BGA Rework Station (WDS-4860)

User’s Manual V1.O

SHENZHEN WISDOMSHOW TECHNOLOGY CO., LTD.

Address:No.6‫آ‬ Haosi‫آ‬ Western‫آ‬ Industrial‫آ‬ Park‫آ‬ ,Xihuan Road ,S
hajing‫آ‬ Town,Bao'an District,Shenzhen,China
TEL：+86 (0755) 27336219

FAX：+86 (0755) 27336216

Email: [email protected]

Web: www.wdsbga.com
Shenzhen Wisdomshow Technology Co., Ltd Property in Copyright

1
 Introduction
Respected customers, thank you very much for using our Touch Screen BGA
Rework Station 。
The main features of WDS-4 860 Touch Screen BGA Rework Station ：
1 ） Linear slider is adopted, so all the three axles (X, Y, and Z) can do fine
tuning and quick location with perfect positioning accuracy and speedily
maneuverability；

2）Adopted touch screen , PLC controlling ，can store 1-50 groups of

temperature curve data.;
3）Three temperature zones to heat up independently, hot air heat up
between up and down zones, IR heat in the bottom, temperature precise
control is in±3 ℃，the three heating zones can work at the same time ,7
temperature curve controlling can be set at most in the up and down
zone;
4）The hot air nozzle can be arbitrary rotation in 360 degree, the IR heater
in the bottom can make PCB board heated evenly ;
5 ) High accuracy K-type thermocouple closed-loop controlling. It can test
temperature accurately through external temperature measurement
interface；
6）PCB board location with V-shape slot ，movable and adjustable jigs can
protect the PCB board;
7）High power cross-flow fan is used for cooling PCB board quickly to
improve work efficiency. What is more, the built-in vacuum pump and
external vacuum nozzle is convenient to take BGA chips ;
8）Having alarm prompt function after welding is done, specially added early
warning function for convenient operation ;
9）Under this situation that temperature is out of control, circuit can
automatically cut off the power with double over temperature protection
function;

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 Shenzhen Wisdomshow Technology Co., ltd is an electronic technique
company which precedes multi-aspect managements including innovating,
production, and selling and trade services.
Thanks to its location in the western district of Bao’an, we can take the
advantage of the international airport, shore line and container terminal to
face modern business opportunities.

BGA repair solution system is the heart of our activities. We

professionally provide our costumers both at home and abroad with SMT
handicraft Solution, as well the advanced production equipment, testing
equipment, and rework station and other excellent services. The main
products of our company are AI, 3D temperature Curve Test, 3D Thickness
Measurement System for Tin Paste, BGA Rework Station, AOI, Spare Parts
Counter and PCB Curve. Developing new solutions to help customers tackle
more diverse and complex issues  keeps Wisdomshow engineering
teams always at the forefront of the high-technology, prestigious awards and
wide recognition in China.

Wisdomshow regards well-educated workers as a main drive to our

development. A strong R&D team supports a dynamic workforce of over
thirty people. A well established sales network and after-sale services have
been built which reward us a strong reputation among high profile customers
both at home and abroad. We promise to provide perfect product and service
for the customer. We have applied the appearance patent for our products
and got through the CE. We have good market in Korea, Japan, North
Africa, Vietnam, and Southeast Asia, Mid-East and European countries.
We are devoted to the practice of  the motto “Specialized, Innovative
and Dedicated” and the company focuses on its customer’s satisfaction and
has set up a network of local offices to tailor its offer to an expanding
market. To expand our management scope, we look forward to your co-
operation。

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 Index

Item Page

1. Installation requirements 05-05

2. Technical parameter 06-06

3. Introduction of main structrue 07-08

4. Program setting and operation 09-13

5.Instructions of external temperature testing thermocouple 14-16

6.Reballing process 17-17

4
7. Equipment Maintenance 18-18

8. Safety caution 19-19

Attached: Temperature curve soldering table 20-23

一、Installation requirements

1、Far from inflammable, explosive, corrosive gas or liquid environment 。

2、To avoid wet places, air humidity is less than 90% 。

3、Environmental temperature-10 ℃ ~ 40 ℃ , avoid direct sunlight, 。

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 4、No dust, floating fibrous and metal particles work environment 。

5、Installation plane require that flat , firm and no vibration 。

6、No heavily object on the machine 。

7、Avoid any air conditioner, heater or fan directly airflow influence 。

8 、 it is required to reserve >300mm space at the back of the rework
station to heat elimination 。
9 、 Workbench of placing bga rework station Suggest surface area (900 x
900 mm) relative level, level 750 ~ 850 mm 。
10 、 Equipment of wiring must be made by qualified professional and
technical personnel for operation, the main line 2.5 square, the
equipment must be grounding is good 。
11 、 Turn off the power when discontinued the switch, long-term out of
service must be pulled out power plug 。

