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    Quectel AF20: Wi-Fi & BT Module With Ultra-Compact LGA Package

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    Alex Barancira

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    © All Rights Reserved
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    Quectel AF20: Wi-Fi & BT Module With Ultra-Compact LGA Package

    Uploaded by

    Alex Barancira
    27 views2 pages

    Original Title

    Quectel_AF20_Wi-Fi&BT_Specification_V1.0

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    27 views2 pages

    Quectel AF20: Wi-Fi & BT Module With Ultra-Compact LGA Package

    Uploaded by

    Alex Barancira

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 2

    Build a Smarter World

    Quectel AF20
    Wi-Fi & BT* Module with
    Ultra-compact LGA Package

    Quectel AF20 is a cost-effective Wi-Fi & BT* module with high performance. The ultra-compact 17.2mm × 15.2 mm × 2.2mm

    profile makes it a perfect choice for size sensitive applications. The compact and unified form factor can also help customers

    reduce product sizes and cut costs.

    Surface-mount technology (SMT) makes AF20 an ideal solution for durable and rugged designs. The compact LGA package

    makes sure AF20 can be easily embedded into size-constrained applications and provide reliable connectivity with these

    applications. The advanced package allows for large-scale automated manufacturing which has strict requirements on cost

    and efficiency.

    Combining advantages such as compact form factor, low power consumption, extended temperature range and stable SDIO

    interface, AF20 is typically used in combination with Quectel automotive grade LTE module AG35 to serve a wide range of

    M2M applications, especially automotive industry application.

    Key
    Benefits

    Ultra-compact Wi-Fi & BT* module


    Ultra-compact LGA Package IEEE 802.11
    Support BT 4.2* technology Size a/b/g/n/ac

    Support IEEE802.11a/b/g/n/ac standards

    Easier soldering and testing process with LGA package


    BT 4.2* SDIO Extended Temperature
    Stable and reliable SDIO communication interface Interface Range: -40°C ~ +85°C

    Fast time-to-market: simple design minimizes design-in time and


    development efforts

    Rev.: V1.0 | Status: Released

    EMAIL US: [email protected] VISIT US: www.quectel.com


    17.2mm
    Quectel AF20
    Wi-Fi & BT* Module with
    Ultra-compact LGA Package
    15.2mm 2.2mm

    Variant for the Global Electrical Characteristics General Features

    Function: Receiving Sensitivity: Encryption Mode:

    2.4GHz + 5GHz Wi-Fi, BT 4.2* -90dBm @802.11a/6Mbps WEP/TKIP/AES/WPA-PSK/WPA2-PSK

    WLAN Standard: -78dBm @802.11a/54Mbps AP (Access Point): Max. 16

    IEEE 802.11a/b/g/n/ac -93dBm @802.11b/1Mbps Operator Mode: AP/STA*

    BT Standard: -88dBm @802.11b/11Mbps Supply Voltage Range:

    BT 4.2 BLE* -87dBm @802.11g/6Mbps 3.14V~3.46V, 3.3V Typ.

    Modulation Mode: -75dBm @802.11g/54Mbps 1.71V~1.89V, 1.8V Typ.

    DBPSK/DQPSK/CCK/BPSK/ -88dBm @802.11n/HT20 MCS0 Temperature Range: -40°C ~ +85°C

    QPSK/16QAM/64QAM/256QAM -70dBm @802.11n/HT40 MCS7 Dimension: 17.2mm × 15.2mm × 2.2mm

    -90dBm @802.11ac/VHT20 MCS0 Weight: 1.26g

    Data -61dBm @802.11ac/VHT80 MCS9

    802.11a: Max 54Mbps Transmitting Power:

    802.11b: Max 11Mbps 15dBm @802.11a/6Mbps * Under Development

    802.11g: Max 54Mbps 11dBm @802.11a/54Mbps

    802.11n: Max 135Mbps 18.5dBm @802.11b/1Mbps

    802.11ac: Max 433Mbps 18.5dBm @802.11b/11Mbps

    BT 4.2*: Max 60Mbps 17dBm @802.11g/6Mbps

    16dBm @802.11g/54Mbps

    16.5dBm @802.11n/HT20 MCS0


    Interfaces

    13.5dBm @802.11n/HT40 MCS7


    SDIO 3.0: × 1

    14.5dBm @802.11ac/VHT20 MCS0


    Wi-Fi Enable Control: × 1

    6dBm @802.11ac/VHT80 MCS9


    BT Enable Control*: × 1

    PCM: × 1

    UART: ×1

    Antenna: Wi-Fi & BT* Antenna

    Copyright © 2018 Quectel Wireless Solutions Co., Ltd. All Rights Reserved http://www.quectel.com
    HQ address: 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China
    Tel: +86 21 51086236 Email: [email protected]

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