Digi Key
Digi Key
com
ElectronicsWeekly
NEWS ANALYSIS & COMMENT FEATURES & TECHNOLOGY
The future of the
internet of thing
CELEBRATE THE
BRIGHTS
Help Electronics PARK IN YOUR
n Ready or
s
not, here it comes
businesses operate – the IoT is already
changing the way
Weekly highlight
the great young
design engineers LIFE the security and
and the electronics
industry
environmental considerations needs to prepare for
in UK electronics now
Security is a
deal-breaker for
business
page 23
Europe tops UK chip sales p3 Bonanza for memory-makers p15 The future of the internet of things p21
Chipset choice
can affect security
page 23
How to create
Electronics Weekly a sustainable IoT
and RS Components page 24
young electronic have teamed up
design engineers for a second year
working in the UK to celebrate the
today. best
Through the BrightSparks
students and innovators programme, we find and highlight
who are making the young engineers,
achievements we waves in electronics entrepreneurs,
hope to play our today; and by celebrating
part in inspiring
new entrants to their
We need your help. engineering.
If you know a brilliant
Faster charging for mobiles p10 Meet BrightSpark Sherzaad Dinah p17 Testing times p18
BrightSpark – and engineer who is
play under 30, nominate
making UK electronics your part in demonstrating how
the youngest engineers them today to be a
Technologies
such an exciting enabling connected
place to be. in the industry are cars
sponsored feature
page 27
Smart manufacturing
sponsored feature
page 29
MAKE YOUR NOMINATI
electronicsweekly.com/b ON NOW
rightsparks
Qualcomm launches
170601_6Mill_EW_UK_Snipe.
indd 1
5/31/17 4:43
PM
YOUR ELEKTRA
VOTE COUNTS
10nm server CPUs
Qualcomm has begun commercial shipments of 10nm server processors to challenge Intel
n Vote online for
your choice of the best
university research
project and consumer
product of 2017
DAVID MANNERS of shared L2 cache for every two PAGE 8
cores, and 60MB of unified L3 cache
Qualcom last week announced the first distributed on the die, the company said.
commercial shipments of its 10nm It has six channels of DDR4 memory
server processors. The Centriq 2400 and can support up to 768GB of total
processor family is an Arm-based DRAM capacity with 32 PCIe Gen3
processor series designed for cloud lanes and six PCIe controllers.
workloads running in datacentres. The processor supports Arm’s
“Today’s announcement is the TrustZone secure operating
culmination of more than four years only 398mm2. It contains up to 48 high environment, and hypervisors for
of intense design, development performance, 64-bit, single-thread cores, virtualisation, but consumes less than
and ecosystem enablement effort,” running at up to 2.6GHz frequency, 120W.
said Anand Chandrasekher, senior according to Qualcomm. The cores With a list price of $1,995, the
vice-president and general manager of are connected with a bi-directional 48-core processor offers greater than
Qualcomm Datacenter Technologies. segmented ring bus with 250GBps 4x better performance per dollar and
The Centriq 2400 processor family of aggregate bandwidth, to avoid up to 45% better performance per watt
is a single chip platform-level product performance bottlenecks under full load. versus Intel’s highest-performance
built using Samsung’s 10nm finfet To maximise performance under Skylake processor, the Intel Xeon
process, with 18 billion transistors on various use cases, the design has 512KB Platinum-8180, claims Qualcomm.
170601_6Mill_EW_UK_Snipe.indd 1 5/31/17
170907_TRWP_EW_UK.indd 1 9/6/17 12:17 PM
NEWS
15 2035 3GPP “
The IoT needs
to be both
trusted and
invisible
Number of minutes Honda hopes The year by which AI could Reference values should be As the internet of things continues
will be needed to charge an generate £630bn for the UK, checked with third-generation to grow its environmental impact
electric car by 2022 according to a government report partnership project standards needs to be contained
PAGE 6 PAGE 16 PAGE 18 PAGE 24
NEWS IN BRIEF
Broadcom bids to buy
Qualcomm for $130bn
AMS has announced a configurable
capacitive sensing front-end which allows
speed and resolution to be traded to
optimise designs. Called PCap04, it can
capture and digitise 50,000 times per
second at its fastest setting, or achieve
8aF resolution at its most sensitive.
“Configurability also enables sensor
manufacturers to trade measurement
speed off against power consumption. Broadcom offers $70 per share for Qualcomm, whether or not it succeeds in its plan to buy NXP
In low-power mode, it draws as little as
4µA,” said the firm. “AMS has developed
a demonstration board with no external DAVID MANNERS Broadcom HQ
power supply, in which the PCap04
operates on the energy harvested from the Broadcom has made its expected bid
RF field generated by an NFC reader.”
for Qualcomm with a $70 per share bid
that is 28% more than the price before
Estonia shows that the number of Broadcom’s interest became known.
e-Residency applications now exceeds the Broadcom says the offer stands whether
yearly number of births in the country.
or not Qualcomm buys NXP, for which
There were 10,269 births in the year to
November 2017, compared with 11,096 Qualcomm will pay $37bn.
e-Residency applications. “We’ve seen the “Broadcom’s proposal is compelling
initiative’s popularity grow steadily since for stockholders and stakeholders in
launch,” said Kaspar Korjus, programme
both companies,” said Broadcom CEO
lead for e-Residency. “It offers the freedom
for every world citizen to easily start and Hock Tan. “Our proposal provides
run a global EU company from anywhere Qualcomm stockholders with a
in the world, and as of October 2017, our substantial and immediate premium enable Broadcom to “deliver more BofA Merrill Lynch, Citi, Deutsche
e-Residents own over 4,000 enterprises,”
in cash for their shares, as well as the advanced semiconductor solutions”, Bank, JP Morgan and Morgan Stanley
Korjus said.
opportunity to participate in the upside while pleasing shareholders. have advised Broadcom in writing
potential of the combined company. “Qualcomm will be best positioned that they will be able to arrange the
A company called 3devised is working “This will position the combined to build on its legacy of innovation necessary debt financing for the
on a high-resolution 3D printer that
company as a global communications and invention,” said Tan. “We believe purchase. Silver Lake Partners, which
occupies only 155x155x290mm but can
print 85.4x48x130mm. Called Pluto, it leader with an impressive portfolio of that Qualcomm and Broadcom has served as a strategic partner to
uses stereolithography, with a liquid print technologies and products,” said Tan, employees will benefit from substantial Broadcom in other transactions, has
medium which polymerises to a solid suggesting that increased scale and opportunities for growth and committed to offer $5bn convertible
under the influence of ultra-violet light.
broader product diversification would development,” he added. debt financing.
The light comes from a 5W UV led, steered
by many tiny micro-machined mirrors on
a single chip (from Texas Instruments) in a
digital light projector.
Fraunhofer IGB
Organs-on-chips combine human overviews and updates of current
mini-organs with microelectronics, and new organ-on-chip initiatives so
microfluidics and nanosensors. that users can track progress easily,
This technology is already providing A microphysiological organ-on-a-chip system offers an alternative to animal testing consult developers directly and identify
new platforms for drug discovery gaps in present knowledge that limit
but is poised to deliver applications implementation.
in personalised medicine and safety Orchid will facilitate dialogue and this technology by a broad group of Orchid will also address ethical
pharmacology, and offers alternatives documentation towards accelerating potential users in science, health care and regulatory issues, particularly
to conventional animal testing. the development of prototypes of and industry. concerning personalised information,
Over the next two years, the EU will organs-on-chips, validated cell systems Orchid will build an infrastructure economic and societal impact, training
invest €0.5m in the ORgan-on-CHip In that mimic diseased or healthy human for scientists, policy makers, funders of researchers, and the design of an
Development (Orchid) project. tissue and the implementation of and end-users to join the decision- R&D ‘roadmap’.
SO L D O U T
INDUSTRY’S BIGGEST NIGHT
DON’T MISS OUT
BOOK YOUR PLACE NOW!
www.elektraawards.co.uk
Electronics Components,
Solutions & Support
uk.farnell.com/industrial-automation-control
assemblies
with its Integrity real-time operating debugging with the Green HiIls
system (RTOS) and supporting tools. Probe and SuperTrace Probe utilising
Zynq UltraScale+ integrates CoreSight from ARM.
64-bit ARM Cortex-A53 processor There is also the Embedded
complete cores and an FPGA fabric, which Cryptographic Toolkit with FIPS
STEVE BUSH CST2020. Available in four turns ratios, AEC-Q200 Grade 1 (-40°C to “Other applications include aerospace
1:70, 1:100, 1:200 and 1:300, they are +125°C) qualification means they are power management, three-phase solar
Coilcraft has introduced a series of intended to provide output feedback for suitable for automotive applications inverters, industrial motor controls
current sense transformers, operating up load current measurement and control such as measurement in traction motor and other applications requiring high
to 40A over 400Hz to 1MHz, and offering in switching power supplies, over-load and battery management systems, the isolation between the sense and output
4,000Vrms isolation voltage between protection and short-circuit protection. company said. windings,” said the firm.
the sense and output windings, using
insulation reinforced to UL 60950-1.
To minimise power loss, the resistance #include<iostream.h>
of the sense coil is very low: 840μΩ #include<conio.h>
in all versions of the series, dubbed
class student
SEE IT.
