24AA00/24LC00/24C00 24AA01/24LC01B

24AA014/24LC014 24C01C
24AA02/24LC02B 24C02C
24AA024/24LC024 24AA025/24LC025
24AA04/24LC04B 24AA08/24LC08B
24AA16/24LC16B 24AA32A/24LC32A
24AA64/24LC64/24FC64 24AA128/24LC128/24FC128
24AA256/24LC256/24FC256 24AA512/24LC512/24FC512

I2C™ Serial EEPROM Family Data Sheet

Features: Description:
• 128-bit through 512 Kbit devices The Microchip Technology Inc. 24CXX, 24LCXX,
• Single supply with operation down to 1.7V for 24AAXX and 24FCXX (24XX*) devices are a family of
24AAXX devices 128-bit through 512 Kbit Electrically Erased PROMs.
• Low-power CMOS technology: The devices are organized in blocks of x8-bit memory
with 2-wire serial interfaces. Low-voltage design
- 1 mA active current, typical
permits operation down to 1.7V (for 24AAXX devices),
- 1 μA standby current, typical (I-temp) with standby and active currents of only 1 μA and 1
• 2-wire serial interface bus, I2C™ compatible mA, respectively. Devices 1 Kbit and larger have page
• Schmitt Trigger inputs for noise suppression write capability. Parts having functional address lines
• Output slope control to eliminate ground bounce allow connection of up to 8 devices on the same bus.
The 24XX family is available in the standard 8-pin
• 100 kHz (1.7V) and 400 kHz (≥ 2.5V) compatibility
PDIP, surface mount SOIC, TSSOP and MSOP pack-
• 1 MHz for 24FCXX products ages. Most 128-bit through 16 Kbit devices are also
• Self-timed write cycle (including auto-erase) available in the 5-lead SOT-23 package. DFN
• Page write buffer packages (2x3mm or 5x6mm) are also available. All
• Hardware write-protect available on most devices packages are Pb-free (Matte Tin) finish.
• Factory programming (QTP) available
• ESD protection > 4,000V
• 1 million erase/write cycles
• Data retention > 200 years
• 8-lead PDIP, SOIC, TSSOP and MSOP packages
• 5-lead SOT-23 package (most 1-16 Kbit devices)
• 8-lead 2x3mm and 5x6mm DFN packages
available
• Pb-free and RoHS compliant *24XX is used in this document as a generic part
• Available for extended temperature ranges: number for 24 series devices in this data sheet.
- Industrial (I): -40°C to +85°C 24XX64, for example, represents all voltages of the 64
- Automotive (E): -40°C to +125°C Kbit device.

Package Types(1)
PDIP/SOIC TSSOP/MSOP(2) SOT-23-5
(24XX00)
A0 1 8 VCC A0 1 8 VCC
(3) SCL 1 5 VCC
A1 2 7 WP A1 2 7 WP(3)
A2 3 6 SCL A2 3 6 SCL VSS 2

VSS 4 5 SDA VSS 4 5 SDA SDA 3 4 NC

SOT-23-5 Note 1: Pins A0, A1, A2 and WP are not used by some
DFN
(all except 24XX00) devices (no internal connections). See Table 1-1,
A0 1 8 VCC Device Selection Table, for details.
SCL 1 5 WP A1 2 7 WP(3) 2: Pins A0 and A1 are no-connects for the 24XX128
A2 3 6 SCL and 24XX256 MSOP devices.
VSS 2
VSS 4 5 SDA 3: Pin 7 is “not used” for 24XX00, 24XX025 and
SDA 3 4 VCC 24C01C.

© 2007 Microchip Technology Inc. DS21930B-page 1

24AAXX/24LCXX/24FCXX

TABLE 1-1: DEVICE SELECTION TABLE

Write- Functional
VCC Max. Clock Page Temp.
Part Number Protect Address Packages(5)
Range Frequency Size Range
Scheme Pins
128-bit devices
24AA00 1.7-5.5V 400 kHz(1) I P, SN, ST, OT, MC
(1) — None None I
24LC00 2.5-5.5V 400 kHz
24C00 4.5-5.5V 400 kHz I, E
1 Kb devices
24AA01 1.7-5.5V 400 kHz (2) I P, SN, ST, MS, OT, MC
8 bytes Entire Array None
24LC01B 2.5-5.5V 400 kHz I, E
(2)
24AA014 1.7-5.5V 400 kHz I P, SN, ST, MS, MC
16 bytes Entire Array A0, A1, A2
24LC014 2.5-5.5V 400 kHz I
24C01C 4.5V-5.5V 400 kHz 16 bytes None A0, A1, A2 I, E P, SN, ST, MC
2 Kb devices
24AA02 1.7-5.5V 400 kHz (2) I P, SN, ST, MS, OT, MC
8 bytes Entire Array None
24LC02B 2.5-5.5V 400 kHz I, E
24AA024 1.7-5.5V 400 kHz(2) I P, SN, ST, MS, MC
16 bytes Entire Array A0, A1, A2
24LC024 2.5-5.5V 400 kHz I
24AA025 1.7-5.5V 400 kHz(2) I P, SN, ST,MS, MC
16 bytes None A0, A1, A2
24LC025 2.5-5.5V 400 kHz I
16 bytes Upper Half A0, A1, A2 I, E P, SN, ST, MC
24C02C 4.5-5.5V 400 kHz
of Array
4 Kb devices
24AA04 1.7-5.5V 400 kHz (2) 16 bytes Entire Array None I P, SN, ST, MS, OT, MC
24LC04B 2.5-5.5V 400 kHz I, E
8 Kb devices
24AA08 1.7-5.5V 400 kHz (2) I P, SN, ST, MS, OT, MC
16 bytes Entire Array None
24LC08B 2.5-5.5V 400 kHz I, E
16 Kb devices
24AA16 1.7-5.5V 400 kHz (2) I P, SN, ST, MS, OT, MC
16 bytes Entire Array None
24LC16B 2.5-5.5V 400 kHz I, E
32 Kb devices
24AA32A 1.7-5.5V 400 kHz (2) I P, SN, SM, ST, MS, MC
32 bytes Entire Array A0, A1, A2
24LC32A 2.5-5.5V 400 kHz I, E
64 Kb devices
24AA64 1.7-5.5V 400 kHz (2) I P, SN, SM, ST, MS, MC
24LC64 2.5-5.5V 400 kHz 32 bytes Entire Array A0, A1, A2 I, E
24FC64 1.7-5.5V 1 MHz(3) I
Note 1: 100 kHz for VCC <4.5V.
2: 100 kHz for VCC <2.5V.
3: 400 kHz for VCC <2.5V.
4: Pins A0 and A1 are no-connects for the 24XX128 and 24XX256 in the MSOP package.
5: P = 8-PDIP, SN = 8-SOIC (3.90 mm JEDEC), ST = 8-TSSOP, OT = 5 or 6-SOT23, MC = 2x3mm DFN,
MS = 8-MSOP, SM = 8-SOIC (200 mil EIAJ), MF = 5x6mm DFN.

