Engineering Workshop

4EJ504

Course Work 1
Workshop Skills Portfolio
Kelvin Brammer
Engineering Workshop 4EJ504
Contents
Module Leader ................................................................................................................................................................... 3
Key dates and details ......................................................................................................................................................... 3
Description of the assessment ........................................................................................................................................... 3
Assessment Content .......................................................................................................................................................... 3
Engineering Workshop Lab 1. ............................................................................................................................................ 4
Engineering Workshop Lab 2a. .......................................................................................................................................... 6
Engineering Workshop Lab 2b. .......................................................................................................................................... 8
Engineering Workshop Lab 3a. .......................................................................................................................................... 9
Engineering Workshop Lab 3b. ........................................................................................................................................10
Engineering Workshop Lab 4. ..........................................................................................................................................11
Engineering Workshop Lab 5. ..........................................................................................................................................13
Engineering Workshop – QR Codes for Useful posters and guides. ................................................................................14
Engineering Workshop – QR Codes for Useful Videos. ...................................................................................................15
Assessment Rubrics .........................................................................................................................................................16
Assessment Regulations ..................................................................................................................................................20
Module Leader
Module Leader: Kelvin Brammer
Email Address: [email protected]
Office Phone Number: +44 (0)1332 593589 (bold text is internal number)

Key dates and details

Assessment Type: Individual lab book

Assessment weighting: 30% of overall module grade
Learning Outcomes: 1 Apply basic skills of drilling, soldering, and wiring (including power
connectors), with due consideration to health and safety issues.
Submission Method: Turnitin
Submission Date: 23:59 UK time, 12/11/2021
Provisional Feedback Release Date: 23:59 UK time, 03/12/2021

Description of the assessment

1. You are required to complete each section of this workbook and get each part assessed (and signed off) by
the lab tutor during each laboratory session.
2. You will need to create a lab book that includes photos of your completed work for each section of this
workbook (PowerPoint or Word), as well as including the signed marking blocks from each session. The file name
should be your student name and number followed by CW2 Eng Wksp 2021 e.g. “A N Other 12345678 CW2 Eng
Wksp 2021”. Submit your workbook via Turnitin.
3. Harvard referencing is to be used where appropriate. See library web pages for more information under
support - skills guides - Academic Writing
If you DO NOT complete the lab exercise during the time-tabled session, you should finish that lab sheet (except
lab 2) in your own time, before the next session and get it marked at the start of the next lab.
4. Each lab will only be assessed once it has been demonstrated as being fully working.
5. Marking will ONLY take place during your timetabled lab session.
6. Your completed lab book must be submitted on Turnitin before 23:59 on the 12th of November 2021.