{
protected:
int rno,m1,m2;
public:
void get()
{
cout<<”Enter the Roll no :”;
SOLVE IT.
cin>>rno;
cout<<”Enter the two marks :
cin>>m1>>m2;
}
};
class sports
{
protected:
int sm; // sm = Sports mark
public:
}
Vishay has added tapped holes to };
some of its high-current shunt resistors class statement:public student,public sports
to aid PCB and wire mounting. {
int tot,avg;
WSBS8518...M3 and WSBS8518...M4 public:
are 36W battery shunt resistors featuring void display()
M3 and M4 tapped holes respectively. {
tot=(m1+m2+sm);
The resistors are 85x18x3mm. avg=tot/3;
With resistance values down to 50µΩ, cout<<”\n\n\tRoll No : “<<rno<<”\n\tTot
Vishay markets them as a more accurate, “<<tot;
cout<<”\n\tAverage : “<<avg;
lower-cost alternative to Hall effect }
sensing “while their tapped holes aid in };
PCB mounting, provide extra support
against vibration, and offer a location to Integrate hardware. Visualise data. Accelerate engineering.
attach voltage sense pins”, said the firm.
Reduce the time you need to visualise, create, and code engineering
Values of 50µΩ, 100µΩ, 125µΩ,
systems by using LabVIEW graphical programming to gain rapid access
and 250µΩ are available, from a
solid metal manganese-copper alloy to hardware and data insights. Take advantage of a worldwide network of
resistive element with ±20ppm/°C developers and discover why LabVIEW is the most productive tool for you.
temperature coefficient and a welded
terminal-to-element connection that See how at ni.com/labview
allows for up to 848A of continuous
current (resistance dependent).
©2017 National Instruments. All rights reserved. LabVIEW, National Instruments, NI, and ni.com are trademarks of National Instruments. Other product and company names listed are trademarks or trade names of their respective companies. 29170
Inductance is <5nH and thermal EMF
can be as low as <3µV/°C.
29170_LabVIEW_Ad_153.5x182mm_ENG.indd 1 13/10/2017 16:48
EMC pre-compliance
testing for USB scope
TiePie adds EMC pre-compliance testing kit to USB including E and H probes
STEVE BUSH allowing a lot of detail to be extracted – a frequency axis. Averaging and max hold
total of 67,108,864 spectral components. history can be cleared manually to start a
Netherlands-based TiePie is getting into “When your display is 1,920 pixels new measurement.
EMI pre-compliance testing with a kit wide, you require 34,952 displays Amplitude unit can be dB, dBv,
based on its Handyscope HS6 DIFF to show the full spectrum 1:1,” said dBmV, dBµV, dBµV (at 10m) and
1Gsample/s 14-bit quad differential TiePie. “And 34,952 displays with a dBm. Amplitude range can be set
channel USB oscilloscope. width of 50cm each gives a total display to: 1-100dBµV, 20-120dBµV or
Called Handyscope HS6 width of 17.47km – so, if you zoom in 40-140dBµV. “For accurate amplitude
DIFF-1000XMESG, the supplied 35,000 times, you will get the spectral measurement, a flat top window is used
TP-EMI-HS6 probe set contains three components 1:1 on your display. That is by default. Besides the flat top window,
magnetic field (H field) probes and one exceptional for an EMI analyser.” a range of eight other windows can be
electric field (E field) probe, plus a tripod Dynamic range is 140dB, and selected from,” said the firm.
to position the probes correctly relative standard limit lines according to The set-up can also be used as a
to the object under test. EN61326-1:2006/EN55011:2007 can normal spectrum analyser, and with a
The EMI analyser software has a be switched on or off. The resolution biconical antenna or combilog antenna
multi-window option where the total bandwidth and frequency range can be (neither in kit), a spectrum of 10MHz to
spectrum or a selected part of the selected individually. 500MHz can be measured.
spectrum is simultaneously shown in The device has three operating modes. The Handyscope HS6
each window. “This gives the user a Normal mode displays the spectrum DIFF-1000XMESG EMI analyser
better understanding of the signals that of the source trace; averaging mode is consists of a Handyscope HS6
are analysed,” said the firm. effective in reducing the noise of the DIFF-1000 with option E installed.
“Besides the spectrum, also a time signal, to see more of the harmonic or Option E also includes the EMI
domain signal is visible, allowing users carrier detail. You can select the number probe set TP-EMI-HS6 in a carrying
to analyse the signal shape at the same of spectra to be averaged. case – three sizes of H field probes and
time. The multi-display option is also Max hold displays the maximum level an E field probe. A short, semi-flexible
available for the time domain signal.” that the signal reaches and is useful for antenna cable, a long flexible antenna
The device has a resolution bandwidth frequency measurements where it shows cable and a grounded 50Ω terminator
of up to 7.45Hz at 500MHz span, the history of peak values across the are included.
ElectronicsWeekly
6th Floor, Davis House, 2 Robert
Street, Croydon CR0 1QQ, England.
www.electronicsweekly.com JOSH BROOKS, EDITOR & PUBLISHER
Email addresses name.surname@
EDITORIAL:
020 8253 8671
[email protected]
MANNERISMS
TOP TWEETS
RICHARD WILSON
Artificial intelligence (AI) may be one of the most interesting AI is already being used in medical research. For example,
developments in computing in recent years. But can we be Fujitsu in Japan is using it to more accurately identify the
certain its impressive capabilities will give us what we really tumours on CT scans by making use of historical use data.
want? Do we want AI to be used by garages and shops to help GlaxoSmithKline is using AI for drug development.
them make a sale by targeting their products at our individual A report on the issue, Growing the artificial intelligence
needs or susceptibilities? industry in the UK, was recently published by the
It is now recognised that the application of AI is just as departments for Business, Energy and Industrial Strategy
likely to be in marketing as in engineering. and for Digital, Culture, Media and Sport as part of the
When AI was first dreamed up and then implemented with government’s industrial strategy. It concluded that AI’s
much investment and R&D effort, I imagined that this form ability to record patterns of behaviour will be used to provide
“
of computing technology could be used for systems of real personal shopping recommendations as well as to help
value to society. Medical diagnosis and robotic surgery could children to learn and teachers to provide more personalised
benefit from AI, for example. education programmes. The capacity
How naive I was. I should have realised that the AI can be used to “boost productivity and make better
capabilities of AI to shape human thoughts would be adopted products and services, including public services”, said the
of artificial
in a heart-beat by the retail sector to make it easier to sell report. It also concluded that AI could generate £630bn intelligence to
things to us. for the UK economy by 2035. Such a big number makes it shape human
And with electronics systems controlling much of what a inevitable that a large part of AI’s market potential will be
car does and how it connects with the outside world, it is now seen to be in transforming commercial business as much as
thoughts will
possible to create large amounts of data about drivers and changing scientific research. be adopted in a
their driving patterns. Data analysts are using AI to process So important is AI to wider commercial business that the heart-beat by the
this data and to turn it into useful and valuable information. UK’s largest business representative body, the CBI, recently
This could be used for safer car design, but it can also be called on the government to bring business and employee
retail sector to
used to help car dealers make us more likely to buy particular representatives and academics together to investigate and make it easier to
vehicles. The danger is that this and similar uses in the retail recommend how it can best be exploited. sell things to us
sector could taint our impression of the true usefulness of AI. Consultant editor Richard Wilson writes a regular column for
This would be a mistake. Electronics Weekly
DISTRIBUTION WORLD
www.microchip.com/motorEU
Motor Control and Drive Solutions
Microchip provides products and solutions (hardware and software) to address the many different motor types, including brushed
DC, stepper, brushless DC, permanent magnet synchronous, AC induction and switched reluctance motors. You can shorten your
development cycle by using our free motor control software with application notes and tuning guides. Our scalable motor control
development tools promote rapid prototyping for low-voltage and high-voltage systems including dual motor control options.
Microchip’s PIC® Microcontrollers (MCUs), dsPIC® Digital Signal Controllers (DSCs) and SAM Cortex® series devices contain
innovative motor control PWM peripherals including complimentary waveforms and dedicated time base. For applications that
require variable speed with constant torque and field-oriented control for greater efficiency, the high-performance PIC32MK and
dsPIC DSC core devices includes DSP instructions for more precise control.
Our single-chip motor control and motor drive solutions enable simpler designs and decrease board space, and are often used as
companion chips with PIC MCUs, dsPIC DSCs and ARM® based MCUs.
