HP ProDesk 600 G3 Desktop Mini Business PC

QuickSpecs HP ProDesk 600 G3 and HP ProOne 600 G3 Business Desktops PCs
Overview
HP ProDesk 600 G3 Desktop Mini Business PC
1. USB Type-C™ charging port 5. Headset Connector

2. USB 3.1 Gen 1 port (5 Gbit/s data speed) 6. Hard drive activity light
3. USB 3.1 Gen 1 charging port (5 Gbit/s data speed) 7. Dual-state power button
4. Universal Audio Jack with CTIA headset support
Not all configuration components are available in all regions/countries. Page 1

c05373438 — DA 15826 — Worldwide — Version 46 — July 10, 2018
Overview
1. Antenna cover 7. Choice of port (DisplayPort™ 1.2, HDMI, VGA, Serial or

USB-C™) (USB-C™ option has alt mode DisplayPort™
1.2 or 15W output)
2. Cover lock switch 8. (2) USB 3.1 Gen 1 (5 Gbit/s data speed) (black)
3. Cable lock slot 9. (2) USB 3.1 Gen 1 (5 Gbit/s data speed) (black), allows
for wake from S4/S5 with keyboard/mouse when
connected and enabled in BIOS
4. External antenna connector 10. RJ-45 Network connector
5. Padlock loop 11. Power connector
6. (2) Dual-Mode DisplayPort™ 1.2 (DP++)
Not Shown
Slots (1) internal M.2 PCIe 2230 connector for optional wireless NIC
(1) internal M.2 SSD storage (2230 or 2280 connector)
Bays (1) 2.5” internal storage drive bay
VESA Support for VESA 100 mounting system on bottom of PC chassis

Overview
HP ProDesk 600 G3 Small Form Factor Business PC
1. Slim Optical Drive (optional) 6. USB 2.0 (fast charging port)

2. SD card 4.0 reader (optional) 7. Universal Audio Jack with CTIA headset support
3. USB Type-C™ charging port 8. Hard drive activity light
4. (2) USB 3.1 Gen1 ports 9. Power button
5. USB 2.0 port

Overview
1. Audio-in connector 7. Optional port (DisplayPort™, HDMI, VGA, or USB-CTM)

(USB-CTM option has alt mode DisplayPort™ or 15W
output)
2. Optional serial port available 8. (2) USB 2.0 ports with wake from S4/S5 feature
3. RJ-45 (network) jack 9. (2) USB 3.1 Gen1 ports
4. (2) USB 3.1 Gen1 ports 10. Power cord connector
5. Audio-out connector for powered audio devices 11. Cable lock slot
6. (2) Dual-Mode DisplayPort™ (DP++)
NOTE: The serial port is no longer standard to the chassis but is available as an option. A second serial port and PS/2 port PCIe combination are
available.
Not Shown
Slots (1) PCI Express x 16 graphics connector
(1) PCI Express x 4 connector
(1) internal M.2 PCIe x1 connector for optional wireless NIC
(1) internal M.2 PCIe x4 connector for optional Turbo Drive SSD
Bays (1) 3.5” internal storage drive bay or 2.5” internal storage drive bay (2.5” drive needs adapter)
(1) 9.5mm slim optical drive bay

Overview
HP ProDesk 600 G3 and 680 G3 Microtower Business PC
1. 5.25-inch drive bay (behind bezel) 1. Audio-in connector

2. Slim optical drive (optional) 2. Dual-Mode DisplayPort™ 1.2 (DP++) (2)
3. Dual-state power button 3. Optional port (DisplayPort™ 1.2, HDMI, VGA, or
USB-C™) (USB-C™option has alt mode
DisplayPort™ 1.2 or 15W output)
4. Hard drive activity light 4. (2) USB 2.0 Ports with Wake from S4/S5 feature
5. Universal Audio Jack with CTIA headset support 5. (2) USB 3.1 Gen1 ports
6. USB 2.0 (fast charging port*) 6. Cable lock slot
7. USB 2.0 port 7. RJ-45 (network) jack
8. (2) USB 3.1 Gen1 ports 8. Optional serial port available
9. USB Type-C™ charging port 9. (2) USB 3.1 Gen1 ports
10. SD card 4.0 reader (optional) 10. Power cord connector
11. Audio-out connector for powered audio devices
*This port connects a USB device, provides high-speed data transfer, and even when the computer is off, charges products such as a cell phone,
camera, activity tracker, or smartwatch.
NOTE: When a device is plugged into the headset jack, a dialog box will open asking if you want to use the connector for a microphone line-in
device or a headphone. You can reconfigure the connector at any time by double-clicking the Audio Manager icon in the Windows® taskbar.
The serial port is no longer standard to the chassis but is available as an option. A second serial port and PS/2 port PCIe combination are
available.

Overview
Not Shown
Slots (2) PCI Express x16 graphics connectors; one wired as an x4
(1) PCI Express x1 accessory connector
(1) PCI Express x1 accessory connector or PCI x1 accessory connector
(1) internal M.2 PCIe x1 connector for optional wireless NIC
(1) internal M.2 PCIe x4 connector for optional Turbo Drive SSD
NOTE: Select models will offer (1) PCI Express x1 accessory connector and (1) PCI connector instead of (2) PCI Express x1 accessory
connectors
NOTE: Maximum total of 4 PCI slots supported on MT.
Bays (1) 5.25” internal half-height drive bay or (2) 2.5” internal storage drive bays
(1) 3.5” internal storage drive bays
(1) 9.5mm internal optical drive bay

Overview
HP ProOne 600 G3 21.5-inch All-in-One Business PC
1. Webcam Microphone 4. Webcam lens

2. Webcam LED 5. Speakers
3. Webcam shutter

Overview
1. Power button 4. Headset jack

2. USB 3.1 Gen 1 charging port (5 Gbit/s data speed) 5. Media card reader
3. USB 3.1 Gen 1 port(5 Gbit/s data speed) 6. Optical disc drive
7. Optical disc drive eject button

Overview
REAR/PORTS (BEHIND SECURITY COVER)
1. Security cable slot 6. Dual-Mode DisplayPort™ 1.2 (DP++) connector

2. Serial port (optional) 7. (2) USB 3.1 Gen 1 charging ports (5 Gbit/s data
speed)
3. PS/2 keyboard connector (optional) 8. (2) USB 2.0 Type-A ports with Wake from S4/S5
feature
4. PS/2 mouse connector (optional) 9. RJ-45 (network) jack
5. Power connector
Not Shown
Slots (1) internal M.2 PCIe x1 connector for optional wireless NIC
(1) internal M.2 PCIe x4 connector for optional Turbo Drive
SSD
Bays (1) 2.5” internal storage drive bay
VESA Support for VESA 100 mounting system on bottom of PC chassis*

Overview
*Mounting hardware sold separately (see Accessories section).

Overview
AT A GLANCE
• Choice of four form factors: Desktop Mini, Small Form Factor, Microtower and All-in-One Non-Touch only
• New commercial design on Desktop Mini, Small Form Factor, Microtower
• HP developed- and engineered UEFI BIOS supporting security, manageability and software image stability
• Intel® Q270 chipset supporting both Intel® 7 Generation and Intel® 6th generation Core™ processors, featuring integrated
Intel® HD Graphics and optional Intel® vPro™ Technology (vPro is optional and requires factory configuration, available with
Core i5 and Core i7 processors only)
• Processor support up to 65W (MT/SFF/AiO), 35W (DM)
• Support for Windows 10 to Windows 7 Downgrade with Intel® 6th Generation processors
• Intel® Ethernet Connection I219LM GbE LOM integrated network connection
• DDR4 Synchronous Dynamic Random Access Memory (SDRAM)
• Support for up to three monitors (on MT/SFF/DM form factors) via two standard DisplayPort™ 1.2connectors and an optional
third video port connector which provides the following choices: HDMI, VGA, DisplayPort™ 1.2, or USB Type-C™ with
DisplayPort™ 1.2 (see Ports section or pages 1-8 for port availability by platform).
• Configurable 3rd rear I/O video port (HDMI, DisplayPort™ 1.2, VGA, Type-C with DisplayPort™ 1.2) (except AiO)
• Multiple data drives setup in a RAID array is optional and requires product to be configured with vPro at purchase
• HP BIOSphere Gen3
• HP Manageability Integration Kit
• HP WorkWise
• Standard and high efficiency energy saving power supply options (Standard AiO power supply is high efficiency, energy
saving)
• ENERGY STAR® certified. EPEAT® Gold registered where applicable/supported. Registration may vary by country. See
www.epeat.net for registration status by country.
• CCC, CECP & SEPA Certified
• Optimized for Skype for Business (AiO only)
• TCO AiO and TCO Edge (AiO only)
• PC chassis and all internal components and modules are manufactured with low halogen content 3
• Arsenic-free
• Dust filter available for Desktop Mini, Small Form Factor, Microtower
• Protected by HP Services, including limited warranties up to 3-3-3 (terms and conditions vary by country; certain restrictions
and exclusions apply); Care Packs available with up to 5 years Next Business Day Onsite Hardware Support
• Lengthy purchase lifecycles and image stability
NOTE: See important legal disclosures for all listed specs in their respective features sections.
1. Multi-Core is designed to improve performance of certain software products. Not all customers or software applications will
ecessarily benefit from use of this technology. Performance and clock frequency will vary depending on application workload and
your hardware and software configurations. Intel’s numbering is not a measurement of higher performance.
2. DisplayPort™ multi-stream monitors ‘daisy-chained’ together.
3. External power supplies, power cords, cables and peripherals are not low halogen. Service parts obtained after purchase may not be
low halogen.

Standard Features and Configurable Components
OPERATING SYSTEMS
Preinstalled
Windows 10 Pro 641
Windows 10 Pro 64 (National Academic License)3
Windows 10 Home 641
Windows 10 Home Single Language 641
Windows 7 Professional 64 (available through downgrade rights from Windows 10 Pro)2, 4
Windows 7 Professional 32 (available through downgrade rights from Windows 10 Pro) 2, 4
Pre-installed (other)
FreeDOS 2.0
NeoKylin Linux® 64
Web-supported only
Windows 10 Enterprise 641
Windows 7 Enterprise 644
1. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately
purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is
automatically updated, which is always enabled. ISP fees may apply and additional requirements may apply over time for
updates. See http://www.windows.com.
2. This system is preinstalled with Windows 7 Pro software and also comes with a license and media for Windows 10 Pro
software. You may only use one version of the Windows software at a time. Switching between versions will require you to
uninstall one version and install the other version. You must back up all data (files, photos, etc.) before uninstalling and
installing operating systems to avoid loss of your data.
3. Some devices for academic use will automatically be updated to Windows 10 Pro Education with the Windows 10 Anniversary
Update. Features vary; see https://aka.ms/ProEducation for Windows 10 Pro Education feature information.
4. Only available with 6th generation (Intel) processors.
CHIPSET
Intel® Q270
PROCESSORS*, **
*NOTE: In accordance with Microsoft’s support policy, HP does not support the Windows® 8 or Windows 7 operating system on
products configured with Intel and AMD 7th generation and forward processors or provide any Windows® 8 or Windows 7 drivers
on http://www.support.hp.com
**Note: Multi-Core is designed to improve performance of certain software products. Not all customers or software applications
will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application
workload and your hardware and software configurations. Intel’s numbering is not a measurement of higher performance.
Intel® 7th Generation Core™ i7 Processors DM SFF MT AiO

Intel® Core™ i7-7700 Processor X X X
65W
Up to 4.2 GHz Max. Turbo Frequency (3.6 GHz base frequency)
8 MB cache, 4 cores, 8 threads
Intel® HD Graphics 630
Supports DDR4 memory up to 2400 MT/s data rate
Supports Intel® vProTM Technology and Intel® Stable Image
Platform Program (SIPP)


Intel® Core™ i7-7700T Processor X
35W

65W
35W
65W
35W

51W
3.9 GHz base frequency
35W


51W
35W
51W
4.1GHz base frequency
Intel® 7th Generation Pentium® Processors DM SFF MT AiO

Intel® Pentium® G4560 Processor X X X
54W
3.5 GHz Base Frequency
Intel® Pentium® G4560T Processor X
35W
51W
Intel® Pentium® G4600T Processor X
35W
51W


Intel® 7th Generation Celeron® Processors DM SFF MT AiO
Intel® Celeron ® G3930 Processor X X X
51W
Intel® Celeron ® G3930T Processor X
35W
Intel® Celeron ® G3950 Processor X X X
51W

65W
35W

65W
35W


65W
35W

51W
35W
Intel® 6th Generation Pentium® Processors DM SFF MT AiO

Intel® Pentium ® G4400 Processor X X
54W
AiO
Intel® 6th Generation Celeron® Processors DM SFF MT
Intel® Celeron ® G3900 Processor X
51W

MEMORY*
Form Factor Type Maximum Number of Slots
Desktop Mini DDR4-2400 (Transfer rates up 32 GB 2 SODIMM
to 2400 MT/s)
Small Form Factor DDR4-2400 (Transfer rates up 64 GB 4 DIMM
to 2400 MT/s)
Microtower DDR4-2400 (Transfer rates up 64 GB 4 DIMM
to 2400 MT/s)
All-in-One DDR4-2400 (Transfer rates up 32 GB 2 SODIMM
to 2400 MT/s)
Memory modules available. Memory options vary by platform. All slots are customer accessible / upgradeable.
• 2,048 MB (2048 MB x 1) (AMO only)
• 4,096 MB (4096 MB x 1)
• 8,192 MB (8192 MB x 1)
• 16,384 MB (16,384 MB x 1)
* Full availability of 4 GB or more of memory requires a 64-bit operating system. With Windows 32-bit operating systems, the
amount of usable memory is dependent upon your configuration, so that above 3 GB all memory may not be available due to
system resource requirements.
Memory modules support data transfer rates up to 2400 MT/s; actual data rate is determined by the system’s configured
processor. See processor specifications for supported memory data rate.
STORAGE*
2.5 inch 7.2k RPM Hard Disk Drives DM SFF MT AiO
1TB SATA X X X X
500GB SATA X X X X
3.5" SATA 7.2k RPM Hard Disk Drives DM SFF MT AiO

500GB 7200RPM 3.5in X X
1TB 7200RPM 3.5in X X
2TB 7200RPM 3.5in X X
2.5 inch Solid State Hybrid Drives (SSHD) DM SFF MT AiO

1TB 5400RPM 2.5in 8GB Hybrid X X X X
500GB 5400RPM 2.5in 8GB Hybrid X X X X
3.5 inch Solid State Hybrid Drives (SSHD) DM SFF MT AiO

1TB 7200RPM 3.5in SSHD (SSHD) X X
2.5 inch Self-encrypting Drives (SED HDD) DM SFF MT AiO

500GB 5400RPM 2.5in Federal Information Processing Standard X X X X
(FIPS) SED
500GB 7200RPM 2.5in SED OPAL2 X X X X

2.5 inch Self-encrypting Drives (SED SSD) DM SFF MT AiO

256GB TLC SED SSD Opal 2 Drive X X X X
512GB TLC SED SSD Opal 2 Drive X X X X
256GB TLC SED SSD 2.5in Federal Information Processing X X X X
Standard (FIPS) SED
512GB TLC SED SSD 2.5in Federal Information Processing X X X X
Standard (FIPS) SED
PCIe NMVe SSD Drives DM SFF MT AiO

HP 256GB Turbo Drive G2 PCIe TLC SSD Drive X X X
HP 512GB Turbo Drive G2 PCIe TLC SSD Drive X X X
HP 1TB Turbo Drive G2 PCIe TLC SSD Drive X X X
HP 256GB PCIe NVMe SSD Drive X
HP 512GB PCIe NVMe SSD Drive X
HP 256GB PCIe NVMe TLC SSD Drive X
HP 512GB PCIe NVMe TLC SSD Drive X
HP 1TB PCIe NVMe TLC SSD Drive X
2.5 SATA SSD Drives DM SFF MT AiO

HP SATA 128GB SSD Drive X X X
HP SATA 256GB SSD Drive X X X
HP SATA 256GB TLC SSD Drive X
HP SATA 512GB TLC SSD Drive X
*For storage drives, GB = 1 billion bytes, TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30GB of
system disk is reserved for system recovery software.
Optical Disc Drives DM SFF MT AiO

HP 9.5mm G3 800/600 Tower DVD-Writer* X
HP 9.5mm G3 800/600 Tower DVD-ROM X
HP 9.5mm G3 800/600/400 SFF G4 400 Microtower DVD-Writer* X
HP 9.5mm G3 800/600/400 SFF G4 400 Microtower DVD-ROM X
HP 9.5mm ProOne AIO 600 G3 Ultra slim DVD-Writer Drive X
HP 9.5mm ProOne AIO 600 G3 Ultra slim DVD-ROM Drive X
*HD-DVD discs cannot be played on this drive. No support for DVD-RAM. Actual speeds may vary. Don’t copy
copyright-protected materials. Double Layer discs can store more data than single layer discs. Discs burned
with this drive may not be compatible with many existing single-layer DVD drives and players.
Removable DM SFF MT AiO

HP 9.5mm Slim Removable SATA 500GB X X X
HP 3.5" Removable SATA HDD Frame/Carrier X


Media Card Reader (optional) DM SFF MT AiO
SD4 with 5-in-1 Interface from SD option to PCA is USB X X
(Supports SD, SDXC, SDHC, UHS-I, UHS-II)
SD3 with 4-in-1 Interface from SD option to PCie X
(Supports SD, SDXC, SDHC, UHS-I)
GRAPHICS
System Integrated Graphics DM SFF MT AiO
Intel® HD Graphics 530 (integrated on 6th gen Core i7/i5/i3 processors) X X X X
Intel® HD Graphics 630 (integrated on 7th gen Core i7/i5/i3 processors and X X X X
Pentium G4620, 4600, 4600T )
Intel® HD Graphics 610 (integrated on Pentium G4560, G4560T, Celeron X X X X
G3950, G3930, G3930T)
Optional Discrete Graphics Solutions

