VinMin = 3.

7V Device = TPS61288RQQR
VinMax = 4.2V Topology = Boost
Vout = 6.0V Created = 2022-01-20 21:58:18.080
Iout = 2.0A BOM Cost = $2.38
® BOM Count = 13
WEBENCH Design Report Total Pd = 0.57W

Design : 14 TPS61288RQQR
TPS61288RQQR 3.7V-4.2V to 6.00V @ 2A

L1
4.7 µH
18.0 m Ohm

Cbst
100.0 nF
1.0 m Ohm

TPS6 1 2 8 8 RQQ
U1 VIN VOUT

SW FB
SW
COMP Rfbt
BST 442.0 kOhm
50.0 m W
EN
Vin AGND
VCC PGND

Cout Iout
Rcom p 47.0 µF
Cin Cinx 16.5 kOhm 3.709 m Ohm
10.0 µF 100.0 nF 63.0 m W Qt y= 2
1.0 m Ohm 20.0 m Ohm Cvcc Ccom p2
62.0 pF
2.2 µF
1.0 m Ohm Rfbb
48.7 kOhm
Ccom p 63.0 m W
47.0 nF
1.0 m Ohm

Vout = 6.0V

Electrical BOM
Name Manufacturer Part Number Properties Qty Price Footprint

Cbst MuRata GRM155R71A104KA01D Cap= 100.0 nF 1 $0.01

Series= X7R ESR= 1.0 mOhm 0402 3 mm
2

VDC= 10.0 V
IRMS= 0.0 A
Ccomp MuRata GRM033R60J473KE19D Cap= 47.0 nF 1 $0.01
Series= X5R ESR= 1.0 mOhm 0201 2 mm
2

VDC= 6.3 V
IRMS= 0.0 A
Ccomp2 Samsung Electro- CL21C620JBANNNC Cap= 62.0 pF 1 $0.01
Mechanics Series= C0G/NP0 VDC= 50.0 V 0805 7 mm
2

IRMS= 0.0 A
Cin MuRata GRM155R60J106ME15D Cap= 10.0 uF 1 $0.03
Series= X5R ESR= 1.0 mOhm 0402 3 mm
2

VDC= 6.3 V
IRMS= 3.52 A
Cinx MuRata GRM188R71H104KA93D Cap= 100.0 nF 1 $0.02
Series= X7R ESR= 20.0 mOhm 0603 5 mm
2

VDC= 50.0 V
IRMS= 3.8 A
Cout MuRata GRM31CR61A476KE15L Cap= 47.0 uF 2 $0.26
Series= X5R ESR= 3.709 mOhm 1206_190 11 mm
2

VDC= 10.0 V
IRMS= 4.2862 A
Cvcc Kemet C0603C225K8PACTU Cap= 2.2 uF 1 $0.04
Series= X5R ESR= 1.0 mOhm 0603 5 mm
2

VDC= 10.0 V
IRMS= 0.0 A
L1 NIC Components NPI31W4R7MTRF L= 4.7 µH 1 $0.23
18.0 mOhm

2
IND_NPI31W 172 mm

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WEBENCH Design

Name Manufacturer Part Number Properties Qty Price Footprint

Rcomp Vishay-Dale CRCW040216K5FKED Res= 16.5 kOhm 1 $0.01

Series= CRCW..e3 Power= 63.0 mW 0402 3 mm
2

Tolerance= 1.0%
Rfbb Vishay-Dale CRCW040248K7FKED Res= 48.7 kOhm 1 $0.01
Series= CRCW..e3 Power= 63.0 mW 0402 3 mm
2

Tolerance= 1.0%
Rfbt Yageo RC0201FR-07442KL Res= 442.0 kOhm 1 $0.01
Series= ? Power= 50.0 mW 0201 2 mm
2

Tolerance= 1.0%
U1 Texas Instruments TPS61288RQQR Switcher 1 $1.48
2
RQQ0011A-MFG 9 mm

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WEBENCH Design Report TPS61288RQQR : TPS61288RQQR 3.7V-4.2V to 6.00V @ 2A January 20, 2022 22:05:59 GMT-06:00
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WEBENCH Design

