2.
Specification
2-1. GSM General Specification
W CDM A2 1 W CDM A9 0 W CDM A1 9
G SM850 EG SM 90 0 DCS1800 PCS1900
00 0 00
Fre q.
Ban d[M Hz] 824 ~849 880 ~915 1710 ~1785 1850 ~1910 1922 ~1977 880 ~915 1852 ~1907
Uplin k/ 869 ~894 925 ~960 1805 ~1880 1930 ~1990 2112 ~2167 925 ~960 1932 ~1987
Downlink
0 ~124 & UL: 9612~9 UL: 2712~2 UL: 9262~9
A RF CN 128 ~251 512 ~885 512 ~810 888DL: 105 8 63,DL:2 9 5 38,DL:9 6
r ange 975 ~1023 62~ 10838 37 ~ 3088 62~ 9938
T x/ R x 45 MHz 45 MHz 95 MHz 80 MHz 19 0MHz 45 MHz 80 MHz
spacing
Mod. Bit 27 0.833 kb 27 0.833 kb 27 0.833 kb 27 0.833 kb
r at e/ ps ps ps ps 3.84 Mcp s 3.84 Mcp s 3.84 Mcp s
Bi t Peri od 3. 692us 3. 692us 3. 692us 3. 692us
Fr ameLeng Fr ameLeng Fr ameLeng
Tim e Slot
th: th: th:
Per iod / 576 .9us 576 .9us 576 .9us 576 .9us
10ms 10ms 10ms
Fram e 4.61 5ms 4.61 5ms 4.61 5ms 4.61 5ms
Slot lengt h: Slot lengt h: Slot lengt h:
Period
0.66 7ms 0.66 7ms 0.66 7ms
QPSKHQ P QPSKHQ P QPSKHQ P
Mod ulat ion 0. 3GMSK 0. 3GMSK 0. 3GMSK 0. 3GMSK SK SK SK
33dBm~5d 33dBm~5d 30dBm~0d 30dBm~0d 24 dBm~- 24 dBm~- 24 dBm~-
MS Power Bm Bm Bm Bm 50 dBm 50 dBm 50 dBm
Power 5pcl ~ 3(max+24dB 3(max+24dB 3(max+24dB
Class 19 pcl 5pcl ~ 19pcl 0pcl ~ 15pcl 0pcl ~ 15pcl m) m) m)
Sensitivity - 102d Bm - 102d Bm - 100d Bm - 100d Bm -10 6.7dBm -10 6.7dBm -10 6.7dBm
TDMA M ux 8 8 8 8 8 8 8
Cell
Radiu s 35 Km 3 5Km 2 Km 2 Km 2 Km 2 Km 2 Km
2-1
Specification
2-2. GSM Tx Power Class
TX Power TX Power TX Power TX Power
control GSM850 control EGSM900 control DCS1800 control PCS1900
level level level level
5 33±2 dBm 5 33±2 dBm 0 30±3 dBm 0 30±3 dBm
6 31±2 dBm 6 31±2 dBm 1 28±3 dBm 1 28±3 dBm
7 29±2 dBm 7 29±2 dBm 2 26±3 dBm 2 26±3 dBm
8 27±2 dBm 8 27±2 dBm 3 24±3 dBm 3 24±3 dBm
9 25±2 dBm 9 25±2 dBm 4 22±3 dBm 4 22±3 dBm
10 23±2 dBm 10 23±2 dBm 5 20±3 dBm 5 20±3 dBm
11 21±2 dBm 11 21±2 dBm 6 18±3 dBm 6 18±3 dBm
12 19±2 dBm 12 19±2 dBm 7 16±3 dBm 7 16±3 dBm
13 17±2 dBm 13 17±2 dBm 8 14±3 dBm 8 14±3 dBm
14 15±2 dBm 14 15±2 dBm 9 12±4 dBm 9 12±4 dBm
15 13±2 dBm 15 13±2 dBm 10 10±4 dBm 10 10±4 dBm
16 11±3 dBm 16 11±3 dBm 11 8±4 dBm 11 8±4 dBm
17 9±3dBm 17 9±3dBm 12 6±4 dBm 12 6±4 dBm
18 7±3 dBm 18 7±3 dBm 13 4±4 dBm 13 4±4 dBm
19 5±3 dBm 19 5±3 dBm 14 2±5 dBm 14 2±5 dBm
15 0±5 dBm 15 0±5 dBm
2-2
3. Operation Instruction and Installation
Main Function
• Android OS: Froyo
• HSDPA 7.2Mbps / HSUPA 5.76Mbps
• 5MP AF
• 4.0" TFT LCD, Full Touch (C-Type)
• A-GPS / BT v2.1 + EDR / USB v2.0 / WiFi (802.11 b/g/n)
• HD Recording (720p) / Full HD Playback (1080p)
• Sensors: Accelerometer, Compass, Proximity, Light
• TouchWiz 3.0 for Android, Multistage, Augmented Reality, Integrated phonebook with
SNS, IM, E-mail, Face Recognition, etc.