(optional and RX 460 devices and GT 730 1GB HDMI card, they must
be configured at purchase) DM SFF MT AiO
AMD Radeon™ R7 430 2GB LP 2DP PCIe x16 GF card X X
AMD Radeon™ R7 450 4GB FH PCIe x16* X
AMD Radeon™ RX 460 2GB FH PCIe x16* X
NVIDIA® GeForce® GT 730 1GB PCIe x8 HDMI X X
NVIDIA® GeForce® GT 730 2GB PCIe x8 DP X X
*Requires 250W chassis
2nd Graphics Cards DM SFF MT AiO
AMD Radeon™ R7 430 2GB LP 2DP PCIe x16 GF card 2nd** X
AMD Radeon™ R7 450 4GB FH PCIe x16 G5 2nd** X
NVIDIA® GeForce® GT 730 1GB PCIe x8 HDMI 2nd*** X
NVIDIA® GeForce® GT 730 2GB PCIe x8 DP 2nd**** X
**Available only with AMD Radeon™ R7 450.
***Available only with NVIDIA® GeForce® GT730 1GB.
****Available only with NVIDIA® GeForce® GT730 2GB.
Display (All-in-One models only)

21.5" diagonal IPS widescreen WLED backlit anti-glare LCD display
Orientation designed to operate in portrait or landscape mode (Additional stand or mount needed for AiO to be used in
portrait mode.)
Non-touch
Display Panel Type IPS WLED Backlit LCD

Viewable image area (mm) 476.064 x 267.786


Screen opening (mm) 478.06 x 269.79
Native Resolution (HxV) 1920 x 1080
Aspect ratio 16:9
Pixel pitch (HxV)(mm) 0.247 x 0.247
Contrast ratio (typical) 1000:1
Brightness (typical) Non-Touch 250nits (cd/m2)
Viewing angle (typical) (HxV) 178 ° x 178 °
Backlight lamp life (to half brightness) 30,000 hours minimum
Color support Over 16 million colors
Color gamut (typical) 72%
Anti-glare Yes
Default color temperature Warm (6500K)
Response Time 14 ms
NOTE: All performance specifications represent the typical specifications provided by HP's
component manufacturers; actual performance may vary either higher or lower.
Easel Stand Tilt Angle -5° (+/-3°) to +70° (+/-3°)

Adjustable Height Height - vertical/landscape 126.55 mm (±3 mm)
Stand: adjustment:
Tilt Angle - Landscape -5° to +20° (+/-3°)
Title Angle – Low Position -5° to +20° (+/-3°)
Rotation(swivel) None
WEBCAM & MIC (All-in-One models only)

Optional integrated 1 MP webcam & microphone; maximum resolution of 1280 x 720; up to 30 frames/sec
Optional integrated 2 MP webcam & microphone; maximum resolution of 1920 x 1080; up to 30 frames/sec
AUDIO/MULTIMEDIA
DM SFF MT AiO
Conexant CX20632 Audio Codec X X X
Conexant CX5001 Codec X
Headset* front connector (3.5mm) X X X
Headphone front connector (3.5mm) X
Line-out rear connector* (3.5mm) X X
Line-in rear connector* (3.5mm) X X
Headset side port (3.5mm) X
Multi-streaming capable* X X X


Internal speaker (standard) X X X
High performance integrated stereo speakers X
* The DM, SFF, MT front headset connector supports CTIA style headsets. The AIO front headset connector supports both CTIA
and OMTP style headsets. Headset connectors are retaskable to function as a Line-In, Microphone-In, Line-out or Headphone-
out port. Rear audio input ports are re-taskable as a Line-in or Microphone-in port. External speakers must be powered
externally. Multi-streaming can be enabled in the audio control panel to allow independent audio streams to be sent to/from
the front and rear jacks. This allows for different audio applications to use separate audio ports on the system. For example,
the front jacks could be used with a headset for a communications application while the rear jacks are being used with external
speakers and a multimedia application.
NETWORKING/COMMUNICATIONS*
Ethernet (RJ-45) Integrated DM SFF MT AiO
Intel® I219LM Gigabit Network Connection LOM (standard X X X X
Ethernet (RJ-45) Optional DM SFF MT AiO

Intel® Ethernet I210-T1 PCIe x1 Gb Network Interface Card (optional) X X
Wireless LAN (optional and all except for 7265 for SFF/MT must be bought at purchase) DM SFF MT AiO

Intel® 8265 802.11AC 2x2 Wi-Fi +Bluetooth M.2 Combo Card vPro™ ( X X X X
802.11AC Wave 2 supported)
Intel® 8265 802.11AC 2x2 Wi-Fi +Bluetooth M.2 Combo Card non-vPro™ X X X X
(802.11AC Wave 2 supported)
Intel® 7265 802.11AC 2x2 Wi-Fi +Bluetooth M.2 Combo Card non-vPro™ X X X X
Intel® 7260 802.11 a,b,g,n 2x2 M.2 Bluetooth® Disabled NIC** X
 X X X X
Intel® 3168 802.11AC 2x2 Wi-Fi +Bluetooth M.2 Combo Card non-vPro™
* Wireless access point and Internet service required and not included. Availability of public wireless access points
limited.
**Wake on Lan feature is not available.
SLOTS
DM SFF MT AiO
Turbo Drive (M.2 PCIe) 1 ea. M.2 PCIe x1-2230 1 ea. M.2 PCIe x1- 1 ea. M.2 PCIe x1-2230 1 ea. M.2 PCIe x1-2230
(for WLAN) 2230 (for WLAN) (for WLAN)
(for WLAN) 1 ea. M.2 PCIe x4-2280 1 ea. M.2 PCIe x4-
1 ea. M.2 PCIe x4- 1 ea. M.2 PCIe x4- (for storage) 2280/2230 combo (for
2280/2230 (for storage) 2280 storage)
(for storage)
PCI Express x1 (v3.0) N/A N/A 2 ea.* (1 optional)) N/A
4.2” full height
6.6” length
10W max. power
PCI Express x 4 (v3.0) N/A 1 ea. N/A N/A
2.5’’ low profile
6.6’’ length
35W max. power


PCI Express x16 (v3.0) N/A N/A 1 ea. N/A
(wired as a x4) 2.5” low profile
6.6” length
35W max. power
PCI Express x16 (v3.0) N/A 1 ea. 1 ea. N/A
2.5” low profile 4.2” full height
6.6” length 6.6” length
35W max. power 75W max. power
Optional PCI N/A N/A 1 ea. N/A
4.2” full height
6.6” length
*Models configured with optional PCI slot with 1 PCI Express x1(v3.0) instead of 2.
NOTE: Maximum total of 4 PCI slots supported on MT.
PORTS
DM SFF MT AiO
USB 2.0 N/A 2 (front) including 1 2 (front) including 1 2 (rear)
fast charging; 2 (rear) fast charging; 2 (rear)
USB 3.1 Gen1 2 (front) including 1 2 (front); 4 (rear) 2 (front); 4 (rear) 2 (side) including 1 fast
fast charging; 4 (rear) charging, 2 (rear)
USB Type-C™3.1 Gen1 port 1 (front); 1 (optional) 1 (front); 1 (optional) 1 (front); 1 (optional) N/A
(rear) (rear) (rear)
Video 2 DisplayPort™ 1.2 with 2 DisplayPort™ 1.2 with 2 DisplayPort™ 1.2 with 1 DisplayPort™ 1.2
multi-stream multi-stream multi-stream with
1 port (choice of 1 Optional port 1 Optional port multi-stream
DisplayPort™ 1.2, (DisplayPort™ 1.2, (DisplayPort™ 1.2,
HDMI, VGA or USB-CTM) HDMI, VGA or USB-CTM) HDMI, VGA or USB-CTM)
(USB-CTM option has alt (USB-CTM option has alt (USB-CTM option has alt
mode DisplayPort™ 1.2 mode DisplayPort™ 1.2 mode DisplayPort™ 1.2
or 15W output) or 15W output) or 15W output)
Audio Front: 1 Headset and Front: 1 Headset Front: 1 Headset Side: 1 Headset
Headphone Rear: 1 Audio-out Rear: 1 Audio-out
1 Audio-in 1 Audio-in
Network Interface RJ-45 RJ-45 RJ-45 RJ-45

Serial (RS-232) 1 (optional)* 1 (optional) 1 (optional) N/A
Serial (RS-232) and (2) PS/2 N/A 1 (optional) (rear) 1 (optional) (rear) N/A
combination*
Serial (RS-232), PS/2, and Hood N/A N/A N/A 1 (optional)(rear)
sensor combination
*This card comes with a Serial Port and 2 PS/2 ports (3 ports total)
I/O Ports — Internal ports
DM SFF TWR AiO
DM SATA storage
1 N/A N/A N/A
connector
AiO SATA storage
N/A N/A N/A 2
connector


Internal SATA
N/A 2 4 N/A
storage connector(s)
BAYS
DM SFF MT AiO
5.25" Half Height ** N/A N/A 1 ea. N/A
9mm Slim ODD N/A 1 ea. 1 ea. 1 ea.
Secure Digital (SD) 4 Reader N/A 1 ea. 1 ea. N/A
Secure Digital (SD) 3 Reader N/A N/A N/A 1 ea.
2.5” internal storage drive 1 ea. 1 ea.* 2 ea. 1 ea.
3.5” internal storage drive N/A 1 ea.* 1 ea. N/A
*SFF can be configured with either (1) 3.5” or (1) 2.5” internal storage drive (2.5 inch drive needs adapter)
**The HP G2 5.25 ODD is also compatible with the G3 MT Chassis

KEYBOARDS AND POINTING DEVICES (optional)

Keyboards DM SFF MT AiO
HP Conferencing Keyboard X X X X
HP USB PS/2 Washable Keyboard* X X X X
HP USB Business Slim CCID SmartCard Keyboard X X X X
HP USB Business Slim Keyboard X X X X
HP PS/2 Business Slim Keyboard* X X X
HP USB Business Slim Keyboard (China only) X X X X
HP USB Business Slim Grey Keyboard X X X X
Mice DM SFF MT AiO
HP PS/2 Mouse* X X X
HP USB 1000dpi Laser Mouse X X X X
HP Grey V2 Mouse X X X` X
HP USB Mouse X X X X
HP USB PS/2 Washable Mouse* X X X X
HP USB Mouse (China only) X X X X
HP USB Hardened Mouse X X X X
Combo DM SFF MT AiO
HP Wireless Business Slim Keyboard and Mouse X X X X
HP USB Keyboard and Mouse (China only) X X X X
Other DM SFF MT AiO
HP Mouse Pad X X X X
*Optional HP Internal Serial/PS/2 Ports is required to support this device.
ADAPTERS AND CABLES (optional)

DM SFF MT AiO
HP DisplayPort™ 1.2 Cable X X X X
HP DisplayPort™ 1.2 to DVI-D Adapter X X X X
HP DisplayPort™ 1.2 to HDMI 4K Adapter X X X X
HP DisplayPort™ 1.2 to VGA Adapter X X X X
HP DVI Cable X X X X
HP 700mm DisplayPort™ 1.2 Cable Kit X
HP USB to Serial Port Adapter X X
I/O Devices
Optional Ports (only one can be chosen) must be configured at purchase except for PCIe x1 cards.
DM SFF MT AiO
HP DisplayPort™ 1.2 Port X X X
HP USB Type-C™ 1.2 Port X X X
HP HDMI Port X X X
HP VGA Port X X X


HP Internal Serial Port X* X*
HP Internal Serial/PS/2 Ports X* X*
HP Serial / PS/2 / Hood Sensor Module X
HP PCIe x1 Parallel Port Card X X
HP PCIe x1 SuperSpeed USB 3.1 Gen 2 Type-C Card X X
DUST FILTERS
DM SFF MT AiO
HP ProDesk 600 G3 Microtower Dust Filter X
HP ProDesk 600/400 G3 SFF Dust Filter X
HP G3 Mini Dust Filter X
* Internal Serial Port and HP Internal Serial/PS/2 Ports can both be selected for MT and SFF
DESKTOP MINI ACCESSORIES (optional)

DM SFF MT AiO
HP Desktop Mini DVD-Writer ODD Expansion Module X
HP Desktop Mini 500GB HDD/ I/O Expansion Module X
HP Desktop Mini I/O Expansion Module X
HP Desktop Mini Security/Dual VESA Sleeve X
HP DM VESA Power Supply Holder X
HP DM VESA Quick Deploy Adhesive X
HP Desktop Mini Vertical Chassis Stand X
HP Desktop Mini Port Cover Kit X
HP Quick Release Bracket X
HP DM Antenna/Wiring WLAN Kit X
HP PC Mounting Bracket for Monitors X
AIO STANDS (optional)

DM SFF MT AiO
HP 600 G3 AIO no stand (Ships with cosmetic VESA cover) X
HP 600 G3 AIO Adjustable Height Stand X
HP 600 G3 AIO Easel Stand X
SOFTWARE COMPONENTS AND APPLICATIONS WITH WINDOWS

BIOS
HP BIOSphere Gen31
HP DriveLock | HP Automatic DriveLock
BIOS Update via Network
Master Boot Record Security
Power On Authentication
Secure Erase2
Absolute Persistence Module3
Pre-boot Authentication


HP LAN-WLAN Protection
HP Wireless Wakeup
Multi Media
CyberLink Power Media Player (select models only)
CyberLink Power2Go (select models only)
Communication / Connectivity
Native Miracast Support4
HP Value Add Software

HP ePrint Driver + JetAdvantage5
HP Hotkey Support - CMIT
HP Recovery Manager
HP Recovery Disc Creator (Windows 7 only)
HP Jumpstart
HP Support Assistant
HP Noise Cancellation Software
HP Velocity
HP Notifications
3rd Party
Foxit PhantomPDF Express for HP (Windows 7 only)
Microsoft Products
Buy Office
Bing Search
Skype6
Manageability
HP Driver Packs7
HP SoftPaq Download Manager (SDM)
HP System Software Manager (SSM)7
HP BIOS Config Utility (BCU)7
HP Client Catalog8
HP Manageability & Integration Kit (MIK)7
LANDESK Management8
For more information on HP Client Management Solutions refer to: http://www.hp.com/go/clientmanagement
Client Security Software

HP Client Security
• HP Security Manager (including Credential Manager and Password Manager)
• HP Drive Lock
• HP Password Manager
• Absolute Persistence Module
• Power On Authentication
Microsoft Security Essentials9 (Windows 7 only)

Microsoft Defender (Windows 10 only)
HP WorkWise (requires Bluetooth)10
Standard
Trusted Platform Module (TPM) 2.0 (Infineon SLB9670). Common Criteria EAL4+ Certified.


Downgradeable to TPM 1.2. Convertible to FIPS 140-2 Certified mode. (TPM 2.0 is not available for Win 7 32-bit.) Restrictions
apply; contact your account manager for more details.
For more information on HP Client Security Software Suite, refer to http://www.hp.com/go/clientsecurity.
1 HP BIOSphere Gen 3 requires Intel® or AMD 7th generation processors.

2 For the methods outlined in the National Institute of Standards and Technology Special Publication 800-88.
3 Absolute agent is shipped turned off, and will be activated when customers activate a purchased subscription. Subscriptions can be purchased
for terms ranging multiple years. Service is limited, check with Absolute for availability outside the U.S. The Absolute Recovery Guarantee is a
limited warranty. Certain conditions apply. For full details visit: http://www.absolute.com/company/legal/agreements/ computrace-
agreement. Data Delete is an optional service provided by Absolute Software. If utilized, the Recovery Guarantee is null and void. In order to
use the Data Delete service, customers must first sign a Pre-Authorization Agreement and either obtain a PIN or purchase one or more RSA
SecurID tokens from Absolute Software.
4 Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming media players that also support
Miracast. You can use Miracast to share what you’re doing on your PC and present a slide show. For more information:
http://windows.microsoft.com/en-us/windows-8/project-wireless-screen-miracast
5 Requires an Internet connection to HP web-enabled printer and HP ePrint account registration (for a list of eligible printers, supported
documents and image types and other HP ePrint details, see www.hp.com/go/eprintcenter). Print times and connection speeds may vary.
6 Skype is not offered in China.
6 Not preinstalled, however available for download at http://www.hp.com/go/clientmanagement.
7 HP Management Integration Kit is available for download at http://www.hp.com/go/clientmanagement.
9 Opt in and internet connection required for updates.
10 HP WorkWise smartphone app is available as a free download on the App Store and Google Play. Requires Windows 10 Build 1607 or higher).
HP BIOS
Key features of the HP BIOS include:
• Deployment and manageability – HP BIOS provides several technologies that help integrate the HP Pro 600 G3
Business PC into the enterprise, such as PXE, remote configuration, remote control, and F10 Setup support for 14
languages.
• Update your BIOS via the cloud or standardize on a BIOS version hosted on Enterprise network.
• Stability – HP BIOS supports the HP stable product roadmap by releasing only critical BIOS changes to the factory and
advanced change notification.
• UEFI specification 2.5
• Absolute Persistence agent – For tracking and tracing services, available in select countries, separate software and
purchase of a subscription is required.
• Thermal and power management – The HP BIOS provides and enables thermal and power management technologies
so component temperatures are managed for high reliability and to assist in operating the HP Business Desktop
computer in any enterprise environment.
• Acoustic performance – Industry leading acoustic emissions across the range of operating conditions.
• Serviceability – HP BIOS provides diagnostic and detailed service information.
• Upgrades and recovery – HP BIOS provides numerous ways to upgrade HP Business Desktop computers, including BIOS
updates from within Windows (HPBIOSUPDREC), HP Client Manager, and fail-safe recovery. In addition, the HP Business
Desktop BIOS Utilities tool enables replicated BIOS setup throughout the Enterprise; it is available from within the BIOS
software and from the support website.
• HP BIOS uses PKI signing of the BIOS for trusted BIOS upgrades and recovery.
Additional HP BIOS Features:
• Power-On password – Helps prevent an unauthorized user from powering on the system.
• Administrator password – Also known as the setup password, this helps prevent unauthorized changes to the system
configuration. If the administrator password is not known, the BIOS version cannot be changed and changes cannot be
made to BIOS settings using F10 setup or under the OS.