二、Technical parameter
Total Power 4800W
Upper Heating Power 800W
Lower Heating Power Second zone:1200W, Third zone: IR
2700W
Power Supply AC 220V±10% 50/60HZ
Overall Dimension L635*W600*H560mm
Locating Mode V-shape card slot, PCB holder can be
adjustable
by X and Y axes with universal jigs.
Temperature Controlling K-type thermocouple closed loop
control, independent temperature
control, precision up to ±3 degree
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PCB Size Max 410*370mm, Min 20*20mm
Electrical Material High sensitive temperature control
module, Delta PLC, Touch Screen
made-in Taiwan

Weight of machine 40KG

三、Introduction of main structrue

（一）Structure Introduction

7
 11 01
le
12 02

13 03

14 04

15 05

16 06

17 07

18 08

19 09

20 10

（二）Function Introduction
Ordinal Name Usage Operation ways

number
The upper heaters Y
Adjust the upper heaters Dextral to back, left spin
1 axis regulating
Y axis position forward
handle
The upper heater Z Adjust the upper heater Dextral to upside, left spin to
2
axis regulating z axis position the downside
Upper heating when Adjust through Z axis
3 Upper heater
soldering BGA regulating handle

8
 4 Light
5 Thermocouple
socket
The lower heater Adjust the lower heater From adjustment to the PCB
6
height height suitable location
7 regulatingindicator
Running handle Point when working
8 light
Lighting button
9 Running button
10 Scram button
Cool down PCB board
11 Cross flow fan
after soldering
12 PCB layer board Upbear PCB board
Ensure hot air focus on
13 Upper nozzle
the bga
14 Article support slider Lock screw and upbear
15 Lower nozzle PCB
16 PCB AL Bar Supporting article
17 locknut support
Fix layerslider
board
18 Upper breeze The left-right rotating, to
adjustment External temperature adjust the size of wind
19 Thermocouple port
testing
20 Touch Screen Operation controlling

四、Program setting and operation

Screen Name: System Home Page

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The first picture after the touch screen lighted

Chinese : button and then go to the operation screen in Chinese

ENGLISH: button and then go to the operation screen in English

10
Screen Name: Main Window (English )

Current Curve: Press and pop up current using parameters.

Run: The system will start heating operation according to the current parameter after
pressing
Stop: The system will stop heating operation according to the current parameter after
pressing
Keep OFF: After pressing, the system will stop heating operation.
Keep ON: After pressing, the system will keep the current temperature unchanged.
Vacuum ON : After pressing the system inatiates the vacuum.
Vacuum OFF: After pressing the system stop the vacuum
Cooling ON：After pressing the system initiates cooling.
Cooling OFF: After pressing the system stop cooling

Current Curve: Press and appear followed picture

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Up Temp : upper temperature
Up Rate：the upper rise temperature speed
Time Constant: when the rise temperature speed up to the temperature ,the time will
keep 30s then go on to the next temperature parameter
Down Temp: Down temperature
Down Rate: the down rise temperature speed
Time Constant: when the rise temperature speed up to the temperature ,time will keep
30s then go on to the next temperature parameter
IR Temp: IR temperature
IR Rate: the IR rise temperature speed
Time Constant: the keep time
Temp curve: the curve temperature parameter
Curve name: name of the curve temperature

Current Select: Press and setting the heating temperature parameters (as followed
picture)

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管理员：Administrator (choose this and click)
Password : 8888 (after press this password press OK then will appear the
followed picture )

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Password: this bottom can change the password u want to set
Delecte: delete the current temperature parameter curve
Save: to save the input parameters.
Apply : after you change the temperature parameter then download the current
temperature curve and press save ,Download the setting parameters to the current
parameters
Choose: choose the temperature parameter to the current parameter to heating

Screen Name: System Parameter (parameter setting)

五、Instructions of external
temperature testing thermocouple

（一）Function of external thermocouple

1、Testing the actual temperature of the heating parts when soldering 。
2 、 Can be movable ， convenient to test temperature of different parts of cell
that need to soldering 。
3 、 Calibration function, through the appropriate adjustments, as far as
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possible make welding parts temperatures close to the setting temperature 。

（二）Thermocouple installation
1 、 Check the thermocouple lines having the following phenomenon or, such
as scratching and broken line 。
2 、 Put the thermocouple line plug into the external thermocouple socket
according to the positive and passive identification 。
3 、 After right installation ， the current testing temperature of thermocouple
will be displayed on the touch screen :“actual measurement”

（三）Using thermocouple to measure actual

temperature
1 、 Place PCB board onto the BGA Rework Station ， fix the thermocouple line
on the PCB through the tin foil sticker （Picture 29）。
2、 Adjust the probe height ， locate the probe above the part that will be
tested 1-2mm（Picture30）。