DS21930B-page 2 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX
TABLE 1-1: DEVICE SELECTION TABLE (CONTINUED)
Write- Functional
VCC Max. Clock Page Temp.
Part Number Protect Address Packages(5)
Range Frequency Size Range
Scheme Pins
128 Kb devices
24AA128 1.7-5.5V 400 kHz (2) I P, SN, SM, ST, MS, MF,
A0, A1, ST14
24LC128 2.5-5.5V 400 kHz 64 bytes Entire Array I, E
A2(4)
24FC128 1.7-5.5V 1 MHz(3) I
256 Kb devices
24AA256 1.7-5.5V 400 kHz (2) I P, SN, SM, ST, MS, MF,
A0, A1, ST14
24LC256 2.5-5.5V 400 kHz 64 bytes Entire Array I, E
A2(4)
24FC256 1.7-5.5V 1 MHz(3) I
512 Kb devices
24AA512 1.7-5.5V 400 kHz (2) I P, SM, MF, ST14
128
24LC512 2.5-5.5V 400 kHz Entire Array A0, A1, A2 I, E
bytes
24FC512 1.7-5.5V(3) 1 MHz I
Note 1: 100 kHz for VCC <4.5V.
2: 100 kHz for VCC <2.5V.
3: 400 kHz for VCC <2.5V.
4: Pins A0 and A1 are no-connects for the 24XX128 and 24XX256 in the MSOP package.
5: P = 8-PDIP, SN = 8-SOIC (3.90 mm JEDEC), ST = 8-TSSOP, OT = 5 or 6-SOT23, MC = 2x3mm DFN,
MS = 8-MSOP, SM = 8-SOIC (200 mil EIAJ), MF = 5x6mm DFN.

© 2007 Microchip Technology Inc. DS21930B-page 3

24AAXX/24LCXX/24FCXX
2.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings (†)

VCC .............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied ................................................................................................-40°C to +125°C
ESD protection on all pins ......................................................................................................................................................≥ 4 kV

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.

TABLE 2-1: DC CHARACTERISTICS

Electrical Characteristics:
DC CHARACTERISTICS Industrial (I): VCC = +1.7V to 5.5V TA = -40°C to +85°C
Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to 125°C
Param.
Sym. Characteristic Min. Max. Units Conditions
No.
D1 — A0, A1, A2, SCL, SDA and — — — —
WP pins:
D2 VIH High-level input voltage 0.7 VCC — V —
D3 VIL Low-level input voltage — 0.3 VCC V VCC ≥ 2.5V
0.2 VCC V VCC < 2.5V
D4 VHYS Hysteresis of Schmitt Trigger 0.05 VCC — V (Note 1)
inputs (SDA, SCL pins)
D5 VOL Low-level output voltage — 0.40 V IOL = 3.0 mA @ VCC = 2.5V
D6 ILI Input leakage current — ±1 μA VIN = VSS or VCC
D7 ILO Output leakage current — ±1 μA VOUT = VSS or VCC
D8 CIN, Pin capacitance — 10 pF VCC = 5.0V (Note 1)
COUT (all inputs/outputs) TA = 25°C, FCLK = 1 MHz
D9 ICC Read Operating current — 400 μA 24XX128, 256, 512: VCC = 5.5V,
SCL = 400 kHz
1 mA All except 24XX128, 256, 512:
VCC = 5.5V, SCL = 400 kHz
ICC Write — 3 mA VCC = 5.5V, All except 24XX512
5 mA VCC = 5.5V, 24XX512
D10 ICCS Standby current — 1 μA TA = -40°C to +85°C
SCL = SDA = VCC = 5.5V
A0, A1, A2, WP = VSS or VCC
— 5 μA TA = -40°C to 125°C
SCL = SDA = VCC = 5.5V
A0, A1, A2, WP = VSS or VCC
— 50 μA 24C01C and 24C02C only
SCL = SDA = VCC = 5.5V
A0, A1, A2, WP = VSS or VCC
Note 1: This parameter is periodically sampled and not 100% tested.

DS21930B-page 4 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX
TABLE 2-2: AC CHARACTERISTICS – ALL EXCEPT 24XX00, 24C01C
AND 24C02C
Electrical Characteristics:
AC CHARACTERISTICS Industrial (I): VCC = +1.7V to 5.5V TA = -40°C to +85°C
Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to 125°C
Param.
Sym. Characteristic Min. Max. Units Conditions
No.
1 FCLK Clock frequency — 100 kHz 1.7V ≤ VCC < 2.5V
— 400 2.5V ≤ VCC ≤ 5.5V
— 400 1.7V ≤ VCC < 2.5V 24FCXXX
— 1000 2.5V ≤ VCC ≤ 5.5V 24FCXXX
2 THIGH Clock high time 4000 — ns 1.7V ≤ VCC < 2.5V
600 — 2.5V ≤ VCC ≤ 5.5V
600 — 1.7V ≤ VCC < 2.5V 24FCXXX
500 — 2.5V ≤ VCC ≤ 5.5V 24FCXXX
3 TLOW Clock low time 4700 — ns 1.7V ≤ VCC < 2.5V
1300 — 2.5V ≤ VCC ≤ 5.5V
1300 — 1.7V ≤ VCC < 2.5V 24FCXXX
500 — 2.5V ≤ VCC ≤ 5.5V 24FCXXX
4 TR SDA and SCL rise time — 1000 ns 1.7V ≤ VCC < 2.5V
(Note 1) — 300 2.5V ≤ VCC ≤ 5.5V
— 300 1.7V ≤ VCC ≤ 5.5V 24FCXXX
5 TF SDA and SCL fall time — 300 ns All except 24FCXXX
(Note 1) — 100 1.7V ≤ VCC ≤ 5.5V 24FCXXX
6 THD:STA Start condition hold time 4000 — ns 1.7V ≤ VCC < 2.5V
600 — 2.5V ≤ VCC ≤ 5.5V
600 — 1.7V ≤ VCC < 2.5V 24FCXXX
250 — 2.5V ≤ VCC ≤ 5.5V 24FCXXX
7 TSU:STA Start condition setup time 4700 — ns 1.7V ≤ VCC < 2.5V
600 — 2.5V ≤ VCC ≤ 5.5V
600 — 1.7V ≤ VCC < 2.5V 24FCXXX
250 — 2.5V ≤ VCC ≤ 5.5V 24FCXXX
8 THD:DAT Data input hold time 0 — ns (Note 2)
9 TSU:DAT Data input setup time 250 — ns 1.7V ≤ VCC < 2.5V
100 — 2.5V ≤ VCC ≤ 5.5V
100 — 1.7V ≤ VCC ≤ 5.5V 24FCXXX
10 TSU:STO Stop condition setup time 4000 — ns 1.7 V ≤ VCC < 2.5V
600 — 2.5 V ≤ VCC ≤ 5.5V
600 — 1.7V ≤ VCC < 2.5V 24FCXXX
250 — 2.5 V ≤ VCC ≤ 5.5V 24FCXXX
11 TSU:WP WP setup time 4000 — ns 1.7V ≤ VCC < 2.5V
600 — 2.5V ≤ VCC ≤ 5.5V
600 — 1.7V ≤ VCC ≤ 5.5V 24FCXXX
12 THD:WP WP hold time 4700 — ns 1.7V ≤ VCC < 2.5V
1300 — 2.5V ≤ VCC ≤ 5.5V
1300 — 1.7V ≤ VCC ≤ 5.5V 24FCXXX
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site:
www.microchip.com.
4: 24FCXXX denotes the 24FC64, 24FC128, 24FC256 and 24FC512 devices.

