ESP32­PICO­V3­ZERO

Datasheet

Alexa Connect Kit (ACK) module with an Espressif chipset

2.4 GHz Wi­Fi + Bluetooth® + Bluetooth LE support
Built around ESP32 series of SiP, Xtensa® dual­core 32­bit LX6 microprocessor
4 MB flash available
On­board PCB antenna and external antenna connector

ESP32­PICO­V3­ZERO

Version 1.2
Espressif Systems
Copyright © 2021

www.espressif.com
1 Module Overview

1 Module Overview
Note:

Check the link or the QR code to make sure that you use the latest version of this document:
https://espressif.com/sites/default/files/documentation/esp32-pico-v3-zero_datasheet_en.pdf

1.1 Features

CPU and On­Chip Memory Peripherals

• ESP32 embedded, Xtensa dual-core 32-bit LX6 • 2 × UART (one for connection to the host and the
microprocessor, up to 240 MHz other for debugging), EN pin, and interrupt pin

• 448 KB ROM Integrated Components on Module

• 40 MHz crystal oscillator
• 520 KB SRAM
• 4 MB SPI flash
• 16 KB SRAM in RTC

Antenna Options
Wi­Fi • On board PCB antenna and a connector for
• 802.11b/g/n external antenna

• Bit rate: 802.11n up to 150 Mbps Operating Conditions

• Operating voltage/Power supply: 3.0 ~ 3.6 V
• A-MPDU and A-MSDU aggregation
• Operating temperature range: –40 ~ 85 °C
• 0.4 µs guard interval support
Certification
• Center frequency range of operating channel:
• Bluetooth certification: BQB (ID: D050108)
2412 ~ 2484 MHz
• RF certification:

Bluetooth – FCC (ID: 2AC7Z-ESP32PICOZERO)

• Bluetooth V4.2 BR/EDR and Bluetooth LE
– SRRC (CMIIT ID: 2020DP3148)
specification
– IC (ID: 21098-ESP32PICOV3)
• Class-1, class-2 and class-3 transmitter
– RCM
• AFH – CE-RED

• CVSD and SBC • Green certification: REACH/RoHS

1.2 Description
The ESP32-PICO-V3-ZERO is a module that is based on ESP32-PICO-V3, a System-in-Package (SiP) device. It
provides complete Wi-Fi and Bluetooth functionalities with embedded Xtensa dual-core 32-bit LX6
microprocessor. The module integrates a 4 MB SPI flash.

At the core of this module is the ESP32 chip, which is a single 2.4 GHz Wi-Fi and Bluetooth combo chip

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1 Module Overview

designed with TSMC’s 40 nm low-power technology. ESP32-PICO-V3-ZERO integrates all peripheral

components seamlessly, including a crystal oscillator, flash, filter capacitors and RF matching links in one single
package. Module assembly and testing are already done at SiP level. As such, ESP32-PICO-V3-ZERO reduces
the complexity of supply chain and improves control efficiency. It is ultra-small in size, with robust performance
and low energy consumption.

ESP32-PICO-V3-ZERO is a module for Alexa Connect Kit (ACK), a managed service that makes it easy to
integrate Alexa into your products. With ESP32-PICO-V3-ZERO and its default firmware, you can connect your
devices or system to Alexa and the Internet without worrying about managing cloud services, writing an Alexa
Skill, or developing complex networking and security firmware. If you add ESP32-PICO-V3-ZERO to your device,
you can easily, quickly and economically create products that customers love.

Note:

• For more information on ESP32, please refer to ESP32 Series Datasheet.

• For more information on ESP32-PICO-V3, please refer to ESP32-PICO-V3 Datasheet.

