• Full Support ▲ Limited Capability ▪ Requires more than 1 product

/ CONTENTS

STRUCTURES FLUIDS
Vibrations..................................................................................................................... 3 General Solver Capabilities .........................................................................22 Webservice..............................................................................................................34 RLCG Parasitic Extraciton............................................................................48
Wave Hydrodynamics....................................................................................... 3 Single Phase, Non-Reacting Flows.......................................................22 General.........................................................................................................................35 Electronics Cooling...........................................................................................48
Additional Physics................................................................................................. 3 Heat Transfer...........................................................................................................23 Designing Optimization and Parameter Cabel Modeling....................................................................................................49
Composite Materials .......................................................................................... 5 Particle Flows (Multiphase).........................................................................23 Identificaton (Calibration)............................................................................35 HPC for Electronics...........................................................................................49
Durability...................................................................................................................... 6 Free Surface Flows (Multiphase)............................................................ 24 Workflow Management................................................................................35 System Modeling for Power Electronics.........................................50
Explicit Dynamics.................................................................................................. 6 Dispersed Multiphase Flows (Multiphase).................................... 24 Tool Interoperability...........................................................................................35 System Modeling for RF / Microwave................................................50
Implicit Dynamics................................................................................................. 7 Reacting Flows......................................................................................................25 System Modeling for SI / PI.........................................................................50
Geometric Idealization...................................................................................... 7 Turbomachinery.................................................................................................. 26 Mulitphysics Platform Technologies....................................................51
Geometry and STL File Handling............................................................. 7 SAFETY ANALYSIS Multhiphysics Electro-Thermal Interation.......................................51
In-Flight Icing........................................................................................................ 26
HPC Structures........................................................................................................8 Functional Safety Analysis ......................................................................... 36
Optimization.......................................................................................................... 26 Materials Database for Electronics.........................................................51
Materials........................................................................................................................8 Cybersecurity Analysis .................................................................................. 36
High Rheology Material................................................................................ 27 Miscellaneous..........................................................................................................51
Miscellaneous and Usability......................................................................... 9 HPC – Fluids............................................................................................................ 27
Modeling Capabilities......................................................................................10 Pre And Post Processing.............................................................................. 27 OPTICS AND VR
Multi Analysis............................................................................................................11 PHOTONICS
Multiphysics ........................................................................................................... 28 Ansys Products Embedded........................................................................37
Nonlinear Transient Dynamics...................................................................11 Design Environment........................................................................................52
Fluid-Structure Interaction......................................................................... 28 General Solver Capabilities..........................................................................37
Optimization............................................................................................................12 General.........................................................................................................................52
Electro-Thermal Interaction...................................................................... 28 Photometry / Radiometry............................................................................37
Structural Solver Capabilties.......................................................................12 General Solver Capabilities..........................................................................52
Other Coupled Interactions....................................................................... 28 Huan Vision............................................................................................................. 38
Thermal.........................................................................................................................12 Materials Selection & Related Tools......................................................53
Ease of Use and Productivity.................................................................... 28 Wavelength Range........................................................................................... 38
Topology and Lattice Optimization.......................................................13 Optimization...........................................................................................................53
Optical Design...................................................................................................... 38
Particle Methods...................................................................................................13 Post Processing.....................................................................................................53
Optical Sensors..................................................................................................... 38
Automotive................................................................................................................13 AUTONOMOUS VEHICLE Head-Up Display................................................................................................. 39
Tool Interoperability..........................................................................................54
SIMULATION HPC - SPEOS......................................................................................................... 39
SOUND SIMULATION
Human Vision .......................................................................................................30 Simulation Preparation................................................................................. 39 DESIGN TOOLS
Headlamp Simulation....................................................................................30 Post Processing....................................................................................................40 3D Printing................................................................................................................55
Acoustics & Sound Quality ..........................................................................14
System Simulation............................................................................................30 Optimization........................................................................................................... 41 Design & Concept Modeling......................................................................55
Context Simulation...........................................................................................30 Optical Measurement Device................................................................... 41 Fluid................................................................................................................................55
ADDITIVE MANUFACTURING Rendering Engine.............................................................................................30 Measurement Capability............................................................................... 41 Interfaces and Add-Ons.................................................................................55
Additive Prep............................................................................................................15 VR....................................................................................................................................30 Use Cases................................................................................................................... 41 Materials Data for Designers and Simulation..............................55
Workbench Additive..........................................................................................15 System Simulation............................................................................................42 Multiphysics.............................................................................................................55
Additive Print.......................................................................................................... 16 Context Simulation...........................................................................................42 Structural................................................................................................................... 56
DIGITAL TWIN
Additive Science....................................................................................................17 Rendering Engine.............................................................................................42 Thermal....................................................................................................................... 56
System Simulation, Validation and
Materials Data Management.................................................................... 18 VR....................................................................................................................................42
Digital Twins ............................................................................................................31
Materials Data Analysis................................................................................... 18 Solver............................................................................................................................42
Data Flow Management............................................................................... 19 GEOMETRY
Integrations with CAD, CAE, PLM.......................................................... 19 EMBEDDED SOFTWARE General ........................................................................................................................57
Restricted Substances..................................................................................... 19 Model-Based Systems Engineering ...................................................32 ELECTRONICS
Materials Selection & Related Tools...................................................... 19 Embedded Control & HMI Software ...................................................32 Low Frequency Electromagnetics....................................................... 43
Data Library for Industry..............................................................................20 Perception Software Testing .....................................................................33 Magnetic Transient........................................................................................... 43
Teaching Resources.........................................................................................20 Advanced Magnetic Modeling................................................................ 43
Concept Design Solution for
Granta MI - Additive............................................................................................21 PLATFORM Electrical Maching.............................................................................................44
Licensing...................................................................................................................34
High Frequency Electromagnetics.....................................................44
Process Integration...........................................................................................34
Power and Signal Integrity Board
Workbench Connector..................................................................................34
Simulation Capabilities.................................................................................. 47
Post Processing....................................................................................................34 © 2021 ANSYS, Inc. All Rights Reserved.

2
 MECHANICAL MECHANICAL MECHANICAL
/ STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
VIBRATIONS
3 = Ansys DesignXplorer
Modal • • • • • 4 = Ansys SpaceClaim
Modal - Pre-Stressed • • • • 5 = Ansys Customization Suite (ACS)

Modal - Damped/UnSymmetric • • • 6 = Ansys HPC, ANSYS HPC Pack

or Ansys HPC Workgroup
Transient - Mode-Superposition • • • 7 = Ansys Granta Materials Data

• • • •
for Simulation
Harmonic - Mode-Superposition
8 = Ansys Additive Suite
Harmonic - Full • • ▲ • 9 = Ansys Composite Cure Simulation

Spectrum • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
Random Vibration • • • • 11 = Ansys SPEOS
Mistuning • • 12 = Ansys SPEOS & Ansys SPEOS for NX

Rotordynamics • • • 13 = Ansys CFD Pro - Ansys Fluent with

a reduced set of capabilities
Modal Acoustic • • • DMP = Distributed-memory parallel

Harmonic Acoustic • • SMP = Shared-memory parallel

WAVE HYDRODYNAMICS MAPDL = Mechanical APDL

Diffraction and Radiation • Explicit = Autodyn

RBD = Rigid Body Dynamics

Frequency & Time Domain Motions Analysis • Aqwa = Aqwa
Moorings, Joints & Tethers •
Load Transfer to Structural Analysis •
ADDITIONAL PHYSICS

1-D Thermal-Flow • • •
1-D Coupled-Field Circuits •
1-D Electromechanical Transducer •
MEMS ROM •
Piezoelectric •
Piezoresistive •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 3

 MECHANICAL MECHANICAL MECHANICAL
/ STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
ADDITIONAL PHYSICS
3 = Ansys DesignXplorer
Electromagnetic • 4 = Ansys SpaceClaim
Vibro-Acoustics • 5 = Ansys Customization Suite (ACS)

Electro-Migration • • 6 = Ansys HPC, ANSYS HPC Pack

or Ansys HPC Workgroup
Diffusion-Pore-Fluid • 7 = Ansys Granta Materials Data

•
for Simulation
Diffusion-Thermal-Electric-Magnetic
8 = Ansys Additive Suite
1-Way Fluid Structure Interaction ▪2
▪
2
▪2

9 = Ansys Composite Cure Simulation

2-Way Fluid-Structure Integration ▪2

10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
ICFD • 11 = Ansys SPEOS
EM - BEM (Boundary Element Method) • 12 = Ansys SPEOS & Ansys SPEOS for NX

Manufacturing Solutions • 13 = Ansys CFD Pro - Ansys Fluent with

a reduced set of capabilities
ALE • DMP = Distributed-memory parallel

Multi-scale modeling • SMP = Shared-memory parallel

CESE • MAPDL = Mechanical APDL

Thermal • Explicit = Autodyn

RBD = Rigid Body Dynamics

NVH • Aqwa = Aqwa
Acoustics - BEM •
Acoustics -SEA •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 4

 MECHANICAL MECHANICAL MECHANICAL
/ STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK

COMPOSITE MATERIALS

Material Definitions • • • •
Layers Definitions • ▲ • •
Interface Plies •
Advanced Modeling •
Features •
Variable Material Data •
Solid Extrusion •
Lay-Up Mapping •
Draping •
Lay-Up Exchange Interfaces •
Advanced Failure Criteria Library •
First-Ply Failure • •
Last-Ply failure •
Delamination • • •
Composite Cure Simulation ▪9

Honeycombs •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 5

 MECHANICAL MECHANICAL MECHANICAL
/ STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
DURABILITY

• • •
3 = Ansys DesignXplorer
Stress-Life (SN)
4 = Ansys SpaceClaim
Strain-Life (EN) • • • 5 = Ansys Customization Suite (ACS)
Dang Van ▪1
▪
1
▪1
6 = Ansys HPC, ANSYS HPC Pack

• • •
or Ansys HPC Workgroup
Safety Factor
7 = Ansys Granta Materials Data
Adhesive Bond ▪1
▪
1
▪1
for Simulation

Crack Growth Linear Fracture Mechanics ▪1

▪
1
▪1 8 = Ansys Additive Suite

▪ ▪ ▪
1 1 1 9 = Ansys Composite Cure Simulation
Seam Weld
10 = Ansys SPEOS for NX & ANSYS SPEOS
Spot Weld ▪1
▪
1
▪1
for Creo Parametric

Thermo-Mechanical Fatigue ▪1
▪
1
▪1 11 = Ansys SPEOS

▪ ▪ ▪
1 1 1 12 = Ansys SPEOS & Ansys SPEOS for NX
Vibration Fatigue
13 = Ansys CFD Pro - Ansys Fluent with
Virtual Strain Gauge Correlation ▪1
▪
1
▪1
a reduced set of capabilities

Python Scripting Customization ▪1

▪
1
▪1
▪1 DMP = Distributed-memory parallel

SMP = Shared-memory parallel

EXPLICIT DYNAMICS

• • •
MAPDL = Mechanical APDL
FE (Lagrange) Solver
Explicit = Autodyn
Euler Solvers • RBD = Rigid Body Dynamics
Meshless Solvers • • Aqwa = Aqwa

Implicit-Explicit Material States • • •

Fluid-Structure Interaction (FSI) • •
Mass Scaling • • •
Natural Fragmentation • •
Erosion Based on Multiple Criteria • •
De-Zoning • •
Part Activation and Deactivation (Multi Stage Analysis) •
Remapping in Space •
Remapping Solution Methods •
Explicit Time Integration •
• Full Support ▲ Limited Capability ▪ Requires more than 1 product 6
 MECHANICAL MECHANICAL MECHANICAL
/ STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
IMPLICIT DYNAMICS
3 = Ansys DesignXplorer
Implicit Time Integration • 4 = Ansys SpaceClaim
GEOMETRIC IDEALIZATION
5 = Ansys Customization Suite (ACS)