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WEBENCH Design Report TPS61288RQQR : TPS61288RQQR 3.7V-4.2V to 6.00V @ 2A January 20, 2022 22:05:59 GMT-06:00
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WEBENCH Design

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WEBENCH Design

Operating Values
# Name Value Category Description
1. Cin ESR 1.0 mOhm Capacitor Cin Capacitor ESR
2. Cin IRMS 171.727 mA Capacitor Input capacitor RMS ripple current
3. Cin Pd 29.49 µW Capacitor Input capacitor power dissipation
4. Cinx ESR 20.0 mOhm Capacitor Cin Capacitor ESR
5. Cinx IRMS 5.019 mA Capacitor Bulk capacitor RMS ripple current
6. Cinx Pd 503.82 nW Capacitor Bulk capacitor power dissipation
7. Cout ESR 1.854 mOhm Capacitor Cout Capacitor ESR
8. IC Ipk 3.636 A IC Peak switch current in IC
9. IC Pd 366.62 mW IC IC power dissipation
10. IC Tj 42.318 degC IC IC junction temperature
11. IC Tolerance 12.0 mV IC IC Feedback Tolerance
12. ICThetaJA Effective 33.6 degC/W IC Effective IC Junction-to-Ambient Thermal Resistance
13. Iin Avg 3.398 A IC Average input current
14. Ipp percentage 18.019 % Inductor Inductor ripple current percentage (with respect to average inductor
current)
15. L Ipp 612.27 mA Inductor Peak-to-peak inductor ripple current
16. L Pd 200.17 mW Inductor Inductor power dissipation
17. L1 DCR 18.0 mOhm Inductor L1 DCR
18. L1 Irms 3.335 A Inductor Inductor ripple current
19. Cin Pd 29.49 µW Power Input capacitor power dissipation
20. Cinx Pd 503.82 nW Power Bulk capacitor power dissipation
21. IC Pd 366.62 mW Power IC power dissipation
22. L Pd 200.17 mW Power Inductor power dissipation
23. Total Pd 571.894 mW Power Total Power Dissipation
24. BOM Count 13 System Total Design BOM count
Information
25. Cross Freq 18.115 kHz System Bode plot crossover frequency
Information
26. Duty Cycle 39.941 % System Duty cycle
Information
27. Efficiency 95.451 % System Steady state efficiency
Information
28. FootPrint 236.0 mm
2
System Total Foot Print Area of BOM components
Information
29. Frequency 500.0 kHz System Switching frequency
Information
30. Gain Marg -6.349 dB System Bode Plot Gain Margin
Information
31. Iout 2.0 A System Iout operating point
Information
32. Iout transient step used 1.0 A System Custom Transient current step requirement that was used for Cout
for Cout calculations Information selection (A).
33. Low Freq Gain 59.075 dB System Gain at 1Hz
Information
34. Mode CCM System Conduction Mode
Information
35. Overshoot Value 15.98 mV System Theoretical Vout Overshoot Value
Information
36. Phase Marg 59.992 deg System Bode Plot Phase Margin
Information
37. Pout 12.0 W System Total output power
Information

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WEBENCH Design

# Name Value Category Description

38. Total BOM $2.38 System Total BOM Cost
Information
39. Undershoot Value 19.78 mV System Theoretical Vout Undershoot Value
Information
40. Vin 3.7 V System Vin operating point
Information
41. Vin p-p 43.445 mV System Peak-to-peak input voltage
Information
42. Vout 6.046 V System Operational Output Voltage
Information
43. Vout Actual 6.046 V System Vout Actual calculated based on selected voltage divider resistors
Information
44. Vout Ripple 1.0 % System Custom maximum output ripple requirement that was used for Cout
requirement used for Information selection(% of Vout).
Cout calculations
45. Vout Tolerance 3.856 % System Vout Tolerance based on IC Tolerance (no load) and voltage divider
Information resistors if applicable
46. Vout p-p 53.009 mV System Peak-to-peak output ripple voltage
Information
47. Vout transient 3.0 % System Custom Transient voltage change requirement that was used for Cout
requirement used for Information selection (% of Vout).
Cout calculations

