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Complex Engineering Problem: Stress Analysis

The document describes an experiment to determine the stress intensity factor (SIF) of a cracked acrylic plate under tensile loading using photoelasticity. A rectangular acrylic plate with a 10mm crack will be loaded with 100N of tension. A transmission polariscope will be used to visualize stress-induced fringes in the photoelastic material and determine the SIF, which will then be verified through simulation. The key steps involve using a polarizer and analyzer in the polariscope to observe fringe patterns indicating stress around the crack tip from which the SIF can be calculated based on factors like crack size and applied stress.

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0% found this document useful (0 votes)
119 views17 pages

Complex Engineering Problem: Stress Analysis

The document describes an experiment to determine the stress intensity factor (SIF) of a cracked acrylic plate under tensile loading using photoelasticity. A rectangular acrylic plate with a 10mm crack will be loaded with 100N of tension. A transmission polariscope will be used to visualize stress-induced fringes in the photoelastic material and determine the SIF, which will then be verified through simulation. The key steps involve using a polarizer and analyzer in the polariscope to observe fringe patterns indicating stress around the crack tip from which the SIF can be calculated based on factors like crack size and applied stress.

Uploaded by

IMRAN KHAN
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as DOCX, PDF, TXT or read online on Scribd
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1 Problem Statement

Complex Engineering
5/16/2022
Problem
Stress Analysis

Submitted To
: Dr. Mubashir Gulzar

Submitted By:

Noor ul eEman 18-ME-05


Mahnoor Fatima Munir18-ME-44

Asad Ghulam 18-ME-59


HusnaJaved 18-ME-68

FIG. 1

For the double edge cracked rectangular plate of acrylic material in Fig.1, having thickness of 20
mm and crack length of 10 mm, tensile loading 100 N, find the SIF using a suitable experimental
setup. Verify the results by simulation.
DEPARTMENT OF MECHANICAL ENGINEERING
FACULTY OF MECHANICAL & AERONAUTICAL ENGINEERING
UNIVERSITY OF ENGINEERING & TECHN OLOGY TAXILA
2 Introduction:
Any material when undergo load, it is under the stress condition. Due to this stress, crack form in
the material. Crack initiation is first process of crack formation. This crack initiates due to the
cyclic loading. Linear elastic fracture mechanics states that the tip of crack is defined by term
called “Stress Intensity Factor (K)”, and this term is related to the magnitude of stress developed
in the material specimen and talks about the size of the crack.
When the load is applied, the crack develops in following three modes. Such modes are opening
mode, tearing mode, and sliding mode.

Plane Stress

This section is concerned with a special two-dimensional state of stress called plane stress. It is
important for two reasons:
 It arises in real components (particularly in thin components loaded in certain ways)
 It is a two-dimensional state of stress, and thus serves as an excellent introduction to more
complicated three-dimensional stress states.

3.5.1 Plane Stress

The state of plane stress is defined as follows:

Plane Stress:
If the stress state at a material particle is such that the only non-zero stress components act in one
plane only, the particle is said to be in plane stress.

The axes are usually chosen such that the x− y plane is the plane in which the stresses act,

x
Figure: non-zero stress components acting in the x – y plane

The stress can be expressed in the matrix form 3.4.1.

Example

The thick block of uniform material shown in Fig. 3.5.2, loaded by a constant stress o in the
x direction, will have xx 0 and all other components zero everywhere. It is therefore in a
state of plane stress.

Figure: a thick block of material in plane stress


Plane Strain

Plane strain assumptions can provide very good representations of real life components.
Essentially, the in-plane strains are developed as in the full 3D formulation, but the out-of-plane
or z-direction strains are set to zero. This condition would exist in an object that is constrained in
the z-direction by rigid walls; the formulation only allows the resolution of strain ‘in (the) plane’,
hence the name ‘plane strain’:

ε zz =ε xz =ε yz =0

In the constitutive equations derived from Hooke’s law, we simply remove the strain components
(ε zz , ε xz , ε yz ) that are to be considered zero.