• Advanced Configuration and Power Interface (ACPI) – Represents a significant innovation in power and configuration
management, allowing operating systems and applications to manage power based on activity and usage. HP Pro
models use ACPI to provide power conservation features.
• HP BIOS Protection - prevents unauthorized updates or changes to the BIOS due to malware, viruses, or malicious BIOS
updates. Based on NIST SP800-147 policy guidelines.
S5 Max Power Savings setting supports EU Lot6 requirement and allows the computer to power down below 0.5W in S5 (when
turned off). When S5 Max Power Savings feature is enabled below features are turned off:
• Power to slots
• Wake events other than power buttons (such as Wake on LAN)
• USB charging ports
Core™ vPro™ Processors*

Intel® 6th & 7th Generation Core™ vPro™ Processors
All HP Pro 600 G3 Business PC models featuring this technology include processors that are part of the Intel® Stable Image
Platform Program (SIPP) designed to ensure the stability promise inherent in the value proposition of the HP Pro 600 G3
Business PC, thus making these models the most stable, secure, and manageable platforms available to enterprises today.
Intel® Advanced Management Technology (AMT) v11** – An advanced set of remote management features and
functionality which provides network administrators the latest and most effective tools to remotely discover, heal, and
protect networked client systems regardless of the system's health or power state. AMT 11 includes the following advanced
management functions:
• Support for configuration of Intel® AMT 11.0 new capabilities

• No reset after provisioning
• Support changes to BIOS table 130
• Support for Microsoft Windows Server 2012 R2
• Support for New Microsoft SQL Server Versions including Standard and Enterprise editions
• Support for Intel® SSD Prop 2500 Series
• Support for Intel® Enterprise Digital Fence
• The Platform Discovery Utility can now discover these additional Intel® products:
• Intel® SSD Pro 2500 Series; Enterprise Digital Fence
• Intel® Identity Protection Technology with One Time Password; Public Key Infrastructure; Multi Factor Authentication
• Intel® Identity Protection Technology with Intel® WiGig
• New Profile Editor and Profile Editor Plugin Interface
• New Required Permissions for Solutions Framework
*Some functionality of this technology, such as Intel Active management technology and Inte l Virtualization technology, requires
additional 3rd party software in order to run. Availability of future "virtual appliances" applications for Intel vPro™ technology is
dependent on 3rd party software providers. Compatibility with future "virtual appliances” is yet to be determined.
** Intel® Active Management Technology requires an Intel® AMT-enabled chipset, network hardware and software, as well as connection
with a power source and a corporate network connection. Setup requires configuration by the purchaser and may require scripting with the
management console or further integration into existing security frameworks to enable certain functionality. It may also require
modifications of implementation of new business processes.
HARDWARE SECURITY
SATA 0,1 port disablement (via BIOS)


Serial, USB enable/disable (via BIOS)
Solenoid Lock/Intrusion Sensor (MT only)
Intrusion Sensor (Optional for SFF and AiO only)
Hood Sensor for DM (integrated in the PCA, can be enabled/disabled through BIOS)
Support for chassis padlocks and cable lock devices

POWER SUPPLY
DM SFF MT AiO
Standard Efficiency 65W EPS, 89% average N/A N/A N/A
efficiency at 115V &
230Vac
80 PLUS Bronze N/A 180W active PFC 180W active PFC N/A
82/85/82% efficient at 82/85/82% efficient at
20/50/100% load (115V) 20/50/100% load (115V)
250W active PFC
82/85/82% efficient at
20/50/100% load (115V)
80 PLUS Gold N/A N/A N/A 160W active PFC
20/50/100% load
(115V)
20/50/100% load
(230V)
80 PLUS Platinum N/A 180W active PFC 250W active PFC N/A
20/50/100% load (115V) 20/50/100% load (115V)
20/50/100% load (230V) 20/50/100% load (230V)
Operating Voltage 90 – 264 VAC 90 – 264 VAC 90 – 264 VAC

Range 90 – 264 VAC
Rated Voltage Range 100-240V AC 100-240V AC 100-240V AC
100-240V AC
Rated Line Frequency 50/60 HZ 50/60 HZ 50/60 HZ
50/60 HZ
Operating Line 47 – 63 Hz 47 – 63 Hz 47 – 63 Hz
Frequency 47 – 63 Hz
Rated Input Current N/A N/A N/A N/A
Rated Input Current with 65W/1.6A 180W/2.3A 180W/2.3A 2A

Energy Efficient* Power 90W/1.4A 250W Bronze/3.5A
Supply 250W Platinum/3A
DC Output
+19.5V +12.1V +12.1V +12.1V
Current Leakage (NFPA Less than 500 Less than 500 microamps of leakage current at Less than 500
99: 2102) microamps of leakage 120 Vac with the ground wire disconnected, as microamps of leakage
current at 120 Vac with required for Non-patient Electrical Appliances and current at 120 Vac with
the ground wire Equipment used in a patient care facility or that the ground wire
disconnected, as disconnected, as


required for Non-patient contact patients in normal use. Per section required for Non-patient
Electrical Appliances and 10.3.5.1. Electrical Appliances and
Equipment used in a Equipment used in a
patient care facility or patient care facility or
that contact patients in that contact patients in
normal use. Per section normal use. Per section
10.3.5.1. 10.3.5.1.
Less than 100 Less than 100 microamps of leakage current at Less than 100
microamps of leakage 120 Vac with the ground wire intact with normal microamps of leakage
current at 120 Vac with polarity, as required for Non-patient Electrical current at 120 Vac with
the ground wire intact Appliances and Equipment used in a patient care the ground wire intact
with normal polarity, as facility or that contact patients in normal use. Per with normal polarity, as
required for Non-patient section 10.3.5.1. required for Non-patient
Electrical Appliances and Electrical Appliances and
Equipment used in a Equipment used in a
patient care facility or patient care facility or
that contact patients in that contact patients in
normal use. Per section normal use. Per section
10.3.5.1. 10.3.5.1.
Power Supply Fan N/A 70mm variable speed 70mm variable speed N/A
Power cord length 6.0 ft. (1.83 m) 6.0 ft. (1.83 m) 6.0 ft. (1.83 m)
6.0 ft. (1.83 m)
External Power Adapter Yes N/A N/A N/A
Dimensions N/A N/A N/A N/A
Total Cord Length 30mm x 113.5mm x N/A N/A N/A

55mm
The harmonic input current requirements must be met under the following operating conditions:
Load Requirements: 50% and 100%
Input Voltage: 230Vac/50Hz.
For active power factor correction the power factor at 50% &100% loads shall be greater than 0.9 over
the entire nominal input voltage range (100-127VAC and 200-240VAC).
Condition Standard 82/85/82% 85/88/85% 87/90/87% 90/92/89% Input Voltage

Efficiency
10% of Rated Load - 75% 81% 84% 84% 115Vac/60HZ
20% of Rated Load - 82% 85% 87% 90% 115Vac/60HZ
- 85% 88% 90% 92%
50% of Rated Load 115Vac/60HZ
PF>0.9 PF>0.9 PF>0.9 PF>0.9 PF>0.95
70% 82% 85% 87% 89% 115Vac/60HZ
100% of Rated Load
PF>0.9 PF>0.9 PF>0.9 PF>0.9 PF>0.9 230Vac/50HZ


WEIGHTS & DIMENSIONS
DM SFF MT AiO
Chassis (W x D x H) 6.97 x 6.88 x 1.35 in 3.7 10.6 x 11.7 in 6.69 x10.79 x 13.3 in See table below.
Not including bezel 177 x 174.7 x 34.2 mm 95 x 270 x 296 mm 170 x 274 x 338 mm
System Volume 64 cu in 463 cu in 960 cu in

1.06 L 7.6 L 15.74 L
System Weight* 2.67 lb 9.98 lb 15.77 lb
1.21 kg 4.53 kg 7.14 kg
Max Supported Weight N/A 77 lb 77 lb
(desktop orientation) 35 kg 35 kg
Packaging (W x D x H) 9.1 x 19.6 x 5.7 in 15.71 x 9.06 x 19.65 in 15.35 x 11.73 x 19.65 x
231.1 x 497.8 x 144.8 399 x 230 x 499 mm in
mm 390 x 298 x 499 mm
Shipping Weight 6.1 lb 16.12 lb. 22.64 lb.
2.8 kg 7.32 kg 10.28 kg
Packaging (with
10.0 x 19.6 x 7.8 in
Expansion Pack, W x D x
255 x 497.8 x 198 mm
H)
Multi-Unit Packaging 20.28 x 16.54 x 25 in
(10 units) 515 x 420 x 636 mm
Shipping Weight 68 lbs /31 kg
Shipping Weight (fully
11.5 lbs / 5.22 kg
loaded)
Palletization Profile 20-units per layer 6-units per layer 6-units per layer
4 layer max 10 layer max 7 layer max
80-units per pallet 60 per pallet 42 per pallet
Footprint-39.21 x 46.61 47.24 x 39.37 x 94.49 in 47.24 x 39.37 x 86.85 in
in (996 x 1184 mm) (including pallet) (including pallet)
Dependent on 40-Ft Stnd.
Sea Container or 40-Ft
High-cube Sea Container
is used)
ALL-IN-ONE WEIGHTS AND DIMENSIONS
Weight Without Stand With Easel Stand With Adjustable Height Stand
(without VESA cover)
System Weight 14.07 lb 15.56 lb 20.92 lb
6.38 kg 7.06 kg 9.49 kg
Shipping Weight 17.77 lbs 19.27 lbs 27.15 lbs
8.07kg 8.74 kg 12.31 kg
Dimensions (W x D x
H)


Product Dimensions Without Stand Easel Stand Adjustable Height Stand
20.92 x 14.63 x 2.04 in 20.92 x 14.63 x 5.85 in (maximum)
531.39 x 371.68 x 51.69 mm 531.45 x 371.8x 148.72 mm
20.92 x 20.92 x 8.27 in
531.45 x 531.44 x 209.95 mm
Adjustable Height Stand

(minimum)
20.92 x 15.94 x 8.27 in
531.45 x 404.89 x209.95 mm
Shipping Dimensions
Shipping Dimensions Without Stand Easel Stand Adjustable Height Stand
Boxed 24.09x7.28x18.98(H) N/A 24.21 x 11.54 x 19.69 (H) in
in 615 x 293 x 500 (H) mm
612x185x482(H) mm
Shipping Dimensions Without Stand Easel Stand Adjustable Height Stand
Pallet (40 units) (40 units) (24 units)
48 x 40 x 81.61 (H) in 48 x 40 x 81.61(H) in 48 x 40 x 84.44 (H) in
1219 x 1016 x2073 (H) mm 1219 x 1016 x 2073 (H) mm 1219 x 1016 x 2145(H) mm


DESKTOP MINI DIMENSIONS


SMALL FORM FACTOR DIMENSIONS


MICROTOWER DIMENSIONS


ALL-IN-ONE EASEL STAND DIMENSIONS


ALL-IN-ONE ADJUSTABLE HEIGHT STAND DIMENSIONS


ALL-IN-ONE NO STAND DIMENSIONS

ENVIRONMENTAL & INDUSTRY

Eco-Label Certifications & This product has received or is in the process of being certified to the following approvals and
declarations may be labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• EPEAT Gold registered in the United States. See http://www.epeat.net for registration
status in your country.
System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions data for the
All-in-One PC model is based on a typically configured PC featuring a hard disk drive, a high
efficiency power supply, and a Microsoft Windows® operating system.
Energy Consumption
(in accordance with US
ENERGY STAR® test method) 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
Normal Operation (Short idle) 8.22 W 9.80 W 8.56 W
Normal Operation (Long idle) 7.66 W 7.69 W 7.70 W
Sleep 1.25 W 1.25 W 1.23 W
Off 1.03 W 1.03 W 1.10 W
Note: Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within
the model family. HP computers marked with the ENERGY STAR® Logo are compliant with the
applicable U.S. Environmental Protection Agency (EPA) ENERGY STAR® specifications for
computers. If a model family does not offer ENERGY STAR® compliant configurations, then
energy efficiency data listed is for a typically configured PC featuring a hard disk drive, a high
Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz

Normal Operation (Short idle) 28 BTU/hr 34 BTU/hr 29 BTU/hr
Normal Operation (Long idle) 26 BTU/hr 26 BTU/hr 26 BTU/hr
Sleep 4 BTU/hr 4BTU/hr 4 BTU/hr
Off 4 BTU/hr 4 BTU/hr 4 BTU/hr
*NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level
is attained for one hour.
Declared Noise Emissions Sound Power Sound Pressure

(in accordance with (LWAd, bels) (LpAm, decibels)
ISO 7779 and ISO 9296)
Typically Configured – Idle 3.0 19
Optical Drive – Sequential 3.1 20
reads
Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years. Upgradeable
features and/or components contained in the product may include:
• 8 USB ports
• 2 memory slots
• 1 internal M.2 PCIe 2230 connector for optional wireless NIC
• 1 internal M.2 SSD storage (2230 or 2280 connector)
• 1 2.5” internal storage drive bay
Spare parts are available throughout the warranty period and or for up to “5” years after the
end of production.
Batteries This battery(s) in this product comply with EU Directive 2006/66/EC


Batteries used in the product do not contain:
Mercury greater the1ppm by weight
Cadmium greater than 20ppm by weight
Battery size: CR2032 (coin cell)

Battery type: lithium
Additional Information • This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive -
2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment
(WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe Drinking
Water and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680 (EPEAT) standard at the Gold level, see
www.epeat.net
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and
ISO1043.
• This product contains 24.1% post-consumer recycled plastic (by wt.)
• This product is 91.4% recycle-able when properly disposed of at end of life.
Packaging Materials External: PAPER/Corrugated 443 g

Internal: PLASTIC/ Polyethylene Expanded - EPE 38 g
PLASTIC/ Polyethylene high density - HDPE 4g
The plastic packaging material is made from 0% recycled content.
The paper material contains at least 25% recycled content.
Material Usage This product does not contain any of the following substances in excess of regulatory limits
(refer to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently handled or
carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs) Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)


Packaging Usage HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in
packaging materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging
materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120
standards.
End-of-life Management and Hewlett-Packard offers end-of-life HP product return and recycling programs in many
Recycling geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle
or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or
disposed of in a responsible manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information

for each product type for use by treatment facilities. This information (product disassembly
instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers.
These instructions may be used by recyclers and other WEEE treatment facilities as well as HP
OEM customers who integrate and re-sell HP equipment.
HP, Inc. Corporate For more information about HP’s commitment to the environment:
Environmental Information
Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

• EPEAT <Gold> registered in the United States. See http://www.epeat.net for
registration status in your country.
• TCO or TCO Certified Edge
Energy Consumption
Sleep 0.83 W 0.84 W 0.83 W
Off 0.72 W 0.72 W 0.72 W


Sleep 3 BTU/hr 3 BTU/hr 3 BTU/hr

reads
• 11 USB ports
• 2 PCIe half-length slot
• 1 internal M.2 PCIe x1 connector for optional wireless NIC
• 1 internal M.2 PCIe x4 connector for optional Turbo Drive SSD
• 1 3.5” internal storage drive bay or 2.5” internal storage drive bay (HDD/SSD/SED/SSHD)
• 1 9.5mm slim optical drive bay
end of production.


Additional Information • This product is in compliance with the Restrictions of Hazardous Substances (RoHS)
directive - 2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic
Equipment (WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe
Drinking Water and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680 (EPEAT) standard at the gold level,
see www.epeat.net
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469
and ISO1043.
Packaging Materials External: PAPER/Paperboard 200 g


Internal: PLASTIC/Polyethylene Expanded - EPE 143 g
PLASTIC/Polystyrene Expanded - EPS 118 g
PLASTIC/Other 98 g
PLASTIC/Polyethylene low density - LDPE 19 g
The plastic packaging material is made from 80% recycled content.
The paper packaging materials contains at least 80% recycled content.
• Asbestos
• Cadmium
• Formaldehyde
materials.
standards.



http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842t
and
HP ProDesk 600 G3 Microtower Business PC

Energy Consumption
Sleep 1.20 W 1.17 W 1.20 W
Off 0.79 W 0.78 W 0.79 W



reads
• 11 USB ports
• 2 2.5"/ 1 3.5” internal storage drive(HDD/SSD/SED/SSHD)
• 1 5.25" external supporting optical drive
end of production.


see www.epeat.net
and ISO1043.

The plastic packaging material is made from 75% recycled content
The paper packaging materials contains at least 47.5% recycled content.
• Asbestos
• Cadmium
• Formaldehyde


materials.
standards.

and


HP ProDesk 600 G3 Microtower Business PC (with PCI slot)
Energy Consumption
Sleep 1.22 W 1.20 W 1.22 W
Off 0.81 W 0.80 W 0.81 W


reads
• 11 USB ports
• 1 PCI half-length slot
• 2 2.5"/ 1 3.5” internal storage drive (HDD/SSD/SED/SSHD)
end of production.



see www.epeat.net
and ISO1043.

The plastic packaging material is made from 75% recycled content
The paper packaging materials contains at least 47.5% recycled content.
• Asbestos
• Cadmium
• Formaldehyde


materials.
standards.

and

• TCO or TCO Certified Edge
Energy Consumption


Sleep 0.76 W 0.78 W 0.77 W
Off 0.63 W 0.64 W 0.62 W


reads
• 6 USB ports
• 2 memory slots
• 1 Mini PCIe half-length slot
• 1 MXM 3.0 Type A - 35W slot
• 1 mSATA slot
• 1 2.5" internal bay supporting up to Two 2.5" hard drives (HDD/SSD/SED/SSHD)
end of production.


Battery type: lithium/manganese dioxide


Additional Information • This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive -
2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment
(WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe Drinking
Water and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680 (EPEAT) standard at the Gold level, see
www.epeat.net
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and
ISO1043.

Internal: PLASTIC/EPS (Expanded Polyethylene) 648 g
PLASTIC/Polyethylene low density 40 g
PLASTIC/Other 23 g
The plastic packaging material contains at least 5% recycled content.
The corrugated paper packaging materials contains at least 30% recycled content.
• Asbestos
• Cadmium
• Formaldehyde


• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging
materials.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842
and
ENERGY STAR® certified models available

EPEAT® registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by
country. Search keyword generator on HP’s 3rd party option store for solar generator accessories at www.hp.com/go/options
TAA compliant models available
* External power supplies, power cords, cables and peripherals are not Low Halogen. Service parts obtained after purchase
may not be Low Halogen.

