OPA365 OPA2365: Features Description
OPA365 OPA2365: Features Description
OPA365 OPA2365: Features Description
OPA2365
SBOS365D − JUNE 2006 − REVISED JUNE 2009
C2
2.2pF
V−
V−
SD1 U2
U1 BAT17 VOUT
OPA365
OPA365
R1
7.5Ω V+
VIN V+ C1
10nF
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semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2006−2009, Texas Instruments Incorporated
! !
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ABSOLUTE MAXIMUM RATINGS(1) This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5.5V handled with appropriate precautions. Failure to observe
Signal Input Terminals, Voltage(2) . . . . (V−) −0.5V to (V+) + 0.5V proper handling and installation procedures can cause damage.
Signal Input Terminals, Current(2) . . . . . . . . . . . . . . . . . . . . ±10mA
Output Short-Circuit(3) . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
Operating Temperature . . . . . . . . . . . . . . . . . . . . . −40°C to +150°C
susceptible to damage because very small parametric changes could
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C cause the device not to meet its published specifications.
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4000V
Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000V
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400V
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2) Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.5V beyond the supply
rails should be current limited to 10mA or less.
(3) Short-circuit to ground, one amplifier per package.
ORDERING INFORMATION(1)
PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING
SOT23-5 DBV OAVQ
OPA365
SO-8 D O365A
OPA2365 SO-8 D O2365A
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
PIN CONFIGURATIONS
Top View
V− 4 5 NC(1) V− 4 5 +IN B
SOT23−5
SO−8 SO−8
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TYPICAL CHARACTERISTICS
At TA = +25°C, VS = +5V, and CL = 0pF, unless otherwise noted.
Phase
80
Phase (_ )
80
60 −90 PSRR
60
40
Gain 40
20 −135
0 20
−20 −180 0
10 100 1k 10k 100k 1M 10M 100M 10 100 1k 10k 100k 1M 10M 100M
Frequency (Hz) Frequency (Hz)
VS = 5.5V
Population
Population
−200
−180
−160
−140
−120
−100
−80
−60
−40
−20
0
20
40
60
80
100
120
140
160
180
200
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Offset Voltage (µV) Offset Voltage Drift (µV/_ C)
700
Input Bias (pA)
600 300
IB (pA)
500
200
400
300 VCM Specified Range
100
200
100
0
0 −25
−50 −25 0 25 50 75 100 125 −0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Temperature (_C) VCM (V)
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−1 −1
−2 −2
−3 −3
0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100
Output Current (mA) Output Current (mA)
40
Quiescent Current (mA)
30 4.50
20
10
0 Dual Single 4.25
−10
−20 VS = ±2.75V
−30
−40 4.00
−50
−60
−70
−80 3.75
−50 −25 0 25 50 75 100 125 2.2 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Temperature (_ C) Supply Voltage (V)
0.1Hz to 10Hz
QUIESCENT CURRENT vs TEMPERATURE INPUT VOLTAGE NOISE
4.80
4.74
Quiescent Current (mA)
4.68
2µV/div
4.62
4.56
4.50
−50 −25 0 25 50 75 100 125 1s/div
Temperature (_ C)
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0.001
VO = 1.448VRMS
10
50 G=1
G = +1 RL = 10kΩ
VS = ±2.5
Output Voltage (50mV/div)
40
Overshoot (%)
G = −1
30
G = +10
20
10
G = −10
0
0 100 1k
Capacitive Load (pF) Time (50ns/div)
G=1 G=1
RL = 10kΩ RL = 600Ω
VS = ±2.5 VS = ±2.5
Output Voltage (50mV/div)
Output Voltage (1V/div)
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G=1
RL = 600Ω
VS = ±2.5
Time (250ns/div)
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APPLICATIONS INFORMATION R2
10kΩ
OPERATING CHARACTERISTICS
The OPA365 amplifier parameters are fully specified
from +2.2V to +5.5V. Many of the specifications apply +1.5V
from −40°C to +125°C. Parameters that can exhibit sig-
nificant variance with regard to operating voltage or
C1
temperature are presented in the Typical Characteris- 100nF
tics. R1
V+
1kΩ
OPA365 VOUT
GENERAL LAYOUT GUIDELINES
The OPA365 is a wideband amplifier. To realize the full VIN
V− C2
operational performance of the device, good high-fre- 100nF
quency printed circuit board (PCB) layout practices are
required. Low-loss, 0.1µF bypass capacitors must be
connected between each supply pin and ground as
−1.5V
close to the device as possible. The bypass capacitor
traces should be designed for minimum inductance. a) Dual Supply Connection
VCM = 1.5V
b) Single−Supply Connection
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V+
RAIL-TO-RAIL INPUT
I OVERLOAD
The OPA365 product family features true rail-to-rail in-
10mA max
put operation, with supply voltages as low as ±1.1V OPA365 VOUT
(2.2V). A unique zer∅-crossover input topology elimi- VIN
5kΩ
nates the input offset transition region typical of many
rail-to-rail, complementary stage operational amplifiers.