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Contents

Contents

1 Module Overview 2
1.1 Features 2
1.2 Description 2

2 Block Diagram 8

3 Pin Definitions 9
3.1 Pin Layout 9
3.2 Pin Description 10

4 Electrical Characteristics 11
4.1 Absolute Maximum Ratings 11
4.2 Recommended Operating Conditions 11
4.3 DC Characteristics (3.3 V, 25 °C) 11
4.4 Current Consumption Characteristics 12
4.5 Wi-Fi RF Characteristics 13
4.5.1 Wi-Fi RF Standards 13
4.5.2 Transmitter Characteristics 13
4.5.3 Receiver Characteristics 14
4.6 Bluetooth Radio 15
4.6.1 Receiver – Basic Data Rate 15
4.6.2 Transmitter – Basic Data Rate 16
4.6.3 Receiver – Enhanced Data Rate 16
4.6.4 Transmitter – Enhanced Data Rate 17
4.7 Bluetooth LE Radio 17
4.7.1 Receiver 17
4.7.2 Transmitter 18

5 Peripheral Schematics 19

6 Physical Dimensions and PCB Land Pattern 20

6.1 Physical Dimensions 20
6.2 PCB Layout 21
6.2.1 Recommended PCB Land Pattern 21
6.2.2 PCB Layout Guide 21
6.3 Dimensions of External Antenna Connector 23

7 Product Handling 24
7.1 Storage Conditions 24
7.2 Electrostatic Discharge (ESD) 24
7.3 Reflow Profile 24

8 Related Documentation and Resources 25

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Contents

Revision History 26

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List of Tables

List of Tables
1 Pin Definitions 10
2 Absolute Maximum Ratings 11
3 Recommended Operating Conditions 11
4 DC Characteristics (3.3 V, 25 °C) 11
5 Current Consumption Depending on RF Modes 12
6 Current Consumption Depending on Work Modes 13
7 Wi-Fi RF Standards 13
8 TX Power Characteristics 14
9 RX Sensitivity Characteristics 14
10 RX Maximum Input Level 15
11 Adjacent Channel Rejection 15
12 Receiver Characteristics – Basic Data Rate 15
13 Transmitter Characteristics – Basic Data Rate 16
14 Receiver Characteristics – Enhanced Data Rate 16
15 Transmitter Characteristics – Enhanced Data Rate 17
16 Receiver Characteristics – Bluetooth LE 18
17 Transmitter Characteristics – Bluetooth LE 18

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List of Figures

List of Figures
1 ESP32-PICO-V3-ZERO Block Diagram 8
2 Pin Layout (Top View) 9
3 Peripheral Schematics 19
4 Physical Dimensions 20
5 Recommended PCB Land Pattern 21
6 Module Placement on a Base Board 22
7 Keepout Zone for Module’s Antenna on the Base Board 22
8 Dimensions of External Antenna Connector 23
9 Reflow Profile 24

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2 Block Diagram

2 Block Diagram

Antenna

RF Matching
ESP32-PICO-V3-ZERO Module

3V3

ESP32-PICO-V3 RF Matching

RF Switch
Connector
UART to Host
Interrupt
Debug UART

EN

Figure 1: ESP32­PICO­V3­ZERO Block Diagram

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3 Pin Definitions

3 Pin Definitions

3.1 Pin Layout

The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 6.1 Physical Dimensions.

Antenna area
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin 64

Pin 63

Pin 62

Pin 61

Pin 60

Pin 59

Pin 58

Pin 57

Pin 56

Pin 55

Pin 54

Pin 53

Pin 52

Pin 51

Pin 50

Pin 49
Pin 65 Pin 68
GND GND

NC Pin 1 Pin 48 NC
NC Pin 2 Pin 47 INT_B/IO27
DBG_RXD/IO3 Pin 3 Pin 46 NC
DBG_TXD/IO1 Pin 4 Pin 45 U1RXD/IO22
NC Pin 5 Pin 44 GND
NC Pin 6 Pin 69 Pin 70 Pin 71 Pin 43 VDD33
GND GND GND