Design Inputs
Name Value Description
Iout 2.0 Maximum Output Current
VinMax 4.2 Maximum input voltage
VinMin 3.7 Minimum input voltage
Vout 6.0 Output Voltage
base_pn TPS61288 Base Product Number
source DC Input Source Type
Ta 30.0 Ambient temperature

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WEBENCH Assembly

Component Testing
Some published data on components in datasheets such as Capacitor ESR and Inductor DC resistance is based on conservative values that
will guarantee that the components always exceed the specification. For design purposes it is usually better to work with typical values. Since
this data is not always available it is a good practice to measure the Capacitance and ESR values of Cin and Cout, and the inductance and DC
resistance of L1 before assembly of the board. Any large discrepancies in values should be electrically simulated in WEBENCH to check for
instabilities and thermally simulated in WebTHERM to make sure critical temperatures are not exceeded.

Soldering Component to Board

If board assembly is done in house it is best to tack down one terminal of a component on the board then solder the other terminal. For surface
mount parts with large tabs, such as the DPAK, the tab on the back of the package should be pre-tinned with solder, then tacked into place
by one of the pins. To solder the tab town to the board place the iron down on the board while resting against the tab, heating both surfaces
simultaneously. Apply light pressure to the top of the plastic case until the solder flows around the part and the part is flush with the PCB. If the
solder is not flowing around the board you may need a higher wattage iron (generally 25W to 30W is enough).

Initial Startup of Circuit

It is best to initially power up the board by setting the input supply voltage to the lowest operating input voltage 3.7V and set the input supply's
current limit to zero. With the input supply off connect up the input supply to Vin and GND. Connect a digital volt meter and a load if needed
to set the minimum Iout of the design from Vout and GND. Turn on the input supply and slowly turn up the current limit on the input supply.
If the voltage starts to rise on the input supply continue increasing the input supply current limit while watching the output voltage. If the
current increases on the input supply, but the voltage remains near zero, then there may be a short or a component misplaced on the board.
Power down the board and visually inspect for solder bridges and recheck the diode and capacitor polarities. Once the power supply circuit is
operational then more extensive testing may include full load testing, transient load and line tests to compare with simulation results.

Load Testing
The setup is the same as the initial startup, except that an additional digital voltmeter is connected between Vin and GND, a load is connected
between Vout and GND and a current meter is connected in series between Vout and the load. The load must be able to handle at least rated
output power + 50% ( 7.5 watts for this design). Ideally the load is supplied in the form of a variable load test unit. It can also be done in the
form of suitably large power resistors. When using an oscilloscope to measure waveforms on the prototype board, the ground leads of the
oscilloscope probes should be as short as possible and the area of the loop formed by the ground lead should be kept to a minimum. This will
help reduce ground lead inductance and eliminate EMI noise that is not actually present in the circuit.

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WEBENCH Electrical Simulation Report
Design Id = 14
sim_id = 1
Simulation Type = Startup

L1 VSwit ch
4.7 µH
IInduct or18.0 m Ohm

Cbst
100.0 nF VOut
1.0 m Ohm
VIn IOut
IIn
TPS6 1 2 8 8 RQQ
U1 VIN VOUT

SW FB
SW ICout ILoad
COMP Rfbt
BST 442.0 kOhm
50.0 m W
EN
Vin IIC AGND
VCC PGND

Cout
Rcom p 47.0 µF Rload
Cin Cinx 16.5 kOhm 3.709 m Ohm
10.0 µF 100.0 nF 63.0 m W Qt y= 2
1.0 m Ohm 20.0 m Ohm Cvcc Ccom p2
2.2 µF 62.0 pF
1.0 m Ohm Rfbb
48.7 kOhm
Ccom p 63.0 m W
47.0 nF
1.0 m Ohm

VinMin = 3.7V Vout = 6.0V

VinMax = 4.2V Iout = 2.0A

Simulation Parameters
# Name Parameter Name Description Values

1. Rload R Load Resistance 3.0 Ohm

Design Assistance
1. Master key : 06F8C78CB1B660A8[v1]
2. TPS61288 Product Folder : https://www.ti.com/product/TPS61288 : contains the data sheet and other resources.

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WEBENCH Design Report TPS61288RQQR : TPS61288RQQR 3.7V-4.2V to 6.00V @ 2A January 20, 2022 22:05:59 GMT-06:00