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02 ECE621 F17 Channel

This document discusses I/O channel characteristics for chip-to-chip communication. It describes the components of communication channels including wires, IC packages, vias and connectors. It discusses channel impairments such as limited bandwidth/loss, reflections, and cross-talk. It then covers various models to represent channels including impulse response, S-parameters, eye diagrams and time-domain reflectometry. Finally, it delves into specific channel characteristics like loss mechanisms, reflections, termination schemes and sources of cross-talk.

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0% found this document useful (0 votes)
100 views76 pages

02 ECE621 F17 Channel

This document discusses I/O channel characteristics for chip-to-chip communication. It describes the components of communication channels including wires, IC packages, vias and connectors. It discusses channel impairments such as limited bandwidth/loss, reflections, and cross-talk. It then covers various models to represent channels including impulse response, S-parameters, eye diagrams and time-domain reflectometry. Finally, it delves into specific channel characteristics like loss mechanisms, reflections, termination schemes and sources of cross-talk.

Uploaded by

Ahmed MaGdy
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 76

ECE 621

Signaling & Synchronization


Fall 2017
Topic 2
I/O Channel Characteristics

Sameh A. Ibrahim
Ain Shams University
ICL
(Courtesy of S. Pamarti – UCLA, S. Palermo – TAMU,
E. Alon – UCB, and W. Dally – Stanford)
Outline
 Channel Components
▪ Wires (PCB traces, Co-axial cables, twisted pairs, ..etc.)
▪ IC Packages
▪ Vias
▪ Connectors
 Channel Impairments
▪ Limited Bandwidth - Loss
▪ Reflections
▪ Cross-Talk
 Channel Representations
▪ Impulse Response
▪ S-Parameters
▪ Eye Diagram
▪ Time-Domain Reflectometry (TDR)

I/O Channel Characteristics 2


Chip-to-Chip Communication Channels
 Short Range
▪ ICs on the same PCB
▪ The PCB could be within a multi-chip module
 Long Range
▪ ICs on different PCBs
▪ PCBs connected through another board or a co-axial
cable

I/O Channel Characteristics 3


Channel Complexity

“Wire”
TX RX

Neglected for low data-rates, short lengths and simple architecture


Otherwise

I/O Channel Characteristics 4


Example Wires
Cables

Coaxial Flat or Ribbon Twisted Pair Flex Circuit

PCB Traces

𝐴
Micro-strip Strip-line 𝐴𝑊𝐺 = −10 ln
𝐴0

[Dally]

I/O Channel Characteristics 5


Wire Models
 Model Types
▪ Ideal
▪ Lumped C, R, L
▪ RC transmission line
▪ LC transmission line
▪ RLGC transmission line

 Condition for LC or RLGC model (vs RC)


𝑹
𝒇𝟎 ≥
𝟐𝝅𝑳

I/O Channel Characteristics 6


Basic Electrical Properties of Wires
 Resistance

 Capacitance
r ri r
ro r
s
s

|| Plate + Fringing
 Inductance

I/O Channel Characteristics 7


Wires/Cables as Transmission Lines

 Electromagnetic field propagation


 Per unit length,
▪ R, L, and C are the resistance, inductance, and
capacitance of the conductor structure
▪ G represents loss in the dielectric between the
conductors
 For a lossless transmission line, R = 0 and G = 0

I/O Channel Characteristics 8


IC Package Types
 Package needed to
protect chips physically
and thermally.
 Packaging pin count did
not increase as on-chip
aggregate bandwidth.
▪ I/O constrained design
▪ Higher data rate per pin
 Attachment to board
▪ Through-hole

▪ Surface-mount
[Fujitsu]
I/O Channel Characteristics 9
IC Package Model
 Bondwires
▪ L ~ 1 nH/mm
▪ Mutual inductance
▪ Ccouple ~ 20 fF/mm
 Package traces
▪ L ~ 0.7 – 1 nH/mm
▪ Mutual inductance
▪ Clayer ~ 80 – 90 fF/mm
▪ Ccouple ~ 40 fF/mm