UNIT ENVIRONMENT AND OPERATING CONDITIONS

General Unit Operating Guidelines
• Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit
is operated within the specified operating range.
• Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the required airflow.
• Never restrict airflow into the computer by blocking any vents or air intakes.
• Do not stack computers on top of each other or place computers so near each other that they are subject to each other's
re-circulated or preheated air.
• Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other
foreign matter can block the vents and limit the airflow.
• If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the
enclosure, and the same operating guidelines listed above will still apply.
Temperature Range Operating: 50° to 95° F (10° to 35° C)*

Non-operating: -22° to 140° F(-30° to 60° C)
Relative Humidity Operating: 10% to 90% (non-condensing at ambient)
Non-operating: 5% to 95% (non-condensing at ambient)
Maximum Operating: 5000m
Altitude (unpressurized) Non-operating: 50000ft (15240 m)
*Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct sustained
sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.
SERVICE AND SUPPORT

On-site Warranty 1: Three-year (3-3-3) limited warranty delivers three years of on-site, next business day 2 service for
parts and labor and complimentary limited technical support. 3 Three-year onsite and labor are not available in all
countries. Service offers terms up to 5 years by choosing an optional HP Care Pack. 4 To choose the right level of service for
your HP product, visit HP Care Pack Central: www.hp.com/go/cpc
NOTE 1: Terms and conditions may vary by country. Certain restrictions and exclusions apply. Other warranty variations
may be offered in your region.
NOTE 2: On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party
provider, and is not available in certain countries. Global service response times are based on commercially reasonable
best effort and may vary by country.
NOTE 3: Technical telephone support applies only to HP-configured and third-party HP qualified hardware and software.
NOTE 4: Service levels and response times for HP Care Packs may vary depending on your geographic location. Service
starts on date of hardware purchase. Restrictions and limitations apply. For details, visit www.hp.com/go/cpc. HP
services are governed by the applicable HP terms and conditions of service provided or indicated to Customer at the time
of purchase. Customer may have additional statutory rights according to applicable local laws, and such rights are not in
any way affected by the HP terms and conditions of service or the HP Limited Warranty provided with your HP Product.

Technical Specifications – Graphics
Graphics
Intel® HD Graphics (integrated)
DisplayPort™ 1.2 Multimode capable; supports HDCP, DisplayPort™ 1.2 Audio (2 streams), HBR2 link rates
and Multi-Stream Technology for a maximum of 3 displays (including the integrated panel)
Memory The BIOS has options for selecting the dedicated memory size of 128MB, 256MB or 512MB
Additional memory is allocated for graphics as needed using Intel's Dynamic Video Memory
Technology (DVMT), to provide an optimal balance between graphics and system memory
use.
Maximum Graphics Memory Microsoft Windows 7 Windows 8.1 Windows 10
Up to 1.7GB Up to 1.8GB >4 GB
Note: the actual amount of maximum graphics memory can be less than the amounts listed
above depending upon your computer’s configuration.
Maximum Color Depth 32 bits/pixel

6th Generation Core™ processors:
• Next Generation Intel® Clear Video Technology HD Support is a collection of video
playback and enhancement features that improve the end user's viewing
experience
o Encode/transcode HD content
o Playback of high definition content including Blu-ray Disc
o Superior image quality with sharper, more colorful images
Graphics/Video API Support • DirectX Video Acceleration (DXVA) support for accelerating video processing
o Full AVC/VC1/MPEG2/HEVC HW Decode
• Advanced Scheduler 2.0, 1.0
• Windows 7, Windows 8.1, Windows 10, Linux OS Support
• DirectX 12.1
• OpenGL 4.4
• Open CL 1.2 (Intel® HD Graphics 510)
• Open CL 1.2/2.0 (Intel® HD Graphics 530)
Supported Display Resolutions and Refresh Rates

Note: other resolutions may be available but are not recommended as they may not have been tested and qualified by HP. For
All in One platforms, resolutions higher than the integrated panel resolution are not supported on the integrated panel.
DisplayPort™ 1.2
HDMI
VGA
Resolution Refresh Rate Standard

640 x 480 60, 75, 85 X X X VESA DMT, CVT 0.31M3
720 x 400 70 X X X IBM VGA
800 x 600 60, 75, 85 X X X VESA DMT, CVT0.48M3


1152 x 864 60, 75, 85 X X X VESA DMT, CVT 0.83MA
1280 x 720 60, 75, 85 X X X VESA DMT, CVT 0.92M9, CEA-770.3
1280 x 768 60, 60RB, 75, 85 X X X VESA DMT, CVT 0.98M9/0.98M9-R
1280 x 800 60, 75, 85 X X X VESA DMT
1280 x 960 60, 75, 85 X X X VESA DMT
1366 x 768 60, 60RB X X X VESA DMT
1440 x 900 60, 60RB X X X VESA DMT
1600 x 900 60, 60RB, 75, 85 X X X VESA DMT
1680 x 1050 60, 60RB, 75 X X X VESA DMT, CVT 1.76MA/1.76MA-R
1920 x 1080 60 X X X VESA DMT, CVT 2.07M9, SMPTE 274M
1920 x 1200 60, 60RB, 75, 85 X* X X DMT, CVT 2.30MA/2.30MA-R
1600 x 1200 60, 75, 85 X* X X VESA DMT, 1.92M3
1920 x 1440 60, 75, 85 X X VESA DMT, CVT 2.76M3
2048 x 1536 60,75 X X CVT 3.15M3
2560 x 1440 59.951 X X CVT 3.69M9-R
2560 x 1600 60, 60RB X X VESA DMT, CVT 4.10MA/4.10MA-R
3840 x 2160 24 X X CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
4096 x 2160 24 X X CVT-RBv1/v2 (8.85M-R), SMPTE 274M
1920 x 1080 60 X X VESA (SMPTE 274M)
1920 x 1080 50 X X SMPTE 274M
1920 x 1080 30 X X SMPTE 274M
1920 x 1080 24 X X SMPTE 274M
1280 x 720 60 X X VESA (CEA-770.3)
1280 x 720 50 X X SMPTE 296M


720 x 480 60 X X MHL (CEA-770.2)
720 x 576 50 X X ITU-R BT.1358
640 x 480 60 X X CEA (VESA DMT)
* 60Hz refresh rate only on VGA
AMD Radeon™ R7 430 2GB LP 2DP PCIe x16 GF card
Product Dimensions 6.22 x 4.76 x 0.85 in (15.81 x 12.09 x 2.15 cm)

Weight 0.3 lb (137 gr)
Package Dimensions 22.52 x 14.61 x 12.95 in (57.2 x 37.1 x 32.9 cm)
Package Weight 23.69 lb (10.75 kg)
Country of Origin Made in China
What Is In The Box One AMD Radeon™ R7 430 2GB LP 2DP PCIe x16 GF card
Warranty Features One year limited warranty
AMD Radeon™ R7 450 4GB PCIe x16 Graphics Card

Memory 4GB 128-bit wide frame buffer operating at 1125MHz.
Controller Clock Speed AMD® Radeon™ R9 450 GPU operating at 925 MHz
Multi-display Support A maximum of 4 displays are supported by the card. A maximum of 2 legacy displays (Native VGA,
DVI, or displays connected with passive DisplayPort™ 1.2 adapters are considered as legacy)
Graphics /API support DIRECTX 12, Open GL 4.3, Open CL1.2, UVD 3
Output Connectors 1 x Dual-Link DVI-I, 1x DisplayPort™ 1.2; 1x HDMI; Includes DVI to VGA adapter
Note: other resolutions may be available but are not recommended as they may not have been tested and qualified by HP
DisplayPort™ 1.2
(DVI-VGA
adapter)
DVI-D
VGA
HDMI
Resolution Refresh Rate* Standard

640 x 480 60, 75, 85 X X X X VESA DMT, CVT 0.31M3
720 x 400 70 X X X X IBM VGA
800 x 600 60, 75, 85 X X X X VESA DMT, CVT0.48M3
1152 x 864 60, 75, 85 X X X X VESA DMT, CVT 0.83MA
1280 x 720 60, 75, 85 X X X X VESA DMT, CVT 0.92M9, CEA-770.3
1280 x 768 60, 60RB, 75, 85 X X X X VESA DMT, CVT 0.98M9/0.98M9-R
1280 x 800 60, 75, 85 X X X X VESA DMT
1280 x 960 60, 75, 85 X X X X VESA DMT


1366 x 768 60, 60RB X X X X VESA DMT
1440 x 900 60, 60RB X X X X VESA DMT
1600 x 900 60, 60RB, 75, 85 X X X X VESA DMT
1680 x 1050 60, 60RB, 75 X X X X VESA DMT, CVT 1.76MA/1.76MA-R
1920 x 1080 60 X X X X VESA DMT, CVT 2.07M9, SMPTE 274M
1920 x 1200 60, 60RB, 75, 85 X X X X DMT, CVT 2.30MA/2.30MA-R
1600 x 1200 60, 75, 85 X X X X VESA DMT, 1.92M3
2048 x 1536 60,75 X X X X CVT 3.15M3
2560 x 1440 59.951 X X X CVT 3.69M9-R
2560 x 1600 60, 60RB X X X VESA DMT, CVT 4.10MA/4.10MA-R
3840 x 2160 30 X X X CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
3840 x 2160 50 X CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
4096 x 2160 50 X CVT-RBv1/v2 (8.85M-R), SMPTE 274M
1920 x 1080 60 X X X VESA (SMPTE 274M)
1920 x 1080 50 X X X SMPTE 274M
1920 x 1080 30 X X X SMPTE 274M
1920 x 1080 24 X X X SMPTE 274M
1280 x 720 60 X X X VESA (CEA-770.3)
1280 x 720 50 X X X SMPTE 296M
720 x 480 60 X X X MHL (CEA-770.2)
* >60 refresh rates only for analog (VGA) signaling
AMD Radeon™ RX 460 2GB FH PCIe x16 Graphics Card

Memory 2GB 128-bit wide frame buffer operating at 1750MHz.
Controller Clock Speed AMD® Radeon™ RX 460 GPU operating at up to 1.2GHz
Multi-display Support A maximum of 4 displays are supported by the card.


Graphics /API support DIRECTX 12, Open GL 4.5, Open CL 2.0, AMD Video Coding Engine (VCE) 3.4 and AMD Universal
Video Decoder( UVD)
Output Connectors 1 x Dual-Link DVI-D, 1x DisplayPort™ 1.2; 1x HDMI

DisplayPort™ 1.2
DVI-D
HDMI
720 x 400 70 X X X IBM VGA
1280 x 800 60, 75, 85 X X X VESA DMT
1280 x 960 60, 75, 85 X X X VESA DMT
1366 x 768 60, 60RB X X X VESA DMT
1440 x 900 60, 60RB X X X VESA DMT
1600 x 900 60, 60RB, 75, 85 X X X VESA DMT
1920 x 1200 60, 60RB, 75, 85 X X X DMT, CVT 2.30MA/2.30MA-R
1600 x 1200 60, 75, 85 X X X VESA DMT, 1.92M3
2048 x 1536 60, 75 X X X CVT 3.15M3
2560 x 1440 59.951 X X X CVT 3.69M9-R
2560 x 1600 60, 60 RB X X X VESA DMT, CVT 4.10MA/4.10MA-R

3840 x 2160 30 X X X CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
1920 x 1080 60 X X X VESA (SMPTE 274M)
1920 x 1080 50 X X X SMPTE 274M
1920 x 1080 30 X X X SMPTE 274M
1920 x 1080 24 X X X SMPTE 274M
1280 x 720 60 X X X VESA (CEA-770.3)
1280 x 720 50 X X X SMPTE 296M
720 x 480 60 X X X MHL (CEA-770.2)
NVIDIA® GeForce® GT 730 1GB PCIe x8 HDMI Graphics Card
Memory 1GB GDDR5 64-bit wide frame buffer operating at 2.5GHz.

Controller Clock Speed NVIDIA® Kepler™ GPU operating at 901 MHz
Multi-display Support A maximum of 2 displays are supported by the card
Supports Microsoft DirectX 12, OpenGL 4.4 and OpenCL 2 API, Shade Model 5 and DirectCompute
Graphics /API support
11
Output Connectors 1 x Dual-Link DVI-I; 1x HDMI; Includes DVI to VGA adapter

(DVI-VGA
adapter)
DVI-D
VGA
HDMI



720 x 400 70 X X X IBM VGA
1280 x 800 60, 75, 85 X X X VESA DMT
1280 x 960 60, 75, 85 X X X VESA DMT
1366 x 768 60, 60RB X X X VESA DMT
1440 x 900 60, 60RB X X X VESA DMT
1600 x 900 60, 60RB, 75, 85 X X X VESA DMT
1600 x 1200 60, 75, 85 X X X VESA DMT, 1.92M3
2048 x 1536 60,75 X X X CVT 3.15M3
2560 x 1440 59.951 X X CVT 3.69M9-R
3840 x 2160 50 CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
3840 x 2160 60 CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
4096 x 2160 50 CVT-RBv1/v2 (8.85M-R), SMPTE 274M
4096 x 2160 60 CVT-RBv1/v2 (8.85M-R), SMPTE 274M
1920 x 1080 60 X X VESA (SMPTE 274M)
1920 x 1080 50 X X SMPTE 274M
1920 x 1080 30 X X SMPTE 274M
1920 x 1080 24 X X SMPTE 274M


1280 x 720 60 X X VESA (CEA-770.3)
1280 x 720 50 X X SMPTE 296M
720 x 480 60 X X MHL (CEA-770.2)
NVIDIA® GeForce® GT 730 2GB DP PCIe x8 Graphics Card
Get impressive graphics and high resolution dual-display performance in a low profile, PCI
Introduction Express x8 graphics add-in card based on the NVIDIA® Kepler™ Graphics Processor.
Improve your everyday PC, Web conferencing, and video or photo editing.
Memory 2GB GDDR5 64-bit wide frame buffer operating at 900 MHz
Controller Clock Speed NVIDIA® Kepler™ GPU operating at 902 MHz
Multi-display Support A maximum of 4 displays are supported by the card.
Supports Microsoft DirectX 12, OpenGL 4.4 and OpenCL 2 APIs, Shade Model 5, UVD 4.2, VCE
Graphics /API support
2.0, and DirectCompute 11
1 x Dual-Link DVI-I, 1x DisplayPort™ 1.2; Includes DVI to VGA adapter

Output Connectors Display Port output is multi-mode capable, support Audio, HBR2 and MST
DisplayPort™ 1.2
(DVI-VGA
adapter)
DVI-D
VGA

720 x 400 70 X X X IBM VGA
1280 x 800 60, 75, 85 X X X VESA DMT
1280 x 960 60, 75, 85 X X X VESA DMT
1366 x 768 60, 60RB X X X VESA DMT


1440 x 900 60, 60RB X X X VESA DMT
1600 x 900 60, 60RB, 75, 85 X X X VESA DMT
1600 x 1200 60, 75, 85 X X X VESA DMT, 1.92M3
2048 x 1536 60,75 X X X CVT 3.15M3
2560 x 1440 59.951 X X CVT 3.69M9-R
1920 x 1080 60 X X VESA (SMPTE 274M)
1920 x 1080 50 X X SMPTE 274M
1920 x 1080 30 X X SMPTE 274M
1920 x 1080 24 X X SMPTE 274M
1280 x 720 60 X X VESA (CEA-770.3)
1280 x 720 50 X X SMPTE 296M
720 x 480 60 X X MHL (CEA-770.2)
720 x 576 50 X X ITU-R BT.1358
640 x 480 60 X X CEA (VESA DMT)

Technical Specifications – Hard Disk and Solid State Storage

HARD DISK AND SOLID STATE STORAGE
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 16 GB
(for Windows 7) and 36 GB (for Windows 8.1/10) of system disk is reserved for the system recovery software.
HP 1 TB 7.2K SATA 6.0Gb/s 2.5” Hard Disk Drive

Capacity 1,000,204,886,016 bytes
Rotational Speed 7,200 rpm
Interface SATA 6 Gb/s
Buffer Size 32 MB
Logical Blocks 1,953,525,168
Single Track: 2.0 ms

Seek Time (typical reads,
includes controller overhead, Average: 12 ms
including settling)
Full-Stroke: 25 ms
Height (nominal) 0.374 in/9.5 mm
Media diameter: 2.5 in/63.5 mm

Width (nominal)
Physical size: 2.75 in/70 mm
Operating Temperature 41° to 131° F (5° to 55° C)
*NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to
36 GB (for Windows 10) of system disk is reserved for the system recovery software.
HP 500 GB 7.2K SATA 6.0Gb/s 2.5” Hard Disk Drive*

Capacity 500,107,862,016 bytes
Buffer Size 16 MB
Logical Blocks 976,773,168
Seek Time (typical reads, Single Track: 2.0 ms

includes controller overhead,
including settling) Average: 12 ms

Full-Stroke: 25 ms

Width (nominal)
500GB* 7.2K rpm SATA 6.0Gb/s 3.5" Hard Disk Drive

Formatted Capacity 500,107,862,016 bytes
Spindle Speed 7,200 rpm
Interface Serial ATA 3.0 (6.0 Gb/s)
Buffer Size 16 MB
Seek Time (average) Average: 11 ms
Full-Stroke: 21 ms
Height (nominal) 1 in/2.54 cm
Media diameter: 3.5 in/8.89 cm

Width (nominal)
Physical size: 4 in/10.2 cm

*NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36
GB (for Windows 10) of system disk is reserved for the system recovery software.
HP 1 TB* 7.2K rpm SATA 6.0Gb/s 3.5" Hard Disk Drive*

Formatted Capacity 1,000,204,886,016 bytes
Buffer Size 32 MB



Full-Stroke: 21 ms
Width (nominal)
Operating
41° to 131° F (5° to 55° C)
Temperature
* For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB
(for Windows 10) of system disk is reserved for the system recovery software.

