DiskOnModule

DiskOnModule
Standard II DJ Series

Rev. A.0 June 2007

 DiskOnModule
TABLE OF CONTENTS

1. PRODUCT DESCRIPTION ......................................................................................................... 1

1.1 PRODUCT OVERVIEW .............................................................................................................................................................. 1
1.2 PRODUCT FEATURES............................................................................................................................................................... 1
1.3 SYSTEM REQUIREMENT........................................................................................................................................................... 1

2. SPECIFICATION......................................................................................................................... 2
2.1 PHYSICAL SPECIFICATIONS ..................................................................................................................................................... 2
2.1.1 Overlook ..........................................................................................................................................................2
2.1.2 Dimension ........................................................................................................................................................3
2.1.3 Weight..............................................................................................................................................................4
2.2 ELECTRONIC SPECIFICATIONS ................................................................................................................................................ 4
2.2.1 Product Definition ............................................................................................................................................4
2.2.1 Operating Voltage ............................................................................................................................................5
2.2.2 Capacity and Block Size information ...............................................................................................................5
2.2.3 Power Consumption ........................................................................................................................................5
2.3 PERFORMANCE SPECIFICATIONS ............................................................................................................................................ 5
2.3.1 Modes ..............................................................................................................................................................5
2.3.2 Seek Time .......................................................................................................................................................5
2.3.3 Mount Time ......................................................................................................................................................5
2.3.4 Data Transfer Time by Channel mode.............................................................................................................5
2.3.5 Data Retention .................................................................................................................................................5
2.3.6 Wear-leveling ...................................................................................................................................................5
2.3.7 Bad Block Management ..................................................................................................................................5
2.4 ENVIRONMENTAL SPECIFICATIONS ......................................................................................................................................... 5
2.4.1 Temperature ....................................................................................................................................................5
2.4.2 Humidity ...........................................................................................................................................................6
2.4.3 Vibration ..........................................................................................................................................................6
2.5 RELIABILITY SPECIFICATIONS ................................................................................................................................................. 6
2.5.1 ECC/EDC (Error Correction Code/Error Detection Code)...............................................................................6
2.5.2 Read and Write/Erase Cycle ...........................................................................................................................6
2.5.3 MTBF (Mean Time Between Failure) ..............................................................................................................6
2.5.4 Power Cycle ....................................................................................................................................................6
2.6 COMPLIANCE SPECIFICATIONS ............................................................................................................................................... 6

3. FUNCTION ................................................................................................................................. 7
3.1 SWITCH SETTING ..................................................................................................................................................................... 7
3.1.2 WRITE PROTECT SWITCH .................................................................................................................................................... 7
3.2 PIN SIGNAL ASSIGNMENT ....................................................................................................................................................... 7
3.3 STANDARD-II CAPACITY AND CYLINDER, HEAD, SECTOR ..................................................................................................... 8

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4. OPERATION SPECIFICATION................................................................................................... 8
4.1 ABSOLUTE M AXIMUM RATINGS............................................................................................................................................... 8

5. ORDERING INFORMATION ....................................................................................................... 9

6. CONTACT INFORMATION ....................................................................................................... 10

Rev. A.0 June 2007

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LIST OF FIGURES

Figure 1: DiskOnModule Overlook Diagram ........................................................................................................2

Figure 2: DOM Dimensions ..................................................................................................................................3
Figure 3: DiskOnModule Block Diagram ..............................................................................................................4
Figure 4: Master/Slave Function Switch ..............................................................................................................7
Figure 5: Write Protect Switch .………………………………………………………………………………………….7
Figure 6: Signal Connector …..………………………………………………………………………………………….8

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LIST OF TABLES

Table 1: DiskOnModule Physical Dimension .......................................................................................................4

Table 2 ATA connector pin definitions ..................................................................................................................7
Table 3: DiskOnModule Ordering Information ......................................................................................................9

Rev. A.0 June 2007

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1. Product Description

1.1 Product Overview

PQI’s DiskOnModule (DOM) is the storage device based on NAND flash memory technology. This product complies
with 40 PIN IDE (ATA) standard interface and is suitable for data storage media and code storage device for embedded
system and boot disk. By using DiskOnModule, it is possible to operate good performance for the systems, which
have IDE interface.
With small form factor, the applicable appliance can add or install IDE storage device on its Mother Board or Complete
set.

