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Three Bond Technical News

Issued October 1, 1987

One-Part Epoxy Resin

Introduction certain degree of knowledge and understanding of

In addition to two-part epoxy resin, one-part one-part epoxy resins can select and use them,
epoxy resin has a wide range of applications. while those who consider it difficult to sell the
However, it seems that the product has not readily resins may not understand the versatility and wide
been and accurately understood by many people. range of applications of epoxy resin.
According to the survey conducted internally, This issue of the newsletter describes one-part
one-part epoxy resin ranked high in both the epoxy resin, which has various properties and a
"salable" and "difficult to sell" groups, giving a wide range of uses, in order to increase
rather puzzling result. After all, though this is my understanding of the resin.
own interpretation, sellers and buyers who have a

Contents
Introduction .......................................................................................................... 1
1. Summary ......................................................................................................... 2
2. Demand for epoxy resin in various fields ........................................................ 2
3. What is epoxy resin? ....................................................................................... 2
4. Compounding ingredients of epoxy-resin and roles thereof............................ 4
4-1. Major types of epoxy resin ....................................................................... 5
4-2. Various curing agents............................................................................... 5
< Dicyandiamide and derivatives thereof>............................................... 5
4-3. Elasticity and shock-resistant agents ....................................................... 6
4-4. Heat-resistant agents ............................................................................... 7
4-5. Fillers........................................................................................................ 7
4-6. Diluents .................................................................................................... 8
4-7. Thixotropic agents .................................................................................... 8
5. Major properties and uses of one-part epoxy resin......................................... 8
Conclusion ......................................................................................................... 10

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 1. Summary decade, the focus of the demand has shifted from
One-part epoxy resin has some commonalities general paints to automobile paints, and then to
with two-part epoxy resin. For example, they use electrical components. In particular over the past
the same epoxy resin, which is the fundamental few years, there has been increasing demand for the
ingredient thereof, and have employed very similar resin as an encapsulating material of IC and LSI for
methods of improvement and development. In electrical machinery such as FA and OA appliances.
addition, the one-part technique is primarily
dependent on the curing agents used. Therefore, the
3. What is epoxy resin?
compounding techniques described in the present
The term "epoxy resin" is a generic name for
report should be understood as regarding general
compounds that have two or more oxirane rings
epoxy-resin compounds. Epoxy resin is
(epoxy groups) in one molecule, and are cured
characterized by the high degree of flexibility in its
three-dimensionally by a suitable curing agent.
compounds due to its stability. Various compound
However, in most cases, the term refers to
techniques have been suggested and discussed for
bisphenol-A diglycidyl ether (DGEBA), which is
exploiting the flexibility and other good properties
formed by the reaction between bisphenol A and
of the basic types of epoxy resin. This report
epichlorohydrin, which currently commands a 75%
describes the basic properties of the epoxy resin and
share of the epoxy-resin market. Of the products of
the ingredients of the compounds and the roles
Three Bond, 50% to 60% of one-part epoxy resin
thereof, and introduces the properties and uses of
and more than 90% of two-part epoxy resin are
one-part epoxy resin.
based on DGEBA or compounds containing
DGEBA. Therefore, DGEBA is synonym for epoxy
2. Demand for epoxy resin in various resin.
fields
As shown in Table 1, there is demand for epoxy The following section describes the structure and
resin in a wide range of fields, including paints and performance of epoxy resin, using DGEBA as a
electrical components. As a trend over the past representative example.