Formatted Capacity 2 TB
Interface SATA 6Gb/s NCQ
Cache, 64 MB
Multisegmented
(MB)
Read <8.5 ms
Seek Time (average)
Write <9.5 ms
Height 1.028 in/26.11 mm
Width 4.0 in/101.6 mm
Depth 5.787 in/146.99 mm
Weight 1.38 lb/626 g
Operating 32° to 140° F (0° to 60° C)
Temperature
GB (for Windows 7) and 36 GB (for Windows 8.1/10) of system disk is reserved for the system recovery software.
HP 1 TB* SATA 6G 2.5" 8GB Solid State Hybrid Drive (SSHD)*

Spindle Speed 5,400 rpm +/- 0.2%
Drive Type Solid State Hybrid Drive (SSHD) technology with NAND Flash


Cache Buffer 64 MB
NAND Flash 8 GB
Commercial Multilevel Cell
(cMLC)
Number of Sectors 976,773,168
Seek Time (typical reads)
Average: 12 ms
Height 0.374 +/-.008 in (9.5 +/- 0.2 mm)
Width 2.750 +/- 0.010 in (69.85 +/- 0.25 mm)
Length 3.951 +0.008 / -0.010 in (100.35 +0.20 / -0.25 mm)
Weight 0.254 lb/115 g (max)
HP 500 GB SATA 6G 2.5” 8GB Solid State Hybrid Drive (SSHD)*

Formatted Capacity 500 GB
Cache Buffer 64 MB
NAND Flash
Commercial Multilevel Cell 8 GB
(cMLC)

Average: 12 ms
Height 0.268 +/-.008 in (6.8 +/- 0.2 mm)
Width 2.750 +/- 0.010 in (69.85 +/- 0.25 mm)
Length 3.951 +0.008 / -0.010 in (100.35 +0.20 / -0.25 mm)

16 GB (for Windows 7) and 36 GB (for Windows 8.1/10) of system disk is reserved for the system recovery software.
HP 1-TB SATA 6G 3.5” 8GB Solid State Hybrid Drive (SSHD)*

Interface Serial ATA (SATA)
Cache Buffer 64 MB
NAND Flash
8 GB
Multilevel Cell (MLC)
Number of Sectors 1,953,525,168

Average: 11 ms
Height 0.783 in / 2.01 cm
Width 4 in / 10.2 cm
Length 5.79 in / 14.7 cm
500GB* 2.5” FIPS 140-2 SED Solid State Drive*
Architecture Self-Encrypting (SED) Solid State Drive with SATA interface.
Interface Serial ATA (6.0 Gb/s)

Form Factor 2.5 inch
Height 6.80 mm ± 0.20
Width 69.85 mm ± 0.25
Length 100.35 mm ± 0.25/0.20
Weight (typical) <95 g (0.209 lb)
Bandwidth Performance Sustained data transfer

100 MB/s max
rate OD
I/O data-transfer rate 600 MB/s max
Spinup (max): 1.00A

Power Power consumption: Idle, active: 0.70W
Sleep 0.18W
Environmental Operating Temperature: 32° to 140° F (0° to 60° C)

(all conditions, non-condensing)
Relative Humidity: 5% to 95%
Shock: Maximum 400 G/2 ms
256GB* TLC SED SSD 2.5” FIPS Drive*
Unformatted Capacity 256 GB
Height 7 mm
Width 69.85 mm
Length 100.45 mm
Weight (typical) 10 g (0.022 lb) max

Bandwidth Performance Sequential read (128KB

530
transfer)
Sequential write
500
(128KB transfer)
Random read (4KB

55,000
transfer)
Random write (4KB

83,000
transfer)
Power SATA Power Sleep Typical: 2mW

consumption
Idle, average: 55mW
Active, average: 70mW
Active maximum (128KB transfer): 3000 mW
Environmental Operating Temperature 32° to 158° F (0° to 70° C)

Relative Humidity 5% to 95%
Non-operating Shock 1500 G/0.5ms
Non-operating Vibration 5-800Hz @ 3.10G
Height 7 mm
Width 69.85 mm
Length 100.45 mm


530
transfer)
Sequential write
500
(128KB transfer)
Random read (4KB

92,000
transfer)
Random write (4KB

83,000
transfer)

consumption
Idle, average: 55mW

500 GB* SATA 2.5" Self-Encrypting (SED) Opal 2 Solid State Drive*
Unformatted Capacity 500GB
Architecture Self-Encrypting (SED) Solid State Drive with 25nm MLC NAND Flash and SATA interface
NAND Flash 25nm MLC NAND Flash
Height .275 in/7mm

Length 3.95 in/100.5 mm
Weight 0.161 lb (73 g)
Bandwidth Performance Sustained Sequential 128k Up to 450 MB/s

Read:
Sustained Sequential 128k

Up to 260 MB/s
Write:
Random 4k Read: Up to 46K IOPs
Random 4k Write: Up to 56K IOPs
Latency Read: 55 µs
Write: 55 µs
Power SATA power consumption: 160 mW (active average); <85 mW (idle average)
Useful Drive Life 72TB written, up to 40GB/day for 5 years
Operating Temperature: 32° to 158° F (0° to 70° C)
Environmental
Shock: 1,500 G/1 ms
256 GB SATA 2.5” TLC SED SSD Opal 2 Drive*

256 GB
Unformatted Capacity
500,118,192 (User Addressable Sectors)
Self-Encrypting (SED) Solid State Drive with NAND Flash and SATA interface.
Architecture
Trusted Computing Group (TCG) OPAL 2.0 compliant encrypted solid state drive

Height 6.80 mm ± 0.20
Width 69.85 mm ± 0.25
Length 100.20 mm ± 0.25
Typical Weight 37.4 g
Bandwidth Performance Sustained Sequential

Up to 520 MB/s
Read:
Sustained Sequential
Up to 460 MB/s
Write:
Power Power consumption: Active: 3.891W; Idle: 0.085W
Mean Time Between Failure

1,500,000 hours
(MTBF)

Shock: 1,500 G/0.5 ms

512 GB
1,000,215,216 (User Addressable Sectors)
Architecture
Trusted Computing Group (TCG) OPAL 2.0 compliant encrypted solid state drive
Height 7 mm ± 0.20
Width 69.85 mm ± 0.25
Length 100.20 mm ± 0.25

Typical Weight 37.4 g

Up to 515 MB/s
Read:
Up to 490 MB/s
Write:
Maximum active power: ≤4,400mW

Power Power consumption: Average power: 70mW
Slumber low power mode: 42mW – 52mW

Up to 1,750,000 hours
(MTBF)
Environmental Operating Temperature: 0˚C to 70˚C (32˚F to 158˚F)

Non-operating temperature and storage -55˚C to +85˚C (-67˚F to 185˚F)
Operating and non-operating shock 1,500 G/0.5 ms
256GB Turbo Drive G2 TLC Solid State Drive

Solid State Drive with TLC NAND Flash and PCIE interface.
Complies with NVMe Standard
Architecture
Power Saving Modes: L1 substates support
Multi Queue support
Interface PCI-E Gen3 x 4
Form Factor M.2 2280
Height 3.73 mm
Width 22.00 ± 0.15 mm
Length 80.00 ± 0.15 mm
Weight Up to 8 g


Up to 2600 MB/s
Read:
Up to 1000 MB/s
Write:
Active: Typical 6.1W;

Power Power consumption: Idle: Typical 80mW
L1.2: Typical 5mW
Mean Time Between Failure (MTBF) 1,500,000 hours

Shock: 1,500 G/0.5 ms
512GB Turbo Drive G2 TLC Solid State Drive
Architecture
Multi Queue support
Height 3.73 mm
Width 22.00 ± 0.15 mm
Length 80.00 ± 0.15 mm
Weight Up to 8 g

Up to 2600 MB/s
Read:
Up to 1200 MB/s
Write:


L1.2: Typical 5mW

Shock: 1,500 G/0.5 ms
1TB Turbo Drive G2 TLC Solid State Drive
Unformatted Capacity 1 TB
Architecture
Multi Queue support
Height 3.73 mm
Width 22.00 ± 0.15 mm
Length 80.00 ± 0.15 mm
Weight Up to 8 g

Up to 2600 MB/s
Read:
Up to 1400 MB/s
Write:

L1.2: Typical 5mW


Shock: 1,500 G/0.5 ms
HP 1 TB 7.2K SATA 6.0Gb/s 2.5” Hard Disk Drive

Capacity 1,000,204,886,016 bytes
Buffer Size 32 MB

including settling)
Full-Stroke: 25 ms

Width (nominal)
HP 500 GB 7.2K SATA 6.0Gb/s 2.5” Hard Disk Drive*

Capacity 500,107,862,016 bytes

Buffer Size 16 MB

including settling)
Full-Stroke: 25 ms

Width (nominal)
500GB* 7.2K rpm SATA 6.0Gb/s 3.5" Hard Disk Drive

Formatted Capacity 500,107,862,016 bytes
Buffer Size 16 MB
Full-Stroke: 21 ms

Width (nominal)



Formatted Capacity 1,000,204,886,016 bytes
Buffer Size 32 MB

Full-Stroke: 21 ms
Width (nominal)
Operating
41° to 131° F (5° to 55° C)
Temperature
(for Windows 10) of system disk is reserved for the system recovery software.

Interface SATA 6Gb/s NCQ
Cache, 64 MB
Multisegmented
(MB)
Read <8.5 ms
Seek Time (average)
Write <9.5 ms
Height 1.028 in/26.11 mm
Depth 5.787 in/146.99 mm
Operating 32° to 140° F (0° to 60° C)
Temperature

HP 500 GB SATA 6G 2.5” 8GB Solid State Hybrid Drive (SSHD)*

Cache Buffer 64 MB
NAND Flash
Commercial Multilevel Cell 8 GB
(cMLC)

Average: 12 ms
Height 0.268 +/-.008 in (6.8 +/- 0.2 mm)
Width 2.750 +/- 0.010 in (69.85 +/- 0.25 mm)
Length 3.951 +0.008 / -0.010 in (100.35 +0.20 / -0.25 mm)
HP 1 TB* SATA 6G 2.5" 8GB Solid State Hybrid Drive (SSHD)*

Cache Buffer 64 MB

NAND Flash 8 GB
Commercial Multilevel Cell
(cMLC)
Average: 12 ms
Height 0.374 +/-.008 in (9.5 +/- 0.2 mm)
Width 2.750 +/- 0.010 in (69.85 +/- 0.25 mm)
Length 3.951 +0.008 / -0.010 in (100.35 +0.20 / -0.25 mm)
HP 1-TB SATA 6G 3.5” 8GB Solid State Hybrid Drive (SSHD)*

Interface Serial ATA (SATA)
Cache Buffer 64 MB
NAND Flash
8 GB
Multilevel Cell (MLC)
Number of Sectors 1,953,525,168

Average: 11 ms
Height 0.783 in / 2.01 cm
Width 4 in / 10.2 cm
Length 5.79 in / 14.7 cm

500GB* 2.5” FIPS 140-2 SED Solid State Drive*
Height 6.80 mm ± 0.20
Width 69.85 mm ± 0.25
Length 100.35 mm ± 0.25/0.20
Weight (typical) <95 g (0.209 lb)
Bandwidth Performance Sustained data transfer

100 MB/s max
rate OD
I/O data-transfer rate 600 MB/s max
Spinup (max): 1.00A

Power Power consumption: Idle, active: 0.70W
Sleep 0.18W

Shock: Maximum 400 G/2 ms

Height 7 mm
Width 69.85 mm
Length 100.45 mm

530
transfer)
Sequential write
500
(128KB transfer)
Random read (4KB

55,000
transfer)
Random write (4KB

83,000
transfer)

consumption
Idle, average: 55mW


Height 7 mm
Width 69.85 mm
Length 100.45 mm

530
transfer)
Sequential write
500
(128KB transfer)
Random read (4KB

92,000
transfer)
Random write (4KB

83,000
transfer)

consumption
Idle, average: 55mW


500 GB* SATA 2.5" Self-Encrypting (SED) Opal 2 Solid State Drive*
Unformatted Capacity 500GB
Architecture Self-Encrypting (SED) Solid State Drive with 25nm MLC NAND Flash and SATA interface
NAND Flash 25nm MLC NAND Flash
Height .275 in/7mm
Length 3.95 in/100.5 mm
Weight 0.161 lb (73 g)
Bandwidth Performance Sustained Sequential 128k Up to 450 MB/s

Read:
Sustained Sequential 128k

Up to 260 MB/s
Write:
Random 4k Read: Up to 46K IOPs
Random 4k Write: Up to 56K IOPs
Latency Read: 55 µs
Write: 55 µs
Power SATA power consumption: 160 mW (active average); <85 mW (idle average)
Operating Temperature: 32° to 158° F (0° to 70° C)
Environmental
Shock: 1,500 G/1 ms


256 GB
500,118,192 (User Addressable Sectors)
Architecture
Trusted Computing Group(TCG) OPAL compliant encrypted solid state drive
Height 6.80 mm ± 0.20
Width 69.85 mm ± 0.25
Length 100.20 mm ± 0.25
Weight Up to 73 g

Up to 520 MB/s
Read:
Up to 460 MB/s
Write:
Power Power consumption: Active: 3.891W; Idle: 0.085W

1,500,000 hours
(MTBF)

Shock: 1,500 G/0.5 ms
128GB SATA 2.5" Value (Non-SED) Solid State Drive


Architecture TLC NAND Flash
Interface SATA 3.2 (6.0 Gb/s)
Dimensions (W x H x D) 6.98 x 0.7 x 10.05 cm
Weight 31g

Up to 510 MB/s
Read:
Up to 330 MB/s
Write:
Random Read: Up to 38K IOPs
Random Write: Up to 70K IOPs
Power DC power requirement: 5 VDC 5%-100 mV ripple p-p
Total power 50mW (active); 20mW (idle)

consumption:

Shock: 1,500 G/0.5 ms
NOTE: "For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36
GB (for Windows 10) of system disk is reserved for the system recovery software."
256GB SATA 2.5" Value (Non-SED) Solid State Drive

Architecture TLC NAND Flash
Interface SATA 3.2 (6.0 Gb/s)

Dimensions (W x H x D) 6.98 x 0.7 x 10.05 cm
Weight 31g

Up to 510 MB/s
Read:
Up to 330 MB/s
Write:
Random Read: Up to 38K IOPs
Random Write: Up to 70K IOPs
Power DC power requirement: 5 VDC 5%-100 mV ripple p-p
Total power 50mW (active); 20mW (idle)

consumption:

Shock: 1,500 G/0.5 ms
NOTE: "For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36
GB (for Windows 10) of system disk is reserved for the system recovery software."
256GB SATA 2.5” TLC Solid State Drive

Architecture Solid State Drive with SATA interface; ATA 8 Compliant and SATA 2.6 compliant
Interface Serial ATA 3 (6.0 Gb/s)
Height 7 mm ± 0.20
Width 69.85 mm ± 0.25

Length 100.2 mm ± 0.25
Weight (typical) 36.5 g (+2)
Data Transfer Rate Sequential Read Up to 500 MB/s

(128k Sequential )
Sequential Write Up to 455 MB/s
Read: 95 mW
Power consumption Write: 95 mW

Power Watts
(avg): Standby: 70 mW
DEVSLP: <7 mW

Shock (2 m Sec half-sine): 1500 G peak 0.5ms (operating)
512 GB SATA 2.5” TLC Solid State Drive*
Architecture Solid State Drive with SATA interface; ATA 8 Compliant and SATA 2.6 compliant
Interface Serial ATA 3 (6.0 Gb/s)
Height 7 mm ± 0.20
Width 69.85 mm ± 0.25
Length 100.2 mm ± 0.25
Weight (typical) 36.5 g (+2)
Data Transfer Rate Sequential Read Up to 500 MB/s

(128k Sequential )
Sequential Write Up to 455 MB/s
Read: 95 mW
Power consumption
Power Watts Write: 95 mW
(avg):
Standby: 70 mW


DEVSLP: <7 mW

Shock (2 m Sec half-sine): 1500 G peak 0.5ms (operating)

Technical Specifications – Optical Drives
OPTICAL DRIVES
HP 9.5mm G3 800/600 Tower DVD-Writer
HP 9.5mm G3 800/600/400 SFF G4 400 SFF/MT DVD-Writer
HP 9.5mm ProOne AIO 600 G3 Ultra slim DVD-Writer Drive
HP 9.5mm ProOne AIO 600 G3 Ultra slim DVD-ROM Drive
Height 12.7mm height
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Disc recording capacity Up to 8.5 GB DL or 4.7 GB standard
Dimensions (W x H x D) 5.04 x 0.5 x 5.0 in (128 x 12.7 x 127 mm) without bezel
Weight (max) 0.42 lb (190 g)

DVD-R DL Up to 6X
DVD+R Up to 8X
DVD+RW Up to 8X
DVD+R DL Up to 6X
Write speeds
DVD-R Up to 8X
DVD-RW Up to 6X
CD-R Up to 24X
CD-RW Up to 24X
DVD-RW, DVD+RW Up to 8X
DVD-R DL, DVD+R DL Up to 8X
DVD+R, DVD-R Up to 8X
Read speeds DVD-ROM DL, DVD-ROM Up to 8X
CD-ROM, CD-R Up to 24X
CD-RW Up to 24X
Random DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical)
Full Stroke DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)
Access time
(typical reads, including Stop Time 6 seconds (typical)
settling)
Source Slimline SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
Power DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
Temperature 41° to 122° F (5° to 50° C)

Technical Specifications – Optical Drives
Maximum Wet Bulb 84° F (29° C)

Environmental conditions Temperature
(operating - non-condensing)

Technical Specifications – Memory
SYSTEM MEMORY SUPPORT

The HP ProDesk 600 G3 Business PC supports the 6th & 7th generation Intel® Core™ processor family. Based on a new PC micro-
architecture, the processor is designed for a two-chip platform consisting of a processor and Platform Controller Hub (PCH). The
6th generation Intel® Core™ processor includes an Integrated Memory Controller (IMC). The IMC supports DDR4protocols with two
independent, 64-bit wide channels each accessing one or two DIMMs.
• Two channels of non-ECC DDR4 unbuffered dual in-line memory modules (UDIMM) or DDR4 unbuffered small outline dual
in-line memory modules (SO-DIMM) with a maximum of two DIMMs per channel
• Single-channel and dual-channel memory organization modes
• Data burst length of eight for all memory organization modes
• Memory data transfer rates of up to 2400MT/s; actual supported data transfer rate determined by the configured
processor.
• 64-bit wide channels
• DDR4 system memory I/O voltage of 1.25V
• Theoretical maximum memory bandwidth of:
o 34 GB/s in dual-channel mode assuming 2400 MT/s
PLATFORM MEMORY SUPPORT

• The Small Form Factor (SFF) and Microtower (MT) platforms support up to four (4) industry-standard DDR4-SDRAM
DIMMs.
• The Desktop Mini (DM) supports up to two (2) industry-standard DDR4-SDRAM SO-DIMMs.
• The All-in-One (AiO) platform supports up to two (2) industry-standard DDR4-SDRAM DIMMs.
CAUTION: You must shut down the computer and disconnect the power cord before adding or removing memory modules.
Regardless of the power-on state, voltage is always supplied to the memory modules as long as the computer is plugged in to an
active AC outlet. Adding or removing memory modules while voltage is present may cause irreparable damage to the memory
modules or system board.
NOTE: For systems configured with more than 3 GB of memory and a 32-bit operating system, all memory may not be available
due to system resource requirements. Addressing memory above 4 GB requires a 64-bit operating system.

