MTCH1010

MTCH1010 Data Sheet

Description
The Microchip MTCH1010 Touch Controller with digital output provides a simple way to add water tolerant touch
detection or proximity sensing to any application. This device implements one capacitive sensor with active guarding
capability. Sensitivity, response time, and oversampling can be configured via CFG input pins at run time. The
MTCH1010 uses advanced optimization algorithms to actively suppress noise from the signal to achieve reliable
touch detection.
The MTCH1010 provides one capacitive touch/proximity detection sensor which can work through plastic, wood, or
even metal front panels with Microchip’s proprietary Metal Over Capacitive (MOC) technology. It also supports a wide
range of conductive materials as sensors, such as copper pad on PCB, silver ink, PEDOT or carbon printing on
plastic film, Indium Tin Oxide (ITO) pad, wire/cable, etc. An open-drain active-low output will communicate the state
of the sensor to a host microcontroller or drive an indication LED.

Features
• Capacitive Touch Sensing
• High Signal to Noise Ratio (SNR)
• Adjustable Sensitivity
• Multi-Stage Active Noise Suppression Filters
• Automatic Environmental Compensation
• Water Tolerant Touch
• Support Wide Range of Sensor Shapes and Sizes
• Touch Indication by OUT Pin Level
• Detect Hysteresis
• Flexible Low-Power Mode
• Brown-Out Protection
• Operating Voltage Range:
– 2V to 5.5V
• Operating Temperature:
– - 40°C to +105°C

Typical Application
• Light and Internet of Things (IoT) Switches
• Power Buttons
• White Goods and Appliance
• Office Equipment
• Toys
• Display and Keypad Back-Lighting Activation by Proximity
• Presence Detection

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 1

 MTCH1010

Table of Contents
Description..................................................................................................................................................... 1

Features......................................................................................................................................................... 1

Typical Application..........................................................................................................................................1

1. Pin Diagram ........................................................................................................................................... 4

2. Configuration...........................................................................................................................................5
2.1. CFG0 – Response Time...............................................................................................................5
2.2. CFG1 – Oversampling per Touch Scan Cycle..............................................................................5
2.3. CFG2 – Touch Sensitivity............................................................................................................. 6
2.4. Further Preset Configurations...................................................................................................... 6

3. Sensor.....................................................................................................................................................8
3.1. CH0 – the Touch Electrode.......................................................................................................... 8
3.2. SHIELD – Driven Shield............................................................................................................... 8

4. Output..................................................................................................................................................... 9
4.1. OUT0............................................................................................................................................9

5. Operation.............................................................................................................................................. 10
5.1. Power On / Reset....................................................................................................................... 10
5.2. Run Time....................................................................................................................................10

6. Example Circuit..................................................................................................................................... 11

7. Response Time..................................................................................................................................... 12
7.1. Definitions...................................................................................................................................12
7.2. Measurement Time.....................................................................................................................12

8. Power Consumption..............................................................................................................................14

9. Electrical Specification.......................................................................................................................... 15
9.1. Disclaimer...................................................................................................................................15
9.2. Absolute Maximum Ratings........................................................................................................15
9.3. General Operating Ratings ........................................................................................................15
9.4. BOD and POR Characteristics................................................................................................... 15
9.5. I/O Pin Characteristics................................................................................................................16

10. Ordering Information............................................................................................................................. 17

10.1. Product Information.................................................................................................................... 17

11. Package Drawing ................................................................................................................................. 18

11.1. 8-Pin SOIC150........................................................................................................................... 18

12. Appendix .............................................................................................................................................. 23

12.1. Static Input Voltages...................................................................................................................23
12.2. Dynamic Input Voltages..............................................................................................................24

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 2

 MTCH1010

13. Conclusion ........................................................................................................................................... 25

14. Revision History.................................................................................................................................... 26

The Microchip Website.................................................................................................................................27

Product Change Notification Service............................................................................................................27

Customer Support........................................................................................................................................ 27

Product Identification System.......................................................................................................................28

Microchip Devices Code Protection Feature................................................................................................ 28

Legal Notice................................................................................................................................................. 28

Trademarks.................................................................................................................................................. 29

Quality Management System....................................................................................................................... 30