Table 1. Delivery quantity of epoxy resin organized by use

(year on year (%)) 87-01-26

Year
54 55 56 57 58 59
Uses

Cans 5,643 4,973 88 6,378 128 5,836 92 7,234 124 8,258 114
Automobiles 6,458 157 7,808 121 9,595 123 10,514 110 11,534 110
Paints
Ships 3,739 4,929 132 7,533 153 7,496 100 6,888 92 7,572 110
General purposes 11,191 10,578 95 10,153 96 9,713 96 10,974 113 13,412 122
Total 24,676 26,938 109 31,872 118 32,640 102 35,610 109 40,776 115
Laminates 7,118 7,364 103 9,982 136 10,362 104 14,142 136 20,864 148
Electrical
Casting 5,282 5,367 102 4,574 85 3,658 80 4,079 112 5,266 129
components
Others 2,231 2,260 101 3,413 151 3,652 107 5,483 150 11,122 203
Total 14,631 14,991 102 17,969 120 17,672 98 23,704 134 37,252 157
Civil construction 6,901 6,558 95 7,411 113 8,002 108 9,446 118 9,469 100
Adhesives 3,582 3,659 102 3,832 105 3,609 94 3,731 103 3,882 104
Others 6,404 6,407 100 5,296 83 4,778 90 6,238 131 7,646 123
Domestic demand total 56,194 58,553 104 66,380 113 66,701 100 78,729 118 99,025 126
Export 915 902 99 568 63 866 152 1,330 154 1,729 130
Grand total 57,109 59,455 104 66,948 113 67,567 101 80,059 118 100,754 126

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 Reactivity Flexibility Heat-resistance and Reactivity and
durability adhesiveness

Chemical-resistance

Fig. 1. Structure and properties of epoxy resin

The excellent properties of epoxy resin, such as degree of cure shrinkage than other
durability and adhesiveness, depend largely on its thermosetting resins.
structure. Fig. 1 shows the relationship 2) The ether linkages included in the main chain
schematically. improve the chemical-resistance and elasticity.
1) The epoxy groups at both terminals of the 3) The benzene rings in bisphenol A provide
molecule and the hydroxyl groups at the chemical-resistance, adhesiveness, durability,
midpoint of the molecule are highly reactive, heat-resistance and excellent electrical
allowing room-temperature and properties.
high-temperature curing using suitable curing 4) The coexistence of hydrophilic groups with
agents, and a wide range of modifications. In hydrophobic groups in the molecule
addition, the resin is cured by ring-opening significantly increases the adhesion to various
polymerization, and as a result has a smaller adherends.

61•Breakdown
60 61•Total
１～３ ４～６ ７～９ 10～12
8,327 101 2,051 93 2,697 116 2,397 127 2,279 119 9,424 113
12,473 108 2,988 101 3,095 91 3,013 100 3,103 100 12,199 98
7,437 98 1,411 73 1,584 78 1,515 85 1,514 88 6,024 81
13,122 98 3,294 104 4,100 121 3,561 113 3,497 103 14,452 110
41,359 101 9,744 95 11,476 103 10,486 107 10,393 103 42,099 102
18,652 89 4,436 100 5,973 133 5,453 110 5,791 121 21,653 116
5,565 106 1,663 121 1,873 136 1,898 139 2,142 148 7,576 136
10,849 98 3,215 102 4,044 144 4,130 193 3,689 135 15,078 139
35,066 94 9,314 104 11,890 137 11,481 136 11,622 130 44,307 126
9,349 99 2,210 92 2,017 96 2,347 96 2,273 95 8,847 95
4,059 105 1,019 105 1,358 138 1,316 133 1,478 133 5,171 127
7,768 102 2,007 95 1,751 97 1,867 101 1,925 97 7,550 97
97,601 99 24,294 98 28,492 115 27,497 117 27,691 113 107,974 111
1,423 82 583 139 521 180 420 111 437 130 1,961 138
99,024 98 24,877 99 29,013 116 27,917 117 28,128 113 109,935 111

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 As described above, many properties are modifiers and diluents in order to impart the resin's
ascribable to the structure, but such properties are desirable properties, such as strength, flowability,
largely dependent on the curing agents that cause and heat-resistance.
the curing reaction, resulting in wide selectivity of
the epoxy resin. In addition to the agents described below, various
agents can be mixed with epoxy resin. In such cases,
epoxy resin causes remarkably less gelation and
4. Compounding ingredients of
reaction inhibition than other reactive resins, which
epoxy-resin and roles thereof
gives a significant advantage to the resin in the
As shown in Table 2, regardless of whether it is
creation of compounds and allows anyone to make
one-part or two-part, epoxy resin is rarely used
such compounds.
alone as an epoxy-resin material, but rather is used
in the form of compounds containing various

