SIM7020 Series Hardware Design - V1.03

SIM7020 Series
Hardware Design
LPWA Module
SIMCom Wireless Solutions Limited

Building B, SIM Technology Building, No.633, Jinzhong Road
Changning District, Shanghai P.R.China
Tel: 86-21-31575100
[email protected]
www.simcom.com
SIM7020 Series Hardware Design V1.03
Document Title: SIM7020 Series Hardware Design

Version: 1.03
Date: 2020-06-02
Status: Released
GENERAL NOTES
SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS TO SUPPORT THE

APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM.
THE INFORMATION PROVIDED IS BASED ON THE REQUIREMENTS SPECIFICALLY FROM THE
CUSTOMERS. SIMCOM HAS NOT UNDERTAKEN ANY INDEPENDENT SEARCH FOR ADDITIONAL
RELEVANT INFORMATION, INCLUDING ANY INFORMATION THAT MAY BE IN THE CUSTOMER’S
POSSESSION. FURTHERMORE, THE SYSTEM VALIDATION OF THE PRODUCT DESIGNED BY
SIMCOM WITHIN A LARGER ELECTRONIC SYSTEM REMAINS THE RESPONSIBILITY OF THE
CUSTOMER OR THE CUSTOMER’S SYSTEM INTEGRATOR. ALL SPECIFICATIONS SUPPLIED
HEREIN ARE SUBJECT TO CHANGE WITHOUT NOTICE.
COPYRIGHT
THIS DOCUMENT CONTAINS THE PROPRIETARY TECHNICAL INFORMATION WHICH IS THE

PROPERTY OF SIMCOM LIMITED, COPYING OF THIS DOCUMENT, GIVING IT TO OTHERS, THE
USING OR COMMUNICATION OF THE CONTENTS THEREOF ARE FORBIDDEN WITHOUT THE
OFFICIAL AUTHORITY BY SIMCOM. OFFENDERS ARE LIABLE TO THE PAYMENT OF THE DAMAGES.
ALL RIGHTS ARE RESERVED IN THE EVENT OF GRANT OF A PATENT OR THE REGISTRATION OF A
UTILITY MODEL OR DESIGN. ALL SPECIFICATIONS SUPPLIED HEREIN ARE SUBJECT TO CHANGE
WITHOUT NOTICE.
SIMCom Wireless Solutions Limited

Building B, SIM Technology Building, No.633 Jinzhong Road, Changning District, Shanghai P.R.China
Tel: +86 21 31575100
Email: [email protected]
For more information, please visit:

https://www.simcom.com/download/list-863-en.html
For technical support, or to report documentation errors, please visit:

https://www.simcom.com/ask/ Or email to: [email protected]
Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2020
www.simcom.com 2 / 60
Version History
Date Version Description of change Author

Ya.li
2018-02-07 1.00 Original
Ming.zhu
Update figure 1,9,20,21

Update table 2,8,9,10,16, 29,30
2018-04-19 1.01 Update chapter 3.5.1 Ming.zhu
Add chapter 3.5.4, 3.5.5
Add table 28
Update figure 1
Ya.li
2018-07-25 1.02 Update table 2,6,21,30
Ming.zhu
Update
2020-05-11 1.03 OLIVIER.WU
Contents
Version History .....................................................................................................................................3
Contents ................................................................................................................................................4
Table Index ............................................................................................................................................6
Figure Index ..........................................................................................................................................8
1. Introduction ......................................................................................................................................9
1.1 Product Outline ................................................................................................................................ 9
1.2 Hardware Interface Overview .......................................................................................................... 9
1.3 Hardware Block Diagram ............................................................................................................... 10
1.4 Functional Overview ...................................................................................................................... 11
2. Package Information ......................................................................................................................12

2.1 Pin Assignment Overview .............................................................................................................. 12
2.2 Pin Description............................................................................................................................... 13
2.3 Mechanical Information .................................................................................................................. 16
2.4 Footprint Recommendation ........................................................................................................... 17
2.5 Paste mask Recommendation ....................................................................................................... 18
3. Interface Application ......................................................................................................................19

3.1 Power Supply................................................................................................................................. 19
3.2 Power Supply Design Guide .......................................................................................................... 19
3.3 Voltage Monitor .............................................................................................................................. 23
3.4 Power on/Power off/Reset Function .............................................................................................. 23
3.4.1 Power on ............................................................................................................................. 23
3.4.2 Power off ............................................................................................................................. 25
3.4.3 Reset Function .................................................................................................................... 27
3.5 UART Interface .............................................................................................................................. 28
3.5.1 UART Design Guide ............................................................................................................ 28
3.5.2 RI and DTR Behavior .......................................................................................................... 30
3.6 USB Interface ................................................................................................................................ 31
3.7 SIM Interface ................................................................................................................................. 32
3.7.1 SIM Application Guide ......................................................................................................... 33
3.7.2 Recommended SIM Card Holder ......................................................................................... 34
3.8 Network status ............................................................................................................................... 35
3.9 ADC ............................................................................................................................................... 36
3.10 Power Supply Output ................................................................................................................... 36
4. RF Specifications ...........................................................................................................................38
4.1 LTE RF Specifications ................................................................................................................... 38
4.2 LTE Antenna Design Guide............................................................................................................ 40
4.3 RF traces note ............................................................................................................................... 41

4.3.1 RF traces layout .................................................................................................................. 41
4.3.2 LTE ANT and other system ANT decoupling ........................................................................ 42
5. Electrical Specifications ................................................................................................................43

5.1 Absolute maximum ratings ............................................................................................................. 43
5.2 Operating conditions ...................................................................................................................... 43
5.3 Operating Mode ............................................................................................................................. 45
5.3.1 Operating Mode Definition ................................................................................................... 45
5.3.2 Sleep mode ......................................................................................................................... 46
5.3.3 Minimum functionality mode and Flight mode...................................................................... 46
5.3.4 Power Saving Mode (PSM) ................................................................................................. 46
5.3.5 Extended Mode DRX (e-DRX) ............................................................................................. 48
5.4 Current Consumption..................................................................................................................... 48
5.5 ESD Notes ..................................................................................................................................... 49
6. SMT Production Guide...................................................................................................................50

6.1 Top and Bottom View of SIM7020 .................................................................................................. 50
6.2 Typical SMT Reflow Profile ............................................................................................................ 50
6.3 Moisture Sensitivity Level (MSL).................................................................................................... 51
6.4 Baking Requirements .................................................................................................................... 51
7. Packaging .......................................................................................................................................53
8. Appendix .........................................................................................................................................56
8.1 Related Documents ....................................................................................................................... 56
8.2 Terms and Abbreviations ............................................................................................................... 58
8.3 Safety Caution ............................................................................................................................... 60
Table Index
Table 1: SIM7020 frequency bands and air interface .............................................................................................. 9