Worldwide Sales and Service.......................................................................................................................31

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 3

 MTCH1010
Pin Diagram

1. Pin Diagram
Figure 1-1. 8-Pin SOIC

Name 8-Lead SOIC Usage

VDD 1 Power Supply (+)
CH0 2 Sensor Electrode Measurement
SHIELD 3 Shield Electrode Output Driver
OUT0 4 Touch Indication
CFG0 5 Response Time
CFG1 6 Oversampling
CFG2 7 Sensitivity
GND 8 Power Supply (-)

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 4

 MTCH1010
Configuration

2. Configuration
Three configuration input pins are provided on the MTCH1010 and each one controls one of the following
configuration parameters:
• Response Time
• Oversampling
• Sensitivity
Inputs are set by applying a voltage level to the respective CFG pin. Options how to generate these input voltages
are provided in the Appendix.
At power-up, the configuration inputs are read by the MTCH1010 and sensor parameters are set accordingly. During
run time, the inputs are measured once every two seconds and configuration changes are applied at subsequent
sensor measurements. Each input must be in the range of 0V to VDD. CFG0 and CFG1 are split into four bands
providing four options for each parameter and CFG2 provides a continuous adjustment of sensitivity between 0V and
VDD.

Input Range Configuration Selection

0V to ¼ VDD A
¼ VDD to ½ VDD B
½ VDD to ¾ VDD C
¾ VDD to VDD D

2.1 CFG0 – Response Time

CFG0 selects a response time of up to 300 ms for the target application. Measurement and sleep cycles are
adjusted on chip depending on the oversampling configuration to achieve this response time. This control allows the
application designer to balance touch responsiveness against power consumption. Increasing the target response
time reduces power consumption as the device spends a higher proportion of time in Sleep mode. Reducing the
response time provides a faster indication of touch contact.
Note:  The configuration input is in non-ascending order. Settings expected in low-power applications are tied
directly to VDD or GND as this removes the necessity for a resistive divider bridge and associated bias current.
To achieve the lowest power configurations, the longest response times are selected at CFG options A (300 ms) and
D (100 ms).

Configuration Response Time (ms)

A 300
B 0 (minimum)
C 50
D 100

2.2 CFG1 – Oversampling per Touch Scan Cycle

CFG1 selects the number of samples to take on each measurement cycle. Increased sampling provides more stable
sensor operation and better tolerance for electrical noise, but at the cost of increased power consumption and
response time.
Note:  As mentioned above, configuration input is in non-ascending order to avoid the necessity of resistive divider
bias current. Lowest power option X8 sampling is selected by CFG1 = ‘A’, while the next lowest option X16 sampling
is selected by CFG1 = ‘D’.

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 5

 MTCH1010
Configuration

Configuration # Samples
A 8
B 64
C 32
D 16

2.3 CFG2 – Touch Sensitivity

CFG2 determines the sensitivity of the touch sensor. A thicker touch cover, smaller sensor or nearby ground
referenced conductors require higher sensitivity settings. Sensitivity does not affect power consumption or
measurement time, except in the case of a high setting which may consume extra power by triggering unnecessary
wake-up events.
Note:  Sensitivity input CFG2 is implemented as a full-scale linear input.
It is recommended to match higher sensitivity settings with higher oversampling for robust touch sensing.

Input Range Sensitivity

0V to VDD • Lowest at 0V
• Increases with increasing Voltage at CFG2
• Highest at VDD

2.4 Further Preset Configurations

Other touch parameters are pre-set to provide reliable and consistent operation in a wide range of applications.
Further details on touch parameters can be found in the Touch library User Guide.

2.4.1 Touch Detection

Setting Value Description

Detect Hysteresis: 12.5% Touch will be reported as released after the signal
falls 12.5% below sensitivity setting.
Detect Count-In: 4 Touch is reported after confirmations scans
confirmed the touched status four times in a row.
These confirmation scans are executed right after the
initial touch status detection.
This suppresses detections generated by electrical
noise or from quick brushes of an object and fosters
robust touch operation.

2.4.2 Anti-Touch Recalibration

Anti-touch recalibration always provides the intended touch sensitivity.