Spring • • 7 • • 6 = Ansys HPC, ANSYS HPC Pack

or Ansys HPC Workgroup
Mass • • • • • 7 = Ansys Granta Materials Data
Damper • • • • for Simulation

8 = Ansys Additive Suite

Spar • • • 9 = Ansys Composite Cure Simulation
Beam • • • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

• • •
for Creo Parametric
Cable
11 = Ansys SPEOS
Pipe/Elbow • • • 12 = Ansys SPEOS & Ansys SPEOS for NX
Shell - Thin • • • • • 13 = Ansys CFD Pro - Ansys Fluent with
a reduced set of capabilities
Layered Shell -Thin (Composite) • • • • DMP = Distributed-memory parallel
Shell - Thick (Solid Shell) • • • SMP = Shared-memory parallel

Layered Shell - Thick (Solid Shell) (Composite) • • • MAPDL = Mechanical APDL

2D Plane / Axisymmetric • • • • Explicit = Autodyn

3D Solids • • • • RBD = Rigid Body Dynamics

• •
Aqwa = Aqwa
Layered 3D Solids (Composite)

Infinite Domain • • • • •
2.5D Elements • •
Reinforcement Elements • • • • •
Coupled Field ROM Element Technology • • ▪
Iso-Geometric Analysis (IGA) •
GEOMETRY AND STL FILE HANDLING

SpaceClaim Direct Modeler •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 7

 MECHANICAL MECHANICAL MECHANICAL
/ STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
HPC - STRUCTURES
3 = Ansys DesignXplorer
4 (DMP or SMP)
MAPDL 4 for 4 ( DMP or 4 = Ansys SpaceClaim
4 ( DMP or
Default Number of Cores Explicit 4 for SMP) 1 1
SMP) 5 = Ansys Customization Suite (ACS)
RBD MAPDL 4
for AQWA 6 = Ansys HPC, ANSYS HPC Pack

• • • • • •
or Ansys HPC Workgroup
Parallel Solving on Local PC
7 = Ansys Granta Materials Data
Parallel Solving on Cluster • • • • • • for Simulation

MAPDL - Yes 8 = Ansys Additive Suite

GPU Acceleration
Explicit - No
RBD - No ▪ 6
▪ 6
9 = Ansys Composite Cure Simulation

AQWA - No 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
MAPDL - Yes
Parallel Solving with Ansys Cloud Launched from Desktop
Explicit - No
RBD - No
MAPDL - Yes
RBD - No
MAPDL - Yes • 11 = Ansys SPEOS

AQWA - No 12 = Ansys SPEOS & Ansys SPEOS for NX

13 = Ansys CFD Pro - Ansys Fluent with

MATERIALS a reduced set of capabilities

Basic Linear Materials (Linear, Anisotropic, Temperature

Dependent) • • • • • • DMP = Distributed-memory parallel

SMP = Shared-memory parallel

Basic Nonlinear Materials (Hyper, Plasticity, Rate Independent,
Isotropic, Concrete) • • ▲ • • MAPDL = Mechanical APDL

Advanced Nonlinear Materials (Rate dependent, Anisotropic,

Damage Models, Geomaterials, Multiphysics) • • • Explicit = Autodyn

RBD = Rigid Body Dynamics

Field Dependent • • • Aqwa = Aqwa
Reactive Materials •
Fracture Mechanics and Crack Growth • ▲
Material Designer •
Granta Materials Data for Simulation ▪ 7
▪ 7
▪ 7

Elastic •
Metals •
Plastics •
Linear visco-elasticity •
Elasto-viscoplastic •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 8

 MECHANICAL MECHANICAL MECHANICAL
/ STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK

MATERIALS

Elastomers and rubbers •

Glass models •
Foams •
Fabrics •
Kevlar material with damage •
Equations-of-state hydrodynamic models •
Acoustic pressure material/element •
Concrete & soils •
High explosives •
Propellants •
Viscous fluids •
Biomechanic material models •
Failure models •
User-defined materials •
Soil, paper/ cardboard •
MISCELLANEOUS AND USABILITY

Ansys SpaceClaim • ▪
4
▪4
▪4
▪4

Ansys Customization Suite (ACS) • ▪5

▪5

Support ACT Extensions • • • • •

Command Snippet Support • • •
Batch run capability • • • • • •
Read/Write 3rd Party Matrix CAE Data • • • •
CDB and 3rd party FE Model Import • • • •
Nastran Bulk File Export • • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 9

 MECHANICAL MECHANICAL MECHANICAL
/ STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK

MISCELLANEOUS AND USABILITY

Global/ selective mass scaling •

Keyword input •
Direct input of Nastran bulk data files •
Splitting of input file into subfiles •
User subroutines •
Re-mapping •
Transmitting boundaries •
Dynamic storage allocation •
Extensive output data controls (ascii/ binary) •
Sense switch controls - monitor simulations status •
Interactive real-time graphics •
Pre-stressing from Nastran Linear Solution' •
Double Precision •
MODELING CAPABILITIES

Lumped inertias/masses •
Beams •
Discrete Elements (DEM) •
Solid elements •
8-node thick shells •
4-node thin shells •
Triangular shells •
Membranes •
Seatbelt elements •
Sensor, accelerometer •
SPH elements •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 10

 MECHANICAL MECHANICAL MECHANICAL
•
/ STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
MODELING CAPABILITIES
3 = Ansys DesignXplorer
Contact - Linear • • • • • 4 = Ansys SpaceClaim
Contact - Nonlinear • • • • • 5 = Ansys Customization Suite (ACS)

Joints • • • • • 6 = Ansys HPC, ANSYS HPC Pack

or Ansys HPC Workgroup
Spot Welds • • • • • 7 = Ansys Granta Materials Data

• •
for Simulation
Element Birth and Death
8 = Ansys Additive Suite
Gasket Elements • 9 = Ansys Composite Cure Simulation

Rezoning and Adaptive Remeshing • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
Inverse Analysis • 11 = Ansys SPEOS

Spotwelds • 12 = Ansys SPEOS & Ansys SPEOS for NX

SPG, • 13 = Ansys CFD Pro - Ansys Fluent with

a reduced set of capabilities

Element Free Gelerkin • DMP = Distributed-memory parallel

•
SMP = Shared-memory parallel
Adaptive remeshing
MAPDL = Mechanical APDL
MULTI ANALYSIS
Explicit = Autodyn

Submodeling • • • RBD = Rigid Body Dynamics

Data Mapping • • • Aqwa = Aqwa

Multiphysics Data Mapping • • ▲

Initial State • • • •
Advanced Multi-Stage 2-D to 3-D Analysis • •
NONLINEAR TRANSIENT DYNAMICS

Rigid Body Mechanisms • •

Rigid Body Dynamics with CMS Components for Flexible Bodies •
Full Transient • • • •
CMS with Substructuring •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 11

 MECHANICAL MECHANICAL MECHANICAL
/ STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
OPTIMIZATION
DesignEplorer Included • • • ▪3
▪3 3 = Ansys DesignXplorer

• • • • •
4 = Ansys SpaceClaim
Parameters
5 = Ansys Customization Suite (ACS)
Design Point Studies • • • • • 6 = Ansys HPC, ANSYS HPC Pack
Correlation Analysis • • • • or Ansys HPC Workgroup

Design of Experiments • • • • 7 = Ansys Granta Materials Data

for Simulation

Sensitivity Analysis • • • • 8 = Ansys Additive Suite

Goal Drive Optimization • • • • 9 = Ansys Composite Cure Simulation

Six Sigma Analysis • • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
STRUCTURAL SOLVER CAPABILITIES
11 = Ansys SPEOS
Linear Static • • • • 12 = Ansys SPEOS & Ansys SPEOS for NX

Nonlinear Static • • • 13 = Ansys CFD Pro - Ansys Fluent with

a reduced set of capabilities
Pre-Stress Effect, Linear Perturbation • • • ▲ ▲ DMP = Distributed-memory parallel
Nonlinear Geometry • • • • • SMP = Shared-memory parallel
Buckling - Linear Eigenvalue • • • MAPDL = Mechanical APDL

Buckling- Nonlinear Post Buckling Behavior • • • • Explicit = Autodyn

Buckling - Nonlinear Post Buckling Behavior - Arc Length • • • RBD = Rigid Body Dynamics

Steady State Analysis Applied to a Transient Condition • Aqwa = Aqwa

Advanced Wave Loading •

THERMAL
Steady State Thermal • • •
Transient Thermal • • •
Conduction • • • • •
Convection • • •
Radiation to Space • • •
Radiation - Surface to Surface • • •
Phase Change • • • • •
Thermal Analysis of Layered Shells and Solids • • •
• Full Support ▲ Limited Capability ▪ Requires more than 1 product 12
 MECHANICAL MECHANICAL MECHANICAL
/ STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
TOPOLOGY AND LATTICE OPTIMIZATION
Structural Optimization • • • 3 = Ansys DesignXplorer

• • •
4 = Ansys SpaceClaim
Modal Optimization
5 = Ansys Customization Suite (ACS)
Thermal Loads • • • 6 = Ansys HPC, ANSYS HPC Pack
Inertial Loads • • • or Ansys HPC Workgroup

Optimized Design Validation • • • 7 = Ansys Granta Materials Data

for Simulation

Manufacturing Constraints • • • 8 = Ansys Additive Suite

Stress Constraints • • • 9 = Ansys Composite Cure Simulation

Symmetry • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric

Lattice Optimization ▪8
11 = Ansys SPEOS

Overhang/Additive Constraints ▪8
12 = Ansys SPEOS & Ansys SPEOS for NX

PARTICLE METHODS 13 = Ansys CFD Pro - Ansys Fluent with

a reduced set of capabilities
SPH elements • DMP = Distributed-memory parallel
SPG • SMP = Shared-memory parallel

CPM • MAPDL = Mechanical APDL

AUTOMOTIVE Explicit = Autodyn

Seat-belts - including modeling of accelerometer, pretensioner,

retractor, sensor, and slip ring • RBD = Rigid Body Dynamics

•
Aqwa = Aqwa
Inflator Models

Airbag Fabric Constitutive Models •

Accelerometers •
Airbag Sensors •
Airbag Breakout •
Eulerian Deployment of Airbags •
Airbag Folder •
Unfolded Reference Geometry for Airbags •
Dummy Positioner •
Side-Impact Dummy Special Damper •
Airbag Deployment •
• Full Support ▲ Limited Capability ▪ Requires more than 1 product 13
 VRXPERIENCE
/ SOUND SIMULATION SOUND 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
ACOUSTICS & SOUND QUALITY
3 = Ansys DesignXplorer
Analyze, Listen & Modify • 4 = Ansys SpaceClaim
Psychoacoustics, Automatic Detection and Separation,
Play 3D Sound • 5 = Ansys Customization Suite (ACS)

Engine Sound Design and Engine Sound Enhancement • 6 = Ansys HPC, ANSYS HPC Pack
or Ansys HPC Workgroup

Active Sound Design for Electric Vehicles • 7 = Ansys Granta Materials Data
for Simulation
3D Sound for Listening Room and VR • 8 = Ansys Additive Suite

Interactive Sound for Driving Simulator • 9 = Ansys Composite Cure Simulation

Measure Sound Perception with Listening Test • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
Listen to ANSYS Mechanical, Fluent, LSDyna ad
Motion Simulations • 11 = Ansys SPEOS