NC Pin 7 Pin 42 GND

NC Pin 8
Pin 72 Pin 73 Pin 74
Pin 41 U1TXD/IO19
GND GND GND
NC Pin 9 Pin 40 NC
NC Pin 10 Pin 39 NC
Pin 75 Pin 76 Pin 77
NC Pin 11 GND GND GND Pin 38 NC
GND Pin 12 Pin 37 GND
NC Pin 13 Pin 36 NC
NC Pin 14 Pin 35 NC
NC Pin 15 Pin 34 NC
NC Pin 16 Pin 33 NC
Pin 17

Pin 18

Pin 19

Pin 20

Pin 21

Pin 22

Pin 23

Pin 24

Pin 25

Pin 26

Pin 27

Pin 28

Pin 29

Pin 30

Pin 31

Pin 32

Pin 66 Pin 67
GND GND
EN
NC
NC

VDD33
GND
GND

GND
GND
GND
GND
GND
GND
GND
GND
GND
GND

Figure 2: Pin Layout (Top View)

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3 Pin Definitions

3.2 Pin Description

The module has 77 pins. See pin definitions in Table 1.

For peripheral pin configurations, please refer to ESP32 Series Datasheet.

Table 1: Pin Definitions

Name No. Type1 Function

1, 2, 5 ~ 11, 13 ~
NC 18, 33 ~ 36, 38 ~ NA Do not connect. These pins must be left floating.
40, 46, 48
DBG_RXD/IO3 3 I GPIO3, Debugging UART RX, GPIO3
DBG_TXD/IO1 4 O GPIO1, Debugging UART TX, GPIO1
High: On; enables the module
EN 19 I Low: Off; the module powers off
Note: Do not leave this pin floating.
VDD33 22 P Power supply (3.0 V ~ 3.6 V)
U1TXD/IO19 41 O UART TX, connected to host RX, GPIO19
VDD33 43 P Power supply (3.0 V ~ 3.6 V)
U1RXD/IO22 45 I UART RX, connected to host TX, GPIO22
INT_B/IO27 47 O Host interrupt, connected to host GPIO, GPIO27
12, 20, 21, 23 ~ 32,
GND P Ground
37, 42, 44, 49 ~ 77
1
P: power supply; I: input; O: output.
2
IO7/IO8/IO9/IO10/IO20 belong to VDD_SDIO power domain and can not work when VDD_SDIO power
shuts down.

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4 Electrical Characteristics

4 Electrical Characteristics

4.1 Absolute Maximum Ratings

Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These
are stress ratings only and functional operation of the device at these or any other conditions beyond those
indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.

Table 2: Absolute Maximum Ratings

Symbol Parameter Min Max Unit

VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 85 °C
*
Please see Appendix IO MUX of
ESP32 Series Datasheet for IO’s power domain.

4.2 Recommended Operating Conditions

Table 3: Recommended Operating Conditions

Symbol Parameter Min Typ Max Unit

VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 — — A
T Operating ambient temperature –40 — 85 °C

4.3 DC Characteristics (3.3 V, 25 °C)

Table 4: DC Characteristics (3.3 V, 25 °C)

Symbol Parameter Min Typ Max Unit

CIN Pin capacitance — 2 — pF
1 1
VIH High-level input voltage 0.75 × VDD — VDD + 0.3 V
1
VIL Low-level input voltage –0.3 — 0.25 × VDD V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
1
VOH High-level output voltage 0.8 × VDD — — V
1
VOL Low-level output voltage — — 0.1 × VDD V
Cont’d on next page

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4 Electrical Characteristics

Table 4 – cont’d from previous page

Symbol Parameter Min Typ Max Unit
High-level source current VDD3P3_CPU
— 40 — mA
(VDD = 3.3 V, VOH >= 2.64 V, power domain 1, 2
1
IOH
output drive strength set to VDD3P3_RTC
— 40 — mA
the maximum) power domain 1, 2
Low-level sink current
IOL (VDD1= 3.3 V, VOL = 0.495 V, — 28 — mA
output drive strength set to the maximum)
RP U Resistance of internal pull-up resistor — 45 — kΩ
RP D Resistance of internal pull-down resistor — 45 — kΩ
Low-level input voltage of CHIP_PU
VIL_nRST — — 0.6 V
to power off the chip
1
Please see Appendix IO MUX of ESP32 Series Datasheet for IO’s power domain. VDD is the I/O voltage
for a particular power domain of pins.
2
For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is grad-
ually reduced from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins
increases.