© 2007 Microchip Technology Inc. DS21930B-page 5

24AAXX/24LCXX/24FCXX
TABLE 2-2: AC CHARACTERISTICS – ALL EXCEPT 24XX00, 24C01C
AND 24C02C (CONTINUED)
Electrical Characteristics:
AC CHARACTERISTICS Industrial (I): VCC = +1.7V to 5.5V TA = -40°C to +85°C
Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to 125°C
Param.
Sym. Characteristic Min. Max. Units Conditions
No.
13 TAA Output valid from clock — 3500 ns 1.7V ≤ VCC < 2.5V
(Note 2) — 900 2.5V ≤ VCC ≤ 5.5V
— 900 1.7V ≤ VCC < 2.5V 24FCXXX
— 400 2.5V ≤ VCC ≤ 5.5V 24FCXXX
14 TBUF Bus free time: Time the bus 4700 — ns 1.7V ≤ VCC < 2.5V
must be free before a new 1300 — 2.5V ≤ VCC ≤ 5.5V
transmission can start 1300 — 1.7V ≤ VCC < 2.5V 24FCXXX
500 — 2.5V ≤ VCC ≤ 5.5V 24FCXXX
15 TOF Output fall time from VIH 10 + 0.1CB 250 ns All except 24FCXXX (Note 1)
minimum to VIL maximum 250 24FCXXX (Note 1)
CB ≤ 100 pF
16 TSP Input filter spike suppression — 50 ns All except 24FCXXX (Note 1)
(SDA and SCL pins)
17 TWC Write cycle time (byte or — 5 ms
page)
18 — Endurance 1,000,000 — cycles 25°C (Note 3)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site:
www.microchip.com.
4: 24FCXXX denotes the 24FC64, 24FC128, 24FC256 and 24FC512 devices.

DS21930B-page 6 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX

TABLE 2-3: AC CHARACTERISTICS – 24XX00, 24C01C AND 24C02C

All Parameters apply across all

Industrial (I): TA = -40°C to +85°C, VCC = 1.7V to 5.5V
recommended operating ranges
Automotive (E): TA = -40°C to +125°C, VCC = 4.5V to 5.5V
unless otherwise noted
Parameter Symbol Min. Max. Units Conditions
Clock frequency FCLK — 100 kHz 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
— 100 1.7V ≤ Vcc ≤ 4.5V
— 400 4.5V ≤ Vcc ≤ 5.5V
Clock high time THIGH 4000 — ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
4000 — 1.7V ≤ Vcc ≤ 4.5V
600 — 4.5V ≤ Vcc ≤ 5.5V
Clock low time TLOW 4700 — ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
4700 — 1.7V ≤ Vcc ≤ 4.5V
1300 — 4.5V ≤ Vcc ≤ 5.5V
SDA and SCL rise time TR — 1000 ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
(Note 1) — 1000 1.7V ≤ Vcc ≤ 4.5V
— 300 4.5V ≤ Vcc ≤ 5.5V
SDA and SCL fall time TF — 300 ns (Note 1)
Start condition hold time THD:STA 4000 — ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
4000 — 1.7V ≤ Vcc ≤ 4.5V
600 — 4.5V ≤ Vcc ≤ 5.5V
Start condition setup time TSU:STA 4700 — ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
4700 — 1.7V ≤ Vcc ≤ 4.5V
600 — 4.5V ≤ Vcc ≤ 5.5V
Data input hold time THD:DAT 0 — ns (Note 2)
Data input setup time TSU:DAT 250 — ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
250 — 1.7V ≤ Vcc ≤ 4.5V
100 — 4.5V ≤ Vcc ≤ 5.5V
Stop condition setup time TSU:STO 4000 — ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
4000 — 1.7V ≤ Vcc ≤ 4.5V
600 — 4.5V ≤ Vcc ≤ 5.5V
Output valid from clock TAA — 3500 ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
(Note 2) — 3500 1.7V ≤ Vcc ≤ 4.5V
— 900 4.5V ≤ Vcc ≤ 5.5V
Bus free time: Time the bus must TBUF 4700 — ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range)
be free before a new transmis- 4700 — 1.7V ≤ Vcc ≤ 4.5V
sion can start 1300 — 4.5V ≤ Vcc ≤ 5.5V
Output fall time from VIH TOF 20+0.1 250 ns (Note 1), CB ≤ 100 pF
minimum to VIL maximum CB
Input filter spike suppression TSP — 50 ns (Note 1)
(SDA and SCL pins)
Write cycle time TWC — 4 ms 24XX00
1.5 24C01C, 24C02C
Endurance 1,000,000 — cycles (Note 3)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained at www.microchip.com.

© 2007 Microchip Technology Inc. DS21930B-page 7

24AAXX/24LCXX/24FCXX
FIGURE 2-1: BUS TIMING DATA

5 4
2 D4

SCL
7
3 8 9 10
SDA
6
IN
16

13 14
SDA
OUT

(protected)
WP 11 12
(unprotected)

DS21930B-page 8 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
8-Pin 8-Pin 5-Pin SOT-23 8-Pin
Pin 5-Pin SOT-23 14-Pin
PDIP and TSSOP and All except 5x6 DFN and Function
Name 24XX00 TSSOP
SOIC MSOP 24XX00 2x3 DFN

A0 1 1(1) — — 1 1 User configurable Chip Select(3)

A1 2 2(1) — — 2 2 User configurable Chip Select(3)
A2 3 3 — — 6 3 User configurable Chip Select(3)
VSS 4 4 2 2 7 4 Ground
SDA 5 5 3 3 8 5 Serial Data
SCL 6 6 1 1 9 6 Serial Clock
(NC) — — 4 — 3, 4, 5, — Not Connected
10, 11, 12
WP 7(2) 7(2) — 5 13 7 Write-Protect Input
VCC 8 8 5 4 14 8 Power Supply
Note 1: Pins 1 and 2 are not connected for the 24XX128 and 24XX256 MSOP packages.
2: Pin 7 is not used for 24XX00, 24XX025 and 24C01C.
3: Pins A0, A1 and A2 are not used by some devices (no internal connections). See Table 1-1 for details.

3.1 A0, A1, A2 Chip Address Inputs 3.3 Serial Clock (SCL)
The A0, A1 and A2 pins are not used by the 24XX01 This input is used to synchronize the data transfer to
through 24XX16 devices. and from the device.
The A0, A1 and A2 inputs are used by the 24C01C,
24C02C, 24XX014, 24XX024, 24XX025 and the
3.4 Write-Protect (WP)
24XX32 through 24XX512 for multiple device opera- This pin must be connected to either VSS or VCC. If tied
tions. The levels on these inputs are compared with the to VSS, write operations are enabled. If tied to VCC,
corresponding bits in the slave address. The chip is write operations are inhibited but read operations are
selected if the compare is true. not affected. See Table 1-1 for the write-protect
For the 24XX128 and 24XX256 in the MSOP package scheme of each device.
only, pins A0 and A1 are not connected.
Up to eight devices (two for the 24XX128 and 3.5 Power Supply (VCC)
24XX256 MSOP package) may be connected to the A VCC threshold detect circuit is employed which
same bus by using different Chip Select bit disables the internal erase/write logic if VCC is below
combinations. 1.5V at nominal conditions. For the 24C00, 24C01C
In most applications, the chip address inputs A0, A1 and 24C02C devices, the erase/write logic is disabled
and A2 are hard-wired to logic ‘0’ or logic ‘1’. For below 3.8V at nominal conditions.
applications in which these pins are controlled by a
microcontroller or other programmable device, the chip
address pins must be driven to logic ‘0’ or logic ‘1’
before normal device operation can proceed.

3.2 Serial Data (SDA)

This is a bidirectional pin used to transfer addresses
and data into and out of the device. It is an open drain
terminal. Therefore, the SDA bus requires a pull-up
resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for
400 kHz and 1 MHz).
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.

