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Desk V Manual

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511 views81 pages

Desk V Manual

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Iris Alanís

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You are on page 1/ 81

DENTONVACUUM

DESKV

DESK V - SPUTTER/ETCH UNIT AND ACCESSORIES

Desk V TSC
Desk V
Desk V

DENTON VACUUM, LLC

1259 N. CHURCH STREET
MOORESTOWN, NJ 08057
PHONE: 856-439-9100
FAX: 856-439-9111
WWW.DENTONVACUUM.COM

Watch the Desk V videos here:

https://www.youtube.com/user/Dentonvacuum

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Table of Contents

Contents
INTRODUCTION ............................................................................................................................................................... 5
GENERALDESCRIPTION............................................................................................................................................ 5
SYSTEMVIEWS ....................................................................................................................................................... 6
FRONT VIEW OF UNIT ...............................................................................................................................................6
REAR VIEW OF UNIT .................................................................................................................................................7
ELECTRICALREQUIREMENTS ..................................................................................................................................... 8
DESK V HP & DESK V TSC ..........................................................................................................................................8
CARBON ROD ACCESSORY AND CARBON YARN ACCESSORY .......................................................................................9
ENVIRONMENTALCONDITIONS ................................................................................................................................ 9
OPTIONS ........................................................................................................................................................... 10
ROTATION .............................................................................................................................................................10
THICKNESS MONITOR .............................................................................................................................................10
CARBON ROD EVAPORATION..................................................................................................................................10
CARBON YARN EVAPORATION ................................................................................................................................10
SAFETYWARNINGS ......................................................................................................................................................... 10
SAFETYSYMBOLS.................................................................................................................................................. 13
UNPACKING&SETUP ....................................................................................................................................................... 13
SYSTEM .............................................................................................................................................................. 13
Emergency Stop Button ........................................................................................................................................14
INSTALLATIONINSTRUCTIONS............................................................................................................................................... 15
VOLTAGE SELECTION ......................................................................................................................................... 15

Verify that the incoming power connection is set for the proper voltage!
........... 15
CHAMBER PREPARATIONS......................................................................................................................................18
MECHANICAL PUMP INSTALLATION ......................................................................................................................... 19
The mechanical pump installed ............................................................................................................................... 19
TARGET INSTALLATION & REPLACEMENT .................................................................................................................... 21
INITIAL START-UP .................................................................................................................................................... 22
INSPECTION......................................................................................................................................................... 22
START-UPPROCEDURE .............................................................................................................................................. 23
OPENINGTHECHAMBER........................................................................................................................................ 24
DESCRIPTIONOFCONTROLS ............................................................................................................................................... 25
SYSTEM START SCREEN........................................................................................................................................... 25
SCREENS ...............................................................................................................................................................26

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.................................................................................................26
MANUAL SPUTTER ............................................................................................................................................ 27
St an d ar d Desk V HP ...........................................................................................................................................27

.....................................................................................27
MANUAL SPUTTER DESK V TSC .......................................................................................................................... 29
TIMED SPUTTER .....................................................................................................................................................31
Desk V TSC .............................................................................................................................................................. 32
Desk V Timed Recipe Programming ......................................................................................................................34
How to Use Timed Recipe Programming ..............................................................................................................35
MANUAL ETCH .....................................................................................................................................................37
DESK V HP ................................................................................................................................................................ 37
TIMED ETCH...........................................................................................................................................................40
OVERVIEW.............................................................................................................................................................42
OPERATION................................................................................................................................................................... 44
ETCH ................................................................................................................................................................. 45
SPUTTER ............................................................................................................................................................. 47
TIMED ETCH OPERATION ........................................................................................................................................ 49
TIMEDSPUTTEROPERATION................................................................................................................................... 50
SHUT-DOWNPROCEDURE...................................................................................................................................... 52
OPTIONS ............................................................................................................................................................ 52
QUARTZ CRYSTAL MONITOR ...................................................................................................................................52
DESK V TSC ............................................................................................................................................................53
CARBON ROD ACCESSORY ......................................................................................................................................54

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CARBON YARN ACCESSORY ....................................................................................................................................... 57
Loa d i ng the Carb on Yarn ............................................................................................................................ 58
MAINTENANCE ............................................................................................................................................................. 59
GENERALMAINTENANCE....................................................................................................................................... 59
MECHANICALPUMP ..............................................................................................................................................59
MECHANICAL PUMP – OIL CHANGE ........................................................................................................................60
SPUTTERTARGET ....................................................................................................................................................60
TROUBLESHOOTING ................................................................................................................................................ 62
VACUUMPERFORMANCEDATASHEET.................................................................................................................................... 64
USEDTARGET ................................................................................................................................................................ 65
TYPICALPERFORMANCEDATA ............................................................................................................................................. 66
PUMPDOWN ...................................................................................................................................................... 66
DEPOSITIONRATE ................................................................................................................................................. 69
PACKINGDESKVFORRETURN ............................................................................................................................................. 72
PACKINGPHOTOS ................................................................................................................................................. 73
SUGGESTEDSPARES ......................................................................................................................................................... 74
CONSUMABLESFOR DESK V AND TSC ....................................................................................................................... 74
FUSES................................................................................................................................................................. 75
CONSUMABLESFORCARBONRODACCESSORY.......................................................................................................... 76
CONSUMABLES FOR CARBON YARN ACCESSORY ........................................................................................................ 77
TARGETS FOR DESK V AND TSC ................................................................................................................................ 78
Adjusting the Vacuum Safety Bellows Switch ........................................................................................... 79
Emergency Stop Button ........................................................................................................................................80
Battery Advisory: ..................................................................................................................................................80

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INTRODUCTION
GENERAL DESCRIPTION
The Denton Vacuum DESK V Cold Sputter/Etch Unit is designed to deposit a conductive coating on an
SEM sample and to provide some limited surface cleaning in some models.

A standard 6” diameter Glass Cylinder with top and bottom seals sits on the aluminum Baseplate.
Metal chamber is optional with Turbo Pump option (TSC).

A two-stage, direct-drive Mechanical Pump, is lo cated out side of the syst em cabinet,
evacuates the cylinder. Turbo molecular pump is optional (TSC).

An automatic Vent Valve is slaved to the mechanical pump. It will automatically open when the
Mechanical Pump is turned OFF to vent the chamber to atmosphere. It will automatically close when
the Mechanical pump is turned on.

An insulated Specimen Table with provisions for height adjustment is mounted within the Pyrex
cylinder. Rotation is optional.

The Sputter Cathode is clamped to an insulated aluminum plate in the chamber cover.

A manual Shutter is provided to shield the Sputter Cathode from contamination during the Etch
cleaning cycle. The shutter control knob is left of the chamber. Clockwise rotation of the knob will
open the shutter and counterclockwise rotation will close it.

A manual Gas Control is provided to control pressure in the cylinder. The Gas Control knob is to the
left of the chamber.

For servicing and inspection convenience, all Fuses are mounted externally on the rear panel and the
rear panel is hinged to provide access to internal components.

There are six main operations for the system: Vacuum, Etch Enable (if equipped), Rotation (if
equipped), Sputter Enable, Timed Etch (if equipped) and Timed Sputter.

A Programmable Logic Controller (PLC) controls the system. A Touch Screen is used to interface with
the PLC. Operator interface is through a graphics program that is running on the Touch Screen. This
control system will be described in detail in the Operation section of this manual.

NOTE: The system offers you a range of thin film process options.
However, it is important to note that with all of this system’s potential, there exist safety
considerations. Individuals who are to operate, service, or maintain this system should
familiarize themselves with this manual.

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If this equipment is used in a manner not specified by Denton Vacuum, the protection
provided by the equipment may be impaired.

A complete understanding of this control system is recommended before operating the

vacuum system.

SYSTEM VIEWS
FRONT VIEW OF UNIT

3 5

6
4
7

1 Head Support 4 Front Panel Removal; Latch

2 Vacuum Chamber 5 Shutter Control

3 Gas Flow Valve 6 Emergency Shut-off

7 Color Touch Screen

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REAR VIEW OF UNIT

6 11
13
3

1 Fan 8 Fuse 5: Rotation Motor (Option) 1 Amp

2 Vacuum Chamber 9 Fuse 6: Turbo Pump (Option) 2 Amps
3 120 VAC/220 VAC Input Power 10 Mechanical Pump 120 VAC Power Connection
Connection and Main 10 Amp Fuses
4 Fuse 1: Mechanical Pump 8 Amps 11 Mechanical Pump Piping Connection

5 Fuse 2: 24 VDC Power Supply 1 Amp 12 Vent Gas Connection (N2)

6 Fuse 3: AC HVB Board 2 Amps 13 Process Gas Connection (Ar)
7 Fuse 4: PLC Touch Screen 1 Amp

NOTE: ALL FUSES MUST OF TIME DELAY OR

SLOW BLOW TYPE

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Picture depicts the tilting, rotating omni found
in the Desk V. The rubber belt controls the
rotation of the specimen stage, while the chain
turns the tilting mechanism at a different speed.
As the white plastic insert moves around the
angled cylinder, it causes the specimen table to
tilt. Because the stage rotates at a different
speed than does the tilting mechanism, the
table’s degree of tilt varies as it passes the same
point in multiple rotations. All systems
equipped with the tilting, rotating omni come
with a screw that can be adjusted to allow for a
fixed degree of tilt (or rotation without tilt).

ELECTRICALREQUIREMENTS
DESK V HP & DESK V TSC
 Dual power input provided at rear of cabinet. Systems shipped set for 120 VAC. Customer
must change the incoming voltage selection at the main power connection at the rear of the
cabinet. This drawer also contains the main system 10 Time Delay Fuses.

Open drawer by placing

screwdriver in slot.