Assessment Content

0900766b81707448.pdf (rs-online.com)
Engineering Workshop Lab 1.
Purpose: Familiarise yourself with some of the common (and not so common) components encountered
in typical circuits, and gain practice in identifying and measuring component values.
Component Identification information is available on course resources (study materials) as well as via some QR
codes at the end of this lab sheet.
Utilising your box of components, and the list below, create one page per item in your lab book, noting the
following:
1. Picture of the package or any other relevant information from the manufacturer's datasheet.
2. Where appropriate, the value of the component in the form of colour code or other markings on the device (you
may refer to colour code charts) including any tolerance and/or voltage ratings, as well as the actual measured
value.
3. Dimensions of the package e.g. diameter, height, the distance between pins taken from the manufacturer’s
datasheet and compared to your actual component.
4. Polarity or pinout information of the device (where applicable).
Device Type – Title for each slide
# Description # Description
3 pole (stereo) panel mount 1/4" unswitched IC ULN2803 Transistor Array
1 jack socket 12 ULN2803A Darlington Transistor Array (Rev. G)
3 Plugs+Jacks PG V7 2008.pdf (farnell.com) (sparkfun.com)
Capacitor Ceramic 100nF 25V SMD 1206 LED 3mm red, 1.85V high intensity
2 13
0900766b81707448.pdf (rs-online.com) L-934ID(V5) (rs-online.com)
Machine Screw M3x16mm countersunk slotted
Capacitor Ceramic 47nF 100V 2.54mm pitch Buy M3 x 16mm Slotted Countersunk Screws (DIN
3 14
2305633.pdf (farnell.com) 963) - Stainless Steel (A2) | Save 95% | 500,000+
Components | Accu®
Capacitor Electrolytic 4.7uF 63V Resistor 15k ¼ W 1% Axial
4 15
2875044.pdf (farnell.com) 2860633.pdf (farnell.com)
Capacitor Polyester 100nF Resistor 4k7 ¼ W 1% Axial
5 16
0900766b8171c8bb.pdf (rs-online.com) 2860633.pdf (farnell.com)
Dual In Line (DIL) 16-way dual wipe IC socket Resistor 8k2 1206 1% 1/8W SMD
6 17
A700000006944332.pdf (rs-online.com) 2167052.pdf (farnell.com)
Diode 1N4148
RJ45 Panel Mount Socket
7 1N/FDLL 914/A/B / 916/A/B / 4148 / 4448 - 18
A700000007671004.pdf (rs-online.com)
Small Signal Diode (rs-online.com)
Transistor BC546 or BC547 Transistor
Header 2 way 0.1” pitch
8 19 Microsoft Word - frontpagetemplate.doc
A700000007927548.pdf (rs-online.com)
(rapidonline.com)
IC 4017 Decade Counter Trimmer potentiometer 50k (Bourns 9mm)
9 CD4017B, CD4022B TYPES datasheet (Rev. C) 20 Bourns® Trimpot® Trimming Potentiometers
(ti.com) (farnell.com)
IC NE555D timer SMD XLR Panel Mount Plug
10 21
xx555 Precision Timers datasheet (Rev. I) Metal 3 pin XLR.cdr (farnell.com)
IC TL082CD Dual Op amp SMD
XLR Panel Mount Socket
11 TL082 Wide Bandwidth Dual JFET Input 22
Metal 3 pin XLR.cdr (farnell.com)
Operational Amplifier datasheet (Rev. C)
 https://www.rapidonline.com/ https://onecall.farnell.com/ https://uk.rs-online.com/web/

Assessment
Bring the completed lab book to your tutor who will assess your overall efforts and highlight any areas that require
improvement.
Fail Pass
Correct Images (20%)
Correct Value Code (20%)
Use of Datasheets for Dimensions (20%)
Correct Polarity or Pinout Information (20%)
References (Harvard) (20%)
Engineering Workshop Lab 2a.
Purpose: Learn how to safely wire a 13A plug.
There is a “How NOT to Wire A Plug” lecture on course resources (study materials).
1. Strip off the outer cable sheathing to expose at least 5cm of the insulated wires without damaging any of the inner
core’s insulation (if you damage any core such that you can see the copper inside, cut them off and re-strip the
outer sheathing).

5cm (to scale)

5mm (to scale)

2. Lay the cable on top of the plug so that:

a. The end of the outer insulation is 5-10mm past the cable clamp
b. The individual wires run correctly to their respective terminals as shown below.
i. The live (brown) wire should go directly to the terminal with the absolute minimum of extra wire. This
ensures that the live wire is the first to break if the cable gets pulled by accident.
ii. The neutral (blue) wire should go directly to the terminal but can have a small amount of extra wire.
iii. The earth wire (green and yellow) must have an extra amount before the terminal as shown in the image
below (the extra length on the earth cable is to ensure that it is the last wire to disconnect if the lead is
pulled out of the plug).
c. Mark each wire to show where the front face of the terminal is as indicated by the red circles below (this is
where you will strip the wire from).
d. Add a second mark 5mm after the first, at the back of the screw terminal as shown by the pale blue circles
below. You can also use the arrows above as a guide.

3. Cut each wire to the correct length at the second mark.

4. Remove the insulation to leave 5mm of exposed metal core on each wire. Ensure that there is no damage to the
inner wires. Carefully twist them in the same direction as they appear naturally.
5. Insert the twisted strand ends into the correct terminal, ensuring that the insulation reaches right up to each
terminal, but does not go inside and that there are no loose strands of wire sticking out. Tighten the terminal
screw – do not over tighten.

6. Fit the flex firmly into the cord grip making sure that the grip fastens on the outer insulating sleeve of the flex.
7. Do NOT put the cover. Take to your tutor for marking.

Fail Pass
Flex (25%)
Conductor There is no failure option. You will need (25%)
Cable clamp to repeat these steps until you pass. (25%)
Polarity (25%)

Academic Signature:
Student Number:

7
Engineering Workshop Lab 2b.
Purpose: Learn how to safely wire a 16A Ceeform socket.
1. Using the principles (but NOT measurements) from lab 2a, strip off the outer cable sheathing to expose enough of
the insulated wires to allow them to reach the bottom of the screw terminals (use a skinny screwdriver to help
measure the depth).
2. Cut the wires to the appropriate lengths. The diagram below shows the connections as viewed from the FRONT
(not the screw terminal side).