An anti-touch occurs if a button is pressed longer than the maximum duration in the moment of
release. Anti-touch re-calibration ensures that the button is capable of detection at the following
touch.

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 6

 MTCH1010
Configuration

2.4.3 Maximum on Recalibration

Setting Value Description

Maximum on Duration: 8s After eight seconds of a detected touch, a calibration
will be performed, thus releasing the touch.

2.4.4 Sensor Drift

The MTCH1010 provides robust touch sensing by considering environmental changes (such as temperature,
humidity, etc.). Touch raw data signals might and will drift over time and it is crucial that drift is compensated,
otherwise, false detections, non-detections, and sensitivity shifts might occur.
Drift compensation is performed on chip the MTCH1010 and no host intervention of any kind is needed.
Figure 2-1. Drift Compensation

Signal
Hysteresis

Threshold
Reference

Output

2.4.5 Frequency Hop with Auto-Tune

The MTCH1010 provides robust touch sensing by considering electrical noise. Built in are latest noise avoidance
technologies such as frequency hopping with auto-tune. As a result, the MTCH1010 will proactively adopt the touch
sensing frequency according to the noise scenario during run time. No host intervention of any kind is needed.

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 7

 MTCH1010
Sensor

3. Sensor

3.1 CH0 – the Touch Electrode

CH0 is the touch sensor input pin, which needs to be connected to the sensor electrode via a series resistor, to
reduce EMI and EMC. The series resistor may be 10 kΩ to 200 kΩ, depending on the sensor capacitance and
desired level of EMC performance.
Refer to the Microchip Capacitive Touch Design Guide – AN2934 for further details.

3.2 SHIELD – Driven Shield

The MTCH1010 features an active shield (Driven shield) signal to enhance touch sensitivity and robustness. Driven
shield benefits:
• Reduced sensor load
• A rear shield prevents touch detection behind
• Provides water tolerant touch
• Increases sensitivity
• Shields against electrical noise
Refer to the Microchip Capacitive Touch Design Guide – AN2934 for further details and layout considerations for
Driven Shield usage.

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 8

 MTCH1010
Output

4. Output

4.1 OUT0
OUT0 provides indication of the touch detection state of the sensor. This is an open-drain output requiring an external
pull-up to VDD. The pin is in a high-impedance state, while the touch sensor is not in detect, switching to output low
when the sensor is touched.

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 9

 MTCH1010
Operation

5. Operation

5.1 Power On / Reset

Configuration inputs CFG0, CFG1, CFG2 are read during the device initialization and the corresponding parameters
are loaded into the run-time memory. An internal timer is configured to wake up the device at the configured cycle
interval.

5.2 Run Time

Sensor Measurement
Measurement of sensor capacitance using Capacitive Voltage Divider method (for further details, see Application
Note 1478 Sensing method Capacitive Voltage Divider). Optional Shield Output driver (SHIELD) provides increased
sensitivity, reduction of sensor capacitive load, and shielding of sensor electrode from electrical noise as well as
water tolerance.
Accumulation of 8/16/32/64 pairs of measurements according to configured oversampling (CFG1).
Post Processing
• Frequency Hop Auto-tune
– Signal variance check
– Frequency adjustment
• Event Processing
– Power-on reference calibration timer-based reference drift
– Touch detection
– Anti-touch recalibration
– Maximum on tecalibration
Sleep
Device enters Sleep mode until woken by the cycle timer.
Configuration
Every two seconds, the MTCH1010 re-reads the input configuration pins and updates the measurement/timing
configuration accordingly.

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 10

 MTCH1010
Example Circuit

6. Example Circuit
Figure 6-1. Example Circuit
2

8
3

dd

nd
G
V

Example:
• CFG0 is connected to GND and so is read as ‘A’, setting the response time to its longest duration of 300 ms
• CFG1 is connected to VDD, read as ‘D’ and selects the number of samples at 16
• CFG2 is connected to Vh1, or (2/3) VDD.
In the example, the resistor ladder used to generate the input voltages for CFG1 and CFG2 will result in a bias
current of 11 uA /17 uA pending VDD of 3.3V or 5V.
See Appendix for further guidance on generation static or dynamic configuration voltages.