I/O Channel Characteristics 10


PCB Vias

 Made by drilling a hole through the board which is plated


with copper
▪ Pads connect to signal layers/traces.
▪ Clearance holes avoid power planes.
 Blind vias are better than through vias with respect to
signal integrity as they are better impedance-controlled.
I/O Channel Characteristics 11
Coaxial-Type Vias

 Extra vias for ground connections


 Spacing used for impedance control

I/O Channel Characteristics 12


Connectors
 Connectors are used to
transfer signals from
board to board.
 Typical differential pair
density ranges between
16 – 32 pairs/10mm.

ISA PCI

I/O Channel Characteristics 13


Common Connectors
 Typical frequencies where attenuation gets to 1 dB.

I/O Channel Characteristics 14


Outline
 Channel Components
▪ Wires (PCB traces, Co-axial cables, twisted pairs, ..etc.)
▪ IC Packages
▪ Vias
▪ Connectors
 Channel Impairments
▪ Limited Bandwidth - Loss
▪ Reflections
▪ Cross-Talk
 Channel Representations
▪ Impulse Response
▪ S-Parameters
▪ Eye Diagram
▪ Time-Domain Reflectometry (TDR)

I/O Channel Characteristics 15


Channel Characteristics

 Flight time typically exceeds bit period in Gb/s


signaling
 Consider 5 Gb/s signaling over a 6΄΄ PCB trace
▪ Flight time is ~ 1ns. Bit period (1 UI) is 200 ps.
▪ In any instant, five bits traveling on the channel.
 Channel cannot be considered lumped.
 Trace is modeled as transmission line.
 Effects include signal attenuation, reflection and cross-
talk.
I/O Channel Characteristics 16
Loss Mechanisms: Dielectric Loss (1)

 The parallel conductance causes signal attenuation.

 The loss increases with transmission wire length.

I/O Channel Characteristics 17


Loss Mechanisms: Dielectric Loss (2)
 Loss tangent can be approximated as a constant
▪ Not true, but a reasonable approximation

 Loss increases linearly with wire length.


 Loss rolls off as 20 dB/decade (like a 1st order filter
past its bandwidth)

I/O Channel Characteristics 18


Loss Mechanisms: Conductive Loss (1)

 Finite conductivity of the conductors causes loss.

 Again, loss increases with transmission wire length.

I/O Channel Characteristics 19


Loss Mechanisms: Conductive Loss (2)

 Conductivity decreases at high frequencies.


▪ Called skin effect.
▪ Current flows close to the surface in a thin layer.
▪ Skin depth, 𝛿, is the depth where the current has fallen to
e-1.
▪ 𝑓𝑠 is the frequency where 𝛿 is equal to 𝑟 or ℎ/2.

I/O Channel Characteristics 20


Losses: Cable vs. PCB Trace

I/O Channel Characteristics 21


Reflection

 Suppose T-line is terminated by 𝒁𝑻 ≠ 𝒁𝟎 .


 Forward wave will launch a backward traveling wave.
▪ Backward wave starts at 𝒁𝑻 with the following time
waveform

 The reflected current is also given by the reflection


coefficient, 𝚪
I/O Channel Characteristics 22
Termination Examples

 The voltage drop at 𝒁𝑻 is


 If 𝒁𝑻 = 𝒁𝟎 ,

▪ Like an infinitely-long TL
 If 𝒁𝑻 = 𝟎,

 If 𝒁𝑻 = ∞,

I/O Channel Characteristics 23
TL Wave Reflections

 Multiple reflections are caused by the forward and


backward waves reflecting at the source and load
boundaries.
I/O Channel Characteristics 24
Lossy TL Wave Reflections

 Loss in TLs reduce the effects of reflections


significantly
I/O Channel Characteristics 25
Numerical Example of TL Reflections

I/O Channel Characteristics 26


Termination Schemes (1)
 No Termination
▪ Little to absorb line energy
▪ Can generate oscillating
waveform
▪ Line must be very short relative
to signal transition time (n = 4 -
6)
▪ Limited off-chip use