© 2007 Microchip Technology Inc. DS21930B-page 9

24AAXX/24LCXX/24FCXX
4.0 FUNCTIONAL DESCRIPTION
Each 24XX device supports a bidirectional, 2-wire bus
and data transmission protocol. A device that sends
data onto the bus is defined as a transmitter, while a
device receiving data is defined as a receiver. The bus
has to be controlled by a master device which gener-
ates the Serial Clock (SCL), controls the bus access
and generates the Start and Stop conditions, while the
24XX works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.

Block Diagram
A0*A1*A2* WP* HV Generator

I/O Memory EEPROM

Control Control XDEC Array
Logic Logic
Page Latches*

I/O
SCL
YDEC
SDA

VCC
VSS Sense Amp.
R/W Control

* A0, A1, A2, WP and page latches are not used by some
devices.
See Table 1-1, Device Selection Table, for details.

DS21930B-page 10 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX
5.0 BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 5-1).

5.1 Bus Not Busy (A)

Both data and clock lines remain high.

5.2 Start Data Transfer (B)

A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.

5.3 Stop Data Transfer (C)

A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.

5.4 Data Valid (D)

The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of data
bytes transferred between Start and Stop conditions is
determined by the master device.

© 2007 Microchip Technology Inc. DS21930B-page 11

24AAXX/24LCXX/24FCXX
5.5 Acknowledge The device that acknowledges has to pull down the
SDA line during the acknowledge clock pulse in such a
Each receiving device, when addressed, is obliged to way that the SDA line is stable low during the high
generate an acknowledge after the reception of each period of the acknowledge related clock pulse. Of
byte. The master device must generate an extra clock course, setup and hold times must be taken into
pulse which is associated with this Acknowledge bit. account. During reads, a master must signal an end-of-
Note: During a write cycle, the 24XX will not data to the slave by not generating an Acknowledge bit
acknowledge commands. on the last byte that has been clocked out of the slave.
In this case, the slave (24XX) will leave the data line
high to enable the master to generate the Stop
condition (Figure 5-2).

FIGURE 5-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS

(A) (B) (D) (D) (C) (A)

SCL

SDA

Start Address or Data Stop

Condition Acknowledge Allowed Condition
Valid to Change

FIGURE 5-2: ACKNOWLEDGE TIMING

Acknowledge
bit

SCL 1 2 3 4 5 6 7 8 9 1 2 3

SDA Data from transmitter Data from transmitter

Transmitter must release the SDA line at this point, Receiver must release the SDA line
allowing the Receiver to pull the SDA line low to at this point so the Transmitter can
acknowledge the previous eight bits of data. continue sending data.

DS21930B-page 12 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX
5.6 Device Addressing For Devices The last bit of the control byte defines the operation to
Without Functional Address Pins be performed. When set to ‘1’, a read operation is
selected. When set to ‘0’ a write operation is selected.
A control byte is the first byte received following the Following the Start condition, the 24XX monitors the
Start condition from the master device (Figure 5-3). SDA bus. Upon receiving a ‘1010’ code, the block
The control byte begins with a four-bit control code. For select bits and the R/W bit, the slave device outputs an
the 24XX, this is set as ‘1010’ binary for read and write Acknowledge signal on the SDA line. The address byte
operations. The next three bits of the control byte are follows the acknowledge.
the block-select bits (B2, B1, B0). They are used by the
master device to select which of the 256-word blocks of
memory are to be accessed. These bits are in effect the
three Most Significant bits of the word address. Note
that B2, B1 and B0 are “don’t care” for the 24XX00, the
24XX01 and 24XX02. B2 and B1 are “don’t care” for
the 24XX04. B2 is “don’t care” for the 24XX08.

FIGURE 5-3: CONTROL AND ADDRESS BYTE ASSIGNMENTS FOR

DEVICES WITHOUT ADDRESS PINS

Control Byte Address Byte

24XX00 S 1 0 1 0 x x x R/W ACK x x x x A3 . . A0

24XX01 S 1 0 1 0 x x x R/W ACK x A6 . . . . . A0
24XX02 S 1 0 1 0 x x x R/W ACK A7 . . . . . . A0
24XX04 S 1 0 1 0 x x B0 R/W ACK A7 . . . . . . A0
24XX08 S 1 0 1 0 x B1 B0 R/W ACK A7 . . . . . . A0
24XX016 S 1 0 1 0 B2 B1 B0 R/W ACK A7 . . . . . . A0
Acknowledge
bit
Start bit Control Code Block Select bits
Read/Write bit (read = 1, write = 0)
x = “don’t care” bit

© 2007 Microchip Technology Inc. DS21930B-page 13

24AAXX/24LCXX/24FCXX
5.7 Device Addressing For Devices The last bit of the control byte defines the operation to
With Functional Address Pins be performed. When set to a ‘1’, a read operation is
selected. When set to a ‘0’, a write operation is
A control byte is the first byte received following the selected.
Start condition from the master device (Figure 5-4).
For higher density devices (24XX32 through
The control byte begins with a 4-bit control code. For
24XX512), the next two bytes received define the
the 24XX, this is set as ‘1010’ binary for read and write
address of the first data byte. Depending on the prod-
operations. The next three bits of the control byte are
uct density, not all bits in the address high byte are
the Chip Select bits (A2, A1, A0). The Chip Select bits
used. A15, A14, A13 and A12 are “don’t care” for
allow the use of up to eight 24XX devices on the same
24XX32. A15, A14 and A13 are “don’t care” for
bus and are used to select which device is accessed.
24XX64. A15 and A14 are “don’t care” for 24XX128.
The Chip Select bits in the control byte must corre-
A15 is “don’t care” for 24XX256. All address bits are
spond to the logic levels on the corresponding A2, A1
used for the 24XX512. The upper address bits are
and A0 pins for the device to respond. These bits are,
transferred first, followed by the Less Significant bits.
in effect, the three Most Significant bits of the word
address. Following the Start condition, the 24XX monitors the
SDA bus. Upon receiving a ‘1010’ code, appropriate
For 24XX128 and 24XX256 in the MSOP package, the
device select bits and the R/W bit, the slave device out-
A0 and A1 pins are not connected. During device
puts an Acknowledge signal on the SDA line. The
addressing, the A0 and A1 Chip Select bits (Figure 5-4)
address byte(s) follow the acknowledge.
should be set to ‘0’. Only two 24XX128 or 24XX256
MSOP packages can be connected to the same bus.

FIGURE 5-4: CONTROL AND ADDRESS BYTE ASSIGNMENTS FOR

DEVICES WITH ADDRESS PINS

Control Byte Address Byte

24C01C S 1 0 1 0 A2 A1 A0 R/W ACK x A6 . . . . . A0

24C02C S 1 0 1 0 A2 A1 A0 R/W ACK A7 . . . . . . A0
24XX024/025 S 1 0 1 0 A2 A1 A0 R/W ACK A7 . . . . . . A0

Control Byte Address High Byte Address Low Byte

24XX32 S 1 0 1 0 A2 A1 A0 R/W ACK x x x x A11 A10 A9 A8 A7 . . . . . . A0

24XX64 S 1 0 1 0 A2 A1 A0 R/W ACK x x x A12 A11 A10 A9 A8 A7 . . . . . . A0
24XX128 S 1 0 1 0 A2 A1 A0 R/W ACK x x A13 A12 A11 A10 A9 A8 A7 . . . . . . A0
24XX256 S 1 0 1 0 A2 A1 A0 R/W ACK x A14 A13 A12 A11 A10 A9 A8 A7 . . . . . . A0
24XX512 S 1 0 1 0 A2 A1 A0 R/W ACK A15 A14 A13 A12 A11 A10 A9 A8 A7 . . . . . . A0

Control Code Chip Select bits* Acknowledge

Start bit bit
Read/Write bit
(Read = 1, Write = 0)

x = “don’t care” bit

* Chip Select bits A1 and A0 must be set to ‘0’ for 24XX128/256 devices in the MSOP package.