Application Fields;
 Industrial PC and Thin Client
 Game and Telecommunication Machine
 Ticketing, Examining, testing machine
 Army, Health and Production Equipment and Machine

1.2 Product Features

Small form factor with IDE (ATA) Standard Interface connector

Memory Capacities: 128MB ~ 4GB

High performance and reliability

Noiseless and stable installation to system

Operating voltage 3.3V or 5.0V operation

Standard IDE (ATA) Interface

Master and Slave Switch

Write Protection Switch

Operating as Boot Disk

Data Storage Device to 4GB

Code Storage Device for Embeded Operating System

1.3 System Requirement

- The Host system which is connected to DiskOnModule should meet system requirements at minimum;

1.3.1 Power Requirement

Voltage: DC +3.3V ± 5% or DC +5.0V ± 10%

1.3.2 Operating System

Windows 2000/XP

Linux

DOS

WinXP Embedded

WinCE

1.3.3 Interface

IDE (ATA) Standard Interface

Rev. A.0 1/10 June 2007

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2. Specification

2.1 Physical Specifications

2.1.1 Overlook
The overlook views of DiskOnModule are illustrated in Figure 1.

Write Protect Switch Power Connector Master/Slave Switch

Figure 1: DiskOnModule Overlook Diagram

Rev. A.0 2/10 June 2007

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2.1.2 Dimension
The Dimensions of DiskOnModule are illustrated in Figure 2 and described in Table 1.

DJ0XXXX46XX0 (40 PIN)

Figure 2: DOM Dimensions

Rev. A.0 3/10 June 2007

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Table 1: DiskOnModule Physical Dimension

Length 27.2 ± 0.2 mm
Width 59.2 ± 0.2 mm
Thickness 6.2 ± 0.2mm

2.1.3 Weight

DiskOnModule Weight: < 12g

Power Cable Weight: < 11g

2.2 Electronic Specifications

2.2.1 Product Definition

DiskOnModule is designed to operate and work as Data or Code Storage device by NAND Flash Memory and its
Controller through IDE (ATA) Standard Interface to Host Systems.

Vcc F L A SH
Regulator Master/Slave
Controller
External Option

DAT A
Hvcc BUFFER

ATA(IDE)
Interface X`tal
Flash memory bus
DD0 to DD15
CS0, CS1
RESET
DA0 to DA2
DIOR
DIOW
INTRQ DATA
IORDY FLASH
ARRAY
DMACK
DMARQ

DASP , PDIAG Control signal

Figure 3: DiskOnModule Block Diagram

Rev. A.0 4/10 June 2007

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2.2.1 Operating Voltage

Voltage DC +3.3V ± 5% or DC +5.0V ± 10%

2.2.2 Capacity and Block Size information

Capacity: 128MB ~ 4GB

Sector Size: 512B

2.2.3 Power Consumption

DC Information

Test Item 3.3V 5.0V

Write Current 45mA 48mA
Read Current 43mA 45mA
Sleep Current 0.6mA 0.8mA

※ Testing Platform;
- Mother-Board: GA-K8U-939, CPU: K8 2.0G, System Memory: DDR 512MB,
Operating System: DOS 6.22, Test Program: RWALL10 & DOMSV31

2.3 Performance Specifications

2.3.1 Modes

PIO mode 4

Ultra DMA 2

Setting to Ultra DMA 0 or 1 also available as following to Customer’s request

2.3.2 Seek Time

DiskOnModule has no seek time by being based on Flash Memory technology.

2.3.3 Mount Time

The Mount Time for initializing and mounting DiskOnModule is different by depending on Operating System and
testing Platform.