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 11

 MTCH1010
Response Time

7. Response Time

7.1 Definitions
Response time Maximum or worst-case ‘delay’ between physical contact until touch reporting on OUT
That time is selected via CFG0.

Measurement time Total time required to acquire (including oversampling) and post process touch signals
Sleep time The time the device sleeps between measurements
Cycle time Time between start of one measurement to start of next measurement – it includes:
• Measurement time
• Sleep time

Figure 7-1. Timing Diagram

Measurement Sleep time

time

Cycle time

7.2 Measurement Time

Measurement time is dependent on oversampling:

Number of samples (CFG1) Measurement time

8 1 ms
16 1.9 ms
32 3.4 ms
64 6.8 ms

To meet the response time configuration, the MTCH1010 calculates and executes the cycle time according to the
oversampling selection:

Power/Sleep cycle: 4 x Measurement time + 2 x Cycle time

Free-running measurements (GFG0 = B): 5 x Measurement time

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 12

 MTCH1010
Response Time

Response time Cycle times executed to achieve response times (ms)

setting CFG0 CFG1 X8 CFG1 X16 CFG1 X32 CFG1 X64
(ms) oversampling oversampling oversampling oversampling
Free run (1) (1.9) (3.4) (6.8)
50 23 21 18 12
100 48 46 43 37
300 148 146 143 137

Keep in mind that the CFG1 response time assumes that physical touch happens right at the beginning of sleep, from
a timing perspective worst-case scenario. The table below reflects the expected minimum, average, and maximum
values for response times under standard conditions.

Min / AVG / Max resulting response time (ms)

Response
time setting CFG1 X16 CFG1 X32 CFG1
CFG0 (ms) CFG1 X8 oversampling
oversampling oversampling X64 oversampling

Min Avg Max Min Avg Max Min Avg Max Min Avg max
Free run 7 11 21 40
50 27 39 50 29 40 50 32 41 50 39 45 50
100 52 76 100 54 77 100 57 79 100 64 82 100
300 152 226 300 154 227 300 157 229 300 164 232 300

Figure 7-2. Response Time

CFG0 - max response time

avg response time
min response time

A A B
A: measurement time
B: touch integrity checks
Note:  During high noise, the response times may exceed the configured target, due to the automatic adjustment of
oversampling period by frequency hopping. In the worst-case frequency selection, the maximum response time may
be extended by 30%.

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 13

 MTCH1010
Power Consumption

8. Power Consumption
Average power consumption in uA by Oversampling, VDD, Response Time.

IDD (uA) / 8x Oversampling

Response CFG1 (ms) VDD = 3.3V VDD = 5V
Free Run 1571 2410
50 69.5 111
100 35.6 55
300 12.7 20.3

IDD (uA) / 16x Oversampling

Response CFG1 (ms) VDD = 3.3V VDD = 5V
Free Run 1580 2381
50 133 222.5
100 63 105.5
300 21.5 33.7

IDD (uA) / 32x Oversampling

Response CFG1 (ms) VDD = 3.3V VDD = 5V
Free Run 1583 2417
50 301.5 500.5
100 124 211
300 39.5 66.5

IDD (uA) / 64x Oversampling

Response CFG1 (ms) VDD = 3.3V VDD = 5V
Free Run 1583.5 2446.5
50 869 1466
100 285 499
300 80.5 159

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 14

 MTCH1010
Electrical Specification

9. Electrical Specification

9.1 Disclaimer
All typical values are measured at T = 25°C and VDD = 3V, unless otherwise specified. All minimum and maximum
values are valid across operating temperature and voltage unless otherwise specified.

9.2 Absolute Maximum Ratings

Stresses beyond those listed in this section may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or other conditions beyond those indicated in the operational sections
of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Absolute Maximum Ratings

Symbol Description Min Max Unit

Ambient temperature under bias -40 +105 °C
TStorage Storage temperature -65 +150 °C
VPin Pin voltage with respect to GND -0.5 VDD + 0.5 V
IPin I/O pin sink/source current -40 +40 mA
Maximum output current -15 15 mA

9.3 General Operating Ratings

The device must operate within the ratings listed in this section for all other electrical characteristics and typical
characteristics of the device to be valid.
Table 9-1. General Operating Conditions

Symbol Description Condition Min. Max. Unit

VDD Operating supply voltage — 2 5.5 V
T Operating temperature range (1) Standard temperature range -40 105 °C

Note: 
1. Refer to the device ordering codes for the device temperature range.

