< Silicon RF Power MOS FET (Discrete) >

RD16HHF1
RoHS Compliance, Silicon MOSFET Power Transistor 30MHz,16W

OUTLINE DRAWING
1.3+/-0.4
DESCRIPTION 9.1+/-0.7

3.2+/-0.4
RD16HHF1 is a MOS FET type transistor specifically
3.6+/-0.2
designed for HF RF power amplifiers applications.
2

12.3+/-0.6

9+/-0.4
FEATURES
High power gain:

4.8MAX
1.2+/-0.4
Pout>16W, Gp>16dB @Vds=12.5V,f=30MHz

12.3MIN
Integrated gate protection diode 0.8+0.10/-0.15

1 2 3
APPLICATION 0.5+0.10/-0.15
2.5 2.5
For output stage of high power amplifiers in

4.5+/-0.5
5deg

3.1+/-0.6
HF band mobile radio sets.
PINS
1:GATE
9.5MAX 2:SOURCE
3:DRAIN
note:
RoHS COMPLIANT Torelance of no designation means typical value.
Dimension in mm.
RD16HHF1-501 is a RoHS compliant product.
This product includes the lead in high melting temperature type solders.
However, it is applicable to the following exceptions of RoHS Directions.
1.Lead in high melting temperature type solders(i.e.tin-lead solder alloys containing more than85% lead.)

Publication Date : Jun．2019

1
< Silicon RF Power MOS FET (Discrete) >

RD16HHF1
RoHS Compliance, Silicon MOSFET Power Transistor 30MHz,16W

ABSOLUTE MAXIMUM RATINGS

(Tc=25°C UNLESS OTHERWISE NOTED)
SYMBOL PARAMETER CONDITIONS RATINGS UNIT
VDSS Drain to source voltage Vgs=0V 50 V
VGSS Gate to source voltage Vds=0V -5 to +10 V
Pch Channel dissipation Tc=25°C 56.8 W
Pin Input power Zg=Zl=50 0.8 W
ID Drain to source current - 5 A
Tch Channel temperature - 150 °C

Tstg Storage temperature - -40 to +150 °C

Rth j-c Thermal resistance junction to case 2.2 °C/W

Note 1: Above parameters are guaranteed independently.

ELECTRICAL CHARACTERISTICS (Tc=25°C , UNLESS OTHERWISE NOTED)

LIMITS UNIT
SYMBOL PARAMETER CONDITIONS
MIN TYP MAX.
IDSS Zero gate voltage drain current VDS=17V, VGS=0V - - 10 uA
IGSS Gate to source leak current VGS=10V, VDS=0V - - 1 uA
VTH Gate threshold voltage VDS=12V, IDS=1mA 1.7 - 4.7 V
Pout Output power VDS=12.5V, Pin=0.4W, 16 19 - W
D Drain efficiency f=30MHz, Idq=0.5A 55 65 - %
Load VSWR tolerance VDS=15.2V,Po=16W(Pin Control) No destroy -
f=30MHz,Idq=0.5A,Zg=50
Load VSWR=20:1(All Phase)
Note : Above parameters , ratings , limits and conditions are subject to change.

Publication Date : Jun．2019

2
< Silicon RF Power MOS FET (Discrete) >

RD16HHF1
RoHS Compliance, Silicon MOSFET Power Transistor 30MHz,16W

TYPICAL CHARACTERISTICS

CHANNNEL DISSIPATION VS.

AMBIENT TEMPERATURE
100
CHANNEL DISSIPATION Pch(W)

80

60

40

20

0
0 40 80 120 160 200
AMBIENT TEMPERATURE Ta(°C)

Vds VS. Ciss CHARACTERISTICS

80
Ta=+25°C
f=1MHz

60
Ciss(pF)

40

20

0
0 5 10 15 20
Vds(V)

Vds VS. Coss CHARACTERISTICS Vds VS. Crss CHARACTERISTICS

100 10
Ta=+25°C
Ta=+25°C f=1MHz
f=1MHz

80 8

6
60
Crss(pF)
Coss(pF)

4
40

2
20

0
0
0 5 10 15 20
0 5 10 15 20
Vds(V)
Vds(V)

Publication Date : Jun．2019

3
< Silicon RF Power MOS FET (Discrete) >

RD16HHF1
RoHS Compliance, Silicon MOSFET Power Transistor 30MHz,16W

TYPICAL CHARACTERISTICS

Pin-Po CHARACTERISTICS

50 Ta=+25°C 100
f=30MHz
Vds=12.5V Po
Idq=0.5A
40 80
Po(dBm) , Gp(dB) , Ids(A)

ηd
30 60

ηd(%)
Gp

20 40

10 20
Ｉds

0 0
0 10 20 30
Pin(dBm)