12 = Ansys SPEOS & Ansys SPEOS for NX

Generate, Filter and Mix Acoustic Measurements and
CAE Simulations • 13 = Ansys CFD Pro - Ansys Fluent with
a reduced set of capabilities

DMP = Distributed-memory parallel

SMP = Shared-memory parallel

MAPDL = Mechanical APDL

Explicit = Autodyn

RBD = Rigid Body Dynamics

Aqwa = Aqwa

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 14

 ADDITIVE ADDITIVE ADDITIVE
/ ADDITIVE MANUFACTURING PREP PRINT SUITE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
ADDITIVE PREP
3 = Ansys DesignXplorer
Define Build Envelope • ▪ • 4 = Ansys SpaceClaim
Multiple Parts • ▪ • 5 = Ansys Customization Suite (ACS)

Optimize Part Orientation Based upon Distortion Tendency,

Build Time and Supports • ▪ • 6 = Ansys HPC, ANSYS HPC Pack
or Ansys HPC Workgroup

Support Region Detection and Manual Modification • • • 7 = Ansys Granta Materials Data
for Simulation
Created Multiple Support Types in One Region • • • 8 = Ansys Additive Suite

Control of Support Parameters • • • 9 = Ansys Composite Cure Simulation

Multiple Support Types • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric

Angled Supports • ▪ • 11 = Ansys SPEOS

Perforations, Tooth Patterns, Intrusion, Sizing and Distribution

of Support Walls • ▪ • 12 = Ansys SPEOS & Ansys SPEOS for NX

13 = Ansys CFD Pro - Ansys Fluent with

Automatic Support Generation • • • a reduced set of capabilities

Export of STL and SpaceClaim Files • • • DMP = Distributed-memory parallel

SMP = Shared-memory parallel

Export of Additive Manufacturing Equipment (OEM) Build Files • • • MAPDL = Mechanical APDL
Cost Estimation • • • Explicit = Autodyn

Layer/Scan Vector Visualization • • • RBD = Rigid Body Dynamics

WORKBENCH ADDITIVE Aqwa = Aqwa

Nonlinear and Temperature Dependent Material Properties •

Thermo-Mechanical Coupled Strain Solution •
Native Mechanical Environment •
Stress-Based Automatically Generated Supports •
Part Distortion and Residual Stress after Support Removal •
Blade Crash Detection •
Identification of High Strain (Crack) Locations •
Layer by Layer Stress and Distortion Visualizations •
Option to Output Only the Last Layer of the Build or
Every Nth Layer •
• Full Support ▲ Limited Capability ▪ Requires more than 1 product 15
 ADDITIVE ADDITIVE ADDITIVE
/ ADDITIVE MANUFACTURING PREP PRINT SUITE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
WORKBENCH ADDITIVE
3 = Ansys DesignXplorer
User-Defined Step Option as 1st or Last Sequence Step • 4 = Ansys SpaceClaim
Layered Tetrahedral Meshing • 5 = Ansys Customization Suite (ACS)

Post Build Heat Treatment • 6 = Ansys HPC, ANSYS HPC Pack

or Ansys HPC Workgroup
Import of STL Supports • 7 = Ansys Granta Materials Data

•
for Simulation
Inherent Strain Isotropic and Anisotropic Released
8 = Ansys Additive Suite
Strain Scaling Factor for Thermal and Structural Analyses • 9 = Ansys Composite Cure Simulation

STL Files can be Exported from STL Supports • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
Voxel Mesh Generation • 11 = Ansys SPEOS
Wizards to Transfer Results from Additive Print to
Workbench Additive • 12 = Ansys SPEOS & Ansys SPEOS for NX

Calibration setup in AM Wizard • 13 = Ansys CFD Pro - Ansys Fluent with

a reduced set of capabilities

AM Bond Implementation • DMP = Distributed-memory parallel

Recoater interference detection and layer end temperature output • SMP = Shared-memory parallel

MAPDL = Mechanical APDL

ADDITIVE PRINT
Explicit = Autodyn
Nonlinear and Temperature Dependent Material Properties • • RBD = Rigid Body Dynamics

Uniform Assumed Isotropic Strain • • Aqwa = Aqwa

Scan Pattern Based Anisotropic Strain • •

Thermal Ratcheting Based Anisotropic Strain • •
Desktop and Cloud Stand-Alone Environments • •
Stress-Based Automatically Generated Supports • •
Part Distortion and Residual Stress (as-built) • •
Part Distortion and Residual Stress after Support Removal • •
Distortion Compensation • •
Blade Crash Detection • •
Identification of High Strain (Crack) Locations • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 16

 ADDITIVE ADDITIVE ADDITIVE
/ ADDITIVE MANUFACTURING PREP PRINT SUITE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
ADDITIVE PRINT
3 = Ansys DesignXplorer
Input Strain Hardening Factor • • 4 = Ansys SpaceClaim
Import of STL Supports • • 5 = Ansys Customization Suite (ACS)

Subvoxel Material Density Assignment • • 6 = Ansys HPC, ANSYS HPC Pack

or Ansys HPC Workgroup
Layer by Layer Stress, Distortion and Blad Crash Visualizations • • 7 = Ansys Granta Materials Data

• •
for Simulation
Build File Readers for Multiple AM Machines
8 = Ansys Additive Suite
Auto Queue Multiple Successive Simulations • • 9 = Ansys Composite Cure Simulation

Additive Print to Workbench Additive Transfer for Post Processing • • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
ADDITIVE SCIENCE
11 = Ansys SPEOS
Meltpool Dimensions • 12 = Ansys SPEOS & Ansys SPEOS for NX

Detailed Thermal History ▲ 13 = Ansys CFD Pro - Ansys Fluent with

a reduced set of capabilities
% Porosity • DMP = Distributed-memory parallel

Sensor Measurement Predictions • SMP = Shared-memory parallel

Ability for Add User-Defined Materials • MAPDL = Mechanical APDL

Material Tuning Wizard • Explicit = Autodyn

RBD = Rigid Body Dynamics

Morphology Prediction • Aqwa = Aqwa
Microstructure Prediction •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 17

 GRANTA MI GRANTA MI GRANTA GRANTA OR MATERIALS
/ MATERIALS GRANTA MI ENTERPRISE PRO SELECTOR CES EDUPACK DATA FOR
SIMULATION
1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
MATERIALS DATA MANAGEMENT

• •
Granta MI Database - "Gold Source" System to Store Corporate 3 = Ansys DesignXplorer
Materials Information
4 = Ansys SpaceClaim
Manage Specialist Materials Data Types • • 5 = Ansys Customization Suite (ACS)

Manage Meta-Data and Context for Materials • 6 = Ansys HPC, ANSYS HPC Pack
or Ansys HPC Workgroup
Traceability for All Materials Data • • 7 = Ansys Granta Materials Data
Access Control • ▲ for Simulation

Version Control • 8 = Ansys Additive Suite

• • • • •
9 = Ansys Composite Cure Simulation
Multiple Unit System Support
10 = Ansys SPEOS for NX & ANSYS SPEOS
Admin UI to Setup and Configure Database • for Creo Parametric

Template Data Structures for Key Materials Use Cases: Metals,

•
11 = Ansys SPEOS
Composites, AM, Restricted Substances
12 = Ansys SPEOS & Ansys SPEOS for NX
Toolbox for Import, Export, Manipulation of Materials Data • ▲ 13 = Ansys CFD Pro - Ansys Fluent with
Web App for Fast Upload of Materials Data • • a reduced set of capabilities

• • • •
DMP = Distributed-memory parallel
Browse Materials Data
SMP = Shared-memory parallel
Edit and Update Materials Data • • ▲ ▲ MAPDL = Mechanical APDL
Search and Query Materials Data • • • • Explicit = Autodyn
Represent Property Data in Interactive Charts • ▲ • • RBD = Rigid Body Dynamics

Comparison Tables and Comparison Charts • ▲ • • Aqwa = Aqwa

Generate Reports on Selected Materials Records •

Export Data to Excel and Third Party Software • ▲ • •
Personalize System Homepages and User Profiles •
Configure Web App UI for Specific User Groups •
MATERIALS DATA ANALYSIS
Interactive Plotting of Data: Scatter, Contour, Error Bar, Surface,
Plotyy, Semilogx, Semilogy, Loglog •
Custom Curve Fitting •
Cross-Table Comparisons of Materials Data •
Scripting Toolkit for Python •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 18

 GRANTA MI GRANTA MI GRANTA GRANTA OR MATERIALS
/ MATERIALS GRANTA MI ENTERPRISE PRO SELECTOR CES EDUPACK DATA FOR
SIMULATION
1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
DATA FLOW MANAGEMENT
Design and develop material data flow • 3 = Ansys DesignXplorer

•
4 = Ansys SpaceClaim
Execute material data flows - Processes, Approvals, Notifications
5 = Ansys Customization Suite (ACS)
INTEGRATION WITH CAD, CAE, PLM

• • ▲ ▲
6 = Ansys HPC, ANSYS HPC Pack
Ansys Workbench or Ansys HPC Workgroup

Abaqus • 7 = Ansys Granta Materials Data

for Simulation
ANSA • 8 = Ansys Additive Suite

HyperMesh • • 9 = Ansys Composite Cure Simulation

Creo • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
NX • • 11 = Ansys SPEOS
Windchill • 12 = Ansys SPEOS & Ansys SPEOS for NX

Teamcenter • 13 = Ansys CFD Pro - Ansys Fluent with

a reduced set of capabilities
File Export (CATIA v5, SOLIDWORKS, and others) • ▲ ▲ ▲ DMP = Distributed-memory parallel
RESTRICTED SUBSTANCES
SMP = Shared-memory parallel
Data Structures to Support Restricted Substance Analytics,
Store Specs, Materials, Legislations, Substances, Parts • MAPDL = Mechanical APDL

Report on Restricted Substance Risk for Materils and

Process Portfolio • Explicit = Autodyn

RBD = Rigid Body Dynamics

Build and Edit Bills of Materials within a Web App • Aqwa = Aqwa
At-a-Glance Restricted Substance Complaince for a BoM ▲
Run Reports Across Multiple BoMs ▲
Integrate Restricted Substance Reporting with PLM, CAD ▲
MATERIALS SELECTION & RELATED TOOLS
Reference Data for Materials Selection on PC/Laptop • •
Interactive 'Ashby Charts' of Materials Property Space ▲ • •
Systematic Materials Selection Methodology • •
Filter Materials Based on Property Profile • • • •
Flilter Materials Based on Links to Other Materials /
Processes / Objects ▲ • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 19

 GRANTA MI GRANTA MI GRANTA GRANTA OR MATERIALS
/ MATERIALS GRANTA MI ENTERPRISE PRO SELECTOR CES EDUPACK DATA FOR
SIMULATION
1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
MATERIALS SELECTION & RELATED TOOLS
Materials Substitution and Equivalency - 'Find Similar' • • 3 = Ansys DesignXplorer

• •
4 = Ansys SpaceClaim
Performance Index Finder
5 = Ansys Customization Suite (ACS)
Engineering Solver - Convert Engineering Requirements
to Materials Properties • • 6 = Ansys HPC, ANSYS HPC Pack
or Ansys HPC Workgroup
Synthesizer - Predict Properties of Hybrid Materials • • 7 = Ansys Granta Materials Data
Part Cost Estimator • • for Simulation

Selection Reports and Export of Charts for Presentations • • 8 = Ansys Additive Suite

• •
9 = Ansys Composite Cure Simulation
Eco Audit for a Product or Conceptual Design
10 = Ansys SPEOS for NX & ANSYS SPEOS
Early stage batter pack design, configuration and performance
evaluation - incl. battery cells database • • for Creo Parametric