Benefits
2 www.microchip.com/motor
Brushed DC Motors
4 www.microchip.com/motor
Brushless DC Motor Control
The simpler commutation method allows the use of a wide range Inverter VBUS
Gate Drivers
of Microchip products, from 8-bit PIC®16 MCUs, to MTD650X
dedicated BLDC driver chips, to dsPIC DSCs. The device best Motor
suited to your application depends on what you are trying to achieve:
performance, cost, efficiency, time to market, etc. Our wide range of
application notes and development tools will allow you to get started
PIC® Microcontroller
with your application quickly. or dsPIC®
Digital Signal
Comparator
Controller
Typical Applications – VREF
Mechanical
+
• Anti-lock braking systems +
Feedback
BLDC
BLDCApplication
ApplicationNotes
Notesand
andTuning
TuningGuides
Guides
Algorithm
Algorithm PIC16
PIC16
Family
Family PIC18
PIC18
Family
Family dsPIC
dsPIC DSC
® ®
DSC
Family
Family App
AppNote
Note 32-Bit
32-Bit
Family
Family 42711A
42711A
Sensored
Sensored AN885,
AN885,AN1779,
AN1779,AN2049
AN2049 AN899
AN899 AN957
AN957 – –
Sensored
Sensored
Sinusoidal
Sinusoidal – – – – AN1017
AN1017 – –
Sensorless
Sensorless
BEMF
BEMF AN1175,
AN1175,AN1305,
AN1305,AN857
AN857 AN970
AN970 AN901,
AN901,AN992
AN992 – –
Sensorless
Sensorless
Filtered
Filtered
BEMF
BEMF
with
with
Majority
Majority
Detect
Detect – – – – – – AN1160
AN1160
Tuning
TuningGuide:
Guide:
Sensorless
SensorlessBLDC
BLDCControl
Control
with
with
Back-EMF
Back-EMF
– – – – – – AN1160
AN1160
Filetering
Filetering
Using
Using
a Majority
a Majority
Function
Function
BLDC
BLDCDevelopment
DevelopmentTools
Tools Low-Voltage
Low-VoltageMotor
MotorControl
ControlDevelopment
DevelopmentBundle
Bundle
(Single
(SingleBoard
Boardand
andDrive
DriveBoard)
Board)(DV330100)
(DV330100)
Motor
MotorControl
ControlStarter
StarterKit
Kit(MCSK)
(MCSK)(DM330015)
(DM330015)
This
Thisbundle
bundleprovides
providesa acost-effective
cost-effective
This
Thisstarter
starterkitkitwith
withmTouch
mTouch ®®
method
methodofofevaluating
evaluatingand anddeveloping
developingdual/
dual/
sensing
sensingisisa acomplete,
complete,integrated
integrated single
singlemotor
motorcontrol
controltotodrive
driveBLDC
BLDCmotors
motors
development
developmentplatform
platformbased
basedononthe the ororPMSMs
PMSMsconcurrently,
concurrently,ororoneoneofofeach
each
dsPIC33FJ16MC102.
dsPIC33FJ16MC102.It Itincludes includesa a type
typeofofmotor.
motor.The
ThedsPIC
dsPICDSC DSCSignal
Signal
USB
USBinterfaced
interfaceddebugger/programmer,
debugger/programmer,a acomplete completedrive
drivecircuit,
circuit, Board
Boardsupports
supportsboth
both3.3V
3.3Vandand5V 5Vdevices
devices
ananon-board
on-boardBLDC
BLDCmotor,
motor,a auser-configurable
user-configurableswitch switchandandanan forforvarious
variousapplications
applicationsand andfrequently
frequently
mTouch
mTouchsensing
sensingslider
sliderwith
withLED
LEDindicators
indicatorsfor forspeed
speedcontrol.
control. used
usedhuman
humaninterface
interfaceincludes
includessomesome
features
featuresandandcommunication
communicationinterfaces.
interfaces.
dsPICDEM
dsPICDEMMCHV-2/3
MCHV-2/3Development
DevelopmentSystem
System The
TheMotor
MotorControl
Control10–24V
10–24VDriver
DriverBoard
Board
(DM330023-2/3)
(DM330023-2/3) (Dual/Single)
(Dual/Single)supports
supportscurrents
currentsupuptoto10A.
10A.
This
Thishigh-voltage
high-voltagesystem
systemisisintended
intended
totoaid
aidyou
youininthe
therapid
rapidevaluation
evaluationandand SAM
SAMBLDC
BLDC24V
24VMotor
MotorControl
ControlKit
Kit
development
developmentofofa awide widevariety
varietyofofmotor
motor (ATSAMD21BLDC24V-STK)
(ATSAMD21BLDC24V-STK)
control
controlapplications
applicationsusingusinga adsPIC
dsPIC®®
This
Thislow-voltage
low-voltagedevelopment
developmentboard boardprovides
providesa amethod
methodfor for
DSC.
DSC.This
Thisdevelopment
developmentsystemsystemisis evaluating
evaluatingBLDC BLDCand andPMSM
PMSMmotormotorcontrol
controlperformance
performanceofof
targeted
targetedtotocontrol
controlBLDC
BLDCmotors,
motors, the
theSAM
SAMCCand andSAM
SAMDDseries
seriesCortex
CortexM0+ M0+devices.
devices.This
Thisboard
board
PMSMs
PMSMsand andACIMs
ACIMsininsensor
sensorororsensorless
sensorlessoperation.
operation.The The supports
supportsspecificspecificARM
ARM Cortex
®®
Cortex plug-in-modules
®®
plug-in-modulesand andisisnotnot
rated
ratedcontinuous
continuousoutputoutputcurrent
currentfrom
fromthetheinverter
inverterisis6.5A
6.5A compatible
compatiblewith withdsPIC
dsPICororPIC32
PIC32plug-in
plug-inmodules.
modules.ThisThiskitkitships
ships
(RMS).
(RMS).This
Thisallows
allowsup uptotoapproximately
approximately2 2kVA kVAoutput
outputwhen
when with
witha aSAMD21
SAMD21Motor Motorcontrol
controlcard,
card,isisalso
alsocompatible
compatiblewith with
running
runningfrom
froma a208V
208Vtoto230V
230Vsingle-phase
single-phaseinput inputvoltage.
voltage.The
The the
theATSAMC21MOTOR
ATSAMC21MOTORplug-in-module plug-in-moduleoffering
offeringincreased
increased
MCHV-3
MCHV-3adds addsPower
PowerFactor
FactorCorrection
Correction(PFC)(PFC)with
withcurrent
current performance,
performance,5V 5Vpower
powersupplies,
supplies,and
andCAN-FD.
CAN-FD.Software
Softwarefor for
feedback
feedbackcircuitry
circuitryand
andzero-crossing
zero-crossingdetection.
detection. this
thiskitkitisisavailable
availableininStudio
StudioFramework
Frameworkand andSTART.
START.
dsPICDEM
dsPICDEMMCLV-2
MCLV-2Development
DevelopmentBoard
Board
BLDC
BLDCFan
FanControl
ControlDevelopment
DevelopmentTools
Tools
(DM330021-2)
(DM330021-2)
This
Thislow-voltage
low-voltagedevelopment
developmentboard board MTD6505
MTD65053-Phase
3-PhaseBLDC
BLDCSensorless
SensorlessFan
Fan
provides
providesa acost-effective
cost-effectivemethod
methodofof Controller
ControllerDemonstration
DemonstrationBoard
Board(ADM00345)
(ADM00345)
evaluating
evaluatingandanddeveloping
developingsensored
sensored This
Thisboard
boardallows
allowsfor
forthe
the
ororsensorless
sensorlessBLDC
BLDCmotormotorandand control
controland
andmonitoring
monitoring
PMSM
PMSMcontrol
controlapplications.
applications.The The ofofthe
theMTD6505
MTD6505device
device
board
boardsupports
supportsMicrochip’s
Microchip’s100-pin
100-pinPIMPIMwith
withdsPIC33E
dsPIC33Eoror using
usingPC PCsoftware
software
dsPIC33F
dsPIC33FDSCs.DSCs.It Italso
alsosupports
supportsthe theuse
useofofthe
theinternal,
internal, connected
connectedtotothe theboard
board
on-chip
on-chipop opamps
ampsfound
foundononcertain
certaindsPIC
dsPICDSCs
DSCsororthe theexternal
external via
viaa aUSB
USBconnection.
connection.
Op
OpAmps
Ampsfound
foundononthe thedsPICDEM
dsPICDEMMCLV-2 MCLV-2Development
Development
Board.
Board.AAdsPIC33EP256MC506
dsPIC33EP256MC506Internal InternalOp
OpAmpAmpPIM PIM
(MA330031)
(MA330031)isisincluded,
included,and andthetheboard
boardisiscapable
capableofof
controlling
controllingmotors
motorsrated
ratedup uptoto48V
48Vand
and15A,
15A,withwithmultiple
multiple
communication
communicationchannels
channelssuch suchasasUSB,
USB,CAN,
CAN,LIN LINand
and
RS-232.
RS-232.
66 www.microchip.com/motor
www.microchip.com/motor
Permanent Magnet Synchronous Motors
PMSM Control
Permanent Magnet Synchronous Motors (PMSM) are brushless and have very high reliability and high efficiency. Due to their
permanent magnet rotor, they also have higher torque with smaller frame size and no rotor current, all of which are advantages
over AC induction motors. With a high power-to-size ratio, PMSMs can help you make your design smaller without the loss of
torque. PMSMs need to be commutated like BLDC motors, but due to the construction of the windings, the waveforms need
to be sinusoidal for good performance. This requires more complicated control algorithms and, therefore, a higher performing
controller like Microchip’s dsPIC® DSCs and 32-Bit PIC32MK or Cortex M based solutions. Microchip offers development tools
and applications notes to help you develop advanced PMSM control solutions Gate Drivers
Inverter V BUS
• Machining tools
– VREF
Mechanical
+
Feedback
• Traction control +
PMSM Libraries
Motor Control Library for dsPIC33F/dsPIC33E Microchip Motor Control Library Blockset
The Motor Control Library contains The Microchip Motor Control Library
Motor Control
Application function blocks that are optimized for Blockset contains a number of basic
the dsPIC33F and dsPIC33E DSC Simulink® blocks that can be used
Motor Control Library
families. All functions in this Motor to jump start model-based design
Control Library have input(s) and of motor control applications using
dsPIC DSC
®
output(s), but do not access any of the Microchip’s dsPIC33F and dsPIC33E
Motor Control Hardware DSC peripherals. The library functions DSC families. These blocks include
are designed to be used within an reference frame transforms, a
application framework for realizing an efficient and flexible way proportional-integral controller and trigonometric functions, all of
of implementing a motor control application. which can be used with Embedded Coder® to generate efficient
code on the dsPIC® DSC that utilizes the Microchip Motor
motorBench™ Development Suite Control Library.