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Alignment arrow

Open the drawer

and flip it to the
desired voltage so
that the arrow on
the drawer aligns
with the arrow on
the frame.
Alignment arrow

Verify that the incoming power connection is set for the proper voltage!

 120VAC; 10 Amps (standard); or

 220 VAC; 8 Amps (non-US)

 Power cord provided with unit.

CARBON ROD ACCESSORY AND CARBON YARN ACCESSORY

 120 VAC; 10 Amps (standard); or

 220 VAC; 5 Amps (non-US or special order).

 Power Cord provided with unit.

ENVIRONMENTAL CONDITIONS
The system is designed and intended for use in the following environmental conditions. If all
specifications are not met, system components may malfunction and can possibly cause injuries.

 Altitude up to 2000 m.

 Temperature range from 5 to 40oC.

 Maximum relative humidity 80% for temperature up to 31oC decreasing linearity to 50%
relative humidity at 40oC.

 Mains supply voltage fluctuations not to exceed +/-10% of the nominal voltage.

 Other supply voltage fluctuations as stated by the manufacturer.

 Pollution degree 2 in accordance with IEC 664.

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OPTIONS

ROTATION
 Tilting and rotating 2.0”, 3.0”, or 4.0” diameter plate.

 Controlled through touch screen.

NOTE: Etch mode disabled with rotation.

Thickness monitor cannot be used with 4.0” diameter plate.

THICKNESS MONITOR
 Stand-alone Film Thickness Monitor

 Crystal Sensor head mounted through the Baseplate.

NOTE: Thickness monitor cannot be used with 4.0” diameter plate.

CARBON ROD EVAPORATION

 Replaces sputter head with low voltage carbon rod evaporation.

 Replaces the 6” x 6” Pyrex cylinder with a 6” x 9” Pyrex cylinder.

 Stand-alone power supply.

CARBON YARN EVAPORATION

 Replaces sputter head with low voltage carbon yarn evaporation.

 Replaces the 6” x 6” Pyrex cylinder with a 6” x 9” Pyrex cylinder.

 Stand-alone power supply.

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SAFETY WARNINGS
This vacuum deposition system is comprised of a number of complex subsystems.

Lethal voltages, high temperatures, high pressures and powerful mechanical

drive mechanisms are present throughout the system.

Every attempt has been made to safeguard operating and maintenance

personnel. Interlocking of subsystems provides a high degree of operator safety.

System/software interlocks should never be defeated unless servicing of the system

requires temporary interlock overrides. Hardwired safety interlocks must never be
defeated.

All safety/software interlocks should be returned to operational status when

problems have been corrected.

Operating and maintenance manuals have been provided and should be

thoroughly understood before any operations are contemplated.

Only personnel with proper training and process experience should operate
the system.

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Check oil level in mechanical pump before starting machine!

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SAFETY SYMBOLS

CAUTION: Risk of Electrical Shock

CAUTION: This symbol is intended to alert the user to the presence of important operation &
maintenance instructions in this manual.

Protective Conductor Terminal: this symbol indicates where the protective earth ground is
connected.

UNPACKING & SETUP

SYSTEM

Caution! Two people are required to lift the unit from the shipping carton.

The Denton Desk V system is shipped is a heavy-duty cardboard carton. The unit is shipped with oil in the
mechanical pump. To unpack the unit, use the following procedure:

1. Open top of carton.

2. Remove packing material.

3. Remove manuals (CD) and glass cylinder. Glass cylinder will be wrapped in packing material.

4. Remove target and power cord. These will be in a plastic bag.

5. Lift machine out of box using the built-in handles on each side panel.

Caution! Two people are required to lift the unit from the shipping carton.

6. Remove the foam pieces from each side of the machine.

7. Place the unit in the desired location.

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8. Cut the plastic band and remove cardboard piece.

9. Replace the cardboard piece with the glass cylinder.

Caution! Handle glass cylinder with care. Wipe all sealing surfaces with a
clean lint-free rag before installing the glass cylinder.

10. The Baseplate and Gaskets are cleaned using isopropyl alcohol and a lint-free cloth. The Gaskets are
lubricated very lightly with vacuum grease. Sufficient grease has been applied when a finger is barely
able to slide around the gasket.

11. The Chamber is placed on the baseplate; and the Sputter Head is positioned on the Chamber.

12. Lift the metal lid from the cylinder and install the target as described in the following manual
section.

NOTICE: You MUST save all packing material, box, and skid in the event the unit has
to be returned for repair. If the unit is returned without the standard packaging
materials, Denton Vacuum cannot be responsible for shipping damages.

Emergency Stop Button

To ensure proper operation, make certain that the

emergency button (shown here) is pulled-out
completely. The Desk V cannot operate when the
emergency button is pushed-in.

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INSTALLATION INSTRUCTIONS

VOLTAGE SELECTION

Verify that the incoming power connection is set for the proper voltage!

 Place the Desk V in the desired location.

All systems are shipped with the fuse block installed for low voltage
(100 – 120 VAC) operation. The following instructions are necessary
only if the system will be connected to high voltage (200 -240 VAC) supply.

 Voltage selection is required only between low (nominal 100 – 120 VAC) and high (nominal 200 – 240
VAC) ranges. There is no distinction between 50 and 60 Hz supplies. Refer to the Electrical
Requirements section of this manual for specific power requirements.

Verify that the proper fuse is in place visually inspecting the fuse for the
proper rating. Use of an improper fuse may create a safety hazard.

For 100 – 120 VAC operation use a 10 Amp fuse.

For 200 – 240 VAC operation use an 8 Amp fuse

This system has line voltage present on the primary circuits whenever it is
plugged into a main power source. Potentially lethal voltages are present when the line

This system must be disconnected from the main power source before inspecting the
fuse.

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 To change the fuse block to high voltage (200 – 240 VAC) input, proceed as follows.

 Pry open the entry module cover. A small flat bladed screwdriver can be used.

 Inspect the external face plate of the fuse block. Arrows and text are molded into the
faceplate to indicate the proper orientation for low voltage (100 -120 VAC) and high
voltage (200 – 240 VAC) input supply.

 Re-install the fuse block in the proper orientation for high voltage (200 – 240 VAC)
supply.

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 Connect the power cord to a 120VAC, 60Hz, 10 Amp outlet (systems shipped with default
setting of 120 VAC).

 OR

 Connect the power cord to a 220VAC, 50Hz, 8 Amp outlet (change voltage selection at main
power inlet connection).

 The main electrical switch in the rear panel is the main circuit breaker. It should be switched
to the ON position when you are ready to power up the system.
GAS CONNECTIONS
 Connect Argon to the Gas inlet
 Recommended for clean, inert atmosphere for sputtering.

 Some users of the Desk V will be satisfied with system operation using room air as
the sputtering gas. If room air is to be used, no connection is required.

 Gas i n l e t fitting is 1/8” FNPT. Swagelok fittings not included. Denton recommends ¼
inch Swagelok fitting. Be certain to use ferrules that match your tubing type (plastic, metal,
etc…).

NOTE: For the Desk V TSC, however, argon is required. The argon cylinder should
have a pressure-reducing regulator to provide 2- to 10-psig to the unit. Tygon tubing is
acceptable.

 Connect Nitrogen or other inert gas to the Vent inlet.

 Recommended for clean inert atmosphere for venting the chamber.

 Some users of the Desk V will be satisfied with system operation using room air for
venting the chamber. If room air is to be used, no connection is required.

 Gas inlet fitting is 1/8” FNPT.



NOTE: Nitrogen from a dry source is recommended. The nitrogen cylinder should
have a pressure-reducing regulator to provide 2- to 10-psig to the unit. Tygon tubing is
acceptable. 

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

CHAMBER PREPARATIONS
 The Baseplate and Gaskets are cleaned using isopropyl alcohol and a lint-free cloth. The
Gaskets are lubricated very lightly with vacuum grease. Sufficient grease has been applied
when a finger is barely able to slide around the gasket.

 The Chamber is placed on the baseplate; and the Sputter Head is positioned on the
Chamber.

 Check manual shutter movement (if provided). The two segments should overlap when
positioned at back of chamber. This is the open position for sputtering. Rotate knob
clockwise to spread the segments, and then move the spread shutter back over specimen
pedestal. This is the position for etching.

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MECHANICAL PUMP INSTALLATION

The mechanical pump installed

Step #1: Installation of vacuum hose to the pump

1. 2. 3.

4. 5. 6.

7. 8.

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Step #2 - Installation of vacuum hose to the rear of the DESK V

1. 2. 3.

4. .

Step #3 - Mist Filter Installation

1. 2. 3.

Check oil level in the mechanical pump. If the oil level is ½ full in the sight glass, the
pump is ready. For detailed instructions, refer to the Maintenance section of this
manual.
MAKE SURE THE POWER SWITCH ON THE MECHANICAL PUMP IS IN THE ON
POSITION!!!!!

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TARGET INSTALLATION & REPLACEMENT
T o o l s R e q u i r ed

Small Phillips screwdriver & target

1. 2. 3.

4. 5.
3a.
1. Open sputter head
2. Remove grid screen
3. Remove retaining ring
4. Center target on plate
5. Replace retaining ring
6. Replace grid screen and
close sputter head
6.

The Desk V is ready for operation.

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INITIAL START-UP
INSPECTION
Before starting up the unit, make sure the following are provided:

Verify that the incoming power connection is set for the proper voltage!

1. 120VAC, 60Hz, 10-amp service or 220VAC, 50Hz, 8 Amps. Verify that the incoming voltage
connection is set for the proper voltage setting.

2. 5-psig-argon gas (or room air, if deemed adequate).

3. All lines are properly connected and there are no loose wires, hoses, or hardware.

4. Check rotary motion: (optional)

 Make sure the small sprocket is spaced from feedthrough nut by at least 1/16".