Table 2: General features ....................................................................................................................................... 11
Table 3: Pin definition ........................................................................................................................................... 13
Table 4: IO parameters definition .......................................................................................................................... 13
Table 5: Pin description ......................................................................................................................................... 14
Table 6: VBAT pins electronic characteristic ........................................................................................................ 19
Table 7: The path of the power supply ............................................................................................................ 20
Table 8：VDET+PMOS&LDO & diode： ........................................................................................................ 21
Table 9: Recommended TVS diode list ........................................................................................................... 22
Table 10: Power on timing and electronic characteristic ....................................................................................... 24
Table 11: Power off timing and electronic characteristic ...................................................................................... 26
Table 12: RESET pin electronic characteristic ...................................................................................................... 27
Table 13: Recommended TVS list ......................................................................................................................... 31
Table 14: SIM electronic characteristic in 1.8V mode (SIM_VDD=1.8V) ........................................................... 32
Table 15: SIM electronic characteristic 3.0V mode (SIM_VDD=3V) .................................................................. 32
Table 16: Molex SIM socket pin description......................................................................................................... 34
Table 17: NETLIGHT pin status ........................................................................................................................... 35
Table 18: ADC electronic characteristics .............................................................................................................. 36
Table 19: Electronic characteristic ........................................................................................................................ 37
Table 20: Conducted transmission power .............................................................................................................. 38
Table 21: Maximum Power Reduction (MPR) for UE category NB1 Power Class 3 ........................................... 39
Table 22: E-UTRA operating bands ...................................................................................................................... 39
Table 23: CAT-NB1 Reference sensitivity (QPSK) ............................................................................................... 39
Table 24: Trace loss ............................................................................................................................................... 40
Table 25: Recommended TVS ............................................................................................................................... 40
Table 26: Absolute maximum ratings .................................................................................................................... 43
Table 27: Recommended operating ratings ........................................................................................................... 43
Table 28: 1.8V Digital I/O characteristics* ........................................................................................................... 43
Table 29: Operating temperature ........................................................................................................................... 44
Table 30: Operating mode Definition .................................................................................................................... 45
Table 31: RTC_GPIO0/RTC_EINT characteristics ............................................................................................... 47
Table 32: Current consumption on VBAT Pins (VBAT=3.3V) ............................................................................. 48
Table 33: The ESD performance measurement table ............................................................................................ 49
Table 34: Moisture Sensitivity Level and Floor Life............................................................................................. 51
Table 35: Baking requirements .............................................................................................................................. 52
Table 36: Tray size ................................................................................................................................................ 54
Table 37: Small Carton size................................................................................................................................... 54
Table 38: Big Carton size ...................................................................................................................................... 55
Table 39: Related Documents ................................................................................................................................ 56
Table 40: Terms and Abbreviations ....................................................................................................................... 58
Table 41: Safety Caution ....................................................................................................................................... 60
Figure Index
Figure 1: SIM7020 block diagram .................................................................................................................... 10

Figure 2: Pin assignment overview .................................................................................................................. 12
Figure 3: Dimensions (Unit: mm)...................................................................................................................... 16
Figure 4: Footprint recommendation (Unit: mm) ............................................................................................ 17
Figure 5: Paste mask SMT stencil footprint outline ....................................................................................... 18
Figure 6: Recommended power supply reference design circuit ................................................................ 20
Figure 7: Power supply application circuit ...................................................................................................... 22
Figure 8: Reference power on/off circuit ......................................................................................................... 23
Figure 9: Power on timing sequence ............................................................................................................... 24
Figure 10: Power off timing sequence ............................................................................................................. 25
Figure 11: Reference reset circuit .................................................................................................................... 27
Figure 12: UART full modem............................................................................................................................. 28
Figure 13: UART null modem ........................................................................................................................... 28
Figure 14: Reference circuit of level shift ........................................................................................................ 29
Figure 15: TX level matching circuit ................................................................................................................. 29
Figure 16: RX level matching circuit ................................................................................................................ 30
Figure 17: RI behaviour （SMS and URC report） ...................................................................................... 30
Figure 18: USB reference circuit ...................................................................................................................... 31
Figure 19: SIM interface reference circuit ....................................................................................................... 33
Figure 20: Molex SIM card socket.................................................................................................................... 34
Figure 21: NETLIGHT reference circuit ........................................................................................................... 35
Figure 22：Power on sequence of the VDD_EXT ........................................................................................ 36
Figure 23：Power on sequence of the VDD_3V3 ......................................................................................... 37
Figure 24: Antenna matching circuit (MAIN_ANT)......................................................................................... 40
Figure 25: RF trace should be far away from other high speed signal lines ............................................. 41
Figure 26: The distance between GND to the inner conductor of SMA ..................................................... 42
Figure 27: PWRKEY or RTC_EINT wake up PSM sequence .......................................................................... 47
Figure 28: Top and bottom view of SIM7020 .................................................................................................. 50
Figure 29: The ramp-soak-spike reflow profile of SIM7020 ......................................................................... 50
Figure 30: packaging diagram .......................................................................................................................... 53
Figure 31: Tray drawing ..................................................................................................................................... 53
Figure 32: Small carton drawing ....................................................................................................................... 54
Figure 33: Big carton drawing ........................................................................................................................... 54
1. Introduction
This document describes SIM7020 hardware interface in great detail. The document can help customer to
quickly understand SIM7020 interface specifications, electrical and mechanical details. With the help of this
document and other SIM7020 application notes, customer guide, customers can use SIM7020 to design
various applications quickly.
1.1 Product Outline

The SIM7020 series modules support LTE CAT-NB1.
With a tiny configuration of 17.6*15.7*2.3mm, SIM7020 can meet almost all the space requirements in
customers’ applications, such as water meter instruments, tracking devices, home security locks and other
aspects. And the physical dimension is compatible with the packaging of SIM800C.
Table 1: SIM7020 frequency bands and air interface
Variants
Standard Frequency
SIM7020C SIM7020E
B1  
B3  
B5  
LTE-FDD
B8  
B20 
B28 
1.2 Hardware Interface Overview
The interfaces are described in detail in the next chapters include:

 Power Supply
 USB Interface
 UART Interface
 SIM Interface
 ADC
 Power Output
 GPIOs
 Antenna Interface
1.3 Hardware Block Diagram
The block diagram of the SIM7020 module is shown in the figure below.
Figure 1: SIM7020 block diagram
1.4 Functional Overview
Table 2: General features
Feature Implementation
Power supply Power supply voltage 2.1～3.6V,Typ=3.3V
Current in sleep mode: 236uA (at+cfun=0)
Power saving
Current in PSM mode: 3.4uA
Radio frequency bands Please refer to the table 1
Transmitting power LTE 23dBm
Data Transmission LTE CAT NB1: 26.15Kbps (DL)
Throughput LTE CAT NB1: 62.5Kbps (UL)
Antenna LTE antenna.
SMS MT, MO, Text and PDU mode
SIM interface Support identity card: 1.8V/ 3V
A full modem serial port by default
Baud rate: default: auto baud rate
UART1 interface
Can be used as the AT commands or data stream channel
Support RTS/CTS hardware handshake
Baud rate: It can be 921600bps when used download mode.
UART2 interface
Can be used for debugging and upgrading firmware
USB 1.1 interface for debugging (Log port can be selected by AT
USB
command.)
Firmware upgrade Firmware upgrade over UART2 interface
Size: 17.6*15.7*2.3mm
Physical characteristics
Weight: 1.3g±0.2g
Normal operation temperature: -30°C to + 80°C
Temperature range Extended operation temperature: -40°C to + 85°C*
Storage temperature -45°C to + 90°C
NOTE
The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the
normal operating temperature range and still within the extreme operating temperature range.
2. Package Information
2.1 Pin Assignment Overview
NETLIGHT
VDD_EXT
PWRKEY
STATUS
ADC
VBAT
VBAT
GND
GND
34
42
41
40
39
38
37
36
35
UART1_TXD 1 33 GND
UART1_RXD 2 32 ANT
UART1_RTS 3 31 GND
UART1_CTS 4 30 GND
UART1_DCD 5 29 GPIO1
UART1_DTR 6 SIM7020 28 RESET
UART1_RI 7 TOP VIEW 27 GND
GND 8 26 USB_DM
VDD_3V3 9 25 USB_DP
GPIO0 10 24 USB_VBUS
RTC_GPIO0 11 23 UART2_RXD
RTC_EINT 12 22 UART2_TXD
16
17
13
14
15
18
19
20
21
SIM_DATA
SIM_DET
SIM_VDD
SIM_CLK
SIM_RST
GND
GND
GND
NC
Figure 2: Pin assignment overview
Table 3: Pin definition
Pin No. Pin Name Pin No. Pin Name

1 UART1_TXD 22 UART2_TXD
2 UART1_RXD 23 UART2_RXD
3 UART1_RTS 24 USB_VBUS
4 UART1_CTS 25 USB_DP
5 UART1_DCD 26 USB_DN
6 UART1_DTR 27 GND
7 UART1_RI 28 RESET
8 GND 29 GPIO1
9 VDD_3V3 30 GND
10 GPIO0 31 GND
11 RTC_GPIO0 32 ANT
12 RTC_EINT 33 GND
13 GND 34 VBAT
14 SIM_DET 35 VBAT
15 SIM_DATA 36 GND
16 SIM_CLK 37 GND
17 SIM_RST 38 ADC
18 SIM_VDD 39 PWRKEY
19 GND 40 VDD_EXT
20 NC 41 NETLIGHT
21 GND 42 STATUS
2.2 Pin Description