Table 2. Compounding ingredients of epoxy-resin and roles thereof

Constituents Ingredients Roles

The bisphenol-A type is common.
However, there are many other
Epoxy resin
types of epoxy resin having
different properties.
Resin content
Curing agents react with epoxy
groups to form a
Curing agents
three-dimensional network
structure by crosslinking.
Elasticity agents elasticate
compounds to improve their
Elasticity agents peeling strength and extensibility,
e.g., elasticizers and epoxy
modifying resins.
Shock-resistant agents eliminate
Shock-resistant brittleness from epoxy resin to
agents prevent cracks and decrease
distortion.
Fillers increase the weight in
order to decrease costs and
Fillers improving various types of
mechanical strength, e.g.,
calcium carbonate and talc.
Heat-resistant agents increase
the heat-resistance and
Modifying
Heat-resistant heat-deformation temperature
ingredients
agents through the use of multi-sensual
types of epoxy resins such as
novolac epoxy resin.
Diluents reduce viscosity and
improve flowability and
permeability. Reactive diluents
Diluents
having epoxy groups and
nonreactive diluents having no
epoxy group are available.
Thixotropic agents impart
thixotropy to compounds in order
Thixotropic agents
to control flowability and increase
viscosity.
Pigments, coupling agents,
Other agents defoaming agents, leveling
agents, etc.

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4-1. Major types of epoxy resin
Bisphenol-A type (DGEBA); Commonly used

Bisphenol-F type; Characterized by having low viscosity

Bisphenol-A D type; Having intermediate characteristics between those of the DGEBA and bisphenol-F types

Most epoxy resins are composed on the basis of and properties of thermal-dissolution reactive
the above three types of resin. There are many other curing agents.
types of epoxy resins; however, most are not <Dicyandiamide and derivatives thereof>
adaptable to a wide variety of applications, and Dicyandiamides are crystals with a high melting
rather are intended for special purposes such as point of 207°C to 210°C. When dispersed in epoxy
modifications and improvements to heat-resistance resin in the form of fine powder, they will have a
and elasticity. pot life of 6 to 12 months, and will remain stable for
a greater length of time than imidazole. Four to ten
4-2. Various curing agents parts of them are added to DGEBA.
Like epoxy resin, there are various types of Dicyandiamides require heating at 160°C to
curing agents for epoxy resin. In fact, there are so 180°C for one hour to several hours for curing, and
many types that they cannot be covered in this generate a large quantity of heat upon curing. They
report; therefore, only the latent curing agent for tend to sediment due to their high specific gravity,
one-part epoxy resin is described in this section. and thus are not suitable for casting. They are used
The types of latent curing agents are classified as for coating, adhesion, and lamination.
shown in Table 3. Including our products, those that In many cases, to decrease the curing temperature,
are commercially available are primarily of the which is a weakness of dicyandiamides, an
thermosetting type. Most thermosetting curing accelerating agent is added, as shown in the
agents are of the dissolution-reactive type. following example of compound, in order to
Table 3. Classification of latent curing agents accelerate curing at a lower temperature. New
Activation means Phenomena Curing agents accelerating agents have actively been developed.
Ionic reactionLewis-acid complexes
(BF3-ME-A, etc.) <Example of compound>
Dissolution Dicyandiamide DGEBA 100
Modified imidazole, organic acids DICY (dicyandiamide*) 8
Heat activation
Hydrazides, DCMU
Dimethyl urea 3
Decomposition Amine-imide compounds
<Properties of the compound>
Elution Molecular sieves
Microcapsules
Curing conditions 120 °C × 30 minutes
Aromatic diazonium salts, diallyl
Shearing strength 150 kgf/cm2
Light (UV) Decomposition iodonium salts, triaryl sulfonium Glass transition point 125 °C
salts
The compound has found a wide range of
Decomposition Ketoimine
Moisture
Elution Molecular sieves applications: as an adhesive in electric and
Pressure Microcapsules electronic applications, as an encapsulating material
Using dicyandiamide as a representative example, for terminals due to the fact that it does not cause
the following section describes the characteristics metal corrosion, as a structural adhesive due to its