This topology also allows the OPA365 to provide superi-
or common-mode performance over the entire input
range, which extends 100mV beyond both power-sup-
Figure 3. Input Current Protection
ply rails, as shown in Figure 4. When driving ADCs, the
highly linear VCM range of the OPA365 assures that the
op amp/ADC system linearity performance is not com-
OFFSET VOLTAGE vs COMMON−MODE VOLTAGE
promised. 200
VS = ±2.75V
150
100
OPA365
50
VOS (µV)
−50
−100
Competitors
−150
−200
−3 −2 −1 0 1 2 3
Common−Mode Voltage (V)
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Regulated
Charge Pump
VO U T = VC C +1.8V
CAPACITIVE LOADS
VC C + 1.8V
The OPA365 may be used in applications where driving
Patent Pending
a capacitive load is required. As with all op amps, there Very Low Ripple
may be specific instances where the OPA365 can be- IB IAS Topology
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ACTIVE FILTERING
The OPA365 is well-suited for active filter applications
requiring a wide bandwidth, fast slew rate, low-noise,
single-supply operational amplifier. Figure 8 shows a
500kHz, 2nd-order, low-pass filter utilizing the multiple−
feedback (MFB) topology. The components have been
selected to provide a maximally-flat Butterworth
response. Beyond the cutoff frequency, roll-off is
−40dB/dec. The Butterworth response is ideal for ap-
plications requiring predictable gain characteristics
such as the anti-aliasing filter used ahead of an ADC.
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One point to observe when considering the MFB filter OPA365 an ideal driver for modern ADCs. Also, be-
is that the output is inverted, relative to the input. If this cause it is free of the input offset transition characteris-
inversion is not required, or not desired, a noninverting tics inherent to some rail-to-rail CMOS op amps, the
output can be achieved through one of these options: OPA365 provides low THD and excellent linearity
1) adding an inverting amplifier; 2) adding an additional throughout the input voltage swing range.
2nd-order MFB stage; or 3) using a noninverting filter Figure 10 shows the OPA365 driving an ADS8326,
topology such as the Sallen-Key (shown in Figure 9). 16-bit, 250kSPS converter. The amplifier is connected
MFB and Sallen-Key, low-pass and high-pass filter syn- as a unity-gain, noninverting buffer and has an output
thesis is quickly accomplished using TI’s FilterPro pro- swing to 0V, making it directly compatible with the ADC
gram. This software is available as a free download at minus full-scale input level. The 0V level is achieved by
www.ti.com. powering the OPA365 V− pin with a small negative volt-
age established by the diode forward voltage drop.
A small, signal-switching diode or Schottky diode
DRIVING AN ANALOG-TO-DIGITAL CONVERTER provides a suitable negative supply voltage of −0.3 to
Very wide common-mode input range, rail-to-rail input −0.7V. The supply rail-to-rail is equal to V+, plus the
and output voltage capability and high speed make the small negative voltage.
C3
220pF
R1 R2 R3
1.8kΩ 19.5kΩ 150kΩ
VIN = 1VRMS
C1 C2 OPA365 VOUT
3.3nF 47pF
+5V
C1
100nF +5V
R1(1)
V+
100Ω
+IN
OPA365 ADS8326
V− C3(1) 16−Bit
1nF −IN 250kSPS
VIN
0 to 4.096V REF IN
Optional(2) +5V
R2 SD1
500Ω BAS40
−5V REF3240
C2 4.096V
C4
100nF 100nF
NOTES: (1) Suggested value; may require adjustment based on specific application.