DS21930B-page 14 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX
5.7.1 CONTIGUOUS ADDRESSING
ACROSS MULTIPLE DEVICES
Chip Select bits A2, A1 and A0 can be used to expand
the contiguous address space by adding up to eight
24XXs on the same bus. Software can use the three
address bits of the control byte as the three Most
Significant bits of the address byte. For example, in the
24XX32 devices, software can use A0 of the control
byte as address bit A12; A1 as address bit A13; and A2
as address bit A14 (Table 5-1). It is not possible to
sequentially read across device boundaries.

TABLE 5-1: CONTROL BYTE ADDRESS BITS

Maximum
Maximum Chip Select Bit Chip Select Bit Chip Select Bit
Contiguous
Devices A2 A1 A0
Address Space
1K (24C01C) 8 8 Kb A10 A9 A8
1K (24XX014) 8 8 Kb A10 A9 A8
2K (24C02C) 8 16 Kb A10 A9 A8
2K (24XX024/025) 8 16 Kb A10 A9 A8
32K (24XX32) 8 256 Kb A14 A13 A12
64K (24XX64) 8 512 Kb A15 A14 A13
128K (24XX128) 8* 1 Mb A16* A15* A14
256K (24XX256) 8* 2 Mb A17* A16* A15
512K (24XX512) 8 4 Mb A18 A17 A16
* Up to two 24XX128 or 24XX256 devices in the MSOP package can be added for up to 256 kb or 512 kb of address
space, respectively. Bits A0 and A1 must be set to ‘0’.

© 2007 Microchip Technology Inc. DS21930B-page 15

24AAXX/24LCXX/24FCXX
6.0 WRITE OPERATIONS For the 24XX00 devices, only the lower four address
bits are used by the device. The upper four bits are
“don’t cares.”
6.1 Byte Write
After receiving the ACK from the 24XX acknowledging
A byte write operation begins with a Start condition the final address byte, the master device transmits the
from the master followed by the four-bit control code data word to be written into the addressed memory
(see Figure 6-1 and Figure 6-2). The next 3 bits are location. The 24XX acknowledges again and the
either the Block Address bits (for devices without master generates a Stop condition, which initiates the
address pins) or the Chip Select bits (for devices with internal write cycle.
address pins). Then the master transmitter clocks the
R/W bit (which is a logic low) onto the bus. The slave If an attempt is made to write to an array with the WP
then generates an Acknowledge bit during the ninth pin held high, the device will acknowledge the
clock cycle. command, but no write cycle will occur, no data will be
written, and the device will immediately accept a new
The next byte transmitted by the master is the address command. After a byte Write command, the internal
byte (for 128-bit to 16 Kbit devices) or the high-order address counter will increment to the next address
address byte (for 32-512 Kbit devices). For 32 through location. During a write cycle, the 24XX will not
512 Kbit devices, the high-order address byte is acknowledge commands.
followed by the low-order address byte. In either case,
each address byte is acknowledged by the 24XX and
the address bits are latched into the internal address
counter of the 24XX.

FIGURE 6-1: BYTE WRITE: 128-BIT TO 16 KBIT DEVICES

S S
Bus Activity T Control Address Data T
Master A Byte Byte Byte O
R P
T

SDA Line S P

A A A
Bus Activity C C C
K K K

FIGURE 6-2: BYTE WRITE: 32 TO 512 KBIT DEVICES

S
Bus Activity T S
Control High Order Low Order Data
Master A T
R Byte Address Byte Address Byte Byte O
T P
SDA Line S P

Bus Activity A A A A
C C C C
K K K K

DS21930B-page 16 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX
6.2 Page Write 6.3 Write-Protection
The write control byte, word address byte(s), and the The WP pin allows the user to write-protect the array
first data byte are transmitted to the 24XX in much the when the pin is tied to VCC. See Device Selection
same way as in a byte write (see Figure 6-3 and Table 1-1 for the write-protect scheme of each device.
Figure 6-4). The exception is that instead of generating If tied to VSS, the write protection is disabled. The WP
a Stop condition, the master transmits up to one page pin is sampled prior to the Stop bit for every Write
of bytes(1), which is temporarily stored in the on-chip command (Figure 2-1). Toggling the WP pin after the
page buffer. This data is then written into memory once Stop bit will have no effect on the execution of the write
the master has transmitted a Stop condition. Upon cycle.
receipt of each word, the internal address counter is
incremented by one. If the master should transmit more Note: Page write operations are limited to
than one page of data prior to generating the Stop con- writing bytes within a single physical
dition, the address counter will roll over and the previ- page, regardless of the number of
ously received data will be overwritten. As with the byte bytes actually being written. Physical
write operation, once the Stop condition is received, an page boundaries start at addresses
internal write cycle begins. During the write cycle, the that are integer multiples of the page
24XX will not acknowledge commands. buffer size (or ‘page size’) and end at
addresses that are integer multiples of
Page writes can be any number of bytes within a page
[page size – 1]. If a Page Write
(up to the page size), starting at any address. Only the
command attempts to write across a
data bytes being addressed will be changed within the
physical page boundary, the result is
page.
that the data wraps around to the
If an attempt is made to write to the array with the WP beginning of the current page (over-
pin held high, the device will acknowledge the writing data previously stored there),
command, but no write cycle will occur, no data will be instead of being written to the next
written and the device will immediately accept a new page, as might be expected. It is there-
command. fore necessary for the application soft-
Note 1: See Device Selection Table 1-1 for the ware to prevent page write operations
page size of each device. that would attempt to cross a page
boundary.

FIGURE 6-3: PAGE WRITE: 1 KB TO 16 KBIT DEVICES

S S
Bus Activity T Control Address T
A Initial Second Final
Master Byte Byte Data Byte Data Byte Data Byte* O
R P
T
SDA Line S P
A A A A A
Bus Activity C C C C C
K K K K K

FIGURE 6-4: PAGE WRITE: 32 TO 512 KBIT DEVICES

S
T Initial Final S
Bus Activity A Control High Order Low Order T
Byte Address Byte Address Byte Data Byte Data Byte*
Master R O
T P
SDA Line S P
A A A A A
Bus Activity C C C C C
K K K K K

* See Table 1-1 for maximum number of data bytes in a page.

© 2007 Microchip Technology Inc. DS21930B-page 17

24AAXX/24LCXX/24FCXX
7.0 ACKNOWLEDGE POLLING FIGURE 7-1: ACKNOWLEDGE
POLLING FLOW
Since the device will not acknowledge commands
during a write cycle, this can be used to determine
when the cycle is complete (This feature can be used
to maximize bus throughput). Once the Stop condition Send
for a Write command has been issued from the master, Write Command
the device initiates the internally timed write cycle. ACK
polling can be initiated immediately. This involves the
master sending a Start condition, followed by the con- Send Stop
trol byte for a Write command (R/W = 0). If the device Condition to
is still busy with the write cycle, then no ACK will be Initiate Write Cycle
returned. If no ACK is returned, the Start bit and control
byte must be re-sent. If the cycle is complete, then the
device will return the ACK and the master can then pro-
ceed with the next Read or Write command. See Send Start
Figure 7-1 for flow diagram.