 Source Termination
▪ Source output takes 2 steps up
▪ Used in moderate speed point-
to-point connections
I/O Channel Characteristics 27
Termination Schemes (2)
 Receiver Termination
▪ No reflection from receiver
▪ Watch out for intermediate
impedance discontinuities
▪ Little to absorb reflections at
driver
 Double Termination
▪ Best configuration for
minimum reflections
▪ Get half the swing relative to
single termination
▪ Most common termination
scheme for high performance
serial links I/O Channel Characteristics 28
Sources of Reflections
 Z-Discontinuities
▪ PCB Z mismatch
▪ Connector Z mismatch
▪ Vias Z mismatch
▪ Device parasitics
 Example Via Stubs
▪ Legacy backplanes
have default straight
vias
▪ Refined backplanes
have expensive
backdrilled vias

I/O Channel Characteristics 29


Minimizing Via Stubs
 Thinner PCBs
 Better vias
 But are expensive solutions

I/O Channel Characteristics 30


Cross-Talk
 Noise induced by one signal that
interferes with another signal
 Capacitive coupling between on-
chip lines
 Capacitive and inductive coupling
between off-chip lines
 Coupling over shared signal
returns
 Near end cross-talk (NEXT) and
far end cross-talk (FEXT)
 Disturbances on both voltage and
current
 Can exceed signal at high
frequencies.
I/O Channel Characteristics 31
Connectors and Cross-Talk

 Connectors have tight footprint constraints.


 Hard to match pairs.
 Big source of impedance discontinuities.
 But above all, a major source of cross-talk.

I/O Channel Characteristics 32


NEXT: To Do and Not To Do


I/O Channel Characteristics 33
Everything together

I/O Channel Characteristics 34


Outline
 Channel Components
▪ Wires (PCB traces, Co-axial cables, twisted pairs, ..etc.)
▪ IC Packages
▪ Vias
▪ Connectors
 Channel Impairments
▪ Limited Bandwidth - Loss
▪ Reflections
▪ Cross-Talk
 Channel Representations
▪ Impulse Response
▪ S-Parameters
▪ Eye Diagram
▪ Time-Domain Reflectometry (TDR)

I/O Channel Characteristics 35


Channel Pulse Response

 TX pulse spreads in time as it travels Main-Cursor


through the channel.
 Channel’s pulse response is used in time Post-Cursors
domain simulations and link analysis.
 Many post-cursors and few pre-cursors Reflections
exist due to spreading.
 Spreading causes interference with Pre-Cursor
adjacent symbols (ISI).
I/O Channel Characteristics 36
Inter-Symbol Interference (ISI)
 ISI is caused by channel loss (dispersion) and
reflections.
 Previous bits residual state can distort the current bit.
 ISI creates a deterministic jitter in received signal’s
zero crossings.
 Left uncompensated, ISI leads to increased BER.

I/O Channel Characteristics 37


Numerical Example

I/O Channel Characteristics 38


Channel Data Stream Response

I/O Channel Characteristics 39


Channel S-Parameters

 S-Parameters are easy to measure.


▪ Y, Z parameters need open and short conditions.
▪ S-parameters are obtained with nominal termination.
 S11 measures reflection from channel, port 2 matched.
 S11 is known as return loss.
 S21 measures fraction of signal delivered to matched
load.
 S21 is known as insertion loss.

I/O Channel Characteristics 40


S-Parameter Channel Example (1)

I/O Channel Characteristics 41


S-Parameter Channel Example (2)

-50 dB = 0.3% at 14 Gb/s

I/O Channel Characteristics 42


Cascading S-Parameters
 Convert to ABCD matrix and cascade.