 Make sure that the chain is not tight. It should be slightly limp.

Check the mechanical pump oil level only after it has been running for a few
minutes. This will give the oil a chance to be distributed throughout the pump and will
give a more accurate level reading. Turn the mechanical off before checking oil level

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START-UP PROCEDURE

To start-up the system, use the following procedure:

1. Turn ON Main Power.

2. Press the START button on the touch screen.

3. Select the desired operating screen from the on-screen menu.

 Manual or Timed Sputter

 Manual or Timed Etch

 Overview

4. Operation of the system is described in detail in the Operation section of this manual.

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OPENING THE CHAMBER
 Be sure that chamber is vented (mechanical pump is off).

 Grasp the underside of the metal top plate. Lift vertically and tilt the plate back towards the
support post. The top plate is hinged to the post.

 To replace the sputter head on the cylinder reverse the procedure.

NOTE: The sputter head WILL only Tilt 180 degrees so the target is
facing up.

Grasp under side of top plate and lift.

Tilt it back so that the target faces up.

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DESCRIPTION OF CONTROLS
SYSTEM START SCREEN

The Desk V system is semi-automatic and is controlled by a PLC. The operator interface is a touch
panel with graphical interface to the PLC. Graphical interface is supported with software. Manual
operation of valves, pump, power supply, and fixture rotation subsystems is through this graphical
interface. Timed processes are also operated through this interface.

This software links the operator to the PLC. It allows for control input and data display. This software
is active when power is applied to the system.

The Start Screen is visible only when the control system is first started. Pressing the START button
will provide access to the control system.

NOTE: This section of the operating manual describes controls for the
Standard Desk V as well as the Desk TSC. There are differences between the two.

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SCREENS

Standard Desk V & Desk V TSC

Access to all control screens is available on this screen. Each system function is described in detail
later in this section of the Operating Manual

 Manual Sputter – Provides access to the manual operation of the sputter controls. Pump(s),
Sputter Power, Sputter Set point (mAmps), Auto Vent Enabled (available only with TSC
option), Substrate Rotation (option) and Gas Valve controls are available from this screen.
System parameters are displayed on this screen: Chamber Pressure (Torr), DC Current, Turbo
@ Speed Indicator (available only with TSC option), Vent Time Remaining (available only with
TSC option), and Sputter Set point (mAmps).

 Timed Sputter – Provides access to the timed operation of the sputter controls. Process
Set point (Torr), Sputter Set point (mAmps), Process Time (seconds), and Vent after Sputter
Enabled are programmed from this screen. System parameters are displayed on this screen:
Vent after Sputter Enabled Indicator and Timed Sputter Enabled Indicator.

 Manual Etch – Provides access to the manual operation of the etch controls. Pump(s), Etch
Power, Etch Set point (mAmps), Auto Vent Enabled (available only with TSC option), Substrate
Rotation (option) and Gas Valve controls are available from this screen. System parameters
are displayed on this screen: Chamber Pressure (Torr), DC Current, Turbo @ Speed Indicator
(available only with TSC option), Vent Time Remaining (available only with TSC option), and
Etch Set point (mAmps).

 Timed Etch – Provides access to the timed operation of the etch controls. Process Set point
(Torr), Etch Set point (mAmps), Process Time (seconds), and Vent after Etch Enabled are
programmed from this screen. System parameters are displayed on this screen: Vent after
Etch Enabled Indicator and Timed Etch Enabled Indicator.

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 Overview - This screen is used to display current system status and the state of vacuum
Chamber and pumping system. Chamber Pressure (Torr), Process Set point (Torr), DC
Current, and Process Time Remaining (Seconds) are displayed.

All system controls are implemented by using the touch screen. All subsystem controls are available
on individual control screens

Subsystem controls are available on the following control screens:

 Manual Sputter – manual operation of the Sputter process.

 Timed Sputter – Timed operation of the Sputter process.

 Manual Etch – manual operation of the Etch process.

 Timed Etch – Timed operation of the Etch process.

Process parameters (set point and real) and system controls are displayed on the appropriate
screens.

MANUAL SPUTTER
Stand ard Desk V HP

Manual Sputter operations are available on this screen.

 Select Manual Sputter from the Screens menu.

 ON/OFF operation of the Mechanical Pump, Gas Valve, Rotation (if equipped), and Sputter
Power Supply is available on this screen.

 Inactive buttons are RED. Buttons will switch to GREEN when active.

 Safety interlocks are in place to prevent unsafe operation of the sputter power supply. The
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power supply will not turn ON unless all safety interlocks are satisfied.

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NOTE: Sputter Set point must be set before power supply is turned ON.

NOTE: Power Supply is interlocked to chamber pressure set point of 5.0 e-1 Torr. The
Power supply will NOT turn ON above this chamber pressure. The power supply will
not turn on unless the Gas Valve is ON.

 Sputter set point allows for adjustment of the power set point of the Sputter Power supply. A
pop-up data entry screen is available by pressing the set point data box. The current Sputter
set point is displayed.

NOTE: Sputter set point range is 0 – 100 milliamps.

 Electrical Current output of the Power Supply is displayed in milliamps.

 Current Chamber Pressure is displayed in Torr.

 The Overview button will return to the Overview screen.

 The Screens button will return to the Screens menu.

MANUAL SPUTTER DESK V TSC

Manual Sputter operations are available on this screen.

 Select Manual Sputter from the Screens menu.

 ON/OFF operation of the Pumps(s), Gas Valve, Rotation (if equipped), and Sputter Power
Supply is available on this screen.

 The Auto Vent Enabled function is available on this screen.

 This feature will shut down the pumps and safely vent the chamber to atmosphere.
The Vent Time Remaining will count down the delay required before venting the
chamber to atmosphere.
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WARNING! Ten (10) minutes must elapse between turning off the turbo
pump and turning off the mechanical pump, or the turbo pump will be damaged.

 Inactive buttons are RED. Buttons will switch to GREEN when active.
 Safety interlocks are in place to prevent unsafe operation of the sputter power supply. The
power supply will not turn ON unless all safety interlocks are satisfied.

NOTE: Sputter set point must be set before power supply is turned ON.

NOTE: Power Supply is interlocked to chamber pressure set point of 5e-1 Torr. The
Power supply will NOT turn ON above this chamber pressure. The power supply will
not turn on unless the Gas Valve is ON.

NOTE: Sputter set point range is 0 - 100 milliamps.

 Electrical Current output of the Power Supply is displayed in milliamps.

 Current Chamber Pressure is displayed in Torr.

 Vent Time Remaining is displayed in seconds.

 Turbo @ Speed indicator will display when turbo pump is at full operating speed (if
equipped).

 The Overview button will return to the Overview screen.

 The Screens button will return to the Screens menu.

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TIMED SPUTTER

S t an d ar d D es k V HP

Timed Sputter operations are available on the Timed Sputter screen.

 Select Timed Sputter from the Screens menu.

 Inactive buttons are RED. Buttons will switch to GREEN when active.

NOTE: Sputter set point must be set before power supply is turned ON.

 The system will automatically pump down to 4.0e-2 Torr before activating the Timed Sputter
process.

 Timed Sputter processes can be started with the chamber at atmospheric pressure or
from any pressure, but the sputtering process will not begin above 4.0e-2 Torr.

Note: Sputter set point range is 0 - 100 milliamps.

 Process Time allows for adjustment of the Process Timer set point of the Sputter Power
supply. A pop-up data entry screen is available by pressing the Process Time data box. The
current Sputter Timer set point is displayed.

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Note: Process Time set point range is 0 – 600 seconds.

 Process Time Remaining is displayed in seconds.

 Vent After Sputter Enabled button will enable an automatic vent of the system to
atmosphere after the timed sputter is complete.

 The Timed Sputter running button will start the Sputter power Supply and the Process
Timer.

 The Abort button will end a Timed Sputter process immediately.

 The Overview button will return to the Overview screen.

Desk V TSC

Desk TSC Timed Sputter operations are available on the Timed Sputter
screen.

 Select Timed Sputter from the Screens menu.

 Inactive buttons are RED. Buttons will switch to GREEN when active.

NOTE: Sputter set point must be set before power supply is turned ON.

NOTE: Power Supply is interlocked to chamber pressure set point of 5.0e-1 Torr. The
Power supply will NOT turn ON above this chamber pressure. The power supply will
not turn on unless the Gas Valve is ON.

 Process set point allows for adjustment of the process pressure start set point. A pop-up data
entry screen is available by pressing the set point data boxes. The current Process set point is
displayed.

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 The system will automatically pump down to the Process set point before activating the
Timed Sputter process.

 Timed Sputter processes can be started with the chamber at atmospheric pressure or
from any pressure, but the sputtering process will not begin above the Process set point.

 Sputter set point allows for adjustment of the power set point of the Sputter Power
supply. A pop-up data entry screen is available by pressing the set point data box. The
current Sputter set point is displayed.

 Note: Sputter set point range is 0 – 100 mAmps standard.

Note: Process Time set point range is 0 – 600 seconds.

 Process Time Remaining is displayed in seconds.

 Vent After Sputter Enabled button will enable an automatic vent of the system after the
timed sputter is complete.

 The Timed Sputter running button will start the Sputter power Supply and the Process
Timer.

 The Abort button will end a Timed Sputter process immediately.

 The Overview button will return to the Overview screen.

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Desk V Timed Recipe Programming
Timed Recipe Programming provides access to the creation and storage of up to 10 separate
recipes. Parameters include Recipe Name, Process Set points (Torr and milliamps), Process
Time (seconds), Vent after Sputter Select and Timed Sputter Enable.

Timed Sputter Recipe Timed Etch Recipe

Parameters Screen Parameters Screen

Below are the Timed Recipe Parameter screens for both sputter and etch functions.