11 = Ansys SPEOS
DATA LIBRARY FOR INDUSTRY
12 = Ansys SPEOS & Ansys SPEOS for NX
Core MaterialUniverse™ Data • • 13 = Ansys CFD Pro - Ansys Fluent with
Core JAHM Curve Data • • a reduced set of capabilities

MI Pro Simulation Data • DMP = Distributed-memory parallel

▪ ▪
SMP = Shared-memory parallel
Advanced Metals Data
MAPDL = Mechanical APDL
Advanced Polymers Data ▪ ▪ Explicit = Autodyn
Advanced Composites Data ▪ ▪ RBD = Rigid Body Dynamics
Advanced Medical Data ▪ ▪ Aqwa = Aqwa

Advanced Aero Data ▪ ▪

Advanced ESDU Aero Alloys ▪ ▪
Advanced Additive Manufacturing Data ▪ ▪
Advanced Eco Design ▪ ▪
TEACHING RESOURCES
Granta EduPack Level 1-3 Teaching Databases •
The Elements Teaching Database •
Materials Science and Engineering Teaching Database •
Sustainability Teaching Database •
Bioengineering Teaching Database •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 20

 GRANTA MI GRANTA MI GRANTA GRANTA OR MATERIALS
/ MATERIALS GRANTA MI ENTERPRISE PRO SELECTOR CES EDUPACK DATA FOR
SIMULATION
1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
TEACHING RESOURCES
3 = Ansys DesignXplorer
Architecture Teaching Database • 4 = Ansys SpaceClaim
Lecture units • 5 = Ansys Customization Suite (ACS)

Student exercises • 6 = Ansys HPC, ANSYS HPC Pack

or Ansys HPC Workgroup
Videos • 7 = Ansys Granta Materials Data

•
for Simulation
Mciro-Projects
8 = Ansys Additive Suite
White Papers • 9 = Ansys Composite Cure Simulation

Case Studies • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
Active Learning Toolkits • 11 = Ansys SPEOS
Data Booklets • 12 = Ansys SPEOS & Ansys SPEOS for NX

Sample Project Files • 13 = Ansys CFD Pro - Ansys Fluent with

a reduced set of capabilities
Phase Diagram Tool • DMP = Distributed-memory parallel

Medical Devices Teaching Database • SMP = Shared-memory parallel

Design Teaching Database • MAPDL = Mechanical APDL

Explicit = Autodyn
GRANTA MI - ADDITIVE
RBD = Rigid Body Dynamics
Traceability and Capture of Additive Manufacturing Data • Aqwa = Aqwa
AM Data Analytics •
Integration with CAD CAE and PLM Systems •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 21

 / FLUIDS FLUENT*13 FLUENT CFX CHEMKIN-PRO FORTE POLYFLOW FENSAP-ICE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
GENERAL SOLVER CAPABILITIES
3 = Ansys DesignXplorer
Comprehensive Inlet and Outlet Conditions • • • • • • • 4 = Ansys SpaceClaim
Steady-State Flow • • • • • • • 5 = Ansys Customization Suite (ACS)
Transient Flow • • • • • • 6 = Ansys HPC, ANSYS HPC Pack

• • ▲ ▲ ▲ • •
or Ansys HPC Workgroup
2-D and 3-D Flow
7 = Ansys Granta Materials Data
Reduced Order Models (ROM) • • for Simulation

Time Dependent Boundary Conditions • • • • • • 8 = Ansys Additive Suite

• • • • • • •
9 = Ansys Composite Cure Simulation
Customizable Materials Library
10 = Ansys SPEOS for NX & ANSYS SPEOS
Granta Materials Data for Simulation ▪7
▪
7 for Creo Parametric

Fan Model • • • • 11 = Ansys SPEOS

Periodic Domains • • • • • • 12 = Ansys SPEOS & Ansys SPEOS for NX

• • ▲ •
13 = Ansys CFD Pro - Ansys Fluent with
Flow-Drive Solid Motion (6DOF) a reduced set of capabilities

Presuure-Based Coupled Solver • • • • • • • DMP = Distributed-memory parallel

Density-Based Coupled Solver • • • SMP = Shared-memory parallel

Dymanic/Moving-Deforming Mesh • • • • • MAPDL = Mechanical APDL

•
Explicit = Autodyn
Oveset Mesh
RBD = Rigid Body Dynamics
Immersed-Soild/MST Method for Moving Parts • • • Aqwa = Aqwa
Automatic On-the-fly Mesh Generation with Dynamic Refinement • • •
Dynamic Solution-Adaptive Mesh Refinement • • • • ▲
Polyhedral Unstructured Solution-Adpative Mesh Refinement •
SINGLE PHASE, NON-REACTING FLOWS
Incompressible Flow • • • • •
Compressible Flow • • • • • •
Porous Media • • • ▲ • ▲
Non-Newtoniam Viscosity • • • •
Turbulence -Isotropic • • • • • •
Turbulence - Anisotropic (RSM) • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 22

 / FLUIDS FLUENT*13 FLUENT CFX CHEMKIN-PRO FORTE POLYFLOW FENSAP-ICE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
SINGLE PHASE, NON-REACTING FLOWS
3 = Ansys DesignXplorer
Turbulence - Unsteady (LES/SAS/DES) • • • 4 = Ansys SpaceClaim
Turbulence - Laminar/Turbulent Transition • • • • 5 = Ansys Customization Suite (ACS)
Flow Pathlines (Massless) • • • • 6 = Ansys HPC, ANSYS HPC Pack

• • •
or Ansys HPC Workgroup
Acoustics (Source Expert)
7 = Ansys Granta Materials Data
Acoustics (Noise Prediction) • ▲ for Simulation

HEAT TRANSFER 8 = Ansys Additive Suite

Natural Convection • • • • • • 9 = Ansys Composite Cure Simulation

• • • • •
10 = Ansys SPEOS for NX & ANSYS SPEOS
Conduction & Conjugate Heat Transfer for Creo Parametric

Shell Conduction (inlcuding Multi-Layer Model) • 11 = Ansys SPEOS

Internal Radiation - Participating Media • • • • • 12 = Ansys SPEOS & Ansys SPEOS for NX

Internal Radiation - Transparent Media • • • • 13 = Ansys CFD Pro - Ansys Fluent with
a reduced set of capabilities

External Radiation • • DMP = Distributed-memory parallel

Solare Radiation & Load • • SMP = Shared-memory parallel

Simplified Heat Exchange Model • MAPDL = Mechanical APDL

Non- Equilibrium Thermal Model • Explicit = Autodyn

• •
RBD = Rigid Body Dynamics
Porous Media
Aqwa = Aqwa
PARTICLES FLOWS (MULTIPHASE)
Coupled Discrete Phase Modeling including Thin Wall Films • • ▲ • •
Macroscopic Particle Model •
Inert Particle Tracking (with Mass) • •
Liquid Droplet (including Evaporation) • • ▲ • •
Combusting Particles • • • • •
Multicomponent Droplets • • ▲ • •
Discrete Element Model (DEM) • •
Break-Up and Coalescence • • ▲ • •
Erosion • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 23

 / FLUIDS FLUENT*13 FLUENT CFX CHEMKIN-PRO FORTE POLYFLOW FENSAP-ICE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
FREE SURFACE FLOWS (MULTIPHASE)
3 = Ansys DesignXplorer
Implicit VOF • • • 4 = Ansys SpaceClaim
Explicit VOF • • • 5 = Ansys Customization Suite (ACS)
Coupled Level Set/VOF • • • 6 = Ansys HPC, ANSYS HPC Pack
or Ansys HPC Workgroup
Complex Multiphase Regime Transitions (AIAD and
GENTOP Model) • 7 = Ansys Granta Materials Data

•
for Simulation
VOF to DPM Spray Model
8 = Ansys Additive Suite
DPM to VOF Model • 9 = Ansys Composite Cure Simulation

Open Channel Flow and Wave • • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
Surface Tension • • • • 11 = Ansys SPEOS
Phase Change • • • • 12 = Ansys SPEOS & Ansys SPEOS for NX
Cavitation • • • • 13 = Ansys CFD Pro - Ansys Fluent with
a reduced set of capabilities
Cavitation Where Mulitple Fluids and Non-Condensing
Gases are Present • DMP = Distributed-memory parallel

DISPERSED MULTIPHASE FLOWS (MULTIPHASE) SMP = Shared-memory parallel

Mixture Fraction • • MAPDL = Mechanical APDL

Eulerian Model including Thin Wall Films • • • • Explicit = Autodyn

Boiling Model • • ▲ • RBD = Rigid Body Dynamics

Surface Tension • • • Aqwa = Aqwa

Phase Change • • ▲ •
Drag and Lift • • •
Wall Lubrication • • •
Heat and Mass Transfer • • • •
Population Balance • • • •
Reactions Between Phases • • • •
Granular Model for Dense Bed of Solids • •
Dense Particulate Coupling (DDPM) • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 24

 / FLUIDS FLUENT*13 FLUENT CFX CHEMKIN-PRO FORTE POLYFLOW FENSAP-ICE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
REACTING FLOWS
3 = Ansys DesignXplorer
Species Transport • • • • • 4 = Ansys SpaceClaim
Non-Premixed Combustion • • • • 5 = Ansys Customization Suite (ACS)
Premixed Combustion • • • • 6 = Ansys HPC, ANSYS HPC Pack

• • • •
or Ansys HPC Workgroup
Partially Premixed Combustion
7 = Ansys Granta Materials Data
Composition PDF Transport • • for Simulation

Finite Rate Chemistry • • • • • 8 = Ansys Additive Suite

• • • •
9 = Ansys Composite Cure Simulation
Polluntants and Soot Modelig
10 = Ansys SPEOS for NX & ANSYS SPEOS
Sparse Chemistry Solver with Dynamic Cell Clustering and
Dynamic Adaptive Chemistry • • • for Creo Parametric

11 = Ansys SPEOS
Ability to Use Model Fuel Library Mechansisms • • • 12 = Ansys SPEOS & Ansys SPEOS for NX
Flame-speed from Fuel-Component Library • • • 13 = Ansys CFD Pro - Ansys Fluent with

• •
a reduced set of capabilities
DPIK Spark-Ignition Model
DMP = Distributed-memory parallel
Flame-Propogation Using Level-Set Method (G-Equation) • • SMP = Shared-memory parallel
Internal Combustion Engine Specific Solution • • • MAPDL = Mechanical APDL
0-D/1-D/2-D Reactor Models and Reactor Networks • Explicit = Autodyn

Plasma Reactions • RBD = Rigid Body Dynamics

Comprehensive Surface-Kinetics • • Aqwa = Aqwa

Chemical and Phase Equilibrium • •

Flamelet Table Generation • •
Flamespeed and Ignition Table Generation •
Reaction Sensitivity, Uncertainty and Path Analysis •
Surrogate Blend Formulation and Optimization •
Mechanism Reduction •
Detailed Electrochemistry Model for Li-ion Batteries • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 25

 / FLUIDS FLUENT*13 FLUENT CFX CHEMKIN-PRO FORTE POLYFLOW FENSAP-ICE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
TURBOMACHINERY
3 = Ansys DesignXplorer
MRF/Frozen-Rotor • • • 4 = Ansys SpaceClaim
Sliding-Mesh/Stage • • 5 = Ansys Customization Suite (ACS)
Transient Blade Row • 6 = Ansys HPC, ANSYS HPC Pack

•
or Ansys HPC Workgroup
Pitch Change
7 = Ansys Granta Materials Data
Time Transformation • for Simulation

Fourier Transformation • 8 = Ansys Additive Suite

•
9 = Ansys Composite Cure Simulation
Harmonic Analysis
10 = Ansys SPEOS for NX & ANSYS SPEOS
Blade Flutter Analysis • for Creo Parametric