Plane strain assumptions tend to be a very good approximation of the behavior inside a thick
component that is loaded only in one plane. The large amount of material through the thickness
essentially renders through-thickness strain irrelevant (or at least negligible).
SIF of Mixed Mode I-II Crack
According to the linear elastic method, the stress components of the mixed mode I-II at the crack
tip in the polar coordinates can be expressed as follows

where KI is the mode-I SIF, KII is the mode-II SIF, r is the distance from the crack tip, and θ is
the angle by which the surface deviates from the original crack tip direction. An infinite plate
with a central crack under biaxial loading (σ∞ y and σ∞ x , σ∞ x � kσ∞ y ) is shown in Figure
1, where the crack length is 2a. 2e stress state along the crack plane can be determined as
follows:

where σT, σN, and τ are the tangential stress, normal stress, and shear stress. 2e tensile stress is
positive, while the compressive stress is negative.
 Evaluation of Mixed-Mode SIFs

The mixed-mode SIFs for anisotropic materials can be determined by using the extrapolation
method of the relative COD, combined with a set of the shape functions. The relative COD is
defined as [18]where the subscript denotes the components of the relative COD, and the
superscript denotes the relative COD at nodes , respectively; are the shape functions which can be
expressed as follows:
It is well known that for a crack in a homogeneous and anisotropic solid, the relative COD is
proportional to , where is the distance behined the crack tip. Therefore, the relation of the relative
CODs and the SIFs can be found as [18, 33]where

Substituting (2.14) into (2.16), a set of algebraic equations is obtained, and then the SIFs and can
be solved. A sign convention for the corresponding SIFs is shown in Figure 2. Using the relative
COD, the sign of SIFs can then be determined.
3 Stress Intensity Factor
Stress intensity factor (K) is introduced by Irwin and Coworkers in 1950. Stress intensity factor
is basically used to describe the stress around the crack tip. Stress intensity factor find the stress
by using following factors like length of the crack and the stress that is applied. When we are
going to find the stress intensity factor, following three factors are needed to find that are:
Material Fracture toughness, crack size and the stress level.

3.1 Material Fracture Toughness:

It is ability of the material to deform plastically in the presence of notch. It is described by the
critical stress intensity factor KIC.

3.2 Crack size:

Fracture starts from the crack that are very small and can vary upto the large cracks. Good
fabrication and the inspection can reduce the size of the crack that is formed.
3.3 Derivation

According to the Westergaard solution method for the stress field for an infinitely sharp crack in
infinite plate,
Where,
Ϭij = Stress tensor r = distance
from the crack tip
θ = angle with respect to the plane of the crack f ij = functions that are
independent of the crack geometry and loading conditions. From Saouma

When θ = 0, we have from (1) to (7)

Now, KI of the finite plate under tension is given by

Correction factor is introduced for the different types of cracks

where
a = characteristic crack dimension
Y = dimensionless constant that depends on the geometry and the mode of loading
4 Experimental Methods
Different experimental methods are used now a days to find the magnitude of the stresses. These
are:

• Photoelasticity
• Strain gauge
These methods are discussed below:

4.1 Strain Gauge

When force is applied on the strain gauge, its resistance value changes. For example, if the
tensile loading is applied on the strain gauge, the gap between the wire in strain gauge increases .
As a result, the resistance value increases.

Figure 1: Strain Gauge


This resistance value is then measured. The resistance value obtained is proportional to the strain,
and this strain is measured using the wheatstone bridge.
Figure 2: Wheatsone Bridge
Here the resistance value of R1, R2 and R3 are same. The circuit is balanced until the value of
resistance R4 is changed. Then the circuit becomes unbalance, and the voltage exists at output
terminal. The resistance R4 is basically the strain sensor. The output voltage is equal to the
difference between the voltage drop of resistances R1 and R4.

4.2 Photoelasticity

Photoelasticity is method used to find the stresses of photo elastic material. It is used in the
several past years with applications in silicon wafer stress analysis, rapid prototyping, Image
processing etc. The two types of polariscope used in photo elastic method are reflective
polariscope and transmission polariscope.
4.2.1 Reflective Polariscope

Reflective polariscopes allow for the visualization of the photo elastic fringes when the light
source and the camera are located on the same side of the photo elastic specimen.
Figure 3: Reflective Polariscope
4.2.2 Transmission Polariscope

It uses the transmitted light. Here the light source and the naked eye are opposite to each other
with respect to the specimen.

