF GND_S
CM863 RM878
DRAIN

P CM892S UF4007 16V/470uF RM864 (RD) 4.7 KF(3216)

ICM801 120F (3216) 50V100nF
ICE3RBR1765J Z 6 NC VCC
7 (RD) B30V (1608)
RM867
QM801 RM865 22( 3216)
KTC3228Y 10KF(3216)
2 3 0.1 85A/0.2A
FB CS
GND

GND_S
-VFD_GND_+2.6V
S /S

1N4148W

RM884 RM892
DM803

DM853 DM858 DM859

RM808 1N4148W 1N4148W 20KF(3216) 20KF(3216)
10 UF4007 GND_S
8

ZDM801 (1608)
LMS Z5239B 2 3
Vin Vo B-5V
(9.1V) 10
CM807 RM889 ICM852 0.1 A/0.22A
2

G
220nF QM852 10KF(3216) S N7905D
25V DM804 RM805 KTC3228Y RM861

1
(1608) 1N4148W 560F (1608) RM860 QM853 CM858
CM857 2K(3216) KTN2907AS 2.7 K(3216) 50V/47uF
CM803 CM804 11, 12 (RD) 1
10nF 470nF CM808 1 16V/470uF ON
LUG801 VFD Spec ifica tions
RM802 50V 16V 50v /33uF(NXB) (MK) 2
(1608) (1608) RM803
10 CM802 EY35
(1608) 2W/0.9F 220nF ZDM802 RM804 +VFD_+2.2V_+4.8V
25V GND
(1608) LMS Z5239B 150K F(1608) 1
(9.1V) -VFD_GND_+2.6V
A5.3V LUG802 2
13 LM851
ZDM803 DM851 1.5 A/2.5A +VFD
LMS Z5237B S DB10100DI RM852 BFD3580R2FD8G RM854 S tby : 4.4V/0.03A
(8.2V) (10A/100V) 1KF(1608) RADIAL 5.1 KF(1608)
RM886 1 4.8V 2.2V
24( 3216) LUG803
11, 12 (S R) 2 -VFD
RM851 !
1

EY38 2.6V
! GND_P
CM851
2KV/470pF
RM887
24( 3216)
1KF
(1608) LTV817S
P CM891S GND
P CM891S (S R) CM855 RM855 GND_S
LTV817S 50V/33pF(1608) COG 180F( 1608)
2

CM852 CM853 CM856

!
CY894S
1000uF /10V(NXB) 1000uF
10V
(NXB)
RM857
15KF(3216)
CM866
680uF/ 10V(NHA)

RM871
250V /1nF CM854 RM853 QM851 50V/100nF
(1608) 1KF(3216)
220nF /25V 10KF(1608) 2N7002K
(1608) P S _ON
RM856
6.8 KF(3216) RM882
ICM851 150K F(1608)
GND_P GND_S KIA431A
GND
GND_S

6-11 Copyright© 1995-2013 SAMSUNG. All rights reserved.

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This Service Manual is a property of Samsung Electronics

Co.,Ltd.
© 2013 Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under
All rights reserved.
applicable International and/or domestic law.
Printed in Korea