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PD Flow I - Floorplan

Floorplan

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0% found this document useful (0 votes)
331 views17 pages

PD Flow I - Floorplan

Floorplan

Uploaded by

gudala praveen
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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3/1/22, 2:38 PM Floorplan – signoffsemiconductors

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Floorplan

May 19, 2017


By Jedi

PD Flow I – Floorplan
 

Physical design is process of transforming netlist into layout which is manufacture-able [GDS]. Physical design process is ofte
and Route) / APR (Automatic Place & Route). Main steps in physical design are placement of all logical cells, clock tree synthe
process of physical design timing, power, design & technology constraints have to be met. Further design might require bein
power and performance.

General Physical Design Flow is shown below,

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1. IMPORT DESIGN / NETLISTIN

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Import design is the first step in Physical Design. In this stage all required inputs & required references are read into the tool. A
done (design, technology consistency).
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Inputs required
1. Gate level netlist
2. Logical (Timing) & Physical views of standard cells & all other IPs used in the design
3. Timing constraints (SDC)
4. Power Intent (UPF / CPF)
5. FP DEF & Scan DEF
6. Technology file
7. RC Co-efficient files

How to qualify Import Design?


1. Check errors & warning while reading netlist. Understand all warnings
2. Check for uniquification & empty modules
3. Check errors & warning while reading timing constraints. Understand all warnings
4. Check errors & warning while reading UPF/CPF. Understand all warnings
5. Timing QoR (Minimal violations with fixable WNS & TNS)
6. Check MV Design (Equivalent to LP checks). Fix all errors & understand all warning
7. Check for assign & tri statements (Usually its checked & fixed after Synthesis)

Timing analyses after Import Design


It is always a good practice to do quick timing analyses after import design. Even though post synthesis timing analyses is do
Tempus/ETS), it’s better to check post synthesis timing QoR in PnR tools also (ICC, Innovus, Olympus) before actual implemen

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Why it is required?
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ICC/Innovus optimizes critical timing paths (violating paths) which are seen by it. There can be chances that PnR tool is show
timing QoR (huge violations) compared to Post Syn QoR seen in PT/Tempus. It can be because of correlation issue / constrai
unnecessary optimization; timing & design closure will be easy if we correlate Import Design timing QoR with Post Syn timing

2. FLOORPLAN
Floorplan is one the critical & important step in Physical design. Quality of your Chip / Design implementation depends on ho
good floorplan can be make implementation process (place, cts, route & timing closure) cake walk. On similar lines a bad flo
issues in the design (congestion, timing, noise, ir, routing issues). A bad floorplan will blow up the area, power & affects reliab
can increase overall IC cost (more effort to closure, more LVTs/ULVTs)

Before staring of Floorplan, it is better to have basic design understanding, data flow of the design, integration guidelines of a
in the design. And for block/partition level designs understanding the placement & IO interactions of the block in Full chip will
good floorplan.

What is required to come with a good floorplan?


1. Basic design understating
2. Data flow diagram (DFA / Analyze logic connectivity in Synopsys ICC)
3. Integration guidelines
4. IO / Pin placement requirements
5. Special requirements from Full Chip floorplan
6. MV / LP requirements. Understanding of PDs & Vas

Different types of partitions / blocks


1. Memory intensive digital cores, graphic cores

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2. Partitions / Blocks with analog Hard IPs


3. DDR & other High Speed Interface
Home partitions / blocks
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4. Channel partitions

Partitions with different critical tasks


1. Timing critical
2. Routing critical / Congestion
3. Blocks with complex Clock structure

Types of floorplan techniques used in Full Chip plan


1. Abutted (All inter block pin connections are done through FTs)
2. Non abutted (Channel based. All inter block pin connections are routed in channels)
3. Mix of both – partially abutted with some channels

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FLOORPLAN STEPS
1. Size & shape of the block (Usually provided by FC floorplan)
2. Voltage area creation (Power domains)
3. IO placement
4. Creating standard cell rows
5. Macro-placement
6. Adding routing & placement blockages (as required)
7. Adding power switches (Daisy chain)
8. Creating Power Mesh
9. Adding physical cells (Well taps, End Caps etc)
10. Placing & qualifying pushdown cells