9.4 BOD and POR Characteristics

Table 9-2. Power Supply Characteristics

Symbol Description Condition Min. Typ. Max. Unit

SRON Power-on Slope — — — 100 V/ms

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 15

 MTCH1010
Electrical Specification

Table 9-3. Power-On Reset (POR) Characteristics

Symbol Description Condition Min. Typ. Max. Unit

VPOR POR threshold voltage on VDD falling VDD falls/rises at 0.5 V/ms or slower 0.8 — 1.6 V

POR threshold voltage on VDD rising 1.4 — 1.8

Table 9-4. Brown-Out Detection (BOD) Characteristics

Symbol Description Condition Min. Typ. Max. Unit

VBOD BOD triggering level (falling/rising) — 1.7 1.8 2.0 V

VHYS Hysteresis — — 25 — mV

TBOD Detection time Continuous — 7 — µs

Sampled, 1 kHz — 1 — ms

Sampled, 125 Hz — 8 —

TStart Start-up time Time from enable to ready — 40 — µs

9.5 I/O Pin Characteristics

Table 9-5. I/O Pin Characteristics (TA = [-40, 105]°C, VDD = [2.7, 5.5]V Unless Otherwise Stated)

Symbol Description Condition Min. Typ. Max. Unit

VOL I/O pin drive strength VDD = 3.0V, IOL = 7.5 mA — — 0.6 V

VDD = 5.0V, IOL = 15 mA — — 1

VOH I/O pin drive strength VDD = 3.0V, IOH = 7.5 mA 2.4 — — V

VDD = 5.0V, IOH = 15 mA 4 — —

VIL2 Input low-voltage on CFG1 pin as I/O — -0.2 — 0.3 × VDD V

VIH2 Input high-voltage on CFG1 pin as I/O — 0.7 × VDD — VDD + 0.2V V

VOL2 I/O pin drive strength on CFG1 pin as I/O VDD = 3.0V, IOL = 0.25 mA — — 0.6 V

VDD = 5.0V, IOL = 0.5 mA — — 1

VOH2 I/O pin drive strength on CFG1 pin as I/O VDD = 3.0V, IOH = 0.25 mA 2.4 — — V

VDD = 5.0V, IOH = 0.5 mA 4 — —

tRISE Rise time VDD = 3.0V, load = 20 pF — 2.5 — ns

VDD = 5.0V, load = 20 pF — 1.5 —

tFALL Fall time VDD = 3.0V, load = 20 pF — 2.0 — ns

VDD = 5.0V, load = 20 pF — 1.3 —

CPIN I/O pin capacitance except CH0, SHIELD, OUT0, and CFG0 — — 3 — pF
pins

CPIN I/O pin capacitance on CH0, SHIELD, OUT0, and CFG0 pins — — 10 — pF

RP Pull-up resistor — 20 35 50 kΩ

Note: 
1. Pin group x (Px[7:0]). The combined continuous sink/source current for all I/O ports should not exceed the
limits.

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 16

 MTCH1010
Ordering Information

10. Ordering Information

Available ordering options can be found by:
• Clicking on one of the following product page links:
– MTCH1010 Product Page
– Searching by product name at microchipdirect.com
– Contacting your local sales representative

10.1 Product Information

Ordering Code(1) Supply Voltage Package Type(2) Packing Media Temperature Range
MTCH1010-V/SN 2V – 5.5V SOIC150 Tube -40°C +105°C
MTCH1010T-V/SN 2V – 5.5V SOIC150 Tape & Reel -40°C +105°C

Notes: 
1. PB-free packaging complies to the European Directive for Restriction Hazardous Substances (RoHS
directive). Also Halide free and fully Green.
2. Package outline drawings can be found in the Package Drawing chapter.

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 17

 MTCH1010
Package Drawing

11. Package Drawing

11.1 8-Pin SOIC150

Figure 11-1. Package Marking Information

Legend:

XX...X Device name

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code

e3 Pb-free JEDEC® designator for Matte Tin (Sn)*This package is Pb-free. The Pb-free
JEDEC designator
* e3 can be found on the outer packaging for this package.