3. Separate the socket as shown below to gain access to the terminals.

Carefully depress
spring clip using a
screwdriver and
twist the outer
body at the same
time to uncover
the screw
terminals

4. Measure the depth of the terminals using a thin screwdriver, and strip off double that amount of insulation, and
twist the ends. Remember to ensure extra length in the earth wire. (Terminals are deeper than 13A plug, especially
the earth which has 2 terminal screws)
5. Place cable through the gland and outer body.
6. Insert the correctly prepared wires into the correct terminals, ensuring that there are no loose strands of wire and
tighten the terminal screw – do not over tighten.
7. Take to your tutor for marking.
Fail Pass
Flex (25%)
Conductor There is no failure option. You will need (25%)
Cable clamp to repeat these steps until you pass. (25%)
Polarity (25%)

Academic Signature:
Student Number:

8
Engineering Workshop Lab 3a.
Purpose: The purpose of this session is to make sure you can carry out basic preparation of wires and
cables, tinning and soldering operations.

Solid core wire 1/0.6mm is used to make connections between two different points of the same board where there will
not be any movement.
Flexible stranded wire 7/0.2mm or 16/0.2mm is used for connections that leave the board where there is the possibility
of movement.
You must demonstrate your ability to strip different types and gauges of wire without damaging the individual wire
strands, and apply solder (tinning) to the stranded wire without causing excessive solder build-up, heat damage or
making the wire brittle by capillary creep of solder.
You will be assessed on how you prepare cables for each of the following instructions. If you are unable to prepare the
wire correctly, seek help, and keep practising!
Images on this page are NOT to scale
Using SOLID CORE WIRE (1/0.6mm) make the following: -
a) A straight, stripped end, 1 cm long.
Using 7/0.2mm STRANDED WIRE, make the following: -
a) A straight, stripped, twisted end, 1 cm long.
b) A straight, stripped, twisted, tinned end, 1 cm long.
Using 16/0.2mm STRANDED WIRE, make the following: -
a) A straight, stripped, twisted end, 1 cm long.
b) A straight, stripped, twisted, tinned end, 1 cm long.
Assessment
Bring all of the various prepared wire ends to your tutor who will assess your overall efforts and highlight
Fail Pass
Undamaged There is no failure option. You will need
(35%)
conductors to repeat these steps until you pass.
Undamaged
(35%)
insulation
Tinning of
(30%)
strands

Academic Signature:
Student Number:

9
Engineering Workshop Lab 3b.
Purpose: The purpose of this session is to make sure you can perform more detailed soldering tasks. You
must demonstrate your ability to solder wires onto stripboard without damaging the copper track,
unintentionally bridging the tracks, or creating dry joints.
Using a small area of one of the supplied pieces of stripboard:
1. Using your track break tool, carefully break one of the copper tracks. Ensure that there are no fine whiskers
of copper touching adjacent tracks or any damage to the tracks on either side of the break (Use a
multimeter set to continuity test to check both sides of the break and to tracks either side. You do not want
any beeps).
2. Take to your tutor for assessment before continuing.
Once you have had the previous step approved, complete all the remaining steps, and then return to your tutor for
assessment.

3. Prepare 2 x Solid 1/0.6mm wires and 2 x 7/0.2mm wires stripped back 4mm, twisted (if
appropriate) and tinned as done previously in lab 3a.
4. Tin 4 x non-adjacent tracks on the stripboard, about 5mm long, at the very edge of the
board.
5. Clean the tip of the soldering iron, apply a small amount of solder to the tip, and join the
tinned wire to the board.

6. Tin the track on either side of the track break from step 1.
7. Repair the break using a short piece of stripped 1/0.6mm tinned wire.