Performance Maps • 11 = Ansys SPEOS

12 = Ansys SPEOS & Ansys SPEOS for NX

IN-FLIGHT ICING
Simulation of Standard Droplets, SLD and Ice Crystals • • 13 = Ansys CFD Pro - Ansys Fluent with
a reduced set of capabilities

Inclusion of Vapor/Humidity Effects on Icing • • DMP = Distributed-memory parallel

Icing Environments of Appendices C, O (SLD) and D (Ice Crystals) • • SMP = Shared-memory parallel

Various Pre-Defined Droplet Size Distributions • • MAPDL = Mechanical APDL

Simulation of Rime, Glaze and Mixed Icing • • Explicit = Autodyn

RBD = Rigid Body Dynamics

Single and Multi-Shot Icing Simulations with Mesh Deformation
for Prediction of Ice Accredtion and Aerodynamic Performance • • Aqwa = Aqwa
Degradation
Single and Multi-Shot Icing Simulations with Automatic Re-Mesh-
ing for Prediction of Ice Accredtion and Aerodynamic Performance •
Degradation

Conjugate Heat Transfer (CHT) for Anti and De-Icing Simulations ▪ ▲

Ice Cracking •
Ice Shedding •
OPTIMIZATION
Parameters • • • • •
Design Point Studies • • • •
Correlation Analysis • • •
Design of Experiments • • •
• Full Support ▲ Limited Capability ▪ Requires more than 1 product 26
 / FLUIDS FLUENT*13 FLUENT CFX CHEMKIN-PRO FORTE POLYFLOW FENSAP-ICE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
OPTIMIZATION
3 = Ansys DesignXplorer
Sensitivity Analysis • • • • 4 = Ansys SpaceClaim
Goal Drive Optimization • • • 5 = Ansys Customization Suite (ACS)
Six Sigma Analysis • • • 6 = Ansys HPC, ANSYS HPC Pack

•
or Ansys HPC Workgroup
Adjoint Solver for Shape Optimization
7 = Ansys Granta Materials Data
Adjoint Solver Supports Rotating Reference Frames
and Conjugate Heat Transfer • for Simulation

8 = Ansys Additive Suite

Mulit-Objective Constrained Optimization • 9 = Ansys Composite Cure Simulation

Mesh Morphing (RBF Morph) 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
HIGH RHEOLOGY MATERIAL
11 = Ansys SPEOS
Viscoelasticity • 12 = Ansys SPEOS & Ansys SPEOS for NX
Specialty Extrusion Models • 13 = Ansys CFD Pro - Ansys Fluent with
Specialty Blow Molding Models • a reduced set of capabilities

•
DMP = Distributed-memory parallel
Speciality Fiber Spinning Models
SMP = Shared-memory parallel
HPC - FLUIDS
MAPDL = Mechanical APDL
Parallel Solving on Local PC Option • • • • • • • • Explicit = Autodyn
Parallel Solving over Network Option • • • • • • • • RBD = Rigid Body Dynamics
Parallel Solving over Cloud launched from Desktop • Aqwa = Aqwa

GPU Support • •
Parallet Mesh Generation •
PRE AND POST PROCESSING
Photo Realistic Rendering • • • • • • •
SpaceClaim Direct Modeler • • • • • •
Compare Multiple Runs, Datasets, Physics, Graphs in
a Single Window • • • • • •
Simulation Reports • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 27

 / FLUIDS FLUENT*13 FLUENT CFX CHEMKIN-PRO FORTE POLYFLOW FENSAP-ICE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
MULTIPHYSICS
Advanced, Automated Data Exchange • • • • 3 = Ansys DesignXplorer

• • •
4 = Ansys SpaceClaim
Accurate Data Interpolation between Dissimilar Meshes
5 = Ansys Customization Suite (ACS)
Drag-n-Drop Multiphysics • • • 6 = Ansys HPC, ANSYS HPC Pack
Direct Coupling between Physics • • or Ansys HPC Workgroup

Collaborative Workflows • • 7 = Ansys Granta Materials Data

for Simulation

Fully Managed Co-Simulation • • 8 = Ansys Additive Suite

Flexiable Solver Coupling Options • • • 9 = Ansys Composite Cure Simulation

Functional Mock Up Unit (FMU) Coupling • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
FLUID-STRUCTURE INTERACTION
11 = Ansys SPEOS
Force Induced Motion/Deformation ▪ ▪ 12 = Ansys SPEOS & Ansys SPEOS for NX

Fluid Thermal Deformation ▪ ▪ • 13 = Ansys CFD Pro - Ansys Fluent with

a reduced set of capabilities
Intrinsic FSI • • DMP = Distributed-memory parallel
Thermo-elasticity • SMP = Shared-memory parallel
ELECTRO-THERMAL INTERACTION
MAPDL = Mechanical APDL
Convection Cooled Electronics • • Explicit = Autodyn

Conduction Cooled Electronics • • RBD = Rigid Body Dynamics

Hihg Frequency Thermal Management • • Aqwa = Aqwa

Electromechanical Thermal Management • •

OTHER COUPLED INTERACTIONS
Aero-Vibro Acoustics •
Acoustic-Structural • •
Fluid Magnetohydrodynamics • •
EASE OF USE AND PRODUCTIVITY
Support ACT Simulation Apps •
Mosaic-Enabled Meshing Technology • •
Task-Based Workflow - Watertight Geometries • •
Task-Based Workflow - Fault Tolerant Geometries •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 28

 / FLUIDS FLUENT*13 FLUENT CFX CHEMKIN-PRO FORTE POLYFLOW FENSAP-ICE 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
EASE OF USE AND PRODUCTIVITY
Directly Enter Expressions • • • 3 = Ansys DesignXplorer

•
4 = Ansys SpaceClaim
Parallel Solving with Ansys Cloud Launched from Desktop
5 = Ansys Customization Suite (ACS)
Parallel Solving with Ansys Cloud Launched from VDI • • • 6 = Ansys HPC, ANSYS HPC Pack
or Ansys HPC Workgroup

7 = Ansys Granta Materials Data

for Simulation

8 = Ansys Additive Suite

9 = Ansys Composite Cure Simulation

10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric

11 = Ansys SPEOS

12 = Ansys SPEOS & Ansys SPEOS for NX

13 = Ansys CFD Pro - Ansys Fluent with

a reduced set of capabilities

DMP = Distributed-memory parallel

SMP = Shared-memory parallel

MAPDL = Mechanical APDL

Explicit = Autodyn

RBD = Rigid Body Dynamics

Aqwa = Aqwa

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 29

 VRXPERIENCE Driving VRXPERIENCE VRXPERIENCE
/ AUTONOMOUS VEHICLE SIMULATION Simulator powered
by SCANeR Sensors Headlamp 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
HUMAN VISION
Glare Simulation • 3 = Ansys DesignXplorer

4 = Ansys SpaceClaim
HEADLAMP SIMULATION
Virtual Measurement • 5 = Ansys Customization Suite (ACS)

•
6 = Ansys HPC, ANSYS HPC Pack
Lamp Control or Ansys HPC Workgroup

IIHS Test • 7 = Ansys Granta Materials Data

for Simulation
SYSTEM SIMULATION
8 = Ansys Additive Suite
Ground-Truth Sensor • 9 = Ansys Composite Cure Simulation

Camera Sensor ▲ • 10 = Ansys SPEOS for NX & ANSYS SPEOS

▲ •
for Creo Parametric
LiDAR Sensor
11 = Ansys SPEOS
Radar Sensor ▲ • 12 = Ansys SPEOS & Ansys SPEOS for NX
HUD ▲ 13 = Ansys CFD Pro - Ansys Fluent with

Advanced Lighting Component • a reduced set of capabilities

DMP = Distributed-memory parallel

CONTEXT SIMULATION

• •
SMP = Shared-memory parallel
Basic Driving Scenario
MAPDL = Mechanical APDL
Advanced Driving Scenario • ▪ ▪ Explicit = Autodyn
Advanced Vehicle Dynamic • ▪ ▪ RBD = Rigid Body Dynamics
Environement Creation • • ▲ Aqwa = Aqwa

MiL/SiL Connectivity • ▪ •
HiL Connectivity • ▪ ▪
RENDERING ENGINE
Real-Time Physics-Based Lighting • •
VR
HMD •
CAVE, Powerwall •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 30

 / DIGITAL TWIN TWIN BUILDER 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
SYSTEM SIMULATION, VALIDATION AND DIGITAL TWINS
Integrated Graphical Modeling Environment • 3 = Ansys DesignXplorer

•
4 = Ansys SpaceClaim
Standard Modeling Languages and Exchange Formats
5 = Ansys Customization Suite (ACS)
Mulit-domain Systems Modeler • 6 = Ansys HPC, ANSYS HPC Pack
Extensive 0D Application-Specific Libraries • or Ansys HPC Workgroup

3rd Party Tool Integrations • 7 = Ansys Granta Materials Data

for Simulation

3D ROM • 8 = Ansys Additive Suite

Embedded Software Integration • 9 = Ansys Composite Cure Simulation

Mulit-Domain System Simulation • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
Rapid HMI Prorotyping • 11 = Ansys SPEOS

System Optimization • 12 = Ansys SPEOS & Ansys SPEOS for NX

XIL Integration • 13 = Ansys CFD Pro - Ansys Fluent with

a reduced set of capabilities
IIOT Connectivity • DMP = Distributed-memory parallel
Digital Twin Runtime Deployment • SMP = Shared-memory parallel

MAPDL = Mechanical APDL

Explicit = Autodyn

RBD = Rigid Body Dynamics

Aqwa = Aqwa

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 31

 SCADE SCADE SCADE SCADE SCADE SCADE SCADE
/ EMBEDDED SOFTWARE Architect Suite Display Vision Test Lifecycle for A661
Applications
1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
MODEL-BASED SYSTEMS ENGINEERING
3 = Ansys DesignXplorer
Systems Requirements Analysis ▲ ▲ 4 = Ansys SpaceClaim
System & Software Architecture Design ▲ • 5 = Ansys Customization Suite (ACS)

SysML Models Import • • 6 = Ansys HPC, ANSYS HPC Pack

or Ansys HPC Workgroup
Collaborative Work through Libraries and Model Synchronizations • • 7 = Ansys Granta Materials Data

• •
for Simulation
Model Checks
8 = Ansys Additive Suite
Model Diff/Merge • • 9 = Ansys Composite Cure Simulation

System/Software Bi-Directional Sync • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
Model Sharing and IP Protection • • 11 = Ansys SPEOS
Model-Based Interface Control Document Production • • 12 = Ansys SPEOS & Ansys SPEOS for NX

Configurable for Industry Standards (IMA, AUTOSAR, etc.) • • 13 = Ansys CFD Pro - Ansys Fluent with
a reduced set of capabilities
Product Configuration for Automotive Developers • • DMP = Distributed-memory parallel

EMBEDDED CONTROL & HMI SOFTWARE SMP = Shared-memory parallel

Traceability with Requirement Management Tools • • • • • • MAPDL = Mechanical APDL

Automatic Document Generation • • • • • • Explicit = Autodyn

• •
RBD = Rigid Body Dynamics
Data Flow and State Machine Design and Simulation Capabilities
Aqwa = Aqwa
Extensive Set of Libraries • • • •
Record and Playback Scenarios • • •
Plant Model co-Simulation including FMI • • • •
On Host and on Target Testing • • •
Model and Code Structural Coverage • • •
Formal Verification •
Timing and Stack Optimization •
Worst Case Execution Time Estimates on Target •
Integration with Real-Time Operating Systems •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 32