Table 4: IO parameters definition
Pin type Description
PI Power input
PO Power output
AI Analog input
AIO Analog input/output
I/O Bidirectional input /output
DI Digital input
DO Digital output
DOH Digital output with high level
DOL Digital output with low level
PU Pull up
PD Pull down
Table 5: Pin description
Default
Pin name Pin No. Description Comment
status
Power supply
Power supply, voltage range:
VBAT 34、35 PI
2.1-3.6V.
Power output 1.8V for other
external circuits with Max 50mA
VDD_EXT 40 PO current output, such as level shift If unused, keep it open.
circuit. Not present in PSM
mode.
Power output 3.3V for other Voltage range
external circuits with Max 50mA 3.3V-3.5V( depend on
VDD_3V3 9 PO
current output. Not present in VBAT). If unused, keep
PSM mode. it open.
8、13、19、
21、27、
GND 30、31、 Ground
33、36、
37
System Control
PWRKEY has been
System power on/off control pulled up to VBAT via
PWRKEY 39 DI，PU input, active low. The efficient
input level must be below 0.5V. 40Kohm resistor
internally.
RESET has been pulled
System reset control input, active
RESET 28 DI，PU up to VBAT via 40Kohm
low.
resistor internally.
SIM interface
SIM_DATA 15 I/O，PU SIM Card data I/O
SIM_RST 17 DO SIM Reset All lines of SIM interface
SIM_CLK 16 DO SIM clock should be protected
Power output for SIM card, its against ESD.
SIM_VDD 18 PO output Voltage depends on SIM
card type automatically. I
SIM card detecting input. (This If used, keep a 10kΩ
SIM_DET
14 DI function do not support yet in resistor pulling up to the
standard software.) VDD_EXT
USB
Valid USB detection input with
USB_VBUS 24 DI,PD
2.5~5.25V detection voltage
Positive line of the differential, USB interface for
USB_DP 25 I/O
bi-directional USB signal. debugging
Negative line of the differential,
USB_DN 26 I/O
bi-directional USB signal.
UART interface
UART1_TXD 1 DOH Transmit Data If unused, keep them
UART1_RXD 2 DI，PU Receive Data open.
UART1_RTS 3 DI，PU Request to send

UART1_CTS 4 DOH Clear to Send
UART1_DCD 5 DOH Data carrier detect
UART1_DTR 6 DI，PU Transmit Data
UART1_RI 7 DOH Ring Indicator
UART2_TXD 22 DOH Transmit Data
UART2_RXD 23 DI，PU Receive Data
Indicate and Control in PSM Mode
In PSM, RTC_GPIO0 will change
state from low to high if
RTC_GPIO0 11 DO
RTC_EINT receive interrupt
Voltage Domain: VBAT
event.
RTC_EINT can be the wake up
RTC_EINT 12 DI、PU
source for exiting PSM.
GPIO
LED control output as network
NETLIGHT 41 DO
status indication.
Operating status output.
High level: Power on and
STATUS 42 DO If unused, keep them
firmware ready
Low level: Power off open.
Do not pull down before power
GPIO0 10 IO
on
GPIO1 29 IO
RF interface
ANT 32 AI antenna
Other interface
Analog-digital converter input. If unused, keep them
ADC 38 AI
Voltage range: 0.1-1.4V. open.
NC 20 No connection. Keep it open
2.3 Mechanical Information
The following figure shows the package outline drawing of SIM7020.
Figure 3: Dimensions (Unit: mm)
2.4 Footprint Recommendation
Figure 4: Footprint recommendation (Unit: mm)
2.5 Paste mask Recommendation
The recommended thickness of stencil foil is 0.15mm.
Figure 5: Paste mask SMT stencil footprint outline
3. Interface Application
3.1 Power Supply
The power supply for SIM7020 must be able to provide sufficient instantaneous current up to more than
[email protected] in order to satisfy the power supply current for maximum consumption.
Table 6: VBAT pins electronic characteristic
Symbol Description Min. Typ. Max. Unit

VBAT Module power voltage 2.1 3.3 3.6 V
IVBAT(peak)@3.3V Module power peak current in NB emission 500 - - mA
IVBAT(average) Module power average current in normal mode
Please refer to the table 32
IVBAT(sleep) Power supply current in sleep mode
IVBAT(PSM) Power supply current in PSM mode - 3.4 - uA
IVBAT(power-off) Module power current in power off mode. - - 12 uA
3.2 Power Supply Design Guide
In the design of the user, special attention must be paid to the design of the power supply to ensure the
stable operation of the module.SIM7020 can support the use of Li-MnO2 battery, DC (LDO/ DC-DC),
Li-SOCl2 battery and other external power supply, such as its reference design.
NOTE
If the power supply for VBAT pins can support up to [email protected], using a total of more than 100uF
capacitors is recommended, or else users must using a total of 300uF capacitors typically, in order to
avoid the voltage drop. The module power peak current depends on the total capacitance. Using a total
of 1000uF capacitors in the test that will reduce the peak current to 320mA.
⑴ 0R
⑵ MBR2H200SF
①system current
BOOST
②PA current PA
⑶ MCH3374
Ca + Cb + Cc Cd Ce
0402 0402 0402
3 NC GND 2
4 VDD OUT 1
③baseband current RF
S-1000C33 [email protected]
PMU
Ⅰ VBAT VBAT
Li-MnO2
Ⅱ Baseband
Surge TVS DC(LDO/DC-DC)
SIM7020G
Ⅲ Li-SOCl2 module
Figure 6: Recommended power supply reference design circuit
Table 7: The path of the power supply
N0. VBAT power supply The path of the power

1 Ⅰ Li-MnO2 ⑴
2 Ⅱ DC (LDO/DC-DC) ⑴
3 Ⅲ Li-SOCl2 ⑵
4 Ⅲ Li-SOCl2 ⑶
NOTE
Using Li-SOCl2 battery, the open circuit voltage is about 3.8v, larger than the VBAT maximum 3.6v.It is
necessary to add the schottky diode ( column 3 of table 7) or voltage limiting circuit (column 4 of table
7) between the battery and the module, and lithium battery or DC can directly supply power (column 1/2
of table 7).
1、schottky diode：On-SEMI , MBR2H200SF；
2 、 voltage limiting circuit: VDET+PMOSFET ： VDET IC Seiko S-1000C33-I4T1U ，

PMOSFET:On-SEMI ,MCH3374-TL-E (Pb-Free), MCH3374-TL-W (Pb-Free/Halogen Free)；
3、LDO DC： TI TPS7A92；
If the use of power adapter output 5V power supply or lithium ion battery: RT5707WSC
4、VDET+PMOS&LDO & diode：
Table 8：VDET+PMOS&LDO & diode：
2A Diode
VDET+PMOS 2A LDO DC TPS7A92
MBR2H200SF
Cost Mediate (Good) high less (BEST)
Solution Size 6.45mm2 6.25mm2 (only TPS7A92) 4.455mm2
Vmin: 3.0V(2.1V+0
Vmin: 2.1V
VBAT operating Vmin: 2.36V(=2.1V+Vdo) .9V@1A)
Vmax: 3.8V (Good)
range Vmax: 3.8V Vmax: 3.8V (Bad)
Ploss =
Efficiency Ploss = 0.75V(Vf@1A) * 1A =
Ploss = (3.8V-3.3V) * 1A = 0.5W 0.9V(Vf@1A) * 1A
@Vin > 3.3V 0.75W
= 0.9W
Efficiency @Vin Ploss = Ron(<0.125ohm) * Ploss = 0.9V *
Ploss = 0.26V * 1.65A = 0.429W
< 3.3V 1.652(A) < 0.34W(Good) 1.65A = 1.485W
Current 2.8mA=> 2.1mA(ground No extra current
MAX < 0.9Ua
consumption current)+0.7mA(VFB leakage) consumption
(Good)
impact (Bad) (BEST)
NOTE
Comprehensive evaluation: VDET+PMOS is recommended.