8. Solder some suitably prepared “flying” wires onto the stripboard from the component side
(i.e. wire is inserted from the ‘plain’ side and the stripped wire end passes straight through
the hole and soldered onto the copper track. Wire on the solder side of the board should
stick straight out of the board, and not be bent over). Trim the excess wire to the top of
the solder joint. This should be done with:
a) 2 x Solid 1/0.6mm wires.
b) 2 x Stranded 7/0.2mm wires.
9. Create 2 small links using 1/0.6mm wire as shown in the image to the right (exact size, image is to scale). They
need to be only 3 tracks wide and bent at 90 using your pliers and flat.
10. Join two non-adjacent tracks, using one of the links from step 9, on the copper side as shown in the image
to the right. You must make sure that the insulation stays intact, does not shrink back over the adjacent
track, and that you only use the minimum amount of copper track to solder to (between 3 holes maximum).
The solder joint should be parallel to the track and the insulated part runs at 90 to the track. Keep the wire
straight and close to the track surface.
11. Repeat step 10 using the other link from step 9, but with the insulation on the top component side,
with the stripped wire running through holes that are not on the same track and soldered on the copper
side of the board. Like in step 8, the wire on the solder side of the board should stick straight out of the
board, and not be bent over. Trim the excess wire to the top of the solder joint.
Assessment
Bring the stripboard to your tutor who will mark your overall efforts and highlight any areas that require
improvement.
Unsatisfactory Poor Acceptable Good Excellent
Track break (10%)
Damaged tracks (10%)
Track repair (10%)
Soldered joints (20%)
Lack of bridging (10%)
Cross-track wiring
practice (20%)
Academic Signature:
Student Number:

10
Engineering Workshop Lab 4.
Purpose: The purpose of this session is to build a circuit on a PCB following a schematic, and to be able
to set up test equipment and take basic measurements using an oscilloscope.
Using the experience gained in labs 1, 3 and 4, and the QR code links at the end of this lab book, complete the following:
1. Identify all the components needed from the kit of parts provided
Quantity Description Ref Des Package
2 Capacitor Electrolytic 100µF C5, C6 CAPPR250-630X1120
2 Capacitor 1nF C2, C4 1206 SMD
2 Capacitor 100nF C1, C3 1206 SMD
4 Test Pins J1, J2, J3, J4 TEST_PT_THT
1 Op-Amp TL082CD U1 SO-8 SOIC SMD
2 Resistor 1kΩ 1% R3, R7 1206 SMD
2 Resistor 4.7kΩ 1% R9, R10 1206 SMD
2 Resistor 8.2kΩ 1% R1, R5 1206 SMD
2 Resistor 10kΩ 1% R4, R8 1206 SMD
2 Resistor 82kΩ 1% R2, R6 1206 SMD
2. Build the headphone amplifier circuit below on the PCB provided. The test pins for J1, J2, J3 and J4 are inserted
from and soldered on the bottom side of the board with the surface mount components (Figure 3) but stick out
of the top of the PCB for the connection of test leads.

Figure 1 Headphone Amplifier Schematic

Figure 2 Topside view of PCB

11
 Figure 3 Bottom side view of PCB
3. Add suitably prepared (stripped and tinned) 7/0.2mm test leads into the appropriate pads of U2, U3 and U4. Red
for 9V, black for Gnd and 0V, any other colour for the +i/p and +o/p pins (both of these the same colour), and a
different colour again for the -i/p and -o/p pins (both of these the same colour).
4. Test and demonstrate the finished amplifier with a signal generator, using a sine wave of amplitude and
frequency specified in the tables below, and an oscilloscope. You should also complete the table provided below
using your measured values in the formulas and include the correct units.

+IP of U2 with
+OP of U3 with respect to Ground
respect to Ground
Signal Period 𝑮𝒂𝒊𝒏 𝑮𝒂𝒊𝒏(𝒅𝑩)
Freq. Vin
Vout as measured 𝑽𝒐𝒖𝒕 𝑽𝒐𝒖𝒕
1 kHz 200mV = = 𝟐𝟎𝒍𝒐𝒈
on the scope 𝑽𝒊𝒏 𝑽𝒊𝒏
Measured ➔ 2.08V 500µs 10.4 20.35dB

-IP of U2 with
-OP of U3 with respect to Ground
respect to Ground
Signal Period 𝑮𝒂𝒊𝒏 𝑮𝒂𝒊𝒏(𝒅𝑩)
Freq. Vin
Vout as measured 𝑽𝒐𝒖𝒕 𝑽𝒐𝒖𝒕
2 kHz 100mV = = 𝟐𝟎𝒍𝒐𝒈
on the scope 𝑽𝒊𝒏 𝑽𝒊𝒏
Measured ➔ 1.06V 500µs 10.6 20.51dB

Assessment
Unsatisfactory Poor Acceptable Good Excellent
Undamaged components (20%)
Component placement (20%)
Quality of soldering (20%)
Correct operation / gain calculations (20%)
Use of oscilloscope and function generator
(20%)
Academic Signature:
Student Number:

12
Engineering Workshop Lab 5.
Purpose: The purpose of this session is to construct a circuit on a PCB (Printed Circuit Board) following a
schematic and component layout diagram.