 SCADE SCADE SCADE SCADE SCADE SCADE SCADE
/ EMBEDDED SOFTWARE Architect Suite Display Vision Test Lifecycle for A661
Applications
1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
EMBEDDED CONTROL & HMI SOFTWARE
3 = Ansys DesignXplorer
Certified Code Generation for DO-178C, EN 50128, ISO26262,
IEC 61508 • • 4 = Ansys SpaceClaim

Certification Kits for DO-178C, EN50128, ISO 26262, IEC 61508 • • • • • 5 = Ansys Customization Suite (ACS)

Model-Based Prototyping and Specification of HMIs • • 6 = Ansys HPC, ANSYS HPC Pack
or Ansys HPC Workgroup

Support of OpenGL, OpenGL SC and OpenGL ES • • 7 = Ansys Granta Materials Data

for Simulation
Font Management • • 8 = Ansys Additive Suite

Optimization of Graphical Specifications • 9 = Ansys Composite Cure Simulation

Solutions for ARINC 661 • • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric

PERCEPTION SOFTWARE TESTING 11 = Ansys SPEOS

Preception Software Robustness Testing • 12 = Ansys SPEOS & Ansys SPEOS for NX

Triggering Conditions Identification • 13 = Ansys CFD Pro - Ansys Fluent with

a reduced set of capabilities

Automatic Safety Report Generation • DMP = Distributed-memory parallel

SMP = Shared-memory parallel

MAPDL = Mechanical APDL

Explicit = Autodyn

RBD = Rigid Body Dynamics

Aqwa = Aqwa

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 33

 Ansys
/ PLATFORM Ansys Cloud optiSLang Minerva 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
LICENSING
3 = Ansys DesignXplorer
Support of HPC solver licenses • 4 = Ansys SpaceClaim
Elastic Licensing • 5 = Ansys Customization Suite (ACS)

PROCESS INTEGRATION 6 = Ansys HPC, ANSYS HPC Pack

or Ansys HPC Workgroup
DPS connector • 7 = Ansys Granta Materials Data

•
for Simulation
AEDT node: Simulation data purge options
8 = Ansys Additive Suite
AEDT node: Remote simulation using scheduler submission option • 9 = Ansys Composite Cure Simulation

AEDT node: Support of post-processing variables • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
ANSYS Workbench Node: Reuse of project data • 11 = Ansys SPEOS

WORKBENCH CONNECTOR 12 = Ansys SPEOS & Ansys SPEOS for NX

Data Receive to External Data • 13 = Ansys CFD Pro - Ansys Fluent with
a reduced set of capabilities
Extract and reuse of DX data in optiSLang components • DMP = Distributed-memory parallel

POST PROCESSING SMP = Shared-memory parallel

Fitting of discrete distributions • MAPDL = Mechanical APDL

CSVImportWizard • Explicit = Autodyn

Residual plot: Fitting Residuals • RBD = Rigid Body Dynamics

design comparison plot • Aqwa = Aqwa

Reliability input importance plot for adaptive sampling •

Design set 'All archive designs' for new NOA-EA •
Cloud-based 3D results visualization •
WEBSERVICE
Basic web-based postprocessing •
Download and/or preview project and node result files •
Install as a service on Windows platforms and a daemon
on Linux platforms •
PyOWA wizard

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 34

 Ansys
/ PLATFORM Ansys Cloud optiSLang Minerva 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
GENERAL
3 = Ansys DesignXplorer
Added node status overview table for displaying and
altering status per node/designs • 4 = Ansys SpaceClaim

Import/export designs of Json format • 5 = Ansys Customization Suite (ACS)

Python-API documentation: examples and descriptions • 6 = Ansys HPC, ANSYS HPC Pack
or Ansys HPC Workgroup

DESIGN OPTIMIZATION AND PARAMETER IDENTIFICATION (CALIBRATION) 7 = Ansys Granta Materials Data
for Simulation
AMOP: multi-objective refinement • 8 = Ansys Additive Suite

AMOP: Convergence criteria for single-objective refinement • 9 = Ansys Composite Cure Simulation

Nature inspired optimization algorithm • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric

Evolution Strategy with Covariance Matrix Adaptation • 11 = Ansys SPEOS

Simulation Process and Data Management • 12 = Ansys SPEOS & Ansys SPEOS for NX

Hybrid Deployment and Simulations Apps • 13 = Ansys CFD Pro - Ansys Fluent with
a reduced set of capabilities

Interoperability • DMP = Distributed-memory parallel

Multiphysics Process Intergration and Robust Design • SMP = Shared-memory parallel

•
MAPDL = Mechanical APDL
Integration with Ansys GRANTA MI Materials Data Management
Explicit = Autodyn
WORKFLOW MANAGEMENT
RBD = Rigid Body Dynamics

Completely secure workflows • Aqwa = Aqwa

Job Monitoring •
TOOL INTEROPERABILITY

Ability to submit HPC jobs from desktop apps to Ansys Cloud • •

Supported running Ansys Cloud In browser interactively • •
Improved submission in AEDT •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 35

 medini medini analyze for medini analyze for
/ SAFETY ANALYSIS analyze Semiconductors Cybersecurity 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
FUNCTIONAL SAFETY ANALYSIS
3 = Ansys DesignXplorer
Safety Concept Modeling • • 4 = Ansys SpaceClaim
Model Based Safety Analysis • • 5 = Ansys Customization Suite (ACS)

Reliability Prediction and Analysis • • 6 = Ansys HPC, ANSYS HPC Pack

or Ansys HPC Workgroup
Traceability and Validation Teamwork • • 7 = Ansys Granta Materials Data

• •
for Simulation
Integration into Engineering Environment
8 = Ansys Additive Suite
Customization and Process Adaption • • 9 = Ansys Composite Cure Simulation

Ansys Product Integration • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
Reporting and Documentation • • 11 = Ansys SPEOS
Safety of Intended Functional Analysis • • 12 = Ansys SPEOS & Ansys SPEOS for NX

CYBERSECURITY ANALYSIS 13 = Ansys CFD Pro - Ansys Fluent with

a reduced set of capabilities
Analysis Contect Establishment and Asset Identification • DMP = Distributed-memory parallel

Systems Vulnerability Analysis • SMP = Shared-memory parallel

Threat Identification • MAPDL = Mechanical APDL

Attack Trees, Attack Path Calculation and Attack Collections • Explicit = Autodyn

RBD = Rigid Body Dynamics

Threat Assessment and Treatment • Aqwa = Aqwa
Requirement Analysis and Management •
Rich Traceability •
Teamwork and Integrated Task Management •
Reporting and Customization •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 36

 SPEOS
SPEOS SPEOS SPEOS HUD SPEOS FAR VRXPERIENCE VRXPERIENCE VRXPERIENCE
/ OPTICS AND VR SPEOS
PRO
SPEOS
PREMIUM
SPEOS
ENTERPRISE OPTICAL PART
DESIGN
OPTICAL
SENSOR TEST
DESIGN AND
ANALYSIS
INFARED
EXTENSION
OPTICAL
DESIGN OMD PRO OMD
PREMIUM
OMD
ENTERPRISE PERCEIVED
QUALITY
LIGHT
SIMULATION HMI
OPTIMIZER

ANSYS PRODUCTS EMBEDDED

Ansys SpaceClaim Direct Modeler • • •

Ansys SpaceClaim Catia V5 Interface • • •
Ansys DesignXplorer • • •
Ansys License Manager • • •
GENERAL SOLVER CAPABILITIES

Monte-Carlo Forward Ray Tracing • • •

Monte-Carlo Backward Ray Tracing • •
Deterministic Simulation ▲ • •
Spectral Propagation • • •
Dispersion • • •
Surface Diffusion • • •
Volumic Diffusion • • •
Ambiant Material • • •
SPEOS Live Preview (GPU Acceleration) •11
•11

Virtual BSDF •10

PHOTOMETRY / RADIOMETRY

Intensity • • •
Illuminance • • •
3D Illuminance • • •
Luminance ▲ • •
3D Energy Density • •
360 View - Observer • •
360 View - Immersive • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 37

 SPEOS
SPEOS SPEOS SPEOS HUD SPEOS FAR VRXPERIENCE VRXPERIENCE VRXPERIENCE
/ OPTICS AND VR SPEOS
PRO
SPEOS
PREMIUM
SPEOS
ENTERPRISE OPTICAL PART
DESIGN
OPTICAL
SENSOR TEST
DESIGN AND
ANALYSIS
INFARED
EXTENSION
OPTICAL
DESIGN OMD PRO OMD
PREMIUM
OMD
ENTERPRISE PERCEIVED
QUALITY
LIGHT
SIMULATION HMI
OPTIMIZER

HUMAN VISION

Dynamic Adaption •
Glare Simulation •
HDR10 Screen Support •
High Dynamic Range Screen Support •
WAVELENGTH RANGE

Visible (360nm - 830nm) • • •

UV (100nm - 360 nm) • •
Near IR (830nm - 2.5um) • •
Far Infra-Red (2.5um - 100um) •
OPTICAL DESIGN

Parabolic Surface • 12
• 12
•12

TIR Lens • 12
• 12
•12

Projection Lens • 12
• 12
•12

Optical Lens •
Optical Surface •
Light Guide •
Sharp Cut-Off Reflector •
Poly-Ellipsoidal Surface •
Micro Optical Stripes •
Freeform Lens •11

Honeycomb Lens •
OPTICAL SENSORS

Field of View •
Export Sensor Grid as Geometry •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 38

 SPEOS
SPEOS SPEOS SPEOS HUD SPEOS FAR VRXPERIENCE VRXPERIENCE VRXPERIENCE
/ OPTICS AND VR SPEOS
PRO
SPEOS
PREMIUM
SPEOS
ENTERPRISE OPTICAL PART
DESIGN
OPTICAL
SENSOR TEST
DESIGN AND
ANALYSIS
INFARED
EXTENSION
OPTICAL
DESIGN OMD PRO OMD
PREMIUM
OMD
ENTERPRISE PERCEIVED
QUALITY
LIGHT
SIMULATION HMI
OPTIMIZER

OPTICAL SENSORS

Camera Sensor •
Camera Raw Signal Export •
Camera Sensor Post Processing •
SPEOS Lens System Importer (ZEMAX OpticStudio) •
LiDAR Sensor •
LiDAR Rotating & Scanning •
LIDAR Raw Time of Flight generation •
HEAD-UP DISPLAY

HUD Optical Analysis •

HUD Optical Design •
HUD Visualisation •
HPC-SPEOS

Default Number of Cores 4 4 4

Parallel Solving on Local PC • • •

Parallel Solving on Cluster • • •
Parallel Solving with Ansys Cloud Launched from Desktop • • •
Ansys RSM Compatibility • • •
SIMULATION PREPARATION

Source Group • • •
Geometry Group • • •
Local Meshing • • •
3D Textures • •
Polarisation Plate • •
Fluorescent Converter • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 39

 SPEOS
SPEOS SPEOS SPEOS HUD SPEOS FAR VRXPERIENCE VRXPERIENCE VRXPERIENCE
/ OPTICS AND VR SPEOS
PRO
SPEOS
PREMIUM
SPEOS
ENTERPRISE OPTICAL PART
DESIGN
OPTICAL
SENSOR TEST
DESIGN AND
ANALYSIS
INFARED
EXTENSION
OPTICAL
DESIGN OMD PRO OMD
PREMIUM
OMD
ENTERPRISE PERCEIVED
QUALITY
LIGHT
SIMULATION HMI
OPTIMIZER