This tool identifies the electrical and
mechanical parameters of a motor
and then automatically tunes the
current and speed control loops. It
then generates complete dsPIC33 motor control code into
an MPLAB® X IDE project. Version 1.x works with the low-
voltage development board (MCLV-2: DM330021-2) and one
permanent magnet synchronous motor (AC300022).
8 www.microchip.com/motor
AC Induction Motors
Typical Applications
• Air conditioner and refrigerator compressors PIC® Microcontroller
or dsPIC®
• Home appliances Digital Signal
Comparator
Controller
• Pumps – VREF
• Blowers +
Mechanical
Feedback
• Automation/industrial applications
+
–
• Power tools Op Amp
EUSART/AUSART
Math Accelerator
PWM (10-/16-bit)
Timer (8-/16-bit)
(5-/8-/9-/10-bit)
Angular Timer
SRAM (Bytes)
Device
Comparator
CCP/ECCP
CWG/COG
Flash (KB)
EE (Bytes)
Op Amp
SPI/I2C
MSSP
NCO
ADC
DAC
SMT
CLC
Pins
HEF
PPS
3 ch,
PIC10F322 6 0.875 64 – – – – 2/0 1 – 2/1 1 – – 1 – – – – – –
8-bit
PIC12F/ 4 ch,
8 1.75 64 – – 1 0/1 – – – 2/1 – – – – – – – – – –
HV615 10-bit
4 ch,
PIC12F1572 8 3.5 256 – ü 1 – 0/3 1/0 1/0/0/0 2/1 – – – – – – – 1/0 – –
10-bit
5 ch,
PIC16F15313 8 3.5 256 – ü 2 1/0 4/0 1/0 1/0/0/0 1/2 4 – – 1 – ü – 1/0 1 –
10-bit
11 ch,
PIC16F15323 14 3.5 256 – ü 2 2/0 4/0 1/0 1/0/0/0 1/2 4 – – 1 – ü – 1/0 1 –
10-bit
12 ch,
PIC16F1509 20 14 512 – ü 2 – 4/0 1/0 – 2/1 4 – – 1 – – – 1/0 1 –
10-bit
12 ch,
PIC16F1618 20 7 512 – ü – 2/0 2/0 1/0 0/1/0/0 3/1 4 2 1 – 1 – – 1/0 1 –
10-bit
11 ch,
PIC16F1936 28 14 512 256 ü 2 2/3 – – – 4/1 4 – – – – – – 1/0 1 –
10-bit
24 ch,
PIC16F15355 28 14 1K – ü 2 2/0 4/0 1/0 1/0/0/0 1/2 4 – – 1 – ü – 2/0 – 1
10-bit
24 ch,
PIC16F18856 28 28 2K 256 ü 2 5/0 2/0 1/0 1/0/0/0 1/2 4 2 – 1 – ü – 1/0 – 1
10-bit
40/ 14 ch,
PIC16F1939 28 1K 256 ü 2 2/3 – – – 4/1 4 – – – – – – 1/0 1 –
44 10-bit
10 www.microchip.com/motor
Recommended Products
EUSART/AUSART
Math Accelerator
PWM (10-/16-bit)
Timer (8-/16-bit)
(5-/8-/9-/10-bit)
Angular Timer
SRAM (Bytes)
ADC (10-bit)
Comparator
Device
CCP/ECCP
CWG/COG
Flash (KB)
EE (Bytes)
Op Amp
SPI/I2C
MSSP
NCO
DAC
SMT
CLC
Pins
HEF
PPS
PIC16F15323 14 3.5 256 – ü 11 ch 2 2/0 4/0 1/0 1/0/0/0 1/2 4 – – 1 – ü – 1/0 1 –
40/
PIC16F1939 28 1K 256 ü 14 ch 2 2/3 – – – 4/1 4 – – – – – – 1/0 1 –
44
Voltage Accuracy
Typical Dropout
Junction Temp.
Output Current
Output Voltage
Typical Output
Typical Active
Current (μA)
Device
Range (°C)
Packages
Features
(mA)
(mV)
(%)
(V)
(V)
Analog Comparators
Temperature Range(3)
Security Segments
Output Compare/
ADC 10-/12-bit(1)
Standard PWM
Motor Control
Input Capture
CodeGuard™
1.1/0.5 Msps
Device
Timer 16-bit
Flash (KB)
DMA # Ch
RAM (KB)
Package
PWM Ch
RTCC
UART
PMP
CAN
Pins
QEI
SPI
I2C
dsPIC33FJ12MC202 28 12 1 – 3 4 2 6+2 ch 1 1 ADC, 6 ch – 2 1 1 1 – – 0 SO, SP, ML I,E
dsPIC33FJ32MC202 28 32 2 – 3 4 2 6+2 ch 1 1 ADC, 6 ch – 2 1 1 1 – – 0 SO, SP, MM I,E
dsPIC33FJ32MC302 28 32 4 8 5 4 4 6+2 ch 2 1 ADC, 6 ch 2 – 2 2 1 1 1 – SO, SP, MM I,E,H
dsPIC33FJ64MC202 28 64 8 8 5 4 4 6+2 ch 2 1 ADC, 6 ch 2 – 2 2 1 1 1 – SO, SP, MM I,E,H
dsPIC33FJ64MC802 28 64 16 8 5 4 4 6+2 ch 2 1 ADC, 9 ch 2 – 2 2 1 1 1 1 SO, SP, MM I,E,H
dsPIC33EP128GM304 44 128 16 4 9 8 8 12 ch 2 2 ADC, 18 ch 5 1 4 3 2 – – – ML, PT I,E, H
dsPIC33EP128GM604 44 128 16 4 9 8 8 12 ch 2 2 ADC, 18 ch 5 1 4 3 2 – – 2 ML, PT I,E, H
dsPIC33EP128GM306 64 128 16 4 9 8 8 12 ch 2 2 ADC, 30 ch 5 1 4 3 2 1 – – ML, PT I,E, H
dsPIC33EP128GM706 64 128 16 4 9 8 8 12 ch 2 2 ADC, 30 ch 5 1 4 3 2 1 – 2 ML, PT I,E, H
dsPIC33EP128GM310 100 128 16 4 9 8 8 12 ch 2 2 ADC, 49 ch 5 1 4 3 2 1 – – PT, BG I,E, H
dsPIC33EP128GM710 100 128 16 4 9 8 8 12 ch 2 2 ADC, 49 ch 5 1 4 3 2 1 – 2 PT, BG I,E, H
dsPIC33EP256GM304 44 256 32 4 9 8 8 12 ch 2 2 ADC, 18 ch 5 1 4 3 2 – – – ML, PT I,E, H
dsPIC33EP256GM604 44 256 32 4 9 8 8 12 ch 2 2 ADC, 18 ch 5 1 4 3 2 – – 2 ML, PT I,E, H
dsPIC33EP256GM306 64 256 32 4 9 8 8 12 ch 2 2 ADC, 30 ch 5 1 4 3 2 1 – – ML, PT I,E, H
dsPIC33EP256GM706 64 256 32 4 9 8 8 12 ch 2 2 ADC, 30 ch 5 1 4 3 2 1 – 2 ML, PT I,E, H
dsPIC33EP256GM310 100 256 32 4 9 8 8 12 ch 2 2 ADC, 49 ch 5 1 4 3 2 1 – – PT, BG I,E, H
dsPIC33EP256GM710 100 256 32 4 9 8 8 12 ch 2 2 ADC, 49 ch 5 1 4 3 2 1 – 2 PT, BG I,E, H
dsPIC33EP512GM304 44 512 48 4 9 8 8 12 ch 2 2 ADC, 18 ch 5 1 4 3 2 – – – ML, PT I,E, H
dsPIC33EP512GM604 44 512 48 4 9 8 8 12 ch 2 2 ADC, 18 ch 5 1 4 3 2 – – 2 ML, PT I,E, H
dsPIC33EP512GM306 64 512 48 4 9 8 8 12 ch 2 2 ADC, 30 ch 5 1 4 3 2 1 – – ML, PT I,E, H
dsPIC33EP512GM706 64 512 48 4 9 8 8 12 ch 2 2 ADC, 30 ch 5 1 4 3 2 1 – 2 ML, PT I,E, H
dsPIC33EP512GM310 100 512 48 4 9 8 8 12 ch 2 2 ADC, 49 ch 5 1 4 3 2 1 – – PT, BG I,E, H
dsPIC33EP512GM710 100 512 48 4 9 8 8 12 ch 2 2 ADC, 49 ch 5 1 4 3 2 1 – 2 PT, BG I,E, H
Note 1: dsPIC33 devices feature one or two user-selectable 1.1 Msps 10-bit ADC (4 S & H) or 500 ksps 12-bit ADC (1 S & H).
2: A DAC is associated with each analog comparator to set a programmable voltage reference. One DAC output may be selected by software and driven on an external pin.
3: I = Industrial Temperature Range (−40°C to +85°C), E = Extended Temperature Range (−40°C to +125°C), H = High Temperature Range (−40°C to +140°C).