Technical Specifications – Networking and Communications

NETWORKING AND COMMUNICATIONS
Intel® I219LM Gigabit Network Connection LOM (standard)

Connector
RJ-45
System Interface
PCIe + SMBus
Controller
Intel® I219LM Gigabit Ethernet Controller
Data rates supported
Supports operation at 10/100/1000 Mb/s data rates
IEEE Compliance IEEE 802.3 Ethernet interface for 1000BASE-T, 100BASETX, and 10BASET applications
(802.3ab, 802.3u, and 802.3i, respectively).
EEE 802.3az support [Low Power Idle (LPI) mode]
IEEE 802.3u auto-negotiation conformance
Performance
Jumbo Frames (up to 9 kB)
802.1Q & 802.1p
Receive Side Scaling (RSS)
Two Queues (Tx & Rx)
Power • Ultra Low Power at cable disconnect (<1 mW) enables platform support for connected
standby
• Reduced power consumption during normal operation and power down modes
• Integrated Intel® Auto Connect Battery Saver (ACBS)
• Single-pin LAN Disable for easier BIOS implementation
• Fully integrated Switching Voltage Regulator (iSVR)
• Low Power Link-Up (LPLU)
MAC/PHY Interconnect • PCIe-based interface for active state operation (S0 state)
• SMBus-based interface for host and management traffic (Sx low power state)
Management Interface
• MDC/MDIO management interface
Security & Manageability
• Intel® vPro™ support with appropriate Intel chipset components
Intel® Ethernet I210-T1 Gigabit Network Adapter

Connector RJ-45
System Interface PCI Express x1
Controller Intel® I210 Gigabit Ethernet Controller
Memory Integrated Dual 48K configurable transmit receive FIFO Buffers
Data rates supported 10/100/1000 Mbps

802.1P
802.1Q
802.2
IEEE Compliance 802.3
802.3AB
802.3u
802.3x flow control
Bus architecture PCI-E 2.1
Data path width X1, 250 MB/s, Bi-directional interface
Data transfer mode Bus-master DMA
Hardware certifications FCC, B, CE, TUV-c, TUVus Mark Canada and United States, TUV-GS Mark for European Union
Power requirement Aux 3.3 V, 3.0 Watts in 1000 base-T and 1.0 Watts in 100 Base-T
Yes
Boot ROM support 10BASE-T (half-duplex) 10 Mbps
10BASE-T (full-duplex) 20 Mbps
10BASE-T (half-duplex) 10 Mbps
10BASE-T (full-duplex) 20 Mbps
Network transfer rate 100BASE-TX (half-duplex) 100 Mbps
100BASE-TX (full-duplex) 200 Mbps
1000BASE-T (full-duplex) 2000 Mbps (actual rate limited by PCI bus)
Operating Temperature: 32° to 132° F (0° to 55° C )

Environmental
Operating Humidity: 85% at 131° F (55° C)
Management WOL, PXE, DMI, WFM 2.0
Intel® 8265 802.11ac 2x2 WiFi + Bluetooth M.2 Combo Card* (802.11AC Wave 2 supported)
Wireless LAN Standards IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
Interoperability Wi-Fi certified
Frequency Band 802.11b/g/n
• 2.402 – 2.482 GHz
Note:
The FCC has declared as of January 1, 2015 products that utilize
passive scanning on channel 12/13 and are capable of transmitting


must fully comply with requirements of 15.247 or otherwise
disable those channels.
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Note: Indonesia no support this band)
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz,
and 80MHz)
Modulation Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security1 • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g
mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX
Lite
• WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power2 • 802.11b : +16dBm minimum
• 802.11g : +14dBm minimum
• 802.11a : +14dBm minimum
• 802.11n HT20(2.4GHz) : +14dBm minimum
• 802.11n HT20(5GHz) : +14dBm minimum
Power Consumption Transmit: 2.0 W (max)
Receive: 1.6 W (max)
Idle mode (PSP): 180 mW (WLAN Associated)
Idle mode: 50 mW (WLAN unassociated)
Connect Standby: 10 mW (WLAN+BT)
Radio disabled: 30 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity3 802.11b, 1Mbps : -94dBm maximum
802.11b, 11Mbps : -86dBm maximum
802.11g, 6Mbps : -88dBm maximum
802.11a, 6Mbps : -88dBm maximum
802.11n, MCS07 : -69dBm maximum
802.11ac, 1SS, MCS-0 : -86dBm maximum


Antenna type High efficiency antenna with spatial diversity, mounted in the
display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the
card to support WLAN MIMO communications and Bluetooth
communications
Form Factor PCI-Express M.2 MiniCard
Dimensions Type 2230 : 2.3 x 22.0 x 30.0 mm
Or
Type 1630 : 2.3 x 16.0 x 30.0 mm
Weight Type 2230 : 2.8g
Or
Type 1630 : 2g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF; LED White – Radio ON
1. Check latest software/driver release for updates on supported security features.
2. Maximum output power may vary by country according to local regulations.
3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a
packet error rate of 10% for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology
Bluetooth Specification 4.0/4.1/4.2 Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Channels Legacy : 0~79 (1 MHz/CH)
BLE : 0~39 (2 MHz/CH)
Data Rates and Throughput Legacy : 3 Mbps data rate; throughput up to 2.17 Mbps
BLE : 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy : Synchronous Connection Oriented links up to 3, 64 kbps,
voice channels
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth
device with a maximum transmit power of +4 dBm for BR and EDR.
Receiver Sensitivity Modulation 0.01% BER 0.001% BER
GFSK -80 dBm -70 dBm
π/4-DQPSK -80 dBm -70 dBm
8DPSK -80 dBm -70 dBm
Power Consumption Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Range Legacy Up to 33 ft (10 m)
BLE Up to 99 ft (30 m)
Electrical Interface USB 2.0 compliant

Bluetooth Software Supported Microsoft Windows Bluetooth Software
Link Topology
Electrical Interface Point to Point, Multipoint Pico Nets up to 7 slaves
Bluetooth Software Supported Full support of Bluetooth Security Provisions


Security
Power Management Microsoft Windows ACPI, and USB Bus Support
Power Management Self-configurable to optimize power conservation in all operating
Certifications modes, including Standby, Hold, Park, and Sniff
Security All necessary regulatory approvals for supported countries,
including:
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Bluetooth Profiles Supported
Power Management ETS 300 328, ETS 300 826
Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Serial Port Profile (SPP)1.2
Service Discovery Application Profile (SDAP)
Dial-Up Networking (DUN)1,1
Certifications Generic Object Exchange Profile (GOEP)1,2
 Object Push Profile (OPP)1,2
Bluetooth Profiles Supported
Hard Copy Cable Replacement (HCRP)1,2
Personal Area Networking Profile (PAN)1.0
Human Interface Device Profile (HID)1.0
Hands Free Profile (HFP) 1.5/1.6
Advanced Audio Distribution Profile (A2DP) 1.3
Audio Video Remote Control Profile (AVRCP) 1.3/1.4

Bluetooth V4.1/V4.2 support V4.1: ESR5/6/7 compliant
feature V4.2: ESR8 compliant, LE Secure Connection – Basic
*Wireless access point and internet access required. Availability of public wireless access points limited. The specifications for the
802.11ac WLAN are draft specifications and are not final. If the final specifications differ from the draft specifications, it may
affect the ability of the notebook to communicate with other 802.11ac WLAN devices.
Intel® 7265 802.11ac 2x2 DualBand Combo PCIe x1 Card

Wireless LAN Standards IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
Interoperability Wi-Fi certified
Frequency Band 802.11b/g/n
• 2.402 – 2.482 GHz
Note:
The FCC has declared as of January 1, 2015 products that utilize
passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or
otherwise disable those channels.
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Note: Indonesia no support this band)
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps


• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz,
and 80MHz)
Modulation Direct Sequence Spread Spectrum
Security1 • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g
mode only
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX
Lite
• WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power2 • 802.11b : +16dBm minimum
• 802.11ac 80MHz(5GHz) : +11dBm minimum
Power Consumption Transmit: 2.0 W (max)
Power Management ACPI and PCI Express compliant power management
Antenna type High efficiency antenna with spatial diversity, mounted in the
display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the
card to support WLAN MIMO communications and Bluetooth
communications
Form Factor PCI-Express M.2 MiniCard
Dimensions Type 2230 : 2.3 x 22.0 x 30.0 mm


Or
Type 1630 : 2.3 x 16.0 x 30.0 mm
Weight Type 2230 : 2.8g
Or
Type 1630 : 2g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF; LED White – Radio ON
4. Check latest software/driver release for updates on supported security features.
5. Maximum output power may vary by country according to local regulations.
6. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and
a packet error rate of 10% for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.2 Wireless Technology
Bluetooth Specification 4.2 Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Channels 79 (1 MHz) available channels
Data Rates and Throughput 3 Mbps data rate; throughput up to 2.17 Mbps
Synchronous Connection Oriented links up to 3, 64 kbps, voice
channels
Asynchronous Connection Less links 2178.1 kbps/177.1 kbps
asymmetric or 1306.9 kbps symmetric
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth
device with a maximum transmit power of +4 dBm for BR and EDR.
GFSK -80 dBm -70 dBm
Peak (Rx) 230 mW
Range Up to 33 ft (10 m)

Bluetooth Software Supported Microsoft Windows Bluetooth Software
Link Topology
Bluetooth Software Supported Full support of Bluetooth Security Provisions
Security
Power Management Self-configurable to optimize power conservation in all operating
Certifications modes, including Standby, Hold, Park, and Sniff
Security All necessary regulatory approvals for supported countries,
including:
Bluetooth Profiles Supported
Certifications Low Voltage Directive IEC950

Serial Port Profile (SPP)1
Generic Object Exchange Profile (GOEP)1,2
Object Push Profile (OPP)1,2
File Transfer Profile (FTP)
Certifications Synchronization Profile (SYNC)
Bluetooth Profiles Supported Hard Copy Cable Replacement (HCRP)1,2
Personal Area Networking Profile (PAN)1,2
Human Interface Device Profile (HID)1,2
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
Intel 3168 802.11ac with PCIe x1 WLAN/ Bluetooth® Combo*

IEEE 802.11a
Wireless LAN Standards
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
Wi-Fi certification
Interoperability
802.11b/g/n 2.402 – 2.482 GHz

Frequency Bands
Note:
The FCC has declared as of January 1, 2015 products that utilize passive
scanning on channel 12/13 and are capable of transmitting must fully
comply with requirements of 15.247 or otherwise disable those
channels.
802.11a/n 4.9 – 4.95 GHz (Japan)

5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
Note: Indonesia only supports 5.725 - 5.825 GHz (CH149 - CH161)
• 802.11b: 1, 2, 5.5, 11 Mbps

Data Rates
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11ac : MCS0 ~ MCS7, (1SS) (20MHz, 40MHz, and 80MHz)
Direct Sequence Spread Spectrum

Modulation
• IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
Security1
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX Lite
• WAPI
1 Check latest software/driver release for updates on supported security features.
Ad-hoc (Peer to Peer)

Network Architecture
Infrastructure (Access Point Required)
Models
802.11r Fast Roaming

Roaming
• 802.11b : +16dBm minimum

Output Power2
• 802.11ac 80MHz(5GHz) : +11dBm minimum
2 Maximum output power may vary by country according to local regulations.
Transmit: 2.0 W (max)

Power Consumption
Connect Standby: 10 mW (WLAN+BT)
ACPI and PCI Express compliant power management

Power Management


3Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation)
and a packet error rate of 10% for 802.11a/g (OFDM modulation).
High efficiency antenna with spatial diversity, mounted in the display enclosure
Antenna type
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO
communications and Bluetooth communications
PCI-Express M.2 MiniCard

Form Factors
Type 2230 : 2.3 x 22.0 x 30.0 mm

Dimensions
Or
Type 1630 : 2.3 x 16.0 x 30.0 mm
Type 2230 : 2.8g

Weight
Or
Type 1630 : 2g
3.3v +/- 9%
Operating Voltage
Operating: 14° to 158° F (-10° to 70° C)

Temperature
Non-operating: -40° to 176° F (-40° to 80° C)
Operating: 10% to 90% (non-condensing)

Humidity
Non-operating: 5% to 95% (non-condensing)
Operating: 0 to 10,000 ft (3,048 m)

Altitude
Non-operating: 0 to 50,000 ft (15,240 m)
LED Amber – Radio OFF; LED White – Radio ON

LED Activity
* Wireless access point and Internet service required and not included. Availability of public wireless access points limited.
HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology
4.0/4.1/4.2 Compliant
Bluetooth Specification
2402 to 2480 MHz

Frequency Band
Legacy : 0~79 (1 MHz/CH)

Number of Available
BLE : 0~39 (2 MHz/CH)
Channels
Legacy : 3 Mbps data rate; throughput up to 2.17 Mbps

Data Rates and Throughput
BLE : 1 Mbps data rate; throughput up to 0.2 Mbps

Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or
864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with a maximum
transmit power of + 4 dBm for BR and EDR.

Legacy GFSK -80 dBm -70 dBm

Peak (Rx) 230 mW
Range Legacy Up to 33 ft (10 m)

BLE Up to 99 ft (30 m)
Bluetooth Software Microsoft Windows Bluetooth Software

Supported
Link Topology

Bluetooth Software
Supported
Security
Full support of Bluetooth Security Provisions

Certifications
Self-configurable to optimize power conservation in all operating modes, including Standby,

Hold, Park, and Sniff
Security All necessary regulatory approvals for supported countries, including:
Bluetooth Profiles
Supported

Certifications
Low Voltage Directive IEC950
Certifications UL, CSA, and CE Mark

Bluetooth Profiles
Serial Port Profile (SPP)1
Supported
Generic Object Exchange Profile (GOEP)1,2
Object Push Profile (OPP)1,2

Hard Copy Cable Replacement (HCRP)1,2
Personal Area Networking Profile (PAN)1,2
Human Interface Device Profile (HID)1,2
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
Audio Video Remote Control Profile (AVRCP)
Bluetooth V4.1/V4.2 support V4.1: ESR5/6/7 compliant

feature
V4.2: ESR8 compliant, LE Secure Connection – Basic.
Technical Specifications - Audio

AUDIO
High Definition Audio – MT/SFF/DM
Type Integrated
HD Stereo Codec Conexant CX20632
Audio I/O Ports Headset connector supports a CTIA style headset and is re-taskable as a Line-in, Line-out,
Microphone-in or Headphone-out port
Rear Line-In can be retasked to function as a microphone input
Rear Line-Out
All ports are 3.5mm and support stereo ( see above tables for system configurations)
Internal Speaker Amplifier 2W class D mono amplifier for the internal speaker only External speakers must be powered
externally.
Multi-streaming Capable Playback multi-streaming can be enabled in the audio control panel to allow independent audio
streams to be sent to/from the front and rear jacks or integrated speaker.
Sampling Independent sampling rates for DAC’s and ADC’s; supports resolutions from 16 to 24-bit; 44.1
kHz to 192 kHz for DAC and 44.1 kHz to 96 kHz for ADC
Wavetable Syntheses Yes – Uses OS soft wavetable
Analog Audio Yes
# of Channels on Line-Out Stereo (Left & Right channels)
Internal Mono Speaker Yes
High Definition Audio - AIO
Type Integrated
HD Stereo Codec Conexant CX5001

Audio I/O Ports Side Headset Jack (Universal Audio Jack 3.5mm) supports CTIA or OMTP style headsets and is re-
taskable as a Line-in, Line-out, Microphone-in or Headphone-out port
All ports are 3.5mm and support stereo ( see above tables for system configurations)
Internal Speaker Amplifier 2W per channel Class D amplifier for the internal speaker only. External speakers must be
powered externally.
Multi-streaming Capable Playback multi-streaming can be enabled in the audio control panel to allow independent audio
streams to be sent to/from the headset, external or integrated speakers.
Sampling Independent sampling rates for DAC’s and ADC’s; supports resolutions from 16 to 24-bit; 44.1
kHz to 192 kHz for DAC and 44.1 kHz to 96 kHz for ADC
Wavetable Syntheses Yes – Uses OS soft wavetable
Technical Specifications - Audio
Analog Audio Yes
Internal Stereo Speakers Yes
Technical Specifications - Input/Output Devices

INPUT/OUTPUT DEVICES
HP Conferencing Keyboard
1. Function Keys 6. End/Decline a Call
2. F11 Lync or Skype for Business Contact list * 7. Answer a Call
3. F12 Lync or Skype for Business Calendar ** 8. Microphone Mute
4. Share Screen 9. Volume Up/Down
5. Stop Webcam 10. Audio Mute
*Microsoft Lync 2013, or Skype for Business, or Microsoft Outlook 2013 Contact list
**Microsoft Lync 2013, or Skype for Business, or Microsoft Outlook 2013 Calendar
Dimensions (H x L x W) 0.85 x 17.34 x 6.10 in (2.16 x 44.05 x 15.50 cm)
Weight 24.69 oz. ( 700 g)
Connectivity USB cable
Keys 110 (US) Layout, 111 (EU) Layout – depending upon country
Feature Summary Full-size ultra-quiet keyboard with numerical pad and 12 function keys
One-touch simplicity for Microsoft Lync or Skype for Business calls with dedicated keys and LED
light indicators
Illuminated keys Incoming Call – Blinks Green

Call in progress –Green
Microphone Mute – Orange
Audio Mute – Orange
Screen Sharing – Orange
Stop Webcam – Orange
Other Call control keys End/Decline Call

Volume up and down rocker key
Microsoft Lync/Outlook Fn+F12 – Lync or Skype for Business Calendar will open. If Lync or Skype for Business is not
available will bring Outlook Calendar *
Fn+F11 – Lync or Skype for Business Contact will open. If Lync or Skype for Business is not available
will bring Outlook Contact list *
* Fn+11 and Fn+12 function keys are not supported in Microsoft Windows 8.x Metro mode
Functions Keys Fn+F10 – System Settings