SIMULATION PREPARATION
Texture Mapping (Bamp, Multi-Layer) • •
Uniform Ambiant Source • • •
HDRI Source • • •
CIE Sky Source • •
Natural Light Source • •
Near Infrared Extended Ambient Source • •
Thermic Source •
Earth Atmosphere Model ▪
POST PROCESSING
Virtual Lighting Controller • •
Photometric Numerical Certification • • •
Colorimetric Analysis • • •
Spectral Analysis • •
Light Expert • • •
Layer by Source • •
Layer by Face • •
Layer by Sequence • •
Stray Light Analysis • •
Layer by Polarisation • •
Visibility and Legilbility •
Night Vision Goggle •
Script Automation • • •
Interpolation Enhancement ▲ • •
SPEOS Labs • • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 40

 SPEOS
SPEOS SPEOS SPEOS HUD SPEOS FAR VRXPERIENCE VRXPERIENCE VRXPERIENCE
/ OPTICS AND VR SPEOS
PRO
SPEOS
PREMIUM
SPEOS
ENTERPRISE OPTICAL PART
DESIGN
OPTICAL
SENSOR TEST
DESIGN AND
ANALYSIS
INFARED
EXTENSION
OPTICAL
DESIGN OMD PRO OMD
PREMIUM
OMD
ENTERPRISE PERCEIVED
QUALITY
LIGHT
SIMULATION HMI
OPTIMIZER

OPTIMIZATION
Parameters • • •
Design of Experiment •3
•3
•3

Design Optimisation •3
•3
•3
•10

Ansys optiSLang Interface (12) ▪ ▪ ▪

OPTICAL MEASUREMENT DEVICE INCLUDED
OMS2 Hardware •
OMS4 Hardware • •
Portable OMD Software •
Laboratory OMD Software • •
MEASUREMENT CAPABILITY
BRDF • • •
BTDF • •
380 - 725nm •
380 - 1000nm •
Roughness (Unpolished) • •
Volume Absorption • •
Volume Diffusion • •
Anisotropic Measurement • •
Target Dynamic Range 10^6 10^8 10^8

Angular Optical Resolution (FWHM) 0.5 0.1 0.1 (or 0.5)

White LED Light Sources •

Laser Light Source • •
Broadband Visible White Source •
USE CASES
Light Modelling and Photometrical Simulations • •
Visual Ergonomics and Style Studies • • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 41

 SPEOS
SPEOS SPEOS SPEOS HUD SPEOS FAR VRXPERIENCE VRXPERIENCE VRXPERIENCE
/ OPTICS AND VR SPEOS
PRO
SPEOS
PREMIUM
SPEOS
ENTERPRISE OPTICAL PART
DESIGN
OPTICAL
SENSOR TEST
DESIGN AND
ANALYSIS
INFARED
EXTENSION
OPTICAL
DESIGN OMD PRO OMD
PREMIUM
OMD
ENTERPRISE PERCEIVED
QUALITY
LIGHT
SIMULATION HMI
OPTIMIZER

SYSTEM SIMULATION
Virtual Display Prototype •
Display software in the Loop (SCADE) •
HUD • •
Advanced Lighting Component • •
CONTEXT SIMULATION
Basic Driving Scenario ▲ ▲
Advanced Driving Scenario ▪
Advanced Vehicle Dynamic ▪
Environement Creation • ▲ •
Trigger & Animation • •
MiL/SiL Connectivity •
Virtual Display & Actuators Interaction •
RENDERING ENGINE
Real-Time Physics-Based Lighting • • •
Advanced Raytraced Lighting • •
Full Physics GPU Lighting •
VR
HMD • •
CAVE, Powerwall • •
Finger Tracking •
SOLVER
Tolerance Variation Engine •
1 = Ansys nCode DesignLife Products 6 = Ansys HPC, ANSYS HPC Pack 10 = Ansys SPEOS for NX & ANSYS SPEOS DMP = Distributed-memory parallel
or Ansys HPC Workgroup for Creo Parametric
2 = Ansys Fluent SMP = Shared-memory parallel
7 = Ansys Granta Materials Data 11 = Ansys SPEOS
3 = Ansys DesignXplorer for Simulation MAPDL = Mechanical APDL
12 = Ansys SPEOS & Ansys SPEOS for NX
4 = Ansys SpaceClaim 8 = Ansys Additive Suite Explicit = Autodyn
13 = Ansys CFD Pro - Ansys Fluent with a
5 = Ansys Customization Suite (ACS) 9 = Ansys Composite Cure Simulation reduced set of capabilities RBD = Rigid Body Dynamics

Aqwa = Aqwa

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 42

 Electronics Electronics
/ ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

LOW FREQUENCY ELECTROMAGNETICS

Electrostatics • • •
AC Conduction • • •
DC Conduction • • •
Magnetostatics • • •
Adaptive Field Mesh • • •
AC Harmonic Magnetic • • •
Electric Transient • • •
MAGNETIC TRANSIENT

Translational Motion • • •
Fully Automatic Symmetrical Mesh Generation • • •
Rotational Motion • • •
Non-Cylindrical Motion • • •
Advanced Embedded Circuit Coupling • • •
Circuit Coupling with Adaptive Time Stepping • • •
Direct and Iterative Matrix Solvers • • •
ADVANCED MAGNETIC MODELING
Vector Hysteresis Modeling • • •
Hysteresis Modeling for Anisotropic Material • • •
Frequency Dependent Reduced Order Models • • •
Reduced Order Model Extraction (Linear-Motion,
Rotational-Motion, No- Motion) • • •
Functional Magnetization Direction • • •
Magnetization/De- Magnetization Modeling • • •
Manufacturing Dependent Core L Loss Models • • •
Noise – Vibration Modeling ▪ ▪ ▪
Temperature Dependent De- Magnetization Modeling • • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 43

 Electronics Electronics
/ ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

ADVANCED MAGNETIC MODELING

Temperature Dependent Core Loss Computation • • •

Lamination Modeling • • •
Magnetostriction and Magnetoelastic Modeling • • •
Hardware in the Loop Modeling • • •
Integrated Motor Synthesis and Design Kit • • •
Integrated Planar Magnetics Synthesis and Design Kit • • •
Litz Wire Modeling • • •
CONCEPT DESIGN SOLUTION FOR ELECTRICAL MACHINE
Template-Based Magnetic Topologies •
Template-Based Cooling Topologies •
Magnetic 2D FEA with Analytical Solution •
Thermal 2D FEA •
3D Thermal and Fluid Network •
Temperature Dependent Duty-Cycle Analysis •
Manufacturing Effects Due to Winding Impregnation and
Housing Interfaces •
Linear Structural 2D FEA •
Electrothermal Reduced Order Model (FMU) •
HIGH FREQUENCY ELECTROMAGNETICS
Fully Automated Adaptive Mesh Refinement • •
Multi-Frequency Broadband Adaptive Meshing • •
Frequency Domain Finite Element (FEM) Analysis • •
Frequency Domain Integral Equation (MoM) Analysis • •
Time Domain FEM Analysis • •
FEM Eigenmode Analysis • •
MoM Characteristic Mode Analysis • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 44

 Electronics Electronics
/ ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

HIGH FREQUENCY ELECTROMAGNETICS

Physical Optics (PO) Analysis • •
Shooting and Bouncing Ray+ (SBR+) Analysis • •
Physical Theory of Diffraction (PTD) Correction for SBR • •
Uniform Theory of Diffraction (UTD) Correction for SBR • •
Visual Ray Tracing for SBR+ Analysis • •
SBR+ Creeping Wave Correction for RCS of Curved Obects • •
Range Doppler Plots for Radar Scenario Analyses •
Accelerated Doppler Processing (ADP) for SBR+ Range Doppler
Analyses •
Domain Decomposition Method (DDM) for Frequency Domain
FEM Analysis • •
Hybrid Finite Element/ Integral Equation Analysis • •
UI Coupled Finite Element and/or IE with SBR+ Analysis • •
Modal Wave Port Excitation • •
Terminal Wave Port Excitations • •
Lumped, Voltage and Current Excitations • •
Circuit Port Excitations • •
Parametric Antenna Excitations for SBR+ • •
Floquet Excitations • •
Incident Wave Excitation • •
Magnetic Ferrite Bias Excitation • •
Perfect Electric and Magnetic Boundary • •
Finite Conductivity Boundary • •
Lumped RLC Boundary • •
Symmetry Boundary • •
Periodic Boundary • •
Frequency Dependant Materials • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 45

 Electronics Electronics
/ ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

HIGH FREQUENCY ELECTROMAGNETICS

Spatial XYZ Material Properties Via Dataset • •
Higher and Mixed Order Elements • •
Curvilinear Element Mesh Correction • •
S,Y,Z Matrix Results • •
E, H, J, P Field Results • •
Direct and Iterative Matrix Solvers • •
Antenna Parameter Calculation • •
Infinite and Finite Antenna Array Calculations • •
Radar Cross Section Calculation • •
FSS, EBG and Metamaterial Calculation • •
Specific Absorption Rate Calculation • •
EMI/EMC Calculation • •
System Level EMI and RFI Analysis • • •
Linear Circuit Analysis with EM Dynamic link • •
Integrated Antenna Synthesis and Design Kit • •
5G SAR Standards Toolkit • •
Power Density and CDF • •
Radar Prep/Post Simulation Wizards • •
3D Component Libraries with User Controled Parametrics • •
3D Component with Encryption Creation • •
3D Component with Encryption Utilization • •
Mutlipaction Solver • •
Accelerated Doppler Processing (ADP) for SBR+
Range-Doppler Analysis •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 46

 Electronics Electronics
/ ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

POWER AND SIGNAL INTEGRITY BOARD SIMULATION CAPABILITIES

Electronics Desktop 3D Layout GUI • • • •
ECAD Translation (Altium, Cadence, Mentor, Pulsonix, & Zuken) • • • • •
MCAD (.sat) Generation from ECAD • • •
Lead Frame Editor • • •
DC Voltage, Current and Power Analysis for PKG/PCB • •
DC Joule Heating with Ansys Icepak • • • •
Passive Excitation Plane Resonance Analysis • •
Driven Excitation Plane Resonance Analysis • •
Automated Decoupling Analysis • •
Capacitor Loop Inductance Analysis • •
AC SYZ Analysis • •
Dynamically Linked Electromagnetic Field Solvers • •
Chip, Package, PCB Analysis (CPM) • • •
Near-Field EMI Analysis •
Far-Field EMI Analysis •
EMI/EMC Full Board Scan •
Characteristic Impedance (Zo) L PKG/PCB Scan •
Full PCB/PKG Cross-Talk Scanning • •
TDR Wizard •
TDR Analysis • • • • •
Transient IBIS Circuit Analysis • • •
Signal Net Analyzer •
SerDes IBIS-AMI Circuit Analysis •
Macro-Modeling (Network Data Explorer) • • • • •
Steady State AC (LNA) Analysis • •
Virtual Compliance - DDRx, GDDRx, & LPDDRx •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 47

 Electronics Electronics
/ ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

POWER AND SIGNAL INTEGRITY BOARD SIMULATION CAPABILITIES

SPISIM Com and USB-C Compliance •
SPISIM IBIS AMI Generation •
Synopsys HSPICE Integration • •
Cadence PSPICE Support • •
Electromagnetically Circuit Driven Field Solvers • • •
RLCG PARASITIC EXTRACTION
DCRL, ACRL & CG Solver • • •
IC Packaging RLCG IBIS Extraction for Signals & Power • •
Touchpanel RLCG Unit Cell Extraction • •
Adaptive Meshing for Accurate Extraction • • •
Bus Bar RLCG Extraction • • • •
Power Inverter & Converter Component Extraction • •
3D Component Library • •
Reduced RLCG Matrix Operations • •
SPICE Equivalent Modeling Export • • •
DCRL & ACRL Joule Heating Analysis with Icepak • •
Macro-Modeling (Network Data Explorer) • •
2D Cable Modeling Toolkit • •
ELECTRONICS COOLING
Multi-Mode Heat Transfer • •
Steady-State and Transient • •
CFD Analysis • •
Turbulent Heat Transfer • •
Multiple-Fluid Analysis • •
Species Transport • •
Solar Loading • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 48