12 www.microchip.com/motor
Recommended Products
PIC16F616/
14 3.5 128 – 2/1 2 0/1 – 8 ch, 10-bit – –
PIC16HV616(1)
Timer (8-/16-bit)
(5-/8-/9-/10-bit)
Angular Timer
SRAM (Bytes)
ADC (10-bit)
Comparator
CCP/ECCP
CWG/COG
Device
Flash (KB)
EE (Bytes)
Op Amp
SPI/I2C
MSSP
NCO
SMT
CLC
Pins
PPS
DAC
HEF
40/
PIC16F1939 28 1K 256 ü 14 ch 2 2/3 – – – 4/1 4 – – – – – – 1/0 1 –
44
EUSART/AUSART
Math Accelerator
PWM (10-/16-bit)
(5-/8-/9-/10-bit)
Timer (8-/16-bit)
Angular Timer
SRAM (Bytes)
ADC (10-bit)
Comparator
CCP/ECCP
CWG/COG
Device
Flash (KB)
EE (Bytes)
Op Amp
SPI/I2C
MSSP
NCO
DAC
SMT
CLC
Pins
HEF
PPS
PIC16F1509 20 14 512 – ü 12 ch 2 – 4/0 1/0 – 2/1 4 – – 1 – – – 2/0 1 –
PIC16F15323 14 3.5 256 – ü 11 ch 2 2/0 4/0 1/0 1/0/0/0 1/2 4 – – 1 – ü – 1/0 1 –
PIC16F15344 20 7 512 – ü 11 ch 2 2/0 4/0 1/0 1/0/0/0 1/2 4 – – 1 – ü – 1/0 1 –
PIC16F1619 20 14 1K – ü 12 ch - 2/0 2/0 1/0 0/1/0/0 3/1 4 2 1 – 1 – – 1/0 1 –
PIC16F1936 28 14 512 256 ü 11 ch 2 2/3 – – – 4/1 4 – – – – – – 1/0 1 –
PIC16F15355 28 14 1K – ü 24 ch 2 2/0 4/0 1/0 1/0/0/0 1/2 4 – – 1 – ü – 2/0 – 1
PIC16F18856 28 28 2K 256 ü 24 ch 2 5/0 2/0 1/0 1/0/0/0 1/2 4 2 - 1 – ü – 1/0 – 1
Comparators
CodeGuard™
Temperature
Timer 16-bit
Device
Flash (KB)
DMA # Ch
RAM (KB)
Op Amps
Package
PWM Ch
USB 2.0
Range(3)
Analog
RTCC
UART
PMP
ADC
CAN
Pins
QEI
SPI
I2C
14 www.microchip.com/motor
Recommended
Recommended Products
Products
Recommended
Recommended Products
Products for
for Brushless
Brushless DC
DC Motors,
Motors, PMSMs
PMSMs and
and ACIMs
ACIMs (Continued)
(Continued)
Security Segments
Segments
Output Compare/
Compare/
Standard PWM
PWM
Motor Control
Control
Input Capture
Capture
Comparators
Comparators
CodeGuard™
CodeGuard™
Temperature
Temperature
Timer 16-bit
16-bit
Device
Device
Flash (KB)
(KB)
# Ch
Ch
RAM (KB)
(KB)
Op Amps
Amps
Standard
Package
Package
PWM Ch
Ch
Security
USB 2.0
2.0
Range(3)
(3)
Analog
Analog
Output
DMA #
Range
Motor
RTCC
RTCC
UART
UART
Timer
Flash
PWM
Input
DMA
RAM
PMP
PMP
ADC
ADC
CAN
CAN
USB
Pins
Pins
QEI
QEI
SPI
SPI
Op
II22C
C
dsPIC33EP128GM604
dsPIC33EP128GM604 44
44 128
128 16
16 44 99 88 88 12
12 22 22ADC,
ADC,18 ch 11++44(2)(2) 44
18ch 11 44 33 22 –– –– 22 –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EP128GM306
dsPIC33EP128GM306 64
64 128
128 16
16 44 99 88 88 12
12 22 22ADC,
ADC,30
30ch
ch 11++44(2)(2) 44 11 44 33 22 11 –– –– –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EP128GM706
dsPIC33EP128GM706 64
64 128
128 16
16 44 99 88 88 12
12 22 22ADC,
ADC,30
30ch
ch 11++44(2)(2) 44 11 44 33 22 11 –– 22 –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EP128GM310
dsPIC33EP128GM310 100
100 128
128 16
16 44 99 88 88 12
12 22 22ADC,
ADC,49
49ch
ch 11++44(2)(2) 44 11 44 33 22 11 –– –– –– PT,
PT,BG
BG I,E,
I,E,HH
dsPIC33EP128GM710
dsPIC33EP128GM710 100
100 128
128 16
16 44 99 88 88 12
12 22 22ADC,
ADC,49
49ch
ch 11++44(2)(2) 44 11 44 33 22 11 –– 22 –– PT,
PT,BG
BG I,E,
I,E,HH
dsPIC33EP256GM304
dsPIC33EP256GM304 44
44 256
256 32
32 44 99 88 88 12
12 22 22ADC,
ADC,18
18ch
ch 11++44(2)(2) 44 11 44 33 22 –– –– –– –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EP256GM604
dsPIC33EP256GM604 44
44 256
256 32
32 44 99 88 88 12
12 22 22ADC,
ADC,18
18ch
ch 11++44 (2)(2)
44 11 44 33 22 –– –– 22 –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EP256GM306
dsPIC33EP256GM306 64
64 256
256 32
32 44 99 88 88 12
12 22 22ADC,
ADC,30
30ch
ch 11++44(2)(2) 44 11 44 33 22 11 –– –– –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EP256GM706
dsPIC33EP256GM706 64
64 256
256 32
32 44 99 88 88 12
12 22 22ADC,
ADC,30
30ch
ch 11++44(2)(2) 44 11 44 33 22 11 –– 22 –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EP256GM310
dsPIC33EP256GM310 100
100 256
256 32
32 44 99 88 88 12
12 22 22ADC,
ADC,49
49ch
ch 11++44(2)(2) 44 11 44 33 22 11 –– –– –– PT,
PT,BG
BG I,E,
I,E,HH
dsPIC33EP256GM710
dsPIC33EP256GM710 100
100 256
256 32
32 44 99 88 88 12
12 22 22ADC,
ADC,49
49ch
ch 11++44(2)(2) 44 11 44 33 22 11 –– 22 –– PT,
PT,BG
BG I,E,
I,E,HH
dsPIC33EP512GM304
dsPIC33EP512GM304 44
44 512
512 48
48 44 99 88 88 12
12 22 22ADC,
ADC,18
18ch
ch 11++44(2)(2) 44 11 44 33 22 –– –– –– –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EP512GM604
dsPIC33EP512GM604 44
44 512
512 48
48 44 99 88 88 12
12 22 22ADC,
ADC,18
18ch
ch 11++44(2)(2) 44 11 44 33 22 –– –– 22 –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EP512GM306
dsPIC33EP512GM306 64
64 512
512 48
48 44 99 88 88 12
12 22 22ADC,
ADC,30
30ch
ch 11++44(2)(2) 44 11 44 33 22 11 –– –– –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EP512GM706
dsPIC33EP512GM706 64
64 512
512 48
48 44 99 88 88 12
12 22 22ADC,
ADC,30
30ch
ch 11++44(2)(2) 44 11 44 33 22 11 –– 22 –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EP512GM310
dsPIC33EP512GM310 100
100 512
512 48
48 44 99 88 88 12
12 22 22ADC,
ADC,49
49ch
ch 11++44(2)(2) 44 11 44 33 22 11 –– –– –– PT,
PT,BG
BG I,E,
I,E,HH
dsPIC33EP512GM710
dsPIC33EP512GM710 100
100 512
512 48
48 44 99 88 88 12
12 22 22ADC,
ADC,49
49ch
ch 11++44(2)(2) 44 11 44 33 22 11 –– 22 –– PT,
PT,BG
BG I,E,
I,E,HH
dsPIC33EV64GM002
dsPIC33EV64GM002 28
28 64
64 88 44 55 44 44 66 –– 11ADC,
ADC,11
11ch
ch 11++44 (2)(2)
44 11 22 22 11 –– –– –– –– SO,SS,
SO,SS,MM
MM I,E,
I,E,HH
dsPIC33EV64GM102
dsPIC33EV64GM102 28
28 64
64 88 44 55 44 44 66 –– 11ADC,
ADC,11
11ch
ch 11++44(2)(2) 44 11 22 22 11 –– –– 11 –– SO,SS,
SO,SS,MM
MM I,E,
I,E,HH
dsPIC33EV64GM004
dsPIC33EV64GM004 44
44 64
64 88 44 55 44 44 66 –– 11ADC,
ADC,24
24ch
ch 11++44(2)(2) 44 11 22 22 11 –– –– –– –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EV64GM104
dsPIC33EV64GM104 44
44 64
64 88 44 55 44 44 66 –– 11ADC,
ADC,24
24ch
ch 11++44(2)(2) 44 11 22 22 11 –– –– 11 –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EV64GM006