Construct and test the Signal Generator circuit below. This is a known working circuit.

NOTE!
The component footprint of the
transistor in your kit is different to that
shown in the pcb layout. The BC107 is
shown left. You are to use the datasheet
for the BC546 or BC547 from Rapid to
ascertain the correct orientation of these
transistors.

Assessment
Unsatisfactory Poor Acceptable Good Excellent
Component placement 25%
Undamaged track, connections,
components 25%

Soldering 25%

Correct connection of
components & wiring 25%

Academic Signature:
Student Number:

13
Engineering Workshop – QR Codes for Useful posters and guides.

Soldering Steps and Joint Types Capacitors and LEDs

Simple Circuit Diagnostics Resistor Colour Codes Chart

Simple Setup and Test of a Circuit Drilling Info

Basic Oscilloscope Setup PCB Design Guide (assignment 2)

14
Engineering Workshop – QR Codes for Useful Videos.

Step 1 Test Leads video Step 2 Power Supply video

Step 3 Signal Generator video Step 4 Digital Multimeter video

Step 5 Oscilloscope video Step 6 Basic Test setup video

SMD Soldering (lab 4) video

15
Assessment Rubrics
Lab 1 - 20% CW1 mark Item
Fail Pass
Component identification Weighting
Correct image used, including
Correct Images 20% Incorrect image used package, pinout, or polarity where
applicable
Poor decode of visual markings to Good decode of visual markings to
Correct Value Code 20% derive component value or part derive component value or part
number number
Accurate use of datasheet of
Datasheet not used or incorrect
Use of Datasheets 20% component values using
information
appropriate test equipment.
None, incorrect or little All polarised components correctly
Correct Polarity or Pinout
20% information given where identified with accompanying
Information
appropriate diagram.
Items correctly referenced using
No referencing or incorrect
References 20% Harvard method next to image and
method used
reference page included

Lab 2a - 10% CW1 mark Item

Fail Pass
Wiring UK 3 pin plug Weighting
Flex stripped and no damage to
Flex stripped but inner conductor
inner conductor insulation (minor
Flex 25% insulation damaged exposing
scuffing to conductor insulation is
copper. (Needs to be repeated)
acceptable).
Conductors cut and stripped to the
Conductors cut to wrong length,
correct length, inner copper
(Live and neutral wires too long,
strands not damaged, no stray
earth wire too short or tight). Stray
strands sticking out of the
strands visible outside terminal.
Conductor 25% terminal, correctly observed
Incorrectly observed terminal
terminal depth. Live wire goes
depth. Excessive strands cut during
directly to terminal. Neutral wire
stripping of insulation. (Needs to
not tight or excessively long. Earth
be repeated)
wire has slack and is not too short.
Cable not clamped or incorrectly
Cable correctly clamped over the
Cable clamp 25% clamped on inner conductors.
outer sheath
(Needs to be repeated)
Conductors connected with
Conductors connected with correct
Polarity 25% incorrect polarity. (Needs to be
polarity observed
repeated)

16
Lab 2b - 10% CW1 mark Item
Fail Pass
Wiring 16A Ceeform plug Weighting
Flex stripped and no damage to
Flex stripped but inner conductor
inner conductor insulation (minor
Flex 25% insulation damaged exposing
scuffing to conductor insulation is
copper.
acceptable).
Conductors cut and stripped to the
Conductors cut to wrong length, correct length, inner copper
(Live and neutral wires too long, strands not damaged, no stray
earth wire too short or tight). Stray strands sticking out of the
Conductor 25% strands visible outside terminal. terminal, correctly observed
Incorrectly observed terminal terminal depth. Live wire goes
depth. Excessive strands cut during directly to terminal. Neutral wire
stripping of insulation. not tight or excessively long. Earth
wire has slack and is not too short.
Cable not clamped or incorrectly Cable correctly clamped over the
Cable clamp 25%
clamped on inner conductors outer sheath
Conductors connected with Conductors connected with correct
Polarity 25%
incorrect polarity polarity observed