LDO solution: LDO current capacity and low Iq are a compromise, and it is not competitive in
performance and cost.
Schottky diode solution: price should be at an advantage but minimum input voltage should be at 3V at
VBAT.
The power supply range of SIM7020 is from 2.1V to 3.6V.Recommended voltage is 3.3V. The transmitting
burst will cause voltage drop and the power supply must be able to provide sufficient current up to
[email protected]，Make sure that the voltage on the VBAT pins will never drop below 2.1V, or module will work
abnormally.
NOTE
SYSTEM CURRENT EVALUAATE:

①system current=② PA current +③baseband current=760mA：
②Max.PA input current=400mA；
③Max.baseband current=20mA(Without other device on system)；
If boost converter efficiency 85%;calculate boost input current=(400mA*3.3V)/0.85/2.1V=740mA;

*Boost output=3.3V/battery min.=2.1V.
Battery pulse current capability should be confirmed with battery vender. SELECT BATTERY
CURRENT CAPABILITY >760mA
Based on the recommendations, the following combination is placed near the VBAT capacitance, near the
module VBAT input, suggested to parallel a low ESR (ESR) = 0.7 Ω 100 uF Ca and Cb tantalum capacitor,
and Cc 100 nF, Cd 100 pF(0402 size) and Ce22pF (0402 size) filtering capacitance, To improve RF
performance and system stability .These capacitors should be put as close as possible to VBAT pads. Also,
users should keep VBAT trace on circuit board wider than 1 mm to minimize PCB trace impedance.
VBAT VBAT
Ce Cd Cc Cb Ca
VBAT 5.1V
500 mW
22pF 100pF 100nC 100uF 100uF
Module
GND
GND
Figure 7: Power supply application circuit
In addition, for ESD protection, it is suggested to add a TVS diode near the VBAT PINs.
Table 9: Recommended TVS diode list
No. Manufacturer Part Number Package

1 Prisemi PESDHC2FD4V5B DFN1006
2 Prisemi PESDHC3D3V3U SOD323
3 WILLsemi ESD5651N-2/TR DFN1006
3.3 Voltage Monitor
To monitor the VBAT voltage, the AT command “AT+CBC” can be used.
When the VBAT voltage is out of the range, the module will be power off when the overvoltage power-off
function is enabled. The AT command “AT+CBATCHK=1” can be used to enable the overvoltage power-off
function and the under-voltage power-off function.
NOTE
Under-voltage warning function and under-voltage power-off function are disabled by default. For more
information about these AT commands, please refer to Document [1].
3.4 Power on/Power off/Reset Function
3.4.1 Power on
SIM7020 can be powered on by pulling the PWRKEY pin to ground.

The PWRKEY pin has been pulled up with a resistance to VBAT internally, so it does not need to be pulled
up externally. It is strongly recommended to put a 100nF capacitor and an ESD protection diode close to the
PWRKEY pin, as it would strongly enhance the ESD performance of PWRKEY pin. Please refer to the
following figure for the recommended reference circuit.
VBAT
40K
Turn on/off PWRKEY 1K Power
impulse on/off
logic
H 4.7K
L
100nF
47K
Module
Figure 8: Reference power on/off circuit
NOTE
Do not directly ground the PWRKEY pin, and do not lower GPIO0 before starting the machine.
The power-on scenarios are illustrated in the following figure.
VBAT Ton
PWRKEY
(Input)
Ton(status)
STATUS
(Output)
Ton(uart)
UART Port Undifined Active
Ton(usb)
USB Port Undifined Active
Figure 9: Power on timing sequence
Table 10: Power on timing and electronic characteristic
Symbol Parameter Min. Typ. Max. Unit

The time of active low level impulse of
Ton 215 1000 - ms
PWRKEY pin to power on module
The time from power-on issue to STATUS
Ton(status) pin output high level(indicating power up 440 ms
ready )
The time from power-on issue to UART
Ton(uart) 2 s
port ready
The time from power-on issue to USB port 4
Ton(usb) s
ready
VIH Input high level voltage on PWRKEY pin 0.7*VBAT V
VIL Input low level voltage on PWRKEY pin 0.3*VBAT V
3.4.2 Power off
The following methods can be used to power off SIM7020.

Method 1: Power off SIM7020 by pulling the PWRKEY pin to ground.
Method 2: Power off SIM7020 by AT command “AT+CPOWD=1”.
Method 3: over-voltage or under-voltage automatic power off. The function can be enabled by AT command
“AT+CBATCHK=1”. Default is disabled.
NOTE
For details about “AT+CPOWD” and “AT+CBATCHK”, please refer to Document [1].
These procedures will make modules disconnect from the network and allow the software to enter a safe
state, and save data before module be powered off completely.
The power off scenario by pulling down the PWRKEY pin is illustrated in the following figure.
Toff-on
PWRKEY Toff Ton

( Input )
STATUS
( Output )
Toff(status)
Toff(uart)
UART Port Active Undefined
Toff(usb)
USB Port Active Undefined
Figure 10: Power off timing sequence
Table 11: Power off timing and electronic characteristic
Time value
Symbol Parameter Unit
Min. Typ. Max.
The active low level time pulse on PWRKEY pin to
Toff 1 1.5 - s
power off module
The time from power-off issue to STATUS pin output
Toff(status) - - 1.1 s
low level(indicating power off )*
Toff(uart) The time from power-off issue to UART port off - - 1 s
Toff(usb) The time from power-off issue to USB port off - - 1 s
The buffer time from power-off issue to power-on
Toff-on 5 - - s
issue
NOTE
The STATUS pin can be used to detect whether module is powered on or not. When module has been
powered on and firmware goes ready, STATUS will be high level, or else STATUS will still low level.
3.4.3 Reset Function
SIM7020 can be reset by pulling the RESET pin to ground.
NOTE
This function is only used as an emergency reset. The RESET pin will be ineffectiveness in the power
off mode.
The RESET pin has been pulled up to 1.8V with a 40KΩ resistor internally. So it does not need to be pulled
up externally. It is strongly recommended to put a100nF capacitor and an ESD protection diode close to the
RESET pin. Please refer to the following figure for the recommended reference circuit.
Figure 11: Reference reset circuit
Table 12: RESET pin electronic characteristic
Symbol Description Min. Typ. Max. Unit

The active low level time impulse on
Treset 48 - - ms
RESET pin to reset module
VIH Input high level voltage 0.7*VBAT V
VIL Input low level voltage 0.3*VBAT V
3.5 UART Interface
SIM7020 provides a 7-wire UART1 (universal asynchronous serial transmission) interface as DCE (Data
Communication Equipment). AT commands and data transmission can be performed through UART1
interface.UART2 can be used for debugging and download software.
3.5.1 UART Design Guide
The following figures show the reference design.
MODULE( DCE) CUSTOMER (DTE)

Serial port Serial port
TXD TXD
RXD RXD
RTS RTS
CTS CTS
UART _ DTR DTR
UART _ DCD DCD
UART1_RI RING
Figure 12: UART full modem
MODULE ( DCE) HOST ( DTE)
TXD TXD
RXD RXD
RTS RTS
UART CTS CTS UART
DTR DTR
DCD DCD
Wake up host
RI RING
Interrupt
Figure 13: UART null modem
The SIM7020 UART is 1.8V voltage interface. If user’s UART application circuit is 3.3V voltage interface,
the level shifter circuits should be used for voltage matching. The TXB0108RGYR provided by Texas
Instruments is recommended. The following figure shows the voltage matching reference design.
VDD_ EXT 3.3V

TXB0108RGYR
MODULE 100nF 100nF
VCCA VCCB
OE GND
TXD A1 B1 TXD_3.3V
RXD A2 B2 RXD_3.3V
UART RTS A3 B3 RTS _3.3V
CTS A4 B4 CTS _3.3V
DTR A5 B5 DTR_3.3V
DCD A6 B6 DCD_3.3V
RI A7 B7 RI _3.3V
47K 47K
A8 B8
Figure 14: Reference circuit of level shift
NOTE
1、When it uses the level shifter IC, the pull up resistance on TXD_3.3V，RTS_3.3V，DCD_3.3V should
not be less than 47KΩ；
2、Special note: the module is DCE, RTS is defined as the INPUT signal, DTE should be connected to
the OUTPUT signal, CTS is defined as the OUTPUT signal, DTE should be connected to the INPUT
signal.
Also the following reference circuit is recommended:

VDD_EXT
GSM DTE
VDD
4.7K
VDD_EXT
4.7K
47K
UART1_TXD RXD
Figure 15: TX level matching circuit
VDD_EXT
GSM DTE
VDD_EXT VDD
4.7K
4.7K
47K
UART1_RXD TXD
Figure 16: RX level matching circuit
NOTE
The default band rate is 0bps (auto baud rate). The triode conversion circuit is not suitable for high
band rate more than 460800. When using UART2 for downloading software, the band rate is
921600bps, please pay attention to the device’s speed support.
3.5.2 RI and DTR Behavior
The RI pin description:

The RI pin can be used to interrupt output signal to inform the host controller such as application CPU.
Before that, users must use AT command “AT+CFGRI=1” to enable this function.
Normally RI will keep high level until certain conditions such as receiving SMS, or a URC report coming,
then it will output a low level pulse 120ms, in the end, it will become high level.
RI 120ms
Idle
HIGH
Receiving SMS and any URC
report coming
LOW
Figure 17: RI behaviour （SMS and URC report）
NOTE
For more details of AT commands about UART, please refer to document [1].
The DTR pin description:

After setting the AT command “AT+CSCLK=1”, SIM7020 will enter sleep mode by pulling up the DTR pin
when module is in idle mode. In sleep mode, the UART is unavailable. When SIM7020 enters sleep mode,
pulling down DTR can wake up module.\
After setting the AT command “AT+CSCLK=0”, SIM7020 will do nothing when the DTR pin is pulling up.
3.6 USB Interface
The SIM7020 contains a USB interface compliant with the USB1.1 specification as a peripheral, but the
USB charging function is not supported.
MODULE HOST
0Ω
USB_ VBUS VBUS
USB_DM D-
USB USB
USB_DP D+
GND GND
USB_ID D3 D1 D2
Figure 18: USB reference circuit
Because of the high speed on USB bus, more attention should be paid to the influence of the junction
capacitance of the ESD component on USB data lines. Typically, the capacitance of the D1 and D2 should
be less than 2pF.
Table 13: Recommended TVS list
No. Manufacturer Part Number Description Package

1 ON Semi ESD9L5.0ST5G TVS 5V 0.5PF 150mW RO SOD-923
2 TOSHIBA DF2S6.8UFS TVS 5V 2PF 150mW RO SOD-923
3 ON Semi ESD9L5.0ST5G TVS 5V 0.5PF 150mW RO SOD-923
4 TOSHIBA DF2S6.8UFS TVS 5V 2PF 150mW RO SOD-923
3.7 SIM Interface
SIM7020 supports both 1.8V and 3.0V SIM Cards.
Table 14: SIM electronic characteristic in 1.8V mode (SIM_VDD=1.8V)

SIM_VD
LDO power output voltage 1.75 1.8 1.95 V
D
VIH High-level input voltage 0.65*SIM_VDD - SIM_VDD +0.3 V
VIL Low-level input voltage -0.3 0 0.25*SIM_VDD V
VOH High-level output voltage SIM_VDD -0.45 - SIM_VDD V
VOL Low-level output voltage 0 0 0.45 V
Table 15: SIM electronic characteristic 3.0V mode (SIM_VDD=3V)

SIM_VD
LDO power output voltage 2.75 3 3.05 V
D
VIH High-level input voltage 0.65*SIM_VDD - SIM_VDD +0.3 V
VIL Low-level input voltage -0.3 0 0.25*SIM_VDD V
VOH High-level output voltage SIM_VDD -0.45 - SIM_VDD V
VOL Low-level output voltage 0 0 0.45 V
3.7.1 SIM Application Guide
It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST

(www.st.com ) or SMF15C produced by ON SEMI (www.onsemi.com ). Note that the SIM peripheral circuit
should be close to the SIM card socket. The following figure shows the 6-pin SIM card holder reference
circuit.
SIM_ DET
100nF
SIM Socket
SIM_ VDD
SIM_ RST VCC GND
22 Ω
RST VPP
MODULE SIM_ CLK 22 Ω CLK /O
I
C 707 10M 006 512

SIM_ DATA 22 Ω
22pF 22pF 22pF
TVS
Figure 19: SIM interface reference circuit
NOTE
SIM_DATA has been pulled up with a 10KΩ resistor to SIM_VDD in module. A 100nF capacitor on
SIM_VDD is used to reduce interference. For more details of AT commands about SIM, please refer to
document [1].SIM_CLK is very important signal, the rise time and fall time of SIM_CLK should be less
than 40ns, otherwise the SIM card might not be initialized correctly. If SIM_DET is used, a 10KΩ resistor
is necessary to pulling up to the power VDD_EXT.
3.7.2 Recommended SIM Card Holder
It is recommended to use the 6-pin SIM socket such as 503960-0696produced by Molex. User can visit
https://www.molex.com/molex/products/part-detail/memory_card_socket/5039600696 for more information
about the holder.
Figure 20: Molex SIM card socket
Table 16: Molex SIM socket pin description
Pin Signal Description

C1 SIM_VDD SIM Card Power supply.
C2 SIM_RST SIM Card Reset.
C3 SIM_CLK SIM Card Clock.
C5 GND Connect to GND.
C6 VPP
C7 SIM_DATA SIM Card data I/O.
SIM card circuit is susceptible to interference, causing the SIM card failures or some other situations, it is
strongly recommended to follow these guidelines while designing:
 Make sure that SIM card holder should far away from NB_IOT antenna while in PCB layout.
 SIM traces should keep away from RF lines, VBAT and high-speed signal lines.
 The traces should be as short as possible.
 Keep SIM holder’s GND connect to main ground directly.
 Shielding the SIM card signal by ground well.
 Recommended to place a 100nF capacitor on SIM_VDD line and keep close to the holder.
 Add some TVS and the parasitic capacitance should not exceed 50pF, and 22Ω resistor in serials the
SIM signal could enhance ESD protection.
3.8 Network status
The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the following
figure.
VBAT
R
Module
4.7K
NETLIGHT
47K
Figure 21: NETLIGHT reference circuit
NOTE
The value of the resistor named “R” depends on the LED characteristic.
Table 17: NETLIGHT pin status
NETLIGHT pin status Module status

64ms ON, 800ms OFF No registered network
64ms ON, 3000ms OFF Registered network
64ms ON, 300ms OFF Data transmit
OFF Power off or PSM mode
NOTE
NETLIGHT output low level as “OFF”, and high level as “ON”.
3.9 ADC
SIM7020 has a dedicated ADC pin. It is available for digitizing analog signals such as battery voltage and
so on. The electronic specifications are shown in the following table.
Table 18: ADC electronic characteristics
Characteristics Min. Typ. Max. Unit

Resolution – 10 – Bits
Input Range 0.1 – 1.4 V
NOTE
“AT+CADC” can be used to read the voltage of the ADC pin, for more details, please refer to document
[1].
3.10 Power Supply Output
SIM7020 has a LDO power output named VDD_EXT. The output voltage is 1.8V. Meanwhile it has a DCDC
power output named VDD_3V3, which voltage range is 3.3V-3.5V (depend on VBAT). Both of them are not
present in PSM mode.
VBAT 64ms
PWRKEY
( Input)
VDD_EXT
( Output)
Figure 22：Power on sequence of the VDD_EXT
VBAT 70ms
PWRKEY
( Input)
VDD_3V3
( Output)
Figure 23：Power on sequence of the VDD_3V3
Table 19: Electronic characteristic
Pin name Description Min. Typ. Max. Unit

VDD_EXT
VVDD_EXT Output voltage 1.7 1.8 1.9 V
IO Output current - - 50 mA
VDD_3V3
VVDD_3V3 Output voltage 3.2 3.3 VBAT-0.1 V
IO Output current - - 50 mA
4. RF Specifications
4.1 LTE RF Specifications
Table 20: Conducted transmission power
Frequency Power Min.