Pin-Po CHARACTERISTICS

25 Ta=25°C
100
f=30MHz
Vds=12.5V Po
Idq=0.5A
20 80
ηd
Po(W) , Ids(A)

15 60
ηd(%)

10 40

5 20
Ids

0 0
0.0 0.2 0.4 0.6 0.8
Pin(W)

Vds-Po CHARACTERISTICS

25 5
Ta=25°C
f=30MHz
Pin=0.6W
Idq=0.5A
20 Zg=ZI=50 ohm
Po 4

15 3
Ids(A)
Po(W)

Ids

10 2

5 1

0 0
4 6 8 10 12 14
Vds(V)

Publication Date : Jun．2019

4
< Silicon RF Power MOS FET (Discrete) >

RD16HHF1
RoHS Compliance, Silicon MOSFET Power Transistor 30MHz,16W

TEST CIRCUIT(f=30MHz)

VGS VDS
1000pF 22000pF 0.1μF 1000pF 22000pF 0.1μF

200μF
L5
8.2kΩ

1000pF 22000pF 0.1μF

50μH
1kΩ
27Ω 88pF 470pF
RF_OUT
470pF RD16HHF1 L3 L4
RF_IN L1 L2 27Ω

470pF
470pF 100pF
27Ω
270Ω 200pF 200pF

470pF

1.5 2

7 11

12 34
35 39
66 43
90 47
100 65
90
100

L1 : 9Turns,I.D5.6mm,D0.9mm enamele wire Dimensions : mm

L2 : 5Turns,I.D5.6mm,D0.9mm enamele wire Note : Board material PTFE substrate
L3 : 5Turns,I.D5.6mm,D0.9mm,P=1mm enamele wire micro strip line width=4.2mm/50Ω,er=2.7,t=1.6mm
L4 : 10Turns,I.D5.6mm,D0.9mm enamele wire
L5 : 4Turns,I.D5.6mm,D0.9mm,P=1mm enamele wire

Publication Date : Jun．2019

5
< Silicon RF Power MOS FET (Discrete) >

RD16HHF1
RoHS Compliance, Silicon MOSFET Power Transistor 30MHz,16W

RD16HHF1 S-PARAMETER DATA (@Vds=12.5V, Id=500mA)

Freq. S11 S21 S12 S22
[MHz] (mag) (ang) (mag) (ang) (mag) (ang) (mag) (ang)
50 0.669 -129.4 33.102 99.5 0.017 27.3 0.516 -118.9
100 0.637 -148.3 16.405 78.3 0.016 28.4 0.545 -141.0
150 0.667 -155.5 10.443 65.0 0.015 47.4 0.606 -148.4
175 0.687 -158.0 8.723 59.3 0.016 58.1 0.632 -151.4
200 0.708 -160.4 7.390 54.0 0.018 68.4 0.664 -154.5
250 0.746 -164.7 5.529 44.9 0.025 80.2 0.718 -158.8
300 0.780 -168.7 4.302 36.4 0.034 85.1 0.758 -164.6
350 0.808 -172.6 3.449 29.6 0.045 86.2 0.803 -168.2
400 0.833 -176.3 2.802 22.5 0.055 84.5 0.826 -174.6
450 0.852 -179.8 2.341 17.2 0.066 82.8 0.853 -177.5
500 0.869 176.6 1.949 11.5 0.075 80.0 0.854 176.7
550 0.881 173.4 1.682 7.3 0.087 77.7 0.876 174.6
600 0.892 170.0 1.428 3.1 0.096 74.8 0.870 169.2
650 0.899 167.0 1.266 -0.3 0.108 71.8 0.894 167.0
700 0.907 163.8 1.101 -3.8 0.117 68.8 0.891 161.2
750 0.913 160.9 1.000 -7.3 0.130 65.4 0.904 158.9
800 0.919 157.7 0.876 -9.7 0.138 62.7 0.898 153.7
850 0.924 154.8 0.800 -13.1 0.150 58.7 0.912 150.9
900 0.927 151.7 0.715 -14.8 0.157 56.3 0.905 145.7
950 0.930 148.9 0.659 -18.4 0.168 51.6 0.902 142.3
1000 0.932 145.8 0.599 -18.8 0.175 49.7 0.906 137.4

Publication Date : Jun．2019

6
< Silicon RF Power MOS FET (Discrete) >

RD16HHF1
RoHS Compliance, Silicon MOSFET Power Transistor 30MHz,16W

ATTENTION:
1.High Temperature ; This product might have a heat generation while operation,Please take notice that have
a possibility to receive a burn to touch the operating product directly or touch the product until cold after switch
off. At the near the product,do not place the combustible material that have possibilities to arise the fire.
2.Generation of High Frequency Power ; This product generate a high frequency power. Please take notice
that do not leakage the unnecessary electric wave and use this products without cause damage for human and
property per normal operation.
3.Before use; Before use the product,Please design the equipment in consideration of the risk for human and
electric wave obstacle for equipment.