4.4 Current Consumption Characteristics

Owing to the use of advanced power-management technologies, the module can switch between different power
modes. For details on different power modes, please refer to Section RTC and Low-Power Management
in ESP32 Series Datasheet.

Table 5: Current Consumption Depending on RF Modes

Work mode Description Average (mA) Peak (mA)

802.11b, 20 MHz, 1 Mbps, @19.5 dBm 233 368
802.11g, 20 MHz, 54 Mbps, @14 dBm 181 258
TX
802.11n, 20 MHz, MCS7, @13 dBm 178 248
Active (RF working)
802.11n, 40 MHz, MCS7, @13 dBm 162 205
802.11b/g/n, 20 MHz 110 111
RX2
802.11n, 40 MHz 116 117
1
The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at
the RF port. All transmitters’ measurements are based on a 50% duty cycle.
2
The current consumption figures in RX mode are for cases when the peripherals are disabled and the CPU
idle.

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4 Electrical Characteristics

Table 6: Current Consumption Depending on Work Modes

Work mode Description Current consumption (Typ)

The CPU is 240 MHz 30 ~ 68 mA
1, 2 3
Modem-sleep powered on 160 MHz 27 ~ 44 mA
Normal speed: 80 MHz 20 ~ 31 mA
Light-sleep — 0.8 mA
4
The ULP coprocessor is powered on 150 µA
ULP sensor-monitored pattern 5 100 µA @1% duty
Deep-sleep
RTC timer + RTC memory 10 µA
RTC timer only 5 µA
Power off CHIP_PU is set to low level, the chip is powered off 1 µA
1
The current consumption figures in Modem-sleep mode are for cases where the CPU is powered on and the
cache idle.
2
When Wi-Fi is enabled, the chip switches between Active and Modem-sleep modes. Therefore, current
consumption changes accordingly.
3
In Modem-sleep mode, the CPU frequency changes automatically. The frequency depends on the CPU load
and the peripherals used.
4
During Deep-sleep, when the ULP coprocessor is powered on, peripherals such as GPIO and RTC I2C are
able to operate.
5
The ”ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor works
periodically. When ADC works with a duty cycle of 1%, the typical current consumption is 100 µA.

4.5 Wi­Fi RF Characteristics

4.5.1 Wi­Fi RF Standards

Table 7: Wi­Fi RF Standards

Name Description
1
Center frequency range of operating channel 2412 ~ 2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n
11b: 1, 2, 5.5, 11 Mbps
20 MHz 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
Data rate
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz 11n: MCS0-7, 150 Mbps (Max)
Antenna type PCB antenna, external antenna2
1
Device should operate in the center frequency range allocated by regional regulatory authorities.
Target center frequency range is configurable by software.
2
For the modules that use external antennas, the output impedance is 50 Ω. For other modules
without external antennas, the output impedance is irrelevant.

4.5.2 Transmitter Characteristics

Target TX power is configurable based on device or certification requirements. The default characteristics are
provided in Table 8.