Lab 3a - 5% CW1 markWire

ItemWeighting Fail Pass
stripping
Conductor not damaged. Minor
Conductor damaged: copper wire
Undamaged conductors 35% scuff to tinning. All strands
nicked; strands completely cut
present.
Insulation poorly stripped, split, Insulation cleanly cut not
Undamaged insulation 35% not a uniform cut. Heat damage stretched or split. Minimal heat
from tinning damage from tinning
Incorrectly twisted, excessive Strands correctly twisted in
Tinning of strands 30% solder (unable to see wire twist) original lay and visible through
and contains flux debris solder. Solder uniform and clean.

17
Lab 3b - 15% CW1 mark Item
Unsatisfactory (20%) Poor (30%) Acceptable (45%) Good (65%) Excellent (100%)
Strip board exercise Weighting
Track broken, major damage to
tracks either side of break, burrs on Track cleanly broken, minimal
Track not broken Track broken, some damage to Track cleanly broken, no damage
Track break 10% copper edges damage to tracks either side of
(Needs to be repeated) tracks either side of break to tracks either side of break
(would benefit from being break
repeated)
Major damage to tracks, tracks
Serious damage to board detached from board Major damage to tracks, tracks
Damaged tracks 10% Minor damage to a few tracks No damaged to any tracks
(Needs to be repeated) (would benefit from being lifting, but still connected
repeated)
large solder joints, long piece of
uninsulated 1/0.6mm wire on the Large solder joints, long piece of Small solder joints, short piece of Small clean solder joints, short
solder side of the board, not in the uninsulated 1/0.6mm wire on the uninsulated 1/0.6mm wire on the piece of uninsulated 1/0.6mm wire
Track repair not electrically
centre of the track, extending solder side of the board, not in the solder side of the board, not in the on the solder side of the board, in
Track repair 10% connected
more than 15mm to either side of centre of the track, not extending centre of the track, not extending the centre of the track, not
(Needs to be repeated)
break more than 15mm to either side of more than 10mm to either side of extending more than 5mm to
(would benefit from being break break either side of break
repeated)
Joint extending past adjacent Joint extending past adjacent
Joint not extending past adjacent Small smooth joint not extending Small smooth joint not extending
holes. Dirty, rough finish. holes. Some debris in joint.
holes. Clean and shiny, free from past adjacent holes. Clean and past adjacent holes. Concaved
Convexed sides. Holes in the Convexed sides. No holes in the
debris. No holes in the solder. shiny, free from debris. No holes in sides. Clean and shiny, free from
Soldered joints 20% solder. Component legs not solder. Component legs not
Triangular shaped flat sides. the solder. Triangular shaped flat debris. No holes in the solder.
trimmed or shorting to other legs shorting to other legs or tracks.
Component legs not shorting to sides. Component leg trimmed to Component leg trimmed to top of
or tracks. (would benefit from being
other legs or tracks. top of solder. solder.
(Needs to be repeated) repeated)
No bridging to adjacent tracks.
Large amount of solder on No bridging to adjacent tracks.
No bridging to adjacent tracks. No bridging to adjacent tracks. No
Tracks bridged with solder. adjacent tracks next to solder Minimum solder residue on
Lack of bridging 10% Minimum solder on adjacent tracks solder on adjacent tracks next to
(Needs to be repeated) joints adjacent tracks next to solder
next to solder joints solder joints
(would benefit from being joints
repeated)
Large solder joints. Insulated wire
Small solder joints between two
on the solder side of the board. Small solder joints between two
Small solder joints between two adjacent holes. Insulated 1/0.6mm
Poor solder joints. Incorrect wire Wire not straight or flat to the adjacent holes. Insulated 1/0.6mm
adjacent holes. Insulated 1/0.6mm wire straight and flat to the solder
used. Incorrect placement. Ends of board. Ends of wire not cut to the wire flat to the solder side of the
wire on the solder side of the side of the board. Stripped ends
Cross track wiring practice wire not trimmed. Excessive edge of the solder joint. Insulation board. Stripped ends bent to 90°.
20% board. Ends of wire cut to the edge bent to 90° and running in centre
Solder side exposed conductor. Excessive heat not over track, exposed conductor Ends of wire cut to the edge of the
of the solder joint. Insulation over of track. Ends of wire cut to the
damage to insulation. over adjacent track. Excessive heat solder joint. Insulation over track.
track. Some heat damage to edge of the solder joint. Insulation
(Needs to be repeated) damage to insulation. Minimum heat damage to
insulation. over track. Minimum heat damage
(would benefit from being insulation.
to insulation.
repeated)
Large solder joints. Insulated wire
Small solder joints between two
on the component side of the Small solder joints between two
Small solder joints between two adjacent holes. Insulated 1/0.6mm
Poor solder joints. Incorrect wire board. Wire not straight or flat to adjacent holes. Insulated 1/0.6mm
adjacent holes. Insulated 1/0.6mm wire straight and flat to the
used. Incorrect placement. Ends of the board. Ends of wire not cut to wire flat to the component side of
wire on the component side of the component side of the board.
Cross track wiring practice wire not trimmed. Excessive the top of the solder joint. the board. Stripped ends bent to
20% board. Ends of wire cut to the top Stripped ends bent to 90° into
Component side exposed conductor. Excessive heat Insulation not up to hole, exposed 90° into hole. Ends of wire cut to
of the solder joint. Insulation up to hole. Ends of wire cut to the top of
damage to insulation. conductor. Excessive heat damage the top of the solder joint.
hole. Some heat damage to the solder joint. Insulation up to
(Needs to be repeated) to insulation. Insulation up to hole. Minimum
insulation. hole. No heat damage to
(would benefit from being heat damage to insulation.
insulation.
repeated)
Lab 4 - 20% CW1 mark Item
Unsatisfactory (20%) Poor (30%) Acceptable (45%) Good (65%) Excellent (100%)
Headphone Amplifier Weighting

