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    Alpha®-PoP-707-Technical-Bulletin - (EN) 1222015 11452 411

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    fixfixit
    Alpha Lead Free Flux

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    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd

    Alpha®-PoP-707-Technical-Bulletin - (EN) 1222015 11452 411

    Uploaded by

    fixfixit
    52 views3 pages
    Alpha Lead Free Flux

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    Alpha®-PoP-707-Technical-Bulletin-(EN)1222015 11452 411

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    © © All Rights Reserved

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    Alpha Lead Free Flux

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    52 views3 pages

    Alpha®-PoP-707-Technical-Bulletin - (EN) 1222015 11452 411

    Uploaded by

    fixfixit
    Alpha Lead Free Flux

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 3

    ALPHA® PoP707

    PACKAGE ON PACKAGE BGA FLUX


    NO CLEAN, LEAD FREE, PASTE FLUX FOR SUB-ASSEMBLY DIP APPLICATIONS
    FLUX PROPERTIES
    Appearance Smooth, white to off-white paste
    Viscosity (Spiral/Malcom) Typically 430 Poise @10 rpm @ 25°C
    Tack strength (per IPC J-STD-004)
    Initial 10.6 grams / sq mm, typical
    6 hr @ 50% RH 8.3 grams / sq mm, typical
    24 hr @ 50% RH 8.8 grams / sq mm, typical
    Fineness of Grind <10 m
    st
    Acid Number (mg KOH/g) 140 – 170 (1 batch = 166.9)
    Corrosivity Passes IPC Cu mirror, Cu corrosion
    Halide Content Halide free (ROL0 per IPC J-STD-004)
    Moisture Content < 1.0 % (w/w)
    Specific Gravity 1.02 grams / cc

    J-STD-004 SIR (pass > 108)


    9
    4.2 x 10 Ohms, 1 Day, un-cleaned
    J-STD-004 SIR (pass > 108)
    9
    6.8 x 10 Ohms, 4 Days, un-cleaned
    J-STD-004 SIR (pass > 108)
    9
    8.9 x 10 Ohms, 7 Days, un-cleaned
    BELLCORE SIR (pass > 1011)
    11
    7.3 x 10 Ohms, 1 Day, un-cleaned
    BELLCORE SIR (pass > 1011)
    11
    3.5 x 10 Ohms, 4 days, un-cleaned
    11
    Electromigration (500 hours) 1.6 x 10 Ohms, 96 hours
    11
    (BELLCORE) 4.0 x 10 Ohms, 500 hours (pass: final > init /10)

    REFLOW
    Reflow can be accomplished in dry air or nitrogen controlled atmosphere. The initial ramp rate should be 1 - 2C
    per second. If necessary, a dwell of 1 to 2 minutes at 130 - 160C is acceptable. Following this equilibrating
    period is a ramp of 60 - 120C to a peak temperature of 235 - 260C depending upon alloy. The time over alloy
    liquidus should be 45 - 90 seconds. Cooling rate should be 3 - 7C per second to room temperature.

    USE
    The flux has been successfully evaluated on both Fuji and Siemens dip application equipment. An example of
    the application is shown on second page.

    TRANSFER PROPERTY
    Transfer weight depends on bump transfer parameters such as Dip thickness, hold time and rise velocity.
    Optimal parameter should be determined according to your bump size and pitch.

    SM #936-2 2014-09-26 an Alent plc Company

    ALPHA Global Headquarters


    300 Atrium Drive, Somerset, NJ 08873 USA  1-800-367-5460  www.alpha.alent.com

    The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is
    expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.

    ALPHA is a registered trademark of Alpha Metals, Inc.

    © 2014 ALPHA
    ALPHA® PoP707
    PACKAGE ON PACKAGE BGA FLUX
    NO CLEAN, LEAD FREE, PASTE FLUX FOR SUB-ASSEMBLY DIP APPLICATIONS

    Dip Thickness Hold Time Rise Velocity

    Generally, transfer amounts depend on flux thickness. Please adjust the flux thickness
    according to your bump diameter.
    7
    Flux thickness evaluation
    6
    Transfer weight （ mg ）

    1 φ0.45mm , Pitch
    0
    0.65mm
    50um 100um 150um 200um
    Flux Application Transfer condition

    Dip Thickness

    Flux Dispensed in Rotating Application Tray

    SM #936-2 2014-09-26
    ALPHA® PoP707
    PACKAGE ON PACKAGE BGA FLUX
    NO CLEAN, LEAD FREE, PASTE FLUX FOR SUB-ASSEMBLY DIP APPLICATIONS

    Doctor Blade Regulates Flux Height

    CLEANING
    Although designed as a no clean flux system, the reflowed residue may be cleaned with BIOACT SC10E or
    BIOACT SC30. Production stencils or pin transfer equipment can be cleaned with BIOACT SC10.

    STORAGE
    The flux should be stored in sealed containers and need not be refrigerated. Shelf life of unopened containers
    is nominally 6 months. If the material has been chilled, the container should be allowed to reach room
    temperature before opening in order to prevent moisture condensation from ambient air onto the flux.

    SAFETY
    While ALPHA PoP707 paste flux is not considered toxic, its use in typical reflow processes will generate some
    decomposition and reaction vapors. These vapors should be adequately exhausted from the work environment
    and away from personnel. For additional safety information, please visit www.alpha.alent.com to request a
    copy of the most recent version of the MSDS.

    SM #936-2 2014-09-26

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