PRECAUTIONS FOR THE USE OF MITSUBISHI SILICON RF POWER DEVICES:

1. The specifications of mention are not guarantee values in this data sheet. Please confirm additional details
regarding operation of these products from the formal specification sheet. For copies of the formal
specification sheets, please contact one of our sales offices.

2.RA series products (RF power amplifier modules) and RD series products (RF power transistors) are designed
for consumer mobile communication terminals and were not specifically designed for use in other applications.
In particular, while these products are highly reliable for their designed purpose, they are not manufactured
under a quality assurance testing protocol that is sufficient to guarantee the level of reliability typically deemed
necessary for critical communications elements and In the application, which is base station applications and
fixed station applications that operate with long term continuous transmission and a higher on-off frequency
during transmitting, please consider the derating, the redundancy system, appropriate setting of the maintain
period and others as needed. For the reliability report which is described about predicted operating life time of
Mitsubishi Silicon RF Products , please contact Mitsubishi Electric Corporation or an authorized Mitsubishi
Semiconductor product distributor.

3. RD series products use MOSFET semiconductor technology. They are sensitive to ESD voltage therefore
appropriate ESD precautions are required.

4. In the case of use in below than recommended frequency, there is possibility to occur that the device is
deteriorated or destroyed due to the RF-swing exceed the breakdown voltage.

5. In order to maximize reliability of the equipment, it is better to keep the devices temperature low. It is
recommended to utilize a sufficient sized heat-sink in conjunction with other cooling methods as needed (fan,
etc.) to keep the channel temperature for RD series products lower than 120deg/C(in case of
Tchmax=150deg/C) ,140deg/C(in case of Tchmax=175deg/C) under standard conditions.

6. Do not use the device at the exceeded the maximum rating condition. In case of plastic molded devices, the
exceeded maximum rating condition may cause blowout, smoldering or catch fire of the molding resin due to
extreme short current flow between the drain and the source of the device. These results causes in fire or
injury.

7. For specific precautions regarding assembly of these products into the equipment, please refer to the
supplementary items in the specification sheet.

8. Warranty for the product is void if the products protective cap (lid) is removed or if the product is modified in
any way from it’s original form.

9. For additional “Safety first” in your circuit design and notes regarding the materials, please refer the last page
of this data sheet.

Publication Date : Jun．2019

7
< Silicon RF Power MOS FET (Discrete) >

RD16HHF1
RoHS Compliance, Silicon MOSFET Power Transistor 30MHz,16W

10. Please avoid use in the place where water or organic solvents can adhere directly to the product and the
environments with the possibility of caustic gas, dust, salinity, etc. Reliability could be markedly decreased
and also there is a possibility failures could result causing a serious accident. Likewise, there is a possibility
of causing a serious accident if used in an explosive gas environment. Please allow for adequate safety
margin in your designs.

11. Please refer to the additional precautions in the formal specification sheet.

Keep safety first in your circuit designs!

Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more
reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead
to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit
designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of
non-flammable material or (iii) prevention against any malfunction or mishap.

Notes regarding these materials

•These materials are intended as a reference to assist our customers in the selection of the Mitsubishi
semiconductor product best suited to the customer’s application; they do not convey any license under any
intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party.
•Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party’s
rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application
examples contained in these materials.
•All information contained in these materials, including product data, diagrams, charts, programs and algorithms
represents information on products at the time of publication of these materials, and are subject to change by
Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore
recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor
product distributor for the latest product information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric
Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or
errors.
Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including
the Mitsubishi Semiconductor home page (http://www.MitsubishiElectric.com/).
•When using any or all of the information contained in these materials, including product data, diagrams, charts,
programs, and algorithms, please be sure to evaluate all information as a total system before making a final
decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no
responsibility for any damage, liability or other loss resulting from the information contained herein.
•Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system
that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric
Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product
contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical,
aerospace, nuclear, or undersea repeater use.
•The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part
these materials.
•If these products or technologies are subject to the Japanese export control restrictions, they must be exported
under a license from the Japanese government and cannot be imported into a country other than the approved
destination.
Any diversion or re-export contrary to the export control laws and regulations of Japan and/or the country of
destination is prohibited.
•Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for
further details on these materials or the products contained therein.

© 2017 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED.

Publication Date : Jun．2019

8