I/O Channel Characteristics 43


Converting Between S & ABCD Parameters

I/O Channel Characteristics 44


Impulse Response and S-Parameters (1)

 Step 1: For ifft, produce


negative frequency
values and append to s-
parameter data in the
following manner

I/O Channel Characteristics 45


Impulse Response and S-Parameters (2)
 Can perform ifft now,
but will get an impulse
response with time
resolution of

 To improve response
resolution, expand
frequency axis and
“zero pad”.

I/O Channel Characteristics 46


Impulse Response and S-Parameters (3)
 Now perform ifft to produce  Can sanity check by doing
impulse response fft on impulse response and
comparing to measured
data

I/O Channel Characteristics 47


Different Channels Examples

I/O Channel Characteristics 48


Eye Diagrams

I/O Channel Characteristics 49


Eye Diagram Basics

I/O Channel Characteristics 50


Loss-Less vs. Lossy Channel

 Loss-less ideal channel  40΄΄ of FR4


 RX eye = TX eye  Data rate = 5 Gb/s
 Eye opening = 500 mV  Effect of attenuation only
 Clear zero crossing  Eye opening = 130 mV
 No ISI, no jitter  Zero crossing jitter = 75 ps
 Reflection and cross-talk further close the eye
I/O Channel Characteristics 51
Eye Diagrams vs. Data Rate

I/O Channel Characteristics 52


Eye Diagrams vs. Channel

I/O Channel Characteristics 53


Attenuation and Eye Opening
 For an attenuation A, Eye
opening is reduced to
B = 2A – 1
 No eye opening at 50%
attenuation
 Significant degradation of
margins at lower levels of
attenuation

I/O Channel Characteristics 54


Estimating the Worst-Case Eye (1)
 Can estimate worst-case eye
height and data pattern from
pulse response.

 Worst-case “1” is
summation of a “1” pulse
with all negative non k=0
pulse responses.
 Worst-case “0” is
summation of a “0” pulse
with all positive non k=0
pulse responses.
I/O Channel Characteristics 55
Estimating the Worst-Case Eye (2)
 Worst case eye height is s1(t)-s0(t).

 If symmetric “1” and “0” pulses, then only positive


pulse response is needed.

I/O Channel Characteristics 56


Worst-Case Eye Example 1

I/O Channel Characteristics 57


Worst-Case Eye Example 2

I/O Channel Characteristics 58


Time-Domain Reflectometer (TDR)

 TDR consists of a fast step generator and a high-speed


oscilloscope
 TDR operation
▪ Outputs fast voltage step onto channel
▪ Observe voltage at source, which include reflections
▪ Voltage magnitude can be converted to impedance
▪ Impedance discontinuity location can be determined by
delay
 Only input port access to characterize channel (vs. VNA)
I/O Channel Characteristics 59
TDR Impedance Calculation

I/O Channel Characteristics 60


TDR Waveforms (Open & Short)
 Open termination

 Short termination

I/O Channel Characteristics 61


TDR Waveforms (Matched & Unmatched)
 Matched termination

 Unmatched termination

I/O Channel Characteristics 62


TDR Waveforms (C & L Discontinuity)
 Shunt C discontinuity

∆𝑉 𝑉
 Series L discontinuity

 Spike depends on rise time ∆𝑉

I/O Channel Characteristics 63


Rise-Time Degradation
 Upstream elements (Ls & Cs) low-pass the signal
resulting in a longer rise-time.
 This affects the reflections from down-stream
elements.
▪ Slow rising edge
▪ Spread out response
▪ L & C responses do not go full swing.
 This makes it
▪ Hard to extract L and C values.
▪ Impossible to measure very small discontinuities.
• But if the TDR cannot see them, neither can the signal.

I/O Channel Characteristics 64


Extraction Procedure
 Identify regions of the TDR plot as
▪ Flat region – transmission line
▪ Bump up – inductor
▪ Bump down – capacitor
 Starting at source
▪ Determine value of Z & td, L, or C for nearest element.
▪ Simulate to validate and determine new tr.
▪ Iterate as needed to get the value right.
▪ Move on to the next element.
 There is no need for models with more resolution than
the fastest rise time.