2.3.4 Data Transfer Time by Channel mode

Mode Single Dual Mode

Condition Sequential Read Sequential Write Sequential Read Sequential Write
Speed 10MB/s 5MB/s 20MB/s 10MB/s

※ Test Platform: GIGA 8I945GME Intel:945+ICH7 3.0GHz DDR:400

Testing Software: HD Bench 3.4 Testing OS: Windows XP
The value is various bases on the testing platform.

2.3.5 Data Retention

10years without requiring power support

2.3.6 Wear-leveling

Dynamic Wear-Leveling for same level of Write/Erase Cycle

2.3.7 Bad Block Management

The Bad Blocks of Flash Memory will be replaced into new ones by controller.

2.4 Environmental Specifications

2.4.1 Temperature

Operating Temperature: 0℃ to +70℃, Non Operating Temperature: -40℃ to +85℃ (Industrial type)

Operating Temperature: -40℃ to +85℃, Non Operating Temperature: -55℃ to +95℃ (Wide Temperature type)

Rev. A.0 5/10 June 2007

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2.4.2 Humidity

Operating Humidity: 10% to 95%

Non-Operating Humidity: 10% to 95% (with no condensation relative humidity)

2.4.3 Vibration

Random Vibration (Operation) : Testing Specification

Frequency (Hz) PSD (G2/Hz) Acceleration (Grms) Dwell Time (Min)

10 0.01 30min per axis
100 0.08 6Grms (X‧Y‧Z)
500 0.08

Sine Vibration (Non-Operation) : Testing Specification

Testing Specification
Frequency（Hz） Acceleration（G） Dwell Time（min）
10~500 Hz 15 G 30min per axis
(X‧Y‧Z)

2.4.4 Bare Drop Testing

Testing Conditions: 75cm height

Testing Orientation: (Free fell) Front/Rear/Right/Left/Top/Bottom side

Testing Result: Pass

2.5 Reliability Specifications

2.5.1 ECC/EDC (Error Correction Code/Error Detection Code)

Built-in Reed Solomon 4bytes/sector correction and 5bytes/sector detection.

2.5.2 Read and Write/Erase Cycle

Read: No Limitation

Write/Erase: 5,000,000 times
(Estimated on reference to Doc No.SM070001)

2.5.3 MTBF (Mean Time Between Failure)

2,000,000 hours
(Estimated on reference to Doc No.SM070002)

2.5.4 Power Cycle

The Power Cycling is tested to 5000 loop. => “Pass”

2.6 Compliance Specifications

CE

FCC

※ Note: Please contact your closest PQI’s office for other certificate information.

Rev. A.0 6/10 June 2007

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3. Function

3.1 Switch Setting

3.1.1 Master/Slave Switch

On case which the switch place “Master” side, then the DOM will be recognized as C: Drive in system and
operate as main storage device.

On case of placing in “Slave” side, the DOM will be recognized as slave disk and operate as slave storage device.

Slave Master

Figure 4: Master/Slave Function Switch

3.1.2 Write Protect Switch

On case which the switch place “Lock” side, then the data can not be written into DOM and can be read only.

On case of placing in “Unlock” side, the data can be written and read together.

Unlock Lock

Figure 5: Write Protect Switch

3.2 Pin Signal Assignment

The signals assigned for ATA applications are described in Table 2

Table 2 ATA connector pin definitions

Signal name Connector Conductor Connector Signal name
contact contact
RESET- 1 1 2 2 Ground
DD7 3 3 4 4 DD8
DD6 5 5 6 6 DD9
DD5 7 7 8 8 DD10
DD4 9 9 10 10 DD11
DD3 11 11 12 12 DD12
DD2 13 13 14 14 DD13
DD1 15 15 16 16 DD14
DD0 17 17 18 18 DD15
Ground 19 19 20 20 (keypin) or Vcc
DMARQ 21 21 22 22 Ground
DIOW- 23 23 24 24 Ground
DIOR- 25 25 26 26 Ground
IORDY 27 27 28 28 CSEL
DMACK- 29 29 30 30 Ground
INTRQ 31 31 32 32 reserved
DA1 33 33 34 34 PDIAG-
DA0 35 35 36 36 DA2
CS0- 37 37 38 38 CS1-
DASP- 39 39 40 40 Ground

Rev. A.0 7/10 June 2007

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※ Notes:
1. All pins are in a single row, with a 2.54 mm (0.100”) pitch.
2. The comments on the mating sequence apply to the case of backplane blind mate connector only. In this case, the mating sequences are:
• - the pre-charge power pints and the other ground pins.
• - the signal pins and the rest of the power pins.