Sputter With Turbo Etch With Turbo

Without Turbo Without Turbo

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To input data, touch cell.

NOTE: The difference between “with turbo” and “without turbo” in recipe programming is that when using a
turbo molecular pump, one can select pressure settings (as found in set point 1 and set point 2).

How to Use Timed Recipe Programming

To create a Timed Recipe from the Timed Sputter screen, select Recipe. This will bring you to the
Recipe page. Touch the cell under the “Recipe Name” portion of the table to open the keyboard.
From there, enter the name of the recipe you wish to create and save.

To input other values, simply touch the cell in which you wish to input a value. With recipes created
and stored, your recipe name will now be displayed on the timed sputter page.

To engage a recipe, simply select the recipe name from the drop down menu and press the send
recipe button. The program will automatically bring you to the timed sputter page.

If you selected enabled timed sputter for a recipe, your process will begin after the timed sputtering
page appears.

NOTE: If you change the parameters at any time after the recipe has been sent, the recipe name will
disappear from the timed sputter page. Changes made on the timed sputter page will not be saved on
your recipe page. However, the system will still be functional with the new parameters.

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A few notes regarding operation of the Timed Recipe Programming follow:

 The system will automatically pump down to the Process set point before activating the
Timed Sputter process.

 Timed Sputter processes can be started with the chamber at atmospheric pressure or
from any pressure, but the sputtering process will not begin above the Process set
point.

The Timed Recipe Program provides the following data input fields:

TIMED SPUTTER RECIPE PROGRAMMING VALUE SELECTIONS

Recipe Number: can create and store up to 10 recipes.

Recipe Name: alphanumeric and up to 10 characters.
Process Setpoint1: base number (in Torrs)
Process setpoint2: exponent (in Torrs)
Example: setpoint1 (5) and setpoint2 (3) is equivalent to 5 -3 (five to the minus three) Torr
Sputter set point: power setting in mAmps (0 to 100 range).
Process Time: up to 600 seconds.
Vent after Sputter Select: enables an automatic vent of the system after the timed sputter is
complete.
Timed Sputter Enable: starts Sputter power Supply and the Process Timer (in seconds).

TIMED ETCH RECIPE PROGRAMMING VALUE SELECTIONS

Recipe Number: Can create and store up to 10 recipes.

Recipe Name: alphanumeric and up to 10 characters.
Process Setpoint1: base number (in Torrs)
Process setpoint2: exponent (in Torrs)
Example: set point 1 (5) and set point 2 (3) is 5 -3 (five to the minus three) Torr
Etch set point: power setting in mAmps (0 to 10 range).
Process Time: up to 600 seconds.
Vent after Etch Select: enables an automatic vent of the system after the timed sputter is
complete.
Timed Etch Enable: starts Sputter power Supply and the Process Timer (in seconds).

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MANUAL ETCH
NOT an option with Rotation.

DESK V HP

Manual Etch operations are available on the Etch screen.

 Select Manual Etch screen from the Screen menu.

Standard Desk V HP

 ON/OFF operation of the Mechanical Pump, Gas Valve, and Etch Power Supply is available on
this screen.

 Inactive buttons are RED. Buttons will switch to GREEN when active.

NOTE: Etch Set point should be set before power supply is turned ON.

NOTE: Power Supply is interlocked to chamber pressure set point of 5.0e-1 Torr. The
Power supply will NOT turn ON above this chamber pressure. The power supply will
not turn on unless the Gas Valve is ON.

 Etch set point allows for adjustment of the power set point of the Etch Power supply. A pop-
up data entry screen is available by pressing the set point data box. The current Etch set point
is displayed.

Note: Etch Power set point range is 0 – 10 Milliamps standard.

 Current chamber pressure is displayed in Torr.

 The Overview button will return to the Overview screen.

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 The Screens button will return to the Screens menu.

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 Select Manual Etch screen from the Screen menu.

DESK TSC
ETCH is not an option with rotation.
Manual Etch operations are available on
the Etch screen.

 ON/OFF operation of the Mechanical Pump, Gas Valve, and Etch Power Supply is available on
this screen.


NOTE: Etch set point should be set before power supply is turned ON.

NOTE: Power Supply is interlocked to chamber pressure set point of 5.0e-1 Torr. The
Power supply will NOT turn ON above this chamber pressure. The power supply will
not turn on unless the Gas Valve is ON. 


Note: Etch Power set point range is 0 – 10 milliamps.

 Current chamber pressure is displayed in Torr.

 The Overview button will return to the Overview screen.

 The Screens button will return to the Screens menu.

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TIMED ETCH

ETCH IS NOT AN OPTION

WITH ROTATION

Timed Etch operations are available on the Timed Etch screen.

 Select Timed Etch from the Main screen.

 ON/OFF operation of the Etch Power Supply is a push button on this screen.

 Inactive buttons are RED. Buttons will switch to GREEN when active.

NOTE: Etch set point should be set before power supply is turned ON.

NOTE: Power Supply is interlocked to chamber pressure set point of 5.0e-1 Torr. The
Power supply will NOT turn ON above this chamber pressure. The power supply will
not turn on unless the Gas Valve is ON.

Note: Etch Power set point range is 0 – 10 milliamps.

 Process Time allows for adjustment of the Process Timer set point of the Etch Power supply.
A pop-up data entry screen is available by pressing the Process Time data box. The current
Sputter Timer set point is displayed.

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Note: set point range is 0 – 600 seconds.

 The Timed Etch Running button will start the Etch power supply and the Process Timer.

 Vent After Etch Enabled button will enable an automatic vent of the system after the timed
etch is complete.

 The Abort button will end a Timed Etch process immediately.

 The Overview button will return to the Overview screen.

Desk V TSC

Timed Etch operations are available on the Timed Etch screen.

Note: Turbo Pump must be OFF to operate the Manual Etch function.

 Select Timed Etch from the Main screen.

 ON/OFF operation of the Etch Power Supply is a push button on this screen.

 Inactive buttons are RED. Buttons will switch to GREEN when active.

NOTE: Etch set point should be set before power supply is turned ON.

NOTE: Power Supply is interlocked to chamber pressure set point of 5.0e-1 Torr. The
Power supply will NOT turn ON above this chamber pressure. The power supply will
not turn on unless the Gas Valve is ON.

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Note: Etch Power set point range is 0 – 10 milliamps.

Note: set point range is 0 – 600 seconds.

 The Timed Etch Running button will start the Etch power supply and the Process Timer.

 Vent After Etch Enabled button will enable an automatic vent of the system after the timed
etch is complete.

 The Abort button will end a Timed Etch process immediately.

 The Overview button will return to the Overview screen.

OVERVIEW

DESK V HP

Select Overview from any other screen.

 All active system parameters are graphically displayed on the Overview screen.

 Current chamber pressure is displayed in Torr. Inactive graphics are RED. Graphics will switch
to GREEN when active. Note the PINK in the graphic above. This indicates that the sputter
and etch are in operation.

 The DC Current is displayed in milliamps.

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 ON/OFF operation of the subsystems (pumps, valves, rotation, sputter, and etch) is
Graphically displayed on this screen.

 Process Time Remaining is displayed in seconds.

 Text messages are displayed on this screen to indicate current active operation in the control
system. These messages will describe the current active operation as follows:

Message Active Operation(s)

Auto Sputter Without Vent - Timed Sputter is enabled; Vent After Sputter is NOT enabled.

Auto Sputter With Vent - Timed Sputter is enabled; Vent After Sputter is enabled.

Auto Etch Without Vent - Timed Etch is enabled; Vent After Sputter is NOT enabled.

Auto Etch With Vent - Timed Etch is enabled; Vent After Sputter is enabled.

System Auto Venting - Ten minute delay timer is counting down. Desk V TSC only.

NOTE: The Abort button will stop a Timed Sputter or Etch process immediately.

 The Screens button will return to the Screens menu.

Desk TSC

All active system parameters are graphically displayed on the Overview screen.

 Select Overview from any other screen.

 Inactive graphics are white. Graphics will switch to black when active.

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 Current chamber pressure is displayed in Torr.

 The Process set point is displayed in Torr.

 The DC Current is displayed in milliamps.

 ON/OFF operation of the subsystems (pumps, valves, rotation, turbo @ speed, sputter, and
etch) is graphically displayed on this screen.

 Process Time Remaining is displayed in seconds.

 The Vent Time Remaining is displayed in seconds.

 Text messages are displayed on this screen to indicate current active operation in the control
system. These messages will describe the current active operation as follows:

Message Active Operation(s)

Auto Sputter Without Vent - Timed Sputter is enabled; Vent After Sputter is NOT enabled.

Auto Sputter With Vent - Timed Sputter is enabled; Vent After Sputter is enabled.

Auto Etch Without Vent - Timed Etch is enabled; Vent After Sputter is NOT enabled.

Auto Etch With Vent - Timed Etch is enabled; Vent After Sputter is enabled.

System Auto Venting - Ten minute delay timer is counting down. Desk V TSC only.

NOTE: The Abort button will stop a Timed Sputter or Etch process immediately.

 The Screens button will return to the Screens menu.

OPERATION
This section of the manual will describe manual and timed operation of the system. A brief
description is provided for a better understanding of the operation of the system.

A complete understanding of the Control System is required before

operating the system. Read the “Description of Controls” section of this manual before
proceeding!

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The Denton Vacuum DESK V Cold Sputter/Etch Unit is designed to clean the surface of SEM
specimens and to deposit a heavy metal conductive coating on the clean surface.