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 strong adhesiveness, and for pre-preg and powder improvements in peel strength by imparting
coating due to its low cost. elasticity to disperse stresses.
The method of compounding elasticated agent is
4-3. Elasticity and shock-resistant agents as follows: an elastic structure is introduced to the
Despite its high strength, (cured) epoxy resin has main chain polymer, side chain or terminal of a
the problem of brittleness due to its poor elasticity. bisphenol type resin (see Fig. 2). However, the
One-part epoxy resin, when it has not been introduction of polymers having a rubber structure
particularly elasticated, has shearing adhesive or a straight chain inevitably causes a significant
strength of 150 to 200 kg f/cm2, which is relatively increase in the viscosity of the material and
high for an adhesive; however, it has peeling deterioration of the properties of the material, such
adhesive strength of 0.5 to 1 kgf/25 mm width in a as heat-resistance, due to the decrease in the
T-peel test, which is equivalent to that of instant crosslinking density.
adhesives. This is due to the fact that the cured resin To avoid such deteriorations in properties, a
is relatively low in extensibility. If this insufficiency special elasticated agent, carboxyl-terminal
is redressed by a elasticity agent, the resin may have butadiene-acrylonitrile copolymer liquid rubber
shearing adhesive strength of 250 kgf/cm2 or higher, (CTBN), may be added. CTBN has mutual
and peeling adhesive force of 20 kgf/25 mm width solubility with epoxy resin, but does not have it
in a T-peel test. with cured epoxy resin and therein forms a
The elasticated agents are described below. dispersed rubber particle phase, and serves as a
The purposes of adding elasticated agents include cushioning material to prevent cracks (see Fig. 3).
the following: 1) improvements in mechanical This elasticated agent is said to provide elasticity
strength, 2) prevention of cracks due to thermal without deteriorations in properties, due to the fact
distortion, and reduction of distortion, and 3) that it does not remain in the epoxy-resin layer.
improvements in adhesiveness, particularly

Fig. 2. Schematic structure of modified resins

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 Dispersed rubber particle
phase

Without CTBN particle phase With CTBN

Fig. 3. Effect of CTBN

4-4. Heat-resistance improvers It can be generally concluded that improvements

The heat-resistance of compounds depends in crosslinking density contribute to improvements
primarily on the epoxy resin contained therein. In in heat-resistance, and thus resins with a short
one-part epoxy resin, the usable curing agents are distance between epoxy groups, or multifunctional
limited, and thus the heat-resistance depends types of epoxy resin are commonly used.
primarily on the type of selected epoxy resin . Representative examples are given below.

Novolac epoxy resin

Glycidyl amine resin

Glycidyl ether resin

Fig. 4. Representative heat-resistance agents

4-5. Fillers 1) Improvements in mechanical strength

Fillers tend to be regarded merely as bulking 2) Reduction in thermal distortion and dimensional
agents, but their roles cannot be neglected due to change
the fact that increasingly rigorous properties are 3) Improvements in electrical properties,
required of epoxy resin. It is therefore necessary to particularly insulating and dielectric properties
select and add appropriate fillers. 4) Cost reduction due to the increase in weight
The effects of fillers include the following: 5) Improvements in fire retardancy

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 6) Improvements in heat conductivity 4-7. Thixotropic agents
Thixotropy is a property of liquids containing
4-6. Diluents flocculating components. Flocculating components
As previously mentioned, when various materials are destroyed by repeated stirring and the liquids
are added to epoxy resin in order to improve its show flowability; however, once stirring is stopped,
properties, the viscosity of the composition the components reflocculate and the liquids return
correspondingly increases. Bisphenol-A-type epoxy to the nonflowable state.
resin itself does not have low viscosity, and thus it This property is required in applications in which
inevitably requires adjustment (reduction) of its sagging causes a problem, such as the thick coating
viscosity. For this purpose, diluents are used. of paints and the adhesive sealing of gaps.
The influence of diluents on performance must be Commonly used effective thixotropic agents include
minimized, and thus the preferably used fillers are silica fine powder (Aerosil), and colloidal hydrated
those that can have a significant effect with as small aluminum silicate/organic complex (Orben).
amounts as possible. One-part epoxy resin requires However, the effect varies among thixotropic
diluents having a low vapor pressure, as it agents. Some exert their effect in heating, and
undergoes a heating process. others disappear in heating, become ineffective
Diluents fall into two types: reactive ones having when cured, or deteriorate over time. Their
epoxy groups and unreactive ones having no epoxy selection is difficult even for experts.
group. Most one-part epoxy resins are used reactive
diluents, as unreactive diluents serve as a elasticizer 5. Major functions and uses of one-part
in the cured resin. Fig. 5 shows the major diluents. epoxy resins
Their handling requires caution, as they have a low Table 4 lists the major properties and uses of
molecular weight and readily permeate through the one-part epoxy resin, and Photograph 1 shows
skin to cause irritation. examples of the usage of one-part epoxy resin.