Pin 1 Pin 39

Pin 2 Pin 40

Figure 6: Signal Connector

3.3 Standard-II Capacity and Cylinder, Head, Sector

The table show various capacities available for Standard-II series, if your platform does not support auto-detection
function or Standard-II series is not identified, we advice can following below Cylinders, Heads, Sectors number to
setting your platform.

Unformatted Disk No. of No. of No. of

Disk Total Sector
Capacity Cylinders Heads Sectors
128MB 480 16 32 245760

256MB 960 16 32 491520

512MB 975 16 63 982800

1GB 1950 16 63 1965600

2GB 3900 16 63 3931200

4GB 7801 16 63 7863408

4. Operation Specification
4.1 Absolute Maximum Ratings

Absolute Maximum Ratings

Parameter Symbol Rating Unit
Power supply voltage VCC -0.3 ~ +5.6 V

Input voltage Vin -0.3 ~ +5.6 V

(Referenced to GND)

Rev. A.0 8/10 June 2007

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Electric characteristics
Vcc=3.14V~5.5V
Value Measuring
Item Symbol Unit
Min. Standard Max. conditions

Input voltage VIH 2.0 - *1 V

(TTL level) VIL - - 0.7 V

VOH 2.2 - *2 V IOH=-2mA~ -24mA

Output voltage
VOL - - 0.4 V IOL=2mA~ 24mA

5. Ordering Information

Table 3: DiskOnModule Ordering Information

P/N Capacity (Max)

DJ0128M*146R*2 F*30 4GB

*
1：128M:128MB, 256M:256MB, 512M:512MB, 010G:1GB, 020G:2GB, 040G:4GB
*
2：R: Industrial type T: Wide Temperature type

*
3:：Flash Density
F:128MB, I:256MB, L:512MB, N:1GB, P:2GB
*
4：DJ0128M46RF0(WP): With Write Protect Switch
DJ0128M46RF0 : Without Write Protect Switch

Rev. A.0 9/10 June 2007

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6. Contact Information

For further information, please contact the following PQI or representative which place you are located at.

TAIWAN‧POWER QUOTIENT INTERNATIONAL CO., LTD.

TEL: +886-2-82265288 Sales: [email protected]
USA‧PQI CORPORATION
TEL: +1-510-6517281 Sales: [email protected]
Customer Service: [email protected]
THE NETHERLANDS‧PQIEUROPE B.V.
TEL: +31-73-6273555 Sales: [email protected]
Customer Service: [email protected]
JAPAN‧PQI Japan Co., Ltd.
TEL: +81-3-58354545 E-Mail: [email protected]
CHINA-Shanghai‧POWER QUOTIENT INTERNATIONAL (Shanghai) CO., LTD.
TEL: +86-21-64403280 FAX: +86-21-64403279
CHINA-Suzhou‧POWER QUOTIENT INTERNATIONAL(Suzhou) CO., LTD.
TEL: +86-512-62882999 FAX: +86-512-62883000
CHINA-Shenzhen‧POWER QUOTIENT INTERNATIONAL (Shenzhen) CO., LTD.
TEL: +86-755-83287509 FAX: +86-755-83287582
CHINA-Hong Kong‧POWER QUOTIENT INTERNATIONAL (H.K.) CO., LTD.
TEL: +852-27074118 E-Mail: [email protected]
KOREA‧POWER QUOTIENT INTERNATIONAL (KOREA) CO., LTD.
TEL: +82-2-7060781 E- mail: [email protected]

Rev. A.0 10/10 June 2007