Lighting Datasheet RGBW SPF05F0B (ANSI) R1.1

Product Data Sheet
Superior Efficacy & Lumen output with Small Form Factor
SPF05F0B
S1C0-4758400000-00000000-00001
RoHS
Product Brief
Description Features and Benefits
• The Z-Power series is designed for high • Super high Flux output and high Luminance
flux output applications with high current
operation capability. • Designed for high current operation
• SMT solderable
• It incorporates state of the art SMD
design and low thermal resistant • Lead Free product
material.
• RoHS compliant
• The Z Power LED is ideal light sources
for directional lighting applications such
as Spot Lights, various outdoor
Key Applications
applications and high performance
torches .
• Architectural Lighting
• Stage Lighting
• Exterior Lighting
Rev1.2, Sep. 2019 www.seoulsemicon.com

Product Data Sheet
Table of Contents
Index
• Product Brief 1
• Table of Contents 2
• Performance Characteristics 3
• Characteristics Graph 4
• Color Bin Structure 9
• Mechanical Dimensions 10
• Reflow Soldering Characteristics 12
• Emitter Tape & Reel Packaging 13
• Packaging Information 15
• Product Nomenclature 16
• Handling of Silicone Resin for LEDs 17
• Precaution For Use 18
• Company Information 21
Rev1.2, Sep. 2019 2 www.seoulsemicon.com

Product Data Sheet
Performance Characteristics
Table 1. Electro-Optical characteristics at 1000mA (Tj=25℃, RH30%)

Value
Parameter Symbol Unit
Min. Typ. Max.
Red Luminous Flux [1]

ФV - 122 - lm
Green Luminous Flux [1]

ФV - 216 - lm
White Luminous Flux [1]

ФV - 302 - lm
[1]
Blue Radiant Power - 1321 - mW
Red : 632
Peak Wavelength Λp Green : 518
Blue : 449
Red Dominant Wavelength Λd 620 625 632 nm
Green Dominant Wavelength Λd 519 525 531 nm
Blue Dominant Wavelength Λd 449 453 458 nm

x : 0.31,
White CIE - - -
y : 0.32
Red : 19
Full Width at Half Maximum Δλ Green : 36
Blue : 20
[3]
Forward Voltage (Red) 1.85 2.59 2.80
Forward Voltage (Green) [3] 3.00 3.74 4.10

VF V
[3]
Forward Voltage (Blue) 3.40 3.80 4.20
Forward Voltage (White) [3] 3.40 3.79 4.20
View Angle 2Θ ½ 120 deg.
Table 2. Characteristics
Value
Parameter Symbol Unit
Min. Typ. Max.
Forward Current IF - - 2500 mA
Junction Temperature Tj - - 125 ºC
Storage Temperature Tstg - 10 - 85 ºC
Thermal resistance (J to S) [3] RθJ-S - 1.4 - K/W
ESD Sensitivity(HBM) [4] Class 2 JEDEC JS-001-2017
Notes :
(1) SSC maintains a tolerance of 7% on power measurements.

(2) Tolerance is 0.06V on forward voltage measurements
(3) RθJ-S is tested at 1000mA.
(3) The zener diode is included to protect the product from ESD.

Product Data Sheet
Characteristics Graph
Color Spectrum (IF=1000mA, Tj=25℃, RH30%)
1.0
Relative Spectral Power Distribution
Red
Green
0.8 Blue
White
0.6
0.4
0.2
0.0
300 400 500 600 700 800
Wavelength [nm]
Forward Voltage vs. Forward Current, Tj=25℃
5.0
4.5
4.0
Forward Voltage[V]
3.5
3.0
Red
2.5 Green
Blue
2.0 White
0.0 0.5 1.0 1.5 2.0 2.5

Forward Current[A]

Product Data Sheet
Forward Current vs. Normalized Relative Luminous Flux, Tj=25℃
2.5
2.0
Relative Output [x100%]
1.5
1.0
Red
0.5 Green
Blue
White
0.0
0.0 0.5 1.0 1.5 2.0 2.5

Forward Current [A]
Forward Current vs Dominant Wavelength, Tj=25℃
700
600
Dominant Wavelength [nm]
500
400
300
Red
Green
200
Blue
White
100
0.0 0.5 1.0 1.5 2.0 2.5