 Electronics Electronics
/ ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

ELECTRONICS COOLING
Reduced Order Flow and Thermal • •
Network Modeling ▪ ▪ ▪ ▪ • •
Joule Heating Analysis • •
Thermo-Electric Cooler Modeling • •
Thermostat Modeling • •
Package Characterization • •
CABLE MODELING
Finite Difference Time Domain Analysis •
Multi-Conductor Transmission Line Analysis • • • • • • • •
Two-Way Coupling FDTD and Transmission Line Solver ▲ • ▲
Twisted Conductors •
Seam Impedance •
Cable Junctions •
Braided Shield Support •
Pin Voltage, Current Density, Plane Wave Excitations •
Multi-Conductor and Multi-Shield Support • •
Uses SpaceClaim Design Modeler UI •
Thin Surface and Thin Wire Algorithms •
HPC FOR ELECTRONICS
GPU Support ▪ ▪ •
HPC Accelerated Frequency Sweeps • • • •
HPC Distributed Hybrid Solving • •
HPC Enabled Domain Decomposition Method • • •
HPC Time Decomposition Method • • •
HPC Enabled Multi-port Excitation Acceleration • •
HPC Acceleration for DCRL, ACRL and CG • •
HPC Enabled Parallel Processing • • • • • •
• Full Support ▲ Limited Capability ▪ Requires more than 1 product 49
 Electronics Electronics
/ ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

SYSTEM MODELING FOR POWER ELECTRONICS

Circuit Simulation • • • • • • •
Block Diagram Simulation • • • • • • •
State Machine Simulation • • • • • • •
VHDL-AMS Simulation • • • • • • •
Integrated Graphical Modeling Environment • • • • • • •
Power Electronics Component Libraries • • • • • • •
Reduced Order Modeling • • • • • • •
Power Electronic Device and Module Characterization • • • • • • •
Co-Simulation with Low Frequency Electromagnetics • • •
Co-Simulation with MathWorks Simulink • • • • • • •
SYSTEM MODELING FOR RF / MICROWAVE
Radio Frequency Interference (RFI) System Solver • • •
Electromagnetic Interference System Solver • • •
RF Link Budget Analysis • • •
RF Co-Site and Antenna Coexistence Analysis • • •
Automated Diagnostics for Rapid Root-Cause Analysis • • •
RF Component Library • • •
Wireless Propagation Models • • •
Multi-Fidelity Parametric Radio Models • • •
SYSTEM MODELING FOR SI/PI
SerDes Channel Modeling - IBIS-AMI, QuickEye and VerifEye •
Multi-Drop & Parallel Bus Modeling - IBIS, HSPICE, Spectre,
PSPICE, and Nexxim Transient ▲ • •
Network Data Exploration • • • • •
TDR analysis • • •
Steady State AC (LNA) Analysis • • •
Virtual Compliance - DDRx, GDDRx, & LPDDRx •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 50

 Electronics Electronics
/ ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Pro 2D Enterprise

MULTIPHYSICS-PLATFORM TECHNOLOGIES
Advanced, Automated Data Exchange • • • • • •
Drag-n-Drop Multiphysics • • • • • •
Direct Coupling Between Physics • • • • • •
Collaborative Workflows • • • • • •
Fully Managed Co-Simulation • • • • • •
Flexible Solver Coupling Options • • • • • •
MULTIPHYSICS ELECTRO-THERMAL INTERACTION
Convection Cooled Electronics • • •
Conduction Cooled Electronics • • •
High Frequency Thermal Management • • • •
Electromechanical Thermal Management • • • •
MATERIALS DATABASE FOR ELECTRONICS
GRANTA Materials Data for Simulation ▪ ▪ ▪ ▪ ▪
MISCELLANEOUS
Integrated Windows HPC Support • • • • •
Integrated IBM Spectrum LSF Support • • • • •
Customizable 3rd Party Scheduler Support • • • • •
Support ACT Extensions ▲ ▲ ▲ ▲ ▲ ▲
Parallel Solving with Ansys Cloud Launched from Desktop • • • • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 51

 CML Interconn Verilog-A
/ PHOTONICS Charge Compliler DGTD FDTD FEEM Heat ect MODE MQW STACK Platform

DESIGN ENVIRONMENT
Finite Element IDE (with 2D/3D modeling) • • • •
Finite Difference IDE (with 2D/3D modeling) • • •
Hierarchical Schematic Editor •
GENERAL
HPC-ready / compatible with cloud providers • •
PIC Element Library •
Supports CML development and distribution • •
Automated CML generation •
Version controlled CMLs •
Structured input with template and data validation •
Automated test case generation •
IP protected CMLs •
INTERCONNECT and Verilog-A models from single source • •
Leverage build-in analysis from 3rd party EDA tools •
Design and model using Verilog-A in 3rd party EDA tools •
GENERAL SOLVER CAPABILITIES
Charge transport (electrostatic potential and drift diffusion) •
Self-consistent heat/charge modeling • •
Heat transport (heat flux, convention, and radiation) •
Finite Element Eigenmode Solver •
Discontinuous Galerkin Time Domain Solver •
Finite Different Time Domain solver

Bidirectional eigenmode expansion •

varFDTD •
Advanced conformal meshing • •
Quantum mechanical band structure calc. (kp method) •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 52

 CML Interconn Verilog-A
/ PHOTONICS Charge Compliler DGTD FDTD FEEM Heat ect MODE MQW STACK Platform

GENERAL SOLVER CAPABILITIES

Waveguide and band diagram calculation •
Gain and spontanious emission calculation •
Temperature, strain, and field effects •
Analytic solver for rapid multilayer thin-film analysis •
Planewave and dipole illumination •
Capture Interface and microcavity effects •
Circuit frequency domain analysis •
Circuit transient mode simulator •
Circuit transient block mode simulator •
Circuilt multi-mode and multi-channel support •
Circuit mixed signal representation •
Laser library with TWLM solver •
System library for optical fibre related applications •
MATERIALS SELECTION & RELATED TOOLS
Comprehensive Material Models • • • • • • •
Multi-coefficient models • •
Non-linearity and Anisotropy modeling •
OPTIMIZATION
Inverse Design with lumopt •
Particle Swarm • • • • • • •
POST PROCESSING
Far-Field Projection •
Band Structure Analysis •
Bidirectional Scattering Distribution Function •
Q-Factor Analysis •
Charge Generation Rate •
Bend Loss Analysis •
• Full Support ▲ Limited Capability ▪ Requires more than 1 product 53
 CML Interconn Verilog-A
/ PHOTONICS Charge Compliler DGTD FDTD FEEM Heat ect MODE MQW STACK Platform

POSTPROCESSING
Overlap analysis •
Model area analysis •
Helical waveguides •
Extract key parametes to TWLM solver (INTERCONNECT) •
Parameter sweeps •
Statistical Support (MC and Corner analysis) • • • • • • • •
TOOL INTEROPERABILITY
Multiphysics Solver Interoperabilty • • • • •
Automation API (Lumerical script/Matlab/Python) • • • • • • • •
Circuit electronic photonic co-simulation (3rd party tools) • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 54

 / DESIGN TOOLS SpaceClaim DesignModeler Discovery 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
3D PRINTING
Import, Repair, Edit Faceted Data • • 3 = Ansys DesignXplorer

• •
4 = Ansys SpaceClaim
Shelling and Infills
5 = Ansys Customization Suite (ACS)
Thickness Detection • • 6 = Ansys HPC, ANSYS HPC Pack
DESIGN & CONCEPT MODELING or Ansys HPC Workgroup

Part/Assembly Creation or Import • • 7 = Ansys Granta Materials Data

for Simulation

Large Assembly Import • • • 8 = Ansys Additive Suite

FLUID 9 = Ansys Composite Cure Simulation

Steady-state Flow • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
Transient Flow • 11 = Ansys SPEOS
Incompressible Flow • 12 = Ansys SPEOS & Ansys SPEOS for NX

Compressible Flow ▲ 13 = Ansys CFD Pro - Ansys Fluent with

a reduced set of capabilities
INTERFACES AND ADD-ONS
DMP = Distributed-memory parallel
Simulation Transfer to Mechanical • SMP = Shared-memory parallel
Simulation Transfer to Fluent • MAPDL = Mechanical APDL
Workbench Plugin • • Explicit = Autodyn

Algoryx Momentum • RBD = Rigid Body Dynamics

MATERIALS DATA FOR DESIGNERS AND SIMULATION Aqwa = Aqwa

Materials Data for Simulation ▪

MULTIPHYSICS
Conjugate Heat Transfer ▪
Thermal-Stress •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 55

 / DESIGN TOOLS SpaceClaim DesignModeler Discovery 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent
STRUCTURAL
Static Structural Analysis • 3 = Ansys DesignXplorer

•
4 = Ansys SpaceClaim
Modal Analysis
5 = Ansys Customization Suite (ACS)
Pre-Stressed Modal Analysis ▪ 6 = Ansys HPC, ANSYS HPC Pack
Point Masses • or Ansys HPC Workgroup

Nonlinear Contact and Joints ▪ 7 = Ansys Granta Materials Data

for Simulation

Pre-Tension Bolts ▪ 8 = Ansys Additive Suite

Large Deformation ▪ 9 = Ansys Composite Cure Simulation

Topology Optimization • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric

THERMAL 11 = Ansys SPEOS

Steady-state Thermal • 12 = Ansys SPEOS & Ansys SPEOS for NX

Transient Thermal • 13 = Ansys CFD Pro - Ansys Fluent with

a reduced set of capabilities
Conduction • DMP = Distributed-memory parallel
Convection • SMP = Shared-memory parallel

MAPDL = Mechanical APDL

Explicit = Autodyn

RBD = Rigid Body Dynamics

Aqwa = Aqwa

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 56

 / GEOMETRY SpaceClaim DesignModeler Discovery 1 = Ansys nCode DesignLife Products

2 = Ansys Fluent

Direct Modeling Technology • • 3 = Ansys DesignXplorer

•
4 = Ansys SpaceClaim
Feature Based Modeling Technology
5 = Ansys Customization Suite (ACS)
Open Data from All Major CAD Systems • • • 6 = Ansys HPC, ANSYS HPC Pack
Export Data to Neutral File Formats • • • or Ansys HPC Workgroup

Modify Imported Geometry • • • 7 = Ansys Granta Materials Data

for Simulation

Defeaturing and Simplification Tools • • • 8 = Ansys Additive Suite

Model Repair • • • 9 = Ansys Composite Cure Simulation

Add Parameters for Deisgn Exploration • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric

Extract Mid-Surfaces/Shells and Beams • • 11 = Ansys SPEOS

Extract Volumes and Create Inner Fluid Domains • • • 12 = Ansys SPEOS & Ansys SPEOS for NX

Extract Outer Air Enclosures • • • 13 = Ansys CFD Pro - Ansys Fluent with
a reduced set of capabilities
Shared Topology for Conformal Meshing • • DMP = Distributed-memory parallel

Booleans and Slicing • • • SMP = Shared-memory parallel

Create Weid Bodies • • MAPDL = Mechanical APDL

Boundary Condition Mapping • • Explicit = Autodyn

Scripting • • ▲ RBD = Rigid Body Dynamics

Sketching and Editing Tools • • • Aqwa = Aqwa

3D Comparison Tools •
Repair and Edit Faceted Data • •
Icepak Integration • •
Reverse Engineering Faceted Data •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 57