LTE-FDD B1 23dBm +/-2.7dB <-40dBm
NOTE
The max power is tested result single-tone in CAT-NB1. Multi-tone test results please refer to part
6.2.3F.3 for CAT-NB1.
Table 21: Maximum Power Reduction (MPR) for UE category NB1 Power Class 3
Modulation QPSK
Tone positions for 3
0-2 3-5 and 6-8 9-11
Tones allocation
MPR ≤ 0.5 dB 0 dB ≤ 0.5 dB
0-5 and 6-11
Tones allocation
MPR ≤ 1 dB ≤ 1 dB
0-11
Tones allocation
MPR ≤ 2 dB
Table 22: E-UTRA operating bands
E-UTRA UL Freq. DL Freq. Duplex Mode

1 1920 ~1980 MHz 2110 ~2170 MHz HD-FDD
3 1710 ~1785 MHz 1805 ~1880 MHz HD-FDD
5 824 ~849 MHz 869 ~894 MHz HD-FDD
8 880 ~915 MHz 925 ~960 MHz HD-FDD
20 832 ~862 MHz 791 ~821 MHz HD-FDD
28 703 ~748 MHz 758 ~803 MHz HD-FDD
Table 23: CAT-NB1 Reference sensitivity (QPSK)
Sensitivity dBm Sensitivity dBm Sensitivity dBm

(95% throughput (95% throughput (95% throughput
Operating band
3GPP required ) without with repetitions )
repetitions )
1,3,5,8,20,28 -108.2 -114 -131
4.2 LTE Antenna Design Guide
Users should connect antennas to SIM7020’s antenna pads through micro-strip line or other types of RF
trace and the trace impedance must be controlled in 50Ω.SIMCom recommends that the total insertion loss
between the antenna pads and antennas should meet the following requirements:
Table 24: Trace loss
Frequency Loss
700MHz-960MHz <0.5dB
1710MHz-2170MHz <0.9dB
2300MHz-2650MHz <1.2dB
To facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit
should be added. The following figure is the recommended circuit.
Figure 24: Antenna matching circuit (MAIN_ANT)
In above figure, the components R1,C1,C2 and R2 are used for antenna matching, the values of
components can only be achieved after the antenna tuning and usually provided by antenna vendor. By
default, the R1, R2 are 0Ω resistors, and the C1, C2 are reserved for tuning. The component D1 is a TVS
for ESD protection, and it is optional for users according to application environment.
The RF test connector is used for the conducted RF performance test, and should be placed as close as to
the module’s MAIN_ANT pin. The traces impedance between SIM7020 and antenna must be controlled in
50Ω.
Two TVS are recommended in the table below.
Table 25: Recommended TVS
Package Part Number Vender

0201 LXES03AAA1-154 Murata
0402 LXES15AAA1-153 Murata
4.3 RF traces note
4.3.1 RF traces layout
Keep the RF trace from module ant pin to antenna as short as possible
RF trace should be 50 Ω either on the top layer or in the inner layer
RF trace should be avoided right angle and sharp angle.
Put enough GND vias around RF traces.
RF trace should be far away from other high speed signal lines.
Figure 25: RF trace should be far away from other high speed signal lines
Avoiding the paroling rout of other system antennas nearly.

There should be some distance from The GND to the inner conductor of the SMA connector. It is better to
keep out all the layers from inner to the outer conductor.
Figure 26: The distance between GND to the inner conductor of SMA
GND pads around the ANT pad should not be hot pad to keep the GND complete, as shown in fig.27 Note2.
NOTE
1. Keep distance from GND to SMA connector throughout all PCB layers;
2. GND pads around the ANT pad should not be hot pad;
4.3.2 LTE ANT and other system ANT decoupling

Make sure the efficiency of LTE main ANT more than 40%
Keep the decoupling of LTE main ANT to WLAN ANT more than 15dB
Keep the decoupling of LTE main ANT to GNSS ANT more than 30dB
NOTE
The decoupling value can be provided by ANT adventure. More details can refer to the document[25].
5. Electrical Specifications
5.1 Absolute maximum ratings
Absolute maximum rating for digital and analog pins of SIM7020 are listed in the following table:
Table 26: Absolute maximum ratings
Parameter Min. Typ. Max. Unit

Voltage at VBAT -0.5 - 3.63 V
Voltage at USB_VBUS -0.5 - 5.50 V
Voltage at digital pins (GPIO, UART etc) -0.3 - 3.63 V
Voltage at digital pins (SIM) -0.3 - 3.63 V
Voltage at PWRKEY/RESET/RTC_EINT/RTC_GPIO0 -0.3 - 3.63 V
5.2 Operating conditions
Table 27: Recommended operating ratings

Voltage at VBAT 2.10 3.30 3.60 V
Voltage at USB_VBUS 2.50 5.0 5.25 V
Table 28: 1.8V Digital I/O characteristics*
Parameter Description Min. Typ. Max. Unit

VIH High-level input voltage 1.17 1.8 2.1 V
VIL Low-level input voltage -0.3 0 0.63 V
VOH High-level output voltage 1.35 - 1.8 V
VOL Low-level output voltage 0 - 0.45 V
High-level output current(no pull
IOH 4 mA
down resistor)
Low-level output current(no pull
IOL 4 mA
up resistor)
Input high leakage current (no

IIH 5 uA
pull down resistor)
Input low leakage current(no pull
IIL 5 uA
up resistor)
NOTE
These parameters are for digital interface pins, such as GPIOs (including NETLIGHT, STATUS,
SIM_DET), UART.
The operating temperature of SIM7020 is listed in the following table.
Table 29: Operating temperature

Normal operation temperature -30 25 80 ℃
Extended operation temperature* -40 25 85 ℃
Storage temperature -45 25 90 ℃
NOTE
The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the
normal operating temperature range and still within the extreme operating temperature range.
5.3 Operating Mode
5.3.1 Operating Mode Definition
The table below summarizes the various operating modes of SIM7020 product.
Table 30: Operating mode Definition
Mode Function
In this case, the current consumption of module will be reduced to
Sleep mode the minimal level and the module can still receive paging message
and SMS.
Normal operation
Software is active. Module is registered to the network, and the

Idle mode
module is ready to communicate.
Module is ready for data transmission, but no data is currently sent
Standby mode or received. In this case, power consumption depends on network
settings.
There is data transmission in progress. In this case, power
Data transmission mode consumption is related to network settings (e.g. power control
level); uplink/downlink data rates, etc.
AT command “AT+CFUN=0” AT+CSCLK=1 can be used to set the
module to a minimum functionality mode without removing the
power supply. In this mode, the RF part of the module will not work
Minimum functionality mode
and the SIM card will not be accessible, but the serial port and USB
port are NOT accessible. The power consumption in this mode is
lower than normal mode.
AT command “AT+CFUN=4” can be used to set the module to flight
mode without removing the power supply. In this mode, the RF part
Flight mode of the module will not work, but the serial port and USB port are still
accessible. The power consumption in this mode is lower than
normal mode.
In this mode, the module will be the least current consumption.
Meanwhile, all the output of the LDO and DCDC in the module will
be closed except the RTC power. And also all of the functions will
PSM mode
be unavailable except the RTC function. In PSM, RTC_GPIO0 will
change state from high to low. RTC_EINT or PWRKEY can
wake up the module.
Module will go into power off mode by sending the AT command
“AT+CPOWD” or pull down the PWRKEY pin, normally. In this
Power off mode mode the power management unit shuts down the power supply,
and software is not active. The serial port and USB are is not
accessible.
5.3.2 Sleep mode
In sleep mode, the current consumption of module will be reduced to the minimal level, and module can still
receive paging message and SMS.
Several hardware and software conditions must be satisfied together in order to let SIM7020 enter sleep
mode:
 USB condition:Connected USB can’t enter into sleep mode. So if module wants to enter into sleep
mode, it must disconnect the power supply for USB_VBUS first.
 Software condition: If module wants to enter into sleep mode, AT comment “AT+CSCLK=1” must be set
to close some clock in the module. If the value “AT+CSCLK” is “0”, module will never enter into sleep
mode.
 UART condition: If module wants to enter into sleep mode, AT comment “AT+CSCLK=1” must be set to
close some clock in the module. If the value “AT+CSCLK” is “0”, module will never enter into sleep
mode.
5.3.3 Minimum functionality mode and Flight mode
Minimum functionality mode ceases a majority function of the module, thus minimizing the power
consumption. This mode is set by the AT command which provides a choice of the functionality levels.
AT+CFUN=0: Minimum functionality