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 18

 MTCH1010
Package Drawing

8-Lead Plastic Small Outline – Narrow, 3.90 mm (.150 In.) Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

2X
0.10 C A–B
D
A D
NOTE 5
N

E
2
E1
2

E1 E

NOTE 1 1 2

e NX b
B 0.25 C A–B D
NOTE 5
TOP VIEW
0.10 C

C A A2
SEATING
PLANE 8X
0.10 C
A1 SIDE VIEW

h
R0.13
h
R0.13
H 0.23

L
SEE VIEW C
(L1)
VIEW A–A

VIEW C
Microchip Technology Drawing No. C04-057-SWB Rev E Sheet 1 of 2

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 19

 MTCH1010
Package Drawing

8-Lead Plastic Small Outline – Narrow, 3.90 mm (.150 In.) Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 1.27 BSC
Overall Height A - - 1.75
Molded Package Thickness A2 1.25 - -
Standoff § A1 0.10 - 0.25
Overall Width E 6.00 BSC
Molded Package Width E1 3.90 BSC
Overall Length D 4.90 BSC
Chamfer (Optional) h 0.25 - 0.50
Foot Length L 0.40 - 1.27
Footprint L1 1.04 REF
Foot Angle 0° - 8°
Lead Thickness c 0.17 - 0.25
Lead Width b 0.31 - 0.51
Mold Draft Angle Top 5° - 15°
Mold Draft Angle Bottom 5° - 15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.

Microchip Technology Drawing No. C04-057-SWB Rev E Sheet 2 of 2

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 20

 MTCH1010
Package Drawing

8-Lead Plastic Small Outline – Narrow, 3.90 mm (.150 In.) Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

SILK SCREEN

Y1

X1
E

RECOMMENDED LAND PATTERN

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Contact Pitch E 1.27 BSC
Contact Pad Spacing C 5.40
Contact Pad Width (X8) X1 0.60
Contact Pad Length (X8) Y1 1.55

Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-2057-SWB Rev E

Table 11-1. Device and Package Maximum Weight

Maximum Weight 78 mg

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 21

 MTCH1010
Package Drawing

Table 11-2. Package Characteristics

Moisture Sensitivity Level MSL3

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 22

 MTCH1010
Appendix

12. Appendix

12.1 Static Input Voltages

These methods will configure the MTCH1010 and provide a fixed behavior at power-up and run time.

12.1.1 Resistor Ladder

VDD

R1

CFGx

R2

GND

Note: Both R1 and R2 are recommended

to be greater than 100K for lower power
consumption

12.1.2 Direct Connect to VDD or GND

Use a series resistor in case a setting is set by connecting a CFGx pin to VDD or GND.
VDD

R1 10K

CFGx CFGx

R2 10K

GND
The pull-up/pull-down resistor is a precautionary recommendation, as MTCH1010 will not pull the CFGx neither to the
VDD nor to the GND during the operation.

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 23

 MTCH1010
Appendix

12.2 Dynamic Input Voltages

These methods enable flexible settings during run time or development. They are controlled by the human developer
or the host IC.

12.2.1 Potentiometer
A useful method during development; this method is also used on the MTCH1010 DevKit.
VDD

R2
R1 CFGx
10K

GND
12.2.2 DAC Controlled by Host
This is advised if settings will dynamically change during run time.

HOS T
R2
DAC CFGx
10K

12.2.3 PWM Controlled by Host

This is advised if settings will dynamically change during run time.

HOS T
R
P WM CFGx

GND

Note: Refer to Application Note 'Using

PWM to Generate Analog Outpout (AN538)'
for details about how to choose appropriate R
and C values

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 24

 MTCH1010
Conclusion

13. Conclusion
The MTCH1010 offers the performance and robust touch experience of Microchips library-based touch solutions. The
MTCH1010 is easy to use and to configure, and it is the first of a growing family of devices. Find the latest in Touch
from Microchip on www.microchip.com/touch.