Carjula E

Fig. 5 Representative reactive diluents

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 Table 4. Major properties and uses of one-part epoxy resin

Product name ("TB" is an

Properties Uses Characteristics
abbreviation for Three Bond.)

Heat- (1) Impregnating fixation of armature Moderate impregnation properties and strength TB2068K, TB2068H
resistance coils with heating at 160 °C or higher TB2064C
Resistance to continuous heating at 220 °C
(2) Heat-resistant adhesion Glass transition temperature of 170 °C, strength TB2064C
with heating
2
200 °C, 50 kgf/cm , peeling strength of 14 kgf/25
mm width
(3) Adhesion of motor magnets Moderate flowability, strength with heating at TB2068M
150°C or higher
Dimensional (1) Encapsulation of heads and Low coefficient of thermal expansion, high TB2071B
stability electrical components moisture-resistance, high purity, resistance to
P.C.T. (pressure cooker test)
Thixotropy (1) Antisagging, temporal adhesion of High thixotropy, screen printability TB2065, TB2065M
chips, fixation of coil terminals Fast curing at 150 °C, curing in one to two
minutes
(2) Terminal seal for prevention of Moderate flowability, curing at a low temperature TB2062B, TB2062D
penetration of 80 °C to 100 °C
(3) Joint sealants High thixotropy, high viscosity TB2065, TB2062K
Fast curing (1) Adhesion of syringe needles Moderate permeability, white cured substance, TB2062D, TB2065L
curing at 150 °C in one to three minutes
(2) Coating of stepping motors Curing at 150 °C in one to three minutes, TB2065, TB2065C
machinability
Machinability (1) Joint sealants for bus bodies High shock adhesive force, slump property, and TB2063C
machinability
Impregnation (1) Low-viscosity impregnating Low viscosity, long shelf life TB2076, TB2076C
adhesion, impregnation of cut cores
(2) Potting agent for small coils Low viscosity, low shrinkage ratio TB2071C
Elasticity (1) Thermal shock, adhesion of motor Absorption of the thermal distortion of TB2064, TB2064B
magnets magnets/yokes, prevention of cracks in
vibration-absorbing magnets
(2) Terminal seal for halogen-lamp Thermal shock, conformity to terminal bending, TB2064
adhesion to engineering plastics
(3) Adhesion of headlights (iron/glass) Rubber elasticity TB2067E, TB2067F
TB2067D
Structural (1) Adhesion of automobile hemming High adhesive strength, peeling adhesive force TB2068G
adhesion (2) Adhesion of joints in chainsaw fuel High adhesive strength, peeling adhesive force TB2063, TB2063D
tanks
Filling (1) Potting of inhibitor switches Moderate flowability, heat-resistance, TB2068M, TB2068P
adhesion weather-resistance TB2068I, TB2063J
(2) Adhesion sealing of plastic cases Moderate permeability, soldering heat-resistance TB2062C, TB2062J
(3) Encapsulation of printer heads Moisture-resistance, flowability, low-temperature TB2065E, TB2065F
fast-curing property

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 Photograph 1 Examples of the usage of one-part epoxy resin

Conclusion Thanks to an increase in the demand for one-part

Three Bond has been selling one-part epoxy resin epoxy resin and the development of various
for more than ten years. In that time, we have functional materials as a result of the efforts of
developed various grades of products, such as a material manufacturers, we have successfully
simple compounds composed of a bisphenol-A-type developed proven products. We will continue to
epoxy resin, dicyandiamide, and a filler, and those work to expand the possibilities of one-part epoxy
containing a low-temperature active curing agent resins.
for curing at 80 °C, as well as those comprising a
heat-resistant resin to achieve high heat-resistance
and those allowing a peeling adhesive force of 10
kg/25 mm width or more through rubber Yukimasa Osumi
modification. The performance of these products Adhesive laboratory
has been proven. R&D Laboratory

1456 Hazama-cho, Hachioji-shi, Tokyo 193-8533, Japan

Tel: 81-426-61-1333

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