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6. Level 1 Repair
6-1. S/W Download
6-1-1. Pre-requisite for S/W Downloading
• Downloader Program(Odin3 v1.0.exe)
• GT-I9003 Mobile Phone
• Data Cable
• JIG BOX (GH99-36900A)
• RF Test Cable (GH39-00985A)
• JIG Cable (GH39-01290A)
• Adapter (GH99-38251A)
• Binary files
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Level 1 Repair
6-1-2. S/W Downloader Program
■ Load the binary download program by executing the
" Odin3 v1.0.exe " ← Run this file.
1. Option Selection
- Check Re-Partition, Auto Reboot and F. Reset Time, then select PIT File
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Level 1 Repair
3. Enter Device into Download Mode
- Enter the device into Download Mode by pressing down on Volume Down button
and OK button and Power On button at the same time.
Volume Down Button Power On Button
OK Button
4. Connect the Handset to PC via Data Cable. Make sure ID:COM box highlighted
yellow that the handset is connected to the PC.
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Level 1 Repair
5. Start Downloading PIT file by clicking Start Button. Then wait for "Pass" to be
appear on the screen.
6. Click on Reset button, then unselect Re-Partition box. Then select PDA, PHONE
and CSC Files.
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Level 1 Repair
7. Remove the battery, then enter Device into Download Mode again as in step #3.
then connect to the PC.
8. Start Downloading PDA, PHONE and CSC files by clicking Start Button. Then
wait for "Pass" to be appear on the screen.
9. Once the device boots up, confirm the downloaded version name and etc. :
*#1234#
Full Reset :
*2767*3855#
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9. Reference Abbreviate
Reference Abbreviate
― AAC: Advanced Audio Coding.
― AVC : Advanced Video Coding.
― BER : Bit Error Rate
― BPSK: Binary Phase Shift Keying
― CA : Conditional Access
― CDM : Code Division Multiplexing
― C/I : Carrier to Interference
― DMB : Digital Multimedia Broadcasting
― EN : European Standard
― ES : Elementary Stream
― ETSI: European Telecommunications Standards Institute
― MPEG: Moving Picture Experts Group
― PN : Pseudo-random Noise
― PS : Pilot Symbol
― QPSK: Quadrature Phase Shift Keying
― RS : Reed-Solomon
― SI : Service Information
― TDM : Time Division Multiplexing
― TS : Transport Stream
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1. Safety Precautions
1-1. Repair Precaution
― Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because
specipicty of cellular phone is sensitive for surrounding interference(RF noise).
― Be careful to use a kind of magnetic object or tool, because performance of parts is damaged by
the influence of magnetic force.
― Surely use a standard screwdriver when you disassemble this product, otherwise screw will be
worn away.
― Use a thicken twisted wire when you measure level.
A thicken twisted wire has low resistance, therefore error of measurement is few.
― Repair after separate Test Pack and Set because for short danger (for example an overcurrent
and furious flames of parts etc) when you repair board in condition of connecting Test Pack and
tuning on.
― Take specially care of soldering, because Land of PCB is small and weak in heat.
― Surely tune on/off while using AC power plug, because a repair of battery charger is dangerous
when tuning ON/OFF PBA and Connector after disassembling charger.
― Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.
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Safety Precautions
1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
― Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity prevention
string on wrist.
― Use earthed soldering steel when you connect or disconnect ESD.
― Use soldering removing tool to break static electricity. , otherwise ESD will be damaged by static
electricity.
― Don't unpack until you set up ESD on product. Because most of ESD are packed by box and
aluminum plate to have conductive power,they are prevented from static electricity.
― You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or a circuit board.
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