A standard 6” diameter by 6” high Pyrex Cylinder with top and bottom Seals sits on an aluminum
Baseplate. (6” D. x 6” H. Metal Chamber on TSC)

The cylinder is evacuated by a two-stage, direct-drive, Mechanical Pump (externally mounted) and a
turbo pump (Desk V TSC only), which is mounted to a flange in the side of the metal chamber. The
mechanical pump provides rough vacuum and the turbo molecular pump (Desk V TSC only) provides
pumping into the high vacuum range.

An insulated Specimen Table with provisions for height adjustment is mounted within the
Pyrex cylinder. The Sputter Cathode is clamped to an insulated aluminum plate in the chamber
cover.

The Desk V contains a single high voltage power supply. The output of the power supply is connected
to the substrate fixture for Etch and to the Sputter Cathode for Sputter deposition. Power output
varies: Etch = 0 - 10 milliamps; and Sputter = 0 - 100 milliamps.

A manual Shutter is provided as the etch electrode and to shield the Sputter Cathode from
contamination during the Etch cleaning cycle. The shutter control knob is left of the chamber.
Clockwise rotation of the knob will open the shutter and counterclockwise rotation will close it.

A manual Gas Control is provided to control pressure in the cylinder. The Gas Control knob is to the
left of the chamber.

The standard Desk V is equipped with a vacuum gauge to provide vacuum pressure measurements
in the vacuum chamber down to the limit of the mechanical pump. The Desk V TSC is equipped with
a full range gauge to provide vacuum pressure measurements down to the limits of the turbo
molecular pump.

ETCH
NOT an option with Rotation. Remove rotation Fixturing and install non-rotating fixture
plate before proceeding!

Note: Turbo Pump must be OFF to operate the Manual Etch function.

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Standard Desk V HP Desk TSC

NOTE: Shutter must be in the closed position (knob fully clockwise)

 From the Manual Etch screen, turn the Mechanical Pump ON. Wait for the Vacuum pressure
to drop below 4.0e-2 Torr.

 With the mechanical pump running, turn the Gas Valve ON.

 Stabilize at between 1.5e-1 and 2.0e-1 Torr by adjusting the Gas flow control knob.

 Gas Flow valve clockwise = decrease flow, reduce pressure.

 Gas Flow valve counter-clockwise = increase flow, increase pressure.

 Close the Shutter

 From the Manual Etch screen, with the Etch set point at a non-zero value.

 Increase the Etch set point to desired level (0 - 10 milliamps).

 Actual current will be displayed on the Manual Etch and the Overview screens.

 Turn the Etch Power On.

 Etch for the desired time.

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 Turn OFF the Etch Power.

 Shut the Gas Valve OFF.

NOTE: Do not run the Etch supply for more than ten minutes.

NOTE: Do not close the manual Gas Flow valve. Leave this set to the desired gas flow
required for the Timed Etch process.

NOTE: Once the desired settings of time, etch level, and gas flow have been
established and set, the timed mode of operation can be used.

SPUTTER
NOTE: Sputtering pressure can be reached with or without the use of the optional Turbo
Molecular pump (Desk V TSC only). Experimentation is required to adjust the gas
flow/pumping speed combination required for your individual process requirements.

Standard Desk V HP Desk TSC

 For the Desk V HP: From the Manual Sputter screen, turn the mechanical pump ON.
Wait for the Vacuum pressure to drop below 4.0e-2 Torr.
 For DESK V TSC: Turn ON the optional Turbo Molecular pump and wait for the
pressure to drop to the desired starting vacuum level.

NOTE: Sputtering pressure setting for the Desk V TSC is between 5.0E-3 to
7.0E-3. The pressure must be less than1.0E+00 (1 TORR) before turning the
Turbo Pump ON.

 Continue pumping and open the Gas Valve.

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 Gas Flow valve clockwise = decrease flow, reduce pressure.

 Gas Flow valve counter-clockwise = increase flow, increase pressure.

NOTE: Additional gas flow may be required when using a new target.

 Turn Rotation ON (if equipped).

 Open Shutter

 From the Manual Sputter screen, turn Sputter Power On with the Sputter set point at a non-
zero value.

 Increase the Sputter set point to desired level (0 - 100 milliamps).

 Actual current will be displayed on the Manual Sputter and the Overview screens.

 Sputter for the desired time.

 Turn OFF the Sputter Power and reduce the Sputter set point to zero.

 Shut the Gas Valve OFF.

NOTE: Do not close the manual Gas Flow valve. Leave this set to the
desired gas flow required for the Timed Sputter process.

 Turn OFF the optional Turbo pump (Desk V TSC) from the Vacuum screen.

The system control will wait ten (10) minutes before turning off the Mechanical Pump
(to protect the turbo pump).

 After ten (10) minutes, turn OFF the Mechanical Pump. The automatic Vent Valve will open
to vent the chamber to atmosphere.

NOTE: Once the desired settings of time and power, and gas flow have been
Established and set, the Timed mode of operation can be used.

WARNING! Ten (10) minutes must elapse between turning off the turbo
pump and turning off the mechanical pump, or the turbo pump will be damaged.

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TIMED ETCH OPERATION

Standard Desk V Desk TSC

NOTE: Shutter must be in the closed position (knob fully clockwise)

 Set the desired Etch power set point.

 Set the desired Process Time set point.

 Select Vent after Etch enables if desired.

NOTE: The manual Gas Flow valve should have been manually set to the
desired gas flow required for the timed process.

Note: Turbo Pump must be OFF to operate the Manual Etch function.


Activate the Timed Etch Running button and the system will operate as follows:

 Mechanical Pump will start and pump the chamber to the initial vacuum level:

 4.0e-2 Torr is the fixed set point for all models.

 When the fixed set point is reached:

 The Gas Valve will open (to the manually adjusted flow set point).

 System will stabilize for 30 seconds.

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 The Etch power supply will turn ON to the set point power level.

 Power will continue until the Process Timer times out.

 The power supply will shut OFF and the Gas Valve will close.

 If the Vent After is enabled, the Mechanical Pump will shut off and the system
will vent to atmosphere.

 If Vent after is not enabled, the power supply will shut OFF and the pumps will
remain on.


Etch Power set points can be adjusted at any time during this timed operation.

WARNING! Ten (10) minutes must elapse between turning off the turbo
pump and turning off the mechanical pump, or the turbo pump will be damaged.

TIMED SPUTTER OPERATION

Standard Desk V Desk TSC

 Set the desired Sputter power set point. 0 – 100 milliamps ( 5.0E-3 to 7.0E-3 on TSC Models )

 Set the desired Process Time set point. 0 – 600 seconds.

 Select Vent after Sputter Enabled if desired.

 Set the desired Process set point (Desk TSC only).

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NOTE: The manual Gas Flow valve should have been manually set to the
desired gas flow required for the Timed Process.

 Activate the Timed Sputter Running button and the system will operate as follows:

 Pumps will start and pump the chamber to the initial vacuum level:

 Below 4.0e-2 Torr is the fixed set point for the Standard Desk V.

 The Process set point is programmable for the Desk V TSC.

NOTE: See the Description of Controls section of this manual for instruction on how to
program the Process set point.

 Rotation is ON during this time (if equipped).

 When the fixed set point or the Process set point is reached:

 The Gas Valve will open (to the manually adjusted flow set point).

 System will stabilize for 30 seconds.

 The Sputter power supply will turn ON to the set point power level.

 Power will continue until the Process Timer times out.

 Power supply will shut OFF and Gas Valve will close.

 If the Vent After is enabled, the pumps will shut off and the system will vent to
atmosphere.

 The ten minute Vent Delay Timer will activate to safely shut down the turbo
pump (Desk TSC only).

 If Vent after is not enabled, the power supply will shut OFF and the pumps will
remain on.

 Sputter power set points can be adjusted at any time during this timed operation.

WARNING! Ten (10) minutes must elapse between turning off the turbo
pump and turning off the mechanical pump, or the turbo pump will be damaged.

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SHUT-DOWNPROCEDURE
1. Turn off all sub-systems (sputter, etch, gas, rotation).
2. For DESK V TSC option, turn off turbo pump, and wait TEN (10) minutes before turning
off mechanical pump, or the turbo pump will be damaged.
3. Turn off mechanical pump.

WARNING! Ten (10) minutes must elapse between turning off the
turbo pump and turning off the mechanical pump, or the turbo pump will be
damaged.
OPTIONS
QUARTZ CRYSTAL MONITOR
OPTIONAL

Note: Read the operating manual for the deposition controller before
proceeding!

Deposition Monitors require programming before depositions. The Operating Manual for the
appropriate Deposition Monitor is provided with the Desk V system. Please read this manual before
proceeding to operate the Desk V system with the Deposition Monitor.

The Deposition Monitor will require programming of the following material parameters:

 Material Density

 Tooling Factor

 Acoustic Impedance

 Thickness Endpoint

The Material Density and Acoustic Impedance are provided in a list in the Operating Manual for the
Deposition Monitor. The Tooling Factor must be calculated relative to the material and the position
of the crystal sensor.

A complete definition of these parameters and instructions for calculating each parameter are
included in the Operating Manual of the Deposition Monitor.

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Deposition with the Deposition Monitor should proceed as follows:

1. Complete the Etch process as described in the Etch section of this manual (if required).

2. Begin the Sputter process as described in the Sputter section of this manual.

3. When the Shutter is opened, start the Deposition Monitor.

4. When the Deposition Monitor reaches the programmed thickness, close the shutter.

5. Power down the Sputter source as described in the Sputter section of this manual.

DESK V TSC
OPTIONAL

Metal vacuum chamber with pump port for Turbo molecular pump on side flange and 2.0” viewport
on front replaces the standard Pyrex cylinder.

Turbo Molecular pump is operated from the Manual Sputter screen.

For proper performance of the TSC system, the following needs to be accomplished:

1. Mechanical pump must be ON until the chamber pressure less than 1.0e+0 Torr ( 1
T o r r ) before turning Turbo Pump ON.