dsPIC33EV64GM006 64
64 64
64 88 44 55 44 44 66 –– 11ADC,
ADC,36
36ch
ch 11++44(2)(2) 44 11 22 22 11 –– –– –– –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EV64GM106
dsPIC33EV64GM106 64
64 64
64 88 44 55 44 44 66 –– 11ADC,
ADC,36
36ch
ch 11++44(2)(2) 44 11 22 22 11 –– –– 11 –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EV128GM002
dsPIC33EV128GM002 28
28 128
128 88 44 55 44 44 66 –– 11ADC,
ADC,11
11ch
ch 11++44(2)(2) 44 11 22 22 11 –– –– –– –– SO,SS,
SO,SS,MM
MM I,E,
I,E,HH
dsPIC33EV128GM102
dsPIC33EV128GM102 28
28 128
128 88 44 55 44 44 66 –– 11ADC,
ADC,11
11ch
ch 11++44(2)(2) 44 11 22 22 11 –– –– 11 –– SO,SS,
SO,SS,MM
MM I,E,
I,E,HH
dsPIC33EV128GM004
dsPIC33EV128GM004 44
44 128
128 88 44 55 44 44 66 –– 11ADC,
ADC,24
24ch
ch 11++44(2)(2) 44 11 22 22 11 –– –– –– –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EV128GM104
dsPIC33EV128GM104 44
44 128
128 88 44 55 44 44 66 –– 11ADC,
ADC,24
24ch
ch 11++44(2)(2) 44 11 22 22 11 –– –– 11 –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EV128GM006
dsPIC33EV128GM006 64
64 128
128 88 44 55 44 44 66 –– 11ADC,
ADC,36
36ch
ch 11++44(2)(2) 44 11 22 22 11 –– –– –– –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EV128GM106
dsPIC33EV128GM106 64
64 128
128 88 44 55 44 44 66 –– 11ADC,
ADC,36
36ch
ch 11++44(2)(2) 44 11 22 22 11 –– –– 11 –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EV256GM002
dsPIC33EV256GM002 28
28 256
256 16
16 44 55 44 44 66 –– 11ADC,
ADC,11
11ch
ch 11++44(2)(2) 44 11 22 22 11 –– –– –– –– SO,SS,
SO,SS,MM
MM I,E,
I,E,HH
dsPIC33EV256GM102
dsPIC33EV256GM102 28
28 256
256 16
16 44 55 44 44 66 –– 11ADC,
ADC,11
11ch
ch 11++44 (2)(2)
44 11 22 22 11 –– –– 11 –– SO,SS,
SO,SS,MM
MM I,E,
I,E,HH
dsPIC33EV256GM004
dsPIC33EV256GM004 44
44 256
256 16
16 44 55 44 44 66 –– 11ADC,
ADC,24
24ch
ch 11++44(2)(2) 44 11 22 22 11 –– –– –– –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EV256GM104
dsPIC33EV256GM104 44
44 256
256 16
16 44 55 44 44 66 –– 11ADC,
ADC,24
24ch
ch 11++44(2)(2) 44 11 22 22 11 –– –– 11 –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EV256GM006
dsPIC33EV256GM006 64
64 256
256 16
16 44 55 44 44 66 –– 11ADC,
ADC,36
36ch
ch 11++44(2)(2) 44 11 22 22 11 –– –– –– –– ML,
ML,PT
PT I,E,
I,E,HH
dsPIC33EV256GM106
dsPIC33EV256GM106 64
64 256
256 16
16 44 55 44 44 66 –– 11ADC,
ADC,36
36ch
ch 11++44(2)(2) 44 11 22 22 11 –– –– 11 –– ML,
ML,PT
PT I,E,
I,E,HH
PIC32MK0512MCF064
PIC32MK0512MCF064 64
64 512
512 128
128 21
21 14
14 16
16 16
16 16
16 66 77ADC,
ADC,26
26ch
ch 55 44 –– 66 66 Yes
Yes Yes
Yes 44 11 PT,
PT,MR
MR I,I,EE
PIC32MK1024MCF064
PIC32MK1024MCF064 64
64 1024
1024 256
256 21
21 14
14 16
16 16
16 16
16 66 77ADC,
ADC,26
26ch
ch 55 44 –– 66 66 Yes
Yes Yes
Yes 44 11 PT,
PT,MR
MR I,I,EE
PIC32MK0512MCF064
PIC32MK0512MCF064 100
100 512
512 128
128 21
21 14
14 16
16 16
16 16
16 66 77ADC,
ADC,42
42ch
ch 55 44 –– 66 66 Yes
Yes Yes
Yes 44 22 PT
PT I,I,EE
PIC32MK0512MCF064
PIC32MK0512MCF064 100
100 1024
1024 256
256 21
21 14
14 16
16 16
16 16
16 66 77ADC,
ADC,42
42ch
ch 55 44 –– 66 66 Yes
Yes Yes
Yes 44 22 PT
PT I,I,EE
ATSAMC20N
ATSAMC20N 100
100 256
256 32
32 66 88 88 88 12
12 11 22ADC,
ADC,20
20ch
ch 44 –– –– 88◊ ◊ 88◊ ◊ 88◊ ◊ No
No Yes
Yes No
No No
No PT
PT I,I,EE
ATSAMC20J
ATSAMC20J 64/56
64/56 256
256 32
32 66 88 88 88 12
12 11 22ADC,
ADC,20
20ch
ch 44 –– –– 66◊ ◊ 66◊ ◊ 66◊ ◊ No
No Yes
Yes No
No No
No PT
PT I,I,EE
ATSAMC20G
ATSAMC20G 48
48 256
256 32
32 66 88 88 88 12
12 11 22ADC,
ADC,20
20ch
ch 44 –– –– 66◊ ◊ 66◊ ◊ 66◊ ◊ No
No Yes
Yes No
No No
No PT
PT I,I,EE
ATSAMC20E
ATSAMC20E 32
32 256
256 32
32 66 88 88 88 12
12 11 22ADC,
ADC,20
20ch
ch 44 –– –– 44
◊◊
4*4* 4*4* No
No Yes
Yes No
No No
No PT
PT I,I,EE
ATSAMC21N
ATSAMC21N 100
100 256
256 32
32 12
12 88 88 88 12
12 11 22ADC,
ADC,20
20ch
ch 44 –– –– 88◊ ◊ 88◊ ◊ 88◊ ◊ No
No Yes
Yes x2
x2CAN-FD
CAN-FD No
No PT
PT I,I,EE
ATSAMC21J
ATSAMC21J 64/56
64/56 256
256 32
32 12
12 88 88 88 12
12 11 22ADC,
ADC,20
20ch
ch 44 –– –– 66◊ ◊ 66◊ ◊ 66◊ ◊ No
No Yes
Yes x2
x2CAN-FC
CAN-FC No
No PT
PT I,I,EE
ATSAMC21G
ATSAMC21G 48
48 256
256 32
32 12
12 88 88 88 12
12 11 22ADC,
ADC,20
20ch
ch 44 –– –– 66◊ ◊ 66◊ ◊ 66◊ ◊ No
No Yes
Yes x2
x2CAN-FC
CAN-FC No
No PT
PT I,I,EE
ATSAMC21E
ATSAMC21E 32
32 256
256 32
32 12
12 88 88 88 12
12 11 22ADC,
ADC,20
20ch
ch 44 –– –– 44◊ ◊ 44◊ ◊ 44◊ ◊ No
No Yes
Yes x2
x2CAN-FC
CAN-FC No
No PT
PT I,I,EE
ATSAMD21J
ATSAMD21J 64
64 256
256 32
32 12
12 55 33 33 12
12 11 11ADC,
ADC,20
20ch
ch 22 –– –– 66◊ ◊ 66◊ ◊ 66◊ ◊ No
No Yes
Yes No
No 11 –– ––
ATSAMD21G
ATSAMD21G 48
48 256
256 32
32 12
12 55 33 33 12
12 11 11ADC,
ADC,20
20ch
ch 22 –– –– 66◊ ◊ 66◊ ◊ 66◊ ◊ No
No Yes
Yes No
No 11 –– ––
Motor
MotorControl
Controland
andDrive
DriveDesign
DesignSolutions
Solutions 15
15
Resources
Security Segments
Output Compare/
Standard PWM
Motor Control
Input Capture
Comparators
CodeGuard™
Temperature
Timer 16-bit
Device
Flash (KB)
DMA # Ch
RAM (KB)
Op Amps
Package
PWM Ch
USB 2.0
Range(3)
Analog
RTCC
UART
PMP
ADC
CAN
Pins
QEI
SPI
I2C
ATSAMD21E 32 256 32 12 5 3 3 12 1 1 ADC, 20 ch 2 – – 6◊ 6◊ 6◊ No Yes No 1 – –
ATSAMD21G16L 48 64 8 12 5 13 – 12 – 1 ADC, 18 ch 4 – – 6◊
6◊
6◊ No Yes No No – –
ATSAMD21E15L 32 32 4 12 5 13 – 12 – 1 ADC, 14 ch 4 – – 6◊ 6◊ 6◊ No Yes No No – –
ATSAMD21E16L 32 64 8 12 5 13 – 12 – 1 ADC, 14 ch 4 – – 6◊ 6◊ 6◊ No Yes No No – –
Training Classes
Motor Type Class Title Language Recording Date Duration
BLDC Sensorless BLDC Motor Control Using a Majority Function English 04/29/2008 19 min.
PMSM Sensorless Field-Oriented Control for Permanent Magnet Synchronous Motors English 03/30/2007 30 min.
ACIM Sensorless Field-Oriented Control (FOC) for AC Induction Motors English 01/21/2008 23 min.