Fn+F9 – Devices
Fn+F8 – Search
Fn+F7 – Blank
Fn+F6 – Up Brightness Adjustment
Fn+F5 – Down Brightness Adjustment
Fn+F4 – Display Options
Fn+F3 – File Explorer
Fn+F2 – System Lock
Fn+F1 – System Sleep
System requirements Available USB port

Windows 7, Windows 8.x, and Windows 10
Server: Microsoft Lync Server 2010 or 2013 and Skype for Business Server 2015
Client: Microsoft Lync 2013 version 15.0.46xx or newer or Skype for Business
Notes:
• Limited support for Microsoft Lync 2010, Microsoft Lync 2013 Basic and Microsoft Metro
Mode
• Screen brightness functions supported in select HP systems
Approvals FCC; CE; ACA(C-tick); EAC

EMC UL, CE Mark
Product Safety
HP USB PS/2 Washable Keyboard

Keys 104 (US) Layout, 105 (EU) layout – depending upon
country
Physical Characteristics
Dimensions (L x W x H) 17.67x 6.62 x 1.38 in (449 x 168 x 35 mm)
Weight 1.7 lb (0.77 kg) minimum
Operating voltage + 5VDC ±5%
Power consumption 50-mA maximum (with three LEDs ON)
System interface USB Type A plug connector
Electrical
ESD CE level 4, 15-kV air discharge
EMI - RFI Conforms to FCC rules for a Class B computing device
Microsoft PC 99 - 2001 Functionally compliant
Mechanical Keycaps Stepped -profile design

Switch actuation 55-g nominal peak force with tactile feedback
Switch life 20 million keystrokes
Switch type Contamination-resistant switch membrane
Key-leveling mechanisms For all double-wide and greater-length keys
Cable length 7 ft (2.2 m)
Microsoft PC 99 - 2001 Mechanically compliant
Acoustics 43-dBA maximum sound pressure level
Operating temperature 50° to 122° F (10° to 50° C)
Non-operating temperature 4° to 149° F (-20° to 65° C)
Operating humidity 10% to 95% (non-condensing at ambient)
Non-operating humidity 0% to 95% (non-condensing at ambient)
Operating shock 40 g, six surfaces
Environmental
Non-operating shock 80 g, six surfaces
Operating vibration 2-g peak acceleration
Non-operating vibration 4-g peak acceleration
Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence
Drop (in box) 42 in (107 cm) on concrete, 16-drop sequence
Operating system support Windows® 7, Windows Vista, Windows XP Professional
Approvals UL, cUL, FCC, CE, TUV GS, VCCI, BSMI, C-Tick, KCC, USB-IF, WHQL, EN/IEC 60601-1,
IP66/NEMA4X
Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS
HP USB Business Slim Smartcard Keyboard
Keys 104, 105, 109 layout
(depending upon country
Physical Characteristics Dimensions 17.34 x 5.68 x 0.78 in (440.6 x 14.45 x 1.98 cm)
(H x W x D)
Weight 1.32 lb (0.6± 0.1 kg)
Operating voltage 5V
Power consumption 200 mA
System interface USB Interface
Electrical
ESD Air 12.5kV / Contact 8kV
EMI - RFI under 3dB
Microsoft PC 99 - 2001 Conforms to FCC rules for a Class B computing device
Keycaps Low-profile design
Switch actuation 60±15g nominal peak force with tactile feedback
Switch life 10 million keystrokes (Life tester)
Mechanical
Environmental

Non-operating temperature -22° to 140° F (-30° to 60° C)
Drop 26 in (66 cm) on carpet, six-drop sequence
(out of box)
Drop 30 in (76.2 cm) on concrete, 16-drop sequence
(in box)
Support All ISO 7816 smart cards
Interface Reads from and writes to all ISO7816-1, 2, 3, 4 memory
and microprocessor smart cards (T=0, T=1)
Chipset IDENTIVE CLOUD 2190 F
Standard APIs supported PC/SC, EMV2000, CT-API
Power USB Port
Short circuit detection (protects smart card and reader)
Power supply compliant with ISO7816 and EMV (5V, 60
mA)
SmartCard Function Supports 3-V and 5-V cards
Power consumption 100-mA maximum draw
Communication From card 9600 bps to 330,000 bps
From computer 12 Mbps (USB transfer speed)
Landing mechanism Contact device Friction contact
Card insertions rating Up to 100,000 insertion cycles
Interface modes CCID protocol
Reader performance interface USB connection
Electro-magnetic standards Europe 2004/108/EC
USA USAFCC part 15
Approvals CE Marking; TUV; EAC; FCC; cULus/CSAus; ICES; RCM; VCCI; KCC; BSMI
Ergonomic Compliance ISO 9241-410, TUV GS
Kit Contents Keyboard, I/O Security and Documentation CD, warranty card
HP USB Business Slim Keyboard
Keys 104, 105, 106, 107, 109 layout (depending upon country)
171.97 x 68.35 x 8.27 in (436.8± 1.5 x 137.6± 1.0 x 21.0±

Physical characteristics Dimensions (L x W x H)
1.0 cm)
Weight 1.32 lb (0.6± 0.08 kg)
Operating voltage + 4.4 – 5.25VDC

Electrical
50-mA maximum (with 5 VDC power supplied and three
Power consumption
LEDs ON)
Contact Discharge: 2, 4,6,8KV

ESD
Air Discharge: 2, 4, 8,10,12.5KV
Microsoft® PC 99 - 2001 Functionally compliant
Switch actuation 60±12.5g nominal peak force with tactile feedback
Mechanical Switch type Contamination-resistant switch membrane
Environmental Operating shock 40 g, six surfaces
Drop (in box) 30 in (76.2 cm) on concrete, 16-drop sequence
Approvals UL, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, KC
Kit contents Keyboard Installation Guide
Warranty Card Safety and Comfort Guide
HP PS/2 Business Slim Keyboard
Keys 104, 105, 106, 107, 109 layout (depending upon country)
171.97 x 68.35 x 8.27 in (436.8± 1.5 x 137.6± 1.0 x 21.0±

Physical Characteristics Dimensions (L x W x H)
1.0 cm)
Weight 1.32 lb (600± 80 g)
Operating voltage + 4.4 – 5.25VDC
50-mA maximum (with 5 VDC power supplied and three

Power consumption
LEDs ON)
System interface PS/2 6-pin mini din connector
Contact Discharge: 2, 4,6,8KV

ESD
Air Discharge: 2, 4, 8,10,12.5KV
Microsoft PC 99 - 2001 Functionally compliant

Electrical
Switch actuation 60±12.5g nominal peak force with tactile feedback

Environmental
Operating shock N/A
Non-operating shock 65 inch 2.9 ms, six surface; 30g 266 inch/second; 50g
266 inch/second six surface
Non-operating vibration Starting at 5 Hz, vary the frequency of vibration from 5 to

500 Hz and back to 5 Hz at a Logarithmic sweep rate of 1
octave per minute.
Drop (in box) 29.93 in (76 cm) on concrete, 16-drop sequence
Approvals UL, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, KC
HP USB (Grey) Business Slim Keyboard

Physical characteristics Keys 104, 105, 106, 107, 109 layout (depending upon country)
Dimensions (L x W x H) 17.19 x 5.41 x 0.82 in (43.68±1.5 x 13.76±1.0 x 2.1 ±1.0 cm)
Weight 1.32 lb (0.6± 0.08 kg)
Electrical Operating voltage + 4.4 – 5.25VDC
Power consumption 100-mA maximum (with 5 VDC power supplied and three LEDs ON)
ESD Contact Discharge: 4, 6, 8 KV
EMI – RFI Air Discharge: 8, 10, 12 KV / 15 KV
Microsoft PC 99 – 2001 Conforms to FCC rules for a Class B computing device; Functionally compliant
Mechanical Keycaps Low-profile design
Switch actuation Rubber dome + membrane
Switch life 10 million
Switch type Rubber dome
Key-leveling mechanisms Link bar
Cable length For all double-wide and greater-length keys
Microsoft PC 99 – 2001 Yes
Environmental Acoustics 55-dBA maximum sound pressure level
Operating temperature 10°C to 50°
Non-operating -30°C to 90°
temperature

Drop (in box) 30 in (76.2 cm) on concrete, 16-drop sequence
Approvals FCC; CE; VCCI; BSMI; KC; EAC; RCM; TUV-GS; UL; RoHS; WEEE
Ergonomic compliance ANSI HFS 100; ISO 9241-4; and TUVGS
HP Wireless Business Slim Keyboard and Mouse

171.97 x 68.35 x 8.27 in (436.8± 1.5 x 137.6± 1.0 x 21.0±
Dimensions ( L x W x H)
1.0 cm)
Keyboard
Weight – Without Two AA 1.23 lb (560± 80 g)
Alkaline Batteries
Dimensions (H x L x W) 1.46 x 4.53 x 2.47 in (37 x 115 x 62.9 mm)
Mouse
Weight – Without Two AA 0.15 lb (67 g)
Alkaline Batteries
Dimensions (H x L x W) 0.33x 1.79 x 0.72 in (8.4 x 45.5 x 18.4 mm)
Weight 0.21 oz (5.9 g)

Receiver
Cable Length – Minimum 6 ft (1.8 m)
Range 32.8 ft (10 m)
Available USB port for the receiver
CD-ROM Drive
System Requirements *This system may require upgraded and/or separately purchased hardware and/or a DVD
drive to install the Windows 7 software and take full advantage of Windows 7 functionality.
See http://www.microsoft.com/windows/windows-7/ for details.
Product Safety UL; CSA /TUV (Europe only); CE Mark; CB Report
Ergonomics ANSI; ISO (Europe only); GS Mark (Germany only)
EMC FCC; CE; ACA (-tick); BSMI; KC ; VCCI
CE Mark EN 55022:2010; EN 55024; EN 301489-1; EN 61000
Approvals Design Guidelines for PCs PC 99 – connector overmold colors; PC 2001 – full
functionality
Telecom All local telecom requirements and approvals for

intended markets
USA FCC Title 47 CFR, Par 15, Subpart C; other local
requirements

Country Support US, Belgium, Switzerland, Spain, Denmark, Netherlands,
France, Germany, Italy, Portugal, Sweden, Norway,
Finland, UK, Poland, Czech Republic, Turkey, Greece,
Austria, Bulgaria, Cyprus, Estonia, Hungary, Ireland,
Latvia, Lithuania, Luxemburg, Malta, Romania, Slovakia,
Slovenia, Vietnam, HK, Australia, NZ, Malaysia,
Singapore, Indonesia, Philippines, Thailand, Canada,
China, Japan, Korea, Taiwan, India, Venezuela, Ecuador,
Russia, Ukraine, Israel, Croatia, United Arab Emirates,
Peru, Brazil, Chile, Argentina, Mexico, South Africa, and
up to 193 countries worldwide.
Environmental Keyboard contains 25% post-consumer recycled plastic material.
HP PS/2 Mouse
Dimensions 1.46 x 2.48 x 4.53 in (3.70 x 6.29 x 11.50 cm)
(H x L x W)
Weight 3.53 oz (100g; +10g/- 5 g)
Operating temperature -32° to 104°F (0° to 40° C)
Non-operating temperature -4° to 140°F (-20° to 60° C)
Operating humidity 10% to 90%
(non condensing at ambient)
Non-operating humidity 10% to 90%
Environmental
Operating shock 40 g, 6 surfaces
Non-operating shock 80 g, 6 surfaces
Operating vibration 2 g peak acceleration
Non-operating vibration 4 g peak acceleration
Drop 80 cm height onto asphalt tile over concrete or equivalent, 5-
(out of box) drop in 5 direction except the cable face
Operating voltage 5 VDC ± 10%
Power consumption 100mA
System consumption PS/2 mini-din connector
Electrical
ESD CE level 4, 15 kV air discharge
EMI-RFI Conforms to FCC rules for a Class B computing device
Microsoft PC99 - 2001 Functionally compliant
Resolution 800 DPI
Tracking speed 10 in/s (25.4 cm/s) maximum
Mechanical Acceleration ±15%
Switch actuation 65±20 gf
Switch life 3,000,000 operations (using Hasco modified tester)

Switch type Low force micro-switches
Tracking mechanism life 80 km
Microsoft PC99 - 2001 Mechanically compliant
Width 6 mm
Diameter 22.5 ± 0.2 mm
Maximum rotation force 50 gf-cm
Scroll wheel
Switch type Light force micro-switch
Switch life 1 million operations
Mechanical life Minimum 200,000 revolutions
Regulatory Approvals UL/cUL, FCC, CE Mark, TUV/GS, VCCI, KCC, BSMI, C-Tick
HP USB 1000dpi Laser Mouse

Dimensions 1.47 x 4.53 x 2.47 in (37.3 x 114.97 x 62.86 mm)
(H x L x W)
Weight 3.360 oz (102g)
Cable length 70.9 in (180 cm)
System requirements Available USB port
Non-operating Temperature -4° to 140° F (-20° to 60° C)
Operating Humidity 10% to 90%
(non-condensing at ambient)
Mechanical Resolution 1000dpi
Tracking Speed 45 cm/sec
Cable Length 70.9 in (180 cm)
HP USB PS/2 Washable Mouse
Dimensions (H x L x W) 1.56 x 2.44 x 4.61 in (3.95 x 6.21 x 11.7 cm)
Weight 4.44 oz (126 g)
Environmental Operating temperature –32° to 104°F (0° to 40° C)
Non-operating –4° to 140°F (–20° to 60° C)
temperature
Non-operating humidity 10% to 90% (non condensing at ambient)

Drop (out of box) 80 cm height onto asphalt tile over concrete or equivalent, 5-drop in 5
direction except the cable face
Electrical Operating voltage 5 VDC ± 10%
Power consumption 100mA
System consumption PS/2 mini-din connector
ESD CE level 4, 15 kV air discharge
EMI-RFI Conforms to FCC rules for a Class B computing device
Microsoft® PC99 – 2001 Functionally compliant
Mechanical Resolution 400 ± 20% DPI
Tracking speed 10 in/s (25.4 cm/s) maximum
Acceleration 100 in/s/s (2.54 m/s/s)
Switch actuation 61 g nominal peak force
Switch life 3,000,000 operations (using Hasco modified tester)
Switch type Low force micro-switches
Tracking mechanism life 155 mi (250 km) at average speed of 10 in/s
Microsoft PC99 – 2001 Mechanically compliant
Scroll wheel Width 8 mm
Diameter 1.01 in (25.6 mm)
Maximum rotation speed 48 rats/sec
Switch type Light force micro-switch
Switch life 1 million operations
Mechanical life Minimum 200,000 revolutions
Regulatory approvals Compliant UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC
HP USB Hardened Mouse

Mouse Type Wired optical mouse
Interface USB 2.0
Dimensions 114.97 x 62.92 x 37.3 mm (+/-0.3 mm)
(H x L x W) (11.49 x 6.29 x 1.46 in)
Weight 92 g (+/-10 g)
(3.2 oz)
Cable length 1.8 M
Tracking X-Y Positioning X-Y Wheel 1000 DPI
Resolution
Tracking Up to 30 in/sec in either X or Y direction
Speed

Z Axis Wheel Z Wheel 24 counts per revolution
Revolution
Tracking 0 ~ 120 rpm
Speed
Environmental Operating temperature 0° - 40°C
Non-operating -40° - 65°C
temperature
Operating humidity 90%
Agency Approvals CE
FCC
RCM
VCCI
EMC
EAC
BSMI
UL
ICES-003 Class B
KCC
TUV/GS
Electrical Input Voltage & Current 4.4 ~ 5.25 VDC / 100 mA
Power Consumption Under nominal 5 VDC power supplied, max current consumption is 100mA
with tracking speed up to 30 in/sec
Color Black
System requirements Windows 10, Windows 8.1 32/64bit, Windows 7 32/64bit
HP Grey V2 Mouse
Dimensions 1.46 x 4.53 x 2.48 in (3.72 x 11.5 x 6.29 cm) ±1 mm
(H x L x W)
Weight 3.53 oz (100g; +10g/- 5 g)
Operating temperature 50° to 122°F (10° to 50° C)
Non-operating temperature -22° to 140°F (-30° to 60° C)
Operating humidity 10% to 90%
Non-operating humidity 20% to 80%
Environmental
Operating voltage 4.75~5.25 Vdc

Electrical
Power consumption (typical) 10mA
Mechanical Connector USB 2.0

Type 3D mouse (3 keys and wheel)
Resolution 800 DPI
Sensor PixArt vendor Optical USB mouse sensor. DIP
Tracking speed 30 inch/sec (max)
Tracking acceleration 8G(max), 1G=9.8m/s2
Color Grey
FCC, CE, ICES, C-TICK, VCCI, KCC, BSMI, ISO9241, Part 4, Computer Work Station Ergonomics
Regulatory Approvals compliance, IEC 801-2, IEC 1000-4-2, EN 55024:1998 + A1:2001 + A2:2003, European Standard
EN 55022: 2006 Class B, CE Mark
HP USB Mouse
Dimensions 2.5 x 4.5 x 1.5 in (63.5 x 114.3 x 38.1 mm)
(H x L x W)
Weight 0.22 lb (99.79 g)
Color Black
Connector USB
Mechanical Resolution 800 DPI sensitivity
Buttons Two primary buttons and clickable scroll wheel
Technical Specifications – Miscellaneous Features
MISCELLANEOUS FEATURES
Management Features
• Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode.
Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or
powered-off state without affecting other elements of the system.
• Intel® Wired for Management support; industry wide initiative to make Intel® architecture based PCs, servers and mobile
computers more inherently manageable out-of-the-box and over the network
• Dual State Power Button; acts as both an on/off button and a suspend-to-sleep button
Serviceability Features
• Dual colored power LED on front of computer to indicate either normal or fault condition
• Diagnostic LED Explanation Table:
o Power LED will blink red 2 to 5 times, then blink white 2 or more times, then repeat (with beep tones for each
blink initially):
▪ 2 red + 2 white User must provide file for BIOS recovery (USB storage, typically)
▪ 2 red + 3 white User must enter a key sequence to proceed with recovery by policy
▪ 2 red + 4 white BIOS recovery is in progress
▪ 3 red + 2 white Memory could not be initialized
▪ 3 red + 3 white Graphics adapter could not be found
▪ 3 red + 4 white Power supply failure / not connected
▪ 3 red + 5 white Processor not installed
▪ 3 red + 6 white Current processor does not support an enabled feature
▪ 4 red + 2 white Processor has exceeded its temperature threshold / system thermal shutdown
▪ 4 red + 3 white System internal temperature has exceeded its threshold
▪ 5 red + 2 white System controller firmware is not valid
▪ 5 red + 3 white System controller detected BIOS is not executing
▪ 5 red + 4 white BIOS could not complete initialization / PCA failure
▪ 5 red + 5 white System controller rebooted the system after a health or recovery timer triggered
• HP PC Hardware Diagnostics UEFI:
o This utility enables hardware level testing outside the operating system on many components. The diagnostics
can be invoked by pressing F2 at POST, and is available as a download from HP Support
• System/Emergency ROM
• Flash ROM
• CMOS Battery Holder for easy replacement
• BIOS recovery files are maintained on the local OS drive when updating with HP BIOS Update and Recovery utility
(HPBIOSUPDREC) 5 Aux Power LED on System PCA
• Processor ZIF Socket for easy Upgrade
• Over-Temp Warning on Screen (Requires IM Agents)
• Clear Password Jumper
• DIMM Connectors for easy Upgrade
• Clear CMOS Button
• NIC LEDs (integrated) (Green & Amber)
• Dual Color Power and HD LED - To Indicate Normal Operations and Fault Conditions
• Color coordinated cables and connectors
• Tool-less Hood Removal
• Front power switch
• System memory can be upgraded without removing the system board or any internal components
• Tool-less Hard Drive, CD & Diskette Removal
• Green Pull Tabs, and Quick Release Latches for easy Identification
Technical Specifications – Environmental
Additional Features Description