(2) Single−supply applications lose a small number of ADC codes near ground due
to op amp output swing limitation. If a negative power supply is available, this
simple circuit creates a −0.3V supply to allow output swing to true ground
potential.
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One method for driving an ADC that negates the need to maintain the ADC gain accuracy. An additional bene-
for an output swing down to 0V uses a slightly com- fit of this method is the elimination of the negative sup-
pressed ADC full-scale input range (FSR). For exam- ply voltage; it requires no additional power-supply cur-
ple, the 16-bit ADS8361 (shown in Figure 11) has a rent.
maximum FSR of 0V to 5V, when powered by a +5V An RC network, consisting of R1 and C1, is included be-
supply and VREF of 2.5V. The idea is to match the ADC tween the op amp and the ADS8361. It not only pro-
input range with the op amp full linear output swing vides a high-frequency filter function, but more impor-
range; for example, an output range of +0.1 to +4.9V. tantly serves as a charge reservoir used for charging
The reference output from the ADS8361 ADC is divided the converter internal hold capacitance. This capability
down from 2.5V to 2.4V using a resistive divider. The assures that the op amp output linearity is maintained
ADC FSR then becomes 4.8VPP centered on a com- as the ADC input characteristics change throughout the
mon-mode voltage of +2.5V. Current from the ADS8361 conversion cycle. Depending on the particular applica-
reference pin is limited to about ±10µA. Here, 5µA was tion and ADC, some optimization of the R1 and C1 val-
used to bias the divider. The resistors must be precise ues may be required for best transient performance.
R2
10kΩ
+5V
C1
100nF
R1 +5V
V+
10kΩ R3(1)
100Ω
−IN ADS8361
OPA365
16−Bit
VIN C2(1) 100kSPS
0.1V to 4.9V V− 1nF +IN
REF OUT REF IN
+2.5V
R5 C3
480kΩ 1µF
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Figure 12 illustrates the OPA2365 dual op amp provid- For best performance, the +5V supply should be as free
ing signal conditioning within an ADS1258 bridge sen- as possible of noise and transients.
sor circuit. It follows the ADS1258 16:1 multiplexer and When the ADS1258 data rate is set to maximum and
is connected as a differential in/differential out amplifier. the chop feature enabled, this circuit yields 12 bits of
The voltage gain for this stage is approximately 10V/V. noise-free resolution with a 50mV full-scale input.
Driving the ADS1258 internal ADC in differential mode,
rather than in a single-ended, exploits the full linearity The chop feature is used to reduce the ADS1258 offset
performance capability of the converter. For best com- and offset drift to very low levels. A 2.2nF capacitor is
mon-mode rejection the two R2 resistors should be required across the ADC inputs to bypass the sampling
closely matched. currents. The 47Ω resistors provide isolation for the
OPA2365 outputs from the relatively large, 2.2nF ca-
Note that in Figure 12, the amplifiers, bridges, pacitive load. For more information regarding the
ADS1258 and internal reference are powered by the ADS1258, see the product data sheet available for
same single +5V supply. This ratiometric connection down load at www.ti.com.
helps cancel excitation voltage drift effects and noise.
+5V
RFI
+
0.1µF 10µF
2kΩ
RFI AIN0 AVSS AVDD
2kΩ REFP
RFI AIN1 +
10µF 0.1µF
…
…
REFN
2kΩ
RFI
ADS1258
AIN14
MUXOUTN
MUXOUTP
2kΩ
ADCINN
ADCINP
RFI AIN15
AINCOM
RFI +5V
2.2nF
0.1µF R3
47Ω
OPA2365
R2 = 10kΩ
R1 = 2.2kΩ
R2 = 10kΩ
R3
47Ω
OPA2365
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Revision History
Changed title.
Changed feature bullets.
6/09 D 1 Front Page
Changed drawing.
Deleted table.
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
15
PACKAGE OPTION ADDENDUM
www.ti.com 23-Feb-2011
PACKAGING INFORMATION
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 23-Feb-2011
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
• Automotive: OPA365-Q1
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Jul-2010
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Jul-2010
Pack Materials-Page 2
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