AT+CFUN=1: Full functionality (Default)
AT+CFUN=4: Flight mode
If SIM7020 has been set to minimum functionality mode, the RF function and SIM card function will be
closed. In this case, the serial port and USB are NOT accessible, but RF function and SIM card will be
unavailable.
If SIM7020 has been set to flight mode, the RF function will be closed. In this case, the serial port and USB
are still accessible, but RF function will be unavailable.
When SIM7020 is in minimum functionality or flight mode, it can return to full functionality by the AT
command “AT+CFUN=1”.
5.3.4 Power Saving Mode (PSM)
SIM7020 module can enter into PSM for reducing its power consumption. The mode is similar to power-off,
but the module remains registered on the network and there is no need to re-attach or re-establish the
network connections. So in PSM all the functions will be unavailable except the RTC function, module
cannot immediately respond users’ requests.
In PSM, RTC_GPIO0 will change state from low to high if RTC_EINT receive interrupt event.
Either of the following methods will wake up the module from PSM:
 Pulling PWRKEY or RTC_EINT to low level will wake up the module.
 When T3412 timer expires, the module will be automatically woken up.
VBAT
5ms
PWRKEY
(Input)
RTC_EINT
RTC_GPIO/VDD_EXT
Module Status
Module unavailable except the RTC function Active
Figure 27: PWRKEY or RTC_EINT wake up PSM sequence
NOTE
Power domain of RTC_GPIO0 and RTC_EINT is VBAT domain, please consider the electrical
characteristics when connecting to external IO (suggest to use trigger as low-active).
Table 31: RTC_GPIO0/RTC_EINT characteristics
IO Vih(min). Vih(max). Vil(min). Vil(max). VBAT

RTC_EINT 1.58 2.1 0 0.53 2.1(min)
RTC_EINT 2.73 3.6 0 0.92 3.6(max)
IO Voh(min). Voh(max). Vol(min). Vol(max). VBAT
RTC_GPIO0 1.79 - - 0.32 2.1(min)
RTC_GPIO0 3.09 - - 0.55 3.6(max)
5.3.5 Extended Mode DRX (e-DRX)
In idle or sleep mode, module and the network may negotiate over non-access stratum signaling the use of
extended mode DRX for reducing power consumption.
5.4 Current Consumption
The current consumption is listed in the table below.
Table 32: Current consumption on VBAT Pins (VBAT=3.3V)
Sleep/Idle Mode
LTE supply current Sleep mode Typical: 236uA (at+cfun=0)
(without USB connection) Idle mode Typical: 5.6mA
Power Saving Mode
PSM supply current PSM mode Typical: 3.4uA
eDRX
@PTW=10.24s, eDRX=20.48s, DRX=1.28s Typical ：
230uA
@PTW=10.24s, eDRX=20.48s, DRX=2.56s Typical ：
130uA
eDRX mode supply current @PTW=20.48s, eDRX=81.92s, DRX=2.56s Typical ：
（Tested in sleep mode） 95uA
@PTW=20.48s, eDRX=162.84s, DRX=2.56s Typical：
77.5uA
@PTW=40.96s, eDRX=655.36s, DRX=2.56s Typical：
69uA
LTE data
@23dbm Typical : 134mA
LTE-FDD B1 @10dbm Typical : 42mA
@0dbm Typical : 31 mA
5.5 ESD Notes
SIM7020 is sensitive to ESD in the process of storage, transporting, and assembling. When SIM7020 is
mounted on the users’ mother board, the ESD components should be placed beside the connectors which
human body may touch, such as SIM card holder, audio jacks, switches, keys, etc. The following table
shows the SIM7020 ESD measurement performance without any external ESD component.
Table 33: The ESD performance measurement table
Part Contact discharge(kV) Air discharge(kV)

GND（Shield） +/-6 +/-12
GND （RF） +/-6 +/-12
VBAT +/-5 +/-10
Antenna port +/-5 +/-10
Other PADs +/-3 +/-6
NOTE
Temperature: 25℃, Humidity: 45%, tested on SIMCOM-EVB.
6. SMT Production Guide
6.1 Top and Bottom View of SIM7020
Figure 28: Top and bottom view of SIM7020
6.2 Typical SMT Reflow Profile
SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only a generic
recommendation and should be adjusted to the specific application and manufacturing constraints.
Figure 29: The ramp-soak-spike reflow profile of SIM7020
NOTE
For more details about secondary SMT, please refer to the document [21].
6.3 Moisture Sensitivity Level (MSL)
SIM7020 is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033. If the
prescribed time limit is exceeded, users should bake modules for 192 hours in drying equipment (<5% RH)
at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not heat-resistant, and only can be baked at
45° C.
Table 34: Moisture Sensitivity Level and Floor Life
Moisture Sensitivity Floor Life (out of bag) at factory ambient≤30°C/60% RH or

Level (MSL) as stated
1 Unlimited at ≦30℃/85% RH
2 1 year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6 Mandatory bake before use. After bake, it must be reflowed within the
time limit specified on the label.
、
NOTE
IPC / JEDEC J-STD-033 standard must be followed for production and storage.
6.4 Baking Requirements
SIM7020 modules are vacuum packaged, and guaranteed for 6 months storage without opening or leakage
under the following conditions: the environment temperature is lower than 40℃, and the air humidity is less
than 90%.
If the condition meets one of the following ones shown below, the modules should be baked sufficiently
before re-flow soldering, and the baking condition is shown in table below; otherwise the module will be at
the risk of permanent damage during re-flow soldering.
If the vacuum package is broken or leakage;
If the vacuum package is opened after 6 months since it’s been packed;
If the vacuum package is opened within 6 months but out of its Floor Life at factory ambient≦30℃/60%RH
or as stated.
Table 35: Baking requirements
Baking temperature Moisture Time

40℃±5℃ <5% 192 hours
120℃±5℃ <5% 4 hours
、
NOTE
Care should be taken if that plastic tray is not heat-resistant, the modules should be taken out for
preheating, and otherwise the tray may be damaged by high-temperature heating.
7. Packaging
SIM7020 module support tray packaging (default packaging).
Figure 30: packaging diagram
Module tray drawing：
Figure 31: Tray drawing
Table 36: Tray size
Length（±3mm） Width（±3mm） Module number

242.0 161.0 50
Small carton drawing：
Figure 32: Small carton drawing
Table 37: Small Carton size
Length（±10mm） Width（±10mm） Height（±10mm） Module number

270 180 120 50*20=1000
Big carton drawing：
Figure 33: Big carton drawing
Table 38: Big Carton size
Length（±10mm） Width（±10mm） Height（±10mm） Module number

380 280 280 1000*4=4000
8. Appendix
8.1 Related Documents
Table 39: Related Documents
NO. Title Description

SIM7020 Series_AT Command
[1] AT Command Manual
Manual_V1.xx
Digital cellular telecommunications (Phase 2+); AT command
[2] GSM 07.07
set for GSM Mobile Equipment (ME)
[3] GSM 07.10 Support GSM 07.10 multiplexing protocol
Digital cellular telecommunications (Phase 2+); Use of Data
Terminal Equipment – Data Circuit terminating Equipment
[4] GSM 07.05
(DTE – DCE) interface for Short Message Service (SMS) and
Cell Broadcast Service (CBS)
Digital cellular telecommunications system (Phase 2+);
[5] GSM 11.14 Specification of the SIM Application Toolkit for the Subscriber
Identity Module – Mobile Equipment (SIM – ME) interface
[6] GSM 11.11 Specification of the Subscriber Identity Module – Mobile
Equipment (SIM – ME) interface
[7] GSM 03.38
Alphabets and language-specific information
Digital cellular telecommunications system (Phase 2) ；
[8] GSM 11.10 Mobile Station (MS) conformance specification ； Part 1:
Conformance specification
Digital cellular telecommunications system (Release 5);
[9] 3GPP TS 51.010-1
Mobile Station (MS) conformance specification
Electromagnetic Compatibility (EMC) for mobile terminals and
[10] 3GPP TS 34.124
ancillary equipment.
Electromagnetic Compatibility (EMC) for mobile terminals and
[11] 3GPP TS 34.121
ancillary equipment.
Technical Specification Group Radio Access Network;
[12] 3GPP TS 34.123-1 Terminal conformance specification; Radio transmission and
reception (FDD)
User Equipment (UE) conformance specification; Part 3:
[13] 3GPP TS 34.123-3
Abstract Test Suites.
Electromagnetic compatibility and Radio spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for
IMT-2000. Third Generation cellular networks; Part 2:
[14] EN 301 908-02 V2.2.1
Harmonized EN for IMT-2000, CDMA Direct Spread
(UTRA FDD) (UE) covering essential requirements of article
3.2 of the R&TTE Directive
Electromagnetic compatibility and Radio Spectrum Matters
[15] EN 301 489-24 V1.2.1 (ERM); Electromagnetic Compatibility (EMC) standard for
radio equipment and services; Part 24: Specific conditions for
IMT-2000 CDMA Direct Spread (UTRA) for Mobile and