2. Turn on Turbo for 20 minutes. (Previous testing with a hot filament gauge produced 5.0e-6
Torr.)

3. Turn on the Gas Valve, adjust Gas Flow Valve to reach 5.0e-3 to 7.0e-3 Torr and wait for the
pressure to stabilize.

4. Set Sputter set point to desired set point.

5. Turn Sputter Power ON. (Plasma will be visible).

6. Turn off Turbo Pump, wait for ten (10) minutes, and then vent system by turning off the
mechanical pump.

Turbo pump is used to reach high vacuum in the metal Chamber. Gas Control can be used with
Turbo Pump to reach process pressure control in the Chamber.

WARNING! Ten (10) minutes must elapse between turning off the turbo
pump and turning off the mechanical pump, or the turbo pump will be damaged.

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WARNING! Never turn system off when turbo pump is running. Turbo
pump must be turned off before turning system off.

CARBON ROD ACCESSORY

OPTIONAL

Caution! The bright light from the carbon evaporation source can damage
the optic nerve. NEVER look at a heated source without eye protection such as a
welder’s glasses or a coated piece of glass such as one might use to watch a solar
eclipse.

Req u i rem en t s
 120/220 VAC; 10/5 amp electrical outlet.

 Emery board or file - used to flatten sections of carbon rod.

 1/16” diameter swizzle stick to push carbon rods through opening in sleeves.

 Welder’s goggles (shade #5 or higher) to observe evaporation process.

 Carbon Rods, 0.125’ x 2.0”, sharpened (100 per pack) = DVI part number CAR001-0024

WARNING! Use dark glass to observe carbon evaporation. Intense

brightness is harmful to eyes when viewed directly.

Sample Prep
To check your carbon evaporation technique, before coating samples, do the following:

1. Coat a glass cover slip with gold.

2. When the cover slip is over coated, the gold color will change:

 To copper with 100 Å of carbon

 To orange with 150 Å of carbon

 To purple with 200 Å

Copyright Denton Vacuum, LLC. All Rights Reserved. Version 9142016da 54

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Operation
The Desk V sputter head must be flipped over. Replace the standard 6.0” diameter by 6.0” high
Pyrex cylinder with the 6" D. x 9" H. Pyrex cylinder. Mount the Carbon Rod accessory plate to the top
of the larger Pyrex cylinder.

The Desk V vacuum pumping system can be used to evacuate a Pyrex cylinder with a carbon
evaporation source mounted in the metal cover. The source can be mounted so as to vary the
source-to-specimen distance from 3-1/2” to 5”.

Two carbon rods are positioned in the center of the “yoke” to do the coating. One rod will have a
point or reduced section. The other will have a full diameter section that has been carefully
flattened on the end touching the point (or reduced section) of the other rod.

Both carbon rods should be inserted, one after another, through the outside end of the fixed rod
holder. First, the pointed rod should be inserted (point trailing) and pushed through with the
flattened carbon rod to move into the moving rod holder. Continue pushing the rods until the spring
is deflected about 1/8 inch. Tighten the thumbscrew holding the flattened carbon in the fixed
holder. If using a reduced section carbon rod, the spring should be moved out a little more than the
length of the reduced carbon.

With the carbon source loaded, place the Pyrex cylinder on the baseplate, seat the source head, and
start pump down. Within two to three minutes, the chamber vacuum gauge should read about
5.0e-2 Torr.

Turn on FILAMENT POWER on the Carbon Evaporation Module. Rotate power stat clockwise to
obtain 15 amp reading on ammeter. Carbon point should be bright red and outgassing. Increase
filament power to 28 to 32 amps until a light spark is seen. DO NOT exceed 50 amps on the meter.

WARNING ! Use dark glass to observe carbon evaporation. Intense

brightness is harmful to eyes when viewed directly.

At 4” source-to-specimen, about 1/8” length of .040 inches reduced section will deposit about 100
angstroms of carbon.

For evaporating at relatively high pressure, it is good practice to check carbon film thickness. Coat a
glass cover slip with gold. The gold color will change to copper when the cover slip is over-coated
with 100 angstroms of carbon; to orange with 150 angstroms of carbon; to purple with 200
angstroms of carbon.

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At 5.0e-2 Torr, the average gas molecule travels about .04” between collisions. With a source-to-
specimen distance of 4”, the carbon will make many collisions. It will arrive from all available

directions. Above 7.5e-2 Torr, the thickness of the carbon film will diminish rapidly, as compared to
the expected thickness.

If the carbon chamber will not pump below 1.0e-1 Torr, check by substituting the Desk V chamber. If
that pumps down, then the trouble is probably with the “L” gaskets on the carbon chamber. Wipe
them clean with a lint free cloth and Isopropanol Alcohol. Apply a thin coating of vacuum grease to
the gasket on the glass side and on the baseplate side.

General Notes
The chamber should first be pumped to 5.0 e-2 Torr or less.

Denton Vacuum supplies a carbon of excellent quality. It is suggested that a low power setting, to
degas the carbon, be used; slowly raise to evaporate. Degas the carbon (bright red) for 5 to 10
seconds. (Watch the chamber pressure rise, and then start to fall back.)

Carbon may be evaporated slowly or rapidly. Normally, after degassing, the power is increased to
where the carbon starts depositing. Length of evaporation time will depend on the desired thickness
of carbon film. It should take from 30 seconds to totally evaporate the carbon. DO NOT take
power too high for more than one minute. NEVER EXCEED 50 AMPS.

A rapid evaporation (flashing) may be utilized by presetting the control to 75 percent of dial rotation,
and then turning on the power. The flash will last from 1 to 2 seconds and help reduce heat damage.

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CARBON YARN ACCESSORY
OPTIONAL

Req u i remen t s
 120/220 VAC; 10/5 amp electrical outlet.

 Welder’s goggles (shade #5 or higher) to observe evaporation process.

 Carbon Yarn (25 feet) = DVI part number YRN001-0001

WARNING ! Use dark glass to observe carbon evaporation. Intense

brightness is harmful to eyes when viewed directly.

Sample Prep
To check your carbon evaporation technique, before coating samples, do the following:

1. Coat a glass cover slip with gold.

2. When the cover slip is over coated, the gold color will change:

 To copper with 100Å of carbon

 To orange with 150 Å of carbon

 To purple with 200 Å

Operation
The Desk V sputter head must be rotated to the side. Replace the standard 6.0” diameter by 6.0”
high Pyrex cylinder with the 6" D. x 9" H. Pyrex cylinder. Mount the Carbon Yarn accessory plate to
the top of the larger Pyrex cylinder.

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DO NOT permit the mounting post to touch the pump-out cover, which is at
baseplate ground. This would short the filament current directly to ground.

The Carbon Yarn Evaporation Source is adjustable and is designed to provide carbon films for
support, replication or conduction. The mounting posts are drilled and tapped to screw onto the
pair of low-voltage feedthroughs. The rectangular extension blocks connect to the upper posts. This
arrangement gives flexibility to locate the source as desired. Each block contains a spring-loaded
terminal to attach each end of the carbon yarn. By depressing the spring-loaded terminal, the carbon
yarn may be clamped.

The carbon yarn evaporation unit is designed to use high-purity carbon yarn. The height is
adjustable by loosening the screw holding the unit to the mounting post.

Loading the Carbon Yarn

The carbon yarn is placed across two spring-loaded electrode posts. (Carbon sublimes – i.e., it goes
from a solid to a gas with no liquid phase). When reloading, allow time for posts to cool as they get
quite hot, especially when firing carbon for 30 seconds or longer.

General Notes
The chamber should first be pumped to 50 m Torr or less.

Carbon vaporizes due to localized heat caused by resistance to flow of electric current. Carbon
resistance lowers as carbon heats up, but will stabilize.

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MAINTENANCE
GENERALMAINTENANCE
The Desk V will operate more efficiently if kept clean. Scale build-up on the baseplate should be
cleaned off weekly and the surface cleaned with Isopropanol alcohol using a lint free cloth or paper
and solvent. Be sure all debris is vacuumed away. Clean coating build-up from the cylinder with a
metal polish. "Wenol" and "Pol" are recommended. These polishes clean off the coating deposit
and polish the glass.

To ensure a proper vacuum seal, inspect the cylinder and gaskets for nicks, cracks, and other foreign
material. Apply a thin coat of vacuum grease to the gaskets and immediately wipe off the grease to
prevent excessive grease build-up. Inspect the sealing surface for nicks or scratches. These must be
smoothed out with emery and polished with fine emery or Scotch Brite. Any deposit build-up must
be similarly removed and the entire surface wiped clean with Isopropanol alcohol using a lint-free
cloth. Vacuum the baseplate to remove all debris and powder deposits.

MECHANICAL PUMP
Mechanical pump oil should be changed annually or whenever it becomes contaminated. Check oil
level and condition. If the oil appears cloudy or brownish, it needs changing. The oil is changed by
opening the drain outlet of the Mechanical Pump.

CAUTION! DO NOT ATTEMPT TO RE-ALIGN, OR MOVE DRAIN VALVE

IN EITHER DIRECTION. METAL CASTING WILL BE DAMAGED. USE PLASTIC
TUBING IF NECESSARY TO FACILITATE DRAIN.

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MECHANICAL PUMP – OIL CHANGE
The pump contains oil. WARNING! Check the oil level before starting the machine.
Mechanical pumps may vary. Typical pump shown on pages 18 - 19

Check oil level at sight port.

TOOLS REQUIRED
 Drain pan.