Towerable Orientation Product can be oriented as either a desktop (horizontal) or a tower (vertical)
Implementation of the industry standard ATA Security feature set. When enabled, it
Drive Lock prevents software access to user data on the drive until one or two user-defined
passwords are provided.
MBR or GPT boot sectors of the hard drive are critical to securely starting the
operating system. By saving the MBR or GPT data (depending on the how the OS was
Boot Sectors Protection
installed), the BIOS will be able to monitor for changes and allow the user to override
them with the backup copy at boot-up.
DPS Access through F10 Setup during Boot

A diagnostic hard drive self-test. It scans critical physical components and every
sector of the hard drive for physical faults and then reports any faults to the user
Running independently of the operating system, it can be accessed through a
Drive Protection System Windows-based diagnostics utility or through the computer's setup procedure. It
produces an evaluation on whether the hard drive is the source of the problem and
needs to be replaced
The system expands on the Self-Monitoring, Analysis, and Reporting Technology
(SMART), a continuously running systems diagnostic that alerts the user to certain
types of failures
SMART Technology (Self-Monitoring, Allows hard drives to monitor their own health and to raise flags if imminent failures
Analysis and Reporting Technology) were predicted
Predicts failures before they occur. Tracks fault prediction and failure indication
SMART I - Drive Failure Prediction parameters such as re-allocated sector count, spin retry count, calibration retry count
By avoiding actual hard drive failures, SMART hard drives act as "insurance" against
SMART II - Off-Line Data Collection
unplanned user downtime and potential data loss from hard drive failure
SMART III - Off-Line Read Scanning with IOEDC: I/O Error Detection Circuitry
Defect Reallocation Detects errors in Read/Write buffers on HDD cache RAM
SMART IV - End-to-End CRC for hard Interface in F10 setup provides confirmation of SMART IV support.
drives
After-Market Options (availability may vary by region)
After Market Options

Business Monitors (sample list)* SFF/MT DM AiO Part Number
HP ProDisplay P240va 23.8-inch Monitor X X N3H14AA
HP ProDisplay P232 23-inch Monitor X X K7X31AA
HP ProDisplay P222c 21.5-inch Video Conferencing Monitor X X L4J08AA
*Additional models are available.
Communication Devices SFF/MT DM AiO Part Number

Intel® Ethernet I210 - T1 Gbe NIC X E0X95AA
Intel® 7265 802.11ac 2x2 DualBand Combo PCIe x1 Card X N4G85AA
Graphics Solutions SFF/MT DM AiO Part Number

NVIDIA® GeForce® GT 730 2GB DP PCIe x8 Card X Z9H51AA
NVIDIA® GeForce® GT 730 1GB HDMI PCIe x8 Card X
AMD® Radeon™ R7 450 4GB PCIe x16 Card MT Only Z9H52AA
HP UHD USB Graphics Adapter X X X N2U81AA
HP DisplayPort™ 1.2 Cable Kit X X X VN567AA
HP DisplayPort™ 1.2 To DVI-D Adapter X X X FH973AA
HP DisplayPort™ 1.2 To VGA Adapter X X X AS615AA
HP DisplayPort™ 1.2 To HDMI 4k Adapter X X X K2K92AA
HP DVI to DVI Cable X X X DC198A
HP (Bulk) 700mm DisplayPort™ 1.2 Cable Kit X V8Y77A6
HP USB-C to VGA Adapter (when Type-C Port is installed) X X N9K76AA
HP USB-C to HDMI Adapter (when Type-C Port is installed) X X N9K77AA
HP USB-C to DisplayPort™ 1.2 Adapter (when Type-C Port is installed) X X N9K78AA
Data Storage Drives SFF/MT DM AiO Part Number

HP 500GB 7200PRM SATA 6.0Gb/s 3.5” Hard Drive X QK554AA
HP 1TB 7200rpm SATA 6Gb/s 3.5” Hard Drive X QK555AA
HP 256GB SATA TLC Solid State Drive X X X P1N68AA
HP 512GB Turbo Drive G2 TLC M.2 SSD Drive X X X X8U75AA
HP 9.5mm Slim Removable SATA 500GB X X T7G14AA
HP 256GB SATA Non-SED Solid State Drive X X X W0U55AA
HP 9.5mm G3 800/600 Tower DVD Writer MT Only 1CA52AA
HP 9.5mm G3 8/4 SFF G4 400 SFF/MT DVD Writer SFF Only AiO Only 1CA53AA
Input Devices SFF/MT DM AiO Part Number

HP Conferencing Keyboard X X X K8P74AA
HP USB Business Slim Keyboard X X X N3R87AA

HP PS/2 Business Slim Keyboard X N3R86AA
HP Wireless Business Slim Keyboard and Mouse** X X X QY449AA
HP USB Business Slim Grey Keyboard (EMEA only) X X X Z9H49AA
HP USB Business Slim Smart Card CCID Keyboard X X X Z9H48AA
HP USB PS/2 Washable Keyboard and Mouse Kit** X X X BU207AA
HP USB Grey V2 Mouse (EMEA only) X X X Z9H74AA
HP USB Business Slim Keyboard and Mouse (China Only) X X X Z9H50AA
HP USB Hardened Mouse X X X P1N77AA
HP PS/2 Mouse X QY775AA
HP USB Mouse X X X QY777AA
HP USB 1000dpi Laser Mouse X X X QY778AA
** Keyboard contains 25% post-consumer recycled plastic material
Desktop Mini Accessories SFF/MT DM AiO Part Number
HP Desktop Mini DVD Super Multi-Writer ODD Expansion Module X K9Q83AA

HP Desktop Mini 500GB HDD/ I/O Expansion Module X K9Q82AA
HP Desktop Mini Rack Mount Tray Kit X G1K21AA
HP Desktop Mini Security/Dual VESA Sleeve X G1K22AA
HP Desktop Mini 65W Power Supply Kit X L2X04AA
HP Desktop Mini 90W Power Supply Kit X L4R65AA
HP Desktop Mini Vertical Chassis Stand X G1K23AA
HP Desktop Mini Port Cover Kit X 1ZE52AA
HP Desktop Mini I/O Expansion Module X K9Q84AA
HP Integrated Work Center Desktop Mini/Thin Clients X G1V61AA
HP Single Monitor Arm X BT861AA
HP Quick Release Bracket X EM870AA
HP PC Mounting Bracket for Monitors X N6N00AT
System Memory SFF/MT DM AiO Part Number
HP 4GB DDR4-2400 DIMM X Z9H59AA

HP 4GB DDR4-2400 SODIMM X X Z9H55AA
Multimedia Devices SFF/MT DM AiO Part Number
HP Business Headset v2 X X X T4E61AA

HP USB Business Speakers v2 X X N3R89AA
Security Devices SFF/MT DM AiO Part Number
HP 600 G3 SFF Intrusion Sensor SFF only J6L43AA

HP 600 G3 MT Solenoid Lock and Intrusion Sensor MT only J6L42AA
HP Business PC Security Lock v2 Kit X N3R93AA
HP Keyed Cable Lock 10mm Kit X X X T1A62AA
HP Dual Head Keyed Cable Lock Kit X X X T1A64AA
Stands and Accessories SFF/MT DM AiO Part Number
HP (10 Set) 600/800 G3 Tower Bezel Support Kit Tower only Z9H63A6
HP (10) 400 G4 600/800 G3 SFF G4 MT Bezel Support Kit SFF only Z9H64A6
HP Single Monitor Arm X X BT861AA
HP 600 G3 800/705/600 G2 AIO Adjustable Height Stand X N7H08AA
HP ProOne 600 G3 Adjustable Height Stand X 2GU06AA
LANDESK Software (e-delivery) SFF/MT DM AiO Part Number
Contact your HP representative for available options. N/A
© Copyright 2018 HP Development Company, L.P. All rights reserved.
The information contained herein is subject to change without notice. The only warranties for HP products are set forth in the
express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an
additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft and Windows
are registered trademarks or trademarks of Microsoft Corporation in the U.S. and/or other countries. Intel, Celeron, Core, Pentium
are registered trademarks or trademarks of Intel Corporation in the U.S. and/or other countries. Bluetooth  is a trademark of its
proprietor, used by HP, Inc. under license. USB Type-C™ and USB-C™ are trademarks of USB Implementers Forum. NVIDIA, GeForce
and NVS are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. AMD and Radeon are
trademarks of Advanced Micro Devices, Inc. ENERGY STAR is a registered trademark owned by the U.S. Environmental Protection
Agency. DisplayPort™ and the DisplayPort™ logo are trademarks owned by the Video Electronics Standards Association (VESA®) in
the United States and other countries.
Change Log
Date of change: Version History: Description of change:

January 25, 2017 Version 1 to 2 Launch QS launched
February 8, 2017 Version 2 to 3 Update Weights & Dimensions Section: Chassis (W x H x D) Not including bezel MT
inches value
February 13, 2017 Version 3 to 4 Update Graphics Section updated
February 27, 2017 Version 4 to 5 Update Bays section updated (5.25" Half Height text updated, footnote added)
March 2, 2017 Version 5 Update Accessories section updated (accessory added), Environmental section
updated
March 6, 2017 Version 5 to 6 Update Security Devices updated and Hardware Security updated
March 9, 2017 Version 6 to 7 Update After market section updated (added accessory)
March 14, 2017 Version 7 to 8 Update Graphics section updated
March 21, 2017 Version 8 to 9 Update Environmental Section updated
March 23, 2017 Version 9 to 10 Update USB ports updated
April 5, 2017 Version 10 to 11 Update Slots section updated & Dimensions nomenclature updated (W x D x H)
April 7, 2017 Version 11 to 12 Updated HP Bios section updated (NIST 800-147 certification added)
April 17, 2017 Version 12 to 13 Updated Overview Section updated
April 17, 2017 Version 13 to 14 Updated Ports section updated
April 27, 2017 Version 14 to 15 Updated Graphics section updated
May 22, 2017 Version 15 to 16 Update Security Devices section: HP 600 G3 SFF Intrusion Sensor part number
changed from 1CA50AA to J6L43AA
July 10, 2017 Version 16 to 17 Added Added AiO form factor
July 17, 2017 Version 17 to 18 Updated Desktop Mini Accessories updated: P3R65AA deleted and replaced
by 1ZE52AA;
I/O Ports – Internal ports section added.
July 21, 2017 Version 18 to 19 Updated Slots footnote updated
Environmental disclaimer updated
July 25, 2017 Version 19 to 20 Updated “256GB Turbo Drive G2 TLC OPAL 2.0 SED Solid State Drive” removal
updated
July 28, 2017 Version 20 to 21 Update Webcam & mic resolution spec added.
August 3, 2017 Version 21 to 22 Update Environmental section Table updated.
August 9, 2017 Version 22 to 23 Update Dimensions and weight section updated
August 21, 2017 Version 23 to 24 Update Added how many PS/2 ports are on the card with footnote, in the Ports
section
August 25, 2017 Version 24 to 25 Update Dimensions and weight section updated
September 1, 2017 Version 25 to 26 Update Environmental for 600 G3 MD, 600 G3 SFF,600 G3 MT and 600 G3 PCI MT
added individually
October 5, 2017 Version 26 to 27 Update DisplayPort ™ version updated in the whole document
October 16, 2017 Version 27 to 28 Update “Multi-unit packaging” and “Shipping weight” added to Weights and
dimensions table
October 18, 2017 Version 28 to 29 Update (5 Gbit/s data speed) added to each USB 3.1 Gen1 Port in all call outs
October 30, 2017 Version 29 to 30 Update Power section updated
November 7, 2017 Version 30 to 31 Update Intel® vPro™ Technology bullet corrected on AT A GLANCE section
November 20, Version 31 to 32 Update New spec line added to WEBCAM & MIC (All-in-One models only)
2017
December 4, 2017 Version 32 to 33 Update Typo corrected in Intel Core i3-7300T Processor specs / And corrections in
Aio SATA Storage connectors
December 12, 2017 Version 33 to 34 Update Typo corrected in Slots section, Adjustable Height Stand specs updated
January 2, 2018 Versoin 34 to 35 Update Serial port updated at 600 G3 SFF
January 3, 2018 Version 35 to 36 Update Power factor information table added to Power supply section
January 4, 2108 Version 36 to 37 Update Slot PCI Express x16 specified to to be designed on MT
January 24, 2018 Version 37 to 38 Update HP Desktop Mini Lock Box removed from the Accessories section
February 7, 2018 Version 38 to 39 Update PCI Express x 4 (v3.0) Row added to Slots section
Change Log
February 12, 2018 Version 39 to 40 Update HP ProOne 600 G3 21.5-inch All-in-One Business PC call out reference
added to side view image
March 28, 2018 Version 40 to 41 Update PCI ports updated
April 13, 2018 Version 41 to 42 Update At a glance section updated
April 15, 2018 Version 42 to 43 Update AMD Radeon™ R7 430 2GB LP 2DP PCIe x16 GF card specs added to MT and
SFF
April 17, 2018 Version 43 to 44 Update 7500 Processor page 13
April 19, 2018 Version 44 to 45 Update At a glance section
July 10, 2018 Verison 45 to 56 Update Note removed from storage specs

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QuickSpecs HP ProDesk 600 G3 and HP ProOne 600 G3 Business Desktops PCs

HP ProDesk 600 G3 Desktop Mini Business PC

1. USB Type-C™ charging port 5. Headset Connector

Not all configuration components are available in all regions/countries. Page 1

HP ProDesk 600 G3 Desktop Mini Business PC

1. Antenna cover 7. Choice of port (DisplayPort™ 1.2, HDMI, VGA, Serial or

Not all configuration components are available in all regions/countries. Page 2

HP ProDesk 600 G3 Small Form Factor Business PC

1. Slim Optical Drive (optional) 6. USB 2.0 (fast charging port)

Not all configuration components are available in all regions/countries. Page 3

HP ProDesk 600 G3 Small Form Factor Business PC

1. Audio-in connector 7. Optional port (DisplayPort™, HDMI, VGA, or USB-CTM)

Not all configuration components are available in all regions/countries. Page 4

HP ProDesk 600 G3 and 680 G3 Microtower Business PC

1. 5.25-inch drive bay (behind bezel) 1. Audio-in connector

Not all configuration components are available in all regions/countries. Page 5

Not all configuration components are available in all regions/countries. Page 6

1. Webcam Microphone 4. Webcam lens

Not all configuration components are available in all regions/countries. Page 7

1. Power button 4. Headset jack

Not all configuration components are available in all regions/countries. Page 8

REAR/PORTS (BEHIND SECURITY COVER)

1. Security cable slot 6. Dual-Mode DisplayPort™ 1.2 (DP++) connector

Not all configuration components are available in all regions/countries. Page 9

Not all configuration components are available in all regions/countries. Page 10

Not all configuration components are available in all regions/countries. Page 11

Standard Features and Configurable Components

4. Only available with 6th generation (Intel) processors.

Intel® 7th Generation Core™ i7 Processors DM SFF MT AiO

Not all configuration components are available in all regions/countries. Page 12

Standard Features and Configurable Components

Intel® 7th Generation Core™ i5 Processors DM SFF MT AiO

Intel® 7th Generation Core™ i3 Processors DM SFF MT AiO

Not all configuration components are available in all regions/countries. Page 13

Standard Features and Configurable Components

Intel® 7th Generation Pentium® Processors DM SFF MT AiO

Not all configuration components are available in all regions/countries. Page 14

Standard Features and Configurable Components

Intel® 6th Generation Core™ i7 Processors DM SFF MT AiO

Intel® 6th Generation Core™ i5 Processors DM SFF MT AiO

Not all configuration components are available in all regions/countries. Page 15

Standard Features and Configurable Components

Intel® 6th Generation Core™ i3 Processors DM SFF MT AiO

Intel® 6th Generation Pentium® Processors DM SFF MT AiO

Not all configuration components are available in all regions/countries. Page 16

Standard Features and Configurable Components

3.5" SATA 7.2k RPM Hard Disk Drives DM SFF MT AiO

2.5 inch Solid State Hybrid Drives (SSHD) DM SFF MT AiO

3.5 inch Solid State Hybrid Drives (SSHD) DM SFF MT AiO

2.5 inch Self-encrypting Drives (SED HDD) DM SFF MT AiO

Not all configuration components are available in all regions/countries. Page 17

Standard Features and Configurable Components

2.5 inch Self-encrypting Drives (SED SSD) DM SFF MT AiO

PCIe NMVe SSD Drives DM SFF MT AiO

2.5 SATA SSD Drives DM SFF MT AiO

Optical Disc Drives DM SFF MT AiO

Removable DM SFF MT AiO

Not all configuration components are available in all regions/countries. Page 18

Standard Features and Configurable Components

Optional Discrete Graphics Solutions