Figure 4: Transmission Polariscope

5 Experimental Setup
The following methods and arrangements are used for ourexperiment.

5.1 Experimental method

The experimental method we are using in our experiment is “Photoelasticity:


5.2 Polariscope Used

The polariscope that is used in our experiment is the “Transmission Polariscope”. And it is the
circular polariscope because both the polarizer and analyzer are used in experiment.

Figure 5: Polariscope
5.2.1 Polarizer:

A polarizer is a purely optical device that can convert a beam of unpolarized light into one that is
appreciably polarized in some form.
5.2.2 Analyzer

Light passes through two plates made of polarizing material--these are the polarizer and the
analyzer. The specimen is fixtured and loaded between these plates. The analyzer is rotated either
to be parallel or perpendicular to the polarizer for a bright field or dark field, respectively.

Figure 6: Circular Polariscope


5.2.3 Material Used

Since we are using the photoelastic technique, which is the used to find the stress in only the
photoelatic material. So, we are using the “Acrylic material”. Acrylic material is photoelastic
material.
5.2.4 Advantages:

Common uses include


▪ Lenses, acrylic nails, paint, security barriers, medical devices, LCD screens, and
furniture. Because of its clarity, it is also often used for windows, tanks, and enclosures
around exhibits.
▪ Technical Name: Acrylic (PMMA)
▪ Chemical Formula: (C5H8O2)n
▪ Heat Deflection Temperature (HDT): 95°C ...
▪ Melt Temperature: 130°C (266°F)

5.2.5 Light used:

Light used in our experiment is Monochromatic light.


5.2.6 Fringe pattern:

Colorful fringe pattern made in our experiment.

Figure 7: Fringes obtained through experiment at 10N load

6 Experimental Analysis
ANSYS analysis is made according to the Complex Engineering Problem Statement
Requirements to evaluate the fringe pattern and to analyze the fringe pattern and crack
propagation.
6.1 Material

Acrylic material is selected of which the material is to be analyzed. The material has the
following properties:

Figure 8: Acrylic material properties

6.2 Geometry

The geometry of the specimen is set according to the complex engineering problem statement

Figure 9: geometric model of the specimen The


dimensions of the model are as:
Table 1: Dimensions in coordinate
X length 0.1m
Y length 0.2m
Z lenth 8 e-003m
6.3 Mesh generation

Figure 10: Mesh generation of the model

6.4 Boundary Conditions

The boundary condition of the body set at the following parameters:

Figure 11: Boundary conditions of the specimen


Table 2: Boundary Conditions applicability
Point A Fixed support at Cornered Edge
Point B Displacement at Face
Point C Displacement at upper face in upward direction of about 100N
6.5 Isotropic Crack Analysis

6.5.1 Equivalent Stresses

The following analysis of the crack is obtained which generates the stated equivalent stress
values in the following pattern

Figure 12: Equivalent Stress Analysis using FEA


Table 3: Equivalent Stress Values
Minimum 6828.8

Maximum 2.5976e+005
Average 1.2449e+005
6.5.2 Principle Stresses

Following are the principal stress obtained after applying the FEA solution:

Figure 13: Maximum Principal stresses analysis using FEA


Table 4: Maximum Principal stresses value
Minimum -11784

Maximum 3.362e+005
Average 1.2396e+005
6.6 Stress Intensity Values

The stress intensity analysis of the specimen at 100N load is made and the following values are
obtained:

Figure 14: Stress Intensity Values Analysis using FEA


Table 5: Stress intensity Factor values
Minimum 7225.2

Maximum 2.9695e+005
Average 1.2684e+005
6.7 Theoretical Calculations

As we know that:
𝑃
𝜎=
𝐴

𝜎=
0.
𝜎 = 50,000
Now for stress intensity Factor

𝑘
𝑘
𝑘 = 8860 𝑃𝑎
6.8 Comparison

Table 6: Comparative Analysis


Parameters Theoretical Experimental %age error
Stresses 50,000 35000 30%
Stress intensity Factor 7225 8860 18%

7 Conclusion
This report gives an insight of calculation of stress intensity factor for acrylic plate with double edged
crack. Different experimental techniques are used for linear and non linear behavior which includes
strain gauge and photoelasticity.

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