Send Control Byte

with R/W = 0

Did Device No
Acknowledge
(ACK = 0)?
Yes

Next
Operation

DS21930B-page 18 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX
8.0 READ OPERATION 8.2 Random Read
Read operations are initiated in much the same way as Random read operations allow the master to access
write operations with the exception that the R/W bit of any memory location in a random manner. To perform
the control byte is set to ‘1’. There are three basic types this type of read operation, the byte address must first
of read operations: current address read, random read be set. This is done by sending the byte address to the
and sequential read. 24XX as part of a write operation (R/W bit set to ‘0’).
Once the byte address is sent, the master generates a
8.1 Current Address Read Start condition following the acknowledge. This termi-
nates the write operation, but not before the internal
The 24XX contains an address counter that maintains
address counter is set. The master then issues the
the address of the last byte accessed, internally incre-
control byte again, but with the R/W bit set to a ‘1’. The
mented by ‘1’. Therefore, if the previous read or write
24XX will then issue an acknowledge and transmit the
operation was to address ‘n’ (n is any legal address),
8-bit data byte. The master will not acknowledge the
the next current address read operation would access
transfer but does generate a Stop condition, which
data from address n + 1.
causes the 24XX to discontinue transmission
Upon receipt of the control byte with R/W bit set to ‘1’, (Figure 8-2 and Figure 8-3). After a random Read
the 24XX issues an acknowledge and transmits the command, the internal address counter will increment
8-bit data byte. The master will not acknowledge the to the next address location.
transfer, but does generate a Stop condition and the
24XX discontinues transmission (Figure 8-1).

FIGURE 8-1: CURRENT ADDRESS

READ
S
T S
Bus Activity A Control Data T
Master R Byte Byte O
T P
SDA Line S P
A N
Bus Activity C O
K
A
C
K

FIGURE 8-2: RANDOM READ: 128-BIT TO 16 KBIT DEVICES

S S
Bus Activity T Control Address T Control Data S
Master A Byte Byte (n) A Byte Byte T
R R O
T T P
S S P
SDA Line
A A A N
C C C O
K K K
Bus Activity A
C
K

FIGURE 8-3: RANDOM READ: 32 TO 512 KBIT DEVICES

S S
Bus Activity T T S
Master A Control High Order Low Order A Control Data T
R Byte Address Byte Address Byte R Byte Byte O
T T P
SDA Line S S P
A A A A N
Bus Activity C C C C O
K K K K A
C
K

© 2007 Microchip Technology Inc. DS21930B-page 19

24AAXX/24LCXX/24FCXX
8.3 Sequential Read
Sequential reads are initiated in the same way as a
random read except that after the 24XX transmits the
first data byte, the master issues an acknowledge as
opposed to the Stop condition used in a random read.
This acknowledge directs the 24XX to transmit the next
sequentially addressed data byte (Figure 8-4). Follow-
ing the final byte transmitted to the master, the master
will NOT generate an acknowledge but will generate a
Stop condition. To provide sequential reads, the 24XX
contains an internal Address Pointer which is incre-
mented by one at the completion of each operation.
This Address Pointer allows the entire memory con-
tents to be serially read during one operation. If the last
address byte in the array is acknowledged, the Address
Pointer will roll over to address 0x00.

FIGURE 8-4: SEQUENTIAL READ

Control Initial Final S
Bus Activity Second Third T
Byte Data Byte Data Byte Data Byte Data Byte
Master O
P

SDA Line P
A A A A N
C C C C O
Bus Activity K K K K A
C
K

DS21930B-page 20 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX
APPENDIX A: REVISION HISTORY

Revision A
Original release of document. Combined Serial
EEPROM 24XXX device data sheets.

Revision B (02/2007)
Change 1.8V to 1.7V; Removed 14-Lead TSSOP
Package; Replaced Package Drawings; Revised
Product ID Section. Updates throughout.

© 2007 Microchip Technology Inc. DS21930B-page 21

24AAXX/24LCXX/24FCXX
9.0 PACKAGING INFORMATION

9.1 Package Marking Information

8-Lead PDIP Example: Pb-free

XXXXXXXX 24LC01B
XXXXXNNN I/P e3 1L7
YYWW 0528

8-Lead PDIP Package Marking (Pb-free)

Line 1 Line 1 Line 1 Line 1

Device Device Device Device
Marking Marking Marking Marking
24AA00 24AA00 24LC00 24LC00 24C00 24C00
24AA01 24AA01 24LC01B 24LC01B
24AA014 24AA014 24LC014 24LC014
24C01C 24C01C
24AA02 24AA02 24LC02B 24LC02B
24AA024 24AA024 24LC024 24LC024
24AA025 24AA025 24LC025 24LC025
24C02C 24C02C
24AA04 24AA04 24LC04B 24LC04B
24AA08 24AA08 24LC08B 24LC08B
24AA16 24AA16 24LC16B 24LC16B
24AA32A 24AA32A 24LC32A 24LC32A
24AA64 24AA64 24LC64 24LC64 24FC64 24FC64
24AA128 24AA128 24LC128 24LC128 24FC128 24FC128
24AA256 24AA256 24LC256 24LC256 24FC256 24FC256
24AA512 24AA512 24LC512 24LC512 24FC512 24FC512

Legend: XX...X Part number or part number code

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code (2 characters for small packages)
e3 Pb-free JEDEC designator for Matte Tin (Sn) plated devices

Note: For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.

DS21930B-page 22 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX

8-Lead SOIC Example: Pb-free

XXXXXXXX 24LC01BI
XXXXXNNN SN e3 0528
YYWW 1L7

8-Lead SOIC Package Marking (Pb-free)

Line 1 Line 1 Line 1 Line 1

Device Device Device Device
Marking Marking Marking Marking
24AA00 24AA00T 24LC00 24LC00T 24C00 24C00T
24AA01 24AA01T 24LC01B 24LC01BT
24AA014 24AA014T 24LC014 24LC014T
24C01C 24C01CT
24AA02 24AA02T 24LC02B 24LC02BT
24AA024 24AA024T 24LC024 24LC024T
24AA025 24AA025T 24LC025 24LC025T
24C02C 24C02CT
24AA04 24AA04T 24LC04B 24LC04BT
24AA08 24AA08T 24LC08B 24LC08BT
24AA16 24AA16T 24LC16B 24LC16BT
24AA32A 24AA32AT 24LC32A 24LC32AT
24AA64 24AA64T 24LC64 24LC64T 24FC64 24FC64T
24AA128 24AA128T 24LC128 24LC128T 24FC128 24FC128T
24AA256 24AA256T 24LC256 24LC256T 24FC256 24FC256T
24AA512 24AA512T 24LC512 24LC512T 24FC512 24FC512T
Note: T = Temperature range: I = Industrial, E = Extended

Legend: XX...X Part number or part number code

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code (2 characters for small packages)
e3 Pb-free JEDEC designator for Matte Tin (Sn) plated devices

Note: For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.