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4 Electrical Characteristics

Table 8: TX Power Characteristics

Rate Typ (dBm)

11b, 1 Mbps 19.5
11b, 11 Mbps 19.5
11g, 6 Mbps 18
11g, 54 Mbps 14
11n, HT20, MCS0 18
11n, HT20, MCS7 13
11n, HT40, MCS0 18
11n, HT40, MCS7 13

4.5.3 Receiver Characteristics

Table 9: RX Sensitivity Characteristics

Rate Typ (dBm)

1 Mbps –97
2 Mbps –94
5.5 Mbps –91
11 Mbps –88
6 Mbps –92
9 Mbps –91
12 Mbps –89
18 Mbps –87
24 Mbps –84
36 Mbps –80
48 Mbps –76
54 Mbps –75
11n, HT20, MCS0 –91
11n, HT20, MCS1 –88
11n, HT20, MCS2 –85
11n, HT20, MCS3 –83
11n, HT20, MCS4 –80
11n, HT20, MCS5 –75
11n, HT20, MCS6 –74
11n, HT20, MCS7 –72
11n, HT40, MCS0 –88
11n, HT40, MCS1 –85
11n, HT40, MCS2 –82
11n, HT40, MCS3 –80
11n, HT40, MCS4 –76
11n, HT40, MCS5 –72
11n, HT40, MCS6 –71
Cont’d on next page

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4 Electrical Characteristics

Table 9 – cont’d from previous page

Rate Typ (dBm)
11n, HT40, MCS7 –69

Table 10: RX Maximum Input Level

Rate Typ (dBm)

11b, 1 Mbps 5
11b, 11 Mbps 5
11g, 6 Mbps 0
11g, 54 Mbps –8
11n, HT20, MCS0 0
11n, HT20, MCS7 –8
11n, HT40, MCS0 0
11n, HT40, MCS7 –8

Table 11: Adjacent Channel Rejection

Rate Typ (dB)

11b, 11 Mbps 35
11g, 6 Mbps 27
11g, 54 Mbps 13
11n, HT20, MCS0 27
11n, HT20, MCS7 12
11n, HT40, MCS0 16
11n, HT40, MCS7 7

4.6 Bluetooth Radio

4.6.1 Receiver – Basic Data Rate

Table 12: Receiver Characteristics – Basic Data Rate

Parameter Conditions Min Typ Max Unit

Sensitivity @0.1% BER — –90 –89 –88 dBm
Maximum received signal @0.1% BER — 0 — — dBm
Co-channel C/I — — +7 — dB
F = F0 + 1 MHz — — –6 dB
F = F0 – 1 MHz — — –6 dB
F = F0 + 2 MHz — — –25 dB
Adjacent channel selectivity C/I
F = F0 – 2 MHz — — –33 dB
F = F0 + 3 MHz — — –25 dB
F = F0 – 3 MHz — — –45 dB
30 MHz ~ 2000 MHz –10 — — dBm
Cont’d on next page
Out-of-band blocking performance

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4 Electrical Characteristics

Table 12 – cont’d from previous page

Parameter Conditions Min Typ Max Unit
2000 MHz ~ 2400 MHz –27 — — dBm
2500 MHz ~ 3000 MHz –27 — — dBm
3000 MHz ~ 12.5 GHz –10 — — dBm
Intermodulation — –36 — — dBm

4.6.2 Transmitter – Basic Data Rate

Table 13: Transmitter Characteristics – Basic Data Rate

Parameter Conditions Min Typ Max Unit

*
RF transmit power — — 0 — dBm
Gain control step — — 3 — dB
RF power control range — –12 — +9 dBm
+20 dB bandwidth — — 0.9 — MHz
F = F0 ± 2 MHz — –55 — dBm
Adjacent channel transmit power F = F0 ± 3 MHz — –55 — dBm
F = F0 ± > 3 MHz — –59 — dBm
∆ f 1avg — — — 155 kHz
∆ f 2max — 127 — — kHz
∆ f 2avg /∆ f 1avg — — 0.92 — —
ICFT — — –7 — kHz
Drift rate — — 0.7 — kHz/50 µs
Drift (DH1) — — 6 — kHz
Drift (DH5) — — 6 — kHz
*
There are a total of eight power levels from 0 to 7, and the transmit power ranges from –12 dBm to 9
dBm. When the power level rises by 1, the transmit power increases by 3 dB. Power level 4 is used
by default and the corresponding transmit power is 0 dBm.