Picture 29 Picture 30
3 、 Adjust head related adjustment button ， make the part that will be heated
above the wind cover（Shown as picture 30）。
4 、 Adjust the head heater ’up-down adjustment button ， the distance between
wind cover edge and PCB about 3-5mm 。
5 、 When soldering and desoldering ， that is to say upper and lower heater
begin to heat 。
6 、 At this time, the red, yellow and green curves will be displayed on the
external testing temperature curve screen of the touch screen.
7、External thermocouple actual temperature curve （Green）。
8、Upper heater internal thermocouple actual temperature curve （Red）。
9、Lower heater internal thermocouple actual temperature curve （Yellow）。

（四）Correct temperature curve through the

external thermocouple
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Notice ： This group of operation may cause temperature deviation even
out of controlling because of incorrect operation ， please operate
carefully ！
1 、 Setting upper parameter such as temperature, time and slope and so on
（The upper heater correction ）。
2 、 Advice to correct on the waste PCB board to avoid damage board and
electronic component.
3、Implement above（三）process.
4 、 Close the lower heating （ set the lower heater data to 0 ） ， back to
“temperature curve setting screen ”click“Run”button ， machine will heat
according to the setting ， The upper actual temperature (Red) and
external testing temperature will be displayed on the external testing
screen of the touch screen.
5、The red curve said Upper heater internal thermocouple actual temperature
curve ， The green curve said External thermocouple actual temperature
curve ， difference between the red curve and the green curve is smaller,
that is to say the temperature of actual heating parts and the setting
temperature are closely ， the upper heating process is more standard ；
on the contrary ，difference between the red curve and the green curve is
bigger ， that is to say the temperature of actual heating parts and the
setting temperature are far ，the upper heating process is not standard 。
6 、 If the difference between the two curves is too big ， should adjust and
correct.
7 、 The detail adjustment ways are the following ，Error can not be avoided
because of the system process and the environment ， if temperature
deviation does not affected soldering and desoldering, non-
professionals try to avoid the following operation ！
a 、 If the external thermocouple actual temperature curve （ Green ） is less
than upper heater internal thermocouple actual temperature
curve （ Red ） ， Adjust upward the internal thermocouple probe in the upper
wind cover；
b 、 If the external thermocouple actual temperature curve （ Green ） is more
than upper heater internal thermocouple actual temperature
curve （ Red ） ， Adjust downward the internal thermocouple probe in the
upper wind cover；
c、Adjustment range can not be too big ，with 1mm every time ；
d、Adjust for many times ；
e 、 When heating after adjustment ， no thing close to the upper internal
thermocouple probe ， to avoid affection on accurace of the testing
temperature；
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f 、 After temperature adjustment ， fix probe well ， to avoid the affection on
testing temperature because of the shake ；
g 、 The adjustment method of this case is only apply for two parallel curve
smoothly uniform deviation ， not apply for the ruleless rise and fall of the
temperature ！
h、Location of upper internal thermocouple ：Take cover in the upper edge of
the hair as about the distance of 2 ~ 3 cm place ；
i、 To avoid empyrosis, so please operate regularly ！
8 、 As the same ， fix the external thermocouple line under the PCB through
the tin foil sticker ， is above the lower nozzle ， Run the lower heater （ close
the upper heater），to test and correct the accurace of lower heating 。
9、Making out：close setting temperature of the lower heater ，（Notice：run
time according to the upper heater ， the upper temperature is set as 0
degree when run the lower heater alone ，the first constant temperature time
of the upper heater should be equal or bigger than the total heating time of
the lower heater。
10、Attention, please refer to the above seven related content 。
11、The detail adjustment methods are the following ：
a 、 If the external thermocouple actual temperature curve （ Green ） is less
than lower heater internal thermocouple actual temperature
curve （ Yellow ） ， Adjust downward the internal thermocouple probe in the
lower wind cover。
B If the external thermocouple actual temperature curve （ Green ） is more
than lower heater internal thermocouple actual temperature
curve （ Yellow ） ， Adjust upward the internal thermocouple probe in the
lower wind cover。

六、Reballing Process
1. Put the BGA that need to reball onto the bottom of the adjustable BGA
Reball Kit, adjust two sliders without spring to fix BGA.

2. Chose suitable stencil according to the BGA size .fix the stencil on the
header and lock 4 M3 screw, then cover the top. adjust the 4 screw on
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 the bottom to suit the height of the BGA.

3. Observe the alignment situation between the stencil hole and the BGA
soldering point, if misplace, please adjust again .

4. Lock two fixed slider without spring, take away the BGA and painted thin
a layer of BGA solder paste, then put it to the kit and cover the top.

5. Put into suitable BGA Solder Ball ,then shake the reball kit lightly, to
ensure every soldering point has the ball, then put out the needless part .