© 2007 Microchip Technology Inc. DS21930B-page 23

24AAXX/24LCXX/24FCXX

8-Lead 2x3 DFN Example:

XXX 244
YWW 506
NN L7

8-Lead 2x3mm DFN Package Marking (Pb-free)

Industrial Industrial E-Temp Industrial E-Temp

Device Line 1 Device Line 1 Line 1 Device Line 1 Line 1
Marking Marking Marking Marking Marking
24AA00 201 24LC00 204 205 24C00 207 208
24AA01 211 24LC01B 214 215
24AA014 2N1 24LC014 2N4 2N5
24C01C 2N7 2N8
24AA02 221 24LC02B 224 225
24AA024 2P1 24LC024 2P4 2P5
24AA025 2R1 24LC025 2R4 2R5
24C02C 2P7 2P8
24AA04 231 24LC04B 234 235
24AA08 241 24LC08B 244 245
24AA16 251 24LC16B 254 255
24AA32A 261 24LC32A 264 265
24AA64 271 24LC64 274 275 24FC64 27A 27B

Legend: XX...X Part number or part number code

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code (2 characters for small packages)
e3 Pb-free JEDEC designator for Matte Tin (Sn) plated devices

Note: For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

DS21930B-page 24 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX

8-Lead DFN Example: Pb-free

XXXXXXX 24AA128
T/XXXXX I/MF e3
YYWW 0528
NNN 1L7

8-Lead 5x6mm DFN Package Marking (Pb-free)

Line 1 Line 1 Line 1

Device Device Device
Marking Marking Marking
24AA128 24AA128 24LC128 24LC128 24FC128 24FC128
24AA256 24AA256 24LC256 24LC256 24FC256 24FC256
24AA512 24AA512 24LC512 24LC512 24FC512 24FC512
Note: Temperature range (T) listed on second line. I = Industrial, E = Extended

Legend: XX...X Part number or part number code

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code (2 characters for small packages)
e3 Pb-free JEDEC designator for Matte Tin (Sn) plated devices

Note: For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

© 2007 Microchip Technology Inc. DS21930B-page 25

24AAXX/24LCXX/24FCXX

5-Lead SOT-23 Example:

XXNN 5EL7

5-Lead SOT-23 Package Marking (Pb-free)

Comm. Indust. Comm. Indust. E-Temp Comm. Indust. E-Temp

Device Device Device
Marking Marking Marking Marking Marking Marking Marking Marking
24AA00 A0NN B0NN 24LC00 L0NN M0NN N0NN 24C00 C0NN D0NN E0NN
24AA01 A1NN B1NN 24LC01B L1NN M1NN N1NN
24AA02 A2NN B2NN 24LC02B L2NN M2NN N2NN
24AA04 A3NN B3NN 24LC04B L3NN M3NN N3NN
24AA08 A4NN B4NN 24LC08B L4NN M4NN N4NN
24AA16 A5NN B5NN 24LC16B L5NN M5NN N5NN

Legend: XX...X Part number or part number code

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code (2 characters for small packages)
e3 Pb-free JEDEC designator for Matte Tin (Sn) plated devices

Note: For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

DS21930B-page 26 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX

8-Lead MSOP (150 mil) Example:

XXXXXXT 4L8BI
YWWNNN 2281L7

8-Lead MSOP Package Marking (Pb-free)

Line 1 Line 1 Line 1 Line 1

Device Device Device Device
Marking Marking Marking Marking
24AA01 4A01T 24LC01B 4L1BT
24AA014 4A14T 24LC014 4L14T
24C01C 4C1CT
24AA02 4A02T 24LC02B 4L2BT
24AA024 4A24T 24LC024 4L24T
24AA025 4A25T 24LC025 4L25T
24C02C 4C2CT
24AA04 4A04T 24LC04B 4L4BT
24AA08 4A08T 24LC08B 4L8BT
24AA16 4A16T 24LC16B 4L16T
24AA32A 4A32AT 24LC32A 4L32AT
24AA64 4A64T 24LC64 4L64T 24FC64 4F64T
24AA128 4A128T 24LC128 4L128T 24FC128 4F128T
24AA256 4A256T 24LC256 4L256T 24FC256 4F256T
Note: T = Temperature range: I = Industrial, E = Extended

Legend: XX...X Part number or part number code

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code (2 characters for small packages)
e3 Pb-free JEDEC designator for Matte Tin (Sn) plated devices

Note: For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

© 2007 Microchip Technology Inc. DS21930B-page 27

24AAXX/24LCXX/24FCXX

8-Lead TSSOP Example:

XXXX 4L08
TYWW I228
NNN 1L7

8-Lead TSSOP Package Marking (Pb-free)

Line 1 Line 1 Line 1 Line 1

Device Device Device Device
Marking Marking Marking Marking
24AA00 4A00 24LC00 4L00 24C00 4C00
24AA01 4A01 24LC01B 4L1B
24AA014 4A14 24LC014 4L14
24C01C 4C1C
24AA02 4A02 24LC02B 4L02
24AA024 4A24 24LC024 4L24
24AA025 4A25 24LC025 4L25
24C02C 4C2C
24AA04 4A04 24LC04B 4L04
24AA08 4A08 24LC08B 4L08
24AA16 4A16 24LC16B 4L16
24AA32A 4AA 24LC32A 4LA
24AA64 4AB 24LC64 4LB 24FC64 4FB
24AA128 4AC 24LC128 4LC 24FC128 4FC
24AA256 4AD 24LC256 4LD 24FC256 4FD
Note: T = Temperature range: I = Industrial, E = Extended

Legend: XX...X Part number or part number code

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code (2 characters for small packages)
e3 Pb-free JEDEC designator for Matte Tin (Sn) plated devices

Note: For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

DS21930B-page 28 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX

8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

NOTE 1
E1

1 2 3

D
E

A A2

A1 L
c

e
b1 eB
b

Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e .100 BSC
Top to Seating Plane A – – .210
Molded Package Thickness A2 .115 .130 .195
Base to Seating Plane A1 .015 – –
Shoulder to Shoulder Width E .290 .310 .325
Molded Package Width E1 .240 .250 .280
Overall Length D .348 .365 .400
Tip to Seating Plane L .115 .130 .150
Lead Thickness c .008 .010 .015
Upper Lead Width b1 .040 .060 .070
Lower Lead Width b .014 .018 .022
Overall Row Spacing § eB – – .430
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-018B

© 2007 Microchip Technology Inc. DS21930B-page 29

24AAXX/24LCXX/24FCXX

8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

e
N

E1

NOTE 1

1 2 3
h α
b
h

c
A A2 φ

A1 L

L1 β

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 1.27 BSC
Overall Height A – – 1.75
Molded Package Thickness A2 1.25 – –
Standoff § A1 0.10 – 0.25
Overall Width E 6.00 BSC
Molded Package Width E1 3.90 BSC
Overall Length D 4.90 BSC
Chamfer (optional) h 0.25 – 0.50
Foot Length L 0.40 – 1.27
Footprint L1 1.04 REF
Foot Angle φ 0° – 8°
Lead Thickness c 0.17 – 0.25
Lead Width b 0.31 – 0.51
Mold Draft Angle Top α 5° – 15°
Mold Draft Angle Bottom β 5° – 15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-057B

DS21930B-page 30 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX

8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

D e
b
N N
L

E E2

EXPOSED PAD

NOTE 1
NOTE 1
1 2 2 1
D2
TOP VIEW BOTTOM VIEW

A3 A1 NOTE 2

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 0.50 BSC
Overall Height A 0.80 0.90 1.00
Standoff A1 0.00 0.02 0.05
Contact Thickness A3 0.20 REF
Overall Length D 2.00 BSC
Overall Width E 3.00 BSC
Exposed Pad Length D2 1.30 – 1.75
Exposed Pad Width E2 1.50 – 1.90
Contact Width b 0.18 0.25 0.30
Contact Length L 0.30 0.40 0.50
Contact-to-Exposed Pad K 0.20 – –
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-123B

© 2007 Microchip Technology Inc. DS21930B-page 31

24AAXX/24LCXX/24FCXX
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

D e
L
b
N N

E E2

EXPOSED PAD

NOTE 1 NOTE 1
1 2 2 1
D2
TOP VIEW BOTTOM VIEW

A3 A1

NOTE 2

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 1.27 BSC
Overall Height A 0.80 0.85 1.00
Standoff A1 0.00 0.01 0.05
Contact Thickness A3 0.20 REF
Overall Length D 5.00 BSC
Overall Width E 6.00 BSC
Exposed Pad Length D2 3.90 4.00 4.10
Exposed Pad Width E2 2.20 2.30 2.40
Contact Width b 0.35 0.40 0.48
Contact Length L 0.50 0.60 0.75
Contact-to-Exposed Pad K 0.20 – –
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-122B