I/O Channel Characteristics 65


Example TDR Trace

I/O Channel Characteristics 66


Same Waveform with 200 ps Edge

I/O Channel Characteristics 67


Channel Summary
Input Output

Horizontal scale: 20 ps/div - Vertical scale: 100 mV/div


20-Gb/s PRBS7 data - 18-inch FR4 trace
 Untreated received eye is closed, or almost closed
 How can it be opened?
▪ Characterize channel & compensate for it at TX/RX.
▪ Use signaling schemes that best match channel. (NRZ)
▪ Use coding to relax constraints. (8b/10b)
 How to quantize performance?
I/O Channel Characteristics 68
Bit-Error Rate (BER)
 System overall performance is best described by BER.
 BER = # of erroneous bits / total number of bits.
 At multiple Gb/s rates, the BER requirement for most
I/O communication standards is 10-12 or smaller.
 BER are measured using BERT.
 BERT consists of a pattern generator and error
detector.
 Pseudo random binary sequence (PRBS) is the most
common bit sequence used in BERTs to mimic a truly-
random sequence.
 PRBS are generated by linear-feedback shift registers
(LFSR).

I/O Channel Characteristics 69


Link Performance Using BERT

BERT

DUT
(TX + CH. +RX)

I/O Channel Characteristics 70


Bathtub Curve

 Shows the BER as a function of the sampling time.


 Determines the horizontal eye opening of the eye
diagram.
 Heavily dependent on the system jitter.
 How can we predict this from the beginning?
I/O Channel Characteristics 71
Traditional Approach
 Borrowed from computer systems
▪ Built to be “error free” (10-20)
▪ Worst-case analysis

 Voltage/Time (VT) Budget


▪ Also called link Budget
▪ Deterministic (Bounded) error sources [Cross-talk,
residual-ISI, reflections, supply and reference noise, TX
offsets, RX offsets and sensitivity] add in the same
direction.
▪ Random (Unbounded) error sources [Thermal and
flicker noise] add in rms.
▪ V & T completely separated.
I/O Channel Characteristics 72
Traditional Voltage Budget Example
Transmitter Bounded
Noise Receiver Bounded
Noise
Crosstalk

ISI and Reflections

𝟏 𝒉
 𝑩𝑬𝑹 = 𝒆𝒓𝒇𝒄 Signal Swing 400 mV
𝟐 𝟐𝝈 Vni Rx offset + sensitivity 50 mV

 𝒉 = 𝑺𝒘𝒊𝒏𝒈 − σ 𝑫𝑵 Uncancelled PS noise 20 mV


Total Vni 70 mV
 Swing determined by residual Kn Crosstalk 10 %

ISI (worst case eye) Reflections


Total
10
20
%
%

 DN = deterministic noise KnVs 80 mV


Vn = Vni + KnVs 150 mV
 σ is obtained by rms addition.
I/O Channel Characteristics 73
Issues with Traditional Approach
 Worst-case analysis is not realistic, especially with
large number of residual-ISI taps.
 Voltage and timing cannot be treated separately for
modern links.
 Modern approach
▪ Uses noise and ISI statistics
▪ Integrates timing noise with voltage noise
▪ Needs mapping from time to voltage

I/O Channel Characteristics 74


Assignment 1

 Assignment is due on 17/10/17 at 6 PM.


 Use the through channel s-parameters
“channel.s4p” to provide the following plots:
▪ AC magnitude and phase (i.e., s21) from 0 Hz
to 20 GHz.
▪ Time-domain pulse response at 8 Gb/s
indicating symbol-spaced sample values.

I/O Channel Characteristics 75


Assignment 1 (Contd.)

 The figure shown is a model for a 1-inch FR4 trace that


can be cascaded for longer traces.
 Provide the input and output eye diagram for a 6-inch
FR4 trace using an 8-Gb/s PRBS source with 0.5 Vpp
swing.
 Estimate the worst-case eye opening and compare it to
the simulated eye.

I/O Channel Characteristics 76

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