Forward Current [A]

Product Data Sheet
Forward Current vs ΔCIE, Tj=25℃ (White)
0.03
0.02
0.01
0.00
 CIE
-0.01
CIE_x
-0.02
CIE_y
-0.03
0.0 0.5 1.0 1.5 2.0 2.5
Forward Current [A]

Product Data Sheet
Junction Temperature vs. Relative Light Output at IF=1000mA
1.0
0.9
Relative Output[x100%]
0.8
0.7
0.6
Red
Green
0.5
Blue
White
0.4
25 50 75 100 125
o
Junction Temperature[ C]
Junction Temperature vs. Forward Voltage at IF=1000mA

0.0
Relative Forward Voltage [V]
-0.2
-0.4
-0.6
Red
Green
-0.8 Blue
White
-1.0
40 60 80 100 120
o

Product Data Sheet
Junction Temperature vs. Dominant Wavelength at IF=1000mA
700
600
Dominant Wavelength [nm]
500
400
300
Red
200 Green
Blue
White
100
20 40 60 80 100 120 140

o
Junction Temperature vs. White ΔCIE at IF=1000mA

0.01
0.00
-0.01
 CIE
-0.02
CIE_x
CIE_y
-0.03
-0.04
25 50 75 100 125
o

Product Data Sheet
Color Bin Structure
Table 3. Bin Code Description
Brightness IF = 1000mA
Color Bin Flux [lm] Radiant Power [mW]
RA 90 ~ 115 -
Red
RB 115 ~ 140 -
GA 140 ~ 180 -
Green GB 180 ~ 230 -
GC 230 ~ 280 -
BA - 1,000 ~ 1,150
Blue BB - 1,150 ~ 1,300
BC - 1,300 ~ 1,500
WA 180 ~ 230 -
White WB 230 ~ 280 -
WC 280 ~ 355 -
Wavelength IF = 1000mA
Dominant Wavelength
Color Bin
[nm]
G1 519 ~ 525
Green
G2 525 ~ 531
B1 449 ~ 453
Blue
B2 453 ~458
CIE IF = 1000mA 0.36
Color CIE_x CIE_y 0.35
0.3217 0.3558 0.34
AA 0.3292 0.3418 0.33

AA
CIE_y
(White) 0.3081 0.2990 0.32
0.2995 0.3132 0.31
0.30
0.29
0.295 0.300 0.305 0.310 0.315 0.320 0.325 0.330
CIE_x

Product Data Sheet
Mechanical Dimensions
0.4 0.4
4.68 0.1
0.77 0.87
0.75
0.1
G(-) G(+) W(-) W(+)
0.4
White Green
5.75
3.25
4.85 4.48
Red Blue
A B B A
0.4
B(+) B(-) R(+) R(-)
0.75
4.2
TOP BOTTOM
1.21
0.51
4.8
SIDE
(1) All dimensions are in millimeters.

(2) Scale : none
(3) Undefined tolerance is ±0.1mm

Product Data Sheet
Mechanical Dimensions

Product Data Sheet
Reflow Soldering Characteristics
IPC/JEDEC J-STD-020
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max.
Preheat
- Temperature Min (Tsmin) 100 °C 150 °C
- Temperature Max (Tsmax) 150 °C 200 °C
- Time (Tsmin to Tsmax) (ts) 60-120 seconds 60-180 seconds
Time maintained above:

- Temperature (TL) 183 °C 217 °C
- Time (tL) 60-150 seconds 60-150 seconds
Peak Temperature (Tp) 215℃ 260℃
Time within 5°C of actual Peak

Temperature (tp)2 10-30 seconds 20-40 seconds
Ramp-down Rate 6 °C/second max. 6 °C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.
Caution
(1) Reflow soldering is recommended not to be done more than two times. In the case of more than
24 hours passed soldering after first, LED will be damaged.
(2) Repairs should not be done after the LED have been soldered. When repair is unavoidable,
suitable tools must be used.
(3) Die slug is to be soldered.
(4) When soldering, do not put stress on the LED during heating.
(5) After soldering, do not warp the circuit board.