DS21930B-page 32 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX

5-Lead Plastic Small Outline Transistor (OT or CT) [SOT-23]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

b
N

E1

1 2 3
e
e1
D

A A2 c φ

A1 L

L1

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 5
Lead Pitch e 0.95 BSC
Outside Lead Pitch e1 1.90 BSC
Overall Height A 0.90 – 1.45
Molded Package Thickness A2 0.89 – 1.30
Standoff A1 0.00 – 0.15
Overall Width E 2.20 – 3.20
Molded Package Width E1 1.30 – 1.80
Overall Length D 2.70 – 3.10
Foot Length L 0.10 – 0.60
Footprint L1 0.35 – 0.80
Foot Angle φ 0° – 30°
Lead Thickness c 0.08 – 0.26
Lead Width b 0.20 – 0.51
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-091B

© 2007 Microchip Technology Inc. DS21930B-page 33

24AAXX/24LCXX/24FCXX

8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

D
N

E
E1

NOTE 1

1 2
e

c φ
A A2

A1 L1 L

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 0.65 BSC
Overall Height A – – 1.10
Molded Package Thickness A2 0.75 0.85 0.95
Standoff A1 0.00 – 0.15
Overall Width E 4.90 BSC
Molded Package Width E1 3.00 BSC
Overall Length D 3.00 BSC
Foot Length L 0.40 0.60 0.80
Footprint L1 0.95 REF
Foot Angle φ 0° – 8°
Lead Thickness c 0.08 – 0.23
Lead Width b 0.22 – 0.40
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-111B

DS21930B-page 34 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

E1

NOTE 1

1 2
b
e

c
A A2 φ

A1 L1 L

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 0.65 BSC
Overall Height A – – 1.20
Molded Package Thickness A2 0.80 1.00 1.05
Standoff A1 0.05 – 0.15
Overall Width E 6.40 BSC
Molded Package Width E1 4.30 4.40 4.50
Molded Package Length D 2.90 3.00 3.10
Foot Length L 0.45 0.60 0.75
Footprint L1 1.00 REF
Foot Angle φ 0° – 8°
Lead Thickness c 0.09 – 0.20
Lead Width b 0.19 – 0.30
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-086B

© 2007 Microchip Technology Inc. DS21930B-page 35

24AAXX/24LCXX/24FCXX
NOTES:

DS21930B-page 36 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX
THE MICROCHIP WEB SITE CUSTOMER SUPPORT
Microchip provides online support via our WWW site at Users of Microchip products can receive assistance
www.microchip.com. This web site is used as a means through several channels:
to make files and information easily available to • Distributor or Representative
customers. Accessible by using your favorite Internet
• Local Sales Office
browser, the web site contains the following
information: • Field Application Engineer (FAE)
• Technical Support
• Product Support – Data sheets and errata,
application notes and sample programs, design • Development Systems Information Line
resources, user’s guides and hardware support Customers should contact their distributor,
documents, latest software releases and archived representative or field application engineer (FAE) for
software support. Local sales offices are also available to help
• General Technical Support – Frequently Asked customers. A listing of sales offices and locations is
Questions (FAQ), technical support requests, included in the back of this document.
online discussion groups, Microchip consultant Technical support is available through the web site
program member listing at: http://support.microchip.com
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives

CUSTOMER CHANGE NOTIFICATION

SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.

© 2007 Microchip Technology Inc. DS21930B-page 37

24AAXX/24LCXX/24FCXX
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.

To: Technical Publications Manager Total Pages Sent ________

RE: Reader Response

From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________ FAX: (______) _________ - _________
Application (optional):
Would you like a reply? Y N

Device: 24AAXX/24LCXX/24FCXX Literature Number: DS21930B

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21930B-page 38 © 2007 Microchip Technology Inc.

 24AAXX/24LCXX/24FCXX
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X X /XX

Examples:
Device Part Packaging Temperature Package a) 24AA014-I/SN: 1 Kbit, Industrial
Number Medium Range Temperature, 1.7V, SOIC package
(Table 1-1) b) 24AA02T-I/OT: 2 Kbit, Industrial
Temperature, 1.7V, SOT-23 package,
Tape and Reel
c) 24LC16B-I/P: 16 Kbit, Industrial Tempera-
Device: See Table 1-1 ture, 2.5V, PDIP package
d) 24LC32A-E/MS: 32 Kbit, Extended
Temperature, 2.5V, MSOP package
Temperature I = -40°C to +85°C
e) 24LC64T-I/MC: 64 Kbit, Industrial
Range: E = -40°C to +125°C
Temperature, 2.5V 2x3 mm DFN package,
Tape and Reel
Packaging T = Tape and Reel f) 24FC512T-I/SM: 512 Kbit, Industrial
Medium: Blank = Tube Temperature, 1 MHz, SOIC package,
Tape and Reel

Package: P = Plastic DIP (300 mil body), 8-lead

SN = Plastic SOIC (3.90 mm body), 8-lead
SM = Plastic SOIC (208 mil body), 8-lead
ST = Plastic TSSOP (4.4 mm), 8-lead
MS = Plastic Micro Small Outline (MSOP), 8-lead
OT = SOT-23, 5-lead (Tape and Reel only)
MC = 2x3 mm DFN, 8-lead
MF = 5x6 mm DFN, 8-lead

© 2007 Microchip Technology Inc. DS21930B-page 39

24AAXX/24LCXX/24FCXX
NOTES:

DS21930B-page 40 © 2007 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device Trademarks

applications and the like is provided only for your convenience
The Microchip name and logo, the Microchip logo, Accuron,
and may be superseded by updates. It is your responsibility to
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
ensure that your application meets with your specifications.
PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and
MICROCHIP MAKES NO REPRESENTATIONS OR
SmartShunt are registered trademarks of Microchip
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
Technology Incorporated in the U.S.A. and other countries.
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, AmpLab, FilterLab, Linear Active Thermistor, Migratable
INCLUDING BUT NOT LIMITED TO ITS CONDITION, Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor
QUALITY, PERFORMANCE, MERCHANTABILITY OR and The Embedded Control Solutions Company are
FITNESS FOR PURPOSE. Microchip disclaims all liability registered trademarks of Microchip Technology Incorporated
arising from this information and its use. Use of Microchip in the U.S.A.
devices in life support and/or safety applications is entirely at Analog-for-the-Digital Age, Application Maestro, CodeGuard,
the buyer’s risk, and the buyer agrees to defend, indemnify and dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
hold harmless Microchip from any and all damages, claims, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
suits, or expenses resulting from such use. No licenses are In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
conveyed, implicitly or otherwise, under any Microchip MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
intellectual property rights. PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC®
MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.

© 2007 Microchip Technology Inc. DS21930B-page 41

 WORLDWIDE SALES AND SERVICE
AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
Corporate Office Asia Pacific Office India - Bangalore Austria - Wels
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Tel: 86-27-5980-5300 Tel: 66-2-694-1351
Fax: 408-961-6445
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China - Xian
Mississauga, Ontario,
Tel: 86-29-8833-7250
Canada
Fax: 86-29-8833-7256
Tel: 905-673-0699
Fax: 905-673-6509

12/08/06

DS21930B-page 42 © 2007 Microchip Technology Inc.