Should the pump require additional oil, proceed as follows:

1. The drain valve is the brass screw mounted at the lower end of the pump body.

2. Place drain pan under drain hole, under the pump.

3. Turn the drain valve counterclockwise.

4. It is not necessary to remove the screw.

5. Tilt the pump forward and drain until flow stops.

6. Turn drain screw clockwise until closed.

7. Remove drain pan. Discard oil following EPA guidelines.

8. Refill with new oil by removing the brass fill plug at the top of the pump body.

9. Fill to the top of the OIL LEVEL line on the sight port.

SPUTTER TARGET
TOOLS REQUIRED
 Small Phillips screwdriver & target

INSTRUCTIONS
1. Open sputter head

2. Remove grid screen

3. Remove retaining ring

4. Center target on plate

5. Replace retaining ring

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6. Replace grid screen and close sputter head

1. 2. 3.

3a. 4. 5.

PLASMA PROBLEMS
If the plasma is flickering during sputtering, the problem is a high voltage short or
starvation of gas. Add more gas before checking other possibilities.

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1. If during etching, take the pedestal apart and clean.

2. If during sputtering, take the sputter head apart and clean. Call the factory if guidance is
needed in this area (856-439-9100).

TROUBLESHOOTING

DESK V
TROUBLESHOOTING GUIDE

FAULT PROBABLE CAUSE ACTION

1. No power a. 120/220 VAC not present a. Check AC receptacle.

at line cord
b. System ON switch is b. Press switch to the ON
defective or off. position or replace.
c. Blown fuse. c. Replace 10 amp
Fuse, located in the
power connection
2. Mechanical pump will a. Blown fuse. a. Replace 8-amp F1 fuse
not start located on rear panel.
b. Bad connection. b. Check all cables
attached to mechanical
c. Pump switch off pump.
c. Check switch on
mechanical pump
3. Chamber will not pull a. Check oil level in a. Fill oil level until it
vacuum mechanical pump. reaches center of sight
glass.
b. Inspect bell jar gaskets b. Replace old gaskets if
for cracks on sealing bad.
surface.
c. Inspect bell jar for chips c. Replace bell jar if chips
across sealing surface. are across sealing
surface.
d. Vent valve open. d. Missing 24 VDC at vent
valve connector or
defective valve.
e. Vacuum leak in system. e. Locate and seal
vacuum leak.
4. Sputter head seals, a. Cracked bell jar gaskets. a. Replace gaskets.
but vacuum is poor. b. Chip on bell jar. b. Replace bell jar.
c. Low oil level in c. Add oil to pump.
mechanical pump.
d. Dirty oil in mechanical d. Change oil in pump.
pump.
e. Vacuum leak in system. e. Find and repair leak.
f. Pirani gauge tube f. Clean or replace Pirani
bad or dirty. Gauge tube.
g. Turbo pump off [turbo g. Check fuses and

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DESK V
TROUBLESHOOTING GUIDE

FAULT PROBABLE CAUSE ACTION

option only]. connections.

5. Unstable vacuum a. Dirty pump oil. a. Change pump oil.
pressure. b. Sample outgassing. b. Sample may need long
pumping time to
c. Defective mechanical outgas.
pump. c. Replace mechanical
d. Dirty vacuum gauge pump.
tube. d. Clean gauge tube.
6. Sputter or Etch mode, a. Electrical short in Sputter a. Disassemble Sputter
no plasma. head. head, check for shorts.

b. Chamber has excessive b. Clean chamber parts.

deposits of metal
causing an electrical
short. c. Call factory for help.
c. Defective high voltage
transformer or PC board. d. Replace fuse F3, 2
d. Fuse blown. amps, located on rear
panel

7. Unit will only sputter a. Pirani Gauge Tube a. Clean or replace Pirani
at high pressures defective or dirty. Gauge tube.
(150mT and up). b. Magnet in Sputter head b. Replace weak magnet.
Current fluctuates at is too weak.
suggested pressure
(50-75mT).
8. Poor quality coatings. a. Sputter pressure too a. Keep pressure
high. between 50-75mT.
b. Contaminates in plasma. b. Use Argon in place of
room air for sputtering.
9. Target center falls a. Normal wear pattern, a. Replace target.
out, about the size of target depleted.
a half dollar.
10. Turbo pump will not a. Blown fuse. a. Replace fuse.
operate.[Turbo units b. Bad connection. b. Check cables.
only]

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VACUUM PERFORMANCE DATA SHEET
(For reference only)

VACUUM PERFORMANCE: PUMPDOWN AND ULTIMATE VACUUM

DESK V or Desk V TSC

DATE: SERIAL #: BY:

ULTIMATE PRESSURE START VACUUM

HI VAC

Vacuum Vacuum Vacuum Vacuum

Notes Minute Minute Minute Minute
(Torr) (Torr) (Torr) (Torr)
Mech pump
1 11 21 31
only*
2 12 22 32

Turbo** 3 13 23 33

4 14 24 34

5 15 25 35

6 16 26 36

7 17 27 37

8 18 28 38

9 19 29 39

10 20 30 40

* Standard Desk V with mechanical pump.

** Desk V TSC with mechanical pump and turbo pump. Turn Turbo pump on at 1.0e+0 (1 Torr).

To evaluate the performance of the vacuum system, periodically record the vacuum pressure during
the pump down of the chamber. This document can be used to collect the data.

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USED TARGET
TYPICAL WEAR PATTERN ON USED TARGET

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TYPICAL PERFORMANCE DATA
PUMP DOWN

Desk V: Pump Down (typical)

Chamber open before pump down

Time 5 sec. 5 min. ?
(Seconds) mTorr mTorr mTorr
0
30
60
90
120
150
180
210
240
270
300

Desk V Pump Down (typical)

100
90
80
Time (Seconds)

70
60 5 sec.

50 5 min.
40 ?
30
20
10
0
0 30 60 90 120 150 180 210 240 270 300
Pressure(mTorr)

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DESK V TSC: Pump Down (typical)
Mechanical Pump ONLY
TC gauge FR gauge
Time
Pressure Pressure
(mTorr) (mBar)
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30

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DESK V TSC Pump Down (typical)
Mechanical Pump & Turbo Pump ON

TC gauge FR gauge
Time
Pressure Pressure
(Minutes) (mTorr) (mBar)
0
1 Turbo ON
2
3 Turbo at Speed
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30

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(mTorr)

1.0E+03

1.0E+02

1.0E+01

1.0E+00

1.0E-01

1.0E-02

1.0E-03

1.0E-04

1.0E-05

1.0E-06
0 10 20 30

TIME (minutes)

DEPOSITION RATE
Desk V: Gold Deposition Rate (typical)

Initial pressure < 20 mTorr

Source to substrate distance = 2.375" (60 mm)
Timed Sputter = 10 minutes (600 seconds)

Target Material: Gold

Gas: Air
Pressure : 50 mTorr

Film Deposition
Power Current
Thickness Rate
% mAmps Å Å / sec.
38 10 260 0.43
58 20 650 1.08
78 30 1020 1.70
97 40 1750 2.92

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Target Material: Gold / Palladium
Gas: Air
Pressure : 50 mTorr

Film Deposition
Power Current
Thickness Rate

% mAmps Å Å / sec.
37 10 405 0.68
58 20 945 1.58
78 30 1390 2.32
97 40 2210 3.68

Target Material: Gold

Gas: Argon
Pressure : 50 mTorr

Film Deposition
Power Current
Thickness Rate

% mAmps Å Å / sec.
26 10 640 1.07
47 20 1440 2.40
68 30 2300 3.83
83 40 3360 5.60

Target Material: Gold / Palladium

Gas: Argon
Pressure : 50 mTorr

Film Deposition
Power Current Thickness Rate
% mAmps Å Å / sec.
22 10 560 0.93
48 20 1140 1.90
68 30 1805 3.01
88 40 2795 4.66

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Desk V Deposition Rates (typical)
Gold Air 50 mTorr

Gold / Paladium Air 50 mTorr

6.0
Gold Argon 50 mTorr
5.0

4.0 Gold / Paladium Argon 50

mTorr
3.0

2.0

1.0

0.0
10 20 30 40
Current (mAmps)

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PACKING DESK V FOR RETURN
(See photos on the next page.)
It may be necessary to return the Desk V unit for repair. Follow these instructions for safe return of
the unit.

If available, use original packing materials, box, and skid received with your system from Denton
Vacuum.

When returning your Desk V to the Denton Vacuum Service

Factory, please follow all instructions from factory personnel
regarding what to return. DO NOT return glass cylinder, target
or pump with unit unless otherwise directed.

Pack as follows:

a. For the Desk V TSC: secure the sputter head to the chamber by taping and banding it to
the chamber.

b. Place insulation pieces on either side of the cabinet.

c. Place the unit (with insulation on sides) into the cardboard carton.

d. Add bubble wrap on top and sides of the machine to fill the gaps.

e. Tape the carton closed.

f. Band all of the cartons to the skid.

g. Ship the unit with a carrier that handles electronic equipment. Call Denton Vacuum for
recommended freight handler (856-439-9100).

When returning your Desk V to the Denton Vacuum Service

Factory, please do not use Styrofoam peanuts or any other
similar packing materials as they will infiltrate the inside of the
vacuum system housing and cause damage.

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NOTE: Denton Vacuum WILL NOT be responsible for any damages sustained in
shipment, including warranty work.

For a fee, Denton Vacuum can provide packing materials to customers for the unit’s return.

PACKING PHOTOS

Customer is responsible for return freight charges. Denton can recommend a carrier for the unit’s return
to Denton Vacuum.

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SUGGESTED SPARES
CONSUMABLES FOR DESK V AND TSC
CONSUMABLES FOR DESK V AND TSC

PART NO. DESCRIPTION LOCATION QTY.

