Interna tional Jo urna l o f Applied Research 2015 ; 1 (5 ): 161 -16 2

ISSN Print: 2394-7500

ISSN Online: 2394-5869
Impact Factor: 3.4 Peltier cooling and mass airflow based laptop cooling
IJAR 2015; 1(5): 161-162
www.allresearchjournal.com device
Received: 12-03-2015
Accepted: 20-04-2015
Abhishek Verma, Roopesh Dhara, Manas Verma, Kunal Dhadse
Abhishek Verma
B. tech, Computer Science
Abstract
Engineering, SRM University,
Power consumption in running a laptop device is mainly due to the integrated circuits and core
Tamil Nadu, India.
processors. Due to very compact arrangement of billions of semiconductors in a tiny space the loss due to
Roopesh Dhara heat is huge and lethal for the components. As working properties of a semiconductor highly depends on
B. tech, Computer Science the temperature so the surrounding, the system needs to be cooled. Cooling of multicore processors is
Engineering, SRM University, achieved by providing with radiator and cooling fans for an optimum air flow over the large surface area
Tamil Nadu, India. of the radiator. This method is sufficient but not fully efficient in providing with long term safety of
components and high reliability. The proposed design is of an external cooling device with peltier cell
Manas Verma cooling mechanism for a provision of cold air flow in the laptop to drain out the heat energy.
B. tech, Aerospace Engineering,
SRM University, Tamil Nadu, Keywords: Peltier Device/Cell, Laptop Cooler, External Cooling, Mass Airflow, Heat Sink, External
India. Cooling.
Kunal Dhadse
B. tech, Civil Engineering, 1. Introduction
SRM University, Tamil Nadu,
India.

Above device shown represents the proposed cooling device with air inflow at room
temperature but cooling and heat loss at contact of peltier devices. The output flux contains the
cold air flow that is diverted by a cooling fan and transferred into the heat radiating laptop
device. The mechanism behind the cooling down the air at room temperature is simple transfer
of energy in the form of convection and radiation between the air and the front of the peltier
cell and the heat sink behind the peltier cell and the air discarded, respectively. The peltier cell
consist of two sides with two DC input terminals. When DC current is applied than the two
terminals get a temperature difference with one end with hot and side with cold temperature.

2. Design Specifications

Correspondence:
Abhishek Verma
B. tech, Computer Science
1-Peltier Cells
Engineering, SRM University,
Tamil Nadu, India. 2-Cooling Fan
3-Bottom Structural Beam
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International Journal of Applied Research
 

4-Canilevered Laptop Base Support to increase the surface area for more amplified heat radiation.
5-Flat Side Supports The heat sink is fit with the peltier with special thermal glue
6-Diagonal plate supporting peltier cells. for a proper heat transfer.
The base of laptop device is to be placed on the top of the
cooling device with end supported cantilever flat slabs are 6. Heat Transfer and Formulation
provided. The load from the top slabs is transferred to the The application of thermal glue for proper lubrication of the
vertical flat supports. To maintain structural stiffness the heat side of the peltier and heat transfer to the heat sink.
diagonal element is provided to join the top flay slab and the
bottom beam to counter any bending Moments. The peltier
cells are fit on the diagonal plate with cold side on above and
hot side at the bottom.

3. Side Sectional View

Q=Heat transferred per second through the thermal glue.

K=Coefficient of heat transfer for glue.
A=surface area of the peltier cell.
t=Thickness of the thermal glue.
The rate of hat transfer can tell us the proper selection of the
1-Diagonally Mounted Peltier Cell thermal glue to be used for peltier device. Varying the
2-Cooling Fan. thickness can also help in setting the rate of hat transfer under
3-Diagonal plate support separating the heat sink and cold side safe limits or working limit of temperature for peltier cell.
of peltier device.
4-Radiator with large surface area acting as a hat sink.
5-Back support flat plate.
The diagonal plate is acting as a barrier between the cold air
and the hot air. This diagonal support provide a support for the
peltier and an ease in mounting just below the cooling fan. The
provision of heat sing in the form of heat radiator is providing
the hot side of the peltier device to cool faster and preventing
it from temperature failure. Maintaining a temperature range
suitable for working range of peltier device is essential in its 7. Acknowledgment
reliability and overall efficiency of the system. We wish to thank our mentors and college for supporting us in
completing our work on laptop cooling device using peltier
4. Working Mechanisms cells. We also wish to thank our parents for providing us with
assets that helped us completing research regarding this
concept.

8. References
1. Thermoelectric Coolers Basics. TEC Microsystems.
Retrieved 16 March, 2013.
2. Frequently asked questions about our product. Tellurex.
Retrieved 16 March, 2013.
3. http://www.engr.sjsu.edu/ndejong/ME_146.htm -
PowerPoint under the "Thermoelectric Coolers" link
The peltier cells works on the principle of the p-n junction
4. The Heatsink Guide. Retrieved 3 May, 2013.
diodes. When a suitable arrangement of p-n junction diodes is
5. Brown DR, Fernandez N, Dirks JA, Stout TB. (March
made with alternate connections to get a two surface flat
2010). The Prospects of Alternatives to Vapor
surfaces. When an electrical charge in the form of DC current
Compression Technology for Space Cooling and Food
is applied to the device them the one side drops in temperature
Refrigeration Applications. Pacific Northwest National
while the other side heats up. Converse is also true but inn
Laboratory (PNL). U.S. Department of Energy.
design of the cooling device the electrical energy is provided
Retrieved 16 March, 2013.
to cool down the air in contact with the cold side of the peltier
6. PCB Heaven - Peltier Elements Explained. PCB Heaven.
device and then transferring that cold air to cool down the
PCB Heaven. Retrieved - Usage Guide of Tec-Modules. 1
laptop system.
May, 2013.
7. Hsu Jeremy. (2011-06-14). Cold? Put this jacket on. Hot?
5. Design Assumptions
Put this jacket on Climate-controlled coat goes from zero
The peltier cells are powered with battery system or the laptop
to 100 degrees C 'in the flip of a button'. NBC News.
device itself. The control of peltier device is manually
NBC. Retrieved 16 March, 2013.
operated. When needed then only it is switched on by the user
8. Ferro, Shaunacy (2013-03-15). How Winter Woes
depending on the requirement. The cooling fan is powered
Inspired A Nanotech Fix For Everything From Cold
mainly by the laptop system. Operational control of the peltier
Necks To Knee Pain. Popular Mechanics. Bonnier Corp.
device and the cooling fan are separate. The Heat sink is made
Retrieved 16 March, 2013.
up of an aluminum based allow with projected grooved plates
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