Some components show signs of

Most components show serious
excessive heat or mechanical
signs of heat or mechanical Some components and tracks show All components and tracks show no
damage. Tracks lifted. Most wires All components, tracks and wires
damage. Tracks removed by heat signs of heat or mechanical signs of heat or mechanical
Undamaged components 20% show lots of heat and/or show no signs of heat or
damage. Most wires show serious damage. Wires show some heat damage. Wires show minimal heat
mechanical damage. mechanical damage
heat and/or mechanical damage. and/or mechanical damage. and/or mechanical damage.
(would benefit from being
(Needs to be repeated)
repeated)
Large gaps (greater than 4mm)
under components. Parts not Some large gaps (greater than Most components placed flush to All components placed flush to the
mounted vertically or horizontally 2mm) under components. Most the board (gap less than 2mm). board (as required). All parts
Large gaps (greater than 4mm)
(as required). Component value parts mounted vertically or Most parts mounted vertically or mounted vertically or horizontally
under components. Incorrect
codes/part numbers randomly horizontally (as required). Some horizontally (as required). Most (as required). All component value
polarity of components. Most
orientated. Correct polarity of all component value codes/part component value codes/part codes/part numbers all sharing
component legs bent over adjacent
Component placement 20% polarised components observed. numbers sharing same orientation. numbers sharing same orientation. same orientation. Correct polarity
tracks or pads. SMD parts not
some component legs bent over Correct polarity of all polarised Correct polarity of all polarised of all polarised components
located within silkscreen outline
adjacent tracks or pads. SMD parts components observed. Some components observed. Most observed. All component legs not
and/or soldered incorrectly.
not located within silkscreen component legs bent over adjacent component legs not bent over bent over adjacent tracks or pads.
(All issues need to be rectified)
outline. Soldering excessively. tracks or pads. SMD parts not adjacent tracks or pads. SMD parts SMD parts located within
(would benefit from being located within silkscreen outline. located within silkscreen outline. silkscreen outline.
repeated)
Some debris in joint. Convexed Small smooth joint not extending Small smooth joint not extending
Dirty, rough finish. Convexed sides.
sides. No holes in the solder. Clean and shiny, free from debris. past adjacent holes. Clean and past adjacent holes. Concaved
Holes in the solder. Component
Component legs not shorting to No holes in the solder. Triangular shiny, free from debris. No holes in sides. Clean and shiny, free from
Quality of soldering 20% legs not trimmed or shorting to
other legs or tracks. shaped flat sides. Component legs the solder. Triangular shaped flat debris. No holes in the solder.
other legs or tracks.
(would benefit from being not shorting to other legs or tracks. sides. Component leg trimmed to Component leg trimmed to top of
(Needs to be repeated)
repeated) top of solder. solder.
Incorrectly measured all signals Incorrectly measured some signals Correctly measured all signals and Correctly measured all signals and
Correct operation / gain Correctly measured all signals and
20% and incorrectly calculated gains. or calculated gains calculated gains with minimal calculated gains without any
calculations calculated gains with assistance
(Needs to be repeated) (Needs to be repeated) assistance assistance
Signal generator correctly set up Signal generator correctly set up Signal generator correctly set up
for the test signal with some for the test signal with minimal for the test signal without any
Incorrect setting up of signal generator
Use of oscilloscope and assistance. assistance. assistance.
20% or oscilloscope not acceptable.
function generator Oscilloscope correctly displays Oscilloscope correctly displays Oscilloscope correctly displays
Must be repeated.
stable test signal and output signal stable test signal and output signal stable test signal and output signal
with some assistance. with minimal assistance. without any assistance.