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 25

 MTCH1010
Revision History

14. Revision History

Revision Date Description
A 04/2021 Initial document release

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 26

 MTCH1010

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seminars and events, listings of Microchip sales offices, distributors and factory representatives

Product Change Notification Service

Microchip’s product change notification service helps keep customers current on Microchip products. Subscribers will
receive email notification whenever there are changes, updates, revisions or errata related to a specified product
family or development tool of interest.
To register, go to www.microchip.com/pcn and follow the registration instructions.

Customer Support
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Embedded Solutions Engineer (ESE)
• Technical Support
Customers should contact their distributor, representative or ESE for support. Local sales offices are also available to
help customers. A listing of sales offices and locations is included in this document.
Technical support is available through the website at: www.microchip.com/support

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 27

 MTCH1010

Product Identification System

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. [X](1) –X /XX

Device Tape Temperature Package
and Reel Range
Device: Device A, Feature A, (Package A) Device B, Feature B, (Package B)
Tape & Reel Option: Blank = Tube
T = Tape & Reel
Temperature Range: I = -40°C to +85°C (Industrial)
E = -40°C to +125°C (Extended)
Package: AA = Package AA
BB = Package BB

Examples:
• MCPXXXXXAT-E/AA: Tape and Reel, Extended temperature, XAA package
• MCPXXXXXBT-E/BB: Tape and Reel Extended temperature, XBB package
Notes: 
1. Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering
purposes and is not printed on the device package. Check with your Microchip Sales Office for package
availability with the Tape and Reel option.
2. Small form-factor packaging options may be available. Please check www.microchip.com/packaging for small-
form factor package availability, or contact your local Sales Office.

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specifications contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is secure when used in the intended manner and under normal
conditions.
• There are dishonest and possibly illegal methods being used in attempts to breach the code protection features
of the Microchip devices. We believe that these methods require using the Microchip products in a manner
outside the operating specifications contained in Microchip’s Data Sheets. Attempts to breach these code
protection features, most likely, cannot be accomplished without violating Microchip’s intellectual property rights.
• Microchip is willing to work with any customer who is concerned about the integrity of its code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code
protection does not mean that we are guaranteeing the product is “unbreakable.” Code protection is constantly
evolving. We at Microchip are committed to continuously improving the code protection features of our products.
Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act.
If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue
for relief under that Act.

Legal Notice
Information contained in this publication is provided for the sole purpose of designing with and using Microchip
products. Information regarding device applications and the like is provided only for your convenience and may be
superseded by updates. It is your responsibility to ensure that your application meets with your specifications.

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 28

 MTCH1010

THIS INFORMATION IS PROVIDED BY MICROCHIP “AS IS”. MICROCHIP MAKES NO REPRESENTATIONS

OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY
OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE
OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR
CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE
INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE
POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW,
MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE
WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR
THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk,
and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or
expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual
property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime,
BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox,
KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip
Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer,
Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed
Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC,
ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra,
TimeProvider, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching,
BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController,
dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, IdealBridge,
In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, maxCrypto,
maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE,
Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SMART-I.S., storClad,
SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense,
VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their respective companies.
© 2021, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-8115-7
AMBA, Arm, Arm7, Arm7TDMI, Arm9, Arm11, Artisan, big.LITTLE, Cordio, CoreLink, CoreSight, Cortex, DesignStart,
DynamIQ, Jazelle, Keil, Mali, Mbed, Mbed Enabled, NEON, POP, RealView, SecurCore, Socrates, Thumb,
TrustZone, ULINK, ULINK2, ULINK-ME, ULINK-PLUS, ULINKpro, µVision, Versatile are trademarks or registered
trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 29