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11. Creating bounds / plan groups / density screens

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Detailed discussion

2. Voltage area creation


In multi-voltage & multi power domain designs, voltage areas are required to guide the tool to understand different domain

There are two methods to create voltage area;

1. Abutted voltage area (Cells are not allowed to place in default voltage area)

As is no default domain area, voltage area feed-through (VA-FT) are required to cross over different voltage area
2. Non-abutted voltage area (Cells are allowed to place in default voltage area)

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1. Shape & size of the block / partition


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In most of the case, block size & shape is decided by FC floorplan. Rectangle/Square shape is best in terms of floorplan & fur
many case, floorplan can be of rectilinear shape with many notches. It is always good practice to discuss with FC floorplan t
improve block/partition level floorplan.

3. IO / Pin placement
IOs / Pins are placed at the boundary of the block. Usually pin placement information is pushed down from FC floorplan. But t
changed based on block critical requirements. Any change in pin location has to be discussed with FC floorplan team. Timin
special attention, like next 2-3 levels of logic from IOs are pre-placed near the IOs). Source synchronous interfaces requires d
into considerations (This will require manual placement & scripting)

4. Row creation
Rows area created in the design using cell-site (unit / basic). Rows aid in systematic placement of standard cells. And stand
considering rows.

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Rows can be cut, wherever cell placement is not allowed OR hard placement blockage can also be used.

5. Macro placement
Step 1 – Understand Pins & Orientation requirements of Macros

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Step 2 – Follow data flow / hierarchy to place the Macros. Make use of reference floorplan if available

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Step 3 – All the pins of the Macros should point towards the core logic

Step 4 – Channels b/w macros should be big enough to accommodate all routing reqs & should get a minimum of one pair
the channel

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Automatic Floorplan / Macro-placement


Most of the PnR tools provide automatic floorplan option. Automatic floorplan option creates its own macro placement base
options. But these options are not matured enough to give optimum floorplan for all kind of designs. This option will be handy
Macros, but generated floorplan needs lot of modification for further optimizations.

How to qualify Macro – Placement


1. All macros should be placed at the boundary
2. Check the orientation & pin directions of all macros

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3. Spacing b/w macros should be enough for routing & power grid
4. Macros should not block partition
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5. [Iterations] Less congestion & good timing QoR – These cannot be achieved in one shot, but need few iterations [Thorou
the key things while iterating]

6. Adding placement & routing blockages


Buffer only blockages are added in channels b/w macros. Partial placement blockages can be added b/w the channels bloc
(whose placement in channels can degrade CTS QoR). Partial blockages are added in congestion prone areas/notches/cor

7. Adding power switches


Power switches are required to gate the power supply of gated domain when not required. Power switches are MT-CMOS (m
will have very high threshold voltage when device is OFF & very low threshold voltage when device is on.

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Power switches are inserted in power mesh & supply to all gated domain cells will be through power switches. Hence a single
enough. A strong network of power switches connected in daisy chain fashion will be inserted in the design.
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8. Adding special cells (Well Taps, EndCaps, Spare Cells, Metal ECO-able cells etc)
Well connection – Almost all standard cell libraries are tap-less (substrate connections are not done @ cell level). So Well-ta
partition/chip level to tie the wells to VDD/VSS. Tap-gate spacing has to be met while adding well-tap array.

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EndCap Cells – These cells are inserted to take care of boundary DRC of Wells & Other layers. End Cap Cells ensure proper te
no DRC are created. This is a physical-only cell.

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How to qualify Floorplan?


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1. Check PG connections (For macros & pre-placed cells only)
2. LP / MV checks on floorplan database
3. Check the power connections to all Macros, specially analog/special macros if any
4. All the macros should be placed at the boundary
5. There should not be any notches / thin channels. If unavoidable, proper blockages has to be added
6. Remove all unnecessary placement blockages & routing blockages (which might be put during floor-plan & pre-placing
7. Check power connection to power switches
8. Check power mesh in different voltage area voltage area
9. Check pin-layers & check layer directions (H-V-H)

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