Product Data Sheet
Emitter Tape & Reel Packaging
0.4 0.4
4.68 0.1
0.77 0.87
0.75
0.1
G(-) G(+) W(-) W(+)
0.4
White Green
5.75
3.25
4.85
4.48
Red Blue
0.4
B(+) B(-) R(+) R(-)
0.75
4.2
0.4 0.4
1.21
4.68 0.51 0.1

0.77 0.87
0.75
0.1
4.8
G(-) G(+) W(-) W(+)
0.4
White Green
5.75
3.25
4.85
4.48
Red Blue
0.4
B(+) B(-) R(+) R(-)
0.75
4.2
1.21
0.51
4.8
Notes :
1. Quantity : 500pcs/Reel
2. Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
3. Adhesion Strength of Cover Tape : Adhesion strength to be 10-60g when the cover tape is
turned off from the carrier tape at the angle of 10º to the carrier tape
4. Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package

Product Data Sheet
Emitter Tape & Reel Packaging
Labeling
X10X11X12X13X14X15~23
500
###############
SPF05F0B
SPF05F0B
Full code form
X1X2X3X4X5X6X7X8
-X1 : Company
-X2 : Z-Power LED series number
-X3 X4 : Color Specification
-X5 : PKG Series
-X6 : Lens Type (Flat)
-X7 : PCB Type
-X8 : Power (A:15W / B:40W / C:60W / D:8W)
Rank
X10X11X12X13 X14X15X16X17X18X19X20X21X22X23
-X10X11X12X13X14X15X16X17 : Brightness (Flux, mW)
-X18X19X20 X21 : Dominant or Peak Wavelength [nm]
-X22X23 : CIE
Lot No
#1#2#3#4#5#6 - #7#8#9#10 - #11#12#13

- #1 #2 : Year - #7 #8 #9 #10 : Mass order
- #3 #4 : Month - #11 #12 #13 : Tray No.
- #5 #6 : Day

Product Data Sheet
Packaging Information

Product Data Sheet
Color BinNomenclature
Product Structure
Part Numbering System
Part Number Code Description Part Number Value
X1 Company S Seoul Semiconductor
X2 Level of Integration 1 Discrete LED
X3X4 Technology C0 Color
X5X6X7X8 Dimension 4758 PKG size
X9X10 Power 40 W
X11X12 CRI 00
00 Full / 1 Red / 2
X13X14 Type 00
Green / 3 Blue / 4 White
Characteristic code
X15X16X17 000
Flux Rank
Characteristic code
X18X19X20 000
Vf Rank
Characteristic code
X21X22 00
Color Step
X23X24 Type 00
X25X26X27 Internal code 001

Product Data Sheet
Handling of Silicone Resin for LED
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LED should only be handled from the side. By the way, this also applies to
LED without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form
of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be
prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These
conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As
mentioned previously, the increased sensitivity to dust requires special care during processing. In
cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning
solution must be applied to the surface after the soldering of components.
(5) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are
used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic
cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this
product with acid or sulfur material in sealed space.
(7) Avoid leaving fingerprints on silicone resin parts.

Product Data Sheet
Precaution for Use

(1) Storage
To avoid the moisture penetration, we recommend storing Z5 Series LED in a dry box with a
desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of
RH50%.
(2) Use Precaution after Opening the Packaging

Use SMT techniques properly when you solder the LED as separation of the lens may affect the light
output efficiency.
Pay attention to the following:

a. Recommend conditions after opening the package
- Sealing / Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 4 weeks (MSL 2a) or the color of
the desiccant changes, components should be dried for 10-12hr at 60±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LED are in operation the maximum current should be decided after measuring the
package temperature.
(10) The appearance and specifications of the product may be modified for improvement without
notice.
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.

Product Data Sheet
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures
can penetrate silicone encapsulants of LED and discolor when exposed to heat and photonic energy.
The result can be a significant loss of light output from the fixture. Knowledge of the properties of the
materials selected to be used in the construction of fixtures can help prevent these issues.
(13) Attaching LEDs, do not use adhesives that outgas organic vapor.
(14) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the
reverse voltage is applied to LED, migration can be generated resulting in LED damage.
(15) LED is sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a
list of suggestions that Seoul Semiconductor purposes to minimize these effects.
a. ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact. While most ESD events are considered harmless, it can be an expensive problem in
many industrial environments during production and storage. The damage from ESD to an LED may
cause the product to demonstrate unusual characteristics such as:
- Increase in reverse leakage current lowered turn-on voltage

- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event.
One or more recommended work area suggestions:
- Ionizing fan setup

- ESD table/shelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options:

- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls:
- Humidity control (ESD gets worse in a dry environment)

Product Data Sheet
Precaution for Use
b. EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device.
The effects from an EOS event can be noticed through product performance like:
- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation.)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary, but there are some
common signs that will indicate an EOS event has occurred:
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires.
- This damage usually appears due to the thermal stress produced during the EOS event.
c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:
- A surge protection circuit

- An appropriately rated over voltage protection device
- A current limiting device

Product Data Sheet
Company Information
Published by
Seoul Semiconductor © 2013 All Rights Reserved.
Company Information
Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage
and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than
10,000 patents globally, while offering a wide range of LED technology and production capacity in
areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT -
Multi-Junction Technology" a proprietary family of high-voltage LEDs.
The company’s broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type
LED as well as custom modules, displays, and sensors.
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products. With
respect to any examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party. The appearance and specifications of the product can be changed
to improve the quality and/or performance without notice.

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Product Data Sheet

Superior Efficacy & Lumen output with Small Form Factor

Rev1.2, Sep. 2019 www.seoulsemicon.com

• Color Bin Structure 9

• Reflow Soldering Characteristics 12

• Emitter Tape & Reel Packaging 13

• Handling of Silicone Resin for LEDs 17

• Precaution For Use 18

Rev1.2, Sep. 2019 2 www.seoulsemicon.com

Table 1. Electro-Optical characteristics at 1000mA (Tj=25℃, RH30%)

Red Luminous Flux [1]

Green Luminous Flux [1]

White Luminous Flux [1]

Red Dominant Wavelength Λd 620 625 632 nm

Green Dominant Wavelength Λd 519 525 531 nm

Blue Dominant Wavelength Λd 449 453 458 nm

Forward Voltage (Green) [3] 3.00 3.74 4.10

Forward Voltage (White) [3] 3.40 3.79 4.20

View Angle 2Θ ½ 120 deg.

Forward Current IF - - 2500 mA

Junction Temperature Tj - - 125 ºC

Storage Temperature Tstg - 10 - 85 ºC

Thermal resistance (J to S) [3] RθJ-S - 1.4 - K/W

ESD Sensitivity(HBM) [4] Class 2 JEDEC JS-001-2017

(1) SSC maintains a tolerance of 7% on power measurements.

Rev1.2, Sep. 2019 3 www.seoulsemicon.com

Forward Voltage vs. Forward Current, Tj=25℃

0.0 0.5 1.0 1.5 2.0 2.5

Rev1.2, Sep. 2019 4 www.seoulsemicon.com

0.0 0.5 1.0 1.5 2.0 2.5

Forward Current vs Dominant Wavelength, Tj=25℃

0.0 0.5 1.0 1.5 2.0 2.5

Rev1.2, Sep. 2019 5 www.seoulsemicon.com

Forward Current vs ΔCIE, Tj=25℃ (White)

Rev1.2, Sep. 2019 6 www.seoulsemicon.com

Junction Temperature vs. Forward Voltage at IF=1000mA

Rev1.2, Sep. 2019 7 www.seoulsemicon.com

20 40 60 80 100 120 140

Junction Temperature vs. White ΔCIE at IF=1000mA

Rev1.2, Sep. 2019 8 www.seoulsemicon.com

Color Bin Structure

Table 3. Bin Code Description

CIE IF = 1000mA 0.36

Color CIE_x CIE_y 0.35

0.3217 0.3558 0.34

AA 0.3292 0.3418 0.33

(White) 0.3081 0.2990 0.32

0.2995 0.3132 0.31

Rev1.2, Sep. 2019 9 www.seoulsemicon.com

(1) All dimensions are in millimeters.

Rev1.2, Sep. 2019 10 www.seoulsemicon.com

Rev1.2, Sep. 2019 11 www.seoulsemicon.com

Reflow Soldering Characteristics

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max.

Time maintained above:

Peak Temperature (Tp) 215℃ 260℃

Time within 5°C of actual Peak

Ramp-down Rate 6 °C/second max. 6 °C/second max.