4.6.3 Receiver – Enhanced Data Rate

Table 14: Receiver Characteristics – Enhanced Data Rate

Parameter Conditions Min Typ Max Unit

π/4 DQPSK
Sensitivity @0.01% BER — –90 –89 –88 dBm
Maximum received signal @0.01% BER — — 0 — dBm
Co-channel C/I — — 11 — dB
F = F0 + 1 MHz — –7 — dB
F = F0 – 1 MHz — –7 — dB
F = F0 + 2 MHz — –25 — dB
Adjacent channel selectivity C/I
F = F0 – 2 MHz — –35 — dB
F = F0 + 3 MHz — –25 — dB
F = F0 – 3 MHz — –45 — dB
Cont’d on next page

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4 Electrical Characteristics

Table 14 – cont’d from previous page

Parameter Conditions Min Typ Max Unit
8DPSK
Sensitivity @0.01% BER — –84 –83 –82 dBm
Maximum received signal @0.01% BER — — –5 — dBm
C/I c-channel — — 18 — dB
F = F0 + 1 MHz — 2 — dB
F = F0 – 1 MHz — 2 — dB
F = F0 + 2 MHz — –25 — dB
Adjacent channel selectivity C/I
F = F0 – 2 MHz — –25 — dB
F = F0 + 3 MHz — –25 — dB
F = F0 – 3 MHz — –38 — dB

4.6.4 Transmitter – Enhanced Data Rate

Table 15: Transmitter Characteristics – Enhanced Data Rate

Parameter Conditions Min Typ Max Unit

RF transmit power (see note under Table 13) — — 0 — dBm
Gain control step — — 3 — dB
RF power control range — –12 — +9 dBm
π/4 DQPSK max w0 — — –0.72 — kHz
π/4 DQPSK max wi — — –6 — kHz
π/4 DQPSK max |wi + w0| — — –7.42 — kHz
8DPSK max w0 — — 0.7 — kHz
8DPSK max wi — — –9.6 — kHz
8DPSK max |wi + w0| — — –10 — kHz
RMS DEVM — 4.28 — %
π/4 DQPSK modulation accuracy 99% DEVM — 100 — %
Peak DEVM — 13.3 — %
RMS DEVM — 5.8 — %
8 DPSK modulation accuracy 99% DEVM — 100 — %
Peak DEVM — 14 — %
F = F0 ± 1 MHz — –46 — dBm
F = F0 ± 2 MHz — –44 — dBm
In-band spurious emissions
F = F0 ± 3 MHz — –49 — dBm
F = F0 +/– > 3 MHz — — –53 dBm
EDR differential phase coding — — 100 — %

4.7 Bluetooth LE Radio

4.7.1 Receiver

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4 Electrical Characteristics

Table 16: Receiver Characteristics – Bluetooth LE

Parameter Conditions Min Typ Max Unit

Sensitivity @30.8% PER — –94 –93 –92 dBm
Maximum received signal @30.8% PER — 0 — — dBm
Co-channel C/I — — +10 — dB
F = F0 + 1 MHz — –5 — dB
F = F0 – 1 MHz — –5 — dB
F = F0 + 2 MHz — –25 — dB
Adjacent channel selectivity C/I
F = F0 – 2 MHz — –35 — dB
F = F0 + 3 MHz — –25 — dB
F = F0 – 3 MHz — –45 — dB
30 MHz ~ 2000 MHz –10 — — dBm
2000 MHz ~ 2400 MHz –27 — — dBm
Out-of-band blocking performance
2500 MHz ~ 3000 MHz –27 — — dBm
3000 MHz ~ 12.5 GHz –10 — — dBm
Intermodulation — –36 — — dBm