DSK004-0016 6” D. X 6” H. PYREX CYLINDER DESK V 1

DESK V PYREX CYLINDER,
DSK001-0045 6” CYLINDER GASKET 2
DESK V TSC ST ST CHAMBER
VFT002-0061 SIGHT GLASS VIEW PORT FOR TSC 1

GSK002-0015 COPPER GASKET SEAL VIEW PORT FOR TSC 1

300
OIL001-0007 OIL MECHANICAL PUMP
CC
PMP007-0049 MIST FILTER MECHANICAL PUMP 1
FILTER ELEMENT REPLACEMENT - MIST FILTER FOR
PMP007-0050 1
OIL MIST ELIMINATOR MECHANICAL PUMP
MFG002-0001 POL POLISH (150 ML TUBE) TO CLEAN METAL & GLASS 1

ORG004-0003 O-RING SHUTTER SHAFT SEALS 2

SHUTTER & GAS INLET HIGH
ORG004-0049 O-RING 2
VOLTAGE FEEDTHROUGH

DSK001-0076 ANODE GRID SPUTTER HEAD ASSEMBLY 1

VAC001-0073 PIRANI GAUGE TUBE UNDER BASEPLATE DESK V 1

HP SYSTEM ONLY
10A, 250V, MAGNETIC CIRCUIT
DSK001-0125 REAR PANEL (NEW STYLE) 1
BREAKER
VFT005-0013 NW 16 VACUUM HOSE WITH PUMP TO CHAMBER 1
FLANGES

DSK001-0165 MECHANICAL PUMP OUTSIDE OF CABINET 1

PRB001-0002 H.V. FEEDTHROUGH BASEPLATE 1

DSK001-0065 CATHODE PLATE TARGET SEAL 1

TURBO PUMP
PMP005-0642 LUBRICANT RESERVOIR 1
FOR DESK V TSC
VAC001-0085 UNDER BASEPLATE, DESK V 1
FULL RANGE GAUGE TUBE;
TSC ONLY

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FUSES
FUSES FOR DESK V AND TSC
PART NO. DESCRIPTION LOCATION QTY.
10 AMP, 250V, TIME DELAY,
FUS001-0047 MAIN FUSE (110V) 1
CERAMIC BODY
8 AMP, 250V, TIME DELAY,
FUS001-0053 MAIN FUSE (230V) 1
CERAMIC BODY
5 AMP, 250V, TIME DELAY,
FUS001-0067 MECHANICAL PUMP (110/230v) 1
CERAMIC BODY
4 AMP, 250V, TIME DELAY,
FUS001-0051 HIGH VOLTAGE (110/230v) 1
CERAMIC BODY
2 AMP, 250V, TIME DELAY,
FUS001-0049 CONTROL (110/230V) 1
CERAMIC BODY
FUSES FOR CARBON ACCESSORIES
PART NO. DESCRIPTION LOCATION QTY.
10 AMP, 250V, TIME DELAY,
FUS001-0047 CARBON ACCESSORY (110V) 1
CERAMIC BODY
5 AMP, 250V, TIME DELAY,
FUS001-0067 CARBON ACCESSORY (230v) 1
CERAMIC BODY

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CONSUMABLES FOR CARBON ROD ACCESSORY
CONSUMABLES FOR CARBON ROD ACCESSORY

PART NO. DESCRIPTION LOCATION QTY.

CHB005-0057 6” D. X 9” H. PYREX CYLINDER DESK V CARBON ACCSY. 1

6” D. X 3.5” H. PYREX
DSK001-0047 DESK V TSC CARBON ACCSY. 1
CYLINDER
DSK001-0045 6” GASKET 6” PYREX CYLINDER 2

CAR001-0014 CERAMIC BUSHING CARBON FIXTURE 2

SPR001-0024 SPRING CARBON FIXTURE 1

CAR001-0012 1/8” STATIONARY CHUCK CARBON FIXTURE 1

CAR001-0013 MOVABLE CHUCK CARBON FIXTURE 1

CAR001-0024 CARBON RODS, 1/8” D. X 2” L. CARBON FIXTURE 100

CAR001-0004 THUMB SCREW, KNURLED CHUCKS 2

DWG001-0061 LEAD – 3 ½ “ GROUND CARBON FIXTURE 1

LEAD – 11” LONG,ELECTRICAL
DWG001-0055 CARBON FIXTURE 1
(TO FEEDTHROUGH)
DSK003-0012 SUPPORT POST CARBON FIXTURE 1

SRC002-0131 3/8” L.V. FEEDTHROUGH BASEPLATE 2

CAR001-0017 CAP HEAD 1

BUS002-0010 BUSHINGS BASEPLATE 4

HDW005-0004 SCREW, NYLON CAP 1

CON005-0034 STRAIN RELIEF CAP 2

ORG004-0049 O-RING BASEPLATE 2

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CONSUMABLES FOR CARBON YARN ACCESSORY
CONSUMABLES FOR CARBON YARN ACCSY.

PART NO. DESCRIPTION LOCATION QTY.

CHB005-0057 6” D. X 9” H. PYREX CYLINDER DESK V CARBON ACCSY. 1

DSK001-0047 6” D. X 3.5” H. PYREX CYLINDER DESK V TSC CARBON ACCSY. 1

DSK001-0045 6” GASKET 6” D. PYREX CYLINDER 2

25
YRN001-0001 CARBON YARN CARBON FIXTURE
FT.
CAR001-0015 CHUCK CARBON FIXTURE 2

HDR001-0029 CARBON YARN HOLDER CARBON FIXTURE 2

DSK003-0012 POST CARBON FIXTURE 2

SRC002-0131 3/8 L.V. FEEDTHROUGH BASEPLATE 2

ORG004-0049 O-RING BASEPLATE 2

BUS002-0010 BUSHING BASEPLATE 4

CAR001-0017 CAP HEAD 1

CON005-0034 STRAIN RELIEF CAP 2

HDW005-0004 SCREW, NYLON, (8-32 x .38 L.) CAP 1

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TARGETS FOR DESK V SERIES
TARGETS FOR DESK V AND TSC

TARGETS FOR DESK V and TSC

PART NO. MATERIAL THICKNESS

2.375” DIAMETER TARGETS

TAR001-0158 (Au) Gold (99.99%) 0.002”

TAR001-0159 (Au/Pd) Gold/Palladium (60/40) 0.002”

TAR001-0091 (Au/Pd) Gold/Palladium (60/40) 0.010”

TAR001-0030 (Pt) Platinum (99.99%) 0.0025”

TAR001-0099 (Pt/Pd) Platinum/Palladium (60/40) 0.002”

TAR001-0253 (Pd) Palladium Target (99.99%) 0.1mm

TAR001-0223 (Au/Pd) Gold Palladium (60/40) – 60mm diameter 0.1mm

TAR001-0227 (Au/Pd) Gold Palladium (60/40) – 60mm diameter 0.2mm

50MM X 50MM TARGETS

TAR001-0031 (Pd) PALLADIUM (99.9%) 0.1mm

TAR001-0033 (Ag) SILVER (99.9985%) 0.1mm

TAR001-0107 (Ag) SILVER (99.9985%) 2.0mm

TAR001-0102 (Ir) Iridium (99.8%) .127mm

TAR001-0065 (Ti) Titanium (99.99%) (TSC only) .127mm

TAR001-0179 (Cr) Chromium (99.95% (TSC only) .0625”

TAR001-0221 (C) Carbon (99.999%) (TSC only) .0625”

TAR001-0032 (Cu) Copper (99.999%) (TSC only) 0.1mm

TAR001-0104 (Pt) PLATINUM (99.998%) 0.1mm

RETAINERS FOR TARGETS

DSK004-0017 FOR 2” DIAMETER AND 50MM X 50MM TARGETS (Aluminum)

DSK003-0036 FOR 2” DIAMETER AND 50MM X 50MM TARGETS FOR TSC (stainless steel)

PRECIOUS METAL PRICES ARE SUBJECT TO CHANGE WITH MARKET VALUE.

PLEASE CALL DENTON VACUUM AT 856-439-9100 FOR A QUOTATION.

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Adjusting the Vacuum Safety Bellows Switch
1) Remove the top cover on the sputter head and locate the bellows safety switch.

2) The bellows safety switch is a round cylinder with 3 wires (red, white, and black) coming
from the top (the name Whitman Controls can be found on the side).

3) Pump system down to a vacuum level between 10 torr and 100 torr ( 1.0E+01 and
1.0E+2).

4) When the vacuum level is between 10 torr and 100 torr ( 1.0E+01 and 1.0E+2), shut the
manual valve on the Mechanical Pump. (DO NOT TURN THE PUMP OFF ON THE
TOUCH SCREEN AS THIS WILL VENT THE SYSTEM).

5) On the vacuum bellows safety switch, locate the knurled locking ring on the top portion
of the switch; loosen the ring while holding onto the section of the switch from which
the wires come out from.

Downloaded from www.Manualslib.com manuals search engine

6) Upon loosening the locking ring, slowly rotate the section with the wires counter clockwise,
while looking at the touch screen.

7) When the interlock message changes to “All Satisfied,” lock the knurled ring back down.

8) Re-open the manual valve on the Mechanical Pump and turn the pump off on the touch screen.

9) The bellows interlock message should re-appear.

10) Start the mechanical pump again and check to ensure that the bellows interlock goes to all satisfied.
If it does not, repeat steps 2 thru 9.

11) If the bellows goes to all satisfied, re-install cover the sputter head.

Emergency Stop Button

To ensure proper operation, make certain that the
emergency button (shown here) is pulled-out
completely. The Desk V cannot operate when the
emergency button is pushed-in.

Battery Advisory:
Note: The battery in your Desk V tool is not rechargeable and the life expectancy is 1 -1.5 Years. To avoid losing the program on
your screen, keep the tool plugged in and the tool on. The screen must always be powered (24 VDC). Should you need to replace
the battery, always replace it with the screen powered.

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