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 Lab 5 - 20% CW1 mark Item
Unsatisfactory (20%) Poor (30%) Acceptable (45%) Good (65%) Excellent (100%)
Signal Generator Weighting
All component place in the correct
All component place in the correct All component place in the correct
location following schematic and All component place in the correct
location following schematic and location following schematic and
board layout. Large gaps (greater location following schematic and
Some component place in the board layout. Most components board layout. All components
than 4mm) under components. board layout. Some large gaps
incorrect location, therefore not placed flush to the board (gap less placed flush to the board (as
Parts not mounted vertically or (greater than 2mm) under
following schematic and board than 2mm). Most parts mounted required). All parts mounted
horizontally (as required). components. Most parts mounted
layout. Large gaps (greater than vertically or horizontally (as vertically or horizontally (as
Component value codes/part vertically or horizontally (as
Component placement 25% 4mm) under components. required). Most component value required). All component value
numbers randomly orientated. required). Some component value
Incorrect polarity of components. codes/part numbers sharing same codes/part numbers all sharing
Correct polarity of all polarised codes/part numbers sharing same
Most component legs bent over orientation. Correct polarity of all same orientation. Correct polarity
components observed. some orientation. Correct polarity of all
adjacent tracks or pads. polarised components and chip of all polarised components and
component legs bent over polarised components observed.
(All issues need to be rectified) carriers observed. Most chip carriers observed. All
adjacent tracks or pads. Some component legs bent over
component legs not bent over component legs not bent over
(would benefit from being adjacent tracks or pads.
adjacent tracks or pads. adjacent tracks or pads.
repeated)
Most components show serious Some components show signs of
signs of heat or mechanical excessive heat or mechanical
Some components and tracks show All components and tracks show
damage. Tracks removed by heat damage. Tracks lifted. Most wires All components, tracks and wires
Undamaged track, signs of heat or mechanical no signs of heat or mechanical
25% damage. Most wires show serious show lots of heat and/or show no signs of heat or
connections, components damage. Wires show some heat damage. Wires show minimal heat
heat and/or mechanical damage. mechanical damage. mechanical damage
and/or mechanical damage. and/or mechanical damage.
(Needs to be repeated where (would benefit from being
possible) repeated where possible)
Large, rough joint. Dirty, rough Some debris in joint. Convexed
Smooth joint. Clean and shiny, free Small smooth joint. Clean and Small smooth joint. Concaved
finish, bulging sides. Holes in the sides. Holes in the solder.
from debris. No holes in the solder. shiny, free from debris. No holes in sides. Clean and shiny, free from
solder. Component legs not Component legs not shorting to
Soldering 25% Triangular shaped flat sides. the solder. Triangular shaped flat debris. No holes in the solder.
trimmed or are shorting to other other legs or tracks.
Component legs not shorting to sides. Component leg trimmed to Component leg trimmed to top of
legs or tracks. (would benefit from being
other legs or tracks. top of solder. solder.
(Needs to be repeated) repeated)
Wires correctly connected to the Wires correctly connected to the
Wires correctly connected to the
Incorrect setting up of oscilloscope board with suitable colour coding. board with suitable colour coding.
Correct connection and board. Oscilloscope correctly
25% or poor wiring not acceptable. Oscilloscope correctly displays the Oscilloscope correctly displays the
functionality displays the correct output signals
Must be repeated. correct output signals with minimal correct output signals without any
with some assistance.
assistance. assistance.

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