4.7.2 Transmitter

Table 17: Transmitter Characteristics – Bluetooth LE

Parameter Conditions Min Typ Max Unit

RF transmit power (see note under Table 13) — — 0 — dBm
Gain control step — — 3 — dB
RF power control range — –12 — +9 dBm
F = F0 ± 2 MHz — –55 — dBm
Adjacent channel transmit power F = F0 ± 3 MHz — –57 — dBm
F = F0 ± > 3 MHz — –59 — dBm
∆ f 1avg — — — 265 kHz
∆ f 2max — 210 — — kHz
∆ f 2avg /∆ f 1avg — — +0.92 — —
ICFT — — –10 — kHz
Drift rate — — 0.7 — kHz/50 µs
Drift — — 2 — kHz

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 5 Peripheral Schematics

5 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).
5 4 3

GND

U1

77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
1 48
D 2 NC NC 47 INT_B/IO27
DBG_RXD/IO3 3 NC INT_B/IO27 46
DBG_TXD/IO1 4 DBG_RXD/IO3 NC 45 U1RXD/IO22
5 DBG_TXD/IO1 U1RXD/IO22 44
NC GND GND
6 43 VCC3V3
7 NC VDD33 42
NC GND GND
8 41 U1TXD/IO19
9 NC U1TXD/IO19 40
10 NC NC 39
11 NC NC 38
12 NC NC 37
GND GND GND GND
13 36
14 NC NC 35
15 NC NC 34
VDD33
16 NC NC 33
GND
GND

GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
NC NC
NC
NC
EN
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
ESP32-PICO-V3-ZERO
PWR_EN

C
VCC3V3

GND GND

VCC3V3

C1 C2
U2
10uF

0.1uF

VCC3V3 PWR_EN R8 TBD 1

INT_B/IO27 R9 TBD 2
U1TXD/IO19 R10 TBD 3
GND GND R1 U1RXD/IO22 R11 TBD 4
TBD

VCC3V3
SW1 R2
1 2 PWR_EN

C4 C5 1 2 0R
10uF

0.1uF

B C3 TBD Host_MCU

GND GND GND

GND J3 J4 GND J6
1 INT_B/IO27 2 1
U1RXD/IO22 2 1 DBG_RXD/IO3 2
U1TXD/IO19 3 DBG_TXD/IO1 3

CON3 GND CON2 CON3

Figure 3: Peripheral Schematics

A • To ensure that the power supply to the ESP32 chip is stable during power-up, it is advised to add an RC
delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C =
1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and
the power-up and reset sequence timing of the chip. For ESP32’s power-up and reset sequence timing
diagram, please refer to Section Power Scheme in ESP32 Series Datasheet.
5 4 3

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6 Physical Dimensions and PCB Land Pattern

6 Physical Dimensions and PCB Land Pattern

6.1 Physical Dimensions

ESP32-PICO-V3-ZERO Module Dimensions

Unit: mm

16±0.15 0.8±0.1
23±0.15

14
13.8

2.3±0.15

Top view Side view Bottom view

Figure 4: Physical Dimensions

Note:
For information about tape, reel, and product marking, please refer to Espressif Module Package Information.

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6 Physical Dimensions and PCB Land Pattern

6.2 PCB Layout

6.2.1 Recommended PCB Land Pattern

Unit: mm
: Pad
16

Antenna Area

0.6 1.2

23
15.4
13.8
12.4
11.6
10.8

16
5
0.6

1.2

10.8
11.6
12.4
13.8
15.4

Figure 5: Recommended PCB Land Pattern

6.2.2 PCB Layout Guide

To achieve the optimum RF performance on a device with on-board antenna, please follow the guidelines
below.

The module uses an inverted-F antenna design, and the antenna area of the module should have specific
placement against the base board. The feed point of the antenna should be as close to the board as possible.
The PCB antenna area should be placed outside the base board whenever possible while the module be put as
close as possible to the edge of the base board.

As is shown in Figure 6, examples 3 and 4 of the module position on the base board are highly recommended,
while examples 1, 2, and 5 are not recommended.