portable (UE) radio and ancillary equipment
[16] IEC/EN60950-1(2001) Safety of information technology equipment (2000)
Digital cellular telecommunications system (Release 5);
[17] 3GPP TS 51.010-1
Mobile Station (MS) conformance specification
[18] GCF-CC V3.23.1 Global Certification Forum - Certification Criteria
Directive of the European Parliament and of the Council of 27
January 2003 on the restriction of the use of certain
[19] 2002/95/EC
hazardous substances in electrical and electronic equipment
(RoHS)
Module Module secondary SMT Guidelines
[20]
secondary-SMT-UGD-V1.xx
[21] SIM7X00 This document describes how to use UART interface of
Series_UART_Application SIMCom modules.
Note_V1.xx
[22] ETSI EN 301 908-13 IMT cellular networks; Harmonized EN covering the
(ETSI TS 136521-1 R13.4.0) essential requirements of article 3.2 of the R&TTE Directive;
Part 13
Antenna design guidelines for Antenna design guidelines for diversity receiver system
[23]
diversity receiver system
[24] SIM7020 Series_Low Power Sleep Mode Application Note
Mode_ Application Note_V1.xx
8.2 Terms and Abbreviations
Table 40: Terms and Abbreviations
Abbreviation Description
ADC Analog-to-Digital Converter
ARP Antenna Reference Point
BER Bit Error Rate
BD BeiDou
BTS Base Transceiver Station
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
DRX Discontinuous Reception
DSP Digital Signal Processor
DTE Data Terminal Equipment (typically computer, terminal, printer)
DTR Data Terminal Ready
DTX Discontinuous Transmission
EFR Enhanced Full Rate
EGSM Enhanced GSM
EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
ETS European Telecommunication Standard
EVDO Evolution Data Only
FCC Federal Communications Commission (U.S.)
FD SIM fix dialing phonebook
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GNSS Global Navigation Satellite System
GPRS General Packet Radio Service
GPS Global Positioning System
GSM Global Standard for Mobile Communications
HR Half Rate
HSPA High Speed Packet Access
I2C Inter-Integrated Circuit
IMEI International Mobile Equipment Identity
LTE Long Term Evolution
MO Mobile Originated
MS Mobile Station (GSM engine), also referred to as TE
MT Mobile Terminated
NMEA National Marine Electronics Association
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCS Personal Communication System, also referred to as GSM 1900
RF Radio Frequency
RMS Root Mean Square (value)
RTC Real Time Clock
SIM Subscriber Identification Module
SMS Short Message Service
SMPS Switched-mode power supply
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
TX Transmit Direction
UART Universal Asynchronous Receiver & Transmitter
VSWR Voltage Standing Wave Ratio
SM SIM phonebook
NC Not connect
EDGE Enhanced data rates for GSM evolution
HSDPA High Speed Downlink Packet Access
HSUPA High Speed Uplink Packet Access
ZIF Zero intermediate frequency
WCDMA Wideband Code Division Multiple Access
VCTCXO Voltage control temperature-compensated crystal oscillator
SIM Universal subscriber identity module
UMTS Universal mobile telecommunications system
UART Universal asynchronous receiver transmitter
PSM Power save mode
8.3 Safety Caution
Table 41: Safety Caution
Marks Requirements
When in a hospital or other health care facility, observe the restrictions about the use
of mobiles. Switch the cellular terminal or mobile off, medical equipment may be
sensitive and not operate normally due to RF energy interference.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden to prevent
interference with communication systems. Forgetting to think much of these
instructions may impact the flight safety, or offend local legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any
electrical equipment in potentially explosive atmospheres can constitute a safety
hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. RF interference can occur if it is used close to TV sets, radios,
computers or other electric equipment.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when
driving a vehicle, unless it is securely mounted in a holder for hands free operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
GSM cellular terminals or mobiles operate over radio frequency signals and cellular
networks and cannot be guaranteed to connect in all conditions, especially with a
mobile fee or an invalid SIM card. While you are in this condition and need emergent
help, please remember to use emergency calls. In order to make or receive calls, the
cellular terminal or mobile must be switched on and in a service area with adequate
cellular signal strength.
Some networks do not allow for emergency call if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate
those features before you can make an emergency call.
Also, some networks require that a valid SIM card be properly inserted in the cellular
terminal or mobile.

SIM7020 Series Hardware Design - V1.03

Uploaded by

Copyright:

Available Formats

SIM7020 Series Hardware Design - V1.03

Uploaded by

Document Information

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

SIM7020 Series Hardware Design - V1.03

Uploaded by

Copyright:

Available Formats

SIM7020 Series

SIMCom Wireless Solutions Limited

Document Title: SIM7020 Series Hardware Design

SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS TO SUPPORT THE

THIS DOCUMENT CONTAINS THE PROPRIETARY TECHNICAL INFORMATION WHICH IS THE

SIMCom Wireless Solutions Limited

For more information, please visit:

For technical support, or to report documentation errors, please visit:

Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2020

Date Version Description of change Author

Update figure 1,9,20,21

Version History .....................................................................................................................................3

Table Index ............................................................................................................................................6

Figure Index ..........................................................................................................................................8

2. Package Information ......................................................................................................................12

3. Interface Application ......................................................................................................................19

4.3 RF traces note ............................................................................................................................... 41

5. Electrical Specifications ................................................................................................................43

6. SMT Production Guide...................................................................................................................50

Table 1: SIM7020 frequency bands and air interface .............................................................................................. 9

Table 41: Safety Caution ....................................................................................................................................... 60

Figure 1: SIM7020 block diagram .................................................................................................................... 10

1.1 Product Outline

Table 1: SIM7020 frequency bands and air interface

1.2 Hardware Interface Overview

The interfaces are described in detail in the next chapters include:

1.3 Hardware Block Diagram

Figure 1: SIM7020 block diagram

1.4 Functional Overview

Table 2: General features

2.1 Pin Assignment Overview

UART1_DTR 6 SIM7020 28 RESET

UART1_RI 7 TOP VIEW 27 GND

Figure 2: Pin assignment overview

Table 3: Pin definition

Pin No. Pin Name Pin No. Pin Name

2.2 Pin Description

Table 5: Pin description

UART1_RTS 3 DI，PU Request to send

2.3 Mechanical Information

The following figure shows the package outline drawing of SIM7020.

Figure 3: Dimensions (Unit: mm)

2.4 Footprint Recommendation

Figure 4: Footprint recommendation (Unit: mm)

2.5 Paste mask Recommendation

The recommended thickness of stencil foil is 0.15mm.

Figure 5: Paste mask SMT stencil footprint outline

3.1 Power Supply

Table 6: VBAT pins electronic characteristic

Symbol Description Min. Typ. Max. Unit

3.2 Power Supply Design Guide

Figure 6: Recommended power supply reference design circuit

Table 7: The path of the power supply

N0. VBAT power supply The path of the power

2 、 voltage limiting circuit: VDET+PMOSFET ： VDET IC Seiko S-1000C33-I4T1U ，

3、LDO DC： TI TPS7A92；

4、VDET+PMOS&LDO & diode：

Table 8：VDET+PMOS&LDO & diode：

Comprehensive evaluation: VDET+PMOS is recommended.