Applications Notes
Motor Type/Algorithm Versus MCU Family
dsPIC® DSC
Motor Type Algorithm PIC16 Family PIC18 Family
Family
Full- and Half-Stepping AN906, AN907 – AN1307
Stepper Motor
Micro-Stepping – AN822 AN1307
Uni-Directional AN905 – –
Brushed DC
Bi-Directional AN893 – –
Motor
Servo Motor AN532, AN696 AN696 –
Sensored AN857, AN885, AN1779, AN2049 AN899 AN957
Sensored Sinusoidal – – AN1017
Sensorless BEMF AN857, AN1175, AN1305 AN970 AN901, AN992
Sensorless Filtered BEMF with Majority Detect – – AN1160
BLDC and PMSM
Sensorless Dual-Shunt FOC with SMO Estimator and Field Weakening – – AN1078
Sensorless Dual-Shunt FOC with SMO and PFC – – AN1208
Sensorless Dual-Shunt FOC with PLL Estimator and Field Weakening – – AN1292
Sensorless Single-Shunt FOC with SMO Estimator and Field Weakening – – AN1299
Open Loop V/F AN887, AN889, AN955, AN967, AN1660 AN900, AN843 AN984
Closed Loop Vector Control – – AN980
ACIM
Sensorless Dual-Shunt FOC with PLL Estimator – – AN1162
Sensorless Dual-Shunt FOC with PLL Estimator and Field Weakening – – AN1206
PFC – – AN1106
Appliance Class B (IEC 60730) – AN1229 AN1229
Other Motor Control Sensor Feedback Circuits AN894 AN894 AN894
MOSFET Driver Selection AN898 AN898 AN898
Current Sensing Circuit Concepts and Fundamentals AN1332 AN1332 AN1332
16 www.microchip.com/motor
Resources
MPLAB® X IDE
Universal and Integrated Tool
Set
MPLAB X IDE is a single, universal
graphical user interface for Microchip
and third-party software and hardware
development tools. It is the industry’s only
IDE to support an entire portfolio of 8-bit,
16-bit and 32-bit PIC® MCUs, dsPIC®
DSCs and memory devices.
18 www.microchip.com/motor
Motor Control Tuning GUIs
Avnet Silica
Future Electronics RS Components Ltd
Tel: +44 1438 788310 Tel: +44 1784 275 000 Tel: +44 8457 201 201
Tel: +44 1438 788250 Fax: +44 1784 275 600 Fax: +44 8458 509 911
www.microchip.com
Microchip Technology Inc. | 2355 W. Chandler Blvd. | Chandler AZ, 85224-6199
Information subject to change. The Microchip name and logo, the Microchip logo, dsPIC, MPLAB and PIC are registered trademarks and CodeGuard and dsPICDEM are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries. mTouch is a registered trademark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of
their respective companies. © 2017, Microchip Technology Incorporated. All Rights Reserved. DS00000896M. ML3112Eng07/17
GADGET MASTER
Meet BrightSpark
Sherzaad Dinah
Sherzaad Dinah is a young engineer who has made his
mark at Nissan’s European technical centre, contributing to
many aspects of electronics design for cars
buerklin.com
How
Hisham Salman explains why regular calibration is important
for ensuring conformance in RF testing
do you
radio resource management (RRM) checked on an annual basis to satisfy
performance of frequency-division the accredited calibration requirements
duplexing (FDD) and test-driven in line with ISO 17025 and ISO 9001
development (TDD) LTE mobile standards.
terminals for their compliance with the In addition to performing the
requirements of 3GPP (3rd Generation calibration checks, the traceability
Partnership Project) test cases. of calibration results to national and
test the
To achieve the required compliance international standards, including
there are certain parameters and certification and service reports, is
reference values that need to be advised, in order to comply with the
present and used by the so-called quality standards.
run time correction (RTC) function,
which automatically runs each time Traceability and accreditation
a connection to the user equipment All the major system providers are
testers?
is made and/or the test case is run by responsible for the selection and use of
Microsoft certified technology specialist the adequate measuring equipment as
(MCTS) test software. well as the purchase of the accredited
The initial reference values will calibration services for the test gear
come from the manufacturer of the RF used to ensure traceability of the test
conformance testing system and will be results achieved.
initially saved in the system’s database Furthermore, the traceability for
when it is installed. This data will be the on-site test gear must be assured
considered as the initial parameter by using measuring equipment and
readings. instruments that are themselves
System performance (system calibrated in a traceable manner and
specification) is calibrated at the also meet the specifications set down
time of the shipment of the system. by UKAS, the United Kingdom
Fundamental correction items are Accreditation Service.
measured simultaneously and then Accreditation laboratories ensure
saved as fundamental correction values that the expected measurement
ahead of the system shipment. These instrumentation uncertainty for
correction values are subsequently power level measurements, frequency
updated on demand, with periodic response, level accuracy measurements,
calibration. and so on, can be achieved.
In any RF system, instruments For example, Anritsu provides
are exposed to a certain level of traceable inspection and calibration
degradation depending on the use and
“
the operational age of the instrument.
How often should these reference
values be checked to ensure the The user needs
system’s conformity with 3GPP
requirements?
to make sure
that the whole
Annual calibration
test platform is
The answer to this question and to
many other quality-focused queries is operating within
to perform verification at the customer the factory-set
site in order to ensure that system
parameters are checked and calibrated
specified tolerance
Shutterstock
“
the system. The run-time correction is
performed before each measurement.
If calibration is However, to keep the reliability
not performed of the system and to increase the
maintainability, the annual calibration
regularly it is essential to check the functionality
can affect the of the instruments that may degrade
with time.
instrument’s In the annual calibration, the
measurements frequency response, level accuracy
and findings and linearity error of the instruments
in the system will be calibrated using
a power meter and a power sensor.
The power meter and the spectrum
calibration is less invasive and incurs analyser are continuously measuring the
the least possible downtime (typically performance of the system and acting as
only one week for a full calibration a reference.
of a test system and all its individual If calibration is not performed
instruments). No packing or transport regularly, it can affect the instrument’s
of the test system is necessary as the measurements and subsequent findings,
calibration can be done on site. especially for platforms used in test
From the time of purchase, users houses or companies with ISO 17025
have a complete test, adjustment and accreditation, where the general
calibration of all the individual units requirements for the competence of
followed by a calibration of the entire testing is the production of accurate and
system. For subsequent calibrations the precise measurements.
programs needed are available in the The annual calibration of RF
MCTS software that is installed on the conformance instruments and test
server PC. platforms has two objectives. It checks
It will test the frequency response, the accuracy of the instrument and
power measurements linearity, level it determines the traceability of the
accuracy within the uncertainty measurement. In addition, calibration
ME7873L/LA RF conformance test system traceable to the initial and reference will check whether any device in the
values, using a power meter with a system is out of spec. If so it can be
power sensor, the signal generator sent for investigation or repair. In the
of all the test equipment inside its operating within the specified tolerance and a spectrum analyser to get the meantime, customers receive a support
laboratories before sending it to the limits initiated by the factory. measurements compared to the initial unit to continue normal activities.
UKAS labs, to ensure that the units Users can help to keep instrument and the reference values. A calibration report/certificate is
meet the defined UKAS specifications. measurements or measured values These will be connected through provided by Anritsu, which shows
As a result, they are calibrated to within the specified limits by general purpose interface bus (GPIB) the measurements including all the
UKAS and the relevant standards, so maintaining a stable temperature and interfaces to the test platform. The measured values.
traceability is guaranteed. This proves humidity in the test laboratory. test gear will then be connected to the The main concern and the biggest
to customers that the instruments are However, the major step that should test ports on the systems and the same issue that calibration addresses is
within the factory specifications. be taken is the annual calibration of the measurements will be run again. The that, as instruments age, measurement
Using accredited test equipment test system and individual instruments results will be compared in order to accuracy might drift in response
ensures that the highest standard of of the system. Providing customers with achieve verification. to environmental factors. Annual
testing is achieved and therefore the a regular (usually annual or bi-annual) At the time of delivery or installation calibration that is easy and traceable is
integrity of the tested instrument or traceable correction and calibration by of the system at the customer’s the answer.
system is upheld. comparing the system’s or instruments’ site, the supplier’s team performs a
performance to a standard of known fundamental correction and calibration.
Why calibrate test gear? accuracy helps to increase their The values obtained will be considered
No measurement is ever 100% correct.
There will always be an unknown,
confidence in the instruments. as the first initial values together with
factory obtained values. All the annual
About the author
finite, non-zero difference between a Calibration procedure measurements thereafter should be Hisham Salman is
measured value and the corresponding When it comes to test equipment compared to these initial values.
EMEA field service and customer
“true” value or the reference value. calibration, the benefits of using
This means that the user needs to
support engineer at Anritsu
test platforms such as Anritsu’s The costs of neglecting calibration
make sure that the instruments – and RF conformance test platform Users of RF test platforms can run a
indeed the whole test platform – are ME7873L/LA (pictured) is that self-test procedure to check the status of
Electronics Weekly and RS Components have teamed up for a second year to celebrate the best
young electronic design engineers working in the UK today.
Through the BrightSparks programme, we find and highlight the young engineers, entrepreneurs,
students and innovators who are making waves in electronics today; and by celebrating their
achievements we hope to play our part in inspiring new entrants to engineering.
We need your help. If you know a brilliant engineer who is under 30, nominate them today to be a
BrightSpark – and play your part in demonstrating how the youngest engineers in the industry are
making UK electronics such an exciting place to be.