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6 Physical Dimensions and PCB Land Pattern

Figure 6: Module Placement on a Base Board

If the positions recommended above are not possible, then please make sure that the module is not covered by
any metal shell and that a clearance area (without copper, routing, or components) outside the antenna is large
enough, as shown in Figure 7. In addition, if there is base board under the antenna area, it is recommended to
cut it off to minimize its impact on the antenna.

Unit: mm
: Clearance Area

Max 2
Min 7
Max 1

Base board

Figure 7: Keepout Zone for Module’s Antenna on the Base Board

If the PCB layout does not follow the above rules, then RF throughput and RF range testing should be performed
to ensure that the end product performance is satisfactory. When designing an end product, pay attention to the
impact of enclosure on the antenna and verify the device performance by making RF verification.

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6 Physical Dimensions and PCB Land Pattern

6.3 Dimensions of External Antenna Connector

IPEX Connector Part No.: 20549-001E

Unit: mm

2.30

2.30
1.35

0.60

1.92

Figure 8: Dimensions of External Antenna Connector

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7 Product Handling

7 Product Handling

7.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.

After unpacking, the module must be soldered within 168 hours with the factory conditions 25 ± 5 °C and 60
%RH. If the above conditions are not met, the module needs to be baked.

7.2 Electrostatic Discharge (ESD)

• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V
• Air discharge: ±6000 V
• Contact discharge: ±4000 V

7.3 Reflow Profile

Solder the module in a single reflow.
Temperature (℃)

Peak Temp.
235 ~ 250 ℃
250
Preheating zone Reflow zone Cooling zone
150 ~ 200 ℃ 60 ~ 120 s 217 ℃ 60 ~ 90 s –1 ~ –5 ℃/s
217
200
Soldering time
> 30 s

Ramp-up zone
1 ~ 3 ℃/s
100

50

25
Time (sec.)
0
0 50 100 150 200 250

Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s

Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy

Figure 9: Reflow Profile

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8 Related Documentation and Resources

8 Related Documentation and Resources

Related Documentation
• ESP32 Technical Reference Manual – Detailed information on how to use the ESP32 memory and peripherals.
• ESP32 Series Datasheet – Specifications of the ESP32 hardware.
• ESP32 Hardware Design Guidelines – Guidelines on how to integrate the ESP32 into your hardware product.
• ESP32 ECO and Workarounds for Bugs – Correction of ESP32 design errors.
• Certificates
http://espressif.com/en/support/documents/certificates
• ESP32 Product/Process Change Notifications (PCN)
http://espressif.com/en/support/documents/pcns
• ESP32 Advisories – Information on security, bugs, compatibility, component reliability.
http://espressif.com/en/support/documents/advisories
• Documentation Updates and Update Notification Subscription
http://espressif.com/en/support/download/documents

Developer Zone
• ESP-IDF Programming Guide for ESP32 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
http://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
http://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
http://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
http://espressif.com/en/support/download/sdks-demos

Products
• ESP32 Series SoCs – Browse through all ESP32 SoCs.
http://espressif.com/en/products/socs?id=ESP32
• ESP32 Series Modules – Browse through all ESP32-based modules.
http://espressif.com/en/products/modules?id=ESP32
• ESP32 Series DevKits – Browse through all ESP32-based devkits.
http://espressif.com/en/products/devkits?id=ESP32
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
http://products.espressif.com/#/product-selector?language=en

Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
http://espressif.com/en/contact-us/sales-questions

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Revision History

Revision History

Date Version Release notes

Added a note below Figure 4: Physical Dimensions
2021-11-08 v1.2 Updated Table 3: Recommended Operating Conditions
Upgraded document formatting
Deleted Reset Circuit and Discharge Circuit for VDD33 Rail in Section 5 Peripheral
2021-02-09 v1.1 Schematics
Modified the note below Figure 9 Reflow Profile
2020-11-03 v1.0 First release

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WARRANTIES TO ITS AUTHENTICITY AND ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-
INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
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