 MTCH1010

Quality Management System

For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 30

 Worldwide Sales and Service
AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
Corporate Office Australia - Sydney India - Bangalore Austria - Wels
2355 West Chandler Blvd. Tel: 61-2-9868-6733 Tel: 91-80-3090-4444 Tel: 43-7242-2244-39
Chandler, AZ 85224-6199 China - Beijing India - New Delhi Fax: 43-7242-2244-393
Tel: 480-792-7200 Tel: 86-10-8569-7000 Tel: 91-11-4160-8631 Denmark - Copenhagen
Fax: 480-792-7277 China - Chengdu India - Pune Tel: 45-4485-5910
Technical Support: Tel: 86-28-8665-5511 Tel: 91-20-4121-0141 Fax: 45-4485-2829
www.microchip.com/support China - Chongqing Japan - Osaka Finland - Espoo
Web Address: Tel: 86-23-8980-9588 Tel: 81-6-6152-7160 Tel: 358-9-4520-820
www.microchip.com China - Dongguan Japan - Tokyo France - Paris
Atlanta Tel: 86-769-8702-9880 Tel: 81-3-6880- 3770 Tel: 33-1-69-53-63-20
Duluth, GA China - Guangzhou Korea - Daegu Fax: 33-1-69-30-90-79
Tel: 678-957-9614 Tel: 86-20-8755-8029 Tel: 82-53-744-4301 Germany - Garching
Fax: 678-957-1455 China - Hangzhou Korea - Seoul Tel: 49-8931-9700
Austin, TX Tel: 86-571-8792-8115 Tel: 82-2-554-7200 Germany - Haan
Tel: 512-257-3370 China - Hong Kong SAR Malaysia - Kuala Lumpur Tel: 49-2129-3766400
Boston Tel: 852-2943-5100 Tel: 60-3-7651-7906 Germany - Heilbronn
Westborough, MA China - Nanjing Malaysia - Penang Tel: 49-7131-72400
Tel: 774-760-0087 Tel: 86-25-8473-2460 Tel: 60-4-227-8870 Germany - Karlsruhe
Fax: 774-760-0088 China - Qingdao Philippines - Manila Tel: 49-721-625370
Chicago Tel: 86-532-8502-7355 Tel: 63-2-634-9065 Germany - Munich
Itasca, IL China - Shanghai Singapore Tel: 49-89-627-144-0
Tel: 630-285-0071 Tel: 86-21-3326-8000 Tel: 65-6334-8870 Fax: 49-89-627-144-44
Fax: 630-285-0075 China - Shenyang Taiwan - Hsin Chu Germany - Rosenheim
Dallas Tel: 86-24-2334-2829 Tel: 886-3-577-8366 Tel: 49-8031-354-560
Addison, TX China - Shenzhen Taiwan - Kaohsiung Israel - Ra’anana
Tel: 972-818-7423 Tel: 86-755-8864-2200 Tel: 886-7-213-7830 Tel: 972-9-744-7705
Fax: 972-818-2924 China - Suzhou Taiwan - Taipei Italy - Milan
Detroit Tel: 86-186-6233-1526 Tel: 886-2-2508-8600 Tel: 39-0331-742611
Novi, MI China - Wuhan Thailand - Bangkok Fax: 39-0331-466781
Tel: 248-848-4000 Tel: 86-27-5980-5300 Tel: 66-2-694-1351 Italy - Padova
Houston, TX China - Xian Vietnam - Ho Chi Minh Tel: 39-049-7625286
Tel: 281-894-5983 Tel: 86-29-8833-7252 Tel: 84-28-5448-2100 Netherlands - Drunen
Indianapolis China - Xiamen Tel: 31-416-690399
Noblesville, IN Tel: 86-592-2388138 Fax: 31-416-690340
Tel: 317-773-8323 China - Zhuhai Norway - Trondheim
Fax: 317-773-5453 Tel: 86-756-3210040 Tel: 47-72884388
Tel: 317-536-2380 Poland - Warsaw
Los Angeles Tel: 48-22-3325737
Mission Viejo, CA Romania - Bucharest
Tel: 949-462-9523 Tel: 40-21-407-87-50
Fax: 949-462-9608 Spain - Madrid
Tel: 951-273-7800 Tel: 34-91-708-08-90
Raleigh, NC Fax: 34-91-708-08-91
Tel: 919-844-7510 Sweden - Gothenberg
New York, NY Tel: 46-31-704-60-40
Tel: 631-435-6000 Sweden - Stockholm
San Jose, CA Tel: 46-8-5090-4654
Tel: 408-735-9110 UK - Wokingham
Tel: 408-436-4270 Tel: 44-118-921-5800
Canada - Toronto Fax: 44-118-921-5820
Tel: 905-695-1980
Fax: 905-695-2078

© 2021 Microchip Technology Inc. Datasheet DS40002314A-page 31