CONTENTS
Security is a deal-breaker for business
PAGE 23
Chipset choice can affect security
PAGE 23
How to create a sustainable IoT
PAGE 24
170601_6Mill_EW_UK_Snipe.indd 1 5/31/1
170921_TROP_EW_UK.indd 1 9/18/17 10:31 AM
VIEWPOINTS IOT
When a typical consumer shops for a new connected device, cyber specialists to scrutinise any device before it is used.
they are looking for the best functionality at the lowest price. In some cases, proactive manufacturers use security to
It’s unlikely that security will be the key concern in their demonstrate added value to their clients. However, IoT
decision-making process. But manufacturers selling devices devices are increasingly becoming a concern for risk
for business use are dealing with a far more security-savvy assessors, particularly in industrial applications such as
and risk-averse customer base. automation and robotics, where it could affect the physical
The focus on price means consumer devices vary wildly safety for employees.
in quality and security. As a result, there has been a steady The corporate model depends much more on repeat
stream of privacy breaches involving consumer-connected business than do consumer sales, so business-to-business
smart devices, although the impact on sales is usually limited. IoT manufacturers cannot afford to offload risk on to the
Many of these devices constantly collect audio and video customer. If a product causes a security breach, it’s likely the
“
feeds from inside users’ homes, and there is often no way for client will be lost for good.
consumers to know for certain where this information goes or The only answer for those building devices is to bake
who has access to it. robust security into design, along with comprehensive Cheap devices
Despite all this, it seems that cheap devices with minimal penetration testing before going to market and procedures for
security continue to win out, although manufacturers continuous diagnostics and monitoring thereafter. with minimal
of these products still need to be mindful of regulatory While this will make devices costlier, they are also likely security continue
responsibilities, particularly regarding health and safety, that to be more attractive to corporate customers who – unlike
necessitate at least some cyber security input. consumers – tend to like their technology to be reassuringly
to win out
Businesses that take security systems seriously engage expensive.
The processor used in an IoT device is influenced by many decrypted data that you thought were safe are not, and this is
factors, but when it comes to selecting parts, the primary not always clear in documentation.
drivers seem to be price and performance. If you choose the If you are not battery powered, it might not make
wrong chip you may not be able to correct security issues for any difference whether it takes 500 milliseconds or 10
products in the field – the only option may be a recall. milliseconds to encrypt data. But when you move to a device
Because the chip in a common ESP8266 Wi-Fi module has powered by a CR2032 battery, that’s the difference between
no internal flash, it cannot possibly store your user’s Wi-Fi one month and two years of battery life.
keys securely. An attacker with access to the device can Many chips have hardware cryptography engines
recover the user’s credentials in under 20 seconds. supporting the most common algorithms such as AES-128
Its successor – the ESP32 – specifically addresses this and SHA-256. These can be far quicker – and hence more
“
issue. But it costs around $3 per device compared to $1.70 for energy efficient – than software implementations.
the ESP8266. Without a good entropy source for your RNG, you have no
Most microcontrollers have some form of debug access effective seed for your cryptography. A lack of randomness The primary
– JTAG, SWD or proprietary – allowing access to flash, leads to predictability, meaning that your crypto could be
registers and RAM. The majority have ‘fuses’ or other compromised. drivers seem
controls to prevent adversaries abusing this access. The chip at the heart of your IoT device might not be the to be price and
JTAG read-protection on the common EM3598 ZigBee obvious place to start when it comes to IoT security, but
chips prevents access to the flash memory but does not stop if you constrain your developers by skimping on security
performance
the attacker inspecting the RAM. Your private keys and functionality, you may pay the price further down the line.
How to create a
sustainable IoT
As the IoT extends its reach product designers must consider the environmental impact of their ideas, writes Kristopher Ardis
Let’s indulge the hyperbole of the for all the discarded devices that didn’t of things, and the ability to process a lot Powering the IoT responsibly
internet of things (IoT) for a moment: work past a year? of that data, so the answer to “can we” Fifty billion devices is a lot. Just think
do we have the silicon to connect 50 Do we have enough insurance for build IoT devices is, generally yes. about your own graveyard of electronic
billion devices? damages arising out of malicious But the answer to “should we” isn’t devices – probably mostly old phones
Do we have the networks to allow bot attacks? Do we have enough always a “yes” – if the devices aren’t and laptops, each with its own battery
them to get data to the cloud? Do we engineering capacity to build all of robust, they won’t last and their value is and obsolete electronic components.
have the manufacturing capacity to these different IoT devices within our limited. The return on investment (ROI) As devices get cheaper and we bring
build enough devices for every person lifetime? for deploying these devices won’t make more of them into the house, we create
on the planet to have seven connected Maybe not. sense if their lifetimes are limited. the potential for much larger quantities
things? Probably, yes. The greatest promise of the IoT is Semiconductor companies work to of scrap.
Now let’s succumb to the reality of the ability to invisibly connect things to close the “should we” gap by providing Many of us save old laptops and
the IoT: do we have a plan to cleanly improve the efficiency of our work and power-efficient, robust, and secure phones because our data is on them.
dispose of billions of batteries each our lives. silicon for sensing and controlling the We may not, however, have such a
year? Do we have the landfill space We have the technology to sense a lot world around us. connection to old thermostats or fitness
trackers, so many of these devices
may end up in landfills.
The alternative is to
use replaceable
batteries
Shutterstock
– but that scenario isn’t much better. cost-effective IoT nodes from the
Instead of piles of electronic devices beginning. Long the domain of critical
we’ll have piles of discarded batteries. infrastructure and financial transactions,
Semiconductor companies have powerful cryptographic tools are
the opportunity to ensure the IoT is available in low-power microcontrollers
powered responsibly, reducing the and companion processors that provide
number of discarded batteries by effective toolboxes for letting a
extending the life and usefulness of Bluetooth heart-rate sensor employ the
remote sensors. same cryptographic tools as a credit
Microcontrollers such as Maxim’s card terminal.
MAX32630 have plenty of horsepower IoT nodes can use advanced
and memory space to tackle complex, techniques such as elliptic-curve
value-added IoT applications while cryptography, making systems widely
consuming only 3.4µW from the deployable without risking system
battery (backing up 512KB SRAM). secret keys.
Power management ICs such as By using special hardware to
its MAX14745 wearable charge- implement these cryptographic
management solution ensure that power techniques, the IoT nodes perform
is delivered efficiently from the battery their secure functions faster and at
to the system, minimising loss from lower power than if they tried to do so
power regulation. in software.
And power-conscious sensors made Using these industry-standard
for wearable applications minimise The MAX32631 is an example of a low-power ARM Cortex-M4 with FPU processor that also cryptographic tools, IoT nodes can boot
the battery impact of detecting the integrates high-performance cryptographic engines securely only from trusted code bases,
real world. setting the stage for future, invisible
The result is sensors that can last feature upgrades and even security
longer and do more processing. patches. The IoT can be secure and
Nodes that can make more intelligent upgrade. Typically, you need to be enough to be upgraded for future needs: invisible after all.
remote decisions help reduce network able to store both the old and the new new home connectivity protocols, new
congestion when they don’t have to go revision of firmware until you are sure functionality, or just fixing bugs in what Can we? Should we?
to the cloud to make decisions, which that you have downloaded the correct got deployed in the first place. The technology is there to build
saves power by eliminating useless new firmware. But the biggest challenge looming plenty of IoT nodes, but real-world
network traffic. Microcontrollers such as Maxim’s over the IoT is trust. The sensors we challenges must be solved before the
have more flash and SRAM than any buy and deploy will collect intimate ROI calculations fall in favour of
Making the IoT last other low-power microcontrollers data about us: when we are home, deployment.
The latest connected door locks and and can extend their address space to what we watch on TV, and what Battery replacement must be
toasters are great, that is until someone external memory chips connected via appliances consume electricity in our mitigated and product life extended
releases a new home connectivity API, Quad-SPI, ensuring that embedded houses, for example. to maximise the potential lifetime of
or a critical bug is patched in firmware. applications can upgrade to any degree Some IoT devices may control sensors and actuators.
If these updates need human of complexity. critical functions in our homes: whether Future-proof IoT devices must be able
intervention to manage, then the electricity can be delivered to the to update as communications protocols
difficulty of using those devices goes up Trusting the IoT house, what the temperature setting for and processing demands change. And
as the ROI goes down. The answer to “should we build the the house should be, whether the garage the data we receive along with the
However, updates are critical to IoT IoT” is getting a little clearer. We can door is down or up. commands we send must be trusted.
devices – new players in the cloud build devices with low enough power When you talk about the IoT in The goal is to make the IoT invisible.
computing space may create a need to mitigate the number of batteries and industrial settings, the threats are even Semiconductor companies are working
to send data to new locations, new devices that find their ways to a landfill. more severe: will your city continue to to make sure IoT devices get deployed
functionality may be dreamed up by the We can build devices that are flexible have reliable electricity, will nuclear once and can safely be forgotten.
device engineers and security risks may power plants operate as intended,
“
warrant a review of the functionality of will manufacturing lines operate
an IoT device. productively or will they break due
But if IoT devices can’t be updated, The biggest to malware?
About the author
they run the risk of becoming obsolete The IoT needs to be both trusted
every time the market changes.
challenge looming and invisible – two seemingly at-odds Kristopher Ardis is
To make IoT devices last, they need over the internet goals. Trusted means constant security executive director,
the ability to be updated in the field. of things is trust patches, which require user intervention micros and security
There are security aspects to this, (and, thus, ruin invisibility), right? business unit at
but there is also a practical need for Not necessarily. Maxim Integrated
sufficient memory to handle a firmware Security can be built into
Mentor Automotive
connectivity autonomous
connecting car, driver autonomous driving
& the external world & driver assist systems
electrification architecture
electric vehicles EE architecture
& supporting technology & system implementation
12 December
Elektra Awards special
CES preview
17 January
Design tools
Automotive
Technologies to watch in 2018
31 January
Power design
Industry 4.0
Read the latest headlines at
Southern Manufacturing
www.electronicsweekly.com
Electronics
Weekly.com
Competitive pricing
for special technology prototypes
and higher PCB quantities
www.pcb-pool.com
www.pcb-pool.com
www.electronicsweekly.com | 15 November 2017 31