6. Place the reball kit on the flat table ,take away top cover, take away the
BGA carefully.

7. To fix the solder ball can be through our bga rework station or soldering
iron ， to heat the BGA Solder Ball on the BGA ,soldering the ball to the
BGA, last reballing is over !

七、Maintenance
In order to guarantee the machine function and prolong service life of the
machine, during usage, we have to do some maintenance on the system
regularly as follows

Parts Name protection Maintenance Period

Open the cover, clean

Upper heater the fan with high- 1 month
pressure air

Drive mechanism of Apply some butter on the 1 month

upper lead rail, rack and gear

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 heater and shaft.

Open the back cover of

the machine, use
Distribution box vacuum cleaner to suck 3 month
the dust and dirt, and
check whether the
components fixed well
Rotation Part of upper Apply some butter on the
drive parts 1 month
heater

Clean the heating plate

with dry cloth(do not use
Bottom IR heating tube wet 1day
(protecting fence) one)

Apply some lubricant to

the PCB supports and
PCB clamps
shaft of support guiding 1 month
axle

八、Safety caution
！（ 一 ） Power of the machine is AC220V ，working temperature is up to
400℃，may damage the machine because of the incorrect operation，even

endanger the safety of the operator 。 So must strictly comply with the

following items：

1 、 No fan or other equipment to blow up the machine when it is working

，or cause the damage of the components ；　

2、No operation under that environment such as Inflammable and explosive liquids or

gases；after power on ，no combustible to touch the high temperature area and
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 metal components，or cause fire and blast easily ；

3、To avoid high temperature burns，no touching on the high temperature area when

working，there is hot after working，it is necessary to take some measures when

operating；

Commonly used BGA soldering and desoldering

process parameter table：（For reference）
Leaded temperature curve soldering

41*41 BGA soldering temperature setting：

Constant
Preheatin Warming Soldering Soldering
temperat Cooling
g period 1 2
ure
Upper
160 185 210 235 240 225
heating
Constant
temperat 30s 30s 35s 40s 20s 15s
ure time
Lower
160 185 210 235 240 225
heating
Constant
temperat 30s 30s 35s 40s 20s 15s
ure time
Slope 3.0 3．0 3．0 3．0 3．0 3．0

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IR
preheatin 180
g

Constant
Preheatin Warming Soldering Soldering
temperat Cooling
g period 1 2
ure
Upper
160 185 210 225 235 215
heating
Constant
temperat 30s 30s 35s 40s 20s 15s
ure time
Lower
160 185 210 225 235 215
heating
Constant
temperat 30s 30s 35s 40s 20s 15s
ure time
Slope 3.0 3．0 3．0 3．0 3．0 3．0
IR
preheatin 185
g
38*38 BGA soldering temperature setting:

31*31 BGA soldering temperature setting：

Constant
Preheatin Warming Soldering Soldering
temperat Cooling
g period 1 2
ure
Upper
160 180 200 215 225 215
heating
Constant
temperat 30s 30s 35s 40s 20s 15s
ure time
Lower
160 180 200 215 225 215
heating
Constant
temperat 30s 30s 35s 40s 20s 15s
ure time
Slope 3.0 3．0 3．0 3．0 3．0 3．0
IR
preheatin 180
g
The above is apply to the leaded BGA

21
 Lead-free temperature curve soldering

41*41 BGA soldering temperature setting：

Constant
Preheatin Warming Soldering Soldering
temperat Cooling
g period 1 2
ure
Upper
165 190 225 245 255 240
heating
Constant
temperat 30s 30s 35s 55s 25s 15s
ure time
Lower
165 190 225 245 255 240
heating
Constant
temperat 30s 30s 35s 55s 25s 15s
ure time
Slope 3.0 3．0 3．0 3．0 3．0 3．0
IR
preheatin 210
g

Constant
Preheatin Warming Soldering Soldering
temperat Cooling
g period 1 2
ure
Upper
165 190 225 245 250 235
heating
Constant
temperat 30s 30s 35s 45s 25s 15s
ure time
Lower
165 190 225 245 250 235
heating
Constant
temperat 30s 30s 35s 45s 25s 15s
ure time
Slope 3.0 3．0 3．0 3．0 3．0 3．0
IR
preheatin 210
g

38*38 BGA soldering temperature setting：

22
31*31 BGA soldering temperature setting：
Constant
Preheatin Warming Soldering Soldering
temperat Cooling
g period 1 2
ure
Upper
165 190 220 240 245 235
heating
Constant
temperat 30s 30s 35s 40s 20s 15s
ure time
Lower
165 190 220 240 245 235
heating
Constant
temperat 30s 30s 35s 40s 20s 15s
ure time
Slope 3.0 3．0 3．0 3．0 3．0 3．0
IR
preheatin 210
g

The above is apply to the Lead-free BGA

Put the cooling temperature to 0 degree when desoldering 。

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